JP2016036968A - Method for manufacturing liquid discharge head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To join an element substrate with a supporting member while reducing possibilities that a liquid supply passage is narrowed.SOLUTION: First light irradiation is performed from the side of an adhesive layer 4 so that light of irradiation energy larger than regions other than first regions 4a of the adhesive layer 4, or second regions 4b, is irradiated to the first regions 4a and that the first regions 4a are cured to an extent where the shapes of the regions can be retained. A laminate 1 is stuck to a substrate 8 of an element substrate 5 so that the adhesive layer 4 in the first regions 4a covers a liquid supply port. Second light irradiation is performed from the side of a base material film to the laminate 1 stuck to the element substrate 5 so that the adhesive layer 4 in the first regions 4a is integrated with a cohesive layer 3 and that an uncured constituent of the adhesive layer 4 in the second regions 4b remains on an interface between the cohesive layer 3 and the adhesive layer 4. The laminate 1 receiving the second light irradiation is separated from the element substrate 5 so that only the adhesive layer 4 in the second regions 4b is adhered to the substrate 8. The element substrate 5 is attached to a supporting member.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a method for manufacturing a liquid discharge head, and more particularly to a method for joining an element substrate and a support member.

  A liquid discharge head such as an ink jet recording head includes a discharge port forming member provided with a discharge port for discharging a liquid typified by ink, an element substrate having an energy generating element provided corresponding to each discharge port, And a support member that supports the element substrate. The element substrate includes a liquid supply path that supplies liquid to the energy generating element, and the support member includes a liquid flow path that supplies liquid to the liquid supply path of the element substrate. The element substrate is bonded to the support member so that the liquid supply path and the liquid flow path communicate with each other. In general, the element substrate is bonded to a support member with an adhesive. Specifically, an amount of adhesive that allows for the required height of the adhesive is drawn and applied to the element substrate using a dispenser. Next, predetermined positions of the element substrate and the support member are aligned by the camera, and the element substrate is brought into close contact with the support member. Thereafter, the adhesive is cured, and the element substrate is bonded to the support member.

  On the other hand, a method of providing an adhesive layer instead of applying an adhesive is also known. According to the technique disclosed in Patent Document 1, a wafer to which a dicing tape is attached is cut, and semiconductor chips arranged at intervals on the dicing tape are created. Next, an adhesive layer containing a photocurable component, a base film laminated on one side of the adhesive layer, and an adhesive layer containing a photocurable component laminated on the other side of the adhesive layer The laminated body made of is attached to the semiconductor chip with the adhesive layer facing the semiconductor chip. Next, light is irradiated from the semiconductor chip side to expose the adhesive layer and the adhesive layer present in the gap between the semiconductor chips. The reaction of the photocurable component of the pressure-sensitive adhesive layer and the adhesive layer proceeds by exposure, and the pressure-sensitive adhesive layer and the adhesive layer are difficult to peel from each other, and the exposed portion becomes brittle with respect to the unexposed portion. The adhesive force between the adhesive layer and the adhesive layer in the unexposed area remains small. Thereafter, the semiconductor chip is separated from the dicing tape. The pressure-sensitive adhesive layer and the adhesive layer in the exposed part and the pressure-sensitive adhesive layer in the unexposed part are separated from the semiconductor chip, and a semiconductor chip having the adhesive layer attached only to the bottom surface is obtained.

JP 2013-4811 A

  In manufacturing the liquid discharge head, it is important to prevent the adhesive from flowing into the liquid supply path and prevent the liquid supply path from being narrowed. On the other hand, miniaturization and higher density of the element substrate for the purpose of improving the image quality of the liquid discharge head have been advanced, and accordingly, the application range and the application amount of the adhesive applied to the element substrate have been reduced. For this reason, it is becoming difficult to apply an amount of adhesive that satisfies a sufficient application area and height of the adhesive. Furthermore, the adhesive may flow into the liquid supply path of the element substrate in an uncured state to narrow the liquid supply path. When the application range and application amount of the adhesive decrease, it becomes difficult to accurately adjust the application range and application amount, and it becomes difficult to reduce the possibility of narrowing of the liquid supply path.

  According to the technique described in Patent Document 1, since a laminate including an adhesive layer is attached to an element substrate, a certain amount of adhesive can be attached to the element substrate. Specifically, the laminate can be attached to the joint surface of the element substrate with the support member. However, this technique cannot selectively remove the adhesive layer attached to the liquid supply port of the liquid supply path of the element substrate. According to the technique of Patent Document 1, light is irradiated from the side opposite to the joint surface with the support member of the element substrate, that is, the surface provided with the discharge ports, but the irradiated light enters the light from the minute discharge ports. This is because it is shielded by the structure of the element substrate except for. For this reason, it is necessary to use a conventional dispenser in order to provide an adhesive in a range excluding the liquid supply port on the bonding surface of the element substrate, and the possibility of narrowing of the liquid supply path cannot be reduced.

  An object of the present invention is to provide a method for manufacturing a liquid discharge head capable of joining an element substrate and a support member while reducing the possibility of narrowing the liquid supply path.

The method for producing a liquid discharge head of the present invention includes a pressure-sensitive adhesive layer containing a first photocurable resin composition, a base film laminated on one surface of the pressure-sensitive adhesive layer, and a second photocurable resin. In the laminate having the composition and the adhesive layer laminated on the other surface of the pressure-sensitive adhesive layer, the first region of the adhesive layer is more than the second region which is a region other than the first region. A step of performing the first light irradiation from the adhesive layer side so that the light of a large irradiation energy is irradiated and the first region is cured to such an extent that the shape can be maintained;
A substrate having a first surface and a second surface that is the back surface of the first surface, the liquid supply port of the liquid supply path for supplying the liquid being provided on the second surface, and the liquid discharging An adhesive layer faces the second surface of the element substrate having the discharge port and has a discharge port forming member bonded to the first surface, and is bonded to the first region. A step of affixing the laminate subjected to the first light irradiation so that the agent layer covers the liquid supply port;
A laminate bonded to the element substrate such that the adhesive layer in the first region is integrated with the pressure-sensitive adhesive layer, and the uncured component remains at the interface with the pressure-sensitive adhesive layer in the second region. Performing a second light irradiation from the base film side,
Separating the laminate that has received the second light irradiation from the element substrate so that only the adhesive layer in the second region is attached to the substrate;
Bonding the element substrate having only the adhesive layer of the second region attached to a support member having a liquid flow path for liquid so that the liquid flow path and the liquid supply path of the substrate communicate with each other. doing.

  The first region of the adhesive layer is cured by the first light irradiation, and then the laminate is attached to the element substrate so that the adhesive layer in the first region covers the liquid supply port. Accordingly, the liquid supply port of the substrate is blocked by the adhesive layer in the first region. Since the adhesive layer in the first region is cured to such an extent that the shape can be maintained, the possibility that the adhesive layer in the first region enters the liquid supply port of the substrate is small. In addition, since the liquid supply port of the substrate is blocked by the adhesive layer in the first region, even if the fluidity remains in the adhesive layer in the second region, the adhesive layer in the second region Is unlikely to enter the liquid supply port of the substrate. In this way, the possibility of narrowing the liquid supply path can be reduced. In the first light irradiation, the adhesive layer in the first region is irradiated with light having a larger irradiation energy than the adhesive layer in the second region. For this reason, the total irradiation energy of the light irradiated to the adhesive layer in the first region, which is a combination of the first light irradiation and the second light irradiation, is the total irradiation energy of the light irradiated to the adhesive layer in the second region. More than total irradiation energy. Therefore, while the uncured component remains at the interface with the adhesive layer in the adhesive layer in the second region, the adhesive layer in the first region is sufficiently cured and integrated with the adjacent adhesive layer. To do. As a result, when the laminate is separated from the substrate, only the adhesive layer in the second region adheres to or remains on the substrate. Thus, a substrate having an adhesive layer formed only in the second region can be obtained, and the substrate and the support member can be joined.

  As described above, according to the present invention, it is possible to provide a method for manufacturing a liquid discharge head capable of joining the element substrate and the support member while reducing the possibility of narrowing the liquid supply path.

It is a schematic diagram of a wafer on which an element substrate to which the present invention is applied is formed. It is a typical sectional view of an element substrate to which the present invention is applied. It is a typical sectional view of a layered product. It is the schematic which shows a 1st light irradiation process. It is a typical sectional view of an element substrate on which a layered product was stuck. It is the schematic which shows the isolation | separation process of the element substrate in which the laminated body was affixed. It is the schematic of a 2nd light irradiation process. It is the schematic which shows the process of isolate | separating an element substrate from a laminated body. It is typical sectional drawing of the element substrate in which the supporting member was bonded together. It is a typical sectional view of an element substrate and a supporting member after an adhesive layer has hardened.

  An embodiment of a method of manufacturing a liquid discharge head according to the present invention will be described with reference to the drawings. In each figure, the same number is attached | subjected to the structure, element, and member which have the same function, and the description may be abbreviate | omitted. FIG. 1 is a schematic view of a wafer on which an element substrate to which the present invention is applied is formed. 1A is a top view of the wafer, and FIG. 1B is an enlarged view of a portion A in FIG. FIG. 2 is a schematic cross-sectional view of the element substrate cut along line 2-2 in FIG. A plurality of element substrates 5 are formed in a lattice shape on the wafer 100. Each element substrate 5 on the wafer includes a discharge port forming member 7 provided with a discharge port 6 for discharging a liquid, and a substrate 8 having an energy generating element 14 provided corresponding to each discharge port 6. ing. FIG. 1B shows the discharge port surface 9 of the discharge port forming member 7. The element substrate 5 is for discharging black ink, and two discharge port arrays are formed on the discharge port surface 9. However, the present invention can be applied to the manufacture of a color liquid discharge head, and can also be applied to the manufacture of a liquid discharge head for printing a high viscosity liquid such as UV ink or solder paste.

  Next, a process for manufacturing the liquid discharge head 101 by bonding the element substrate 5 to the support member 10 will be described. In the following description, the step of cutting the element substrate 5 from the wafer 100 and the step of bonding the element substrate 5 to the support member 10 will be described, and other steps, for example, the steps of connecting and sealing the electrical wiring substrate will be described. Omitted.

[Creation of Laminate 1] (See FIG. 3)
The pressure-sensitive adhesive layer 3, a light-transmitting base film 2 laminated on one surface 3 a of the pressure-sensitive adhesive layer 3, and an adhesive layer 4 laminated on the other surface 3 b of the pressure-sensitive adhesive layer 3 The laminated body 1 is formed. FIG. 2 shows a schematic configuration of the laminate 1. The laminate 1 according to this embodiment includes an adhesive layer 3, a base film 2, and an adhesive layer 4. The laminate 1 is formed by sequentially laminating an adhesive layer 3 and an adhesive layer 4 on a base film 2. The laminated body 1 has a function as a dicing tape and a function as a die bonding film for joining the element substrate 5 to the support member 10 as will be described later. It has the same layer structure. The pressure-sensitive adhesive layer 3 includes a first photocurable resin composition, and the adhesive layer 4 includes a second photocurable resin composition. Accordingly, when the pressure-sensitive adhesive layer 3 and the adhesive layer 4 are irradiated with light, the reaction of the photocurable component is started and the curing proceeds. As shown in FIG. 1, the base film 2 has a square shape covering the wafer 100, but may have any shape suitable for mounting the base film 2 on a dicing apparatus in a subsequent process. it can. The pressure-sensitive adhesive layer 3 and the adhesive layer 4 are stacked so as to be within the range of the base film 2 and cover the entire area of the wafer 100.

[First light irradiation] (see FIG. 4)
The first region 4a of the adhesive layer 4 is irradiated with light from the adhesive layer 4 side (first light irradiation). A mask 12 is arranged between the light source 11 and the adhesive layer 4 to block or reduce the light when irradiated with light from the adhesive layer side. The light 11 a emitted from the light source 11 reaches the region that is not shielded by the mask 12 as it is. This area is referred to as a first area 4a. The first region 4 a is a region inside a projection line obtained by projecting the edge of the mask 12 perpendicularly to the surface of the adhesive layer 4 of the laminate 1. Light with reduced irradiation energy reaches the area shielded by the mask 12, or no light reaches it at all. This region, that is, the region other than the first region is referred to as a second region 4b. The mask 12 irradiates the first region 4a with a larger irradiation energy than the second region 4b. The first region 4 a of the adhesive layer 4 has the same shape and dimensions as the liquid supply port 13 of the substrate 8, but the first region 4 a is in contact with the substrate 8 when the laminate 1 is brought into close contact with the substrate 8. As long as it completely covers the liquid supply port 13, it can have any shape and size. In order to adjust the degree of curing of the adhesive layer 4 and the pressure-sensitive adhesive layer 3, preliminary light irradiation may be performed in advance before the first light irradiation.

  By the first light irradiation, the first region 4a of the adhesive layer 4 is cured to such an extent that the shape can be maintained. The viscosity of the second region 4b of the adhesive layer 4 is desirably increased to the extent that the interface 21 with the first region 4a is maintained. Since the light is diffracted at the edge of the mask 12, the first region 4 a of the adhesive layer 4 has the same shape and size as the liquid supply port 13 of the substrate 8, and the mask 12 completely blocks the light. However, light having a certain irradiation energy is irradiated near the interface 21 between the second region 4b and the first region 4a.

[Affixing the laminated body 1 to the element substrate 5] (see FIGS. 2 and 5)
The laminated body 1 that has received the first light irradiation is attached to the element substrate 5. First, the configuration of the element substrate 5 will be described. The element substrate 5 has a discharge port forming member 7 made of an organic polymer material such as a photosensitive resist. The discharge port forming member 7 includes a pressure chamber 15 that stores liquid and a discharge port 6 that communicates with the pressure chamber 15 and discharges liquid. The element substrate 5 has a substrate 8 made of silicon, and has a liquid supply path 16 communicating with the pressure chamber 15. The liquid supply path 16 has a second surface 18 (the back surface of the first surface 17) facing the support member 10 to be bonded to the substrate 8 in a later process from the first surface 17 to which the discharge port forming member 7 is bonded. ) Through the substrate 8. The liquid supply path 16 communicates with the pressure chamber 15 through an opening 24 located on the first surface 17 and is a liquid supply port 13 (an opening on the support member 10 side of the liquid supply path 16) located on the second surface 18. It communicates with the liquid flow path 19 of the support member 10. An energy generating element 14 is formed at a position facing the pressure chamber 15 of the substrate 8. The energy generating element 14 discharges the liquid from the discharge port 6 by heating the liquid supplied to the pressure chamber 15 and generating bubbles.

  The laminate 1 is attached to the second surface 18 of the substrate 8 so that the adhesive layer 4 faces the second surface 18 and the adhesive layer 4 in the first region 4 a covers the liquid supply port 13. . The liquid supply port 13 has a substantially rectangular shape extending along the arrangement direction of the discharge port arrays, and the adhesive layer 4 in the first region 4 a is also a substantially rectangular planar shape having the same size as the liquid supply port 13. have. The stacked body 1 is aligned with the substrate 8 so that the first region 4 a coincides with the liquid supply port 13, and is attached to the substrate 8. The laminate 1 is in close contact with the substrate 8 by the second region 4 b of the adhesive layer 4. In the second region 4b, the reaction of the photocurable component does not progress so much by the first light irradiation, and has sufficient adhesion.

[Separation of element substrate 5] (see FIG. 6)
The wafer 100 is cut and the element substrate 5 is separated. Specifically, the base film 2 of the laminate 1 is mounted on a dicing apparatus (not shown), and the wafer 100 is cut by the dicing blade 20 along the boundary line between the element substrates 5 arranged in a lattice pattern. The adhesive layer 4 and the pressure-sensitive adhesive layer 3 of the laminate 1 are completely cut. The base film 2 of the laminated body 1 is not completely cut because it holds the separated element substrates 5 while maintaining the mutual positional relationship. In order to cut the pressure-sensitive adhesive layer 3 reliably, it is preferable to cut to about half the thickness of the base film 2, but it is also possible not to cut at all.

[Second light irradiation] (see FIG. 7)
Light is applied to the laminate 1 attached to the element substrate 5 from the base film 2 side (second light irradiation). That is, the second light irradiation is performed from the direction opposite to the first light irradiation, that is, the base film side, by arranging the light source 22 on the base film 2 side. Unlike the first light irradiation, the second light irradiation does not use a mask. Accordingly, light 22 a having substantially uniform irradiation energy is irradiated to the pressure-sensitive adhesive layer 3 through the light-transmitting base film 2. The light reaches the adhesive layer 4 through the pressure-sensitive adhesive layer 3 and hardens the pressure-sensitive adhesive layer 3 and the adhesive layer 4. As described above, in the first light irradiation, the first region 4a is irradiated with light having an irradiation energy larger than that of the second region 4b. Accordingly, the total irradiation energy of the light applied to the adhesive layer 4 in the first region 4a is larger than the total irradiation energy of the light applied to the adhesive layer 4 in the second region 4b. The irradiation energy in the second light irradiation is such that the adhesive layer 4 in the first region 4a is sufficiently cured and integrated with the adjacent adhesive layer 3, while the adhesive layer 4 in the second region 4b It is adjusted so that an uncured component remains at the interface with the pressure-sensitive adhesive layer 3.

[Separation of Laminate 1 from Element Substrate 5] (See FIG. 8)
The laminate 1 that has received the second light irradiation is separated from the element substrate 5. Specifically, the element substrate 5 shown in FIG. 8A is picked up as shown in FIG. The adhesive layer 4 in the first region 4 a is integrated with the pressure-sensitive adhesive layer 3, but the uncured component remains in the adhesive layer 4 in the second region 4 b and is completely integrated with the pressure-sensitive adhesive layer 3. It has not become. The pressure-sensitive adhesive layer 3 is cured and fixed to the base film 2. Therefore, when the element substrate 5 is picked up by the pins, only the adhesive layer 4 in the second region 4 b adheres to the substrate 8, and the other part of the stacked body 1 is separated from the element substrate 5.

[Bonding of element substrate 5 and support member 10] (see FIG. 9)
The element substrate 5 to which only the adhesive layer 4 in the second region 4b is attached is bonded to the support member 10 having the liquid flow path 19. Specifically, the element substrate 5 is aligned with the support member 10 so that the liquid flow path 19 of the support member 10 and the liquid supply port 13 (liquid supply path 16) of the substrate 8 communicate with each other without being displaced. . The substrate 8 is bonded to the support member 10 through the adhesive layer 4 in which uncured components remain.

[Curing Adhesive Layer 4] (See FIG. 10)
The support member 10 and the element substrate 5 bonded to the support member 10 are heated to sufficiently cure the adhesive layer 4. This step can be omitted if necessary. That is, even when the supporting member 10 and the element substrate 5 bonded to the supporting member 10 are left untreated, the adhesive layer 4 is cured with time. However, the time required for curing can be shortened by heating the adhesive layer 4.

Next, the light sources 11 and 22, the pressure-sensitive adhesive layer 3, the adhesive layer 4, and the base film 2 used in this embodiment will be described in more detail.
[Light sources 11, 22]
The light sources 11 and 22 used in the present embodiment can be arbitrarily selected according to the curing reaction start wavelength of the photocurable resin composition. For example, as a low wavelength light source, a low pressure mercury lamp: a wavelength of 185 to 254 nm, a high pressure mercury UV (ultraviolet) lamp: a wavelength of 365 nm, a metal halide UV lamp: a wavelength of 200 to 400 nm, an excimer lamp, an ultra high pressure UV lamp, or the like can be selected. You may use UV-LED light source with little temperature rise of an irradiation part. In the first light irradiation, it is necessary to cure the first region 4a of the adhesive layer 4 more than the second region 4b. Therefore, it is necessary to prevent the diffusion of the curing reaction due to the positional accuracy of the irradiation range and heat. For this reason, it is preferable to use a UV-LED light source that emits short wavelength light near the reaction wavelength, rather than a lamp having a wide wavelength distribution. In the second light irradiation, light is irradiated onto the entire surface of the wafer 100 at a time, so it is desirable to use a light source in which a large number of LED elements are arranged in the same plane. Alternatively, the light source may be scanned to irradiate the entire surface of the wafer 100 with light having a required irradiation energy.

[Adhesive layer 3]
The pressure-sensitive adhesive layer 3 used in the present embodiment may be a liquid film or a semi-solid film as long as it contains a photocurable resin composition. In order to enable adhesion in a short time, it is desirable to use a (meth) acrylic copolymer, a photo radical generator, and an adhesive that cures by an ionic polymerization reaction mechanism. “(Meth) acryl” means acryl or methacryl corresponding to it. As an adhesive that is cured by an ion polymerization reaction mechanism, for example, a UV curable resin composition such as a UV cation epoxy resin composition can be suitably used. The pressure-sensitive adhesive layer 3 contains a basic composition of an epoxy resin, a photoinitiator, and a reactive diluent. In order to adjust curability and fluidity, a filler such as a thixotropic agent, a silane coupling agent, and a sensitizer may be appropriately added to the pressure-sensitive adhesive layer 3.

[Adhesive layer 4]
Similarly to the pressure-sensitive adhesive layer 3, the adhesive layer 4 may be a liquid film or a semi-solid film as long as it contains a photocurable resin composition. In order to enable adhesion in a short time, it is desirable to use a (meth) acrylic copolymer, a photo radical generator, and an adhesive that cures by an ionic polymerization reaction mechanism. As an adhesive that is cured by an ion polymerization reaction mechanism, for example, a UV curable resin composition such as a UV cation epoxy resin composition can be suitably used. Among the UV cationic epoxy resin compositions, it is preferable to use a resin composition having delayed curing properties. The adhesive layer 4 includes a basic composition of an epoxy resin, a photoinitiator, and a reactive diluent. In order to adjust curability and fluidity, a filler such as a thixotropic agent, a silane coupling agent, and a sensitizer may be appropriately added to the adhesive layer 4.

[Base film 2]
As the base film 2 on which the pressure-sensitive adhesive layer 3 and the adhesive layer 4 are laminated, for example, a plastic film such as a polyethylene film, a polypropylene film, polyethylene terephthalate, or an ethylene (meth) acrylic acid copolymer film is used. 30-250 micrometers is preferable and, as for the thickness of the base film 2 which consists of these plastic films, 50-220 micrometers is more preferable. The surface on which the pressure-sensitive adhesive layer 3 of the base film 2 is laminated can be subjected to plasma treatment, corona discharge treatment, primer treatment or the like in order to improve adhesion. In order to cure the photocurable resin composition of the pressure-sensitive adhesive layer 3 efficiently, it is preferable that the transparency of the base film 2 is high.

  As described above, according to this embodiment, at least two times of light irradiation (exposure) are performed on the element substrate 5 to which the multilayer body 1 is attached. By selectively curing the first region 4a of the adhesive layer 4 by multiple times of light irradiation, the adhesive layer 4 in the first region 4a and the first and second regions can be separated when the element substrate 5 is separated. The pressure-sensitive adhesive layer 3 in the regions 4 a and 4 b (that is, the entire region) can be separated from the element substrate 5 at once. The adhesive layer 4 in the second region 4b attached to or remaining on the element substrate 5 starts the reaction of the photocurable component by the first light irradiation attenuated by the mask 12 and the second light irradiation. Curing is progressing to some extent. Therefore, the shape does not change greatly when the element substrate 5 is bonded to the support member 10. Accordingly, the possibility that the adhesive layer 4 protrudes from the liquid supply path 16 of the substrate 8 or the liquid flow path 19 of the support member 10 during the bonding is reduced.

  Since this embodiment is intended for the wafer 100 on which a large number of element substrates 5 are formed, a process of cutting the wafer 100 and separating the element substrates 5 into individual pieces is performed. However, it is also possible to first cut the wafer 100 and bond the separated element substrate 5 to the support member 10 by the method described above. Note that the singulation step is not limited to the example of the present embodiment, and can be performed between the step of attaching the laminate 1 and the step of separating the laminate 1 from the element substrate 5.

  In the technique disclosed in Patent Document 1, light irradiation is performed from the semiconductor chip side. Similarly, in the second light irradiation step of the present embodiment, light irradiation is performed from the discharge port forming member 7 side of the element substrate 5. It is possible to do it. In this case, it is conceivable that light is introduced into the liquid supply path 16 of the substrate 8 through the discharge port 6 and light is applied to the adhesive layer 4 in the first region 4 a immediately below the liquid supply port 13. However, the discharge port 6 and the liquid supply path 16 are connected via the pressure chamber 15, and the flow path is bent as a whole (see FIG. 2). Further, since the discharge port 6 itself is also a very small opening, it is very difficult to uniformly irradiate the entire surface of the adhesive layer 4 in the first region 4a with light introduced from the discharge port 6. Further, since the adhesive layer 4 in the second region 4b is completely shielded by the discharge port forming member 7 and the substrate 8, it is impossible to irradiate the adhesive layer 4 in the second region 4b with light. is there.

  Further, the discharge port forming member 7 is formed of an organic polymer material, and when irradiated with light, it absorbs irradiation energy and generates heat due to molecular motion generated thereby. As a result, the organic polymer material forming the discharge port forming member 7 is damaged due to heat damage. Even if light irradiation is performed through a mask so as not to irradiate a portion other than the discharge port 6, a deviation occurs in the irradiated portion due to variations in the size of the discharge port forming member 7, diffraction of light, and the like. Therefore, it is extremely difficult to selectively irradiate the adhesive layer 4 in the first region 4a with light without causing thermal damage to the discharge port forming member 7. On the other hand, in this embodiment, since light is irradiated from the base film 2 side, the adhesive layer 4 in the first region 4 a can be evenly irradiated with light, and the discharge port forming member 7 is formed. Less likely to cause heat damage to organic polymer materials.

[Example]
Examples will be described below. A base film 2 was prepared by cutting a polyester film having a thickness of 160 μm along an 8-inch wafer 100 on which a large number of element substrates 5 were formed. Next, the photocurable resin composition used as the material of the adhesive layer 3 was prepared. Specifically, a mixture in which a photocurable acrylate monomer and a photoinitiator were mixed at a ratio of 100 parts by mass / 0.5 part by mass was prepared. To this mixture, 45 parts by mass of silica filler was added, and 20 parts by mass of (meth) acrylic acid copolymer was added in order to increase the viscosity and adhesive strength. The photocurable resin composition thus obtained was applied on the base film 2 with a uniform film thickness of 120 μm. An appropriate spinner or die coater was used according to the viscosity of the photocurable resin composition. Next, the photocurable resin composition used as the material of the adhesive bond layer 4 was prepared. Specifically, a UV cation epoxy resin composition, a photoinitiator, and spherical silica particles as a filler are mixed at a ratio of 100 parts by mass, 0.5 part by mass, and 200 parts by mass, respectively, to obtain a photocurable resin composition. Created. This photocurable resin composition was applied onto the pressure-sensitive adhesive layer 3 with a thickness of 150 μm. The laminated body 1 was obtained by the above (refer FIG. 3).

Next, the mask 12 was arrange | positioned at the adhesive bond layer 4 side of the laminated body 1, and 1st light irradiation was performed. The UV-LED light source 11 applies an irradiation energy of 1000 mJ / cm ² from the UV-LED light source 11 to the first region 4a using the mask 12 that shields the region other than the first region 4a corresponding to the liquid supply port 13 of the element substrate 5. Light was irradiated (see FIG. 4). Next, the 8-inch wafer 100 on which the element substrate 5 was formed was bonded to the laminate 1 (see FIG. 5). Next, the base film 2 of the laminate 1 is fixed to a dicing apparatus, the dicing blade 20 is inserted into the wafer 100 from the discharge port forming member 7 side, and the wafer 100 is cut along the arrangement pattern of the element substrate 5. The board | substrate 5 was separated into pieces (refer FIG. 6). Next, the entire surface was irradiated with UV light from the base film 2 side to perform second light irradiation, and the pressure-sensitive adhesive layer 3 was cured (see FIG. 7). A high pressure mercury lamp light source was used as the light source 22, and the irradiation energy was 1500 mJ / cm ² . This irradiation energy is large enough to cure the pressure-sensitive adhesive layer 3 and initiate the photocuring reaction of the adhesive layer 4. Irradiation energy needs to be appropriately changed according to the thickness of the pressure-sensitive adhesive layer 3 and the adhesive layer 4. Next, the element substrate 5 was picked up by the pins 23 to obtain the element substrate 5 to which the adhesive layer 4 in the second region 4b was adhered (see FIG. 8). The element substrate 5 was mounted on the support member 10 (see FIG. 9). Although the adhesive is cured even if left as it is, considering the process tact, the support member 10 and the element substrate 5 are heated to completely cure the adhesive layer 4 (see FIG. 10).

DESCRIPTION OF SYMBOLS 1 Laminated body 2 Base film 3 Adhesive layer 4 Adhesive layer 4a 1st area | region 4b 2nd area | region 5 Element substrate 7 Discharge port formation member 8 Substrate 10 Support member

Claims (6)

A pressure-sensitive adhesive layer containing the first photocurable resin composition, a base film laminated on one surface of the pressure-sensitive adhesive layer, and the other of the pressure-sensitive adhesive layer containing the second photocurable resin composition The laminate having the adhesive layer laminated on the surface of the adhesive layer is irradiated with light having a larger irradiation energy than the second region, which is a region other than the first region, in the first region of the adhesive layer. And performing the first light irradiation from the adhesive layer side so that the first region can be cured to such an extent that the shape can be maintained;
A substrate having a first surface and a second surface which is a back surface of the first surface, and a liquid supply port of a liquid supply path to which a liquid is supplied is provided on the second surface; and the liquid The adhesive layer faces the second surface on the second surface of the substrate of the element substrate having a discharge port forming member having a discharge port for discharging the liquid crystal, and bonded to the first surface. A step of affixing the laminate subjected to the first light irradiation so that the adhesive layer in the first region covers the liquid supply port;
The element substrate so that the adhesive layer in the first region is integrated with the pressure-sensitive adhesive layer, and the uncured component remains at the interface between the adhesive layer in the second region and the pressure-sensitive adhesive layer. Performing a second light irradiation from the base film side to the laminate adhered to the substrate,
Separating the laminate subjected to the second light irradiation from the element substrate so that only the adhesive layer in the second region adheres to the substrate;
The element substrate to which only the adhesive layer in the second region is attached is attached to a support member having the liquid flow path for the liquid so that the liquid flow path and the liquid supply path of the substrate communicate with each other. And a step of combining the liquid ejection head.   A plurality of element substrates are formed on a wafer, and the step of cutting the wafer and separating the element substrate between the step of attaching the laminate and the step of separating the laminate from the element substrate The method for manufacturing a liquid discharge head according to claim 1, comprising:   The method for manufacturing a liquid ejection head according to claim 1, wherein the second photocurable resin composition of the adhesive layer is a UV curable resin composition.   4. The method of manufacturing a liquid ejection head according to claim 1, wherein the first region of the adhesive layer has the same shape and size as the liquid supply port of the substrate. 5.   5. The method for manufacturing a liquid ejection head according to claim 1, further comprising a step of curing the adhesive layer after the step of bonding.   6. The liquid ejection head according to claim 1, wherein, in the first light irradiation, the adhesive layer is irradiated with light so that the second region can maintain a shape. 6. Method.

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