JP2016166120A - Processing method of laminated substrate, and processing device of laminated substrate by laser beam - Google Patents

Abstract

PROBLEM TO BE SOLVED: To process a brittle material substrate and a resin layer constituting a laminated substrate, simultaneously in a high quality.SOLUTION: A processing method includes a first step and a second step. In the first step, a laminated substrate G comprising a glass substrate 11, and a resin layer 12 formed on the surface of the glass substrate 11 is prepared. In the second step, a laser beam having a prescribed wavelength is condensed onto the glass substrate 11 to irradiate the laminated substrate G, and thereby a laser beam irradiation part of the resin layer 12 is modified, to thereby lower brittle fracture strength more than that of its periphery, and simultaneously generates a crack on the glass substrate 11.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a method for processing a laminated substrate, and more particularly to a method for processing a laminated substrate in which a resin layer is laminated on the surface of a brittle material substrate. The present invention also relates to an apparatus for processing a laminated substrate using a laser beam.

  In a thin film solar cell, a liquid crystal display device, or the like, a resin layer as a protective film may be provided on a glass substrate. Such a substrate is divided into a plurality of unit substrates from one large mother substrate.

  Patent Document 1 discloses such a method for dividing a laminated substrate. In the method disclosed in Patent Document 1, a protective resin layer formed on the surface of a glass substrate is irradiated with laser light along a planned dividing line. By this laser light irradiation, a part of the resin layer is removed, and a part of the glass substrate is exposed. Moreover, the initial crack is formed in the glass substrate before processing, and thereafter, the glass substrate is irradiated with a laser beam and cooled by a water jet, whereby the crack is developed and divided.

Japanese National Patent Publication No. 10-506087

  In the method of Patent Document 1, a part of the resin layer formed on the glass substrate surface is evaporated and removed by laser light irradiation. At this time, the removed resin may scatter and adhere as foreign matter on the substrate, or the surface of the resin layer may oxidize, resulting in a problem that scribing cannot be performed in a later step. In addition, there are problems such as discolored portions around the processed portion, increasing the processing width, and requiring a high-power laser. Moreover, in the method of patent document 1, it is necessary to form an initial crack in a glass substrate before the process by a laser beam.

  An object of the present invention is to enable a brittle material substrate and a resin layer constituting a laminated substrate to be processed simultaneously with high quality.

A method for processing a laminated substrate according to one aspect of the present invention includes the following steps.
1st process: The laminated substrate which consists of a brittle material board | substrate and the resin layer formed in the surface of a brittle material board | substrate is prepared.
Second step: irradiating the laminated substrate with laser light of a predetermined wavelength so as to be focused on the brittle material substrate, modifying the laser light irradiated portion of the resin layer to lower the brittle fracture strength than that of the surroundings At the same time, the brittle material substrate is cracked.

  In this method, laser light having a predetermined wavelength is irradiated onto a laminated substrate in which a resin layer is formed on the surface of a brittle material substrate. By this laser light irradiation, the resin layer irradiated with the laser light and the brittle material substrate are processed simultaneously. In particular, the portion of the resin layer irradiated with the laser light is modified without removing the resin layer. By this modification, the brittle fracture strength of the laser light irradiated portion of the resin layer becomes lower than that of the surrounding portion. For this reason, a laminated substrate can be processed with high quality and a short processing time.

  In such a method, the resin layer and the brittle material substrate are divided by a subsequent dividing step without removing the resin layer of the planned dividing line, for example, by irradiating laser light along the scheduled dividing line of the laminated substrate. can do. Therefore, it is possible to suppress the deterioration of the processing quality due to the scattering of the resin layer and perform the processing with a low output laser beam.

  In the method for processing a laminated substrate according to another aspect of the present invention, in the second step, the volume of the laser light irradiated portion is expanded or discolored to perform modification.

  In the method for processing a laminated substrate according to still another aspect of the present invention, in the second step, the laser beam irradiated portion is cracked to perform modification.

  In the multilayer substrate processing method according to still another aspect of the present invention, laser light having a wavelength of 515 to 1080 nm is irradiated in the first step.

  In the multilayer substrate processing method according to still another aspect of the present invention, in the first step, a pulse laser beam having a pulse width of 50 psec to 15 nsec is irradiated.

  In the method for processing a laminated substrate according to still another aspect of the present invention, in the second step, pulsed laser light having a condensing lens NA of 0.17 psec to 0.7 nsec is irradiated.

  In the method for processing a laminated substrate according to still another aspect of the present invention, a dividing line is set on the laminated substrate. The second step further includes a third step of irradiating the laser beam along the planned division line of the resin layer to divide the brittle material substrate and the resin layer along the planned division line.

  In the method for processing a laminated substrate according to still another aspect of the present invention, a dividing line is set on the laminated substrate. The second step further includes a third step of irradiating the laser beam along the planned dividing line and dividing the brittle material substrate and the resin layer along the planned dividing line.

  An apparatus for processing a laminated substrate with a laser beam according to one aspect of the present invention is an apparatus for processing a laminated substrate in which a resin layer is laminated on the surface of a brittle material substrate, and includes a supporting unit, a laser beam irradiating unit, It is equipped with. The support means supports the laminated substrate. The laser beam irradiation means irradiates the laminated substrate with a laser beam having a predetermined wavelength so as to be focused on the brittle material substrate, and modifies the laser beam irradiated portion of the resin layer so that the brittle fracture strength is higher than that of the surroundings. As well as causing cracks in the brittle material substrate.

  In the present invention as described above, the brittle material substrate and the resin layer constituting the laminated substrate can be simultaneously processed with high processing quality.

FIG. 3 is a partial cross-sectional view of a multilayer substrate as a processing target. Sectional drawing of the laminated substrate for demonstrating the 2nd process of a processing method. The schematic block diagram of the processing apparatus by one Embodiment of this invention.

[Processing target]
FIG. 1 shows a cross section of a laminated substrate cut by a method according to an embodiment of the present invention. The laminated substrate G is formed by laminating a polyester film (hereinafter simply referred to as “resin layer”) 12 as a protective layer on the surface of a glass substrate 11 such as tempered glass. In addition, here, the laminated substrate G is a single large mother substrate, and a division line is set in the mother substrate, for example, in the X and Y directions. Then, the mother substrate is divided into a plurality of unit substrates along the division line.

  FIG. 1 is a schematic diagram, and the thickness and the like of the glass substrate 11 and the resin layer 12 are schematically shown. Moreover, the dashed-dotted line d in a figure has shown the position where the division | segmentation scheduled line was set.

[Processing (partitioning) method]
When the laminated substrate G is divided, first, laser light is irradiated from the side on which the resin layer 12 is formed along the division line d. Hereinafter, an example of modifying the resin layer 12 will be described.

  In this case, as a condition of the laser beam to be irradiated, as shown in FIG. 2, in the resin layer 12, the region R irradiated with the laser beam L is modified, and at the same time, the inside of the glass substrate 11 or the surface The laser beam is such that a crack C is generated from the inside to the inside.

Here, “modification” means that the region R of the resin layer 12 irradiated with the laser light undergoes the following physical changes, and the brittle fracture strength is further reduced as compared with the surrounding portion. means.
・ The volume of the part irradiated with laser light expands. ・ The part irradiated with laser light changes color. ・ The crack occurs in the part irradiated with laser light.

  Due to the modification as described above, the portion irradiated with the laser light becomes brittle compared to other portions.

  As described above, both sides of the planned dividing line are pressed against the laminated substrate G in which the modified region R and the crack C are formed. Thereby, the glass substrate 11 and the resin layer 12 can be divided | segmented simultaneously.

[Example 1]
In the case of performing the above processing, it is preferable to use a laser beam having the following specifications as the laser beam to be irradiated.
Wavelength: 532nm
Laser output: 1.0W
Scanning speed: 500mm / s
Condensing diameter: φ5μm
Pulse width: 0.5nsec
In addition to the specification of the first embodiment, the laser light may be processed under the following conditions.
Wavelength: 515-1080nm
Pulse width: 50 psec to 15 nsec
NA of condenser lens: 0.17 psec to 0.7 nsec

[Processing equipment]
FIG. 4 shows a schematic configuration of a processing apparatus for performing the above processing method. The processing device 25 includes a laser beam oscillation unit 26 including a laser beam oscillator 26 a and a laser control unit 26 b, a transmission optical system 27 including a plurality of mirrors for guiding laser light in a predetermined direction, and a transmission optical system 27. And a condensing lens 28 for condensing the laser beam. From the laser beam oscillation unit 26, pulsed laser light whose irradiation conditions such as beam intensity are controlled is emitted. The laser beam oscillating unit 26, the transmission optical system 27, and the condensing lens 28 constitute a laser beam irradiation unit that irradiates the laminated substrate with laser beams.

  For example, the absorptance of the resin layer of the multilayer substrate can be changed by using an oscillator having a mechanism for switching the frequency and pulse width of the oscillating laser light as the laser beam oscillator 26a. The wavelength of the laser beam is not particularly limited as long as it is absorbed by the resin layer. For example, a laser beam having a wavelength of 1030 to 1080 nm (fundamental wave), a double wave of the fundamental wave, and 600 to 980 nm can be used. .

  The laminated substrate G is placed on the table 29. The table 29 is driven and controlled by the drive control unit 30 and can move in a horizontal plane. That is, the laminated substrate G placed on the table 29 and the laser beam irradiated from the condenser lens 28 can be relatively moved in a horizontal plane. Further, the laser beam and the table 29 on which the laminated substrate G is placed can move relatively in the vertical direction. The laser control unit 26 b and the drive control unit 30 are controlled by the processing control unit 21.

  The processing control unit 31 is configured by a microcomputer, and controls the laser control unit 26b and the drive control unit 30 to execute the processing as described above.

[Other Embodiments]
The present invention is not limited to the above-described embodiments, and various changes or modifications can be made without departing from the scope of the present invention.

  (A) In the embodiment described above, a laminated substrate in which a resin layer is formed on the surface of a glass substrate has been described as an example. However, the present invention is similarly applied to a laminated substrate in which a resin layer is formed on the surface of a brittle material substrate. Can be applied to. Specifically, the material of the brittle material substrate can be silicon, alumina ceramic, LTCC, aluminum nitride, or silicon nitride, and the material of the resin layer can be silicone, epoxy, or solder resist. The resin layer may be a multilayer film in which a plurality of resin layers are stacked. Note that the wavelength of the laser to be used is not limited to the above-described wavelength range, and may be appropriately selected according to the material of the brittle material substrate and the resin layer.

  (B) In the above embodiment, the laser light is irradiated onto the resin layer from the side of the laminated substrate on which the resin layer is formed. However, under the laser irradiation conditions that pass through the brittle material substrate and are absorbed by the resin layer. If present, the resin layer may be irradiated with laser light from the brittle material substrate side.

  (C) In the above embodiment, the present invention is applied when the laminated substrate is divided. However, the present invention can be similarly applied to other processing.

11 Glass substrate 12 Polyester film (resin layer)
G Multilayer substrate

Claims (8)

A first step of preparing a laminated substrate comprising a brittle material substrate and a resin layer formed on the surface of the brittle material substrate;
The laminated substrate is irradiated with a laser beam having a predetermined wavelength so as to be focused on the brittle material substrate, and the laser beam irradiated portion of the resin layer is modified to lower the brittle fracture strength than that of the surroundings. At the same time, a second step of causing a crack in the brittle material substrate,
A method for processing a laminated substrate including:   The method for processing a laminated substrate according to claim 1, wherein in the second step, the modification is performed by expanding or changing a volume of a laser light irradiation portion of the resin layer.   2. The method for processing a laminated substrate according to claim 1, wherein in the second step, the laser beam irradiation portion of the resin layer is cracked to perform modification.   4. The method for processing a laminated substrate according to claim 1, wherein in the second step, laser light having a wavelength of 515 to 1080 nm is irradiated. 5.   5. The method for processing a laminated substrate according to claim 1, wherein in the second step, a pulse laser beam having a pulse width of 50 psec to 15 nsec is irradiated.   6. The method for processing a laminated substrate according to claim 1, wherein in the second step, pulse laser light having a NA of 0.17 psec to 0.7 nsec is applied to the condenser lens. A line to be divided is set in the laminated substrate,
In the second step, a laser beam is irradiated along the dividing line.
Further includes a third step of dividing the brittle material substrate and the resin layer along a line to be divided.
The processing method of the laminated substrate in any one of Claim 1 to 6. An apparatus for processing a laminated substrate in which a resin layer is laminated on the surface of a brittle material substrate,
Support means for supporting the laminated substrate;
The laminated substrate is irradiated with a laser beam having a predetermined wavelength so as to be focused on the brittle material substrate, and the laser beam irradiated portion of the resin layer is modified to lower the brittle fracture strength than that of the surroundings. And a laser beam irradiation means for generating a crack in the brittle material substrate,
A laminated substrate processing apparatus using a laser beam.

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