JP2017175088A - Printed wiring board and method for manufacturing printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the durability of a terminal part in insertion and removal, and suppress occurrence of defects such as poor connection and falling off of the connection terminals while providing a simple metal reinforcement method.SOLUTION: The printed wiring board is composed of an insulating base material 2, circuit pattern wiring 3 formed on the insulating base material 2, and terminal pattern wiring 5 that is composed of conductive particles deposited on the insulating base material 2 and is joined to the circuit pattern wiring 3.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a printed wiring board and a manufacturing method thereof.

In the printed wiring board, terminal portions are provided for electrical connection with other wiring boards, and terminal bonding is performed by crimping.
When providing a terminal part on a flexible printed wiring board, the terminal part is reinforced by attaching a reinforcing plate to the terminal part with an adhesive, preventing damage when inserting and removing the terminal part to and from the connector. I was trying to improve. In addition, the flexible printed wiring board is thin, but by increasing the thickness of the terminal portion by providing a reinforcing plate in the terminal portion, when inserting the terminal portion into the connector, the reinforcing plate functions as a spacer, A secure connection with the connector is achieved.

  Moreover, when connecting a some wiring board, it is necessary not only to connect so that the electroconductivity of a circuit may be impaired, but to connect so that base materials may be fixed physically. Conventionally, many methods have been proposed for electrical joining. For example, a socket-shaped wiring end portion is formed and the wiring end portions are crimped and connected, or a lead wire is a connection terminal between circuits. The method of connecting to the part with solder is taken. Also, many physical connection methods between base materials have been proposed, and as a typical connection method, another connection base material is prepared, and by fixing this connection base material with an adhesive or screwing, A technique for connecting two substrates is used.

JP 2003-124583 A

However, in order to provide a reinforcing plate in the terminal portion, first, after applying an adhesive to the terminal portion as described above, a reinforcing plate must be provided, in order to reduce the number of members and simplify the manufacturing process. Is required to reinforce the terminal portion with a simpler configuration.
In addition, in the connection terminal of the printed wiring board, the circuit pattern made of the metal paste has a problem that durability against external pressure is low, and durability is lowered by inserting and removing the connector.

  On the other hand, it has been considered to reinforce the circuit pattern by providing a metal film on the surface of the circuit pattern by plating or metal vapor deposition. However, in the reinforcement that simply covers the metal paste circuit, unnecessary pressure is also applied to the metal paste when pressure is applied, the pattern is broken, and connection failure or terminal dropping may occur. In addition, the conductive connection of the circuit pattern and the physical connection of the base material could not be connected at the same time even if any of the above-described methods was adopted. Conventionally, the configuration of the connecting portion is complicated, and the printed wiring board requires an extra area for processing the connecting portion. Furthermore, it is necessary to perform the connection work in separate steps, and each requires work time.

  The subject of this invention is improving the insertion / extraction durability of a terminal part, suppressing the bad generation | occurrence | production of the connection failure of a connection terminal, dropping, etc., providing the method of a simple metal reinforcement. Furthermore, it is to provide a technique for simultaneously and simply performing electrical connection and physical connection of a plurality of printed wiring boards, and to reduce connection costs related to the printed wiring boards.

  A printed wiring board according to an aspect of the present invention includes an insulating base material, circuit pattern wiring formed on the insulating base material, and conductive particles deposited on the insulating base material, and is bonded to the circuit pattern wiring. Terminal pattern wiring.

  ADVANTAGE OF THE INVENTION According to this invention, durability of a terminal part improves while providing the method of a simple circuit reinforcement, and the electrical connection and physical connection of a some printed circuit base material can be performed simultaneously.

It is a block diagram of the printed wiring board with a terminal part. 5 is a configuration diagram of a printed wiring board with a terminal portion showing Comparative Example 1. FIG. It is a block diagram of a composite printed wiring board. 5 is a configuration diagram of a composite printed wiring board showing a comparative example 2. FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Each drawing is schematic and may be different from the actual one. Further, the following embodiments exemplify apparatuses and methods for embodying the technical idea of the present invention, and the configuration is not specified as follows. That is, the technical idea of the present invention can be variously modified within the technical scope described in the claims.

<< First Embodiment >>
FIG. 1 is a configuration diagram of a printed wiring board with terminal portions.
(A) in a figure is a top view of a terminal part, (b) is sectional drawing of a terminal part and a connector.
In the printed wiring board 1 with terminal portions, a terminal portion 4 (shown by a dotted line) that can be inserted into the connector 6 is formed on a part of the insulating base 2. In regions other than the terminal portions 4, circuit pattern wiring 3 is formed on the upper surface of the insulating base 2. In the region corresponding to the terminal portion 4, the terminal pattern wiring 5 is formed on the upper surface of the insulating base 2. When the terminal portion 4 is inserted into the connector 6 and the terminal pattern wiring 5 comes into contact with the conductor wiring 7, the circuit pattern wiring 3 and the conductor wiring 7 are electrically connected.

  Examples of the insulating base material 2 include suitable materials applicable to printed wiring board manufacturing applications, and it is particularly preferable to use a flexible film (flexible film). The flexible film is preferably a plastic film and has a heat resistance sufficient to withstand a thermal process in the circuit pattern wiring 3 forming step and the electronic component mounting step. Specific materials for the insulating substrate 2 include polycarbonate, polyether sulfide, polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyimide, polyamide, liquid crystal polymer, and the like. In particular, a polyimide film is preferably used because it is excellent in heat resistance and chemical resistance. In addition, a liquid crystal polymer is also preferably used because it has excellent electrical characteristics such as low dielectric loss. It is also possible to adopt a flexible glass fiber reinforced resin plate. In this case, the resin constituting the glass fiber reinforced resin plate is an epoxy resin, polyphenylene sulfide resin, polyphenylene ether resin, maleimide resin, polyamide resin. And polyimide resin. The dimensions, thickness, etc. of the flexible film for forming the insulating substrate 2 are not particularly limited, and appropriate ones are adopted. For example, the thickness can be in the range of 0.02 to 1.10 mm. .

The terminal portion 4 is formed at the end portion of the insulating base material 2. Here, the insulating base material 2 is partly projected in plan view.
The circuit pattern wiring 3 forms the circuit pattern wiring 3 by printing and applying a conductive paste in a pattern on the surface of the insulating base material 2 and curing the conductive paste. The circuit pattern wiring 3 is provided on at least one surface of the insulating base material 2, and the circuit pattern wiring 3 may be provided on the other surface of the insulating base material 2. Moreover, when forming the circuit pattern wiring 3 on both surfaces of the insulating base material 2, the circuit pattern wiring 3 on the front and back sides may be conducted through through holes.

The terminal pattern wiring 5 is formed as an extension of the circuit pattern wiring 3 after the circuit pattern wiring 3 is formed by a cold spray technique. That is, the terminal pattern wiring 5 is formed by adhering and depositing metal particles (conductor particles) so as to be bonded to the circuit pattern wiring 3 on the insulating substrate 2.
The cold spray technique includes supplying metal particles using a carrier gas, heating the carrier gas, and directing the metal particle material and the carrier gas to a region of the conductive circuit pattern. Any material can be used as the carrier gas as long as it is a gas at room temperature. However, a high sound velocity is required to accelerate the metal particles, and therefore a low molecular weight is used. Moreover, in order to avoid dangers such as dust explosion, an inert gas is often used among them. In order to mix the metal particles and the carrier gas and to direct to the target position, a nozzle having a throat portion is used.

The metal material used for the terminal pattern wiring 5 is not particularly limited, but aluminum or copper is preferable. The particle diameter of the metal material set in the cold spray apparatus is preferably 1 μm to 30 μm, and preferably 10 μm to 20 μm.
Appropriate electronic components such as resistors, capacitors, transistors, diodes, and ICs are mounted on the printed wiring board 1 with terminal portions as described above as necessary.

  For the insulating substrate 2, a 200 μm film of polyethylene terephthalate was used. On the insulating base material 2, a mask is applied to the terminal portion 4 portion of the screen plate of the circuit pattern wiring 3 using Ag paste K-3303 (manufactured by Pernox) as a printing ink, and a circuit pattern other than the terminal portion 4 is formed. The wiring 3 was printed with an Ag paste and cured at 150 ° C. for 30 minutes. A mask with a hole in the pattern of the terminal part 4 is brought into close contact with a copper spray having an average particle diameter of 10 μm as a raw material using a cold spray device (DYMET, DYMET), conditions: particle supply rate 2.0 g / min, carrier gas ( Helium), a gas pressure of 600 kpa, a gas temperature of 100 ° C., and a terminal portion 4 made of copper having a thickness of 100 μm was formed.

[Comparative Example 1]
FIG. 2 is a configuration diagram of a printed wiring board with a terminal portion showing the first comparative example.
(A) in a figure is a top view of a terminal part, (b) is sectional drawing of a terminal part and a connector.
Here, the mask pattern of the terminal portion 4 of the screen plate is not masked, and the circuit pattern wiring 3 is also formed of Ag paste in the terminal portion 4.

[Comparative Example 2]
The circuit pattern wiring 3 of the terminal portion 4 was formed of Ag paste without masking the terminal portion 4 of the screen plate, and the surface was provided with a 1 μm layer made of copper by plating. Formed.

[Evaluation test]
The terminal part 4 was inserted into the connector 6, and the ease of insertion and the difficulty of coming out after insertion were evaluated. As a result, in the example, even after the connector 6 was inserted 100 times, it could be smoothly inserted as in the first time, and there was no problem in holding the connector. In Comparative Example 1, the circuit pattern wiring 3 in the terminal portion 4 collapses at the tenth time, and the connector 6 comes off. In Comparative Example 2, the circuit pattern wiring 3 in the terminal portion 4 collapses and the connector 6 comes off at the 20th time.

  The difference from plating is the structural feature that there is a single layer by cold spraying by extending the wiring, taking advantage of the feature that it can be in close contact with the substrate, regardless of the printed conductive pattern of the base. Since plating can be formed only on a silver paste pattern as a conductive layer, it may break from the weakened silver base layer when it is inserted and removed with a connector. In this configuration using cold spray, it becomes a connection terminal of a single layer of extended cold spray, and since there is no fragile layer at the bottom, durability is improved.

<< Second Embodiment >>
FIG. 3 is a configuration diagram of the composite printed wiring board.
(A) in the figure is a top view of the composite printed wiring board, and (b) is a top view of the pattern mask.

  The composite printed wiring board 10 is a combination of a first printed wiring board 11 and a second printed wiring board 12. A circuit pattern wiring 15 is formed on the insulating base material 13 of the first printed wiring board 11, and the circuit pattern wiring 15 extends to a terminal portion 17 (shown by a dotted line) formed on the edge side of the insulating base material 13. It extends. Circuit pattern wiring 16 is formed on the insulating base material 14 of the second printed wiring board 12, and the circuit pattern wiring 16 extends to the terminal portion 18 (shown by a dotted line) formed on the edge side of the insulating base material 13. It extends. The first printed wiring board 11 and the second printed wiring board 12 are physically connected by a connecting portion 30 and are electrically connected. That is, the connection unit 30 physically connects the first printed wiring board 11 and the second printed wiring board 12 and electrically connects the terminal unit 17 and the terminal unit 18.

  The circuit pattern wiring 15 is formed by forming a conductive material into a circuit pattern, and is patterned by etching a metal foil attached to the insulating base material 13. As the conductive material, metal materials such as gold, silver, copper, and aluminum and alloys thereof are used. Alternatively, the circuit pattern wiring 15 can be formed by printing and applying a conductive paste in a pattern on the surface of the insulating substrate 13 and curing the conductive paste. The circuit pattern wiring 15 is provided on at least one surface of the insulating base material 13, and the circuit pattern wiring 15 may be provided on the other surface of the insulating base material 13. Further, when the circuit pattern wiring 15 is formed on both surfaces of the insulating base material 13, the circuit pattern wiring 15 on the front and back sides may be conducted through through holes. The present invention is not limited to the material of the circuit pattern wiring 15 and the pattern manufacturing method. The circuit pattern wiring 16 and the insulating base material 14 are the same as the circuit pattern wiring 15 and the insulating base material 13.

  The connecting portion 30 is made of a metal material film formed through the pattern mask 31 by a cold spray technique. The connection portion 30 includes a physical connection portion 32 that physically connects the insulating base material 13 and the insulating base material 14, and an electrical connection portion 33 that electrically connects the terminal portion 17 and the terminal portion 18. Prepare. That is, the insulating base material 13 on which the circuit pattern wiring 15 is formed and the insulating base material 14 on which the circuit pattern wiring 16 is formed are arranged side by side, and metal particles are placed on the insulating base material 13 and the insulating base material 14. Deposit and deposit to form physical connections 32. In addition, metal particles are attached and deposited on the circuit pattern wiring 15 and the circuit pattern wiring 16 to form the electrical connection portion 33. Here, two physical connection portions 32 and two electrical connection portions 33 are provided, and two electrical connection portions 33 are arranged between the two physical connection portions 32. The physical connection part 32 and the electrical connection part 33 are in a non-contact state and insulated.

  The cold spray technique includes supplying metal particles using a carrier gas, heating the carrier gas, and directing the metal particle material and the carrier gas to a region of the conductive circuit pattern. Any material can be used as the carrier gas as long as it is a gas at room temperature. However, a high sound velocity is required to accelerate the metal particles, and therefore a low molecular weight is used. Moreover, in order to avoid dangers such as dust explosion, an inert gas is often used among them. In order to mix the metal particles and the carrier gas and to direct to the target position, a nozzle having a throat portion is used.

  Although the metal material used for the connection part 30 does not have a restriction | limiting in particular, Aluminum and copper are good suitably. The particle diameter of the metal material set in the cold spray apparatus is preferably 1 μm to 30 μm, and preferably 10 μm to 20 μm. Further, if the thickness of the connecting portion 30 is 50 μm or less, many defective portions are generated in the film.

The pattern mask 31 is a plate-like mask having a pattern-shaped hole of the connection portion 30, and a physical connection hole 34 for forming the physical connection portion 32 and an electric for forming the electrical connection portion 33. Connection hole 35. Although a raw material and a film thickness are not specifically limited, The metal plate etc. which carried out the punching process to the base material of thickness 0.1mm-0.5mm are mention | raise | lifted.
On the composite printed wiring board described above, appropriate electronic components such as resistors, capacitors, transistors, diodes, and ICs are mounted as necessary.

A 200 μm film of polyethylene terephthalate was used for the insulating substrate 13 of the first printed wiring board 11. A 50 μm copper foil was bonded onto the insulating substrate 13 and the circuit pattern wiring 15 was formed by an etching method. The same applies to the insulating substrate 14 and the circuit pattern wiring 16 of the second printed wiring board 12. Then, the first printed wiring board 11 and the second printed wiring board 12 are arranged side by side, the pattern mask 31 is brought into close contact therewith, and the copper particles having an average particle diameter of 10 μm are obtained by a cold spray apparatus (DYMET Corporation DYMET). As a raw material, conditions: Particle supply amount 2.0 g / min, carrier gas (helium), gas pressure 600 kpa, gas temperature 100 ° C., line speed 10 cm / sec. did. The formation was completed in 20 seconds including the preliminary operation.
When the connection state was confirmed, the physical connection and the electrical connection between the first printed wiring board 11 and the second printed wiring board 12 were made without problems.

[Comparative Example 2]
FIG. 4 is a configuration diagram of a composite printed wiring board showing Comparative Example 2.
(A) in a figure is a top view of a composite printed wiring board, (b) is sectional drawing which shows an electrical connection, (c) is sectional drawing which shows a physical connection.
Here, as shown in (b), when the terminal portion 17 and the terminal portion 18 are inserted into the connector 20 and the circuit pattern wiring 15 and the circuit pattern wiring 16 are in contact with the conductor wiring 22, the circuit pattern wiring 15 and the circuit pattern wiring 16 are electrically connected. In addition, the terminal part 17 and the terminal part 18 are made into the shape which protruded a part of insulation base materials 13 and 14 by planar view so that it can insert in the connector 20, respectively.

  Moreover, as shown in (c), while connecting one end side of the connection base material 24 to the upper surface of the insulating base material 13 through the adhesive 26, the other end side of the connection base material 24 is connected through the adhesive 26. Bonded to the upper surface of the insulating substrate 14. Thereby, the first printed wiring board 11 and the second printed wiring board 12 are physically connected. A 200 μm film of polyethylene terephthalate is used for the connection substrate 24.

In Comparative Example 2, it is necessary to process the terminal portions 17 and 18 into a shape corresponding to the connector 20, and further, the connector 20 and the connection base material 24 are necessary. In addition, it is necessary to perform electrical connection and physical connection in separate steps.
Although the present invention has been described with reference to a limited number of embodiments, the scope of rights is not limited thereto, and modifications of the embodiments based on the above disclosure are obvious to those skilled in the art.

DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Insulating base material 3 Circuit pattern wiring 4 Terminal part 5 Terminal pattern wiring 6 Connector 7 Conductor wiring 10 Composite printed wiring board 11 Printed wiring board 12 Printed wiring board 13 Insulating base material 14 Insulating base material 15 Circuit pattern wiring 16 Circuit pattern wiring 17 Terminal portion 18 Terminal portion 20 Connector 22 Conductor wiring 24 Connection base material 26 Adhesive 30 Connection portion 31 Pattern mask 32 Physical connection portion 33 Electrical connection portion 34 Physical connection hole 35 Electrical connection hole

Claims (4)

An insulating substrate;
Circuit pattern wiring formed on the insulating substrate;
A printed wiring board comprising terminal pattern wiring made of conductive particles deposited on the insulating base material and bonded to the circuit pattern wiring. Forming a circuit pattern wiring on an insulating substrate;
Forming a terminal pattern wiring by depositing conductive particles so as to be bonded to the circuit pattern wiring on the insulating base material. The first insulating base material on which the first circuit pattern wiring is formed and the second insulating base material on which the second circuit pattern wiring is formed are arranged side by side, and on the first insulating base material. A base material connecting step of depositing conductive particles on the second insulating base material to connect the first insulating base material and the second insulating base material;
A wiring connection step of depositing the conductive particles on the first circuit pattern wiring and the second circuit pattern wiring to connect the first circuit pattern wiring and the second circuit pattern wiring; Including,
The method for manufacturing a printed wiring board, wherein the substrate connecting step and the wiring connecting step are performed simultaneously.   The method for manufacturing a printed wiring board according to claim 2, wherein the conductor particles are deposited using a cold spray method.

Images