JP2017010961A - Led package, lead frame for multi-column led, and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To promote integration without causing metal burrs on the cut surface or intrusion of moisture from the cut surface, to prevent steps, deformation, warpage, etc., and to maintain the flatness of the terminal surface for external connection and improve productivity. LED packages and lead frames that can reduce costs, extend the continuous productivity and life of blades that are cut into individual packages, prevent cracking of the reflector resin part, and prevent reflectance from being lowered. A pad portion 11 and a lead portion 12 which are formed separately from a metal plate without a connecting portion, a reflector resin portion 15 for fixing them, and a cut surface is present only on the outer peripheral surface of the reflector resin portion. And the lead portion are exposed on the side opposite to the LED element mounting side. A reflective plating layer 13a is provided at a position corresponding to the pad portion and the lead portion on the upper surface of the metal plate, and step portions 26a and 26b having a depth of 10 to 25 μm are provided around the reflective plating layer 13a. The resulting surface irregularities are polished. [Selection] Figure 1

Description

  The present invention relates to an LED package, a multi-row LED lead frame, and a method of manufacturing the same.

2. Description of the Related Art Optical semiconductor devices equipped with LED (Light Emitting Diode) elements have come to be used in various devices such as general lighting and displays such as televisions, mobile phones, and OA devices.
In these optical semiconductor devices, as LED packages that have been developed to meet demands for thinning and mass production, LED elements are conventionally mounted on lead frames having electrically insulated pad portions and lead portions, An LED in which a reflector resin portion is formed so as to surround a pad portion and a lead portion on the side on which the LED element is mounted, and the inner space on the side on which the LED element is mounted is sealed by the transparent resin portion. There is a package.

  In this type of LED package, for example, as shown in FIG. 4A, the lead frame 10 includes a pad portion 11 and a lead portion 12 that is spaced from the pad portion 11. In addition, on the upper surface and the lower surface of the lead part 12, a plating layer 13 for reflection and external connection is formed. In addition, an LED element 20 is mounted on the pad portion 11 on the upper surface side of the lead frame 10, and the LED element 20 and the lead portion 12 are connected via a bonding wire 14 or the like. In addition, a reflector resin portion 15 that reflects light is formed around the LED element 20 so as to surround the pad portion 11 and the lead portion 12. The internal space surrounded by the reflector resin portion 15 and mounted with the LED element 20 is sealed with a transparent resin portion 16 made of a transparent resin.

  In addition, as shown in FIGS. 5A to 5C, the lead frame used for manufacturing this type of LED package has a pad portion 11 and a lead portion so as to obtain a large number of LED packages at a time. 12 are formed as a multi-row lead frame arranged in a matrix form (indicated by a dashed-dotted rectangle in FIG. 5B). As shown in FIG. 5 (b), each of the pad portion 11 and the lead portion 12 is connected to a connecting portion 17 formed from a metal plate forming the base material of the lead frame (hatched hatched lines in FIG. 5 (b)). And connected to the pad portion 11 or the lead portion 12 in the other lead frame region, or the outer frame portion 18 in the metal plate for manufacturing the multi-row type lead frame through the connecting portion 17. It is connected with.

  In the manufacture of this type of LED package, as shown in FIG. 4B, each reflector resin portion 15 corresponding to each lead frame region in the multi-row lead frame is covered with the connecting portion 17. Reflector resin formed in a lump after forming the transparent resin portion 16 in the inner space by mounting and fixing the LED element 20 to the pad portion 11 surrounded by each reflector resin portion 15 and performing wire bonding or the like. A part of the part 15 and a part of the connecting part 17 are simultaneously cut along the cut part between the lead frame regions.

By this cutting process, as shown in FIG. 4A, the lower surfaces of the pad portion 11 and the lead portion 12 are exposed on the lower surface side of the LED package, and individual LED packages that can be electrically connected to an external substrate are obtained. It is done. On the side surface of each LED package, the lead frame connecting portion 17 is exposed as a part of the cut surface together with the reflector resin portion 15.
Conventional LED packages having such a configuration are described in, for example, the following Patent Documents 1 and 2.

JP 2013-232506 A JP 2013-232508 A

  As described above, in the manufacture of the LED package, in order to obtain a large number of LED packages at a time, the pad portion 11 and the lead portion 12 in each lead frame region as shown in FIG. A multi-row lead frame connected through a pad portion 11 or a lead portion 12 in the lead frame region and a connecting portion 17 for connecting to an outer frame portion 18 in a metal plate for manufacturing a multi-row lead frame is used. .

  By the way, the LED package manufactured using the above-described multi-row lead frame is generally a surface mount type package in which a terminal surface for external connection is exposed on the back surface side of the lead frame. In the surface mount type LED package, the flatness of the terminal surface for external connection exposed on the back surface side is required, and steps, deformation, warpage, etc. of the pad part and the lead part are also severely restricted.

However, pad portions and lead portions in individual lead frame regions, pad portions or lead portions in other lead frame regions, and outer frame portions in metal plates for manufacturing multi-row lead frames are respectively connected via connecting portions. When connected to each other, depending on the strength of the connecting part, the shape of the pad part and the lead part connected to the connecting part, and the connection position, the connecting part may be deformed, and the pad part and the lead part may be stepped, deformed, warped. Etc. are likely to occur, and the flatness of the external connection terminal surface exposed on the back surface side is impaired, which may adversely affect the connection with external devices.
In order to suppress warping and deformation of the entire lead frame, the connecting portion is required to have a certain degree of strength. For this purpose, it is necessary to increase the width and thickness of the connecting portion. In addition, it is necessary to devise the shape of the pad portion and the lead portion and the connection position with the connecting portion so that the connecting portion is not easily deformed, and the degree of freedom in designing the pad portion and the lead portion is also limited.

  However, the connecting portion is made of a metal that forms the base material of the lead frame. When the width and thickness of the connecting portion are increased, the connecting portion is cut together with the reflector resin portion for cutting into individual LED packages. The blade is clogged, and the blade needs to be regenerated by dressing, which reduces the continuous productivity of the blade. In addition, a plurality of connecting portions are provided so as to be connected to a plurality of positions in each lead frame region, and each of the multi-row LED packages manufactured using the multi-row lead frame and arranged in a plurality of LED package regions is individually provided. In order to obtain an LED package of this type, it is necessary to cut a large number of connecting portions with a blade, which has a significant adverse effect on the product life of the cutter.

In addition, as described above, the metal constituting the connecting portion requires a thickness and a width to prevent warping and deformation, so that the pad portion and lead portion in each lead frame region and the pad in other lead frame regions It is impossible to reduce the length of the connecting portion that connects the portion or the lead portion and the outer frame portion of the metal plate for manufacturing the multi-row type lead frame.
As a result, the area occupied by the connecting portion in the multi-row lead frame becomes a size that cannot be ignored. In addition, as described above, it is necessary to devise the shape of the pad portion and the lead portion and the connection position with the connecting portion so that the connecting portion is not easily deformed.
For this reason, the number of individual lead frames that can be formed in the multi-row type lead frame forming area is limited, and the integration of the LED package area during the manufacture of the multi-row type LED package is hindered.

  On the other hand, by reducing the width and thickness of the connecting part and reducing the adverse effect of the connecting part on the blade, the width of the blade is reduced and the cutting width by the blade is reduced. The length of the connecting part that connects the lead part and the lead part and the pad part or lead part in the other lead frame region and the outer frame part in the metal plate for manufacturing the multi-row type lead frame is shortened as an assembly part. When an attempt is made to integrate the LED package area during the manufacture of the multi-row LED package by reducing the connecting area of the pad part, the lead part and the individual lead frame area, the individual leads as described above. The strength of the connecting part that connects the frames is weakened, and deformation and warping of the pad part and the lead part connected through the connecting part frequently occur, and the LED pad. There is a problem of lowering the assembly yield of over di. For this reason, in a conventional LED package using a multi-row lead frame having a connecting portion like the LED package described in Patent Documents 1 and 2, a cutting width by a blade is provided by about 0.3 to 0.5 mm. Inevitably, integration of the package area was limited.

  In general, in a multi-row lead frame having a connecting portion, in order to suppress a decrease in assembly yield of the LED package due to deformation or warpage of the connecting portion in the assembly process of the LED package, Resin tape is affixed as means for preventing deformation and warping of the pad portion and the lead portion that are connected to the entire surface exposed on the back side of the row type lead frame via the connecting portion. This resinous tape also serves to prevent the molding resin (reflector resin) from wrapping around the external connection terminal surface.

  However, this resin tape is die-bonding for fixing the mounted LED element to the pad part, wire bonding for electrically connecting the LED element and the lead part, and a mold resin for forming a reflector resin part and a transparent resin part. It is composed of an expensive heat-resistant polyimide film and a heat-resistant silicon adhesive so that it can withstand use under various overheating conditions such as filling. For this reason, in manufacturing an LED package, if a resin tape is attached to the back surface of the multi-row lead frame, the cost increases.

  Furthermore, when the resin tape is peeled off after being filled with the final mold resin and discarded, the adhesive layer of the resin tape remains on the terminal surface for external connection and the mold resin side. In addition, even when a heat-resistant material is used for the resin tape, under various heating conditions, the heat resistance of the resin tape exceeds the limit of heat resistance. There is also a problem in that the position of the lead portion varies and the dimensional accuracy of each LED package varies.

  In addition, in individual LED packages manufactured using a multi-row lead frame in which individual lead frame regions are connected via connecting portions, as described above, the connecting portion of the lead frame is cut together with the reflector resin portion. The metal forming the base of the lead frame that is not coated with plating is exposed from the cut surface of the connecting portion of the lead frame exposed as a part of the surface and exposed from the LED package. For this reason, if metal burrs occur on the cut surface, there is a risk of contact failure, and moisture will enter from the cut surface of the connecting part when the completed LED package is connected to an external device and used. There is a risk that the metal forming the base material of the lead frame may be corroded to cause defects such as deterioration of the quality of the LED package product.

  Further, the multi-row lead frame used in the manufacture of the LED package described in Patent Document 2 includes the lead frame as a further connecting portion in addition to the connecting portion connecting the lead frame regions shown in FIG. Inclined reinforcing pieces are provided to connect the pad portion of the region and the lead portion of another lead frame region adjacent to the lead frame region to prevent warping of the lead frame. However, if the number of connecting portions connecting adjacent lead frame regions is increased, a lead frame exposed as a part of the cut surface together with the reflector resin portion when the multi-row LED package is manufactured and then cut into individual LED packages. As the number of connecting parts increases, the exposed area of the metal increases, which may lead to further deterioration of the quality of the LED package product due to an increase in moisture intrusion from the cut surface of the connecting part. In addition, since the number of connecting portions to be cut by the blade is increased, there is a significant adverse effect on productivity, blade life, and the like.

  In addition, the multi-row lead frame used for manufacturing the LED package described in Patent Documents 1 and 2 is such that each lead frame region (pad part, lead part) and connecting part are made of a metal plate forming a lead frame base material. After being processed into a predetermined shape by pressing or etching, a reflective plating layer is formed on the upper surface side where the LED element is mounted, and an external connection plating layer is formed on the lower surface side. However, if the plating layer is formed after the metal plate is formed in a predetermined shape, the plating layer is formed on the entire upper surface, side surface, and lower surface of the metal plate formed in the predetermined shape, and the plating layer is formed in an unnecessary region. The noble metal that forms is likely to be expensive.

In order to reduce costs, a multi-row lead manufactured in the order of processes in which a plating layer is first formed in necessary areas on the upper and lower surfaces of the metal plate and then the shape of the lead frame is formed through etching. It is desirable to use a frame.
However, when forming the shape of the lead frame after forming this plating layer, if etching is performed by providing an etching mask only on the upper surface of the formed plating layer, the metal immediately below the plating layer is dissolved and removed, and the metal is removed. The plating layer of the part removed by dissolution is exposed, and the exposed part becomes a plating burr and is liable to be cracked or chipped. In particular, if the plating burr formed on the reflective plating layer breaks, the reflective plating layer in the vicinity of the plating burr may be peeled off, leading to deterioration of product quality such as a reduction in reflectance. Therefore, it is necessary to form an etching mask for the reflective plating area so as to cover the reflective plating layer to the extent that the metal immediately below the reflective plating layer is not dissolved and removed.

However, if a resist mask is formed so as to cover the reflective plating layer to the extent that the metal directly under the reflective plating layer is not dissolved and removed, etching is performed to form a lead frame shape, and then the reflection is removed when the resist mask is removed. The upper surface of the metal plate remains around the plating layer. The upper surface of the remaining metal plate has a lower reflectivity than the reflective plating layer or the reflector resin portion. For this reason, even if the reflector resin portion is formed between the pad portion formed by etching and the lead portion, the LED portion is mounted on the pad portion on the side where the LED element is mounted and the upper surface of the metal plate around the lead portion. The reflectivity of the entire region where the element is mounted decreases.
Further, when the reflector resin portion is formed between the pad portion formed by etching and the lead portion, the surface of the reflector resin portion on the side where the LED element is mounted is flush with the surface of the reflective plating layer. Even if the upper surface of the remaining metal plate is covered with the reflector resin, the thickness of the reflective plating layer is very thin, so the reflector resin is formed to cover the upper surface of the remaining metal plate around the reflective plating layer. The thickness of the portion is also very thin, and a sufficient reflection effect as a reflector at that portion cannot be obtained.
Moreover, if the thickness of the reflector resin portion formed so as to cover the upper surface of the metal plate remaining around the reflective plating layer is very thin, cracks and chips are likely to occur. And when a crack and a chip | tip arise in the reflector resin part around the plating layer for reflection, the upper surface of a metal plate will be exposed and the reflectance of the whole area | region which mounts an LED element will fall.

  The present invention has been made in view of such problems, and there is a risk of contact failure due to the occurrence of metal burrs at the cut surfaces of individual LED packages that have been commercialized, and there is a risk of moisture intrusion from the cut surfaces. In manufacturing, the integration of individually arranged LED packages is promoted, the stepped portion of the pad portion and the lead portion, deformation and warpage are prevented, and the terminal surface for external connection exposed on the back side is flat. The productivity can be improved while maintaining good performance, the cost can be reduced without the need for attaching an expensive resin tape, and the continuous productivity of blades to be cut to obtain individual LED packages LED package, multi-row LED lead frame, and the like, which can prolong the life and prevent the reflector resin part from being cracked or chipped and prevent the decrease in reflectance on the LED element mounting side And its object is to provide a method of manufacturing.

  In order to achieve the above object, an LED package according to the present invention is an individual LED package formed by cutting a multi-row LED package in which a plurality of LED package regions are arranged. A pad portion and a lead portion formed in separate predetermined shapes without being provided with a portion, and interposed between the pad portion and the lead portion, and surrounds the outer periphery of the pad portion and the lead portion, A reflector resin portion that fixes the pad portion and the lead portion, and a cut surface formed by cutting the multi-row LED package surrounds an outer periphery of the pad portion and the lead portion; The side on which the LED element is mounted on the reflector resin part, which is present only on the outer peripheral surface and the pad part and part of the lead part are part of the reflector resin part Is exposed in a region inside the cut surface formed on the outer peripheral surface of the reflector resin portion on the opposite side, and is further reflected at a predetermined position corresponding to the pad portion and the lead portion on the upper surface of the metal plate. A plating layer is formed, and has a step portion having a depth of 10 μm to 25 μm formed by half etching using the reflection plating layer as an etching mask around the reflection plating layer on the upper surface side of the metal plate. The reflective plating layer is characterized in that the surface irregularities formed during the half etching are polished by etching.

  Moreover, in the LED package of this invention, it is preferable that the surface of the said level | step-difference part is given the roughening process.

  The multi-row LED lead frame according to the present invention is a multi-row LED lead frame in which a plurality of LED lead frame regions are arranged, and each lead frame region includes a pad portion on the upper surface of the metal plate and A reflective plating layer formed at a predetermined position corresponding to the lead portion, and a first half etching using the reflective plating layer as an etching mask around the reflective plating layer on the upper surface side of the metal plate A step portion formed at a depth of 10 μm to 25 μm, a plating layer for external connection formed at a predetermined position corresponding to the pad portion and the lead portion on the lower surface of the metal plate, and the pad in the metal plate Between the reflective plating layer corresponding to the portion and the reflective plating layer corresponding to the lead portion and in the lead frame region And a recess formed by second half etching between the reflective plating layer in the other lead frame region adjacent to the upper surface of the metal plate by the second recess. In the applied depth, it is divided into a pad portion and a lead portion, and is divided into another lead frame region adjacent to the lead frame region, and the reflective plating layer is formed during the first half etching. The feature is that the formed surface irregularities are polished by etching.

  In the multi-row LED lead frame of the present invention, it is preferable that at least one of the surface of the concave portion and the surface of the step portion is subjected to a roughening treatment.

  In the multi-row LED lead frame of the present invention, the recessed portion and the stepped portion are interposed between the partitioned pad portion and the lead portion, and the pad portion and the lead portion It is preferable that a reflector resin portion that surrounds the outer periphery so as to protrude upward from the LED element mounted on the LED element mounting surface of the pad portion is preferably formed.

  Also, in the LED package manufacturing method according to the present invention, a reflective plating layer is formed on a surface at a predetermined position corresponding to the pad portion and the lead portion on the upper surface of the metal plate, and the pad portion and the lead on the lower surface of the metal plate. A plating layer for external connection is formed at a predetermined position corresponding to the portion, and the first half-etching is performed around the reflection plating layer on the upper surface side of the metal plate by the first half etching using the reflection plating layer as an etching mask. A step portion having a depth of 25 μm is formed, and the pad portion and the lead portion are partitioned by a second half-etched recess from the upper surface side of the metal plate, and the reflective plating layer includes A step of preparing a lead frame for a multi-row type LED in which irregularities on the surface formed during half-etching 1 are polished by etching, and the metal The concave portion formed by the second half-etching on the upper surface side of the plate and the step portion formed by the first half-etching are filled with a reflector resin, and the partitioned pad portion and the lead portion A step of forming a reflector resin portion interposed between the pad portion and the outer periphery of the lead portion so as to protrude above the LED element mounted on the LED element mounting surface of the pad portion; Mounting the LED element on the surface of the pad portion partitioned on the upper surface side of the metal plate, wire bonding the lead portion partitioned on the upper surface side of the metal plate and the LED element, and the upper surface of the metal plate The pad portion and the lead resin portion in the lead portion are surrounded by the reflector resin portion and the LED element is mounted. Etching so that the reflector resin portion is exposed from the lower surface side using the external connection plating layer formed on the lower surface of the metal plate as an etching mask, and a step of providing a transparent resin portion that fills the space. The pad portion in the board is separated from the lead portion and the pad portion or the lead portion in another adjacent LED package region, and the pad portion, the lead portion, and the pad portion in the other adjacent LED package region or A step of fixing the lead portion only by the reflector resin portion, and a step of cutting a portion surrounding the outer periphery of the pad portion and the lead portion in the reflector resin portion. .

  In the LED package manufacturing method of the present invention, the reflective plating layer of the prepared multi-row LED lead frame is etched to a depth of about 1 μm to polish the irregularities on the surface. It is preferable.

  Moreover, in the manufacturing method of the LED package of this invention, the surface of the said level | step-difference part formed by the said 1st half etching of the lead frame for multi-row type LED to prepare, and the said formed by the said 2nd half etching It is preferable that at least one of the surfaces of the recesses is roughened.

  In addition, the method for manufacturing a multi-row LED lead frame according to the present invention is a method for manufacturing a multi-row LED lead frame in which a plurality of LED lead frame regions are arranged, and includes a pad portion and leads on the upper surface of a metal plate. Forming a plating layer for reflection at a predetermined position corresponding to the portion, and forming a plating layer for external connection at a predetermined position corresponding to the pad portion and the lead portion on the lower surface of the metal plate; A step of forming a first etching resist mask that covers the entire surface on the lower surface side, and 10 μm to 25 μm from the upper surface side of the metal plate using the reflective plating layer formed on the upper surface of the metal plate as an etching mask The first half-etching is performed at the depth of the metal plate, and the first half-etching is performed on the metal plate at the depth of the first half-etching. A step of forming a step portion around the reflective plating layer, a step of performing etching for polishing irregularities on the surface of the reflective plating layer formed during the first half etching, and the metal plate On the upper surface side of the reflective plating layer formed and the side surface of the step portion around the reflective plating layer, and without providing a connecting portion, the pad portion and the lead portion having a predetermined shape separated from each other. Forming a resist mask for second etching that can be partitioned into two, and performing the second half-etching from the upper surface side of the metal plate, and at the depth of the metal plate subjected to the second half-etching A step of partitioning into a pad portion and a lead portion; and a step of removing the first etching resist mask and the second etching resist mask. It is set to.

  In the method for manufacturing a lead frame for a multi-row LED according to the present invention, it is preferable that the depth of the etching for polishing the irregularities on the surface of the reflective plating layer is about 1 μm.

  In the method for manufacturing a multi-row LED lead frame of the present invention, it is preferable that the surface of the stepped portion to be formed is roughened by the first half etching from the upper surface side of the metal plate. .

  Moreover, in the manufacturing method of the lead frame for multi-row type LEDs of the present invention, it is preferable that the surface of the concave portion to be formed is roughened by the second half etching from the upper surface side of the metal plate.

  In the method for manufacturing a multi-row LED lead frame of the present invention, the concave portion formed by the second half etching and the first half etching on the upper surface side of the metal plate are further formed. LED in which the stepped portion is filled with reflector resin and interposed between the partitioned pad portion and the lead portion, and the pad portion and the outer periphery of the lead portion are mounted on the LED element mounting surface of the pad portion It is preferable to include a step of forming a reflector resin portion surrounding the element so as to protrude upward from the element.

  According to the present invention, there is no risk of contact failure due to the occurrence of metal burrs on the cut surfaces of individual LED packages that have been commercialized, and there is no risk of moisture intrusion from the cut surfaces. Promote integration of LED packages, prevent stepping, deformation, warping, etc. of pads and leads, maintain good flatness of the external connection terminal surface exposed on the back side, and improve productivity In addition, it is possible to reduce the cost by attaching an expensive resin tape, and to increase the continuous productivity and life of the blade to be cut to obtain individual LED packages. Thus, there can be obtained an LED package, a multi-row LED lead frame, and a method for manufacturing them, which can prevent a reduction in reflectance on the side on which the LED element is mounted without cracking or chipping of the portion.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows schematic structure of the LED package concerning one Embodiment of this invention, (a) is sectional drawing of the LED package in the state cut | disconnected and turned into one product, (b) is the principal part in (a). FIG. 4C is a partial enlarged view showing a shape, and FIG. 4C is a partial cross-sectional view showing a cut portion in a multi-row LED package manufactured in a batch before being cut. FIG. 2 is a diagram showing a schematic configuration of a multi-row type LED lead frame used for manufacturing the LED package shown in FIG. 1, wherein (a) is a partial plan view of the arrangement of pads and leads in each lead frame region as viewed from the upper surface side (B) is BB sectional drawing of (a), (c) is the elements on larger scale which show the shape of the principal part of (b). FIG. 5 is an explanatory view showing an example of a manufacturing process and a modification of the LED package and the multi-row LED lead frame shown in FIGS. 1 and 2. It is a figure which shows schematic structure of the conventional LED package, (a) is sectional drawing of the LED package in the state cut | disconnected and turned into one product, (b) is the multi-row type LED manufactured collectively before cut | disconnecting It is a fragmentary sectional view which shows the cut part in a package. It is a figure which shows schematic structure of the lead frame for multi-row type LED used for manufacture of LED package, (a) is a top view which shows notionally arrangement | positioning of each lead frame in the lead frame for multi-row type LED, (b) FIG. 4 is a partially enlarged plan view of the arrangement of pads and leads in each lead frame region of a multi-row LED lead frame used in the manufacture of an LED package of the type shown in FIG. It is AA sectional drawing of).

Prior to the description of the embodiment, the function and effect of the present invention will be described.
The LED package of the present invention is an individual LED package formed by cutting a multi-row LED package in which a plurality of LED package regions are arranged, and is separated from a metal plate without providing a connecting portion. A pad portion and a lead portion formed in a predetermined shape, and a reflector resin portion that is interposed between the pad portion and the lead portion, surrounds the outer periphery of the pad portion and the lead portion, and fixes the pad portion and the lead portion. And the cut surface formed by cutting the multi-row LED package exists only on the outer peripheral surface of the reflector resin portion surrounding the outer periphery of the pad portion and the lead portion, and a part of the pad portion and the lead portion However, on the side opposite to the side where the LED element is mounted in the reflector resin portion, it is inside the cut surface formed on the outer peripheral surface of the reflector resin portion. They are exposed to the pass.

Like the LED package of the present invention, the cut surface formed by cutting the multi-row LED package in which a plurality of LED package regions are arranged is the outer peripheral surface of the reflector resin portion surrounding the outer periphery of the pad portion and the lead portion. And a part of the pad portion and the lead portion is exposed in a region inside the cut surface formed on the outer peripheral surface of the reflector resin portion on the side opposite to the side where the LED element is mounted in the reflector resin portion. With this configuration, unlike conventional LED packages such as those described in Patent Documents 1 and 2, the metal that forms the base material of the lead frame that is not coated with plating is exposed as a cut surface of the connecting portion. There is nothing.
For this reason, there is no fear of the occurrence of metal burrs on the cut surface or the intrusion of moisture from the cut surface, and there is no problem such as deterioration of the quality of the LED package product due to corrosion of the metal.

Further, as in the LED package of the present invention, if the cut surface is present only on the outer peripheral surface of the reflector resin portion surrounding the outer periphery of the pad portion and the lead portion, the LED in the previous stage of obtaining each LED package At the stage of manufacturing a multi-row type LED package in which a plurality of package areas are arranged, pad portions and lead portions in individual lead frame regions, pad portions or lead portions in other lead frame regions, and multi-row lead frames The outer frame portion of the metal plate for manufacturing is fixed only by the reflector resin portion, and there is no connection portion made of metal that forms the base material of the lead frame.
For this reason, when the individual LED packages are obtained from the multi-row LED package in which a plurality of LED package regions are arranged, almost all of the blade cutting target portions are the reflector resin portions except for a part of the outer frame portion.
As a result, the amount of cutting the metal that forms the base material of the lead frame can be greatly reduced as compared with the conventional LED package having a connecting portion such as the LED package described in Patent Documents 1 and 2. The adverse effect on the blade during processing can be greatly reduced, and the continuous productivity and life of the blade can be extended.

In addition, by configuring the LED package of the present invention, in the stage of manufacturing a multi-row LED package in which a plurality of LED package areas are arranged before obtaining each LED package, in each lead frame area The pad portion or lead portion, the pad portion or lead portion in another lead frame region, or the outer frame portion in a metal plate for manufacturing a multi-row type lead frame is fixed only by the reflector resin portion, and the lead frame base material In this configuration, the reflector resin portion can be cut into individual LED packages without greatly adversely affecting the blade even if the width of the blade is reduced. In a conventional LED package using a multi-row lead frame having a connecting portion such as the LED package described in Patent Documents 1 and 2, a blade that had to be provided with a width of about 0.3 to 0.5 mm By configuring the cutting width as in the LED package of the present invention, the cutting width can be set as narrow as about 0.1 to 0.3 mm.
As a result, a reflector resin portion that fixes a pad portion or lead portion in each lead frame region, a pad portion or lead portion in another lead frame region, or an outer frame portion in a metal plate for manufacturing a multi-row lead frame. And the number of individual lead frames that can be formed in the multi-row type lead frame forming area can be increased, and marked integration is possible during manufacturing. Moreover, unlike the LED packages described in Patent Documents 1 and 2, it is not necessary to devise the shape of the pad portion and the lead portion and the connection position with the connecting portion so that the connecting portion is not easily deformed. In addition, the degree of freedom in designing the lead portion increases.

  In the LED package of the present invention, a reflective plating layer is further formed at predetermined positions corresponding to the pad portion and the lead portion on the upper surface of the metal plate, and around the reflective plating layer on the upper surface side of the metal plate. , Having a step portion with a depth of 10 μm to 25 μm formed by half etching using the reflective plating layer as an etching mask, and the reflective plating layer is polished by etching the surface irregularities formed during the half etching Has been.

If it does in this way, the bottom face of the level | step-difference part formed in the circumference | surroundings of the plating layer for reflection in a metal plate will have a certain amount of depth from the upper surface of the plating layer for reflection. For this reason, the reflector resin portion in the step portion, which is formed so as to be flush with the upper surface of the reflective plating layer on the side where the LED element is mounted, has such a thickness that a sufficient reflection effect can be obtained as a reflector. become. Moreover, since the thickness of the reflector resin part formed in a level | step-difference part becomes remarkably thick compared with the thickness of the plating layer for reflection, it becomes difficult to produce a crack and a chip. If it becomes difficult for the reflector resin portion around the reflective plating layer to be cracked or chipped, the stepped portion of the metal plate in the vicinity of the reflective plating layer becomes difficult to be exposed, and the entire area where the LED element is mounted is reflected. It becomes possible to prevent a decrease in rate.
Further, if the depth of the stepped portion formed by half etching using the reflective plating layer as an etching mask is 10 μm to 25 μm, the metal immediately below the reflective plating layer is not dissolved and removed by half etching, and the plating burr is removed. Does not occur.
Furthermore, if the reflective plating layer has a configuration in which the unevenness of the surface formed during half etching is polished by etching, the reflectance of the reflective plating layer that has decreased by half etching can be reduced before half etching. It can be returned to the state.

In addition, in the LED package of this invention, it is preferable that the surface of the level | step-difference part is roughened.
If it does in this way, the adhesiveness of a reflector resin part when a reflector resin part is formed in a level difference part will improve.

  The multi-row LED lead frame of the present invention is a multi-row LED lead frame in which a plurality of LED lead frame regions are arranged, and each lead frame region includes a pad portion on the upper surface of the metal plate and 10 μm to 25 μm by first half-etching using the reflective plating layer as an etching mask around the reflective plating layer on the upper surface side of the metal plate and the reflective plating layer formed at a predetermined position corresponding to the lead portion A step portion formed at a depth, an external connection plating layer formed at a predetermined position corresponding to the pad portion and the lead portion on the lower surface of the metal plate, and a reflection plating layer corresponding to the pad portion in the metal plate Between the lead plate and the reflective plating layer corresponding to the lead portion and in the lead frame region adjacent to the reflective plating layer in the lead frame region. A recess formed by the second half etching between the reflective plating layer and the pad portion and the lead portion at a depth at which the upper surface side of the metal plate is subjected to the second half etching by the recess. And the lead plating region is divided into another lead frame region adjacent to the lead frame region. The reflective plating layer is formed by polishing the surface irregularities formed during the first half etching. Yes.

  Like the lead frame for multi-row type LED of the present invention, the upper surface side of the metal plate is partitioned into a pad portion and a lead portion at a depth where the half etching is performed by the recess, and the other adjacent to the lead frame region. If the configuration is divided into the lead frame region, the recess is formed on the upper surface of the metal plate, and the pad portion and the outer periphery of the lead portion are padded between the partitioned pad portion and the lead portion. The reflector resin part is formed so as to protrude upward from the LED element mounted on the LED element mounting surface of the part, and the LED element is mounted on the surface of the pad section partitioned on the upper surface side of the metal plate, and the metal plate The lead portion partitioned on the upper surface side of the LED and the LED element are wire-bonded, and the pad portion and the lead portion partitioned on the upper surface side of the metal plate are bonded. After providing a transparent resin portion that is surrounded by the reflector resin portion and fills the internal space where the LED element is mounted, the reflector resin portion is formed from the lower surface side using the external connection plating layer formed on the lower surface of the metal plate as an etching mask. Etching is performed so that the pad portion and the lead portion in the metal plate are separated from the pad portion or the lead portion in the other adjacent LED package region, and the pad portion and the lead portion and the other adjacent LED package are removed. A multi-row type LED package in which a plurality of LED package regions are arranged before the above-described LED package of the present invention can be fixed with the pad portion or lead portion in the region only by the reflector resin portion. Manufacturable.

  Then, in the process of manufacturing the multi-row LED package in which a plurality of LED package regions are arrayed before the LED package of the present invention is obtained using the multi-row LED lead frame of the present invention, the lower surface of the metal plate Until the etching is performed so that the reflector resin portion is exposed from the lower surface side using the external connection plating layer formed on the metal plate as the etching mask, the metal on the back surface side of the lead frame, for example, the metal plate that forms the base material of the lead frame The lead frame region is not deformed, and there is no step, deformation, warpage, etc. of the pad portion or the lead portion. It does not occur, and the flatness of the terminal surface for external connection exposed on the back surface side is maintained. For this reason, it is composed of a heat-resistant polyimide film and a heat-resistant silicone adhesive to prevent deformation and warping of the pad part and lead part connected to the entire surface exposed on the back side of the multi-row type lead frame via the connecting part. This eliminates the need for expensive resin tape, which can reduce costs.

In addition, like the multi-row LED lead frame of the present invention, the first half-etching using the reflective plating layer as an etching mask around the reflective plating layer on the upper surface side of the metal plate has a thickness of 10 μm to 25 μm. If it has the structure which has the level | step-difference part formed in depth, the bottom face of the level | step-difference part formed in the circumference | surroundings of the plating layer for reflection in a metal plate may have a certain amount of depth from the upper surface of the plating layer for reflection. Become. For this reason, the concave portion and the stepped portion are filled with the reflector resin, and are interposed between the partitioned pad portion and the lead portion, and the outer periphery of the pad portion and the lead portion is mounted on the LED element mounting surface of the pad portion. When the reflector resin portion that surrounds the element so as to protrude upward from the element is formed, the reflector resin portion in the stepped portion that is formed to be flush with the upper surface of the reflective plating layer on the LED element mounting side As a reflector, it has a thickness enough to obtain a sufficient reflection effect. Moreover, since the thickness of the reflector resin part formed in a level | step-difference part becomes remarkably thick compared with the thickness of the plating layer for reflection, it becomes difficult to produce a crack and a chip. If it becomes difficult for the reflector resin portion around the reflective plating layer to be cracked or chipped, the stepped portion of the metal plate in the vicinity of the reflective plating layer becomes difficult to be exposed, and the entire area where the LED element is mounted is reflected. It becomes possible to prevent a decrease in rate.
Moreover, if the depth of the stepped portion formed by the first half etching using the reflective plating layer as an etching mask is 10 μm to 25 μm, the metal immediately below the reflective plating layer is dissolved and removed by the first half etching. No plating burr is generated.

  Further, as in the multi-row LED lead frame of the present invention, if the reflective plating layer has a configuration in which the surface irregularities formed during the first half-etching are polished by etching, the first It is possible to return the reflectance of the reflective plating layer, which has been lowered by the half etching, to the state before the half etching.

In the multi-row LED lead frame of the present invention, it is preferable that at least one of the surface of the concave portion and the surface of the step portion is subjected to a roughening treatment.
If it does in this way, the adhesiveness of a reflector resin part when a reflector resin part is formed in a recessed part and a level | step difference part will improve.

In the multi-row LED lead frame of the present invention, the recesses and the stepped portions are interposed between the partitioned pad portion and the lead portion, and the outer periphery of the pad portion and the lead portion is the LED of the pad portion. It is preferable that a reflector resin portion is formed so as to project upward from the LED element mounted on the element mounting surface.
In this way, the metal on the back side of the lead frame is integrally connected with a considerable thickness, for example, about 25 to 50% of the thickness of the metal plate forming the base material of the lead frame. In addition, since the reflector resin portion fixes the pad portion and the lead portion, when the multi-row type LED package in which a plurality of LED package regions are arranged is used in the manufacturing process, the individual lead frame regions are further deformed. As a result, the stepped portion, deformation, warpage, or the like of the pad portion or the lead portion does not occur further, and the flatness of the terminal surface for external connection exposed on the back surface side is further maintained.

  In the LED package of the present invention described above, a reflective plating layer is formed on a surface at a predetermined position corresponding to the pad portion and the lead portion on the upper surface of the metal plate, and corresponds to the pad portion and the lead portion on the lower surface of the metal plate. A stepped portion having a depth of 10 μm to 25 μm formed by first half-etching using the reflective plating layer as an etching mask around the reflective plating layer on the upper surface side of the metal plate, with an external connection plating layer formed at a predetermined position From the upper surface side of the metal plate, the pad portion and the lead portion are partitioned by a recess formed by the second half etching, and the reflective plating layer is formed on the surface formed during the first half etching. It is formed by preparing a multi-row LED lead frame with unevenness polished by etching and second half etching on the upper surface side of the metal plate. The recessed portion and the stepped portion formed by the first half-etching are filled with the reflector resin, and are interposed between the partitioned pad portion and the lead portion, and the pad portion and the outer periphery of the lead portion are connected to the LED of the pad portion. A step of forming a reflector resin portion that surrounds the LED element mounted on the element mounting surface so as to protrude upward, and an LED element is mounted on the surface of the pad section partitioned on the upper surface side of the metal plate, A step of wire bonding the lead part and the LED element partitioned on the upper surface side, and a pad part and a reflector resin part in the lead part partitioned on the upper surface side of the metal plate, and the internal space where the LED element is mounted The process of providing the transparent resin part to be filled, and the plating layer for external connection formed on the lower surface of the metal plate as an etching mask, from the lower surface side Etching is performed so that the reflector resin portion is exposed, and the pad portion in the metal plate is separated from the lead portion and the pad portion or lead portion in the other adjacent LED package region, and the pad portion, the lead portion, and the other adjacent LED are separated. It can be manufactured by having a step of fixing the pad portion or the lead portion in the package region only by the reflector resin portion and a step of cutting a portion surrounding the outer periphery of the pad portion and the lead portion in the reflector resin portion. .

  The multi-row LED lead frame of the present invention described above forms a reflection plating layer at a predetermined position corresponding to the pad portion and the lead portion on the upper surface of the metal plate, and the pad portion and the lead on the lower surface of the metal plate. Forming a plating layer for external connection at a predetermined position corresponding to the portion, forming a resist mask for first etching covering the entire surface on the lower surface side of the metal plate, and forming on the upper surface of the metal plate Using the reflective plating layer as an etching mask, the first half etching is performed at a depth of 10 μm to 25 μm from the upper surface side of the metal plate, and the first half etching is performed on the metal plate at the depth of the upper surface of the metal plate. A step of forming a step portion around the reflective plating layer and an etch for polishing the irregularities of the reflective plating layer surface formed during the first half etching. A step of applying a coating, and a pad portion having a predetermined shape that is separated from the upper surface side of the metal plate, covering the side surface of the formed reflective plating layer and the stepped portion around the reflective plating layer, and not having a connecting portion. A step of forming a resist mask for second etching that can be divided into lead portions, a second half-etching from the upper surface side of the metal plate, and a pad at a depth where the second half-etching is performed on the metal plate And a step of partitioning into a lead portion and a lead portion, and a step of removing the resist mask for first etching and the resist mask for second etching.

  Therefore, according to the present invention, there is no risk of contact failure due to the occurrence of metal burrs on the cut surface, and there is no risk of moisture entering from the cut surface of each individual LED package that has been commercialized. Promotes integration of LED packages, prevents stepping, deformation, warping, etc. of the pad part and lead part, and maintains the flatness of the terminal surface for external connection exposed on the back side to improve productivity. In addition, it is possible to reduce the cost by attaching an expensive resin tape, and to increase the continuous productivity and life of the blade to be cut to obtain individual LED packages, There can be obtained an LED package, a multi-row type LED lead frame, and a manufacturing method thereof, which can prevent the reflector resin portion from being cracked or chipped and can prevent a decrease in reflectance on the side where the LED element is mounted.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram showing a schematic configuration of an LED package according to an embodiment of the present invention. FIG. 4C is a partial enlarged view showing the shape of a main part, and FIG. 4C is a partial cross-sectional view showing a cut portion in a multi-row type LED package manufactured in a batch before being cut. FIG. 2 is a diagram showing a schematic configuration of a multi-row LED lead frame used for manufacturing the LED package shown in FIG. 1, and FIG. FIG. 4B is a partial plan view, FIG. 5B is a sectional view taken along line B-B in FIG. 5A, and FIG. 4C is a partially enlarged view showing the shape of the main part in FIG. FIG. 3 is an explanatory view showing an example and a modification of the manufacturing process of the LED package and the multi-row LED lead frame shown in FIGS.

As shown in FIG. 1A, the LED package of this embodiment includes a pad part 11, a lead part 12, a reflective plating layer 13a, an external connection plating layer 13b, an LED element 20, and a bonding wire. 14, a reflector resin portion 15, and a transparent resin portion 16.
The pad portion 11 and the lead portion 12 are formed in a predetermined shape that is separated from the metal plate forming the base material of the lead frame without providing a connecting portion.
The reflective plating layer 13 a is formed on the upper surface side of the pad portion 11 and the lead portion 12.
Step portions 26a and 26b are formed around the reflective plating layer 13a on the upper surface side of the metal plate, as shown in FIG. The step portions 26a and 26b are formed by half etching using the reflective plating layer 13a as an etching mask, and have a depth of 10 μm to 25 μm.
In addition, the surface of the reflective plating layer 13a, which is formed during half-etching using the reflective plating layer 13a as an etching mask, is polished by etching.
The external connection plating layer 13 b is formed on the lower surface side of the pad portion 11 and the lead portion 12.
The reflector resin portion 15 is formed in the hatched region in FIG. 2A and then cut so that the package outline remains. Further, as shown in FIG. 1 (a), the reflector resin portion 15 enters the lower surface side, for example, about 50 to 75% of the thickness of the metal plate from the upper surface side of the metal plate, and steps 26a, 26b and the side surface of the metal plate. The reflector resin portion 15 is interposed between the pad portion 11 and the lead portion 12 such that the side on which the LED element 20 is mounted is flush with the pad portion 11 and the outer periphery of the lead portion 12. The pad part 11 and the pad part 12 are fixed so as to protrude upward from the LED element 20 mounted on the LED element mounting surface.
The LED element 20 is mounted on the surface of the pad portion 11 on which the reflective plating layer 13a is formed.
The bonding wire 14 joins the LED element 20 and the surface of the lead portion 12 on which the reflective plating layer 13a is formed.
The transparent resin part 16 is surrounded by the pad resin 11 partitioned on the upper surface side of the metal plate and the reflector resin part 15 in the lead part 12, and seals the internal space in which the LED element 20 is mounted.
In the LED package of the present embodiment, the cut surface formed by cutting the multi-row LED package in which a plurality of LED package regions are arranged is the reflector resin portion 15 surrounding the pad portion 11 and the lead portion 12. The side surfaces and lower side surfaces of the pad portion 11 and the lead portion 12 are formed on the outer peripheral surface of the reflector resin portion 15 on the side opposite to the side on which the LED element 20 is mounted in the reflector resin portion 15. It is exposed in a region inside the cut surface.
Further, the surface of the step portions 26a and 26b is subjected to a roughening process.

Also, the lead frame used in the manufacture of the LED package of the present embodiment, as shown in FIG. 2 (a) and FIG. 2 (b), in order to obtain a large number of LED packages at a time, leads 11 and leads Each lead frame region (a package outline line indicated by a one-dot chain line rectangle in FIG. 2) formed by a combination of the portions 12 is formed as a multi-row lead frame arranged in a matrix.
As shown in FIG. 2C, each lead frame region includes a reflective plating layer 13a formed at a predetermined position corresponding to the pad portion 11 and the lead portion 12 on the upper surface of the metal plate, and the upper surface side of the metal plate. Step portions 26a and 26b formed at a depth of 10 μm to 25 μm by the first half etching using the reflective plating layer 13a as an etching mask around the reflective plating layer 13a, and a pad on the lower surface of the metal plate It has an external connection plating layer 13 b formed at a predetermined position corresponding to the portion 11 and the lead portion 12. The reflective plating layer 13a has the surface irregularities formed during the first half-etching polished by etching.
Further, the multi-row LED lead frame of the present embodiment includes a metal plate between the reflective plating layer 13a corresponding to the pad portion 11 and the reflective plating layer 13a corresponding to the lead portion 12 and the lead frame region. For example, a second half etching having a depth of about 50 to 75% of the thickness of the metal plate is formed between the reflective plating layer 13a in the metal layer and the reflective plating layer 13a in another lead frame region adjacent thereto. The recessed portions 19a and 19b are formed.
The upper surface side of the metal plate is partitioned into the pad portion 11 and the lead portion 12 at the depth of the second half etching by the recesses 19a and 19b, and another lead adjacent to the lead frame region. It is divided into a frame area. In FIG. 2A, reference numeral 18 denotes an outer frame portion in a metal plate for manufacturing a multi-row lead frame.
Further, the surface of the recesses 19a and 19b and the surface of the step portions 26a and 26b are roughened.

  The LED package and the multi-row LED lead frame of this embodiment configured as described above are manufactured, for example, as follows. Note that description of pre-processing and post-processing including chemical solution cleaning and water cleaning performed in each manufacturing process is omitted for the sake of convenience.

First, resist masks 30 for plating are formed on both surfaces of a metal plate (for example, Cu material) serving as a base, and a necessary plating layer is formed on the surface of the exposed metal plate (a reflective plating layer on the upper surface). 13a, an external connection plating layer 13b) is formed on the lower surface (see FIG. 3A). At this time, the reflective plating layer 13a is formed to be thick, for example, about 1 μm as the thickness for polishing the unevenness of the surface formed by using an etching mask in the first half etching described later. Keep it.
In addition, formation of the resist mask used in the manufacturing process of the LED package and the multi-row type LED lead frame of the present embodiment and the examples to be described later is performed by laminating, for example, a dry film resist on both surfaces of the metal plate. On the other hand, both surfaces are exposed and developed using a glass mask in which a pattern for forming the base portion of the pad portion and the lead portion is formed at a predetermined position. Exposure and development are performed by a conventionally known method. For example, by irradiating ultraviolet rays in a state covered with a glass mask, reducing the solubility of the dry film resist portion irradiated with the ultraviolet rays that passed through the glass mask with respect to the developer, and removing other portions, A resist mask is formed. Although a negative dry film resist is used here as a resist, a negative liquid resist may be used for forming a resist mask. Furthermore, by using a positive dry film resist or a liquid resist, the solubility of the resist portion irradiated with ultraviolet rays that has passed through the glass mask is increased in the developing solution, and the resist mask is removed by removing the portion. You may make it form.

  After forming the necessary plating layers (reflection plating layer 13a and external connection plating layer 13b) on the upper and lower surfaces of the exposed metal plate, the plating resist mask 30 is peeled off and the lower surface side is formed. A first etching resist mask 31-1 covering the entire surface is formed (see FIG. 3B).

Next, using the reflective plating layer 13a formed on the upper surface of the metal plate as an etching mask, first half etching is performed at a depth of 10 to 25 μm from the upper surface side of the metal plate, and the first half etching on the metal plate is performed. Steps 26a and 26b are formed around the reflective plating layer 13a on the upper surface of the metal plate at the depths subjected to (see FIG. 3C). The first half etching from the upper surface side of the metal plate is preferably performed so as to roughen the surfaces of the stepped portions 26a and 26b to be formed.
Next, etching for polishing the irregularities on the surface of the reflective plating layer 13a, which is formed during the first half etching, is performed at a depth of about 1 μm (see FIG. 3D).

Next, on the upper surface side of the metal plate, the reflective plating layer 13a and the side surfaces of the stepped portions 26a and 26b around the reflective plating layer 13a are covered, and the pads having a predetermined shape are separated from each other without providing a connecting portion. A second etching resist mask 31-2 that can be divided into a portion 11 and a lead portion 12 is formed (see FIG. 3E).
When the second half etching to be described later is performed on the exposed metal plate, the metal immediately below the reflective plating layer 13a is dissolved and removed, and the reflective plating layer 13a in the portion where the metal is dissolved and removed is exposed. Since the reflective plating layer 13a is thin, the exposed portion becomes a plating burr and is likely to be cracked or chipped. When the plating burr is cracked, the reflective plating layer 13a in the vicinity of the plating burr is also peeled off, and there is a risk that the quality of the product may be deteriorated, such as reducing the reflectance.
Therefore, the second etching layer on the upper surface side is covered so as to cover the side surfaces of the step portions 26a and 26b around the reflection plating layer 13a and the reflection plating layer 13a to such an extent that the metal immediately below the reflection plating layer 13a is not dissolved and removed. By forming the resist mask 31-2, the occurrence of plating burrs when the second half etching is performed is prevented.

Next, from the upper surface side of the metal plate, for example, at a depth of about 50 to 75% of the thickness of the metal plate, the second half etching is performed, and the depth at which the second half etching is performed on the metal plate is performed. In FIG. 3, the pad portion 11 and the lead portion 12 are formed so as to be partitioned (see FIG. 3 (f)). At this time, as shown in FIG. 3G, the second etching resist mask 31-2 on the upper surface side reflects so that the metal (here, Cu) just below the reflective plating layer 13a is not dissolved and removed. Since the side surfaces of the step portions 26a and 26b around the plating layer 13a and the reflective plating layer 13a are covered, the metal immediately below the reflective plating layer 13a remains without being dissolved and removed by the second half etching. .
The second half etching from the upper surface side of the metal plate is preferably performed so as to roughen the surfaces of the recesses 19a and 19b to be formed.

  Next, the first etching resist mask 31-1 and the second etching resist mask 31-2 are removed (see FIG. 3H). As a result, the multi-row LED lead frame of this embodiment is completed.

  Next, the recessed portions 19a and 19b formed by the second half etching on the upper surface side of the metal plate and the step portions 26a and 26b formed by the first half etching are filled with the reflector resin, and the partitioned pad portions 11 are filled. And the reflector resin portion 15 that surrounds the pad portion 11 and the outer periphery of the lead portion 12 so as to protrude above the LED element 20 mounted on the LED element mounting surface of the pad portion 11. And using a mold (see FIG. 3 (i)). Thereby, it becomes the lead frame for multi-row type LED provided with the reflector resin part of this embodiment.

  Next, the LED element 20 is mounted on the surface of the pad portion 11 partitioned on the upper surface side of the metal plate, and the lead portion 11 and the LED element 20 partitioned on the upper surface side of the metal plate are connected via the bonding wires 14. Connecting. Further, the transparent resin portion 16 is formed by filling the inner space in which the LED element 20 is mounted, surrounded by the reflector resin portion 15 in the pad portion 11 and the lead portion 12 partitioned on the upper surface side of the metal plate. Then, the internal space surrounded by the reflector resin portion 15 is sealed (see FIG. 3 (j)).

  Next, using the external connection plating layer 13b formed on the lower surface of the metal plate as an etching mask, etching is performed so that the reflector resin portion 15 is exposed from the lower surface side, and the pad portion 11 and the lead portion 12 on the metal plate are adjacent to each other. The pad portion 11 or the lead portion 12 in the other LED package region that fits is separated, and the pad portion 11 and the lead portion 12 and the pad portion 11 or the lead portion 12 in another adjacent LED package region are fixed only by the reflector resin portion 15. (See FIG. 3 (k)).

Next, the part surrounding the outer periphery of the pad part 11 and the lead part 12 in the reflector resin part 15 is cut (see FIG. 3 (l)). Thereby, the LED package of this embodiment is completed.
In the multi-row LED package shown in FIG. 3 (k), the portion etched from the lower surface side of the metal plate has a depth of about 25 to 50% of the thickness of the metal plate that forms the base material of the lead frame. It is recessed. For this reason, in the LED package of this embodiment shown in FIG. 3 (l), the side surfaces and the lower side surface of the pad portion 11 and the lead portion 12 are exposed.

  In addition, as a manufacturing method of the LED package of the modification of the present embodiment, the resin is filled in the recessed portion etched from the lower surface side of the metal plate in the multi-row LED package shown in FIG. Then, the side surfaces of the pad portion 11 and the lead portion 12 are fixed (see FIG. 3 (m)), and then the portion surrounding the outer periphery of the pad portion 11 and the lead portion 12 in the reflector resin portion 15 is cut (FIG. 3 (n ))).

According to the LED package of this embodiment, the cut surface formed by cutting a multi-row LED package in which a plurality of LED package regions are arranged surrounds the pad portion 11 and the lead portion 12 and the reflector resin portion 15. The pad portion 11 and a part of the lead portion 12 are formed on the outer peripheral surface of the reflector resin portion 15 on the side opposite to the side on which the LED element 20 is mounted in the reflector resin portion 15. Unlike conventional LED packages such as the LED packages described in Patent Documents 1 and 2, the metal that forms the base material of the lead frame that is not coated with plating because it is configured to be exposed in the region inside the cut surface However, it is not exposed as a cut surface of the connecting portion.
For this reason, there is no fear of the occurrence of metal burrs on the cut surface or the intrusion of moisture from the cut surface, and there is no problem such as deterioration of the quality of the LED package product due to corrosion of the metal.

Further, according to the LED package of the present embodiment, a stage of manufacturing a multi-row type LED package in which a plurality of LED package areas are arranged, which is a stage before obtaining individual LED packages (see FIG. 3 (l) or FIG. n)), the pad 11 or lead 12 in each lead frame region, the pad 11 or lead 12 in another lead frame region, or the outer frame of a metal plate for manufacturing a multi-row lead frame. The portion 18 is fixed only by the reflector resin portion 15, and there is no connection portion made of metal that forms the base material of the lead frame.
For this reason, when the individual LED packages are obtained from the multi-row LED package in which a plurality of LED package regions are arranged, almost all of the cutting target portions of the blade except the part of the outer frame portion 18 are the reflector resin portion 15. Become.
As a result, the amount of cutting the metal that forms the base material of the lead frame can be greatly reduced as compared with the conventional LED package having a connecting portion such as the LED package described in Patent Documents 1 and 2. The adverse effect on the blade during processing can be greatly reduced, and the continuous productivity and life of the blade can be extended.

Further, according to the LED package of the present embodiment, the pad portion 11 in each lead frame region is manufactured at the stage of manufacturing a multi-row type LED package in which a plurality of LED package regions are arranged, before obtaining each LED package. The lead portion 12, the pad portion 11 or the lead portion 12 in another lead frame region, and the outer frame portion 18 in the metal plate for manufacturing the multi-row type lead frame are fixed only by the reflector resin portion 15, and the lead frame By having a structure in which there is no connection part made of metal forming the base material, the reflector resin part 15 is cut into individual LED packages without greatly adversely affecting the blade even if the width of the blade is reduced. Can do. In a conventional LED package using a multi-row lead frame having a connecting portion such as the LED package described in Patent Documents 1 and 2, a blade that had to be provided with a width of about 0.3 to 0.5 mm According to the LED package of the present embodiment, the cutting width can be set as narrow as about 0.1 to 0.3 mm.
As a result, the pad portion 11 and the lead portion 12 in each lead frame region, the pad portion 11 or the lead portion 12 in another lead frame region, and the outer frame portion 18 in the metal plate for manufacturing the multi-row type lead frame. The width of the reflector resin portion 15 to be fixed can be narrowed, the number of individual lead frames that can be formed in the multi-row lead frame forming area can be increased, and remarkable integration can be achieved during manufacturing. . Moreover, unlike the LED packages described in Patent Documents 1 and 2, it is not necessary to devise the shape of the pad portion 11 and the lead portion 12 and the connection position with the connecting portion so that the connecting portion is not easily deformed. The degree of freedom in designing the pad portion 11 and the lead portion 12 is increased.

Further, according to the LED package of the present embodiment, the reflective plating layer 13a is formed at a predetermined position corresponding to the pad portion 11 and the lead portion 12 on the upper surface of the metal plate, and the reflective plating on the upper surface side of the metal plate. Around the layer 13a, there are step portions 26a and 26b having a depth of 10 μm to 25 μm formed by half-etching using the reflective plating layer 13a as an etching mask. The reflective plating layer 13a is formed during half-etching. Since the unevenness of the formed surface is polished by etching, the bottom surfaces of the step portions 26a and 26b formed around the reflective plating layer 13a on the metal plate are somewhat distant from the upper surface of the reflective plating layer 13a. Has depth. For this reason, the reflector resin portion 15 in the step portions 26a and 26b, which is formed so as to be flush with the upper surface of the reflective plating layer 13a on the side where the LED element 20 is mounted, can obtain a sufficient reflection effect as a reflector. Having a thickness of Moreover, since the thickness of the reflector resin part 15 formed in the level | step-difference part 26a, 26b becomes remarkably thick compared with the thickness of the plating layer 13a for reflection, it becomes difficult to produce a crack and a chip. As a result, it is difficult for the reflector resin portion 15 around the reflective plating layer 13a to be cracked or chipped. As a result, the step portions 26a and 26b of the metal plate in the vicinity of the reflective plating layer 13a are difficult to be exposed, and the LED element is formed. It is possible to prevent a decrease in the reflectance of the entire area to be mounted.
In addition, since the depth of the stepped portions 26a and 26b formed by half etching using the reflective plating layer 13a as an etching mask is 10 μm to 25 μm, the metal immediately below the reflective plating layer 13a is dissolved and removed by half etching. In addition, no plating burr occurs.
Furthermore, since the reflective plating layer 13a has a structure in which the unevenness of the surface formed during half-etching is polished by etching, the reflectance of the reflective plating layer 13a that has decreased by half-etching is half-etched. You can return to the previous state.

  In addition, in the LED package of the present invention, if the surface 26a, 26b of the stepped portion is subjected to a roughening process, the reflector resin portion 15 when the reflector resin portion 15 is formed on the stepped portions 26a, 26b. Improved adhesion.

  In addition, according to the multi-row LED lead frame of the present embodiment, the multi-row LED lead frame in which a plurality of LED lead frame regions are arranged, each lead frame region on the upper surface of the metal plate A reflective plating layer 13a formed at a predetermined position corresponding to the pad portion 11 and the lead portion 12, and an external connection plating layer 13b formed at a predetermined position corresponding to the pad portion 11 and the lead portion 12 on the lower surface of the metal plate. And another lead frame adjacent to the reflection plating layer 13a in the lead frame region between the reflection plating layer 13a corresponding to the pad portion 11 and the reflection plating layer 13a corresponding to the lead portion 12 in the metal plate. Recesses 19a and 19b formed by half etching between the reflective plating layer 13a in the region, By the portions 19a and 19b, the upper surface side of the metal plate is partitioned into a pad portion 11 and a lead portion 12 at a depth where half etching is performed, and is partitioned into another lead frame region adjacent to the lead frame region. Therefore, the recesses 19a and 19b formed on the upper surface of the metal plate are interposed between the partitioned pad part 11 and the lead part 12, and the outer periphery of the pad part 11 and the lead part 12 is provided. A reflector resin portion 15 is formed so as to protrude upward from the LED element 20 mounted on the LED element mounting surface of the pad portion 11, and the LED element 20 is placed on the surface of the pad portion 11 partitioned on the upper surface side of the metal plate. In addition to being mounted, the lead part 11 and the LED element 20 partitioned on the upper surface side of the metal plate are wire-bonded to each other on the upper surface side of the metal plate. After providing a transparent resin portion that is enclosed by the reflector resin portion 15 in the pad portion 11 and the lead portion 20 that are partitioned and fills the internal space in which the LED element is mounted, the external connection is formed on the lower surface of the metal plate. Etching is performed using the plating layer 13b as an etching mask so that the reflector resin portion 15 is exposed from the lower surface side, whereby the pad portion 11 and the lead portion 12 in the metal plate and the pad portion 11 or the lead in the other LED package region adjacent to each other. The portion 20 can be separated, and the pad portion 11 and the lead portion 12 and the pad portion 11 or the lead portion 12 in another adjacent LED package region can be fixed only by the reflector resin portion 15, and the book described above. It becomes possible to manufacture a multi-row LED package in the previous stage to obtain the LED package of the embodiment.

  Then, in the process of manufacturing the multi-row LED package in which a plurality of LED package regions are arranged before the LED package of the present embodiment is obtained using the multi-row LED lead frame of the present embodiment, a metal plate Until the etching is performed so that the reflector resin portion 15 is exposed from the lower surface side using the external connection plating layer 13b formed on the lower surface of the substrate as an etching mask, metal is used on the back surface side of the lead frame, for example, the base material of the lead frame. Since the metal plate is integrally connected with a considerable thickness such as about 25 to 50% of the thickness of the metal plate forming the metal plate, there is no deformation of each lead frame region, and the steps of the pad portion 11 and the lead portion 12 The flatness of the terminal surface for external connection exposed on the back surface side is maintained without deformation, warpage, or the like. For this reason, it is composed of a heat-resistant polyimide film and a heat-resistant silicone adhesive to prevent deformation and warping of the pad part and lead part connected to the entire surface exposed on the back side of the multi-row type lead frame via the connecting part. This eliminates the need for expensive resin tape, which can reduce costs.

Further, according to the multi-row type LED lead frame of the present embodiment, the first half etching using the reflective plating layer 13a as an etching mask is performed around the reflective plating layer 13a on the upper surface side of the metal plate by 10 μm. Since the stepped portions 26a and 26b formed with a depth of ˜25 μm are provided, the bottom surfaces of the stepped portions 26a and 26b formed around the reflective plating layer 13a on the metal plate are reflected on the reflective plating layer 13a. It has a certain depth from the upper surface. For this reason, the concave portions 19a and 19b and the step portions 26a and 26b are filled with reflector resin, and are interposed between the partitioned pad portion 11 and the lead portion 12, and the outer circumferences of the pad portion 11 and the lead portion 12 are pad portions. When the reflector resin portion 15 is formed so as to protrude upward from the LED element 20 mounted on the LED element mounting surface, the upper surface of the reflective plating layer 13a is flush with the LED element 20 mounting side. Thus, the reflector resin portion 15 in the step portions 26a and 26b is formed to have such a thickness that a sufficient reflection effect can be obtained as a reflector. Moreover, since the thickness of the reflector resin part 15 formed in the level | step-difference part 26a, 26b becomes remarkably thick compared with the thickness of the plating layer 13a for reflection, it becomes difficult to produce a crack and a chip. As a result, it is difficult for the reflector resin portion 15 around the reflective plating layer 13a to be cracked or chipped. As a result, the step portions 26a and 26b of the metal plate in the vicinity of the reflective plating layer 13a are hardly exposed, and the LED element 20 is exposed. It is possible to prevent a decrease in the reflectivity of the entire region where the is mounted.
If the depth of the stepped portions 26a and 26b formed by the first half etching using the reflective plating layer 13a as an etching mask is set to 10 μm to 25 μm, the first half etching directly below the reflective plating layer 13a. The metal is not dissolved and removed, and no plating burr is generated.

  Also, according to the multi-row LED lead frame of the present invention, the reflective plating layer 13a has a configuration in which the surface irregularities formed during the first half-etching are polished by etching. The reflectance of the plating layer for reflection that has been reduced by the half etching can be returned to the state before the half etching.

  In the multi-row LED lead frame of the present embodiment, a roughening process is applied to at least one of the surfaces of the recesses 19a and 19b and the step portions 26a and 26b formed by half etching. If it does so, the adhesiveness of the reflector resin part 15 when the reflector resin part 15 is formed in recessed part 19a, 19b and level | step-difference part 26a, 26b will improve.

  Further, in the multi-row LED lead frame of the present embodiment, the recesses 19a and 19b and the step portions 26a and 26b are interposed between the partitioned pad portion 11 and the lead portion 12, and the pad portion 11 and If the reflector resin portion 15 is formed so as to surround the outer periphery of the lead portion 12 so as to protrude above the LED element 20 mounted on the LED element mounting surface of the pad portion 11, the metal on the back side of the lead frame is formed. However, in addition to being integrally connected with a considerable thickness, for example, about 25 to 50% of the thickness of the metal plate that forms the base material of the lead frame, the reflector resin portion 15 includes the pad portion 11 and the lead portion. 12 is used to manufacture a multi-row type LED package in which a plurality of LED package regions are arranged. Deformation becomes more difficult even occur, the step of the pad portion 11 and lead portion 12, deformation, etc. do not occur more warp, flatness of the terminal face for external connection which are exposed on the back side is further maintained.

  Therefore, according to the present embodiment, there is no risk of contact failure due to the occurrence of metal burrs on the cut surfaces of individual LED packages that have been commercialized, and there is no risk of moisture intrusion from the cut surfaces. Productivity is promoted by promoting the integration of LED packages to be arranged, preventing stepping, deformation and warping of the pads and leads, and maintaining the flatness of the terminal surface for external connection exposed on the back side. In addition, it is not necessary to attach expensive resin tape, and the cost can be reduced, and the continuous productivity and life of the blade to be cut to obtain individual LED packages can be extended. In addition, there can be obtained an LED package, a multi-row LED lead frame, and a manufacturing method thereof, which can prevent the reflector resin portion from being cracked or chipped and can prevent a decrease in the reflectance on the LED element mounting side.

EXAMPLES Next, examples of the present invention will be described.
In the present embodiment, the pre-processing and post-processing of each process such as cleaning processing and drying processing are general processing, and thus description thereof is omitted.

First, a strip-like Cu material having a thickness of 0.15 mm was prepared as a base material for a lead frame, pilot holes were formed at the edge of the outer frame, and then a resist layer was formed on both sides.
Next, a glass mask on which a pattern necessary for obtaining a resist mask for forming a reflective plating layer is prepared is prepared on the upper surface side of the lead frame substrate, and an external connection is provided on the lower surface side. By preparing a glass mask on which a pattern necessary for obtaining a resist mask for forming a plating layer is drawn, determining the position of the glass mask based on the pilot hole formed earlier, and performing exposure and development A resist mask for plating was formed on both surfaces of the base material of the lead frame.
Next, a reflective plating layer is formed on the upper surface of the base material of the lead frame where the Cu is exposed, and an external connection plating layer is formed on the lower surface. The formed resist mask for plating was peeled off (see FIG. 3A).
The reflective plating layer is formed by first forming Ni plating with a set thickness of 3 μm, forming Pd plating with a set thickness of 0.03 μm thereon, and then forming Au plating with a set thickness of 0.01 μm. Finally, it was obtained by forming an Ag plating with a set thickness of 3 μm.
The external connection plating layer is formed by first forming Ni plating with a set thickness of 3 μm, forming Pd plating with a set thickness of 0.03 μm thereon, and finally forming Au plating with a set thickness of 0.01 μm. Was obtained by

Next, a resist layer was formed on the lower surface, and exposure and development were performed to form a first etching resist mask covering the entire surface.
Next, using the reflective plating layer formed on the upper surface as an etching mask, an etching process is performed to perform a first half-etching process having a depth of 10 μm to 25 μm from the upper surface side of the base material of the lead frame (FIG. 3 ( c)), a stepped portion was formed around the reflective plating layer.
Next, an etching process for polishing irregularities on the surface of the reflective plating layer formed during the first half-etching process was performed at a depth of about 1 μm (see FIG. 3D).

  Next, a resist layer is formed on both surfaces again, and exposure and development are performed. On the upper surface side, the Cu layer immediately below the formed reflective plating layer is not dissolved and removed. By covering the side surface of the stepped portion, a second etching resist mask for obtaining a pad portion, a lead portion, and other necessary shapes was formed (see FIG. 3E).

Next, an etching process is performed to perform a second half-etching process to a depth of about 0.1 mm (see FIG. 3F), and a first etching resist mask on the lower surface and a second etching on the upper surface. By removing the resist mask, the necessary plating layers (reflection plating layer, external connection plating layer) are formed on both sides, and the depth of the second half-etching in the lead frame base material Then, a lead frame for a multi-row LED in which the pad portion and the lead portion were partitioned was obtained (see FIG. 3 (h)). Since this multi-row LED lead frame has a thickness of about 0.05 mm on the lower surface side and a plurality of pad portions and lead portions are connected to each other, it is connected like the LED package described in Patent Documents 1 and 2. In the formation of a multi-row LED lead frame used in the manufacture of a conventional LED package having a portion, there is no connection portion required when the lead frame substrate is subjected to through etching.
In addition, the pad portion and the lead portion after the etching process have a step around the reflective plating film, and only the plating film is exposed on the outermost surface of the pad portion and the lead portion on the reflective plating layer side, and the Cu material There are no exposed parts.

Next, a reflector resin portion was formed on the LED lead frame using a mold (see FIG. 3 (i)). The lower surface of the LED lead frame is approximately 0.05 mm thick and the lead frame base material (Cu material) remains, so the reflector resin fills the concave and stepped portions that are half-etched parts on the upper surface. Then, a predetermined shape is formed between the partitioned pad portion and the lead portion so that the side on which the LED element is mounted is flush. The reflector resin portion is formed so as to surround the outer periphery of the pad portion and the lead portion so as to protrude above the LED element mounted on the LED element mounting surface of the pad portion. In addition, the plating layer formed previously is exposed in the bonding portion of the lead portion and the portion where the LED element of the pad portion is mounted and fixed surrounded by the reflector resin portion.
Next, the LED element is mounted and fixed on the pad portion of the LED lead frame on which the reflector resin portion is formed, the LED element and the lead portion are wire-bonded, and the LED element surrounded by the reflector resin portion is mounted. The inner space thus filled was filled with a transparent resin to form a transparent resin portion for sealing the LED element and the bonding wire (see FIG. 3 (j)).

  Next, using the external connection plating layer formed on the lower surface side as an etching mask, the remaining lead frame base material (Cu material) of about 0.05 mm is etched to provide a pad on the lead frame base material. And lead portions are formed in an independent state (see FIG. 3 (k)). At this time, since the reflector resin portion is interposed between the pad portion and the lead portion and surrounds the outer periphery of the pad portion and the lead portion, the pad portion and the lead portion are fixed by the reflector resin portion. There is no conventional connecting part.

Next, in order to obtain individual LED packages from the multi-row LED package formed with a plurality of LED package regions fixed by the reflector resin portion, the connected pad portions and lead portions of the reflector resin portion are obtained. The part surrounding the outer periphery was cut (see FIG. 3 (l)). Thereby, the pad portion and the lead portion are independently fixed by the reflector resin portion, and the cut surface exists only on the outer peripheral surface of the reflector resin portion surrounding the outer periphery of the pad portion and the lead portion, and the pad portion and the lead portion are An LED package was obtained in which a part of the side surface on the lower surface side and the lower surface were exposed in a region inside the cut surface formed on the outer peripheral surface of the reflector resin portion on the lower surface side of the reflector resin. Since this LED package has a structure without a connecting portion of a conventional lead frame, a cut surface of the connecting portion does not appear on the side surface side of the LED package.
Further, there is no portion where the base material (Cu material) of the lead frame is exposed around the reflective plating layer.

  INDUSTRIAL APPLICABILITY The LED package, the multi-row type LED lead frame, and the manufacturing method thereof according to the present invention are useful in a field where it is necessary to assemble a surface mount type encapsulating resin type semiconductor device.

DESCRIPTION OF SYMBOLS 10 Lead frame 11 Pad part 12 Lead part 13 Plating layer 13a Reflective plating layer 13b External connection plating layer 14 Bonding wire 15 Reflector resin part 16 Transparent resin part 17 Connection part 18 Outer frame part 19a, 19b Recess 20 LED element 26a, 26b Stepped portion 30 Plating resist mask 31-1 First etching resist mask 31-2 Second etching resist mask

Claims (13)

An individual LED package formed by cutting a multi-row LED package in which a plurality of LED package regions are arranged,
From the metal plate, without providing the connection portion, the pad portion and the lead portion formed in a predetermined shape, respectively separated from each other,
A reflector resin portion that is interposed between the pad portion and the lead portion, surrounds the outer periphery of the pad portion and the lead portion, and fixes the pad portion and the lead portion;
The cut surface formed by cutting the multi-row LED package exists only on the outer peripheral surface of the reflector resin portion surrounding the pad portion and the outer periphery of the lead portion, and
A part of the pad part and the lead part is exposed in a region inside the cut surface formed on the outer peripheral surface of the reflector resin part on the side opposite to the side on which the LED element is mounted in the reflector resin part, further,
A reflective plating layer is formed at a predetermined position corresponding to the pad portion and the lead portion on the upper surface of the metal plate,
On the upper surface side of the metal plate, there is a step portion having a depth of 10 μm to 25 μm formed by half etching using the reflective plating layer as an etching mask around the reflective plating layer,
The LED package according to claim 1, wherein the reflective plating layer has a surface irregularity formed during the half-etching polished by etching.   The LED package according to claim 1, wherein the surface of the stepped portion is subjected to a roughening process. A multi-row LED lead frame in which a plurality of LED lead frame regions are arranged,
Individual lead frame areas
A reflective plating layer formed at a predetermined position corresponding to the pad portion and the lead portion on the upper surface of the metal plate;
A step portion formed at a depth of 10 μm to 25 μm by first half etching using the reflective plating layer as an etching mask around the reflective plating layer on the upper surface side of the metal plate;
A plating layer for external connection formed at a predetermined position corresponding to the pad portion and the lead portion on the lower surface of the metal plate;
In the metal plate, between the reflective plating layer corresponding to the pad portion and the reflective plating layer corresponding to the lead portion, and for reflection in another lead frame region adjacent to the reflective plating layer in the lead frame region. A recess formed by the second half-etching between the plating layer;
Have
By the recess, the upper surface side of the metal plate is partitioned into a pad portion and a lead portion at a depth where the second half etching is performed, and is partitioned into another lead frame region adjacent to the lead frame region,
The reflective plating layer is a multi-column LED lead frame, wherein the surface irregularities formed during the first half-etching are polished by etching.   The lead frame for a multi-row LED according to claim 3, wherein at least one of the surface of the concave portion and the surface of the stepped portion is subjected to a roughening process.   An LED element that is interposed between the partitioned pad part and the lead part in the recess and the step part, and that the outer periphery of the pad part and the lead part is mounted on the LED element mounting surface of the pad part. The lead frame for multi-row type LEDs according to claim 3 or 4, wherein a reflector resin portion is formed so as to protrude upward. A reflective plating layer is formed on a surface at a predetermined position corresponding to the pad portion and the lead portion on the upper surface of the metal plate, and a plating layer for external connection at a predetermined position corresponding to the pad portion and the lead portion on the lower surface of the metal plate. A step portion having a depth of 10 μm to 25 μm is formed around the reflective plating layer on the upper surface side of the metal plate by first half etching using the reflective plating layer as an etching mask, From the upper surface side of the metal plate, the pad portion and the lead portion are partitioned by a recess formed by second half etching, and the reflective plating layer is formed on the surface formed during the first half etching. A step of preparing a lead frame for a multi-row LED in which irregularities are polished by etching;
The recessed pad formed by the second half-etching on the upper surface side of the metal plate and the stepped part formed by the first half-etching are filled with reflector resin, and the partitioned pad part and the lead part Forming a reflector resin portion that surrounds the pad portion and the outer periphery of the lead portion so as to protrude above the LED element mounted on the LED element mounting surface of the pad portion;
Mounting the LED element on the surface of the pad section partitioned on the upper surface side of the metal plate, and wire bonding the lead section partitioned on the upper surface side of the metal plate and the LED element;
A step of providing a transparent resin portion that is surrounded by the reflector resin portion in the pad portion and the lead portion partitioned on the upper surface side of the metal plate and fills the internal space in which the LED element is mounted;
Etching is performed using the plating layer for external connection formed on the lower surface of the metal plate as an etching mask so that the reflector resin portion is exposed from the lower surface side, and the pad portion and the lead portion of the metal plate are adjacent to each other. The pad portion or the lead portion in another LED package region is separated, and the pad portion and the lead portion and the pad portion or the lead portion in another adjacent LED package region are fixed only by the reflector resin portion. A process of making
Cutting the portion surrounding the pad portion and the outer periphery of the lead portion in the reflector resin portion;
A method for manufacturing an LED package, comprising:   7. The LED according to claim 6, wherein the reflective plating layer of the prepared multi-row LED lead frame is etched to a depth of about 1 μm to polish the irregularities on the surface. Package manufacturing method.   At least one of the surface of the stepped portion formed by the first half etching and the surface of the concave portion formed by the second half etching of the multi-row LED lead frame to be prepared is roughened. 8. The method of manufacturing an LED package according to claim 6 or 7, wherein: A method of manufacturing a multi-row LED lead frame in which a plurality of LED lead frame regions are arranged,
A reflective plating layer is formed at a predetermined position corresponding to the pad portion and the lead portion on the upper surface of the metal plate, and an external connection plating layer is formed at a predetermined position corresponding to the pad portion and the lead portion on the lower surface of the metal plate. Forming, and
Forming a first etching resist mask covering the entire surface on the lower surface side of the metal plate;
Using the reflective plating layer formed on the upper surface of the metal plate as an etching mask, first half etching is performed at a depth of 10 μm to 25 μm from the upper surface side of the metal plate, and the first half of the metal plate is formed. A step of forming a step portion around the reflective plating layer on the upper surface of the metal plate at an etched depth;
Performing etching for polishing irregularities on the surface of the reflective plating layer formed during the first half etching;
The reflective plating layer formed on the upper surface side of the metal plate and the side surface of the stepped portion around the reflective plating layer are formed, and the pad portions having a predetermined shape separated from each other without providing a connecting portion, and Forming a second etching resist mask that can be partitioned into lead portions;
Performing a second half-etching from the upper surface side of the metal plate, and partitioning the pad portion and the lead portion at a depth of the metal plate subjected to the second half-etching;
Removing the first etching resist mask and the second etching resist mask;
The manufacturing method of the lead frame for multi-row type LED characterized by having.   10. The method of manufacturing a lead frame for a multi-row LED according to claim 9, wherein an etching depth for polishing irregularities on the surface of the reflective plating layer is about 1 μm.   11. The lead frame for a multi-row LED according to claim 9, wherein the surface of the stepped portion formed by the first half etching from the upper surface side of the metal plate is roughened. Production method.   12. The multi-row LED lead according to claim 9, wherein the surface of the concave portion to be formed is roughened by the second half etching from the upper surface side of the metal plate. Manufacturing method of the frame.   Further, the recessed portion formed by the second half etching on the upper surface side of the metal plate and the stepped portion formed by the first half etching are filled with reflector resin, and the partitioned pad portion and Forming a reflector resin portion interposed between the lead portion and surrounding the pad portion and the outer periphery of the lead portion so as to protrude above the LED element mounted on the LED element mounting surface of the pad portion; The method for producing a lead frame for a multi-row LED according to any one of claims 9 to 12.

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