JP2016018821A - Method of manufacturing semiconductor device, semiconductor device, and lead frame - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the tip positions of a plurality of lead terminals from varying, even if bent parts are formed in the plurality of lead terminals projecting from a sealing portion, when a semiconductor device is manufactured, and to prevent other part of a lead frame from being distorted.SOLUTION: In a method of manufacturing a semiconductor device, a lead frame 10 where the second ends of a plurality of strip-like lead terminals 11, arranged in the width direction, are coupled by strip-like coupling portions 13 is prepared. After sealing the first ends of the plurality of lead terminals 11 in the longitudinal direction into the seal portion 3, bent parts of corrugated shape are formed in the way of the plurality of lead terminals 11 in the longitudinal direction. Thereafter, the plurality of lead terminals 11 are separated individually by cutting off the coupling portions 13.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a semiconductor device manufacturing method, a semiconductor device, and a lead frame.

   In a conventional semiconductor device, for example, as in Patent Document 1, a semiconductor element and one end portion of a plurality of lead terminals (pin terminals) in a longitudinal direction are electrically connected, and one end portion of the semiconductor element and the plurality of lead terminals is connected. Some are sealed by a sealing part (case). In this type of semiconductor device, a plurality of lead terminals protruding outside the sealing portion are arranged in a line.

   Patent Document 1 discloses a semiconductor device in which a bent portion is formed at an intermediate portion in the longitudinal direction of a lead terminal. In such a configuration, in the state where the other end portion of the lead terminal is bonded to the wiring board or the like with solder or the like and the semiconductor device is mounted on the wiring board or the like, repeated stress due to vibration or heat is generated between the lead terminal and the wiring board or the like. Even if it acts on the joint portion, this stress can be absorbed in the bent portion of the lead terminal. That is, the stress acting on the joint portion between the lead terminal and the wiring board can be relaxed, and the connection state between the lead terminal and the wiring board can be stably maintained.

JP 2005-123328 A

By the way, when manufacturing such a semiconductor device, a lead frame in which a plurality of lead terminals are connected to each other by a frame portion is often used.
However, in the conventional method for manufacturing a semiconductor device, a plurality of lead terminals are separated from each other by cutting off the frame portion in a state where one end portions of the semiconductor element and the plurality of lead terminals are sealed by the sealing portion. A bent portion is formed at an intermediate portion of the lead terminal. Therefore, in the state after forming the bent portion, the tip positions of the plurality of lead terminals (positions of the other end portions of the lead terminals) are in a direction orthogonal to the longitudinal direction of the lead terminals and the arrangement direction of the plurality of lead terminals. There is a risk of misalignment. That is, there is a possibility that the tip positions of the plurality of lead terminals vary. When variations occur in the tip positions of the lead terminals, it becomes difficult to mount the semiconductor device on the wiring board or the like through holes.
On the other hand, if an attempt is made to form a bent portion in the middle portion of the lead terminal without cutting off the frame portion, there is a problem in that other portions of the lead frame are distorted.

  The present invention has been made in view of the above-described circumstances, and even if bent portions are formed on a plurality of lead terminals, it is possible to prevent variations in tip positions of the plurality of lead terminals, and the bent portions on the lead terminals. To provide a method for manufacturing a semiconductor device that can prevent distortion in other portions of the lead frame when forming the semiconductor device, a semiconductor device manufactured by the manufacturing method, and a lead frame used for manufacturing the semiconductor device With the goal.

  In order to solve this problem, a method of manufacturing a semiconductor device according to the present invention includes a plurality of lead terminals that are formed in a strip shape and arranged in the width direction, and electrical connection to a first end portion in the longitudinal direction of the lead terminals. A semiconductor device manufacturing method comprising: a semiconductor chip to be connected; a plurality of first end portions of the lead terminals; and a sealing portion that seals the semiconductor chip. A plurality of the lead terminals arranged inside the outer frame part, a band-like connecting part for connecting the second ends of the lead terminals in the longitudinal direction inside the outer frame part, and the outer frame part And a preparation step of preparing a lead frame in which connection portions for connecting the connecting portions to each other are prepared, an electrical connection step of electrically connecting first end portions of the plurality of lead terminals to the semiconductor chip, and a plurality of the leads A first end of the terminal and the terminal A sealing step of sealing the conductor chip to the sealing portion; a first cutting step of cutting off the connecting portion and separating the connecting portion from the outer frame portion after the sealing step; and the first cutting step A kink processing step of forming a corrugated bent portion by kinking the longitudinal middle portions of the plurality of lead terminals, and a plurality of the lead terminals by cutting off the connecting portions after the kink processing step And a second cutting step for separating the components individually.

  Further, the lead frame of the present invention includes a plurality of lead terminals formed in a strip shape and arranged in the width direction, a semiconductor chip electrically connected to the first end portion in the longitudinal direction of the lead terminals, and a plurality of lead terminals A lead used for manufacturing a semiconductor device comprising a first end portion of the lead terminal and a sealing portion for sealing the semiconductor chip, wherein a corrugated bent portion is formed in a middle portion in the longitudinal direction of the lead terminal. A conductive plate, an outer frame portion, a plurality of the lead terminals arranged inside the outer frame portion, and a second in the longitudinal direction of the plurality of lead terminals inside the outer frame portion A band-shaped connecting portion that connects end portions and a connecting portion that connects the outer frame portion and the connecting portion to each other are formed.

According to the present invention, when the kink processing step is performed, the second end portions of the plurality of lead terminals (tip portions of the plurality of lead terminals protruding from the sealing portion) are connected to each other by the connecting portion. For this reason, even if it implements a kink process, it can prevent that dispersion | variation arises in the position (tip position) of the 2nd edge part of a some lead terminal. Therefore, the manufactured semiconductor device can be easily mounted on the wiring board or the like through hole.
Moreover, according to this invention, a connection part is cut off in a 1st cutting process, and a connection part is isolate | separated from an outer frame part. For this reason, the 2nd end part of the some lead terminal connected by the connection part can be freely moved to the longitudinal direction of a lead terminal with respect to a sealing part, without being restrained by an outer frame part in a kink processing process. . Therefore, even if the kink processing step is performed, it is possible to prevent distortion in other portions of the lead frame.

1 is a perspective view showing a semiconductor device manufactured by a manufacturing method according to a first embodiment of the present invention. It is a top view which shows the lead frame used for the manufacturing method of the semiconductor device which concerns on 1st embodiment of this invention. In the manufacturing method of the semiconductor device concerning a first embodiment of the present invention, it is a top view showing the state after a sealing process. In the manufacturing method of the semiconductor device concerning a first embodiment of the present invention, it is a top view showing the state after the 1st cutting process. It is a figure explaining the kink processing process in the manufacturing method of the semiconductor device which concerns on 1st embodiment of this invention. In the manufacturing method of the semiconductor device concerning a first embodiment of the present invention, it is a top view showing the state after the 2nd cutting process. It is a top view which shows the lead frame used for the manufacturing method of the semiconductor device which concerns on 2nd embodiment of this invention. In the manufacturing method of the semiconductor device concerning a second embodiment of the present invention, it is a top view showing the state after a sealing process. In the manufacturing method of the semiconductor device concerning a second embodiment of the present invention, it is a top view showing the state after the 1st cutting process. In the manufacturing method of the semiconductor device concerning a second embodiment of the present invention, it is a top view showing the state after the 2nd cutting process.

[First embodiment]
The first embodiment of the present invention will be described below with reference to FIGS.
The method for manufacturing a semiconductor device according to this embodiment is a method for manufacturing a semiconductor device 1 including a plurality of lead terminals 11, a semiconductor chip 2, and a sealing portion 3, as shown in FIG. First, the semiconductor device 1 will be described.

  In the semiconductor device 1, the plurality of lead terminals 11 are formed in a strip shape and are arranged in the width direction of the lead terminals 11. The strip-shaped lead terminal 11 includes not only a strip-shaped lead terminal having a width dimension larger than a thickness dimension but also a rod-shaped one having a width dimension and a thickness dimension equivalent to each other. The lead terminal 11 of this embodiment includes a signal lead terminal 11A through which a small current such as a signal current flows, and a power lead terminal 11B through which a large current such as a power current flows. Each of the signal lead terminal 11A and the power supply lead terminal 11B is formed in a bar shape.

  The semiconductor chip 2 is electrically connected to the first end portion in the longitudinal direction of the lead terminal 11. The electrical connection between the semiconductor chip 2 and the lead terminal 11 is performed using, for example, a wire (not shown), a conductive connection plate, a substrate having a wiring pattern (wiring substrate), or the like. The semiconductor device 1 illustrated in FIG. 1 includes a plurality of semiconductor chips 2, but is not limited thereto.

  The sealing portion 3 seals the first end portions of the plurality of lead terminals 11 and the semiconductor chip 2. The sealing portion 3 in the present embodiment is a mold resin that embeds the first end portions of the plurality of lead terminals 11 and the semiconductor chip 2 and fixes them together, for example, the first of the plurality of lead terminals 11. It may be a case that accommodates the end portion and the semiconductor chip 2.

A corrugated bent portion 21 is formed at a portion of each lead terminal 11 protruding from the sealing portion 3 described above. The bent portion 21 is bent in a direction orthogonal to the longitudinal direction of the lead terminals 11 and the arrangement direction of the plurality of lead terminals 11 (width direction of the lead terminals 11). The bent portion 21 may be formed in, for example, an S shape or an L shape as viewed from the arrangement direction of the plurality of lead terminals 11, but in the present embodiment, the bent portion 21 is formed in a U shape. In the present embodiment, the portions of the lead terminals 11 located on both sides in the longitudinal direction of the lead terminals 11 with respect to the bent portion 21 are located without shifting in the direction perpendicular to the longitudinal direction and the arrangement direction of the lead terminals 11. ing.
The bent portions 21 of the plurality of lead terminals 11 arranged in the width direction of the lead terminal 11 are formed in the same shape and size. Further, the bent portions 21 of the plurality of lead terminals 11 are arranged in the arrangement direction of the plurality of lead terminals 11.

  Furthermore, the semiconductor device 1 of the present embodiment has two lead terminal groups 5 in which a plurality of lead terminals 11 are arranged at intervals in the width direction. The lead terminals 11 of the two lead terminal groups 5 protrude from the sealing portion 3 in opposite directions. For this reason, each lead terminal 11 is bent so that the leading ends of all the lead terminals 11 extend in the same direction. The bent portion 22 of each lead terminal 11 is located closer to the sealing portion 3 than the bent portion 21 in the longitudinal direction of each lead terminal 11.

Next, a method for manufacturing the semiconductor device 1 will be described.
When manufacturing the semiconductor device 1, first, as shown in FIG. 2, a lead frame 10 in which an outer frame portion 12, a plurality of lead terminals 11, a coupling portion 13, and a connection portion 14 are formed on a conductive plate material is prepared. Perform the preparation process. The lead frame 10 is obtained by subjecting a conductive plate material having conductivity, such as a copper plate, to press processing or the like.

  The outer frame portion 12 of the present embodiment is formed in a rectangular shape in plan view. The outer frame portion 12 is formed with a plurality (six in the illustrated example) of positioning holes 15 (pilot holes) penetrating in the thickness direction. In the illustrated example, one positioning hole 15 is formed in a square shape in plan view and the remaining positioning holes 15 are formed in a circular shape in plan view. However, the present invention is not limited to this.

The plurality of lead terminals 11 are arranged in the width direction of the lead terminals 11 inside the outer frame portion 12.
The lead frame 10 of this embodiment has two lead terminal groups 5 in which a plurality of lead terminals 11 are arranged at intervals in the width direction. The two lead terminal groups 5 are spaced apart from each other so that the first end portions of the lead terminals 11 face each other. Further, the two lead terminal groups 5 are arranged such that directions from the first end portion to the second end portion in the longitudinal direction of the lead terminals 11 are opposite to each other. In the following description, one of the two lead terminal groups 5 is called a first lead terminal group 5A, and the other of the two lead terminal groups 5 is called a second lead terminal group 5B.

In the lead frame 10 of this embodiment, a part of the plurality of lead terminals 11 is the signal lead terminal 11A, and the remaining lead terminals 11 are the power lead terminals 11B. Both the signal lead terminal 11A and the power lead terminal 11B are formed in a bar shape.
The signal lead terminals 11A are all included in the first lead terminal group 5A, and are arranged at intervals in the width direction of the lead terminals 11.

  The power lead terminal 11B is included in both the first lead terminal group 5A and the second lead terminal group 5B. The power supply lead terminals 11B constitute one power supply terminal portion 16 with a predetermined number of two or more (three in the illustrated example). In each power supply terminal portion 16, the plurality of power supply lead terminals 11 </ b> B are arranged at intervals in the width direction of the lead terminals 11. Further, the first end portions of the plurality of power supply lead terminals 11B constituting the same power supply terminal portion 16 are integrally formed. Thus, the first end portion of each power terminal portion 16 is formed in a plate shape wider than the power lead terminal 11B.

The first lead terminal group 5 </ b> A has two power supply terminal portions 16 described above. These two power supply terminal portions 16 are arranged on both sides in the arrangement direction of the plurality of signal lead terminals 11A. In the first lead terminal group 5 </ b> A, the plurality of signal lead terminals 11 </ b> A and the power lead terminals 11 </ b> B are arranged at equal intervals in the width direction of the lead terminals 11. In the first lead terminal group 5A, the longitudinal directions of the plurality of signal lead terminals 11A and the power lead terminals 11B are parallel to each other.
The second lead terminal group 5B includes three power supply terminal portions 16 described above. These three power supply terminal portions 16 are arranged at intervals in the arrangement direction of the lead terminals 11. The interval between the adjacent power supply terminal portions 16 may be set wider than the interval between the power supply lead terminals 11B in the same power supply terminal portion 16 as in the illustrated example. It may be set equal to the interval.

The connecting portion 13 connects the second ends in the longitudinal direction of the plurality of lead terminals 11 to each other inside the outer frame portion 12.
In the present embodiment, the second end portions of the plurality of signal lead terminals 11 </ b> A are connected to each other by one connecting portion 13. Further, the second end portions of the plurality of power supply lead terminals 11 </ b> B constituting the same power supply terminal portion 16 are connected to each other by one connection portion 13. Each connecting portion 13 is formed in a strip shape extending in the width direction of the lead terminal 11.

The connecting part 14 connects the outer frame part 12 and the connecting part 13 to each other.
In the present embodiment, the connecting portion 14 is connected to both ends in the longitudinal direction of each connecting portion 13 extending in the width direction of the lead terminal 11. That is, a pair of connection portions 14 of the present embodiment are provided for the same connecting portion 13.
Each connection portion 14 extends in the longitudinal direction of the lead terminal 11 from the second end portion of the lead terminal 11 to the inner edge of the outer frame portion 12. Although the width dimension of each connection part 14 may be set equivalent to the lead terminal 11 like the example of illustration, it is not restricted to this.

In addition, a lead holding portion 17 is formed in the lead frame 10 of the present embodiment.
The lead holding portion 17 holds the plurality of lead terminals 11 on the outer frame portion 12 at least in a state after the first cutting step described later.
In the present embodiment, the lead holding portion 17 is formed so as to connect one lead terminal 11 </ b> C arranged at the end portion in the arrangement direction among the plurality of lead terminals 11 and the outer frame portion 12. . One lead terminal 11C in the present embodiment is a power lead terminal 11B. Each lead holding portion 17 extends in the arrangement direction of the lead terminals 11 from one lead terminal 11 </ b> C to the inner edge of the outer frame portion 12.

  Each lead holding portion 17 is connected to a position closer to the first end portion side of one lead terminal 11C than a region where a bent portion 21 (see FIGS. 5 and 6) to be described later is to be formed in one lead terminal 11C. Has been. Furthermore, each lead holding part 17 is provided in the position which is not sealed by the sealing part 3 (refer FIG. 3) formed in the sealing process mentioned later. Each lead holding portion 17 is connected to a portion between the first end portion of one lead terminal 11 </ b> C and a region where the bent portion 21 is to be formed.

In addition, a tie bar portion 18 is formed in the lead frame 10 of the present embodiment.
The tie bar portion 18 connects the lead terminals 11 adjacent to each other at a position closer to the first end portion side than the second end portion of the lead terminal 11 within a range not sealed by the sealing portion 3 described later.
The tie bar portion 18 extends in the arrangement direction of the plurality of lead terminals 11 in the same manner as the lead holding portion 17 of the present embodiment described above. Although the tie bar portions 18 may be arranged in the arrangement direction of the lead terminals 11 with respect to the lead holding portion 17 as shown in the illustrated example, the tie bar portions 18 may be displaced in the longitudinal direction of the lead terminals 11, for example. The tie bar portion 18 in the illustrated example is positioned closer to the first end portion side of the lead terminal 11 than a region where a bent portion 21 to be described later is to be formed.

  In the present embodiment, the tie bar portion 18 is between the signal lead terminals 11A adjacent to each other, between the signal lead terminal 11A and the power supply terminal portion 16, and between the power supply terminal portions 16 adjacent to each other. Is provided. Since the plurality of power supply lead terminals 11B constituting the same power supply terminal portion 16 are integrally formed at their first ends, the tie bar portion 18 described above is provided between the plurality of power supply lead terminals 11B. Is not provided.

  The lead frame 10 required for manufacturing one semiconductor device 1 has been described above, but the lead frame 10 may be configured to manufacture a plurality of semiconductor devices 1. In this case, a plurality of outer frame portions 12 may be integrally formed in the lead frame 10.

  After the preparation step for preparing the lead frame 10 described above, as shown in FIG. 3, an electrical connection step for electrically connecting the first end portions of the plurality of lead terminals 11 to the semiconductor chip 2, and a plurality of lead terminals 11. The first end portion and the sealing step for sealing the semiconductor chip 2 to the sealing portion 3 are sequentially performed.

  In the electrical connection step, the lead terminals 11 and the semiconductor chip 2 may be electrically connected via a well-known wire, a connection plate, a wiring pattern of a wiring board, solder, or the like. In the electrical connection step, for example, the semiconductor chip 2 may be mounted on a wiring board, and the wiring board may be bonded to the first end portion of the lead terminal 11. Further, for example, a die pad for mounting the semiconductor chip 2 on the lead frame 10 may be formed in the preparation step described above, and the semiconductor chip 2 may be mounted on the die pad in the electrical connection step.

  In the sealing step, for example, the first end portions of the plurality of lead terminals 11 and the semiconductor chip 2 may be accommodated in a case as the sealing portion 3, but in the sealing step of the present embodiment, the plurality of lead terminals 11 is formed as the sealing portion 3 with a mold resin for embedding the first end portion and the semiconductor chip 2. In the present embodiment, a portion other than the first end portion of the lead terminal 11 in the lead frame 10 is located outside the sealing portion 3 in a state after the sealing step.

After the above-described sealing step, as shown in FIGS. 3 and 4, a first cutting step is performed in which the connecting portion 14 of the lead frame 10 is cut off and the connecting portion 13 is separated from the outer frame portion 12. In the present embodiment, the tie bar portion 18 is also cut off in the first cutting step.
In the state after the first cutting step, the plurality of lead terminals 11 are held by the outer frame portion 12 by the lead holding portion 17. In the present embodiment, only one lead terminal 11 </ b> C (power supply lead terminal 11 </ b> B) arranged at the end of the plurality of lead terminals 11 in the arrangement direction is connected to the outer frame portion 12 by the lead holding portion 17. A plurality of lead terminals 11 excluding one lead terminal 11C are connected to one lead terminal 11C via a connecting portion 13 and a sealing portion 3. Accordingly, all the lead terminals 11 are held by the outer frame portion 12 by the lead holding portion 17.

  After the first cutting step, as shown in FIGS. 4 and 5, a kink processing step is performed in which corrugated portions 21 are formed in the longitudinal direction of the plurality of lead terminals 11 to form corrugated bent portions 21. In FIG. 4, a region surrounded by a two-dot chain line is a formation scheduled region PA of the bent portion 21 in the present embodiment.

The bent portion 21 is formed by bending in a direction orthogonal to the longitudinal direction of the lead terminals 11 and the arrangement direction of the lead terminals 11 (width direction of the lead terminals 11). The bent portion 21 may be formed in, for example, an S shape or an L shape as viewed from the arrangement direction of the plurality of lead terminals 11, but in the present embodiment, the bent portion 21 is formed in a U shape.
Further, in the present embodiment, the portions of the lead terminals 11 located on both sides in the longitudinal direction of the lead terminal 11 with respect to the bent portion 21 do not shift in the thickness direction of the lead terminal 11 (thickness direction of the conductive plate material). Located in.
In the kink processing step of the present embodiment, since the second end portions of the plurality of lead terminals 11 arranged in the width direction are connected by the connecting portion 13, with respect to the plurality of lead terminals 11 arranged in the width direction. The bent portion 21 is formed collectively. At this time, the second end portions of the plurality of lead terminals 11 are moved in the longitudinal direction of the lead terminals 11 with respect to the sealing portion 13 by the connecting portion 13, specifically, moved closer to the sealing portion 13. To do.

Further, in the kink processing step of the present embodiment, the bent portion 21 is formed on the lead terminal 11 using the kink processing mold M illustrated in FIG. In the lower mold BM of the mold M for kink processing, a recess BM2 is formed on the mounting surface BM1 on which the lead terminal 11 is mounted. The upper mold UM arranged on the mounting surface BM1 of the lower mold BM includes a stripper S that sandwiches the lead terminal 11 between the mounting surface BM1 and a part of the lead terminal 11 in the recess BM2 of the lower mold BM. And a punch P to be pushed in.
When the bent portion 21 is formed on the lead terminal 11 using this mold M, the lead terminal 11 is first placed on the placement surface BM1 of the lower mold BM, and then placed by the stripper S of the upper mold UM. The lead terminal 11 is sandwiched between the surface BM1. Finally, a U-shaped bent portion 21 is formed in the lead terminal 11 by pushing a part of the lead terminal 11 into the recess BM2 of the lower die BM by the punch P of the upper die UM.

  In the present embodiment, as shown in FIG. 4, the plurality of lead terminals 11 are held by the outer frame portion 12 by the lead holding portion 17 in the state before the kink processing step. For this reason, when the kink processing step is performed, the plurality of lead terminals 11 can be positioned with respect to the above-described mold M by the outer frame portion 12 and the positioning holes 15.

  After the kink processing step, as shown in FIGS. 4 and 6, a second cutting step is performed in which the connecting portion 13 is cut off and the plurality of lead terminals 11 are individually separated. Further, in the manufacturing method of the present embodiment, in the second cutting step, the lead holding portion 17 is cut off and the plurality of lead terminals 11 are separated from the outer frame portion 12.

  The manufacturing of the semiconductor device 1 may be completed by performing the above-described second cutting process. However, in the manufacturing method of the present embodiment, the leads of the two lead terminal groups 5 are in a state after the second cutting process. Terminals 11 extend in opposite directions from the sealing portion 3. For this reason, in the manufacturing method of this embodiment, as shown in FIG. 1, the bending process which bends the some lead terminal 11 is implemented after a 2nd cutting process. The bending process is performed so that the leading ends of all the lead terminals 11 extending from the sealing portion 3 extend in the same direction. The bent portion 22 of each lead terminal 11 in the bending step is located closer to the sealing portion 3 than the bent portion 21.

As described above, according to the manufacturing method of the semiconductor device 1 of the present embodiment and the lead frame 10 used for manufacturing the semiconductor device 1, the semiconductor device 1 protrudes from the sealing portion 3 when performing the kink processing step. Second ends of the plurality of lead terminals 11 are connected to each other by a connecting portion 13 (see FIG. 4). For this reason, even if it implements a kink process, it can prevent that dispersion | variation arises in the position (front-end | tip position) of the 2nd edge part of the some lead terminal 11. FIG. In particular, the tip positions of the plurality of lead terminals 11 can be prevented from shifting from each other in the direction perpendicular to the longitudinal direction of the lead terminals 11 and the arrangement direction of the plurality of lead terminals 11. Therefore, the manufactured semiconductor device 1 can be easily through-hole mounted on a wiring board or the like.
In the present embodiment, the connecting portion 14 is cut off in the first cutting step, and the connecting portion 13 is separated from the outer frame portion 12. For this reason, the 2nd end part of the some lead terminal 11 connected by the connection part 13 is not restrained by the outer frame part 12 in a kink process, but the longitudinal direction of the lead terminal 11 with respect to the sealing part 3 You can move freely. Therefore, even if the kink processing step is performed, it is possible to prevent distortion in other portions of the lead frame 10.

  Further, according to the present embodiment, in the state after the first cutting step, the plurality of lead terminals 11 are held by the outer frame portion 12 by the lead holding portion 17 (see FIG. 4). For this reason, when performing the kink processing step, the plurality of lead terminals 11 can be positioned with respect to the mold M for kink processing by the outer frame portion 12 and the positioning holes 15. Here, even if the number and thickness of the lead terminals 11 arranged in a line in the lead frame 10 and the interval between the lead terminals 11 are different, the shape of the outer frame portion 12 and the position of the positioning hole 15 in the outer frame portion 12 are different. Can be unified. Therefore, even when various types of lead frames 10 having different numbers and thicknesses of lead terminals 11 arranged in a row and intervals between the lead terminals 11 are used, a plurality of lead terminals 11 are used when the kink processing step is performed. Can be positioned with respect to the same mold M. That is, it is possible to perform the kink processing step on the lead terminals 11 of various types of lead frames 10 using the same mold M.

  Furthermore, according to this embodiment, in the state after the first cutting step (before the kink processing step), among the lead terminals 11 arranged in a row, one lead terminal 11C arranged at the end in the arrangement direction. Is connected to the outer frame portion 12 by the lead holding portion 17 (see FIG. 4). Further, the lead holding portion 17 is connected to a position closer to the first end portion side of the one lead terminal 11C than the formation region PA of the bent portion 21 in the one lead terminal 11C (see FIG. 4). For this reason, the lead holding portion 17 does not hinder kink processing on the plurality of lead terminals 11. That is, in the kink processing step, the bent portions 21 can be appropriately formed on the plurality of lead terminals 11.

  Furthermore, according to the present embodiment, the plurality of lead terminals 11 are connected to each other by the connecting portion 13 and the tie bar portion 18 at positions spaced apart in the longitudinal direction (see FIG. 2). Thus, in the state where the plurality of lead terminals 11 are connected, the first end portion of each lead terminal 11 swings with respect to the second end portion by an external force during the period from the preparation step to the sealing step. Or deformation. That is, the plurality of lead terminals 11 can be held in a stable state.

  Further, according to the present embodiment, the connecting portions 14 of the lead frame 10 are provided at both ends in the longitudinal direction of the respective connecting portions 13 (see FIGS. 2 and 3). For this reason, the plurality of lead terminals 11 can be stably held with respect to the outer frame portion 12 until the first cutting step is performed.

  In the lead frame 10 of the first embodiment, for example, the second end portions of all the lead terminals 11 constituting the same lead terminal group 5 may be connected to each other by one connecting portion 13. .

[Second Embodiment]
Next, a second embodiment of the present invention will be described with a focus on differences from the first embodiment with reference to FIGS. In addition, about the structure which is common in 1st embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  In the method for manufacturing a semiconductor device according to this embodiment, the same preparation process, electrical connection process, sealing process, first cutting process, kink processing process, and second cutting process as those in the first embodiment may be sequentially performed. Moreover, what is necessary is just to implement a bending process after a 2nd cutting process as needed. However, the manufacturing method of this embodiment is partly different from the manufacturing method of the first embodiment described above. Hereinafter, the manufacturing method of the present embodiment will be described focusing on differences from the manufacturing method of the first embodiment.

As shown in FIG. 7, the lead frame 30 prepared in the preparation process of the present embodiment includes an outer frame portion 12, a plurality of lead terminals 11, a coupling portion 13, and a connection portion similar to those in the first embodiment. 14 is formed. Further, in the lead frame 30 of the present embodiment, as in the first embodiment, a lead holding portion 37 that holds the plurality of lead terminals 11 on the outer frame portion 12, and a sealing portion 3 described later (see FIG. 8). The tie bar portion 18 that connects the lead terminals 11 adjacent to each other at a position closer to the first end portion than the second end portion of the lead terminal 11 is formed in a range that is not sealed by the above.
The outer frame portion 12 and the tie bar portion 18 of the present embodiment are the same as in the first embodiment.

  Similar to the first embodiment, the lead frame 30 of the present embodiment has two lead terminal groups 35 in which a plurality of lead terminals 11 are arranged at intervals in the width direction. In the present embodiment, some lead terminals 11 are signal lead terminals 11A, and the remaining lead terminals 11 are power lead terminals 11B. 11 A of signal lead terminals are formed in the rod shape similarly to 1st embodiment. However, the power supply lead terminal 11B of the present embodiment is formed in a plate shape (band plate shape) wider than the signal lead terminal 11A.

One power supply lead terminal 11B is arranged on each side of the plurality of signal lead terminals 11A in one lead terminal group 35A. In addition, a plurality (three in the illustrated example) of power supply lead terminals 11B are arranged in the other lead terminal group 35B at intervals in the arrangement direction of the lead terminals 11.
The longitudinal dimension of the power supply lead terminal 11B of the present embodiment is set shorter than that of the signal lead terminal 11A. Here, in one lead terminal group 35A, since the first end portions of the signal lead terminal 11A and the power lead terminal 11B are arranged in the arrangement direction of the plurality of lead terminals 11, the power lead terminals 11B The second end is located closer to the first end than the second end of the signal lead terminal 11A.

  The connecting portion 13 in the lead frame 30 of the present embodiment only connects the second end portions in the longitudinal direction of the plurality of signal lead terminals 11A to each other. Accordingly, the connecting portion 14 in the lead frame 30 of the present embodiment connects only the above-described connecting portion 13 to the outer frame portion 12.

  In the lead holding portion 37 in the lead frame 30 of the present embodiment, one lead terminal 11 </ b> C and the outer frame portion 12 that are arranged at the end portions in the arrangement direction among the plurality of lead terminals 11 in each lead terminal group 35. 37A, and a second lead holding portion 37B for connecting the second end portion in the longitudinal direction of each power lead terminal 11B and the outer frame portion 12 to each other. One lead terminal 11C in the present embodiment is a power supply lead terminal 11B as in the first embodiment.

37 A of 1st lead holding parts are the same as that of the lead holding part 17 of 1st embodiment, and are connected to the position near the 1st end part side among 11 C of one lead terminal. As a result, one lead terminal 11C is supported at its longitudinal ends by the first and second lead holding portions 37A and 37B. The first lead holding portion 37 </ b> A extends in the arrangement direction of the plurality of lead terminals 11 from the power supply lead terminal 11 </ b> B forming one lead terminal 11 </ b> C to the inner edge of the outer frame portion 12.
On the other hand, the second lead holding portion 37 </ b> B extends in the longitudinal direction of the lead terminal 11 from the second end of each power supply lead terminal 11 </ b> B to the inner edge of the outer frame portion 12.
The lead holding portions 37 of the present embodiment described above are provided at positions that are not sealed by the sealing portion 3 (see FIG. 8) formed in the sealing step, as in the first embodiment.

After the above-described preparation process, as shown in FIG. 8, the same electrical connection process and sealing process as in the first embodiment are performed in order. Furthermore, after the sealing step, the same first cutting step as that in the first embodiment is performed.
In the first cutting process of the present embodiment, as shown in FIGS. 8 and 9, the connecting portion 14 of the lead frame 30 is cut off and the connecting portion 13 is separated from the outer frame portion 12 as in the first embodiment. . The tie bar portion 18 is also cut off. Furthermore, in the first cutting step of the present embodiment, the first lead holding portion 37A is also cut off.
For this reason, in the state after the first cutting step of the present embodiment, the plurality of lead terminals 11 are held on the outer frame portion 12 by the second lead holding portion 37B. That is, each power supply lead terminal 11B is connected to the outer frame portion 12 by the second lead holding portion 37B. The plurality of signal lead terminals 11 </ b> A are connected to the power supply lead terminal 11 </ b> B through the sealing portion 3. Thus, all the lead terminals 11 are held on the outer frame portion 12 by the second lead holding portion 37B.

After the first cutting step described above, the same kink processing step as that in the first embodiment is performed.
However, in the kink processing step of the present embodiment, kink processing is performed on the middle portions in the longitudinal direction of the plurality of signal lead terminals 11A to form the bent portions 21 (see FIG. 5) similar to those of the first embodiment. That is, in the manufacturing method of the present embodiment, the bent portion 21 is not formed in the power supply lead terminal 11B. In FIG. 9, a region surrounded by a two-dot chain line indicates a region PA where the bent portion 21 is to be formed.

  After the kink processing step, as shown in FIGS. 9 and 10, a second cutting step is performed in which the connecting portion 13 is cut off and the plurality of signal lead terminals 11A are individually separated. In the second cutting step of the present embodiment, the second lead holding portion 37B is cut off to separate the plurality of lead terminals 11 (particularly the power supply lead terminals 11B) from the outer frame portion 12.

Furthermore, in the manufacturing method of the present embodiment, as in the first embodiment, the bending process of bending the plurality of lead terminals 11 is performed after the second cutting process described above, thereby completing the manufacture of the semiconductor device 1.
In the bending process, as in the first embodiment, all the lead terminals 11 are bent so that the leading ends of all the lead terminals 11 extending from the sealing portion 3 extend in the same direction.

  When the semiconductor device manufactured by the above manufacturing method is mounted on a wiring board, for example, the signal lead terminal 11A may be inserted into a through hole of the wiring board. The power supply lead terminal 11B may be connected to an external circuit (for example, a bus bar connected to the wiring board) by welding or the like, for example.

According to the semiconductor device manufacturing method of the present embodiment and the lead frame 30 used for manufacturing the semiconductor device, the same effects as those of the first embodiment can be obtained.
That is, also in this embodiment, the connection part 14 is cut off in the first cutting step, and the connecting part 13 is separated from the outer frame part 12. For this reason, the second end portions of the plurality of signal lead terminals 11A connected by the connecting portion 13 are not restrained by the outer frame portion 12 and the power supply lead terminal 11B not subjected to kink processing in the kink processing step. It can move freely in the longitudinal direction of the signal lead terminal 11 </ b> A with respect to the sealing portion 3. Therefore, even if the kink processing step is performed, it is possible to prevent distortion in other portions of the lead frame 10.
Further, when the kink processing step is performed, the second end portions of the plurality of signal lead terminals 11A are connected to each other by the connecting portion 13, and therefore the positions of the second end portions of the plurality of signal lead terminals 11A. It is possible to prevent variation in (tip position).

  In the second embodiment, the first lead holding portion 37A is cut off in the first cutting step, but may be cut off in the second cutting step, for example. In this case, the first lead holding portion 37A also plays a role of holding the lead terminal 11 on the outer frame portion 12 in the kink processing step, like the second lead holding portion 37B. Further, when the first lead holding portion 37A is cut off in the second cutting step, the second lead holding portion may be cut off in the first cutting step, for example.

  Although the details of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

  For example, the tie bar portion 18 is not limited to being cut off in the first cutting step as in the above embodiment, but may be cut off in the second cutting step. In this case, if the tie bar portion 18 is located closer to the first end portion side of the lead terminal 11 than the region PA where the bent portion 21 is to be formed in the lead terminal 11, the tie bar portion 18 is kink to the lead terminal 11. Does not hinder processing. That is, the bent portion 21 can be appropriately formed on the lead terminal 11 in the kink processing step.

  In addition, the manufacturing method and the lead frame of the present invention are not limited to being applied to a semiconductor device in which the lead terminals 11 protrude from the sealing portion 3 in the opposite direction. For example, all the lead terminals 11 are connected to the sealing portion 3. The present invention can also be applied to a semiconductor device protruding in the same direction.

DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Semiconductor chip 3 Sealing part 10, 30 Lead frame 11 Lead terminal 11C One lead terminal 12 Outer frame part 13 Connection part 14 Connection part 17, 37 Lead holding part 37A First lead holding part 37B Second lead holding Part 18 Tie bar part 21 Bending part PA formation area

Claims (7)

A plurality of lead terminals formed in a strip shape and arranged in the width direction, a semiconductor chip electrically connected to a first end portion in the longitudinal direction of the lead terminals, a first end portion of the plurality of lead terminals, and A method for manufacturing a semiconductor device comprising: a sealing portion for sealing the semiconductor chip,
A conductive plate material, an outer frame part, a plurality of the lead terminals arranged inside the outer frame part, and a belt-like shape connecting the second ends in the longitudinal direction of the lead terminals inside the outer frame part A preparation step of preparing a lead frame formed with a connecting portion, and a connecting portion for connecting the outer frame portion and the connecting portion to each other;
An electrical connection step of electrically connecting first end portions of the plurality of lead terminals to the semiconductor chip;
A sealing step of sealing the first end portions of the plurality of lead terminals and the semiconductor chip in the sealing portion;
After the sealing step, a first cutting step of cutting off the connecting portion and separating the connecting portion from the outer frame portion;
After the first cutting step, a kink processing step of forming a corrugated bent portion by performing kink processing in a longitudinal direction of a plurality of the lead terminals;
After the kink processing step, a second cutting step of cutting off the connecting portion and separating the plurality of lead terminals individually;
A method for manufacturing a semiconductor device, comprising: In the lead frame prepared in the preparation step, a lead holding portion that holds the plurality of lead terminals in the outer frame portion at least after the first cutting step is formed,
2. The method of manufacturing a semiconductor device according to claim 1, wherein in the second cutting step, the lead holding portion is cut off to separate the plurality of lead terminals from the outer frame portion.   The lead holding portion connects one lead terminal arranged at an end in the arrangement direction of the plurality of lead terminals and the outer frame portion, and forms the bent portion of the one lead terminal. The method for manufacturing a semiconductor device according to claim 2, wherein the semiconductor device is connected to a position closer to the first end than the planned region. Tie bar portion for connecting the lead terminals adjacent to each other at a position closer to the first end portion side than the second end portion to the lead frame prepared in the preparation step within a range not sealed by the sealing portion Formed,
4. The method of manufacturing a semiconductor device according to claim 1, wherein the tie bar portion is cut off in the first cutting step or the second cutting step. 5.   The semiconductor device manufactured by the manufacturing method as described in any one of Claims 1-4. A plurality of lead terminals formed in a strip shape and arranged in the width direction, a semiconductor chip electrically connected to a first end portion in the longitudinal direction of the lead terminals, a first end portion of the plurality of lead terminals, and A lead frame used for manufacturing a semiconductor device comprising a sealing portion that seals the semiconductor chip, and a corrugated bent portion formed in a middle portion in the longitudinal direction of the lead terminal,
An outer frame portion, a plurality of the lead terminals arranged inside the outer frame portion, and a second end portion in the longitudinal direction of the plurality of lead terminals inside the outer frame portion are connected to the conductive plate member. A lead frame comprising: a strip-shaped connecting portion; and a connecting portion that connects the outer frame portion and the connecting portion to each other.   The lead frame according to claim 6, wherein the connection portion is provided at both ends in the longitudinal direction of the connecting portion.

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