JP2016224035A - Measurement device, system, article manufacturing method, calculation method, and program - Google Patents
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Description
本発明は、被計測物の形状を計測する計測装置、システム、物品の製造方法、算出方法及びプログラムに関する。 The present invention relates to a measuring apparatus, system, article manufacturing method, calculation method, and program for measuring the shape of an object to be measured.
空間符号化法などに代表されるラインパターン光をプロジェクターなどの投影部を介して被計測物に投影し、撮像部によって得られた反射光の位置に基づいて、三角測量の原理から3次元座標を求める計測装置が知られている。このような計測装置においては、計測結果が被計測物の材質の影響を受けやすいという傾向がある。 3D coordinates are projected from the principle of triangulation based on the position of the reflected light obtained by projecting the line pattern light represented by the spatial coding method onto the object to be measured through a projection unit such as a projector. There are known measuring devices for obtaining the above. In such a measuring apparatus, the measurement result tends to be easily influenced by the material of the object to be measured.
例えば、工業生産の分野では、被計測物として樹脂を扱う場合がある。被計測物が樹脂である場合、被計測物に投影された光が被計測物の内部にまで入り込み、被計測物の内部で散乱する現象、所謂、内部散乱が生じることが知られている。内部散乱が生じると、被計測物からの反射光には、被計測物の表面からの表面散乱光に加えて、被計測物の内部からの内部散乱光も含まれることになる。内部散乱光には、表面散乱光とは異なる距離からの散乱光が含まれているため、計測装置では、被計測物の表面位置とは異なる計測値が算出されることになる。従って、内部散乱光は、計測装置において系統誤差として現れ、計測精度を低下させる要因となる。 For example, in the field of industrial production, a resin may be handled as an object to be measured. When the object to be measured is a resin, it is known that light projected onto the object to be measured enters the object to be measured and is scattered inside the object to be measured, so-called internal scattering. When internal scattering occurs, the reflected light from the object to be measured includes internal scattered light from the inside of the object to be measured in addition to the surface scattered light from the surface of the object to be measured. Since the internally scattered light includes scattered light from a different distance from the surface scattered light, the measurement device calculates a measurement value different from the surface position of the object to be measured. Accordingly, the internally scattered light appears as a systematic error in the measuring apparatus and becomes a factor that decreases the measurement accuracy.
そこで、内部散乱の影響を低減するための技術が提案されている(非特許文献1参照)。かかる技術では、明部と暗部とを含み、空間的に高周波のパターン光を被計測物である樹脂に投影し、表面散乱成分と内部散乱成分とを含む明部での強度分布から、内部散乱成分を含む暗部での強度分布を差し引いている。このように、非特許文献1では、明部での強度分布から内部散乱成分を低減することで、計測装置で求められる3次元座標が被計測物の内部方向に系統的にずれる誤差(系統誤差)を低減することが可能であるとしている。 Therefore, a technique for reducing the influence of internal scattering has been proposed (see Non-Patent Document 1). In such a technique, a bright portion and a dark portion are included, and spatially high-frequency pattern light is projected onto a resin that is an object to be measured, and an internal scattering is obtained from an intensity distribution in a bright portion including a surface scattering component and an internal scattering component The intensity distribution in the dark part including the component is subtracted. As described above, in Non-Patent Document 1, by reducing the internal scattering component from the intensity distribution in the bright part, an error (systematic error) in which the three-dimensional coordinates obtained by the measurement device are systematically shifted in the internal direction of the measurement object. ) Can be reduced.
しかしながら、非特許文献1には、パターン光の空間的な周波数と内部散乱や表面散乱との関係に関する具体的な開示がない。例えば、パターン光の空間的な周波数が低い場合には、暗部での強度分布に内部散乱成分が含まれなくなるため、明部での強度分布に含まれる内部散乱成分を適切に除去することができない。一方、パターン光の空間的な周波数が高い場合には、デフォーカスを含む光学的な点像強度分布を考慮すると、明部が空間的に広がるために、暗部での強度分布に表面散乱成分が含まれる。従って、明部での強度分布から暗部での強度分布を差し引くと、明部での強度分布から表面散乱成分も差し引かれてしまうため、内部散乱成分を適切に除去することができない。このように、非特許文献1では、被計測物での内部散乱の影響、即ち、計測装置の計測精度を低下させる要因である系統誤差を最適に低減することができるとは限らない。 However, Non-Patent Document 1 does not specifically disclose the relationship between the spatial frequency of pattern light and internal scattering or surface scattering. For example, when the spatial frequency of the pattern light is low, the internal scattering component is not included in the intensity distribution in the dark part, and thus the internal scattering component included in the intensity distribution in the bright part cannot be appropriately removed. . On the other hand, when the spatial frequency of the pattern light is high, considering the optical point image intensity distribution including defocus, the bright part spreads spatially, so that the surface scattering component is included in the intensity distribution in the dark part. included. Therefore, if the intensity distribution in the dark part is subtracted from the intensity distribution in the bright part, the surface scattering component is also subtracted from the intensity distribution in the bright part, so that the internal scattering component cannot be appropriately removed. As described above, in Non-Patent Document 1, it is not always possible to optimally reduce the influence of internal scattering on the object to be measured, that is, the systematic error that is a factor that reduces the measurement accuracy of the measurement apparatus.
本発明は、このような従来技術の課題に鑑みてなされ、被計測物の形状を高精度に計測するのに有利な計測装置を提供することを例示的目的とする。 The present invention has been made in view of the above-described problems of the prior art, and an object of the present invention is to provide a measurement device that is advantageous for measuring the shape of an object to be measured with high accuracy.
上記目的を達成するために、本発明の一側面としての計測装置は、被計測物の形状を計測する計測装置であって、第1方向に沿って明部と暗部とを交互に含むパターン光が投影された前記被計測物を撮像して得られる画像に基づいて、前記被計測物の形状の情報を求める処理部を有し、前記処理部は、前記暗部に対応する前記画像の領域から、前記第1方向に交差する第2方向における光強度分布を示す、互いに異なる複数の第1信号を取得し、前記明部に対応する前記画像の領域から取得される前記第2方向における光強度分布を表す第2信号を、前記複数の第1信号のそれぞれを用いて補正することで得られる複数の補正信号の、それぞれの良否についての評価値を求め、前記評価値が許容範囲内となる補正信号を用いて、前記情報を求めることを特徴とする。 In order to achieve the above object, a measuring device according to one aspect of the present invention is a measuring device that measures the shape of an object to be measured, and includes pattern light that alternately includes bright and dark portions along a first direction. Based on an image obtained by imaging the object to be measured, and a processing unit for obtaining information on the shape of the object to be measured, and the processing unit from the region of the image corresponding to the dark part The light intensity in the second direction obtained from a plurality of different first signals indicating the light intensity distribution in the second direction intersecting the first direction and obtained from the region of the image corresponding to the bright portion An evaluation value for each pass / fail of each of the plurality of correction signals obtained by correcting the second signal representing the distribution using each of the plurality of first signals is obtained, and the evaluation value falls within an allowable range. The information is obtained using a correction signal. And wherein the Rukoto.
本発明の更なる目的又はその他の側面は、以下、添付図面を参照して説明される好ましい実施形態によって明らかにされるであろう。 Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.
本発明によれば、例えば、被計測物の形状を高精度に計測するのに有利な計測装置を提供する。 According to the present invention, for example, a measuring apparatus that is advantageous for measuring the shape of an object to be measured with high accuracy is provided.
以下、添付図面を参照して、本発明の好適な実施の形態について説明する。なお、各図において、同一の部材については同一の参照番号を付し、重複する説明は省略する。 DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted.
図1は、本発明の一側面としての計測装置100の構成を示す概略図である。計測装置100は、三角測量の原理に基づいて被計測物5の形状を計測する。計測装置100は、図1に示すように、投影部1と、撮像部3と、処理部4とを有する。計測装置100は、投影部1から符号化された光、即ち、パターン光を被計測物5に投影し、かかるパターン光を撮像部3で撮像して取得された画像から、処理部4で被計測物5の3次元座標点群データ(被計測物5の形状の情報)を求める。また、処理部4は、予め登録された被計測物5のCADモデルに対して3次元座標点群データをフィッティングすることによって、被計測物5の位置又は姿勢を求める機能を有する。 FIG. 1 is a schematic diagram showing a configuration of a measuring apparatus 100 as one aspect of the present invention. The measuring device 100 measures the shape of the measurement object 5 based on the principle of triangulation. As shown in FIG. 1, the measurement apparatus 100 includes a projection unit 1, an imaging unit 3, and a processing unit 4. The measuring apparatus 100 projects the light encoded from the projection unit 1, that is, the pattern light onto the measurement object 5, and captures the pattern light with the imaging unit 3 from the image acquired by the processing unit 4. Three-dimensional coordinate point group data (information on the shape of the measurement object 5) of the measurement object 5 is obtained. Further, the processing unit 4 has a function of obtaining the position or orientation of the measurement object 5 by fitting three-dimensional coordinate point group data to a CAD model of the measurement object 5 registered in advance.
ここで、図13を参照して、三角測量の原理に基づいて被計測物の形状を計測する一般的な計測装置において、かかる被計測物が樹脂である場合に生じる系統誤差について説明する。被計測物が樹脂である場合、被計測物の表面からの表面散乱光及び被計測物の内部からの内部散乱光が撮像部(の撮像面上)で結像されるため、内部散乱の影響で計測結果に系統誤差が含まれてしまう。 Here, with reference to FIG. 13, in a general measuring apparatus that measures the shape of an object to be measured based on the principle of triangulation, a system error that occurs when the object to be measured is resin will be described. When the object to be measured is a resin, the surface scattering light from the surface of the object to be measured and the internal scattered light from the inside of the object to be measured are imaged on the imaging unit (on the imaging surface), so the influence of internal scattering Therefore, systematic errors are included in the measurement results.
図13は、投影部から光を被計測物に投影し、被計測物で反射された光の撮像面上での強度分布(光強度分布)を説明するための図である。ここでは、内部散乱を生じる被計測物からの反射光が撮像面上で結像される説明として、被計測物の内部を多層構造と考えて、各層からの散乱光を撮像面上で結像するモデルを例に説明する。 FIG. 13 is a diagram for explaining the intensity distribution (light intensity distribution) on the imaging surface of the light reflected from the measurement object by projecting light from the projection unit onto the measurement object. Here, as an explanation of the reflected light from the object to be measured causing internal scattering being imaged on the imaging surface, the inside of the object to be measured is considered to be a multilayer structure, and the scattered light from each layer is imaged on the imaging surface. A model to be described will be described as an example.
図13は、投影部の光軸に沿って被計測物に投影された光が被計測物の内部で散乱して広がっている状態を示している。被計測物の表面のみで光が反射される場合、即ち、内部散乱を生じない被計測物の場合、例えば、被計測物に対してガウス分布で集光するように光を投影すると、撮像面上での強度分布は、対称的な強度分布となる。一方、内部散乱を生じる被計測物の場合、図13に示すように、被計測物の表面、被計測物の内部の各層、即ち、第1層、第2層、第3層からの散乱光が重ね合わされて撮像面上で結像する。従って、被計測物の表面からの反射光が強く、内部散乱による反射光が各層で徐々に弱くなる場合には、撮像面上での強度分布は、非対称な強度分布となる。 FIG. 13 shows a state in which light projected onto the measurement object along the optical axis of the projection unit is scattered and spread inside the measurement object. When light is reflected only on the surface of the object to be measured, that is, in the case of an object to be measured that does not cause internal scattering, for example, when light is projected on the object to be collected with a Gaussian distribution, the imaging surface The intensity distribution above is a symmetric intensity distribution. On the other hand, in the case of an object to be measured that causes internal scattering, as shown in FIG. 13, the scattered light from the surface of the object to be measured and each layer inside the object to be measured, that is, the first layer, the second layer, and the third layer. Are superimposed and imaged on the imaging surface. Therefore, when the reflected light from the surface of the object to be measured is strong and the reflected light due to internal scattering gradually weakens in each layer, the intensity distribution on the imaging surface is an asymmetric intensity distribution.
撮像面上での強度分布を、被計測物からの表面散乱と内部散乱とに分類することを考える。表面散乱においては、被計測物の表面に集光した光が反射されて撮像面上で結像するため、撮像面上での強度分布(の幅)が狭くなる。一方、内部散乱においては、内部散乱による光の広がりがある(即ち、被計測物の各層に光が集光していない)ため、撮像面上での強度分布が広がる。また、内部散乱においては、被計測物の内部に入り込んだ光の散乱光が撮像面上で取得されるため、撮像面上において、内部散乱のピークは、表面散乱のピークとは異なる位置に現れる。 Consider that the intensity distribution on the imaging surface is classified into surface scattering and internal scattering from the object to be measured. In the surface scattering, the light collected on the surface of the object to be measured is reflected and imaged on the imaging surface, so that the intensity distribution (width) on the imaging surface becomes narrow. On the other hand, in the internal scattering, there is a spread of light due to the internal scattering (that is, light is not condensed on each layer of the object to be measured), so that the intensity distribution on the imaging surface is widened. In addition, in the internal scattering, since the scattered light of the light entering the object to be measured is acquired on the imaging surface, the internal scattering peak appears at a position different from the surface scattering peak on the imaging surface. .
例えば、被計測物の内部の第1層、第2層及び第3層のそれぞれからの散乱光の撮像面上での結像位置は、図13に示すように、被計測物の表面からの散乱光の撮像面上での結像位置から少しずつシフトしている。従って、撮像面上では、内部散乱による光の強度分布と、表面散乱による光の強度分布とが重ね合わされるため、非対称な強度分布が得られる。 For example, as shown in FIG. 13, the imaging position of the scattered light from each of the first layer, the second layer, and the third layer inside the object to be measured is from the surface of the object to be measured. The scattered light is gradually shifted from the imaging position on the imaging surface. Accordingly, since the light intensity distribution due to internal scattering and the light intensity distribution due to surface scattering are superimposed on the imaging surface, an asymmetric intensity distribution is obtained.
一方、表面散乱のみが生じる場合には、撮像面上で得られる強度分布は、表面散乱による光の強度分布だけであるため、かかる強度分布に対して重心検出などを行えば、被計測物の形状を正確に求めることができる。但し、内部散乱が生じる場合、非対称な強度分布に対して単純に重心検出を行うと、かかる強度分布の非対称性に起因して被計測物の内部に引き込まれた位置の形状が求められてしまう。このように、内部散乱が生じると、被計測物の内部方向に統計的にずれる誤差、即ち、系統誤差が生じるため、被計測物の形状を正確に求めることができない。 On the other hand, when only surface scattering occurs, the intensity distribution obtained on the imaging surface is only the light intensity distribution due to surface scattering. The shape can be determined accurately. However, when internal scattering occurs, if the center of gravity is simply detected for an asymmetric intensity distribution, the shape of the position drawn into the object to be measured is required due to the asymmetry of the intensity distribution. . As described above, when internal scattering occurs, an error that statistically shifts in the internal direction of the object to be measured, that is, a systematic error occurs, so that the shape of the object to be measured cannot be obtained accurately.
そこで、本実施形態の計測装置100では、樹脂などの被計測物5の内部散乱に起因する非対称な強度分布の影響(系統誤差)を最適に低減して、被計測物5の形状を高精度に計測することを実現する。計測装置100において、被計測物5に投影されるパターン光は、第1方向に沿って明部と暗部とを交互に含む。そして、被計測物5に投影されたパターン光を撮像して取得される画像のうち、パターン光の暗部に対応する領域から、第1方向に交差する第2方向(例えば、第1方向に対して垂直な方向)における強度分布を示す、互いに異なる複数の第1信号を取得する。また、被計測物5に投影されたパターン光を撮像して取得される画像のうち、パターン光の明部に対応する領域から取得される第2方向における強度分布を表す第2信号を、複数の第1信号のそれぞれを用いて補正して複数の補正信号を求める。次いで、複数の補正信号のそれぞれの良否についての評価値を求め、かかる評価値が許容範囲内となる補正信号を用いて、被計測物5の形状の情報を求める(算出する)。これにより、パターン光の明部での強度分布から内部散乱の影響を最適に低減することが可能となる。 Therefore, in the measurement apparatus 100 of the present embodiment, the influence (systematic error) of the asymmetric intensity distribution caused by internal scattering of the measurement object 5 such as resin is optimally reduced, and the shape of the measurement object 5 is highly accurate. Realize to measure. In the measurement apparatus 100, the pattern light projected onto the measurement object 5 includes bright portions and dark portions alternately along the first direction. And among the images acquired by imaging the pattern light projected on the measurement object 5, from the region corresponding to the dark part of the pattern light, the second direction intersecting the first direction (for example, with respect to the first direction). A plurality of different first signals indicating intensity distributions in a vertical direction). In addition, among the images acquired by imaging the pattern light projected on the measurement object 5, a plurality of second signals representing the intensity distribution in the second direction acquired from the area corresponding to the bright part of the pattern light are provided. A plurality of correction signals are obtained by correcting each of the first signals. Next, evaluation values for the quality of each of the plurality of correction signals are obtained, and information on the shape of the object to be measured 5 is obtained (calculated) using the correction signal that makes the evaluation values within an allowable range. This makes it possible to optimally reduce the influence of internal scattering from the intensity distribution in the bright part of the pattern light.
以下、計測装置100の具体的な構成について詳細に説明する。投影部1は、光源8と、照明光学系9と、マスク10と、投影光学系11とを含む。照明光学系9は、光源8から射出された光でマスク10を均一に照明するための光学系であって、例えば、マスク10をケーラー照明する。マスク10には、例えば、ガラス基板にクロムをスパッタ蒸着させてエッチングすることによって、被計測物5に投影するパターンを生成するための透過領域及び遮光領域が形成されている。投影光学系11は、マスク10のパターンを被計測物5に投影させるための光学系である。 Hereinafter, a specific configuration of the measuring apparatus 100 will be described in detail. The projection unit 1 includes a light source 8, an illumination optical system 9, a mask 10, and a projection optical system 11. The illumination optical system 9 is an optical system for uniformly illuminating the mask 10 with the light emitted from the light source 8, and for example, the mask 10 is Koehler illuminated. In the mask 10, for example, a transmissive region and a light-shielding region for generating a pattern to be projected onto the measurement object 5 are formed by sputtering and etching chromium on a glass substrate. The projection optical system 11 is an optical system for projecting the pattern of the mask 10 onto the measurement object 5.
図2は、マスク10によって生成されるパターン光PLの一例を示す図である。マスク10は、本実施形態では、Y軸方向(第1方向)に沿って明部PLaと暗部PLbとを交互に含むラインが、X軸方向に周期的に配列されたパターン光PLを生成する生成部として機能する。マスク10の透過領域を通過する光及びマスク10の遮光領域で遮光される光によって、被計測物5に投影される、明部PLa及び暗部PLbを含むパターン光PLが生成される。パターン光PLは、本実施形態では、Y軸方向の長さLyが互いに異なる複数の暗部PLbを含む。また、パターン光PLの暗部PLbは、明部PLaを識別するための識別部として機能し、かかる識別部は、複数のドットで構成されている。このように、パターン光PLは、それぞれがランダムに配置された複数の暗部PLb、即ち、ドットでパターンを符号化したドットラインパターン光である。符号化したドットラインパターン光は、撮像部3で取得された画像に含まれる各ラインが何番目のラインであるかを識別するための符号としての機能を実現する。 FIG. 2 is a diagram illustrating an example of the pattern light PL generated by the mask 10. In this embodiment, the mask 10 generates pattern light PL in which lines that alternately include bright portions PLa and dark portions PLb along the Y-axis direction (first direction) are periodically arranged in the X-axis direction. Functions as a generation unit. The pattern light PL including the bright part PLa and the dark part PLb that is projected onto the measurement object 5 is generated by the light passing through the transmission region of the mask 10 and the light shielded by the light shielding region of the mask 10. In the present embodiment, the pattern light PL includes a plurality of dark portions PLb having different lengths Ly in the Y-axis direction. The dark portion PLb of the pattern light PL functions as an identification portion for identifying the bright portion PLa, and the identification portion is composed of a plurality of dots. Thus, the pattern light PL is a plurality of dark portions PLb that are randomly arranged, that is, dot line pattern light obtained by encoding a pattern with dots. The encoded dot line pattern light realizes a function as a code for identifying which line each line included in the image acquired by the imaging unit 3 is.
撮像部3は、撮像光学系6と、撮像素子7とを含み、被計測物5に投影されたパターン光PLを撮像して画像を取得する。撮像光学系6は、被計測物5に投影されたパターン光PLを撮像素子7に結像するための光学系である。撮像素子7は、撮像面で結像されたパターン光PLを撮像して画像に変換するためのイメージセンサである。撮像素子7は、例えば、CMOSセンサやCCDセンサなどを含む。 The imaging unit 3 includes an imaging optical system 6 and an imaging element 7 and images the pattern light PL projected on the measurement object 5 to acquire an image. The imaging optical system 6 is an optical system for forming an image on the imaging element 7 with the pattern light PL projected on the measurement object 5. The imaging element 7 is an image sensor for imaging the pattern light PL formed on the imaging surface and converting it into an image. The image sensor 7 includes, for example, a CMOS sensor or a CCD sensor.
処理部4は、撮像部3で取得された画像に基づいて、被計測物5の形状の情報を求める。処理部4は、本実施形態では、撮像部3で取得された画像に含まれる各ラインを対応付けし、内部散乱の影響を低減するための処理を行ってから、三角測量の原理に基づいて、被計測物5の3次元座標点群データを求める。 The processing unit 4 obtains information on the shape of the measurement object 5 based on the image acquired by the imaging unit 3. In this embodiment, the processing unit 4 associates each line included in the image acquired by the imaging unit 3 and performs processing for reducing the influence of internal scattering, and then, based on the principle of triangulation. Then, the three-dimensional coordinate point group data of the measurement object 5 is obtained.
計測装置100における被計測物5の形状を計測する計測処理について詳細に説明する。まず、パターン光PLの暗部PLbの長さLyについて、内部散乱に起因する系統誤差を最小する最適な長さが存在することを説明する。 A measurement process for measuring the shape of the measurement object 5 in the measurement apparatus 100 will be described in detail. First, it will be described that there is an optimum length for minimizing the systematic error due to internal scattering for the length Ly of the dark portion PLb of the pattern light PL.
図3は、被計測物5としての樹脂に投影されたパターン光PLを撮像することで取得される画像の一例を示す図である。図3に示す画像において、黒い部分が強度の小さい領域であり、白い部分が強度の大きい領域である。X=0上の強度が極大となる箇所を明部とし、X=0上の強度が極小となる箇所を暗部としている。図4は、図3に示す明部から取得されるX軸方向(第1方向に直交する第2方向)における強度分布の一例を示す図である。図4に示す強度分布は、内部散乱の影響によって、X=0に対して負側に広がり、X軸方向に左右非対称になっている。 FIG. 3 is a diagram illustrating an example of an image acquired by imaging the pattern light PL projected onto the resin as the measurement object 5. In the image shown in FIG. 3, the black portion is a region having a low intensity, and the white portion is a region having a high intensity. A portion where the intensity on X = 0 is maximized is a bright portion, and a portion where the intensity on X = 0 is minimized is a dark portion. FIG. 4 is a diagram illustrating an example of an intensity distribution in the X-axis direction (second direction orthogonal to the first direction) acquired from the bright portion illustrated in FIG. 3. The intensity distribution shown in FIG. 4 spreads to the negative side with respect to X = 0 due to the influence of internal scattering, and is asymmetrical in the X-axis direction.
図5、図6及び図7のそれぞれは、X=0上での明部の間隔である暗部のY軸方向の長さを変更させた場合の明部での計測信号、明部での表面散乱信号、明部での内部散乱信号、及び、暗部での計測信号の一例を示す図である。ここで、明部での計測信号とは、明部に対応する領域、詳細には、かかる領域のY軸方向における中央部分から取得されるX軸方向における強度分布を表す信号(第2信号)である。同様に、暗部での計測信号とは、暗部に対応する領域、詳細には、かかる領域のY軸方向における中央部分から取得されるX軸方向における強度分布を表す信号(第1信号)である。また、明部での表面散乱信号とは、明部に対応する領域での表面散乱光のX軸方向における強度分布を表す信号であり、明部での内部散乱信号とは、明部に対応する領域での内部散乱光のX軸方向における強度分布を表す信号である。 FIG. 5, FIG. 6 and FIG. 7 show the measurement signal in the bright part and the surface in the bright part when the length in the Y-axis direction of the dark part, which is the interval of the bright part on X = 0, is changed. It is a figure which shows an example of a scattering signal, the internal scattering signal in a bright part, and the measurement signal in a dark part. Here, the measurement signal at the bright portion is a signal (second signal) representing an intensity distribution in the X-axis direction acquired from the region corresponding to the bright portion, specifically, the central portion of the region in the Y-axis direction. It is. Similarly, the measurement signal in the dark part is a signal (first signal) representing the intensity distribution in the X-axis direction acquired from the area corresponding to the dark part, specifically, the central part of the area in the Y-axis direction. . The surface scattering signal in the bright part is a signal representing the intensity distribution in the X-axis direction of the surface scattered light in the region corresponding to the bright part, and the internal scattering signal in the bright part corresponds to the bright part. It is a signal showing the intensity distribution in the X-axis direction of the internally scattered light in the region to be used.
図5乃至図7を参照して、暗部がY軸方向に特定の長さを有する場合に、明部での計測信号を暗部での計測信号を用いて補正することで得られる補正信号に含まれる系統誤差が最小になることを説明する。ここでは、明部での計測信号と暗部での計測信号との差分をとることで補正信号が取得されるものとする。また、図5、図6、図7の順に、暗部のY軸方向の長さが長くなるものとする。換言すれば、図5では、暗部のY軸方向の長さが最も小さく、図7では、暗部のY軸方向の長さが最も長く、図6では、暗部のY軸方向の長さが最も小さい長さと最も長い長さとの中間となる。 Referring to FIG. 5 to FIG. 7, when the dark part has a specific length in the Y-axis direction, it is included in the correction signal obtained by correcting the measurement signal in the bright part using the measurement signal in the dark part. Explain that the systematic error is minimized. Here, it is assumed that the correction signal is acquired by taking the difference between the measurement signal in the bright part and the measurement signal in the dark part. In addition, it is assumed that the length of the dark portion in the Y-axis direction becomes longer in the order of FIG. 5, FIG. 6, and FIG. In other words, the length of the dark portion in the Y-axis direction is the smallest in FIG. 5, the length of the dark portion in the Y-axis direction is the longest in FIG. 7, and the length of the dark portion in the Y-axis direction is the longest in FIG. It is halfway between the smallest length and the longest length.
図5を参照するに、暗部での計測信号には、暗部のY軸方向の長さが小さいために、暗部での内部散乱成分に加えて、明部での点像分布で空間的に広がった表面散乱成分が含まれる。従って、明部での計測信号から暗部での計測信号を差し引くと、明部での計測信号から内部散乱成分だけではなく表面散乱成分も差し引かれる(即ち、内部散乱成分のみを除去することができない)ため、系統誤差が生じてしまう。 Referring to FIG. 5, in the measurement signal in the dark part, the length of the dark part in the Y-axis direction is small, so that in addition to the internal scattering component in the dark part, it spreads spatially by the point image distribution in the bright part. Surface scattering components. Therefore, when the measurement signal in the dark part is subtracted from the measurement signal in the bright part, not only the internal scattering component but also the surface scattering component is subtracted from the measurement signal in the bright part (that is, only the internal scattering component cannot be removed). Therefore, a systematic error occurs.
また、図7を参照するに、暗部での計測信号は、明部での内部散乱信号と比較して大きくならない。これは、暗部のY軸方向の長さが長いために、明部から空間的に広がる内部散乱光が暗部の中央部分まで入り込まないからである。従って、明部での計測信号から暗部での計測信号を差し引いて得られる補正信号は、明部での表面散乱信号と一致していない。 Further, referring to FIG. 7, the measurement signal in the dark part does not become larger than the internal scattering signal in the bright part. This is because the length of the dark portion in the Y-axis direction is long, so that the internally scattered light spreading spatially from the bright portion does not enter the central portion of the dark portion. Therefore, the correction signal obtained by subtracting the measurement signal in the dark portion from the measurement signal in the bright portion does not match the surface scattering signal in the bright portion.
一方、図6を参照するに、明部での内部散乱信号と暗部での計測信号とが略一致しているため、明部での計測信号から内部散乱成分を適切に除去することが可能である。図8に、暗部のY軸方向の長さと、明部での計測信号と暗部での計測信号との差分をとることで得られる補正信号に含まれる系統誤差との関係を破線で示す。図8を参照するに、図6での暗部のY軸方向の長さ、即ち、暗部がY軸方向に長さLyAを有する場合に、補正信号に含まれる系統誤差が最小になることがわかる。 On the other hand, referring to FIG. 6, since the internal scattering signal in the bright part and the measurement signal in the dark part substantially coincide, it is possible to appropriately remove the internal scattering component from the measurement signal in the bright part. is there. FIG. 8 shows the relationship between the length of the dark portion in the Y-axis direction and the systematic error included in the correction signal obtained by taking the difference between the measurement signal in the bright portion and the measurement signal in the dark portion. Referring to FIG. 8, it can be seen that the systematic error included in the correction signal is minimized when the length of the dark portion in FIG. 6 in the Y-axis direction, that is, the dark portion has a length LyA in the Y-axis direction. .
このように、Y軸方向に特定の長さを有する暗部での計測信号を用いて明部での計測信号を補正することで、明部での計測信号から内部散乱成分を最適に除去することが可能となる。これは、暗部での計測信号を用いて明部での計測信号を補正する場合、明部での計測信号から内部散乱成分を除去するためには、最適な暗部のY軸方向の長さが存在するからである。 In this way, the internal scattering component is optimally removed from the measurement signal in the bright part by correcting the measurement signal in the bright part using the measurement signal in the dark part having a specific length in the Y-axis direction. Is possible. This is because when the measurement signal in the bright part is corrected using the measurement signal in the dark part, in order to remove the internal scattering component from the measurement signal in the bright part, the optimum length of the dark part in the Y-axis direction is Because it exists.
次いで、Y軸方向に互いに異なる長さを有する複数の暗部での計測信号から、明部での計測信号を最適に補正するための計測信号を選択する手法に関して説明する。内部散乱を生じない被計測物5にパターン光PLを投影して表面散乱光のみを撮像部3に結像させると、内部散乱光がないために、撮像部3で得られる強度分布は、対称的な強度分布となる。 Next, a method for selecting a measurement signal for optimally correcting the measurement signal in the bright part from the measurement signals in the dark part having different lengths in the Y-axis direction will be described. When the pattern light PL is projected onto the object to be measured 5 that does not cause internal scattering and only the surface scattered light is imaged on the imaging unit 3, the intensity distribution obtained by the imaging unit 3 is symmetric because there is no internal scattered light. Intensity distribution.
本実施形態では、内部散乱を生じる被計測物5に投影されたパターン光PLを撮像して取得される画像の暗部に対応する領域での強度分布を表す計測信号を用いて、かかる画像の明部に対応する領域での強度分布を表す非対称な計測信号を補正する場合を考える。上述したように、Y軸方向に特定の長さを有する暗部での計測信号を用いて明部での計測信号を補正していれば、補正信号は、ほぼ表面散乱光のみの強度分布を表すことになるため、対称性の高い強度分布を表す信号となる。そこで、対称性を評価値(指標)として、明部での計測信号と暗部での計測信号との差分をとることで得られる補正信号を評価する。 In the present embodiment, the brightness of the image is measured using a measurement signal representing an intensity distribution in a region corresponding to a dark portion of an image acquired by imaging the pattern light PL projected on the measurement object 5 that causes internal scattering. Consider a case where an asymmetric measurement signal representing an intensity distribution in a region corresponding to a portion is corrected. As described above, if the measurement signal in the bright part is corrected using the measurement signal in the dark part having a specific length in the Y-axis direction, the correction signal substantially represents the intensity distribution of only the surface scattered light. Therefore, the signal represents a highly symmetrical intensity distribution. Therefore, the correction signal obtained by taking the difference between the measurement signal in the bright part and the measurement signal in the dark part is evaluated using the symmetry as an evaluation value (index).
信号(の波形)の対称性を評価する評価方法としては、様々な評価方法が存在する。例えば、補正信号の重心位置と、補正信号の最大値となる位置とのずれ量から補正信号の対称性を評価してもよいし、補正信号の最大値の半値となる2つの位置の中点位置と、補正信号の最大値となる位置とのずれ量から対称性を評価してもよい。また、確率論や統計学において、非対称性の指標となる歪度(3次モーメント)を用いて補正信号の対称性を評価してもよい。 There are various evaluation methods for evaluating the symmetry of the signal (waveform). For example, the symmetry of the correction signal may be evaluated from the amount of deviation between the position of the center of gravity of the correction signal and the position where the correction signal is the maximum value, or the midpoint between the two positions where the half value of the maximum value of the correction signal is The symmetry may be evaluated from the amount of deviation between the position and the position where the correction signal becomes the maximum value. Further, in probability theory and statistics, the symmetry of the correction signal may be evaluated using the skewness (third-order moment) that is an index of asymmetry.
図8に、暗部のY軸方向の長さと、明部での計測信号と暗部での計測信号との差分をとることで得られる補正信号の対称性との関係を実線で示す。ここでは、補正信号の重心位置と補正信号の最大値となる位置とのずれ量を対称性の指標としている。図8を参照するに、補正信号に含まれる系統誤差を極小化する暗部での計測信号を用いた場合に、補正信号の対称性が最も高くなることがわかる。 FIG. 8 shows the relationship between the length of the dark part in the Y-axis direction and the symmetry of the correction signal obtained by taking the difference between the measurement signal in the bright part and the measurement signal in the dark part. Here, the amount of deviation between the position of the center of gravity of the correction signal and the position where the correction signal becomes the maximum value is used as an index of symmetry. Referring to FIG. 8, it can be seen that the symmetry of the correction signal is the highest when the measurement signal in the dark part that minimizes the systematic error included in the correction signal is used.
図9及び図10のそれぞれは、互いに異なる内部散乱を生じる被計測物について、暗部のY軸方向の長さと、補正信号に含まれる系統誤差及び補正信号の対称性との関係を示す図である。図9及び図10を参照するに、図8と同様に、補正信号に含まれる系統誤差を極小化する暗部での計測信号を用いた場合に、補正信号の対称性が最も高くなることがわかる。このように、補正信号に含まれる系統誤差が最小になる場合に補正信号の対称性が高くなる傾向は、被計測物の種類に依存しない。従って、補正信号の対称性を評価することによって、明部での計測信号を最適に補正するための暗部での計測信号を選択することが可能となる。 FIG. 9 and FIG. 10 are diagrams illustrating the relationship between the length of the dark portion in the Y-axis direction, the systematic error included in the correction signal, and the symmetry of the correction signal, for the objects to be measured that cause different internal scattering. . Referring to FIGS. 9 and 10, as in FIG. 8, when the measurement signal in the dark part that minimizes the systematic error included in the correction signal is used, the symmetry of the correction signal becomes the highest. . Thus, the tendency for the symmetry of the correction signal to increase when the systematic error included in the correction signal is minimized does not depend on the type of the object to be measured. Therefore, by evaluating the symmetry of the correction signal, it is possible to select the measurement signal in the dark part for optimally correcting the measurement signal in the bright part.
図11を参照して、計測装置100における計測処理について説明する。かかる計測処理は、処理部4が計測装置100の各部を統括的に制御することで行われる。なお、計測装置100が起動されると、初期化処理が行われる。初期化処理には、投影部1及び撮像部3を起動させる処理や投影部1や撮像部3の較正データなどの各種パラメータを設定する処理などが含まれる。
かかる計測処理の信号処理は、処理部4のコンピュータがプログラムを読み出すことで実行される。なお、本実施形態の機能を実現するソフトウェアやプログラムはネットワーク又は各種記憶媒体を介して1つ又は複数のコンピュータよりなる情報処理装置に供給される。その情報処理装置の処理部が、記録媒体または記憶媒体に記録又は記憶されたプログラムを読み出すことにより、プログラムが実行される。離れた位置にある複数のコンピュータが有線又は無線通信で互いにデータを送受信することにより、プログラムの各種処理を行ってもよい。情報処理装置の処理部は、各ステップを実行する各手段を構成する。
With reference to FIG. 11, the measurement process in the measurement apparatus 100 is demonstrated. Such measurement processing is performed by the processing unit 4 controlling the respective units of the measurement apparatus 100 in an integrated manner. Note that when the measurement apparatus 100 is activated, an initialization process is performed. The initialization process includes a process of starting the projection unit 1 and the imaging unit 3, a process of setting various parameters such as calibration data of the projection unit 1 and the imaging unit 3, and the like.
The signal processing of the measurement processing is executed by the computer of the processing unit 4 reading out the program. Note that software and programs that implement the functions of the present embodiment are supplied to an information processing apparatus including one or more computers via a network or various storage media. The processing unit of the information processing apparatus reads the program recorded or stored in the recording medium or the storage medium, so that the program is executed. A plurality of computers at distant locations may perform various processes of the program by transmitting and receiving data to each other by wired or wireless communication. The processing unit of the information processing apparatus constitutes each means for executing each step.
S1102では、被計測物5に対して、投影部1からパターン光PLを投影する。S1104では、被計測物5に投影されたパターン光PLを撮像部3で撮像して画像を取得する。 In step S1102, the pattern light PL is projected from the projection unit 1 onto the measurement object 5. In step S <b> 1104, the pattern light PL projected on the measurement object 5 is imaged by the imaging unit 3 to acquire an image.
S1106では、S1104で取得された画像に基づいて、補正信号を取得する。具体的には、まず、パターン光PLの複数の暗部PLbのそれぞれのY軸方向における中央部分に対応する画像の複数の領域のそれぞれから、X軸方向における強度分布を表す計測信号(第1信号)を取得する。同様に、パターン光PLの1つの明部PLaのY軸方向における中央部分に対応する画像の領域から、X軸方向における強度分布を表す計測信号(第2信号)を取得する。そして、明部PLaでの計測信号と、複数の暗部PLbでの複数の計測信号のそれぞれとの差分をとることで複数の補正信号を取得する。 In S1106, a correction signal is acquired based on the image acquired in S1104. Specifically, first, a measurement signal (first signal) representing an intensity distribution in the X-axis direction from each of a plurality of regions of the image corresponding to the central portion in the Y-axis direction of each of the plurality of dark portions PLb of the pattern light PL. ) To get. Similarly, a measurement signal (second signal) representing the intensity distribution in the X-axis direction is acquired from the region of the image corresponding to the central portion in the Y-axis direction of one bright part PLa of the pattern light PL. And a several correction signal is acquired by taking the difference of the measurement signal in bright part PLa, and each of the several measurement signal in several dark part PLb.
S1108では、S1106で取得された複数の補正信号のそれぞれの良否についての評価値として、複数の補正信号のそれぞれの対称性を求める。補正信号の対称性は、上述したように、補正信号の重心位置と、補正信号の最大値となる位置とのずれ量から求めてもよいし、補正信号の最大値の半値となる2つの位置の中点位置と、補正信号の最大値となる位置とのずれ量から対称性を求めてもよい。 In S1108, the symmetry of each of the plurality of correction signals is obtained as an evaluation value for the quality of each of the plurality of correction signals acquired in S1106. As described above, the symmetry of the correction signal may be obtained from the amount of deviation between the position of the center of gravity of the correction signal and the position that is the maximum value of the correction signal, or two positions that are half the maximum value of the correction signal. Symmetry may be obtained from the amount of deviation between the midpoint position and the position where the correction signal becomes the maximum value.
S1110では、S1108で求めた対称性に基づいて、対称性が許容範囲内となる補正信号を選択する。本実施形態では、対称性が最も高い補正信号に対応する暗部PLbでの計測信号を選択する。 In S1110, based on the symmetry obtained in S1108, a correction signal whose symmetry is within an allowable range is selected. In this embodiment, the measurement signal in the dark part PLb corresponding to the correction signal having the highest symmetry is selected.
S1112では、S1110で選択された暗部PLbでの計測信号を用いて、Y軸方向に沿った各明部PLaでの計測信号を補正して補正信号を生成する。具体的には、パターン光PLの複数の明部PLaに対応する画像の複数の領域から取得される複数の計測信号のそれぞれについて、S1110で選択された暗部PLbでの計測信号との差分をとることで補正信号を生成する。 In S1112, using the measurement signal in the dark part PLb selected in S1110, the measurement signal in each bright part PLa along the Y-axis direction is corrected to generate a correction signal. Specifically, for each of the plurality of measurement signals acquired from the plurality of regions of the image corresponding to the plurality of bright portions PLa of the pattern light PL, the difference from the measurement signal in the dark portion PLb selected in S1110 is taken. Thus, a correction signal is generated.
S1114では、S1112で生成した補正信号を用いて、被計測物5の3次元座標点群データを求める。 In S1114, the three-dimensional coordinate point group data of the measurement object 5 is obtained using the correction signal generated in S1112.
このように、本実施形態では、Y軸方向に互いに異なる長さを有する複数の暗部PLbでの計測信号から、明部PLaでの計測信号を最適に補正するための計測信号を選択して補正する。これにより、明部PLaでの計測信号から内部散乱の影響を低減することができる。従って、計測装置100は、被計測物5の形状を高精度に計測することができる。 As described above, in the present embodiment, the measurement signal for optimally correcting the measurement signal in the bright portion PLa is selected and corrected from the measurement signals in the plurality of dark portions PLb having different lengths in the Y-axis direction. To do. Thereby, the influence of internal scattering can be reduced from the measurement signal in the bright part PLa. Therefore, the measuring apparatus 100 can measure the shape of the measurement object 5 with high accuracy.
また、本実施形態では、Y軸方向に互いに異なる長さを有する複数の暗部PLbのそれぞれに対応する画像の複数の領域から計測信号(第1信号)を取得しているが、これに限定されるものではない。例えば、図2に示すように、暗部PLbのY軸方向における端EgからY軸方向に沿った距離Dt1乃至Dt4が互いに異なる暗部PLbの複数の部分に対応する画像の複数の領域のそれぞれから計測信号(第1信号)を取得してもよい。 In the present embodiment, measurement signals (first signals) are acquired from a plurality of regions of an image corresponding to each of a plurality of dark portions PLb having different lengths in the Y-axis direction. However, the present invention is not limited to this. It is not something. For example, as shown in FIG. 2, each of a plurality of regions of the image corresponding to a plurality of portions of the dark part PLb having different distances Dt 1 to Dt 4 along the Y-axis direction from the end Eg in the Y-axis direction of the dark part PLb. A measurement signal (first signal) may be obtained from
また、図11では、パターン光PLの1つの明部PLaでの計測信号(第2信号)に基づいて、補正信号を生成するために用いる暗部PLbでの計測信号(第1信号)を選択している。但し、1つの明部PLaにおいても、Y軸方向の各位置によって、X軸方向における強度分布、即ち、計測信号が異なる場合がある。このような場合、明部PLaでの計測信号を最適に補正するためには、明部PLaのY軸方向の各位置での計測信号に対して、補正信号を生成するために用いる暗部PLbでの計測信号を選択して補正する必要がある。 In FIG. 11, the measurement signal (first signal) in the dark portion PLb used for generating the correction signal is selected based on the measurement signal (second signal) in one bright portion PLa of the pattern light PL. ing. However, even in one bright part PLa, the intensity distribution in the X-axis direction, that is, the measurement signal may differ depending on the position in the Y-axis direction. In such a case, in order to optimally correct the measurement signal in the bright part PLa, the dark part PLb used to generate a correction signal for the measurement signal at each position in the Y-axis direction of the bright part PLa. It is necessary to select and correct the measurement signal.
図12を参照して、パターン光PLの1つの明部PLaのY軸方向の各位置での計測信号が異なる場合における計測処理を説明する。なお、図12に示すS1202及びS1204は、図11に示すS1102及びS1104と同様であるため、ここでの詳細な説明は省略する。 With reference to FIG. 12, the measurement process in the case where the measurement signals at the respective positions in the Y-axis direction of one bright portion PLa of the pattern light PL will be described. Note that S1202 and S1204 illustrated in FIG. 12 are the same as S1102 and S1104 illustrated in FIG. 11, and thus detailed description thereof is omitted here.
S1206では、S1204で取得された画像に基づいて、1つの明部PLaのY軸方向の各位置についての補正信号を取得する。具体的には、1つの明部PLaのY軸方向における端からY軸方向に沿った距離が互いに異なる明部PLaの複数の部分に対応する画像の複数の領域のそれぞれから複数の計測信号(第2信号)を取得する。また、パターン光PLの複数の暗部PLbのそれぞれのY軸方向における中央部分に対応する画像の複数の領域のそれぞれから、X軸方向における強度分布を表す計測信号(第1信号)を取得する。そして、明部PLaのY軸方向の複数の位置での複数の計測信号(第2信号)のそれぞれと、複数の暗部PLbのそれぞれでの複数の計測信号(第1信号)との差分をとることで複数の補正信号を取得する。 In S1206, based on the image acquired in S1204, a correction signal for each position in the Y-axis direction of one bright part PLa is acquired. Specifically, a plurality of measurement signals (from each of a plurality of regions of the image corresponding to a plurality of portions of the bright portion PLa having different distances along the Y-axis direction from the end in the Y-axis direction of one bright portion PLa) 2nd signal) is acquired. Further, a measurement signal (first signal) representing the intensity distribution in the X-axis direction is acquired from each of the plurality of regions of the image corresponding to the central portion in the Y-axis direction of each of the plurality of dark portions PLb of the pattern light PL. Then, the difference between each of the plurality of measurement signals (second signal) at the plurality of positions in the Y-axis direction of the bright part PLa and the plurality of measurement signals (first signal) at each of the plurality of dark parts PLb is taken. Thus, a plurality of correction signals are obtained.
S1208では、S1106で取得された複数の補正信号のそれぞれの良否についての評価値として、複数の補正信号のそれぞれの対称性を求める。 In S1208, the symmetry of each of the plurality of correction signals is obtained as an evaluation value for the quality of each of the plurality of correction signals acquired in S1106.
S1210では、1つの明部PLaのY軸方向の各位置について、S1208で求めた対称性に基づいて、S1106で取得された複数の補正信号から対称性が許容範囲内となる補正信号を選択する。本実施形態では、対称性が最も高い補正信号を選択する。 In S1210, for each position in the Y-axis direction of one bright portion PLa, a correction signal whose symmetry is within an allowable range is selected from the plurality of correction signals acquired in S1106 based on the symmetry obtained in S1208. . In the present embodiment, the correction signal having the highest symmetry is selected.
S1212では、S1210で選択した補正信号を用いて、被計測物5の3次元座標点群データを求める。 In S1212, three-dimensional coordinate point group data of the measurement object 5 is obtained using the correction signal selected in S1210.
このように、1つの明部PLaにおいて、Y軸方向の各位置によって計測信号が異なる場合であっても、各位置での計測信号(第2信号)に対して最適な暗部PLbでの計測信号(第1信号)を用いて補正することで、内部散乱の影響を低減することができる。 As described above, in one bright part PLa, even when the measurement signal differs depending on each position in the Y-axis direction, the measurement signal in the dark part PLb that is optimum for the measurement signal (second signal) at each position. By correcting using (first signal), the influence of internal scattering can be reduced.
<他の実施形態>
上述の計測装置は、ある支持部材に支持された状態で使用される。本実施形態では、一例として、図14に示すように、ロボットアーム300(把持装置)に備え付けられて使用される制御システムについて説明する。計測装置100は、支持台350に置かれた被計測物210にパターン光を投影して撮像し、画像を取得する。そして、計測装置100の制御部が、又は、計測装置100の制御部から画像データを取得した制御部310が、被計測物210の位置及び姿勢を求め、求められた位置及び姿勢の情報を制御部310が取得する。制御部310は、その位置及び姿勢の情報に基づいて、ロボットアーム300に駆動指令を送ってロボットアーム300を制御する。ロボットアーム300は先端のロボットハンドなど(把持部)で被計測物210を保持して、並進や回転などの移動をさせる。更に、ロボットアーム300によって被計測物210を他の部品に組み立てることにより、複数の部品で構成された物品、例えば、電子回路基板や機械などを製造することができる。また、移動された被計測物210を加工(処理)することにより、物品を製造することができる。制御部310は、CPUなどの演算装置やメモリなどの記憶装置を有する。なお、ロボットを制御する制御部を制御部310の外部に設けてもよい。また、計測装置100により計測された計測データや得られた画像をディスプレイなどの表示部320に表示してもよい。
<Other embodiments>
The above-described measuring device is used in a state of being supported by a certain support member. In the present embodiment, as an example, as shown in FIG. 14, a control system that is provided and used in a robot arm 300 (gripping device) will be described. The measuring apparatus 100 projects and images pattern light on the measurement object 210 placed on the support base 350, and acquires an image. Then, the control unit of the measurement apparatus 100 or the control unit 310 that has acquired the image data from the control unit of the measurement apparatus 100 obtains the position and orientation of the measurement object 210 and controls the obtained position and orientation information. Acquired by the unit 310. Based on the position and orientation information, control unit 310 sends a drive command to robot arm 300 to control robot arm 300. The robot arm 300 holds the object to be measured 210 with a robot hand or the like (gripping unit) at the tip, and moves it such as translation or rotation. Further, by assembling the measurement object 210 into other parts by the robot arm 300, an article composed of a plurality of parts, for example, an electronic circuit board or a machine can be manufactured. Further, an article can be manufactured by processing (processing) the moved measurement object 210. The control unit 310 includes an arithmetic device such as a CPU and a storage device such as a memory. Note that a control unit that controls the robot may be provided outside the control unit 310. In addition, measurement data measured by the measurement apparatus 100 and an obtained image may be displayed on the display unit 320 such as a display.
以上、本発明の好ましい実施形態について説明したが、本発明はこれらの実施形態に限定されないことはいうまでもなく、その要旨の範囲内で種々の変形及び変更が可能である。 As mentioned above, although preferable embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.
100:計測装置 1:投影部 10:マスク 3:撮像部 4:処理部 5:被計測物 100: Measuring device 1: Projection unit 10: Mask 3: Imaging unit 4: Processing unit 5: Object to be measured
Claims (18)
第1方向に沿って明部と暗部とを交互に含むパターン光が投影された前記被計測物を撮像して得られる画像に基づいて、前記被計測物の形状の情報を求める処理部を有し、
前記処理部は、
前記暗部に対応する前記画像の領域から、前記第1方向に交差する第2方向における光強度分布を示す、互いに異なる複数の第1信号を取得し、
前記明部に対応する前記画像の領域から取得される前記第2方向における光強度分布を表す第2信号を、前記複数の第1信号のそれぞれを用いて補正することで得られる複数の補正信号の、それぞれの良否についての評価値を求め、
前記評価値が許容範囲内となる補正信号を用いて、前記情報を求めることを特徴とする計測装置。 A measuring device for measuring the shape of an object to be measured,
A processing unit for obtaining information on the shape of the measurement object based on an image obtained by imaging the measurement object on which the pattern light including alternating bright and dark portions is projected along the first direction; And
The processor is
Obtaining a plurality of first signals different from each other indicating a light intensity distribution in a second direction intersecting the first direction from a region of the image corresponding to the dark portion;
A plurality of correction signals obtained by correcting, using each of the plurality of first signals, a second signal representing the light intensity distribution in the second direction acquired from the region of the image corresponding to the bright portion. The evaluation value about each quality is obtained,
The measurement apparatus characterized in that the information is obtained using a correction signal that makes the evaluation value within an allowable range.
前記処理部は、前記複数の暗部に対応する前記画像の複数の領域のそれぞれから前記複数の第1信号を取得することを特徴とする請求項1に記載の計測装置。 The pattern light includes a plurality of dark portions having different lengths in the first direction,
The measurement apparatus according to claim 1, wherein the processing unit acquires the plurality of first signals from each of a plurality of regions of the image corresponding to the plurality of dark portions.
前記処理部は、
前記複数の明部のうちの1つの明部に対応する前記画像の領域から取得される第2信号と、前記複数の第1信号のそれぞれとの差分をとることで前記複数の補正信号を取得し、
前記複数の補正信号から前記評価値が最も高い補正信号に対応する第1信号を選択し、
前記複数の明部に対応する前記画像の複数の領域から取得される複数の第2信号のそれぞれについて、当該第2信号と前記評価値が最も高い補正信号に対応する第1信号との差分をとることで前記評価値が前記許容範囲内となる補正信号を取得することを特徴とする請求項1乃至4のうちいずれか1項に記載の計測装置。 The pattern light includes a plurality of bright portions along the first direction,
The processor is
The plurality of correction signals are acquired by taking a difference between each of the plurality of first signals and the second signal acquired from the image area corresponding to one of the plurality of bright portions. And
Selecting a first signal corresponding to the correction signal having the highest evaluation value from the plurality of correction signals;
For each of a plurality of second signals acquired from a plurality of regions of the image corresponding to the plurality of bright portions, a difference between the second signal and the first signal corresponding to the correction signal having the highest evaluation value is calculated. 5. The measuring apparatus according to claim 1, wherein a correction signal for obtaining the evaluation value within the allowable range is acquired.
前記明部の前記第1方向における端から前記第1方向に沿った距離が互いに異なる前記明部の複数の部分に対応する前記画像の複数の領域のそれぞれから取得される複数の第2信号のそれぞれと、前記複数の第1信号のそれぞれとの差分をとることで前記複数の補正信号を取得し、
前記明部の複数の部分のそれぞれについて、前記複数の補正信号から前記評価値が最も高い補正信号を、前記評価値が前記許容範囲内となる補正信号として取得することを特徴とする請求項1乃至4のうちいずれか1項に記載の計測装置。 The processor is
A plurality of second signals acquired from each of a plurality of regions of the image corresponding to a plurality of portions of the bright portion having different distances along the first direction from an end of the bright portion in the first direction; Obtaining the plurality of correction signals by taking the difference between each and the plurality of first signals,
2. The correction signal having the highest evaluation value from the plurality of correction signals is acquired as a correction signal for which the evaluation value is within the allowable range for each of the plurality of bright portions. 5. The measuring device according to any one of 4 to 4.
第1方向に沿って明部と暗部とを交互に含むパターン光が投影された前記被計測物を撮像して得られる画像に基づいて、前記被計測物の形状の情報を求める処理部を有し、
前記パターン光は、前記第1方向の長さが互いに異なる複数の暗部を含み、
前記処理部は、
前記複数の暗部に対応する前記画像の複数の領域から、前記第1方向に交差する第2方向における強度分布を示す、互いに異なる複数の第1信号を取得し、
前記明部に対応する前記画像の領域から取得される前記第2方向における光強度分布を表す第2信号を、前記第1信号を用いて補正して前記情報を求めることを特徴とする計測装置。 A measuring device for measuring the shape of an object to be measured,
A processing unit for obtaining information on the shape of the measurement object based on an image obtained by imaging the measurement object on which the pattern light including alternating bright and dark portions is projected along the first direction; And
The pattern light includes a plurality of dark portions having different lengths in the first direction,
The processor is
Obtaining a plurality of different first signals indicating intensity distributions in a second direction intersecting the first direction from a plurality of regions of the image corresponding to the plurality of dark portions;
A measurement apparatus characterized by correcting the second signal representing the light intensity distribution in the second direction acquired from the image area corresponding to the bright portion using the first signal to obtain the information. .
前記パターン光が投影された前記被計測物を撮像して画像を取得する撮像部と、を更に有し、
前記処理部は、前記撮像部によって取得された画像に基づいて、前記被計測物の形状の情報を求める、ことを特徴とする請求項1乃至12のうちいずれか1項に記載の計測装置。 A projection unit that projects the pattern light onto the measurement object;
An image capturing unit that captures an image by capturing the object to be measured on which the pattern light is projected, and
The measurement apparatus according to claim 1, wherein the processing unit obtains information on a shape of the object to be measured based on an image acquired by the imaging unit.
前記計測装置による計測結果に基づいて、前記被計測物を保持して移動させるロボットと、
を有することを特徴とするシステム。 The measuring device according to any one of claims 1 to 13, which measures an object to be measured;
Based on the measurement result by the measurement device, a robot that holds and moves the object to be measured;
The system characterized by having.
前記計測装置の計測結果に基づいて前記被計測物を処理することにより物品を製造する工程と、を有することを特徴とする物品の製造方法。 A step of measuring an object to be measured using the measuring device according to any one of claims 1 to 13,
And a step of manufacturing the article by processing the object to be measured based on the measurement result of the measuring device.
第1方向に沿って明部と暗部とを交互に含むパターン光が投影された前記被計測物を撮像して得られる画像を取得する工程と、
前記画像に基づいて、前記被計測物の形状の情報を求める工程と、を有し、
前記情報を求める工程において、
前記暗部に対応する前記画像の領域から、前記第1方向に交差する第2方向における光強度分布を示す、互いに異なる複数の第1信号を取得し、
前記明部に対応する前記画像の領域から取得される前記第2方向における光強度分布を表す第2信号を、前記複数の第1信号のそれぞれを用いて補正することで得られる複数の補正信号の、それぞれの良否についての評価値を求め、
前記評価値が許容範囲内となる補正信号を用いて、前記情報を求めることを特徴とする算出方法。 A calculation method for calculating the shape of an object to be measured,
Obtaining an image obtained by imaging the object to be measured on which pattern light alternately including a bright part and a dark part is projected along the first direction;
Obtaining information on the shape of the object to be measured based on the image,
In the step of obtaining the information,
Obtaining a plurality of first signals different from each other indicating a light intensity distribution in a second direction intersecting the first direction from a region of the image corresponding to the dark portion;
A plurality of correction signals obtained by correcting, using each of the plurality of first signals, a second signal representing the light intensity distribution in the second direction acquired from the region of the image corresponding to the bright portion. The evaluation value about each quality is obtained,
A calculation method characterized in that the information is obtained by using a correction signal that makes the evaluation value within an allowable range.
第1方向に沿って明部と暗部とを交互に含むパターン光が投影された前記被計測物を撮像して得られる画像を取得する工程と、
前記画像に基づいて、前記被計測物の形状の情報を求める工程と、を有し、
前記パターン光は、前記第1方向の長さが互いに異なる複数の暗部を含み、
前記情報を求める工程において、
前記複数の暗部に対応する前記画像の複数の領域から、前記第1方向に交差する第2方向における強度分布を示す、互いに異なる複数の第1信号を取得し、
前記明部に対応する前記画像の領域から取得される前記第2方向における光強度分布を表す第2信号を、前記第1信号を用いて補正して前記情報を求めることを特徴とする算出方法。 A calculation method for calculating the shape of an object to be measured,
Obtaining an image obtained by imaging the object to be measured on which pattern light alternately including a bright part and a dark part is projected along the first direction;
Obtaining information on the shape of the object to be measured based on the image,
The pattern light includes a plurality of dark portions having different lengths in the first direction,
In the step of obtaining the information,
Obtaining a plurality of different first signals indicating intensity distributions in a second direction intersecting the first direction from a plurality of regions of the image corresponding to the plurality of dark portions;
A calculation method comprising: correcting the second signal representing the light intensity distribution in the second direction acquired from the area of the image corresponding to the bright portion using the first signal to obtain the information. .
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