JP2016162735A - Lighting device and heat sink - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a luminaire which is light, which has good heat radiation properties, which can emit light of a large luminous flux and which can improve insulation pressure-resistant performance, in the luminaire using a semiconductor light-emitting device.SOLUTION: A luminaire includes a semiconductor light-emitting device, a housing, and a heat sink for constituting at least one part of the housing. The heat sink includes a bottom part in which the semiconductor light-emitting device is installed, and a plurality of heat radiation fins, and also it is an integral molding body of a metal skeleton and heat conductive resin. The metal skeleton has a metal skeleton of the bottom part and a metal skeleton of the heat radiation fin connected to the metal skeleton of the bottom part. The metal skeleton of the bottom part is directly connected to the semiconductor light-emitting device.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a lighting device including a semiconductor light emitting device, and a heat sink used in the lighting device.

Various lighting devices using semiconductor light emitting devices such as LEDs (Light-emitting Diodes) having high efficiency and long life have been developed instead of general lamps such as halogen light bulbs. When the LED is heated to a high temperature due to heat generated from the LED, there is a problem that the light emission efficiency is lowered, the light output of the lighting device is lowered, and the life of the LED is shortened. Therefore, in this kind of illuminating device, what is equipped with the heat sink which thermally radiates the heat which generate | occur | produces from LED is known (refer patent documents 1-3).

International Publication No. 2014/119169 Pamphlet JP 2014-67728 A Japanese Patent No. 5276239

  By the way, a standard standard (for example, C7527-JIS-6320-2) that defines the maximum outer diameter dimension, the overall length dimension, and the like of a general lamp such as a halogen bulb has been established. Therefore, even when the halogen light bulb is replaced with an LED lighting device, it is necessary to adapt the maximum outer diameter size, the overall length size, and the like of the LED lighting device to existing standards, and it is difficult to provide a large heat sink. For this reason, when replacing a halogen light bulb with an LED lighting device, the heat generated from the LED cannot be sufficiently dissipated, and the LED becomes high temperature. As a result, the luminous efficiency may be reduced.

  Therefore, efficient heat dissipation has been attempted using various heat sinks. However, since the heat sink usually uses a metal such as aluminum, and the weight of the LED lighting device is increased, the safety of the LED lighting device is increased. There is a risk that the performance and ease of handling may be impaired. On the other hand, when a light-weight resin heat sink is used, there is a problem that heat radiation is not sufficient and light of a sufficient luminous flux cannot be emitted from the LED lighting device, or the life of the semiconductor light-emitting device is shortened. .

  In addition, in a conventional lighting device such as a light bulb, the casing is made of a highly conductive metal, and therefore, when a high voltage is applied to the outer surface of the casing during a dielectric strength test, the entire casing is the same. High potential. For this reason, if there is a close location between the housing and the circuit system (consisting of a base, a circuit unit, and a semiconductor light emitting device), the electric field strength there may be increased and dielectric breakdown may occur.

  The present invention has been made in view of the above problems, and in a lighting device using a semiconductor light emitting device, it is lightweight, has good heat dissipation, can emit a large luminous flux, has a long life, and further has an insulating property. Provided is a lighting device capable of improving pressure resistance.

In order to solve the above problems, the gist of the present invention is as follows.
[1] A semiconductor light emitting device, a housing, and a heat sink that constitutes at least a part of the housing, the heat sink includes a bottom portion on which the semiconductor light emitting device is installed, and a plurality of heat radiation fins; , A metal skeleton and a thermally conductive resin, wherein the metal skeleton includes the bottom metal skeleton and the metal skeleton of the radiating fin connected to the bottom metal skeleton. The skeleton is directly connected to the semiconductor light emitting device, and the radiating fin is a plate-like structure extending radially from the edge of the bottom.
[2] The semiconductor light emitting device installation surface at the bottom is not covered with a heat conductive resin, and the opposite surface of the semiconductor light emitting device installation surface is covered with a heat conductive resin. The lighting device described in 1.
[3] The lighting device according to [1] or [2], wherein the metal skeleton of the heat radiating fin forms a core of the heat radiating fin, and both surfaces thereof are covered with the heat conductive resin.
[4] The lighting device according to any one of [1] to [3], wherein the metal used for the metal skeleton is a metal selected from the group consisting of aluminum, magnesium, an aluminum alloy, and a magnesium alloy.
[5] The lighting device according to any one of [1] to [4], wherein the thermally conductive resin is a polycarbonate resin or a polybutylene terephthalate resin.
[6] The heat sink includes the concave portion including the bottom portion and an outer cylindrical portion that rises from the edge portion of the bottom portion toward the opening, and the radiating fin is provided on an outer peripheral surface of the outer cylindrical portion. The lighting device according to any one of [1] to [5], which is a plate-like structure that is connected and extends radially.
[7] The illumination device according to any one of [1] to [6], further including a lens module positioned in front of the semiconductor light emitting device.
[8] The lighting device according to any one of [1] to [7], wherein a driver housing is provided so as to be positioned behind the heat sink.
[9] The lighting device according to any one of [1] to [8], wherein the casing has a structure in which a cross-sectional area decreases as it goes toward a base provided at the rear.
[10] The illumination device according to any one of [1] to [9], wherein the value of the emitted light beam per mass of the illumination device is 3.5 lumen / g or more.
[11] The maximum diameter of the heat sink is 90 mm or more and 300 mm or less [1] to [1
0]. The illuminating device in any one of 0.
[12] The illumination device according to any one of [1] to [11], in which a thickness of the radiation fin is 5.0 mm or more and 20 mm or less.
[13] The lighting device according to any one of [1] to [12], wherein the heat dissipating fin has a flat plate shape or a curved surface shape.
[14] Furthermore, the bridge | crosslinking part which connects the front-end | tip parts of the said radiation fin is provided [1]-[1
[3] The illumination device according to any one of [3].
[15] A bottom part for installing the semiconductor light emitting device and a plurality of heat dissipating fins, and an integrally formed body of a metal skeleton and a heat conductive resin, wherein the metal skeleton includes the bottom metal skeleton and the bottom metal. A metal skeleton of the radiating fin connected to the skeleton, the metal skeleton of the bottom portion can be directly connected to the semiconductor light emitting device, and the radiating fin has a plate-like shape extending radially from the edge of the bottom portion A heat sink for an LED lighting device as a structure.

  In the lighting device using the semiconductor light-emitting device of the present invention, a specific heat sink integrally formed with a metal skeleton and a resin is provided with a housing that constitutes a part, so that it is lightweight, has good heat dissipation, and has a large luminous flux. It is possible to provide an illuminating device that can emit a large amount of light, has a long lifetime, and can further improve the withstand voltage performance.

It is a disassembled perspective view of the illuminating device (AR111 type LED lamp) which concerns on embodiment of this invention. It is a perspective view of the illuminating device which concerns on embodiment of this invention. It is side sectional drawing of the illuminating device which concerns on embodiment of this invention. It is front sectional drawing of the heat sink which concerns on embodiment of this invention. It is a perspective view of the metal frame of the heat sink concerning the embodiment of the present invention. It is a front view of the metal frame of the heat sink concerning the embodiment of the present invention. It is a side view of the metal skeleton of the heat sink concerning the embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described in detail based on examples and modifications with reference to the drawings. In addition, this invention is not limited to the content demonstrated below, In the range which does not change the summary, it can change arbitrarily and can implement. In addition, the drawings used for explaining the embodiments and the modified examples both schematically show the lighting device according to the present invention, and are partially emphasized, enlarged, reduced, or omitted to deepen the understanding. In some cases, it does not accurately represent the scale or shape of each component. Furthermore, the various numerical values and quantities used in the embodiments and the modifications are only examples, and can be variously changed as necessary.

(Lighting device)
The illumination device according to the embodiment is an LED lamp provided with a semiconductor light emitting device (LED) as a light source, and its housing conforms to a standard size established by a standard such as JIS (Japanese Industrial Standard). It is configured as follows. Here, with reference to FIG. 1, the example which comprises the illuminating device 1 which concerns on this embodiment as the AR111 type | mold LED lamp 1 which can substitute for the AR111 type | mold halogen light bulb which has an outer diameter of about 111 mm is demonstrated.

FIG. 1 is an exploded perspective view of an AR111 type LED lamp 1 according to the present embodiment. The AR111 type LED lamp 1 includes an LED module (semiconductor light emitting device) 2, an optical lens 3, a housing 4, a base 5 and the like. In the present specification, the side on which the lens 3 is provided is defined as “front” of the lighting device 1 (AR111 type LED lamp 1). The LED module 2 has a semiconductor light-emitting device as a light source and a module substrate on which the semiconductor light-emitting device is mounted, and the semiconductor light-emitting device is disposed at the center of the module substrate. The lens is a one-core type lens (one-core type condensing optical component) 3, and the light emitting surface of the semiconductor light emitting device is disposed on the optical axis (FIG. 3). By arranging in this way, the light emitted from the semiconductor light emitting device 2 can be light with high directivity (narrow light distribution angle).
The illuminating device of the present invention can be reduced in weight while maintaining the luminous flux, and the value of the luminous flux emitted per mass of the illuminating device is usually 3.5 lumen / g or more, preferably 4.0 lumen / g. g or more, more preferably 5.0 lumen / g or more.

(Semiconductor light emitting device)
The semiconductor light emitting device 2 has, for example, a chip-on-board structure in which one or a plurality of near-ultraviolet LED chips are directly mounted on a wiring provided on the mounting surface of the module substrate 14, and is excited by the near-ultraviolet LED chip to emit light. The blue phosphor, the green phosphor, and the red phosphor that are mixed are potted by a translucent resin mixed therein. As the LED chip, not only a near ultraviolet LED chip but also various LED chips such as a blue LED chip can be used, and various phosphors can be selected according to the LED chip to be used. Moreover, what has a GaN (gallium nitride, gallium nitride) board | substrate can be used for the LED chip in this embodiment. Thus, when an LED chip using a GaN substrate is applied, a large current can be input, and a point light source with a large luminous flux can be realized.

The semiconductor light emitting device 2 can adopt a package structure instead of using a chip-on-board structure, and can be applied to various forms. Moreover, the LED light emitting module 2 can also disperse | distribute and arrange | position several semiconductor light-emitting devices on a module board | substrate. Further, a substrate other than the GaN substrate, such as a sapphire substrate or a silicon substrate, may be applied to the LED chip.

  In this case, it is preferable to use a one-core module, which is a single light source that emits light from only one light emitting surface, in which LED chips are centrally arranged at the center of the module substrate. By adopting such a one-core LED light source (semiconductor light emitting device), the entire LED lighting device can be a point light source. In addition, by adopting such a one-core LED light source, multi-shadows can be effectively eliminated or alleviated, and a uniform and stable illumination effect with little light unevenness can be realized.

  As the module substrate for mounting the LED chip, for example, a metal base substrate formed of a metal material such as aluminum having good thermal conductivity or an insulating material is preferably used.

(Optical lens)
The lens module is preferably provided so as to be positioned in front of the semiconductor light emitting device as shown in FIG. 1 as necessary. FIG. 3 is a cross-sectional view showing an outline of the illumination device 1 (excluding the driver housing portion) according to the embodiment of the present invention. FIG. 1 shows a cross section when the optical lens 3 is cut by a plane including the optical axis. The figure is described.

The optical lens 3 has a rotating body shape centered on the optical axis (Z), and has a structure including an incident surface 30, an output surface 33, and a side reflecting surface 34. The above-mentioned rotator shape means that the entire lens is a substantially symmetric rotator shape, and even if a member is added or processed and deformed so as not to affect the light collecting function, the present invention It shall be included in the shape of the rotating body.
The shape of the incident surface 30 of the lens 3 is provided so as to be symmetric with respect to the optical axis of the lens 3, and forms a single concave shape with the opening facing the semiconductor light emitting device (see FIG. 3). ). Further, the incident surface 30 of the lens 3 is opposed to the substantially planar optical axis direction incident surface 32 opposed to the optical axis direction of the semiconductor light emitting device 2 in the lateral direction with respect to the optical axis direction. And a cylindrical side surface incidence surface 31 that rises toward the edge.

For the optical lens having the above structure, one of two types of optical lenses, a one-time reflection type and a two-time reflection type, can be adopted, and the illumination angle is 15 ° or more and 30 ° or less. In general, a single reflection type optical lens is used, and in the case of illumination with a light distribution angle of less than 15 °, it is preferable to use a double reflection type optical lens in order to reduce irradiation unevenness.
In the one-time reflection type optical lens 3 (see FIG. 3), a part of the light emitted upward from the semiconductor light emitting device is introduced into the optical lens from the optical axis direction incident surface 32, and then is emitted from the emission surface 33 to the outside. Exit. Another part of the light emitted upward from the semiconductor light emitting device was introduced into the optical lens from the side direction incident surface 31, and the main light incident from the side direction incident surface was reflected by the side reflecting surface 34. Thereafter, the light is incident on the light exit surface at an angle equal to or smaller than the critical angle of the light exit surface 33 so as to pass through the optical lens light exit surface 33. The optical axis direction entrance surface 32 is preferably a convex lens in order to condense light emitted from the exit surface to the outside after being introduced into the optical lens. Further, the side reflecting surface 34 is preferably a substantially parabolic curved surface in order to collect light from the light source.

In the double reflection type optical lens (not shown), a part of the light emitted upward from the semiconductor light emitting device is introduced into the optical lens from the incident surface in the optical axis direction and then emitted to the outside from the emission surface. Another part of the light emitted upward from the semiconductor light emitting device is introduced into the optical lens from the side surface incident surface, and the main light incident from the side surface incident surface is an angle equal to or greater than the critical angle of the optical lens output surface. When the light is incident on the light exit surface, the light is totally reflected on the light exit surface of the optical lens.

The main light totally reflected by the exit surface is reflected by the side reflection surface, and then is incident on the exit surface at an angle equal to or smaller than the critical angle of the exit surface, thereby being transmitted through the exit surface of the optical lens.
In order to cause the main light incident from the side direction entrance surface to enter the exit surface at an angle greater than the critical angle of the optical lens exit surface, the side direction entrance surface is substantially cylindrical and is a surface perpendicular to the optical axis direction. The maximum diameter of the cut substantially circular cross section is preferably smaller from the opening to the incident surface in the optical axis direction, and preferably has a substantially truncated cone shape with a skirt. The shape of the side incident surface 31 of the lens 3 has a curved surface that is convex in the optical axis direction (the lens is convex in the light incident direction) in a cross section when the lens 3 is cut by a plane including the optical axis. The shape is preferred.
The side reflection surface can have a structure in which a reflection film is formed on the side surface of the optical lens, or can have a structure in which a metal or ceramic reflector is in close contact with the side surface of the optical lens.

  The material of the lens 3 is not particularly limited as long as the object of the present invention can be achieved, but plastic can be suitably used. Specifically, acrylic resins such as polymethyl methacrylate resin, thermoplastic plastics such as cyclic polyolefin and polycarbonate, photocurable plastics, UV curable plastics, and the like can be used. Among these, from the viewpoint of reducing the production cost, thermoplastics such as acrylic, cyclic polyolefin, and polycarbonate that can be produced by injection molding can be suitably used, and among them, polycarbonate is flame retardant. Is particularly preferred.

  The optical lens 3 can have a one-core type lens and a lens holder to which this lens can be attached. The one-core lens is a lens that has only one optical axis and gives a predetermined light distribution angle to emitted light. The one-core lens is formed of, for example, an acrylic resin or a polycarbonate resin, and has, for example, a substantially truncated cone shape as a whole, and has an emission surface 33 that emits light emitted from the semiconductor light emitting device 2. . In the one-core lens, when the side on which the emission surface 33 is formed is defined as a “front part”, a concave incident surface 30 for accommodating the LED is formed in the rear part of the one-core lens.

  The optical lens 3 can have a pair of projecting arm portions that project downward from the periphery of the lens. A hook-shaped connecting claw is formed at the tip of the protruding arm portion. Thereby, an optical lens can be fixed to the heat sink 41 site | part of an illuminating device. As shown in FIG. 3, the protruding collar portion is directly connected to the optical lens and integrated, thereby reducing the number of parts and simplifying the manufacturing process.

(Casing)
The housing has a structure in which a cross-sectional area becomes smaller toward a base provided at the rear.
The housing 4 is a housing (housing) of the AR111 type LED lamp 1, and houses the LED module 2, a lens, and the like. The housing 4 has at least a part of a heat sink that dissipates heat generated by the semiconductor light emitting device 2. Specifically, the housing 4 includes a heat sink 42 that dissipates heat generated by the semiconductor light emitting device 2, and a power supply circuit unit that supplies driving power to the semiconductor light emitting device 2 in the LED module from a power source (not shown). And a driver housing 42 for housing the housing.

(Driver housing)
The driver housing 42 can be provided behind the heat sink (opposite side of the light emitting device installation surface) or around or on the side of the light emitting device in front of the heat sink. However, in FIGS. 1 and 2, the driver housing 42 is positioned behind the heat sink. Is provided. As the material of the driver housing 42, various resins, inorganic materials such as ceramics, and metals such as aluminum can be applied. The driver housing 42 may be configured by using these materials together. In the present embodiment, PBT (polybutylene telephthalate) is used for the driver housing 42, but the present invention is not limited to this. Further, the material of the driver housing 42 is preferably a resin-based material having no conductivity. The driver housing 42 includes a circuit unit housing part for housing a circuit unit (not shown), a base connecting part for fixing the base 5, a base circuit terminal 6 for supplying power into the circuit unit storage part, and external power Is provided with a drive circuit (not shown) for converting and supplying the voltage and current required for the semiconductor light emitting device 2. The circuit unit housing portion has a set of fixing portions to which a fastener such as a screw can be screwed.

  A pair of insertion holes is arranged in the thickness direction of the base connecting portion of the driver housing 42. The insertion hole is provided with a conductive member for electrically connecting the base 5 installed on the lower outer side of the driver housing 42 and the base circuit terminal 6 disposed in the circuit unit housing portion. This conductive material member has a function of locking the base 5 and the base circuit terminal 6 by a method such as screwing or caulking. The base circuit terminal 6 is electrically connected to the power input portion of the drive circuit. The drive circuit is locked at a predetermined position by either or both of the base circuit terminal 6 and the fastening portion provided in the fixing portion. Note that the cap pin protruding to the outside through the insertion hole can be inserted and connected to a socket (not shown). Thereby, electric power can be supplied to the circuit unit from an external power supply.

(heatsink)
FIG. 2 is a perspective view of the lighting device 1 according to the present embodiment, and FIG. 3 is a side sectional view of the lighting device 1 according to the present embodiment taken along line XX in FIG. FIG. 4 is a front cross-sectional view of the illumination device 1 taken along line YY in FIG. The heat sink 41 is a housing member that constitutes the housing 4 together with the driver housing 42. The heat sink 41 is also a heat radiating member for radiating the heat generated by the semiconductor light emitting device 2 as described above.
The heat sink 41 includes a bottom portion on which the semiconductor light emitting device 2 is installed and a plurality of heat radiation fins 415. The bottom of the heat sink 41 has a substantially circular planar shape. Moreover, a concave-shaped part is formed by the bottom part of the heat sink 41 and the outer cylinder part 43 rising from the edge part of the bottom part toward the opening part.

  Moreover, the heat sink 41 has a plurality of heat radiation fins 415 arranged radially at the bottom edge. Each radiating fin has a plate shape, and by increasing the surface area of the heat sink 41, it is possible to promote the radiating of the heat transmitted from the semiconductor light emitting device 2 to the bottom. Each heat radiating fin extends radially outward (in other words, outward of the edge of the bottom) (see FIGS. 1, 2, 3, and 4). In addition, the radiating fins are radially arranged at regular intervals with respect to the center of the installation portion in the heat sink 41. Moreover, the front-end | tip parts of the outermost periphery of each radiation fin are mutually connected by the cyclic | annular bridge | crosslinking part (annular part).

Moreover, the bottom part and the radiation fin which comprise a heat sink are the integrally molded bodies of a metal frame | skeleton and heat conductive resin. Integrated molding does not use secondary bonding or mechanical bonding, and the product is integrally molded at the same time as the joining of the members. Therefore, it is possible to provide a strong, lightweight heat sink with good adhesion, good thermal conductivity. it can. A heat sink, which is an integrally molded body of a metal skeleton and a heat conductive resin, can be further designed with a high degree of design and a high degree of freedom in shape and color. There are two types of molding of metal and resin: outsert molding and insert molding. Outsert molding is a method of surrounding a metal with a resin. For example, a resin can be molded around a metal pipe or a metal rod. Various resins can be molded from general resins to rubbers (elastomers). Insert molding is a method of embedding metal parts in resin. For example, if you want to increase the strength by embedding threaded metal in resin. It is preferably used when a resin bearing is to be formed on a part of a metal part.

FIG. 5 is a perspective view of the metal skeleton of the heat sink 41, FIG. 6 is a front view of the metal skeleton of the heat sink 41, and FIG. 5 is a side view of the metal skeleton of the heat sink 41. As shown in the figure, the metal skeleton has a metal skeleton 4111 at the bottom and a metal skeleton 4112 of a heat radiating fin connected to the metal skeleton 4111 at the bottom, and the metal skeleton at the bottom has thermal conductivity with the semiconductor light emitting device. It is directly connected so that it is fully retained. As a result, the heat generated in the semiconductor light emitting device can be conducted through the heat conduction path of the metal skeleton from the bottom of the metal skeleton of the heat sink to the heat radiating fin, and further transferred from the metal skeleton to the heat conductive resin. Heat can be efficiently radiated from the surface of the heat conductive resin 412 into the air. Further, the metal skeleton 4112 of the heat radiating fins has the heat radiating fins at the outermost peripheral portions connected by the metal skeleton 4113 of the annular portion of the heat sink, and can radiate heat more efficiently.
In addition, the metal skeleton 4113 of the annular portion of the heat sink can be a fixed portion to the ceiling or the like when the lighting device is installed on the ceiling or the like.

It is preferable that the semiconductor light emitting device installation surface at the bottom is not covered with the heat conductive resin, and the surface opposite to the semiconductor light emitting device installation surface is covered with the heat conductive resin 4121. As a result, direct connection from the semiconductor light emitting device to the bottom is ensured, and insulation on the opposite surface can be ensured, and the circuit unit housed in the driver housing can be safely protected.
The metal skeleton of the radiating fin forms a core of the radiating fin, and the periphery thereof is preferably covered with the heat conductive resin 4122. As a result, a heat sink that is lightweight and has good heat dissipation can be realized.

The metal used for the metal skeleton 411 is a metal selected from the group of aluminum, magnesium, an aluminum alloy, and a magnesium alloy. The thermal conductivity of the metal is preferably 200 W / m · K or more.
The heat conductive resin 412 is preferably a thermoplastic resin such as a polycarbonate resin or a polybutylene terephthalate resin. As the heat conductive resin, a resin in which a carbon material, ceramic powder, soft magnetic powder, or the like is dispersed in the resin can be used. This is because the heat conductivity of the heat sink can be improved.

  The maximum diameter of the heat sink 41 is preferably 90 mm or more and 300 mm or less. Moreover, the thickness of the radiation fin 415 is preferably 5.0 mm or more and 20 mm or less, and the shape of the radiation fin is preferably a flat plate shape or a curved surface shape. Furthermore, it is preferable to provide a bridging portion that connects the heat dissipating fins, and preferably connects the tip outer peripheral portions of the heat dissipating fins. This is because by adopting these configurations, it is possible to achieve both the lightness of the instrument and the merit of heat dissipation.

A board housing portion in the driver housing 42 can be inserted behind the heat sink. Further, a set of screw insertion holes and a set of arm insertion holes through which the claw portions of the set of protruding arm portions 36 of the lens 3 can be respectively inserted are formed at the bottom of the heat sink 41. Furthermore, a wiring opening through which wiring connected to each terminal of the circuit unit housed in the driver housing 42 and the module substrate of the semiconductor light emitting device is formed at the bottom of the heat sink 41.
The semiconductor light emitting device 2 is fixed to the heat sink 41 of the housing 4 with fixing screws. The module substrate of the semiconductor light emitting device 2 is formed with a set of screw insertion portions that are notches through which fixing screws are inserted.

From the above, the illumination device according to the present embodiment can be used as an alternative to the AR111 type spot illumination device using a halogen lamp as a light source with a simple configuration.
And since the illuminating device 1 which concerns on a present Example can have the effect mentioned above, it is various, such as comparatively large-sized spotlights, such as PAR30 and AR111, A type electric bulb, a downlight, a universal downlight. It can be applied to a general lighting device.

DESCRIPTION OF SYMBOLS 1 Illuminating device 2 Semiconductor light-emitting device 3 Optical lens 30 Incident surface 31 Side surface direction incident surface 32 Optical axis direction incident surface 33 Output surface 34 Side reflective surface 4 Case 41 Heat sink 411 Metal skeleton 4111 Metal skeleton 4112 at the bottom of the heat sink Metal skeleton 4113 of the heat sink fins Metal frame 412 of the annular portion of the heat sink Thermal conductive resin 4121 Thermal conductive resin 4122 of the bottom portion of the heat sink Thermal conductive resin 415 of the heat sink fins of the heat sink
42 Driver housing 43 Outer tube part 5 Base 6 Base circuit terminal

Claims (15)

A semiconductor light-emitting device, a housing, and a heat sink constituting at least a part of the housing;
The heat sink includes a bottom portion on which the semiconductor light emitting device is installed, and a plurality of heat radiation fins, and is an integrally molded body of a metal skeleton and a heat conductive resin,
The metal skeleton has a metal skeleton of the bottom part, and a metal skeleton of a radiation fin connected to the metal skeleton of the bottom part,
The bottom metal skeleton is directly connected to the semiconductor light emitting device,
The radiating fin is a lighting device which is a plate-like structure extending radially from an edge of the bottom. The semiconductor light-emitting device installation surface of the bottom is not covered with a heat conductive resin, and an opposite surface of the semiconductor light-emitting device installation surface is covered with a heat conductive resin. Lighting device. The lighting device according to claim 1, wherein a metal skeleton of the heat radiating fin forms a core of the heat radiating fin, and a periphery thereof is covered with the heat conductive resin. The lighting device according to any one of claims 1 to 3, wherein the metal used for the metal skeleton is a metal selected from the group consisting of aluminum, magnesium, an aluminum alloy, and a magnesium alloy. The lighting device according to claim 1, wherein the heat conductive resin is a polycarbonate resin or a polybutylene terephthalate resin. The housing includes the concave portion including the bottom portion and an outer cylindrical portion that rises from the edge portion of the bottom portion toward the opening, and the radiating fin is connected to an outer peripheral surface of the outer cylindrical portion. It is a plate-shaped structure extended radially, The illuminating device of any one of Claims 1-5. Furthermore, the lens module is provided so that it may be located ahead of the said semiconductor light-emitting device. The illuminating device of any one of Claims 1-6. Furthermore, the driver housing is provided so that it may be located in the back of the said heat sink. The illuminating device of any one of Claims 1-7. The lighting device according to any one of claims 1 to 8, wherein the casing has a structure in which a cross-sectional area becomes smaller toward a base provided at a rear side. The illuminating device according to any one of claims 1 to 9, wherein a value of a luminous flux emitted per mass of the illuminating device is 3.5 lumen / g or more. The lighting device according to claim 1, wherein a maximum diameter of the heat sink is 90 mm or more and 300 mm or less. The lighting device according to any one of claims 1 to 11, wherein a thickness of the heat radiating fin is 5.0 mm or more and 20 mm or less. The illuminating device according to any one of claims 1 to 12, wherein the radiating fin has a flat plate shape or a curved surface shape. Furthermore, the illuminating device of any one of Claims 1-13 provided with the bridge | crosslinking part which connects the front-end | tip parts of the said radiation fin. A bottom portion for installing the semiconductor light emitting device and a plurality of heat radiation fins are provided,
It is an integral molded body of metal skeleton and heat conductive resin,
The metal skeleton has a metal skeleton of the bottom part, and a metal skeleton of a radiation fin connected to the metal skeleton of the bottom part,
The bottom metal skeleton can be directly connected to the semiconductor light emitting device,
The heat radiating fin is a plate-like structure extending radially from the edge of the bottom portion.

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