JP2016111201A - Imprint device and manufacturing method of material - Google Patents

Abstract

An imprint apparatus advantageous in terms of economy is provided. An imprint apparatus for forming a pattern on the substrate by performing a mold pressing on the imprint material on the substrate, a supply unit for supplying a gas between the imprint material and the mold, A control unit that controls the supply unit so that the first gas is supplied to perform the pressing, and the second gas is supplied to perform processing different from the pressing. [Selection] Figure 2

Description

  The present invention relates to an imprint apparatus and an article manufacturing method.

  An imprint apparatus that forms a pattern on a substrate using a mold has attracted attention as one of lithography apparatuses for mass production such as semiconductor devices. The imprint apparatus can form a pattern on a substrate by curing the imprint material in a state where the imprint material on the substrate is molded with a mold and releasing the cured imprint material.

  In the imprint apparatus, if air bubbles remain between the mold and the imprint material in a pressing process in which the mold and the imprint material are pressed against each other, a defect (defect) may occur in the formed pattern. In Patent Document 1, a permeable gas that permeates at least one of a mold, an imprint material, and a substrate, and a condensable gas that is liquefied by a pressure increase caused by a pressing die are provided between the mold and the imprint material (substrate). There has been proposed a method of supplying a mold to a die. Thereby, said bubble (volume) can be reduced.

JP 2012-164785 A

  Patent Document 1 specifies the atmosphere of the imprint material when performing the stamping, but in steps other than the stamping, for example, to reduce the adhesion of particles to the substrate and the deterioration (oxidation, etc.) of the imprint material, It is preferable to adjust (control) the atmosphere. Here, the permeable gas and the condensable gas as described above may be expensive or have a high global warming potential. For this reason, supplying such a gas in a process (processing) other than the pressing die is not preferable from the viewpoint of economics such as cost of ownership of the imprint apparatus (Cost of Ownership).

  Accordingly, an object of the present invention is to provide an imprint apparatus that is advantageous in terms of economy.

  In order to achieve the above object, an imprint apparatus according to one aspect of the present invention is an imprint apparatus that forms a pattern on the substrate by performing a mold pressing on an imprint material on the substrate. A supply unit that supplies a gas between the imprint material and the mold, a first gas is supplied to perform the pressing mold, and a second gas is supplied to perform a process different from the pressing mold. And a control unit that controls the supply unit.

  Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, an imprint apparatus that is advantageous in terms of economy can be provided.

It is the schematic which shows the imprint apparatus of 1st Embodiment. It is a flowchart which shows the operation | movement sequence which performs an imprint process to each shot area | region. It is the schematic which shows the structure of a gas supply part. It is a figure which shows the relationship between each process of an imprint process, and the gas preferable to supply to space.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member thru | or element, and the overlapping description is abbreviate | omitted.

<First Embodiment>
An imprint apparatus 100 according to a first embodiment of the present invention will be described with reference to FIG. The imprint apparatus 100 is used for manufacturing a semiconductor device or the like, and uses an imprint process on a shot region formed on a substrate 2 using a mold 1 (mold) on which an uneven pattern is formed. I do. For example, the imprint apparatus 100 cures the imprint material in a state where the mold 1 on which the pattern is formed and the imprint material on the substrate are in contact with each other. And the imprint apparatus 100 forms the pattern comprised by the imprint material on the board | substrate by extending the space | interval of the mold 1 and the board | substrate 2, and peeling the mold 1 from the hardened imprint material (mold release). can do. The method for curing the imprint material includes a thermal cycle method using heat and a photocuring method using light. In the first embodiment, an example in which the photocuring method is employed will be described. The photo-curing method refers to supplying an uncured ultraviolet curable resin as an imprint material onto a substrate and irradiating the imprint material with ultraviolet rays in a state where the mold 1 and the imprint material are in contact with each other. Is a method of curing.

[Configuration of the imprint apparatus 100]
FIG. 1 is a schematic diagram illustrating an imprint apparatus 100 according to the first embodiment. The imprint apparatus 100 can include an irradiation unit 3, a mold holding unit 4, a substrate holding unit 5, a resin supply unit 6, a measurement unit 7, and a control unit 8. The control unit 8 includes, for example, a CPU and a memory, and controls imprint processing (controls each unit of the imprint apparatus 100). Here, the mold holding unit 4 is fixed to the bridge surface plate 13 supported by the base surface plate 11 via the support column 12, and the substrate holding unit 5 is movably supported on the base surface plate 11. . The imprint apparatus 100 includes, for example, a chamber 14 provided with a blower having a blower port 15a and an exhaust port 15b as shown in FIG. 1, and includes an irradiation unit 3, a mold holding unit 4, a substrate holding unit 5, and the like. Can be placed in the chamber 14. The blower removes chemical substances and dust contained in the atmosphere with a chemical filter, a particle filter, and the like, and supplies clean air into the chamber 14 from the blower port 15a.

  The mold 1 is usually made of a material that can transmit ultraviolet rays, such as quartz, and a partial region (pattern region) on the substrate side has irregularities for forming an imprint material on the substrate. A pattern is formed. The substrate 2 is, for example, a single crystal silicon substrate or an SOI (Silicon on Insulator) substrate, and an imprint material is supplied to the upper surface (surface to be processed) of the substrate 2 by a resin supply unit 6 described later. .

  The irradiation unit 3 irradiates the imprint material on the substrate through the mold 1 with light (ultraviolet rays) for curing the imprint material during the imprint process. The irradiation unit 3 can include, for example, a light source 3a and an optical element 3b for adjusting light emitted from the light source 3a to light suitable for imprint processing. Here, for example, when the thermal cycle method is employed, a heat source unit for curing the thermosetting resin as the imprint material may be provided instead of the irradiation unit 3.

  The mold holding unit 4 can include, for example, a mold chuck 4a that holds the mold 1 by a vacuum suction force or an electrostatic force, and a mold driving unit 4b that drives the mold chuck 4a in the Z direction. The mold chuck 4 a and the mold driving unit 4 b have an opening region at the center (inside) thereof, and the light emitted from the irradiation unit 3 is irradiated to the imprint material on the substrate through the mold 1. It is configured as follows. Here, the mold 1 may be deformed including components such as a magnification component and a base formation due to a manufacturing error or thermal deformation. Therefore, a deforming portion 4 c that deforms the pattern region by applying a force to a plurality of locations on the side surface of the mold 1 may be provided in the mold holding portion 4. For example, the deforming portion 4 c can include a plurality of actuators arranged to apply force to a plurality of locations on each side surface of the mold 1. And the pattern area | region of the mold 1 can be deform | transformed into a desired shape by separately applying force to the several location in each side of the mold 1 with a some actuator. As the actuator of the deforming portion 4c, for example, a linear motor, an air cylinder, a piezo actuator, or the like can be used.

  The mold driving unit 4b includes an actuator such as a linear motor or an air cylinder, for example. The mold driving unit 4b moves the mold chuck 4a (mold 1) to Z so that the pattern area of the mold 1 and the imprint material on the substrate are brought into contact with each other or separated. Drive in the direction. Since the mold driving unit 4b is required to be positioned with high accuracy when the mold 1 and the imprint material are brought into contact with each other, the mold driving unit 4b may be configured by a plurality of driving systems such as a coarse driving system and a fine driving system. Further, the mold driving unit 4b is not limited to driving in the Z direction, and a position adjusting function for adjusting the position of the mold 1 by driving the mold 1 in the XY direction and the θ direction (rotation direction around the Z axis) It may have a tilt function for correcting the tilt. Here, in the imprint apparatus 100 of the first embodiment, the operation of changing the distance between the mold 1 and the substrate 2 is performed by the mold driving unit 4b, but is performed by the substrate driving unit 5b of the substrate holding unit 5. It may be performed relatively by both.

  The substrate holding unit 5 includes a substrate chuck 5a and a substrate driving unit 5b, and moves the substrate 2 so as to align the mold 1 and the substrate 2 in the XY directions. The substrate chuck holds the substrate 2 by 5a, for example, vacuum suction force or electrostatic force. The substrate driving unit 5b mechanically holds the substrate chuck 5a and drives the substrate chuck 5a (substrate 2) in the XY directions. Here, for example, a linear motor is used as the substrate driving unit 5b, and the substrate driving unit 5b may be configured by a plurality of driving systems such as a coarse driving system and a fine driving system. The substrate driving unit 5b is not only driven in the XY directions, but also a position adjusting function for adjusting the position of the substrate 2 by driving the substrate 2 in the Z direction and the θ direction, and a tilt for correcting the tilt of the substrate 2. It may have a function. Here, in the imprint apparatus 100 of the first embodiment, the alignment of the mold 1 and the substrate 2 is performed by the substrate driving unit 5b, but may be performed by the mold driving unit 4b of the mold holding unit 4. However, it may be performed relatively by both.

  The resin supply unit 6 supplies an ultraviolet curable resin having a property of being cured by irradiation of ultraviolet rays onto the substrate as an imprint material. The measuring unit 7 detects, for example, a mark provided on the mold 1 and a mark provided on the substrate 2 (shot area), and a relative position (XY direction) between the mark on the mold and the mark on the substrate. Measure. Thereby, the control part 8 can align the mold 1 and the board | substrate 2 so that the said relative position may turn into a target relative position based on the measurement result by the measurement part 7. FIG.

  In the imprint apparatus 100, the imprint process is generally performed in an air atmosphere. However, depending on the process (process) of the imprint process, the space 10 between the mold 1 and the substrate 2 (imprint material) may contain other than air. It may be better to supply gas. Therefore, the imprint apparatus 100 according to the first embodiment includes a gas supply unit 16 (supply unit) that supplies gas to the space 10 between the mold 1 and the substrate 2, and supplies gas other than air to the space 10. It is configured to be able to. Here, the gas supply unit 16 in the first embodiment uses at least one kind of gas among a plurality of kinds of gases (for example, a first gas and a second gas described later) as a space 10 between the mold 1 and the substrate 2. It supplies so that it may supply via the supply nozzle 9a. And the supply nozzle 9a is provided in common with multiple types of gas. However, the present invention is not limited to this, and for example, the supply nozzle 9a may be individually provided for each of a plurality of types of gases. Further, the imprint apparatus 100 collects the gas via the recovery nozzle 9b so as to prevent the gas supplied from the gas supply unit 16 to the space 10 from leaking outside the space 10. Can be included.

  For example, if air bubbles remain in the concave portions of the pattern of the mold 1 in the pressing process in which the mold 1 and the imprint material are pressed against each other, the pattern made of the imprint material may be damaged. Therefore, it is preferable to supply a permeable gas, a condensable gas, or the like to the space 10 between the mold 1 and the substrate 2 during the stamping process. The permeable gas is a gas having a property of transmitting at least one of the mold 1, the imprint material, and the substrate 2. In addition, the condensable gas is a gas having a property of being liquefied by a pressure increase (for example, or a pressure increase from a pressure lower than the vapor pressure to a high pressure) generated by the pressing die. That is, in the stamping step, a gas containing at least one of a permeable gas and a condensable gas may be used as the first gas and supplied to the space 10 by the gas supply unit 16. When the mold 1 and the imprint material are brought into contact with the space 10 in the state where the first gas is supplied in this manner, the volume of bubbles remaining in the concave portions of the pattern of the mold 1 is reduced, and the pattern configured by the imprint material. It is possible to suppress the occurrence of defects.

  In the imprint apparatus 100, for example, in the process (process) after the stamping process, such as a filling process for waiting for the imprint material to be filled in the pattern of the mold 1 and a curing process for curing the imprint material, the space In some cases, a gas other than air may be supplied to 10. This is because it is preferable to prevent the particles scattered from the outside of the space 10 from adhering to the substrate and the deterioration (oxidation or the like) of the imprint material that inhibits the curing of the imprint material. However, for example, permeable gases such as helium are very expensive, and condensable gases such as pentafluoropropane (PFP) have a large global warming potential and are harmful to the human body. It is preferable to reduce the amount of condensable gas used as much as possible. Therefore, in a process after the stamping process such as a filling process or a curing process, a first gas including a permeable gas or a condensable gas and a gas different from air may be supplied to the space 10 as the second gas. Moreover, it is not restricted to a filling process or a hardening process, It is preferable to supply the gas different from 1st gas to the space 10 as 2nd gas in processes other than a stamping process (process different from a stamping process). Therefore, the imprint apparatus 100 (control unit 8) according to the first embodiment is configured so that each process among a plurality of types of gases is supplied to the space 10 so that a gas to be used in each of the plurality of processes in the imprint process is supplied. The gas supply unit 16 is supplied with a gas corresponding to the above. Here, in at least two of the plurality of steps, the gases to be used may be different from each other. In the first embodiment, for example, an inert gas such as nitrogen or argon can be used as the second gas.

[About imprint processing]
Next, an operation sequence for performing imprint processing on each of a plurality of shot areas on the substrate in the imprint apparatus 100 according to the first embodiment will be described with reference to FIG. FIG. 2 is a flowchart showing an operation sequence for performing imprint processing on each of a plurality of shot areas on one substrate 2. Each step of the flowchart shown in FIG. 2 can be performed by the control unit 8 controlling each unit of the imprint apparatus 100. Further, the mold 1 and the substrate 2 are respectively transferred to the mold holding unit 4 and the substrate holding unit 5 by a transfer mechanism (not shown) before starting the flowchart shown in FIG. 2, and transferred after the flowchart shown in FIG. It can be recovered by the mechanism.

  In S <b> 1, the control unit 8 controls the substrate holding unit 5 so as to place a target shot area (hereinafter referred to as a target shot area) to be imprinted under the resin supply unit 6, and imprints in the target shot area. The resin supply unit 6 is controlled to supply the material (resin supply process). In the step S1, the control unit 8 can control the gas supply unit 16 to supply the second gas to the space 10, for example. In S <b> 2, the control unit 8 controls the gas supply unit 16 to start the supply of the first gas to the space 10 by switching the gas injected from the supply nozzle 9 a from the second gas to the first gas. In S <b> 3, the control unit 8 controls the substrate holding unit 5 so as to dispose the target shot area supplied with the imprint material under the mold 1. Here, in the flowchart shown in FIG. 2, the gas supplied to the space 10 is switched after the imprint material is supplied to the target shot area (that is, after the step S <b> 1), but the present invention is not limited to this. . For example, the control unit may switch the gas supplied to the space 10 while supplying the imprint material to the target shot area or before supplying the imprint material to the target shot area.

  In S4, the control unit 8 controls the mold holding unit 4 to press the mold 1 and the imprint material on the target shot area against each other by reducing the distance between the mold 1 and the substrate 2 (molding process). At this time, since the mold 1 and the imprint material are in contact with each other while the first gas is supplied to the space 10, the volume of bubbles remaining in the concave portions of the pattern of the mold 1 can be reduced. In S5, the control unit 8 controls the gas supply unit 16 to start the supply of the second gas to the space 10 by switching the gas injected from the supply nozzle 9a from the first gas to the second gas. After the mold pressing step for pressing the mold 1 and the imprint material to each other is completed as described above, the first gas containing the permeable gas and the condensable gas is switched by switching the gas supplied to the space 10 from the first gas to the second gas. The amount of gas used can be reduced.

  In S6, the control unit 8 allows a predetermined time to elapse in a state where the mold 1 and the imprint material are in contact with each other so that the imprint material fills every corner of the pattern of the mold 1 (filling step). Here, in the flowchart shown in FIG. 2, the controller 8 switches the gas supplied to the space 10 so that the first gas is supplied to the space 10 in the pressing process and the second gas is supplied to the space 10 in the filling process. However, the present invention is not limited to this. For example, the control unit 8 supplies the gas to the space 10 so that the first gas is supplied to the space 10 in the filling process and the second gas is supplied to the space 10 in the processes after the filling process (for example, the alignment process and the curing process). This switching may be performed after the filling step is completed. Moreover, in 1st Embodiment, although switching of the gas for supplying 2nd gas to the space 10 is performed after a stamping process is complete | finished and before a hardening process starts, after a stamping process starts, It may be performed before the curing process starts.

  In S7, the control unit 8 causes the measurement unit 7 to measure the relative position between the mark on the mold and the mark on the substrate in a state where the mold 1 and the imprint material are in contact with each other, and based on the measurement result, the mold 8 1 and the substrate 2 are aligned (alignment process). In S8, the control unit 8 controls the irradiation unit 3 to irradiate the imprint material with light while the mold 1 and the imprint material are in contact with each other, and cures the imprint material (curing step). . In S9, the control unit 8 increases the distance between the mold 1 and the substrate 2 and controls the mold holding unit 4 so as to peel (release) the mold 1 from the cured imprint material (peeling step). . In the steps S <b> 7 to S <b> 9, the control unit 8 can control the gas supply unit 16 to supply the second gas to the space 10, for example. In S <b> 10, the control unit 8 determines whether or not there is a shot area (next shot area) on which the pattern of the mold 1 is subsequently transferred on the substrate. If there is a next shot area, the process proceeds to S1, and if there is no next shot area, the process ends.

  Here, in the above-described example, the method of supplying the imprint material onto the substrate by the resin supply unit 6 is shown for each of the plurality of shot regions on the substrate. However, the method is not limited thereto. For example, there is a method in which after the imprint material is supplied to the entire surface of the substrate 2 by a spin coater or the like, the process of forming the imprint material by the mold 1 is performed for each of a plurality of shot regions on the substrate. Also in this method, after the stamping step is completed, the amount of the first gas including the permeable gas and the condensable gas can be reduced by switching the gas supplied to the space 10 from the first gas to the second gas. it can.

[Configuration of gas supply unit 16]
Next, the configuration of the gas supply unit 16 will be described with reference to FIG. The gas supply unit 16 may include a switch for supplying at least one type of gas among a plurality of types of gases supplied via the plurality of pipes 16a to the space 10 via the supply nozzle 9a. In FIG. 3, there are two systems of gas input to the gas supply unit 16 (gas is input through the _two pipes 16 a ₁ and 16 a ₂ ), and gas output from the gas supply unit 16 is one system. An example (in which gas is output through one pipe 16b) will be described. However, the present invention is not limited to this. For example, the gas input to the gas supply unit 16 may be three or more lines, and the gas output from the gas supply unit 16 may be two or more lines. Further, FIG. 3 shows an example in which the electromagnetic valve 16c ₁ or the mass flow controller 16c ₂ is used as a switching device. However, both the electromagnetic valve 16c ₁ and the mass flow controller 16c ₂ may be used (mixed) as switching devices. .

In the example shown in FIG. 3 (a), the electromagnetic valve 16c ₁ is provided in each of the pipes 16a ₁ and the pipe 16a _2. Control unit 8, by supplying a control signal 8a to the respective solenoid valves 16c _1, the gas inputted through the pipe 16a ₁ or the pipe 16a _2, can be output via a piping 16b. In the example shown in FIG. 3 (b), a mass flow controller 16c ₂ is provided in each of the pipes 16a ₁ and the pipe 16a _2. Control unit 8, by supplying a control signal 8a to the respective mass flow controllers 16c _2, the gas input through a pipe 16a ₁ or the pipe 16a _2, can be output via a piping 16b. Mass flow controller 16c ₂ is different from the solenoid valve 16c _1, it is possible to adjust the flow rate of the gas, it is possible to suppress the disturbance of the pressure change and the air flow of the gas output from the pipe 16b. Further, in the example shown in FIG. 3 (c), a mixer 16d for mixing with the target ratio are provided two or more gas output from the mass flow controller 16c _2. For example, the permeable gas through the pipe 16a ₁ is supplied to the gas supply unit 16, it is assumed that the condensable gas through the pipe 16a ₂ is supplied to the gas supply unit 16. In this case, the control unit 8 can supply the mixed gas obtained by mixing the permeable gas and the condensable gas in the mixer 16d at the target ratio to the space 10 as the first gas.

  As described above, the imprint apparatus 100 according to the first embodiment responds to each step among a plurality of types of gases so that the gas to be used in each of the plurality of steps in the imprint process is supplied to the space 10. The gas is supplied to the gas supply unit 16. Thereby, the usage-amount of 1st gas (permeable gas and condensable gas) used in order to reduce the volume of the bubble which remains in the recessed part of the pattern of the mold 1 can be reduced.

Second Embodiment
In the imprint apparatus 100 according to the first embodiment, a permeable gas or a condensable gas as the first gas or an inert gas (for example, nitrogen) as the second gas is supplied in accordance with each step of the imprint process. The example which supplies to the space 10 by the part 16 was demonstrated. However, the imprint apparatus 100 may supply various gases different from the first gas to the space 10 as the second gas in a process other than the stamping process (a process different from the stamping process). In the second embodiment, a gas that is preferably supplied to the space 10 as the second gas in each step of the imprint process will be described with reference to FIG. FIG. 4 is a diagram illustrating the relationship between each step of the imprint process and a gas that is preferably supplied to the space 10.

  For example, as shown in FIG. 1, a plurality of types of gases are supplied to the gas supply unit 16 via a pipe 16 a. The plural types of gases are, for example, inert gas (nitrogen), permeable gas (helium), condensable gas (PFP), ionized gas, gas for separation, active gas, temperature-adjusted gas (air), humidity May contain conditioned gas (air). Then, the control unit 8 selects at least one type of gas from among a plurality of types of gas according to each step of the imprint process, and controls the gas supply unit 16 so that the selected gas is supplied to the space 10. To do.

  For example, in the step S1 (resin supply step), the control unit 8 may control the gas supply unit 16 so as to supply an inert gas such as nitrogen and a peeling gas as the second gas to the space 10. The peeling gas is, for example, a gas for facilitating peeling of the mold 1 and the imprint material in the peeling process, that is, for reducing the force required for peeling the mold 1 and the imprint material. The stripping gas can be generated, for example, by applying ultrasonic vibration to a liquid stripping agent such as a fluorine-based or silicone-based material to vaporize the stripping agent. Thus, by supplying the release gas to the space 10 in the resin supply process, a film of a release agent is formed on the surface of the mold 1, and the mold 1 and the imprint material can be easily separated in the release process. .

  In the processes of S7 to S9, the control unit 8 may control the gas supply unit 16 so as to supply, for example, an inert gas (second gas) such as nitrogen and an ionized gas to the space 10 as the second gas. The ionized gas is, for example, a gas for preventing the mold 1, the imprint material, and the substrate 2 from being charged by a peeling process, and can be generated by irradiating a gas such as nitrogen with soft X-rays using an ionizer. By supplying the ionized gas to the space 10 in this manner, charging of the mold 1 or the like due to the peeling process is suppressed, and particles in the imprint apparatus can be prevented from being attracted to the space 10 due to charging of the mold 1 or the like. it can.

  Moreover, also in processes (processes) other than each process of an imprint process, the control part 8 is the gas supply part 16 so that at least 1 type of gas may be supplied to the space 10 as 2nd gas among multiple types of gas. It is good to control. Processes other than each process of the imprint process include, for example, a standby process in which the imprint apparatus 100 is stopped for maintenance work and a cleaning process (cleaning process) for cleaning (cleaning) the inside of the imprint apparatus. sell. In the standby process, the control unit 8 controls the gas supply unit 16 so that the gas (air) whose temperature is adjusted and the gas (air) whose humidity is adjusted are supplied to the space 10 as the second gas. The supply of the gas to the space 10 in such a standby process adjusts the temperature of the mold 1 and the substrate 2, cools the temperature of the mold 1 that has been raised by the exposure heat, and changes the position of the mold 1 and the substrate 2. This is effective for stabilizing the air refractive index in the optical path of the interferometer to be measured. In the cleaning process, the control unit 8 controls the gas supply unit 16 so that an active gas such as ozone is supplied to the space 10 as the second gas.

<Embodiment of Method for Manufacturing Article>
The method for manufacturing an article according to an embodiment of the present invention is suitable, for example, for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. In the method for manufacturing an article according to the present embodiment, a pattern is formed in a step of forming a pattern on the resin applied to the substrate using the above-described imprint apparatus (step of performing imprint processing on the substrate). Processing the substrate. Further, the manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, and the like). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

  As mentioned above, although preferred embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

1: mold, 2: substrate, 3: irradiation unit, 4: mold holding unit, 5: substrate holding unit, 8: control unit, 16: gas supply unit, 100: imprint apparatus

Claims (10)

An imprint apparatus for forming a pattern on the substrate by performing a mold pressing on the imprint material on the substrate,
A supply unit for supplying gas between the imprint material and the mold;
A control unit for controlling the supply unit so that the first gas is supplied and the pressing is performed, and the second gas is supplied and a process different from the pressing is performed;
An imprint apparatus comprising:   The imprint apparatus according to claim 1, wherein the supply unit includes a nozzle for supplying at least one of the first gas and the second gas.   The imprint apparatus according to claim 1, wherein the processing different from the pressing mold is curing of the imprint material.   4. The imprint apparatus according to claim 3, wherein the control unit controls the supply unit to supply the second gas after the stamping mold starts and before the curing starts. 5.   The supply unit uses, as the first gas, at least one of a permeable gas that transmits at least one of the mold, the imprint material, and the substrate, and a condensable gas that is liquefied by a pressure increase generated by the pressing die. The imprint apparatus according to claim 1, wherein the imprint apparatus is supplied.   The imprint apparatus according to claim 5, wherein the supply unit supplies a mixed gas of the permeable gas and the condensable gas as the first gas.   The imprint apparatus according to claim 1, wherein the supply unit supplies an inert gas as the second gas.   The imprint apparatus according to claim 1, wherein the processing different from the pressing mold is a mold release.   The imprint apparatus according to claim 1, wherein the processing different from the pressing mold is cleaning. Forming a pattern on a substrate using the imprint apparatus according to any one of claims 1 to 9,
Processing the substrate on which the pattern is formed in the step;
A method for producing an article comprising:

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