JP2017037707A - Optical semiconductor unit for lamp and manufacturing method of optical semiconductor unit for lamp - Google Patents

Abstract

An optical semiconductor unit for a lamp capable of improving handling properties and heat dissipation performance is provided. A substrate 14 and a light emitting module 15 are provided. The substrate 14 includes a metal layer 17, a rear side insulating layer 18, and a terminal insertion hole 29. The light emitting module 15 emits light with a lower surface 38b as a flat surface. A module main body 36 and a lead 37 extending outward from the lower surface 38b of the light emitting module main body 36. The lower surface 38b of the light emitting module main body 36 is bonded to the metal layer 17 via an insulating high heat dissipation adhesive 47. The leading end of the lead 37 is exposed to the outer surface of the rear side insulating layer 18 through the terminal insertion hole 29 of the substrate 14. [Selection] Figure 3

Description

  The present invention relates to an optical semiconductor unit for a lamp and a method for manufacturing the optical semiconductor unit for a lamp.

  In recent years, as shown in Patent Document 1, a light emitting module including an optical semiconductor element tends to be used as a light source for a vehicle lamp. The light emitting module includes a light emitting module main body that holds the optical semiconductor element therein, and a power supply terminal that extends outward from the base end surface of the light emitting module main body and supplies power for light emission to the light emitting module main body. The light emitting module is mounted so that the light emitting module main body does not interfere with light emission and power supply when the light emitting module is used (specifically, in a cylindrical holder attached to the lamp main body). The peripheral surface of the light emitting module main body is fitted and held), and the power supply terminal is extended to the outside (specifically, the outside through the holder space) through the attachment target so as to be connected to the power supply related element.

JP 2012-59608 A

However, in the above case, since the light emitting module itself must be attached to the attachment target, a small and easily damaged light emitting module must be attached to the attachment target in consideration of the presence of a power supply terminal that is easily broken. In addition, it is not easy to handle the light emitting module when it is attached.
In recent years, the output of light emitting modules has been increasing, and accordingly, it is necessary to improve the heat dissipation performance for the light emitting modules, and improvements are demanded for improving the heat dissipation performance.

This invention is made | formed in view of the said situation, The 1st objective is to provide the optical semiconductor unit for lamps which can improve a handleability and heat dissipation performance.
The second object is to provide a manufacturing method of an optical semiconductor unit for a lamp for manufacturing the optical semiconductor unit for a lamp.

In order to achieve the first object of the present invention (the invention according to claim 1),
A substrate and a light emitting module disposed on the substrate,
The substrate has a plate-shaped metal layer, a rear-side insulating layer laminated on one side in the thickness direction of the metal layer, and both sides in the thickness direction of the substrate passing through the metal layer and the rear-side insulating layer. A terminal insertion hole opened outward,
The light emitting module has an optical semiconductor element inside and a light emitting module main body having a flat base end surface, and a power supply for light emission to the light emitting module main body extending outward from the base end surface of the light emitting module main body. A power supply terminal for performing
The base end surface of the light emitting module body is connected to the other side surface in the thickness direction of the metal layer via an insulating adhesive,
The front end of the power supply terminal is exposed to the outer surface of the rear insulating layer through the terminal insertion hole of the substrate.
It is set as the structure which was set as the optical semiconductor unit for lamps characterized by the above. Preferred embodiments of the first aspect are as described in the second to fifth aspects.

In order to achieve the second object of the present invention (the invention according to claim 6),
As a substrate, a plate-shaped metal layer, a rear-side insulating layer laminated on one side in the thickness direction of the metal layer, and the both sides of the substrate in the thickness direction through the metal layer and the rear-side insulating layer A light emitting module main body having an optical semiconductor element inside and a base end surface as a flat surface, and a base end surface of the light emitting module main body. A power supply terminal that extends outward from the power supply terminal and supplies power for light emission to the light emitting module body,
The power supply terminal of the light emitting module main body is exposed to the outer surface of the rear side insulating layer through the terminal insertion hole of the substrate, and the base end surface of the light emitting module main body is insulated on the other side surface in the thickness direction of the metal layer. Connect via glue,
The manufacturing method of the optical semiconductor unit for a lamp is characterized by this. Preferred embodiments of the sixth aspect are as described in the seventh and tenth aspects.

In order to achieve the second object of the present invention (the invention according to claim 8),
As a light emitting module, a light emitting module main body having an optical semiconductor element inside and a base end surface being flat, and a power supply for light emission to the light emitting module main body extending outward from the base end surface of the light emitting module main body In addition to preparing a power supply terminal to be performed, an insulating adhesive is filled in a hardened state in an initial hole in a previous stage finished as a terminal insertion hole for inserting the power supply terminal of the light emitting module as a substrate. Preparing a metal layer, a rear side insulating layer laminated on one side in the thickness direction of the metal layer, and a front side insulating layer laminated on the other side in the thickness direction of the metal layer,
First, by forming the insulating cured adhesive in the initial hole, the rear-side insulating layer and the front-side insulating layer facing the initial hole, the terminal insertion hole is formed, and the front surface By processing a range including at least the region where the initial hole faces in the side insulating layer, the metal layer is exposed with an area where at least a base end surface of the light emitting module body can be disposed,
Next, the power supply terminal of the light emitting module main body is exposed to the outer surface of the rear side insulating layer through the terminal insertion hole, and the base end surface of the light emitting module main body is exposed on the metal layer exposed in the front side insulating layer. To connect through insulating adhesive,
The manufacturing method of the optical semiconductor unit for a lamp is characterized by this. Preferred embodiments of the eighth aspect are as described in the ninth and tenth aspects.

According to the present invention (the invention according to claim 1), the light emitting module body of the optical semiconductor element is bonded to the metal layer of the substrate, and the tip of the power supply terminal in the optical semiconductor element is insulated in the substrate through the terminal insertion hole. Since it is exposed on the outer surface of the layer, the light emitting module and the substrate become one component as the optical semiconductor unit for the lamp, and are larger than the light emitting module rather than the light emitting module that is small and easily damaged when mounted on the mounting target. A strong substrate can be handled as a center, and a power supply terminal that is easily broken can be protected by the terminal insertion hole. Thereby, in the said optical semiconductor unit for lamps, the handleability at the time of attachment of the light emitting module with respect to attachment object can be improved.
Moreover, since the base end surface of the light emitting module is connected to the other side surface in the thickness direction of the metal layer via an insulating adhesive, the amount of heat generated by the light emitting module increases as the output of the light emitting module increases. Even so, the heat is effectively transferred from the wide base end face of the light emitting module body to the metal layer, and the amount of heat transferred is dissipated by the metal layer. Thereby, in the said optical semiconductor unit for lamps, the thermal radiation performance with respect to a light emitting module can be improved.
Furthermore, the substrate has a wider and flat surface than the light emitting module, and the surface can be effectively used as a mounting surface. For this reason, if the said optical semiconductor unit for lamps is used, attachment stability can be improved.

  According to the invention of claim 2, since the inner peripheral surface of the terminal insertion hole is formed of an insulating resin film, the insulation between the power supply terminal and the metal layer is provided in the terminal insertion hole. The front end portion of the power supply terminal can be exposed on the rear surface side insulating layer while maintaining. Thereby, the heat dissipation performance can be improved based on the use of the metal layer for the substrate while ensuring an accurate power feeding structure.

  According to the invention of claim 3, the front-side insulating layer is laminated on the other side surface in the thickness direction of the metal layer in a region excluding the region where the light emitting module body is disposed, and the power supply electrode is provided on the front-side insulating layer. The substrate is formed with through-holes penetrating the insulating layers on both sides of the substrate in the thickness direction and the metal layers between the two insulating layers, and the entire inner peripheral surface of the through-hole is formed of an insulating film, and the through-holes are electrically conductive. Since the conductive member is arranged so as to penetrate and the conductive member connects the power supply terminal and the power supply electrode, the front end portion of the power supply terminal is exposed on the rear insulating layer. In addition, by using the through-hole and the conductive member, the power supply side electrode can be provided on the front insulating layer, and the light emitting module main body can emit light by supplying power to the power supply side electrode. By providing the power supply side electrode on the front insulating layer, the usability of the optical semiconductor unit for lamps can be improved.

  According to the fourth aspect of the present invention, the through hole is opened on the front side insulating layer so as to face the power feeding electrode, and the conductive member is disposed on the rear side insulating layer so that the front end portion and the through hole of the power feeding terminal are disposed. Since the connection element straddling between the opening and the conductive film that covers the entire inner peripheral surface of the through hole and connects the connection element and the power feeding electrode is provided, the structure related to wiring is extremely simple. It can be a structure. In particular, on the front side (on the front-side insulating layer) that is a visual target, the appearance can be improved without any wiring.

  According to the invention according to claim 5, since the thermal conductivity of the insulating adhesive is higher than the thermal conductivity of the rear side insulating layer, the amount of heat generated by the light emitting module increases as the output of the light emitting module increases. Even so, the amount of heat transferred from the light emitting module to the metal layer can be increased, and the heat dissipation performance for the light emitting module can be enhanced.

  According to the invention which concerns on Claim 6, the optical semiconductor unit for lamps which concerns on the said Claim 1 can be manufactured by using the said manufacturing method.

According to the invention according to claim 7, in preparing the substrate, the metal plate constituting the metal layer in the state having the initial stage of the previous stage finished as the terminal insertion hole, and the insulating property constituting the rear side insulating layer A substrate, an insulating adhesive for bonding the metal plate and the insulating substrate, and then, one side surface in the thickness direction of the metal plate and the insulating substrate between them, By pressing the insulating adhesive so as to approach each other, the thickness direction one side surface of the metal plate and the insulating substrate are bonded, and the insulating adhesive is pushed into the initial hole, After the insulating adhesive is cured, the insulating adhesive in the initial hole and the portion of the insulating substrate facing the initial hole are processed to form the terminal insertion hole. Insulating contact by effectively using the bonding work (pressing work) of Agent it is possible to fill the initial holes can easily be formed in the insertion hole for the desired terminal by cutting the insulating adhesive after the curing.
In addition, by processing the cured insulating adhesive filled in the initial holes, it is possible to form terminal insertion holes with a desired small diameter, so that the space facing the base end face of the light emitting module body can be reduced (light emission). Reduction of the non-contact area of the base end surface of the module main body) and the deterioration of heat dissipation performance can be suppressed.

  According to the invention according to claim 8, by using the manufacturing method, an insulating layer (front side insulation) is also formed on the other side surface in the thickness direction of the metal layer among the optical semiconductor units for lamps according to claim 1. Layer) can be manufactured in a region excluding the region where the light emitting module main body is disposed. Thereby, various apparatuses and elements, such as a power feeding electrode, can be arranged on the front-side insulating layer.

  According to the ninth aspect of the invention, in the pressing of the insulating adhesive into the initial hole, the bonding operation (pressing operation) of the rear side insulating substrate and the front side insulating substrate to the metal plate can be effectively used. Insulating adhesive can be more reliably filled in the initial holes than in the case of the above-described seventh aspect.

  According to the invention which concerns on Claim 10, what has a thermal conductivity higher than the thermal conductivity of a back surface side insulating layer is used as an insulating adhesive for adhere | attaching the base end surface of a light emitting module main body to a metal layer. Thus, even if the heat generation amount of the light emitting module increases with the increase in output of the light emitting module, the amount of heat transferred from the light emitting module to the metal layer can be increased, and the heat dissipation performance for the light emitting module can be improved.

A longitudinal section showing a vehicular lamp concerning an embodiment. The perspective view which shows the optical semiconductor unit for lamps used in the vehicle lamp which concerns on embodiment. The expanded longitudinal cross-sectional view which shows the optical semiconductor unit for lamps used in the vehicle lamp which concerns on embodiment. The perspective view which shows the light emitting module used in the optical semiconductor unit for lamps concerning embodiment. Explanatory drawing which shows the internal structure of the light emitting module which concerns on embodiment. Explanatory drawing explaining the manufacturing process of the optical semiconductor unit for lamps which concerns on embodiment. Explanatory drawing explaining the process of the continuation of FIG. Explanatory drawing explaining the process of the continuation of FIG. Explanatory drawing explaining the process of the continuation of FIG. Explanatory drawing explaining the process of the continuation of FIG. Explanatory drawing explaining the process of the continuation of FIG. Explanatory drawing explaining the process of the continuation of FIG. Explanatory drawing explaining the process of the continuation of FIG. The perspective view which shows the state of FIG. Explanatory drawing explaining the process of the continuation of FIG. Explanatory drawing explaining the process of the continuation of FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In FIG. 1, the code | symbol 1 shows the headlamp as a vehicle lamp which concerns on 1st Embodiment. The headlamp 1 includes a lamp body 2 whose front is opened with a horizontally long shape, and a front cover 3 which is detachably attached to an opening peripheral edge of the lamp body 2 so as to cover the horizontally long opening. The lamp body 2 and the front cover 3 define a lamp chamber 4. A lamp unit 5 is disposed in the lamp chamber 4, and irradiation light is emitted to the outside through the front cover 3 by the lamp unit 5.

As shown in FIG. 1, the lamp unit 5 includes a metal heat sink (for example, an aluminum die-cast product) 6, a lens holder 7, a projection lens 8, a reflector 9, and a lamp optical semiconductor unit 10. ing.
In the present embodiment, the heat sink 6 integrally includes a metal plate-like support plate portion 11 and a mounting base portion 12. The support plate portion 11 is supported on the back wall portion 2a of the lamp body 2 via an aiming screw 13 or the like, and the plate surface of the support plate portion 11 faces the front side from the back wall portion 2a while facing the front-rear direction. It is arrange | positioned in the state spaced apart. The mounting base part 12 is attached to the front surface of the support plate part 11, and the upper surface of the mounting base part 12 is formed as a flat surface.
The lens holder 7 has a rear end portion (one end portion) attached to the front surface of the mounting base portion 12 of the heat sink 6. The lens holder 7 has a front end (the other end) extending forward, and the upper surface of the lens holder 7 is continuous with the upper surface of the mounting base 12.
The projection lens 8 is attached to the front end portion of the lens holder 7, whereby the projection lens 8 is disposed on the optical axis L extending in the vehicle front-rear direction.
The reflector 9 is disposed above the upper surface of the mounting base 12 so as to cover the lamp optical semiconductor unit 10 from above. The reflector 9 has an effective reflection surface that reflects light from the optical semiconductor unit 10 for a lamp toward the front (projection lens 15) toward the optical axis L.

  As shown in FIG. 1, the optical semiconductor unit 10 for a lamp is disposed on the upper surface of the mounting base 12 on the lower side of the reflector 9. As shown in FIG. 2, the optical semiconductor unit 10 includes a substrate 14 and a light emitting module 15 disposed on the substrate 14, and the substrate 14 has a plate surface on the upper surface of the mounting base 12. While being directed, it is fixed to the upper surface of the mounting base 12 by screws 16.

  As shown in FIGS. 2 and 3, the substrate 14 includes a plate-like metal layer 17 and a rear-side insulating layer 18 laminated on one side (the lower side in FIG. 3) in the thickness direction of the metal layer 17. The front side insulating layer 19 is laminated on the other side in the thickness direction of the metal layer 17 (upper side in FIG. 3).

  The metal layer 17 is composed of a metal plate 17A. As this metal plate 17A, a 1 mm or 3 mm thick Cu plate is used in the present embodiment.

As shown in FIG. 3, the rear-side insulating layer 18 is made of a resin that is bonded to one side surface (the lower side surface in FIG. 3) of the metal layer 17 via an insulating adhesive (for example, epoxy resin). The rear surface side insulating substrate 18A is used. As the material of the rear surface side insulating substrate 18A, the same kind of resin as the insulating adhesive used for bonding to the one side surface in the thickness direction of the metal layer 17 is used. The back-side insulating substrate 18A is bonded to the metal layer 17 in an integrated state with the conductive substrate 18A.
A wiring pattern portion 20 is provided as a connection element on the outer surface of the rear surface side insulating substrate 18A. The wiring pattern portion 20 includes a pair of conductive line portions 21 extending in parallel with a certain interval, a land portion 22 continuous to one end portion of each conductive line portion 21, and other conductive line portions 21. It has the land part 23 which continues to an edge part, and the insulating coating-film part 24 which covers each electroconductive line part 21 and the land part 23. FIG.
Unnecessary portions of this rear surface side insulating substrate 18A are removed as much as possible. In the present embodiment, a portion of the rear surface side insulating layer 18 where the wiring pattern portion 20, fillet 48 described later and the like are disposed is left, and most of the other rear surface side insulating layer 18 is removed. Along with this, the metal layer 17 is exposed in the removed portion (see FIG. 3).

As shown in FIG. 3, the front-side insulating layer 19 is composed of a resin-made front-side insulating substrate 19 </ b> A bonded to the other side surface in the thickness direction of the metal layer 17 via the insulating adhesive. As the material of the front-side insulating substrate 19A, the same kind of resin as the insulating adhesive used for bonding to the other side surface in the thickness direction of the metal layer 17 is used. As in the case of the conductive substrate 18A, the front-side insulating substrate 19A is bonded to the metal layer 17 in an integrated state with the front-side insulating substrate 19A.
As shown in FIGS. 2 and 3, the front-side insulating substrate 19 </ b> A is partially removed to expose the metal layer 17. The exposed portion of the metal layer 17 is set as the arrangement region 25 of the light emitting module 15, and the arrangement region 25 of the light emitting module 15 is in the thickness direction of the substrate 14 with respect to the land portion 22 in the wiring pattern portion 20. Are opposed to each other.
A pair of power supply electrodes 26 are provided on the surface of the front insulating substrate 19A in the vicinity of the arrangement region 25 of the light emitting module 15. A metal thin film, such as a Cu foil, is used as each power supply electrode, and each power supply electrode 26 corresponds to each land portion 23 in the wiring pattern portion 20 in the thickness direction of the front-side insulating substrate 19A. Are arranged opposite to each other.
Further, since a wiring pattern can be formed on the surface of the front-side insulating substrate 19A, electronic components such as a connector 27 and a thermistor 28 are mounted as shown in FIG. The thermistor 28 is disposed in the vicinity of the light emitting module 15 in order to detect the temperature and perform current control on the light emitting module 15.

As shown in FIG. 3, a pair of terminal insertion holes 29 and a pair of through holes 30 are formed in the substrate 14 so as to penetrate the substrate 14 in the thickness direction.
One end of each of the pair of terminal insertion holes 29 is opened in the hole of each land portion 22 of the wiring pattern portion 20, and the other end is opened in the arrangement region 25 of the light emitting module 15. The inner peripheral surface of each terminal insertion hole 29 is formed with the insulating adhesive (insulating resin coating) 32 in the metal layer 17, and in the rear surface side insulating layer 18, the surface of the rear surface side insulating layer 18. Each terminal insertion hole 29 is insulated from the metal layer 17. Specifically, in forming each terminal insertion hole 29, the terminal initial hole 31 formed in advance in the metal layer 17 is filled with the insulating adhesive 32, and after the curing, the filling is performed. Machining is performed on the partial and rear insulating layer 18.

As shown in FIG. 3, the pair of through holes 30 are opened such that one end thereof faces each land portion 23 in the wiring pattern portion 20, and the other end thereof is in the vicinity of the arrangement region 25 of the light emitting module 15. Openings are made in the outer surface of the front insulating layer 19. The inner peripheral surface of each through hole 30 is formed of a conductive coating 33 over the entire thickness direction of the substrate 14, and the conductive coating 33 is insulated from the metal layer 17 on the outer side in the radial direction. In order to ensure, an insulating layer 34 is disposed. Specifically, the through hole initial hole 35 formed in advance in the metal layer 17 is filled with the insulating adhesive 32, and after the curing, the filled portion, the rear side insulating layer 18 and A through-hole 51 having a smaller diameter than the through-hole initial hole 35 is formed in the front-side insulating layer 19 by machining, and the conductive coating 33 is formed on the inner peripheral surface of the through-hole 51. For this reason, as the insulating layer 34, the insulating adhesive 32, the rear-side insulating layer 18 and the front-side insulating layer 19 are used.
As a result, the conductive coating 33 constituting the inner peripheral surface of each through-hole 30 is formed on each land portion 23 (the other end portion of the conductive line portion 21) in the wiring pattern portion 20 and each of the feeding electrodes 26. Will be connected.

As shown in FIGS. 3 to 5, the light emitting module 15 includes a light emitting module main body 36 and a pair of leads 37 as power supply terminals.
The light emitting module main body 36 includes a disc-shaped stem 38 and a bottomed cylindrical cap 39 disposed on the stem 38.
Both the upper and lower surfaces 38 a and 38 b of the stem 38 are formed as flat surfaces, the upper surface 38 a constitutes a component placement surface, and the lower surface 38 b constitutes the base end surface of the light emitting module main body 36. A laser diode (chip) 42 as an optical semiconductor element is disposed on the upper surface 38 a of the stem 38 via a heat sink 40 and a submount 41. In the present embodiment, a laser diode that emits blue laser light is used as the laser diode 42, and the laser light from the laser diode 42 is irradiated upward.
The cap 39 is disposed so that the opening end thereof is in contact with the stem upper surface 38 a, and the heat sink 40, the submount 41, the laser diode 42, and the like are accommodated in the internal space of the cap 39. On the bottom 39a of the cap 39, a phosphor 43 that generates yellow is provided in the region irradiated with laser light from the laser diode 42, and white light passes through the phosphor 43 through the blue laser light. It is supposed to be emitted.

  As shown in FIG. 5, the pair of leads 37 penetrates the stem 38 in the thickness direction of the stem 38 through a through hole 44 formed in the stem 38. One end of each lead 37 extends above the stem upper surface 38 a, and one end of each lead 37 is connected to the laser diode 42 via a metal wire 45. The other end of each lead 37 extends outward from the lower surface (base end surface) 38b of the stem, and an insulating material (not shown) is interposed between each lead 37 and each through hole 44 of the stem 38. Has been.

As shown in FIG. 3, the light emitting module 15 has a lower surface 38 b of the light emitting module main body 36, a portion where the metal layer 17 is exposed, that is, an arrangement region 25 of the light emitting module 15 with an insulating adhesive 47 interposed therebetween. Are glued together.
As the insulating adhesive 47, an insulating high heat dissipation adhesive 47 is used. In this insulating high heat radiation adhesive 47, a filler (filler) is mixed in the resin in order to increase insulation and thermal conductivity, and the thermal conductivity is the above-mentioned insulating adhesive 32, the rear side insulation. The thermal conductivity of the layer 18 and the front-side insulating layer 19 is higher. In this embodiment, as this insulating high heat dissipation adhesive, a silicone resin containing a filler such as alumina is used with a thickness of about 60 μm or less, and at that time, its thermal conductivity It is preferable to use a material of 2 W / mK or more. As a result, the amount of heat transferred from the light emitting module 15 to the metal layer 17 is increased as much as possible due to the large heat transfer area and the high thermal conductivity of the insulating adhesive 47.
Further, in a state where the light emitting module main body 36 is bonded to the arrangement region 25, each lead 37 is inserted into each terminal insertion hole 29.
The leading end portion of each lead 37 protrudes to the outside through each terminal insertion hole 29 and the land portion 22 (hole) in the wiring pattern portion 20, and the protruding leading end portion of each lead 37 and each land portion 22 is The fillet 48 is formed by soldering both the members 37 and 22. As a result, the light emitting module 15 is connected to the power supply electrode 26 via the conductive pattern 33 that forms the wiring pattern portion 20 and the through hole 30.

  Therefore, in such a headlamp 1, the optical semiconductor unit for lamps 10 includes the light emitting module 15 mounted on the substrate 4, and the optical semiconductor unit for lamps 10 may be attached to the mounting base 12. Therefore, when the headlamp 1 is manufactured, the light emitting module 15 is not small and easily damaged, and the substrate 14 can be handled mainly with a larger and stronger substrate 14 than the light emitting module 15 (improvement in handling). The lead 37 that is easily broken can be protected by the terminal insertion hole 29.

  In addition, since the lower surface 38b of the light emitting module 15 is bonded to the other side surface in the thickness direction of the metal layer 17 via the insulating high heat radiation adhesive 47, the light emitting module 15 is increased in accordance with the increase in output. 15, the wide lower surface 38 b of the light emitting module main body 36 can be used as a heat transfer area, and the heat conductivity of the insulating high heat dissipation adhesive 47 can be used, so that the heat from the light emitting module 15 can be effectively used. Can be transmitted to the metal layer 17. Accordingly, the metal layer 17 quickly dissipates heat, and the heat dissipating performance for the light emitting module 15 can be enhanced.

Furthermore, the board | substrate 14 has a flat surface wider than the light emitting module 15, The surface can be utilized effectively as an attachment surface, and the attachment stability with respect to the attachment base part 12 can be improved. In addition, the rear insulating layer 18 is removed as much as possible on the surface, and the metal layer 17 is exposed in most of the surface. Therefore, the metal layer 17 is attached to the mounting base 12. It will be able to contact, and can improve heat dissipation.
In this case, it is preferable that a recess is formed on the upper surface of the mounting base portion 12, and the rear-side insulating layer 18, the wiring pattern portion 20, the fillet 48, etc. thereon are accommodated in the recess. Most of the flat outer surface of the exposed metal layer 17 can be brought into precise contact with the upper surface of the mounting base 12, and as a result, the mountability can be improved and the mounting base 12 (to the heat sink 6). Of course, in this case, as another mode, a recess is formed in the metal layer 17 (substrate 17), and the rear side insulating layer 18 is formed in the recess. A wiring pattern portion 20 or the like to be arranged may be provided.

  Moreover, the power supply side electrode 26 can be provided on the front side insulating layer 19 even under a structure in which the lead 37 of the light emitting module 15 must be exposed to the outer surface of the rear side insulating layer 18. Usability can be improved.

Next, the manufacturing method of the said optical semiconductor unit 10 for lamps is demonstrated.
First, as shown in FIG. 6, a metal plate 17A is prepared. A terminal initial hole 31 and a through hole initial hole (through hole) 35 are formed in the metal plate 17A at a predetermined interval in advance. In the present embodiment, a Cu plate is used as the metal plate 17A.

Next, as shown in FIG. 7, one side surface in the thickness direction of the metal plate 17A and the rear surface side insulating substrate 18A are overlapped with the insulating adhesive 32 interposed between the both sides 17A, 18A, The other side surface in the thickness direction of the plate 17A and the front side insulating substrate 19A are overlapped with the insulating adhesive 32 interposed between the two sides 17A and 19A, and the rear side insulating substrate 18A and the front side insulating substrate are then stacked. The back side insulating substrate 18A and the front side insulating substrate 19A are bonded to the metal plate 17A by pressing the 19A close to each other, and the insulating adhesive 32 is placed in the terminal initial holes 31 and through holes. It pushes into the initial hole 35 for use. This is because in the pressing of the insulating adhesive 32 into the initial holes 31 and 35, the bonding work (pressing work) of the rear side insulating substrate 18A and the front side insulating substrate 19A to the metal plate 17A is effectively used.
In this case, when the thickness of the metal plate 17A is thick (for example, 3 mm) or when the diameters of the initial holes 31 and 35 are large, before the bonding work (pressing work) of the rear side insulating substrate 18A and the front side insulating substrate 19A. Furthermore, it is preferable to fill the initial holes 31 and 35 with the insulating adhesive 32 to some extent. Further, in the bonding operation (pressing operation), it is more preferable from the viewpoint of workability to heat the metal plate 17A, the rear surface side insulating substrate 18A, and the front surface side insulating substrate 19A.

  Next, as shown in FIG. 8, a laminated structure 50 is formed by integrating a metal foil (for example, Cu foil) 49 on the outer surface of the rear insulating substrate 18A and the outer surface of the front insulating substrate 19A. This is for forming the power supply electrode 26, the wiring pattern portion 20, and the like.

  Next, as shown in FIG. 9, a pair of terminal insertion holes 29 and a pair of through holes 51 are formed in the laminated structure 50. The terminal insertion hole 29 has a smaller diameter than the initial hole 31 in the region where the insulating adhesive 32 (cured) in the initial hole 31 exists, and penetrates the laminated structure 50 in the thickness direction. The inner peripheral surface of the terminal insertion hole 29 is secured by the rear insulating substrate 18A, the insulating adhesive 32 (cured), and the front insulating substrate 19A. Further, the through hole 51 penetrates the laminated structure 50 in the thickness direction with a smaller diameter than the initial hole 35 in the region where the insulating adhesive 32 (cured) in the initial hole 35 exists, and the through hole 51 passes therethrough. As with the inner peripheral surface of the terminal insertion hole 29, the inner peripheral surface of the hole 51 is secured by the rear insulating substrate 18A, the insulating adhesive 32 (cured), and the front insulating substrate 19A. Become.

  Next, as shown in FIG. 10, a conductive coating (for example, Cu film) 33 is coated on the inner peripheral surface of each through hole 51 by plating or the like. This is because the through hole 30 is formed.

  Next, as shown in FIG. 11, unnecessary portions of the metal foil 49 are removed by etching. That is, on the outer surface of the front-side insulating substrate 19A, a base portion 26a of the power supply electrode 26 that is continuous with the metal film 52 on the inner peripheral surface of each through-hole 30 is formed, and on the outer surface of the rear-side insulating substrate 18A, Each conductive line portion disposed on the peripheral edge portion of the land portion 23 that continues to the metal film 52 on the inner peripheral surface of each through hole 30, the conductive line portion 21 that continues to each land portion 23, and the terminal insertion hole 29. A land portion 22 (wiring pattern portion 20) that is continuous with 21 is formed.

Next, as shown in FIG. 12, a certain region is removed from the front-side insulating substrate 19A around the terminal insertion hole 29 by machining (counterbore processing), and the metal plate 17A is removed in that region. Expose. This is for securing the arrangement area 25 of the light emitting module 15.
In this case, unnecessary portions of the rear surface side insulating substrate 18A are also removed. At that time, it is preferable to perform corrosion prevention treatment, gold plating treatment, etc. on the exposed exposed portion (metal plate 17A).

  Next, as shown in FIGS. 13 and 14, in the front-side insulating substrate 19 </ b> A, a metal foil (for example, Cu foil) 53 is integrated with the upper surface of the base portion 26 a for each power supply electrode 26. A pair of power supply electrodes 26 is formed. Further, in the rear side insulating substrate 18A, the wiring pattern portion 20 is covered with the insulating coating film portion 24 except for the pair of land portions 22, and only the pair of land portions 22 is exposed to the outside. In this case, in order to facilitate soldering in each land portion 22, the outer surface of each land portion is subjected to surface treatment (gold plating treatment, solder plating treatment, etc.).

  Next, as shown in FIG. 15, the insulating high heat radiation adhesive 47 is applied to the arrangement region 25 of the light emitting module 15 using a dispenser (not shown). This is for fixing the lower surface 38a of the light emitting module main body 36 to the arrangement region 25 (metal layer 17). In this case, the insulating high heat radiation adhesive 47 is applied so as to spread over the arrangement region 25 so that the entire lower surface 38a of the light emitting module main body 36 is adhered to the arrangement region.

  Next, as shown in FIG. 16, by using assembly equipment such as a mounter (not shown), the lower surface 38 a of the light emitting module main body 36 is lowered onto the arrangement region 25 through the insulating high heat radiation adhesive 47, and a pair of The leads 37 are inserted into the pair of terminal insertion holes 29, and the leading ends of the leads 37 are projected outward from the land portions 22. Then, the adhesive 47 is heated, and after the adhesive 47 is cured, each lead 37 and each land portion 22 are soldered using a robot or a laser (not shown) to form a fillet 48. Thereby, the light emitting module 15 is fixed on the substrate 14, and power can be supplied to the light emitting module 15 from the pair of power supply electrodes 26.

As mentioned above, although embodiment was described, in this invention, the following aspects are included.
(1) The substrate 14 is not provided with the front-side insulating layer 19 but is formed by laminating only the rear-side insulating layer 18 on the metal layer 17.
(2) Use an LED (Light Emitting Diode) or the like as the optical semiconductor element.
(3) Use Cu plates having various thicknesses other than 1 mm and 3 mm as the Cu plate as the metal plate 17A.
(4) Disposing the power feeding electrodes 26 at various positions on the surface of the front insulating substrate 19A.
(5) In forming the inner peripheral surface of each terminal insertion hole 29, an insulating resin (ink) having no adhesive function is used instead of the insulating adhesive 32 to be filled in each terminal insertion hole 29. Use.
(6) Prepare a metal foil 49 integrated with the outer surface of the rear side insulating substrate 18A and the outer surface of the front side insulating substrate 19A, and use them in the step shown in FIG.
(7) As the front-side insulating substrate 19A, the power supply electrode 26 is previously formed, and as the rear-side insulating substrate 18A, the land portion 23, the conductive line portion 21, the land portion 22 (wiring pattern) Part 20) is prepared, and the front-side insulating substrate 19A and the rear-side insulating substrate 18A are used, whereby the feeding electrode 26 forming step and the wiring pattern portion 20 forming step are performed. Omit.
(8) Instead of the through hole 30, a conductive substance (Cu or the like) is deposited on the inner peripheral surface of the through hole 51 by electroplating or the like, thereby filling the through hole 51 with the conductive substance. Use it.

1 Headlamp (vehicle lamp)
DESCRIPTION OF SYMBOLS 10 Optical semiconductor unit for lamps 15 Light emitting module 17 Metal layer 17A Metal plate 18 Rear side insulating layer 18A Rear side insulating substrate 1 Front side insulating layer 19A Front side insulating substrate 20 Wiring pattern part (conductive member, connecting element)
25 Arrangement area of light-emitting module body 26 Feed electrode 29 Terminal insertion hole 30 Through hole 31 Terminal initial hole 32 Insulating adhesive 33 Conductive coating (conductive member)
35 Initial hole for through hole (through hole)
36 Light Emitting Module Body 37 Lead (Power Supply Terminal)
38b Stem bottom surface (base end surface of light emitting module body)
42 Laser diode (optical semiconductor device)
47 Insulating high heat dissipation adhesive 51 Through hole

Claims (10)

A substrate and a light emitting module disposed on the substrate,
The substrate has a plate-shaped metal layer, a rear-side insulating layer laminated on one side in the thickness direction of the metal layer, and both sides in the thickness direction of the substrate passing through the metal layer and the rear-side insulating layer. A terminal insertion hole opened outward,
The light emitting module has an optical semiconductor element inside and a light emitting module main body having a flat base end surface, and a power supply for light emission to the light emitting module main body extending outward from the base end surface of the light emitting module main body. A power supply terminal for performing
The base end surface of the light emitting module body is connected to the other side surface in the thickness direction of the metal layer via an insulating adhesive,
The front end of the power supply terminal is exposed to the outer surface of the rear insulating layer through the terminal insertion hole of the substrate.
An optical semiconductor unit for a lamp. In claim 1,
The terminal insertion hole inner peripheral surface is formed of an insulating resin film,
An optical semiconductor unit for a lamp. In claim 1,
A front-side insulating layer is laminated on the other side surface in the thickness direction of the metal layer in a region excluding the arrangement region of the light emitting module body,
A power supply electrode is provided on the front insulating layer,
In the substrate, a through-hole penetrating the insulating layer on both sides in the thickness direction of the substrate and the metal layer between both insulating layers is formed,
The entire inner peripheral surface of the through hole is formed of an insulating film,
The conductive member is disposed so as to penetrate through the through hole,
The conductive member connects the power supply terminal and the power supply electrode,
An optical semiconductor unit for a lamp. In claim 3,
The through hole is opened on the front-side insulating layer so as to face the feeding electrode,
The conductive member is disposed on the rear-side insulating layer and spans between the front end of the power supply terminal and the opening of the through hole, and the connection is made by covering the entire inner peripheral surface of the through hole. A conductive coating connecting the element and the power supply electrode,
An optical semiconductor unit for a lamp. In claim 1,
The thermal conductivity of the insulating adhesive is higher than the thermal conductivity of the rear side insulating layer,
An optical semiconductor unit for a lamp. As a substrate, a plate-shaped metal layer, a rear-side insulating layer laminated on one side in the thickness direction of the metal layer, and the both sides of the substrate in the thickness direction through the metal layer and the rear-side insulating layer A light emitting module main body having an optical semiconductor element inside and a base end surface as a flat surface, and a base end surface of the light emitting module main body. A power supply terminal that extends outward from the power supply terminal and supplies power for light emission to the light emitting module body,
The power supply terminal of the light emitting module main body is exposed to the outer surface of the rear side insulating layer through the terminal insertion hole of the substrate, and the base end surface of the light emitting module main body is insulated on the other side surface in the thickness direction of the metal layer. Connect via glue,
A method for producing an optical semiconductor unit for a lamp. In claim 6,
In preparing the substrate, the metal plate constituting the metal layer in a state having the initial stage of the previous stage finished as the terminal insertion hole, the insulating substrate constituting the rear side insulating layer, and the metal plate And an insulating adhesive for bonding the insulating substrate and
Then, the metal plate is pressed by pressing the one side surface in the thickness direction of the metal plate and the insulating substrate so as to approach each other with the insulating adhesive interposed therebetween. Adhering one side surface in the thickness direction and the insulating substrate, and pushing the insulating adhesive into the initial hole,
After the insulating adhesive is cured, the insulating adhesive in the initial hole and the portion of the insulating substrate facing the initial hole are processed to form the terminal insertion hole,
A method for producing an optical semiconductor unit for a lamp. As a light emitting module, a light emitting module main body having an optical semiconductor element inside and a base end surface being flat, and a power supply for light emission to the light emitting module main body extending outward from the base end surface of the light emitting module main body In addition to preparing a power supply terminal to be performed, an insulating adhesive is filled in a hardened state in an initial hole in a previous stage finished as a terminal insertion hole for inserting the power supply terminal of the light emitting module as a substrate. Preparing a metal layer, a rear side insulating layer laminated on one side in the thickness direction of the metal layer, and a front side insulating layer laminated on the other side in the thickness direction of the metal layer,
First, by forming the insulating cured adhesive in the initial hole, the rear-side insulating layer and the front-side insulating layer facing the initial hole, the terminal insertion hole is formed, and the front surface By processing a range including at least the region where the initial hole faces in the side insulating layer, the metal layer is exposed with an area where at least a base end surface of the light emitting module body can be disposed,
Next, the power supply terminal of the light emitting module main body is exposed to the outer surface of the rear side insulating layer through the terminal insertion hole, and the base end surface of the light emitting module main body is exposed on the metal layer exposed in the front side insulating layer. To connect through insulating adhesive,
A method for producing an optical semiconductor unit for a lamp. In claim 8,
In preparing the substrate, the metal plate constituting the metal layer with the initial holes, the rear-side insulating substrate constituting the rear-side insulating layer, and the front-side insulation constituting the front-side insulating layer Preparing an insulating substrate, an insulating adhesive for bonding the metal plate and each insulating substrate,
One side surface in the thickness direction of the metal plate and the rear insulating substrate are overlapped with the insulating adhesive interposed therebetween, and the other side surface in the thickness direction of the metal plate and the front side insulation The metal substrate by pressing the rear surface side insulating substrate and the front surface side insulating substrate so as to approach each other. Adhering the rear-side insulating substrate and the front-side insulating substrate to a plate and pushing the insulating adhesive into the initial hole,
A method for producing an optical semiconductor unit for a lamp. In claim 6 or 8,
As the insulating adhesive for adhering the base end surface of the light emitting module body to the metal layer, one having a thermal conductivity higher than the thermal conductivity of the rear side insulating layer is used.
A method for producing an optical semiconductor unit for a lamp.

Images