JP2017199888A - Semiconductor device manufacturing method and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the chipping of a resin part which occurs when cutting a lead connecting part and to improve the quality. A step of using a collective lead frame 1 in which a plurality of chip mounting areas for each chip are connected, mounting a semiconductor chip 3 on the collective lead frame 1, and electrically connecting these semiconductor chips 3 to leads 7a. The semiconductor chip 3 and the leads 7a are sealed in each chip mounting region, a part of each lead 7a is exposed and protrudes at an end as a terminal, and each chip mounting region is connected by a lead connecting portion 7. A step of forming a plurality of mold intermediates, a step of forming a processed groove 8 on, for example, the upper surface of the lead connecting portion 7 between the mold intermediates, and a processed groove 8 forming the lead connecting portion 7 between the mold intermediates. It includes a step of cutting out individual semiconductor devices by cutting from a surface which is not formed. [Selection diagram] Fig. 1

Description

  The present invention relates to a semiconductor device manufacturing method and a semiconductor device, and more particularly to a semiconductor device manufacturing method and a semiconductor device in which terminals are exposed from the bottom surface of a resin package.

  In recent years, not only miniaturization of communication devices such as mobile phones, smartphones, tablets, etc., but also miniaturization of in-vehicle electronic devices has been promoted due to an increase in the number of sensors mounted. In particular, in-vehicle electronic devices have high mounting reliability. It is necessary to make a component that can be mounted in a predetermined space while maintaining it, and for this purpose, a semiconductor device having a short lead is used.

  In this type of semiconductor device, a standoff is provided between the lead and the sealing resin in order to ensure ease of mounting and reliability. A sheet is used. This sealing sheet is in close contact with at least the bottom surface of the lead of the lead frame on which the semiconductor chip is mounted, and slightly enters the resin side at the sealing resin portion flowing between the leads. In addition to protecting the sealing resin from entering the bottom surface, a stand-off having a desired height is formed between the bottom surface of the lead and the sealing resin (sealing body).

  4 and 5 show an example of a conventional semiconductor device. In these drawings, reference numeral 1 denotes a lead frame (die pad), 2 denotes a lead, 3 denotes a semiconductor chip, and 4 denotes a semiconductor chip 3. Bonding wires 5 for connecting the leads 2 are sealing resins. This semiconductor device is a semiconductor device having a short lead, and as shown in FIG. 5, a part of each lead 2 is disposed so as to be exposed at both end portions (peripheral portions) of the sealing body. Becomes an external terminal with a standoff.

  That is, in the manufacture of the semiconductor device, the semiconductor chip 3 is mounted on the lead frame 1, the lead 2 and the semiconductor chip 3 are connected by the wire 4, the back surface of each of the plurality of leads 2, and the lower mold of the resin molding die. Resin sealing is performed with the sealing sheet placed on the mold surface in close contact. Thereby, it is possible to prevent the sealing resin from adhering to the back surface of each lead 2. Moreover, by injecting each lead 2 into the sealing sheet when the sealing resin is injected, each lead 2 slightly protrudes from the back surface of the sealing body after resin sealing. Standoff is secured.

  Furthermore, at the time of this resin sealing, a release sheet is also arranged on the upper mold surface of the resin molding die, and this release sheet is similar to the sealing sheet. It is possible to prevent the sealing resin from adhering to the surface. Further, by inserting each lead 2 into the release sheet when the sealing resin is injected, each lead 2 slightly protrudes from the surface of the sealing body after resin sealing.

  Further, the semiconductor device is manufactured using a collective lead frame in which a plurality of lead frames 1 including the above leads 2 are connected and arranged, and after a plurality of semiconductor chips 3 are mounted and sealed with resin. The assembly is placed in a cutting die, and lead connecting portions (portions where the leads 2 are connected) and suspension leads (connecting portions) between the respective sealing bodies of the semiconductor device unit are cut with a cutting punch, so that FIG. The individual semiconductor devices (packages) shown in FIG. 5 are manufactured.

JP 2001-127090 A JP 2002-026223 A JP 2014-112714 A Japanese Patent Laid-Open No. 06-151681

However, in the manufacture of the conventional semiconductor device, as shown in FIG. 5, in the sealing body, the chip 6 is not formed between the leads 2 or the surface (upper surface) of the resin portion filled in the side surface of the lead 2. There was a problem that occurred.
That is, as described above, since the release sheet or the sealing sheet is used for resin sealing, the resin molding state varies. For example, as shown in FIG. The resin recess is not favorably supported by the receiving part of the cutting die, and the resin part chipping 6 occurs. This chip 6 in the resin portion occurs regardless of the lead cutting direction.
Resin portion chipping 6 between each lead 2 that functions as a terminal for electrical connection reduces the reliability of the semiconductor device.

  The present invention has been made in view of the above-described problems, and a purpose thereof is to suppress a chipping of a resin portion that occurs at the time of cutting a lead connecting portion, and to improve a quality of a semiconductor device manufacturing method and a semiconductor To provide an apparatus.

In order to achieve the above object, a method of manufacturing a semiconductor device according to the invention of claim 1 uses a collective lead frame in which a plurality of chip mounting areas in a chip unit are connected, and a plurality of the chip mounting areas of the collective lead frame. A semiconductor chip is mounted at a predetermined portion of the chip, and a chip mounting step for electrically connecting the semiconductor chip to the lead, and the semiconductor chip and the lead are sealed for each chip mounting region, and a part of the lead is an end portion. An intermediate body forming step for forming a plurality of mold intermediate bodies that are exposed to each other and connected to each chip mounting region by lead connecting portions, and a surface opposite to the cutting direction of the lead connecting portions between the mold intermediate bodies A groove forming step for forming a processed groove on the surface and a lead connecting portion between the mold intermediate bodies are cut from a surface where the processed groove is not formed to cut individual semiconductor devices. And be cutting step, characterized in that it comprises a.
According to a second aspect of the present invention, there is provided a method of manufacturing a semiconductor device, wherein the processing groove of the lead connecting portion of the collective lead frame is formed by a rotating blade, and the cutting of the lead connecting portion between the mold intermediates is performed by a punching die. It is characterized by performing with a cutting punch using.

  According to a third aspect of the present invention, there is provided a semiconductor device comprising: a lead frame including a plurality of leads; a semiconductor chip mounted on the lead frame; and a part of the lead protruding and exposed from an end portion as a terminal. A resin encapsulant formed by resin-sealing the semiconductor chip as a state in which the space is filled with resin, and a projecting portion that is composed of the terminal and a resin between the terminals, and projects and is exposed from an end of the resin encapsulated body. And the terminal part by which the level | step difference extended in the direction orthogonal to the extension direction of the said terminal was formed in the any one edge part of the upper and lower surfaces is characterized by the above-mentioned.

According to the above configuration, the semiconductor chip is mounted on a predetermined portion of each chip mounting region provided in the collective lead frame, the semiconductor chip is electrically connected to the lead, and the semiconductor chip and the lead are further connected to each chip mounting region. As a result, a part of each lead is exposed as a terminal at the end (for example, bottom surface and side surface) of the sealing body, and a plurality of molds are connected to each chip mounting region by a lead connecting portion. An intermediate is formed. Then, a processed groove for preventing chipping of the resin portion is formed on the surface opposite to the cutting direction of the lead connecting portion (portion where the leads are connected) between the plurality of mold intermediates, and the lead connecting between the mold intermediates Individual semiconductor devices can be manufactured by cutting the part from the surface where the processing groove is not formed.
Moreover, in the resin sealing body as the obtained semiconductor device, a terminal portion (a portion constituted by a part of the lead) protrudes and is exposed from an end portion thereof, and is formed on either the upper or lower surface of the terminal portion. A step is formed.

According to the method for manufacturing a semiconductor device of the present invention, it is possible to suppress chipping of the resin portion that occurs when the lead connecting portion is cut, and to improve the quality of the semiconductor device.
Further, according to the semiconductor device of the present invention, since the terminal portion is configured to protrude from the bottom surface side of the side surface of the sealing body, the protruding terminal portion follows the deformation of the mounting substrate, thereby providing high reliability. There is an effect that sex can be achieved.

It is sectional drawing (only a lead frame is hatching) which shows the cutting process of the lead connection part between mold intermediate bodies in manufacture of the semiconductor device of the Example which concerns on this invention. It is sectional drawing (only a lead frame is hatched) which shows the structure of the semiconductor device of Example. It is an external appearance perspective view of the semiconductor device of an Example. It is sectional drawing (only a lead frame is hatched) which shows the structure of the conventional semiconductor device. It is an external appearance perspective view of the conventional semiconductor device.

FIGS. 1A and 1B show a state of cutting the lead connecting portion in the semiconductor device manufacturing method of the embodiment, and FIGS. 2 and 3 show the configuration of the semiconductor device after manufacturing. . In each of the drawings, reference numeral 1 is a lead frame (die pad), 3 semiconductor chip, 4 is a bonding wire, 5 is a sealing resin, 7 is a lead connecting portion comprising a part of the lead frame 1, 7a is each lead, and 8 is A processing groove, 9 is a terminal portion, 5a is a resin of the terminal portion 9, 9D is a step, 12 is a punching die, and 13 is a cutting punch.
In the manufacture of a semiconductor device, a collective lead frame 1 in which a plurality of chip mounting areas for each chip are connected and arranged is used. In this collective lead frame 1, a lead connecting portion 7 in which a plurality of leads 7a are regularly arranged is used. They are arranged in a connected state between chip mounting areas.

  In the manufacture of the semiconductor device, a chip mounting step of mounting the semiconductor chip 3 in each chip mounting region on the lead frame 1 having the leads 7a, and a mold intermediate is formed so that a part of each lead 7a becomes the terminal portion 9. Intermediate forming step, groove forming step of forming processed groove 8 on either one of the upper and lower surfaces of lead connecting portion 7 between the mold intermediates, lead connecting portion 7 between a plurality of mold intermediates (between each) A cutting step of cutting from a surface where the processing groove 8 is not formed.

  For example, in the chip mounting process, a chip mounting portion (die pad), a lead connecting portion 7 arranged around the chip mounting portion, and a suspension lead connecting the chip mounting portion on a stage of a semiconductor manufacturing apparatus that performs chip mounting. The lead frame 1 having The chip mounting portion and the suspension lead can be half-etched as necessary. Then, the back surface of the semiconductor chip 3 is connected to the chip mounting portion of the lead frame 1, and the electrode pads on the surface of the semiconductor chip 3 and the leads 7 a are connected by the conductive bonding wires 4.

  In the intermediate forming step, a resin molding die having a gate part for injecting resin into a cavity formed between the upper mold and the lower mold and having an upper mold and a lower mold is prepared. The lead frame 1 is sandwiched between the sealing sheet on the lower mold of the resin mold and the release sheet on the inner surface of the upper mold. Then, by injecting a sealing resin from the gate portion into the cavity, a sealing (mold) body in which a part of the semiconductor chip 3, the lead 7a, and the chip mounting portion is sealed, that is, a mold intermediate is formed. To do. In this mold intermediate body, as shown in FIG. 2, the lead 7a which will be the final terminal portion 9 protrudes and is exposed in the horizontal direction from the bottom surface side of both side surfaces of the sealing body. As also shown, the resin 5a is sandwiched (the resin 5a is sandwiched between the leads 7a).

  In the groove forming step, when the surface of the lead frame 1 on which the semiconductor chip 3 is mounted is up, the processing groove 8 in the thickness direction is processed with a rotary blade or the like on the upper surface of the lead connecting portion 7 between the mold intermediates. . As shown in FIG. 1, the processing grooves 8 of the embodiment are formed at two locations in accordance with the positions of both ends of the cutting punch 13. The processed groove 8 can have various shapes, for example, a single groove having the width of the cutting punch 13.

  In the cutting step, as shown in FIG. 1 (A), the mold assembly after the groove forming step is disposed at a predetermined position of the punching die 12, and between the mold intermediate bodies (sealing bodies). By cutting (punching) punch 13 from the direction in which machining groove 8 is not provided in lead connecting portion 7 of this, and cutting lead connecting portion 7 in which a plurality of leads 7a are arranged, a semiconductor device (package) is obtained. It is divided into pieces.

  The processed groove 8 can reduce the load applied to the lead connecting portion 7 of the mold intermediate from the cutting punch 13 and can suppress the occurrence of chipping (6) of the resin portion as in the prior art. There is an advantage of improving the quality of the semiconductor device. Further, even when chipping of the resin portion occurs, the cutting punch 13 enters at an obtuse angle (conventionally at a right angle) with respect to the cut surface as indicated by an arrow 30 in FIG. It is possible to control the position where it comes off.

  Although it is possible to work the complete cutting of the semiconductor device with a rotating blade in dislike of the chipping (6) of the resin portion, the embodiment uses the die 12 for punching and the cutting punch 13 at once. Therefore, it is possible to provide cost competitiveness and throughput competitiveness.

  2 and 3 show a semiconductor device manufactured by the above-described manufacturing method. In this semiconductor device, the terminal portion 9 in which the resin 5a and the lead 7a are alternately arranged is an end portion (bottom surface side) of the sealing body. A step 9 </ b> D in which a part of the processing groove 8 remains by cutting the cutting punch 13 is provided on the upper surface side of the tip of the terminal portion 9. The protruding terminal portion 9 follows the deformation of the mounting substrate, thereby increasing the reliability of the device.

In the above-described embodiment, the processed groove 8 is provided on the upper surface (semiconductor chip mounting side) of the lead connecting portion 7 of the lead frame 1, but this processed groove 8 is formed on the lower surface on the side where the semiconductor chip 3 is not mounted. Alternatively, the lead connecting portion 7 may be cut.
Moreover, although the Example was set as the structure provided with the short lead which the terminal part 9 protrudes from the both sides | surfaces of a sealing body (apparatus), the terminal part does not protrude and the terminal which consists of lead 7a is a sealing body side surface. For example, it may be a leadless structure exposed on the bottom surface and the side surface of the lower side. In this case, the processed groove (8) and the step (9D) do not protrude the terminal portion from the side surface in the sealing body of FIG. Is provided on the bottom surface side.

1 ... lead frame, 2,7a ... lead,
3 ... semiconductor chip, 4 ... bonding wire,
5 ... Sealing resin, 5a ... Resin,
6 ... Less resin, 7 ... Lead connecting part,
8 ... Processed groove, 9 ... Terminal part,
9D ... Step, 12 ... Punching die,
13: Cutting punch.

Claims (3)

Using a collective lead frame in which a plurality of chip mounting areas in units of chips are connected, a semiconductor chip is mounted on a predetermined portion of the plurality of chip mounting areas of the collective lead frame, and these semiconductor chips are electrically connected to leads. Chip mounting process;
The semiconductor chip and the lead are sealed in each chip mounting region, and a part of the lead is exposed at the end, and a plurality of mold intermediates are formed which are connected to each chip mounting region by a lead connecting portion. An intermediate forming step,
A groove forming step of forming a processed groove on a surface opposite to the cutting direction of the lead connecting portion between the mold intermediates;
And a cutting step of cutting each semiconductor device by cutting a lead connecting portion between the mold intermediate bodies from a surface where the processing groove is not formed.   The processing groove of the lead connecting portion of the assembly lead frame is formed by a rotating blade, and the cutting of the lead connecting portion between the mold intermediates is performed by a cutting punch using a punching die. Item 14. A method for manufacturing a semiconductor device according to Item 1. A lead frame including a plurality of leads;
A semiconductor chip mounted on the lead frame;
A resin encapsulant formed by resin-sealing the semiconductor chip as a state in which a part of the lead protrudes and is exposed from an end as a terminal and the space between the terminals is filled with resin,
It is a protrusion part which consists of the said terminal and resin between these terminals, and protrudes and is exposed from the edge part of the said resin sealing body, Comprising: It is orthogonal to the extension direction of the said terminal at either one of the upper-and-lower surface. And a terminal portion formed with a step extending in the direction.

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