JP2017151010A - Sensor devices, electronic devices and mobile objects - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor device, an electronic equipment and a moving body that can reduce deterioration of the precision of detecting the angular velocity even when suffering an impact having a vibration content comparable to detuning frequency.SOLUTION: A sensor device is equipped with a sensor that detects physical quantities and a reed having the sensor fitted to its one end and a fixed part for mounting use at the other end, and satisfies the relationship of f1<f2/√2, where f1 is the natural frequency of the reed and f2 is the absolute value of the difference between the frequency of the detuning frequency of the sensor in its drive oscillation mode and the frequency of the same in its detecting vibration mode. The sensor is an angular velocity sensor that detects the angular velocity around the detection axis.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a sensor device, an electronic apparatus, and a moving object.

  Conventionally, it has a package containing a resonator element and an IC, a lead electrically connected to the package, and a mold material that molds the package while exposing the lead, and is mounted on the mounting substrate via the lead. There are known electronic devices (see, for example, Patent Document 1 and Patent Document 2). It is also known to use a gyro sensor element that has a drive vibration arm and a detection vibration arm as a vibration piece and detects an angular velocity applied to the electronic device based on a detection signal generated by the detection vibration of the detection vibration arm. (For example, see Patent Document 3).

JP 2010-145137 A JP 2010-147604 A JP 2014-032205 A

  However, for example, when an impact is transmitted from the mounting substrate to the package via the lead, the detuning frequency of the gyro sensor element (absolute value of the difference between the resonance frequency of the driving vibration arm and the resonance frequency of the detection vibration arm) If the vibration component having the same frequency as that of the gyro sensor element is included, there is a problem in that the accuracy of detecting the angular velocity is reduced due to noise on the detection signal from the gyro sensor element.

  An object of the present invention is to provide a sensor device, an electronic apparatus, and a moving body that can reduce a decrease in detection accuracy of angular velocity even when an impact including a vibration component equivalent to a detuning frequency is applied.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.

The sensor device of this application example includes a sensor that detects a physical quantity,
The sensor is attached to one end side, and a lead having a mounting fixing portion on the other end side,
When the natural frequency of the lead is f1, and the detuning frequency that is the absolute value of the difference between the frequency of the driving vibration mode of the sensor and the frequency of the detection vibration mode is f2,

の関係を満足することを特徴とする。
これにより、離調周波数と同等の振動成分を含む衝撃が加わった場合における角速度の検出精度の低下を低減することのできるセンサーデバイスとなる。

It is characterized by satisfying the relationship.
As a result, a sensor device capable of reducing a decrease in angular velocity detection accuracy when an impact including a vibration component equivalent to the detuning frequency is applied.

In the sensor device of this application example, it is preferable that the sensor is an angular velocity sensor that detects an angular velocity around a detection axis.
Thereby, the angular velocity can be detected, and the sensor device is highly convenient.

In the sensor device of this application example, it is preferable that the spring constant of the lead in the direction along the detection axis is 0.01 N / mm or more and 2.0 N / mm or less.
Thereby, the vibration component equivalent to the detuning frequency can be attenuated more effectively by the lead.

In the sensor device of this application example, it is preferable that the spring constant of the lead in the direction orthogonal to the detection axis is 0.02 N / mm or more and 4.0 N / mm or less.
Thereby, the vibration component equivalent to the detuning frequency can be attenuated more effectively by the lead.

In the sensor device of this application example, it is preferable that the spring constant of the lead in the direction orthogonal to the detection axis is 0.04 N / mm or more and 6.0 N / mm or less.
Thereby, the vibration component equivalent to the detuning frequency can be attenuated more effectively by the lead.

In the sensor device according to this application example, it is preferable that the lead has a first bent portion and a second bent portion positioned on the other end side with respect to the first bent portion.
Thereby, the vibration component can be attenuated more effectively by the lead.

In the sensor device of this application example, it has a resin portion that covers the sensor,
It is preferable that each of the first bent portion and the second bent portion is located outside the resin portion.
Thereby, the vibration component can be attenuated more effectively by the lead.

In the sensor device according to this application example, it is preferable that the fixed portion is positioned on the other end side of the lead with respect to the second bent portion.
Thereby, the vibration component can be attenuated more effectively by the lead.

In the sensor device of this application example, it is preferable that the second bent portion bends on the opposite side to the first bent portion.
Thereby, the mounting stability of the sensor device on the mounting substrate is improved.

In the sensor device of this application example, it is preferable that the second bent portion bends on the same side as the first bent portion.
Thereby, size reduction of a sensor device can be achieved.

In the sensor device of this application example, it is preferable that the lead includes a first lead and a second lead that are located on opposite sides of the sensor.
Thereby, the mounting stability of the sensor device on the mounting substrate is improved.

An electronic apparatus according to this application example includes the sensor device according to the application example described above.
As a result, a highly reliable electronic device can be obtained.

The moving body of this application example includes the sensor device of the above application example.
Thereby, a mobile body with high reliability is obtained.

It is sectional drawing of the sensor device which concerns on 1st Embodiment of this invention. It is sectional drawing of the sensor which the sensor device shown in FIG. 1 has. It is a top view of the gyro sensor element which the sensor shown in FIG. 2 has. It is a schematic diagram which shows the drive vibration mode of the gyro sensor element shown in FIG. It is a schematic diagram which shows the detection vibration mode of the gyro sensor element shown in FIG. FIG. 3 is a plan view of the sensor shown in FIG. 2. It is a top view of the sensor shown in FIG. FIG. 2 is a perspective view of a lead included in the sensor device shown in FIG. 1. It is the graph which showed the relationship between (beta) and (lambda). It is a graph which shows the relationship between the natural frequency of a lead | read | reed, and the spring constant of each axial direction. It is sectional drawing which shows the modification of the sensor device shown in FIG. It is sectional drawing of the sensor device which concerns on 2nd Embodiment of this invention. It is sectional drawing of the sensor device which concerns on 3rd Embodiment of this invention. It is sectional drawing of the sensor device which concerns on 4th Embodiment of this invention. 1 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer to which an electronic apparatus of the present invention is applied. It is a perspective view which shows the structure of the mobile telephone (a smart phone, PHS etc. are included) to which the electronic device of this invention is applied. It is a perspective view which shows the structure of the digital still camera to which the electronic device of this invention is applied. It is a perspective view which shows the motor vehicle to which the mobile body of this invention is applied.

  Hereinafter, a sensor device, an electronic apparatus, and a moving object of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

<First Embodiment>
First, the sensor device according to the first embodiment of the present invention will be described.

  FIG. 1 is a cross-sectional view of a sensor device according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view of a sensor included in the sensor device shown in FIG. FIG. 3 is a plan view of the gyro sensor element included in the sensor shown in FIG. FIG. 4 is a schematic diagram showing a driving vibration mode of the gyro sensor element shown in FIG. FIG. 5 is a schematic diagram showing a detection vibration mode of the gyro sensor element shown in FIG. FIG. 6 is a plan view of the sensor shown in FIG. FIG. 7 is a top view of the sensor shown in FIG. FIG. 8 is a perspective view of a lead included in the sensor device shown in FIG. FIG. 9 is a graph showing the relationship between β and λ. FIG. 10 is a graph showing the relationship between the natural frequency of the lead and the spring constant in each axial direction. FIG. 11 is a cross-sectional view showing a modification of the sensor device shown in FIG. Hereinafter, for convenience of explanation, three axes orthogonal to each other are referred to as an x-axis, a y-axis, and a z-axis.

  A sensor device 1 shown in FIG. 1 is an angular velocity sensor device that can detect an angular velocity (physical quantity). The sensor 2, a plurality of leads 7 connected to the sensor 2, and ends of the leads 7 are exposed. And a resin part 8 for molding the sensor 2 in a state. In such a sensor device 1, the tip portion (free end portion) of the lead 7 is fixed to the mounting substrate (fixed object) 9 via the bonding member 12.

(Package parts)
The sensor 2 is an angular velocity sensor that can detect an angular velocity around the detection axis, and as shown in FIG. 2, the package 3, the gyro sensor element 4, the support substrate 5 and the IC 6 accommodated in the package 3, have. Thus, by using an angular velocity sensor as the sensor 2, the sensor device 1 is highly convenient.

  The package 3 has a rectangular plan view shape, and includes a cavity-shaped base 31 having a recess 311 opening on the upper surface, and a plate-shaped lid 32 bonded to the base 31 by closing the opening of the recess 311. Have. In the sensor device 1, the lid 32 is arranged in a posture facing the lower side (mounting substrate 9 side). By setting the package 3 in such a posture, it is possible to reduce the height of the sensor device 1 while ensuring a long overall length of the lead 7.

  The package 3 has an internal space S formed by closing the opening of the recess 311 with the lid 32, and the gyro sensor element 4, the support substrate 5, and the IC 6 are accommodated in the internal space S. The internal space S is hermetically sealed and is in a reduced pressure state (about 10 Pa or less, preferably vacuum). Thereby, since the viscous resistance in the internal space S decreases, the gyro sensor element 4 can be driven efficiently.

  The base 31 has a plurality of internal terminals 331 and a plurality of internal terminals 332 provided facing the internal space S, and a plurality of external terminals 333 provided on the bottom surface. Each internal terminal 331 is electrically connected to the IC 6 via a bonding wire BW. The plurality of internal terminals 331 are electrically connected to the internal terminal 332 via an internal wiring (not shown) formed on the base 31, and are electrically connected to the external terminal 333. There is. Each internal terminal 332 is electrically connected to the support substrate 5 via a conductive bonding member 59, as will be described later. The plurality of external terminals 333 are arranged along a pair of opposing sides on the bottom surface of the package 3. Note that the numbers of the internal terminals 331 and 332 and the external terminals 333 are not particularly limited, and may be set as needed.

  As shown in FIG. 3, the gyro sensor element 4 includes a vibrating body 41 and an electrode disposed on the vibrating body 41.

  The vibrating body 41 is composed of a Z-cut quartz plate and has a spread on an XY plane defined by an X axis (electric axis) and a Y axis (mechanical axis) that are crystal axes of the quartz crystal, and a Z axis (optical axis). It has a thickness in the direction. The vibrating body 41 includes a base 42, detection arms 431 and 432 extending from the base 42 toward both sides in the Y-axis direction, and connecting arms 441 and 442 extending from the base 42 toward both sides in the X-axis direction. Drive arms 451 and 452 extending from the tip of the connecting arm 441 toward both sides in the Y-axis direction, and drive arms 453 and 454 extending from the tip of the connecting arm 442 toward both sides in the Y-axis direction. Have.

  On the other hand, the electrodes include a drive signal electrode 481, a drive ground electrode 482, a first detection signal electrode 483, a first detection ground electrode 484, a second detection signal electrode 485, and a second detection ground electrode 486. Have.

  The drive signal electrode 481 is disposed on the upper and lower surfaces of the drive arms 451 and 452 and on both side surfaces of the drive arms 453 and 454. On the other hand, the drive ground electrode 482 is disposed on both side surfaces of the drive arms 451 and 452 and the upper and lower surfaces of the drive arms 453 and 454. The first detection signal electrode 483 is disposed on the upper and lower surfaces of the detection arm 431, and the first detection ground electrode 484 is disposed on both side surfaces of the detection arm 431. On the other hand, the second detection signal electrode 485 is disposed on the upper and lower surfaces of the detection arm 432, and the second detection ground electrode 486 is disposed on both side surfaces of the detection arm 432. Although not shown, each of the electrodes 481 to 486 is routed to the base portion 42 and is electrically connected to the support substrate 5 at the base portion 42.

  The configuration of the gyro sensor element 4 has been briefly described above. Such a gyro sensor element 4 detects an angular velocity ωz about the Z axis as a detection axis as follows. First, when a drive signal is applied between the drive signal electrode 481 and the drive ground electrode 482, the drive arms 451 to 454 vibrate in a drive vibration mode as shown in FIG. When the angular velocity ωz around the Z axis is applied to the gyro sensor element 4 in the state of driving in the drive vibration mode, a detection vibration mode as shown in FIG. 5 is newly excited. In this detection vibration mode, Coriolis force acts on the drive arms 451 to 454 to excite vibration in the direction indicated by arrow A, and the detection arms 431 and 432 correspond to this vibration in the direction indicated by arrow B ( Bend and vibrate in the X-axis direction). The charges generated in the detection arms 431 and 432 due to the vibration in the detection vibration mode are taken out as detection signals from between the first and second detection signal electrodes 483 and 485 and the first and second detection ground electrodes 484 and 486, Based on this signal, the angular velocity ωz can be detected.

  The frequency of the drive vibration mode (resonance frequency of the drive arms 451 to 454) fd and the frequency of the detection vibration mode (resonance frequency of the detection arms 431 and 432) fs are set to be different from each other. The absolute value of the difference (| fd−fs |) is referred to as “detuning frequency Δf”. It may be fd> fs or fd <fs. Further, the detuning frequency Δf is not particularly limited, but can be, for example, about 300 Hz or more and 3960 Hz or less.

  The support substrate 5 is a conventionally known TAB (Tape Automated Bonding) mounting substrate. As shown in FIG. 6, the support substrate 5 has a frame-shaped base 51 and a plurality of (six in this embodiment) leads 52 provided on the base 51. The base 51 is fixed to the base 31 via a joining member 59, and each lead 52 and the internal terminal 332 are electrically connected via the joining member 59. In addition, the gyro sensor element 4 is fixed to the leading end portion of each lead 52 via a bonding member 58, and the lead 52 and the electrodes 481 to 486 are electrically connected. Therefore, the gyro sensor element 4 is supported by the base 31 via the support substrate 5 and is electrically connected to the IC 6.

  As shown in FIG. 2, the IC 6 is fixed to the bottom surface of the recess 311. The IC 6 includes, for example, an interface unit that communicates with an external host device and a drive / detection circuit that drives the gyro sensor element 4 and detects the angular velocity ωz applied to the gyro sensor element 4.

  Although the sensor 2 has been described above, the sensor 2 is not limited to the above-described configuration as long as the angular velocity can be detected. For example, the configuration of the gyro sensor element 4 is not limited to the configuration described above, and the angular velocity detection axis is not limited to the Z axis. For example, the support substrate 5 may be omitted and the gyro sensor element 4 may be fixed on the base 31 or the IC 6.

(Resin part)
As shown in FIG. 1, the resin portion 8 covers the entire area of the sensor 2. Thereby, the sensor 2 can be protected from impact, dust (dust, dust), and moisture. Further, the connection portion between the sensor 2 and the lead 7 can be protected. As such a resin part 8, various resin materials, such as an epoxy resin and a silicone resin, can be used, for example. Moreover, the resin part 8 can be shape | molded by transfer molding, for example.

(Lead)
As shown in FIG. 1, a plurality of (eight in this embodiment) leads 7 are electrically connected to external terminals 333 disposed on the bottom surface of the package 3 of the sensor 2 on the base end side (one end side). It is fixed via the bonding member 11 and is electrically connected to the external terminal 333. Each of the plurality of leads 7 has a fixing portion 79 on the front end side (the other end side), and is fixed to the mounting substrate 9 via the conductive bonding member 12 in the fixing portion 79. It is electrically connected to the mounting substrate 9.

  As shown in FIG. 7, such a plurality of leads 7 are arranged along a pair of opposing sides on the bottom surface of the package 3 so as to extend to one side (−x axis side) of the sensor 2. Are divided into a plurality of (four) first leads 7a and a plurality of (four) second leads 7b arranged to extend to the other side (+ x axis side). . By having the first lead 7a and the second lead 7b positioned on the opposite sides with respect to the sensor 2, the sensor device 1 can be fixed to the mounting substrate 9 in a more stable posture, and the mounting stability is improved. be able to.

  Further, as shown in FIG. 8, each lead 7 includes a first bent portion 71 located in the middle of the length direction, and a second bent portion positioned on the distal end side (the other end side) from the first bent portion 71. 72. Moreover, both the 1st bending part 71 and the 2nd bending part 72 are bent at substantially right angle, and are bent to the opposite side. Therefore, each lead 7 has a crank shape.

  More specifically, each first lead 7 a includes a base end portion 73 that extends in the −x-axis direction from the portion fixed to the external terminal 333 toward the outside of the sensor 2, and a sensor from the tip of the base end portion 73. A central portion 74 extending in the −z-axis direction toward the lower side of 2, and a distal end portion 75 extending in the −x-axis direction from the distal end of the central portion 74 toward the outside of the sensor 2, A connecting portion between the base end portion 73 and the central portion 74 becomes the first bent portion 71, a connecting portion between the central portion 74 and the distal end portion 75 becomes the second bent portion 72, and the fixing portion 79 is located at the distal end portion 75. Yes. Therefore, the first lead 7a extends in the xy plane.

  Similarly, each second lead 7 b includes a base end portion 73 extending in the + x-axis direction from the fixed portion to the external terminal 333 toward the outside of the sensor 2, and a lower side of the sensor 2 from the tip end of the base end portion 73. A central portion 74 that extends in the −z-axis direction toward the outer side, and a distal end portion 75 that extends in the + x-axis direction from the distal end of the central portion 74 toward the outside of the sensor 2. A connecting portion with the central portion 74 is a first bent portion 71, and a connecting portion between the central portion 74 and the tip portion 75 is a second bent portion 72. The fixing portion 79 is located on the tip portion 75 (that is, on the tip side of the second bent portion 72). Therefore, the second lead 7b also extends in the xy plane.

  When each lead 7 has such a configuration, the shape of the lead 7 becomes relatively simple, and the vibration component can be effectively attenuated by the lead 7. In particular, since the two bent portions are positioned between the two fixed ends of the lead 7, the vibration component can be attenuated more effectively. Further, since the sensor device 1 can be fixed to the mounting substrate 9 in a state where the sensor 2 is separated from the mounting substrate 9, it is difficult for the impact to be transmitted to the sensor 2 via the mounting substrate 9. In addition, since the separation distance between the fixing portion 79 of the first lead 7a and the fixing portion 79 of the second lead 7b can be increased, the sensor device 1 can be fixed to the mounting substrate 9 in a more stable posture. Further, the surface including the fixing portion 79 of each lead 7 is parallel to the mounting surface (xy plane) of the gyro sensor element 4, and the mounting angle of the gyro sensor element 4 with respect to the mounting substrate 9 can be controlled with high accuracy. Therefore, for example, variation in mounting angle between individuals can be reduced.

  In each lead 7, the first bent portion 71 and the second bent portion 72 are both located outside the resin portion 8. Thereby, the impact transmitted from the mounting substrate 9 can be reduced and absorbed by the first bent portion 71 and the second bent portion 72. Therefore, it is difficult for the impact to be transmitted to the sensor 2. Moreover, the vibration component can be attenuated more effectively by the lead 7.

  Here, an example of the size of the lead 7 will be described. However, the size of the lead 7 is not limited to the following, and varies depending on the constituent material of the lead 7 and the like. The cross section of the lead 7 is substantially square, and the width W and the thickness T are not particularly limited, but can be about 0.25 mm ± 0.10 mm, respectively. Further, the length L1 of the base end portion 73 (the length of the portion exposed from the resin portion 8) L1 is not particularly limited, but is preferably about 5.84 mm ± 2 mm, and about 5.84 mm ± 1 mm. More preferably, it is more preferably about 5.84 mm ± 0.5 mm. The length L2 of the central portion 74 is not particularly limited, but is preferably about 9.54 mm ± 3 mm, more preferably about 9.54 mm ± 1.5 mm, and 9.54 mm ± 0.5 mm. More preferably, it is about. By adopting such a size, it is possible to obtain the lead 7 capable of effectively attenuating a vibration component equivalent to the detuning frequency Δf as described later while suppressing an increase in size.

  Moreover, as shown in FIG. 1, although it does not specifically limit as the separation distance D of the surface F in which the fixing | fixed part 79 of each lead 7 is located, and the lower surface of the resin part 8, It is preferable that it is about 5 mm or more and 15 mm or less, More preferably, it is about 7 mm or more and 10 mm or less. As a result, a sufficiently large space can be formed between the mounting substrate 9 and the resin portion 8, and collision between the mounting substrate 9 and the resin portion 8 when an impact is applied can be reduced.

  The constituent material of the lead 7 is not particularly limited as long as it has conductivity and a certain degree of hardness, and various metal materials (including alloys) can be used. Among metal materials, it is particularly preferable to use copper alloy (copper alloy) or iron / nickel alloy (for example, 42 alloy of 57% iron and 42% nickel). By using these, the lead 7 with low resistance and high strength is obtained.

  The shape of the lead 7 has been described above. Next, the physical properties of the lead 7 will be described. First, in such a sensor device 1, when an impact is transmitted from the mounting substrate 9 to the sensor 2 via the lead 7, the impact includes a vibration component having a frequency equivalent to the detuning frequency Δf of the gyro sensor element 4. If this is the case, the detection vibration mode is excited by the vibration component, and noise on the detection signal from the gyro sensor element 4 becomes large, and there is a problem that the detection accuracy of the angular velocity is lowered. Therefore, the sensor device 1 is characterized in the physical properties of the lead 7 so that a decrease in the detection accuracy of the angular velocity can be reduced even when an impact including a vibration component equivalent to the detuning frequency Δf is applied. .

  Specifically, when the natural frequency (natural frequency) of the lead 7 is f1, and the detuning frequency Δf of the sensor 2 (gyro sensor element 4) is f2, the lead is satisfied so as to satisfy the following formula (1). 7 physical properties are set.

  That is, for example, when the detuning frequency f2 is 600 Hz, the physical properties of the lead 7 are set so that the natural frequency f1 of the lead 7 is about 424 or less as determined by the following equation (2).

  By satisfying such a relationship, the vibration component equivalent to the detuning frequency Δf can be effectively damped (relaxed / absorbed) by the lead 7, and an impact including a vibration component equivalent to the detuning frequency Δf is generated. Even when added, it is possible to reduce a decrease in detection accuracy of angular velocity. The minimum value of f1 is not particularly limited, but for example, it is preferable to satisfy the relationship of f2 / 20 <f1. This can prevent the natural frequency f1 of the lead 7 from becoming too small (that is, the lead 7 becomes too soft).

  Here, the vibration transmissibility to the support point of the lead 7 (the boundary portion of the lead 7 with the resin portion 8) when the mounting substrate 9 is vibrated with the sensor device 1 fixed to the mounting substrate 9 is λ. Then, the vibration transmissibility λ is expressed by the following formula (3).

  However, β = ω / Ω, ω is the excitation angular frequency (frequency of the mounting substrate 9), Ω is the natural angular frequency (= 2π · f1) of the lead 7, and ζ is the damping ratio.

  The graph of FIG. 9 is a graph showing the relationship between β and λ for a plurality of sensor devices 1 having different Q values of the sensors 2. From this graph, regardless of the magnitude of the Q value, when β = 1.0, that is, when the excitation angular frequency ω matches the natural angular frequency Ω of the lead 7, the lead 7 resonates and the sensor device 1 It can be seen that vibrates very greatly. On the contrary, it can be seen that the vibration transmissibility λ is smaller than 1 in the range of β> √2. When the excitation angular frequency ω coincides with 2π · f2 that is the angular frequency of the detuning frequency (that is, ω = 2π · f2), β> √2 is given by the above-described equation. (1) where f1 <f2 / √2. Therefore, as described above, by satisfying the relationship of f1 <f2 / √2, the vibration component equivalent to the detuning frequency Δf can be effectively attenuated by the lead 7, and the same as the detuning frequency Δf. Even when an impact including a vibration component is applied, it is possible to reduce a decrease in detection accuracy of angular velocity.

  Next, the spring constant of each lead 7 will be described. Table 1 below shows almost the maximum value (≈f2 / √2) of the natural frequency f1 when the detuning frequency f2 (Δf) is 300 Hz, 622 Hz, 800 Hz, 3000 Hz, and 3960 Hz, and the natural frequency f1 It is the table | surface which showed the spring constant (N / mm) of each direction of an x-axis, a y-axis, and a z-axis when setting the lead | read | reed 7 so that it may become. Moreover, the graph of FIG. 10 is a graph which shows the relationship between the natural frequency f1 shown in Table 1, and the spring constant of each axial direction.

  The approximate expression of the spring constant in the x-axis direction in FIG. 10 is expressed by the following expression (4), the approximate expression of the spring constant in the y-axis direction is expressed by the following expression (5), and the spring constant in the z-axis direction. Is expressed by the following formula (6).

  From Table 1 and FIG. 10, when the detuning frequency f2 is 300 Hz or more and 3960 Hz or less, the x-axis direction (the direction orthogonal to the detection axis of the sensor 2; the in-plane direction of the mounting surface (xy plane) of the gyro sensor element 4 ) Is preferably 0.04 N / mm or more and 6.0 N / mm or less, and the y-axis direction (the direction perpendicular to the detection axis of the sensor 2; the surface of the mounting surface of the gyro sensor element 4) The spring constant in the inward direction is preferably 0.02 N / mm or more and 4.0 Nmm or less, and the z-axis direction (the direction along the detection axis of the sensor 2; the method of the mounting surface of the gyro sensor element 4) The spring constant in the linear direction is preferably 0.01 N / mm or more and 2.0 N / mm or less. By satisfying at least one of these conditions, the vibration component equivalent to the detuning frequency Δf can be attenuated more effectively by the lead 7.

  The measurement of the spring constant of the lead 7 can be performed as follows, for example. That is, first, the lead 7 (part exposed from the resin portion 8) is prepared as a single unit, and the lead 7 is fixed by the fixing portion 79. The spring constant in each axial direction can be measured by applying a load to the free end in each of the x-axis, y-axis, and z-axis directions.

  The sensor device 1 according to the present embodiment has been described above. As described above, in this embodiment, the lead 7 and the package 3 are fixed via the bonding member 11, and the lead 7 and the external terminal 333 are electrically connected via the bonding member 11. The configuration of the part is not particularly limited. For example, as shown in FIG. 11, the lead 7 and the package 3 may be fixed via the bonding member 11, and the lead 7 and the external terminal 333 may be electrically connected via the bonding wire BW1.

  Further, the number of leads 7 is not limited to 8, but may be 1 to 7 or 9 or more, and can be set as appropriate according to the configuration of the sensor device 1. . In the present embodiment, the plurality of leads 7 are divided into the first lead 7a and the second lead 7b. However, all the leads 7 may be the first lead 7a or the second lead 7b. That is, all the leads 7 may be arranged along one side on the bottom surface of the package 3.

  In the present embodiment, the bending angles of the first and second bent portions 71 and 72 are both 90 °, but the bending angles of the first and second bent portions 71 and 72 are not particularly limited. However, the first and second bent portions are arranged so that the base end portion 73 and the tip end portion 75 are parallel, in other words, the mounting surface of the gyro sensor element 4 and the surface F where the fixing portion 79 is arranged are parallel. It is preferable that the bending angles of the portions 71 and 72 are set.

Second Embodiment
Next, a sensor device according to a second embodiment of the present invention will be described.
FIG. 12 is a sectional view of a sensor device according to the second embodiment of the present invention.

  The sensor device according to the present embodiment is the same as the sensor device of the first embodiment described above except that the lead configuration is mainly different.

  In the following description, the sensor device according to the second embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted. In FIG. 12, the same reference numerals are given to the same configurations as those in the above-described embodiment.

  In each lead 7 included in the sensor device 1 of the present embodiment, the first bent portion 71 and the second bent portion 72 are both bent at substantially right angles and bent to the same side.

  More specifically, each first lead 7 a includes a base end portion 73 that extends in the −x-axis direction from the portion fixed to the external terminal 333 toward the outside of the sensor 2, and a sensor from the tip of the base end portion 73. 2, a central portion 74 extending in the −z-axis direction toward the lower side, and a distal end portion 75 extending in the + x-axis direction from the distal end of the central portion 74 toward the inside of the sensor 2. A connecting portion between the end portion 73 and the central portion 74 becomes the first bent portion 71, a connecting portion between the central portion 74 and the tip portion 75 becomes the second bent portion 72, and the fixing portion 79 is located at the tip portion 75. .

  Similarly, each second lead 7 b includes a base end portion 73 extending in the + x-axis direction from the fixed portion to the external terminal 333 toward the outside of the sensor 2, and a lower side of the sensor 2 from the tip end of the base end portion 73. A central portion 74 extending in the −z-axis direction toward the inner side, and a distal end portion 75 extending in the −x-axis direction from the distal end of the central portion 74 toward the inside of the sensor 2. A connecting portion between the central portion 74 and the central portion 74 becomes the first bent portion 71, a connecting portion between the central portion 74 and the tip portion 75 becomes the second bent portion 72, and the fixing portion 79 is located at the tip portion 75.

  When the lead 7 has such a configuration, for example, the spread of the lead 7 in the x-axis direction can be suppressed as compared with the first embodiment described above. Therefore, the sensor device 1 can be downsized.

  Also according to the second embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Third Embodiment>
Next, a sensor device according to a third embodiment of the present invention will be described.
FIG. 13 is a cross-sectional view of a sensor device according to a third embodiment of the present invention.

  The sensor device according to the present embodiment is the same as the sensor device of the first embodiment described above except that the lead configuration is mainly different.

  In the following description, the sensor device according to the third embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted. Moreover, in FIG. 13, the same code | symbol is attached | subjected about the structure similar to embodiment mentioned above.

  In the sensor device 1 of the present embodiment, each lead 7 has two bent portions (a third bent portion 731 and a fourth bent portion 732) at the base end portion 73, as shown in FIG. Further, all the bent portions 71, 72, 731 and 732 are bent on the same side. Therefore, the lead 7 has a spiral shape. Further, in each lead 7, the first bent portion 71, the second bent portion 72, and the fourth bent portion 732 are located outside the resin portion 8, and the third bent portion 731 is located inside the resin portion 8. .

  More specifically, each of the first leads 7 a includes a first base end portion 733 extending in the + x-axis direction from the portion fixed to the external terminal 333 toward the inside of the sensor 2, and the first base end portion 733. A second base end 734 extending in the + z-axis direction from the tip toward the upper side of the sensor 2, and a third base extending in the −x-axis direction from the tip of the second base end 734 toward the outside of the sensor 2 A base end portion 735, a central portion 74 extending in the −z-axis direction from the distal end of the third base end portion 735 toward the lower side of the sensor 2, and + x from the distal end of the central portion 74 toward the inside of the sensor 2 A distal end portion 75 extending in the axial direction, and a connecting portion between the first base end portion 733 and the second base end portion 734 becomes a third bent portion 731, and the second base end portion 734 and the third base end The connection portion with the end portion 735 becomes the fourth bent portion 732, and the connection portion between the third base end portion 735 and the central portion 74 Becomes the first bending portion 71, the connecting portion between the central portion 74 and the distal end portion 75 and the second bending portion 72, and the fixed portion 79 to the distal end portion 75 is located.

  Similarly, each of the second leads 7 b extends from the first base end portion 733 extending in the −x-axis direction from the portion fixed to the external terminal 333 toward the inside of the sensor 2, and from the front end of the first base end portion 733. A second base end portion 734 extending in the + z-axis direction toward the upper side of the sensor 2, and a third base end portion extending in the + x-axis direction from the tip end of the second base end portion 734 toward the outside of the sensor 2 735, a central portion 74 extending in the −z-axis direction from the distal end of the third base end portion 735 toward the lower side of the sensor 2, and an −x-axis direction from the distal end of the central portion 74 toward the inside of the sensor 2 A connecting portion between the first base end portion 733 and the second base end portion 734 becomes a third bent portion 731, and the second base end portion 734 and the third base end portion The connection portion between the third base end portion 735 and the central portion 74 is the first bending portion. Part 71, and the central portion 74 and the distal end portion 75 and the connecting portion and the second bent portion 72, and the fixed portion 79 to the distal end portion 75 is located.

  When the lead 7 has such a configuration, for example, the spread of the lead 7 in the x-axis direction can be suppressed as compared with the first embodiment described above. Therefore, the sensor device 1 can be downsized. Furthermore, compared with the second embodiment described above, the lead 7 can be made longer while the extent in the x-axis direction is the same. Therefore, vibration can be attenuated more effectively by the lead 7.

<Fourth embodiment>
Next, a sensor device according to a fourth embodiment of the present invention will be described.
FIG. 14 is a cross-sectional view of a sensor device according to a fourth embodiment of the present invention.

  The sensor device according to the present embodiment is the same as the sensor device of the first embodiment described above except that the lead configuration is mainly different.

  In the following description, the sensor device according to the fourth embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted. Moreover, in FIG. 14, the same code | symbol is attached | subjected about the structure similar to embodiment mentioned above.

  In the sensor device 1 of the present embodiment, the sensor 2 has a posture opposite to that of the first embodiment described above. In other words, the lid 32 is directed upward (on the side opposite to the mounting substrate 9 (the surface F on which the fixing portions 79 are arranged)).

  Each lead 7 has two bent portions (third bent portion 731 and fourth bent portion 732) at the base end portion 73. Furthermore, the third and fourth bent portions 731 and 732 are bent on the same side, the first and second bent portions 71 and 72 are on the same side, and the third and fourth bent portions 731 and 732 are Is bent to the opposite side. Therefore, the lead 7 has a meandering shape. Further, in each lead 7, the first bent portion 71, the second bent portion 72, and the fourth bent portion 732 are located outside the resin portion 8, and the third bent portion 731 is located inside the resin portion 8. .

  More specifically, each of the first leads 7 a includes a first base end portion 733 extending in the + x-axis direction from the portion fixed to the external terminal 333 toward the inside of the sensor 2, and the first base end portion 733. A second base end portion 734 extending in the −z-axis direction from the tip toward the lower side of the sensor 2, and extending in the −x-axis direction from the tip of the second base end 734 toward the outside of the sensor 2. A third base end portion 735, a central portion 74 extending from the tip of the third base end portion 735 to the lower side of the sensor 2 in the −z-axis direction, and a tip of the central portion 74 toward the inside of the sensor 2; A distal end portion 75 extending in the + x-axis direction, and a connection portion between the first proximal end portion 733 and the second proximal end portion 734 becomes a third bent portion 731, and the second proximal end portion 734 and the second proximal end portion 734 A connection portion between the third base end portion 735 becomes a fourth bent portion 732, and a connection portion between the third base end portion 735 and the central portion 74 Becomes the first bending portion 71, the connecting portion between the central portion 74 and the distal end portion 75 and the second bending portion 72, and the fixed portion 79 to the distal end portion 75 is located.

  Similarly, each of the second leads 7 b extends from the first base end portion 733 extending in the −x-axis direction from the portion fixed to the external terminal 333 toward the inside of the sensor 2, and from the front end of the first base end portion 733. A second base end 734 extending in the −z-axis direction toward the lower side of the sensor 2, and a third base extending in the + x-axis direction from the tip of the second base end 734 toward the outside of the sensor 2 An end portion 735, a central portion 74 extending in the −z-axis direction from the distal end of the third base end portion 735 toward the lower side of the sensor 2, and an −x toward the inner side of the sensor 2 from the distal end of the central portion 74 A distal end portion 75 extending in the axial direction, and a connecting portion between the first base end portion 733 and the second base end portion 734 becomes a third bent portion 731, and the second base end portion 734 and the third base end The connecting portion with the end portion 735 becomes the fourth bent portion 732, and the connecting portion between the third base end portion 735 and the central portion 74 is the first bent portion. Part 71, and the central portion 74 and the distal end portion 75 and the connecting portion and the second bent portion 72, and the fixed portion 79 to the distal end portion 75 is located.

  When the lead 7 has such a configuration, for example, the spread of the lead 7 in the x-axis direction can be suppressed as compared with the first embodiment described above. Therefore, the sensor device 1 can be downsized. Furthermore, compared with the second embodiment described above, the lead 7 can be made longer while the extent in the x-axis direction is the same. Therefore, vibration can be attenuated more effectively by the lead 7.

[Electronics]
Next, the electronic apparatus of the present invention will be described.

  FIG. 15 is a perspective view showing the configuration of a mobile (or notebook) personal computer to which the electronic apparatus of the present invention is applied. In this figure, a personal computer 1100 includes a main body 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display 1108. The display unit 1106 is connected to the main body 1104 via a hinge structure. It is rotatably supported. Such a personal computer 1100 incorporates the sensor device 1.

  FIG. 16 is a perspective view illustrating a configuration of a mobile phone (including a smartphone, a PHS, and the like) to which the electronic device of the invention is applied. In this figure, a cellular phone 1200 includes an antenna (not shown), a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is provided between the operation buttons 1202 and the earpiece 1204. Has been placed. Such a cellular phone 1200 incorporates the sensor device 1.

  FIG. 17 is a perspective view showing a configuration of a digital still camera to which the electronic apparatus of the present invention is applied. In this figure, a display unit 1310 is provided on the back of a case (body) 1302 in the digital still camera 1300, and a display is performed based on an image pickup signal by a CCD. Functions as a viewfinder that displays images. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302. When the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. Such a digital still camera 1300 incorporates the sensor device 1.

  Since such an electronic apparatus includes the sensor device 1, the effect of the sensor device 1 described above can be enjoyed, and excellent reliability can be exhibited.

  In addition to the personal computer of FIG. 15, the mobile phone of FIG. 16, and the digital still camera of FIG. 17, the electronic apparatus of the present invention includes, for example, a smartphone, a tablet terminal, a watch (including a smart watch), an inkjet discharge Wearable terminals such as devices (for example, inkjet printers), laptop personal computers, televisions, HMDs (head-mounted displays), video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic Dictionaries, calculators, electronic game devices, word processors, workstations, videophones, crime prevention TV monitors, electronic binoculars, POS terminals, medical devices (for example, electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiogram measuring devices, ultrasonic diagnostic devices) An electronic endoscope), a fish finder, various measurement devices, gauges (e.g., gages for vehicles, aircraft, and ships), can be applied to a flight simulator or the like.

[Moving object]
Next, the moving body of the present invention will be described.

  FIG. 18 is a perspective view showing an automobile to which the moving body of the present invention is applied. In this figure, a sensor device 1 is built in an automobile 1500. For example, the posture of a vehicle body 1501 can be detected by the sensor device 1. The detection signal of the sensor device 1 is supplied to the vehicle body posture control device 1502, and the vehicle body posture control device 1502 detects the posture of the vehicle body 1501 based on the signal, and controls the stiffness of the suspension according to the detection result. The brakes of the individual wheels 1503 can be controlled. In addition, sensor device 1 includes keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), airbag, tire pressure monitoring system (TPMS), engine It can be widely applied to electronic control units (ECUs) such as control, battery monitors of hybrid vehicles and electric vehicles.

  Since such a moving body includes the sensor device 1, the effect of the sensor device 1 described above can be enjoyed and excellent reliability can be exhibited.

  As described above, the sensor device, the electronic apparatus, and the moving body of the present invention have been described based on the illustrated embodiment. However, the present invention is not limited to this, and the configuration of each unit is an arbitrary configuration having the same function. Can be substituted. In addition, any other component may be added to the present invention.

  In the above-described embodiment, the configuration using the gyro sensor capable of detecting the angular velocity as the sensor has been described. However, the sensor is not particularly limited as long as it is a physical quantity sensor having a detuning frequency. It may be a detectable acceleration sensor or a composite sensor capable of detecting both acceleration and angular velocity.

  DESCRIPTION OF SYMBOLS 1 ... Sensor device 11, 12 ... Joining member, 2 ... Sensor, 3 ... Package, 31 ... Base, 311 ... Recess, 32 ... Lid, 331, 332 ... Internal terminal, 333 ... External terminal, 4 ... Gyro sensor element, DESCRIPTION OF SYMBOLS 41 ... Vibrating body, 42 ... Base part, 431, 432 ... Detection arm, 441, 442 ... Connection arm, 451, 452, 453, 454 ... Drive arm, 481 ... Drive signal electrode, 482 ... Drive ground electrode, 483 ... 1st Detection signal electrode, 484 ... first detection ground electrode, 485 ... second detection signal electrode, 486 ... second detection ground electrode, 5 ... support substrate, 51 ... base, 52 ... lead, 58, 59 ... joining member, 6 ... IC, 7 ... lead, 7a ... first lead, 7b ... second lead, 71 ... first bent portion, 72 ... second bent portion, 73 ... base end portion, 731 ... third bent portion, 732 ... fourth bent 733 ... 1 base end portion, 734... 2nd base end portion, 735... 3rd base end portion, 74... Central portion, 75 .. tip end portion, 79 .. fixing portion, 8 .. resin portion, 9. DESCRIPTION OF SYMBOLS 1102 ... Keyboard, 1104 ... Main body, 1106 ... Display unit, 1108 ... Display unit, 1200 ... Mobile phone, 1202 ... Operation button, 1204 ... Earpiece, 1206 ... Mouthpiece, 1208 ... Display, 1300 ... Digital steel Camera, 1302 ... Case, 1304 ... Light receiving unit, 1306 ... Shutter button, 1308 ... Memory, 1310 ... Display unit, 1500 ... Automobile, 1501 ... Car body, 1502 ... Car body attitude control device, 1503 ... Wheel, A, B ... Arrow, BW, BW1 ... bonding wire, D ... separation distance, F ... surface, L1, L2 ... length, S ... internal space, T ... thickness , W ... width, ωz ... angular velocity

Claims (13)

A sensor that detects physical quantities;
The sensor is attached to one end side, and a lead having a mounting fixing portion on the other end side,
When the natural frequency of the lead is f1, and the detuning frequency that is the absolute value of the difference between the frequency of the driving vibration mode of the sensor and the frequency of the detection vibration mode is f2,

Sensor device characterized by satisfying the relationship.   The sensor device according to claim 1, wherein the sensor is an angular velocity sensor that detects an angular velocity around a detection axis.   The sensor device according to claim 2, wherein a spring constant of the lead in the direction along the detection axis is 0.01 N / mm or more and 2.0 N / mm or less.   The sensor device according to claim 2, wherein a spring constant of the lead in a direction orthogonal to the detection axis is 0.02 N / mm or more and 4.0 N / mm or less.   The sensor device according to claim 2, wherein a spring constant of the lead in a direction orthogonal to the detection axis is 0.04 N / mm or more and 6.0 N / mm or less.   6. The sensor device according to claim 1, wherein the lead includes a first bent portion and a second bent portion located on the other end side of the first bent portion. 7. . Having a resin part covering the sensor;
The sensor device according to claim 6, wherein each of the first bent portion and the second bent portion is located outside the resin portion.   8. The sensor device according to claim 6, wherein, in the lead, the fixing portion is located on the other end side with respect to the second bent portion. 9.   The sensor device according to any one of claims 6 to 8, wherein the second bent portion is bent to the opposite side to the first bent portion.   The sensor device according to claim 6, wherein the second bent portion is bent to the same side as the first bent portion.   The sensor device according to any one of claims 1 to 10, wherein the lead includes a first lead and a second lead that are located on opposite sides of the sensor.   An electronic apparatus comprising the sensor device according to claim 1.   A moving body comprising the sensor device according to claim 1.

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