JP2016030318A - Film processing method and film processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film processing method and a film processing device that can properly remove punching waste formed in punching processing on a film from a punching blade.SOLUTION: Punching waste is removed by bonding an adhesion part 102 to punching waste 105 formed in punching processing and relatively moving the adhesion part and a punching blade 7. A bonding process includes making the adhesion part adhesive at a position corresponding to the punching waste and bonding the punching waste to the adhesion part. The adhesion part is made of thermoplastic resin and heated by heating means 5 in a region, corresponding to the punching waste, of the adhesion part to make the region adhesive.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a film processing method and a film processing apparatus for punching a film using a punching blade.

  Conventionally, as a method of forming a hole in a film made of a thermoplastic resin, the film is punched with a heated hole forming pin, and punching waste generated inside the punching blade when the hole is formed is removed by a vacuum suction means. The method is known.

JP-A-9-103996

  However, in the above-described punching scrap removal method, it is necessary to provide discharge holes (pores) for sucking and discharging punching scraps on the base that supports the film. It must be designed larger than the punched shape. This increase in the design size of the discharge holes is a detrimental effect when a large number of finely punched holes are laid out at a narrow pitch.

  The present invention is excellent in the performance of removing punching scraps, and is capable of properly removing punching scraps even when punching fine holes laid out at a narrow pitch. The purpose is to provide a processing device.

In order to achieve the above object, the present invention has the following configuration.
That is, in the first embodiment of the present invention, a punching process of pressing a punching blade against the film to be processed and punching the film to be processed, an adhesion process of bonding an adhesive portion to the punching waste formed by the punching process, and And a removing step of removing the punching scraps by relative movement between the bonding portion and the punching blade.

  Further, the second form of the present invention is a punching means for punching the processed film by pressing a punching blade against the processed film, an adhesive means for bonding an adhesive portion to the punched waste formed by the punching means, A film processing apparatus comprising: a removing unit that removes the punching scraps by relative movement between the bonding portion and the punching blade.

  According to the present invention, it is possible to obtain high removal performance with respect to punching waste generated by punching processing, and even when punching processing of fine holes laid out in large numbers at a narrow pitch, It becomes possible to remove.

It is a cross-sectional model drawing which shows the punching apparatus of the film of 1st Embodiment. It is a cross-sectional model drawing which shows the punching process process of the film by 1st Embodiment. It is a cross-sectional model drawing which shows the punching process of the film by 2nd Embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(First embodiment)
FIG. 1 is a schematic sectional view showing a film processing apparatus 1 in the first embodiment of the present invention. The film processing apparatus 1 shown here is a punching apparatus for punching a film, and includes an upper film feeding mechanism 10 for feeding the upper film 110, a lower film feeding mechanism 20 for feeding the lower film 120, Is provided. The upper film 110 includes a first support 101 and a first adhesive layer (adhesive portion) 102 bonded to one surface (lower surface) of the first support 101. The lower film 120 includes a second support 103 and a second adhesive layer 104 bonded to one surface (lower surface) of the second support 103. This lower film 120 is a film to be processed to be punched as described later.

  A lower film feeding mechanism (hereinafter referred to as a lower feeding mechanism) 20 is a mechanism for feeding a lower film 120 as a film to be processed along the lower feeding path 19. The lower feeding mechanism 20 includes a roll-shaped lower film feeding unit 17 (hereinafter referred to as a lower feeding unit) equipped with a belt-like lower film 120, and a lower film winding unit 18 (hereinafter referred to as a lower winding) that winds the lower film 120. It is called Totoribu). The lower feeding unit 17 and the lower winding unit 18 are rotated by a driving force of a motor (not shown). The lower feeding unit 17 feeds the lower film 120 along the flat lower feeding path 19 in the Y2 direction (feeding direction), and the lower winding unit 18 winds the lower film 120 fed from the lower feeding unit 17.

  On the other hand, the upper feed mechanism 10 includes a roll-shaped upper film feed section (hereinafter referred to as an upper feed section) 14 equipped with a belt-like upper film 110 and an upper film take-up section (hereinafter referred to as an upper roll). 15). The upper feed unit 14 and the upper winding unit 15 are rotated by a motor (not shown). The upper feeding unit 14 feeds the upper film 110 along the upper feeding path 16 in the upper film feeding direction (upward feeding direction) Y1, and the upper winding unit 15 winds up the upper film 110 fed from the upper feeding unit 14. I do.

  The upper feed path 16 is a path that is bent at two locations by the pinch rollers 21 and 22 that are in contact with the upper surface of the upper film 110. The position where the upper film 110 is bent by the pinch roller 21 is a position where the first adhesive layer 102 of the upper film 110 starts to contact the upper surface of the second support 103 of the lower film 120 (contact start position). . Further, the position where the upper film 110 is bent by the pinch roller 22 is a position where the first adhesive layer 102 begins to peel from the second support surface (peeling start position). Note that a peeling jig 3 for assisting the first adhesive layer 102 to peel from the second support 103 is provided at the peeling start position.

  In the film punching apparatus 1 according to the present embodiment, a heater unit (heating means) 5 is installed between the upper film feeding unit 14 and the upper film winding unit 15 so as to be moved up and down by a heater lifting / lowering mechanism (not shown). Has been. A punching blade 7 is installed directly below the heater unit 5 with the upper film 110 and the lower film 120 sandwiched therebetween. In this embodiment, a flexible pinnacle die (registered trademark) manufactured by Tsukaya Cutlery Co., Ltd. is used as the punching blade 7. This flexible pinnacle die has a punching frame 6 in which a cutting edge of an etching blade is formed sharply, and is set on a stage 8 made of a magnet. The stage 8 can be moved up and down by a stage lifting mechanism (not shown), and the punching blade 7 moves up and down together with the stage 8.

  In the vicinity of the heater unit 5, an alignment camera 2 is installed that is used for alignment so that the central axis of the heater unit 5 and the central axis of the punching frame 6 coincide with each other during film punching. The shapes of the heater unit 5, the punching frame 6, and the punching blade 7 can be arbitrarily changed depending on the shape of the punching pattern.

  2A to 2D are schematic cross-sectional views showing a film punching process according to this embodiment. As shown in FIG. 2A, a lower film 120 is disposed below the upper film 110 between the heater unit 5 and the punching blade 7. That is, between the heater unit 5 and the punching blade 7, the first support 101, the first adhesive layer 102, the second support 103, and the second adhesive layer 104 are provided from above (the heater unit 5). Are arranged sequentially (from the side).

  The first support 101 that supports the first adhesive layer 102 uses a thin film film made of a synthetic resin, but preferably has a heat resistance of 140 ° C. or higher. Here, a film formed of polyethylene terephthalate is used. I am using it. In addition, a thermoplastic resin mainly composed of polyethylene is used for the first adhesive layer 102, but it is desirable to use a thermoplastic resin film that exhibits adhesiveness at 110 ° C. or lower.

  The second support 103 may be made of the same material as the first support 101. More preferably, in order to prevent the heat transmitted from the heater unit 5 from being transferred to the second adhesive layer 104 during the punching process, It is desirable to use a material having heat insulating properties. In this embodiment, the second adhesive layer 104 uses a thermoplastic resin having a melting point of 140 ° C. mainly composed of polypropylene, but is not limited to this, and the first adhesive layer 102 has. A film made of a thermoplastic resin having a melting point higher than the melting point may be used.

A film punching operation performed by the punching apparatus having the above-described configuration will be described with reference to FIGS.
FIG. 2A shows a state in which the heater unit 5 is held in the raised position and the stage 8 on which the punching blade 7 is set is held in the lowered position. When performing the punching process, first, the lower feeding unit 17 and the lower winding unit 18 of the lower feeding mechanism 20 are rotated to feed the lower film 120 along the feeding direction (Y2 direction), and a portion to be subjected to the punching process is determined. The punching blade 7 is positioned on the punching frame 6. At the same time, the upper feed portion 14 and the upper take-up portion 15 of the upper feed mechanism 10 are also rotated, and the upper film 110 is fed in the feed direction (Y1 direction) along the feed path 16 to perform a predetermined punching process. The location is positioned at the punching position on the punching blade 7.

  When the upper film 110 and the lower film 120 are sent to a predetermined punching position, the control means controls a motor (not shown), and the upper feeding unit 14, the upper winding unit 15, the lower feeding unit 17, and the lower winding unit 18 are controlled. At the same time.

  Subsequently, the control means drives the stage elevating mechanism to raise the stage, and as shown in FIG. 2B, the punching blade 7 is relatively moved upward relative to the second adhesive layer 104 of the lower film 120 ( And stop at a predetermined position. As for the rising stop position of the punching blade 7, the back surface height position 104a of the second adhesive layer 104 is detected in advance by a displacement sensor so that the gap of the punching blade 7 with respect to the second adhesive layer 104 becomes a predetermined setting. Set to. The gap is set in advance so that the tip of the punching blade 7 does not exceed the position of the back surface height position 104a.

  Further, the control means controls the heater raising / lowering mechanism, lowers the heater unit 5 in accordance with the rise and stop of the punching blade 7, and presses the heater unit 5. The temperature of the heater unit 5 needs to be set within a range that exceeds the melting point of the first adhesive layer 102 and does not exceed the melting point of the second adhesive layer 104. In the present embodiment, the temperature of the heater unit 5 is set to 120 ° C.

  The lowering stop position of the heater unit 5 is 10% to 50% of the thickness of the first adhesive layer 102, the thickness of the second support 103, and the second height position 104a of the adhesive layer 104. The heater unit 5 is set to stop at a position where the thickness of the adhesive layer 104 is added. In this embodiment, since the thickness of each of the first adhesive layer 102, the second support body 103, and the second adhesive layer 104 is 0.05 mm, the back surface height position 104a of the adhesive layer 104 is set to 0. The heater unit 5 is stopped at a position where 105 to 0.125 mm is added. That is, the cutting edge of the punching frame 6 penetrates the second adhesive layer 104 and the second support 103 and does not cross the interface between the first support 101 and the first adhesive layer 102. Set the dimensions.

  After the heater unit 5 is stopped at the lowering stop position, the state is maintained for a predetermined time (4 sec or more in the present embodiment), and the first heat heater 5 is heated to apply heat to the first inside the punching frame 6. The adhesive layer 102 and the second support 103 are thermocompression bonded. The holding time in this heating step may be appropriately changed depending on the thickness and melting point of the first adhesive layer 102, the set temperature conditions of the heater unit 5, and the like.

  After the holding time has elapsed, the control means drives the heater lifting mechanism to raise the heater unit 5 as shown in FIG. 2C, and drives the stage lifting mechanism to lower the punching blade 7. At this time, in the case of a conventional punching apparatus, most of the second support 103 and the second adhesive layer 104 punched by the punching frame 6 remained inside the punching frame 6 as the scrap 105. However, in the present embodiment, the first adhesive layer 102 and the second support 103 on the punching frame 6 are regions corresponding to the inner region of the punching frame 6, that is, the region where the punching scraps 105 are formed. It is designed to be thermocompression bonded. For this reason, when the punching frame 6 is lowered together with the punching blade 7, most of the punching waste 105 formed on the punching frame 6 adheres to the first adhesive layer 102. Therefore, in the present embodiment, the amount of the punching scraps 105 remaining inside the punching frame 6 after punching is greatly reduced, and the maintenance work for removing the punching scraps 105 from the punching blade 7 is also reduced. You can expect improved productivity.

  Moreover, in this embodiment, the time which cools the 1st contact bonding layer 102 located inside the punching frame 6 and the thermocompression bonding part of the 2nd support body 103 after the above-mentioned heating process is provided. According to this, it can suppress that the 1st contact bonding layer 102 which expressed adhesiveness adheres to the unnecessary part of the lower film 120. FIG.

  Further, when the upper film 110 is peeled from the lower film 120 after the above-described punching process and heating process are finished, the punching waste 105 adhered to the first adhesive layer 102 also moves together with the upper film 110, and the lower film 120. Removed from the product part. Thereafter, the upper film 110 is taken up by the upper winding unit 15, and the lower film 120 is taken up by the lower winding unit 18. In addition, when using the upper film 110 as a disposable member, what is necessary is just to make it wind up to the upper winding part 15 with the state which hold | maintains the punching waste. Further, if the punching scraps adhering to the upper film 110 are removed with a blade or the like and then wound on the upper winding portion 15, the upper film 110 can be reused.

  As described above, in this embodiment, punching of fine holes laid out at a narrow pitch is performed in order to bond the punching waste formed inside the punching frame 6 to the first adhesive layer 102 of the upper film 110. Even in the case of applying, it becomes possible to properly remove the punching waste.

(Second Embodiment)
Next, a second embodiment of the present invention will be described. In the second embodiment, the punching waste 105 is removed in accordance with the steps shown in FIGS. The punching apparatus according to the second embodiment also has the configuration shown in FIG. 1 as in the first embodiment. That is, the configurations of the first support 101, the second support 103, and the second adhesive layer 104, and the configurations of the film feeding mechanisms 10 and 20 shown in FIG. Since it is the same as that of a form, detailed description is abbreviate | omitted.

  In this second embodiment, an adhesive film coated with an ultraviolet curable adhesive resin is used as the first adhesive layer supported by the first support 101 of the upper film 210. Is different from the first embodiment. In the present embodiment, the thickness of the first adhesive layer 202 is 0.05 mm, but this thickness can be changed as appropriate. In the second embodiment, instead of the heater unit 5 of the first embodiment, a cylindrical pressing roller (pressing means) 9 is moved up and down and moved along the feed path 16. A pressing roller unit having a roller moving mechanism (not shown) is used.

  Further, as shown in FIG. 3B, in the second embodiment, the control means drives the stage lifting mechanism to raise the punching blade 7, while the pressing roller 9 moves in accordance with the raising of the punching blade 7. Is to be lowered. Further, the control means controls to move (roll) on the first support 101 along the path 16 while pressing the punching target range of the lower film 120 with the pressing roller 9. In addition, about the raising stop position of the punching blade 7, since it is the same as that of 1st Embodiment, description is abbreviate | omitted.

The lowering stop position of the pressing roller 9 is pressed to a position where 0.105 to 0.125 mm is added to the back surface height position 104a of the second adhesive layer 104, similarly to the heater unit 5 of the first embodiment. The lowermost portion of the outer peripheral portion of the roller 9 is set to be positioned. The pressing pressure of the pressing roller 9 against the upper film 210 may be a pressure at which the first adhesive layer 202 and the second support 103 are pressure-bonded. In the second embodiment, pressurization with a pressure of 0.5 kgf / cm ² is performed.

  Further, in the second embodiment, as shown in FIG. 3C, an ultraviolet lamp 30 and a mask 32 that partially blocks light emitted from the ultraviolet lamp are arranged above the upper film. Has been. The mask 32 is formed with a light shielding portion 32 a that blocks ultraviolet rays and a light transmitting portion 32 b that allows ultraviolet rays to pass therethrough, and the light shielding portions 32 a are formed at positions corresponding to the inside of the punching frame 6. For this reason, the ultraviolet light is not irradiated to the part corresponding to the area | region inside the punching frame 6 among the 1st contact bonding layers 202, and adhesiveness is maintained.

On the other hand, in the region corresponding to the region outside the punching frame 6 in the first adhesive layer 202, that is, in the region other than the region where the punching waste 105 is formed, the ultraviolet rays emitted from the ultraviolet lamp 30 are applied to the mask 32. Irradiation is performed through the light transmitting portion 32 b and the first support 101. Thus, the adhesiveness at the interface between the first adhesive layer 202 and the second support 103 is attenuated in the portion irradiated with the ultraviolet rays in the first adhesive layer 202 by the ultraviolet curing action. In the present embodiment, the ultraviolet irradiation amount to the first adhesive layer 202 is set to 600 mj / cm ² , but the ultraviolet irradiation amount is not limited to this and is appropriately changed depending on the thickness of the first adhesive layer 202. Is possible.

  After the ultraviolet irradiation process, the punching blade 7 is lowered and detached from the lower film 120. At this time, the punching waste 105 formed on the inside of the punching frame 6 of the punching blade 7 is held by being bonded to the first adhesive layer 202 and does not remain inside the punching frame 6. When the punching blade 7 is lowered, the upper film 210 and the lower film 120 are sent in the feeding directions Y1 and Y2, and the upper film 210 is peeled from the lower film 120 at the peeling start position as shown in FIG. . When the upper film 210 is peeled from the lower film 120, the punching waste 105 bonded to the first adhesive layer 202 also moves together with the upper film 110 and is removed from the product portion of the lower film 120.

  As described above, according to the second embodiment, the punching waste 105 generated in the punching frame 6 is bonded to the first adhesive layer 202 of the upper film 210. Similarly, it is possible to appropriately remove the punching waste 105.

  Furthermore, in the second embodiment, the portion of the first adhesive layer 202 that should be adhered to the second support 103 can be accurately specified by the mask 32. Accordingly, the first adhesive layer 202a can be accurately adhered to the portion where the punching waste 105 is formed, and the first adhesive layer 202 can be prevented from adhering to the product portion. High quality processed products can be obtained.

(Other embodiments)
In each of the above embodiments, a case has been shown in which the inner region of the punching blade becomes punching scraps in the lower film, which is a film to be processed. In some cases, the present invention is applicable. That is, when the region where the punching waste is formed is outside the punching blade, the adhesive portion is adhered to this, and the adhesive portion and the punching blade are moved relative to each other, so that the punching waste is appropriately removed from the punching blade. It is possible.

  In the above embodiment, Pinnacle Die (registered trademark) is used as the punching blade. However, other Thomson types can also be used as the punching blade, and the present invention is applicable to various punching processes using the punching blade. Applicable.

  Furthermore, in the said embodiment, the example which uses the 1st contact bonding layer in a strip | belt-shaped upper film was shown as an adhesion part made to adhere to stamping waste. However, the bonding portion of the present invention is not particularly limited as long as it can adhere to the punching waste and can bond and hold the punching waste in the relative movement with the punching blade.

DESCRIPTION OF SYMBOLS 1 Film processing apparatus 5 Heater unit 7 Punching blade 9 Pressing roller 10 Upper feed mechanism 20 Lower feed mechanism 30 UV lamp 31 UV 32 Mask 101 1st support body 102 1st contact bonding layer 103 2nd support body 104 2nd support body 104 Adhesive layer 105 Punching waste 110 Upper film 120 Lower film (film to be processed)

Claims (11)

A punching process of punching the processed film by pressing a punching blade against the processed film;
An adhering step for adhering an adhesive portion to the punched waste formed by the punching step;
And a removing step of removing the punching scraps by relative movement between the adhesive portion and the punching blade. The adhesive portion is a first adhesive layer that is brought into contact with one surface of the processed film,
2. The film processing method according to claim 1, wherein the bonding step causes the first adhesive layer to exhibit adhesiveness at a position corresponding to the punched waste to adhere the punched waste to the first adhesive layer. The first adhesive layer is a thermoplastic resin,
3. The film processing method according to claim 2, wherein in the bonding step, heat is applied to a region corresponding to the punched waste in the first bonding layer by a heating unit to develop adhesiveness in the region.   The method for processing a film according to claim 3, wherein the first adhesive layer is cooled after the first adhesive layer is heated.   The film processing method according to any one of claims 1 to 4, wherein the melting point of the second adhesive layer is higher than the melting point of the first adhesive layer. The first adhesive layer is an ultraviolet curable adhesive resin,
2. The film according to claim 1, wherein the bonding step irradiates a region other than a region corresponding to the punched waste in the first adhesive layer, and irradiates a region corresponding to the punched waste with ultraviolet light. Processing method.   The film according to any one of claims 1 to 6, wherein the bonding step includes a step of pressing so that at least a region corresponding to the punched waste in the first adhesive layer is pressed against the punched waste. Processing method.   The film processing method according to claim 1, wherein the film to be processed includes a second support and a second adhesive layer provided on one surface of the second support.   9. The film processing method according to claim 1, wherein in the bonding step, the bonding portion is bonded to punching waste remaining inside the punching blade in the punching step. Punching means for punching the processed film by pressing a punching blade against the processed film;
An adhering means for adhering an adhesive portion to the punched waste formed by the punching means;
A film processing apparatus comprising: removal means for removing the punching scraps by relative movement between the adhesive portion and the punching blade. The adhering means has a first film comprising a first support having a band shape and an adhesive layer formed on one surface of the support,
The film to be processed has a second film comprising the second support and an adhesive layer provided on one surface of the second support,
The film processing apparatus according to claim 10, further comprising moving means for moving the first adhesive layer of the first film and the second support of the second film while being in contact with each other.

Images