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JP2016030364A - 貼り合わせ基板の分断方法及び分断装置 - Google Patents

貼り合わせ基板の分断方法及び分断装置 Download PDF

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Publication number
JP2016030364A
JP2016030364A JP2014152902A JP2014152902A JP2016030364A JP 2016030364 A JP2016030364 A JP 2016030364A JP 2014152902 A JP2014152902 A JP 2014152902A JP 2014152902 A JP2014152902 A JP 2014152902A JP 2016030364 A JP2016030364 A JP 2016030364A
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JP
Japan
Prior art keywords
bonded substrate
dividing
scribe line
substrate
elastic body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014152902A
Other languages
English (en)
Japanese (ja)
Inventor
村上　健二
Kenji Murakami
健二 村上
武田　真和
Masakazu Takeda
真和 武田
久司 五十川
Hisaji Isokawa
久司 五十川
栗山　規由
Noriyoshi Kuriyama
規由 栗山
多市 橋本
Taichi Hashimoto
多市 橋本
健太 田村
kenta Tamura
健太 田村
護 秀島
Mamoru Hideshima
護 秀島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2014152902A priority Critical patent/JP2016030364A/ja
Priority to KR1020150047227A priority patent/KR20160013795A/ko
Priority to TW104114609A priority patent/TWI686279B/zh
Priority to CN201510350983.6A priority patent/CN105304562A/zh
Publication of JP2016030364A publication Critical patent/JP2016030364A/ja
Pending legal-status Critical Current

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Classifications

    • H10P54/00—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10P72/0428—

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
JP2014152902A 2014-07-28 2014-07-28 貼り合わせ基板の分断方法及び分断装置 Pending JP2016030364A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014152902A JP2016030364A (ja) 2014-07-28 2014-07-28 貼り合わせ基板の分断方法及び分断装置
KR1020150047227A KR20160013795A (ko) 2014-07-28 2015-04-03 접합 기판의 분단 방법 및 분단 장치
TW104114609A TWI686279B (zh) 2014-07-28 2015-05-07 貼合基板之分斷方法及分斷裝置
CN201510350983.6A CN105304562A (zh) 2014-07-28 2015-06-23 贴合基板的分断方法及分断装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014152902A JP2016030364A (ja) 2014-07-28 2014-07-28 貼り合わせ基板の分断方法及び分断装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016036917A Division JP6114422B2 (ja) 2016-02-29 2016-02-29 貼り合わせ基板の分断装置

Publications (1)

Publication Number Publication Date
JP2016030364A true JP2016030364A (ja) 2016-03-07

Family

ID=55201635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014152902A Pending JP2016030364A (ja) 2014-07-28 2014-07-28 貼り合わせ基板の分断方法及び分断装置

Country Status (4)

Country Link
JP (1) JP2016030364A (zh)
KR (1) KR20160013795A (zh)
CN (1) CN105304562A (zh)
TW (1) TWI686279B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210014067A (ko) 2019-07-29 2021-02-08 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 분단 방법

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015221739A (ja) * 2014-05-23 2015-12-10 株式会社ジャパンディスプレイ 表示装置の製造方法
KR101656337B1 (ko) * 2016-03-16 2016-09-13 제너셈(주) 싱귤레이터
KR101656342B1 (ko) * 2016-03-16 2016-09-23 제너셈(주) 싱귤레이터
KR102579235B1 (ko) * 2017-10-27 2023-09-14 미쓰보시 다이야몬도 고교 가부시키가이샤 메탈막 부착 기판의 분단 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011121817A (ja) * 2009-12-10 2011-06-23 Seiko Instruments Inc 接合ガラスの切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計
JP2013247147A (ja) * 2012-05-23 2013-12-09 Hamamatsu Photonics Kk 加工対象物切断方法、加工対象物、及び、半導体素子

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124537A (ja) * 1998-10-21 2000-04-28 Sharp Corp 半導体レーザチップの製造方法とその方法に用いられる製造装置
JP5187421B2 (ja) * 2010-11-30 2013-04-24 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法
JP2012206869A (ja) * 2011-03-29 2012-10-25 Seiko Instruments Inc ガラス体の切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計
WO2013009833A1 (en) * 2011-07-11 2013-01-17 King Abdullah University Of Science And Technology Integrated circuit manufacturing for low-profile and flexible devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011121817A (ja) * 2009-12-10 2011-06-23 Seiko Instruments Inc 接合ガラスの切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計
JP2013247147A (ja) * 2012-05-23 2013-12-09 Hamamatsu Photonics Kk 加工対象物切断方法、加工対象物、及び、半導体素子

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210014067A (ko) 2019-07-29 2021-02-08 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 분단 방법

Also Published As

Publication number Publication date
KR20160013795A (ko) 2016-02-05
TWI686279B (zh) 2020-03-01
CN105304562A (zh) 2016-02-03
TW201603980A (zh) 2016-02-01

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