JP2016039171A - Conductive wiring manufacturing method and conductive wiring - Google Patents

Abstract

Provided is a method for manufacturing a conductive wiring, which can easily form a conductive wiring having desired characteristics on an insulating substrate without supplying a conductive paste to the insulating substrate by screen printing.
A method of manufacturing a conductive wiring includes a step (S1) of printing an ink 2 so as to form a predetermined pattern on an insulating substrate 1, and an ink 2 (predetermined pattern) before the printed ink 2 is dried. The step (S2) of placing (spreading) the conductive powder 3 onto the insulating substrate 1, the step of pressing the placed conductive powder 3 against the insulating substrate 1 (S3), and the compressed conductive The conductive powder 3 is heated and sintered (S4), and the conductive wiring 20 is manufactured through the series of steps (S1 to S4).
[Selection] Figure 1

Description

  The present invention relates to a method for manufacturing a conductive wiring and a conductive wiring, and more particularly to a method for manufacturing a conductive wiring and a conductive wiring formed of conductive powder.

Conventionally, as a method of forming a conductive wiring on an insulating substrate, a photolithography method in which a copper foil formed on an insulating substrate is etched and then sintered, or after a conductive paste is screen printed on an insulating substrate, There is a printing method that sinters after ink jet printing.
A metal material having a particle size on the order of microns for the purpose of solving both the problem that the number of steps in the photolithography method is large and the problem that the metal particles used in the conductive paste are easily oxidized in the printing method. A circuit board manufacturing method using a conductive paste containing metal microparticles and metal nanoparticles having a particle size of nanometer order is disclosed (for example, see Patent Document 1).

JP 2007-53212 A (Page 6, FIG. 1)

  In the invention disclosed in Patent Document 1, a conductive paste containing metal micron particles and metal nanoparticles is supplied to an insulating substrate by screen printing, and fired in a low oxygen atmosphere to sinter the metal nanoparticles. It is what is done. For this reason, there has been a problem that it is difficult to select a conductive paste that satisfies both securing fluidity suitable for screen printing and suppressing increase in electrical resistance. That is, the material and particle size of metal micron particles, the material and particle size of metal nanoparticles, the type of solvent, and the amount of each (the proportion of each in the conductive paste) are the characteristics of the conductive wiring formed on the insulating substrate. It took a lot of tests and a long time to set according to the conditions.

  The present invention solves the above-described problem, and a method of manufacturing a conductive wiring capable of easily forming a conductive wiring having desired characteristics on an insulating substrate without supplying the conductive paste to the insulating substrate by screen printing. And providing a conductive wiring formed by the method of manufacturing the conductive wiring.

(1) A method for producing a conductive wiring according to the present invention includes a step of printing ink so as to form a predetermined pattern on an insulating substrate, and a conductive powder on the ink before the printed ink is dried. , A step of pressing the conductive powder placed on the insulating substrate and compressing the conductive powder, and a step of heating and sintering the compressed conductive powder.
(2) Moreover, the said heating is performed by irradiating an ultraviolet-ray or a laser beam toward the said compressed electroconductive powder.
(3) The insulating substrate is white or transparent, and the laser beam is a YAG laser beam.
(4) Furthermore, the conductive wiring which concerns on this invention is formed by the manufacturing method of the conductive wiring in any one of said (1)-(3).

(I) In the case where the conductive paste is supplied to the insulating substrate by screen printing or the like, the conductive powder in the ink deteriorates the printing accuracy and cannot increase the density of the conductive powder. Since the method for manufacturing the conductive wiring can easily select an ink suitable for printing a predetermined pattern, the printing accuracy can be increased. In addition, the density of the conductive powder can be increased, the conductivity can be improved, and there is no need to select a conductive paste that satisfies both screen printability and electrical conductivity as in the conventional case, and the work is quick. become.
(Ii) Moreover, since it sinters by irradiation of an ultraviolet-ray or a laser beam, a conductive wiring can be manufactured cheaply. The material of the conductive powder is not limited and is copper, copper alloy, silver, silver alloy, or the like.
(Iii) Since the insulating substrate is white or transparent and the white or transparent insulating substrate is irradiated with YAG laser light having a property of passing through the white or transparent base material, heat generation of the insulating substrate can be suppressed. it can. Therefore, it is not necessary to limit the insulating substrate to a heat-resistant material such as a ceramic plate, so that options for the insulating substrate are expanded, and the conductive wiring can be manufactured at low cost by using an inexpensive insulating substrate. .
(Iv) Moreover, since the conductive wiring according to the present invention is formed by the method for manufacturing a conductive wiring having the effect described in any one of (i) to (iii), the conductive wiring has good conductivity, Inexpensive.

The flowchart explaining the manufacturing method of the electrically conductive wiring which concerns on Embodiment 1 of this invention. Sectional drawing of the side view which shows typically each process in the manufacturing method of the electrically conductive wiring which concerns on Embodiment 1 of this invention. Sectional drawing of the side view which shows typically the electrically conductive wiring which concerns on Embodiment 2 of this invention.

[Embodiment 1]
1 and 2 illustrate a method for manufacturing a conductive wiring according to Embodiment 1 of the present invention and a conductive wiring manufactured by the method for manufacturing the conductive wiring. FIG. 1 is a flowchart, FIG. (A)-(e) is sectional drawing of the side view which shows each process typically. FIG. 2 schematically shows a part in an exaggerated manner, and the present invention is not limited to the illustrated form (size and quantity).

1 and 2, the conductive wiring manufacturing method includes a step (S1) of printing the ink 2 so as to form a predetermined pattern on the insulating substrate 1, and before the printed ink 2 is dried, the ink 2 ( A step (S2) of placing (dispersing) the conductive powder 3 in a predetermined pattern), a step of pressing the placed conductive powder 3 against the insulating substrate 1 and compressing (S3), and compression And heating the sintered conductive powder 3 to sinter (S4), and the conductive wiring 20 is manufactured through the series of steps (S1 to S4).
In the present invention, the compressing step (S3) and the heating and sintering step (S4) are not limited to those performed continuously, and may be performed simultaneously.

At this time, the conductive powder 3 is, for example, fine particles of copper or copper alloy, and has an average particle size of 1 to 200 μm, for example, but the present invention limits the range of the average particle size of the conductive powder 3. Not what you want.
Since the conductive powder 3 is sprayed on the insulating substrate 1 before the printed ink 2 dries, the conductive powder 3 adheres to the ink 2 (shown by a single oblique line) before drying, and the ink 2 The conductive powder 3 adhering to has a predetermined pattern.
The heating is performed by irradiating the compressed conductive powder 3 with a laser beam (for example, YAG laser beam) 30.
In addition, since the conductive powder 3 adhered to the ink 2 is compressed before the laser light irradiation (the ink 2 and the conductive powder 3 are collectively indicated by a double oblique line), the interval between the conductive powders 3 (accurately) The size of the pores (pores) is reduced and the density is increased, so that the sintering is promoted and the heating operation can be performed more quickly at a lower temperature (the conductive powder after sintering). 3 is shown as a solid fill). The heating may be performed by irradiating with ultraviolet rays (cannon light) instead of the laser light 30.

In other words, the method for producing a conductive wiring does not supply the conductive paste to the insulating substrate 1 by screen printing or the like, so that the ink 2 suitable for printing a predetermined pattern can be easily selected. Therefore, it is possible to easily select the conductive powder 3 in accordance with the above characteristics, so that the printing accuracy can be increased, the density of the conductive powder can be increased, and the conductivity can be improved. Further, there is no need to select a conductive paste satisfying both screen printing properties and electrical conductivity as in the prior art, and the work is quickened.
Further, since the conductive powder 3 is fine and is sintered by irradiation with ultraviolet rays or laser light, the conductive wiring can be manufactured at low cost.

At this time, if the insulating substrate 1 is made white or transparent and YAG laser light is irradiated as laser light, the YAG laser light has a property of passing through the white or transparent base material, so that heat generation of the insulating substrate 1 is suppressed. be able to. Accordingly, since it is not necessary to limit the insulating substrate 1 to a heat-resistant material, for example, a ceramic plate, the choice of the insulating substrate is expanded, and the conductive wiring 20 is manufactured at low cost by using an inexpensive insulating substrate. be able to.
In FIG. 2 (d), the granular conductive powder 3 adheres on the part with double diagonal lines (ink 2 and conductive powder 3), and the thicknesses thereof are substantially the same. However, the present invention is not limited to this, and each thickness may be any thickness, and the conductive powder 3 deposited on the portion with double diagonal lines is further limited. is not. Furthermore, there may be no conductive powder 3 attached on the part with double diagonal lines, and only the part with double diagonal lines may be provided.

[Embodiment 2]
FIG. 3 is a side sectional view showing the conductive wiring according to the second embodiment of the present invention. The same parts as those in FIG. 2 are denoted by the same reference numerals, and a part of the description is omitted.
In FIG. 3, the conductive wiring 20 has a predetermined pattern drawn by the conductive powder 3 sintered on the insulating substrate 1. At this time, since the conductive wiring 20 is formed by the conductive wiring manufacturing method, it has good conductivity and is inexpensive.
The insulating substrate 1 is not limited to a flat surface and may be a curved surface. Further, the pattern drawn by the conductive powder 3 is not limited, and the material (component) of the conductive powder 3 is not limited.

  According to the present invention, since a conductive wiring having a desired pattern can be easily and inexpensively manufactured, it can be widely used as a method for manufacturing a conductive wiring on various shapes of insulating substrates.

1 Insulating substrate 2 Ink 3 Conductive powder 20 Conductive wiring 30 Laser light

Claims (4)

A step of printing ink so as to form a predetermined pattern on the insulating substrate;
Placing the conductive powder on the ink before the printed ink is dried; and
Pressing the conductive powder placed on the insulating substrate and compressing the conductive powder;
Heating and sintering the compressed conductive powder; and
A method for producing a conductive wiring, comprising:   The method of manufacturing a conductive wiring according to claim 1, wherein the heating is performed by irradiating the compressed conductive powder with ultraviolet rays or laser light.   3. The method of manufacturing a conductive wiring according to claim 2, wherein the insulating substrate is white or transparent, and the laser beam is a YAG laser beam.   A conductive wiring formed by the method for manufacturing a conductive wiring according to claim 1.

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