JP2016100574A - Multilayer capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated capacitor in which vibration generated in a laminated capacitor main body is hardly propagated to a substrate.SOLUTION: A laminated capacitor is configured so that: a first external terminal 4a has a first external electrode connection portion 4a1, a first center side extending portion 4a2 which extends toward the center side of a laminate capacitor main body 10, and a first outside extending portion 4a3 which extends in a direction opposite to the first center side extending portion 4a2; a second external terminal 4b has a second external electrode connection portion 4b1, a second center side extending portion 4b2 which extends towards the center side of the laminate capacitor main body 10, and a second outside extending portion 4b3 which extends in a direction opposite to the first center side extending portion 4b2; and first and second external electrodes 3a and 3b are bonded to each of the first and second external electrode connection portions 4a1 and 4b1 between the first and second center side extending portions 4a2 and 4b2 and the first and second outside extending portions 4a3 and 4b3.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a multilayer capacitor, and more particularly to a multilayer capacitor mounted on a substrate by a pair of external terminals provided on a pair of external electrodes.

  In a multilayer capacitor, dielectric layers and internal electrodes are alternately laminated. As a ceramic material constituting the dielectric layer, a ferroelectric material such as barium titanate having a relatively high dielectric constant is generally used. It is used. When an AC voltage is applied to such a multilayer capacitor, distortion occurs in the dielectric layer due to the electrostrictive effect, and vibration occurs in the multilayer capacitor itself. The vibration of the multilayer capacitor propagates to the substrate on which the multilayer capacitor is mounted via solder or the like, and the vibration propagated to the substrate causes the substrate to resonate and amplify the vibration, and vibration sound is generated in the substrate. When the vibration frequency of the substrate becomes an audible frequency band, an audible sound is generated from the substrate. That is, a so-called “sounding” phenomenon occurs. Specifically, in a multilayer capacitor, when a pair of external electrodes and a substrate electrode are mounted via solder, the vibration of the multilayer capacitor deforms the substrate via the solder attached to the pair of external electrodes. Therefore, vibration sound is generated in the substrate.

  In order to reduce vibration noise in a substrate, a multilayer capacitor having a multilayer capacitor body having a pair of external electrodes on opposing end surfaces and a pair of external terminals joined to the pair of external electrodes is used. . In such a multilayer capacitor, a pair of external terminals are joined to a pair of external electrodes, and the multilayer capacitor body is mounted on the substrate while being separated from the substrate using the pair of external terminals. By adopting such a configuration, vibration generated in the multilayer capacitor main body is hardly propagated to the substrate, and generation of vibration noise on the substrate due to the multilayer capacitor main body is suppressed. An example of such a multilayer capacitor is disclosed in Patent Document 1.

JP 2012-212861 A

  However, the above-mentioned multilayer capacitor suppresses “sounding” by making it difficult to propagate the vibration of the multilayer capacitor body to the substrate by providing the multilayer capacitor body away from the substrate using a pair of external terminals. However, it is difficult to make the vibration of the multilayer capacitor main body more difficult to propagate to the substrate because the pair of external terminals are joined to the entire surface of the facing portion of the pair of external electrodes via the external electrodes and solder. There was a problem that.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a multilayer type in which vibration generated in the multilayer capacitor body is less likely to propagate to the substrate and “sounding” can be suppressed. It is to provide a capacitor.

The multilayer capacitor of the present invention includes a multilayer body in which a plurality of dielectric layers are stacked, a multilayer body formed in a substantially rectangular parallelepiped shape having first and second end faces facing each other, and the plurality of dielectric layers in the multilayer body. A plurality of internal electrodes arranged at intervals in the stacking direction of the body layers, and first and second electrodes formed on the first and second end surfaces and electrically connected to the internal electrodes A multilayer capacitor comprising a multilayer capacitor body having an external electrode and a pair of external terminals joined to the first and second external electrodes, wherein the pair of external terminals is the first external terminal A first external electrode connection portion joined to the electrode and one end of the first external electrode connection portion are connected to the center side of the multilayer capacitor body from the first external electrode connection portion. A first central extension extending toward the It is connected to the other end of the first external electrode connecting portion, and extends in a direction opposite to the direction in which the first central extending portion extends from the first external electrode connecting portion. A first external terminal having a first outer extending portion, a second external electrode connecting portion joined to the second external electrode, and one end of the second external electrode connecting portion. A second center-side connection portion extending from the second external electrode connection portion toward the center side of the multilayer capacitor main body and the other end portion of the second external electrode connection portion. A second outer portion connected and having a second outer extending portion extending in a direction opposite to a direction in which the second central side extension extends from the second outer electrode connecting portion. The first external electrode includes a first outer electrode extending between the first central extension and the first outer extension. The second external electrode is joined to the second external electrode connecting portion between the second central extending portion and the second outer extending portion. It is characterized by being.

  According to the multilayer capacitor of the present invention, the one end of each of the pair of external terminals extends above the upper surface of the external electrode of the multilayer capacitor body to increase the length of the external terminal. It is possible to make it difficult for vibration generated in the capacitor body to propagate to the substrate.

(A) is a schematic perspective view which shows the multilayer capacitor based on Embodiment, (b) is sectional drawing which cut | disconnected the multilayer capacitor shown to (a) by the AA line. 1 is a multilayer capacitor body of the multilayer capacitor shown in FIG. 1, wherein (a) is a schematic perspective view showing the multilayer capacitor body, and (b) is a diagram illustrating the multilayer capacitor body shown in FIG. It is sectional drawing cut | disconnected by the -B line. (A) is a schematic perspective view showing a state in which the multilayer capacitor shown in FIG. 1 is mounted on a substrate, and (b) is a diagram showing a state in which the multilayer capacitor shown in (a) is mounted on a substrate. It is sectional drawing cut | disconnected by the -C line | wire. (A) is a schematic perspective view which shows the other example of the multilayer capacitor | condenser which concerns on embodiment, (b) is sectional drawing which cut | disconnected the multilayer capacitor | condenser shown to (a) by DD line. is there. FIG. 5A is a schematic perspective view illustrating a state in which the multilayer capacitor illustrated in FIG. 4 is mounted on a substrate, and FIG. 5B illustrates a state in which the multilayer capacitor illustrated in FIG. It is sectional drawing cut | disconnected by the -E line | wire. (A) And (b) is explanatory drawing for demonstrating the manufacturing method of the multilayer capacitor shown to FIG. 1 and FIG. (A) And (b) is explanatory drawing for demonstrating the manufacturing method of the multilayer capacitor shown to FIG. 1 and FIG.

<Embodiment>
Hereinafter, a multilayer capacitor 10A according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic perspective view showing a multilayer capacitor 10A according to an embodiment of the present invention. The multilayer capacitor 10A includes a multilayer capacitor body 10 and a pair of external electrodes 3 ( A pair of external terminals 4 (first external terminal 4a and second external terminal 4b) joined to the first external electrode 3a and the second external electrode 3b) are provided.

  The multilayer capacitor body 10 includes a dielectric layer made of a ceramic material and an internal electrode 2 (first internal electrode 2a and second internal electrode 2b), and the dielectric layer and the internal electrode 2 are connected to each other. A pair of external electrodes 3 (a first external electrode 3a and a second external electrode 3b) are stacked alternately, and are electrically connected to the internal electrodes 2 drawn to the first or second end face 1c, 1d. Has been. That is, in the internal electrode 2, the first internal electrode 2a is electrically connected to the first external electrode 3a, and the second internal electrode 2b is electrically connected to the second external electrode 3b. . In addition, for convenience, the multilayer capacitor 10A defines an orthogonal coordinate system XYZ, and uses terms of the upper surface or the lower surface as appropriate, with the positive side in the Z direction as the upper side.

  The multilayer capacitor 10 </ b> A is mounted on a circuit board (hereinafter referred to as a board 9) via solder 6. The substrate 9 is used, for example, in a notebook computer, a smartphone, a mobile phone, or the like. For example, an electric circuit to which the multilayer capacitor 10A is electrically connected is formed on the surface.

  As shown in FIG. 4, for example, the substrate 9 is provided with a substrate electrode 9a and a substrate electrode 9b on the surface on which the multilayer capacitor 10A is mounted, and a wiring 9c extends from the substrate electrode 9a. The wiring 9d extends from the substrate electrode 9b. In the multilayer capacitor 10A, for example, the first external terminal 4a and the substrate electrode 9a are soldered by soldering, and the second external terminal 4b and the substrate electrode 9b are soldered by soldering.

  First, the multilayer capacitor body 10 will be described below with reference to the drawings.

  As shown in FIG. 2, the multilayer capacitor body 10 includes a multilayer body 1, internal electrodes 2 (first internal electrode 2a and second internal electrode 2b) formed in the multilayer body 1, multilayer body, and the like. A pair of external electrodes 3 (first electrodes) formed on one first and second end faces 1c, 1d and electrically connected to the internal electrodes 2 drawn out to the first or second end faces 1c, 1d. 1 external electrode 3a and second external electrode 3b).

  The laminated body 1 is formed in a substantially rectangular parallelepiped shape by laminating a plurality of dielectric layers, and first and second end faces 1c facing each other and the first and second main faces 1a and 1b facing each other, 1d and first and second side surfaces 1e and 1f facing each other. The first and second end faces 1c, 1d facing each other connect the first and second main faces 1a, 1b, and the first and second side faces 1e, 1f facing each other. Connects the first and second main faces 1a, 1b and the first and second end faces 1c, 1d. The substantially rectangular parallelepiped shape includes not only a cubic shape or a rectangular parallelepiped shape, but also includes, for example, a shape in which a ridge line portion of a cube or a rectangular parallelepiped is chamfered so that the ridge line portion has an R shape.

  The laminated body 1 is a sintered body obtained by laminating and firing a plurality of ceramic green sheets serving as dielectric layers. Thus, the laminated body 1 is formed in a substantially rectangular parallelepiped shape, and is formed on the first main surface 1a and the second main surface 1b, the first main surface 1a, and the second main surface 1b facing each other. The first end face 1c and the second end face 1d that are orthogonal to each other, and the first side face 1e and the second end face 1d that are orthogonal to the first end face 1c and the second end face 1d and that are opposite to each other. Side surface 1f. Moreover, the laminated body 1 has a rectangular plane as a cross section (XY plane) in a direction orthogonal to the stacking direction (Z direction) of the dielectric layers. In the multilayer capacitor body 10, each ridge line portion of the multilayer body 1 may be rounded.

  The dimension of the multilayer capacitor body 10 having such a configuration is such that the length in the longitudinal direction (Y direction) is, for example, 0.6 (mm) to 2.2 (mm), and the length in the short direction (X direction). For example, the length in the height direction (Z direction) is, for example, 0.3 (mm) to 1.5 (mm).

  The dielectric layer has a rectangular shape in a plan view from the stacking direction, and the thickness per layer is, for example, 0.5 (μm) to 3 (μm). In the laminated body 1, for example, a plurality of dielectric layers made of 10 (layers) to 1000 (layers) are laminated in the Z direction. The number of internal electrodes 2 in the multilayer body 1 is appropriately designed according to the characteristics of the multilayer capacitor body 10.

The dielectric layer is, for example, barium titanate (BaTiO ₃ ), calcium titanate (CaTiO ₃ ), strontium titanate (SrTiO ₃ ), or calcium zirconate (CaZrO ₃ ). The dielectric layer preferably uses barium titanate as a ferroelectric material having a high dielectric constant from the viewpoint of a high dielectric constant.

  The plurality of internal electrodes 2 include a first internal electrode 2a and a second internal electrode 2b. The first internal electrode 2a and the second internal electrode 2b are opposed to each other with a predetermined interval. 2 (b) and (c), the plurality of dielectric layers in the multilayer body 1 are alternately arranged at predetermined intervals in the laminating direction, and the first main body of the multilayer body 1 is arranged. They are provided so as to be substantially parallel to the surface 1a and the second main surface 1b, respectively. The first internal electrodes 2 a and the second internal electrodes 2 b form a pair of internal electrodes 2 and are alternately arranged in the stacked body 1.

  Thus, the first internal electrode 2a and the second internal electrode 2b are arranged at a predetermined interval in the stacking direction of the plurality of dielectric layers in the stacked body 1, and are separated by the dielectric layers, In addition, at least one dielectric layer is sandwiched between the first internal electrode 2a and the second internal electrode 2b. A plurality of dielectric layers on which the internal electrodes 2 are formed are laminated to form the multilayer body 1 of the multilayer capacitor body 10.

  The plurality of internal electrodes 2 are formed in the multilayer body 1 and have a rectangular shape in plan view from the stacking direction, and are arranged at intervals in the stacking direction of the plurality of dielectric layers in the stack body 1. Has been. In the multilayer capacitor body 10, as shown in FIG. 2B, the first internal electrode 2a is disposed between the dielectric layers, and one end thereof is drawn out to the first end face 1c. The two internal electrodes 2b are arranged between the dielectric layers, and one end thereof is led out to the second end face 1d facing the first end face 1c.

  Further, the internal electrode 2 is provided so as to be exposed at one end face of the first end face 1c and the second end face 1d and not exposed to the first side face 1e and the second side face 1f. The number of internal electrodes 2 in the multilayer body 1 is appropriately designed according to the characteristics of the multilayer capacitor body 10.

  The conductive material of the first and second internal electrodes 2a and 2b is, for example, a metal material such as nickel (Ni), copper (Cu), silver (Ag), palladium (Pd) or gold (Au), or these For example, an alloy material such as an Ag—Pd alloy including one or more of the above metal materials. The first and second internal electrodes 2a and 2b have an electrode thickness of, for example, 0.5 (μm) to 2 (μm), and the thickness may be set as appropriate depending on the application. The first internal electrode 2a and the second internal electrode 2b are preferably formed of the same metal material or alloy material.

  The pair of external electrodes 3 are formed on the first and second end faces 1c and 1d, respectively, and are electrically connected to the internal electrode 2 drawn to the first end face 1c or the second end face 1d. . Specifically, the first external electrode 3a is disposed on the first end face 1c, and is electrically connected to the first internal electrode 2a drawn out to the first end face 1c. The second external electrode 3b is disposed on the second end face 1d, and is electrically connected to the second internal electrode 2b drawn to the second end face 1d.

  As described above, the pair of external electrodes 3 includes the first external electrode 3a and the second external electrode 3b, and is formed so as to cover the first and second end faces 1c and 1d. The external electrode 3a and the second external electrode 3b are arranged so as to face each other. Further, as shown in FIG. 2, the pair of external electrodes 3 are formed so as to cover the first and second end faces 1c, 1d, and in the laminate 1, the first and second end faces 1c, The first and second main surfaces 1a and 1b are formed so as to extend from 1d to the surfaces of the first and second main surfaces 1a and 1b, respectively, and from the first and second end surfaces 1c and 1d to the first and second side surfaces 1e and 1f. Each is formed extending on the surface.

  Further, as shown in FIG. 2B, the first external electrode 3a and the second external electrode 3b are formed on the surface (end surface, main surface, and side surface) of the laminate 1, and the base electrode 3c A plating layer 3d. The base electrode 3c is electrically connected to the internal electrode 2 drawn out to the first end face 1c or the second end face 1d, and the plating layer 3d is formed on the surface of the base electrode 3c so as to cover the base electrode 3c. Is formed. The plating layer 3d is formed to protect the base electrode 3c or to improve the bonding property between the pair of external electrodes 3 and the pair of external terminals 4.

  The conductive material of the base electrode 3c includes, for example, a metal material such as nickel (Ni), copper (Cu), silver (Ag), palladium (Pd), or gold (Au), or one or more of these metal materials. For example, an alloy material such as an Ag—Pd alloy. The pair of base electrodes 3c is preferably formed of the same metal material or alloy material.

  The base electrode 3c has a thickness on the first and second main surfaces 1a and 1b of, for example, 4 (μm) to 10 (μm), and a thickness on the first and second end surfaces 1c and 1d, for example, 10 (μm) to 25 (μm), and the thickness of the first and second side surfaces 1e and 1f is, for example, 4 (μm) to 10 (μm).

  The base electrode 3c is formed to extend from the first end face 1c and the second end face 1d to the first and second main faces 1a and 1b, and the first end face 1c and the first end face 1c The first and second side surfaces 1e and 1f are formed so as to extend from the two end surfaces 1d. The plating layer 3 d is formed on the surface of the base electrode 3 c so as to cover the base electrode 3 c formed on the surface of the multilayer body 1.

  In this way, as shown in FIG. 2B, the first and second external electrodes 3a and 3b have the plating layer 3d formed on the surface of the base electrode 3c, and the plating layer 3d is made of, for example, nickel. (Ni) plating layer, copper (Cu) plating layer, gold (Au) plating layer or tin (Sn) plating layer.

  The first and second external electrodes 3a and 3b may be formed of a single plating layer 3d, but as shown in FIG. 2 (b), the first and second external electrodes 3a and 3b are formed of a plurality of plating layers. Also good. As shown in FIG. 2B, the first and second external electrodes 3a and 3b are, for example, a first plating layer 3d1 and a second plating layer 3d2 formed on the surface of the first plating layer 3d1. Is formed on the surface. In the embodiment, the plating layer 3d has a configuration of a laminated body including a first plating layer 3d1 and a second plating layer 3d2.

For example, in the first and second external electrodes 3a and 3b, a Ni plating layer (first plating layer 3d1) is formed on the surface of the base electrode 3c, and an Sn plating layer (second plating is formed on the surface of the Ni plating layer). Layer 3d2) is formed, and the plating layer 3d is formed of a laminate of a Ni plating layer (3d1) and a Sn plating layer (3d29). The first plating layer 3d1 has a thickness of, for example, 5 (μm). )
The thickness of the second plating layer 3d2 is, for example, 3 (μm) to 5 (μm).

  Here, the pair of external terminals 4a and 4b will be described below with reference to the drawings.

  The pair of external terminals 4 includes a first external terminal 4a and a second external terminal 4b, and the first external terminal 4a is a first external terminal of the multilayer capacitor body 10 as shown in FIG. The second external terminal 4b is bonded to the second external electrode 3b. The first external terminal 4a includes the multilayer capacitor body 10 on the substrate 9 as shown in FIG. The second external terminal 4b is joined to the first external electrode 3b so as to be separated from the surface of the substrate 9, and the second external terminal 4b is connected to the second external electrode 3b so that the multilayer capacitor body 10 is separated from the surface of the substrate 9. It is joined to.

  The first external terminal 4a includes a first external electrode connection portion 4a1, a first central extension portion 4a2, and a first outer extension portion 4a3. The first external electrode connection portion 4a1 is provided to face the first external electrode 3a, and is joined to the first external electrode 3a via the solder 5. The first central extending portion 4a2 is connected to one end of the first external electrode connection portion 4a1, is opposed to the upper surface of the first external electrode 3a, and is the first external electrode connection portion 4a1. To the center side of the multilayer capacitor body 10. The first outer extending portion 4a3 is connected to the other end of the first external electrode connecting portion 4a1, and the first central extending portion 4a2 extends from the first external electrode connecting portion 4a1. It extends toward the opposite direction.

In the multilayer capacitor 10A, the first external terminal 4a is joined to the first external electrode 3a via the solder 5 at the first external electrode connection portion 4a1, and the first central extension portion 4a2 is connected to the first external electrode 4a1. It is located above the upper surface of the first external electrode 3a and faces the first external electrode 3a, and the first outer extension 4a3 is located below the lower surface of the first external electrode 3a. The substrate 9 is connected to the substrate electrode 9 a via the solder 6. Further, as shown in FIG. 1, the first external electrode 3a is a first external electrode connecting portion 4a1 at a central portion between the first central extending portion 4a2 and the first outer extending portion 4a3. However, what is necessary is just to join with the 1st external electrode connection part 4a1 between the 1st center side extension part 4a2 and the 1st outer side extension part 4a3.

  The second external terminal 4b has a second external electrode connection portion 4b1, a second central extension portion 4b2, and a second outer extension portion 4b3. The second external electrode connection portion 4b1 is provided to face the second external electrode 3b, and is joined to the first external electrode 3b via the solder 5. The second central extension 4b2 is connected to one end of the second external electrode connection 4b1, is opposed to the upper surface of the second external electrode 3b, and is the second external electrode connection 4b1. To the center side of the multilayer capacitor body 10. The second outer extension 4b3 is connected to the other end of the second external electrode connection 4b1, and the second central extension 4b2 extends from the second external electrode connection 4b1. It extends toward the opposite direction.

  In the multilayer capacitor 10A, the second external terminal 4b is joined to the second external electrode 3b via the solder 5 at the second external electrode connection portion 4b1, and the second central extension portion 4b2 is connected to the second external electrode 4b1. It is located above the upper surface of the second external electrode 3b and is opposed to the first external electrode 3a, and the second outer extension 4b3 is located below the lower surface of the second external electrode 3b. The substrate 9 is connected to the substrate electrode 9b via the solder 6. Further, as shown in FIG. 1, the second external electrode 3b is a second external electrode connecting portion 4b1 at the central portion between the second central extending portion 4b2 and the second outer extending portion 4b3. However, what is necessary is just to join with the 2nd external electrode connection part 4b1 between the 2nd center side extension part 4b2 and the 2nd outer side extension part 4b3.

The first external terminal 4a is joined to the first external electrode 3a by fusion bonding with the first external electrode connection part 4a1, and the second external terminal 4b is connected to the second external electrode connection part 4b1 by the first external terminal 4a. The two external electrodes 3b may be joined by fusion joining. When melt bonding is used, bonding is greatly simplified and mass productivity is excellent. The fusion bonding is spot welding such as arc spot welding or laser spot welding.

  As shown in FIG. 1, the first external terminal 4a has a first central extension 4a2 that is substantially vertical toward the central side of the multilayer capacitor body 10 with respect to the first external electrode connection 4a1. The first outer extending portion 4a3 extends in a substantially vertical direction toward the outer side of the multilayer capacitor body 10 with respect to the first external electrode connecting portion 4a1. . That is, the first external terminal 4a has the first central extension 4a2 bent at a substantially right angle in the direction inside the multilayer capacitor body 10 with respect to the first external electrode connection 4a2. One outer extending portion 4a3 is bent at a substantially right angle in the direction of the outer side of the multilayer capacitor body 10 with respect to the first external electrode connecting portion 4a2.

  As described above, the first external terminal 4a is formed by bending both ends of one metal plate-like body at substantially right angles in opposite directions. The substantially right angle means the angle formed between the first external electrode connection portion 4a1 and the first central extension portion 4a2 and the formation between the first external electrode connection portion 4a1 and the first outer extension portion 4a3. The angle is in the range of 85 (°) to 95 (°).

  Further, as shown in FIG. 1, the second external terminal 4b is formed symmetrically with the first external terminal 4a, and the second central side extending portion 4b2 is connected to the second external electrode connecting portion 4b1. The multilayer capacitor extends in a substantially vertical direction toward the center of the multilayer capacitor body 10 with respect to the reference, and the second outer extending portion 4b3 is based on the second external electrode connection portion 4b1. It extends in a substantially vertical direction toward the outside of the main body 10. That is, the second external terminal 4b has a second central extension 4b2 bent at a substantially right angle in the direction inside the multilayer capacitor body 10 with respect to the second external electrode connection portion 4b1. The outer extending portion 4b3 is bent substantially at a right angle in the direction of the outer side of the multilayer capacitor body 10 with respect to the second external electrode connecting portion 4b2.

  As described above, the second external terminal 4b is obtained by bending both ends of one metal plate-like body in directions opposite to each other at substantially right angles. The substantially right angle means an angle formed between the second external electrode connection portion 4b1 and the second central connection portion 4b2 and an angle formed between the second external electrode connection portion 4b1 and the second outer extension portion 4b3. Is within the range of 85 (°) to 95 (°).

  In the multilayer capacitor 10 </ b> A, the pair of external terminals 4 a and 4 b includes a first central extension 4 a 2 and a second central extension 4 b 2 that extend toward the center of the multilayer capacitor body 10. The first external electrode connection part 4a1 and the first central extension part 4a2 are substantially perpendicular, and the second external electrode connection part 4b1 and the second central extension part 4b2 is substantially perpendicular.

  The pair of external terminals 4a and 4b includes a first outer extending portion 4a3 and a second outer extending portion 4b3 extending in directions opposite to each other toward the outer side of the multilayer capacitor body 10. The first external electrode connection portion 4b1 and the first outer extension portion 4a3 are substantially perpendicular, and the second outer electrode connection portion 4b1 and the second outer extension portion 4b3 are substantially It is a right angle.

Thus, as shown in FIG. 1, the first external terminal 4a is disposed on the first end face 1c side so that the first external electrode connecting portion 4a1 faces the first external electrode 3a. The first external electrode 3a is joined to the first external electrode 3a through the solder 5, and the first outer electrode connecting portion 4a1 is substantially perpendicular to the first outer electrode connecting portion 4a1 so that the first outer extending portion 4a3 faces the substrate 9. And is electrically connected to the substrate electrode 9 a via the solder 6. The first external terminal 4a has an end portion located on the center side of the multilayer capacitor body 10 in which the first center-side extending portion 4a2 is provided away from the upper surface of the first outer electrode 3a. Is the free end.

  As shown in FIG. 1, in the multilayer capacitor 10A, the first external terminal 4a has the same length of the extending portions of the first central extending portion 4a2 and the first outer extending portion 4a3. Then, when viewed from the side (X direction) orthogonal to the first side surface 1e or the second side surface 1f, the first external electrode connection portion 4a1 is symmetrical with respect to the center of the first external electrode connection portion 4a1. . For example, the length of the extending portion of the first central side extending portion 4a2 is 0.1 (mm) to 0.3 (mm). Moreover, as for the 1st outer side extension part 4a3, the length of an extension part is 0.1 (mm)-0.3 (mm), for example.

  Moreover, the length of the extension part of the 1st center side extension part 4a2 and the 1st outer side extension part 4a3 may be provided in mutually different length. The length of the extending portion of the first central extending portion 4a2 is set so as to improve the effect of suppressing vibration noise generated in the substrate 9, and the extending portion of the first outer extending portion 4a3. This length is set according to the size of the substrate electrode and the like.

  On the other hand, as shown in FIG. 1, the first external terminal 4b is disposed on the second end face 1d side so that the second external electrode connection portion 4b1 faces the second external electrode 3b. Two external electrodes 3b and the solder 5 are joined, and the second outer extending portion 4b3 is substantially perpendicular to the second external electrode connecting portion 4b1 so as to face the substrate 9. It is electrically connected to the substrate electrode 9b via the solder 6. The second external terminal 4b has an end portion located on the center side of the multilayer capacitor body 10 in which the second center side extending portion 4b2 is provided away from the upper surface of the second outer electrode 3b. Is the free end.

  As shown in FIG. 1, in the multilayer capacitor 10A, the second external terminal 4b has the same lengths of the second central extension 4b2 and the second outer extension 4b3. As viewed from the side in the direction (X direction) orthogonal to the first side surface 1e or the second side surface 1f, the second external electrode connection portion 4b1 is symmetric with respect to the center of the second external electrode connection portion 4b1. For example, the length of the extension part of the second center side extension part 4b2 is 0.1 (mm) to 0.3 (mm). Moreover, as for the 2nd outer side extension part 4a3, the length of an extension part is 0.1 (mm)-0.3 (mm), for example.

  Moreover, the length of the extension part of the 2nd center side extension part 4b2 and the 2nd outer side extension part 4b3 may be provided in mutually different length. The length of the extending portion of the second central extending portion 4b2 is set so as to improve the effect of suppressing vibration noise generated in the substrate 9, and the extending portion of the second outer extending portion 4b3. Is set according to the size of the substrate electrode 9a (9b) and the like.

  In the first external terminal 4a, the first external electrode connection portion 4a1 is joined to the first external electrode 3a via the solder 5, and the second external terminal 4b is connected to the second external electrode connection portion 4b1. The two external electrodes 3 b are joined to each other through the solder 5. As shown in FIG. 1, the first external electrode connection portion 4a1 is solder-bonded to the first external electrode 3a, and the upper end portion and the lower end portion are not bonded to the first external electrode 3a. It is not restrained by the first external electrode 3a. Further, as shown in FIG. 1, the second external electrode connection portion 4b1 is soldered to the second external electrode 4a, and the upper end portion and the lower end portion are not joined to the second external electrode 3b. The second external electrode 3b is not constrained. Moreover, the solder 5 has a high melting point, and for example, Sn—Sb or Sn—Ag—Cu can be used. The solder 5 serves as a solder joint between the first external electrode connection 4a1 and the first external electrode 3a, and serves as a solder joint between the second external electrode connection 4b1 and the second external electrode 3b.

As described above, the multilayer capacitor 10 </ b> A is joined to the pair of external electrodes 3 a and 3 b so that the pair of external terminals 3 a and 3 b are separated from the surface of the substrate 9. The multilayer capacitor 10A includes a multilayer capacitor body 10 that is a substrate 9.
The separation distance (the distance between the surface of the substrate 9 and the second main surface 1b of the multilayer capacitor body 10) is the size of the multilayer capacitor body 10 or the mounting stability of the multilayer capacitor 10A, etc. Accordingly, the length of the first and second external electrode connecting portions 4a1, 4b1 can be adjusted.

The first external electrode 3a is joined to the first external electrode connecting portion 4a1 between the first central extending portion 4a2 and the first outer extending portion 4a3. The electrode 3b is joined to the second external electrode connecting portion 4b1 between the second central extending portion 4b2 and the second outer extending portion 4b3, and the first external electrode 3a and the second external electrode connecting portion 4b1 are connected to each other. In the external electrode 3b, the joining position of the first external electrode connection portion 4a1 and the second external electrode connection portion 4b1 is set according to the required suppression effect of vibration noise. For example, in order to enhance the required effect of suppressing vibration noise, the first external electrode 3a is joined on the first outer extension 4a3 side, and the second outer electrode 3b is connected to the second outer extension. Joined on the side 4b3 side.

  The first external electrode connection portion 4a1 has an upper end portion and a lower end portion that are not connected to the first external electrode 3a, and are side surfaces from a direction (X direction) orthogonal to the first side surface 1e or the second side surface 1f. As seen, it is easy to absorb vibration by increasing the length of the upper end, and the second external electrode connection portion 4b1 is not connected to the second external electrode 3b at the upper end and the lower end. When the side surface is viewed from the direction (X direction) orthogonal to the first side surface 1e or the second side surface 1f, vibration is easily absorbed by increasing the length of the upper end portion.

  As shown in FIG. 1, the first external terminal 4a has a rectangular plate-shaped first external electrode connection portion 4a1, and is substantially parallel to the first external electrode 3a. 3a, the first central extension 4a2 is a rectangular plate, is substantially parallel to the upper surface of the first external electrode 3a, and the first outer substrate side connection 4a2 is It is a rectangular plate-like body, is substantially parallel to the substrate electrode 9a of the substrate 9 on which the multilayer capacitor 10A is mounted, and is connected to the substrate electrode 9a via the solder 6. The shapes of the first external electrode connecting portion 4a1, the first central side extending portion 4a2, and the first outer extending portion 4a3 are not limited to the rectangular plate-like body, but are the first external electrode 3a and the substrate electrode 9a. It is set appropriately according to the shape and the like.

  Further, as shown in FIG. 1, the second external terminal 4b has a rectangular plate-like body as the second external electrode connecting portion 4b1, and is substantially parallel to the second external electrode 3b. Joined to the external electrode 3b, the second central extension 4b2 is a rectangular plate, is substantially parallel to the upper surface of the second external electrode 3b, and the second substrate-side connection 4b2 is rectangular. It is a plate-like body, is substantially parallel to the substrate electrode 9b of the substrate 9 on which the multilayer capacitor 10A is mounted, and is connected to the substrate electrode 9b via the solder 6. The shapes of the second external electrode connection portion 4b1, the second central extension portion 4b2, and the second outer extension portion 4b3 are not limited to the rectangular plate-like body, but are the second external electrode 3b and the substrate electrode 9b. It is set appropriately according to the shape and the like.

  The pair of external terminals 4a and 4b are made of, for example, a metal material such as iron (Fe), nickel (Ni), chromium (Cr), copper (Cu), silver (Ag), or cobalt (Co), or these metals For example, an alloy material such as a stainless alloy or a copper alloy including one or more materials. The first external terminal 4a and the second external terminal 4b are preferably formed of the same metal material or alloy material.

  In addition, the first external terminal 4a and the second external terminal 4b include a first outer extending portion 4a3, a first outer electrode connecting portion 4a1, a first central extending portion 4a2, and a second outer extending portion. The thickness of the existing portion 4b3, the second external electrode connecting portion 4b1, and the second central side connecting portion 4b2 is, for example, 0.1 (mm) to 0.15 (mm), and the size of the multilayer capacitor body 10 is large. The thickness may be set as appropriate so as to obtain an effect of suppressing the vibration noise depending on the thickness or application.

  In the first external terminal 4a, a region of the first external electrode connection portion 4a1 that is not joined to the first external electrode 3a absorbs vibration due to distortion, and the second external terminal 4b Of the two external electrode connection portions 4b1, a region that is not joined to the second external electrode 3b absorbs vibration due to distortion. In the first external terminal 4a, the first central extension 4a2 is not restricted by the first external electrode 3a, and the first central extension 4a2 absorbs vibration due to distortion. In addition, the second external terminal 4b has the second central extension 4b2 not restricted by the second external electrode 3b, and the second central extension 4b2 vibrates due to distortion. Will absorb.

  For example, if the thickness of the first external terminal 4a and the second external terminal 4b is thinner than 0.1 (mm), for example, the multilayer capacitor 10A has a reduced rigidity. Vibration due to the generated distortion is easily absorbed by the first external terminal 4a and the second external terminal 4b, and the deformation of the multilayer capacitor body 10 is hardly transmitted to the substrate 9. However, in the multilayer capacitor 10A, the vibration noise of the substrate 9 tends to be small, but when mounted on the substrate 9, the mounting stability is deteriorated.

  Conversely, if the thickness of the first external terminal 4a and the second external terminal 4b is greater than, for example, 0.15 (mm), the multilayer capacitor 10A has increased rigidity, so the multilayer capacitor body 10 The vibration due to the distortion generated in step 1 is difficult to be absorbed by the first external terminal 4a and the second external terminal 4b, the deformation of the multilayer capacitor body 10 is easily transmitted to the substrate 9, and the vibration sound of the substrate 9 is likely to increase. As described above, in the multilayer capacitor 10A, the thickness of the first external terminal 4a and the second external terminal 4b is set in consideration of the effect of suppressing the vibration noise generated in the substrate 9 and the mounting stability.

  Further, the first external terminal 4a and the second external terminal 4b have the lengths of the first external electrode connection portion 4a1 and the first central side extension portion 4a2 and the second external electrode connection portion 4b1 and the second external electrode connection portion 4b1. What is necessary is just to set suitably the length with the center side extension part 4b2 of 2 so that the suppression effect of a vibration sound may be acquired according to the magnitude | size or use of the multilayer capacitor main body 10, etc.

  For example, in the first external terminal 4a and the second external terminal 4b, when the length of the first external electrode connection portion 4a1 and the length of the second external electrode connection portion 4b1 are increased, the multilayer capacitor 10A is Since the rigidity is reduced, vibration due to distortion generated in the multilayer capacitor body 10 is easily absorbed by the first external terminal 4a and the second external terminal 4b, and the deformation of the multilayer capacitor body 10 is not easily transmitted to the substrate 9. Become. However, in the multilayer capacitor 10A, the vibration noise of the substrate 9 tends to be small, but since the rigidity is small, the mounting stability is deteriorated when mounted on the substrate 9.

  Conversely, when the length of the first external electrode connection portion 4a1 and the length of the second external electrode connection portion 4b1 are shortened in the first external terminal 4a and the second external terminal 4b, the multilayer capacitor 10A Since the rigidity is increased, vibration due to distortion generated in the multilayer capacitor body 10 is not easily absorbed by the first external terminal 4a and the second external terminal 4b, and the deformation of the multilayer capacitor body 10 is transmitted to the substrate 9. This is easy, and the vibration sound of the substrate 9 tends to increase. As described above, in the multilayer capacitor 10A, the lengths of the first external terminal 4a and the second external terminal 4b are set in consideration of the effect of suppressing vibration noise generated in the substrate 9 and the mounting stability.

The pair of external terminals 4a and 4b has a plating layer 7 formed on the surface thereof for solder bonding to the substrate electrodes 9a and 9b. As shown in FIGS. 6 and 7, the plating layer 7 formed on the surface is formed. Is included. The plating layer 7 is formed on the pair of external terminals 4a and 4b using, for example, an electrolytic plating method or the like. The plating layer 7 may be formed not only on both main surfaces of the pair of external terminals 4a and 4b but also on a side surface located between both main surfaces. Moreover, when providing the area | region which does not form the plating layer 7 among a pair of external terminals 4a and 4b, the plating layer 7 performs a masking process etc., for example, may be formed using the electrolytic plating method etc., for example. it can.

  The plating layer 7 is composed of a first plating layer and a second plating layer formed on the surface of the first plating layer. The first plating layer is a first and second external terminal. The surfaces of 4a and 4b are covered, and the second plating layer is formed on the surface of the first plating layer and covers the surface of the first plating layer. Each of the first plating layer and the second plating layer may be composed of a plurality of plating layers.

  The first plating layer is, for example, a metal material such as nickel (Ni), silver (Ag), or tin (Sn), or an alloy material such as an Sn—Ag alloy including one or more of these metal materials. It is. For example, the first plating layer is made of a metal material of nickel (Ni) or an alloy material containing nickel (Ni) as a main component, and has a thickness of, for example, 1 (μm) to 2 (μm).

  In addition, the second plating layer is, for example, a metal material such as nickel (Ni), silver (Ag), or tin (Sn), or an alloy of, for example, Sn—Ag alloy containing one or more of these metal materials. Material. For example, the second plating layer is made of a metal material of tin (Sn) or an alloy material containing tin (Sn) as a main component, and has a thickness of, for example, 1 (μm) to 2 (μm).

  Further, as shown in FIG. 3, the first external terminal 4a has the first outer extending portion 4a3 mounted on the substrate electrode 9a of the substrate 9 through the solder 6, similarly, In the second external terminal 4b, the second outer extending portion 4b2 is mounted on the substrate electrode 9b of the substrate 9 via solder.

  As shown in FIG. 3, the first external terminal 4a is connected to the substrate electrode 9a on the substrate 9 via the solder 6, and the solder 6 is connected to the first external electrode connecting portion 4a1 from the lower end portion. The fillet is formed over the outer extending portion 4a3 and the substrate electrode 9a. Further, as shown in FIG. 3, the second external terminal 4b is connected to the substrate electrode 9b on the substrate 9 via the solder 6, and the solder 6 is connected to the lower end of the second external electrode connecting portion 4b1. A fillet is formed from the second outer extension 4b3 and the substrate electrode 9b. As the solder 6, for example, Sn—Sb or Sn—Ag—Cu solder can be used. For example, when the multilayer capacitor 10 </ b> A is mounted using a reflow furnace, the solder 6 is preferably a solder having a melting point lower than that of the solder 5 so that the solder 5 does not melt.

In the multilayer capacitor, for example, when the multilayer capacitor main body is composed mainly of barium titanate (BaTiO ₃ ), etc. as a dielectric layer, when an AC voltage is applied to the multilayer capacitor main body, Due to the electrostrictive effect, distortion occurs in the dielectric layer in accordance with the magnitude of the AC voltage. In the multilayer capacitor, the distortion causes vibration in the multilayer capacitor body itself, and the vibration propagates to the substrate and the substrate vibrates. When this vibration is in an audible frequency band, the vibration of the substrate appears as vibration sound.

  Such a multilayer capacitor uses a pair of external terminals to improve the effect of suppressing vibration noise, but the pair of external terminals is connected to the external electrode over the entire surface of the portion facing the pair of external electrodes via solder. It is difficult to further propagate the vibration of the multilayer capacitor body to the substrate.

However, in the multilayer capacitor 10A according to the embodiment, the first external electrode connection portion 4a1 is not joined at the upper end and the lower end to the first external electrode 3a, and the second external electrode connection The upper end portion and the lower end portion of the portion 4b1 are not joined to the second external electrode 3b, and the first central extension portion 4a2 is spaced apart from the first external electrode 3a and the first external electrode The connection portion 4a1 extends toward the center side of the multilayer capacitor body 10, and the second center side extension 4b2 is separated from the second external electrode 3b and the second external electrode connection portion 4b1. To the center side of the multilayer capacitor body 10.

  Thus, in the multilayer capacitor 10A, the upper end portion and the lower end portion of the first external electrode connection portion 4a1 are not constrained by the external electrode 3a, and the upper end portion and the lower end portion of the second external electrode connection portion 4b1. Are not constrained by the second external electrode 3b, and the first central extension 4a2 is not constrained by the first external electrode 3a, and the second central extension 3 4b2b is not restrained by the second external electrode 3b.

  Therefore, the multilayer capacitor 10A includes an upper end portion and a lower end portion of the first external electrode connection portion 4a1 and the second external electrode connection portion 4b1, a first central extension portion 4a2, and a second central extension portion. 4b2 makes it easy to absorb the vibration due to the distortion of the multilayer capacitor main body 10, and the vibration of the multilayer capacitor main body 10 can be further prevented from propagating to the substrate 9, so that the vibration of the multilayer capacitor main body 10 is the first. Propagation to the substrate 9 through the external terminal 4a and the second external terminal 4b can be effectively suppressed. In this way, the multilayer capacitor 10A can suppress the generation of vibration sound on the substrate 9, so that “sounding” hardly occurs and the effect of suppressing vibration sound can be improved.

  The first external terminal 4a has a free end at the center of the first central extension 4a2, and the second external terminal 4b has a second central extension 4b2. The end of the center side is a free end. Therefore, the pair of external terminals 4a and 4b is easily elastically deformed by the first central extending portion 4a2 and the second central extending portion 4b2, and the multilayer capacitor body 10 vibrates with the elastic deformation. The multilayer capacitor 10 </ b> A can be easily absorbed and can suppress the generation of vibration sound on the substrate 9, so that “sounding” is less likely to occur and the effect of suppressing vibration sound can be improved.

  Further, the multilayer capacitor 10A is provided such that the first center-side extension portion 4a2 and the second center-side extension portion 4b2 are parallel to the multilayer capacitor body 10, while suppressing the height, That is, it is possible to improve the effect of suppressing vibration noise by reducing the sacrifice of low profile.

  In addition, when a multilayer capacitor having an external terminal is mounted on a substrate via a solder using a collision jet heating method in a reflow furnace, for example, hot air blown from a jet port is connected to the first external electrode. Since it becomes easy to directly contact the solder joint portion between the first external terminal and the solder joint portion between the second external electrode and the second external terminal, and the temperature of the solder joint portion is likely to rise, the solder joint portion As the alloying progresses, the solder joint tends to deteriorate.

  However, in the multilayer capacitor 10A, the first central extension 4a2 and the second central extension 4b2 are located above the first external electrode 3a and the second external electrode 3b. Since the first capacitor body 10 extends toward the center side, the first center side extension portion 4a2 and the second center side extension portion 4b2 are the first outer electrode 3a and the second outer electrode 3b. It is in a state that covers.

Therefore, in the multilayer capacitor 10A, the first central extension 4a2 and the second central extension 4b2 are connected to the solder joint between the first external electrode 3a and the first external terminal 4a and the second external extension 4a2. The hot air blown from the jet outlet is made difficult to directly contact the solder joint between the external electrode 3b and the second external terminal 4a, and the temperature rise of the solder joint is suppressed, and the solder joint is alloyed. Since it becomes difficult to progress, durability can be improved.

  As described above, when the multilayer capacitor 10A is mounted on the substrate 9, the first outer extension 4a3 is connected to the substrate electrode 9a of the substrate 9, and the second outer extension 4b3 is connected to the substrate 9. To the substrate electrode 9a. On the other hand, as shown in FIGS. 4 and 5, the multilayer capacitor 10B has the same configuration as that of the multilayer capacitor 10A, and the vertical direction of the multilayer capacitor 10A is reversed. Therefore, in the multilayer capacitor 10B, the first central extension 4a2 is connected to the substrate electrode 9a of the substrate 9, and the second central extension 4b2 is connected to the substrate electrode 9a of the substrate 9. Become. In the multilayer capacitor 10B, the first and second outer extending portions 4a3 and 4b3 have the same effects as the first and second central extending portions 4a2 and 4b2 of the multilayer capacitor 10A. .

  As described above, in the multilayer capacitor 10B, the first external terminal 4a is formed so that the first external electrode connection portion 4a1 faces the first external electrode 3a as shown in FIGS. The first external electrode connecting portion is disposed on the end surface 1c side of the first external electrode 3a and joined to the first external electrode 3a via the solder 5 so that the first central extension 4a2 faces the substrate 9. It is substantially perpendicular to 4a1 and is electrically connected to the substrate electrode 9a via the solder 6. The first external terminal 4a is provided with a first outer extension 4a2 spaced from the first external electrode 3a, and an end located outside the multilayer capacitor body 10 is a free end. It has become.

  In the multilayer capacitor 10B, the first external terminal 4a is joined to the first external electrode 3a via the solder 5 at the first external electrode connection portion 4a1, and the first outer side extending portion 4a3 is connected to the first external electrode 4a1. It is located above the upper surface of the first external electrode 3a, and the first central extension 4a2 is located below the lower surface of the first external electrode 3a and faces the first external electrode 3a. Therefore, the substrate 9 is connected to the substrate electrode 9 a via the solder 6.

  On the other hand, as shown in FIGS. 4 and 5, the first external terminal 4b is disposed on the second end face 1d side so that the second external electrode connecting portion 4b1 faces the second external electrode 3b. The second external electrode 3b is joined to the second external electrode 3b via the solder 5, and is substantially perpendicular to the second external electrode connection portion 4b1 so that the second central extension 4b2 faces the substrate 9. It is electrically connected to the substrate electrode 9b via the solder 6. The second external terminal 4b has a second outer extending portion 4b3 spaced apart from the second external electrode 3b, and an end located on the center side of the multilayer capacitor body 10 is a free end. It has become.

  In the multilayer capacitor 10B, the second external terminal 4b is joined to the second external electrode 3b via the solder 5 at the second external electrode connection portion 4b1, and the second outer extension portion 4b3 is connected to the second external electrode 4b3. 2 is located above the upper surface of the second external electrode 3b, and the second central extension 4b2 is located below the lower surface of the second external electrode 3b and faces the second external electrode 3b. The substrate 9 is connected to the substrate electrode 9b via the solder 6.

  As described above, the multilayer capacitor 10B (10A) has the first central extension 4a2 and the second central extension 4b2 or the first outer extension 4a3 by reversing the vertical direction. And it can mount on the board | substrate 9 by the 2nd outer side extension part 4b3. Therefore, the multilayer capacitor 10B (10A) can be mounted on the substrate 9 in accordance with the inter-electrode distance between the substrate electrode 9a and the substrate electrode 9b by changing the vertical direction. It is possible to increase the degree of freedom of design such as the distance.

In addition, as shown in FIGS. 4 and 5, in the multilayer capacitor 10 </ b> B, the pair of external terminals 4 a and 4 b suppresses vibration of the substrate 9, thereby making it difficult for “sounding” to occur, and suppressing vibration noise. Can be improved. Further, in the multilayer capacitor 10B, the first outer extending portion 4a3 and the second outer extending portion 4b3 are located below the multilayer capacitor main body 10, the length in the Y direction is shortened, and the substrate 9 The interelectrode distance between the upper substrate electrode 9a and the substrate electrode 9b can be shortened. Therefore, in the multilayer capacitor 10B, a chip component having a height lower than that of the multilayer capacitor 10B is mounted around the multilayer capacitor 10B below the first outer extension 4a3 and the second outer extension 4a3. And the mounting density of components can be improved. Note that the multilayer capacitor 10B is longer than the multilayer capacitor 10A in the Y direction by the amount that the first outer extension 4a3 and the second outer extension 4b3 are bent inward (center side). Is shorter.

  Here, an example of a manufacturing method of the multilayer capacitor body 10A (10B) shown in FIG. 1 will be described below.

  First, a method for manufacturing the multilayer capacitor body 10 will be described below.

  A plurality of first and second ceramic green sheets are prepared. The first ceramic green sheet is formed with the first internal electrode 2a, and the second ceramic green sheet is formed with the second internal electrode 2b.

  In order to form the first internal electrode 2a, the plurality of first ceramic green sheets have the internal electrode conductor paste layer formed on the ceramic green sheet by using the pattern shape of the internal electrode 2a as the conductive paste for the internal electrode 2a. It is formed. In the first ceramic green sheet, a plurality of first internal electrodes 2 a are formed in one ceramic green sheet in order to obtain a large number of multilayer capacitor bodies 10.

  Further, in order to form the second internal electrode 2b, the plurality of second ceramic green sheets are formed on the ceramic green sheet by using the pattern shape of the internal electrode 2b as a conductive paste for the internal electrode 2b. A layer is formed. In the second ceramic green sheet, a plurality of second internal electrodes 2b are formed in one ceramic green sheet in order to obtain a large number of multilayer capacitor bodies 10.

  The first and second internal electrode conductor paste layers described above are formed by printing each conductor paste in a predetermined pattern shape on a ceramic green sheet using, for example, a screen printing method or the like.

  The first and second ceramic green sheets serve as dielectric layers, the first internal electrode conductor paste layer serves as the first internal electrode 2a, and the second internal electrode conductor paste layer serves as the second internal electrode 2b. Become.

Examples of the material of the ceramic green sheet used as the dielectric layer include dielectrics such as barium titanate (BaTiO ₃ ), calcium titanate (CaTiO ₃ ), strontium titanate (SrTiO ₃ ), or calcium zirconate (CaZrO ₃ ). The main component is ceramics. For example, a Mn compound, Fe compound, Cr compound, Co compound, or Ni compound may be added as the accessory component.

  The first and second ceramic green sheets are prepared by adding a suitable organic solvent and the like to the dielectric ceramic raw material powder and the organic binder and mixing them, and using a doctor blade method or the like. It is obtained by forming a ceramic slurry.

  In the conductive paste for the first and second internal electrodes 2a and 2b, an additive (dielectric material), a binder, a solvent, a dispersant and the like are added to the above-described powder of the conductive material (metal material) of each internal electrode. And kneading. The conductive material of the first and second internal electrodes 2a and 2b is, for example, a metal material such as nickel (Ni), copper (Cu), silver (Ag), palladium (Pd), or gold (Au), or a metal thereof. For example, an alloy material such as an Ag—Pd alloy including one or more materials may be used. The first and second internal electrodes 2a and 2b are preferably formed of the same metal material or alloy material.

  The first ceramic green sheet is formed with a first internal electrode 2a, and the second ceramic green sheet is formed with a second internal electrode 2b. The first ceramic green sheet and the second ceramic green sheet A plurality of ceramic green sheets are alternately stacked, and a ceramic green sheet on which no internal electrode is formed is stacked on the outermost layer in the stacking direction, thereby manufacturing a stacked body made of a ceramic material.

  Thus, the laminated body which consists of a some 1st and 2nd ceramic green sheet becomes large sized green laminated body containing many raw laminated bodies by pressing and integrating. By cutting this large green laminate, a green laminate that becomes the laminate 1 of the multilayer capacitor 10 as shown in FIG. 1 can be obtained. The large green laminate can be cut using, for example, a dicing blade.

  And the laminated body 1 can be obtained by baking a raw laminated body at 800 (degreeC) -1300 (degreeC), for example. By this step, the plurality of first and second ceramic green sheets become dielectric layers, the first internal electrode conductor paste layer becomes the first internal electrode 2a, and the second internal electrode conductor paste layer becomes the second internal electrode. It becomes the internal electrode 2b. Moreover, the laminated body 1 can round a corner | angular part or a side part using grinding | polishing means, such as barrel grinding | polishing, for example. The laminated body 1 becomes a thing which a corner | angular part or a side part cannot be easily chipped by rounding a corner | angular part or a side part.

  Next, the base electrode 3c of the external electrode 3 is applied to the first end face 1c and the second end face 1d of the multilayer body 1 by applying and baking a conductive paste for the base electrode 3c to be the base electrode 3c of the external electrode 3. Form. The conductive paste for the base electrode 3c is prepared by adding a binder, a solvent, a dispersant, and the like to the metal material powder constituting the base electrode 3c described above and kneading.

  The conductive paste for the base electrode 3c is prepared by adding a binder, a solvent, a dispersant and the like to the powder of the metal material constituting the base electrode 3c and kneading. The conductive material of the base electrode is, for example, a metal material such as nickel (Ni), copper (Cu), silver (Ag), palladium (Pd), or gold (Au), or one or more of these metal materials. For example, an alloy material such as an Ag—Pd alloy. The base electrode 3c may be formed by using a thin film forming method such as a vapor deposition method, a plating method, or a sputtering method, in addition to using a method of baking a conductor paste.

  Next, a plating layer 3 d is formed on the surface of the base electrode 3 c so as to cover the base electrode 3 c of the external electrode 3. The plating layer 3d is formed on the surface of the base electrode 3c using, for example, an electrolytic plating method or the like. The plating layer 3d is, for example, a nickel (Ni) plating layer, a copper (Cu) plating layer, a gold (Au) plating layer, a tin (Sn) plating layer, or the like. Although the plating layer 3d may be formed from a single plating layer, the multilayer capacitor body 10 has a plating layer 3d composed of a first plating layer 3d1 and a second plating layer 3d2. The body is formed on the surface. For example, in the multilayer capacitor main body 10, the first plating layer 3d1 is made of a nickel (Ni) plating layer, the second plating layer 3d2 is made of a tin (Sn) plating layer, and the second plating layer 3d2 has a tin ( The Sn) plating layer is formed so as to cover the nickel (Ni) plating layer of the first plating layer 3d1.

  Next, an example of a method for manufacturing the multilayer capacitor 10A (10B) will be described below with reference to FIGS.

  First, an example of a manufacturing method of the pair of external terminals 4a and 4b will be described. One strip-shaped metal plate is prepared. The strip-shaped metal plate has, for example, a thickness of 0.1 (mm) to 0.15 (mm), a length of 100 (mm) to 250 (mm), and is made of, for example, a stainless alloy.

  For example, as shown in FIG. 6A, the first external terminal 4aa serving as the first external terminal 4a and the second external terminal 4bb serving as the second external terminal 4b are arranged to face each other. Then, the band-shaped metal plate is punched using, for example, a press punching method in accordance with the pattern shapes of the first external terminal 4aa and the first external terminal 4bb. In this way, as shown in FIG. 6A, a plurality of external terminal pairs 8a including the first external terminals 4aa and the second external terminals 4bb are provided on the belt-shaped metal plate. In the following description, a strip-shaped metal plate formed with a plurality of external terminal bodies 8a is used as the lead frame 8. As described above, the plurality of multilayer capacitors 10 </ b> A (10 </ b> B) are efficiently manufactured by using the lead frame 8.

  In the lead frame 8, the plating layer 7 is formed by plating the plurality of external terminal pairs 8 a. As shown in FIG. 6A, the plating layer 7 is formed on the external terminal pair 8a (the first external terminal 4aa and the second external terminal 4bb) by using, for example, an electrolytic plating method. The plating layer 7 is formed in a region including the front surface, the back surface, and the side surface of the external terminal pair 8a.

  In the above, the lead frame 8 is plated after punching, but the lead frame 8 may be punched after plating, and the shape of the pair of external terminals 4aa and 4bb. The processing order is appropriately set in consideration of the above.

  As shown in FIGS. 1 and 4, the first external terminal 4aa is connected to the boundary between the first external electrode connecting portion 4a1 and the first central extending portion 4a2 and the first external electrode extending portion 4a1. And the second outer terminal 4bb are connected to the second outer electrode so that the second outer terminal 4bb has a structure having a bent portion at the boundary between the first outer extending portion 4a3 and the first outer extending portion 4a3. So that the boundary portion between the portion 4b1 and the second central extension portion 4b2 and the boundary portion between the second external electrode extension portion 4b1 and the second outer extension portion 4b3 has a bent portion. As shown in FIG. 5A, the lead frame 8 is bent by setting first to fourth bending lines L1 to L4. Moreover, each bending part may have roundness.

  Specifically, the lead frame 8 has first to fourth fold lines L1 to L4, and the first fold line L1 extends from the first external electrode connecting portion 4a1 and the first center side. 4a2, the second fold line L2 is set at the boundary between the second external electrode connecting portion 4b1 and the second central extension 4b2, and the third fold line L3 is the first fold line L3. 1 is set at the boundary between the first external electrode connection 4a1 and the first outer extension 4a3, and the fourth fold line L4 is the boundary between the second outer electrode connection 4b1 and the second outer extension 4b3. Is set in the department. In addition, the 1st-4th bending lines L1-L4 are shown by the dotted line in Fig.6 (a).

  In the bending process, as shown in FIG. 6A, the first outer electrode connecting portion 4a1 is bent downward with respect to the third fold line L3, and the first outer extending portion 4a3 and the first outer extending portion 4a1 are bent. The boundary portion with the external electrode connection portion 4a1 is bent at a substantially right angle, the second external electrode connection portion 4b1 is bent downward with respect to the fourth fold line L4, and the second outer extension portion 4b3 and the second outer extension portion 4b3 The boundary portion with the external electrode connection portion 4b1 is bent at a substantially right angle.

  Further, the bending process is performed by bending the first central extension 4a2 upward with respect to the first fold line L1, and the first external electrode connection 4a1 and the first central extension 4a2. The second center side extending portion 4b2 is bent upward with respect to the second fold line L2, and the second external electrode connection portion 4b1 and the second center side are bent. A boundary portion with the extending portion 4b2 is bent at a substantially right angle.

  In this way, by using a bending process for the lead frame 8, as shown in FIG. 6B, the first external terminal 4aa is connected to the first external electrode connection portion 4a1 and the first central side. It has a structure having a bent portion (bent portion) between the extended portion 4a2 and between the first external electrode connecting portion 4a1 and the first outer extended portion 4a3, and the second external terminal 4bb is Bending portions (bending portions) are provided between the second external electrode connection portion 4b1 and the second central extension portion 4b2 and between the second external electrode connection portion 4b1 and the second outer extension portion 4b3. It becomes the structure which has. The bending process is performed with respect to the first to fourth fold lines L1 to L4 using, for example, a bending die that matches the shape of the bent portion.

  The bending process for the lead frame 8 may be performed in the following order.

  First, the first central extension 4a2 is bent upward with respect to the first fold line L1, and the boundary between the first central extension 4a2 and the first external electrode connection 4a1 is formed. The second center side extending portion 4b2 is bent upward with respect to the second fold line L2, and the second center side extending portion 4b2 and the second external electrode connecting portion 4b1 are bent. Bend the boundary at a substantially right angle.

  Next, the first external electrode connection portion 4a1 is bent downward with respect to the third fold line L3, so that the boundary between the first outer extension portion 4a3 and the first external electrode connection portion 4a1 is substantially omitted. The second external electrode connection portion 4b1 is bent downward with respect to the fourth fold line L4, and the boundary between the second outer extension portion 4b3 and the second external electrode connection portion 4b1. Bend the part at a substantially right angle.

  Next, as shown in FIG. 7A, the lead frame 8 has the external terminal pair 8a bent, and the first lead frame 8 is bent with respect to the first lead frame 8 using, for example, a dispenser. Solder 5 is supplied to the respective regions of the external electrode connection portion 4a1 and the second external electrode connection portion 4b1. The solder 5 may be formed in each region of the first external electrode connection portion 4a1 and the second external electrode connection portion 4b1 using a printing method.

  Then, as shown in FIG. 7A, on the solder 5 of the first external electrode connecting portion 4a1 and the second external electrode connecting portion 4b1, for example, using an automatic mounting machine equipped with a suction nozzle, A capacitor body 10 is mounted.

  As shown in FIG. 7A, for example, the solder 5 on the first electrode connection portion 4a1 and the second electrode connection portion 4b1 is melted at 220 (° C.) to 250 (° C.) to obtain the first The external electrode 3a and the first external electrode connection portion 4a1 are electrically connected, and the second external electrode 3b and the second external electrode connection portion 4b1 are electrically connected.

  Thus, in the multilayer capacitor body 10, the first external terminal 4aa is attached to the first external electrode 3a, and the second external terminal 4bb is attached to the second external electrode 3b.

  Then, as shown in FIG. 7A, the lead frame 8 sets the first cutting line S1 and the second cutting line S2, and the first cutting line S1 and the second cutting line S2 are set. Is cut. For example, in the lead frame 8, the external terminal pair 8a on which the multilayer capacitor main body 10 is mounted is cut using a cutting die. As a result, as shown in FIG. 7B, a plurality of multilayer capacitors 10 </ b> A are obtained from the lead frame 8. The first cutting line S1 and the second cutting line S2 are indicated by dotted lines in FIG.

  As described above, by using the lead frame 8, the multilayer capacitor 10A (10B) shown in FIG. 1 (FIG. 4) can be efficiently manufactured.

  The present invention is not limited to the multilayer capacitor 10A (10B) of the above-described embodiment, and various modifications and improvements can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Laminate 1a 1st main surface 1b 2nd main surface 1c 1st end surface 1d 2nd end surface 1e 1st side surface 1f 2nd side surface 2 Internal electrode 2a 1st internal electrode 2b 2nd internal electrode 3 external electrode 3a first external electrode 3b second external electrode 3c ground electrode 3d plating layer 3d1 first plating layer 3d2 second plating layer 4 external terminal 4a first external terminal 4a1 first external electrode connection portion 4a2 1st center side extension part 4a3 1st outside extension part 4b 2nd external terminal 4b1 2nd external electrode connection part 4b2 2nd center side extension part 4b3 2nd outside extension part 5 Solder 6 Solder 7 Plating layer 8 Lead frame 8a External terminal pair 9 Substrate 9a, 9b Substrate electrode 9c, 9d Wiring 10 Multilayer capacitor body 10A, 10B Multilayer capacitor L1-L4 Bending line S1-S2 Cutting line

Claims (2)

A plurality of dielectric layers are stacked, and a stack formed in a substantially rectangular parallelepiped shape having first and second end faces facing each other, and an interval in the stacking direction of the plurality of dielectric layers in the stack. And a plurality of internal electrodes disposed on the first and second end faces, and a first and second external electrodes electrically connected to the internal electrodes. The body,
A multilayer capacitor comprising a pair of external terminals joined to the first and second external electrodes,
The pair of external terminals are connected to a first external electrode connecting portion joined to the first external electrode and one end of the first external electrode connecting portion, and the first external electrode A first central side extending portion extending from the connecting portion toward the central side of the multilayer capacitor main body and the other end portion of the first external electrode connecting portion; A first external terminal having a first outer extension extending from the electrode connecting portion in a direction opposite to a direction in which the first central extension extends; and the second external electrode Are connected to one end of the second external electrode connecting portion and the second external electrode connecting portion, and are directed from the second external electrode connecting portion toward the center of the multilayer capacitor body. Connected to the other end of the second central connection portion and the second external electrode connection portion, Wherein the second external electrode connecting portion second central side extending are and a second external terminal and a second outer extending portion extending toward the direction opposite to the direction extending,
The first external electrode is joined to the first external electrode connection portion between the first central extension portion and the first outer extension portion, and the second external electrode The multilayer capacitor is characterized in that it is joined to the second external electrode connecting portion between the second central extending portion and the second outer extending portion. The first external terminal has different lengths of the first central extension part and the extension part of the first outer extension part, and the second external terminal has the second external terminal 2. The multilayer capacitor according to claim 1, wherein lengths of an extension portion of the center side extension portion and the second outer extension portion are different.

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