JP2016119445A - Solar cell, solar cell module, and assembly method of bypass diode - Google Patents

Abstract

The present invention provides a method for assembling a solar battery cell, a solar battery module, and a bypass diode. The solar battery cell includes a first ribbon and a second ribbon, wherein the first ribbon and the second ribbon are disposed on different surfaces of the substrate, and further includes at least one diode die. The first electrode of the diode die is electrically connected to the first ribbon, and the second electrode of the diode die is electrically connected to the second ribbon. Is electrically connected. The advantage of the present invention is that if a part of the solar cells is blocked by changing the design and assembly form of the bypass diode of the solar module and installing a corresponding bypass diode die for each solar cell. Ensures that only solar cells are isolated from the main circuit, greatly reduces the temperature when hot spots occur in the solar module, increases reliability in use and ensures maximum output power . [Selection] Figure 1A

Description

  The present invention relates to a solar cell module region, and more particularly to a solar cell, a solar cell module, and a bypass diode used for a crystalline silicon battery cell (P type, N type) and a corresponding module.

  Generally, a solar cell module is formed by combining a plurality of solar cells in parallel or in series connection, and is arranged so as to be arranged in an array. In the case of a plurality of solar cells or modules connected in series, the current passing through the inside is determined by the solar cell or module having the lowest ability to pass current. Thus, when a solar cell or module is damaged or obstructed, this battery is reverse biased due to its poor ability to conduct current, and in addition, other normally functioning solar cells in the circuit. There is a risk of being destroyed by the cell or module.

  In the prior art, a bypass diode is used in parallel with the solar cell module, and when this solar cell module is damaged or interrupted and becomes a load, the voltage across this bypass diode rises quickly. In order to achieve positive conduction, it is common to protect the solar cell module by passing a current through the bypass diode instead of the solar cell module.

  As an example in which one solar cell module is composed of 60 solar cells in the prior art, generally, there are three sets, and each set includes 20 solar cells connected in series. One bypass diode is installed for the solar cells connected in series. Therefore, it is necessary to install three bypass diodes for each solar cell module, and the maximum reverse bias voltage of each bypass diode is approximately 12 V (the output voltage of each solar cell is 0). .6V). If one of the 20 solar cells in each set is damaged or blocked, the bypass diode will shunt the current of the 20 series connected solar cells in the set and separate it from the main circuit . In construction, it is necessary to connect the bypass diode to the solar cell module side using a dedicated terminal box. One solar cell module may be composed of 96, 72, or 54 solar cells, and each set may have 32, 24, or 18 solar cells connected in series.

  For this reason, the bypass diode is expensive and difficult to assemble and maintain. In addition, there is only one bypass diode for each set of solar cells, and the extremely high demand for withstand voltage is a problem to be solved by the prior art.

  The technical problem to be solved by the present invention provides a method for assembling a solar cell, a solar cell module, and a bypass diode that can more effectively provide bypass protection to the solar cell.

  In order to solve the above problems, the present invention includes a substrate, a first set of ribbons, and a second set of ribbons, wherein the first set of ribbons includes a plurality of first ribbons, and the second set of ribbons. A set of ribbons comprises a plurality of second ribbons, wherein the first ribbon and the second ribbon are solar cells disposed on different surfaces of the substrate, further comprising at least one diode die, The first electrode and the second electrode are disposed on both opposing surfaces, the first electrode of the diode die is electrically connected to the first ribbon, and the second electrode of the diode die is connected to the second ribbon. Provided is an electrically connected solar cell.

  In the solar cell of the present invention, the first ribbon is electrically connected to the negative electrode finger of the substrate, the second ribbon is electrically connected to the positive electrode finger of the substrate, and the first electrode of the diode is It is a positive electrode, and the second electrode is a negative electrode. The first ribbon is electrically connected to the positive electrode finger of the substrate, the second ribbon is electrically connected to the negative electrode finger of the substrate, the first electrode of the diode is a negative electrode, and the second electrode is You may arrange | position so that it may be a positive electrode.

  The advantage of the above technical means is that a bypass diode can be installed for each solar cell, that is, “one solar cell corresponds to the protection of one parallel connected diode die (OCODP: If a solar cell becomes invalid due to the implementation of a protection form called “One Cell One Diode Protection” or “Cell Protected Module (CPM)” Only the cells are isolated from the main circuit of the battery chain, and other normally functioning solar cells in the battery chain can still generate electricity.

  The connection between the diode die and the ribbon can be realized in a plurality of installation forms, the diode die being installed in the through hole of the substrate, the installation between the two ribbons on the substrate side, and the ribbon Including, but not limited to, connecting to the ribbon via a connection structure.

  Further, in the solar cell of the present invention, the first ribbon and the second ribbon are installed symmetrically across the substrate, the second ribbon includes an extension portion, and the diode die includes the extension portion and the extension portion. The first electrode of the diode die is bonded to the first ribbon, and the second electrode of the diode die is bonded to the second ribbon.

  Further, in the solar cell of the present invention, further comprising a second extension finger, the second extension finger is installed on the surface of the substrate where the second ribbon is installed, connected to the second ribbon, A second electrode of the diode die is connected to the second extension finger via a second electrode connection piece, and a first electrode of the diode die is directly connected to the first ribbon via a first electrode connection piece. The

  The solar cell of the present invention further includes a first extension finger and a second extension finger, wherein the first extension finger and the second extension finger are installed on different surfaces of the substrate, respectively, Connected to a ribbon and a second ribbon, a first electrode of the diode die is connected to the first extension finger via a first electrode connection piece, and a second electrode of the diode die is connected to a second electrode connection piece Connected to the second extension finger.

  Further, in the solar cell of the present invention, the first ribbon and the second ribbon are installed symmetrically with the substrate interposed therebetween, and a through hole is further installed in the substrate, and the through hole is formed by the first ribbon. The diode die is located in a region covered by the first ribbon and the second ribbon, the diode die is fitted into the through hole, and is electrically isolated from the substrate by an insulating layer, and the first electrode of the diode die is connected to the first ribbon. The second electrode of the diode die is bonded to the second ribbon.

  The present invention further provides a solar cell module comprising an array of a plurality of solar cells, wherein the array comprises at least one of the solar cells.

  The present invention provides a substrate having a positive electrode surface and a negative electrode surface, a step of forming at least one through hole in the substrate, a step of covering a side wall of the through hole with an insulating layer, And inserting a diode die in which the positive electrode is exposed on the negative electrode surface of the substrate and the negative electrode is exposed on the positive electrode surface of the substrate.

  In the prior art solar cell module and diode die assembly method, whether the bypass diode die is conductive or not is determined by the fact that the bias voltage generated in the failed solar cell itself is sufficiently high and other normally functioning solar cells in the battery chain. This is determined by whether or not a larger negative bias voltage is required to resist the positive voltage generated in the battery cell. For example, in a conventional module with 60 solar cells, a failed solar cell needs to overcome the sum of the positive voltage of 19 solar cells and the voltage that causes the diode die to conduct. Thus, in order to conduct the diode dies connected in series, it is necessary to generate a negative bias voltage higher than the total voltage at least in the failed solar cell (this is more in the failed solar cell as a load). It means that a large reverse current is applied and more heat is generated). Similarly, a higher bias voltage is created in the failed solar cell to overcome the voltage of the 23 solar cells in order to conduct the series connected diode die of the solar cell module with 72 solar cells. There is a need to conduct the diode die and protect the failed solar cells.

  A diode die is connected in parallel to each solar cell module according to the present invention, and such a module has a more sensitive hot spot response capability than a conventional solar cell module. Cut-off area experiments that produce hot spots also prove that the module according to the invention has a smaller cut-off area for conducting the bypass diode die. (Since the hot spot blocking area of solar cells and the efficiency of solar cells are related, one range value must be provided.)

  For this reason, the advantage of the present invention is that a part of the solar cells are blocked by changing the design and assembly form of the bypass diode of the solar cell module and installing a corresponding bypass diode die for each solar cell. Module temperature when hotspots occur in the solar module, ensuring that only blocked solar cells are isolated from the main circuit, ensuring that other normally functioning solar cells in the solar chain can still generate electricity As a result, the reliability of use of the module is greatly reduced, and the maximum output power of the module is ensured. In addition, since each of the diode die and the substrate is a semiconductor material, the reinforcement of the contact surface between the diode die and the ribbon and the reinforcement between the substrate and the ribbon can be completed at the same time in the same process. Does not increase the process. Further, since it is not necessary to install a diode die in a terminal box having such a module, the wiring of the module becomes more convenient.

FIG. 1A is a schematic structural view of a first embodiment of a solar battery cell according to the present invention. FIG. 1B is an equivalent circuit diagram of the structure shown in FIG. 1A. FIG. 2A is a schematic view of an embodiment in which the solar cells shown in FIG. 1A are connected in series to form a battery chain, and further, a solar cell module is formed. FIG. 2B is an equivalent circuit diagram of the structure shown in FIG. 2A. FIG. 3A is a schematic structural diagram of a second embodiment of a solar battery cell according to the present invention. FIG. 3B is a schematic structural diagram of a second embodiment of a solar battery cell according to the present invention. FIG. 4A is a schematic structural diagram of a third embodiment of a solar battery cell according to the present invention. FIG. 4B is a schematic structural diagram of a third embodiment of a solar battery cell according to the present invention. FIG. 5 is a schematic structural view of a fourth embodiment of the solar battery cell according to the present invention. FIG. 6 is a step schematic diagram of an embodiment of a method of manufacturing the structure shown in FIG. FIG. 7A is a process schematic diagram of the method shown in FIG. FIG. 7B is a process schematic diagram of the method shown in FIG. FIG. 7C is a process schematic diagram of the method shown in FIG. FIG. 7D is a process schematic diagram of the method shown in FIG. FIG. 7E is a process schematic diagram of the method shown in FIG.

  Hereinafter, embodiments of a method for assembling a solar battery cell, a solar battery module, and a bypass diode according to the present invention will be described in detail with reference to the drawings.

  In the following embodiment, the first ribbon is arranged as a negative electrode ribbon and electrically connected to the negative electrode finger of the substrate, the second ribbon is arranged as a positive electrode ribbon and electrically connected to the positive electrode finger of the substrate, and a diode die In the (diode die), the first electrode is arranged as a positive electrode and the second electrode is arranged as a negative electrode.

  In other embodiments, the first ribbon is disposed as a positive ribbon and electrically connected to the positive finger of the substrate, the second ribbon is disposed as a negative ribbon and electrically connected to the negative finger of the substrate, and the diode die. The first electrode may be disposed as a negative electrode, and the second electrode may be disposed as a positive electrode.

  First, a first embodiment of a solar battery cell according to the present invention will be described with reference to the drawings.

  FIG. 1A is a structural schematic diagram of the present embodiment. The solar cell 1 according to the present embodiment includes a substrate 10, a first ribbon 11 and a second ribbon 12 are installed on each of different surfaces of the substrate 10, and the first ribbon 11 and the second ribbon are provided. 12 are installed symmetrically across the substrate. The solar battery cell 1 may be an N-type battery cell or a P-type battery cell. In FIG. 1A, a solar battery cell manufactured from a P-type silicon wafer is taken as an example. The first ribbon 11 is electrically connected to a negative electrode finger (not shown) of the substrate 10, and the second ribbon 12 is electrically connected to a positive electrode finger (not shown) of the substrate 10. The second ribbon 12 includes an extension (not shown), that is, the second ribbon 12 extends outward from the periphery of the substrate 10. The first ribbon 11 itself needs to extend and be connected to the positive electrode finger of another adjacent solar battery cell. The first ribbon 11 and the second ribbon 12 are metals that can be welded to fingers. The diode die 13 is installed between the extension of the second ribbon 12 and the first ribbon 11, and the positive electrode 131 of the diode die 13 is bonded to the first ribbon 11, and the negative electrode 132 of the diode die 13. Is bonded to the second ribbon 12. The laminating may be realized by welding or conductive tape bonding. The first ribbon 11 and the second ribbon 12 may be one set or a plurality of sets. In the case of a plurality of sets, at least one set is arranged in the structure according to the present embodiment. The diode die 13 means a piece-like structure having a diode die structure cut directly from a wafer, and is used directly without being packaged. The wafer and substrate 10 for manufacturing the diode die 13 generally have approximate thicknesses, thus ensuring the realization of the parallel sandwich structure shown in FIG. 1A. Since each of the diode die 13 and the substrate 10 is a semiconductor material, the reinforcement of the contact surface between the diode die 13 and the ribbon and the reinforcement between the substrate 10 and the ribbon can be completed at the same time in the same process. Does not increase materials and reinforcement processes. The diode die 13 has a cross-sectional shape in a direction perpendicular to the drawing selected from a rectangle, a circle, an oval, and a polygon.

  As shown in FIG. 1B, the equivalent circuit diagram of the structure shown in FIG. 1A is bypassed with respect to one solar cell 1 in which the diode die 13 is independent by connecting the solar cell 1 and the diode die 13 in parallel. Functions as a diode.

  In other embodiments, a plurality of diode dies 13 may be sandwiched in parallel between the first ribbon 11 and the second ribbon 12 to reinforce bypass current passing performance.

  FIG. 2A is a schematic view of an embodiment in which the solar battery cells 1 shown in FIG. 1A are connected in series to form a battery chain, and further a solar battery module is formed. The first ribbon 11 in the substrate 10 of the solar cell 1 and the second ribbon 202 in the substrate 200 of the adjacent solar cell 20 are the same ribbon, and the first ribbon in the substrate 210 of the other adjacent solar cell 21. 211 and the second ribbon 12 on the substrate 10 are the same ribbon, thereby forming a battery chain connected in series. Note that the solar battery cell 20 and the solar battery cell 21 may have similar parallel-connected diode dies 203 and 213.

  In the equivalent circuit diagram of the structure shown in FIG. 2A, as shown in FIG. 2B, a corresponding bypass diode is installed for each solar cell. Thereby, when a solar cell becomes invalid, only that solar cell is isolated from the main circuit, ensuring that other normally functioning solar cells in the battery chain can still generate electricity. And since one bypass diode respond | corresponds only to one photovoltaic cell, the request | requirement with respect to the withstand voltage of the said bypass diode becomes low significantly. In the case of a silicon-based solar cell, the maximum reverse bias voltage of the bypass diode only needs to be 0.6V. The market price of the diode and the maximum reverse bias voltage are consistent, so the number of diodes is increased compared to installing one bypass diode for a series of solar cells, but a single diode The cost is significantly reduced. Moreover, since the diode die that is not packaged has a small plane area and is only a few square millimeters, it can be placed in a gap between the solar cell arrays, and the volume of the entire solar cell module does not increase.

  Next, 2nd Embodiment of the photovoltaic cell concerning this invention is described, referring drawings.

  3A and 3B are schematic structural views of the solar battery cell according to the present embodiment, which includes a substrate 30, and a first ribbon 31 and a second ribbon 32 are installed on each of different surfaces of the substrate 30. 3A is a view on the first ribbon 31 side, and FIG. 3B is a view on the second ribbon 32 side. In the above two figures, the structure of the relative back side is indicated by a broken line. The first ribbon 31 and the second ribbon 32 are placed symmetrically with the substrate 30 in between. The first ribbon 31 is electrically connected to the negative electrode finger of the substrate 30, and the second ribbon 32 is electrically connected to the positive electrode finger of the substrate 30.

  3B, a second extension finger 321 is further installed on the surface on which the second ribbon 32 is located, and the second extension finger 321 is a surface on which the second ribbon 32 in the substrate 30 is installed. And is connected to the second ribbon 32. 3B, the negative electrode of the diode die 33 is connected to the second extension finger 321 through a second electrode connection piece 342 (that is, a negative electrode connection piece), and further, the second ribbon 32 and the substrate 30 are connected. Connected to the positive finger. The second extension finger 321 may be attached to the surface of the substrate 30 with a metal strip, or may be coated on the surface of the substrate 30 by being coated with a conductive slurry. As shown in FIG. 3A, the positive electrode of the diode die 33 is directly connected to the first ribbon 31 via the first electrode connection piece 341 (that is, the positive electrode connection piece), and further, to the negative electrode finger of the substrate 30 Connected. The material of the first electrode connection piece 341 (that is, the positive electrode connection piece) and the second electrode connection piece 342 (that is, the negative electrode connection piece) may be a metal or other conductive material. It may be the same as the ribbon material.

  The second extension finger 321 may be adjusted by a screen print plate and printed on the positive electrode surface of the substrate (that is, the surface on which the second ribbon 32 is located). The connection line is printed as a second extension finger 321 by screen printing, and is thereby welded to the first electrode connection piece 341 (that is, the positive electrode connection piece).

  Each of the fingers of any of the solar cells in the battery chain is connected to the finger on the opposite side of the adjacent battery cell on the different side with the same ribbon (see FIG. 2A), so either one side In addition, at least one ribbon needs to extend beyond the edge of the battery cell. In the present embodiment, the first ribbon 31 extends beyond the edge of the battery cell. When the second ribbon 32 extends beyond the battery cell on the other side of the battery cell and the diode die 33 is installed on this side, the positive electrode and the negative electrode described in the above embodiment may be switched.

  The diode die 33 means a piece-like structure having a diode structure cut directly from a wafer, and is used directly without being packaged. Since the wafer and the substrate 30 for manufacturing the diode die 33 generally have an approximate thickness, smooth implementation of the parallel sandwich structure of the substrate 30 and the diode die 33 shown in FIGS. 3A and 3B can be ensured. . Since each of the diode die 33 and the substrate 30 is a semiconductor material, the reinforcement of the contact surface between the diode die 33 and the two connection pieces and the reinforcement between the substrate 30 and the two ribbons are performed in the same process. Completed at the same time and does not increase extra reinforcement materials and processes.

  In other embodiments, a plurality of diode dies 33 may be installed in parallel, electrically connected to the ribbon via the same or different connection pieces in series or parallel connection, and the series connection reduces the withstand voltage of the bypass. The parallel connection can reinforce the current passing performance of the bypass.

  An equivalent circuit diagram of the above structure, a schematic structure diagram of the solar cell module, and an equivalent circuit diagram are similar to those of the first embodiment, and a description thereof will be omitted. Similar to the above embodiment, the structure according to this embodiment is also configured so that when a certain solar battery cell becomes invalid, only the relevant battery cell is isolated from the main circuit, and other normally functioning solar battery cells in the battery chain. Is still guaranteed to generate electricity, and unpackaged diode dies have a small plane area, only a few square millimeters, and meet the insulation requirements as long as the connecting piece length is a few millimeters. The solar cell module can be installed in a gap between the solar cell cell arrays, and the volume of the entire solar cell module does not increase.

  Next, a third embodiment of the solar battery cell according to the present invention will be described with reference to the drawings.

  4A and 4B are schematic structural views of the solar battery cell according to the present embodiment. A first ribbon 41 and a second ribbon 42 are installed on each of the different surfaces of the substrate 40, FIG. 4A is a view of the first ribbon 41 side, and FIG. 4B is a view of the second ribbon 42 side. FIG. In the above two figures, the structure of the relative back side is indicated by a broken line. The first ribbon 41 and the second ribbon 42 are installed symmetrically with the substrate 40 in between. The first ribbon 41 is electrically connected to the negative finger of the substrate 40, and the second ribbon 42 is electrically connected to the positive finger of the substrate 40.

  As shown in FIG. 4A, a first extension finger 411 is further installed on the surface on which the first ribbon 41 is located, and the first extension finger 411 is a surface on which the first ribbon 41 in the substrate 40 is installed. Is connected to the first ribbon 41, and the positive electrode of the diode die 43 is connected to the first extension finger 411 via the first electrode connection piece 441 (that is, the positive electrode connection piece). 4B, a second extension finger 421 is further installed on the surface on which the second ribbon 42 is located, and the second extension finger 421 is a surface on which the second ribbon 42 in the substrate 40 is installed. Is connected to the second ribbon 42, and the negative electrode of the diode die 43 is connected to the second extension finger 421 via the second electrode connection piece 442 (that is, the positive electrode connection piece). The first extension finger 411 and the second extension finger 421 may be attached to the surface of the substrate 40 with a metal strip, or may be formed on the surface of the substrate 40 by being coated with a conductive slurry (screen printing). The material of the first electrode connection piece 441 (that is, the positive electrode connection piece) and the second electrode connection piece 442 (that is, the negative electrode connection piece) may be a metal or other conductive material, and the ribbon on the surface of the substrate 40. It may be the same as the material. In this embodiment, in order to improve the insulation performance between the first electrode connection piece 441 (that is, the positive electrode connection piece) and the second electrode connection piece 442 (that is, the negative electrode connection piece), the first electrode connection piece 441 ( That is, the end connected to the diode die 43 in the positive electrode connection piece) has a bend, so that the main part of the second electrode connection piece 442 (that is, the negative electrode connection piece) and the first electrode connection piece 441 (that is, the positive electrode) A distance L is placed between the main part of the connection piece) and the insulation between them is enhanced.

  Since each of the fingers of the solar cell needs to be connected to the adjacent solar cell on a different side (see FIG. 2A), at least one ribbon on either side of the solar cell edge Need to extend more. In the present embodiment, the second ribbon extends beyond the edge of the solar battery cell. When the first ribbon extends beyond the solar battery cell, the positive electrode and the negative electrode described in the above embodiment may be exchanged.

  The diode die 43 refers to a piece-like structure having a diode structure cut directly from a wafer, and is used directly without being packaged. Since the wafer and the substrate 40 for manufacturing the diode die 43 generally have an approximate thickness, smooth implementation of the parallel sandwich structure of the substrate 40 and the diode die 43 shown in FIGS. 4A and 4B can be ensured. . Since each of the diode die 43 and the substrate 40 is a semiconductor material, the reinforcement of the contact surface between the diode die 43 and the two connection pieces and the reinforcement between the substrate 40 and the two ribbons are performed in the same process. Can be completed at the same time and does not increase extra reinforcement materials and processes.

  In other embodiments, a plurality of diode dies 43 may be installed in parallel, electrically connected to the ribbon via the same or different connection pieces in series or parallel connection, and the series connection reduces the withstand voltage of the bypass. The parallel connection can reinforce the current passing performance of the bypass.

  An equivalent circuit diagram of the above structure, a schematic structure diagram of the solar cell module, and an equivalent circuit diagram are similar to those of the first embodiment, and a description thereof will be omitted. Similar to the above embodiment, the structure according to this embodiment is also configured so that when a certain solar battery cell becomes invalid, only the relevant battery cell is isolated from the main circuit, and other normally functioning solar battery cells in the battery chain. Is still guaranteed to generate electricity, and unpackaged diode dies have a small plane area, only a few square millimeters, and meet the insulation requirements as long as the connecting piece length is a few millimeters. The solar cell module can be installed in a gap between the solar cell cell arrays, and the volume of the entire solar cell module does not increase.

  Next, a fourth embodiment of the solar battery cell according to the present invention will be described with reference to the drawings.

  FIG. 5 is a schematic structural diagram of a solar battery cell according to this embodiment. A first ribbon 51 and a second ribbon 52 are provided on each of different surfaces of the substrate 50, and the first ribbon 51 and the second ribbon 52 are installed symmetrically across the substrate. Is done. The first ribbon 51 is electrically connected to the negative electrode finger of the substrate 50, and the second ribbon 52 is electrically connected to the positive electrode finger of the substrate 50. The substrate 50 is provided with a through hole (not shown), the through hole is located in a region covered by the first ribbon 51 and the second ribbon 52, and the diode die 53 is It is fitted into the through hole and is electrically isolated from the substrate 50 by the insulating layer 54. The insulator filled in the insulating layer 54 is made of an elastic material, and is, for example, one of an infrared solidified adhesive, an ultraviolet solidified adhesive, and a heat solidified adhesive, and the diode die 53 and It is ensured that the through hole is in close contact with the insulating layer 54 in between. The negative electrode of the diode die 53 is bonded to the second ribbon 52, and the positive electrode of the diode die 53 is bonded to the first ribbon 51. The through hole is located between the first ribbon 51 and the second ribbon 52, can reduce the occupation of the surface of the substrate 50 to the minimum, and does not affect the light absorption efficiency.

  The diode die 53 means a piece-like structure having a diode structure cut directly from a wafer, and is used directly without being packaged. Since the wafer and substrate 50 for manufacturing the diode die 53 generally have an approximate thickness, it is ensured that the surface after the diode die 53 shown in FIG. it can. Since each of the diode die 53 and the substrate 50 is a semiconductor material, the reinforcement of the contact surface between the diode die 53 and the two connection pieces and the reinforcement between the substrate 50 and the two ribbons are performed in the same process. Can be completed at the same time and does not increase extra reinforcement materials and processes.

  In another embodiment, a plurality of through holes for installing a plurality of diode dies 53 are installed in parallel between the first ribbon 51 and the second ribbon 52 to reinforce the bypass current passing performance. Is done.

  An equivalent circuit diagram of the above structure, a schematic structure diagram of the solar cell module, and an equivalent circuit diagram are similar to those of the first embodiment, and a description thereof will be omitted. Similar to the above embodiment, the structure according to this embodiment is also configured so that when a certain solar battery cell becomes invalid, only the relevant battery cell is isolated from the main circuit, and other normally functioning solar battery cells in the battery chain. Since the diode die is installed inside the solar cell, the volume of the entire solar cell module does not increase.

  Next, an embodiment of a method for manufacturing a structure according to the fourth embodiment will be described with reference to the drawings. FIG. 6 is a schematic diagram of steps in the present embodiment. Step S60 for providing a substrate having a positive electrode surface and a negative electrode surface; Step S61 for forming at least one through hole in the substrate; Step S62 for covering a side wall of the through hole with an insulating layer; Step S63 for fitting a diode die in which the positive electrode and the negative electrode are exposed on the positive electrode surface and the negative electrode surface of the substrate, respectively, and Step S64 for forming a ribbon on the substrate surface on both sides facing the through hole.

  As shown in FIG. 7A, in step S60, a substrate 70 having a positive electrode surface and a negative electrode surface is provided. The substrate 70 is provided with a vertical PN junction structure (not shown) for a solar cell, and the PN junction structure may be formed by any conventional method. The vertical PN junction forms a positive electrode surface that is a P-type surface and a negative electrode surface that is an N-type surface in the substrate 70.

  As shown in FIG. 7B, in step S61, at least one through hole 71 is formed in the substrate. The method of forming the through hole 71 may be laser etching, plasma etching, or chemical corrosion.

  As shown in FIG. 7C, in step S62, the side wall of the through hole 71 is covered with an insulating layer 74. The insulating layer 74 may be made of an elastic material, and ensures that a diode die to be fitted later and the through hole 71 are in close contact with the insulating layer 74 interposed therebetween. In order to further ensure the bond between the diode die that will be fitted later and the insulating layer 74, preferably the insulating layer is comprised of an infrared solidifying adhesive, an ultraviolet solidifying adhesive and a heat solidifying adhesive. Manufactured with any solidified adhesive.

  As shown in FIG. 7D, in step S <b> 63, a diode die 73 having a positive electrode exposed on the negative electrode surface of the substrate 70 and a negative electrode exposed on the positive electrode surface of the substrate 70 is fitted into the through hole 71. The diode die 73 and the through hole 71 are in close contact with the insulating layer 74 interposed therebetween.

  In an embodiment in which the insulating layer 74 is made of a solidified adhesive, after this step, it is necessary to further include a step of solidifying the insulating layer 74 so as to fix the diode die 73.

  Thus, the diode die 73 has already been fitted into the substrate 70 and functions as a bypass diode as long as electrical connection with the substrate 70 is formed. There are many methods for forming electrical connections, and one direct method is to form a first ribbon and a second ribbon on the substrate surface on opposite sides of the through hole using the method of FIG. 7E and step S64. The diode die 73 is directly bonded. In another embodiment, a certain distance may be placed between the ribbon and the through hole 71, and both may be electrically connected by a connecting strip to form a peripheral conductive structure.

  The above is only a preferred embodiment of the present invention. For those skilled in the art, some changes and modifications can be made on the assumption that the gist of the present invention is not deviated, and these changes and modifications belong to the protection scope of the present invention.

Claims (11)

A substrate, a first set of ribbons, and a second set of ribbons, wherein the first set of ribbons includes a plurality of first ribbons, and wherein the second set of ribbons includes a plurality of second ribbons, A solar cell in which a first ribbon and a second ribbon are installed on different surfaces of the substrate,
Further comprising at least one diode die, wherein the first electrode and the second electrode of the diode die are disposed on opposite surfaces, and the first electrode of the diode die is electrically connected to the first ribbon; The solar cell, wherein the second electrode of the diode die is electrically connected to the second ribbon.   The first ribbon and the second ribbon are disposed symmetrically across the substrate; the second ribbon includes an extension; and the diode die is disposed between the extension and the first ribbon; The solar cell according to claim 1, wherein a first electrode of a diode die is bonded to the first ribbon, and a second electrode of the diode die is bonded to the second ribbon.   The solar cell according to claim 2, wherein a peripheral edge of the extension portion of the second ribbon is located inside a peripheral edge of the diode die.   A second extension finger, wherein the second extension finger is disposed on a surface of the substrate on which the second ribbon is disposed, connected to the second ribbon, and the second electrode of the diode die is connected to the second electrode. The first electrode of the diode die is connected directly to the first ribbon through a first electrode connection piece, connected to the second extension finger through a piece. Solar cells.   The diode further comprises a first extension finger and a second extension finger, wherein the first extension finger and the second extension finger are respectively installed on different surfaces of the substrate and connected to the first ribbon and the second ribbon, respectively, A second electrode of the die is connected to the second extension finger via a second electrode connection piece, and a first electrode of the diode die is connected to the first extension finger via a first electrode connection piece. The solar cell according to claim 1, wherein   The first ribbon and the second ribbon are installed symmetrically across the substrate, and a through hole is further installed in the substrate, and the through hole is located in a region covered by the first ribbon and the second ribbon. The diode die is fitted in the through hole, electrically isolated from the substrate by an insulating layer, the first electrode of the diode die is bonded to the first ribbon, and the second electrode of the diode die is The solar cell according to claim 1, wherein the solar cell is bonded to the second ribbon. A solar cell module comprising an array of a plurality of solar cells,
The said array is provided with the photovoltaic cell as described in any one of Claims 1-5 at least, The solar cell module characterized by the above-mentioned. Providing a substrate comprising a positive electrode surface and a negative electrode surface;
Forming at least one through hole in the substrate;
Covering the side wall of the through hole with an insulating layer;
A step of fitting a diode die in which the positive electrode is exposed on the negative electrode surface of the substrate and the negative electrode is exposed on the positive electrode surface of the substrate in the through hole;
A method of assembling a bypass diode, comprising:   9. The bypass diode assembling method according to claim 8, wherein the insulating layer is made of an elastic material, and the diode die and the through hole are in close contact with the elastic material interposed therebetween.   The bypass according to claim 8, further comprising the step of solidifying the insulating layer to fix the diode die after the step of fitting the diode die, wherein the insulating layer is made of a solidified adhesive. How to assemble a diode.   9. The method of assembling a bypass diode according to claim 8, further comprising the step of forming a first ribbon and a second ribbon on the surface of the substrate on opposite sides of the through hole.