JP2017175068A - Electronic device and manufacturing method thereof - Google Patents

Abstract

An electronic device and a method for manufacturing the electronic device are provided that can confirm solder finish without visual inspection. A circuit board 20 is fixed to a case so that a back surface 20b faces the case. The circuit board includes a through hole 21 penetrating over one surface 20a and the back surface, a wall surface portion 23a formed on the wall surface of the through hole, a land 23 including a peripheral portion 23b formed on the back surface around the opening of the through hole, and a plurality of through holes. It has the solder inspection part 24 formed corresponding to a part. The solder inspection portion includes a conductive connection portion 24a formed over one surface and the back surface, a wiring 24b formed between the conductive connection portion and the peripheral portion on the back surface, and a conductive path between the wall surface portion and the conductive connection portion on the back surface. A gap 24c is included that divides the conductor pattern including the peripheral portion and the wiring. The solder 70 is integrally disposed on the peripheral portion and the gap portion, and the wall surface portion and the conductive connection portion are electrically connected. [Selection] Figure 10

Description

  The disclosure in this specification relates to an electronic device including a circuit board, a housing that accommodates the circuit board, and an insertion mounting component that is inserted and mounted on the circuit board, and a manufacturing method thereof.

  2. Description of the Related Art Conventionally, there has been known an electronic apparatus that includes a circuit board, a housing that accommodates the circuit board, and an insertion mounting component that is inserted and mounted on the circuit board.

  The circuit board has a plurality of through holes. Lands are formed around the wall surface and the opening of the through hole. The insertion mounting component has a plurality of terminals. The insertion mounting component is arranged such that the terminal passes through the corresponding through hole and the tip of the terminal protrudes to the first main surface side of the circuit board. The terminal is flow soldered from the first main surface side, and the terminal and the land are electrically connected via the solder. In order to secure the connection reliability between the terminal and the land, the solder finish is important.

  On the other hand, Patent Document 1 discloses a technique that allows easy confirmation of solder rise after flow soldering.

JP 2010-92919 A

  The conventional technique confirms the solder rise based on the degree of solder rise in two or more solder rise confirmation through holes provided on the printed circuit board, each having different solder finish.

  Therefore, it is not possible to confirm the solder rise without visual inspection from the second main surface side opposite to the first main surface. In a configuration in which the circuit board is fixed to the case constituting the housing and the terminals are flow soldered in this fixed state, the second main surface side is hidden by the case, so the solder rise cannot be visually confirmed. .

  The present disclosure has been made in view of such problems, and an object thereof is to provide an electronic device and a method for manufacturing the same that can confirm the solder rise without visual observation.

  The present disclosure employs the following technical means to achieve the above object. In addition, the code | symbol in parenthesis shows the corresponding relationship with the specific means as described in embodiment mentioned later as one aspect | mode, Comprising: The technical scope is not limited.

One of the present disclosure includes a first main surface (20a), a plurality of through holes (21) penetrating over the second main surface (20b) opposite to the first main surface in the plate thickness direction, and wall surfaces of the through holes. A circuit board (20) having a wall surface portion (23a) formed and a land (23) connected to the wall surface portion and including a peripheral portion (23b) formed around the opening of the through hole on the second main surface. When,
One side is open and is placed so as to face the second main surface of the circuit board. The case (31) to which the circuit board is fixed is assembled to the case in the plate thickness direction so as to cover the one side opening. A cover (32), and a housing (30) for accommodating the circuit board,
Insert mounting component (40) having a plurality of terminals (42) electrically connected to the land through solder (70), with the tip protruding to the first main surface side of the circuit board through the corresponding through hole. )When,
With
The circuit board has a conductive connection portion (24a) formed over the first main surface and the second main surface at a position different from the through hole in order to electrically inspect the solder rising toward the second main surface side. In the second main surface, the wiring (24b) formed between the conductive connection portion and the peripheral portion, and on the second main surface, the conductive path between the wall surface portion of the land and the conductive connection portion is blocked. A gap portion (24c) that divides the conductor pattern composed of the peripheral portion and the wiring into two, and further includes a solder inspection portion (24) formed corresponding to a part of the plurality of through holes;
Solder is integrally disposed on the peripheral portion and in the gap, and the wall surface portion and the conductive connection portion are electrically connected via the solder.

  According to this, the circuit board has a solder inspection part. When the solder rises to the second main surface side and the solder is disposed not only on the peripheral portion but also on the gap portion, the wall surface portion of the land and the conductive connection portion are electrically connected. The conductive connection portion is formed over the first main surface and the second main surface. Therefore, even if it does not visually confirm from the 2nd main surface side, the solder rising to the 2nd main surface side can be confirmed by the electrical test | inspection by the 1st main surface side.

Another one of the present disclosure includes a first main surface (20a), a plurality of through holes (21) penetrating through the second main surface (20b) opposite to the first main surface in the plate thickness direction, A circuit board having a wall surface portion (23a) formed on the wall surface and a land (23) connected to the wall surface portion and including a peripheral portion (23b) formed around the opening of the through hole on the second main surface ( 20)
One side is open and is placed so as to face the second main surface of the circuit board. The case (31) to which the circuit board is fixed is assembled to the case in the plate thickness direction so as to cover the one side opening. A cover (32), and a housing (30) for accommodating the circuit board,
Insert mounting component (40) having a plurality of terminals (42) electrically connected to the land through solder (70), with the tip protruding to the first main surface side of the circuit board through the corresponding through hole. )When,
With
A conductive connection part (24a) formed over the first main surface and the second main surface at a position different from the through hole in order for the circuit board to electrically inspect the solder rise toward the second main surface side. In the second main surface, the wiring (24b) formed between the conductive connection portion and the peripheral portion, and on the second main surface, the conductive path between the wall surface portion of the land and the conductive connection portion is blocked. An electronic device further comprising a solder inspection portion (24) formed corresponding to a part of a plurality of through holes, including a gap portion (24c) that divides a conductor pattern composed of a peripheral portion and wiring into two. A manufacturing method comprising:
Prepare a circuit board with through holes, lands, and solder inspection parts,
After the preparation, fix the circuit board to the case so that the terminals of the inserted mounting parts pass through the corresponding through holes,
After fixing, perform terminal flow soldering from the first main surface side of the circuit board,
After the flow soldering, the jig is brought into contact with the first main surface of the circuit board, and electrical inspection is performed between the land and the solder inspection portion corresponding to the through hole in which the land is formed. Check whether or not the solder is placed in the gap of the pattern, and the wall surface part and the conductive connection part are electrically connected via the solder,
When the wall surface portion and the conductive connection portion are electrically connected, the case and the cover are assembled so as to accommodate the circuit board.

  According to this, after fixing the circuit board which has a solder test | inspection part to a case, the terminal of a connector is flow soldered. When the solder wets up to the second main surface side and the solder is placed not only on the peripheral portion but also in the gap portion, the solder rises to the second main surface side in the electrical inspection after flow soldering. Can be confirmed. Therefore, the solder finish can be confirmed without visually confirming from the second main surface side.

1 is a perspective view of an electronic device according to a first embodiment. It is a perspective view which shows the state which removed the cover. It is a top view which shows the state which removed the cover. It is sectional drawing which follows the IV-IV line of FIG. It is sectional drawing to which the connector periphery was expanded. It is the top view which looked at the area | region VI of FIG. 3 from the 2nd main surface side, and has shown the state before fixing to a case. It is the top view to which the area | region VII of FIG. 6 was expanded. It is sectional drawing which follows the VIII-VIII line of FIG. It is a top view which shows the area | region VI, and has shown the state after flow soldering. It is sectional drawing which follows the X-XI line of FIG. It is sectional drawing which shows the manufacturing method of an electronic device. It is sectional drawing which shows the manufacturing method of an electronic device. It is sectional drawing which shows the manufacturing method of an electronic device. In the electronic device which concerns on 2nd Embodiment, it is sectional drawing which shows the periphery of a solder test | inspection part, and respond | corresponds to FIG. In the electronic device which concerns on 3rd Embodiment, it is a top view which shows the periphery of a solder test | inspection part, and respond | corresponds to FIG.

  A plurality of embodiments will be described with reference to the drawings. In several embodiments, functionally and / or structurally corresponding parts are given the same reference numerals. In the following, the height direction of the housing, in other words, the thickness direction of the circuit board is the Z direction, one direction orthogonal to the Z direction, and the width direction of the housing is the X direction. In addition, a direction orthogonal to both the Z direction and the X direction, that is, a depth direction with respect to the opening of the housing is indicated as a Y direction. Unless otherwise specified, the shape along the XY plane is a planar shape.

(First embodiment)
First, a schematic configuration of the electronic device according to the present embodiment will be described with reference to FIGS. In FIG. 4, the solder 70 is omitted for convenience. 4 and 5, the lands 23 and wirings of the circuit board 20 are omitted for convenience.

  An electronic device 10 shown in FIG. 1 is mounted on a vehicle, for example. The electronic device 10 is configured as an electronic control device that controls a vehicle. The electronic device 10 is configured as a waterproof electronic control device. The electronic device 10 is configured as, for example, an engine ECU (Electronic Control Unit) that controls an engine mounted on a vehicle.

  As shown in FIGS. 1 to 4, the electronic device 10 includes a circuit board 20, a case 30 having a case 31 and a cover 32, a connector 40 having a housing 41 and terminals 42, screws 50, and a resin frame 60. And.

  The circuit board 20 includes a printed board and electronic components (not shown) mounted on the printed board. The printed circuit board is formed by arranging a conductor pattern on a base material formed using an electrically insulating material such as a resin. A circuit is formed by the conductor pattern and the electronic component. The circuit board 20 is accommodated in the internal space of the housing 30.

  The circuit board 20 has one surface 20a and a back surface 20b opposite to the one surface 20a in the Z direction, which is the plate thickness direction. The one surface 20a corresponds to the first main surface, and the back surface 20b corresponds to the second main surface. As shown in FIGS. 2 and 3, the circuit board 20 (printed board) has a substantially rectangular planar shape. As shown in FIGS. 4 and 5, the circuit board 20 has a plurality of through holes 21. The through hole 21 penetrates the circuit board 20 along the Z direction, that is, across the one surface 20a and the back surface 20b. The through hole 21 is formed corresponding to the terminal 42 of the connector 40. In the circuit board 20, lands are formed on the wall surfaces of the through holes 21. The land will be described later.

  As shown in FIG. 3, in the circuit board 20 having a substantially rectangular plane shape, the through hole 21 is provided on one end side in the Y direction. Specifically, it is provided on the mounting side of the connector 40 in the Y direction. In the present embodiment, the through hole 21 is divided into a plurality of regions in the X direction, which is the arrangement direction of the terminals 42. Specifically, the region is divided into three regions corresponding to the cylindrical portion 41 a of the connector 40.

  As shown in FIG. 4, the circuit board 20 has a fixing hole 22 for fixing the circuit board 20 to the housing 30. The fixing hole 22 is a hole through which the screw 50 is inserted. The circuit board 20 is fixed to the case 31 of the housing 30 by screws 50. The circuit board 20 is fixed to the case 31 so that the back surface 20 b faces the bottom of the case 31. The fixing hole 22 is formed in a portion different from the through hole 21 in the circuit board 20.

  In the present embodiment, among the four corners of the circuit board 20 having a substantially rectangular planar shape, the fixing holes 22 are formed in two corners located opposite to the mounting side of the connector 40 in the Y direction. . Further, fixing holes 22 are formed in the Y direction closer to the center than the through hole 21 and near both ends in the X direction. In this way, a total of four fixing holes 22 are formed.

  The housing 30 houses the circuit board 20 and protects the circuit board 20. The housing 30 also houses a part of the connector 40 therein. The housing 30 has two members divided in the Z direction, specifically, a case 31 and a cover 32. As a material for forming the case 31 and the cover 32, for example, a metal material or a resin material can be employed. When at least one of the case 31 and the cover 32 is made of metal, the heat generated by the circuit board 20 can be radiated through the metal portion of the housing 30.

  In the present embodiment, the case 31 and the cover 32 are formed using a metal material. Specifically, the case 31 is formed by die casting using an aluminum-based material. The cover 32 is formed by pressing an aluminum material.

  The case 31 has a box shape with one surface opened. Corresponding to the circuit board 20 having a substantially rectangular planar shape, the bottom of the case 31 is also substantially rectangular. In the case 31, one of the four side surfaces is open, and the side surface opening is connected to the above-described one-surface opening.

  A connector 40 is integrated with the case 31. A resin frame 60 is also integrated with the case 31. The case 31, the connector 40, and the resin frame 60 are integrally formed by using the terminals 42 of the case 31 and the connector 40 as insert parts and injection molding the housing 41 and the resin frame 60.

  The case 31 has a pedestal portion 31a, a screw hole 31b, and an attachment portion 31c. As shown in FIG. 4, the pedestal portion 31 a protrudes from the inner surface of the case 31 in the Z direction corresponding to the position where the circuit board 20 is fixed by the screw 50. The protruding tip of the pedestal 31a is a flat surface so as to contact the back surface 20b of the circuit board 20 and support the circuit board 20. The screw hole 31b opens at the protruding tip of the pedestal portion 31a and is formed with a predetermined depth in the Z direction. The attachment portion 31 c is provided outside the installation area of the resin frame 60 with respect to the case 31. The attachment part 31c is a part for attaching the electronic device 10 to the vehicle. In the present embodiment, there are two pairs of attachment portions 31c provided so as to sandwich the circuit board 20 in the X direction.

  The cover 32 forms an internal space of the housing 30 together with the case 31. By assembling the case 31 and the cover 32, the opening of one surface of the case 31 is closed by the cover 32, and the opening 30a is formed. The opening 30 a is formed by closing the opening on one side by the cover 32 so that the opening on the side is partitioned.

  In the present embodiment, the housing 41, the resin frame 60, and the cover 32 are connected by heat welding. That is, the case 31 and the cover 32 are assembled via the housing 41 and the resin frame 60.

  The contact surfaces of the case 31 and the cover 32 with the housing 41 and the resin frame 60 are subjected to fine hole processing. As a method for forming the fine holes, for example, etching with a chemical solution, laser beam irradiation, or the like can be employed. Part of the resin constituting the housing 41 and the resin frame 60 enters the fine holes of the case 31 and the cover 32.

  The connector 40 is disposed on one end side in the Y direction with respect to the circuit board 20. The connector 40 is inserted and mounted on the circuit board 20. A part of the connector 40 is exposed to the outside through the opening 30 a of the housing 30, and the remaining part is accommodated in the internal space of the housing 30. The connector 40 includes a housing 41 and a plurality of terminals 42.

  The housing 41 is formed using a resin material. As shown in FIG. 5, the housing 41 has a cylindrical portion 41 a and a closing portion 41 b. The cylinder part 41a is formed in a cylindrical shape. The cylinder part 41a has an axis along the Y direction. The closing part 41b is connected to the cylinder part 41a and closes the cylinder part 41a. All the terminals 42 are held in the closing portion 41b. In the present embodiment, the closing part 41b closes one end of the cylindrical part 41a. For this reason, the housing 41 has a bottomed cylindrical shape.

  As shown in FIGS. 1 to 3, the housing 41 has three cylindrical portions 41a. Part of the three cylinder parts 41a is an engine block provided for connection with a wire harness for driving the engine, and the remaining cylinder part 41a is connected to a wire harness corresponding to the relay box and the body ECU. It is considered as a body block for use in The blocking part 41b is common to the three cylinder parts 41a. The blocking part 41b can also be referred to as a base part.

  The housing 41 further has a step portion 41c. As shown in FIG. 5, the stepped portions 41 c are respectively provided on the outer surface on the case 31 side and the outer surface on the cover 32 side in the closing portion 41 b in the Z direction. The step part 41c is provided on the end part side opposite to the cylinder part 41a in the closing part 41b. For this reason, the length of the closing portion 41b in the Z direction is the longest on the connection side with the cylindrical portion 41a and the shortest in the portion where the stepped portion 41c is formed. The depth in the Z direction of the step portion 41 c is substantially equal to the thickness of the case 31 and the cover 32. For this reason, in the Z direction, the outer surface of the case 31 is substantially flush with the outer surface of the cylindrical portion 41a. Although not shown, the outer surface of the cover 32 is also substantially flush with the outer surface of the cylindrical portion 41a.

  The terminal 42 is formed using a conductive material, and electrically relays a circuit configured on the circuit board 20 and an external device. The terminal 42 is held by the closing portion 41b by, for example, press-fitting and insert molding. The plurality of terminals 42 are arranged along the X direction, which is the width direction of the housing 41, as shown in FIGS. 1 and 2. In the present embodiment, since the number of terminals is large, the terminals 42 are arranged in multiple stages in the Z direction. As shown in FIG. 5, the terminal 42 has a held portion 42a, a fitting portion 42b, and a leg portion 42c.

  The held portion 42 a is a portion of the terminal 42 that is held by the closing portion 41 b of the housing 41. In the cross section shown in FIG. 5, the held portion 42a is held in four steps in the Z direction with respect to the closing portion 41b. The held portion 42a extends along the Y direction.

  The fitting portion 42b is a portion of the terminal 42 into which a female connector of an external device is fitted. The fitting portion 42b is a portion that is electrically connected to the female connector described above. The fitting portion 42 b extends from the held portion 42 a to the opposite side to the internal space of the housing 30. The fitting part 42b is arrange | positioned in the cylinder part 41a. In this embodiment, the fitting part 42b is arrange | positioned at each of the three cylinder parts 41a.

  The fitting part 42b is also extended in the Y direction. There is no bent portion between the held portion 42a and the fitting portion 42b, and the fitting portion 42b extends in the Y direction continuously to the fitting portion 42b. The interval between the held portions 42a adjacent in the Z direction, that is, the interval D1 between the adjacent fitting portions 42b is a constant value. The distance D1 is determined according to the connection structure with the female connector.

  The leg portion 42c is a portion of the terminal 42 that extends from the held portion 42a to the circuit board 20 side. The leg part 42c is a part extended from the held part 42a to the opposite side to the fitting part 42b. The leg part 42c has a first bent part 42d, an insertion part 42e, and a connecting part 42f that connects the held part 42a and the first bent part 42d.

  42 d of 1st bending parts are provided in the leg part 42c between the insertion part 42e and the connection part 42f. The first bent portion 42d is a portion that bends the leg portion 42c so as to extend downward in the Z direction and on the circuit board 20 side. In the present embodiment, regarding the positional relationship between the two portions A and B in the terminal 42, when A is positioned on the bottom side of the case 31 with respect to B, B is positioned below A and A is relative to B. It is shown that it is located above.

  In the terminals 42 arranged in multiple stages, the position of the first bent portion 42d is as far away from the closing portion 41b in the Y direction as the first bent portion 42d of the terminal 42 located on the upper side, as shown by a broken line in FIG. Yes. That is, the distance along the Y direction between the held portion 42a and the first bent portion 42d of the leg portion 42c connected to the held portion 42a is longer as the terminal 42 is located above.

  The insertion part 42e is a part extending downward from the first bent part 42d. The insertion part 42 e is inserted through the corresponding through hole 21 of the circuit board 20. For this reason, a part of the insertion portion 42 e is inserted into the through hole 21. The insertion portion 42 e is electrically connected to the land on the wall surface of the through hole 21 through the solder 70. In the terminals 42 arranged in multiple stages, the insertion portions 42e are arranged in the Y direction, and the interval between the insertion portions 42e in the Y direction is a constant value.

  In the present embodiment, the connecting portions 42f of all the terminals 42 include the first horizontal portion 42g, the second bent portion 42h, the inclined portion 42i, the third bent portion 42j, and the second horizontal portion 42k. doing. That is, all the terminals 42 are inclined terminals 43 including the second bent part 42h and the inclined part 42i.

  The first horizontal portion 42g is a portion from the end portion on the held portion 42a side to the second bent portion 42h in the connecting portion 42f. The first horizontal portion 42g extends in the Y direction. That is, the first horizontal portion 42 g is substantially parallel to the one surface 20 a of the circuit board 20. There is no bent portion between the held portion 42a and the first horizontal portion 42g, and the first horizontal portion 42g extends in the Y direction continuously to the fitting portion 42b. For this reason, in the inclined terminals 43 arranged in multiple stages, the interval between the first horizontal portions 42g adjacent in the Z direction is also D1.

  The second bent portion 42h and the inclined portion 42i are provided so that the first bent portion 42d of the leg portion 42c connected to the held portion 42a is positioned above the held portion 42a. In the present embodiment, as shown by a one-dot chain line in FIG. 5, the second bent portion 42h and the inclined portion 42i are arranged so that the circuit board 20 is positioned above the first-stage held portion 42a from the lower side. Is provided. In other words, the first bent portion 42d of the leg portion 42c connected to the held portion 42a is positioned above the held portion 42a, and further, the circuit board 20 is held in the first stage held portion 42a. The bending angle of the second bent part 42h and the length of the inclined part 42i are determined so as to be positioned above the upper part.

  The second bent portion 42h is a portion that bends the connecting portion 42f obliquely upward toward the first bent portion 42d. The second bent portion 42h is provided between the first horizontal portion 42g and the inclined portion 42i. The second bent portion 42h is a portion that bends the connecting portion 42f extending in the Y direction so as to extend obliquely upward. In the inclined terminals 43 arranged in multiple stages, the positions of the second bent portions 42h in the Y direction are substantially equal to each other as indicated by broken lines in FIG.

  The inclined portion 42i is connected to the first bent portion 42d side with respect to the second bent portion 42h, and extends obliquely upward from the second bent portion 42h. In the inclined terminals 43 arranged in multiple stages, the bending angle of the second bent portion 42h is larger as the inclined terminal 43 is located below.

  The third bent portion 42j is provided between the second bent portion 42h and the first bent portion 42d, and bends the connecting portion 42f toward the first bent portion 42d. The third bent portion 42j is provided between the inclined portion 42i and the second horizontal portion 42k. The second horizontal portion 42k is a portion between the third bent portion 42j and the first bent portion 42d in the connecting portion 42f. The second horizontal portion 42k extends in the Y direction. That is, the second horizontal portion 42k is substantially parallel to the one surface 20a of the circuit board 20. The third bent portion 42j is a portion that bends the connecting portion 42f extending obliquely upward along the Y direction.

  In the inclined terminals 43 arranged in multiple stages, the position of the third bent portion 42j is closer to the closing portion 41b as the inclined terminal 43 is located upward as shown by the broken line in FIG. That is, the distance along the Y direction between the held portion 42a and the third bent portion 42j of the leg portion 42c connected to the held portion 42a is shorter as the inclined terminal 43 is located above. Thereby, the extending length of the inclined portion 42 i is shorter as the inclined terminal 43 is positioned upward.

  The extending length of the second horizontal portion 42k is longer as the inclined terminal 43 is positioned upward. In the present embodiment, in the inclined terminals 43 arranged in multiple stages, the interval D2 between the second horizontal portions 42k adjacent in the Z direction is a constant value. Particularly in the present embodiment, the interval D2 is narrower than the interval D1 of the held portion 42a.

  The screw 50 is formed using a metal material. The screw 50 is inserted through the fixing hole 22 of the circuit board 20 and screwed into the screw hole 31 b of the case 31.

  The resin frame 60 is interposed between the opposing peripheral edge portions of the case 31 and the cover 32 constituting the housing 30. As described above, the resin frame 60 is formed integrally with the housing 41 of the connector 40. As a material of the housing 41 and the resin frame 60, for example, a thermoplastic resin such as PBT can be employed. The resin frame 60 fulfills the function of connecting the case 31 and the cover 32 together with the closing part 41 b of the housing 41 and the sealing function of sealing the inside of the housing 30 in a watertight manner. Therefore, the closing part 41 b holds the terminal 42 and functions as the resin frame 60.

  As shown in FIGS. 2 and 3, a blocking portion 41 b and a resin frame 60 are provided so as to surround the circuit board 20 having a substantially planar shape. The resin frame 60 is provided in a substantially U-shaped plane corresponding to the three sides of the circuit board 20. The blocking portion 41 b is provided corresponding to the remaining one side of the circuit board 20. The ends of the resin frame 60 having a substantially U-shaped planar shape are connected to both ends in the X direction of the closing portion 41b.

  As described above, the electronic device 10 described above has a waterproof structure using the housing 41 and the resin frame 60 without using a sealing material. The case 31 and the cover 32 are connected via the housing 41 and the resin frame 60. Therefore, no seal groove or seal projection is required, and the electronic device 10 can be made thin in the Z direction. In particular, in the present embodiment, the step portion 41c is provided in the closing portion 41b. Thereby, the electronic device 10 can be made thinner in the Z direction.

  In addition, an inclined terminal 43 is used as the terminal 42. The inclined terminal 43 has a second bent portion 42h and an inclined portion 42i between the held portion 42a and the first bent portion 42d. The second bent portion 42h and the inclined portion 42i are provided so that the first bent portion 42d of the leg portion 42c connected to the held portion 42a is positioned above the held portion 42a. Thereby, the front-end | tip position of the insertion part 42e can be made upward rather than before. Therefore, the size of the electronic device 10 can be reduced in the Z direction.

  In particular, in the present embodiment, the second bent portion 42h and the inclined portion 42i are provided so that the circuit board 20 is positioned above the first-stage held portion 42a from the lower side. Therefore, the size of the electronic device 10 can be further reduced in the Z direction.

  Further, the inclined terminals 43 are held by the housing 41 in multiple stages. For this reason, the physique of the electronic device 10 can be reduced in size as compared with the configuration in which only the first-stage terminal 42 is the inclined terminal 43. Furthermore, since all the terminals 42 are inclined terminals 43, the size of the electronic device 10 can be further reduced.

  Further, the inclined terminals 43 are held in multiple stages, and the bending angle of the second bent portion 42h is smaller as the inclined terminal 43 is higher. As a result, in the inclined terminal 43 held in multiple stages, the distance D2 in the Z direction of the second horizontal portion 42k, which is the portion between the third bent portion 42j and the first bent portion 42d, is set to Z in the held portion 42a. It can be narrower than the distance D1 in the direction. Therefore, the size of the electronic device 10 can be further reduced in the Z direction.

  Further, the distance along the Y direction between the held portion 42a and the third bent portion 42j of the leg portion 42c connected to the held portion 42a is shorter as the inclined terminal 43 is located at the upper side. Also in this manner, in the inclined terminal 43 held in multiple stages, the Z-direction interval D2 of the second horizontal portion 42k, which is the portion between the third bent portion 42j and the first bent portion 42d, is set in the held portion 42a. It can be made narrower than the interval D1 in the Z direction. That is, the size of the electronic device 10 can be further reduced in the Z direction.

  Next, the land 23 and the solder inspection part 24 of the circuit board 20 will be described with reference to FIGS.

  6 to 8 show a state before the circuit board 20 is fixed to the case 31, that is, a state before the terminal 42 of the connector 40 is inserted into the through hole 21. The circuit board 20 further includes a land 23 and a solder inspection unit 24.

  The land 23 has a wall surface portion 23 a formed on the wall surface of the through hole 21 and a peripheral portion 23 b that is connected to the wall surface portion 23 a and is formed around the opening of the through hole 21 on the back surface 20 b. The land 23 is further connected to the wall surface portion 23a, and further includes a peripheral portion 23c formed around the opening of the through hole 21 on one surface 20a. The lands 23 are formed for all the through holes 21. The land 23 is also referred to as a through hole land. The through hole 21 penetrates the conductor pattern disposed on each of the one surface 20a and the back surface 20b.

  The wall surface portion 23a is formed by plating. In the present embodiment, after the electroless copper plating is performed on the wall surface of the through hole 21, the electrolytic copper plating is performed.

  The peripheral portions 23b and 23c are configured as a part of the conductor pattern described above. In the present embodiment, the conductor pattern is formed by patterning a copper foil.

  The peripheral portion 23b is connected to the ground pattern 25 which is a conductor pattern. That is, the peripheral part 23b and the ground pattern are continuously formed as a conductor pattern. The ground pattern 25 is a portion that is set to the ground potential in the circuit board 20. The ground pattern 25 is extended from the peripheral part 23b. A part of the peripheral portion 23 b and the ground pattern 25 are covered with a solder resist 26. Outer peripheral edge portion of the peripheral portion 23 b is covered with the solder resist 26. The peripheral part 23 b has an exposed part 230 exposed from the solder resist 26 and a covering part 231 covered with the solder resist 26. By having the covering portion 231, the solder 70 rises due to surface tension on the exposed portion 230. Thereby, the solder rise with respect to the terminal 42 can be improved.

  The solder inspection part 24 is a part for electrically inspecting the solder rise on the back surface 20b in the circuit board 20. The solder inspection part 24 is formed corresponding to a part of the plurality of through holes 21. In the present embodiment, solder inspection portions 24 are formed corresponding to at least one of the through holes 21 located at the four corners in the XY plane. More specifically, solder inspection portions 24 are formed corresponding to the two through holes 21 on the housing 41 side in the Y direction among the four corners. The solder inspection part 24 has a conductive connection part 24a, a wiring 24b, and a gap part 24c.

  The conductive connection portion 24a is formed across the one surface 20a and the back surface 20b at a position different from the through hole 21. The conductive connection portion 24a electrically connects the conductor pattern on the one surface 20a of the circuit board 20 and the conductor pattern on the back surface 20b.

  In the present embodiment, the conductive connection portion 24a is formed as a through via. The conductive connecting portion 24a is formed by arranging conductive members on the wall surface of the through hole formed in the circuit board 20 over the one surface 20a and the back surface 20b and around the through hole in the one surface 20a and the back surface 20b. The through hole has a smaller diameter than the through hole 21. For example, the wall surface of the through hole is plated. Conductor patterns are arranged around the through holes on the one surface 20a and the back surface 20b. The through hole penetrates the conductor pattern arranged on the one surface 20a and the back surface 20b.

  As shown in FIG. 7, on the back surface 20 b, a part of the conductive connection portion 24 a, specifically, the outer peripheral edge portion is covered with the solder resist 26. The conductive connection portion 24a is not limited to the above-described through via. For example, it can be configured by a plurality of interlayer connection vias and conductor patterns.

  The wiring 24b is configured as a part of the conductor pattern (copper foil) on the back surface 20b. The wiring 24b is formed between the conductive connection portion 24a and the peripheral portion 23b of the land 23 on the back surface 20b. In the present embodiment, the wiring 24b is connected to the conductive connection portion 24a. The wiring 24b extends in the Y direction. Of the wiring 24 b, at least a part of the region from the end on the gap 24 c side is exposed from the solder resist 26. In the present embodiment, the wiring 24b is exposed over the entire length in the Y direction.

  The gap portion 24c divides the conductive pattern including the peripheral portion 23b and the wiring 24b into two so as to block the conductive path between the wall surface portion 23a of the land 23 and the conductive connection portion 24a on the back surface 20b. In the present embodiment, as shown in FIGS. 7 and 8, a gap 24c is formed in a portion between the peripheral portion 23b and the wiring 24b. More specifically, a part of the copper foil at the outer peripheral edge portion in the peripheral portion 23b is removed, and this copper foil removed portion is a gap portion 24c. Further, the gap portion 24 c is exposed from the solder resist 26. The gap 24c is recessed with respect to the peripheral portion 23b and the wiring 24b, and the gap 24c is also referred to as a groove. Since the gap portion 24c is recessed, the solder 70 that wets and spreads on the exposed portion 230 easily flows into the gap portion 24c.

  9 and 10 show a state after flow soldering. Although FIG. 9 is a plan view, the solder 70 is hatched for clarity.

  As will be described later, flow soldering is performed from the one surface 20a side with the terminal 42 inserted through the corresponding through hole 21 and the tip of the terminal 42 protruding to the one surface 20a side. The solder 70 wets the surfaces of the land 23 and the terminal 42 from the one surface 20a side. When the solder 70 wets up to the back surface 20b side, the solder 70 spreads over the peripheral portion 23b of the land 23 and is disposed in the gap portion 24c. As shown in FIGS. 9 and 10, the solder 70 is integrally disposed on the peripheral portion 23 b and the gap portion 24 c, and the wall surface portion 23 a and the conductive connection portion 24 a are electrically connected via the solder 70. ing. In this embodiment, as shown in FIG. 10, the gap 24 c is filled with the solder 70. The solder 70 is also disposed in the gap portion 24c, thereby electrically connecting the peripheral portion 23b and the wiring 24b.

  In addition, arrangement | positioning of the solder 70 in the clearance gap 24c is not limited to the said example. By arranging the solder 70 in the gap portion 24 c, the wall surface portion 23 a of the land 23 and the conductive connection portion 24 a of the solder inspection unit 24 may be electrically connected via the solder 70. Therefore, the solder 70 may be disposed only in a part of the gap 24c in the Z direction. For example, a configuration is adopted in which the solder 70 is not disposed on the lower end side of the gap portion 24c but the solder 70 is disposed on the upper end side so as not to contact the base material (resin) of the printed circuit board that forms the bottom of the gap portion 24c. You can also.

  Further, in the present embodiment, since the through via is employed as the conductive connection portion 24a, the solder 70 wets the conductive connection portion 24a. However, the terminal 42 is not inserted into the conductive connection portion 24a. A plating film for improving the wettability with the solder 70 is formed on the surface of the terminal 42. For this reason, in FIG. 10, the solder rises to the middle of the through hole of the conductive connection portion 24 a.

  Next, a method for manufacturing the electronic device 10 will be described with reference to FIGS.

  First, as shown in FIG. 11, a circuit board 20, a case 31 and a cover 32 constituting the housing 30, and a screw 50 as a fixing member are prepared. Specifically, a circuit board 20 having a through hole 21, a fixing hole 22, a land 23, and a solder inspection unit 24 is prepared.

  As for the case 31 and the cover 32, microhole processing is performed in advance on the connection surface between the housing 41 (blocking portion 41 b) and the resin frame 60. Micropores can be formed by etching with a chemical solution, laser light irradiation, or the like.

  Then, the housing 31 and the resin frame 60 are injection-molded using the case 31 and the terminal 42 that have been subjected to micro-hole processing as insert parts. Thereby, the case 31 in which the connector 40 and the resin frame 60 are integrated can be obtained. In the insert molding, the closed portion 41b and a part of the resin frame 60 enter into the fine holes on the surface of the case 31. Therefore, the blocking portion 41b and the resin frame 60 are firmly fixed to the case 31 by the anchor effect and the effect of increasing the contact area.

  Next, as shown in FIG. 12, the case 31 is fixed to the circuit board 20 using screws 50. In a projection view from the Z direction, the circuit board 20 is positioned with respect to the case 31 so that the insertion portion 42e of the terminal 42 overlaps the corresponding through hole 21 and the fixing hole 22 overlaps the corresponding screw hole 31b. . In addition, the circuit board 20 is positioned with respect to the case 31 so that the back surface 20 b of the circuit board 20 faces the bottom of the case 31.

  In this positioning state, the circuit board 20 and the case 31 are relatively moved in the Z direction so that the back surface 20b of the circuit board 20 contacts the protruding tip of the pedestal 31a of the case 31. Thereby, the insertion part 42e of the terminal 42 is inserted through the corresponding through hole 21, and the tip of the insertion part 42e protrudes to the one surface 20a side of the circuit board 20. Further, the fixing holes 22 are connected to the corresponding screw holes 31b. Then, the screw 50 is inserted into the fixing hole 22 from the one surface 20a side and screwed into the screw hole 31b. Thereby, the circuit board 20 is fixed to the case 31.

  Next, as shown in FIG. 13, the flow soldering of the terminal 42 is performed from the one surface 20a of the circuit board 20. Specifically, the wall member 100 is disposed so as to surround the through hole 21, and local flow soldering is performed. In the present embodiment, flow soldering is performed in the cylinder portion 41a unit. As a result, as shown in FIG. 10, the terminal 42 is electrically connected to the land 23 via the solder 70.

  Next, a jig is brought into contact with the one surface 20a side of the circuit board 20, and an electrical inspection is performed between the land 23 and the solder inspection portion 24 corresponding to the through hole 21 in which the land 23 is formed. In this electrical inspection, the solder 70 flows into the gap 24c and spreads to a part of the wiring 24b by the above-described flow soldering, so that the wall surface portion 23a of the land 23 and the conductive connection portion 24a of the solder inspection portion 24 Inspect whether is electrically connected. Specifically, a measuring device that measures resistance and current is used as the jig described above, and one of the pair of contacts of the measuring device is connected to, for example, a land 23 on one surface 20a side of the circuit board 20. 70, and the other is brought into contact with the solder 70 connected to the conductive connection portion 24a. One of the contacts may be brought into contact with the peripheral portion 23 c of the land 23. Further, since the land 23 is connected to the ground pattern 25, it may be brought into contact with the portion of the ground potential exposed on the one surface 20a. About the other of a contactor, you may make it contact the electrically-conductive connection part 24a in the one surface 20a.

  In the flow soldering, when the solder 70 is wetted to the back surface 20b side and the solder 70 is disposed in the gap 24c as shown in FIG. 10, the wall surface portion 23a of the land 23 and the conductive connection portion 24a of the solder inspection portion 24 are Electrically connected. On the other hand, when the solder rise is insufficient and the solder 70 is not disposed in the gap portion 24c, the wall surface portion 23a and the conductive connection portion 24a are electrically separated. Therefore, it can be confirmed by electrical inspection whether or not the solder 70 is disposed in the gap 24c, that is, whether or not the wall surface portion 23a and the conductive connection portion 24a are electrically connected.

  When it is confirmed by electrical inspection that the wall surface portion 23a and the conductive connection portion 24a are electrically connected, the case 31 and the cover 32 are then assembled so as to accommodate the circuit board 20. In the present embodiment, the cover 32 is disposed in contact with the step portion 41 c formed on the closing portion 41 b of the housing 41 and the resin frame 60 so as to close the opening on the one surface of the case 31. By applying heat to the cover 32 side in this arrangement state, the surface of the closed portion 41b and the resin frame 60 on the cover 32 side is melted, and the closed portion 41b and the resin frame 60 and the cover 32 are thermally welded.

  Since the closed portion 41b and a part of the resin frame 60 enter into the fine holes on the surface of the cover 32, the closed portion 41b and the resin frame 60 are firmly fixed to the cover 32 due to the anchor effect and the effect of increasing the contact area. That is, the case 31 and the cover 32 are fixed via the closing part 41 b and the resin frame 60. Thus, the electronic device 10 can be obtained.

  Next, effects of the electronic device 10 and the manufacturing method thereof according to the present embodiment will be described.

  In the present embodiment, the circuit board 20 has a solder inspection unit 24. The solder inspection part 24 has a gap part 24c that divides the conductor pattern composed of the peripheral part 23b of the land 23 and the wiring 24b on the back surface 20b. Therefore, during flow soldering, when the solder 70 is wetted up to the back surface 20b side and the solder 70 is disposed in the gap portion 24c of the conductor pattern, the wall surface portion 23a of the land 23 and the conductive connection portion 24a are electrically connected. Is done. The conductive connection portion 24a is formed over the one surface 20a and the back surface 20b. Therefore, by bringing a jig for electrical inspection into contact with the one surface 20a side, it is possible to confirm the solder rise without visual confirmation from the back surface 20b.

  Specifically, even if flow soldering is performed with the circuit board 20 fixed to the case 31, after the flow soldering, a jig is brought into contact with the one surface 20 a side of the circuit board 20, and the land 23 and the land 23 are contacted. The electrical inspection with the solder inspection part 24 corresponding to the through-hole 21 in which is formed can be performed. Thereby, it can be confirmed whether or not the solder 70 is disposed in the gap portion 24c, that is, whether or not the wall surface portion 23a and the conductive connection portion 24a are electrically connected. Therefore, the solder finish can be confirmed without visual inspection.

  In the present embodiment, a connector 40 as an insertion mounting component is fixed to the case 31. Specifically, the connector 40 is integrally formed with the case 31. In this case, the circuit board 20 is fixed to the case 31 so that the back surface 20 b faces the bottom of the case 31 and the terminal 42 is inserted through the through hole 21. For this reason, the back surface 20b side of the circuit board 20 is hidden by the case 31 at the time of flow soldering, and it is impossible to visually confirm the solder rising to the back surface 20b side. However, since it has the solder test | inspection part 24 as mentioned above, a solder rise can be confirmed.

  In particular, in the present embodiment, a gap portion 24c is formed between the peripheral portion 23b and the wiring 24b in the conductor pattern including the peripheral portion 23b and the wiring 24b. That is, a gap 24c is formed adjacent to the peripheral portion 23b. At the time of flow soldering, when the solder 70 rises to the back surface 20b side and the solder 70 wets and spreads on the peripheral portion 23b of the land 23, the solder 70 flows into the gap portion 24c. Therefore, when the solder 70 wets and spreads on the peripheral portion 23 b and a good solder fillet is formed between the peripheral portion 23 b and the terminal 42, the solder 70 is disposed in the gap portion 24 c. Therefore, the connection reliability between the land 23 and the terminal 42 can be ensured.

  By the way, the ground pattern 25 has a solid conductor pattern. Accordingly, in the through hole 21 in which the ground pattern 25 is connected to the land 23, heat escapes to the ground pattern 25 at the time of flow soldering, and soldering is poor. On the other hand, in this embodiment, the solder inspection part 24 is formed corresponding to the through hole 21 of the land 23 to which the ground pattern 25 is connected. In other words, the solder inspection part 24 is formed corresponding to the through hole 21 with poor soldering out of the plurality of through holes 21. Therefore, it is possible to guarantee the solder rise for all the through holes 21 while the solder inspection section 24 is provided in only a part of the plurality of through holes 21.

  Since the power supply pattern to be the power supply potential is also solidly arranged, heat escapes to the power supply pattern during flow soldering. Therefore, the solder inspection part 24 may be provided corresponding to the through hole 21 of the land 23 to which the power supply pattern is connected.

  The plurality of through holes 21 are arranged in the X direction and arranged in multiple stages in the Y direction on the circuit board 20. In the plurality of through holes 21 arranged in this way, generally, the solder rise is poor at the through holes 21 at the four corners. On the other hand, in this embodiment, the solder inspection part 24 is formed corresponding to at least one of the through holes 21 located at the four corners. In other words, the solder inspection part 24 is formed corresponding to the through hole 21 with poor soldering out of the plurality of through holes 21. Therefore, it is possible to guarantee the solder rise for all the through holes 21 while the solder inspection section 24 is provided in only a part of the plurality of through holes 21.

  In the present embodiment, the example in which the solder inspection portion 24 is formed corresponding to the two through holes 21 on the housing 41 side in the Y direction among the four corners is shown, but the present invention is not limited to this. For example, you may provide the solder test | inspection part 24 in each of the through-hole 21 of four corners. Further, the solder inspection part 24 may be provided in only one of the through holes 21 located at the four corners.

(Second Embodiment)
This embodiment can refer to the preceding embodiment. For this reason, the description of the parts common to the electronic device 10 and the manufacturing method thereof shown in the preceding embodiment is omitted.

  In the present embodiment, as shown in FIG. 14, the solder inspection portion 24 is formed at a position different from the conductive connection portion 24 a on the one surface 20 a of the circuit board 20, and is contacted with the electrical inspection jig. It further includes a portion 24d, and a connecting portion 24e that electrically connects the contacted portion 24d and the conductive connection portion 24a.

  The contacted portion 24d is configured as a part of the conductor pattern disposed on the one surface 20a. The contacted portion 24 d is exposed from the solder resist 26.

  The connecting portion 24e is also configured as a part of the conductor pattern disposed on the one surface 20a. The connecting portion 24e is configured as a wiring that electrically connects the conductive connecting portion 24a and the contacted portion 24d. On one surface 20a, a solder resist 26 is disposed between the conductive connection portion 24a and the contacted portion 24d in order to suppress the wetting and spreading of the solder 70 to the contacted portion 24d.

  According to this, as shown in FIG. 14, even with the configuration in which the solder 70 is connected to the conductive connection portion 24a, the jig (contactor) can be stably brought into contact with the contacted portion 24d.

  In addition, although the example of the conductor pattern arrange | positioned on the one surface 20a was shown as the connection part 24e, it is not limited to this. The connecting portion 24e may be anything that electrically connects the contacted portion 24d and the conductive connecting portion 24a. For example, an inner layer conductor pattern and an interlayer connection via disposed inside the circuit board 20 may be included.

(Third embodiment)
This embodiment can refer to the preceding embodiment. For this reason, the description of the parts common to the electronic device 10 and the manufacturing method thereof shown in the preceding embodiment is omitted.

  In the present embodiment, as shown in FIG. 15, the gap portion 24 c has a conductor pattern composed of the peripheral portion 23 b and the wiring 24 b in the conductive path from the wall surface portion 23 a of the land 23 to the conductive connection portion 24 a of the solder inspection portion 24. It is formed in the peripheral portion 23b so as to be divided into two. The wiring 24b is continuous with the peripheral portion 23b. The gap portion 24c is formed in a portion between the through hole 21 and the wiring 24b in the Y direction in the peripheral portion 23b. In FIG. 15, the copper foil is removed along the X direction, whereby the exposed portion 230 of the peripheral portion 23b is divided into two regions.

  This also has the same effect as the first embodiment. Note that the gap 24c may be provided in the wiring 24b. That is, a configuration in which the wiring 24b is divided into two regions by the gap 24c can be employed.

  The disclosure of this specification is not limited to the illustrated embodiments. The disclosure encompasses the illustrated embodiments and variations by those skilled in the art based thereon. For example, the disclosure is not limited to the combination of elements shown in the embodiments. The disclosure can be implemented in various combinations. The technical scope disclosed is not limited to the description of the embodiments. The several technical scopes disclosed are indicated by the description of the claims, and should be understood to include all modifications within the meaning and scope equivalent to the description of the claims. .

  Although the example of engine ECU was shown as electronic device 10, it is not limited to this. Furthermore, the present invention is not limited to the electronic control device. The electronic device 10 only needs to include the circuit board 20, the housing 30, and the insertion mounting component (connector 40).

  Although an example in which the case 31 and the cover 32 are assembled by heat welding has been shown, the present invention is not limited to this. A well-known assembly method such as screw fastening may be employed.

  Although the example of the screw 50 is shown as a fixing member for fixing the circuit board 20 to the case 31, it is not limited to this. A press-fit type fixing member or a caulking member can also be used.

  Although the example of the inclination terminal 43 was shown as the terminal 42 of the connector 40, it is not limited to this. A well-known terminal having an approximately L shape may be employed.

  Although the example of the connector 40 was shown as an insertion mounting component, it is not limited to this. For example, an aluminum electrolytic capacitor or the like can be employed as the insertion mounting component.

  The example in which the connector 40 which is an insertion mounting component is fixed to the case 31 is shown. However, the present invention can also be applied to a configuration in which the insertion mounted component is not fixed to the case 31. It is only necessary that the terminal 42 of the insertion mounted component is inserted through the through hole 21 with the circuit board 20 fixed to the case 31, and the tip of the terminal 42 protrudes toward the one surface 20a.

  Although the example of the over resist structure by the solder resist 26 was shown as the peripheral part 23b of the land 23, it is not limited to this. A normal resist structure can also be adopted.

  In the case of an insertion mounting component with multiple terminals such as a connector, it is difficult to confirm the solder rise by visual inspection from the back side of the circuit board for the lower terminal, in other words, the terminal located on the back side. It is. On the other hand, when the circuit board 20 has the solder inspection part 24, it is possible to confirm the solder rise even for the lower terminal 42 which is difficult to visually confirm. That is, even when performing flow soldering before fixing to the case 31 (housing 30), it is possible to confirm the solder finish.

DESCRIPTION OF SYMBOLS 10 ... Electronic device, 20 ... Circuit board, 20a ... One side, 20b ... Back surface, 21 ... Through hole, 22 ... Fixed hole, 23 ... Land, 23a ... Wall surface part, 23b, 23c ... Peripheral part, 230 ... Exposed part, 231 DESCRIPTION OF SYMBOLS ... Covering part, 24 ... Solder inspection part, 24a ... Conductive connection part, 24b ... Wiring, 24c ... Gap part, 24d ... Contacted part, 24e ... Connection part, 25 ... Ground pattern, 26 ... Solder resist, 30 ... Housing , 30a ... opening, 31 ... case, 31a ... pedestal part, 31b ... screw hole, 31c ... mounting part, 32 ... cover, 40 ... connector, 41 ... housing, 41a ... cylindrical part, 41b ... closing part, 41c ... step 42, terminal, 42a ... retained part, 42b ... fitting part, 42c ... leg part, 42d ... first bent part, 42e ... insertion part, 42f ... connecting part, 42g ... first horizontal part, 42h ... first 2 bends , 42i ... inclined portion, 42j ... third bent portion, 42k ... second horizontal section, 43 ... inclined terminal, 50 ... screw, 60 ... resin frame, 70 ... solder, 100 ... wall member

Claims (8)

A plurality of through holes (21) penetrating over the first main surface (20a) and the second main surface (20b) opposite to the first main surface in the plate thickness direction, and a wall surface portion formed on the wall surface of the through hole (23a) and a circuit board (20) having a land (23) connected to the wall surface portion and including a peripheral portion (23b) formed around the opening of the through hole in the second main surface;
One surface is open, arranged to face the second main surface of the circuit board, and the case (31) to which the circuit board is fixed, and the thickness direction so as to cover the opening on the one surface A cover (32) assembled to the case, and a housing (30) for housing the circuit board,
Insertion mounting having a plurality of terminals (42) electrically connected to the land through solder (70), with the tip projecting through the corresponding through hole and protruding to the first main surface side of the circuit board Parts (40);
With
The circuit board is electrically conductive formed over the first main surface and the second main surface at a position different from the through hole in order to electrically inspect the solder rising toward the second main surface side. The connection portion (24a), the wiring (24b) formed between the conductive connection portion and the peripheral portion on the second main surface, and the wall surface portion of the land and the conductive connection on the second main surface A gap portion (24c) that divides the conductor pattern composed of the peripheral portion and the wiring into two so as to cut off a conductive path to the portion, and is formed corresponding to a part of the plurality of through holes. A solder inspection section (24),
The electronic device in which the solder is integrally disposed on the peripheral portion and the gap, and the wall surface portion and the conductive connection portion are electrically connected via the solder.   The electronic device according to claim 1, wherein the gap is formed between the peripheral portion and the wiring.   3. The electron according to claim 1, wherein the land of the through hole in which the solder inspection portion is formed is electrically connected to a ground pattern (25) or a power supply pattern arranged on the circuit board. apparatus.   The solder inspection part is formed at a position different from the conductive connection part on the first main surface of the circuit board, and a contacted part (24d) to which an electrical inspection jig is contacted, and the contacted part The electronic device according to any one of claims 1 to 3, further comprising a connecting portion (24e) for electrically connecting the conductive connecting portion and the conductive connecting portion.   The electronic device according to claim 1, wherein the insertion mounting component is fixed to the case.   The said insertion mounting component is a connector which is integrally molded with the case, has a housing (41) for holding the plurality of terminals, and the plurality of terminals are arranged in the width direction of the housing. Electronic devices. The plurality of terminals are held in multiple stages in the plate thickness direction with respect to the housing,
The plurality of through holes are arranged in the width direction and provided in multiple stages in a direction orthogonal to both the width direction and the plate thickness direction,
The electronic device according to claim 6, wherein the solder inspection portion is formed corresponding to at least one of the through holes located at four corners. A plurality of through holes (21) penetrating over the first main surface (20a) and the second main surface (20b) opposite to the first main surface in the plate thickness direction, and a wall surface portion formed on the wall surface of the through hole (23a) and a circuit board (20) having a land (23) connected to the wall surface portion and including a peripheral portion (23b) formed around the opening of the through hole in the second main surface;
One surface is open, arranged to face the second main surface of the circuit board, and the case (31) to which the circuit board is fixed, and the thickness direction so as to cover the opening on the one surface A cover (32) assembled to the case, and a housing (30) for housing the circuit board,
Insertion mounting having a plurality of terminals (42) electrically connected to the land through solder (70), with the tip projecting through the corresponding through hole and protruding to the first main surface side of the circuit board Parts (40);
With
Conductivity formed over the first main surface and the second main surface at a position different from the through hole in order for the circuit board to electrically inspect the solder rising toward the second main surface side. The connection portion (24a), the wiring (24b) formed between the conductive connection portion and the peripheral portion on the second main surface, and the wall surface portion of the land and the conductive connection on the second main surface A gap portion (24c) that divides the conductor pattern composed of the peripheral portion and the wiring into two so as to cut off a conductive path to the portion, and is formed corresponding to a part of the plurality of through holes. An electronic device manufacturing method further comprising a solder inspection section (24),
Preparing the circuit board having the through hole, the land, and the solder inspection part;
After the preparation, the circuit board is fixed to the case so that the terminal of the insertion mounted component is inserted through the corresponding through hole,
After fixing, perform the flow soldering of the terminal from the first main surface side of the circuit board,
After flow soldering, a jig is brought into contact with the first main surface of the circuit board, and an electrical inspection is performed between the land and the solder inspection portion corresponding to the through hole in which the land is formed. Thus, the solder is disposed in the gap portion of the conductor pattern, and it is confirmed whether or not the wall surface portion and the conductive connection portion are electrically connected via the solder.
A manufacturing method of an electronic device in which the case and the cover are assembled so as to accommodate the circuit board when the wall surface portion and the conductive connection portion are electrically connected.

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