JP2016015469A - Cleaning chemical supply apparatus, cleaning chemical supply method, and cleaning unit - Google Patents

Abstract

A cleaning chemical supply device, a cleaning chemical supply method, and a cleaning unit that can flexibly cope with a change in dilution ratio and suppress an increase in the size of the apparatus. A cleaning chemical solution supply device includes a first in-line mixer for supplying a first cleaning chemical solution to a cleaning device, and a second in-line mixer for supplying a second cleaning chemical solution to a substrate cleaning device. 73, the first chemical liquid CLC box 120 for controlling the flow rate of the first chemical liquid supplied to the first in-line mixer 72, and the flow rate of the second chemical liquid supplied to the second in-line mixer 73. The second chemical liquid CLC box 130 and the DIWCLC box 110 for controlling the flow rate of dilution water supplied to the first in-line mixer 72 or the second in-line mixer 73. It is configured to switch from the first in-line mixer 72 to the second in-line mixer 73 or from the second in-line mixer 73 to the first in-line mixer 72. [Selection] Figure 2

Description

  The present invention relates to a cleaning chemical supply device, a cleaning chemical supply method, and a cleaning unit.

  A CMP (Chemical Mechanical Polishing) apparatus includes a polishing apparatus for polishing a surface of a semiconductor substrate on which a semiconductor chip is formed, and a cleaning for supplying a cleaning chemical solution to the semiconductor substrate polished by the polishing apparatus. Device. This cleaning apparatus mixes a chemical solution with dilution water such as DIW (De-Ionized Water) to create a cleaning chemical solution (diluted chemical solution), and cleans the semiconductor substrate using the cleaning chemical solution ( For example, see Patent Document 1).

  2. Description of the Related Art Conventionally, in a cleaning apparatus using a cleaning chemical solution, a cleaning chemical solution supply device having an in-line type flow meter configured by arranging a chemical flow meter and a DIW flow meter in pairs has been used. These cleaning chemical flowmeters and DIW flowmeters include a CLC (Closed Loop Controller), and the respective flow rates are feedback-controlled so that the chemical liquid flow rate and the DIW flow rate become a constant ratio. Thereby, the chemical | medical solution diluted by the fixed ratio is supplied to the washing tank of a washing | cleaning apparatus.

  In a conventional chemical solution supply apparatus, a chemical flow meter, a DIW flow meter, and an in-line mixer for mixing the chemical flow and DIW whose flow rate is controlled are housed in one box. That is, one DIW flow meter was designed to be combined with one chemical flow meter, and the size of one box was designed to accommodate only two flow meters.

  In recent years, in a cleaning apparatus provided in a CMP apparatus, a process for cleaning a semiconductor substrate by using an acidic chemical solution and an alkaline chemical solution alternately is required. As described above, since the conventional cleaning apparatus is designed to have a box that can accommodate only two flow meters, only two types of chemical flow meters are accommodated in the box, and a DIW flow meter is installed. Could not be established. For this reason, in the conventional chemical | medical solution supply apparatus, while arrange | positioning two flow meters in a box, it supplied two types of cleaning chemical | medical solutions diluted beforehand via each flow meter.

  However, in the chemical solution supply apparatus using two types of cleaning chemical solutions diluted in advance, if the dilution ratio of the cleaning chemical solution is changed in accordance with the change of the process recipe, cleaning chemical solutions having different dilution ratios must be prepared. That is, this chemical solution supply apparatus cannot flexibly cope with a change in process recipe.

  On the other hand, if the in-line type flow meter described above is used, it is possible to cope with a change in the dilution ratio accompanying a change in the process recipe simply by changing the flow rate setting values of the chemical flow meter and the DIW flow meter. . However, in order to supply two types of chemical solutions to the cleaning device, it is necessary to prepare two in-line flow meters. In this case, since the DIW flow meters are respectively provided in the two in-line flow meters, there is a problem that the chemical solution supply apparatus is enlarged.

JP 2009-54959 A

  The present invention has been made in view of the above problems, and the object thereof is to provide a cleaning chemical solution supply device and a cleaning device that can flexibly cope with a change in dilution ratio and can suppress an increase in device size. It is to provide a chemical supply method.

  According to one aspect of the present invention, a cleaning chemical supply apparatus is provided. The cleaning chemical supply apparatus is a cleaning chemical supply apparatus for supplying a cleaning chemical to a substrate cleaning apparatus, and a first cleaning chemical obtained by mixing a first chemical and dilution water is supplied to the substrate cleaning apparatus. A first mixing unit for supplying, a second mixing unit for supplying the second cleaning chemical obtained by mixing the second chemical and dilution water to the substrate cleaning apparatus, and the first mixing unit A first chemical control unit for controlling the flow rate of the first chemical solution to be supplied; a second chemical solution control unit for controlling the flow rate of the second chemical solution supplied to the second mixing unit; A dilution water control unit for controlling a flow rate of the dilution water supplied to one mixing unit or the second mixing unit, and a supply destination of the dilution water from the first mixing unit to the second mixing unit, or A dilution water supply switching unit for switching from the second mixing unit to the first mixing unit.

  According to another aspect of the present invention, in the cleaning chemical solution supply device, the first chemical control unit supplies the first chemical solution while the second cleaning chemical solution is supplied to the substrate cleaning device. The second chemical liquid control unit is configured to stop the supply of the second chemical liquid while the first cleaning chemical liquid is supplied to the substrate cleaning apparatus.

  According to another aspect of the present invention, in the cleaning chemical solution supply apparatus, the dilution water supply switching unit is configured so that the first chemical solution control unit supplies the first chemical solution to the first mixing unit. The dilution water is supplied to the first mixing unit, and the dilution water is supplied to the second mixing unit while the second chemical solution control unit supplies the second chemical solution to the second mixing unit. The

  According to another aspect of the present invention, the cleaning chemical solution supply device supplies a first chemical solution supply source for supplying a first chemical solution to the first chemical solution control unit, and supplies a second chemical solution to the second chemical solution control unit. A second chemical liquid supply source, a first chemical liquid inlet valve provided on a pipe line connecting the first chemical liquid supply source and the first chemical liquid control unit, the second chemical liquid supply source, and the second chemical liquid control. And a second chemical liquid inlet valve provided on a pipe line connecting the parts.

According to another aspect of the present invention, in the cleaning chemical solution supply apparatus, one of the first chemical solution and the second chemical solution is an alkaline chemical solution and the other is an acidic chemical solution.
According to another aspect of the present invention, a cleaning chemical supply method is provided. The cleaning chemical supply method is a cleaning chemical supply method for supplying a cleaning chemical to a substrate cleaning apparatus, the step of controlling the flow rate of the first chemical solution, the step of controlling the flow rate of dilution water, and the first Supplying a chemical solution and the dilution water to the first mixing unit to mix the first chemical solution and the dilution water, and a first cleaning obtained by mixing the dilution water and the first chemical solution A first supply step of supplying a chemical solution to the substrate cleaning apparatus, a step of controlling a flow rate of the second chemical solution, a step of switching the supply destination of the dilution water from the first mixing unit to the second mixing unit, Supplying the second chemical solution and the dilution water to the second mixing unit to mix the second chemical solution and the dilution water, and the second cleaning chemical solution obtained by mixing with the dilution water to the substrate And a second supply step for supplying the cleaning device.

  According to another aspect of the present invention, in the cleaning chemical solution supply method, the first supply step is performed while the second cleaning chemical solution is supplied to the substrate cleaning apparatus in the second supply step. A step of stopping the supply of the first cleaning chemical solution, wherein the second supply step supplies the second cleaning chemical solution while the first cleaning chemical solution is supplied to the substrate cleaning apparatus in the first supply step. The process of stopping.

  According to another aspect of the present invention, in the cleaning chemical solution supply method, one of the first chemical solution and the second chemical solution is an alkaline chemical solution and the other is an acidic chemical solution. According to another aspect of the invention, a cleaning unit is provided. This cleaning unit is a cleaning unit having a substrate cleaning apparatus for cleaning a substrate and a cleaning chemical supply apparatus for supplying a cleaning chemical to the substrate cleaning apparatus, and the substrate cleaning apparatus supplies a cleaning chemical to the substrate. A first ultrasonic flowmeter for measuring a flow rate of the cleaning chemical supplied to the substrate, and the first ultrasonic flowmeter is located at a position lower than the position of the nozzle. Be placed.

  According to another aspect of the present invention, in the cleaning unit, the first ultrasonic flow meter is configured such that the flow direction of the cleaning chemical liquid passing through the first ultrasonic flow meter is directed in the vertical direction. .

  According to another aspect of the present invention, in the cleaning unit, the cleaning chemical solution supply device includes a mixing unit for supplying a cleaning chemical solution obtained by mixing a chemical solution and dilution water to the substrate cleaning device. A chemical flow rate control unit for controlling the flow rate of the chemical solution and supplying the chemical solution to the mixing unit; and a dilution water flow rate control unit for controlling the flow rate of the dilution water and supplying the dilution water to the mixing unit The chemical flow rate control unit and the dilution water flow rate control unit respectively include a second ultrasonic flow meter and a third ultrasonic flow meter, and the second ultrasonic flow meter and the third super flow rate meter. The sonic flow meter is disposed at a position lower than the position of the nozzle.

  According to another aspect of the present invention, in the cleaning unit, the flow direction of the dilution water flowing through the second ultrasonic flow meter and the flow direction of the chemical liquid passing through the third ultrasonic flow meter are in the vertical direction. The second ultrasonic flow meter and the third ultrasonic flow meter are arranged so as to face.

  ADVANTAGE OF THE INVENTION According to this invention, the washing | cleaning chemical | medical solution supply apparatus and the washing | cleaning chemical | medical solution supply method which can respond flexibly to the change of a dilution ratio and can suppress enlargement of apparatus size can be provided.

It is a schematic front view which shows the chemical | medical solution supply apparatus which concerns on 1st Embodiment. It is a chemical solution supply flow figure of a chemical solution supply device concerning a 1st embodiment. It is a chemical solution supply flow figure of a chemical solution supply device concerning a 2nd embodiment. It is a schematic side view which shows the chemical | medical solution supply apparatus which the washing | cleaning unit which concerns on 3rd Embodiment has. It is a schematic perspective view which shows the washing | cleaning apparatus which the washing | cleaning unit which concerns on 3rd Embodiment has. It is the schematic of the washing | cleaning unit which concerns on 3rd Embodiment.

<First Embodiment>
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic front view showing a chemical liquid supply apparatus according to the first embodiment of the present invention. The chemical liquid supply apparatus according to the present embodiment is configured to be able to supply, for example, a first chemical liquid that is an alkaline chemical liquid and a second chemical liquid that is an acidic chemical liquid, for example, to a cleaning device included in the CMP apparatus. As shown in FIG. 1, the chemical solution supply apparatus 100 according to the first embodiment includes a case 101, a DIWCLC box 110 (dilution water control unit), a first chemical solution CLC box 120 (first chemical solution control unit), 2 chemical liquid CLC box 130 (second chemical liquid control unit). The DIWCLC box 110 controls the supply of DIW (dilution water). The first chemical liquid CLC box 120 controls the supply of the first chemical liquid. The second chemical liquid CLC box 130 controls the supply of the second chemical liquid.

  The chemical solution supply device 100 further includes a plurality of chemical solution utility boxes 50 (60 for introducing the chemical solution from the first chemical solution supply source 20 and the second chemical solution supply source 30 (see FIGS. 2 and 3) into the chemical solution supply device 100. ). In the illustrated example, six chemical utility boxes 50 (60) are provided in the chemical supply device 100, but this is an example, and the number of chemical utility boxes 50 (60) is appropriately determined according to the specifications of the cleaning device. Be changed.

  The DIWCLC box 110, the first chemical liquid CLC box 120, the second chemical liquid CLC box 130, and the plurality of chemical liquid utility boxes 50 (60) are accommodated in the case 101.

  The DIWCLC box 110 is configured to supply DIW from a DIW supply source 10 to be described later to a first inline mixer 72 (72a) or a second inline mixer 73 (73a) to be described later (FIGS. 2 and 3). reference). Also, the DIWCLC box 110 can control the DIW flow rate to a flow rate set by feedback control.

  The 1st chemical | medical solution CLC box 120 is comprised so that the 1st chemical | medical solution from the 1st chemical | medical solution supply source 20 may be supplied to the 1st in-line mixer 72 (72a) mentioned later (refer FIG.2 and FIG.3). Moreover, the 1st chemical | medical solution CLC box 120 can control the flow volume of a 1st chemical | medical solution to the flow volume set by feedback control.

  Similarly, the second chemical liquid CLC box 130 is configured to supply the second chemical liquid from the second chemical liquid supply source 30 to a second in-line mixer 73 (73a) described later (see FIGS. 2 and 3). . Further, the second chemical liquid CLC box 130 can control the flow rate of the second chemical liquid to a flow rate set by feedback control.

Although not shown, the chemical solution supply apparatus 100 includes piping, valves, pressure gauges, and the like for transporting DIW, the first chemical solution, or the second chemical solution. Details will be described with reference to FIGS.
FIG. 2 is a chemical solution supply flow chart of the chemical solution supply apparatus 100 according to the first embodiment of the present invention.

  As illustrated, the chemical liquid supply apparatus 100 includes a DIW supply source 10 for supplying DIW, a first chemical liquid supply source 20 for supplying a first chemical liquid, and a second chemical liquid supply for supplying a second chemical liquid. It is configured to be in fluid communication with the source 30 via respective pipes. The chemical solution supply apparatus 100 is configured to be in fluid communication with the cleaning apparatus 200 (substrate cleaning apparatus). Specifically, the chemical solution supply device 100 performs cleaning so that DIW, the diluted first chemical solution (first cleaning chemical solution), and the diluted second chemical solution (second cleaning chemical solution) can be supplied to the cleaning device 200. It is configured to be in fluid communication with device 200.

  The cleaning apparatus 200 includes a DIW cleaning unit 210 that cleans an object to be cleaned, such as a semiconductor substrate polished by the polishing apparatus, using DIW, and a chemical solution in which the object to be cleaned, such as a semiconductor substrate polished by the polishing apparatus, is diluted ( And a chemical solution cleaning unit 220 for cleaning using the cleaning chemical solution. The DIW cleaning unit 210 includes, for example, an ultrasonic water cleaning unit and other DIW cleaning units. The chemical solution cleaning unit 220 includes, for example, a roll type cleaning unit. The DIW cleaning unit 210 and the chemical solution cleaning unit 220 coexist in the same cleaning tank 230.

The chemical solution supply apparatus 100 includes a first in-line mixer 72 (corresponding to an example of a first mixing unit), a second in-line mixer 73 (corresponding to an example of a second mixing unit), and a first chemical liquid CLC box 120. And a second chemical liquid CLC box 130 and a DIWCLC box 110. The first in-line mixer 72 mixes the first chemical and DIW to generate a first cleaning chemical. The second in-line mixer 73 mixes the second chemical and DIW to generate a second cleaning chemical. The first chemical liquid CLC box 120 controls the flow rate of the first chemical liquid supplied from the first chemical liquid supply source 20 to the first in-line mixer 72. The second chemical liquid CLC box 130 controls the flow rate of the second chemical liquid supplied from the second chemical liquid supply source 30 to the second in-line mixer 73. The DIWCLC box 110 controls the flow rate of DIW supplied from the DIW supply source 10 to the first in-line mixer 72 or the second in-line mixer 73.

  The first in-line mixer 72 is configured to supply the generated first cleaning chemical solution to the chemical cleaning unit 220. Similarly, the second in-line mixer 73 is configured to supply the generated second cleaning chemical to the chemical cleaning unit 220.

  The DIWCLC box 110 includes a first DIW supply valve 112, a second DIW supply valve 113, and a CLC (Closed Loop Controller) 111. The first DIW supply valve 112 supplies DIW for dilution from the DIW supply source 10 to the first in-line mixer 72. The second DIW supply valve 113 supplies DIW for dilution from the DIW supply source 10 to the second in-line mixer 73. The CLC 111 adjusts the flow rate supplied to the first DIW supply valve 112 and the second DIW supply valve 113. The CLC 111 measures the flow rate of DIW flowing through the CLC 111. Based on this measurement result, the CLC 111 adjusts (feedback control) the opening of the CLC 111 internal control valve so that the flow rate of DIW flowing in the CLC 111 becomes a desired flow rate.

  The DIWCLC box 110 supplies DIW to the first in-line mixer 72 by closing the second DIW supply valve 113 and opening the first DIW supply valve 112. On the other hand, the DIWCLC box 110 supplies DIW to the second in-line mixer 73 by closing the first DIW supply valve 112 and opening the second DIW supply valve 113. That is, the DIWCLC box 110, the first DIW supply valve 112, and the second DIW supply valve 113 function as a dilution water supply switching unit that switches the DIW supply destination between the first inline mixer 72 and the second inline mixer 73. To do.

  The first chemical liquid CLC box 120 has a first chemical liquid supply valve 122 for supplying the first chemical liquid from the first chemical liquid supply source 20 to the first in-line mixer 72, and a flow rate of the first chemical liquid flowing through the first chemical liquid supply valve 122. CLC 121 to be measured. CLC121 measures the flow volume of the 1st chemical | medical solution which flows into CLC121. Based on the measurement result, the CLC 121 adjusts (feedback control) the opening of the CLC 121 internal control valve so that the flow rate of the first chemical flowing in the CLC 121 becomes a desired flow rate.

  The second chemical liquid CLC box 130 has a second chemical liquid supply valve 132 that supplies the second chemical liquid from the second chemical liquid supply source 30 to the second in-line mixer 73 and a flow rate of the second chemical liquid that flows through the second chemical liquid supply valve 132. CLC 131 to be measured. CLC131 measures the flow volume of the 2nd chemical | medical solution which flows into CLC131. Based on the measurement result, the CLC 131 adjusts (feedback control) the opening of the CLC 131 internal control valve so that the flow rate of the second chemical flowing in the CLC 131 becomes a desired flow rate.

  The chemical solution supply apparatus 100 includes a chemical solution utility box 50 and a chemical solution utility box 60. The chemical liquid utility box 50 introduces the first chemical liquid from the first chemical liquid supply source 20 into the CLC 121 of the first chemical liquid CLC box 120. The chemical liquid utility box 60 introduces the second chemical liquid from the second chemical liquid supply source 30 into the CLC 131 of the second chemical liquid CLC box 130.

The chemical liquid utility box 50 is provided on a pipe 91 that connects the first chemical liquid supply source 20 and the CLC 121 of the first chemical liquid CLC box 120, a first chemical liquid inlet valve 51 that supplies the first chemical liquid to the pipe 91, and a pipe The pressure gauge 52 which measures the fluid pressure in 91 is provided. The first chemical liquid inlet valve 51 is controlled to open and close by a control device (not shown), for example.

  Similarly, the chemical liquid utility box 60 is provided on a pipe 92 that connects the second chemical liquid supply source 30 and the CLC 131 of the second chemical liquid CLC box 130, and a second chemical liquid inlet valve 61 that supplies the second chemical liquid to the pipe 92. And a pressure gauge 62 for measuring the fluid pressure in the pipe 92. The second chemical liquid inlet valve 61 is controlled to be opened and closed by a control device (not shown), for example.

  The chemical solution supply apparatus 100 includes a DIW supply pipe 81 having one end connected to the DIW supply source 10 and the other end connected to the DIW cleaning unit 210 of the cleaning apparatus 200. The DIW supply pipe 81 is provided with a DIW supply valve 86, a DIW pressure adjustment regulator 87, and a DIW pressure gauge 88. The DIW supply valve 86 is opened and closed to control the supply of DIW from the DIW supply source 10 to the DIW supply pipe 81. The DIW pressure adjustment regulator 87 adjusts the supply pressure of DIW from the DIW supply pipe 81 to the DIW cleaning unit 210. The DIW pressure gauge 88 measures the pressure of DIW passing through the inside of the DIW supply pipe 81.

  A DIW branch pipe 82 having one end connected to the CLC 111 of the DIWCLC box 110 is connected between the DIW supply valve 86 and the DIW pressure adjustment regulator 87 on the DIW supply pipe 81. Connected to the CLC 111 is a first DIW pipe 83 in fluid communication with the first in-line mixer 72 and a second DIW pipe 84 in fluid communication with the second in-line mixer 73. The first DIW supply valve 112 is provided on the first DIW pipe 83 and is controlled to be opened and closed when DIW is supplied to the first in-line mixer 72. The second DIW supply valve 113 is provided on the second DIW pipe 84 and is controlled to open and close when DIW is supplied to the second in-line mixer 73.

  A first chemical liquid pipe 93 that is in fluid communication with the first in-line mixer 72 is connected to the CLC 121 of the first chemical liquid CLC box 120. The first chemical solution supply valve 122 is provided on the first chemical solution pipe 93 and is controlled to be opened and closed when the first chemical solution is supplied to the first in-line mixer 72. A first cleaning chemical solution pipe 96 having one end connected to the chemical solution cleaning unit 220 is connected to the first in-line mixer 72.

  A second chemical liquid pipe 94 that is in fluid communication with the second in-line mixer 73 is connected to the CLC 131 of the second chemical liquid CLC box 130. The second chemical liquid supply valve 132 is provided on the second chemical liquid pipe 94 and is controlled to be opened and closed when supplying the second chemical liquid to the second in-line mixer 73. The second in-line mixer 73 is connected to a second cleaning chemical liquid pipe 97 having one end connected to the chemical cleaning section 220.

  The CLC 111 of the DIWCLC box 110, the CLC 121 of the first chemical liquid CLC box 120, and the CLC 131 of the second chemical liquid CLC box 130 are configured to be able to receive a signal indicating a predetermined flow rate value from a control device (not shown). Based on this flow rate value, the opening degrees of the internal control valves of the CLC 111, CLC 121, and CLC 131 are controlled.

Next, a chemical solution supply process in the chemical solution supply apparatus 100 shown in FIG. 2 will be described.
When supplying the first cleaning chemical solution to the chemical cleaning unit 220 of the cleaning device 200, first, the first chemical inlet valve 51 of the chemical utility box 50 is opened. The flow rate of the first chemical solution is adjusted by the CLC 121 of the first chemical solution CLC box 120, and the first chemical solution having a predetermined flow rate is supplied from the first chemical solution supply source 20 to the first in-line mixer 72.

When the DIW supply valve 86 on the DIW supply pipe 81 is opened, DIW is supplied from the DIW supply source 10 to the CLC 111 of the DIWCLC box 110. First DIW supply valve 11
By opening 2, DIW is supplied from the DIWCLC box 110 to the first in-line mixer 72. At this time, the second DIW supply valve 113 is closed.

  The first chemical solution supplied to the first in-line mixer 72 and DIW are mixed. The first cleaning chemical liquid generated in this way is supplied to the chemical cleaning section 220 via the first cleaning chemical liquid pipe 96.

  While the first cleaning chemical solution is supplied to the chemical cleaning unit 220, the supply of the second chemical solution to the second in-line mixer 73 is stopped. Specifically, the second chemical liquid inlet valve 61 of the chemical liquid utility box 60 and / or the second chemical liquid supply valve 132 of the second chemical liquid CLC box 130 are closed. Accordingly, the second cleaning chemical solution is not supplied to the chemical cleaning unit 220, and only the first cleaning chemical solution is supplied.

  In the chemical solution supply apparatus 100 according to the present embodiment, the first cleaning chemical solution and the second cleaning chemical solution can be supplied alternately. When switching from the first cleaning chemical to the second cleaning chemical, the first DIW supply valve 112 of the DIWCLC box 110 is closed and the second DIW supply valve 113 is opened. As a result, DIW is supplied from the DIWCLC box 110 to the second in-line mixer 73. Subsequently, the second chemical liquid inlet valve 61 of the chemical liquid utility box 60 is opened. The flow rate of the second chemical solution is adjusted by the CLC 131 of the second chemical solution CLC box 130, and the second chemical solution having a predetermined flow rate is supplied from the second chemical solution supply source 30 to the second in-line mixer 73. The second chemical liquid supplied to the second in-line mixer 73 and DIW are mixed. The second cleaning chemical liquid thus generated is supplied to the chemical cleaning section 220 via the second cleaning chemical pipe 97.

  While the second cleaning chemical is supplied to the chemical cleaning unit 220, the supply of the first chemical to the first in-line mixer 72 is stopped. Specifically, the first chemical liquid inlet valve 51 of the chemical liquid utility box 50 and / or the first chemical liquid supply valve 122 of the first chemical liquid CLC box 120 are closed. Thereby, the first cleaning chemical solution is not supplied to the chemical cleaning unit 220, and only the second cleaning chemical solution is supplied.

  Further, when switching from the second cleaning chemical to the first cleaning chemical, the second DIW supply valve 113 of the DIWCLC box 110 is closed and the first DIW supply valve 112 is opened. Further, the first chemical liquid inlet valve 51 of the chemical liquid utility box 50 is opened, and the first chemical liquid supply valve 122 of the first chemical liquid CLC box 120 is opened. Further, the second chemical liquid inlet valve 61 and / or the second chemical liquid supply valve 132 of the chemical liquid utility box 60 are closed. Accordingly, the second cleaning chemical solution is not supplied to the chemical cleaning unit 220, and only the first cleaning chemical solution is supplied.

  In the present embodiment, the flow ranges of the first chemical liquid and the second chemical liquid whose flow rates are controlled by the first chemical liquid CLC box 120 and the second chemical liquid CLC box 130 are, for example, 30 ml / min or more and 300 ml / min or less, respectively. is there. The flow rate range of DIW whose flow rate is controlled by the DIWCLC box 110 is, for example, 200 ml / min or more and 2000 ml / min or less. Therefore, the dilution ratio between the first chemical solution or the second chemical solution and DIW is 1: 1 or more and 1:65 or less.

As described above, in the chemical solution supply apparatus 100 according to the present embodiment, the DIWCLC box 110 that controls the flow rate of DIW supplied from the DIW supply source 10 to the first inline mixer 72 or the second inline mixer 73 is provided. Have. The chemical solution supply apparatus 100 switches the DIW supply destination between the first in-line mixer 72 and the second in-line mixer 73. Therefore, DI supplied to the first in-line mixer 72 and the second in-line mixer 73.
By controlling the flow rate of W, it is possible to flexibly cope with a change in the dilution ratio of the first chemical solution and the second chemical solution.

  In the present embodiment, since the first chemical solution and the second chemical solution can be diluted by the common DIWCLC box 110, there is no need to provide two DIW flowmeters as in the prior art, and the chemical solution supply apparatus 100 is enlarged. Can be suppressed. In other words, the number of DIW flow meters can be reduced as compared with the prior art, so that the device cost can be reduced.

  When diluting the first chemical and the second chemical using two DIW flowmeters as in the past, the error (instrument difference) between the two DIW flowmeters is different, so set the same dilution ratio. Even if the first chemical solution and the second chemical solution are diluted, the same dilution ratio may not be obtained due to the above-described instrumental difference. On the other hand, in the chemical solution supply apparatus 100 according to the present embodiment, the first chemical solution and the second chemical solution can be diluted by the common DIWCLC box 110. Therefore, the first chemical solution caused by the instrumental difference of the DIWCLC box 110 is used. And the difference in the dilution ratio of the second chemical solution can be eliminated.

Further, in the chemical solution supply apparatus 100 according to the present embodiment, the supply of the second chemical solution is stopped while the first cleaning chemical solution is supplied to the chemical solution cleaning unit 220 of the cleaning device 200, and the second cleaning chemical solution is supplied to the chemical solution cleaning unit. While being supplied to 220, the supply of the first chemical solution is stopped. Accordingly, the first chemical liquid that is an alkaline chemical liquid and the second chemical liquid that is an acidic chemical liquid are prevented from being mixed during cleaning in the cleaning apparatus 200, and toxic gas generated by mixing the alkaline chemical liquid and the acidic chemical liquid is prevented. Occurrence can be prevented.
Second Embodiment
Next, a chemical solution supply apparatus according to a second embodiment of the present invention will be described. FIG. 3 is a chemical solution supply flow chart of the chemical solution supply apparatus 100 according to the second embodiment of the present invention. The chemical solution supply apparatus 100 according to the second embodiment is the same as the chemical solution supply apparatus 100 shown in FIG.

  The second embodiment is different from the first embodiment in that the cleaning device 200 includes two DIW cleaning units and two chemical cleaning units. Accordingly, the DIWCLC box 110, the first chemical liquid CLC box 120, and the second chemical liquid CLC box 130 of the chemical liquid supply apparatus 100 are different from the first embodiment in that each has two CLCs. In addition, the number of valves and chemical utility boxes and the piping configuration are also different from those of the first embodiment. The following description will focus on the parts different from the first embodiment, and the same components as those in the first embodiment will be denoted by the same reference numerals and description thereof will be omitted.

As shown in FIG. 3, the chemical solution supply apparatus 100 is configured to be in fluid communication with a DIW supply source 10a for supplying DIW via a pipe.
The cleaning apparatus 200 includes a DIW cleaning unit 210a that cleans an object to be cleaned such as a semiconductor substrate polished by the polishing apparatus using DIW, and a chemical solution (diluted cleaning object such as a semiconductor substrate polished by the polishing apparatus). And a chemical cleaning unit 220a for cleaning using a cleaning chemical). Similar to the DIW cleaning unit 210, the DIW cleaning unit 210a includes, for example, an ultrasonic water cleaning unit and other DIW cleaning units. Similarly to the chemical solution cleaning unit 220, the chemical solution cleaning unit 220a includes, for example, a roll type cleaning unit. The DIW cleaning unit 210a and the chemical solution cleaning unit 220a coexist in the same cleaning tank 230a.

The chemical liquid supply apparatus 100 mixes the first chemical liquid and DIW to generate a first cleaning chemical liquid, and mixes the second chemical liquid and DIW with the second cleaning. A second in-line mixer 73a (second mixing unit) that generates a chemical solution. The first chemical liquid CLC box 120 is configured to control the flow rate of the first chemical liquid supplied from the first chemical liquid supply source 20 to the first in-line mixer 72a. The second chemical liquid CLC box 130 is configured to control the flow rate of the second chemical liquid supplied from the second chemical liquid supply source 30 to the second in-line mixer 73a. The DIWCLC box 110 is configured to control the flow rate of DIW supplied from the DIW supply source 10a to the first in-line mixer 72a or the second in-line mixer 73a.

  The first in-line mixer 72a is configured to supply the generated first cleaning chemical liquid to the chemical cleaning section 220a. Similarly, the second in-line mixer 73a is configured to supply the generated second cleaning chemical to the chemical cleaning unit 220a.

  The DIWCLC box 110 includes a first DIW supply valve 112a, a second DIW supply valve 113a, and a CLC 111a. The first DIW supply valve 112a supplies DIW for dilution from the DIW supply source 10a to the first in-line mixer 72a. The second DIW supply valve 113a supplies DIW for dilution from the DIW supply source 10a to the second in-line mixer 73a. The CLC 111a adjusts the flow rate supplied to the first DIW supply valve 112a and the second DIW supply valve 113a. The CLC 111a measures the flow rate of DIW flowing through the CLC 111a. Based on the measurement result, the CLC 111a adjusts (feedback control) the opening of the CLC 111a internal control valve so that the flow rate of DIW flowing in the CLC 111a becomes a desired flow rate.

  The DIWCLC box 110 supplies DIW to the first in-line mixer 72a by closing the second DIW supply valve 113a and opening the first DIW supply valve 112a. On the other hand, the DIWCLC box 110 supplies DIW to the second in-line mixer 73a by closing the first DIW supply valve 112a and opening the second DIW supply valve 113a. That is, the DIWCLC box 110, the first DIW supply valve 112a, and the second DIW supply valve 113a function as a dilution water supply switching unit that switches the DIW supply destination between the first inline mixer 72a and the second inline mixer 73a. To do.

  The first chemical liquid CLC box 120 has a first chemical liquid supply valve 122a for supplying the first chemical liquid from the first chemical liquid supply source 20 to the first in-line mixer 72a, and a flow rate of the first chemical liquid flowing through the first chemical liquid supply valve 122a. CLC 121a to be measured. CLC121a measures the flow volume of the 1st chemical | medical solution which flows into CLC121a. Based on the measurement result, the CLC 121a adjusts (feedback control) the opening of the CLC 121a internal control valve so that the flow rate of the first chemical flowing in the CLC 121a becomes a desired flow rate.

  The second chemical liquid CLC box 130 has a second chemical liquid supply valve 132a for supplying the second chemical liquid from the second chemical liquid supply source 30 to the second in-line mixer 73a, and a flow rate of the second chemical liquid flowing through the second chemical liquid supply valve 132a. CLC 131a to be measured. CLC131a measures the flow volume of the 2nd chemical | medical solution which flows into CLC131a. Based on the measurement result, the CLC 131a adjusts (feedback control) the opening of the CLC 131a internal control valve so that the flow rate of the second chemical flowing in the CLC 131a becomes a desired flow rate.

  The chemical solution supply apparatus 100 includes a chemical solution utility box 50a and a chemical solution utility box 60a. The chemical liquid utility box 50 a introduces the first chemical liquid from the first chemical liquid supply source 20 into the CLC 121 a of the first chemical liquid CLC box 120. The chemical liquid utility box 60 a introduces the second chemical liquid from the second chemical liquid supply source 30 into the CLC 131 a of the second chemical liquid CLC box 130.

The chemical liquid utility box 50a includes a first chemical liquid inlet valve 51a provided on a pipe 91a that connects the first chemical liquid supply source 20 and the CLC 121a of the first chemical liquid CLC box 120, and a pressure gauge that measures the fluid pressure in the pipe 91. 52a. The first chemical liquid inlet valve 51a is controlled to open and close by a control device (not shown), for example, and supplies the first chemical liquid to the pipe 91a.

  Similarly, the chemical liquid utility box 60a measures the second chemical liquid inlet valve 61a provided on the pipe 92a connecting the second chemical liquid supply source 30 and the CLC 131a of the second chemical liquid CLC box 130, and the fluid pressure in the pipe 92a. A pressure gauge 62a is provided. The second chemical liquid inlet valve 61a is controlled to open and close by a control device (not shown), for example, and supplies the second chemical liquid to the pipe 92a.

  The chemical solution supply apparatus 100 includes a DIW supply pipe 81 a having one end connected to the DIW supply source 10 a and the other end connected to the DIW cleaning unit 210 a of the cleaning apparatus 200. The DIW supply pipe 81a is provided with a DIW supply valve 86a, a DIW pressure adjustment regulator 87a, and a DIW pressure gauge 88a. The DIW supply valve 86a is opened and closed to control the supply of DIW from the DIW supply source 10a to the DIW supply pipe 81a. The DIW pressure adjustment regulator 87a adjusts the supply pressure of DIW from the DIW supply pipe 81a to the DIW cleaning unit 210a. The DIW pressure gauge 88a measures the pressure of DIW passing through the inside of the DIW supply pipe 81a.

  A DIW branch pipe 82a having one end connected to the CLC 111a of the DIWCLC box 110 is connected between the DIW supply valve 86a and the DIW pressure adjustment regulator 87a on the DIW supply pipe 81a. Connected to the CLC 111a is a first DIW pipe 83a in fluid communication with the first in-line mixer 72a and a second DIW pipe 84a in fluid communication with the second in-line mixer 73a. The first DIW supply valve 112a is provided on the first DIW pipe 83a, and is controlled to be opened and closed when DIW is supplied to the first in-line mixer 72a. The second DIW supply valve 113a is provided on the second DIW pipe 84a and is controlled to be opened and closed when DIW is supplied to the second in-line mixer 73a.

  A first chemical liquid pipe 93 a that is in fluid communication with the first in-line mixer 72 a is connected to the CLC 121 a of the first chemical liquid CLC box 120. The first chemical liquid supply valve 122a is provided on the first chemical liquid pipe 93a, and is controlled to be opened and closed when the first chemical liquid is supplied to the first in-line mixer 72a. Connected to the first in-line mixer 72a is a first cleaning chemical pipe 96a having one end connected to the chemical cleaning section 220a.

  A second chemical liquid pipe 94 a that is in fluid communication with the second in-line mixer 73 a is connected to the CLC 131 a of the second chemical liquid CLC box 130. The second chemical liquid supply valve 132a is provided on the second chemical liquid pipe 94a, and is controlled to be opened and closed when the second chemical liquid is supplied to the second in-line mixer 73a. The second in-line mixer 73a is connected to a second cleaning chemical solution pipe 97a having one end connected to the chemical cleaning unit 220.

  The CLC 111a of the DIWCLC box 110, the CLC 121a of the first chemical liquid CLC box 120, and the CLC 131a of the second chemical liquid CLC box 130 are configured to receive a signal indicating a predetermined flow rate value from a control device (not shown). Based on this flow rate value, the opening degree of the internal control valve of the CLC 111a, CLC 121a, and CLC 131a is controlled.

Next, a chemical solution supply process in the chemical solution supply apparatus 100 shown in FIG. 3 will be described. In the chemical solution supply apparatus 100 according to the second embodiment, the first cleaning chemical solution or the second cleaning chemical solution can be supplied to the chemical solution cleaning unit 220 as described in the first embodiment, and the chemical solution cleaning unit 220a can also be configured as the first. The first cleaning chemical solution or the second cleaning chemical solution can be supplied. Since the process of supplying the first cleaning chemical solution or the second cleaning chemical solution to the chemical cleaning unit 220 is the same as that of the first embodiment, the description is omitted, and the first cleaning chemical solution or the second cleaning chemical solution is supplied to the chemical cleaning unit 220a. Describe the process.

  When supplying the first cleaning chemical liquid to the chemical cleaning section 220a of the cleaning device 200, first, the first chemical liquid inlet valve 51a of the chemical liquid utility box 50a is opened. The flow rate of the first chemical solution is adjusted by the CLC 121a of the first chemical solution CLC box 120, and the first chemical solution having a predetermined flow rate is supplied from the first chemical solution supply source 20 to the first in-line mixer 72a.

  The DIW supply valve 86a on the DIW supply pipe 81a is opened, and DIW is supplied from the DIW supply source 10a to the CLC 111a of the DIWCLC box 110. By opening the first DIW supply valve 112a, DIW is supplied from the DIWCLC box 110 to the first in-line mixer 72a. At this time, the second DIW supply valve 113a is closed.

  The first chemical solution and DIW supplied to the first in-line mixer 72a are mixed. The first cleaning chemical liquid thus generated is supplied to the chemical cleaning section 220a via the first cleaning chemical liquid pipe 96a.

  While the first cleaning chemical solution is supplied to the chemical cleaning unit 220a, the supply of the second chemical solution to the second in-line mixer 73a is stopped. Specifically, the second chemical liquid inlet valve 61a of the chemical liquid utility box 60a and / or the second chemical liquid supply valve 132a of the second chemical liquid CLC box 130 are closed. Accordingly, the second cleaning chemical solution is not supplied to the chemical cleaning unit 220a, and only the first cleaning chemical solution is supplied.

  In the chemical solution supply apparatus 100 according to the second embodiment, the first cleaning chemical solution and the second cleaning chemical solution can be alternately supplied not only to the chemical solution cleaning unit 220 but also to the chemical solution cleaning unit 220a. When switching from the first cleaning chemical to the second cleaning chemical, the DIWCLC box 110 closes the first DIW supply valve 112a and opens the second DIW supply valve 113a. Thereby, DIW is supplied from the DIWCLC box 110 to the second in-line mixer 73a.

  Moreover, the 2nd chemical | medical solution inlet valve 61a of the chemical | medical solution utility box 60a opens. The flow rate of the second chemical solution is adjusted by the CLC 131a of the second chemical solution CLC box 130, and the second chemical solution having a predetermined flow rate is supplied from the second chemical solution supply source 30 to the second in-line mixer 73a.

  The second chemical solution and DIW supplied to the second in-line mixer 73a are mixed. The second cleaning chemical liquid generated in this way is supplied to the chemical cleaning section 220a via the second cleaning chemical pipe 97a.

  While the second cleaning chemical is supplied to the chemical cleaning unit 220a, the supply of the first chemical to the first in-line mixer 72a is stopped. Specifically, the first chemical liquid inlet valve 51a of the chemical liquid utility box 50a and / or the first chemical liquid supply valve 122a of the first chemical liquid CLC box 120 are closed. Thereby, the first cleaning chemical solution is not supplied to the chemical cleaning unit 220a, and only the second cleaning chemical solution is supplied.

Further, when switching from the second cleaning chemical to the first cleaning chemical, the second DIW supply valve 113a of the DIWCLC box 110 is closed and the first DIW supply valve 112a is opened. Further, the first chemical liquid inlet valve 51a of the chemical liquid utility box 50a is opened, and the first chemical liquid supply valve 122a of the first chemical liquid CLC box 120 is opened. Further, the second chemical liquid inlet valve 61a and / or the second chemical liquid supply valve 132a of the chemical liquid utility box 60a are closed. Accordingly, the second cleaning chemical solution is not supplied to the chemical cleaning unit 220a, and only the first cleaning chemical solution is supplied.

  In the present embodiment, the flow ranges of the first chemical liquid and the second chemical liquid whose flow rates are controlled by the CLC 121, 121a of the first chemical liquid CLC box 120 and the CLC 131, 131a of the second chemical liquid CLC box 130 are, for example, 30 ml, respectively. / Min to 300 ml / min. Further, the flow range of DIW whose flow rate is controlled by the CLCs 111 and 111a of the DIWCLC box 110 is, for example, 200 ml / min or more and 2000 ml / min or less, respectively. Therefore, the dilution ratio between the first chemical solution or the second chemical solution and DIW is 1: 1 or more and 1:65 or less.

  The chemical liquid supply apparatus 100 according to the second embodiment has the same advantages as the chemical liquid supply apparatus 100 according to the first embodiment. In addition, the chemical liquid supply apparatus 100 according to the second embodiment can alternately supply the first cleaning chemical liquid and the second cleaning chemical liquid to the two chemical liquid cleaning units 220 and 220a.

  In the second embodiment, the first chemical cleaning solution and the second cleaning chemical solution are supplied to the two chemical cleaning units 220 and 220a. However, the present invention is not limited thereto, and the first chemical cleaning unit includes three or more chemical cleaning units. The cleaning chemical solution and the second cleaning chemical solution may be supplied. In that case, the number of CLCs corresponding to the chemical liquid cleaning unit may be added to the DIWCLC box 110, the first chemical liquid CLC box 120, and the second chemical liquid CLC box 130.

  In the first embodiment and the second embodiment, the first chemical liquid is an alkaline chemical liquid and the second chemical liquid is an acidic chemical liquid. On the contrary, the first chemical liquid is an acidic chemical liquid, The two chemicals may be alkaline chemicals.

<Third Embodiment>
Next, a cleaning unit according to a third embodiment of the present invention will be described. FIG. 4 is a schematic side view showing a chemical liquid supply apparatus included in the cleaning unit according to the third embodiment. The chemical liquid supply apparatus is configured to be able to supply a chemical liquid such as hydrofluoric acid or ammonia to a cleaning apparatus for cleaning each part of the CMP apparatus.

  As shown in FIG. 4, the chemical solution supply apparatus 100 according to this embodiment includes a frame 102 and a chemical solution dilution box 140 for diluting the chemical solution with DIW (diluted water) and supplying the diluted chemical solution (cleaning chemical solution). And having. In the illustrated example, four chemical solution dilution boxes 140 are provided in the chemical solution supply apparatus 100. However, this is an example, and the number of the chemical solution dilution boxes 140 is appropriately changed according to the specifications of the cleaning device. As illustrated, the chemical dilution box 140 is accommodated in the frame 102. The chemical dilution box 140 is configured to mix DIW from a DIW supply source 10 to be described later and a chemical from the chemical supply source 40 so as to supply the cleaning chemical to the cleaning device 200 (see FIG. 6).

Although not shown, the chemical solution supply apparatus 100 has piping, valves, pressure gauges, and the like for transporting DIW or chemical solution. These details will be described with reference to FIG.
FIG. 5 is a schematic perspective view illustrating a cleaning device included in the cleaning unit according to the third embodiment. The cleaning apparatus is an apparatus for cleaning each part of the semiconductor substrate and the CMP apparatus using the cleaning chemical liquid supplied from the chemical liquid supply apparatus 100 shown in FIG.

As illustrated in FIG. 5, the cleaning apparatus 200 includes a frame 201, a chemical solution cleaning unit 220 that cleans a semiconductor substrate or the like using a cleaning chemical solution, and a plurality of chemical solution supply boxes 240 that supply the cleaning solution to the chemical solution cleaning unit 220. Have. In the illustrated example, the cleaning apparatus 200 includes four chemical liquid cleaning units 220 and two chemical liquid supply boxes 240. However, this is an example, and the number of the cleaning apparatuses 200 is appropriately determined according to the specifications of the cleaning apparatus 200. Be changed.

Although not shown, the cleaning device 200 includes piping, valves, pressure gauges, and the like for transporting DIW or a chemical solution. These details will be described with reference to FIG.
The chemical supply box 240 has a flow meter for measuring the flow rate of the cleaning chemical supplied to the chemical cleaning unit 220 (see FIG. 6). As this flow meter, an orifice flow meter that measures the flow rate from the differential pressure of the fluid has been conventionally used. However, in recent years, ultrasonic flow meters capable of measuring the flow rate of cleaning chemicals have been developed. Since the ultrasonic flow meter has a wider flow rate measurement range than the orifice flow meter, in this embodiment, the ultrasonic flow meter is employed as the flow meter of the chemical solution supply box 240.

  On the other hand, since the ultrasonic flowmeter measures the flow rate based on the ultrasonic wave propagating in the pipe, if bubbles are present in the pipe, the ultrasonic wave is scattered and it is difficult to perform accurate measurement. Therefore, in this embodiment, the position of the flow meter included in the chemical solution supply box 240 is set lower than the position of the nozzle that supplies the cleaning chemical solution to the chemical solution cleaning unit 220. Thereby, the bubbles in the pipe of the flow meter are easily moved toward the nozzle, and the bubbles in the pipe are suppressed from staying in the flow meter.

  In the present embodiment, the flow meter is configured such that the flow direction of the cleaning chemical liquid passing through the flow meter included in the chemical liquid supply box 240 is directed in the vertical direction. Further, the flow meter is configured so that the cleaning chemical liquid passing through the flow meter flows from the bottom to the top. Thereby, since the bubbles in the pipe of the flow meter move upward, the bubbles in the pipe are further suppressed from staying in the flow meter.

  Next, the cleaning unit according to this embodiment will be described in detail. FIG. 6 is a schematic view of a cleaning unit according to the third embodiment. As shown in the figure, the cleaning unit includes the chemical solution supply device 100 (corresponding to an example of the cleaning chemical solution supply device) shown in FIG. 4 and the cleaning device 200 (corresponding to an example of the substrate cleaning device) shown in FIG. Have. In FIG. 6, one of the four chemical solution dilution boxes 140 shown in FIG. 4 is shown, and one of the two chemical solution supply boxes 240 shown in FIG. One of them is shown.

  The chemical solution supply apparatus 100 is configured to be in fluid communication with a DIW supply source 10 for supplying DIW and a chemical solution supply source 40 for supplying a chemical solution such as hydrofluoric acid and ammonia, respectively, via pipes. Yes. Further, the chemical solution supply apparatus 100 is configured to be in fluid communication with the cleaning apparatus 200. Specifically, the chemical solution supply device 100 is in fluid communication with the cleaning device 200 so that DIW and diluted chemical solution can be supplied to the cleaning device 200.

  The cleaning apparatus 200 includes a DIW cleaning unit 210 for cleaning an object using DIW, and a chemical solution cleaning unit 220 for cleaning the cleaning target object using a diluted chemical solution (cleaning chemical solution). The DIW cleaning unit 210 includes, for example, an ultrasonic water cleaning unit and other DIW cleaning units, and cleans an object to be cleaned such as a semiconductor substrate polished by a CMP apparatus and each part of the CMP apparatus using DIW. . The chemical cleaning unit 220 includes, for example, a roll-type cleaning unit or a pen-type cleaning unit, and cleans an object to be cleaned such as a semiconductor substrate polished by a CMP apparatus.

  The chemical solution supply apparatus 100 includes a chemical solution dilution box 140 for diluting the chemical solution with DIW (dilution water) and supplying the diluted chemical solution (cleaning chemical solution) to the chemical solution cleaning unit 220 of the cleaning device 200.

The chemical solution dilution box 140 includes an in-line mixer 115 (corresponding to an example of a mixing unit), a DIWCLC 111b (corresponding to an example of a dilution water flow rate control unit mixing unit), and a chemical solution CLC11.
3b (corresponding to an example of a chemical liquid flow rate control unit mixing unit). The in-line mixer 115 mixes the chemical and DIW to generate a cleaning chemical. The DIWCLC 111b adjusts the flow rate of DIW supplied from the DIW supply source 10 to the in-line mixer 115. The chemical liquid CLC 113b adjusts the flow rate of the chemical liquid supplied from the chemical liquid supply source 40 to the in-line mixer 115. The in-line mixer 115 is configured to supply the generated cleaning chemical solution to the chemical cleaning unit 220.

  The chemical solution dilution box 140 further includes a DIW supply valve 112 b for supplying DIW for dilution from the DIW supply source 10 to the in-line mixer 115. The DIWCLC 111b includes an ultrasonic flow meter (corresponding to an example of a third ultrasonic flow meter) for measuring the flow rate of DIW flowing through the DIWCLC 111b. Based on the flow rate measurement result, the DIWCLC 111b adjusts (feedback control) the opening of the internal control valve so that the flow rate of DIW flowing in the DIWCLC 111b becomes a desired flow rate.

  The chemical solution dilution box 140 further includes a chemical solution supply valve 114 b for supplying the chemical solution from the chemical solution supply source 40 to the in-line mixer 115. The chemical liquid CLC 113b includes an ultrasonic flow meter (corresponding to an example of a second ultrasonic flow meter) for measuring the flow rate of the chemical liquid flowing through the chemical liquid CLC 113b. Based on the measurement result of the flow rate, the chemical solution CLC 113b adjusts (feedback control) the opening of the internal control valve so that the flow rate of the chemical solution flowing in the chemical solution CLC 113b becomes a desired flow rate.

  The chemical solution dilution box 140 includes a chemical solution inlet valve 51b provided on a pipe 91b that connects the chemical solution supply source 40 and the chemical solution CLC 113b, and a pressure gauge 52b that measures the fluid pressure in the pipe 91b. The chemical solution inlet valve 51b is controlled to be opened and closed by a control device (not shown), for example.

  The chemical solution supply apparatus 100 includes a DIW supply pipe 81b having one end connected to the DIW supply source 10 and the other end connected to the DIW cleaning unit 210 of the cleaning apparatus 200. The DIW supply pipe 81b is provided with a DIW supply valve 86b, a DIW pressure adjustment regulator 87b, and a DIW pressure gauge 88b. The DIW supply valve 86b controls the supply of DIW from the DIW supply source 10 to the DIW supply pipe 81b by being opened and closed. The DIW pressure adjustment regulator 87b adjusts the supply pressure of DIW from the DIW supply pipe 81b to the DIW cleaning unit 210. The DIW pressure gauge 88b measures the pressure inside the DIW supply pipe 81.

  A DIW branch pipe 82b having one end connected to the DIWCLC 111b is connected between the DIW supply valve 86b and the DIW pressure adjustment regulator 87b on the DIW supply pipe 81b. A DIW pipe 83 b that is in fluid communication with the in-line mixer 115 is connected to the DIWCLC 111 b. The DIW supply valve 112b is provided on the DIW pipe 83b and is controlled to be opened and closed when DIW is supplied to the in-line mixer 115.

  A chemical liquid pipe 84 b that is in fluid communication with the in-line mixer 115 is connected to the chemical liquid CLC 113 b of the chemical liquid dilution box 140. The chemical liquid supply valve 114b is provided on the chemical liquid pipe 84b and supplies the chemical liquid into the chemical liquid pipe 84b. A cleaning chemical solution pipe 96 b having one end connected to the cleaning device 200 is connected to the in-line mixer 115.

  The DIWCLC 111b and the chemical CLC 113b of the chemical dilution box 140 are configured to be able to receive a signal indicating a predetermined flow rate value from a control device (not shown). Based on this flow rate value, the opening degree of the internal control valve of the DIWCLC 111b and the chemical liquid CLC 113b is controlled.

  The chemical solution cleaning unit 220 of the cleaning apparatus 200 supplies a cleaning chemical solution to the upper surface of the polished substrate for cleaning, and a lower surface cleaning unit 223 for supplying a cleaning chemical solution to the lower surface of the polished substrate for cleaning. And comprising. In addition, the chemical cleaning unit 220 includes a standby unit 221 on which a substrate that waits for cleaning by the upper surface cleaning unit 222 and the lower surface cleaning unit 223 is disposed. The upper surface cleaning unit 222 and the lower surface cleaning unit 223 function as a substrate cleaning unit that simultaneously cleans the upper and lower surfaces of a single substrate. The standby unit 221 supplies a cleaning chemical solution to the standby substrate in order to prevent the standby substrate from being oxidized.

  The cleaning apparatus 200 includes a cleaning chemical liquid supply pipe 231, a cleaning chemical liquid supply pipe 232, and a cleaning chemical liquid supply pipe 233. The cleaning chemical liquid supply pipe 231 fluidly connects the cleaning chemical liquid pipe 96b and the standby unit 221. The cleaning chemical solution supply pipe 232 allows the cleaning chemical solution pipe 96b and the upper surface cleaning unit 222 to be in fluid communication. The cleaning chemical solution supply pipe 233 allows the cleaning chemical solution pipe 96b and the lower surface cleaning unit 223 to be in fluid communication.

  A cleaning chemical solution supply valve 224 for supplying the cleaning chemical solution to the standby unit 221 and a flow meter 225 for measuring the flow rate of the supplied cleaning chemical solution are provided on the cleaning chemical solution supply pipe 231. A cleaning chemical solution supply valve 226 for supplying the cleaning chemical solution to the upper surface cleaning unit 222 and a flow meter 227 for measuring the flow rate of the supplied cleaning chemical solution are provided on the cleaning chemical solution supply pipe 232. A cleaning chemical solution supply valve 228 for supplying the cleaning chemical solution to the lower surface cleaning unit 223 and a flow meter 229 for measuring the flow rate of the supplied cleaning chemical solution are provided on the cleaning chemical solution supply pipe 233. The flow meters 225, 227, and 229 and the cleaning chemical solution supply valves 224, 226, and 228 are accommodated in the chemical solution supply box 240. The cleaning chemical solution supply valve 224, the cleaning chemical solution supply valve 226, and the cleaning chemical solution supply valve 228 are controlled to be opened and closed by a control device (not shown), for example.

  The downstream end of the cleaning chemical solution supply pipe 231 has a nozzle 231 a for supplying the cleaning chemical solution to the standby unit 221. Further, the downstream end portion of the cleaning chemical solution supply pipe 232 has a nozzle 232 a for supplying the cleaning chemical solution to the upper surface cleaning unit 222. Further, the downstream end portion of the cleaning chemical solution supply pipe 233 has a nozzle 233 a for supplying the cleaning chemical solution to the lower surface cleaning unit 223.

  As described in FIG. 5, the flow meters 225, 227, and 229 in the chemical solution supply box 240 are ultrasonic flow meters (corresponding to an example of a first ultrasonic flow meter), respectively. In order for these flow meters 225, 227, and 229 to measure the flow rate of the cleaning chemical more accurately, in the present embodiment, the corresponding flow meters 225, 227, and 229 rather than the respective positions of the nozzles 231a, 232a, and 233a. The position of 229 is lowered. This makes it easier for bubbles in the pipes of the flow meters 225, 227, and 229 to move toward the nozzles 231a, 232a, and 233a, and prevents bubbles in the pipes from staying in the flow meters 225, 227, and 229. Yes.

  Further, as described with reference to FIG. 5, the flow meters 225, 227, and 229 are configured such that the flow direction of the cleaning chemical passing through the flow meters 225, 227, and 229 is directed in the vertical direction. That is, as shown in FIG. 6, the pipes passing through the flow meters 225, 227, and 229 are arranged in the vertical direction so as to face the vertical direction. Further, the flow meter 225, 227, 229 and the cleaning chemical solution supply pipes 231, 232, 233 are configured so that the cleaning chemical solution passing through the flow meters 225, 227, 229 flows from the bottom to the top. Thereby, since the bubbles in the flow meters 225, 227, and 229 move upward, the bubbles are further suppressed from remaining in the flow meters 225, 227, and 229.

The “vertical direction” here includes not only a complete vertical direction but also a direction having a slight angle with respect to the vertical direction. In other words, in the “vertical direction”, the flow direction of the cleaning chemical solution passing through the flow meters 225, 227, and 229 is such that the bubbles passing through the flow meters 225, 227, and 229 can move upward without remaining. Including the case of having a slight angle with respect to the vertical direction.

  In the present embodiment, the positions of the DIWCLC 111b and the chemical liquid CLC 113b are lower than the positions of the nozzles 231a, 232a, and 233a, similarly to the flow meters 225, 227, and 229 of the chemical liquid supply box 240. Thereby, the bubbles in the ultrasonic flowmeter included in the DIWCLC 111b and the chemical liquid CLC113b are easily moved toward the nozzles 231a, 232a, and 233a, and the bubbles are suppressed from staying in the ultrasonic flowmeter.

  In the example of FIG. 6, the flow direction of DIW and the chemical liquid flowing through the DIWCLC 111b and the chemical liquid CLC 113b is described as being in the horizontal direction (horizontal direction). However, the DIWCLC 111b and the chemical CLC 113b can also be configured so that these flow directions are in the vertical direction. In this case, since bubbles in the ultrasonic flowmeter of DIWCLC 111b and chemical liquid CLC113b move upward, it is possible to further suppress the bubbles from remaining in the ultrasonic flowmeter.

  As described above, since the flow meters 225, 227, and 229 are ultrasonic flowmeters, the chemical solution supply box 240 including the flow meters 225, 227, and 229 can be made smaller than before. Further, since the flow direction of the cleaning chemical liquid passing through the flow meters 225, 227, and 229 is the vertical direction, the chemical liquid supply box 240 including the flow meters 225, 227, and 229 is disposed at the position shown in FIG. be able to. Furthermore, the position of the chemical solution supply box 240 is lower than the positions of the nozzles 231a, 232a, and 233a. Therefore, it is possible to perform flow rate measurement while suppressing measurement errors due to bubbles without increasing the size of the apparatus.

  As mentioned above, although embodiment of this invention was described, embodiment of the invention mentioned above is for making an understanding of this invention easy, and does not limit this invention. The present invention can be changed and improved without departing from the gist thereof, and the present invention includes the equivalents thereof. In addition, any combination or omission of each component described in the claims and the specification is possible within a range where at least a part of the above-described problems can be solved or a range where at least a part of the effect can be achieved. is there.

  Specifically, the characteristic portions of the first to third embodiments can be replaced or combined. For example, when an ultrasonic flow meter is employed as the flow meter of the CLC 111, 121, 131 (see FIG. 2) of the first embodiment, the position of the CLC 111, 121, 131 is set to a nozzle that supplies the cleaning chemical solution to the chemical cleaning unit 220. It can also be lower than the position. Moreover, it replaces with the washing | cleaning apparatus 200 (refer FIG.2 and FIG.3) of 1st Embodiment or 2nd Embodiment, The cleaning apparatus 200 (refer FIG. 6) of 3rd Embodiment is also employable. Further, for example, instead of the chemical solution supply apparatus 100 (see FIG. 6) according to the third embodiment, the chemical solution supply apparatus 100 (see FIGS. 2 and 3) according to the first embodiment or the second embodiment may be employed. .

51, 51a ... first chemical liquid inlet valve 61, 61a ... second chemical liquid inlet valve 72, 72a ... first inline mixer 73, 73a ... second inline mixer 110 ... DIWCLC box 120 ... first chemical liquid CLC box 130 ... first 2 Chemical CLC box 100 ... Chemical supply device 111b ... DIWCLC
113b ... CLC CLC
115 ... Mixer 200 ... Cleaning device 225, 227, 229 ... Flow meter 231a, 232a, 233a ... Nozzle

Claims (12)

A cleaning chemical supply apparatus for supplying a cleaning chemical to a substrate cleaning apparatus,
A first mixing unit for supplying a first cleaning chemical obtained by mixing the first chemical and dilution water to the substrate cleaning apparatus;
A second mixing unit for supplying a second cleaning chemical obtained by mixing the second chemical and dilution water to the substrate cleaning apparatus;
A first chemical control unit for controlling the flow rate of the first chemical supplied to the first mixing unit;
A second chemical control unit for controlling the flow rate of the second chemical supplied to the second mixing unit;
A dilution water control unit for controlling a flow rate of the dilution water supplied to the first mixing unit or the second mixing unit;
A cleaning chemical supply apparatus, comprising: a dilution water supply switching unit for switching the supply destination of the dilution water from the first mixing unit to the second mixing unit, or from the second mixing unit to the first mixing unit. . The first chemical liquid control unit is configured to stop the supply of the first chemical liquid while the second cleaning chemical liquid is being supplied to the substrate cleaning apparatus,
The cleaning chemical solution supply according to claim 1, wherein the second chemical solution control unit is configured to stop the supply of the second chemical solution while the first cleaning chemical solution is supplied to the substrate cleaning apparatus. apparatus.   The dilution water supply switching unit supplies the dilution water to the first mixing unit while the first chemical solution control unit supplies the first chemical solution to the first mixing unit, and the second chemical solution control unit The cleaning chemical solution supply device according to claim 1, wherein the cleaning chemical solution supply device is configured to supply the dilution water to the second mixing unit while supplying the second chemical solution to the second mixing unit. A first chemical supply source for supplying a first chemical to the first chemical controller;
A second chemical liquid supply source for supplying a second chemical liquid to the second chemical liquid control unit;
A first chemical liquid inlet valve provided on a pipe line connecting the first chemical liquid supply source and the first chemical liquid control unit;
The cleaning chemical solution supply according to any one of claims 1 to 3, further comprising: a second chemical solution inlet valve provided on a pipe line connecting the second chemical solution supply source and the second chemical solution control unit. apparatus.   The cleaning chemical solution supply apparatus according to any one of claims 1 to 4, wherein one of the first chemical solution and the second chemical solution is an alkaline chemical solution and the other is an acidic chemical solution. A cleaning chemical supply method for supplying a cleaning chemical to a substrate cleaning apparatus,
Controlling the flow rate of the first chemical solution;
Controlling the flow rate of the dilution water;
Supplying the first chemical and the dilution water to the first mixing unit, and mixing the first chemical and the dilution water;
A first supply step of supplying a first cleaning chemical obtained by mixing the dilution water and the first chemical to the substrate cleaning apparatus;
A step of controlling the flow rate of the second chemical solution;
Switching the supply destination of the dilution water from the first mixing unit to the second mixing unit;
Supplying the second chemical solution and the dilution water to the second mixing unit, and mixing the second chemical solution and the dilution water;
A second supply step of supplying a second cleaning chemical obtained by mixing with the dilution water to the substrate cleaning apparatus;
A method for supplying a cleaning chemical solution. The first supply step includes a step of stopping the supply of the first cleaning chemical solution while the second cleaning chemical solution is supplied to the substrate cleaning apparatus in the second supply step,
The said 2nd supply process has the process of stopping supply of the said 2nd cleaning chemical | medical solution, while the said 1st cleaning chemical | medical solution is supplied to the said board | substrate cleaning apparatus by the said 1st supply process. Cleaning chemical solution supply method.   The cleaning chemical solution supply method according to claim 6 or 7, wherein one of the first chemical solution and the second chemical solution is an alkaline chemical solution and the other is an acidic chemical solution. A cleaning unit having a substrate cleaning device for cleaning a substrate and a cleaning chemical solution supply device for supplying a cleaning chemical solution to the substrate cleaning device,
The substrate cleaning apparatus includes:
A nozzle for supplying a cleaning chemical to the substrate;
A first ultrasonic flowmeter for measuring a flow rate of the cleaning chemical solution supplied to the substrate,
The first ultrasonic flowmeter is a cleaning unit disposed at a position lower than the position of the nozzle. A cleaning unit according to claim 9,
A cleaning unit in which the first ultrasonic flowmeter is configured such that the flow direction of the cleaning chemical passing through the first ultrasonic flowmeter is directed in the vertical direction. The cleaning unit according to claim 9 or 10,
The cleaning chemical solution supply device includes:
A mixing unit for supplying a cleaning chemical obtained by mixing the chemical and dilution water to the substrate cleaning apparatus;
A chemical flow rate control unit for controlling the flow rate of the chemical solution and supplying the chemical solution to the mixing unit;
A dilution water flow rate control unit for controlling the flow rate of the dilution water and supplying the dilution water to the mixing unit,
The chemical liquid flow rate control unit and the dilution water flow rate control unit have a second ultrasonic flow meter and a third ultrasonic flow meter, respectively.
The cleaning unit, wherein the second ultrasonic flow meter and the third ultrasonic flow meter are disposed at a position lower than the position of the nozzle. The cleaning unit according to claim 11, wherein
The second ultrasonic flowmeter and the third ultrasonic flowmeter are arranged such that the flow direction of the dilution water flowing through the second ultrasonic flowmeter and the flow direction of the chemical liquid passing through the third ultrasonic flowmeter are directed in the vertical direction. A cleaning unit in which an ultrasonic flowmeter is placed.

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