JP2017111409A - Conductive substrate, electrophotographic photoreceptor, process cartridge, image forming apparatus, and manufacturing method of conductive substrate - Google Patents
Conductive substrate, electrophotographic photoreceptor, process cartridge, image forming apparatus, and manufacturing method of conductive substrate Download PDFInfo
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- JP2017111409A JP2017111409A JP2015247992A JP2015247992A JP2017111409A JP 2017111409 A JP2017111409 A JP 2017111409A JP 2015247992 A JP2015247992 A JP 2015247992A JP 2015247992 A JP2015247992 A JP 2015247992A JP 2017111409 A JP2017111409 A JP 2017111409A
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Landscapes
- Photoreceptors In Electrophotography (AREA)
Abstract
Description
本発明は、導電性支持体、電子写真感光体、プロセスカートリッジ、画像形成装置、及び導電性支持体の製造方法に関する。 The present invention relates to a conductive support, an electrophotographic photosensitive member, a process cartridge, an image forming apparatus, and a method for manufacturing a conductive support.
従来、電子写真方式の画像形成装置としては、電子写真感光体を用いて帯電、露光、現像、転写、クリーニング等の工程を順次行う装置が広く知られている。 2. Description of the Related Art Conventionally, as an electrophotographic image forming apparatus, an apparatus that sequentially performs processes such as charging, exposure, development, transfer, and cleaning using an electrophotographic photosensitive member is widely known.
電子写真感光体としては、アルミニウム等の導電性を有する支持体上に、露光により電荷を発生する電荷発生層と、電荷を輸送する電荷輸送層を積層する機能分離型の電子写真感光体や、電荷を発生する機能と電荷を輸送する機能を同一の層が果たす単層型の電子写真感光体が知られている。 As the electrophotographic photosensitive member, a functionally separated type electrophotographic photosensitive member in which a charge generation layer that generates charges upon exposure and a charge transport layer that transports charges is laminated on a support having conductivity such as aluminum, There is known a single-layer type electrophotographic photosensitive member in which the same layer performs the function of generating charge and the function of transporting charge.
例えば、特許文献1には、Fe0.3質量%以上1.0質量%以下、Si0.2質量%以上0.8質量%以下を含有し、かつ、Fe/Si<3であり、板面の平均結晶粒径が35μm以下であり、絞り比(ブランク径/ポンチ径)2で耳率3%以内であることを特徴とする感光ドラム用アルミニウム板材が開示されている。 For example, Patent Document 1 contains Fe 0.3 mass% or more and 1.0 mass% or less, Si 0.2 mass% or more and 0.8 mass% or less, and Fe / Si <3. An aluminum plate material for a photosensitive drum is disclosed, which has an average crystal grain size of 35 μm or less and a drawing ratio (blank diameter / punch diameter) of 2 and an ear ratio of 3% or less.
また、特許文献2には、Zn4.5質量%以上7.5質量%以下、Mg0.3質量%以上0.8質量%以下、Cu0.1質量%以上0.2質量%以下を含有し、さらにMn0.15質量%以上0.4質量%以下、Cr0.05質量%以上0.3質量%以下、Zr0.1質量%以上0.3質量%以下のうち1種または2種以上を含有し、且つMn+Cr+Zrの合計が0.25質量%以上で、残部がAl及び不純物からなることを特徴とするアルミニウム合金を用いた冷間インパクト成形したインパクト成形品が開示されている。 Patent Document 2 contains Zn 4.5 mass% to 7.5 mass%, Mg 0.3 mass% to 0.8 mass%, Cu 0.1 mass% to 0.2 mass%, Furthermore, Mn 0.15 mass% or more and 0.4 mass% or less, Cr 0.05 mass% or more and 0.3 mass% or less, Zr 0.1 mass% or more and 0.3 mass% or less 1 type or 2 types or more are contained. In addition, an impact molded product is disclosed that is cold impact molded using an aluminum alloy characterized in that the total of Mn + Cr + Zr is 0.25% by mass or more and the balance is made of Al and impurities.
アルミニウム合金を使用した導電性支持体には、原料の使用量の低減等の目的からより薄肉化することが求められる。ただ、薄肉化して作製した場合、導電性支持体に外力が加わったときに塑性変形(永久変形)し易くなるため、導電性支持体には強度が求められる。一方で、単に高硬度であるアルミニウム合金を使用して導電性支持体を作製すると、加工したときの残留歪みにより導電性支持体自体が変形することがあり、形状精度が低下することがある。
本発明の課題は、特定成分組成のアルミニウム合金を用いた導電性支持体において、特定成分組成のアルミニウム合金の結晶粒の平均面積が100μm2よりも大きい場合に比べて、強度が高くかつ形状精度が高い導電性支持体を提供することである。
A conductive support using an aluminum alloy is required to be thinner for the purpose of reducing the amount of raw materials used. However, when the thickness is reduced, the conductive support is likely to undergo plastic deformation (permanent deformation) when an external force is applied to the conductive support, and thus the conductive support is required to have strength. On the other hand, when a conductive support is produced simply using an aluminum alloy having high hardness, the conductive support itself may be deformed due to residual strain when processed, and the shape accuracy may be lowered.
An object of the present invention is to provide a conductive support using an aluminum alloy having a specific component composition, which has higher strength and shape accuracy than the case where the average area of crystal grains of the aluminum alloy having a specific component composition is larger than 100 μm 2. Is to provide a highly conductive support.
上記課題は、以下の手段により解決される。 The above problem is solved by the following means.
請求項1に係る発明は、
Si:0.8質量%以下、Fe:0.7質量%以下、Cu:3.0質量%以上5.0質量%以下、Mn:0.3質量%以上1.0質量%以下、Mg:0.4質量%以上1.8質量%以下、Cr:0.1質量%以下、Zn:0.25質量%以下、Ti:0.15質量%以下、残部:Al及び不純物からなるアルミニウム合金を有し、前記アルミニウム合金の結晶粒の平均面積が、3.0μm2以上100μm2以下である導電性支持体。
The invention according to claim 1
Si: 0.8 mass% or less, Fe: 0.7 mass% or less, Cu: 3.0 mass% or more and 5.0 mass% or less, Mn: 0.3 mass% or more and 1.0 mass% or less, Mg: An aluminum alloy comprising 0.4% by mass or more and 1.8% by mass or less, Cr: 0.1% by mass or less, Zn: 0.25% by mass or less, Ti: 0.15% by mass or less, balance: Al and impurities. has an average area of crystal grains of the aluminum alloy, the conductive support is 3.0 [mu] m 2 or more 100 [mu] m 2 or less.
請求項2に係る発明は、
前記導電性支持体の厚みが、0.03mm以上1.5mm以下である請求項1に記載の導電性支持体。
The invention according to claim 2
The conductive support according to claim 1, wherein the conductive support has a thickness of 0.03 mm to 1.5 mm.
請求項3に係る発明は、
前記導電性支持体の円筒度が、60μm以下である請求項1又は請求項2に記載の導電性支持体。
The invention according to claim 3
The conductive support according to claim 1, wherein the conductive support has a cylindricity of 60 μm or less.
請求項4に係る発明は、
前記導電性支持体の真円度が、30μm以下である請求項1〜請求項3のいずれか1項に記載の導電性支持体。
The invention according to claim 4
The roundness of the said electroconductive support body is 30 micrometers or less, The electroconductive support body of any one of Claims 1-3.
請求項5に係る発明は、
前記導電性支持体の同軸度が、20μm以下である請求項1〜請求項4のいずれか1項に記載の導電性支持体。
The invention according to claim 5
The conductive support according to any one of claims 1 to 4, wherein the conductive support has a coaxiality of 20 µm or less.
請求項6に係る発明は、
前記導電性支持体の偏肉が、30μm以下である請求項1〜請求項5のいずれか1項に記載の導電性支持体。
The invention according to claim 6
The conductive support according to any one of claims 1 to 5, wherein an uneven thickness of the conductive support is 30 µm or less.
請求項7に係る発明は、
前記導電性支持体が電子写真感光体用の導電性支持体である請求項1〜請求項6のいずれか1項に記載の導電性支持体。
The invention according to claim 7 provides:
The conductive support according to any one of claims 1 to 6, wherein the conductive support is a conductive support for an electrophotographic photosensitive member.
請求項8に係る発明は、
請求項1〜請求項7のいずれか1項に記載の導電性支持体と、
前記導電性支持体上に感光層と、
を有する電子写真感光体。
The invention according to claim 8 provides:
The conductive support according to any one of claims 1 to 7,
A photosensitive layer on the conductive support;
An electrophotographic photosensitive member having:
請求項9に係る発明は、
請求項8に記載の電子写真感光体を備え、
画像形成装置に着脱するプロセスカートリッジ。
The invention according to claim 9 is:
An electrophotographic photoreceptor according to claim 8,
A process cartridge that can be attached to and detached from an image forming apparatus.
請求項10に係る発明は、
請求項8に記載の電子写真感光体と、
前記電子写真感光体の表面を帯電する帯電手段と、
帯電した前記電子写真感光体の表面に静電潜像を形成する静電潜像形成手段と、
トナーを含む現像剤により、前記電子写真感光体の表面に形成された静電潜像を現像してトナー像を形成する現像手段と、
前記トナー像を記録媒体の表面に転写する転写手段と、
を備える画像形成装置。
The invention according to claim 10 is:
The electrophotographic photosensitive member according to claim 8,
Charging means for charging the surface of the electrophotographic photosensitive member;
An electrostatic latent image forming means for forming an electrostatic latent image on the surface of the charged electrophotographic photosensitive member;
Developing means for developing the electrostatic latent image formed on the surface of the electrophotographic photosensitive member with a developer containing toner to form a toner image;
Transfer means for transferring the toner image to the surface of the recording medium;
An image forming apparatus comprising:
請求項11に係る発明は、
前記アルミニウム合金を準備する工程と、
前記アルミニウム合金に冷間インパクトプレス加工を施して成形体を得る第1の加工工程と、
前記第1の加工工程で得た前記成形体に溶体化処理を施す工程と、
前記溶体化処理を施した前記成形体に形状加工を施す第2の加工工程と、
前記形状加工を施した前記成形体に時効硬化処理を施す工程と、
を含む請求項1〜請求項7のいずれか1項に記載の導電性支持体の製造方法。
The invention according to claim 11 is:
Preparing the aluminum alloy;
A first processing step of obtaining a molded body by subjecting the aluminum alloy to a cold impact press;
Applying solution treatment to the molded body obtained in the first processing step;
A second processing step of performing shape processing on the molded body subjected to the solution treatment;
Applying age-hardening treatment to the shaped body subjected to the shape processing;
The manufacturing method of the electroconductive support body of any one of Claims 1-7 containing these.
請求項1、3、4、5、又は6に係る発明によれば、上記成分組成のアルミニウム合金を用いた導電性支持体において、上記成分組成のアルミニウム合金の結晶粒の平均面積が100μm2よりも大きい場合に比べて、強度が高くかつ形状精度が高い導電性支持体が提供される。 According to the invention according to claim 1, 3, 4, 5, or 6, in the conductive support using the aluminum alloy having the above component composition, the average area of crystal grains of the aluminum alloy having the above component composition is more than 100 μm 2 . Compared with the case of larger, a conductive support having high strength and high shape accuracy is provided.
請求項2に係る発明によれば、上記成分組成のアルミニウムを含む金属を用いた導電性支持体において、導電性支持体の厚みが0.03mm以上1.5mm以下の場合であっても、上記成分組成のアルミニウム合金の結晶粒の平均面積が100μm2よりも大きい場合に比べて、強度が高くかつ形状精度が高い導電性支持体が提供される。 According to the invention of claim 2, in the conductive support using a metal containing aluminum having the above component composition, even if the thickness of the conductive support is 0.03 mm or more and 1.5 mm or less, As compared with the case where the average area of the crystal grains of the aluminum alloy having the component composition is larger than 100 μm 2, a conductive support having high strength and high shape accuracy is provided.
請求項7に係る発明によれば、上記成分組成のアルミニウム合金を用いた導電性支持体において、上記成分組成のアルミニウム合金の結晶粒の平均面積が100μm2よりも大きい場合に比べて、強度が高くかつ形状精度が高い電子写真感光体用の導電性支持体が提供される。 According to the invention of claim 7, in the conductive support using the aluminum alloy having the above component composition, the strength is higher than when the average area of the crystal grains of the aluminum alloy having the above component composition is larger than 100 μm 2. A conductive support for an electrophotographic photosensitive member having high shape accuracy is provided.
請求項8、9、又は10に係る発明によれば、上記成分組成のアルミニウム合金を用いた導電性支持体において、上記成分組成のアルミニウム合金の結晶粒の平均面積が100μm2よりも大きい場合に比べて、強度が高くかつ形状精度が高い導電性支持体が適用される電子写真感光体、プロセスカートリッジ、又は画像形成装置が提供される。 According to the invention which concerns on Claim 8, 9, or 10, In the electroconductive support body using the aluminum alloy of the said component composition, when the average area of the crystal grain of the aluminum alloy of the said component composition is larger than 100 micrometer < 2 >. In comparison, an electrophotographic photosensitive member, a process cartridge, or an image forming apparatus to which a conductive support having high strength and high shape accuracy is applied is provided.
請求項11に係る発明によれば、上記成分組成のアルミニウム合金を用いた導電性支持体において、切削加工を含む加工により、導電性支持体を作製した場合に比べて、強度が高くかつ形状精度が高い導電性支持体の製造方法が提供される。 According to the eleventh aspect of the present invention, in the conductive support using the aluminum alloy having the above component composition, the strength is higher and the shape accuracy is higher than in the case where the conductive support is manufactured by processing including cutting. There is provided a method for producing a conductive substrate having a high conductivity.
以下、添付図面を参照しながら本発明の実施形態について説明する。なお、図面中、同様の機能を有する要素には同一の符号を付し、重複する説明は省略する。 Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings, elements having similar functions are denoted by the same reference numerals, and redundant description is omitted.
[導電性支持体]
本実施形態に係る導電性支持体(以下、単に「支持体」と称することがある。)は、Si:0.8質量%以下、Fe:0.7質量%以下、Cu:3.0質量%以上5.0質量%以下、Mn:0.3質量%以上1.0質量%以下、Mg:0.4質量%以上1.8質量%以下、Cr:0.1質量%以下、Zn:0.25質量%以下、Ti:0.15質量%以下、残部:Al及び不純物からなるアルミニウム合金(以下、単に「特定アルミニウム合金」と称することがある。)を有する。そして、このアルミニウム合金の結晶粒の平均面積が、3.0μm2以上100μm2以下である。
[Conductive support]
The conductive support according to the present embodiment (hereinafter sometimes simply referred to as “support”) has a Si content of 0.8 mass% or less, an Fe content of 0.7 mass% or less, and a Cu content of 3.0 mass. % To 5.0% by mass, Mn: 0.3% to 1.0% by mass, Mg: 0.4% to 1.8% by mass, Cr: 0.1% by mass or less, Zn: 0.25% by mass or less, Ti: 0.15% by mass or less, balance: an aluminum alloy composed of Al and impurities (hereinafter, simply referred to as “specific aluminum alloy”). The average area of crystal grains of the aluminum alloy is 3.0 [mu] m 2 or more 100 [mu] m 2 or less.
本実施形態に係る支持体は、上記構成により、強度が高く、形状精度が高い支持体が得られる。その理由は定かではないが、以下に示す理由によるものと推測される。 The support body which concerns on this embodiment can obtain a support body with high intensity | strength and high shape precision by the said structure. The reason is not clear, but is presumed to be as follows.
一般的に、電子写真感光体(以下、「感光体」と称することがある。)等に用いられる支持体には、円筒度の向上のために、高硬度で、且つ加工性に優れた材料が選択される。具体的には、支持体は、ヤング率等の各物性値にて円筒度の向上が図られている。また、原料の使用量の低減等の理由から、支持体の厚みを薄く作製(以下、支持体の厚みを「肉厚」、厚みを薄く作製することを「薄肉化」と称することがある)することが求められる。 In general, a support used for an electrophotographic photoreceptor (hereinafter sometimes referred to as “photoreceptor”) or the like is a material having high hardness and excellent workability in order to improve cylindricity. Is selected. Specifically, the support has an improved cylindricity with various physical property values such as Young's modulus. In addition, for reasons such as a reduction in the amount of raw materials used, the support is made thin (hereinafter, the thickness of the support is referred to as “thickness”, and the production of a thin thickness is sometimes referred to as “thinning”). It is required to do.
例えば、加工性に優れた純アルミニウムを使用して支持体を作製すると、形状精度(例えば、円筒度)は高いものが得られるが、純アルミニウムは柔らかいために、強度が低いことがある。そのため、例えば、支持体を薄肉化して(例えば、0.4mm以下)作製すると、支持体に外力が加わった場合に、塑性変形(永久変形)し易いことがあり、支持体としての機能を発揮しにくくなることがある。 For example, when a support is produced using pure aluminum having excellent workability, a shape having a high shape accuracy (for example, cylindricity) can be obtained. However, since pure aluminum is soft, the strength may be low. Therefore, for example, if the support is made thin (for example, 0.4 mm or less), when an external force is applied to the support, it may be easily plastically deformed (permanently deformed), and the function as the support is exhibited. May be difficult.
一方で、支持体を薄肉化しても高強度が得られるように、加工硬化した高硬度のアルミニウム合金を使用して支持体を作製すると、加工したときの残留歪みにより支持体自体が変形し、形状精度が低下してしまうことがある。 On the other hand, when a support is made using a work hardened aluminum alloy so as to obtain high strength even if the support is thinned, the support itself is deformed due to residual strain when processed, Shape accuracy may be reduced.
これに対し、本実施形態に係る支持体は、特定アルミニウム合金を用いることで、支持体を作製する工程において、加工性を向上し得るため、形状精度が高くなる。そして、支持体を作製したときの特定アルミニウム合金の結晶粒の平均面積が上記範囲であることで、外力に対する強度が向上する。そのため、強度が高く、形状精度が高い支持体が得られると推測される。 On the other hand, the support according to the present embodiment can improve workability in the step of manufacturing the support by using a specific aluminum alloy, so that the shape accuracy is increased. And the intensity | strength with respect to external force improves because the average area of the crystal grain of a specific aluminum alloy when producing a support body is the said range. Therefore, it is estimated that a support body having high strength and high shape accuracy can be obtained.
特に、本実施形態に係る支持体における特定アルミニウム合金の組成は、Cuの量が3.0質量%以上5.0質量%以下であり、かつMnの量が0.3質量%以上1.0質量%以下である。Cuの量が3.0質量%以上と多いことで、CuとAlとの金属間化合物(CuAl2等)の形成が促進され、硬く強度の高い支持体が得られる。また、Mnの量が0.3質量%以上と多いことでアルミニウム合金の結晶粒の微細化がさらに促進され、硬く強度の高い支持体が得られると考えられる。
また、本実施形態に係る支持体における特定アルミニウム合金が前記の組成を有することで、結晶粒の粒界への合金成分の析出が促進され、結晶粒の微細化も促されて、硬く強度の高い支持体が得られると考えられる。
In particular, the composition of the specific aluminum alloy in the support according to the present embodiment is such that the amount of Cu is 3.0% by mass or more and 5.0% by mass or less, and the amount of Mn is 0.3% by mass or more and 1.0% by mass. It is below mass%. When the amount of Cu is as large as 3.0% by mass or more, formation of an intermetallic compound of Cu and Al (CuAl 2 or the like) is promoted, and a hard and strong support is obtained. Further, it is considered that when the amount of Mn is as large as 0.3% by mass or more, the refinement of the crystal grains of the aluminum alloy is further promoted, and a hard and high strength support can be obtained.
In addition, since the specific aluminum alloy in the support according to the present embodiment has the above composition, precipitation of the alloy component at the grain boundaries of the crystal grains is promoted, and the refinement of the crystal grains is also promoted, so It is believed that a high support can be obtained.
一方で、本実施形態に係る支持体における特定アルミニウム合金が前記の組成を有することで、形状精度の高い支持体が得られる。特に、本実施形態に係る支持体が、アルミニウム合金に冷間インパクトプレス加工を施して成形体を得る第1の加工工程、この成形体に溶体化処理を施す工程、及び溶体化処理を施した成形体に形状加工を施す第2の加工工程を経て製造される支持体である場合には、溶体化処理後の第2の加工工程での加工性に優れるため、より形状精度の高い支持体が得られる。 On the other hand, a support body with high shape accuracy is obtained because the specific aluminum alloy in the support body according to the present embodiment has the above composition. In particular, the support according to the present embodiment was subjected to a first processing step for obtaining a compact by subjecting an aluminum alloy to cold impact press processing, a step for subjecting the compact to a solution treatment, and a solution treatment. In the case of a support manufactured through a second processing step in which the molded body is subjected to shape processing, the support has higher shape accuracy because it is excellent in workability in the second processing step after solution treatment. Is obtained.
このため、本実施形態に係る支持体によれば、強度が高く、形状精度が高い支持体が提供され、その結果この支持体を画像形成装置用の電子写真感光体に適用することで、画像再現性が高く、濃度低下や白抜け等の画質欠陥が抑制される。
また、本実施形態に係る支持体は、薄肉化しても強度が高く形状精度が高いため、薄肉化することにより、アルミニウム合金の使用量の低減を図ることができる。
Therefore, according to the support according to the present embodiment, a support having high strength and high shape accuracy is provided. As a result, by applying this support to an electrophotographic photosensitive member for an image forming apparatus, an image can be obtained. Reproducibility is high, and image quality defects such as density reduction and white spots are suppressed.
In addition, since the support according to the present embodiment has high strength and high shape accuracy even if it is thinned, the amount of aluminum alloy used can be reduced by thinning.
次いで、本実施形態に係る支持体の構成及び製造方法について説明する。 Next, the structure and manufacturing method of the support according to this embodiment will be described.
本実施形態の支持体は、上記成分組成からなる特定アルミニウム合金を有する。 The support of the present embodiment has a specific aluminum alloy having the above component composition.
(特定アルミニウム合金)
−Si、Mg−
Siは0.8質量%以下、Mgは0.4質量%以上1.8質量%以下の範囲である。Si、及びMgの含有量がこの範囲内であると、支持体の強度を向上させ得る。Siは、Mgと共存し、Mg2Si析出物を生じさせ、支持体の強度を向上させ得る作用がある。Siの含有量の下限値としては特に限定されないが、例えば、0.3質量%以上であることがよい。
(Specific aluminum alloy)
-Si, Mg-
Si is 0.8 mass% or less, and Mg is 0.4 mass% or more and 1.8 mass% or less. When the content of Si and Mg is within this range, the strength of the support can be improved. Si coexists with Mg, produces Mg 2 Si precipitates, and has an effect of improving the strength of the support. Although it does not specifically limit as a lower limit of content of Si, For example, it is good that it is 0.3 mass% or more.
−Cu−
Cuは3.0質量%以上5.0質量%以下の範囲で含有する。Cuの含有量がこの範囲内であると、支持体の強度を向上させ得る。Cuは、Mg2Si析出物を増加させ、またCuとAlとの金属間化合物(CuAl2等)の形成を促進させ、支持体の強度を向上させ得る作用がある。
-Cu-
Cu contains in the range of 3.0 mass% or more and 5.0 mass% or less. The intensity | strength of a support body can be improved as content of Cu exists in this range. Cu has the effect of increasing the Mg 2 Si precipitates and promoting the formation of an intermetallic compound of Cu and Al (CuAl 2 or the like) and improving the strength of the support.
−Fe−
Feは0.7質量%以下の範囲である。Feの含有量がこの範囲内であると、支持体の強度を向上させ得る。Feは、合金中でAl、Siと結合して晶出するとともに、結晶粒の粗大化を抑制させ得る作用がある。Feの含有量の下限値としては特に限定されないが、例えば、0.05質量%以上であることがよい。
-Fe-
Fe is in the range of 0.7% by mass or less. When the content of Fe is within this range, the strength of the support can be improved. Fe combines with Al and Si in the alloy and crystallizes, and has the effect of suppressing coarsening of crystal grains. Although it does not specifically limit as a lower limit of content of Fe, For example, it is good that it is 0.05 mass% or more.
−Mn−
Mnは0.3質量%以上1.0質量%以下の範囲で含有する。Mnの含有量がこの範囲内であると、結晶粒を微細化させ得る。また、結晶粒の粗大化を抑制させ得る。
-Mn-
Mn is contained in the range of 0.3% by mass or more and 1.0% by mass or less. If the Mn content is within this range, the crystal grains can be refined. Moreover, coarsening of crystal grains can be suppressed.
−Cr、Zn、Ti−
Crは0.1質量%以下、Znは0.25質量%以下、及びTiは0.15質量%以下の範囲である。Cr、Zn、及びTiの含有量がこの範囲内であると、結晶粒を微細化させ得る。また、結晶粒の粗大化を抑制させ得る。Cr、Zn、及びTiの含有量の下限値としては特に限定されないが、例えば、それぞれ、Cr:0.3質量%以上、Zn:0.03質量%以上、及びTi:0.03質量%以上であることがよい。
-Cr, Zn, Ti-
Cr is 0.1% by mass or less, Zn is 0.25% by mass or less, and Ti is 0.15% by mass or less. When the content of Cr, Zn, and Ti is within this range, the crystal grains can be refined. Moreover, coarsening of crystal grains can be suppressed. Although it does not specifically limit as a lower limit of content of Cr, Zn, and Ti, For example, Cr: 0.3 mass% or more, Zn: 0.03 mass% or more, respectively, Ti: 0.03% mass or more It is good that it is.
−不純物−
特定アルミニウム合金は、上記の各成分とアルミニウムの他に不純物を含有することもある。不純物は、例えば、アルミニウムの原料や、特定アルミニウム合金地金の製造工程において含有され得る。また、不純物としては、例えば、Ga、V、Ni、B、Zr、Ca等の成分が挙げられる。
-Impurities-
The specific aluminum alloy may contain impurities in addition to the above components and aluminum. Impurities can be contained, for example, in the raw material of aluminum or the manufacturing process of a specific aluminum alloy ingot. Examples of the impurity include components such as Ga, V, Ni, B, Zr, and Ca.
(結晶粒の平均面積)
本実施形態の支持体は、特定アルミニウム合金の結晶粒の平均面積が、3.0μm2以上100μm2以下である。より強度が高く、より形状精度が高い支持体を得る点で、5.0μm2以上80μm2以下の範囲であることが好ましい。より好ましくは、7.0μm2以上70μm2以下の範囲である。
ここで、本実施形態の支持体において、特定アルミニウム合金の「結晶粒」とは、特定アルミニウム合金を構成する多結晶組織の個々の結晶を示す。そして、「結晶粒の平均面積」とは、結晶粒の面積を平均値で表したものである。
(Average area of crystal grains)
In the support of the present embodiment, the average area of crystal grains of the specific aluminum alloy is 3.0 μm 2 or more and 100 μm 2 or less. In terms of obtaining a support having higher strength and higher shape accuracy, it is preferably in the range of 5.0 μm 2 to 80 μm 2 . More preferably, it is in the range of 7.0 μm 2 or more and 70 μm 2 or less.
Here, in the support of the present embodiment, “crystal grains” of the specific aluminum alloy indicate individual crystals of a polycrystalline structure constituting the specific aluminum alloy. The “average area of crystal grains” is the average area of crystal grains.
なお、結晶粒の平均面積は、走査型電子顕微鏡(SEM)にて観察及び計測される値である。具体的には、次のように測定する。
まず、支持体の軸方向の一端、及び他端からそれぞれ5mmの位置、支持体の軸方向中央において、周方向90度ごとに4箇所(合計4×3=12箇所)について、測定用試料を準備する。次に、この測定用試料をエポキシ樹脂包埋処理後、研磨処理を行う。研磨処理は、耐水研磨紙#500を用いて行い、その後、バフ研磨にて鏡面仕上げを行う。この研磨処理した測定用試料について、キーエンス(KEYENCE)社製のVE SEMにて観察及び計測を実施する。
各サンプルの断面のうち、支持体の外周面から軸方向30μm×厚み方向20μmの範囲に相当する位置に存在する一つの結晶粒の面積について、上記キーエンス(KEYENCE)社製のVE SEMに標準装備されている画像処理ソフトにて求め、12個のサンプルの結晶粒の面積を数平均し、これを支持体の結晶粒の平均面積として求める。
In addition, the average area of a crystal grain is a value observed and measured with a scanning electron microscope (SEM). Specifically, the measurement is performed as follows.
First, measurement samples were measured at four locations (total 4 × 3 = 12 locations) every 90 degrees in the axial direction of the support at 5 mm from one end and the other end in the axial direction of the support, respectively. prepare. Next, this measurement sample is subjected to polishing after embedding with an epoxy resin. The polishing process is performed using water-resistant polishing paper # 500, and then mirror finishing is performed by buffing. The polished measurement sample is observed and measured with a VE SEM manufactured by KEYENCE.
Among the cross sections of each sample, the VE SEM manufactured by Keyence Co., Ltd. is standard equipment for the area of one crystal grain existing at a position corresponding to the range of 30 μm in the axial direction and 20 μm in the thickness direction from the outer peripheral surface of the support. The number of crystal grain areas of 12 samples is number averaged and obtained as the average area of crystal grains of the support.
なお、支持体を画像形成装置用の電子写真感光体に適用した場合において、測定対象となる感光体から、上記結晶粒の平均面積を測定する方法としては、以下のとおりである。
まず、測定対象となる感光体を準備する。次に、例えば、電荷発生層、及び電荷輸送層等の感光層、及び下引層を溶剤や工具等の手段を用いて除去し、下引層を露出させる。さらに、露出した下引層を除去し、測定用試料とする。そして、この測定用試料について、上記の手順により、支持体の結晶粒の平均面積を測定する。
When the support is applied to an electrophotographic photoreceptor for an image forming apparatus, the method for measuring the average area of the crystal grains from the photoreceptor to be measured is as follows.
First, a photoconductor to be measured is prepared. Next, for example, the photosensitive layer such as the charge generation layer and the charge transport layer, and the undercoat layer are removed using means such as a solvent or a tool, and the undercoat layer is exposed. Further, the exposed undercoat layer is removed to obtain a measurement sample. And about this measuring sample, the average area of the crystal grain of a support body is measured with said procedure.
(導電性支持体の製造方法)
本実施形態の支持体を製造する方法は、支持体の結晶粒の平均面積が上記範囲を満たすものであれば、特に限定されるものではない。
(Method for producing conductive support)
The method for producing the support of the present embodiment is not particularly limited as long as the average area of the crystal grains of the support satisfies the above range.
支持体を製造する方法としては、例えば、特定アルミニウム合金を準備する工程と、特定アルミニウム合金に冷間インパクトプレス加工を施して成形体を得る第1の加工工程と、第1の加工工程で得た成形体に溶体化処理を施す工程と、溶体化処理を施した成形体に形状加工を施す第2の加工工程と、形状加工を施した成形体に時効硬化処理を施す工程と、を含む工程によって得る方法が挙げられる。
以下、上記の製造方法における各工程について説明する。
As a method of manufacturing the support, for example, a process of preparing a specific aluminum alloy, a first processing process of obtaining a compact by subjecting the specific aluminum alloy to a cold impact press process, and a first processing process are obtained. Including a step of subjecting the molded body to solution treatment, a second processing step of performing shape processing on the molded body subjected to solution treatment, and a step of performing age hardening treatment on the molded body subjected to shape processing. The method obtained by a process is mentioned.
Hereinafter, each process in said manufacturing method is demonstrated.
図5は、特定アルミニウム合金の被加工材料(以下、被加工材料を「スラグ」と称することがある)を冷間インパクトプレス加工(以下、単に「インパクトプレス加工」と称することがある)によって、円筒状に成形する工程の一例を示す。図6は、インパクトプレス加工によって成形した円筒状の成形体の外周面に、しごき加工を施して本実施形態に係る支持体を製造する工程の一例を示している。 FIG. 5 shows a work material of a specific aluminum alloy (hereinafter, the work material may be referred to as “slag”) by cold impact press work (hereinafter, may be simply referred to as “impact press work”). An example of the process of shape | molding in a cylindrical shape is shown. FIG. 6 shows an example of a process for producing a support according to the present embodiment by ironing the outer peripheral surface of a cylindrical molded body formed by impact press processing.
−特定アルミニウム合金の準備−
まず、加工する材料となる特定アルミニウム合金を準備し、潤滑材を塗布した特定アルミニウム合金のスラグ30を用意する。
なお、特定アルミニウム合金以外のアルミニウムを含む金属(例えば純アルミニウム)を用いた場合には、以下の工程によって製造しても、高硬度、高強度の支持体が得られないことがある。
-Preparation of specific aluminum alloy-
First, a specific aluminum alloy as a material to be processed is prepared, and a specific aluminum alloy slag 30 coated with a lubricant is prepared.
When a metal containing aluminum other than the specific aluminum alloy (for example, pure aluminum) is used, a support with high hardness and high strength may not be obtained even if manufactured by the following steps.
−インパクトプレス加工(第1の加工)−
潤滑材を塗布した特定アルミニウム合金のスラグ30を、図5(A)に示すようにダイ(雌型)20に設けられている円形孔24にセットする。次いで、図5(B)に示すように、ダイ20にセットしたスラグ30を円柱状のパンチ(雄型)21によりプレスする。これにより、スラグ30がダイ20の円形孔24からパンチ21の周囲を覆うように円筒状に伸びて成形される。成形後、図5(C)に示すように、パンチ21を引き上げてストリッパー22の中央孔23を通すことにより、パンチ21が引き抜かれて円筒状の成形体4Aが得られる。
-Impact pressing (first processing)-
A slag 30 of a specific aluminum alloy coated with a lubricant is set in a circular hole 24 provided in a die (female mold) 20 as shown in FIG. Next, as shown in FIG. 5B, the slag 30 set on the die 20 is pressed by a cylindrical punch (male) 21. Thereby, the slag 30 is formed in a cylindrical shape so as to cover the periphery of the punch 21 from the circular hole 24 of the die 20. After molding, as shown in FIG. 5C, the punch 21 is pulled up and passed through the central hole 23 of the stripper 22, whereby the punch 21 is pulled out to obtain a cylindrical molded body 4A.
このようなインパクトプレス加工によれば、加工硬化によって硬度が上がり、厚みが薄く、かつ、硬度が高いアルミニウム合金製の円筒状の成形体4Aが製造される。
成形体4Aの厚みは特に限定されない。例えば、厚み(肉厚)が0.03mm以上1.5mm以下の支持体を作製する場合には、インパクトプレス加工により成形した成形体4Aの厚みは、0.1mm以上2.0mm以下であることが好ましく、0.05mm以上1.7mm以下であることがより好ましい。
According to such an impact press process, the cylindrical molded body 4A made of an aluminum alloy having a high hardness due to work hardening, a small thickness, and a high hardness is manufactured.
The thickness of the molded body 4A is not particularly limited. For example, when producing a support having a thickness (wall thickness) of 0.03 mm or more and 1.5 mm or less, the thickness of the molded body 4A formed by impact press processing is 0.1 mm or more and 2.0 mm or less. It is more preferable that it is 0.05 mm or more and 1.7 mm or less.
−溶体化処理−
インパクトプレス加工により成形された円筒状の成形体4Aを加熱した後、冷却する。この処理により、円筒状の成形体4Aを構成する特定アルミニウム合金は、合金成分がムラなく固溶した状態(つまり、合金成分がアルミニウム合金中に溶け込んだ状態)となり、軟らかい状態となる。
-Solution treatment-
The cylindrical shaped body 4A formed by impact pressing is heated and then cooled. By this treatment, the specific aluminum alloy constituting the cylindrical molded body 4A is in a soft state where the alloy components are in solid solution without unevenness (that is, the alloy components are dissolved in the aluminum alloy).
溶体化処理の加熱温度は、300℃以上600℃以下の温度範囲で行ことがよい。形状精度をより向上させる観点から、350℃以上600℃以下で行ことが好ましい。さらに、380℃以上600℃以下で行ことが好ましい。
また、加熱時間は、0.2時間以上4.0時間以下の範囲で行うことがよい。同じ観点から、0.4時間以上3.0時間以下で行うことが好ましい。さらに、0.5時間以上2時間以下で行ことが好ましい。
The heating temperature of the solution treatment is preferably performed in a temperature range of 300 ° C. or more and 600 ° C. or less. From the viewpoint of further improving the shape accuracy, it is preferable to carry out at 350 ° C. or more and 600 ° C. or less. Furthermore, it is preferable to carry out at 380 ° C. or more and 600 ° C. or less.
The heating time is preferably in the range of 0.2 hours to 4.0 hours. From the same viewpoint, it is preferable to carry out in 0.4 hours or more and 3.0 hours or less. Furthermore, it is preferable to carry out in 0.5 hours or more and 2 hours or less.
溶体化処理により加熱された円筒状の成形体4Aを冷却する速度としては、特定アルミニウム合金中の合金成分が、固溶した状態、及び軟らかい状態を得る点で、例えば、1℃/秒以上の冷却速度で冷却することがよい。また、冷却した特定アルミニウム合金の温度としては、例えば、室温(例えば25℃)以上100℃以下まで冷却することがよい。 The cooling rate of the cylindrical shaped body 4A heated by the solution treatment is, for example, 1 ° C./second or more in that the alloy component in the specific aluminum alloy is in a solid solution state and a soft state. It is preferable to cool at a cooling rate. Moreover, as temperature of the cooled specific aluminum alloy, it is good to cool to room temperature (for example, 25 degreeC) or more and 100 degrees C or less, for example.
−形状加工(第2の加工)−
次に、上記の溶体化処理を行った円筒状の成形体4Aに対し形状加工を行い、成形体4Aの形状矯正を行う。形状加工は、例えば、図6(A)に示すように、溶体化処理を行った円筒状の成形体4Aを、内部から円柱状のパンチ31によりダイス32に押し込んでしぼり加工を施して径を小さくする。その後、図6(B)に示すように、さらに径を小さくしたダイス33間に押し込んでしごき加工を施す。形状加工は、しぼり加工を経ずにしごき加工を施してもよく、しごき加工を複数段階に分けて行ってもよい。つまり、しぼり加工、及びしごき加工のいずれか一方、又はそれら両方の加工を施すことができる。なお、しごき加工の回数によって、成形体4Bの厚み及び円筒度が調整され得る。
-Shape processing (second processing)-
Next, shape processing is performed on the cylindrical molded body 4A subjected to the above-described solution treatment to correct the shape of the molded body 4A. For example, as shown in FIG. 6 (A), the shape processing is performed by pressing a cylindrical shaped body 4A subjected to solution treatment into a die 32 by a cylindrical punch 31 from the inside to perform a squeezing process to reduce the diameter. Make it smaller. Thereafter, as shown in FIG. 6B, the ironing process is performed by pressing between the dies 33 having a further reduced diameter. The shape processing may be performed without squeezing, or may be performed in a plurality of stages. That is, it is possible to perform either or both of the squeezing process and the ironing process. Note that the thickness and cylindricity of the molded body 4B can be adjusted by the number of times of ironing.
形状成形後の成形体4Bの厚みは特に限定されない。例えば、厚み(肉厚)が0.03mm以上1.5mm以下の支持体を作製する場合には、0.1mm以上2.0mm以下であることが好ましく、0.05mm以上1.7mm以下であることがより好ましい。 The thickness of the molded body 4B after shape molding is not particularly limited. For example, when producing a support having a thickness (wall thickness) of 0.03 mm or more and 1.5 mm or less, the thickness is preferably 0.1 mm or more and 2.0 mm or less, and 0.05 mm or more and 1.7 mm or less. It is more preferable.
−時効硬化処理−
次に、上記の形状加工により形状矯正された円筒状の成形体4Bを加熱して保持する。この処理によって、円筒状の成形体4Bを構成する特定アルミニウム合金は、合金成分が析出し(つまり、析出強化)、得られた支持体は、高硬度、高強度の状態となる。
-Age hardening treatment-
Next, the cylindrical molded body 4B whose shape has been corrected by the above-described shape processing is heated and held. By this treatment, the alloy component is precipitated in the specific aluminum alloy constituting the cylindrical molded body 4B (that is, precipitation strengthening), and the obtained support is in a state of high hardness and high strength.
時効硬化処理の加熱温度としては、支持体の強度を向上させる点で、100℃以上300℃以下の範囲で行うことがよい。保持時間としては、1時間以上で行うことがよい。保持時間の上限は特に制限はないが、例えば、3時間以下の範囲で行うことが好ましい。 The heating temperature for the age hardening treatment is preferably in the range of 100 ° C. or higher and 300 ° C. or lower in terms of improving the strength of the support. The holding time is preferably 1 hour or longer. The upper limit of the holding time is not particularly limited, but for example, it is preferably performed in a range of 3 hours or less.
以上の工程により製造することで、薄肉化しても、強度が高く、形状精度が高い支持体が得られる。すなわち、冷間インパクトプレス加工により加工した成形体を、溶体化処理によって成形体を軟化させ、軟化させた状態の成形体を形状加工により形状矯正し、さらに、時効硬化処理により合金成分を析出させる工程により、上記特性が得られる。そして、薄肉化することで、軽量化された支持体が得られる。 By manufacturing according to the above steps, a support having high strength and high shape accuracy can be obtained even if it is thinned. That is, a molded body processed by cold impact press processing is softened by a solution treatment, the molded body in a softened state is shaped by shape processing, and further alloy components are precipitated by age hardening processing. Depending on the process, the above characteristics are obtained. And the support body reduced in weight is obtained by thinning.
本実施形態の支持体は、例えば、0.03mm以上1.5mm以下の厚み(肉厚)で作製され得る。より強度が高く、より形状精度が高い支持体を作製する観点から、0.03mm以上1.0mm以下が好ましく、0.05mm以上1.0mm以下がより好ましく、0.1mm以上0.9mm以下であることがさらに好ましく、0.2mm以上0.8mm以下であることが特に好ましい。 The support of the present embodiment can be produced with a thickness (wall thickness) of 0.03 mm or more and 1.5 mm or less, for example. From the viewpoint of producing a support having higher strength and higher shape accuracy, 0.03 mm to 1.0 mm is preferable, 0.05 mm to 1.0 mm is more preferable, and 0.1 mm to 0.9 mm is preferable. More preferably, it is more preferably 0.2 mm or more and 0.8 mm or less.
本実施形態の支持体は、アルミニウム合金の組成を前述の特定の成分組成とし、かつ上記の各工程により作製することで、結晶粒の平均面積が、3.0μm2以上100μm2以下である支持体が得られる。上記工程により支持体を作製する場合には、例えば、溶体化処理の条件(加熱条件、冷却条件)、及び時効硬化処理の条件等により、結晶粒の平均面積を調整することができる。例えば、時効硬化処理の際の温度を高くするほど、また時間を長くするほど、合金成分の析出が促進されて結晶粒が微細化され、結晶粒の平均面積が小さくなる傾向にある。 The support of the present embodiment is a support in which the average area of crystal grains is 3.0 μm 2 or more and 100 μm 2 or less by making the composition of the aluminum alloy into the above-mentioned specific component composition and by each of the above steps. The body is obtained. In the case of producing a support by the above steps, for example, the average area of crystal grains can be adjusted according to the solution treatment conditions (heating conditions, cooling conditions), age hardening treatment conditions, and the like. For example, the higher the temperature during the age hardening treatment and the longer the time, the more the precipitation of the alloy components is promoted and the crystal grains become finer, and the average area of the crystal grains tends to be smaller.
(物性)
本実施形態の支持体は、形状精度(円筒度等)が高いものが得られる。円筒度とは、本来円筒でなければならない部分の幾何学的円筒からの狂いの大きさの程度を数字で表したものである。本実施形態の支持体は、例えば、60μm以下の円筒度を示すものが得られる。形状精度をより高いものとする点で、円筒度は40μm以下であることがより好ましい。
また、形状精度を表す指標としては、円筒度の他に、真円度、同軸度が挙げられる。形状精度をより高いものとする点で、真円度は、30μm以下であることが好ましく、同軸度は、20μm以下であることが好ましい。
(Physical properties)
The support of this embodiment can be obtained with a high shape accuracy (cylindricity or the like). The cylindricity is a numerical value representing the degree of deviation from the geometric cylinder of a portion that should originally be a cylinder. As the support of the present embodiment, for example, one having a cylindricity of 60 μm or less is obtained. It is more preferable that the cylindricity is 40 μm or less from the viewpoint of higher shape accuracy.
In addition to the cylindricity, the index representing the shape accuracy includes roundness and coaxiality. The roundness is preferably 30 μm or less and the coaxiality is preferably 20 μm or less from the viewpoint of higher shape accuracy.
なお、円筒度、真円度、及び同軸度の測定は、東京精密社製ロンコム60Aを用いて、倍率:200倍、測定速度:(回転)6°/min、(上下移動)3mm/sec、フィルタ:デジタルフィルタ 2RC の条件で測定する。 In addition, the measurement of cylindricity, roundness, and coaxiality was carried out using a Roncom 60A manufactured by Tokyo Seimitsu Co., Ltd., magnification: 200 times, measurement speed: (rotation) 6 ° / min, (vertical movement) 3 mm / sec, Filter: Measured under the condition of digital filter 2RC.
また、支持体の厚み(肉厚)の偏り(本明細書において、「偏肉」と称することがある)は小さいほうが好ましく、例えば、偏肉は30μm以下であることが好ましい。
なお、偏肉は、ポイントマイクロメータを用いて、支持体の端部の断面の肉厚を対角線上に4点測定し、最大値と最小値の差を計測した値である。
Further, it is preferable that the thickness (thickness) of the support is uneven (sometimes referred to as “uneven thickness” in this specification). For example, the uneven thickness is preferably 30 μm or less.
The uneven thickness is a value obtained by measuring the thickness of the cross section of the end portion of the support at four points on a diagonal line using a point micrometer and measuring the difference between the maximum value and the minimum value.
本実施形態の支持体は、上記範囲を示す円筒度、真円度、同軸度、及び偏肉が得られるため、特に感光体用の支持体としての特性を満足し得るものとなる。 The support of this embodiment can satisfy the characteristics as a support for a photoconductor, in particular, because cylindricity, roundness, coaxiality, and uneven thickness in the above ranges are obtained.
(用途)
本実施形態に係る導電性支持体は、特に限定されることなく種々の用途に使用し得る。例えば、画像形成装置に用いられる電子写真用感光体における支持体(導電性基体)、電子写真用定着ロールにおける支持体、電子写真用現像ロールにおける支持体等が挙げられる。
(Use)
The conductive support according to the present embodiment is not particularly limited and can be used for various applications. Examples thereof include a support (conductive substrate) in an electrophotographic photoreceptor used in an image forming apparatus, a support in an electrophotographic fixing roll, and a support in an electrophotographic developing roll.
次いで、本実施形態に係る支持体を導電性基体として用いた電子写真感光体について説明する。 Next, an electrophotographic photoreceptor using the support according to this embodiment as a conductive substrate will be described.
[電子写真感光体]
本実施形態に係る電子写真感光体は、本実施形態に係る支持体と、支持体上に配置された感光層と、を有して構成される。
図1は、本実施形態に係る電子写真感光体7Aの層構成の一例を示す模式断面図である。図1に示す電子写真感光体7Aは、支持体4上に、下引層1、電荷発生層2及び電荷輸送層3がこの順序で積層された構造を有し、電荷発生層2及び電荷輸送層3が感光層5を構成している。
[Electrophotographic photoreceptor]
The electrophotographic photoreceptor according to the exemplary embodiment includes the support according to the exemplary embodiment and a photosensitive layer disposed on the support.
FIG. 1 is a schematic cross-sectional view showing an example of the layer structure of the electrophotographic photoreceptor 7A according to this embodiment. The electrophotographic photoreceptor 7A shown in FIG. 1 has a structure in which an undercoat layer 1, a charge generation layer 2, and a charge transport layer 3 are laminated in this order on a support 4, and the charge generation layer 2 and the charge transport layer are transported. Layer 3 constitutes photosensitive layer 5.
図2乃至図4は、それぞれ本実施形態に係る電子写真感光体の層構成の他の例を示す模式断面図である。
図2及び図3に示す電子写真感光体7B、7Cは、図1に示す電子写真感光体7Aと同様に、電荷発生層2と電荷輸送層3とに機能が分離された感光層5を備えるものであり、最外層として保護層6が形成されている。図2に示す電子写真感光体7Bは支持体4上に下引層1、電荷発生層2、電荷輸送層3及び保護層6が順次積層された構造を有する。図3に示す電子写真感光体7Cは、支持体4上に下引層1、電荷輸送層3、電荷発生層2、保護層6が順次積層された構造を有する。
2 to 4 are schematic cross-sectional views showing other examples of the layer structure of the electrophotographic photosensitive member according to this embodiment.
Similar to the electrophotographic photoreceptor 7A shown in FIG. 1, the electrophotographic photoreceptors 7B and 7C shown in FIGS. 2 and 3 include a photosensitive layer 5 whose functions are separated into a charge generation layer 2 and a charge transport layer 3. The protective layer 6 is formed as the outermost layer. The electrophotographic photoreceptor 7B shown in FIG. 2 has a structure in which an undercoat layer 1, a charge generation layer 2, a charge transport layer 3 and a protective layer 6 are sequentially laminated on a support 4. The electrophotographic photoreceptor 7C shown in FIG. 3 has a structure in which an undercoat layer 1, a charge transport layer 3, a charge generation layer 2, and a protective layer 6 are sequentially laminated on a support 4.
一方、図4に示す電子写真感光体7Dは、電荷発生材料と電荷輸送材料とを同一の層(単層型感光層10)に含有して機能を一体化したものである。図4に示す電子写真感光体7Dは、支持体4上に下引層1、単層型感光層10が順次積層された構造を有する。
なお、各電子写真感光体7A乃至7Dは、下引層1、及び保護層6は必ずしも設けられなくともよい。
On the other hand, the electrophotographic photoreceptor 7D shown in FIG. 4 is one in which a charge generation material and a charge transport material are contained in the same layer (single-layer type photosensitive layer 10) and functions are integrated. The electrophotographic photoreceptor 7D shown in FIG. 4 has a structure in which an undercoat layer 1 and a single-layer type photosensitive layer 10 are sequentially laminated on a support 4.
In each of the electrophotographic photoreceptors 7A to 7D, the undercoat layer 1 and the protective layer 6 are not necessarily provided.
以下、電子写真感光体の各要素について説明する。なお、各要素の符号は省略して説明する。 Hereinafter, each element of the electrophotographic photosensitive member will be described. In addition, the code | symbol of each element is abbreviate | omitted and demonstrated.
(導電性基体)
導電性基体には、前述の本実施形態に係る支持体が用いられる。
(Conductive substrate)
The support according to the above-described embodiment is used for the conductive substrate.
導電性基体の表面は、電子写真感光体がレーザプリンタに使用される場合、レーザ光を照射する際に生じる干渉縞を抑制する目的で、中心線平均粗さRaで0.04μm以上0.5μm以下に粗面化されていることが好ましい。なお、非干渉光を光源に用いる場合、干渉縞防止の粗面化は、特に必要ないが、導電性基体の表面の凹凸による欠陥の発生を抑制するため、より長寿命化に適する。 When the electrophotographic photosensitive member is used in a laser printer, the surface of the conductive substrate has a center line average roughness Ra of 0.04 μm or more and 0.5 μm for the purpose of suppressing interference fringes generated when laser light is irradiated. The surface is preferably roughened below. When non-interfering light is used as a light source, roughening for preventing interference fringes is not particularly required, but it is suitable for extending the life because it suppresses generation of defects due to irregularities on the surface of the conductive substrate.
粗面化の方法としては、例えば、研磨剤を水に懸濁させて支持体に吹き付けることによって行う湿式ホーニング、回転する砥石に導電性基体を圧接し、連続的に研削加工を行うセンタレス研削、陽極酸化処理等が挙げられる。 As a roughening method, for example, wet honing performed by suspending an abrasive in water and spraying it on a support, centerless grinding in which a conductive substrate is pressed against a rotating grindstone, and grinding is continuously performed, Anodizing treatment etc. are mentioned.
粗面化の方法としては、導電性基体の表面を粗面化することなく、導電性又は半導電性粉体を樹脂中に分散させて、導電性基体の表面上に層を形成し、その層中に分散させる粒子により粗面化する方法も挙げられる。 As a roughening method, without roughening the surface of the conductive substrate, conductive or semiconductive powder is dispersed in the resin to form a layer on the surface of the conductive substrate. The method of roughening by the particle | grains disperse | distributed in a layer is also mentioned.
陽極酸化による粗面化処理は、導電性基体を陽極とし電解質溶液中で陽極酸化することにより導電性基体の表面に酸化膜を形成するものである。電解質溶液としては、例えば、硫酸溶液、シュウ酸溶液等が挙げられる。しかし、陽極酸化により形成された多孔質陽極酸化膜は、そのままの状態では化学的に活性であり、汚染され易く、環境による抵抗変動も大きい。そこで、多孔質陽極酸化膜に対して、酸化膜の微細孔を加圧水蒸気又は沸騰水中(ニッケル等の金属塩を加えてもよい)で水和反応による体積膨張でふさぎ、より安定な水和酸化物に変える封孔処理を行うことが好ましい。 The roughening treatment by anodic oxidation is to form an oxide film on the surface of the conductive substrate by anodizing in an electrolyte solution using the conductive substrate as an anode. Examples of the electrolyte solution include a sulfuric acid solution and an oxalic acid solution. However, the porous anodic oxide film formed by anodic oxidation is chemically active as it is, easily contaminated, and has a large resistance fluctuation due to the environment. Therefore, the pores of the oxide film are blocked by the volume expansion due to the hydration reaction in pressurized water vapor or boiling water (a metal salt such as nickel may be added) against the porous anodic oxide film, and more stable hydration oxidation It is preferable to perform a sealing treatment for changing to a product.
陽極酸化膜の膜厚は、例えば、0.3μm以上15μm以下が好ましい。この膜厚が上記範囲内にあると、注入に対するバリア性が発揮される傾向があり、また繰り返し使用による残留電位の上昇が抑えられる傾向にある。 The thickness of the anodized film is preferably, for example, 0.3 μm or more and 15 μm or less. When this film thickness is within the above range, the barrier property against implantation tends to be exhibited, and the increase in residual potential due to repeated use tends to be suppressed.
導電性基体には、酸性処理液による処理又はベーマイト処理を施してもよい。
酸性処理液による処理は、例えば、以下のようにして実施される。先ず、リン酸、クロム酸及びフッ酸を含む酸性処理液を調製する。酸性処理液におけるリン酸、クロム酸及びフッ酸の配合割合は、例えば、リン酸が10質量%以上11質量%以下の範囲、クロム酸が3質量%以上5質量%以下の範囲、フッ酸が0.5質量%以上2質量%以下の範囲であって、これらの酸全体の濃度は13.5質量%以上18質量%以下の範囲がよい。処理温度は例えば42℃以上48℃以下が好ましい。被膜の膜厚は、0.3μm以上15μm以下が好ましい。
The conductive substrate may be treated with an acidic treatment liquid or boehmite treatment.
The treatment with the acidic treatment liquid is performed as follows, for example. First, an acidic treatment liquid containing phosphoric acid, chromic acid and hydrofluoric acid is prepared. The mixing ratio of phosphoric acid, chromic acid and hydrofluoric acid in the acidic treatment liquid is, for example, in the range of 10% by mass to 11% by mass of phosphoric acid, in the range of 3% by mass to 5% by mass of chromic acid, The concentration of these acids is preferably in the range of 13.5% by mass or more and 18% by mass or less. The treatment temperature is preferably 42 ° C. or higher and 48 ° C. or lower, for example. The film thickness is preferably from 0.3 μm to 15 μm.
ベーマイト処理は、例えば90℃以上100℃以下の純水中に5分から60分間浸漬すること、又は90℃以上120℃以下の加熱水蒸気に5分から60分間接触させて行う。被膜の膜厚は、0.1μm以上5μm以下が好ましい。これをさらにアジピン酸、硼酸、硼酸塩、燐酸塩、フタル酸塩、マレイン酸塩、安息香酸塩、酒石酸塩、クエン酸塩等の被膜溶解性の低い電解質溶液を用いて陽極酸化処理してもよい。 The boehmite treatment is performed, for example, by immersing in pure water of 90 ° C. or higher and 100 ° C. or lower for 5 minutes to 60 minutes, or by contacting with heated steam of 90 ° C. or higher and 120 ° C. or lower for 5 minutes to 60 minutes. The film thickness is preferably 0.1 μm or more and 5 μm or less. This may be further anodized using an electrolyte solution with low film solubility such as adipic acid, boric acid, borate, phosphate, phthalate, maleate, benzoate, tartrate, citrate, etc. Good.
(下引層)
下引層は、例えば、無機粒子と結着樹脂とを含む層である。
(Undercoat layer)
The undercoat layer is, for example, a layer containing inorganic particles and a binder resin.
無機粒子としては、例えば、粉体抵抗(体積抵抗率)102Ωcm以上1011Ωcm以下の無機粒子が挙げられる。
これらの中でも、上記抵抗値を有する無機粒子としては、例えば、酸化錫粒子、酸化チタン粒子、酸化亜鉛粒子、酸化ジルコニウム粒子等の金属酸化物粒子がよく、特に、酸化亜鉛粒子が好ましい。
Examples of the inorganic particles include inorganic particles having a powder resistance (volume resistivity) of 10 2 Ωcm or more and 10 11 Ωcm or less.
Among these, as the inorganic particles having the resistance value, for example, metal oxide particles such as tin oxide particles, titanium oxide particles, zinc oxide particles, and zirconium oxide particles are preferable, and zinc oxide particles are particularly preferable.
無機粒子のBET法による比表面積は、例えば、10m2/g以上がよい。
無機粒子の体積平均粒径は、例えば、50nm以上2000nm以下(好ましくは60nm以上1000nm以下)がよい。
The specific surface area of the inorganic particles by the BET method is preferably 10 m 2 / g or more, for example.
The volume average particle diameter of the inorganic particles is, for example, preferably from 50 nm to 2000 nm (preferably from 60 nm to 1000 nm).
無機粒子の含有量は、例えば、結着樹脂に対して、10質量%以上80質量%以下であることが好ましく、より好ましくは40質量%以上80質量%以下である。 For example, the content of the inorganic particles is preferably 10% by mass or more and 80% by mass or less, and more preferably 40% by mass or more and 80% by mass or less with respect to the binder resin.
無機粒子は、表面処理が施されていてもよい。無機粒子は、表面処理の異なるもの、又は、粒子径の異なるものを2種以上混合して用いてもよい。 The inorganic particles may be subjected to a surface treatment. Two or more inorganic particles having different surface treatments or particles having different particle diameters may be mixed and used.
表面処理剤としては、例えば、シランカップリング剤、チタネート系カップリング剤、アルミニウム系カップリング剤、界面活性剤等が挙げられる。特に、シランカップリング剤が好ましく、アミノ基を有するシランカップリング剤がより好ましい。 Examples of the surface treatment agent include a silane coupling agent, a titanate coupling agent, an aluminum coupling agent, and a surfactant. In particular, a silane coupling agent is preferable, and an amino group-containing silane coupling agent is more preferable.
アミノ基を有するシランカップリング剤としては、例えば、3−アミノプロピルトリエトキシシラン、N−2−(アミノエチル)−3−アミノプロピルトリメトキシシラン、N−2−(アミノエチル)−3−アミノプロピルメチルジメトキシシラン、N,N−ビス(2−ヒドロキシエチル)−3−アミノプロピルトリエトキシシラン等が挙げられるが、これらに限定されるものではない。 Examples of the silane coupling agent having an amino group include 3-aminopropyltriethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, and N-2- (aminoethyl) -3-amino. Examples include, but are not limited to, propylmethyldimethoxysilane, N, N-bis (2-hydroxyethyl) -3-aminopropyltriethoxysilane, and the like.
シランカップリング剤は、2種以上混合して使用してもよい。例えば、アミノ基を有するシランカップリング剤と他のシランカップリング剤とを併用してもよい。この他のシランカップリング剤としては、例えば、ビニルトリメトキシシラン、3−メタクリルオキシプロピル−トリス(2−メトキシエトキシ)シラン、2−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、3−グリシドキシプロピルトリメトキシシラン、ビニルトリアセトキシシラン、3−メルカプトプロピルトリメトキシシラン、3−アミノプロピルトリエトキシシラン、N−2−(アミノエチル)−3−アミノプロピルトリメトキシシラン、N−2−(アミノエチル)−3−アミノプロピルメチルジメトキシシラン、N,N−ビス(2−ヒドロキシエチル)−3−アミノプロピルトリエトキシシラン、3−クロロプロピルトリメトキシシラン等が挙げられるが、これらに限定されるものではない。 Two or more silane coupling agents may be used in combination. For example, a silane coupling agent having an amino group and another silane coupling agent may be used in combination. Other silane coupling agents include, for example, vinyltrimethoxysilane, 3-methacryloxypropyl-tris (2-methoxyethoxy) silane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycol. Sidoxypropyltrimethoxysilane, vinyltriacetoxysilane, 3-mercaptopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, N-2- ( Aminoethyl) -3-aminopropylmethyldimethoxysilane, N, N-bis (2-hydroxyethyl) -3-aminopropyltriethoxysilane, 3-chloropropyltrimethoxysilane, and the like, but are not limited thereto. It is not a thing.
表面処理剤による表面処理方法は、公知の方法であればいかなる方法でもよく、乾式法又は湿式法のいずれでもよい。 The surface treatment method using the surface treatment agent may be any method as long as it is a known method, and may be either a dry method or a wet method.
表面処理剤の処理量は、例えば、無機粒子に対して0.5質量%以上10質量%以下が好ましい。 The treatment amount of the surface treatment agent is preferably 0.5% by mass or more and 10% by mass or less with respect to the inorganic particles, for example.
ここで、下引層は、無機粒子と共に電子受容性化合物(アクセプター化合物)を含有することが、電気特性の長期安定性、キャリアブロック性が高まる観点からよい。 Here, the undercoat layer may contain an electron-accepting compound (acceptor compound) together with the inorganic particles from the viewpoint of enhancing the long-term stability of the electric characteristics and the carrier blocking property.
電子受容性化合物としては、例えば、クロラニル、ブロモアニル等のキノン系化合物;テトラシアノキノジメタン系化合物;2,4,7−トリニトロフルオレノン、2,4,5,7−テトラニトロ−9−フルオレノン等のフルオレノン化合物;2−(4−ビフェニル)−5−(4−t−ブチルフェニル)−1,3,4−オキサジアゾール、2,5−ビス(4−ナフチル)−1,3,4−オキサジアゾール、2,5−ビス(4−ジエチルアミノフェニル)−1,3,4オキサジアゾール等のオキサジアゾール系化合物;キサントン系化合物;チオフェン化合物;3,3’,5,5’テトラ−t−ブチルジフェノキノン等のジフェノキノン化合物;等の電子輸送性物質等が挙げられる。
特に、電子受容性化合物としては、アントラキノン構造を有する化合物が好ましい。アントラキノン構造を有する化合物としては、例えば、ヒドロキシアントラキノン化合物、アミノアントラキノン化合物、アミノヒドロキシアントラキノン化合物等が好ましく、具体的には、例えば、アントラキノン、アリザリン、キニザリン、アントラルフィン、プルプリン等が好ましい。
Examples of the electron accepting compound include quinone compounds such as chloranil and bromoanil; tetracyanoquinodimethane compounds; 2,4,7-trinitrofluorenone, 2,4,5,7-tetranitro-9-fluorenone, and the like. 2- (4-biphenyl) -5- (4-t-butylphenyl) -1,3,4-oxadiazole, 2,5-bis (4-naphthyl) -1,3,4- Oxadiazole compounds such as oxadiazole and 2,5-bis (4-diethylaminophenyl) -1,3,4 oxadiazole; xanthone compounds; thiophene compounds; 3,3 ′, 5,5 ′ tetra- electron transporting substances such as diphenoquinone compounds such as t-butyldiphenoquinone;
In particular, the electron-accepting compound is preferably a compound having an anthraquinone structure. As the compound having an anthraquinone structure, for example, a hydroxyanthraquinone compound, an aminoanthraquinone compound, an aminohydroxyanthraquinone compound, and the like are preferable, and specifically, for example, anthraquinone, alizarin, quinizarin, anthralfin, and purpurin are preferable.
電子受容性化合物は、下引層中に無機粒子と共に分散して含まれていてもよいし、無機粒子の表面に付着した状態で含まれていてもよい。 The electron-accepting compound may be dispersed and included in the undercoat layer together with the inorganic particles, or may be included in a state of being attached to the surface of the inorganic particles.
電子受容性化合物を無機粒子の表面に付着させる方法としては、例えば、乾式法、又は、湿式法が挙げられる。 Examples of the method for attaching the electron accepting compound to the surface of the inorganic particles include a dry method and a wet method.
乾式法は、例えば、無機粒子をせん断力の大きなミキサ等で攪拌しながら、直接又は有機溶媒に溶解させた電子受容性化合物を滴下、乾燥空気や窒素ガスとともに噴霧させて、電子受容性化合物を無機粒子の表面に付着する方法である。電子受容性化合物の滴下又は噴霧するときは、溶剤の沸点以下の温度で行うことがよい。電子受容性化合物を滴下又は噴霧した後、更に100℃以上で焼き付けを行ってもよい。焼き付けは電子写真特性が得られる温度、時間であれば特に制限されない。 In the dry method, for example, while stirring inorganic particles with a mixer having a large shearing force or the like, an electron-accepting compound dissolved directly or in an organic solvent is dropped and sprayed with dry air or nitrogen gas. It is a method of adhering to the surface of inorganic particles. When the electron-accepting compound is dropped or sprayed, it is preferably performed at a temperature not higher than the boiling point of the solvent. After dropping or spraying the electron-accepting compound, baking may be performed at 100 ° C. or higher. The baking is not particularly limited as long as it is a temperature and time for obtaining electrophotographic characteristics.
湿式法は、例えば、攪拌、超音波、サンドミル、アトライター、ボールミル等により、無機粒子を溶剤中に分散しつつ、電子受容性化合物を添加し、攪拌又は分散した後、溶剤除去して、電子受容性化合物を無機粒子の表面に付着する方法である。溶剤除去方法は、例えば、ろ過又は蒸留により留去される。溶剤除去後には、更に100℃以上で焼き付けを行ってもよい。焼き付けは電子写真特性が得られる温度、時間であれば特に限定されない。湿式法においては、電子受容性化合物を添加する前に無機粒子の含有水分を除去してもよく、その例として溶剤中で攪拌加熱しながら除去する方法、溶剤と共沸させて除去する方法が挙げられる。 In the wet method, for example, an electron-accepting compound is added while dispersing inorganic particles in a solvent by stirring, ultrasonic waves, a sand mill, an attritor, a ball mill, etc., and after stirring or dispersing, the solvent is removed to remove electrons. This is a method of attaching a receptive compound to the surface of inorganic particles. The solvent removal method is distilled off by filtration or distillation, for example. After removing the solvent, baking may be performed at 100 ° C. or higher. The baking is not particularly limited as long as it is a temperature and time for obtaining electrophotographic characteristics. In the wet method, the water content of the inorganic particles may be removed before adding the electron-accepting compound. Examples thereof include a method of removing while stirring and heating in a solvent, and a method of removing by azeotropic distillation with a solvent. Can be mentioned.
なお、電子受容性化合物の付着は、表面処理剤による表面処理を無機粒子に施す前又は後に行ってよく、電子受容性化合物の付着と表面処理剤による表面処理と同時に行ってもよい。 The attachment of the electron-accepting compound may be performed before or after the surface treatment with the surface treatment agent is performed on the inorganic particles, or may be performed simultaneously with the attachment of the electron-accepting compound and the surface treatment with the surface treatment agent.
電子受容性化合物の含有量は、例えば、無機粒子に対して0.01質量%以上20質量%以下がよく、好ましくは0.01質量%以上10質量%以下である。 The content of the electron-accepting compound is, for example, from 0.01% by mass to 20% by mass with respect to the inorganic particles, and preferably from 0.01% by mass to 10% by mass.
下引層に用いる結着樹脂としては、例えば、アセタール樹脂(例えばポリビニルブチラール等)、ポリビニルアルコール樹脂、ポリビニルアセタール樹脂、カゼイン樹脂、ポリアミド樹脂、セルロース樹脂、ゼラチン、ポリウレタン樹脂、ポリエステル樹脂、不飽和ポリエステル樹脂、メタクリル樹脂、アクリル樹脂、ポリ塩化ビニル樹脂、ポリビニルアセテート樹脂、塩化ビニル−酢酸ビニル−無水マレイン酸樹脂、シリコーン樹脂、シリコーン−アルキッド樹脂、尿素樹脂、フェノール樹脂、フェノール−ホルムアルデヒド樹脂、メラミン樹脂、ウレタン樹脂、アルキド樹脂、エポキシ樹脂等の公知の高分子化合物;ジルコニウムキレート化合物;チタニウムキレート化合物;アルミニウムキレート化合物;チタニウムアルコキシド化合物;有機チタニウム化合物;シランカップリング剤等の公知の材料が挙げられる。
下引層に用いる結着樹脂としては、例えば、電荷輸送性基を有する電荷輸送性樹脂、導電性樹脂(例えばポリアニリン等)等も挙げられる。
Examples of the binder resin used for the undercoat layer include acetal resins (eg, polyvinyl butyral), polyvinyl alcohol resins, polyvinyl acetal resins, casein resins, polyamide resins, cellulose resins, gelatin, polyurethane resins, polyester resins, and unsaturated polyesters. Resin, methacrylic resin, acrylic resin, polyvinyl chloride resin, polyvinyl acetate resin, vinyl chloride-vinyl acetate-maleic anhydride resin, silicone resin, silicone-alkyd resin, urea resin, phenol resin, phenol-formaldehyde resin, melamine resin, Known polymer compounds such as urethane resin, alkyd resin, epoxy resin; zirconium chelate compound; titanium chelate compound; aluminum chelate compound; titanium alkoxide compound ; Organic titanium compounds; known materials silane coupling agent, and the like.
Examples of the binder resin used for the undercoat layer include a charge transport resin having a charge transport group, a conductive resin (for example, polyaniline) and the like.
これらの中でも、下引層に用いる結着樹脂としては、上層の塗布溶剤に不溶な樹脂が好適であり、特に、尿素樹脂、フェノール樹脂、フェノール−ホルムアルデヒド樹脂、メラミン樹脂、ウレタン樹脂、不飽和ポリエステル樹脂、アルキド樹脂、エポキシ樹脂等の熱硬化性樹脂;ポリアミド樹脂、ポリエステル樹脂、ポリエーテル樹脂、メタクリル樹脂、アクリル樹脂、ポリビニルアルコール樹脂及びポリビニルアセタール樹脂からなる群から選択される少なくとも1種の樹脂と硬化剤との反応により得られる樹脂が好適である。
これら結着樹脂を2種以上組み合わせて使用する場合には、その混合割合は、必要に応じて設定される。
Among these, as the binder resin used for the undercoat layer, a resin insoluble in the upper coating solvent is preferable, and in particular, a urea resin, a phenol resin, a phenol-formaldehyde resin, a melamine resin, a urethane resin, and an unsaturated polyester. Thermosetting resins such as resins, alkyd resins, and epoxy resins; at least one resin selected from the group consisting of polyamide resins, polyester resins, polyether resins, methacrylic resins, acrylic resins, polyvinyl alcohol resins, and polyvinyl acetal resins; Resins obtained by reaction with curing agents are preferred.
When these binder resins are used in combination of two or more, the mixing ratio is set as necessary.
下引層には、電気特性向上、環境安定性向上、画質向上のために種々の添加剤を含んでいてもよい。
添加剤としては、多環縮合系、アゾ系等の電子輸送性顔料、ジルコニウムキレート化合物、チタニウムキレート化合物、アルミニウムキレート化合物、チタニウムアルコキシド化合物、有機チタニウム化合物、シランカップリング剤等の公知の材料が挙げられる。シランカップリング剤は前述のように無機粒子の表面処理に用いられるが、添加剤として更に下引層に添加してもよい。
The undercoat layer may contain various additives for improving electrical characteristics, improving environmental stability, and improving image quality.
Additives include known materials such as electron transport pigments such as polycyclic condensation systems and azo systems, zirconium chelate compounds, titanium chelate compounds, aluminum chelate compounds, titanium alkoxide compounds, organic titanium compounds, and silane coupling agents. It is done. The silane coupling agent is used for the surface treatment of the inorganic particles as described above, but may be further added to the undercoat layer as an additive.
添加剤としてのシランカップリング剤としては、例えば、ビニルトリメトキシシラン、3−メタクリルオキシプロピル−トリス(2−メトキシエトキシ)シラン、2−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、3−グリシドキシプロピルトリメトキシシラン、ビニルトリアセトキシシラン、3−メルカプトプロピルトリメトキシシラン、3−アミノプロピルトリエトキシシラン、N−2−(アミノエチル)−3−アミノプロピルトリメトキシシラン、N−2−(アミノエチル)−3−アミノプロピルメチルメトキシシラン、N,N−ビス(2−ヒドロキシエチル)−3−アミノプロピルトリエトキシシラン、3−クロロプロピルトリメトキシシラン等が挙げられる。 Examples of the silane coupling agent as the additive include vinyltrimethoxysilane, 3-methacryloxypropyl-tris (2-methoxyethoxy) silane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3- Glycidoxypropyltrimethoxysilane, vinyltriacetoxysilane, 3-mercaptopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, N-2- (Aminoethyl) -3-aminopropylmethylmethoxysilane, N, N-bis (2-hydroxyethyl) -3-aminopropyltriethoxysilane, 3-chloropropyltrimethoxysilane and the like can be mentioned.
ジルコニウムキレート化合物としては、例えば、ジルコニウムブトキシド、ジルコニウムアセト酢酸エチル、ジルコニウムトリエタノールアミン、アセチルアセトネートジルコニウムブトキシド、アセト酢酸エチルジルコニウムブトキシド、ジルコニウムアセテート、ジルコニウムオキサレート、ジルコニウムラクテート、ジルコニウムホスホネート、オクタン酸ジルコニウム、ナフテン酸ジルコニウム、ラウリン酸ジルコニウム、ステアリン酸ジルコニウム、イソステアリン酸ジルコニウム、メタクリレートジルコニウムブトキシド、ステアレートジルコニウムブトキシド、イソステアレートジルコニウムブトキシド等が挙げられる。 Examples of the zirconium chelate compound include zirconium butoxide, zirconium zirconium acetoacetate, zirconium triethanolamine, acetylacetonate zirconium butoxide, ethyl acetoacetate butoxide, zirconium acetate, zirconium oxalate, zirconium lactate, zirconium phosphonate, zirconium octoate, Zirconium naphthenate, zirconium laurate, zirconium stearate, zirconium isostearate, methacrylate zirconium butoxide, stearate zirconium butoxide, isostearate zirconium butoxide and the like.
チタニウムキレート化合物としては、例えば、テトライソプロピルチタネート、テトラノルマルブチルチタネート、ブチルチタネートダイマー、テトラ(2−エチルヘキシル)チタネート、チタンアセチルアセトネート、ポリチタンアセチルアセトネート、チタンオクチレングリコレート、チタンラクテートアンモニウム塩、チタンラクテート、チタンラクテートエチルエステル、チタントリエタノールアミネート、ポリヒドロキシチタンステアレート等が挙げられる。 Examples of the titanium chelate compound include tetraisopropyl titanate, tetranormal butyl titanate, butyl titanate dimer, tetra (2-ethylhexyl) titanate, titanium acetylacetonate, polytitanium acetylacetonate, titanium octylene glycolate, and titanium lactate ammonium salt. , Titanium lactate, titanium lactate ethyl ester, titanium triethanolamate, polyhydroxy titanium stearate and the like.
アルミニウムキレート化合物としては、例えば、アルミニウムイソプロピレート、モノブトキシアルミニウムジイソプロピレート、アルミニウムブチレート、ジエチルアセトアセテートアルミニウムジイソプロピレート、アルミニウムトリス(エチルアセトアセテート)等が挙げられる。 Examples of the aluminum chelate compound include aluminum isopropylate, monobutoxy aluminum diisopropylate, aluminum butyrate, diethyl acetoacetate aluminum diisopropylate, aluminum tris (ethyl acetoacetate) and the like.
これらの添加剤は、単独で、又は複数の化合物の混合物若しくは重縮合物として用いてもよい。 These additives may be used alone or as a mixture or polycondensate of a plurality of compounds.
下引層は、ビッカース硬度が35以上であることがよい。
下引層の表面粗さ(十点平均粗さ)は、モアレ像抑制のために、使用される露光用レーザ波長λの1/(4n)(nは上層の屈折率)から1/2までに調整されていることがよい。
表面粗さ調整のために下引層中に樹脂粒子等を添加してもよい。樹脂粒子としてはシリコーン樹脂粒子、架橋型ポリメタクリル酸メチル樹脂粒子等が挙げられる。また、表面粗さ調整のために下引層の表面を研磨してもよい。研磨方法としては、バフ研磨、サンドブラスト処理、湿式ホーニング、研削処理等が挙げられる。
The undercoat layer preferably has a Vickers hardness of 35 or more.
The surface roughness (ten-point average roughness) of the undercoat layer is from 1 / (4n) (where n is the refractive index of the upper layer) to 1/2 of the exposure laser wavelength λ used to suppress moire images. It is good that it is adjusted to.
Resin particles or the like may be added to the undercoat layer for adjusting the surface roughness. Examples of the resin particles include silicone resin particles and cross-linked polymethyl methacrylate resin particles. Further, the surface of the undercoat layer may be polished for adjusting the surface roughness. Examples of the polishing method include buffing, sandblasting, wet honing, and grinding.
下引層の形成は、特に制限はなく、周知の形成方法が利用されるが、例えば、上記成分を溶剤に加えた下引層形成用塗布液の塗膜を形成し、当該塗膜を乾燥し、必要に応じて加熱することで行う。 There is no particular limitation on the formation of the undercoat layer, and a well-known formation method is used. For example, a coating film for forming an undercoat layer in which the above components are added to a solvent is formed, and the coating film is dried. And heating as necessary.
下引層形成用塗布液を調製するための溶剤としては、公知の有機溶剤、例えば、アルコール系溶剤、芳香族炭化水素溶剤、ハロゲン化炭化水素溶剤、ケトン系溶剤、ケトンアルコール系溶剤、エーテル系溶剤、エステル系溶剤等が挙げられる。
これらの溶剤として具体的には、例えば、メタノール、エタノール、n−プロパノール、iso−プロパノール、n−ブタノール、ベンジルアルコール、メチルセルソルブ、エチルセルソルブ、アセトン、メチルエチルケトン、シクロヘキサノン、酢酸メチル、酢酸エチル、酢酸n−ブチル、ジオキサン、テトラヒドロフラン、メチレンクロライド、クロロホルム、クロロベンゼン、トルエン等の通常の有機溶剤が挙げられる。
Solvents for preparing the coating solution for forming the undercoat layer include known organic solvents such as alcohol solvents, aromatic hydrocarbon solvents, halogenated hydrocarbon solvents, ketone solvents, ketone alcohol solvents, ether solvents. Examples include solvents and ester solvents.
Specific examples of these solvents include methanol, ethanol, n-propanol, iso-propanol, n-butanol, benzyl alcohol, methyl cellosolve, ethyl cellosolve, acetone, methyl ethyl ketone, cyclohexanone, methyl acetate, ethyl acetate, Examples include ordinary organic solvents such as n-butyl acetate, dioxane, tetrahydrofuran, methylene chloride, chloroform, chlorobenzene, and toluene.
下引層形成用塗布液を調製するときの無機粒子の分散方法としては、例えば、ロールミル、ボールミル、振動ボールミル、アトライター、サンドミル、コロイドミル、ペイントシェーカー等の公知の方法が挙げられる。 Examples of the dispersion method of the inorganic particles when preparing the coating liquid for forming the undercoat layer include known methods such as a roll mill, a ball mill, a vibration ball mill, an attritor, a sand mill, a colloid mill, and a paint shaker.
下引層形成用塗布液を導電性基体上に塗布する方法としては、例えば、ブレード塗布法、ワイヤーバー塗布法、スプレー塗布法、浸漬塗布法、ビード塗布法、エアーナイフ塗布法、カーテン塗布法等の通常の方法が挙げられる。 Examples of the method for applying the coating liquid for forming the undercoat layer onto the conductive substrate include, for example, a blade coating method, a wire bar coating method, a spray coating method, a dip coating method, a bead coating method, an air knife coating method, and a curtain coating method. The usual methods such as these are mentioned.
下引層の膜厚は、例えば、好ましくは15μm以上、より好ましくは20μm以上50μm以下の範囲内に設定される。 The thickness of the undercoat layer is, for example, preferably set in the range of 15 μm or more, more preferably 20 μm or more and 50 μm or less.
(中間層)
図示は省略するが、下引層と感光層との間に中間層をさらに設けてもよい。
中間層は、例えば、樹脂を含む層である。中間層に用いる樹脂としては、例えば、アセタール樹脂(例えばポリビニルブチラール等)、ポリビニルアルコール樹脂、ポリビニルアセタール樹脂、カゼイン樹脂、ポリアミド樹脂、セルロース樹脂、ゼラチン、ポリウレタン樹脂、ポリエステル樹脂、メタクリル樹脂、アクリル樹脂、ポリ塩化ビニル樹脂、ポリビニルアセテート樹脂、塩化ビニル−酢酸ビニル−無水マレイン酸樹脂、シリコーン樹脂、シリコーン−アルキッド樹脂、フェノール−ホルムアルデヒド樹脂、メラミン樹脂等の高分子化合物が挙げられる。
中間層は、有機金属化合物を含む層であってもよい。中間層に用いる有機金属化合物としては、ジルコニウム、チタニウム、アルミニウム、マンガン、ケイ素等の金属原子を含有する有機金属化合物等が挙げられる。
これらの中間層に用いる化合物は、単独で又は複数の化合物の混合物若しくは重縮合物として用いてもよい。
(Middle layer)
Although illustration is omitted, an intermediate layer may be further provided between the undercoat layer and the photosensitive layer.
An intermediate | middle layer is a layer containing resin, for example. Examples of the resin used for the intermediate layer include an acetal resin (for example, polyvinyl butyral), polyvinyl alcohol resin, polyvinyl acetal resin, casein resin, polyamide resin, cellulose resin, gelatin, polyurethane resin, polyester resin, methacrylic resin, acrylic resin, Polymer compounds such as polyvinyl chloride resin, polyvinyl acetate resin, vinyl chloride-vinyl acetate-maleic anhydride resin, silicone resin, silicone-alkyd resin, phenol-formaldehyde resin, melamine resin, and the like can be given.
The intermediate layer may be a layer containing an organometallic compound. Examples of the organometallic compound used for the intermediate layer include organometallic compounds containing metal atoms such as zirconium, titanium, aluminum, manganese, and silicon.
The compounds used for these intermediate layers may be used alone or as a mixture or polycondensate of a plurality of compounds.
これらの中でも、中間層は、ジルコニウム原子又はケイ素原子を含有する有機金属化合物を含む層であることが好ましい。 Among these, the intermediate layer is preferably a layer containing an organometallic compound containing a zirconium atom or a silicon atom.
中間層の形成は、特に制限はなく、周知の形成方法が利用されるが、例えば、上記成分を溶剤に加えた中間層形成用塗布液の塗膜を形成し、当該塗膜を乾燥、必要に応じて加熱することで行う。
中間層を形成する塗布方法としては、浸漬塗布法、突き上げ塗布法、ワイヤーバー塗布法、スプレー塗布法、ブレード塗布法、ナイフ塗布法、カーテン塗布法等の通常の方法が用いられる。
The formation of the intermediate layer is not particularly limited, and a well-known formation method is used. For example, a coating film of an intermediate layer forming coating solution in which the above components are added to a solvent is formed, and the coating film is dried and necessary. It is performed by heating according to.
As the coating method for forming the intermediate layer, usual methods such as a dip coating method, a push-up coating method, a wire bar coating method, a spray coating method, a blade coating method, a knife coating method, and a curtain coating method are used.
中間層の膜厚は、例えば、好ましくは0.1μm以上3μm以下の範囲に設定される。なお、中間層を下引層として使用してもよい。 For example, the thickness of the intermediate layer is preferably set in a range of 0.1 μm to 3 μm. An intermediate layer may be used as the undercoat layer.
(電荷発生層)
電荷発生層は、例えば、電荷発生材料と結着樹脂とを含む層である。また、電荷発生層は、電荷発生材料の蒸着層であってもよい。電荷発生材料の蒸着層は、LED(Light Emitting Diode)、有機EL(Electro−Luminescence)イメージアレー等の非干渉性光源を用いる場合に好適である。
(Charge generation layer)
The charge generation layer is, for example, a layer containing a charge generation material and a binder resin. The charge generation layer may be a vapor deposition layer of a charge generation material. The vapor-deposited layer of the charge generation material is suitable when an incoherent light source such as an LED (Light Emitting Diode) or an organic EL (Electro-Luminescence) image array is used.
電荷発生材料としては、ビスアゾ、トリスアゾ等のアゾ顔料;ジブロモアントアントロン等の縮環芳香族顔料;ペリレン顔料;ピロロピロール顔料;フタロシアニン顔料;酸化亜鉛;三方晶系セレン等が挙げられる。 Examples of the charge generating material include azo pigments such as bisazo and trisazo; fused aromatic pigments such as dibromoanthanthrone; perylene pigments; pyrrolopyrrole pigments; phthalocyanine pigments; zinc oxide;
これらの中でも、近赤外域のレーザ露光に対応させるためには、電荷発生材料としては、金属フタロシアニン顔料、又は無金属フタロシアニン顔料を用いることが好ましい。具体的には、例えば、特開平5−263007号公報、特開平5−279591号公報等に開示されたヒドロキシガリウムフタロシアニン;特開平5−98181号公報等に開示されたクロロガリウムフタロシアニン;特開平5−140472号公報、特開平5−140473号公報等に開示されたジクロロスズフタロシアニン;特開平4−189873号公報等に開示されたチタニルフタロシアニンがより好ましい。 Among these, in order to cope with near-infrared laser exposure, it is preferable to use a metal phthalocyanine pigment or a metal-free phthalocyanine pigment as the charge generation material. Specifically, for example, hydroxygallium phthalocyanine disclosed in JP-A-5-263007, JP-A-5-279591, etc .; chlorogallium phthalocyanine disclosed in JP-A-5-98181; More preferred are dichlorotin phthalocyanines disclosed in JP-A No. 140472, JP-A No. 5-140473 and the like; and titanyl phthalocyanine disclosed in JP-A No. 4-189873.
一方、近紫外域のレーザ露光に対応させるためには、電荷発生材料としては、ジブロモアントアントロン等の縮環芳香族顔料;チオインジゴ系顔料;ポルフィラジン化合物;酸化亜鉛;三方晶系セレン;特開2004−78147号公報、特開2005−181992号公報に開示されたビスアゾ顔料等が好ましい。 On the other hand, in order to cope with laser exposure in the near-ultraviolet region, as the charge generation material, condensed aromatic pigments such as dibromoanthanthrone; thioindigo pigments; porphyrazine compounds; zinc oxide; trigonal selenium; Bisazo pigments and the like disclosed in 2004-78147 and JP-A-2005-181992 are preferred.
450nm以上780nm以下に発光の中心波長があるLED,有機ELイメージアレー等の非干渉性光源を用いる場合にも、上記電荷発生材料を用いてもよいが、解像度の観点より、感光層を20μm以下の薄膜で用いるときには、感光層中の電界強度が高くなり、基体からの電荷注入による帯電低下、いわゆる黒点と呼ばれる画像欠陥を生じやすくなる。これは、三方晶系セレン、フタロシアニン顔料等のp−型半導体で暗電流を生じやすい電荷発生材料を用いたときに顕著となる。 The above-described charge generation material may also be used in the case of using an incoherent light source such as an LED having a central wavelength of light emission of 450 nm to 780 nm and an organic EL image array. However, from the viewpoint of resolution, the photosensitive layer is 20 μm or less. When the thin film is used, the electric field strength in the photosensitive layer is increased, and a charge decrease due to charge injection from the substrate, that is, an image defect called a black spot is likely to occur. This becomes conspicuous when a charge generating material that easily generates a dark current is used in a p-type semiconductor such as trigonal selenium or a phthalocyanine pigment.
これに対し、電荷発生材料として、縮環芳香族顔料、ペリレン顔料、アゾ顔料等のn−型半導体を用いた場合、暗電流を生じ難く、薄膜にしても黒点と呼ばれる画像欠陥を抑制し得る。n−型の電荷発生材料としては、例えば、特開2012−155282号公報の段落[0288]〜[0291]に記載された化合物(CG−1)〜(CG−27)が挙げられるがこれに限られるものではない。
なお、n−型の判定は、通常使用されるタイムオブフライト法を用い、流れる光電流の極性によって判定され、正孔よりも電子をキャリアとして流しやすいものをn−型とする。
On the other hand, when an n-type semiconductor such as a condensed ring aromatic pigment, perylene pigment, azo pigment or the like is used as the charge generation material, dark current hardly occurs and even a thin film can suppress image defects called black spots. . Examples of the n-type charge generation material include compounds (CG-1) to (CG-27) described in paragraphs [0288] to [0291] of JP2012-155282A. It is not limited.
The n-type determination is performed by using a time-of-flight method that is usually used, and is determined by the polarity of the flowing photocurrent, and an n-type is more likely to flow electrons as carriers than holes.
電荷発生層に用いる結着樹脂としては、広範な絶縁性樹脂から選択され、また、結着樹脂としては、ポリ−N−ビニルカルバゾール、ポリビニルアントラセン、ポリビニルピレン、ポリシラン等の有機光導電性ポリマーから選択してもよい。
結着樹脂としては、例えば、ポリビニルブチラール樹脂、ポリアリレート樹脂(ビスフェノール類と芳香族2価カルボン酸の重縮合体等)、ポリカーボネート樹脂、ポリエステル樹脂、フェノキシ樹脂、塩化ビニル−酢酸ビニル共重合体、ポリアミド樹脂、アクリル樹脂、ポリアクリルアミド樹脂、ポリビニルピリジン樹脂、セルロース樹脂、ウレタン樹脂、エポキシ樹脂、カゼイン、ポリビニルアルコール樹脂、ポリビニルピロリドン樹脂等が挙げられる。ここで、「絶縁性」とは、体積抵抗率が1013Ωcm以上であることをいう。
これらの結着樹脂は1種を単独で又は2種以上を混合して用いられる。
The binder resin used for the charge generation layer is selected from a wide range of insulating resins, and the binder resin is selected from organic photoconductive polymers such as poly-N-vinylcarbazole, polyvinyl anthracene, polyvinyl pyrene, and polysilane. You may choose.
As the binder resin, for example, polyvinyl butyral resin, polyarylate resin (polycondensate of bisphenol and aromatic divalent carboxylic acid, etc.), polycarbonate resin, polyester resin, phenoxy resin, vinyl chloride-vinyl acetate copolymer, Examples thereof include polyamide resin, acrylic resin, polyacrylamide resin, polyvinyl pyridine resin, cellulose resin, urethane resin, epoxy resin, casein, polyvinyl alcohol resin, polyvinyl pyrrolidone resin, and the like. Here, “insulating” means that the volume resistivity is 10 13 Ωcm or more.
These binder resins are used singly or in combination of two or more.
なお、電荷発生材料と結着樹脂の配合比は、質量比で10:1から1:10までの範囲内であることが好ましい。 The mixing ratio of the charge generation material and the binder resin is preferably in the range of 10: 1 to 1:10 by mass ratio.
電荷発生層には、その他、周知の添加剤が含まれていてもよい。 In addition, the charge generation layer may contain a known additive.
電荷発生層の形成は、特に制限はなく、周知の形成方法が利用されるが、例えば、上記成分を溶剤に加えた電荷発生層形成用塗布液の塗膜を形成し、当該塗膜を乾燥し、必要に応じて加熱することで行う。なお、電荷発生層の形成は、電荷発生材料の蒸着により行ってもよい。電荷発生層の蒸着による形成は、特に、電荷発生材料として縮環芳香族顔料、ペリレン顔料を利用する場合に好適である。 The formation of the charge generation layer is not particularly limited, and a known formation method is used. For example, a coating film of a charge generation layer forming coating solution in which the above components are added to a solvent is formed, and the coating film is dried. And heating as necessary. The charge generation layer may be formed by vapor deposition of a charge generation material. Formation of the charge generation layer by vapor deposition is particularly suitable when a condensed ring aromatic pigment or perylene pigment is used as the charge generation material.
電荷発生層形成用塗布液を調製するための溶剤としては、メタノール、エタノール、n−プロパノール、n−ブタノール、ベンジルアルコール、メチルセルソルブ、エチルセルソルブ、アセトン、メチルエチルケトン、シクロヘキサノン、酢酸メチル、酢酸n−ブチル、ジオキサン、テトラヒドロフラン、メチレンクロライド、クロロホルム、クロロベンゼン、トルエン等が挙げられる。これら溶剤は、1種を単独で又は2種以上を混合して用いる。 Solvents for preparing the charge generation layer forming coating solution include methanol, ethanol, n-propanol, n-butanol, benzyl alcohol, methyl cellosolve, ethyl cellosolve, acetone, methyl ethyl ketone, cyclohexanone, methyl acetate, n-acetate. -Butyl, dioxane, tetrahydrofuran, methylene chloride, chloroform, chlorobenzene, toluene and the like. These solvents are used alone or in combination of two or more.
電荷発生層形成用塗布液中に粒子(例えば電荷発生材料)を分散させる方法としては、例えば、ボールミル、振動ボールミル、アトライター、サンドミル、横型サンドミル等のメディア分散機や、攪拌、超音波分散機、ロールミル、高圧ホモジナイザー等のメディアレス分散機が利用される。高圧ホモジナイザーとしては、例えば、高圧状態で分散液を液−液衝突や液−壁衝突させて分散する衝突方式や、高圧状態で微細な流路を貫通させて分散する貫通方式等が挙げられる。
なお、この分散の際、電荷発生層形成用塗布液中の電荷発生材料の平均粒径を0.5μm以下、好ましくは0.3μm以下、更に好ましくは0.15μm以下にすることが有効である。
Examples of a method for dispersing particles (for example, a charge generation material) in a coating solution for forming a charge generation layer include, for example, a media disperser such as a ball mill, a vibrating ball mill, an attritor, a sand mill, a horizontal sand mill, a stirring, an ultrasonic disperser, etc. Medialess dispersers such as roll mills and high-pressure homogenizers are used. Examples of the high-pressure homogenizer include a collision method in which a dispersion liquid is dispersed by liquid-liquid collision or liquid-wall collision in a high pressure state, and a penetration method in which a fine flow path is dispersed in a high pressure state.
In this dispersion, it is effective that the average particle size of the charge generation material in the coating solution for forming the charge generation layer is 0.5 μm or less, preferably 0.3 μm or less, more preferably 0.15 μm or less. .
電荷発生層形成用塗布液を下引層上(又は中間層上)に塗布する方法としては、例えばブレード塗布法、ワイヤーバー塗布法、スプレー塗布法、浸漬塗布法、ビード塗布法、エアーナイフ塗布法、カーテン塗布法等の通常の方法が挙げられる。 Examples of methods for applying the charge generation layer forming coating solution on the undercoat layer (or on the intermediate layer) include blade coating, wire bar coating, spray coating, dip coating, bead coating, and air knife coating. And usual methods such as a curtain coating method.
電荷発生層の膜厚は、例えば、好ましくは0.1μm以上5.0μm以下、より好ましくは0.2μm以上2.0μm以下の範囲内に設定される。 The film thickness of the charge generation layer is, for example, preferably set in the range of 0.1 μm to 5.0 μm, more preferably 0.2 μm to 2.0 μm.
(電荷輸送層)
電荷輸送層は、例えば、電荷輸送材料と結着樹脂とを含む層である。電荷輸送層は、高分子電荷輸送材料を含む層であってもよい。
(Charge transport layer)
The charge transport layer is, for example, a layer containing a charge transport material and a binder resin. The charge transport layer may be a layer containing a polymer charge transport material.
電荷輸送材料としては、p−ベンゾキノン、クロラニル、ブロマニル、アントラキノン等のキノン系化合物;テトラシアノキノジメタン系化合物;2,4,7−トリニトロフルオレノン等のフルオレノン化合物;キサントン系化合物;ベンゾフェノン系化合物;シアノビニル系化合物;エチレン系化合物等の電子輸送性化合物が挙げられる。電荷輸送材料としては、トリアリールアミン系化合物、ベンジジン系化合物、アリールアルカン系化合物、アリール置換エチレン系化合物、スチルベン系化合物、アントラセン系化合物、ヒドラゾン系化合物等の正孔輸送性化合物も挙げられる。これらの電荷輸送材料は1種を単独で又は2種以上で用いられるが、これらに限定されるものではない。 Examples of charge transport materials include quinone compounds such as p-benzoquinone, chloranil, bromanyl and anthraquinone; tetracyanoquinodimethane compounds; fluorenone compounds such as 2,4,7-trinitrofluorenone; xanthone compounds; benzophenone compounds A cyanovinyl compound; an electron transporting compound such as an ethylene compound; Examples of the charge transporting material include hole transporting compounds such as triarylamine compounds, benzidine compounds, arylalkane compounds, aryl-substituted ethylene compounds, stilbene compounds, anthracene compounds, and hydrazone compounds. These charge transport materials may be used alone or in combination of two or more, but are not limited thereto.
電荷輸送材料としては、電荷移動度の観点から、下記構造式(a−1)で示されるトリアリールアミン誘導体、及び下記構造式(a−2)で示されるベンジジン誘導体が好ましい。 As the charge transport material, from the viewpoint of charge mobility, a triarylamine derivative represented by the following structural formula (a-1) and a benzidine derivative represented by the following structural formula (a-2) are preferable.
構造式(a−1)中、ArT1、ArT2、及びArT3は、各々独立に置換若しくは無置換のアリール基、−C6H4−C(RT4)=C(RT5)(RT6)、又は−C6H4−CH=CH−CH=C(RT7)(RT8)を示す。RT4、RT5、RT6、RT7、及びRT8は各々独立に水素原子、置換若しくは無置換のアルキル基、又は置換若しくは無置換のアリール基を示す。
上記各基の置換基としては、ハロゲン原子、炭素数1以上5以下のアルキル基、炭素数1以上5以下のアルコキシ基が挙げられる。また、上記各基の置換基としては、炭素数1以上3以下のアルキル基で置換された置換アミノ基も挙げられる。
In Structural Formula (a-1), Ar T1 , Ar T2 , and Ar T3 are each independently a substituted or unsubstituted aryl group, —C 6 H 4 —C (R T4 ) ═C (R T5 ) (R T6), or -C 6 H 4 -CH = CH- CH = C (R T7) shows the (R T8). R T4 , R T5 , R T6 , R T7 , and R T8 each independently represent a hydrogen atom, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group.
Examples of the substituent for each group include a halogen atom, an alkyl group having 1 to 5 carbon atoms, and an alkoxy group having 1 to 5 carbon atoms. Examples of the substituent of each group also include a substituted amino group substituted with an alkyl group having 1 to 3 carbon atoms.
構造式(a−2)中、RT91及びRT92は各々独立に水素原子、ハロゲン原子、炭素数1以上5以下のアルキル基、又は炭素数1以上5以下のアルコキシ基を示す。RT101、RT102、RT111及びRT112は各々独立に、ハロゲン原子、炭素数1以上5以下のアルキル基、炭素数1以上5以下のアルコキシ基、炭素数1以上2以下のアルキル基で置換されたアミノ基、置換若しくは無置換のアリール基、−C(RT12)=C(RT13)(RT14)、又は−CH=CH−CH=C(RT15)(RT16)を示し、RT12、RT13、RT14、RT15及びRT16は各々独立に水素原子、置換若しくは無置換のアルキル基、又は置換若しくは無置換のアリール基を表す。Tm1、Tm2、Tn1及びTn2は各々独立に0以上2以下の整数を示す。
上記各基の置換基としては、ハロゲン原子、炭素数1以上5以下のアルキル基、炭素数1以上5以下のアルコキシ基が挙げられる。また、上記各基の置換基としては、炭素数1以上3以下のアルキル基で置換された置換アミノ基も挙げられる。
In Structural Formula (a-2), R T91 and R T92 each independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 5 carbon atoms, or an alkoxy group having 1 to 5 carbon atoms. R T101 , R T102 , R T111 and R T112 are each independently substituted with a halogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or an alkyl group having 1 to 2 carbon atoms. A substituted amino group, a substituted or unsubstituted aryl group, —C (R T12 ) ═C (R T13 ) (R T14 ), or —CH═CH— CH═C (R T15 ) (R T16 ), R T12 , R T13 , R T14 , R T15 and R T16 each independently represent a hydrogen atom, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group. Tm1, Tm2, Tn1, and Tn2 each independently represent an integer of 0 or more and 2 or less.
Examples of the substituent for each group include a halogen atom, an alkyl group having 1 to 5 carbon atoms, and an alkoxy group having 1 to 5 carbon atoms. Examples of the substituent of each group also include a substituted amino group substituted with an alkyl group having 1 to 3 carbon atoms.
ここで、構造式(a−1)で示されるトリアリールアミン誘導体、及び前記構造式(a−2)で示されるベンジジン誘導体のうち、特に、「−C6H4−CH=CH−CH=C(RT7)(RT8)」を有するトリアリールアミン誘導体、及び「−CH=CH−CH=C(RT15)(RT16)」を有するベンジジン誘導体が、電荷移動度の観点で好ましい。 Here, among the triarylamine derivative represented by the structural formula (a-1) and the benzidine derivative represented by the structural formula (a-2), in particular, “—C 6 H 4 —CH═CH—CH═ Triarylamine derivatives having “C (R T7 ) (R T8 )” and benzidine derivatives having “—CH═CH— CH═C (R T15 ) (R T16 )” are preferable from the viewpoint of charge mobility.
高分子電荷輸送材料としては、ポリ−N−ビニルカルバゾール、ポリシラン等の電荷輸送性を有する公知のものが用いられる。特に、特開平8−176293号公報、特開平8−208820号公報等に開示されているポリエステル系の高分子電荷輸送材は特に好ましい。なお、高分子電荷輸送材料は、単独で使用してよいが、結着樹脂と併用してもよい。 As the polymer charge transporting material, known materials having charge transporting properties such as poly-N-vinylcarbazole and polysilane are used. In particular, polyester-based polymer charge transport materials disclosed in JP-A-8-176293, JP-A-8-208820 and the like are particularly preferable. The polymer charge transport material may be used alone or in combination with a binder resin.
電荷輸送層に用いる結着樹脂は、ポリカーボネート樹脂、ポリエステル樹脂、ポリアリレート樹脂、メタクリル樹脂、アクリル樹脂、ポリ塩化ビニル樹脂、ポリ塩化ビニリデン樹脂、ポリスチレン樹脂、ポリビニルアセテート樹脂、スチレン−ブタジエン共重合体、塩化ビニリデン−アクリロニトリル共重合体、塩化ビニル−酢酸ビニル共重合体、塩化ビニル−酢酸ビニル−無水マレイン酸共重合体、シリコーン樹脂、シリコーンアルキッド樹脂、フェノール−ホルムアルデヒド樹脂、スチレン−アルキッド樹脂、ポリ−N−ビニルカルバゾール、ポリシラン等が挙げられる。これらの中でも、結着樹脂としては、ポリカーボネート樹脂又はポリアリレート樹脂が好適である。これらの結着樹脂は1種を単独で又は2種以上で用いる。
なお、電荷輸送材料と結着樹脂との配合比は、質量比で10:1から1:5までが好ましい。
The binder resin used for the charge transport layer is polycarbonate resin, polyester resin, polyarylate resin, methacrylic resin, acrylic resin, polyvinyl chloride resin, polyvinylidene chloride resin, polystyrene resin, polyvinyl acetate resin, styrene-butadiene copolymer, Vinylidene chloride-acrylonitrile copolymer, vinyl chloride-vinyl acetate copolymer, vinyl chloride-vinyl acetate-maleic anhydride copolymer, silicone resin, silicone alkyd resin, phenol-formaldehyde resin, styrene-alkyd resin, poly-N -Vinylcarbazole, polysilane, etc. are mentioned. Among these, as the binder resin, a polycarbonate resin or a polyarylate resin is preferable. These binder resins are used alone or in combination of two or more.
The mixing ratio of the charge transport material and the binder resin is preferably 10: 1 to 1: 5 by mass ratio.
電荷輸送層には、その他、周知の添加剤が含まれていてもよい。 In addition, the charge transport layer may contain a known additive.
電荷輸送層の形成は、特に制限はなく、周知の形成方法が利用されるが、例えば、上記成分を溶剤に加えた電荷輸送層形成用塗布液の塗膜を形成し、当該塗膜を乾燥、必要に応じて加熱することで行う。 The formation of the charge transport layer is not particularly limited, and a well-known formation method is used. This is done by heating as necessary.
電荷輸送層形成用塗布液を調製するための溶剤としては、ベンゼン、トルエン、キシレン、クロロベンゼン等の芳香族炭化水素類;アセトン、2−ブタノン等のケトン類;塩化メチレン、クロロホルム、塩化エチレン等のハロゲン化脂肪族炭化水素類;テトラヒドロフラン、エチルエーテル等の環状又は直鎖状のエーテル類等の通常の有機溶剤が挙げられる。これら溶剤は、単独で又は2種以上混合して用いる。 Solvents for preparing the coating solution for forming the charge transport layer include aromatic hydrocarbons such as benzene, toluene, xylene and chlorobenzene; ketones such as acetone and 2-butanone; methylene chloride, chloroform and ethylene chloride. Halogenated aliphatic hydrocarbons: Usual organic solvents such as cyclic or linear ethers such as tetrahydrofuran and ethyl ether. These solvents are used alone or in combination of two or more.
電荷輸送層形成用塗布液を電荷発生層の上に塗布する際の塗布方法としては、ブレード塗布法、ワイヤーバー塗布法、スプレー塗布法、浸漬塗布法、ビード塗布法、エアーナイフ塗布法、カーテン塗布法等の通常の方法が挙げられる。 Coating methods for applying the charge transport layer forming coating solution on the charge generation layer include blade coating method, wire bar coating method, spray coating method, dip coating method, bead coating method, air knife coating method, curtain A usual method such as a coating method may be mentioned.
電荷輸送層の膜厚は、例えば、好ましくは5μm以上50μm以下、より好ましくは10μm以上30μm以下の範囲内に設定される。 The film thickness of the charge transport layer is, for example, preferably set in the range of 5 μm to 50 μm, more preferably 10 μm to 30 μm.
(保護層)
保護層は、必要に応じて感光層上に設けられる。保護層は、例えば、帯電時の感光層の化学的変化を防止したり、感光層の機械的強度をさらに改善する目的で設けられる。
そのため、保護層は、硬化膜(架橋膜)で構成された層を適用することがよい。これら層としては、例えば、下記1)又は2)に示す層が挙げられる。
(Protective layer)
The protective layer is provided on the photosensitive layer as necessary. The protective layer is provided, for example, for the purpose of preventing chemical change of the photosensitive layer during charging or further improving the mechanical strength of the photosensitive layer.
Therefore, it is preferable to apply a layer composed of a cured film (crosslinked film) as the protective layer. Examples of these layers include the layers shown in 1) or 2) below.
1)反応性基及び電荷輸送性骨格を同一分子内に有する反応性基含有電荷輸送材料を含む組成物の硬化膜で構成された層(つまり当該反応性基含有電荷輸送材料の重合体又は架橋体を含む層)
2)非反応性の電荷輸送材料と、電荷輸送性骨格を有さず、反応性基を有する反応性基含有非電荷輸送材料と、を含む組成物の硬化膜で構成された層(つまり、非反応性の電荷輸送材料と、当該反応性基含有非電荷輸送材料の重合体又は架橋体と、を含む層)
1) A layer composed of a cured film of a composition containing a reactive group-containing charge transporting material having a reactive group and a charge transporting skeleton in the same molecule (that is, a polymer or cross-linking of the reactive group-containing charge transporting material) Layer containing body)
2) a layer composed of a cured film of a composition comprising a non-reactive charge transport material and a reactive group-containing non-charge transport material having a reactive group and having no charge transport skeleton (that is, A layer comprising a non-reactive charge transport material and a polymer or a cross-linked product of the reactive group-containing non-charge transport material)
反応性基含有電荷輸送材料の反応性基としては、連鎖重合性基、エポキシ基、−OH、−OR[但し、Rはアルキル基を示す]、−NH2、−SH、−COOH、−SiRQ1 3−Qn(ORQ2)Qn[但し、RQ1は水素原子、アルキル基、又は置換若しくは無置換のアリール基を表し、RQ2は水素原子、アルキル基、トリアルキルシリル基を表す。Qnは1〜3の整数を表す]等の周知の反応性基が挙げられる。 The reactive group of the reactive group-containing charge transport material includes a chain polymerizable group, an epoxy group, —OH, —OR [wherein R represents an alkyl group], —NH 2 , —SH, —COOH, —SiR. Q1 3-Qn (OR Q2 ) Qn [wherein R Q1 represents a hydrogen atom, an alkyl group, or a substituted or unsubstituted aryl group, and R Q2 represents a hydrogen atom, an alkyl group, or a trialkylsilyl group. Qn represents an integer of 1 to 3], and the like, and other well-known reactive groups.
連鎖重合性基としては、ラジカル重合しうる官能基であれば特に限定されるものではなく、例えば、少なくとも炭素二重結合を含有する基を有する官能基である。具体的には、ビニル基、ビニルエーテル基、ビニルチオエーテル基、スチリル基(ビニルフェニル基)、アクリロイル基、メタクリロイル基、及びそれらの誘導体から選択される少なくとも一つを含有する基等が挙げられる。なかでも、その反応性に優れることから、連鎖重合性基としては、ビニル基、スチリル基(ビニルフェニル基)、アクリロイル基、メタクリロイル基、及びそれらの誘導体から選択される少なくとも一つを含有する基であることが好ましい。 The chain polymerizable group is not particularly limited as long as it is a functional group capable of radical polymerization. For example, it is a functional group having a group containing at least a carbon double bond. Specific examples include groups containing at least one selected from vinyl groups, vinyl ether groups, vinyl thioether groups, styryl groups (vinyl phenyl groups), acryloyl groups, methacryloyl groups, and derivatives thereof. Among them, since it is excellent in the reactivity, the chain polymerizable group is a group containing at least one selected from a vinyl group, a styryl group (vinylphenyl group), an acryloyl group, a methacryloyl group, and derivatives thereof. It is preferable that
反応性基含有電荷輸送材料の電荷輸送性骨格としては、電子写真感光体における公知の構造であれば特に限定されるものではなく、例えば、トリアリールアミン系化合物、ベンジジン系化合物、ヒドラゾン系化合物等の含窒素の正孔輸送性化合物に由来する骨格であって、窒素原子と共役している構造が挙げられる。これらの中でも、トリアリールアミン骨格が好ましい。 The charge transporting skeleton of the reactive group-containing charge transporting material is not particularly limited as long as it is a known structure in an electrophotographic photoreceptor, and examples thereof include triarylamine compounds, benzidine compounds, hydrazone compounds, and the like. And a structure conjugated from a nitrogen-containing hole transporting compound and conjugated with a nitrogen atom. Among these, a triarylamine skeleton is preferable.
これら反応性基及び電荷輸送性骨格を有する反応性基含有電荷輸送材料、非反応性の電荷輸送材料、反応性基含有非電荷輸送材料は、周知の材料から選択すればよい。 The reactive group-containing charge transport material having a reactive group and a charge transport skeleton, a non-reactive charge transport material, and a reactive group-containing non-charge transport material may be selected from well-known materials.
保護層には、その他、周知の添加剤が含まれていてもよい。 In addition, the protective layer may contain known additives.
保護層の形成は、特に制限はなく、周知の形成方法が利用されるが、例えば、上記成分を溶剤に加えた保護層形成用塗布液の塗膜を形成し、当該塗膜を乾燥し、必要に応じて加熱等の硬化処理することで行う。 The formation of the protective layer is not particularly limited, and a well-known forming method is used. It is performed by performing a curing process such as heating as necessary.
保護層形成用塗布液を調製するための溶剤としては、トルエン、キシレン等の芳香族系溶剤;メチルエチルケトン、メチルイソブチルケトン、シクロヘキサノン等のケトン系溶剤;酢酸エチル、酢酸ブチル等のエステル系溶剤;テトラヒドロフラン、ジオキサン等のエーテル系溶剤;エチレングリコールモノメチルエーテル等のセロソルブ系溶剤;イソプロピルアルコール、ブタノール等のアルコール系溶剤等が挙げられる。これら溶剤は、単独で又は2種以上混合して用いる。
なお、保護層形成用塗布液は、無溶剤の塗布液であってもよい。
Solvents for preparing the coating solution for forming the protective layer include aromatic solvents such as toluene and xylene; ketone solvents such as methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone; ester solvents such as ethyl acetate and butyl acetate; tetrahydrofuran And ether solvents such as dioxane; cellosolv solvents such as ethylene glycol monomethyl ether; alcohol solvents such as isopropyl alcohol and butanol. These solvents are used alone or in combination of two or more.
The protective layer forming coating solution may be a solventless coating solution.
保護層形成用塗布液を感光層(例えば電荷輸送層)上に塗布する方法としては、浸漬塗布法、突き上げ塗布法、ワイヤーバー塗布法、スプレー塗布法、ブレード塗布法、ナイフ塗布法、カーテン塗布法等の通常の方法が挙げられる。 As a method for applying the coating solution for forming the protective layer on the photosensitive layer (for example, charge transport layer), dip coating method, push-up coating method, wire bar coating method, spray coating method, blade coating method, knife coating method, curtain coating method. Ordinary methods such as a method may be mentioned.
保護層の膜厚は、例えば、好ましくは1μm以上20μm以下、より好ましくは2μm以上10μm以下の範囲内に設定される。 The thickness of the protective layer is, for example, preferably set in the range of 1 μm to 20 μm, more preferably 2 μm to 10 μm.
(単層型感光層)
単層型感光層(電荷発生/電荷輸送層)は、例えば、電荷発生材料と電荷輸送材料と、必要に応じて、結着樹脂、及びその他周知の添加剤と、を含む層である。なお、これら材料は、電荷発生層及び電荷輸送層で説明した材料と同様である。
そして、単層型感光層中、電荷発生材料の含有量は、全固形分に対して10質量%以上85質量%以下がよく、好ましくは20質量%以上50質量%以下である。また、単層型感光層中、電荷輸送材料の含有量は、全固形分に対して5質量%以上50質量%以下がよい。
単層型感光層の形成方法は、電荷発生層や電荷輸送層の形成方法と同様である。
単層型感光層の膜厚は、例えば、5μm以上50μm以下がよく、好ましくは10μm以上40μm以下である。
(Single layer type photosensitive layer)
The single-layer type photosensitive layer (charge generation / charge transport layer) is, for example, a layer containing a charge generation material, a charge transport material, and, if necessary, a binder resin and other known additives. Note that these materials are the same as those described for the charge generation layer and the charge transport layer.
In the single-layer type photosensitive layer, the content of the charge generating material is preferably 10% by mass or more and 85% by mass or less, and preferably 20% by mass or more and 50% by mass or less with respect to the total solid content. In the single-layer type photosensitive layer, the content of the charge transport material is preferably 5% by mass or more and 50% by mass or less based on the total solid content.
The method for forming the single-layer type photosensitive layer is the same as the method for forming the charge generation layer and the charge transport layer.
The film thickness of the single-layer type photosensitive layer is, for example, from 5 μm to 50 μm, and preferably from 10 μm to 40 μm.
[画像形成装置(及びプロセスカートリッジ)]
本実施形態に係る画像形成装置は、電子写真感光体と、電子写真感光体の表面を帯電する帯電手段と、帯電した電子写真感光体の表面に静電潜像を形成する静電潜像形成手段と、トナーを含む現像剤により電子写真感光体の表面に形成された静電潜像を現像してトナー像を形成する現像手段と、トナー像を記録媒体の表面に転写する転写手段と、を備える。そして、電子写真感光体として、上記本実施形態に係る電子写真感光体が適用される。
[Image forming apparatus (and process cartridge)]
The image forming apparatus according to the present embodiment includes an electrophotographic photosensitive member, a charging unit that charges the surface of the electrophotographic photosensitive member, and an electrostatic latent image formation that forms an electrostatic latent image on the surface of the charged electrophotographic photosensitive member. Means, developing means for developing the electrostatic latent image formed on the surface of the electrophotographic photosensitive member with a developer containing toner to form a toner image, and transfer means for transferring the toner image to the surface of the recording medium; Is provided. The electrophotographic photosensitive member according to the present embodiment is applied as the electrophotographic photosensitive member.
本実施形態に係る画像形成装置は、記録媒体の表面に転写されたトナー像を定着する定着手段を備える装置;電子写真感光体の表面に形成されたトナー像を直接記録媒体に転写する直接転写方式の装置;電子写真感光体の表面に形成されたトナー像を中間転写体の表面に一次転写し、中間転写体の表面に転写されたトナー像を記録媒体の表面に二次転写する中間転写方式の装置;トナー像の転写後、帯電前の電子写真感光体の表面をクリーニングするクリーニング手段を備えた装置;トナー像の転写後、帯電前に電子写真感光体の表面に除電光を照射して除電する除電手段を備える装置;電子写真感光体の温度を上昇させ、相対温度を低減させるための電子写真感光体加熱部材を備える装置等の周知の画像形成装置が適用される。 The image forming apparatus according to the present embodiment includes an apparatus having fixing means for fixing a toner image transferred to the surface of a recording medium; direct transfer for directly transferring the toner image formed on the surface of the electrophotographic photosensitive member to the recording medium Type apparatus; intermediate transfer in which the toner image formed on the surface of the electrophotographic photosensitive member is primarily transferred onto the surface of the intermediate transfer member, and the toner image transferred onto the surface of the intermediate transfer member is secondarily transferred onto the surface of the recording medium. Type of apparatus; apparatus with cleaning means for cleaning the surface of the electrophotographic photosensitive member after the toner image is transferred and before charging; after the toner image is transferred, the surface of the electrophotographic photosensitive member is irradiated with a charge eliminating light before charging. A known image forming apparatus such as an apparatus provided with an electrophotographic photoreceptor heating member for raising the temperature of the electrophotographic photoreceptor and reducing the relative temperature is applied.
中間転写方式の装置の場合、転写手段は、例えば、表面にトナー像が転写される中間転写体と、電子写真感光体の表面に形成されたトナー像を中間転写体の表面に一次転写する一次転写手段と、中間転写体の表面に転写されたトナー像を記録媒体の表面に二次転写する二次転写手段と、を有する構成が適用される。 In the case of an intermediate transfer type apparatus, the transfer means includes, for example, an intermediate transfer body on which a toner image is transferred to the surface, and a primary transfer that primarily transfers the toner image formed on the surface of the electrophotographic photosensitive member to the surface of the intermediate transfer body. A configuration including a transfer unit and a secondary transfer unit that secondarily transfers the toner image transferred onto the surface of the intermediate transfer member onto the surface of the recording medium is applied.
本実施形態に係る画像形成装置は、乾式現像方式の画像形成装置、湿式現像方式(液体現像剤を利用した現像方式)の画像形成装置のいずれであってもよい。 The image forming apparatus according to the present embodiment may be either a dry developing type image forming apparatus or a wet developing type (developing type using a liquid developer).
なお、本実施形態に係る画像形成装置において、例えば、電子写真感光体を備える部分が、画像形成装置に対して脱着されるカートリッジ構造(プロセスカートリッジ)であってもよい。プロセスカートリッジとしては、例えば、本実施形態に係る電子写真感光体を備えるプロセスカートリッジが好適に用いられる。なお、プロセスカートリッジには、電子写真感光体以外に、例えば、帯電手段、静電潜像形成手段、現像手段、転写手段からなる群から選択される少なくとも一つを備えてもよい。 Note that in the image forming apparatus according to the present embodiment, for example, the portion including the electrophotographic photosensitive member may have a cartridge structure (process cartridge) that is detachable from the image forming apparatus. As the process cartridge, for example, a process cartridge including the electrophotographic photosensitive member according to this embodiment is preferably used. In addition to the electrophotographic photosensitive member, the process cartridge may include at least one selected from the group consisting of a charging unit, an electrostatic latent image forming unit, a developing unit, and a transfer unit.
以下、本実施形態に係る画像形成装置の一例を示すが、これに限定されるわけではない。なお、図に示す主要部を説明し、その他はその説明を省略する。 Hereinafter, an example of the image forming apparatus according to the present embodiment will be described, but the present invention is not limited thereto. In addition, the main part shown to a figure is demonstrated and the description is abbreviate | omitted about others.
図7は、本実施形態に係る画像形成装置の一例を示す概略構成図である。
本実施形態に係る画像形成装置100は、図7に示すように、電子写真感光体7を備えるプロセスカートリッジ300と、露光装置9(静電潜像形成手段の一例)と、転写装置40(一次転写装置)と、中間転写体50とを備える。なお、画像形成装置100において、露光装置9はプロセスカートリッジ300の開口部から電子写真感光体7に露光し得る位置に配置されており、転写装置40は中間転写体50を介して電子写真感光体7に対向する位置に配置されており、中間転写体50はその一部が電子写真感光体7に接触して配置されている。図示しないが、中間転写体50に転写されたトナー像を記録媒体(例えば用紙)に転写する二次転写装置も有している。なお、中間転写体50、転写装置40(一次転写装置)、及び二次転写装置(不図示)が転写手段の一例に相当する。
FIG. 7 is a schematic configuration diagram illustrating an example of an image forming apparatus according to the present embodiment.
As shown in FIG. 7, the image forming apparatus 100 according to this embodiment includes a process cartridge 300 including an electrophotographic photosensitive member 7, an exposure device 9 (an example of an electrostatic latent image forming unit), and a transfer device 40 (primary. Transfer device) and an intermediate transfer member 50. In the image forming apparatus 100, the exposure device 9 is disposed at a position where the electrophotographic photosensitive member 7 can be exposed from the opening of the process cartridge 300, and the transfer device 40 is interposed between the electrophotographic photosensitive member via the intermediate transfer member 50. 7, and a part of the intermediate transfer member 50 is disposed in contact with the electrophotographic photosensitive member 7. Although not shown, it also has a secondary transfer device that transfers the toner image transferred to the intermediate transfer member 50 to a recording medium (for example, paper). The intermediate transfer member 50, the transfer device 40 (primary transfer device), and the secondary transfer device (not shown) correspond to an example of a transfer unit.
図7におけるプロセスカートリッジ300は、ハウジング内に、電子写真感光体7、帯電装置8(帯電手段の一例)、現像装置11(現像手段の一例)、及びクリーニング装置13(クリーニング手段の一例)を一体に支持している。クリーニング装置13は、クリーニングブレード(クリーニング部材の一例)131を有しており、クリーニングブレード131は、電子写真感光体7の表面に接触するように配置されている。なお、クリーニング部材は、クリーニングブレード131の態様ではなく、導電性又は絶縁性の繊維状部材であってもよく、これを単独で、又はクリーニングブレード131と併用してもよい。 In the process cartridge 300 in FIG. 7, an electrophotographic photosensitive member 7, a charging device 8 (an example of a charging unit), a developing device 11 (an example of a developing unit), and a cleaning device 13 (an example of a cleaning unit) are integrated in a housing. I support it. The cleaning device 13 includes a cleaning blade (an example of a cleaning member) 131, and the cleaning blade 131 is disposed so as to contact the surface of the electrophotographic photosensitive member 7. The cleaning member may be a conductive or insulating fibrous member instead of the cleaning blade 131, and may be used alone or in combination with the cleaning blade 131.
なお、図7には、画像形成装置として、潤滑材14を電子写真感光体7の表面に供給する繊維状部材132(ロール状)、及び、クリーニングを補助する繊維状部材133(平ブラシ状)を備えた例を示してあるが、これらは必要に応じて配置される。 In FIG. 7, as an image forming apparatus, a fibrous member 132 (roll shape) for supplying the lubricant 14 to the surface of the electrophotographic photosensitive member 7 and a fibrous member 133 (flat brush shape) for assisting cleaning are shown. Examples are provided, but these are arranged as necessary.
以下、本実施形態に係る画像形成装置の各構成について説明する。 Hereinafter, each configuration of the image forming apparatus according to the present embodiment will be described.
−帯電装置−
帯電装置8としては、例えば、導電性又は半導電性の帯電ローラ、帯電ブラシ、帯電フィルム、帯電ゴムブレード、帯電チューブ等を用いた接触型帯電器が使用される。また、非接触方式のローラ帯電器、コロナ放電を利用したスコロトロン帯電器やコロトロン帯電器等のそれ自体公知の帯電器等も使用される。
-Charging device-
As the charging device 8, for example, a contact type charger using a conductive or semiconductive charging roller, a charging brush, a charging film, a charging rubber blade, a charging tube or the like is used. Further, a non-contact type roller charger, a known charger such as a scorotron charger using a corona discharge or a corotron charger may be used.
−露光装置−
露光装置9としては、例えば、電子写真感光体7表面に、半導体レーザ光、LED光、液晶シャッタ光等の光を、定められた像様に露光する光学系機器等が挙げられる。光源の波長は電子写真感光体の分光感度領域内とする。半導体レーザの波長としては、780nm付近に発振波長を有する近赤外が主流である。しかし、この波長に限定されず、600nm台の発振波長レーザや青色レーザとして400nm以上450nm以下に発振波長を有するレーザも利用してもよい。また、カラー画像形成のためにはマルチビームを出力し得るタイプの面発光型のレーザ光源も有効である。
-Exposure device-
Examples of the exposure device 9 include optical system devices that expose the surface of the electrophotographic photoreceptor 7 with light such as semiconductor laser light, LED light, and liquid crystal shutter light in a predetermined image-like manner. The wavelength of the light source is set within the spectral sensitivity region of the electrophotographic photosensitive member. As the wavelength of the semiconductor laser, near infrared having an oscillation wavelength near 780 nm is the mainstream. However, the present invention is not limited to this wavelength, and an oscillation wavelength laser in the 600 nm range or a laser having an oscillation wavelength of 400 nm to 450 nm as a blue laser may be used. In addition, a surface-emitting type laser light source that can output a multi-beam is also effective for color image formation.
−現像装置−
現像装置11としては、例えば、現像剤を接触又は非接触させて現像する一般的な現像装置が挙げられる。現像装置11としては、上述の機能を有している限り特に制限はなく、目的に応じて選択される。例えば、一成分系現像剤又は二成分系現像剤をブラシ、ローラ等を用いて電子写真感光体7に付着させる機能を有する公知の現像器等が挙げられる。中でも現像剤を表面に保持した現像ローラを用いるものが好ましい。
-Developer-
Examples of the developing device 11 include a general developing device that performs development by bringing a developer into contact or non-contact with the developer. The developing device 11 is not particularly limited as long as it has the functions described above, and is selected according to the purpose. For example, a known developing device having a function of attaching a one-component developer or a two-component developer to the electrophotographic photosensitive member 7 using a brush, a roller, or the like can be used. Among these, those using a developing roller holding the developer on the surface are preferable.
現像装置11に使用される現像剤は、トナー単独の一成分系現像剤であってもよいし、トナーとキャリアとを含む二成分系現像剤であってもよい。また、現像剤は、磁性であってもよいし、非磁性であってもよい。これら現像剤は、周知のものが適用される。 The developer used in the developing device 11 may be a one-component developer including a toner alone or a two-component developer including a toner and a carrier. Further, the developer may be magnetic or non-magnetic. A well-known thing is applied for these developers.
−クリーニング装置−
クリーニング装置13は、クリーニングブレード131を備えるクリーニングブレード方式の装置が用いられる。
なお、クリーニングブレード方式以外にも、ファーブラシクリーニング方式、現像同時クリーニング方式を採用してもよい。
-Cleaning device-
As the cleaning device 13, a cleaning blade type device including a cleaning blade 131 is used.
In addition to the cleaning blade method, a fur brush cleaning method and a simultaneous development cleaning method may be employed.
−転写装置−
転写装置40としては、例えば、ベルト、ローラ、フィルム、ゴムブレード等を用いた接触型転写帯電器、コロナ放電を利用したスコロトロン転写帯電器やコロトロン転写帯電器等のそれ自体公知の転写帯電器が挙げられる。
-Transfer device-
As the transfer device 40, for example, a contact transfer charger using a belt, a roller, a film, a rubber blade, etc., or a known transfer charger such as a scorotron transfer charger using a corona discharge or a corotron transfer charger. Can be mentioned.
−中間転写体−
中間転写体50としては、半導電性を付与したポリイミド、ポリアミドイミド、ポリカーボネート、ポリアリレート、ポリエステル、ゴム等を含むベルト状のもの(中間転写ベルト)が使用される。また、中間転写体の形態としては、ベルト状以外にドラム状のものを用いてもよい。
-Intermediate transfer member-
As the intermediate transfer member 50, a belt-like member (intermediate transfer belt) containing polyimide, polyamideimide, polycarbonate, polyarylate, polyester, rubber or the like having semiconductivity is used. Further, as the form of the intermediate transfer member, a drum-like one may be used in addition to the belt-like.
図8は、本実施形態に係る画像形成装置の他の一例を示す概略構成図である。
図8に示す画像形成装置120は、プロセスカートリッジ300を4つ搭載したタンデム方式の多色画像形成装置である。画像形成装置120では、中間転写体50上に4つのプロセスカートリッジ300がそれぞれ並列に配置されており、1色に付き1つの電子写真感光体が使用される構成となっている。なお、画像形成装置120は、タンデム方式であること以外は、画像形成装置100と同様の構成を有している。
FIG. 8 is a schematic configuration diagram illustrating another example of the image forming apparatus according to the present embodiment.
An image forming apparatus 120 shown in FIG. 8 is a tandem multicolor image forming apparatus equipped with four process cartridges 300. In the image forming apparatus 120, four process cartridges 300 are arranged in parallel on the intermediate transfer member 50, and one electrophotographic photosensitive member is used for one color. The image forming apparatus 120 has the same configuration as that of the image forming apparatus 100 except that it is a tandem system.
以下、本発明の実施例について説明するが、本発明は以下の実施例に限定されるものではない。なお、以下の説明において、特に断りのない限り、「部」及び「%」はすべて質量基準である。 Examples of the present invention will be described below, but the present invention is not limited to the following examples. In the following description, “part” and “%” are all based on mass unless otherwise specified.
<実施例1>
−支持体1の作製−
潤滑剤を塗布したアルミニウム合金(「成分組成」Si:0.5質量%、Fe:0.5質量%、Cu:3.0質量%、Mn:0.3質量%、Mg:1.8質量%、Cr:0.1質量%、Zn:0.25質量%、Ti:0.15質量%、残部:アルミニウム及び不純物)スラグを用意した。このスラグを用いて、ダイ(雌型)とパンチ(雄型)により、インパクトプレス加工を施し、Φ32mmの円筒状の成形体を作製した(第1加工工程)。
次に、インパクトプレス加工により成形された円筒状の成形体を350℃、0.5時間の温度条件で加熱後、100℃/秒の速度で冷却することにより、溶体化処理を施した(溶体化処理工程)。
<Example 1>
-Production of support 1-
Aluminum alloy coated with a lubricant ("component composition" Si: 0.5% by mass, Fe: 0.5% by mass, Cu: 3.0% by mass, Mn: 0.3% by mass, Mg: 1.8% by mass %, Cr: 0.1% by mass, Zn: 0.25% by mass, Ti: 0.15% by mass, balance: aluminum and impurities). Using this slag, impact pressing was performed with a die (female) and a punch (male) to produce a cylindrical molded body having a diameter of 32 mm (first processing step).
Next, the cylindrical shaped body formed by impact pressing was heated at 350 ° C. for 0.5 hours, and then cooled at a rate of 100 ° C./second to give a solution treatment (solution) Processing step).
次に、溶体化処理を施した円筒状の成形体に対し、しごき加工を1回施して形状矯正を行った(第2加工工程)。
その後、形状矯正を施した円筒状の成形体を300℃に加熱して、1時間保持して時効硬化処理を行った(時効硬化処理工程)。こうして支持体1を作製した。
Next, the cylindrical molded body subjected to the solution treatment was subjected to ironing once to perform shape correction (second processing step).
Thereafter, the cylindrical shaped body subjected to shape correction was heated to 300 ° C. and held for 1 hour to perform age hardening treatment (age hardening treatment step). Thus, the support 1 was produced.
<実施例2〜12、比較例1〜6>
−支持体2〜18の作製−
表1に示す成分組成のアルミニウム合金を用い、表2に示す支持体の作製条件に変更したこと以外は、支持体1と同様にして、支持体2〜18を作製した。
<Examples 2-12, Comparative Examples 1-6>
-Production of Supports 2-18-
Supports 2 to 18 were prepared in the same manner as the support 1 except that the aluminum alloy having the component composition shown in Table 1 was used and the production conditions for the support shown in Table 2 were changed.
<比較例7、比較例8>
−支持体19、支持体20の作製−
表1に示す成分組成のアルミニウム合金を用い、従来の押し出し加工と抽伸加工とを併用して作製した円筒状の成形体を表面切削し、Φ30mmの支持体19、及び支持体20を作製した。
<Comparative Example 7 and Comparative Example 8>
-Production of support 19 and support 20-
Using an aluminum alloy having the component composition shown in Table 1, a cylindrical shaped body produced by combining conventional extrusion and drawing was subjected to surface cutting to produce a support 19 and a support 20 having a diameter of 30 mm.
<比較例9>
−支持体21の作製−
実施例10と同じ成分組成のアルミニウム合金を用い、従来の押し出し加工と抽伸加工とを併用して作製した円筒状の成形体を表面切削し、Φ30mmの支持体21を作製した。
<Comparative Example 9>
-Production of support 21-
Using an aluminum alloy having the same component composition as in Example 10, a cylindrical shaped body produced by combining conventional extrusion and drawing was subjected to surface cutting to produce a support 21 having a diameter of 30 mm.
上記の各例で作製した支持体について、円筒度、真円度、及び同軸度を、第2加工工程後及び事項硬化処理後のそれぞれについて既述の方法により測定した。また、偏肉、結晶粒の平均面積、及び肉厚を、既述の方法により測定した。測定結果を表3に示す。 About the support body produced by said each example, the cylindricity, the roundness, and the coaxiality were measured by the above-mentioned method about each after a 2nd process process and a matter hardening process. Further, the uneven thickness, the average area of crystal grains, and the wall thickness were measured by the methods described above. Table 3 shows the measurement results.
〔電子写真感光体の作製〕
上記の各例で作製した支持体を用いて、下記に示す方法により、電子写真感光体を作製した。
[Production of electrophotographic photoreceptor]
An electrophotographic photoreceptor was produced by the method described below using the support produced in each of the above examples.
(下引層の形成)
酸化亜鉛(平均粒子径70nm:テイカ社製:比表面積値15m2/g):100質量部をテトラヒドロフラン:500質量部と攪拌混合し、シランカップリング剤(KBM503:信越化学工業社製):1.3質量部を添加し、2時間攪拌した。その後、トルエンを減圧留去し、120℃、3時間の条件で焼き付けを行い、シランカップリング剤で表面処理を施した酸化亜鉛を得た。
(Formation of undercoat layer)
Zinc oxide (average particle diameter 70 nm: manufactured by Teika: specific surface area value 15 m 2 / g): 100 parts by mass with stirring and mixing with 500 parts by mass of tetrahydrofuran, silane coupling agent (KBM503: manufactured by Shin-Etsu Chemical Co., Ltd.): 1 3 parts by mass were added and stirred for 2 hours. Thereafter, toluene was distilled off under reduced pressure, baking was performed at 120 ° C. for 3 hours, and zinc oxide surface-treated with a silane coupling agent was obtained.
この表面処理を施した酸化亜鉛:110質量部と、テトラヒドロフラン:500質量部とを攪拌混合し、さらに、アリザリン:0.6質量部をテトラヒドロフラン:50質量部に溶解させた溶液を添加し、50℃にて5時間攪拌した。その後、減圧ろ過にてアリザリンを付与させた酸化亜鉛をろ別し、さらに60℃で減圧乾燥を行い、アリザリン付与酸化亜鉛を得た。
このアリザリン付与酸化亜鉛:60質量部と、硬化剤(ブロック化イソシアネート、スミジュール3175、住友バイエルンウレタン社製):13.5質量部と、ブチラール樹脂(エスレックBM−1、積水化学工業社製):15質量部とを、メチルエチルケトン:85質量部に溶解した溶液を調製した。この溶液:38質量部と、メチルエチルケトン:25質量部とを混合し、1mmφのガラスビーズを用いて、サンドミルにて2時間の分散を行い、分散液を得た。
The surface-treated zinc oxide: 110 parts by mass and tetrahydrofuran: 500 parts by mass were mixed with stirring, and a solution prepared by dissolving alizarin: 0.6 parts by mass in tetrahydrofuran: 50 parts by mass was added. Stir at 5 ° C. for 5 hours. Then, the zinc oxide to which alizarin was imparted by filtration under reduced pressure was filtered off, and further dried at 60 ° C. under reduced pressure to obtain alizarin imparted zinc oxide.
This alizarin-provided zinc oxide: 60 parts by mass, a curing agent (blocked isocyanate, Sumijoule 3175, manufactured by Sumitomo Bayern Urethane Co., Ltd.): 13.5 parts by mass, and a butyral resin (ESLEC BM-1, manufactured by Sekisui Chemical Co., Ltd.) A solution prepared by dissolving 15 parts by mass in 85 parts by mass of methyl ethyl ketone was prepared. This solution: 38 parts by mass and methyl ethyl ketone: 25 parts by mass were mixed, and dispersed using a 1 mmφ glass bead in a sand mill for 2 hours to obtain a dispersion.
得られた分散液に、触媒としてジオクチルスズジラウレート:0.005質量部と、シリコーン樹脂粒子(トスパール145、モメンティブ・パフォーマンス・マテリアルズ社製):45質量部とを添加して、下引層形成用塗布液を調製した。この下引層形成用塗布液を浸漬塗布法にて、上記の各例で作製した支持体上に塗布し、170℃、30分の条件で乾燥硬化を行い、膜厚23μmの下引層を形成した。 Dioctyltin dilaurate: 0.005 parts by mass and silicone resin particles (Tospearl 145, manufactured by Momentive Performance Materials): 45 parts by mass are added to the resulting dispersion as a catalyst to form an undercoat layer. A coating solution was prepared. This undercoat layer-forming coating solution is applied on the support prepared in each of the above examples by dip coating, followed by drying and curing at 170 ° C. for 30 minutes to form an undercoat layer having a thickness of 23 μm. Formed.
(電荷発生層の形成)
X線回折スペクトルにおけるブラッグ角(2θ±0.2°)が7.5°、9.9°、12.5°、16.3°、18.6°、25.1°、28.3°に強い回折ピークを持つヒドロキシガリウムフタロシアニン1質量部と、ポリビニルブチラール(エスレックBM−S、積水化学工業社製)1質量部と、酢酸n−ブチル80質量部とを混合して混合液を得た。この混合液をガラスビーズと共に、ペイントシェーカーで1時間分散処理することにより、電荷発生層形成用塗布液を調製した。得られた電荷発生層形成用塗布液を上記で形成した下引層上に浸漬塗布し、100℃、10分間の条件で加熱乾燥行い、膜厚0.15μmの電荷発生層を形成した。
(Formation of charge generation layer)
Bragg angles (2θ ± 0.2 °) in X-ray diffraction spectrum are 7.5 °, 9.9 °, 12.5 °, 16.3 °, 18.6 °, 25.1 °, 28.3 ° 1 part by weight of hydroxygallium phthalocyanine having a strong diffraction peak, 1 part by weight of polyvinyl butyral (ESREC BM-S, manufactured by Sekisui Chemical Co., Ltd.), and 80 parts by weight of n-butyl acetate were obtained to obtain a mixed solution. . The mixed solution was dispersed together with glass beads with a paint shaker for 1 hour to prepare a coating solution for forming a charge generation layer. The obtained coating solution for forming a charge generation layer was dip-coated on the undercoat layer formed above and dried by heating at 100 ° C. for 10 minutes to form a charge generation layer having a thickness of 0.15 μm.
(電荷輸送層の形成)
下記式(CT−1)で表されるベンジジン化合物:2.6質量部、及び下記式(B−1)で表される繰り返し単位を有する高分子化合物(粘度平均分子量:40,000):3質量部を、THF(テトラヒドロフラン):25質量部に溶解させて、電荷輸送層形成用塗布液を調製した。得られた電荷輸送層形成用塗布液を上記で形成した電荷発生層上に浸漬塗布し、130℃、45分の条件で加熱を行い、膜厚20μmの電荷輸送層を形成した。これにより電子写真感光体を作製した。
(Formation of charge transport layer)
Benzidine compound represented by the following formula (CT-1): 2.6 parts by mass and a polymer compound having a repeating unit represented by the following formula (B-1) (viscosity average molecular weight: 40,000): 3 Part by mass was dissolved in 25 parts by mass of THF (tetrahydrofuran) to prepare a coating solution for forming a charge transport layer. The obtained coating solution for forming a charge transport layer was dip-coated on the charge generation layer formed above, and heated at 130 ° C. for 45 minutes to form a charge transport layer having a thickness of 20 μm. Thus, an electrophotographic photosensitive member was produced.
〔評価〕
(落下試験)
上記で作製した電子写真感光体を画像形成装置(富士ゼロックス社製、Docu Print C1100)のプロセスカートリッジに搭載し床面から1.5mの落下高さから自由落下させ、床に衝突させた。
落下後、支持体の変形量について、東京精密社製ロンコム60Aによる真円度の測定、及び目視にて確認した。
その後、プリンタに実装し、A4用紙(富士ゼロックス社製、C2紙)に50%濃度のハーフトーン画像(低濃度画質の画像)の出力を行った。その後、A4用紙(富士ゼロックス社製、C2紙)に、エリアカバレッジ(A4用紙における文字の占める面積率)が2%の文字画像を20,000枚出力し、画像を確認し使用上の問題を確認した。
結果を表3に示す。
[Evaluation]
(Drop test)
The electrophotographic photosensitive member produced above was mounted on a process cartridge of an image forming apparatus (manufactured by Fuji Xerox Co., Ltd., Docu Print C1100), freely dropped from a fall height of 1.5 m from the floor surface, and collided with the floor.
After the fall, the amount of deformation of the support was confirmed by measuring the roundness with a Roncom 60A manufactured by Tokyo Seimitsu Co., Ltd. and visually.
After that, it was mounted on a printer, and a 50% density halftone image (low density image) was output on A4 paper (Fuji Xerox, C2 paper). After that, on A4 paper (Fuji Xerox Co., C2 paper), output 20,000 character images with area coverage (area ratio occupied by characters in A4 paper) of 2%. confirmed.
The results are shown in Table 3.
−変形量−
A:真円度の変化無し、問題無し。
B:落下前に比べ真円度が変化(高く)なっているが、落下後の真円度が30μm以下であり、実使用上問題無し。
C:落下前に比べ真円度が変化(高く)なっているが、落下後の真円度が30μmを超え100μm以下であり、実使用上問題無し。
D:落下前に比べ真円度が変化(高く)なっており、かつ落下後の真円度が100μmを超えている。
−Deformation amount−
A: No change in roundness, no problem.
B: Although the roundness is changed (higher) than before dropping, the roundness after dropping is 30 μm or less, and there is no problem in practical use.
C: Although the roundness is changed (higher) than before dropping, the roundness after dropping is more than 30 μm and not more than 100 μm, and there is no problem in practical use.
D: The roundness is changed (higher) than before dropping, and the roundness after dropping exceeds 100 μm.
−画質−
A:初期の画像と20,000枚出力後の画像とで濃度変化が見えず、問題無し。
B:初期の画像と20,000枚出力後の画像とで濃度変化が見えるが、実使用上問題無し。
C:初期の画像に比べ20,000枚出力後の画像に明らかな濃度低下(実使用上問題となる濃度低下)が発生。
D:1枚目から変形による白抜け発生。
-Image quality-
A: No change in density is seen between the initial image and the image after output of 20,000 sheets, and there is no problem.
B: Although a change in density can be seen between the initial image and the image after outputting 20,000 sheets, there is no problem in actual use.
C: A clear density drop (density drop causing a problem in actual use) occurs in the image after outputting 20,000 sheets compared to the initial image.
D: White spots occur due to deformation from the first sheet.
なお、表3において、「結晶粒」は、「結晶粒の平均面積」を表す。 In Table 3, “crystal grains” represents “average area of crystal grains”.
上記結果から、本実施例では、比較例に比べ、各形状の測定結果について、良好な結果が得られたことがわかる。また、本実施例では、比較例に比べ、変形量や、画質の評価結果が良好な結果が得られたことがわかる。これにより、厚みを薄く作製したときでも、強度が高く、形状精度が高いことがわかる。 From the above results, it can be seen that in this example, better results were obtained for the measurement results of each shape than in the comparative example. In addition, in this embodiment, it can be seen that the deformation amount and the evaluation result of the image quality are good as compared with the comparative example. Thereby, even when the thickness is made thin, it can be seen that the strength is high and the shape accuracy is high.
1 下引層、2 電荷発生層、3 電荷輸送層、4 支持体、4A、4B 成形体、5 感光層、6 保護層、7 電子写真感光体、8 帯電装置、9 露光装置、10 単層型感光層、11 現像装置、13 クリーニング装置、20 ダイ(雌型)、21 パンチ(雄型)、22 ストリッパー、23 中央孔、24 円形孔、30 スラグ、31 パンチ、32 ダイス、33 ダイス、40 転写装置、50 中間転写体、100 画像形成装置、120 画像形成装置、131 クリーニングブレード、132 繊維状部材(ロール状)、133 繊維状部材(平ブラシ状)、300 プロセスカートリッジ
DESCRIPTION OF SYMBOLS 1 Undercoat layer, 2 Charge generation layer, 3 Charge transport layer, 4 Support body, 4A, 4B Molded body, 5 Photosensitive layer, 6 Protective layer, 7 Electrophotographic photoconductor, 8 Charging device, 9 Exposure device, 10 Single layer Type photosensitive layer, 11 developing device, 13 cleaning device, 20 die (female type), 21 punch (male type), 22 stripper, 23 center hole, 24 circular hole, 30 slug, 31 punch, 32 die, 33 die, 40 Transfer device, 50 Intermediate transfer member, 100 Image forming device, 120 Image forming device, 131 Cleaning blade, 132 Fibrous member (roll shape), 133 Fibrous member (flat brush shape), 300 Process cartridge
Claims (11)
前記導電性支持体上に感光層と、
を有する電子写真感光体。 The conductive support according to any one of claims 1 to 7,
A photosensitive layer on the conductive support;
An electrophotographic photosensitive member having:
画像形成装置に着脱するプロセスカートリッジ。 An electrophotographic photoreceptor according to claim 8,
A process cartridge that can be attached to and detached from an image forming apparatus.
前記電子写真感光体の表面を帯電する帯電手段と、
帯電した前記電子写真感光体の表面に静電潜像を形成する静電潜像形成手段と、
トナーを含む現像剤により、前記電子写真感光体の表面に形成された静電潜像を現像してトナー像を形成する現像手段と、
前記トナー像を記録媒体の表面に転写する転写手段と、
を備える画像形成装置。 The electrophotographic photosensitive member according to claim 8,
Charging means for charging the surface of the electrophotographic photosensitive member;
An electrostatic latent image forming means for forming an electrostatic latent image on the surface of the charged electrophotographic photosensitive member;
Developing means for developing the electrostatic latent image formed on the surface of the electrophotographic photosensitive member with a developer containing toner to form a toner image;
Transfer means for transferring the toner image to the surface of the recording medium;
An image forming apparatus comprising:
前記アルミニウム合金に冷間インパクトプレス加工を施して成形体を得る第1の加工工程と、
前記第1の加工工程で得た前記成形体に溶体化処理を施す工程と、
前記溶体化処理を施した前記成形体に形状加工を施す第2の加工工程と、
前記形状加工を施した前記成形体に時効硬化処理を施す工程と、
を含む請求項1〜請求項7のいずれか1項に記載の導電性支持体の製造方法。 Preparing the aluminum alloy;
A first processing step of obtaining a molded body by subjecting the aluminum alloy to a cold impact press;
Applying solution treatment to the molded body obtained in the first processing step;
A second processing step of performing shape processing on the molded body subjected to the solution treatment;
Applying age-hardening treatment to the shaped body subjected to the shape processing;
The manufacturing method of the electroconductive support body of any one of Claims 1-7 containing these.
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| EP4050418A2 (en) | 2021-02-26 | 2022-08-31 | Canon Kabushiki Kaisha | Electrophotographic photosensitive member, process cartridge, and electrophotographic apparatus |
| US12510835B2 (en) | 2022-04-28 | 2025-12-30 | Canon Kabushiki Kaisha | Electrophotographic photosensitive member, process cartridge, and electrophotographic apparatus |
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