JP2017059784A - Cup cleaning jig, substrate liquid processing apparatus for cleaning cup using the jig, and cup cleaning method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remove crystals and the like of processing liquid attached to an upper end part of an inner peripheral surface of a cup so as to prevent occurrence of poor processing of a substrate caused by adherence of the crystals to the substrate.SOLUTION: A cup washing jig (49) is used for washing with washing liquid an inner peripheral surface (41) of a cup (36) for receiving processing liquid provided outside a substrate (a wafer W) in a substrate liquid processing device (a substrate processing system 1) for liquid-processing with the processing liquid the substrate (the wafer W), which comprises: a base (50) which is held by a substrate holding body (8) provided in the substrate liquid processing device (the substrate processing system 1) for holding the substrate (the wafer W); and a guide body (51) which extends from a center side of the base (50) toward below the upper side of the inner peripheral surface (41) of the cup (36), and guides the washing liquid toward the upper side of the inner peripheral surface (41) of the cup (36).SELECTED DRAWING: Figure 8

Description

  The present invention relates to a cup cleaning jig used for cleaning an inner peripheral surface of a cup provided for receiving a processing liquid for processing a substrate outside the substrate with a cleaning liquid. The present invention relates to a substrate liquid processing apparatus and a cup cleaning method for cleaning a cup using a tool.

  In the manufacture of semiconductor components and flat panel displays, a substrate liquid processing apparatus is used to perform liquid processing on a substrate such as a semiconductor wafer or a liquid crystal substrate using a processing liquid such as a cleaning liquid or an etching liquid.

  In the substrate liquid processing apparatus, while rotating the substrate while being held by the substrate holder, the processing liquid is supplied to the surface of the substrate. The processing liquid flows on the surface of the substrate by the centrifugal force of the rotating substrate and is shaken off to the outside of the substrate. Thereby, the surface of the substrate is liquid-treated with the treatment liquid. Thereafter, the processing liquid is collected by a cup provided outside the outer periphery of the substrate.

  In this substrate liquid processing apparatus, the processing liquid may crystallize and adhere to the inner peripheral surface of the cup. If the crystal of the processing liquid adhering to the cup is transferred to the substrate, it may cause a processing failure such as pattern collapse of the substrate or generation of particles.

  Therefore, conventionally, in the substrate liquid processing apparatus, the inner peripheral surface of the cup is cleaned using a cup cleaning jig. At that time, in the substrate liquid processing apparatus, the cup cleaning jig is rotated while being held by the substrate holder, and the cleaning liquid is supplied to the cup cleaning jig. Then, the cleaning liquid is guided to the inner peripheral surface of the cup by the cup cleaning jig, and the inner peripheral surface of the cup is cleaned with the cleaning liquid (see, for example, Patent Document 1).

JP 2014-33178 A

  In the conventional substrate liquid processing apparatus, since the processing liquid is supplied in a state where the outer peripheral edge of the substrate is held by the substrate holder, the processing liquid collides with the substrate holder and scatters, and the inner peripheral surface of the cup It was often observed that crystals were attached to the upper end.

  However, in the conventional cup cleaning jig, when the upper end portion of the inner peripheral surface of the cup is to be cleaned, the cleaning liquid for cleaning the cup scatters out of the cup. Therefore, there exists a possibility of contaminating components outside the cup.

  Therefore, in the present invention, a cup cleaning jig used for cleaning the inner peripheral surface of the cup for receiving the processing liquid provided outside the substrate with the cleaning liquid is provided to hold the substrate. A base that is held by the substrate holder, and extends from the center side of the base toward the lower side of the upper part of the inner peripheral surface of the cup, and the cleaning liquid is directed toward the upper part of the inner peripheral surface of the cup. And a guide body for guiding.

  Further, the guide body has an inclined surface formed in a downwardly inclined manner from the center side of the base toward the lower side than the upper end portion of the inner peripheral surface of the cup.

  Further, the guide body has a horizontal flat surface on the outer periphery of the inclined surface.

  Further, the guide body has a step between the inclined surface and the flat surface.

  In addition, the guide body forms a gap with the base and an opening communicating with the base on the center side.

  Further, in the present invention, in the substrate liquid processing apparatus for cleaning the inner peripheral surface of the cup with a cleaning liquid using a cup cleaning jig for receiving the processing liquid for liquid processing the substrate outside the substrate, the cup cleaning A jig for holding a substrate by a substrate holder provided in the substrate liquid processing apparatus to hold the substrate, and a lower side than an upper part of the inner peripheral surface of the cup from the center side of the base And a guide body that guides the cleaning liquid toward the upper part of the inner peripheral surface of the cup, and supplies the cleaning liquid to the upper part of the guide body while rotating the cup cleaning jig. It was to be.

  In addition, the cleaning liquid is supplied to the upper portion of the guide body while rotating the cup cleaning jig so that the cleaning liquid bridges between the inner peripheral surface of the cup and the guide body. I made it.

  In addition, gas was supplied to the upper part of the cup.

  The cup includes a rotating cup that rotates together with the substrate, and a fixed cup that is fixed outside the outer periphery of the rotating cup, and the guide body extends from the center side of the base to the inner periphery of the rotating cup. It extended to the lower side rather than the surface upper part, and decided to guide the said washing | cleaning liquid toward the inner peripheral surface upper part of the said rotary cup.

  The present invention is also a cup cleaning method for cleaning an inner peripheral surface of a cup for receiving a processing solution for processing a substrate outside the substrate with a cleaning solution using a cup cleaning jig, The cleaning jig includes a base that is held by a substrate holder provided in the substrate liquid processing apparatus to hold the substrate, and a lower side than the upper part of the inner peripheral surface of the cup from the center side of the base. A guide body that extends toward the side and guides the cleaning liquid toward the upper part of the inner peripheral surface of the cup, and supplies the cleaning liquid to the upper part of the guide body while rotating the cup cleaning jig Decided to do.

  In this invention, it can prevent that the washing | cleaning liquid which wash | cleans a cup splashes to the outer side of a cup.

The top view which shows a substrate processing system. The side view which shows a board | substrate washing | cleaning apparatus (state which hold | maintained the board | substrate). FIG. The side view which shows a board | substrate cleaning apparatus (state which hold | maintained the jig | tool for cup cleaning). FIG. FIG. The side view which shows a board | substrate washing | cleaning apparatus (state which wash | cleans a cup). FIG. Explanatory drawing which shows the flow of the washing | cleaning liquid at the time of cup washing | cleaning.

  Hereinafter, specific configurations of a substrate cleaning apparatus according to the present invention, a cup cleaning jig used in the substrate cleaning apparatus, and a cup cleaning method using the cup cleaning jig will be described with reference to the drawings. . In the following description, the configuration of the substrate processing system to which the substrate liquid processing apparatus according to the present invention is applied will be described first, then the configuration of the cup cleaning jig will be described, and finally the cup cleaning method will be described.

  FIG. 1 is a diagram showing a schematic configuration of a substrate processing system according to the present embodiment. In the following, in order to clarify the positional relationship, the X axis, the Y axis, and the Z axis that are orthogonal to each other are defined, and the positive direction of the Z axis is the vertically upward direction.

  As shown in FIG. 1, the substrate processing system 1 includes a carry-in / out station 2 and a processing station 3. The carry-in / out station 2 and the processing station 3 are provided adjacent to each other.

  The carry-in / out station 2 includes a carrier placement unit 11 and a transport unit 12. A plurality of carriers C that accommodate a plurality of substrates, in this embodiment a semiconductor wafer (hereinafter referred to as a wafer W) in a horizontal state, are placed on the carrier placement unit 11.

  The transport unit 12 is provided adjacent to the carrier placement unit 11 and includes a substrate transport device 13 and a delivery unit 14 inside. The substrate transfer device 13 includes a wafer holding mechanism that holds the wafer W. Further, the substrate transfer device 13 can move in the horizontal direction and the vertical direction and can turn around the vertical axis, and transfers the wafer W between the carrier C and the delivery unit 14 using the wafer holding mechanism. Do.

  The processing station 3 is provided adjacent to the transfer unit 12. The processing station 3 includes a transport unit 15 and a plurality of processing units 16. The plurality of processing units 16 are provided side by side on the transport unit 15.

  The transport unit 15 includes a substrate transport device 17 inside. The substrate transfer device 17 includes a wafer holding mechanism that holds the wafer W. Further, the substrate transfer device 17 can move in the horizontal direction and the vertical direction and can turn around the vertical axis, and transfers the wafer W between the delivery unit 14 and the processing unit 16 using a wafer holding mechanism. I do.

  The processing unit 16 performs predetermined substrate processing on the wafer W transferred by the substrate transfer device 17.

  Further, the substrate processing system 1 includes a control device 4. The control device 4 is a computer, for example, and includes a control unit 18 and a storage unit 19. The storage unit 19 stores a program for controlling various processes executed in the substrate processing system 1. The control unit 18 controls the operation of the substrate processing system 1 by reading and executing the program stored in the storage unit 19.

  Such a program may be recorded on a computer-readable storage medium, and may be installed in the storage unit 19 of the control device 4 from the storage medium. Examples of the computer-readable storage medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

  In the substrate processing system 1 configured as described above, first, the substrate transfer device 13 of the loading / unloading station 2 takes out the wafer W from the carrier C placed on the carrier placement unit 11 and receives the taken-out wafer W. Place on the transfer section 14. The wafer W placed on the delivery unit 14 is taken out from the delivery unit 14 by the substrate transfer device 17 of the processing station 3 and carried into the processing unit 16.

  The wafer W carried into the processing unit 16 is processed by the processing unit 16, then unloaded from the processing unit 16 by the substrate transfer device 17, and placed on the delivery unit 14. Then, the processed wafer W placed on the delivery unit 14 is returned to the carrier C of the carrier placement unit 11 by the substrate transfer device 13.

  The processing unit 16 provided in the substrate processing system 1 (substrate liquid processing apparatus) includes a substrate holding unit 71, a processing liquid supply unit 72, and a processing liquid recovery unit 73, as shown in FIGS. These are controlled by the control unit 18. Here, the substrate holder 71 rotates while holding the wafer W. The processing liquid supply unit 72 supplies a processing liquid to the wafer W. The processing liquid recovery unit 73 recovers the processing liquid. The control unit 18 controls the entire substrate processing system 1.

  The substrate holding part 71 is rotatably provided with a rotating shaft 6 extending vertically in the center of the inside of the processing chamber 5. A disc-shaped turntable 7 is horizontally attached to the upper end of the rotating shaft 6. Four substrate holders 8 are attached to the outer peripheral edge of the turntable 7 at equal intervals in the circumferential direction. An outer peripheral edge of the wafer W is placed on the inner upper portion of the substrate holder 8. As a result, the wafer W is held by the substrate holder 8.

  The substrate holding unit 71 connects the substrate rotation mechanism 9 and the substrate lifting mechanism 10 to the rotation shaft 6. The substrate rotating mechanism 9 and the substrate lifting mechanism 10 are rotationally controlled and lifted / lowered by the control unit 18.

  The substrate holder 71 holds the wafer W horizontally by the substrate holder 8 of the turntable 7. Further, the substrate holding unit 71 rotates the wafer W held on the turntable 7 by driving the substrate rotating mechanism 9. Further, the substrate holding unit 71 raises and lowers the turntable 7 and the wafer W by driving the substrate lifting mechanism 10.

  The processing liquid supply unit 72 is provided with a guide rail 21 that is horizontally extended in the left and right directions in the processing chamber 5, and an arm 22 that is horizontally extended in the front and rear directions is provided on the guide rail 21 so as to be movable left and right. On the left side of the lower end of the tip of the arm 22, a chemical supply nozzle 23 is attached vertically downward. A chemical liquid supply source 24 is connected to the chemical liquid supply nozzle 23 via a flow rate regulator 25. A pure water supply nozzle 26 is attached vertically downward on the right side of the lower end of the tip of the arm 22. A pure water supply source 27 is connected to the pure water supply nozzle 26 via a flow rate regulator 28. The flow rate is controlled by the flow rate regulators 25 and 28 and the control unit 18.

  Further, the treatment liquid supply unit 72 connects the nozzle moving mechanism 29 to the arm 22. The nozzle moving mechanism 29 is controlled to move by the control unit 18.

  The processing liquid supply unit 72 is provided with a guide rail 30 horizontally extended in the left and right directions in the processing chamber 5, and an arm 31 extended horizontally in the front and rear directions is provided on the guide rail 30 so as to be movable left and right. A gas supply nozzle 32 is attached vertically downward at the lower end of the arm 31. A gas supply source 33 is connected to the gas supply nozzle 32 via a flow rate regulator 34. The flow rate regulator 34 is controlled by the control unit 18.

  Further, the treatment liquid supply unit 72 connects the nozzle moving mechanism 35 to the arm 31. The nozzle moving mechanism 35 is controlled to move by the control unit 18.

  The processing liquid supply unit 72 drives the nozzle moving mechanisms 29 and 35 so that the tips of the arms 22 and 31 (chemical solution supply nozzle 23, pure water supply nozzle 26, gas supply nozzle 32) are moved outward of the wafer W. The wafer is moved between the standby position of the wafer and the discharge position at the center of the wafer W. Further, the processing liquid supply unit 72 uses the flow rate regulators 25, 28, 34 to move the chemical liquid (for example, buffered hydrofluoric acid (for example, buffered hydrofluoric acid) from the chemical liquid supply nozzle 23, the pure water supply nozzle 26, and the gas supply nozzle 32 toward the wafer W. BHF) or the like), pure water, or gas (for example, inert gas such as nitrogen gas) is discharged. When liquid processing the wafer W, the chemical liquid functions as a processing liquid for liquid processing the wafer W, and the pure water functions as a rinsing liquid after the wafer W is liquid processed. Further, when cleaning the cup 36 to be described later, pure water functions as a cleaning liquid for cleaning the cup 36.

  In the processing liquid recovery unit 73, the cup 36 is disposed so as to surround the wafer W outside the outer periphery of the wafer W held by the substrate holder 8. The cup 36 includes a rotating cup 37 that rotates together with the turntable 7, and a fixed cup 38 that is fixed to the processing chamber 5 outside the rotating cup 37 (not rotated together with the turntable 7) (see FIG. 6). Here, the cup 36 is configured to include the rotating cup 37 and the fixed cup 38, but the present invention is not limited to this, and the cup 36 may be configured only by the fixed cup 38.

  The rotating cup 37 has an outer rotating cup 37a and an inner rotating cup 37b. The outer rotary cup 37 a and the inner rotary cup 37 b are attached to the upper part of the outer peripheral edge of the turntable 7 via a column 39. Four support columns 39 are provided at equal intervals in the circumferential direction. A gap 40 is formed between the upper surface of the turntable 7 and the lower surface of the rotary cup 37. Since the rotating cup 37 rotates together with the wafer W, the relative speed between the rotating cup 37 and the wafer W becomes 0, and the dispersion of the processing liquid can be suppressed.

  The outer rotating cup 37a has an inner peripheral surface 41 that is a convex arc surface facing outward, and the inner peripheral surface is used for processing liquid (chemical solution or pure water) shaken off from the wafer W while rotating together with the wafer W. At 41, the sheet is discharged from the gap 40 with the turntable 7 toward the fixed cup 38.

  The inner rotary cup 37 b has an outer circumferential surface 48 that is convex toward the outside, and the processing liquid (chemical solution or pure water) shaken off from the surface of the wafer W is moved outward along the outer circumferential surface 48. The processing liquid is prevented from flowing around the back surface of the wafer W and flowing.

  The fixed cup 38 has a bottom 42 attached to the processing chamber 5, and a cup 43 is connected to the bottom 42 via a cup lifting mechanism 44. The cup lifting mechanism 44 is lifted and lowered by the control unit 18. A drain 45 is connected to the bottom 42.

  The fixed cup 38 receives the processing liquid discharged from the rotating cup 37 by the inner peripheral surface 46 and discharges it from the drain 45 to the outside. At that time, the processing liquid may flow backward from between the upper end outer peripheral portion of the rotating cup 37 and the upper end inner peripheral portion of the fixed cup 38. For this purpose, the outer peripheral portion of the upper end of the rotating cup 37 is disposed above the inner peripheral portion of the upper end of the fixed cup 38, and an annular convex portion 47 projecting in a hook shape is formed on the outer peripheral portion of the upper end of the rotating cup 37. Yes. Thereby, even if the processing liquid flows backward along the outer peripheral surface of the rotating cup 37, it can be blocked by the convex portion 47.

  The substrate processing system 1 is configured as described above. As shown in FIG. 2, the substrate processing system 1 is controlled by the control unit 18 according to various programs stored in the storage unit 19 provided in the control unit 18 (computer). Then, the wafer W is processed.

  Next, the configuration of the cup cleaning jig will be described. As shown in FIGS. 4 to 6, the cup cleaning jig 49 is arranged on the disk-shaped base 50 and the outer periphery of the base 50. And a guide body 51.

  The base 50 is held by the substrate holder 8 by placing the outer peripheral edge on the substrate holder 8. The base 50 has an inclined surface 52 that is inclined downward from the central side toward the outer peripheral side at the outer peripheral portion.

  The guide body 51 is attached to the upper periphery of the base 50 via a support column 53. Eight support columns 53 are provided at equal intervals in the circumferential direction. A gap 54 is formed between the upper surface of the base 50 and the lower surface of the guide body 51. A circular opening 55 that communicates with the upper surface of the base 50 is formed on the center side of the guide body 51. On the lower end side of the opening 55, an inclined surface 56 that is inclined downward from the center side toward the outer peripheral side is formed.

  Further, the lower surface 57 of the guide body 51 extends horizontally from the center side of the base 50 (the lower end of the inclined surface 56) toward the middle portion of the inner peripheral surface 41 of the cup 36 (rotating cup 37). In addition, the guide body 51 has an upper surface 58 that extends from the center side of the base 50 (the upper end of the opening 55) in a substantially inclined manner downward from the upper portion of the inner peripheral surface 41 of the cup 36 (rotating cup 37). Yes. More specifically, when the cleaning liquid passes between the upper portion of the inner peripheral surface 41 and the front end portion of the guide body 51, the cleaning liquid is placed on the upper portion of the inner peripheral surface 41 and the front end portion of the guide body 51 by the surface tension of the cleaning liquid. The guide body 51 has a distance (distance) at which the cleaning liquid can maintain a bridged state (see FIG. 9) between the upper portion of the inner peripheral surface 41 and the tip of the guide body 51. Is extended toward the inner peripheral surface 41 of the cup 36.

  On the upper surface 58 of the guide body 51, a horizontal flat surface 59 is formed from the upper end of the opening 55 toward the outer peripheral side. On the outer peripheral side of the flat surface 59, there is formed an inclined surface 60 that is inclined downward from the center side of the base 50 toward the lower side of the upper end portion of the inner peripheral surface 41 of the cup 36 (rotating cup 37). . On the outer peripheral side of the inclined surface 60, a horizontal flat surface 62 is formed through a step 61 that is one step lower than the outer peripheral edge (lower end) of the inclined surface 60. An inclined surface that is inclined downward toward the center may be formed between the upper end portion of the opening 55 and the flat surface 59.

  The cup cleaning jig 49 is configured as described above, and holds the substrate of the substrate processing system 1 in order to clean the inner peripheral surface 41 of the cup 36 (rotating cup 37) of the substrate processing system 1 in particular. The substrate holder 8 of the unit 71 is used by being held and rotated in the same manner as the wafer W.

  Next, a cup cleaning method for cleaning the cup 36 (the rotating cup 37) using the cup cleaning jig 49 in the substrate processing system 1 will be described. In the substrate processing system 1, a cup cleaning method described below is executed in accordance with a program stored in the storage unit 19.

  First, the substrate processing system 1 sets a cup cleaning jig 49 in the substrate holding portion 71 as shown in FIGS. As for the setting of the cup cleaning jig 49, the cup cleaning jig 49 may be automatically placed on the substrate holding unit 71 by the substrate transfer device 17 in the same manner as the wafer W, or manually placed by the operator. Also good.

  Next, as shown in FIGS. 7 and 8, the substrate processing system 1 supplies a cleaning liquid (pure water) to the cup cleaning jig 49. At that time, the substrate processing system 1 supplies gas (nitrogen gas) to the cup 36 (rotary cup 37).

  Specifically, the pure water supply nozzle 26 is disposed above the flat surface 59 of the guide body 51 of the cup cleaning jig 49 by moving the arm 22 by the nozzle moving mechanism 29. Further, the gas supply nozzle 32 is disposed above the upper end surface of the rotary cup 37 by moving the arm 31 by the nozzle moving mechanism 35. Furthermore, the cup cleaning jig 49 is rotated by rotating the turntable 7 at a predetermined rotation speed by the substrate rotating mechanism 9. Thereafter, the gas whose flow rate is controlled to a predetermined flow rate by the flow rate regulator 34 is discharged from the gas supply nozzle 32 toward the upper end surface of the rotary cup 37. Further, pure water whose flow rate is controlled to a predetermined flow rate by the flow rate regulator 28 is discharged from the pure water supply nozzle 26 toward the flat surface 59 of the guide body 51 of the cup cleaning jig 49. Here, the cup cleaning jig 49 is such that pure water as cleaning water is not affected by centrifugal force (the pure water is linear in the radial direction from the center side to the outer periphery side of the cup cleaning jig 49. Rotate at a rotation speed of about

  As shown in FIG. 9, the cleaning liquid discharged from the pure water supply nozzle 26 overflows from the flat surface 59 without being affected by the centrifugal force, and most of the cleaning liquid moves to the outer peripheral side along the flat surface 59 of the guide body 51. Partly flows along the flat surface 59 toward the inner peripheral side (center side).

  The cleaning liquid that has flowed toward the outer peripheral side of the flat surface 59 of the guide body 51 flows while accelerating toward the outer peripheral side along the inclined surface 60, and then decelerates on the flat surface 62 after dropping the step 61. It flows along the flat surface 62 toward the outer peripheral side. Thereafter, the cleaning liquid contacts both the upper portion of the inner peripheral surface 41 and the front end portion of the guide body 51 by the surface tension of the cleaning liquid at the front end portion (outer peripheral portion) of the flat surface 62 of the guide body 51. Then, the cleaning liquid is bridged between the upper portion of the inner peripheral surface 41 and the distal end portion of the guide body 51. Thereafter, the cleaning liquid flows downward along the inner peripheral surface 41. Thereby, the inner peripheral surface 41 (especially upper end part) of the cup 36 (outer side rotation cup 37a) can be wash | cleaned with a washing | cleaning liquid. The bridge is not formed on the entire circumference of the cup 36 (outer peripheral cup 37a), but is formed by a part overflowing from the pure water supply nozzle 26. However, since the cup 36 is rotating, the cup is rotated. The bridge passes through the entire circumference of 36, and the entire circumference of the cup 36 can be washed. Since the gas discharged to the upper end surface of the rotating cup 37 flows toward the inner peripheral side (center side), the cleaning liquid does not flow out from the upper end surface of the rotating cup 37 to the outside.

  The cleaning liquid that flows toward the inner peripheral side of the flat surface 59 of the guide body 51 flows through the opening 55 along the inclined surface 56 toward the lower outer peripheral side, and then passes through the gap 54 to the base 50. It flows toward the outer peripheral side along the upper surface of. Thereafter, the cleaning liquid flows downward along the outer peripheral surface 48 of the inner rotary cup 37b from the upper surface of the base 50. Thereby, the outer peripheral surface 48 of the inner rotating cup 37b can be cleaned with the cleaning liquid. All the cleaning liquid is finally discharged from the gap 45 of the rotating cup 37 to the fixed cup 38 and then discharged from the drain 45 to the outside.

  As described above, in the substrate processing system 1, the inner peripheral surface 41 of the cup 36 (the rotating cup 37) is cleaned with the cleaning liquid. At that time, in the cup cleaning jig 49, the guide body 51 extends from the center side of the base 50 toward the lower side of the upper end portion of the inner peripheral surface 41 of the cup 36 (rotating cup 37). Therefore, the cleaning liquid can be guided toward the upper end portion of the inner peripheral surface 41 of the cup 36 (the rotating cup 37) by the guide body 51. Thereby, when the crystal | crystallization of a process liquid, etc. have adhered to the upper end part of the internal peripheral surface 41 of the cup 36 (rotating cup 37), they can be removed and the transfer to the wafer W is prevented. Occurrence of processing defects on the wafer W can be prevented.

  In particular, in the guide body 51 of the cup cleaning jig 49, an inclination formed in a downwardly inclined manner from the center side of the base 50 toward the lower side than the upper end portion of the inner peripheral surface 41 of the cup 36 (the rotating cup 37). Since the surface 60 is provided, the cleaning liquid can be smoothly supplied (guided) toward the inner peripheral surface 41 of the cup 36 (the rotating cup 37), and the cleaning liquid can be prevented from scattering on the flat surface 59. .

  Further, since the guide body 51 of the cup cleaning jig 49 has the horizontal flat surface 62 on the outer periphery of the inclined surface 60, the speed of the cleaning liquid flowing toward the outer peripheral side can be delayed. As a result, the cleaning liquid stays in the vicinity of the upper end portion of the inner peripheral surface 41 of the cup 36 (rotating cup 37), ensures contact between the cleaning liquid and the upper end portion of the inner peripheral surface 41, and adheres to the inner peripheral surface 41. Crystals of the treatment liquid can be removed satisfactorily. The flat surface 62 may be continuously formed from the lower end of the outer periphery of the inclined surface 60, but in the guide body 51 of the cup cleaning jig 49, a step 61 is formed between the inclined surface 60 and the flat surface 62. doing. Thereby, since the speed of the cleaning liquid flowing toward the outer peripheral side can be further delayed, a speed suitable for forming a bridge of the cleaning liquid between the upper portion of the inner peripheral surface 41 and the distal end portion of the guide body 51 can do.

  Further, in the guide body 51 of the cup cleaning jig 49, the gap 54 is formed between the guide body 51 and the base 50, and the opening 55 communicating with the base 50 is formed on the center side. A part of the cleaning liquid supplied to the upper surface 58 of 51 is allowed to flow from the outer peripheral edge of the base 50 toward the middle part of the inner peripheral surface 41 of the cup 36 (rotating cup 37) through the opening 55 and the gap 54. it can. Thereby, the middle part of the inner peripheral surface 41 of the cup 36 (rotating cup 37) can be cleaned with the cleaning liquid. Moreover, the cleaning liquid that flows from the upper surface 58 of the guide body 51 toward the upper end portion of the inner peripheral surface 41 of the cup 36 (rotating cup 37) in the middle portion of the inner peripheral surface 41 of the cup 36 (rotating cup 37) is the base. It collides (joins) with the cleaning liquid that flows from the upper surface of 50 toward the middle portion of the inner peripheral surface 41 of the cup 36 (rotating cup 37). Therefore, the speed of the cleaning liquid that flows from the upper surface 58 of the guide body 51 toward the upper end portion of the inner peripheral surface 41 of the cup 36 (rotating cup 37) can be delayed. And the crystal of the treatment liquid adhering to the inner peripheral surface 41 can be removed more satisfactorily. In addition, since the inclined surface 52 inclined downward toward the outer peripheral side is formed on the upper surface of the base 50, the cleaning liquid flowing toward the outer peripheral side along the upper surface of the base 50 can be accelerated, The cleaning liquid is reliably collided (supplied) to the midway part of the inner peripheral surface 41 of the cup 36 (rotating cup 37).

  In the substrate processing system 1, the cleaning liquid flows out from the upper end of the cup 36 (rotating cup 37) by supplying gas to the upper part of the cup 36 (rotating cup 37) during cup cleaning. Can be prevented. The gas supply nozzle 32 may be fixed and gas may be continuously discharged to a predetermined position of the cup 36, or the gas supply nozzle 32 may be moved to the inner peripheral side while discharging gas.

W Wafer 1 Substrate Processing System 8 Substrate Holder 36 Cup 49 Cup Cleaning Jig 50 Base 51 Guide Body

Claims (11)

A cup cleaning jig used for cleaning the inner peripheral surface of a cup for receiving a processing liquid provided outside the substrate with a cleaning liquid,
A base that is held by a substrate holder provided to hold the substrate;
A guide body extending from the center side of the base toward the lower side of the upper part of the inner peripheral surface of the cup, and guiding the cleaning liquid toward the upper part of the inner peripheral surface of the cup;
A cup-cleaning jig comprising:   2. The cup cleaning device according to claim 1, wherein the guide body has an inclined surface formed in a downward inclined shape from the center side of the base toward a lower side than an upper end portion of an inner peripheral surface of the cup. jig.   The cup cleaning jig according to claim 2, wherein the guide body has a horizontal flat surface on an outer periphery of the inclined surface.   4. The cup cleaning jig according to claim 3, wherein the guide body has a step between the inclined surface and the flat surface.   The cup according to any one of claims 1 to 4, wherein the guide body forms a gap between the base and an opening communicating with the base on the center side. Cleaning jig. A substrate liquid processing apparatus for cleaning an inner peripheral surface of a cup for receiving a processing liquid for liquid processing a substrate outside the substrate with a cleaning liquid using a cup cleaning jig,
The cup cleaning jig is
A base held by a substrate holder provided in the substrate liquid processing apparatus for holding the substrate;
A guide body extending from the center side of the base toward the lower side of the upper part of the inner peripheral surface of the cup, and guiding the cleaning liquid toward the upper part of the inner peripheral surface of the cup;
Have
A substrate liquid processing apparatus, wherein the cleaning liquid is supplied to an upper portion of the guide body while rotating the cup cleaning jig.   The cleaning liquid is supplied to the upper part of the guide body while rotating the cup cleaning jig so that the cleaning liquid is bridged between the inner peripheral surface of the cup and the guide body. The substrate liquid processing apparatus according to claim 6.   The substrate liquid processing apparatus according to claim 6, wherein a gas is supplied to an upper portion of the cup. The cup comprises a rotating cup that rotates together with the substrate, and a fixed cup that is fixed outside the outer periphery of the rotating cup,
The guide body extends from the center side of the base toward the lower side of the upper part of the inner peripheral surface of the rotary cup, and guides the cleaning liquid toward the upper part of the inner peripheral surface of the rotary cup. The substrate liquid processing apparatus according to any one of claims 6 to 8. A cup cleaning method for cleaning an inner peripheral surface of a cup for receiving a processing liquid for liquid processing a substrate outside the substrate with a cleaning liquid using a cup cleaning jig,
The cup cleaning jig is
A base held by a substrate holder provided in the substrate liquid processing apparatus for holding the substrate;
A guide body extending from the center side of the base toward the lower side of the upper part of the inner peripheral surface of the cup, and guiding the cleaning liquid toward the upper part of the inner peripheral surface of the cup;
Have
A cup cleaning method, wherein the cleaning liquid is supplied to an upper portion of the guide body while rotating the cup cleaning jig.   The cup cleaning method according to claim 10, wherein a gas is supplied to an upper portion of the cup.

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