JP2016006562A - Conductive laminate for touch panel and transparent conductive film for touch panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a conductive laminate for a touch panel and a transparent conductive film for a touch panel, which can give a touch panel having an image with excellent patterning property and visibility while showing high transparency and conductivity.SOLUTION: The conductive laminate for a touch panel includes a pale color layer, an electrode layer, and a photosensitive layer, successively formed on a transparent plastic film substrate. The transparent conductive film for a touch panel is produced by processing the conductive layer into mesh-like copper wiring lines by photolithography.

Description

  The present invention relates to a conductive laminate for a touch panel and a transparent conductive film for a touch panel, which provide an image touch panel sensor that exhibits high transparency and conductivity while having excellent patternability and visibility.

In recent years, an example in which a touch panel is mounted on a display device such as an electronic paper, a liquid crystal display, and an organic EL display is increasing. This is because touch panels can be input easily and sensuously, and are currently installed in many products, most of which are capacitive touch panels. There are two types of capacitive touch panels: surface type and projection type. Both types detect the position by detecting the change in capacitance between the fingertip and the electrode layer of the touch panel. The projected capacitance method can detect multiple points and has a configuration in which a substrate on which an electrode layer and an IC are mounted is covered with a transparent resin.

A sensor having an electrode part for detecting an input operation of a touch panel is composed of an indium-tin composite oxide (ITO), which is mainly a transparent conductive material, on a transparent substrate such as glass or plastic film, and an X-axis electrode. Mosaic electrodes composed of a set of Y-axis electrodes are formed.

Conventionally, it has been used for relatively small electronic devices such as mobile phones, smartphones, personal digital assistants, etc., but recently it has been adopted for medium and large displays such as car navigation systems, medical display devices, and beverage vending machines. . In addition, as demand increases, there is an increasing demand for lower prices of sensors. For this reason, replacement of glass substrates with transparent plastic film substrates that are inexpensive and excellent in productivity is also being carried out.

  ITO has a relatively high sheet resistance value of about 100Ω / □. When used in a small electronic device, there are few troubles. However, when the medium and large size is used, the sheet resistance value is high, resulting in problems such as a slow response speed and frequent malfunctions. In the case of a glass substrate, the firing temperature is raised to lower the resistance value, but in the case of a plastic substrate having low heat resistance, the upper limit of the heat treatment temperature is 100 to 180 ° C., and the sheet resistance is lowered. Is not easy.

  For this reason, recently, a conductive metal fine wire, a silver salt, or a conductive polymer has been proposed as a transparent conductive material replacing ITO.

Patent Document 1 proposes a method in which metal nanowires are dispersed in a resin matrix on a triacetylcellulose (TAC) film to form a conductive layer in which the nanowires have a network structure. Patent Document 2 discloses that a photosensitive material having a silver salt emulsifier layer is coated, exposed and developed on a support substrate to form a conductive pattern of metallic silver. Patent Document 3 describes a method of laminating a transparent conductive film containing a conductive polymer such as polythiophene and an ultraviolet blocking layer. Also. Patent Document 4 proposes a method for producing a transparent film substrate, which is characterized in that fine metal wires are formed into a mesh structure by a photolithography method.

JP 2014-17110 A JP 2012-146548 A JP 2014-71484 A JP 2014-29614 A

  However, migration resistance without short circuit due to transition of conductive metal, low sheet resistance to increase the response speed of touch panel operation, transparent for touch panel satisfying all excellent visibility which means that mesh-like wiring is hard to be seen It is difficult to obtain a conductive film. The present invention has been made in view of this situation, and provides a conductive laminate for a touch panel and a transparent conductive film for a touch panel that can obtain a touch panel sensor that simultaneously satisfies excellent visibility and low sheet resistance. It is intended.

  Visibility means whether the wiring corresponding to the electrode portion is easily visible or difficult for a person operating the touch panel. If the wiring is easy to see, the clarity of the screen and characters displayed on the touch panel is lowered, making it difficult to see the display content and operability. In addition, the fatigue level of the operator is increased. That is, good visibility as used in the present invention indicates that the wiring portion is difficult to be recognized.

  Two factors can be cited as factors that make the wiring easier to see, that is, the visibility decreases. One is that the width of the wiring is thick. The other is that the hue difference between the wiring that is the electrode portion and the transparent non-conductive portion without the wiring is increased. Accordingly, the present invention improves the visibility by simultaneously satisfying the thinning of the wiring and the reduction of the hue difference between the wiring that is the electrode portion and the transparent non-conductive portion having no wiring. The copper wiring has a reddish color, and since the hue difference with the transparent non-conductive portion is large, the wiring becomes easy to see. For this reason, it is required to form a light-colored layer having a white or silver color having a smaller hue difference or a color close thereto.

The present invention is characterized in that a light-colored layer is formed between a transparent plastic film substrate and a conductive layer in order to improve visibility, and a positive photosensitive layer is formed in order to thin the wiring. . More specifically, the present invention provides the following conductive laminate for touch panel sensor and touch panel sensor, and the present invention has the following configuration.
(1) A transparent plastic film substrate, a light-colored layer having a thickness of 1 to 50 nm, a conductive layer made of copper, and a positive photosensitive layer having a dry thickness of 0.5 to 5 μm are laminated in this order. Conductive laminate for touch panel.
(2) A conductive laminate for a touch panel in which the light-colored layer is made of nickel or copper nitride.
(3) A transparent conductive material for a touch panel, characterized in that the conductive layer is processed into a mesh-like electrode wiring having a line width of 1 to 10 μm by a photolithography method comprising a pattern exposure, development, and etching process for the conductive laminate for the previous touch panel. Sex film.

According to the present invention, the wiring width can be reduced to 10 μm or less, and a high transparency and a low sheet resistance value can be obtained by forming a light-colored layer having a color of white to silver or a color close to that of the copper layer. In addition, a conductive laminate for a touch panel and a transparent conductive film for a touch panel having excellent visibility can be provided.

It is sectional drawing of the electroconductive laminated body for touchscreens. It is sectional drawing of the transparent conductive film for touchscreens. It is a top view of copper fine wire wiring (mesh structure) of a touch panel sensor.

<Structure of conductive laminate for touch panel>
The structure of the conductive laminate for touch panel is shown in FIG. The conductive laminate for a touch panel has a structure in which a light color layer 3, a conductive layer 4, and a positive photosensitive layer 5 are laminated in this order on a transparent plastic film substrate 2 having a hard coat layer 1.

<Transparent plastic film substrate>
It is desirable that the plastic film substrate of the present invention is a colorless material excellent in light transmittance and transparency. As a resin constituting such a substrate, triacetyl acetate (TAC), polyamide, polycarbonate, polystyrene, polyethylene, polypropylene, amorphous polyolefin, acrylic resin, methacrylic resin, polyethylene terephthalate (PET), polyethylene naphthalate (PEN) However, PET is preferable from the viewpoint of optical properties, mechanical properties, and price.

  The thickness of the substrate is appropriately selected according to the intended use. Generally, it is 5 to 500 μm, but 10 to 250 μm is particularly preferable. If the thickness is 5 μm or less, the strength and rigidity of the film substrate are insufficient, and handling becomes difficult. On the other hand, when the thickness is 500 μm or more, the rigidity of the film base is too strong, and not only the operations in the subsequent steps, which are roll-to-roll handling, become difficult, but the cost also increases. In order to improve the scratch resistance and surface hardness, it is preferable to form a hard coat layer such as an acrylic resin or a silicone resin on one surface of the transparent plastic film substrate.

<Light color layer>
There are two reasons why the visibility of the transparent conductive film for a touch panel having a mesh-like wiring structure is deteriorated. One is that the line width of the wiring copper mesh pattern of the electrode part that generates the conductive function is wide, and the other is the hue difference between the electrode part made of copper and the transparent non-conductive part from which copper is removed. Because it ’s big. As a result of intensive studies by the present inventors in order to solve the problem of visibility of the mesh-like wiring, the color difference between the non-conductive layer and the copper electrode layer serving as the wiring is smaller than that of copper. It has been found that the problem can be solved by forming a layer. The light color layer is formed using a material having a color of white to silver or a color close thereto. Examples of such substances include nickel, copper nitride, silver, aluminum, cobalt, and chromium. When processing the conductive laminate for touch panel into a transparent conductive film for touch panel, the light-colored layer must be removed by etching in the same manner as the conductive layer made of copper except for the mesh-like wiring portion. Since silver, aluminum, cobalt, and chromium cannot be removed in the same process as that for copper, an etching process for that purpose is required, which is not preferable. For this reason, nickel and copper nitride are particularly preferred.

<Formation of nickel layer>
Examples of methods for forming a nickel layer on a transparent plastic film substrate include vapor phase methods such as vapor deposition and sputtering, and liquid phase methods such as electroless plating. Vapor deposition is desirable from the viewpoint of temperature. The film thickness is preferably 1 to 50 nm, and more preferably 2 to 20 nm. When the film thickness is 1 nm or less, the copper in the electrode portion can be seen through, and thus visibility cannot be improved. Even if the film thickness is 50 nm or more, the effect of improving the visibility is sufficient, but the processing time for film formation and etching becomes longer, the productivity is lowered, and the manufacturing cost is increased.

<Formation of copper nitride layer>
The copper nitride layer can be formed by the following method, for example. For example, a copper thin film is formed on a transparent plastic substrate so that the light-colored layer has the above thickness. Next, when a solution obtained by dissolving copper acetate or copper formate in a mixed solvent of aqueous ammonia and alcohol is brought into contact with the copper thin film by spraying or the like in a nitrogen-ammonia mixed gas atmosphere, the copper surface layer becomes a copper nitride layer. It becomes. The concentration of the ammonia water is not particularly limited, but generally, for example, about 0.5 to 3% by mass is preferable. When the concentration is 0.5% by mass or less, the nitriding rate is extremely slow, and when the concentration is 3% by mass or more, thermal decomposition of copper formate is not sufficient, which is not preferable. Examples of the alcohol include saturated aliphatic alcohols having about 1 to 4 carbon atoms such as methanol, ethanol, isopropyl alcohol, and n-butanol.

  A general reactive magnetron sputtering nitriding method has a high processing temperature of about 500 ° C. and cannot be applied to a plastic film substrate. However, as described above, copper acetate or copper formate is added at 130 to 160 ° C. in the presence of nitrogen and ammonia gas. The copper surface layer can be converted into a copper nitride layer by treating for 1 to 2 minutes.

<Formation of conductive layer>
The conductive layer is a base for the electrode portion, that is, the wiring, and copper, aluminum, and silver are preferable, but copper is most preferable from the viewpoint of electric resistance value, migration resistance, and cost. Although a copper electrode layer can be obtained by vapor deposition, sputtering, and electroless plating, vapor deposition is desirable from the viewpoint of film uniformity and adhesion, processing temperature, and pinholes. The film thickness of copper is preferably 0.1 to 5 μm, but more preferably 0.2 to 2 μm from the viewpoint of suitability for thinning by generation of pinholes and etching. When the film thickness is 0.1 μm or less, defects such as pinholes are likely to occur, and the sheet resistance value of the transparent conductive film for touch panel becomes high, making it difficult to apply to medium and large display devices. In general, it is difficult to make the wiring obtained by photolithography less than the thickness of the conductive layer, and when the thickness becomes 5 μm or more, it becomes difficult to make the line width 5 μm or less.

<Formation of photosensitive layer>
In order to obtain an electrode part by pattern formation by a photolithography method, it is necessary to form a photosensitive layer on the electrode layer. There are two methods for obtaining a photosensitive layer: a method using a dry film resist swellable with an alkaline aqueous solution comprising a polymer such as an acrylic resin and a photosensitizer, and a method of applying a photosensitive coating solution. Even the thinnest dry film resist has a thickness of 15 μm, and it is difficult to obtain a wiring having a line width of 5 μm or less, which is not preferable from the viewpoint of thinning. In addition, the dry film resist swells in an aqueous alkali solution, but does not dissolve, and thus has a disadvantage that it is difficult to peel off, and a method using a photosensitive resist coating solution that can easily obtain a thin film and dissolves in an aqueous alkali solution is preferable.

  Although the photosensitive resist is classified into a negative type and a positive type, since the negative type is subjected to oxygen inhibition, the sensitivity is greatly lowered when the resist layer is thin. In addition, the resolution required to obtain a fine line is insufficient. Furthermore, there is a disadvantage that the usable period of the product after applying the resist is short, and a positive type is preferable. The dry film thickness of the photosensitive resist is preferably 0.2 to 10 μm, and more preferably 0.5 to 3 μm. When the film thickness of the resist is 0.2 μm or less, light shielding is insufficient and an accurate pattern cannot be obtained. When the film thickness is 10 μm or more, not only a large amount of light is required, but the processing time becomes long, and problems such as thinning of wiring and disconnection due to overexposure occur.

<Positive resist agent>
The positive resist agent is composed of an alkali aqueous solution-soluble novolak resin, an alkaline aqueous solution-soluble acrylic resin, and a photosensitive agent.

<Alkaline aqueous soluble novolak resin>
The alkali aqueous solution-soluble novolak resin is not particularly limited, but is preferably one obtained by addition condensation of an aromatic compound having a phenolic hydroxyl group and an aldehyde under an acid catalyst.

  Examples of the phenols include alkylphenols, polyhydric phenols, alkyl polyhydric phenols, and the like, in addition to cresols such as phenol, m-cresol, o-cresol, and p-cresol. These phenols can be used alone or in combination of two or more.

  Examples of the aldehydes include formaldehyde, acetaldehyde, benzaldehyde, and paraformaldehyde. These aldehydes can be used alone or in combination of two or more.

<Acid catalyst>
Examples of the acid catalyst include inorganic acids such as hydrochloric acid, nitric acid, sulfuric acid, and phosphoric acid, and organic acids such as formic acid, acetic acid, and oxalic acid. These acids can be used alone or in combination of two or more.

一般式１中、Ｒaは水素原子またはメチル基を示し、Ｒbはカルボキシル基、アミノ基、水酸基などの置換基を有してもよい炭素数４以上（好ましくは、炭素数４〜？？）の直鎖状または分岐鎖状のアルキル基を示す。 <Alkaline aqueous solution-soluble acrylic resin>
The aqueous alkaline solution-soluble acrylic resin has a structural unit represented by the following general formula 1.

In general formula 1, Ra represents a hydrogen atom or a methyl group, and Rb has 4 or more carbon atoms (preferably 4 to ??) that may have a substituent such as a carboxyl group, an amino group, or a hydroxyl group. A linear or branched alkyl group is shown.

<Photosensitive agent>
Although it does not specifically limit as a photosensitive agent component, A quinonediazide group containing compound is desirable. For example, polyhydroxybenzophenones such as 2,3,4-trihydroxybenzophenone and 2,4,6-trihydroxybenzophenone, and bis [(poly) hydroxyphenyl] alkanes such as bis (2,4-dihydroxyphenyl) methane Etc. These photosensitizers can be used alone or in combination of two or more.

<Formation of photosensitive layer>
In the case where the photosensitive layer is not formed, copper in the conductive layer is oxidized in the air to produce blackened copper oxide on the surface, so that the hue difference from the nonconductive layer becomes larger and visibility is lowered. For this reason, it is important to form a photosensitive layer and prevent oxidation of the conductive layer before copper oxide is formed. Examples of the method for forming the photosensitive layer include general methods such as casting, spin coating, dip coating, bar coating, spraying, blade coating, gravure coating, and roll coating. Among these, roll coating is desirable because of uniformity of film thickness, productivity, and single-sided coating.
By the above operation, the conductive laminate for a touch panel of the present invention is obtained.

  In this invention, the transparent conductive film for touch panels which processed the conductive layer into the mesh-shaped electrode wiring of 1-10 micrometers in line width by the photolithographic method which consists of pattern exposure, image development, and an etching process for the conductive laminated body for touch panels is obtained. Can do.

<Transparent conductive film for touch panel>
The structure of the transparent conductive film for touch panels in this invention is shown in FIG. The transparent conductive film for a touch panel can be obtained from the conductive laminate for a touch panel of FIG. 1 by a photolithography method comprising pattern exposure, development, and etching processes. On the transparent plastic film base material 2 to which the hard coat layer 1 is applied, the electrode part 4 is structured in a mesh shape with a light color part 3 interposed therebetween.

<Shape of mesh copper wiring>
FIG. 3 shows a top view of the copper wiring (mesh structure) of the electrode portion. Hereinafter, the width of the copper wiring is referred to as D, the vertical pitch corresponding to the non-conductive portion is referred to as P1, and the horizontal pitch is referred to as P2. Note that the shape of the mesh-like copper wiring does not have to be a square in which the opening portions have the same length of P1 and P2, and may be a rectangle or a parallelogram. The value of D is preferably as small as possible from the viewpoint of visibility, and is preferably 1 to 10 μm, particularly preferably 1 to 5 μm, as long as there is no defect such as disconnection. Although it does not specifically limit about P1 and P2, Usually, it is 1-100 mm.

<Formation of transparent conductive plastic film>
A transparent conductive plastic film having a mesh-like copper wiring structure can be obtained by processing a conductive laminate by a photolithography method comprising exposure, development and etching processes. When the wiring width is wide, the mesh wiring is easily recognized visually. For this reason, 1-10 micrometers is preferable and, as for the width | variety of wiring, 1-5 micrometers is especially preferable. If the thickness is 1 μm or less, disconnection is likely to occur, and the yield of the product is greatly reduced. If it is 10 μm or more, the wiring in the mesh pattern becomes easy to see, and the visibility is greatly reduced.

<Exposure process>
A quartz or glass mask capable of obtaining the pattern of FIG. 3 is brought into contact with the transparent conductive laminate, and irradiated with a metal halide lamp or a high-pressure mercury lamp having a light source having a central wavelength of 350 nm, and the alkaline aqueous solution dissolving portion is formed on the photosensitive layer. A non-dissolved part is formed. The amount of irradiation light depends on the film thickness of the photosensitive layer, but is preferably 30 to 200 mJ / cm 2. When the irradiation light quantity is 30 mJ / cm 2 or less, the exposure is not sufficient, so that the solubility in the alkaline aqueous solution is greatly reduced, and the non-electrode portion cannot be removed by etching. In addition, if the amount of irradiation light exceeds 200 mJ / cm 2, it is not preferable because the part of the portion covered with the mask is exposed to light, so that the width of the electrode wiring becomes smaller than a predetermined width and disconnection is likely to occur. .

<Development process>
After the exposure step, development is performed by dipping or showering in a sodium hydroxide or potassium hydroxide aqueous solution having a concentration of 1 to 5% by mass. The treatment temperature is preferably 10 to 50 ° C, more preferably 20 to 40 ° C. When the temperature is 10 ° C. or lower, the time required for development becomes extremely long. When the temperature is 50 ° C. or higher, the development proceeds too quickly, making it difficult to perform uniform development. The time of contact with the aqueous alkali solution is generally 20 seconds to 3 minutes, although it depends on the film thickness of the photosensitive layer. It is desirable to remove the residue by thoroughly washing with water after completion of the development process.

<Etching process>
As the etchant, a commonly used copper layer etchant such as a cupric chloride aqueous solution, a ferric chloride aqueous solution, or an alkaline aqueous solution is used. Liquid is preferred.
By performing the photolithography method as described above, a mesh-like copper wiring is formed, and the transparent conductive film for a touch panel of the present invention is obtained.

  Examples of the present invention will be described below, but the present invention is not limited to these examples.

<Transparent plastic film substrate>
A hard coating treatment made of acrylic resin is performed on one side, a total light transmittance is 93%, and a PET film having a thickness of 100 μm (MSK-SHS100 manufactured by Nasaka Vacuum Industry Co., Ltd.) is used as a transparent plastic film substrate. .

(Conductive laminate 1)
A nickel layer having a thickness of 2 nm was formed on the surface of the transparent plastic film substrate on which the hard coat layer was not formed, by vacuum deposition. A 0.5 μm copper conductive layer is formed thereon by vacuum deposition, and then a positive resist coating solution AFR-Exp-800 manufactured by Nagase Chemtex Co., Ltd. is applied thereon by a roll coating method to a dry film thickness of 2 μm. It apply | coated so that it might become, The conductive laminated body for touchscreens of this invention was obtained. This was designated as conductive laminate 1.

(Conductive laminate 2)
A conductive laminate 2 was prepared in the same manner as the conductive laminate 1 except that the positive resist coating solution was PMER-R-PC manufactured by Tokyo Ohka Kogyo Co., Ltd.

(Conductive laminate 3)
A copper layer having a thickness of 10 nm is formed on the surface of the plastic film substrate on which the hard coat layer is not formed by vacuum deposition, the substrate surface temperature is raised to 150 ° C., and the ammonia gas concentration is 1.2. In a nitrogen-ammonia mixed gas atmosphere having a capacity of%, the visibility improving layer is formed on the copper surface and back surface by treating for 1 minute while spraying a solution obtained by dissolving copper formate in a mixed solution of ammonia water and an alcohol solution on the copper layer. A copper nitride (Cu3N) film was obtained. A copper layer having a thickness of 1 μm was formed on the copper nitride film by vacuum deposition. Further, on the copper layer, a positive resist coating solution AFR-Exp. Manufactured by Nagase ChemteX Corporation. A conductive laminate 3 was prepared by coating 800 with a roll coater method so that the dry film thickness was 2 μm.

(Conductive laminate 4)
A conductive laminate 4 was prepared in the same manner as the conductive laminate 1 except that the resist was a negative resist sensitizing solution PWP-502 manufactured by Kyodo Chemical Industry Co., Ltd.

(Conductive laminate 5)
The conductive laminate 5 was the same as the conductive laminate 1 except that the resist was a dry film resist film “Sunfort UFG158T” with a film thickness of 15 μm manufactured by Asahi Kasei E-Materials Co., Ltd.

(Conductive laminate 6)
A conductive laminate 6 was prepared in the same manner as in Example 1 except that the nickel layer was not formed.

Examples 1-3 and Comparative Examples 1-3 (Creation of transparent conductive film for touch panel)
After the conductive laminates 1 to 6 are cut into a size of 200 mm × 300 mm, P1 and P2 are made constant at 10 mm, and a mask from which 6 patterns with D of 2 μm, 3 μm, 5 μm, 7 μm, 10 μm, and 20 μm can be obtained A transparent conductive film for a touch panel that is mounted, irradiated with a high-pressure mercury lamp so that the amount of irradiation light is 100 mJ / cm2, developed with an aqueous sodium hydroxide solution, etched in a liquid containing cupric chloride as a main component, and washed with water. Got.

Example 1 shows a transparent conductive film for a touch panel obtained from the conductive laminate 1 for a touch panel, Example 2 shows a transparent conductive film for a touch panel obtained from the conductive laminate 2 for a touch panel, and Example 2 shows a conductive laminate for a touch panel. The transparent conductive film for a touch panel obtained from 3 was taken as Example 3.

  The transparent conductive film for touch panel obtained from the conductive laminate 4 for touch panel is Comparative Example 1, the transparent conductive film for touch panel obtained from the conductive laminate 5 for touch panel is Comparative Example 2, the conductive laminate for touch panel The transparent conductive film for touch panels obtained from 6 was designated as Comparative Example 3.

<Determination of the fineness of copper wiring>
Ten obtained transparent conductive films for a touch panel were inspected, and the value of the minimum width of D in which no disconnection of the wiring was observed was determined as the fineness of the copper wiring.

<Visibility determination>
A transparent conductive film for a touch panel with a minimum width of D in which no disconnection of wiring was observed was cut to 100 × 100 mm, and placed on a horizontal base with the mesh-shaped copper wiring facing up. Next, the three-wavelength phosphor was placed at a distance of 50 cm from the transparent conductive film for a touch panel so as to be directly above the conductive laminate. The transparent conductive film for a touch panel was observed from an angle of 45 degrees, and it was determined that the visibility was poor when the copper wiring was visible. Among the five observers, those that were visually recognized by two or more people were indicated as x, and those that were not visible at all were indicated as ◯.

<Total light transmittance>
Using a turbidimeter NDH2000 (manufactured by Nippon Denshoku Industries Co., Ltd.), based on JIS K7361-1 (1997), the total light transmittance in the thickness direction of the transparent conductive film for a touch panel cut to 100 × 100 mm is obtained. The measurement was performed by making light incident from the mesh copper wiring side. Three samples were measured and the average value was calculated.

<Sheet resistance value>
The sheet resistance value of the obtained transparent conductive film for touch panel is that of the transparent conductive film for touch panel cut to 100 × 100 mm using a non-contact type resistivity meter (Loresta-AX manufactured by Mitsubishi Chemical Analytech Co., Ltd.). The middle part was measured. Three samples were measured and the average value was calculated.

The evaluation result of the transparent conductive film for Examples 1 to 3 and Comparative Examples 1 to 3 obtained in Table 1 is shown.

  The conductive laminate for a touch panel and the transparent conductive film for a touch panel according to the present invention can be applied to an image touch panel sensor having excellent patternability and visibility while exhibiting high transparency and conductivity.

DESCRIPTION OF SYMBOLS 1 Hard coat layer 2 Transparent plastic film base material 3 Light color layer 4 Conductive layer 5 Photosensitive layer 30 Light color part 40 Electrode part P1 Vertical pitch P2 Horizontal pitch D Copper wiring width

Claims (4)

A touch panel comprising: a transparent plastic film substrate; a light-colored layer having a thickness of 1 to 50 nm; a conductive layer made of copper; and a positive photosensitive layer having a dry thickness of 0.5 to 5 μm. Conductive laminate. The conductive laminate for a touch panel according to claim 1, wherein the light color layer is made of nickel. The conductive laminate for a touch panel according to claim 1, wherein the light-colored layer is made of copper nitride.   The conductive laminate for a touch panel according to any one of claims 1 to 3 is processed into a mesh electrode wiring having a line width of 1 to 10 μm by a photolithography method including pattern exposure, development, and etching processes. A transparent conductive film for touch panels.

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