JP2016115796A - Electric apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve workability of creating a duct. A housing 2 having a front wall 6 and a back wall 8 is divided into a heat sink chamber 18 and a component mounting chamber 20 by a heat sink mounting wall 16. A large number of electronic components are arranged in the component mounting chamber 20 to constitute a plurality of electric circuits. A duct 30 is integrally provided along the direction connecting the front wall 6 and the back wall 8 on the component mounting room 20 side of the heat sink mounting wall 16, and transmission lines 40, 42, 48, 50 are arranged in the duct 30. Has been. [Selection] Figure 1

Description

  The present invention relates to electrical equipment, and more particularly to processing of transmission lines arranged in a housing.

  Conventionally, there has been a technique disclosed in Patent Document 1 in order to improve the workability of wiring laying. In the technique of Patent Document 1, the edge of the copper plate box plate constituting the box body of the switchboard is bent into a U-shape, and this bent portion is used as a wiring space to form an L shape made of copper plate. One side of the folded shielding plate and one side of the box plate folded in a U-shape are overlapped and fixed, and the opening of the wiring space is covered with the other side of the shielding plate to form a duct. .

JP-A-11-289611

  According to the technique of Patent Document 1, in order to configure a duct, an edge portion of a box body plate is folded into a U-shape, and an L-shaped shielding plate created separately is formed on the folded portion. Installation was necessary, and workability of duct creation was bad.

  An object of this invention is to provide the electric equipment which improved the workability | operativity of creation of a duct.

  The electric device of one embodiment of the present invention includes a housing. The housing has first and second walls facing each other. As the first and second walls, for example, a flat plate can be used, or a curved plate can be used. A third wall is located between the first and second walls and partitions the casing into first and second rooms. The third wall can also be conductive. A plurality of electrical components are arranged in the second room. As an electrical component, for example, a heat generating component such as a semiconductor element or a transformer can be included. These heat-generating components can be mounted on a printed circuit board, for example. For example, in the case where the electrical device is a power supply device and includes an AC-DC converter, a DC-AC converter, and a controller of the DC-AC converter, these electrical components are used for each block. A plurality of transmission lines for connecting the plurality of electrical components are provided, and the plurality of transmission lines include at least one transmission line disposed between the first and second walls. These transmission lines can be used to connect, for example, the electrical components in the above-described block, and can also be used to connect each block. A duct is integrally provided on the second room side of the third wall, and the duct is disposed along a direction connecting the first and second walls, and the at least one transmission line is connected to the third wall. Contained.

  In the electrical apparatus configured as described above, since the duct is integrally provided on the third wall, if the third wall is disposed between the first and second walls, the installation of the duct is easily completed. . Therefore, the workability of duct installation is improved. Note that if the third wall and the duct are made of a conductive material, a shielding effect can be obtained.

  The third wall may have a window. In this case, a part of the heat sink disposed in the first room is attached to the third wall so as to be exposed from the window to the second room. Heat generating components in the plurality of electrical components are attached to the heat sink exposed from the window in the second room. If comprised in this way, a duct can be comprised originally using the 3rd wall for attaching a heat sink, and cost can be reduced. Moreover, the heat generating component can be attached to the heat sink through the window, and it becomes easy to connect the heat generating component to the electric component in the second room.

  The duct may be formed by cutting and raising a part of the third wall. If comprised in this way, a 3rd wall can be used as a material for comprising a duct, and the operation | work which attaches a duct structural member to a 3rd wall becomes unnecessary.

  As described above, according to the present invention, it is possible to improve the workability of creating a duct that accommodates a transmission line.

1 is a partially omitted plan view, a partially omitted side view, and a partially omitted front view of an electric apparatus according to an embodiment of the present invention. It is a top view of the heat sink attachment wall used with the electric equipment of FIG. FIG. 3 is a front view of a state in which transmission lines are bound to a duct of the heat sink of FIG. 2.

  An electrical apparatus according to an embodiment of the present invention is obtained by implementing the present invention on, for example, a power supply device for electroplating, and has a housing 2 as shown in FIGS. The housing 2 has a substantially rectangular bottom wall 4 as shown in FIGS. A first wall, for example, a front wall 6 is provided at one edge of the bottom wall 4. At the other edge of the bottom wall 4, a second wall, for example, a back wall 8 is provided. The front wall 6 and the back wall 8 are rectangular shapes that are perpendicular to the bottom wall 4 and parallel to each other. A front panel (not shown) is attached to the front surface of the front wall 6. The housing 2 has a lid (not shown). This lid has a rectangular shape arranged so as to cover the upper end of the front wall 6 and the back wall 8, has rectangular side walls 10 at both ends thereof, and has an inverted U shape by the lid and both side walls. There is no. The bottom wall 4, the front wall 6, the back wall 8, the lid and the side wall 10 are all made of metal, for example.

  In the housing 2, a rectifying / smoothing unit that rectifies and smoothes a commercial AC power source into a DC power source, and an AC-DC converting unit that converts the DC power source from the rectifying / smoothing unit into an AC power source having a desired frequency, for example, An inverter, a control unit that controls the inverter, and an AC-DC conversion unit that converts a desired alternating current into a direct current and outputs the alternating current are provided.

  Among these, a heat generating component, for example, a plurality of semiconductor elements constituting an inverter, specifically, an IGBT 12 and a rectifying diode bridge 13 constituting a rectifying / smoothing unit are heat sinks 14 (in FIG. 1, roughly in a block shape). Although shown, it actually has a large number of fins). As shown in FIG. 1C, the IGBT 12 is attached below the heat sink 14, and the rectifying diode bridge 13 is attached above the heat sink 14.

  In order to mount the heat sink 14 in the housing 2, a third wall, for example, a heat sink mounting wall 16, is disposed between the front wall 6 and the back wall 8. The housing 2 is partitioned by the heat sink mounting wall 16 into first and second rooms, for example, a heat sink room 18 and a component mounting room 20.

  As shown in FIG. 2, the heat sink mounting wall 16 has a substantially rectangular main wall 22 and an L-shaped planar shape having a side wall 24 formed perpendicular to the main wall 22 at one end thereof. As shown in FIG. 1A, the side wall 24 side is located on the heat sink room 18 side on the back wall 8 side, and the edge opposite to the side wall 22 is in contact with the front wall 6 side. The heat sink 14 is attached to one surface of the main wall 22, that is, the heat sink chamber 18 side. The heat sink mounting wall 16 is actually formed with screw holes and the like for mounting the heat sink 14, but the illustration is omitted. The heat sink mounting wall 16 has a height dimension substantially equal to the height dimension of the front wall 6 and the rear wall 8, and its width dimension is slightly shorter than the dimension between the front wall 6 and the rear wall 8 in this example. However, the first room and the second room may be completely separated. In the center, a rectangular window 26 for exposing the IGBT 12 attached to the heat sink 14 to the component mounting room 20 side as shown in FIG. 1C communicates the heat sink room 18 side and the component mounting room 20. The heat sink mounting wall 16 is formed so as to penetrate in the thickness direction.

  As shown in FIG. 1B, on the component mounting room 20 side, a substrate 28 is arranged above the heat sink mounting wall 16 in parallel with the heat sink mounting wall 16 with a space therebetween. The substrate 28 covers the rectifying diode bridge 13, and a lead 13 a of the diode bridge 13 protrudes toward the component mounting chamber 20 side of the substrate 28 and is connected to a predetermined position of the substrate 28. On the substrate 28, for example, a rectifying and smoothing unit is configured. In addition, a substrate on which a component that constitutes the inverter is mounted and a substrate on which a component that constitutes a control unit that controls the inverter is configured are arranged in the component mounting portion 20. In these substrates, their predetermined positions are connected by a transmission line (not shown).

  A duct 30 is integrally formed along the upper edge of the window 26 on the surface of the heat sink mounting wall 16 on the component mounting room 20 side. As shown in FIGS. 1C and 3, the duct 30 has an L-shaped side surface, and has a bottom wall 32 and a side wall 34. The duct 30 is formed by cutting and bending the window 26 at the same time when the window 26 is cut from a plate material for forming the window 26 on the main wall 22 of the heat sink mounting wall 16. The side wall 34 is notched in the middle, and serves as a transmission line outlet 36 as will be described later. Further, as shown in FIG. 1 (c) and FIG. 3, slits 38 and 38 are formed at the boundary between the cut-out two side walls 34 and 34 and the middle bottom wall 32, respectively. ing.

  As shown in FIG. 1A, two transmission lines 40 and 42 connected to an AC power supply are introduced into the housing 2 from a portion of the back wall 8 of the housing 2 that faces the heat sink 14. These two transmission lines 40 and 42 pass through the duct 30 and are connected to a power switch 46 attached to the front wall 6. The transmission lines 48 and 50 returned from the power switch 46 also pass over the duct 30 and are drawn out from the transmission line outlet 36 and connected to a predetermined position on the substrate 28. The transmission line outlet 36 is formed so that the transmission lines 48 and 50 are drawn out from the middle of the duct 30 so as to minimize the wiring length from the power switch 46 to the substrate 28. Alternatively, the transmission lines 48 and 50 may be routed from the end of the duct and connected to the substrate 28 without providing the wiring.

  In order to connect the transmission lines 40, 42 to the power switch 46 and to connect the transmission lines 48, 50 from the power switch 46 to the substrate 28, the transmission lines 40, 42, 48, 50 are connected to the main wall 22. Need to penetrate. In order to protect the transmission lines 40, 42, 48, and 50, a grommet 52 is attached to the penetration place. Further, as shown in FIG. 3, the transmission lines 40, 42, 48, 50 are bound by a binding band 54 using the slits 38, 38, and the transmission lines 40, 42, 48, 50 are Out of the duct 30 is prevented. In addition, although the slit 38 is formed in order to bind a transmission line easily, the slit 38 is not necessarily required.

  With this configuration, the transmission lines 40 and 42 from the AC power source to the power switch 46 and the transmission lines 48 and 50 from the power switch 46 to the substrate 28 can be smoothly performed using the duct 30, respectively. Wiring work becomes easy. In particular, a large number of components are arranged on the substrate 28 or a substrate (not shown), and these components include large components, so that the wiring space is limited. Therefore, the wiring space can be ensured with certainty. In addition, since these transmission lines can be separated from the wiring of the transmission lines connecting the substrates, it is possible to avoid complication of various transmission lines. Furthermore, since the duct 30 is made of metal, it has a shielding effect and can suppress unnecessary radiation from the transmission lines 40, 42, 48, 50. Further, by covering the housing 2 with the lid, the inside of the duct is surrounded by the wall surface, and the shielding effect can be further enhanced. Further, since the duct 30 is formed integrally with the heat sink mounting wall 16, the duct 30 can be mounted simultaneously with the mounting by mounting the heat sink mounting wall 16 between the front wall 6 and the back wall 8.

  In the above-described embodiment, the side wall 34 of the duct 30 is provided at a right angle to the bottom wall 32, but it can also be bent so as to make an acute angle with respect to the bottom wall 32 a so as to advance onto the bottom wall 32. In the above embodiment, the transmission lines 40, 42, 48, and 50 related to the power source are arranged in the duct 30. However, the present invention is not limited to this. For example, the transmission line between the inverter and its control unit is connected. It can also be arranged in the duct 30, and at least one transmission line may be accommodated in the duct 30. Further, although the duct 30 is formed on the heat sink mounting wall 16, the duct 30 is not necessarily limited to the one for mounting the heat sink as long as it is a partition wall that partitions the inside of the housing 2. If there is, it can also be provided on another partition wall. In the above embodiment, the heat sink mounting wall 16 is provided between the front wall 6 and the back wall 8, but in some cases, the heat sink mounting wall 16 may be provided between both side walls. In the above-described embodiment, the electroplating power supply device is used as the electric device. However, the power supply device is not limited to this, and can be used, for example, for a power supply device for arc welding.

2 Housing 6 Front wall (first wall)
8 Back wall (second wall)
16 Heat sink mounting wall (third wall)
30 Duct 40, 42, 48, 50 Transmission line

Claims (3)

A housing having opposing first and second walls;
A third wall located between the first and second walls and partitioning the housing into a first room and a second room;
A plurality of electrical components arranged in the second room and constituting a plurality of electrical circuits;
A plurality of transmission lines including at least one transmission line disposed between the first and second walls and connecting the plurality of electrical circuits;
In electrical equipment that has
A duct that is integrally provided along the direction connecting the first and second walls on the second room side of the third wall and accommodates the at least one transmission line;
Electric equipment that has.   2. The electric device according to claim 1, wherein the third wall includes a window, and a part of the heat sink disposed in the first room on the third wall is transferred from the window to the second room. An electric device, wherein the heat generating component in the plurality of electric components is attached to the heat sink exposed from the window in the second room.   3. The electric device according to claim 1, wherein the duct is formed by cutting and raising a part of the third wall.

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