JP2016122690A - LIGHT EMITTING DEVICE MANUFACTURING METHOD AND LIGHT EMITTING DEVICE - Google Patents

Abstract

A sealing layer is formed which is in close contact with a side surface of a phosphor layer and has an upper surface at a position higher than the upper surface of the phosphor layer. First, phosphor particles 5 and an uncured translucent resin 7 including beads serving as spacers are arranged on the upper surface of a light emitting element 10. Next, a sheet 8 having a predetermined shape with respect to the upper surface shape of the light emitting element 10 is mounted on the uncured translucent resin 7. Thereby, the upper surface of the uncured translucent resin 7 is molded by the lower surface of the sheet 8 to form the uncured translucent resin layer 7a. After disposing the sealing resin 11 around the uncured translucent resin 7, the sheet 8 is removed. [Selection] Figure 1

Description

  The present invention relates to a light emitting device in which a phosphor layer is disposed on a light emitting element.

  A semiconductor light emitting device that converts a part of light emitted from a light emitting element into fluorescence by arranging a phosphor layer on the light emitting element, and emits light mixed with the light emitted from the light emitting element and the fluorescence is disclosed in Patent Literature 1 and 2 etc.

  In the light emitting device described in Patent Document 1, a resin containing a phosphor is formed into a plate shape in advance, and this is mounted on the upper surface of the light emitting element. Then, the entire side surface of the light emitting element and the side surface of the phosphor layer are covered with a light-reflective resin so that light is emitted only from the upper surface of the phosphor layer. This provides a light emitting device with high front luminance.

  On the other hand, in the light-emitting device described in Patent Document 2, an uncured resin containing a phosphor is dropped on a light-emitting element, and a transparent plate-like member is disposed thereon, whereby a side surface of the resin containing the phosphor. However, the resin is cured after being formed so as to be an inclined surface connecting the side surface of the light emitting element and the side surface of the transparent plate member. Accordingly, the light emitted from the side surface of the light emitting element can be reflected upward by the inclined side surface of the phosphor resin layer, so that the side light emission of the light emitting element can be emitted from above without returning to the light emitting element. The light emission efficiency is improved.

JP 2009-218274 A JP 2012-4303 A

  In a light emitting device in which a phosphor layer is disposed on the upper surface of a light emitting element, the conversion efficiency of the phosphor layer can be improved by efficiently conducting heat generated by the phosphor layer to a mounting substrate or the like through the light emitting element. . Therefore, it is desired to make the phosphor particles as close as possible to the light emitting element and to make the layer thickness of the phosphor particles as thin as possible.

  In addition, as in Patent Document 1, the structure in which the light-reflecting resin and the phosphor layer are covered with the light-reflective resin so as to be in close contact with the light-emitting element and the phosphor layer is formed by covering the light-emitting element and the phosphor layer with the uncured light-reflecting resin. In addition, the uncured resin tends to crawl up to the upper surface of the phosphor layer. For this reason, it is not easy to cover the side surfaces of the phosphor layer and the like with a light-reflective resin without staining the upper surface of the phosphor layer.

  The objective of this invention is providing the manufacturing method of the light-emitting device which can form the sealing layer closely_contact | adhered to the side surface of the fluorescent substance layer of a thin film.

  In order to achieve the above object, in the present invention, a first step of disposing an uncured translucent resin containing phosphor particles on the upper surface of the light emitting element, on the uncured translucent resin, A second step of forming a sheet having a predetermined shape with respect to the upper surface shape of the light emitting element, and forming an uncured translucent resin layer whose upper surface is molded by the lower surface of the sheet; At least a light-transmitting resin layer with an uncured sealing resin around the light-emitting element, the translucent resin layer, and the sheet so that the light-emitting element, the translucent resin, and the side surface of the sheet are in close contact with each other. A third step of filling up to a position higher than the upper surface of the resin, and after curing the sealing resin, the sheet is peeled from the translucent resin layer and the sealing resin, thereby having an upper surface higher than the upper surface of the translucent resin. And surrounding the light emitting element and the translucent resin layer in close contact with their side surfaces, To provide a method of manufacturing a light emitting device and a fourth step of forming a sealing resin layer having an opening having a shape corresponding to the sheet to above the optical resin layer.

  According to the present invention, by covering the upper surface of the translucent resin layer with a sheet, a thin phosphor layer and a sealing layer in close contact with the side surface of the phosphor layer can be easily formed. By removing, the upper surface of the translucent resin layer can be exposed.

Explanatory drawing which shows the manufacturing method of the light-emitting device of (a)-(e) embodiment. Explanatory drawing which shows the manufacturing method of the light-emitting device of (f)-(i) embodiment. FIG. 3 is a cross-sectional view of the light emitting device manufactured in the first embodiment. FIG. 3 is a cross-sectional view of the light emitting device manufactured in the first embodiment. FIG. 3 is a cross-sectional view of the light emitting device manufactured in the first embodiment. Explanatory drawing which shows the method of peeling a sheet | seat using a needle | hook. Sectional drawing of another example of the light-emitting device manufactured in Embodiment 1. FIG. FIG. 3 is an explanatory diagram showing a state where the light emitting device of Embodiment 1 is picked up by a pickup nozzle 13. (A) Sectional drawing which shows 1 process of the manufacturing method of the light-emitting device of Embodiment 2, (b) Sectional drawing of the light-emitting device manufactured in Embodiment 2. (A) Sectional drawing which shows 1 process of the manufacturing method of another example of the light-emitting device of Embodiment 2, (b) Sectional drawing of another example of the light-emitting device manufactured in Embodiment 2. (A) Sectional drawing which shows 1 process of the manufacturing method of the light-emitting device of Embodiment 3, (b) Sectional drawing of the light-emitting device manufactured in Embodiment 3. (A) Sectional drawing which shows 1 process of the manufacturing method of another example of the light-emitting device of Embodiment 3, (b) Sectional drawing of another example of the light-emitting device manufactured in Embodiment 3. (A) And (b) The top view and sectional drawing which show 1 process of the manufacturing method of the light-emitting device of Embodiment 4, (c) Sectional drawing of the light-emitting device manufactured in Embodiment 4. (A) Sectional drawing which shows 1 process of the manufacturing method of another example of the light-emitting device of Embodiment 4, (b) Sectional drawing of another example of the light-emitting device manufactured in Embodiment 4.

  A method for manufacturing a light-emitting device according to an embodiment of the present invention will be described with reference to FIGS.

  The present invention is characterized by using the sheet 8 of FIG. 1 to mold the upper surface of the translucent resin layer 7 a and mask the upper surface of the translucent resin layer 7. First, an uncured translucent resin 7 including phosphor particles 5 is disposed on the upper surface of the light emitting element 10 (see FIGS. 1C and 1D). Next, a sheet 8 having a predetermined shape with respect to the upper surface shape of the light emitting element 10 is mounted on the uncured translucent resin 7 (see FIG. 1E). Thereby, the upper surface of the uncured translucent resin 7 is molded by the lower surface of the sheet 8 to form an uncured translucent resin layer 7a (FIG. 1 (e)). At this time, the sheet 8 has a function of masking the upper surface of the translucent resin layer 7a as well as a molding function. Therefore, the light-emitting element 10 and the translucent resin layer 7a are provided around the light-emitting element 10, the translucent resin layer 7a, and the sheet 8 while the sheet 8 performing the masking function is mounted on the translucent resin layer 7a. The uncured sealing resin is filled at least to a position higher than the upper surface of the translucent resin layer so as to be in close contact with the side surface of the sheet 8 (FIG. 2G). Thereby, without encapsulating the sealing resin on the upper surface of the translucent resin layer 7a, the light emitting element 10 and the translucent resin layer 7a are in close contact with each other and the height is higher than that of the translucent resin layer 7a. Higher sealing resin layer 11 can be formed. The sealing resin layer 11 can cover and cover all the side surfaces of the translucent resin layer 7a.

  After the sealing resin layer 11 is cured, the sheet 8 is peeled from the translucent resin layer 7a and the sealing resin layer 11 (FIG. 2 (i)). Thereby, in the sealing resin layer 11, the opening 13 having a shape corresponding to the sheet 8 is formed above the translucent resin layer 7a, and the upper surface of the translucent resin layer 7a is exposed, so that the light exit surface is formed. Can be used as Further, the sealing resin layer 11 having a height higher than the upper surface of the translucent resin layer 7 a is in close contact with the side surfaces of the translucent resin layer 7 and the light emitting element 10 and surrounds the periphery. Therefore, at the time of picking up the light emitting device, the nozzle can be brought into contact with the upper surface of the sealing resin, and damage due to the nozzle contact with the translucent resin layer 7a or the light emitting element 10 can be avoided.

  In particular, even when a small light emitting device having a sealing resin layer size that is too small to fit within the upper surface of the sealing resin layer is manufactured, the pickup nozzle is sealed from the upper surface of the translucent resin layer 7a. Since the upper surface of the resin layer is at a high position, the pickup nozzle does not contact the translucent resin layer 7a and the translucent resin layer 7a. For this reason, the damage by the nozzle contact to the translucent resin layer 7a or the light emitting element 10 can be avoided.

  Here, since the size of the light emitting element is about 1 mm square, the light emitting device in which the phosphor layer is arranged on one light emitting element is a very small device. When such a small light emitting device is mounted on a mounting substrate, a method is employed in which the light emitting device is vacuum-sucked by a vacuum pickup nozzle or the like, lifted, moved to the mounting substrate, and vacuum suction is released. However, when the pickup nozzle is in direct contact with the upper surface of the phosphor layer, a load of the pickup nozzle is applied to the phosphor layer and the light emitting element and an adsorption force is also applied, which may damage the phosphor layer and the light emitting element. For this reason, it is necessary to form a region where the pickup nozzle can come into contact with the surface other than the phosphor layer, but it is difficult to form such a region in a small light emitting device. Hereinafter, the manufacturing method will be described more specifically with reference to FIG.

<Embodiment 1>
As shown in FIGS. 1A and 1B, a substrate 1 having a wiring pattern 3 previously formed on the surface is prepared, and a light emitting element (semiconductor light emitting element) 10 is die-bonded. The number of light-emitting elements to be die-bonded may be one or plural, but here, a plurality of light-emitting elements are die-bonded on one substrate 1 to manufacture a plurality of light-emitting devices at a time. A method will be described.

  For example, as shown in FIG. 1A, the bonding material 2 is applied to the substrate 1, the light emitting element 10 is mounted, and the light emitting element 10 is die-bonded to the substrate 1 with the bonding material 2. At this time, the material and application region of the bonding material 2 are set according to the arrangement of the electrode pads of the light emitting element 10. For example, in the case of using a face-up type in which two electrode pads are arranged on the upper surface as the light emitting element 10, a non-conductive material is used as the bonding material 2, and the two electrode pads on the upper surface after die bonding are used. It connects to the wiring pattern 3 of the board | substrate 1 with a bonding wire. When a chip having a lower electrode pad and an upper electrode pad is used as the light emitting element 10, the lower electrode pad is bonded to the wiring pattern 3 of the substrate 1 with the conductive bonding material 2 as shown in FIG. The pad is connected to the wiring pattern 3 of the substrate 1 by the bonding wire 4. Further, when a flip chip type light emitting element 10 having two electrode pads arranged on the lower surface is used, the two flip chip electrode pads are electrically connected to the wiring pattern 3 of the substrate 1 as shown in FIG. The bonding materials 2 (for example, solder bumps and solder) are used for bonding.

  Next, uncured translucent resin 7 including phosphor particles 5 and beads 6 serving as spacers is disposed on the upper surface of light emitting element 10. At this time, phosphor particles and spacer beads dispersed in an uncured translucent resin may be applied on the light emitting element 10 by potting or the like, but only the phosphor particles 5 are shown in FIG. ), The phosphor particles 5 are made of uncured translucent resin 7 in which beads 6 serving as spacers are uniformly dispersed, as shown in FIG. 1 (d). It is also possible to employ a covering process. As a result, the phosphor particles 5 can be placed in contact with or close to the light emitting element 10, so that the heat generated by the phosphor particles 5 can be efficiently removed to the light emitting element 10.

  Specifically, a mixture of phosphor particles 5 in a volatile solvent is applied onto the light emitting element 10 by a dispenser or the like, and a thin layer of phosphor particles 5 is produced as shown in FIG. The application range may be the entire top surface of the light emitting element 10 or only a predetermined region. For example, as shown in FIG. 5, when the light emitting element 10 having a structure in which the light emitting layer 100a formed by epitaxial growth is mounted on the upper surface of the element substrate 100b is used, the light emitting layer 100a is formed slightly smaller than the element substrate 100b. Since it is often applied, the upper surface and the side surface of the light emitting layer 100 a are applied so as to be covered with the phosphor particles 5. At this time, by using a dispenser nozzle whose discharge port is about a fraction of the upper surface size of the light emitting element 10, a small amount of a volatile solvent in which the phosphor particles 5 are dispersed is applied onto the light emitting element 10. Phosphor particles can be applied. Thereafter, the layer of phosphor particles 5 is heated to volatilize the solvent.

  The thickness of the phosphor particle 5 layer is set according to the chromaticity required for the light emitting device. For example, it can be set to about 20 to 60 μm, particularly about 30 to 50 μm. The combination of the wavelength of the light emitted from the light emitting element 10 and the fluorescence emitted from the phosphor particles 5 is selected according to the required chromaticity. For example, it is possible to provide a light emitting device that emits white light by combining a blue light emitting element with a yellow phosphor or a blue light emitting element with green and red phosphors. It is also possible to combine a blue phosphor or the like with the light emitting element 10 that emits ultraviolet light.

  Next, as shown in FIG. 1D, an uncured translucent resin 7 in which beads 6 are dispersed is applied onto the layer of phosphor particles 5 by potting or the like. For example, by utilizing the surface tension of the uncured translucent resin 7, the translucent resin 7 is raised on the light emitting element 10, so that the uncured translucent resin 7 is applied only to the upper surface of the light emitting element 10. Can be applied. Thereby, the uncured translucent resin 7 covers the phosphor particles 5 and fills the spaces between the phosphor particles 5. Thereby, as shown in FIG. 5, the uncured translucent resin 7 including the phosphor particles 5 in contact with or close to the upper surface of the light emitting element 10 and the beads 6 serving as spacers disposed thereon is disposed. Is done.

  Next, the sheet 8 is disposed on the uncured translucent resin 7 as shown in FIG. Since the lower surface of the sheet 8 comes into contact with the upper surface of the uncured translucent resin 7 due to its own weight, the upper surface of the uncured translucent resin 7 is molded into a flat surface on the lower surface of the sheet 8. An uncured translucent resin layer 7a is formed. The thickness of the translucent resin layer 7 a is set by the particle size of the beads 6. The beads 6 have a particle diameter that allows the translucent resin layer 7 a to be formed, for example, a particle diameter of about 40 to 70 μm, so that the sheet 8 does not contact the bonding wire 4. Thereby, the bonding wire 4 can be protected. Note that when the flip chip type light emitting element 10 as shown in FIG. 4 that does not require the bonding wire 4 is used, the bonding wire is not connected, so the beads 6 do not need to be arranged. When the beads 6 are arranged, the shape and film thickness of the translucent resin layer 7a can be stably formed, and the particle size of the beads 6 can be designed freely. For the translucent resin 7, a resin that does not deteriorate with light or heat is selected. For example, when using the light emitting element 10 that emits blue light, it is desirable to use a silicone resin as the translucent resin 7. Moreover, it is preferable that the bead 6 is translucent, for example, the bead formed with glass, resin, etc. can be used.

  As the sheet 8, a sheet having a predetermined shape with respect to the upper surface shape of the light emitting element 10 is used. For example, it is possible to use a light emitting element 10 that is the same size as the upper surface size, larger by a predetermined size, or smaller by a predetermined size. It is also possible to use a sheet whose shape is perpendicular to the upper surface of the light emitting element 10. It is also possible to use a sheet having an inclined surface in which the inclination of the sheet 8 widens or narrows at a predetermined angle. Depending on the shape of the sheet 8, the shape of the uncured translucent resin layer 7a and the shape of the opening 13 of the sealing resin layer 11 formed in a later step can be formed into a desired shape. The sheet 8 having such a predetermined shape can be formed by cutting the sheet with a desired size and a desired inclination angle using, for example, a dicing blade. The shape of the sheet 8 and the shape of the opening 13 of the sealing resin layer 11 will be described in detail later. If the sheet 8 is mounted on the uncured translucent resin 7, the uncured translucent resin layer 7a is semi-cured or cured as necessary. As a semi-curing and curing method, a method according to the material of the translucent resin 7, for example, heating or ultraviolet irradiation is selected and used.

  As the sheet 8, a sheet having a property of repelling at least the translucent resin layer 7 a and the sealing resin layer 11 is used. For example, at least the lower surface and the side surface can be made of a fluorine-containing resin (for example, a fluorine resin such as PTFE (polytetrafluoroethylene) or amorphous fluorine resin). Since the upper limit of the upper surface height of the sealing resin layer 11 to be formed in a later step is determined by the thickness of the sheet 8, the thickness of the sheet 8 to be used is considered in consideration of the required height of the sealing resin layer 11. Design the size. If there is a bonding wire 4 or an electrostatic protection element connected to the light emitting element 10, the height of the sealing resin layer 11 needs to be set to a height at which they are completely covered. A thickness of 8 is selected. For example, the thickness of the sheet 8 can be set within a range of about 0.05 mm to 0.2 mm.

  Next, as shown in FIG. 2F, the frame 9 is arranged on the outer periphery of the substrate 1. Then, as shown in FIG. 2G, the light emitting element 10 and the light transmitting element are placed around the light emitting element 10, the light transmitting resin layer 7a, and the sheet 8 while the sheet 8 is mounted on the light transmitting resin layer 7a. The uncured sealing resin is filled up to at least a predetermined height higher than the upper surface of the translucent resin layer 7a so as to be in close contact with the side surface of the transparent resin layer 7a and the sheet 8. When the sealing resin is filled to a predetermined height, the sealing resin is cured and the sealing resin layer 11 is formed. The height of the sealing resin layer 11 is such that the sealing resin layer 11 is higher than the uppermost portion of the bonding wire 4 in the case where the light emitting element 10 is connected to the substrate 1 by the bonding wire 4. To design. However, if the sealing resin layer 11 is too high, the light emitted from the upper surface of the transparent resin layer 7a is obstructed when the light is emitted from the opening 13 to the outside. Therefore, the height is set so as not to hinder the emission of light to the outside. Further, when the light emitting element 10 is picked up by a pickup nozzle or the like, it can be picked up on the upper surface of the sealing resin layer 11 and the sealing resin layer 11 is prevented from contacting the upper surface of the translucent resin layer 7a. Design the height. As a method for curing the sealing resin, a method such as heating or ultraviolet irradiation is selected and used according to the material of the sealing resin. When the translucent resin layer 7a is uncured or semi-cured at this stage, it can be simultaneously cured in the step of curing the sealing resin layer 11. The sealing resin constituting the sealing resin layer 11 can be a light-reflective white resin in which reflective particles such as titanium oxide are dispersed.

  Next, as shown in FIG. 2H, the sealing resin layer 11 is cut at a position 12 as necessary, and is divided into individual light emitting devices.

  Thereafter, as shown in FIG. 2 (i), the sheet 8 is peeled from the translucent resin layer and the sealing resin. Specifically, for example, as shown in FIG. 6, two corners in a diagonal relationship of the sheet 8 are picked up simultaneously by a needle 12 having a thin tip, and the sheet 8 is translucent resin layer 7 a and sealing resin layer 11. Remove from and remove. At this time, if the load by the needle 12 is applied to the translucent resin layer 7a and the light emitting element 10 by a predetermined value or more, there is a possibility that problems such as leakage of the light emitting element 10 occur. For this reason, the operation of the needle 12 is controlled such that the load applied by the needle 12 is smaller than the load that causes the malfunction of the light emitting element 10 that has been obtained in advance. Thereby, the sealing resin layer 11 provided with the opening 13 having a shape corresponding to the sheet 8 can be formed above the translucent resin layer 7a as shown in FIG. 2 (i). Thus, a light emitting device can be manufactured.

  According to the manufacturing method, the sealing resin layer 11 can be formed in close contact with the side surface of the thin-film translucent resin layer 7a (phosphor layer) containing the phosphor particles 5, and the translucent The upper surface of the resin layer 7a can be exposed. For example, when the sealing resin layer 11 is composed of a light-reflecting white resin, according to the above manufacturing method, the white resin is adhered to the side surface of the phosphor particle-containing translucent resin layer 7a (phosphor layer). Since all of the side surfaces can be covered, light incident on the side surfaces of the translucent resin layer 7a can be efficiently reflected and emitted from the upper surface of the translucent resin layer 7a serving as a light emitting surface. The light can be increased. That is, a light emitting device with high emission efficiency can be provided. Moreover, according to the said manufacturing method, since white resin does not cover the upper surface of a translucent resin layer by the process of arrange | positioning a sheet | seat, even if the translucent resin layer 7a is thin, white resin does not cover By covering the upper surface of the translucent resin layer 7a, it is possible to stably supply a light emitting device that does not block emitted light.

  The light emitting device of FIGS. 3 to 5 and FIG. 7 manufactured by the above manufacturing method will be described.

  The light emitting device of FIG. 3 has a structure in which the light emitting element 10 includes electrode pads on the upper surface and the lower surface, and the electrode pads on the upper surface are connected to the wiring pattern 3 of the substrate 1 by bonding wires 4. The height of the sealing resin layer 11 is set higher than the uppermost part of the bonding wire 4. Since the phosphor particles 5 are disposed in contact with or close to the upper surface of the light emitting element 10, the heat of the phosphor particles 5 can be efficiently conducted to the light emitting element 10 and can be drawn off.

  In the light emitting device of FIG. 4, the light emitting element 10 is a flip chip, and a pair of electrode pads on the lower surface of the light emitting element 10 is connected to the wiring pattern 3 of the substrate 1 by a bonding material 2. Therefore, no bonding wire is used. Other configurations are the same as those of the light-emitting device of FIG.

  The light emitting device of FIG. 5 has a structure in which the light emitting element 10 includes a light emitting layer 100a that is an epitaxial layer on the upper surface of the element substrate 100b, and the phosphor particles 5 are disposed so as to cover the upper surface and side surfaces of the light emitting layer 100a. Has been. The pair of electrode pads of the light emitting element 10 are both disposed on the upper surface of the element substrate 100b and connected to the wiring pattern 3 of the substrate 1 by bonding wires, but are not shown in FIG. The height of the sealing resin layer 11 is set higher than the uppermost part of the bonding wire.

  In the light emitting device of FIG. 7, phosphor particles 5 and beads 6 are dispersed throughout the translucent resin layer 7a. The structure of the light emitting element 10 can be employed in any of the configurations shown in FIGS.

  In these light emitting devices of FIGS. 3 to 5 and FIG. 7, the sealing resin layer 11 has an upper surface higher than the upper surface of the translucent resin layer 7a, so that the pickup nozzle 130 is sealed as shown in FIG. The light emitting device can be picked up without being brought into contact only with the upper surface of the resin layer 11 and without being brought into contact with the upper surface of the translucent resin layer 7a.

  In these light emitting devices, the light emitting element 10 emits light of a predetermined wavelength by supplying electric power to the light emitting element 10 through the wiring pattern 3 of the substrate 1. Of the light emitted from the light emitting element 10, the light emitted from the upper surface is absorbed by the phosphor particles 5. Thereby, the phosphor particles 5 are excited and emit fluorescence. The light emitted from the light emitting element 10 and not absorbed by the phosphor particles 5 and the fluorescence emitted by the phosphor particles 5 are mixed and emitted from the upper surface of the translucent resin layer 7a. At this time, when the sealing resin layer 11 is formed of a light-reflective resin, light emitted from the side surfaces of the light-emitting element 10 and the light-transmitting resin layer 7a is reflected by the sealing resin layer 11; Light is emitted only from the upper surface of the light-sensitive resin layer 7a. Thus, a light emitting device with high front luminance can be provided.

  When the phosphor particles 5 are arranged in contact with or close to the light emitting element 10 as shown in FIGS. 3 to 5, the heat of the phosphor particles 5 is efficiently conducted to the light emitting element 10, and the substrate It is possible to efficiently dissipate heat through 1 or the like. Therefore, the temperature rise of the phosphor particles 5 can be suppressed, and the fluorescence emission efficiency of the phosphor particles 5 can be maintained high. For example, the whitening rate (= light emission of the light emitting device ÷ light emission of the light emitting element 10) can be brightened by about 10% as compared with the structure in which the phosphor particles 5 are dispersed throughout the translucent resin layer 7.

  On the other hand, as shown in FIG. 7, when the phosphor particles 5 are dispersed throughout the translucent resin layer 7a, the phosphor particles 5 exist up to the vicinity of the upper surface of the transparent resin layer 7a. The luminance of the upper surface of the resin layer 7a can be increased.

  In the light emitting device manufactured according to the present invention, the upper surface of the translucent resin layer 7 a including the phosphor particles 5 is exposed in the opening 13. Therefore, the light emitted from the upper surface of the translucent resin layer 7a can be directly emitted to the outside without passing through a plate-like member such as glass. For this reason, a light-emitting device with high light extraction efficiency and a large amount of light can be provided.

  Further, as shown in FIGS. 3 to 5, the beads 6 are mixed in the phosphor particles 5 by arranging the phosphor particles 5 on the light emitting element 10 before the application of the translucent resin 7. First, beads 6 are disposed on the layer of phosphor particles 5. Therefore, as shown in FIG. 7, compared with a configuration in which the phosphor particles 5 and the beads 6 are dispersed throughout the translucent resin layer 7, the light emitted from the light emitting element 10 is directly transmitted through the beads 6 ( Color loss) and the phenomenon of color unevenness can be reduced, and uniform light with less color unevenness can be emitted.

<Embodiment 2>
In the first embodiment described above, the case where the upper surface size of the light emitting element 10 and the size of the sheet 8 are equivalent as shown in FIGS. 1 to 7 has been described, but the present invention is not limited to the shape of the first embodiment. Another application example will be described.

  As shown in FIG. 9A, the sheet 8 has a side surface that is smaller than the lower surface in contact with the translucent resin layer 7a and has a side surface that is inclined so as to be tapered inward as it goes upward. It can be used in the step (e). The size of the lower surface of the sheet 8 is equivalent to the upper surface of the light emitting element 10. By using the sheet 8 having such a shape, the diameter of the opening 13 of the sealing resin layer 11 formed by removing the sheet 8 in the process of FIG. 2I is as shown in FIG. The distance decreases as the distance from the translucent resin layer 7 increases.

  Thereby, the minimum diameter of the opening 13 of the sealing resin layer 11 can be made smaller than the size of the light emitting layer 100a which is an epitaxial growth layer (FIG. 9B). In the region where the light emitting layer 100a around the light emitting element 10 is not disposed, the intensity of the emitted light decreases. In the light emitting device of FIG. 9B, the light emitting layer is formed by the inclination of the inner wall of the opening 13 of the sealing resin layer 11. An area where 100a is not arranged can be covered. Therefore, by forming the sealing resin layer 11 with a light-reflective resin, uniform light emission without color unevenness can be emitted from the opening 13.

  On the other hand, as shown in FIG. 10 (a), the sheet 8 has an upper surface larger than the lower surface in contact with the translucent resin layer 7a and has a side surface inclined so as to open outward as it goes upward. It can be used in the step (e). The size of the lower surface of the sheet 8 is equivalent to the upper surface of the light emitting element 10. By using the sheet 8 having such a shape, the diameter of the opening 13 of the sealing resin layer 11 formed by removing the sheet 8 in the process of FIG. 2I is as shown in FIG. The distance increases as the distance from the translucent resin layer 7 increases.

  As a result, light emitted from the light emitting layer 100a can be prevented from being reflected or absorbed by the inner wall of the opening 13 of the sealing resin layer 11, and much of the light emitted from the light emitting layer 100a can be obtained. The light can be emitted from the opening 13 to the outside. Therefore, a light emitting device with a large amount of emitted light can be provided.

  The manufacturing method of the light emitting device of FIGS. 9 and 10 is the same as that of the first embodiment except for the steps described above, and thus the description thereof is omitted.

<Embodiment 3>
The third embodiment will be described with reference to FIGS. 11 (a) and 11 (b). In the present embodiment, as shown in FIG. 11A, the sheet 8 having a lower surface that is in contact with the light-transmitting resin layer 7 a is smaller than the upper surface of the light emitting element 10. Thereby, in the process of FIG. 1E, the translucent resin layer 7a having the inclined side surface that connects the side surface of the light emitting element 10 and the lower surface of the sheet 8 can be formed. Further, when the sealing resin layer 11 is formed of a light-reflective material, the sealing resin layer 11 that is in close contact with the side surface of the translucent resin layer 7a is a peripheral portion where the light emitting layer 100a is not disposed. Cover the luminescence from. Therefore, in the light emitting device of FIG. 11B from which the sheet 8 has been peeled off, the sealing resin layer 11 on the side surface of the translucent resin layer 7a is formed in the region where the light emitting layer 100a is not disposed, as in FIG. 9B. Can be covered. Accordingly, similarly to FIG. 9B, the light emitting device of FIG. 11B can emit uniform light from the opening 13 while suppressing color unevenness.

  On the other hand, as shown in FIG. 12A, it is possible to use a sheet 8 having a lower surface in contact with the translucent resin layer 7 a that is larger than the upper surface of the light emitting element 10. In the step of FIG. 1E, the translucent resin layer 7a having a side surface inclined so as to open to the outside can be formed by connecting the side surface of the light emitting element 10 and the lower surface of the sheet 8. Therefore, in the light emitting device of FIG. 12B from which the sheet 8 has been peeled, the light emitted from the light emitting layer 100a is reflected or absorbed by the side surface of the translucent resin layer 7a, as in FIG. 10B. And much of the light emitted from the light emitting layer 100a can be emitted from the opening 13 to the outside. Therefore, a light emitting device with a large amount of emitted light can be provided.

<Embodiment 4>
The fourth embodiment will be described with reference to FIGS. In this embodiment, as shown in FIGS. 13A and 13B, as the sheet 8, one side 8a is positioned immediately above one side 10a of the outer periphery of the light emitting element 10, and at least one of the other sides 8b to 8d is a light emitting element. The thing of the magnitude | size located outside the other sides 10b-10d of 10 is used. By disposing such a sheet 8 on the uncured translucent resin 7 in the step of FIG. 1E, the opening 13 of the sealing resin layer 11 formed in the step of FIG. As shown in FIG. 13C, the inner wall of the light emitting device 10 is positioned immediately above the side 10a in one side 10a. The other sides 10b to 10d of the light emitting element 10 are located on the outer side from directly above the sides 10b to 10d.

  Therefore, the light emitted from the upper surface of the light-transmitting resin layer 7a of the light-emitting device in FIG. 13C is almost vertical by the inner wall of the opening 13 of the sealing resin layer 11 above the one side 10a of the light-emitting element 10. The light is emitted upward. On the other hand, in the other sides 10b to 10c of the light emitting element 10, the inner wall of the opening 13 of the sealing resin layer 11 is located on the outside of the light emitting element 10 directly above the sides 10b to 10c. Can spread out. By using such a light emitting device for a vehicle lighting device, the side 10a of the light emitting element 10 can be used as a cut-off line. With respect to the other sides 10b to 10d, light can be efficiently emitted at a wide angle.

  Similarly, as shown in FIG. 14A, as the sheet 8, the side surface of the one side 8a is perpendicular to the main plane, and at least one side surface such as the other side 8c is separated from the upper surface of the translucent resin layer 7a. The thing of the shape which inclines so that it may open outside can also be used. In this case, the inner wall of the opening 13 of the sealing resin layer 11 formed in the step of FIG. 2 (i) is in relation to the upper surface of the light emitting element 10 on one side 10a of the light emitting element 10 as shown in FIG. 14 (b). The other side 10c and the like of the light emitting element 10 has an inclined shape that opens outward as the distance from the upper surface of the translucent resin layer 7a increases.

  Therefore, the light emitted from the upper surface of the light-transmitting resin layer 7a of the light-emitting device in FIG. 14B is almost vertical above the one side 10a of the light-emitting element 10 by the inner wall of the opening 13 of the sealing resin layer 11. The light is emitted upward. On the other hand, since the inner wall of the opening 13 of the sealing resin layer 11 is inclined outward at the other side 10c of the light emitting element 10, the light from the translucent resin layer 7a can be spread and emitted. In such a light emitting device, the side 10a of the light emitting element 10 can be used as a cut-off line by using the side 8a for the vehicle lighting device. With respect to the other sides 10c and the like, light can be efficiently emitted at a wide angle.

  DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 2 ... Bonding material, 3 ... Wiring pattern, 4 ... Bonding wire, 5 ... Phosphor particle, 6 ... Bead, 7 ... Translucent resin, 7a ... Translucent resin layer, 8 ... Sheet, 9 ... Frame, 10 ... light emitting element, 11 ... sealing resin layer, 12 ... needle, 13 ... opening, 130 ... pickup nozzle

Claims (14)

A first step of arranging an uncured translucent resin containing phosphor particles on the upper surface of the light emitting element;
The uncured translucent resin layer in which a sheet having a predetermined shape is mounted on the uncured translucent resin with respect to the upper surface shape of the light emitting element, and the upper surface is molded by the lower surface of the sheet. A second step of forming
While the sheet is mounted on the translucent resin layer, the light emitting element, the translucent resin layer, and the sheet are in close contact with the light emitting element, the translucent resin layer, and the side surface of the sheet. A third step of filling the uncured sealing resin to a position higher than at least the upper surface of the translucent resin layer;
After curing the sealing resin, the sheet is peeled from the translucent resin layer and the sealing resin, thereby having an upper surface higher than the upper surface of the translucent resin layer, and the light emitting element and the And a fourth step of forming a sealing resin layer having an opening having a shape corresponding to the sheet above the translucent resin layer, surrounding the translucent resin layer in close contact with the side surfaces thereof. A method for manufacturing a light emitting device.   2. The method of manufacturing a light emitting device according to claim 1, wherein after the first step, the phosphor particles are arranged on the upper surface of the light emitting element, an uncured translucent resin including beads serving as a spacer is used. A method for manufacturing a light-emitting device, which is a step of arranging so as to cover phosphor particles.   3. The method of manufacturing the light emitting device according to claim 1, wherein in the second step, the upper surface of the uncured translucent resin is molded by the lower surface of the sheet, and then the translucent resin layer is formed. A method for manufacturing a light-emitting device, characterized by curing or semi-curing. 4. The method of manufacturing a light-emitting device according to claim 1, wherein the sheet has an inclined side surface that is larger than the lower surface in contact with the translucent resin, and has an inclined side surface. The size is equivalent to the upper surface of the light emitting element,
The method of manufacturing a light emitting device, wherein the diameter of the opening of the sealing resin layer formed in the fourth step increases as the distance from the translucent resin layer increases. 4. The method of manufacturing a light emitting device according to claim 1, wherein the sheet has an inclined side surface that is smaller than a lower surface in contact with the translucent resin, and has an inclined side surface. The size is equivalent to the upper surface of the light emitting element,
The method of manufacturing a light emitting device, wherein a diameter of the opening of the sealing resin layer formed in the fourth step is reduced as the distance from the translucent resin layer is increased. The light emitting device manufacturing method according to claim 5, wherein the light emitting element includes a light emitting layer formed by epitaxial growth on an upper surface,
A method of manufacturing a light emitting device, wherein a minimum diameter of the opening of the sealing resin layer is smaller than a size of the light emitting layer. 4. The method of manufacturing a light-emitting device according to claim 1, wherein a lower surface of the sheet that contacts the light-transmitting resin is smaller than an upper surface of the light-emitting element.
The method of manufacturing a light emitting device, wherein the second step includes forming the translucent resin layer having an inclined side surface that connects a side surface of the light emitting element and a lower surface of the sheet. 4. The method of manufacturing a light-emitting device according to claim 1, wherein a lower surface of the sheet that is in contact with the light-transmitting resin is larger than an upper surface of the light-emitting element.
The method of manufacturing a light emitting device, wherein the second step includes forming the translucent resin layer having an inclined side surface that connects a side surface of the light emitting element and a lower surface of the sheet.   4. The method for manufacturing a light-emitting device according to claim 1, wherein in the second step, the sheet is positioned immediately above one side of the outer periphery of the light-emitting element. By disposing on the uncured translucent resin such that two other sides are located outside the other side of the light emitting element, the opening of the sealing resin layer formed in the fourth step A method of manufacturing a light-emitting device, wherein an inner wall is located immediately above the one side of the light-emitting element and is located outside the other side of the light-emitting element.   4. The method for manufacturing a light emitting device according to claim 1, wherein in the second step, as the sheet, a side surface of one side is perpendicular to a main plane, and at least one other side is By using a shape inclined outward, the inner wall of the opening of the sealing resin layer formed in the fourth step is perpendicular to the upper surface of the light emitting element on the one side of the light emitting element. The method for manufacturing a light-emitting device, wherein the other side of the light-emitting element has an inclined shape that opens outward as the distance from the upper surface of the translucent resin layer increases. A light emitting element;
A translucent resin layer containing phosphor particles mounted on the upper surface of the light emitting element;
A sealing resin layer that closely surrounds and surrounds the light emitting element and the translucent resin layer,
The sealing resin layer has an upper surface higher than the upper surface of the translucent resin, and has an opening on the upper portion of the translucent resin layer that exposes the upper surface of the translucent resin layer. A light emitting device.   The light-emitting device according to claim 11, wherein the phosphor particles are disposed on an upper surface of the light-emitting element, and the translucent resin layer is disposed so as to cover the phosphor particles. Light-emitting device.   13. The light-emitting device according to claim 11, wherein an inner wall of the opening of the sealing resin layer is positioned immediately above the one side of the light-emitting element and on the other side of the light-emitting element. A light-emitting device, which is located on the outer side from directly above the side.   13. The light-emitting device according to claim 11, wherein an inner wall of the opening of the sealing resin layer is perpendicular to an upper surface of the light-emitting element on one side of the light-emitting element. The method for manufacturing a light-emitting device, characterized in that the side has an inclined shape that opens outward as the distance from the upper surface of the translucent resin layer increases.

Images