JP2016148541A - Non-contact temperature sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact temperature sensor that is light-weight and achieves prevention of an increase in cost of materials and high sensitivity even when incident directions of infrared rays are somewhat uneven.SOLUTION: A non-contact temperature sensor comprises a sensor 2 that receives infrared rays IR and a support 3 that supports the sensor. The sensor has an insulating film 4, a thin-film thermistor 5 that is patterned on a surface of the insulating film using a thermistor material, a pair of comb electrodes that have teeth and are patterned on the thin-film thermistor in such a manner that the comb electrodes face each other, a pair of pattern electrodes that are patterned on the surface of the insulating film and have one end connected to the pair of comb electrodes, and an infrared reflective film 8 that is patterned on the surface of the insulating film and reflects the infrared rays. The support supports the sensor in such a manner that the thin-film thermistor faces an object to be measured and the insulating film is bent at an angle at which the infrared reflective film reflects infrared rays from the object to be measured to the thin-film thermistor.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a non-contact temperature sensor in which radiation from a distance is focused and sensitivity to the radiation is increased.

  In general, in order to measure the temperature of an object to be measured such as a fixing roller used in a copying machine or a printer, a non-contact temperature sensor that is placed opposite the object to be measured and receives the radiant heat to measure the temperature is installed. ing. As such a non-contact temperature sensor, for example, Patent Document 1 proposes a reflecting mirror that collects radiant heat energy and a radiant heat sensor in which a heat sensitive element is installed in a condensing part of the reflecting mirror. In this radiant heat sensor, a chip thermistor is used as a thermal element.

Japanese Patent Laid-Open No. 7-181083

The following problems remain in the conventional technology.
In the conventional non-contact temperature sensor, it is necessary to prepare a reflecting mirror member that focuses infrared rays on a chip thermistor that is a thermal element in order to increase sensitivity to radiation from a distant measurement object. For this reason, there existed a problem that the whole weight will increase by a reflecting mirror member, and member cost will increase. In addition, it is necessary to focus the radiant heat on the chip thermistor. However, if the incident direction of the radiant heat (infrared rays) from the object to be measured varies, the chip thermistor, which is a pinpoint, cannot be focused, and the sensitivity decreases. There was a problem.

  The present invention has been made in view of the above-mentioned problems, and is a non-contact temperature sensor that is light in weight, can suppress an increase in member cost, and can obtain high sensitivity even if there is some variation in the incident direction of infrared rays. The purpose is to provide.

  The present invention employs the following configuration in order to solve the above problems. That is, the non-contact temperature sensor according to the first invention includes a sensor unit that receives infrared rays and a support that supports the sensor unit, and the sensor unit includes an insulating film and a surface of the insulating film. A thin film thermistor portion patterned with a thermistor material, a pair of comb electrodes having a plurality of comb portions above and below the thin film thermistor portion and patterned to face each other, and one end of the pair of comb electrodes A pair of pattern electrodes connected to a pair of comb-shaped electrodes and patterned on the surface of the insulating film; and an infrared reflective film that is patterned on the surface of the insulating film and reflects infrared rays; The thin film thermistor portion is disposed opposite to the measurement object, and the infrared reflecting film directs infrared rays from the measurement object to the thin film thermistor portion. And wherein the supporting bending the insulating film at an angle of reflection.

  In this non-contact temperature sensor, the support has the thin film thermistor portion disposed opposite to the measurement object, and the infrared reflection film reflects the infrared rays from the measurement object toward the thin film thermistor portion at an angle. Since it is supported by bending, it is not necessary to separately prepare a reflecting mirror or a reflecting plate, and infrared rays can be condensed on the thin film thermistor portion with an infrared reflecting film simply by bending and installing a flexible sensor portion. In addition, since a thin infrared reflecting film is formed on the insulating film as compared with a case where a reflecting mirror or a reflecting plate is attached as a separate member, the overall weight can be reduced. In addition, the thin film thermistor part can receive infrared light over a wider area than the chip thermistor, and even if the incident direction of infrared light varies to some extent, the thin film thermistor part can receive the infrared light reflected by the infrared reflective film. Can be obtained. In addition, since the sensor unit is flexible, it is easy to adjust the angle of the infrared reflecting film and control the light collecting property by changing the bending angle of the insulating film according to the incident direction and angle of infrared rays. It is.

A non-contact temperature sensor according to a second invention is the non-contact temperature sensor according to the first invention, wherein the insulating film is formed in a strip shape, the thin film thermistor portion is arranged in the center of the insulating film, and a pair of The infrared reflective film is disposed on both ends of the insulating film with the thin film thermistor portion interposed therebetween.
That is, in this non-contact temperature sensor, the thin film thermistor portion is disposed at the center of the strip-shaped insulating film, and the pair of infrared reflecting films are disposed on both ends of the insulating film with the thin film thermistor portion interposed therebetween. Therefore, by curving the insulating film in a concave shape with the surface facing inward, the infrared rays can be reflected by the pair of infrared reflecting films on both sides and condensed on the central thin film thermistor portion.

A non-contact temperature sensor according to a third invention is the non-contact temperature sensor according to the first invention, wherein the insulating film is formed in a cross shape, and the thin film thermistor portion is arranged at the center of the insulating film. The infrared reflective film is disposed on each of four end portions of the insulating film.
That is, in this non-contact temperature sensor, the thin film thermistor portion is disposed at the center of the cross-shaped insulating film, and the infrared reflecting films are disposed on the four end portions of the insulating film, respectively. By folding the four end portions of the insulating film inward so as to surround the central portion, the infrared rays can be reflected by the four infrared reflecting films and condensed on the central thin film thermistor portion.

The non-contact temperature sensor according to a fourth aspect is the non-contact temperature sensor according to the first aspect, wherein the support supports the insulating film by bending the insulating film into a cylindrical shape having an open end and a closed end, and the infrared reflection. The film is disposed on the entire inner peripheral surface, and the thin film thermistor portion is disposed on the inner surface of the closed end portion.
That is, in this non-contact temperature sensor, the support supports the insulating film by bending it into a cylindrical shape having an open end and a closed end, and arranges the infrared reflecting film over the entire inner peripheral surface, and closes it. Since the thin film thermistor portion is arranged on the inner surface of the end portion, infrared rays can be reflected by the entire cylindrical infrared reflecting film surrounding the thin film thermistor portion and condensed on the thin film thermistor portion at the closed end portion.

A non-contact temperature sensor according to a fifth invention is the non-contact temperature sensor according to any one of the first to fourth inventions, wherein a plurality of the infrared reflecting films are provided, at least a part of which is formed by the pattern electrode. Features.
That is, in this non-contact temperature sensor, since a plurality of infrared reflecting films are provided, and at least a part of them is formed of a pattern electrode, the manufacturing process can be simplified and the cost can be reduced.

The present invention has the following effects.
That is, according to the non-contact temperature sensor according to the present invention, the support member has the thin film thermistor portion opposed to the measurement object, and the infrared reflection film reflects the infrared ray from the measurement object toward the thin film thermistor portion. Since the insulating film is bent and supported at the angle to which it is attached, it is lightweight and does not require additional members such as reflectors, which can suppress an increase in member cost, and there is some variation in the incident direction of infrared rays. High sensitivity can be obtained.
Therefore, the non-contact temperature sensor of the present invention can easily set the reflection and the collection of infrared rays with a simple structure that only bends a flexible insulating film, and can effectively focus radiation from a distance. High sensitivity to radiation can be obtained.

1 is a side view showing a first embodiment of a non-contact temperature sensor according to the present invention. In 1st Embodiment, it is the top view and AA sectional view taken on the line which show a sensor part. It is a perspective view which shows 2nd Embodiment of the non-contact temperature sensor which concerns on this invention. In 2nd Embodiment, it is a top view which shows a sensor part. It is a perspective view which shows 3rd Embodiment of the non-contact temperature sensor which concerns on this invention. In 3rd Embodiment, it is a top view which shows the expanded sensor part. It is a side view which shows 4th Embodiment of the non-contact temperature sensor which concerns on this invention. In 4th Embodiment, it is a top view and a BB line sectional view showing a sensor part.

  Hereinafter, a non-contact temperature sensor according to a first embodiment of the present invention will be described with reference to FIGS. 1 and 2. In each drawing used for the following description, the scale is appropriately changed in order to make each member recognizable or easily recognizable.

As shown in FIGS. 1 and 2, the non-contact temperature sensor 1 of the present embodiment includes a sensor unit 2 that receives infrared IR and a support body 3 that supports the sensor unit 2.
The sensor part 2 has an insulating film 4, a thin film thermistor part 5 patterned with a thermistor material on the surface of the insulating film 4, and a plurality of comb parts 6 a on the thin film thermistor part 5. A pair of comb-shaped electrodes 6 that are patterned in this manner, a pair of pattern electrodes 7 that have one end connected to the pair of comb-shaped electrodes 6 and patterned on the surface of the insulating film 4, and a pattern on the surface of the insulating film 4 And an infrared reflecting film 8 that is formed and reflects infrared IR.

The support 3 has an insulating film at an angle at which the thin film thermistor portion 5 is disposed opposite to the measurement object M and the infrared reflection film 8 reflects the infrared IR from the measurement object M toward the thin film thermistor portion 5. 4 is supported by bending.
The insulating film 4 is formed in a strip shape. This insulating film 4 is formed of, for example, a polyimide resin sheet having a thickness of 7.5 to 125 μm.
The thin film thermistor portion 5 is disposed at the center of the insulating film 4, and a pair of infrared reflective films 8 are disposed on both ends of the insulating film 4 with the thin film thermistor portion 5 interposed therebetween.

  The pair of pattern electrodes 7 is formed by patterning, for example, a multilayer metal film of a NiCr film and a Pt film, and has comb-shaped electrode portions (comb portions 6a) arranged in a mutually opposed state. The comb electrode portions of the pattern electrodes 7 are arranged so as to extend along the extending direction of the strip-shaped insulating film 4. One end of a lead wire (not shown) is joined to the end portions of the pair of pattern electrodes 7 with a solder material. It should be noted that through holes may be formed in the insulating film 4 and the support 3 and lead wires may be inserted.

The thin film thermistor portion 5 is a thin film thermistor material made of nitride such as TiAlN having a film thickness of 100 to 1000 nm, for example, and is patterned in the center of the insulating film 4 in a rectangular shape.
In particular, the thin film thermistor portion 5 of the present embodiment has a general formula: Ti _x Al _y N _z (0.70 ≦ y / (x + y) ≦ 0.95, 0.4 ≦ z ≦ 0.5, x + y + z = 1). The crystal structure is a single phase of a hexagonal wurtzite type.

Further, the non-contact temperature sensor 1 of the present embodiment includes a protective film 9 that covers the thin film thermistor portion 5 on the surface of the insulating film 4. Further, an insulating protective sheet that covers the protective film 9 on the surface of the insulating film 4 may be adhered.
The protective film 9 is an insulating resin film, for example, a polyimide film having a thickness of 20 μm is employed. The protective film 9 is patterned in a rectangular shape so as to cover the comb portion 6 a together with the thin film thermistor portion 5.

  The pair of infrared reflection films 8 are formed in a rectangular pattern on the insulating film 4 by depositing or sputtering a metal thin film such as Al or Au.

  The sensor part 2 is attached to the support 3 with an adhesive or the like on the back surface of the insulating film 4 in a state where the thin film thermistor part 5 is bent inside so as to be substantially U-shaped. . In addition, the support body 3 has a shape that can hold the curved state of the sensor unit 2. The degree of curvature of the insulating film 4 is set so that the infrared IR from the measuring object M is totally reflected by the pair of infrared reflecting films 8 and enters the central thin film thermistor section 5.

  As described above, in the non-contact temperature sensor 1 according to the present embodiment, the support 3 disposes the thin film thermistor portion 5 opposite to the measurement object M, and the infrared reflection film 8 thins the infrared IR from the measurement object M. Since the insulating film 4 is bent and supported at an angle that reflects toward the thermistor portion 5, there is no need to prepare a separate reflector or reflector, and only the flexible sensor portion 2 is bent and installed. The infrared ray IR can be condensed to the central thin film thermistor portion 5 by the film 8.

  Moreover, since the thin infrared reflecting film 8 is formed on the insulating film 4 as compared with the case where a reflecting mirror or a reflecting plate is attached as a separate member, the whole can be reduced in weight. Further, the thin film thermistor unit 5 can receive infrared IR over a wider area than the chip thermistor, and the thin film thermistor unit 5 receives the infrared IR reflected by the infrared reflecting film 8 even if the incident direction of the infrared IR varies to some extent. And high sensitivity can be obtained. In addition, since the sensor part is flexible, the angle of the infrared reflecting film 8 is adjusted by changing the bending angle of the insulating film 4 according to the incident direction and angle of the infrared IR, and the light collecting property is controlled. It is also easy. In this case, the support 3 may be movable so that the bending angle of the insulating film 4 can be adjusted.

  Further, the thin film thermistor portion 5 is disposed at the center of the strip-shaped insulating film 4, and a pair of infrared reflecting films 8 are disposed on both ends of the insulating film 4 with the thin film thermistor portion 5 interposed therebetween. Therefore, by curving the insulating film 4 in a concave shape with the surface facing inward, the infrared rays can be reflected by the pair of infrared reflecting films 8 on both sides and condensed on the thin film thermistor portion 5.

  Next, 2nd and 3rd embodiment of the temperature sensor which concerns on this invention is described below with reference to FIGS. In the following description of each embodiment, the same constituent elements described in the above embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  The difference between the second embodiment and the first embodiment is that, in the first embodiment, the pair of infrared reflecting films 8 are formed on the strip-shaped insulating film 4, whereas the non-contact of the second embodiment. In the temperature sensor 21, as shown in FIGS. 3 and 4, the insulating film 24 is formed in a cross shape, and the thin film thermistor portion 5 is arranged at the center of the insulating film 24, and the insulating film 24. The infrared reflection film 8 is disposed on each of the four end portions.

That is, in the second embodiment, the four end portions of the insulating film 24 are bent inward and supported by the support body 23, and the infrared IR reflected by the respective infrared reflecting films 8 from the four sides of the thin film thermistor portion 5. Is condensed on the thin film thermistor section 5.
As described above, in the non-contact temperature sensor 21 according to the second embodiment, the thin film thermistor portion 5 is arranged at the center of the cross-shaped insulating film 24, and infrared rays are formed on the four end portions of the insulating film 24. Since each of the reflection films 8 is arranged, the four IR reflection films 8 reflect the IR IR by bending the four end portions of the insulating film 24 inward so as to surround the center portion. The light can be condensed on the thin film thermistor section 5.

  The difference between the third embodiment and the second embodiment is that, in the second embodiment, the thin film thermistor portion 5 is arranged at the center of the four infrared reflection films 8 and the support body 23 supports the sensor portion 22. On the other hand, in the non-contact temperature sensor 31 of the third embodiment, as shown in FIGS. 5 and 6, the support 33 has a cylindrical shape in which the insulating film 34 has an open end and a closed end. The infrared reflective film 38 is disposed on the entire inner peripheral surface while being bent and supported, and the thin film thermistor portion 5 is disposed on the inner surface of the closed end.

  In the third embodiment, as shown in FIG. 5, when the sensor unit 32 is expanded, the insulating film 34 includes a belt-like C-shaped part 34 </ b> A on which the infrared reflecting film 38 is formed, and a C-shaped part 34 </ b> A. It is comprised by the circular part 34B which was connected to the center opening area | region and in which the thin film thermistor part 5 was formed. The insulating film 34 has a cylindrical shape by bonding both end portions of the C-shaped portion 34A, and an infrared reflecting film 38 is formed on the inner peripheral surface.

  Further, the length of the inner peripheral edge of the C-shaped portion 34A is set to be the same as the circumferential length of the circular portion 34B, and when the C-shaped portion 34A is formed into a cylindrical shape, the opening end portion is the circular portion 34B. It is closed so as to become a closed end portion, and the opening portion is set to have a large cup shape as a whole. Further, the support 33 is formed in a cup shape capable of supporting the sensor unit 32 on the inner surface, and supports the sensor unit 32 by bonding the back surface of the insulating film 34 to the inner surface.

  As described above, in the non-contact temperature sensor 31 of the third embodiment, the support 33 supports the insulating film 34 by bending it into a cylindrical shape having an open end and a closed end, and the infrared reflective film 38 inside. Since the thin film thermistor portion 5 is disposed on the entire peripheral surface and the inner surface of the closed end portion, the infrared light IR is reflected by the entire cylindrical infrared reflection film 38 surrounding the thin film thermistor portion 5 to thereby close the closed end portion. Can be condensed on the thin film thermistor portion 5.

  Next, the difference between the fourth embodiment and the first embodiment is that, in the first embodiment, the pattern electrode 7 and the infrared reflecting film 8 are provided separately, whereas the fourth embodiment is different from the first embodiment. In the contact temperature sensor 41, the infrared reflective film 48 is formed by the pattern electrode 47. That is, in the fourth embodiment, the pattern electrode 47 extends from the pair of comb-shaped electrodes 6 to both ends of the insulating film 4, and the portion not covered with the protective film 9 remains as it is. A film 48 is formed.

Thus, in the non-contact temperature sensor 41 of the fourth embodiment, since the infrared reflective film 48 is formed of the pattern electrode 47, the manufacturing process is simplified and the cost can be reduced. In this embodiment, the pattern electrode 47 from the comb electrode 6 to the infrared reflection film 48 is connected at a short distance, but the infrared reflection film 48 (pattern electrode 47) having a large area is connected to the thin film thermistor section 5. In order to prevent heat from being dissipated, the wiring of the pattern electrode 47 from the comb-shaped electrode 6 to the infrared reflecting film 48 may be set long and thin. For example, the escape of heat can be suppressed by forming the wiring of the pattern electrode 47 from the comb electrode 6 to the infrared reflecting film 48 into a thin meander shape that is repeatedly folded.
Further, only one of the pair of infrared reflection films 48 may be the pattern electrode 47, and when there are three or more infrared reflection films 48, all of the infrared reflection films 48 or a part of them may be the pattern electrodes 47. .

  The technical scope of the present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

  1, 2, 31, 41 ... non-contact temperature sensor, 2, 22, 32 ... sensor part, 3, 23, 33 ... support, 4, 24, 34 ... insulating film, 5 ... thin film thermistor part, 6 ... comb Type electrode, 6a ... comb, 7,47 ... pattern electrode, 8,38,48 ... infrared reflective film, IR ... infrared, M ... measurement object

Claims (5)

A sensor unit for receiving infrared rays;
A support for supporting the sensor unit,
The sensor portion has an insulating film, a thin film thermistor portion patterned with a thermistor material on the surface of the insulating film, and a plurality of comb portions above and below the thin film thermistor portion and facing each other. A pair of comb-shaped electrodes patterned, a pair of pattern electrodes having one end connected to the pair of comb-shaped electrodes and patterned on the surface of the insulating film, and a pattern formed on the surface of the insulating film And an infrared reflecting film that reflects infrared rays,
The support is disposed so that the thin film thermistor portion faces the measurement object, and the insulating film is bent at an angle at which the infrared reflection film reflects infrared rays from the measurement object toward the thin film thermistor portion. A non-contact temperature sensor characterized by being supported. The non-contact temperature sensor according to claim 1.
The insulating film is formed in a band shape,
The thin film thermistor portion is disposed in the center of the insulating film, and a pair of the infrared reflective films are disposed on both ends of the insulating film with the thin film thermistor portion interposed therebetween. Non-contact temperature sensor. The non-contact temperature sensor according to claim 1.
The insulating film is formed in a cross shape,
The non-contact temperature sensor, wherein the thin film thermistor portion is arranged in the center of the insulating film, and the infrared reflecting films are arranged on the four end portions of the insulating film, respectively. . The non-contact temperature sensor according to claim 1.
The support supports the insulating film by bending it into a cylindrical shape having an open end and a closed end, and arranges the infrared reflecting film over the entire inner peripheral surface, and on the inner surface of the closed end. A non-contact temperature sensor comprising the thin film thermistor portion. The non-contact temperature sensor according to any one of claims 1 to 4,
A non-contact temperature sensor, wherein a plurality of the infrared reflection films are provided, at least a part of which is formed by the pattern electrode.

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