JP2017028039A5

JP2017028039A5 -

Info

Publication number: JP2017028039A5
Application number: JP2015143582A
Authority: JP
Filing date: 2015-07-21
Publication date: 2018-08-09
Anticipated expiration: 2035-07-21

Description

本発明の一実施形態の電子機器は、動作時に熱を発生する電子部品と、前記電子部品が発生する熱が伝わり、ユーザが把持する外装部材と、第一の融点を持つ第一の潜熱蓄熱材を有する第一の蓄熱部材と、前記第一の融点より高い第二の融点を持つ第二の潜熱蓄熱材を有する第二の蓄熱部材とを備える。前記第一の蓄熱部材は、前記電子部品と前記外装部材とを含む、前記電子部品から前記外装部材への伝熱経路の少なくとも一箇所に設けられる。前記第二の蓄熱部材は、前記伝熱経路における、前記第一の蓄熱部材の接続箇所よりも前記電子部品の動作時の温度が高い箇所に設けられる。 An electronic device according to an embodiment of the present invention includes an electronic component that generates heat during operation, an exterior member that is transmitted by heat generated by the electronic component, and a first latent heat storage having a first melting point. A first heat storage member having a material, and a second heat storage member having a second latent heat storage material having a second melting point higher than the first melting point. The first heat storage member is provided in at least one place of a heat transfer path from the electronic component to the exterior member, including the electronic component and the exterior member . The second heat storage member is provided at a location where the temperature during operation of the electronic component is higher than the connection location of the first heat storage member in the heat transfer path.

Claims

And electronic components that generate heat during operation,
The heat generated by the electronic component is transmitted, and an exterior member gripped by the user;
A first heat storage member having a first latent heat storage material having a first melting point;
A second heat storage member having a second latent heat storage material having a second melting point higher than the first melting point;
The first heat storage member is provided in at least one place of a heat transfer path from the electronic component to the exterior member, including the electronic component and the exterior member ,
Said 2nd heat storage member is provided in the location where the temperature at the time of operation | movement of the said electronic component is higher than the connection location of said 1st heat storage member in the said heat-transfer path | route.

When the first melting point is T _mL , the second melting point is T _mH , and the allowable temperature in the thermal design of the exterior member is T _c ,
T _mL <T _c <T _mH
The electronic apparatus according to claim 1, wherein:

The thermal resistance from the electronic component to the first heat storage member is larger than the thermal resistance from the electronic component to the second heat storage member. Electronic equipment.

A period from the start of melting of the first latent heat storage material included in the first heat storage member during operation of the electronic device to the end of melting, and the second latent heat storage included in the second heat storage member The electronic device according to any one of claims 1 to 3, wherein the amount of the latent heat storage material and the melting point are set so that a period from when the material starts to melt until the material finishes melting is overlapped. .

The electron according to any one of claims 1 to 4, wherein the first heat storage member and the second heat storage member are formed by filling a latent heat storage material in a metal or resin container. machine.

5. The electronic apparatus according to claim 1, wherein the first heat storage member and the second heat storage member are formed by adding a latent heat storage material to a resin or a rubber member.

The first heat storage member and the second heat storage member are formed by sandwiching a latent heat storage material between two sheet members and hermetically sealing an end portion. The electronic device described.

8. The electronic apparatus according to claim 7, wherein one of the two sheet members is a heat insulating sheet member, and the other is a heat conductive sheet member having a predetermined thermal conductivity.

The electronic apparatus according to claim 1, wherein the first heat storage member and the second heat storage member or the exterior member are insulated by a heat insulating member.

The image pickup apparatus functioning as the electronic apparatus according to claim 1, wherein the electronic component is an image pickup element.

The imaging apparatus according to claim 10, further comprising a heat conduction member that conducts heat generated by the imaging element in a direction perpendicular to an optical axis and transmits the heat to the second heat storage member.