JP2017003391A

JP2017003391A - Laser radar system

Info

Publication number: JP2017003391A
Application number: JP2015116690A
Authority: JP
Inventors: 大地外間; Daichi Sotoma; 善明帆足; Yoshiaki Hoashi; 柳井　謙一; Kenichi Yanai; 謙一柳井; 尾崎　憲幸; Noriyuki Ozaki; 憲幸尾崎
Original assignee: Denso Corp
Current assignee: Denso Corp
Priority date: 2015-06-09
Filing date: 2015-06-09
Publication date: 2017-01-05

Abstract

PROBLEM TO BE SOLVED: To provide a laser radar system capable of correctly detecting a scan angle of laser beam projected from a light projection part.SOLUTION: A laser radar system comprises: a light emission part 5 comprising a light emission element for emitting laser beam 7 of belt-like beam, and a scanner 9 for reflecting and scanning the laser beam 7 and radiating the laser beam to an object; a light reception part 6 comprising a first light reception element 10 of a two-dimensional array state, for receiving reflectance from the object, and a second light reception element 11 for determining a light reception area to be turned on in the first light reception element 10; a light path 15 for guiding part of the scanned laser beam 7 of the belt-like beam to the second light reception element 11 according to a scan angle; and a distance calculation part for calculating a distance to the object, based on a light emission timing of the light emission element and a light reception timing of the first light emission element 10.SELECTED DRAWING: Figure 2

Description

本発明は、レーザ光を照射し、物体からの反射光を受光して物体までの距離を測定する機能を備えたレーザレーダシステムに関する。 The present invention relates to a laser radar system having a function of irradiating laser light, receiving reflected light from an object, and measuring a distance to the object.

この種のレーザレーダシステムにおいては、発光部からのレーザ光をスキャナでスキャンさせて物体に照射し、物体からの反射光を受光部で受光するように構成されている。スキャナとしては、例えばＭＥＭＳ（Micro Electro Mechanical System）スキャナを使用したものが知られている。 This type of laser radar system is configured to scan a laser beam from a light emitting unit with a scanner and irradiate the object, and receive a reflected light from the object with a light receiving unit. As a scanner, for example, a scanner using a micro electro mechanical system (MEMS) scanner is known.

特開２０１３−２１０３１５号公報JP 2013-210315 A 特開２０１３−２１０３１６号公報JP 2013-210316 A

上記従来構成では、ＭＥＭＳスキャナの向き（スキャン角度）を正確に把握できないという事情があり、発光と受光のタイミングの同期が難しいため、受光部を広めにオンするようにしている。しかし、受光部を広めにオンすると、外乱光の影響を大きく受けるという問題があった。また、受光部を広めにオンすると、同時処理が必要な受光素子（画素）の個数が増えるため、配線量が増えることから、開口率が低下するという問題があった。 In the above-described conventional configuration, there is a situation in which the direction (scan angle) of the MEMS scanner cannot be accurately grasped, and it is difficult to synchronize the timing of light emission and light reception. However, there is a problem that when the light receiving unit is turned on wider, it is greatly affected by ambient light. In addition, when the light receiving unit is turned on wider, the number of light receiving elements (pixels) that need to be simultaneously processed increases, which increases the amount of wiring, resulting in a problem that the aperture ratio decreases.

また、ＭＥＭＳスキャナの位置を検出する機能を備えた装置として、特許文献１、２に記載された装置が知られている。しかし、特許文献１、２の装置では、ＭＥＭＳスキャナのスキャン領域の一部を検出することで振幅を推定しているだけであり、ＭＥＭＳスキャナの振れ角（スキャン角度）を正確に検出できていないため、検出精度が悪いという問題があった。 In addition, devices described in Patent Documents 1 and 2 are known as devices having a function of detecting the position of a MEMS scanner. However, in the apparatuses of Patent Documents 1 and 2, the amplitude is only estimated by detecting a part of the scan area of the MEMS scanner, and the deflection angle (scan angle) of the MEMS scanner cannot be accurately detected. Therefore, there was a problem that detection accuracy was poor.

そこで、本発明の目的は、投光部から投光されたレーザ光のスキャン角度を正確に検出することができるレーザレーダシステムを提供することにある。 Therefore, an object of the present invention is to provide a laser radar system that can accurately detect the scan angle of the laser light projected from the light projecting unit.

請求項１の発明は、帯状ビームのレーザ光を発光する発光素子、及び、前記レーザ光を反射し且つスキャンさせて物体へ照射するスキャナを有する発光部と、前記物体からの反射光を受光する２次元アレイ状の第１受光素子、及び、前記第１受光素子の中のオンする受光領域を決定する第２受光素子を有する受光部と、前記スキャンされた帯状ビームのレーザ光の一部をスキャン角度に応じて前記第２受光素子へ導く光路と、前記発光素子の発光タイミングと前記第１受光素子の受光タイミングに基づいて前記物体までの距離を算出する距離算出部とを備えて構成されている。 According to a first aspect of the present invention, a light emitting element that emits a laser beam of a belt-like beam, a light emitting unit that includes a scanner that reflects and scans the laser light and irradiates the object, and receives reflected light from the object. A light-receiving unit having a first light-receiving element in a two-dimensional array, a second light-receiving element that determines a light-receiving region to be turned on in the first light-receiving element, and a part of the laser beam of the scanned band beam An optical path that leads to the second light receiving element according to a scan angle; and a distance calculation unit that calculates a distance to the object based on a light emission timing of the light emitting element and a light reception timing of the first light receiving element. ing.

本発明の第１実施形態を示すレーザレーダシステムの外観斜視図1 is an external perspective view of a laser radar system showing a first embodiment of the present invention. レーザレーダシステムの縦断側面図Longitudinal side view of laser radar system レーザレーダシステムの発光受光の動作を説明する図Diagram for explaining the operation of light emission and reception in the laser radar system レーザレーダシステムの電気的構成を示すブロック図Block diagram showing the electrical configuration of the laser radar system フローチャートflowchart 本発明の第２実施形態を示すレーザレーダシステムの縦断側面図Vertical side view of a laser radar system showing a second embodiment of the present invention レーザレーダシステムの発光受光の動作を説明する図Diagram for explaining the operation of light emission and reception in the laser radar system 本発明の第３実施形態を示すレーザレーダシステムの縦断側面図Vertical side view of a laser radar system showing a third embodiment of the present invention レーザレーダシステムの発光受光の動作を説明する図Diagram for explaining the operation of light emission and reception in the laser radar system 本発明の第４実施形態を示すレーザレーダシステムの縦断側面図Vertical side view of a laser radar system showing a fourth embodiment of the present invention レーザレーダシステムの発光受光の動作を説明する図Diagram for explaining the operation of light emission and reception in the laser radar system 光ファイバから出射されるレーザ光のビームスポットと第２受光素子との関係を示す図The figure which shows the relationship between the beam spot of the laser beam radiate | emitted from an optical fiber, and a 2nd light receiving element. 本発明の第５実施形態を示すレーザレーダシステムのブロック図Block diagram of a laser radar system showing a fifth embodiment of the present invention 本発明の第６実施形態を示すレーザレーダシステムの縦断側面図Vertical sectional side view of a laser radar system showing a sixth embodiment of the present invention 本発明の第７実施形態を示すレーザレーダシステムの縦断側面図Vertical side view of a laser radar system showing a seventh embodiment of the present invention

以下、本発明の第１実施形態について、図１ないし図５を参照して説明する。まず、図１は本実施形態のレーザレーダシステム１の全体構成を示す外観斜視図であり、図２はレーザレーダシステム１の縦断側面図である。これら図１及び図２に示すように、レーザレーダシステム１の本体（ケーシング）２は、下部収容室３と、上部収容室４とを備える。下部収容室３内には発光部５が配設されており、上部収容室４内には受光部６が配設されている。 Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 1 to 5. First, FIG. 1 is an external perspective view showing the overall configuration of the laser radar system 1 of the present embodiment, and FIG. 2 is a longitudinal side view of the laser radar system 1. As shown in FIGS. 1 and 2, the main body (casing) 2 of the laser radar system 1 includes a lower accommodation chamber 3 and an upper accommodation chamber 4. A light emitting unit 5 is disposed in the lower housing chamber 3, and a light receiving unit 6 is disposed in the upper housing chamber 4.

発光部５は、図３にも示すように、帯状ビーム（短冊状ビームまたは矩形状ビームと称してもよい）のレーザ光７を発光する発光素子８と、上記帯状ビームのレーザ光７を反射し且つスキャンさせて物体へ照射するＭＥＭＳスキャナ９とを有する。発光素子８は、例えば半導体レーザダイオードと光学系から構成されており、帯面が例えば鉛直方向に沿う帯状ビームのレーザ光７を例えば水平方向に発光し、ＭＥＭＳスキャナ９へ照射する。本実施形態では、発光素子８は、レーザ光７として例えばパルスレーザ光７を発光するように構成されている。尚、パルスレーザ光７としては、パルス幅が例えば４ｎｓ程度、発光周期が例えば４μｓ程度のものが好ましい。 As shown in FIG. 3, the light emitting unit 5 reflects a light emitting element 8 that emits a laser beam 7 of a strip beam (may be referred to as a strip beam or a rectangular beam) and the laser beam 7 of the strip beam. And a MEMS scanner 9 that scans and irradiates an object. The light emitting element 8 is composed of, for example, a semiconductor laser diode and an optical system. The light emitting element 8 emits a laser beam 7 of a belt-shaped beam whose vertical surface is along the vertical direction, for example, in the horizontal direction and irradiates the MEMS scanner 9. In the present embodiment, the light emitting element 8 is configured to emit, for example, pulsed laser light 7 as the laser light 7. The pulse laser beam 7 preferably has a pulse width of, for example, about 4 ns and a light emission period of, for example, about 4 μs.

ＭＥＭＳスキャナ９は、ＭＥＭＳ技術で形成された走査ミラーを有し、この走査ミラーを往復回転振動させることが可能なように構成されており、発光素子８から入射した帯状ビームのレーザ光７を反射し且つスキャンさせる。この場合、図３に示すように、帯状ビームのレーザ光７を、例えば水平方向に反射させ、更に、例えば矢印Ａ方向に往復に振ってスキャンさせる構成となっている。尚、図３において示す角度範囲ｄが、レーザ光７のスキャン角度の全範囲である。 The MEMS scanner 9 has a scanning mirror formed by the MEMS technology, and is configured to be able to reciprocate and oscillate the scanning mirror. The MEMS scanner 9 reflects the laser beam 7 of the belt-shaped beam incident from the light emitting element 8. And let it scan. In this case, as shown in FIG. 3, the laser beam 7 of the strip beam is reflected in the horizontal direction, for example, and is further scanned in a reciprocating manner in the direction of the arrow A, for example. Note that the angle range d shown in FIG. 3 is the entire scan angle range of the laser light 7.

受光部６は、物体からの反射光を受光する２次元アレイ状の第１受光素子１０と、第１受光素子１０の中のオンする受光領域を決定する第２受光素子１１とを有する。受光部６（第１受光素子１０及び第２受光素子１１）の前方には、受光レンズ１２が配設されている。第１受光素子１０は、例えば半導体光センサからなる２次元アレイ状のイメージセンサで構成されており、（ａ行＊ｂ列）個の画素（ピクセル）１３を有する。第２受光素子１１は、例えば半導体光センサからなるラインセンサ（１次元のイメージセンサ）で構成されており、ｂ個の画素（ピクセル）１４を有する。本実施形態では、第１受光素子１０の画素１３の列数（ｂ）と、第２受光素子１１の画素１４の個数（ｂ）を等しくするように構成している。尚、画素１３、１４の具体的構成としては、周知のレーザレーダシステム用の受光素子の画素の構成を適宜用いて構成することが好ましく、例えばＳＰＡＤ（Single Photon Avalanche Diode）を備えた画素を使用することが好ましい。 The light receiving unit 6 includes a first light receiving element 10 in a two-dimensional array that receives reflected light from an object, and a second light receiving element 11 that determines a light receiving region to be turned on in the first light receiving element 10. A light receiving lens 12 is disposed in front of the light receiving unit 6 (the first light receiving element 10 and the second light receiving element 11). The first light receiving element 10 is constituted by a two-dimensional array image sensor made of, for example, a semiconductor optical sensor, and has (a row * b column) pixels (pixels) 13. The second light receiving element 11 is composed of, for example, a line sensor (one-dimensional image sensor) made of a semiconductor optical sensor, and has b pixels (pixels) 14. In the present embodiment, the number of columns (b) of the pixels 13 of the first light receiving element 10 and the number (b) of the pixels 14 of the second light receiving element 11 are configured to be equal. In addition, as a specific configuration of the pixels 13 and 14, it is preferable to appropriately configure a pixel configuration of a well-known light receiving element for a laser radar system. For example, a pixel having a SPAD (Single Photon Avalanche Diode) is used. It is preferable to do.

また、第１受光素子１０及び第２受光素子１１は、例えば同一の半導体チップ上に形成されている。上記半導体チップには、第２受光素子１１のｂ個の画素１４のうちの例えば左からｎ番目の画素１４がレーザ光７の一部（後述する）を受光すると、第１受光素子１０の画素１３のうちの左からｎ列目の１列分（ａ個）の画素１３を直接オン（受光可能状態に）することが可能なハードウエア回路が形成されている。即ち、第２受光素子１１は、第１受光素子１０の画素１３の中のオンする１列分（ａ個）の画素１３を決定する機能、即ち、受光領域（受光可能領域）を決定する機能を有する。 The first light receiving element 10 and the second light receiving element 11 are formed on, for example, the same semiconductor chip. In the semiconductor chip, when the nth pixel 14 from the left among the b pixels 14 of the second light receiving element 11 receives a part (described later) of the laser light 7, the pixel of the first light receiving element 10. A hardware circuit is formed that can directly turn on (a light receiving) pixels 13 corresponding to one column (a number) from the left of 13. That is, the second light receiving element 11 has a function of determining one row (a) of pixels 13 among the pixels 13 of the first light receiving element 10, that is, a function of determining a light receiving area (light receiving area). Have

また、下部収容室３及び上部収容室４内には、スキャンされた帯状レーザのレーザ光７の一部（上端部の一部）を第２受光素子１１へ導く光路１５が設けられている。この光路１５は、図２及び図３に示すように、帯状ビームのレーザ光７の例えば上端部にかかるように配設された第１のプリズム１６と、下部収容室３と上部収容室４を仕切る仕切板１７に形成された貫通孔１７ａと、この貫通孔１７ａ内に配設された第２のプリズム１８とを備えている。 In the lower storage chamber 3 and the upper storage chamber 4, an optical path 15 that guides a part of the laser beam 7 of the scanned belt-like laser (a part of the upper end) to the second light receiving element 11 is provided. As shown in FIGS. 2 and 3, the optical path 15 includes a first prism 16 disposed so as to cover, for example, an upper end portion of the laser beam 7 of the band-shaped beam, the lower storage chamber 3, and the upper storage chamber 4. A through hole 17a formed in the partition plate 17 to be partitioned, and a second prism 18 disposed in the through hole 17a are provided.

第１のプリズム１６は、スキャンされた帯状ビームのレーザ光７の端（上端）が入射されると共に、帯状ビームのレーザ光７のスキャン角度全範囲ｄのレーザ光７が入射されるように配置されている。そして、第１のプリズム１６から出射されたレーザ光７は、第２のプリズム１８へ入射され、更に、第２のプリズム１８から出射されたレーザ光７は、受光レンズ１２を通過して集光されてから、第２受光素子１１へ照射されるように構成されている。この場合、受光レンズ１２の集光作用と光路１５によって、レーザ光７が第２受光素子１１へ照射されたとき、照射スポットの大きさ（面積）は、第２受光素子１１の１個の画素１４の大きさ（面積）とほぼ等しくなるように構成されている。 The first prism 16 is arranged so that the end (upper end) of the laser beam 7 of the scanned belt-shaped beam is incident and the laser beam 7 in the entire scanning angle range d of the laser beam 7 of the strip-shaped beam is incident. Has been. The laser beam 7 emitted from the first prism 16 enters the second prism 18, and the laser beam 7 emitted from the second prism 18 passes through the light receiving lens 12 and is condensed. After that, the second light receiving element 11 is irradiated. In this case, when the laser light 7 is irradiated onto the second light receiving element 11 by the light collecting action of the light receiving lens 12 and the optical path 15, the size (area) of the irradiation spot is one pixel of the second light receiving element 11. It is comprised so that it may become substantially equal to the magnitude | size (area) of 14.

そして、上記構成においては、第１のプリズム１６及び第２のプリズム１８は、スキャンされた帯状ビームのレーザ光７の端部が入射されると共に、入射されたレーザ光７を第２受光素子１１へ向けて出射するプリズムを構成している。また、光路１５は、スキャンされた帯状ビームのレーザ光７の一部をスキャン角度に応じて第２受光素子１１へ導く光路となっている。これにより、第２受光素子１１の画素１４の中の受光した画素１４の位置に基づいて、レーザ光７のスキャン角度を正確に検出することができる構成となっている。 In the configuration described above, the first prism 16 and the second prism 18 are incident on the end of the scanned belt-shaped laser beam 7 and the incident laser beam 7 is received by the second light receiving element 11. The prism which radiate | emits toward is comprised. The optical path 15 is an optical path for guiding a part of the scanned belt-shaped laser beam 7 to the second light receiving element 11 in accordance with the scan angle. As a result, the scan angle of the laser beam 7 can be accurately detected based on the position of the received pixel 14 in the pixel 14 of the second light receiving element 11.

図４は、レーザレーダシステム１の電気的構成を示すブロック図である。この図４に示すように、レーザレーダシステム１は、発光部５と、受光部６と、距離算出部２０と、制御部２１とを備えている。発光部５は、発光素子８と、ＭＥＭＳスキャナ９と、発光素子８及びＭＥＭＳスキャナ９を駆動する駆動回路２２とを有する。受光部６は、第１受光素子１０と、第２受光素子１１とを有する。 FIG. 4 is a block diagram showing an electrical configuration of the laser radar system 1. As shown in FIG. 4, the laser radar system 1 includes a light emitting unit 5, a light receiving unit 6, a distance calculating unit 20, and a control unit 21. The light emitting unit 5 includes a light emitting element 8, a MEMS scanner 9, and a drive circuit 22 that drives the light emitting element 8 and the MEMS scanner 9. The light receiving unit 6 includes a first light receiving element 10 and a second light receiving element 11.

距離算出部２０は、駆動回路２２から出力される発光開始信号と、第１受光素子１０から出力される受光信号とを入力し、発光開始信号を入力した時刻（発光タイミング）と受光信号を入力した時刻（受光タイミング）とに基づいて物体までの距離を算出し、算出した距離検出情報を制御部２１へ送信する。 The distance calculation unit 20 inputs the light emission start signal output from the drive circuit 22 and the light reception signal output from the first light receiving element 10, and inputs the time (light emission timing) when the light emission start signal is input and the light reception signal. The distance to the object is calculated based on the received time (light reception timing), and the calculated distance detection information is transmitted to the control unit 21.

制御部２１は、レーザレーダシステム１全体を制御する機能を有しており、発光素子８を発光させる制御信号を駆動回路２２へ出力すると共に、第２受光素子１１の全ての画素１４をオン（受光可能状態に）する制御信号を第２受光素子１１へ出力する。そして、制御部２１は、第２受光素子１１から出力される受光信号、第１受光素子１０から出力される受光信号、距離算出部２０から出力される距離検出情報を受信する。尚、制御部２１は、検出した距離検出情報を外部へ通信手段等（図示しない）を介して送信する機能を有する。 The control unit 21 has a function of controlling the entire laser radar system 1, outputs a control signal for causing the light emitting element 8 to emit light to the drive circuit 22, and turns on all the pixels 14 of the second light receiving element 11 ( A control signal for enabling light reception is output to the second light receiving element 11. The control unit 21 receives the light reception signal output from the second light receiving element 11, the light reception signal output from the first light receiving element 10, and the distance detection information output from the distance calculation unit 20. The control unit 21 has a function of transmitting the detected distance detection information to the outside via a communication unit or the like (not shown).

図５は、レーザレーダシステム１（制御部２１）の制御の内容を示すフローチャートである。まず、図５のステップＳ１０では、発光素子８を駆動して帯状ビームのレーザ光７を発光させ、ＭＥＭＳスキャナ９へ照射する。このとき、同時に第２受光素子１１の全画素１４をオン（受光可能状態に）する。そして、ＭＥＭＳスキャナ９は、発光素子８から入射した帯状ビームのレーザ光７を反射し且つスキャンさせる。スキャンされたレーザ光７は、物体に照射されると共に、レーザ光７の上端部は、光路１５に導かれて受光レンズ１２を通り、第２受光素子１１に照射される。 FIG. 5 is a flowchart showing the contents of control of the laser radar system 1 (control unit 21). First, in step S10 in FIG. 5, the light emitting element 8 is driven to emit a laser beam 7 of a belt-like beam and irradiate the MEMS scanner 9. At this time, all the pixels 14 of the second light receiving element 11 are simultaneously turned on (light reception enabled). The MEMS scanner 9 reflects and scans the strip-shaped laser beam 7 incident from the light emitting element 8. The scanned laser light 7 is irradiated on the object, and the upper end portion of the laser light 7 is guided to the optical path 15, passes through the light receiving lens 12, and is irradiated on the second light receiving element 11.

続いて、ステップＳ２０へ進み、第２受光素子１１の画素１４の中のレーザ光７が照射された画素１４（即ち、レーザ光７のスキャン角度に対応する画素１４）が受光する。そして、ステップＳ３０へ進み、第２受光素子１１の上記受光した画素１４に対応する第１受光素子１０の１列分の画素１３がオン（受光可能状態に）される。即ち、第１受光素子１０の２次元アレイ状の画素１３の中の、レーザ光７のスキャン角度に対応する１列分の画素１３がオンされる。 Then, it progresses to step S20 and the pixel 14 (namely, pixel 14 corresponding to the scanning angle of the laser beam 7) irradiated with the laser beam 7 in the pixel 14 of the 2nd light receiving element 11 receives light. Then, the process proceeds to step S30, and the pixels 13 for one column of the first light receiving elements 10 corresponding to the received pixels 14 of the second light receiving element 11 are turned on (in a light receiving enabled state). That is, one row of pixels 13 corresponding to the scan angle of the laser light 7 in the two-dimensional array of pixels 13 of the first light receiving element 10 is turned on.

次いで、ステップＳ４０へ進み、物体に向けて照射されたレーザ光７のうちの、物体で反射された反射光を第１受光素子１０の上記オンされた１列分の画素１３で受光する。続いて、ステップＳ５０へ進み、距離算出部２０は、発光素子８の発光開始タイミング（駆動回路２２からの発光開始信号の入力時点）と、第１受光素子１０の受光タイミング（第１受光素子１０からの受光信号の入力時点）とに基づいて物体までの距離を算出する。 Next, the process proceeds to step S <b> 40, and the reflected light reflected by the object among the laser light 7 irradiated toward the object is received by the pixels 13 corresponding to the turned on one row of the first light receiving element 10. Subsequently, the process proceeds to step S50, where the distance calculation unit 20 starts the light emission start timing of the light emitting element 8 (when the light emission start signal is input from the drive circuit 22) and the light reception timing of the first light receiving element 10 (first light receiving element 10). The distance to the object is calculated on the basis of the received light reception signal from (1).

そして、ステップＳ６０へ進み、距離の検出制御が終了したか否かを判断する。本実施形態の場合、例えばレーザ光７のスキャン１回分の検出制御が完了したとき（即ち、第２受光素子１１のｂ個の画素１４が全て受光動作した場合（第１受光素子１０のｂ列分の画素１３が全てオンされて受光動作した場合））に、距離検出制御の終了と判断している。上記ステップＳ６０において、検出終了が判断されないときには（「ＮＯ」）、ステップＳ１０へ戻り、距離の検出制御を繰り返す。また、ステップＳ６０にて、検出終了が判断されると（「ＹＥＳ」）、検出制御を終了する。 Then, the process proceeds to step S60, and it is determined whether or not the distance detection control is finished. In the case of the present embodiment, for example, when the detection control for one scan of the laser beam 7 is completed (that is, when all the b pixels 14 of the second light receiving element 11 perform a light receiving operation (b columns of the first light receiving element 10). When all the pixels 13 are turned on and a light receiving operation is performed)), it is determined that the distance detection control is finished. If the end of detection is not determined in step S60 ("NO"), the process returns to step S10 and the distance detection control is repeated. If it is determined in step S60 that the detection is finished ("YES"), the detection control is finished.

このような構成の本実施形態においては、発光素子８から発光された帯状ビームのレーザ光７を、ＭＥＭＳスキャナ９によってスキャンさせて物体へ照射する構成において、光路１５により、スキャンされた帯状ビームのレーザ光７の一部をスキャン角度に応じて第２受光素子２２へ導き、そして、物体からの反射光を受光する２次元アレイ状の第１受光素子の中のオンする受光領域を、第２受光素子２２によって決定するように構成した。この構成によれば、レーザ光７のスキャン角度に応じて第１受光素子の中のオンする受光領域を決定できるので、第１受光素子の中のオンする受光領域の大きさを、レーザ光７のスキャン角度に正確に対応させて小さく設定することができる。この結果、同時処理が必要な受光素子（画素）の個数を必要最小限とできることから、配線量を減らすことができ、開口率の低下を防止することができる。 In the present embodiment having such a configuration, the band-shaped laser beam 7 emitted from the light-emitting element 8 is scanned by the MEMS scanner 9 to irradiate the object. A part of the laser beam 7 is guided to the second light receiving element 22 in accordance with the scan angle, and the light receiving area to be turned on in the first light receiving element in the two-dimensional array that receives the reflected light from the object is set to the second light receiving area. The light receiving element 22 is determined. According to this configuration, since the light receiving area to be turned on in the first light receiving element can be determined in accordance with the scan angle of the laser light 7, the size of the light receiving area to be turned on in the first light receiving element can be determined. It is possible to set a small value corresponding to the scan angle accurately. As a result, the number of light receiving elements (pixels) that need to be simultaneously processed can be minimized, so that the amount of wiring can be reduced and a reduction in aperture ratio can be prevented.

また、本実施形態では、第２受光素子１１が第１受光素子１０の中の画素１３をオンする受光領域を決定する機能を、半導体チップ上に設けたハードウエア回路で実現するように構成したので、レーザ光７のスキャン角度に応じて第１受光素子の中の受光領域をタイムラグなし且つピンポイントでオンすることができる。 In the present embodiment, the second light receiving element 11 is configured to realize a function of determining a light receiving region for turning on the pixel 13 in the first light receiving element 10 by a hardware circuit provided on the semiconductor chip. Therefore, the light receiving area in the first light receiving element can be turned on without a time lag and in a pinpoint manner according to the scan angle of the laser beam 7.

図６及び図７は、本発明の第２実施形態を示すものである。尚、第１実施形態と同一構成には、同一符号を付している。この第２実施形態では、第２受光素子１１の前方に遮光板２３を設け、光路１５に代わる光路２４により導かれたレーザ光７以外の光が第２受光素子１１へ入射しないように構成した。 6 and 7 show a second embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the same structure as 1st Embodiment. In the second embodiment, a light shielding plate 23 is provided in front of the second light receiving element 11 so that light other than the laser beam 7 guided by the optical path 24 instead of the optical path 15 does not enter the second light receiving element 11. .

具体的には、図６に示すように、第２受光素子１１を第１受光素子１０の下方に設けた。そして、仕切板１７の上面における貫通孔１７ａの図６中左端部の開口縁部と、第１受光素子１０と第２受光素子１１との間の部位とに斜めに架け渡すように、遮光板２３を配設している。光路２４は、第１のプリズム１６と、第２のプリズム１８と、第１のプリズム１６のＭＥＭＳスキャナ９側に設けられたスリッド２５とを備えている。 Specifically, as shown in FIG. 6, the second light receiving element 11 is provided below the first light receiving element 10. Then, the light shielding plate is obliquely bridged between the opening edge at the left end in FIG. 6 of the through hole 17a on the upper surface of the partition plate 17 and the portion between the first light receiving element 10 and the second light receiving element 11. 23 is disposed. The optical path 24 includes a first prism 16, a second prism 18, and a slit 25 provided on the MEMS scanner 9 side of the first prism 16.

スリッド２５は、帯状ビームのレーザ光７の上端部（一部）のビームスポットの大きさを後述するように調整する機能を有する。図７に示すように、スリッド２５は、スキャン角度全範囲のレーザ光７が入射される位置に配置されている。そして、スリッド２５は、レーザ光７のビームスポットの幅寸法（例えば３ｍｍ程度）を、例えば４０μｍ程度に細く絞る調整機能を有する。スリッド２５により調整されたレーザ光７の上端部が第１のプリズム１６に入射され、第１のプリズム１６から第２のプリズム１８へ向けて出射される。第２のプリズム１８に入射されたレーザ光７は、第２のプリズム１８から第２受光素子１１へ向けて出射される。この場合、スリッド２５の調整作用と光路２４によって、レーザ光７が第２受光素子１１へ照射されたとき、照射スポットの大きさ（面積）は、第２受光素子１１の１個の画素１４の大きさ（面積）とほぼ等しくなるように構成されている。即ち、スリッド２５は、第２受光素子１１へ照射されるレーザ光７のビームスポットの面積が第２受光素子１１の画素１４の面積とほぼ一致するように調整する開口幅を有する。 The slide 25 has a function of adjusting the size of the beam spot at the upper end portion (a part) of the laser beam 7 of the belt-like beam as will be described later. As shown in FIG. 7, the slide 25 is disposed at a position where the laser beam 7 in the entire scan angle range is incident. The slit 25 has an adjustment function of narrowing the width dimension (for example, about 3 mm) of the beam spot of the laser light 7 to, for example, about 40 μm. The upper end portion of the laser light 7 adjusted by the slide 25 is incident on the first prism 16 and is emitted from the first prism 16 toward the second prism 18. The laser beam 7 incident on the second prism 18 is emitted from the second prism 18 toward the second light receiving element 11. In this case, when the laser beam 7 is irradiated onto the second light receiving element 11 by the adjusting action of the slide 25 and the optical path 24, the size (area) of the irradiation spot is the same as that of one pixel 14 of the second light receiving element 11. It is comprised so that it may become substantially equal to a magnitude | size (area). That is, the slit 25 has an opening width that adjusts the area of the beam spot of the laser light 7 irradiated to the second light receiving element 11 to substantially match the area of the pixel 14 of the second light receiving element 11.

尚、上述した以外の第２実施形態の構成は、第１実施形態の構成と同じ構成となっている。従って、第２実施形態においても、第１実施形態とほぼ同じ作用効果を得ることができる。特に、第２実施形態によれば、遮光板２３によって光路２４により導かれたレーザ光７以外の光が第２受光素子１１へ入射しないように構成したので、第２受光素子１１が外乱光により誤動作することを確実に防止できる。 The configurations of the second embodiment other than those described above are the same as the configurations of the first embodiment. Therefore, in the second embodiment, substantially the same operational effects as in the first embodiment can be obtained. In particular, according to the second embodiment, since the light other than the laser light 7 guided by the light path 24 by the light shielding plate 23 is not incident on the second light receiving element 11, the second light receiving element 11 is caused by disturbance light. It is possible to reliably prevent malfunction.

図８ないし図９は、本発明の第３実施形態を示すものである。尚、第２実施形態と同一構成には、同一符号を付している。この第３実施形態では、スリッド２５を配設しないようにすると共に、第２のプリズム１８の代わりに凹面鏡２６を設けた。 8 to 9 show a third embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the same structure as 2nd Embodiment. In the third embodiment, the slit 25 is not provided, and the concave mirror 26 is provided instead of the second prism 18.

第３実施形態においては、レーザ光７の上端部が第１のプリズム１６に入射され、第１のプリズム１６から凹面鏡２６へ向けて出射される。凹面鏡２６は、第１のプリズム１６から出射されたレーザ光７のスキャン角度全範囲のレーザ光７が入射される位置に配置されていると共に、反射光が集光される曲率の反射面を持ち、更に、集光された反射光が第２受光素子１１へ照射される設置角度で配置されている。 In the third embodiment, the upper end portion of the laser beam 7 is incident on the first prism 16 and is emitted from the first prism 16 toward the concave mirror 26. The concave mirror 26 is disposed at a position where the laser beam 7 of the entire scan angle range of the laser beam 7 emitted from the first prism 16 is incident, and has a reflecting surface with a curvature for collecting the reflected light. Furthermore, it is arranged at an installation angle at which the collected reflected light is irradiated to the second light receiving element 11.

この場合、凹面鏡２６の集光作用によって、レーザ光７が第２受光素子１１へ照射されたとき、照射スポットの大きさ（面積）は、第２受光素子１１の１個の画素１４の大きさ（面積）とほぼ等しくなるように構成されている。 In this case, when the laser beam 7 is irradiated onto the second light receiving element 11 by the condensing action of the concave mirror 26, the size (area) of the irradiation spot is the size of one pixel 14 of the second light receiving element 11. It is configured to be approximately equal to (area).

尚、上述した以外の第３実施形態の構成は、第２実施形態の構成と同じ構成となっている。従って、第３実施形態においても、第２実施形態とほぼ同じ作用効果を得ることができる。特に、第３実施形態によれば、第２のプリズム１８とスリッド２５の代わりに凹面鏡２６を設ける構成としたので、部品点数を少なくすることができる。 The configuration of the third embodiment other than that described above is the same as the configuration of the second embodiment. Therefore, in the third embodiment, substantially the same operational effects as in the second embodiment can be obtained. In particular, according to the third embodiment, since the concave mirror 26 is provided instead of the second prism 18 and the slide 25, the number of parts can be reduced.

図１０ないし図１２は、本発明の第４実施形態を示すものである。尚、第３実施形態と同一構成には、同一符号を付している。この第４実施形態では、第１のプリズム１６及び凹面鏡２６の代わりに光ファイバ２７を設けた。 10 to 12 show a fourth embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the same structure as 3rd Embodiment. In the fourth embodiment, an optical fiber 27 is provided in place of the first prism 16 and the concave mirror 26.

第４実施形態においては、レーザ光７の上端部が光ファイバ２７の一端部２７ａに入射され、光ファイバ２７の他端部２７ｂから出射されたレーザ光７が第２受光素子１１へ照射される構成となっている。光ファイバ２７は、一端部２７ａ側の先端がスキャン角度全範囲のレーザ光７が入射される位置（ＭＥＭＳスキャナ９に近い位置）に配置されていると共に、他端部２７ｂ側の先端は出射光が第２受光素子１１へ照射される位置に配置されている。 In the fourth embodiment, the upper end portion of the laser beam 7 is incident on one end portion 27 a of the optical fiber 27, and the second light receiving element 11 is irradiated with the laser beam 7 emitted from the other end portion 27 b of the optical fiber 27. It has a configuration. The tip of the optical fiber 27 is disposed at a position where the laser beam 7 having a full scan angle range is incident (position close to the MEMS scanner 9) and the distal end of the other end 27b is emitted light. Is arranged at a position where the second light receiving element 11 is irradiated.

上記光ファイバ２７は、図１１に示すように、レーザ光７の入射角度が保存される特性、即ち、光ファイバ２７の一端部へのレーザ光７の入射角度θ１と、光ファイバ２７の他端部から出射されたレーザ光７の出射角度θ２が等しいという特性を有する。尚、光ファイバ２７の他端部から出射されたレーザ光７は、図１２に示すように、入射角度が保存された（即ち、出射角度θ２＝入射角度θ１）同心円状のレーザ光７である。この場合、図１２に示すように、第２受光素子１１には、同心円状のレーザ光７が照射されるので、第２受光素子１１の左右２個の画素１４が受光状態となり、一方（例えば右または左）の画素１４の位置が入射角度＋θ１に対応し、他方（例えば左または右）の画素１４の位置が入射角度−θ１に対応する。図１２において、外側の大きな円状のレーザ光７は、例えば±３０ｄｅｇのレーザ光７である。内側の円状のレーザ光７は、例えば±１５ｄｅｇのレーザ光７である。中心のスポット状のレーザ光７は、０ｄｅｇのレーザ光７である。 As shown in FIG. 11, the optical fiber 27 has a characteristic that the incident angle of the laser beam 7 is preserved, that is, the incident angle θ1 of the laser beam 7 to one end of the optical fiber 27 and the other end of the optical fiber 27. The laser beam 7 emitted from the portion has the same emission angle θ2. As shown in FIG. 12, the laser beam 7 emitted from the other end of the optical fiber 27 is a concentric laser beam 7 in which the incident angle is preserved (that is, the emission angle θ2 = incident angle θ1). . In this case, as shown in FIG. 12, since the concentric laser beam 7 is irradiated to the second light receiving element 11, the two left and right pixels 14 of the second light receiving element 11 are in a light receiving state, and one (for example, The position of the right or left pixel 14 corresponds to the incident angle + θ1, and the position of the other (for example, left or right) pixel 14 corresponds to the incident angle −θ1. In FIG. 12, the outer large circular laser beam 7 is, for example, a laser beam 7 of ± 30 deg. The inner circular laser beam 7 is, for example, ± 15 deg laser beam 7. The central spot-shaped laser beam 7 is a 0-deg laser beam 7.

尚、入射角度θ１が「＋」であるか「−」であるかは、ＭＥＭＳスキャナ９の駆動電圧に基づいて判定することができる。また、光ファイバ２７から出射された同心円状のレーザ光７が第２受光素子１１へ照射されたとき、照射スポットの大きさ（面積）は、第２受光素子１１の左右２個の画素１４（尚、入射角度が０度のときは１個の画素１４）を受光状態とする程度の大きさ（面積）となるように、光ファイバ２７へ入射されるレーザ光７の光量が調整される構成となっている。 Whether the incident angle θ1 is “+” or “−” can be determined based on the drive voltage of the MEMS scanner 9. Further, when the concentric laser beam 7 emitted from the optical fiber 27 is irradiated onto the second light receiving element 11, the size (area) of the irradiation spot is set to the two left and right pixels 14 ( In addition, when the incident angle is 0 degree, the light quantity of the laser light 7 incident on the optical fiber 27 is adjusted so that the size (area) is such that one pixel 14) is in a light receiving state. It has become.

尚、上述した以外の第４実施形態の構成は、第３実施形態の構成と同じ構成となっている。従って、第４実施形態においても、第３実施形態とほぼ同じ作用効果を得ることができる。特に、第４実施形態によれば、第１のプリズム１６及び凹面鏡２６の代わりに光ファイバ２７を設ける構成としたので、部品点数をより一層少なくすることができる。 The configurations of the fourth embodiment other than those described above are the same as the configurations of the third embodiment. Therefore, in the fourth embodiment, substantially the same operational effects as in the third embodiment can be obtained. In particular, according to the fourth embodiment, since the optical fiber 27 is provided in place of the first prism 16 and the concave mirror 26, the number of parts can be further reduced.

図１３は、本発明の第５実施形態を示すものである。尚、第１実施形態と同一構成には、同一符号を付している。第１実施形態では、第２受光素子１１が第１受光素子１０の中の画素１３をオンする受光領域を決定する機能を、ハードウエア回路で実現するように構成したが、これに代えて、第５実施形態では、第２受光素子１１が第１受光素子１０の中の画素１３をオンする受光領域を決定する機能をソフト的に実現する。 FIG. 13 shows a fifth embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the same structure as 1st Embodiment. In the first embodiment, the second light receiving element 11 is configured to realize the function of determining the light receiving region for turning on the pixel 13 in the first light receiving element 10 with a hardware circuit. In the fifth embodiment, the second light receiving element 11 realizes in software the function of determining the light receiving region where the pixel 13 in the first light receiving element 10 is turned on.

第５実施形態においては、図１３に示すように、制御部２１内に、スキャン角度判定部２８を設けた。このスキャン角度判定部２８は、第２受光素子１１からの受光信号を入力し、第２受光素子１１のｂ個の画素１４の中の、受光した画素１４の位置によってレーザ光７のスキャン角度を判定する。そして、スキャン角度判定部２８は、判定したスキャン角度に基づいて、例えば左からｎ番目の画素１４が受光したときには、第１受光素子１０の左からｎ列目の１列分（ａ個）の画素１３をオン（受光可能状態に）する制御信号を第１受光素子１０へ出力するように構成されている。 In the fifth embodiment, as shown in FIG. 13, a scan angle determination unit 28 is provided in the control unit 21. The scan angle determination unit 28 receives a light reception signal from the second light receiving element 11, and determines the scan angle of the laser light 7 according to the position of the received pixel 14 among the b pixels 14 of the second light receiving element 11. judge. Then, based on the determined scan angle, for example, when the nth pixel 14 from the left receives light, the scan angle determination unit 28 corresponds to one column (a) of the nth column from the left of the first light receiving element 10. A control signal for turning on the pixel 13 (in a state where light can be received) is output to the first light receiving element 10.

尚、上述した以外の第５実施形態の構成は、第１実施形態の構成と同じ構成となっている。従って、第５実施形態においても、第１実施形態とほぼ同じ作用効果を得ることができる。 The configurations of the fifth embodiment other than those described above are the same as the configurations of the first embodiment. Therefore, in the fifth embodiment, substantially the same operational effects as in the first embodiment can be obtained.

図１４は、本発明の第６実施形態を示すものである。尚、第１実施形態及び第２実施形態と同一構成には、同一符号を付している。第１実施形態では、第１受光素子１０及び第２受光素子１１を同一平面に並べて配設したが、これに代えて、第６実施形態では、第２受光素子２９を第１受光素子１０の裏面側に配設するように構成した。 FIG. 14 shows a sixth embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the same structure as 1st Embodiment and 2nd Embodiment. In the first embodiment, the first light receiving element 10 and the second light receiving element 11 are arranged side by side on the same plane. Instead, in the sixth embodiment, the second light receiving element 29 is replaced by the first light receiving element 10. It comprised so that it might arrange | position on the back side.

具体的には、下部収容室３内において、スリッド２５によって調整されたレーザ光７の上端部を、第２受光素子２９に照射させるように構成した。即ち、受光部６の後方に配置された発光部５から照射されたレーザ光７の一部が第２受光素子２９へ入射されるように受光部６と発光部５の位置関係が構成されている。この場合、スリッド２５の調整作用によって、レーザ光７が第２受光素子２９へ照射されたとき、照射スポットの大きさ（面積）は、第２受光素子２９の１個の画素１４の大きさ（面積）とほぼ等しくなるように構成されている。また、第２受光素子１１のｂ個の画素１４の位置と、第２受光素子１１のｂ列の画素１３の位置とが裏表で一致するように、第２受光素子２９及び第２受光素子１１が配設されている。更に、第２受光素子１１のｂ個の画素１４のうちの例えば左からｎ番目の画素１４がレーザ光７の一部（後述する）を受光すると、第１受光素子１０の左からｎ列目の１列分（ａ個）の画素１３を直接オン（受光可能状態に）することが可能なハードウエア回路が形成されている。 Specifically, the second light receiving element 29 is configured to irradiate the upper end portion of the laser light 7 adjusted by the slide 25 in the lower housing chamber 3. That is, the positional relationship between the light receiving unit 6 and the light emitting unit 5 is configured so that a part of the laser light 7 emitted from the light emitting unit 5 disposed behind the light receiving unit 6 is incident on the second light receiving element 29. Yes. In this case, when the laser light 7 is irradiated onto the second light receiving element 29 by the adjusting action of the slide 25, the size (area) of the irradiation spot is the size of one pixel 14 of the second light receiving element 29 ( (Area). In addition, the second light receiving element 29 and the second light receiving element 11 are arranged so that the positions of the b pixels 14 of the second light receiving element 11 and the positions of the pixels 13 in the b column of the second light receiving element 11 coincide with each other. Is arranged. Furthermore, for example, when the nth pixel 14 from the left of the b pixels 14 of the second light receiving element 11 receives a part of the laser light 7 (described later), the nth column from the left of the first light receiving element 10. A hardware circuit capable of directly turning on (a light receiving state) one row (a) of pixels 13 is formed.

尚、上述した以外の第６実施形態の構成は、第１実施形態及び第２実施形態の構成と同じ構成となっている。従って、第６実施形態においても、第１実施形態及び第２実施形態とほぼ同じ作用効果を得ることができる。 The configurations of the sixth embodiment other than those described above are the same as the configurations of the first embodiment and the second embodiment. Therefore, in the sixth embodiment, it is possible to obtain substantially the same operational effects as those in the first embodiment and the second embodiment.

図１５は、本発明の第７実施形態を示すものである。尚、第６実施形態と同一構成には、同一符号を付している。第７実施形態では、スリッド２５に代えて、レンズ３０を配設するように構成した。この構成では、レーザ光７の上端部を、レンズ３０を介して集光させて第２受光素子２９に照射させるように構成した。この場合、レンズ３０の集光作用によって、レーザ光７が第２受光素子２９へ照射されたとき、照射スポットの大きさ（面積）は、第２受光素子２９の１個の画素１４の大きさ（面積）とほぼ等しくなるように構成されている。 FIG. 15 shows a seventh embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the same structure as 6th Embodiment. In the seventh embodiment, the lens 30 is arranged in place of the slide 25. In this configuration, the upper end portion of the laser beam 7 is condensed through the lens 30 and irradiated to the second light receiving element 29. In this case, when the laser light 7 is irradiated onto the second light receiving element 29 by the condensing action of the lens 30, the size (area) of the irradiation spot is the size of one pixel 14 of the second light receiving element 29. It is configured to be approximately equal to (area).

尚、上述した以外の第７実施形態の構成は、第６実施形態の構成と同じ構成となっている。従って、第７実施形態においても、第６実施形態とほぼ同じ作用効果を得ることができる。 The configurations of the seventh embodiment other than those described above are the same as the configurations of the sixth embodiment. Therefore, in the seventh embodiment, substantially the same operational effects as in the sixth embodiment can be obtained.

また、第６実施形態及び第７実施形態では、第１受光素子１０及び第２受光素子２９を別体の半導体チップで構成したが、これに代えて、１つの半導体チップの表裏に第１受光素子１０及び第２受光素子２９を形成するように構成しても良い。このように構成した場合、下部収容室３と上部収容室４を仕切る仕切板１７に貫通孔を形成し、上記１つの半導体チップの第２受光素子２９を形成した部分を、仕切板１７の上記貫通孔を通して下部収容室３内へ突出させるように構成すれば良い。 In the sixth embodiment and the seventh embodiment, the first light receiving element 10 and the second light receiving element 29 are configured as separate semiconductor chips. Instead, the first light receiving elements are arranged on the front and back sides of one semiconductor chip. The element 10 and the second light receiving element 29 may be formed. When configured in this manner, a through hole is formed in the partition plate 17 that partitions the lower storage chamber 3 and the upper storage chamber 4, and the portion of the one semiconductor chip in which the second light receiving element 29 is formed is the above-described portion of the partition plate 17. What is necessary is just to comprise so that it may protrude in the lower accommodating chamber 3 through a through-hole.

図面中、１はレーザレーダシステム、２は本体、３は下部収容室、４は上部収容室、５は発光部、６は受光部、７はレーザ光、８は発光素子、９はＭＥＭＳスキャナ、１０は第１受光素子、１１は第２受光素子、１５は光路、１６は第１のプリズム、１８は第２のプリズム、２０は距離算出部、２３は遮光板、２４は光路、２５はスリッド、２６は凹面鏡、２７は光ファイバ、２８はスキャン角度判定部、２９は第２受光素子である。 In the drawings, 1 is a laser radar system, 2 is a main body, 3 is a lower accommodating chamber, 4 is an upper accommodating chamber, 5 is a light emitting portion, 6 is a light receiving portion, 7 is a laser beam, 8 is a light emitting element, 9 is a MEMS scanner, 10 is a first light receiving element, 11 is a second light receiving element, 15 is an optical path, 16 is a first prism, 18 is a second prism, 20 is a distance calculation unit, 23 is a light shielding plate, 24 is an optical path, and 25 is a slide. , 26 is a concave mirror, 27 is an optical fiber, 28 is a scan angle determination unit, and 29 is a second light receiving element.

Claims

A light-emitting element (8) that emits a laser beam (7) of a belt-like beam, and a light-emitting unit (5) having a scanner (9) that reflects and scans the laser light (7) to irradiate an object;
A first light receiving element (10) in a two-dimensional array that receives reflected light from the object, and a second light receiving element (11) that determines a light receiving area to be turned on in the first light receiving element (10). A light receiving portion (6) having,
An optical path (15) for guiding a part of the laser beam (7) of the scanned belt-like beam to the second light receiving element (11) according to a scan angle;
A distance calculation unit (20) that calculates a distance to the object based on a light emission timing of the light emitting element (8) and a light reception timing of the first light receiving element (10);
A laser radar system comprising:

In the optical path (15), the end of the laser beam (7) of the scanned belt-shaped beam is incident, and the incident laser beam (7) is emitted toward the second light receiving element (11). The laser radar system according to claim 1, further comprising a prism.

The prism is disposed at a position where the laser beam (7) in the entire scan angle range of the scanned laser beam (7) is incident, and emitted light is irradiated to the second light receiving element (11). The laser radar system according to claim 2, wherein the laser radar system is arranged at an angle.

A light receiving lens (12) provided in front of the light receiving section (5);
The laser light emitted from the prism is configured so as to pass through the light receiving lens (12) and be condensed and then irradiated to the second light receiving element (11). The laser radar system according to 2 or 3.

In the optical path (15), a slit (25) for adjusting a part of a beam spot of the laser beam (7) of the belt-shaped beam and a part of the laser beam (7) adjusted by the slit (25) are incident. The laser radar system according to claim 1, further comprising a prism that emits the incident laser beam (7) toward the second light receiving element (11).

The slit (25) is arranged so that the area of the beam spot of the laser beam (7) irradiated to the second light receiving element (11) matches the area of the pixel (14) of the second light receiving element (11). 6. The laser radar system according to claim 5, wherein the laser radar system has an opening width to be adjusted and is disposed at a position where the laser beam (7) in the entire scan angle range is incident.

The prism is arranged at a position where the laser beam having a full scan angle range emitted from the slide (25) is incident, and arranged at an angle at which the emitted light is irradiated onto the second light receiving element (11). 6. The laser radar system according to claim 5, wherein the laser radar system is provided.

The optical path (24) includes a prism (16) on which an end portion of the laser beam (7) of the scanned belt-shaped beam is incident, and a laser beam (7) emitted from the prism (16). The laser radar system according to claim 1, further comprising a concave mirror (26) that reflects toward the light receiving element (11).

The prism (16) is disposed at a position where the laser beam (7) of the entire scan angle range is incident, and is disposed at an angle at which the emitted light is irradiated onto the concave mirror (26). The laser radar system according to claim 8.

The concave mirror (26) is arranged at a position where the laser beam (7) of the entire scan angle range of the laser beam (7) emitted from the prism (16) is incident and the reflected light is condensed. 9. The laser radar system according to claim 8, wherein the laser radar system has a concave reflecting surface with a certain curvature, and is arranged at an angle at which the collected reflected light is irradiated onto the second light receiving element (11).

The optical path (15) guides a part of the laser beam (7) of the scanned belt-like beam to the second light receiving element (11), and has a characteristic that preserves the angle of incident light. 2. The laser radar system according to claim 1, comprising a fiber (27).

The optical fiber (27) has a tip on one end side disposed at a position where a laser beam (7) having a full scan angle range is incident, and the other end side emits light from the second light receiving element (27). The laser radar system according to claim 11, wherein the laser radar system is disposed at a position irradiated to 11).

Based on a voltage applied to the MEMS scanner (9) with respect to a laser beam irradiated from the optical fiber (27) to the second light receiving element (11) and concentrically shaped in accordance with an incident angle. The laser radar system according to claim 1, wherein the laser radar system is configured to determine whether the scan angle is positive or negative.

A light shielding plate that is disposed in front of the second light receiving element (11) and shields light other than the laser light (7) guided by the optical path (24) from entering the second light receiving element (11). The laser radar system according to claim 1, further comprising (23).

The second light receiving element (29) is arranged on the back side of the first light receiving element (10) and is irradiated from the light emitting part (5) arranged behind the light receiving part (6). The positional relationship between the light receiving unit (6) and the light emitting unit (5) is configured so that a part of the laser beam (7) is incident on the second light receiving element (29). The laser radar system according to claim 1.