JP2016178160A - Laminated film capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated film capacitor advantageously suppressed in generation of vibration sound, compact and capable of being manufactured at low cost.SOLUTION: A laminated film capacitor 10 is configured such that a film capacitor element 12 having a structure where a plurality of dielectric films 18 and a plurality of metal deposition films 20 are laminated to be located alternately is provided with a through hole 34 penetrating through the film capacitor element 12 in a lamination direction of the dielectric films 18 and the metal deposition films 20 and the film capacitor element 12 including the inside of the through hole 34 is sealed by a sealing material 14 comprising a synthetic resin.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a multilayer film capacitor, and more particularly to a multilayer film capacitor that can advantageously suppress the generation of vibration noise.

  Conventionally, a multilayer film capacitor is known as one of film capacitors used in electronic devices. Such a multilayer film capacitor is, for example, a film capacitor element (capacitor element) having a structure in which at least one dielectric film made of a resin film or the like and at least one metal deposition film are alternately positioned. And an external connection terminal is connected to each of the pair of metallicon electrodes formed in the capacitor element.

  By the way, in the laminated film capacitor having such a structure, when an AC voltage is applied at the time of use, the dielectric film repeatedly contracts at a constant cycle in the laminating direction by Coulomb force (electrostatic force), As a result, there is a problem that the capacitor element vibrates and generates a sound (vibration sound).

  As one countermeasure against such vibration noise, a structure is adopted in which the generated vibration noise is attenuated by covering the capacitor element with an elastic member. For example, even in the applicant of the present application, in Japanese Patent Application Laid-Open No. 2012-54468 (Patent Document 1), the capacitor element is accommodated in a case in a state where the periphery is covered with a rubber filler, When the capacitor element vibrates by energization, the vibration of the capacitor element can be advantageously absorbed by the elastic deformation of the filler, and the generation of noise caused by the vibration of the capacitor element can be effectively prevented. (See paragraph [0052] of the specification of the same document).

  As another countermeasure against vibration noise, a structure that suppresses vibration noise generated by increasing the rigidity of a member disposed around the capacitor element is also employed. For example, in JP 2010-219259 A (Patent Document 2), among a plurality of capacitor elements formed by winding a metallized film, a gap is provided between at least one pair of adjacent capacitor elements, A structure has been clarified in which inclusions are disposed in such gaps to increase the rigidity of the capacitor module (film capacitor) and suppress vibration.

JP 2012-54468 A JP 2010-219259 A

  However, in the structure that attenuates the generated vibration noise by covering the capacitor element with the elastic member in such a manner, the elastic member is filled in an elastically deformed state in advance to ensure the moisture resistance of the film capacitor. It will be necessary. For this reason, the vibration sound attenuation effect by such an elastic member is reduced, and it is difficult to sufficiently attenuate the vibration sound. Also, if the vibration sound is to be sufficiently attenuated, the amount of elastic member required As a result, problems such as an increase in the size of film capacitors and an increase in manufacturing costs arise.

  Further, as described above, in the structure that suppresses the generated vibration noise by increasing the rigidity of the film capacitor, it is necessary to provide a gap for arranging inclusions between the plurality of capacitor elements. However, there is a problem that the film capacitor becomes large. In addition, since it has a plurality of capacitor elements, it is difficult to place each capacitor element at a predetermined position in the case, and there are a plurality of junctions between the capacitor elements and the lead terminals. As a result, workability deteriorates and the manufacturing cost of the film capacitor rises.

  Here, the present invention has been made in the background of such circumstances, and the solution to that problem is that generation of vibration noise is advantageously suppressed, and the device can be manufactured in a small size and at low cost. And providing a laminated film capacitor.

  And in this invention, in order to solve such a subject, it has a plurality of dielectric films and a plurality of metal vapor deposition films, and they are laminated so that these dielectric films and metal vapor deposition films are alternately positioned. A multilayer film capacitor obtained by using a film capacitor element having a structure as described above, wherein the film capacitor element penetrates through the film capacitor element in the stacking direction of the dielectric film and the metal vapor deposition film. A gist of the present invention is a laminated film capacitor, wherein the film capacitor element including a hole and further including the inside of the through hole is sealed with a sealing material made of a synthetic resin. .

  In addition, according to one of the desirable embodiments of the multilayer film capacitor according to the present invention, a metallized film in which the dielectric film is made of a resin film and the metal vapor deposition film is formed on the resin film. The film capacitor element is configured by overlapping a plurality.

  Further, according to one of the advantageous aspects of the multilayer film capacitor according to the present invention, the film capacitor element is accommodated in a casing-shaped case, the gap between the film capacitor element and the case, and the By filling the inside of the through hole with the sealing material, the film capacitor element including the inside of the through hole is accommodated in the case in a state of being sealed with the sealing material.

  Thus, in the multilayer film capacitor according to the present invention, through holes are provided in a film capacitor element having a structure in which a plurality of dielectric films and a plurality of metal vapor deposition films are alternately stacked. Since the entire film capacitor element including the inside of the through hole is sealed with a sealing material made of synthetic resin, the vibration of the film capacitor element is transmitted to the outside by such a sealing material. Therefore, the vibration noise of the multilayer film capacitor resulting from the vibration of the film capacitor element can be advantageously suppressed.

  In the multilayer film capacitor according to the present invention, the rigidity of the multilayer film capacitor is advantageously increased by sealing the film capacitor element including the inside of the through hole with a sealing material made of synthetic resin. ing. In particular, since the inside of the through hole is sealed with such a sealing material, the rigidity of the multilayer film capacitor can be effectively increased. And the generation of vibration noise in the multilayer film capacitor can be advantageously suppressed.

  Furthermore, in the multilayer film capacitor according to the present invention, in order to suppress vibration noise of the multilayer film capacitor, the film capacitor element is divided into a plurality of pieces as in the prior art, or between the plurality of film capacitor elements. It is not necessary to provide a gap in the film, and it is not necessary to cover the film capacitor element with an elastic member or the like. Therefore, the laminated film capacitor can be advantageously reduced in size and manufactured at a low cost. There are advantages.

It is a section explanatory view showing an example of a lamination type film capacitor according to the present invention. It is AA cross-section explanatory drawing in FIG. It is BB sectional explanatory drawing in FIG. It is a cross-sectional expansion explanatory drawing shown about the metallized film used in the multilayer film capacitor shown by FIG. It is sectional explanatory drawing corresponding to FIG. 1 which shows another example of the laminated film capacitor according to this invention. It is explanatory drawing which shows another example of the laminated film capacitor according to this invention, Comprising: (a) is sectional explanatory drawing corresponding to FIG. 1, (b) is sectional explanatory drawing corresponding to FIG. . It is a cross-sectional enlarged explanatory view corresponding to FIG. 4 which shows about the laminated | multilayer film which can be used in the laminated film capacitor according to this invention.

  Hereinafter, in order to clarify the present invention more specifically, representative embodiments of the present invention will be described in detail with reference to the drawings.

  First, FIG. 1 to FIG. 3 show an example of a multilayer film capacitor according to the present invention in different cross-sectional forms. As shown in FIG. 1, a laminated film capacitor 10 (hereinafter also referred to as a capacitor 10) includes a film capacitor element 12 (hereinafter also referred to as a capacitor element 12) that is sealed by a sealing material 14 made of a synthetic resin. In a sealed state, it is housed in a casing-like case 16 and configured.

  More specifically, the capacitor element 12 has a structure in which a plurality of dielectric films and a plurality of metal vapor deposition films are alternately stacked so as to be shown in FIG. As described above, a plurality of metallized films 22 (see FIG. 4) having a structure in which a metal vapor-deposited film 20 is formed on a resin film 18 as a dielectric film are stacked and laminated. The resin film 18 which comprises those metallized films 22 consists of a stretched film made from polypropylene, and has a moderately thin thickness of about 1 to 10 μm. In addition, as a forming material of such a resin film, it is not limited to polypropylene at all. For example, the formation of a resin film in a film capacitor such as polyethylene terephthalate, polyphenylene sulfide, polyethylene naphthalate, and polyvinylidene fluoride has been conventionally used. An insulating resin material used as a material can be appropriately used.

The metal vapor deposition film 20 that forms the metallized film 22 together with the resin film 18 is formed on the resin film 18 as an internal electrode film in the capacitor element 12. The metal deposition film 20 is formed on the resin film 18 by performing a conventionally known vacuum deposition method belonging to the category of PVD or CVD using a known metal material such as aluminum or zinc as a deposition material. It is what is done. And in such a metal vapor deposition film | membrane 20, the formation material, a film thickness, etc. will be determined suitably so that film | membrane resistance value may be set to about 1-50 ohm / cm < ² >.

  Furthermore, a margin portion 24 where no metal vapor deposition film 20 is formed is provided in one side portion of each metallized film 22 in the width direction (left and right direction in FIGS. 2 and 4). As shown in FIG. 2, in the capacitor element 12, the margin portions 24 and 24 of the adjacent metallized films 22 and 22 among the plurality of metallized films 22 are respectively arranged on both sides in the width direction of the capacitor element 12. Arranged so that they are staggered.

  And in the edge part of the one side (upper side in FIG. 2) of the lamination direction of the some metallization film 22, the protective film 26 which consists of a resin film in which no metal vapor deposition film is formed on the metal vapor deposition film 20 is provided. It is arranged. Thereby, the surface of the capacitor element 12 on both sides in the thickness direction (vertical direction in FIG. 2) is arranged at the end of the other side (lower side in FIG. 2) in the stacking direction of the protective film 26 and the plurality of metallized films 22. The resin film 18 is protected. In addition, such a protective film is not restricted to what consists of a resin film, You may be formed with the vapor deposition film and vapor deposition polymerization film which consist of a predetermined | prescribed resin material.

  In addition, a pair of metallicon electrodes 28 and 28 are formed on both sides of the capacitor element 12 in the width direction. These metallicon electrodes 28 and 28 exhibit functions as external electrodes of the capacitor element 12, and are respectively metal coating films formed by thermal spraying with a predetermined technique using a predetermined metal material. It is composed. The material for forming such a metallicon electrode is not particularly limited, and a metal material such as aluminum or zinc can be appropriately used.

  Further, as shown in FIG. 1, resin protective films 30 and 30 made of a resin film formed by vapor deposition polymerization are respectively provided on both sides of the capacitor element 12 in the vertical direction (vertical direction in FIG. 1). The upper and lower surfaces of the capacitor element 12 are protected by the resin protective films 30, 30. Examples of such resin protective films include polyurea resin films, polyamide resin films, polyimide resin films, polyamideimide resin films, polyester resin films, polyazomethine resin films, polyurethane resin films, and acrylic resin films. A known resin film that can be formed by a conventional method is used. Note that such a resin protective film may be formed of a vapor deposition film made of a predetermined resin material.

  Thus, the capacitor element 12 includes a plurality of metallized films 22, the protective film 26, the metallicon electrodes 28 and 28, and the resin protective films 30 and 30, and has a substantially rectangular parallelepiped shape as a whole. Here, as shown in FIGS. 1 and 2, the dimension in the stacking direction of the plurality of metallized films 22 and the protective film 26 in the capacitor element 12 is the thickness dimension of the capacitor element 12: Tc. When the dimension in the length direction (vertical direction in FIG. 1) of each metallized film 22 is Lf and the dimension in the width direction is Wf, in capacitor element 12, the length dimension of such metallized film 22 is used. : Lf and width dimension: Wf are larger than the thickness dimension: Tc of the capacitor element 12.

  It should be noted that bus bars 32 and 32 as external connection terminals are connected to the metallicon electrodes 28 and 28 of the capacitor element 12, respectively. The bus bars 32 and 32 have a long flat plate shape and are made of a copper plate or the like having high conductivity. Such a bus bar is not limited to a metal plate material having a rectangular shape in cross section as an example, and for example, a metal wire material having a circular shape in cross section can be used as appropriate.

  And in the capacitor | condenser element 12 of this embodiment, as shown in FIG.1 and FIG.3, the through-hole 34 which penetrates the center part of this capacitor | condenser element 12 in the lamination direction of the some metallized film 22 is provided. It is. That is, such a through hole 34 has a circular hole shape and is formed at the central portion of the capacitor element 12 (the plurality of metallized films 22) viewed from the stacking direction of the plurality of metallized films 22. Here, such a through hole 34 is formed by using a known mechanical drilling means using a drill, a hole saw, or a punch.

  In addition, it is preferable that the through hole 34 is formed after the metallicon electrodes 28 and 28 are formed on the plurality of laminated metallized films 22 and the protective film 26 in the capacitor element 12. Thereby, there exists an advantage that the through-hole 34 is formed stably in the state in which the several metallized film 22 and the protective film 26 were fixed by the metallicon electrodes 28 and 28.

  Furthermore, the self-healing function peculiar to the capacitor element 12 is exerted on the inner peripheral surface (cut surface) of the through hole 34 by a predetermined voltage process performed before the capacitor element 12 is used. Generation | occurrence | production of the short circuit (short) in a cut surface is prevented advantageously. During such voltage treatment, gas or the like may be generated due to evaporation of the resin film 18 or the metal deposition film 20 on the cut surface. Therefore, it is desirable that the capacitor element 12 in which the through hole 34 is formed is subjected to a predetermined voltage process before being sealed with the sealing material 14.

  By the way, in the present embodiment, the capacitor element 12 having the structure as described above is accommodated in a casing-like case 16, and the case 16 is made of aluminum and is formed from the capacitor element 12. Has a slightly larger inner shape and has a rectangular housing shape opening upward. The material for forming such a case is not particularly limited, and various resin materials, metal materials, and the like are appropriately selected and used. However, the case has excellent rigidity and moisture penetration through the case. However, a metal material can be preferably used because it can be more sufficiently prevented. Further, among these, aluminum materials are preferably used from the viewpoints of lightness and cost. Further, the thickness (plate thickness) of the case is appropriately determined as long as desired rigidity and strength can be ensured. In the case 16, the capacitor element 12 is arranged such that the through hole 34 extends between the pair of side walls 16 a and 16 a facing the stacking direction of the plurality of metallized films 22 in the case 16. It is.

  In the case 16, the capacitor element 12 including the inside of the through hole 34 is sealed with a sealing material 14 made of synthetic resin. That is, the entire periphery (outer shape) of the capacitor element 12 is surrounded by the sealing material 14, and the sealing material 14 is also filled in the through hole 34 of the capacitor element 12. In addition, as such a sealing material, synthetic resin materials, such as an epoxy resin and a urethane resin, can be mentioned, Among these, the epoxy resin excellent in rigidity and mechanical strength will be used preferably.

  As described above, in the capacitor 10, the capacitor element 12 is accommodated in the case 16, and sealed in the gap between the capacitor element 12 and the inner peripheral surface of the case 16 and in the through hole 34 of the capacitor element 12. By filling the material 14, the capacitor element 12 including the inside of the through hole 34 is accommodated in the case 16 in a state of being sealed by the sealing material 14. Here, the sealing material 14 filled in the through-hole 34 of the capacitor element 12 is a pair facing in the stacking direction of the plurality of metallized films 22 in the case 16, in other words, in the thickness direction of the capacitor element 12. It is arranged so as to be bridged between the side walls 16a, 16a. The side walls 16 a and 16 a have a larger area than the other side walls 16 b and 16 b of the case 16.

  The capacitor element 12 is disposed at a predetermined position in the case 16 with a gap from the inner peripheral surface of the case 16, and is filled with a liquid sealing material (synthetic resin material), so-called so-called operation. By performing the potting operation, sealing is performed. That is, the liquid encapsulant material flows in the case 16, and the liquid encapsulant material is placed in the gap between the capacitor element 12 and the inner peripheral surface of the case 16 and in the through hole 34 of the capacitor element 12. After filling, the liquid encapsulant material is cured, whereby the encapsulant 14 is formed and the desired capacitor 10 is obtained.

  As is clear from the above description, in this embodiment, a through-hole that penetrates the capacitor element 12 in the stacking direction of the plurality of metallized films 22 in the capacitor element 12 having a structure in which the plurality of metallized films 22 are stacked. 34 is provided, and the entire capacitor element 12 including the inside of the through hole 34 is sealed with a sealing material 14 made of synthetic resin. Therefore, the vibration of the capacitor 10 caused by the vibration of the capacitor element 12 can be advantageously suppressed.

  That is, in the capacitor 10 having the above-described structure, when an AC voltage is applied to the capacitor element 12 via the bus bars 32 and 32, the metal vapor deposition films 20 and 20 are applied to the metal deposition films 20 and 20 by Coulomb force (electrostatic force). The sandwiched resin film 18 is repeatedly contracted at a constant cycle in the stacking direction (thickness direction), and the capacitor element 12 vibrates. Then, when such vibration of the capacitor element 12 is transmitted, the outer surface of the capacitor 10 (here, the case 16) vibrates, and sound noise (vibration sound) is recognized. Note that the frequency of such vibration noise is substantially the same as the frequency of the AC voltage applied to the capacitor 10 (capacitor element 12), and the frequency of the applied AC voltage is in the human audible frequency range. In the case of the corresponding range of approximately 5 to 15 kHz, the vibration sound generated in the capacitor 10 is remarkably recognized. On the other hand, the magnitude of such vibration sound is determined by the amplitude of the outer surface of the capacitor 10 and is related to the contraction amount of the entire capacitor element 12 including the plurality of resin films 18.

  Here, in the present embodiment, since the sealing material 14 is filled up to the inside of the through hole 34 provided in the capacitor element 12, the rigidity of the sealing material 14 is advantageously increased as a whole. -ing Thereby, the vibration of the sealing material 14 itself can be suppressed, and the vibration of the capacitor element 12 caused by the contraction and the return of each resin film 18 by applying a voltage is the sealing material 14. In other words, transmission to the outside through the case 16 is suppressed, and thus vibration noise of the capacitor 10 due to vibration of the capacitor element 12 is advantageously suppressed. .

  Further, in the capacitor 10, the capacitor element 12 including the inside of the through hole 34 is sealed with the sealing material 14, so that the rigidity of the capacitor 10 including the capacitor element 12 and the sealing material 14 is increased. It will be advantageously increased. In particular, since the inside of the through hole 34 is sealed with the sealing material 14, the rigidity of the capacitor 10 is effectively enhanced, thereby suppressing the vibration of the capacitor 10. Thus, the generation of vibration noise in the capacitor 10 can be advantageously suppressed.

  Furthermore, in the capacitor element 12, the through hole 34 has a circular hole shape and is formed at the central portion of the capacitor element 12 as viewed from the stacking direction of the plurality of metallized films 22. Thereby, in the capacitor element 12, the rigidity of the central portion of the capacitor element 12 that is long in distance from the edge portion where the metallicon electrodes 28 and 28 and the resin protective films 30 and 30 are formed, and the amplitude tends to be relatively large. However, it can be effectively increased.

  In addition, such a through hole 34 preferably has a circular shape, the diameter thereof is in the range of 1 to 5 mm, and the area occupied by the through hole 34 in each metallized film 22 is that of the metallized film 22. It is formed so as to be in the range of 1 to 10% of the area (product of length: Lf and width: Wf). When the diameter of the through hole 34 is smaller than 1 mm or the area occupied by the through hole 34 is smaller than 1%, the rigidity of the sealing material 14 or the capacitor 10 cannot be sufficiently increased, and vibration noise is suppressed. There is a risk that the effect cannot be obtained sufficiently. On the other hand, when the diameter of the through hole 34 is larger than 5 mm or the area occupied by the through hole 34 exceeds 10%, the yield of the metallized film 22 deteriorates (the effective area decreases), and the electrostatic capacity of the capacitor 10 is reduced. There is a problem that the capacity is insufficient or the capacitor 10 needs to be enlarged.

  Further, the capacitor element 12 has a structure in which a plurality of metallized films 22 are laminated as described above. For example, a metallized film is wound and pressed as is conventionally known. In contrast to the so-called wound film capacitor element, variation in the load applied to the resin film inside the capacitor element, that is, the resin film is less likely to become dense or dense. Therefore, the characteristic that there is little variation in the vibration sound generated by the application of the AC voltage is exhibited.

  Further, the capacitor 10 includes a single capacitor element 12, and, as in the prior art, in order to suppress the vibration noise of the capacitor, the capacitor element is divided into a plurality of parts or between the plurality of capacitor elements. There is no need to provide a gap in the capacitor, and it is not necessary to cover the capacitor element with an elastic member or the like. Therefore, the capacitor 10 is advantageously downsized and can be manufactured at low cost. There is.

  Here, since the capacitor element 12 has a thickness Tc smaller than the length Lf and the width Wf of the metallized film 22, the capacitor element 12 and thus the capacitor 10 is advantageously thinned. ing. In short, since the vibration of the capacitor element 12 is suppressed by the formation of the through hole 34, the length of the metallized film 22: Lf and the width: Wf can be increased to increase the area thereof. Thus, it is possible to reduce the thickness Tc of the capacitor element 12 while ensuring the performance (capacitance, etc.) required in (1). In order to advantageously realize the thinning of the capacitor 10, the ratio of the thickness: Tc of the capacitor element 12 to the length: Lf and the width: Wf of the metallized film 22 is 1/4 or less. It is preferred that

  Further, in the capacitor 10, since a capacitor element 12 is configured by superimposing a plurality of metallized films 22 each having a metal vapor deposition film 20 formed on a resin film 18, a conventionally used metal is used. The laminated film capacitor element 12 (laminated film capacitor 10) can be easily manufactured using the fluorinated film 22. Here, since the vibration of each of the plurality of resin films 18 constituting each metallized film 22 is suppressed, the vibration suppressing effect of the capacitor element 12 as described above is advantageously enjoyed.

  Further, here, the capacitor element 12 is accommodated in the case 16, and the gap between the capacitor element 12 and the case 16 and the inside of the through hole 34 are filled with the sealing material 14, so that the through hole is formed. The entire capacitor element 12 including the inside of 34 is accommodated in the case 16 in a state of being sealed by the sealing material 14. Thereby, the rigidity of the capacitor 10 is advantageously improved by the synergistic effect of the sealing material 14 and the case 16, and vibration noise is suppressed.

  In particular, in the capacitor 10, the sealing material 14 filled in the through hole 34 of the capacitor element 12 is laminated in the case 16, in other words, in the thickness direction of the capacitor element 12. The rigidity of the capacitor 10 is increased more advantageously because the capacitor 10 is disposed so as to be bridged between the pair of side walls 16a, 16a facing each other. In addition, since the side walls 16a and 16a are the wall surfaces having the largest area in the case 16, in other words, the wall surfaces having the largest amplitude (vibration noise), the vibration noise suppression effect by improving the rigidity is achieved. It will be enjoyed even more advantageously.

  The exemplary embodiments of the present invention have been described in detail above. However, the embodiments are merely examples, and the present invention is limited in any way by specific descriptions according to such embodiments. It should be understood that it is not interpreted. In the aspect shown below, parts having the same structure as in the previous embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  For example, a plurality of (here, five) through holes 34 may be formed in the film capacitor element 12 as in a laminated film capacitor 36 shown in FIG. Further, the shape of the through hole 34 is not limited to a circular hole shape as illustrated, and may be a rectangular hole shape or a polygonal hole shape. The shape, size, and number of such through holes 34 are appropriately determined according to the intended vibration suppressing effect and the performance of the multilayer film capacitor.

  Further, in the multilayer film capacitor according to the present invention, the case 16 is not necessarily required. For example, if the required performance (humidity resistance, rigidity, strength, durability, etc.) is ensured according to the usage environment of the multilayer film capacitor, as shown in FIGS. The film capacitor element 12 can be used as the laminated film capacitor 38 in a state where the film capacitor element 12 is sealed with the sealing material 14. The protective film 26 and the resin protective film 30 are also provided for the purpose of protecting the film capacitor element, and are not essential components.

  Furthermore, instead of the metallized film 22 used in the above-described embodiment, a plurality of metal vapor deposition films 20 and a plurality of vapor deposition polymer films 40 as dielectric films are formed on the resin film 18 as shown in FIG. It is also possible to use a laminated film 42 that is alternately laminated. In addition, although the formation material of the vapor deposition polymer film which comprises such a laminated film 42 is not specifically limited, For example, a polyurea resin film, a polyamide resin film, a polyimide resin film, a polyamide-imide resin film, polyester Examples of the resin film, polyazomethine resin film, polyurethane resin film, acrylic resin film, and the like include known resin films that can be formed by a vacuum deposition polymerization method.

  In addition, the production of the multilayer film capacitor according to the present invention is not limited to the above-described embodiment. For example, the metallicon electrode may be formed after the through-hole is formed in the film capacitor element. Further, a plurality of predetermined unit capacitor elements (unit elements) formed by laminating several metallized films are used, through holes are formed in each of the unit elements, and the unit elements are connected to the through holes. A film capacitor element can also be formed by superimposing them in a damped state. In such an embodiment, by adjusting the number of unit elements, a multilayer film capacitor having desired performance (capacitance, etc.) can be advantageously produced. When a plurality of unit elements are overlapped, workability can be improved by passing each through hole through a guide pin.

  In addition, although not listed one by one, the present invention can be carried out in an embodiment to which various changes, modifications, improvements and the like are added based on the knowledge of those skilled in the art. It goes without saying that any one of them falls within the scope of the present invention without departing from the spirit of the present invention.

  Examples of the present invention will be shown below to clarify the present invention more specifically. However, the present invention is not limited by the description of such examples. Needless to say.

-Example-
First, an aluminum vapor deposition film (metal vapor deposition film) having a predetermined thickness is formed on a long resin film made of a stretched polypropylene film having a thickness of 2.5 μm and a width of 25 mm (corresponding to the width of the metallized film: corresponding to Wf). A long metallized film formed was prepared. Using such a long metallized film, a plurality of resin films and a plurality of metal vapor deposition films are laminated alternately by a known method, and metal vapor deposition located at one end in the lamination direction A long capacitor element base material in which a protective film was disposed on the film was obtained. The thickness of the capacitor element base material was 13 mm (capacitor element thickness: corresponding to Tc).

  Next, the obtained capacitor element base material was cut to a length of 25 mm (corresponding to the length of the metallized film: corresponding to Lf), and zinc was sprayed on both sides in the width direction of the metallized film to form a pair of metallicons. While forming an electrode, the resin protective film was formed in the surface of the both sides of the length direction of a metallized film, respectively, and the capacitor | condenser element was obtained.

  Then, a 3 mm diameter circular hole penetrating the capacitor element in the metallized film laminating direction is machined using a hole saw in the central part of the obtained capacitor element viewed from the metallized film laminating direction. A hole was formed. In addition, a bus bar as an external connection terminal was connected to each of the pair of metallicon electrodes of the capacitor element, and a predetermined voltage process was performed on the capacitor element via these bus bars.

  Further, such a capacitor element is housed in a predetermined position of a PPS case, and the case is filled with an epoxy resin and cured, so that the entire capacitor element including the inside of the through hole is sealed with the epoxy resin. Then, a laminated film capacitor was produced. Here, three laminated film capacitors having such a configuration were produced.

-Comparative example-
Three laminated film capacitors were produced in the same manner as in the above example except that no through hole was formed in the capacitor element.

  The noise level of the vibration sound generated in the multilayer film capacitor obtained as described above was measured according to the following method.

-Measurement of noise level of multilayer film capacitor-
For each of the multilayer film capacitors according to the examples and comparative examples, a bias voltage of 450 V was applied, a ripple frequency of 12 kHz was applied with a ripple current of 6 A, and the noise level (dB) of the generated vibration sound was It was measured. The noise level was measured at a position 50 mm away from the outer surface of the opposite side wall of the case in the metallized film lamination direction.

  As described above, the noise level of each multilayer film capacitor was measured, and as a result, the average of the measured values of the noise level in the plurality of multilayer film capacitors according to the example was 67 dB. The average of the measured noise levels in the plurality of laminated film capacitors was 71 dB. As is apparent from the results, in the multilayer film capacitor having the structure according to the present invention, it is recognized that the noise level of the generated vibration noise is reduced.

10, 36, 38 Multilayer film capacitor 12 Capacitor element 14 Sealing material 16 Case 16a Side wall 18 Resin film 20 Metal vapor deposition film 22 Metallized film 28 Metallicon electrode 32 Bus bar 34 Through-hole 40 Deposition polymer film 42 Multilayer film

Claims (3)

A multilayer film obtained by using a film capacitor element having a structure in which a plurality of dielectric films and a plurality of metal vapor deposition films are laminated such that the dielectric films and metal vapor deposition films are alternately positioned. A capacitor,
The film capacitor element is provided with a through-hole penetrating the film capacitor element in the stacking direction of the dielectric film and the metal vapor-deposited film, and the film capacitor element including the inside of the through-hole is made of a synthetic resin. A laminated film capacitor, which is sealed with a sealing material.   2. The multilayer according to claim 1, wherein the dielectric film is made of a resin film, and the film capacitor element is configured by superimposing a plurality of metallized films formed by forming the metal vapor deposition film on the resin film. Type film capacitor. The film capacitor element is accommodated in a casing-like case, and the sealing material is filled in the gap between the film capacitor element and the case and the inside of the through hole. The multilayer film capacitor according to claim 1 or 2, wherein the film capacitor element including the inside is accommodated in the case in a state of being sealed by the sealing material.

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