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JP2016001118A - Current detection device, magnetic field detection device, and methods thereof - Google Patents

Current detection device, magnetic field detection device, and methods thereof Download PDF

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JP2016001118A
JP2016001118A JP2014120469A JP2014120469A JP2016001118A JP 2016001118 A JP2016001118 A JP 2016001118A JP 2014120469 A JP2014120469 A JP 2014120469A JP 2014120469 A JP2014120469 A JP 2014120469A JP 2016001118 A JP2016001118 A JP 2016001118A
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conductor
current
magnetic field
magnetoresistive effect
effect element
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陽亮 津嵜
Yosuke Tsuzaki
陽亮 津嵜
隆志 長永
Takashi Osanaga
隆志 長永
泰助 古川
Taisuke Furukawa
泰助 古川
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Mitsubishi Electric Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a current detection device, etc., in which the saturation and further the hysteresis of magnetic field responsiveness in a magnetoresistance effect element are improved and reproducibility in resistance-magnetism characteristic is improved.SOLUTION: Provided is a current detection device comprising a long and narrow magnetoresistance effect element in which a fixed layer whose magnetization direction is fixed and a free layer whose magnetization direction changes due to an external magnetic field are laminated, and a conductor extending to the vicinity of the magnetoresistance effect element, the current detection device detecting a current flowing in the conductor in accordance with the resistance value of the magnetoresistance effect element that changes due to the current induced magnetic field of the current flowing in the conductor. The magnetoresistance effect element is disposed at a position where it overlaps the conductor in whole or part as viewed from the lamination direction of the magnetoresistance effect element. The direction of the center line along a direction in which the conductor current flows differs from the direction of the center line along the longitudinal direction of the magnetoresistance effect element.

Description

この発明は、電流検出装置、磁界検出装置等に関するもので、特にスピンバルブ構造を有するトンネル磁気抵抗効果または巨大磁気抵抗効果を用いた電流検出装置、磁界検出装置等に関するものである。   The present invention relates to a current detection device, a magnetic field detection device, and the like, and particularly to a current detection device, a magnetic field detection device, and the like using a tunnel magnetoresistance effect or a giant magnetoresistance effect having a spin valve structure.

近年、磁気抵抗効果素子として、従来の巨大磁気抵抗(GMR:giant-magnetoresistance)効果よりも大きな抵抗変化率が得られるトンネル磁気抵抗(TMR:tunneling magnetoresistance)効果を有するTMR素子が開発され、磁気ヘッドなど、磁界検出装置への応用が進められている。   In recent years, as a magnetoresistive effect element, a TMR element having a tunneling magnetoresistance (TMR) effect capable of obtaining a larger resistance change rate than a conventional giant-magnetoresistance (GMR) effect has been developed. Etc., application to magnetic field detection devices is underway.

磁気抵抗(MR:magnetoresistance)効果は、磁界によって変化する磁性体の磁化方向に依存して電気抵抗が変化する現象であり、磁界検出装置や磁気ヘッドなどに利用されている。GMR素子においては強磁性層/金属層/強磁性層からなる積層構造が用いられ、TMR素子においては、強磁性層/絶縁層/強磁性層からなる積層構造が用いられる。これらの素子においては、外部磁界によって2つの強磁性層のスピンを互いに平行(0°)あるいは反平行(180°)に設定することにより、GMR素子では、強磁性/金属層界面での電子の散乱確率に依存して抵抗が変化し、TMR素子では、膜面垂直方向の絶縁層を流れるトンネル電流の大きさが変化するため、これらの特性が利用されている。GMR素子やTMR素子では、抵抗変化を検出することにより、2層の強磁性層の相対的な磁化方向を検出することが可能である。   The magnetoresistance (MR) effect is a phenomenon in which electric resistance changes depending on the magnetization direction of a magnetic material that changes with a magnetic field, and is used in a magnetic field detection device, a magnetic head, and the like. In the GMR element, a laminated structure composed of a ferromagnetic layer / metal layer / ferromagnetic layer is used, and in the TMR element, a laminated structure composed of a ferromagnetic layer / insulating layer / ferromagnetic layer is used. In these elements, by setting the spins of the two ferromagnetic layers to be parallel (0 °) or antiparallel (180 °) to each other by an external magnetic field, in the GMR element, electrons at the ferromagnetic / metal layer interface The resistance changes depending on the scattering probability, and the TMR element uses these characteristics because the magnitude of the tunnel current flowing through the insulating layer in the direction perpendicular to the film surface changes. In the GMR element and the TMR element, it is possible to detect the relative magnetization directions of the two ferromagnetic layers by detecting a resistance change.

これらの磁気抵抗効果素子では、一方の強磁性層を反強磁性層と交換結合させて、その強磁性層の磁化を固定していわゆる固着層とし、他方の強磁性層の磁化を外部磁界で容易に反転することのできる自由層とする、いわゆるスピンバルブ型構造が知られている。   In these magnetoresistive elements, one ferromagnetic layer is exchange-coupled with an antiferromagnetic layer to fix the magnetization of the ferromagnetic layer to a so-called pinned layer, and the magnetization of the other ferromagnetic layer with an external magnetic field. A so-called spin-valve type structure is known, which is a free layer that can be easily inverted.

スピンバルブ型構造の磁気抵抗効果素子は、金属層や絶縁層を介した強磁性層間の磁気的な相互作用を抑制することが可能であり、高感度な磁界検出装置として用いられる。スピンバルブ型磁気抵抗効果素子に外部から磁界が印加されると、固着層の磁化は固定されているために、自由層の磁化のみが外部印加磁界に応じて回転する。これにより、2つの強磁性層の磁化の相対角が変化し、磁気抵抗効果により素子の抵抗が変化する。この抵抗値の変化を、たとえば素子に定電流を流した状態で電圧の変化として検出する。この電圧変化が印加された磁界に応じて変化する信号として読出され、高感度の磁界検出が可能となる。   A magnetoresistive effect element having a spin valve structure can suppress a magnetic interaction between ferromagnetic layers via a metal layer or an insulating layer, and is used as a highly sensitive magnetic field detection device. When a magnetic field is applied to the spin valve magnetoresistive element from the outside, the magnetization of the pinned layer is fixed, so that only the magnetization of the free layer rotates according to the externally applied magnetic field. As a result, the relative angle of magnetization of the two ferromagnetic layers changes, and the resistance of the element changes due to the magnetoresistive effect. This change in resistance value is detected as a change in voltage with a constant current flowing through the element, for example. This voltage change is read out as a signal that changes in accordance with the applied magnetic field, so that highly sensitive magnetic field detection is possible.

さらに、単体の磁気抵抗効果素子における抵抗変化を検出するのではなく、4個の磁気抵抗効果素子を用いてホイートストンブリッジ回路を形成し、かつ、固着層の磁化方向が逆向きの素子を組合せることで、磁界が存在しない場合の出力を0とし、高出力な磁界検出装置を形成する技術が提案されている(例えば下記特許文献1参照)。   Furthermore, instead of detecting a resistance change in a single magnetoresistive effect element, a Wheatstone bridge circuit is formed using four magnetoresistive effect elements, and elements whose magnetization directions of the pinned layer are reversed are combined. Thus, a technique has been proposed in which the output in the absence of a magnetic field is set to 0 and a high-output magnetic field detection device is formed (for example, see Patent Document 1 below).

また、固着層の磁化方向が逆向きである2個の磁気抵抗効果素子を直列に接続したハーフブリッジ回路でも、2個の磁気抵抗効果素子の抵抗比で出力信号が決定されるため、温度や製造工程に起因した抵抗変動の影響を抑制することが可能である。   Even in a half-bridge circuit in which two magnetoresistive elements whose magnetization directions of the pinned layer are opposite to each other are connected in series, the output signal is determined by the resistance ratio of the two magnetoresistive elements. It is possible to suppress the influence of resistance fluctuation caused by the manufacturing process.

以上の磁界検出方式を用いることで、磁気抵抗効果素子からは電気的に絶縁された導体における、電流の検出も可能である。この際は、電流によって誘起され、電流に比例した磁界を、磁気抵抗効果素子で検出する。特にスピンバルブ構造の磁気抵抗効果素子は、固定層磁化に沿った方向の磁界強度の検出に適しているため、(導体方向と磁気抵抗効果素子の配置が固定されれば)磁界方向が常に一定となる電流検出に適している。   By using the magnetic field detection method described above, it is possible to detect current in a conductor that is electrically insulated from the magnetoresistive effect element. At this time, a magnetic field induced by the current and proportional to the current is detected by the magnetoresistive element. In particular, a magnetoresistive element with a spin valve structure is suitable for detecting the magnetic field strength in the direction along the fixed layer magnetization, so that the magnetic field direction is always constant (if the conductor direction and the arrangement of the magnetoresistive element are fixed). Suitable for current detection.

磁界検出装置に用いられる磁気抵抗効果素子では、強磁性体の磁化が回転する際に、それ以前の磁化の状態に依存した経路を示すヒステリシスが発生することで、検出精度の再現性が得られず、検出誤差となる。この対策としては、フリー(自由)層における磁気異方性を制御する必要がある。この目的や磁界応答性におけるオフセットを調整する目的により、素子の外部からフリー層にバイアス磁界を印加する方法が用いられている。バイアス磁界を印加する方法として、例えば下記特許文献2に示されるような、永久磁石を用いる方法がある。   In the magnetoresistive effect element used in the magnetic field detection device, when the magnetization of the ferromagnetic material rotates, a hysteresis indicating a path depending on the previous magnetization state is generated, so that reproducibility of detection accuracy can be obtained. First, it becomes a detection error. As a countermeasure, it is necessary to control the magnetic anisotropy in the free layer. For this purpose and the purpose of adjusting the offset in the magnetic field response, a method of applying a bias magnetic field to the free layer from the outside of the element is used. As a method for applying the bias magnetic field, for example, there is a method using a permanent magnet as disclosed in Patent Document 2 below.

特開2008−243920号公報JP 2008-243920 A 特開2013−47610号公報JP 2013-47610 A

スピンバルブ構造のTMR素子TMR素子は、前述の通り、小さい磁界に対して大きな抵抗変化示すことで、磁界に対して高感度な特長を有するが、一方でフリー(自由)層の磁化が磁界印加方向と一致した(飽和した)場合は、その抵抗は一定値となり、それ以上の大きな磁界を検出できず、これによってその動作範囲が限定されるという課題があった。   As described above, the TMR element with a spin valve structure has a high sensitivity to a magnetic field by exhibiting a large resistance change with respect to a small magnetic field, but the magnetization of the free layer is applied to the magnetic field. When the direction matches (saturates), the resistance becomes a constant value, and a large magnetic field beyond that cannot be detected, which limits the operation range.

またTMR素子自由層の磁化においてヒステリシスが発生すると、TMR素子磁界検出における再現性を低下させ、検出誤差が発生する課題があった。   Further, when hysteresis occurs in the magnetization of the TMR element free layer, there is a problem in that the reproducibility in TMR element magnetic field detection is lowered and a detection error occurs.

これらの課題の対策としては、TMR素子のフリー層に対してバイアス磁界を印加する方法がある。しかしながら、従来のバイアス磁界の印加方法として永久磁石を用いる方法は、磁界、電流の検出、また、装置の製造の際の工程を複雑化するとともに、永久磁石を設置するために一定の領域を占有する。すなわち、コストの増大と素子の集積化を困難にするという課題が発生する。上記と異なる方法として、電流によって誘起される磁界により、バイアス磁界を印加する方法が考えられるが、この場合においては、追加的な配線の形成による工程数の増大や、電流を発生するための消費電力の増大という課題がある。   As a countermeasure for these problems, there is a method of applying a bias magnetic field to the free layer of the TMR element. However, the conventional method of using a permanent magnet as a bias magnetic field application method complicates the magnetic field and current detection and the manufacturing process of the device and occupies a certain area for installing the permanent magnet. To do. That is, there arises a problem that it is difficult to increase costs and to integrate elements. As a method different from the above, a method in which a bias magnetic field is applied by a magnetic field induced by current can be considered. In this case, however, the number of processes increases due to the formation of additional wiring, and the consumption for generating a current occurs. There is a problem of increasing electric power.

この発明は、上記の課題を解決するためになされたものであり、磁気抵抗効果素子における磁界応答性の飽和、さらにヒステリシスが改善され抵抗−磁気特性における再現性を向上させた電流検出装置等を提供することを目的とする。   The present invention has been made in order to solve the above-described problems. A current detection device and the like in which saturation of magnetic field responsiveness in a magnetoresistive effect element and further improvement in hysteresis and improved reproducibility in resistance-magnetic characteristics are provided. The purpose is to provide.

この発明は、磁化方向が固定された固定層と外部磁界によって磁化方向が変化する自由層とが積層された細長い磁気抵抗効果素子と、前記磁気抵抗効果素子の近傍に延在する導体と、を備え、前記導体に流れる電流の電流誘起磁界により変化する前記磁気抵抗効果素子の抵抗値に従い、前記導体に流れる電流を検出する電流検出装置であって、前記磁気抵抗効果素子における積層方向からみて、前記磁気抵抗効果素子が前記導体とその一部または全部が重なる位置に配置され、かつ前記導体の電流が流れる方向に沿った中心線の方向が、前記磁気抵抗効果素子の長手方向に沿った中心線の方向と異なることを特徴とする電流検出装置等にある。   The present invention includes an elongated magnetoresistive effect element in which a fixed layer whose magnetization direction is fixed and a free layer whose magnetization direction is changed by an external magnetic field, and a conductor extending in the vicinity of the magnetoresistive effect element, A current detecting device for detecting a current flowing through the conductor according to a resistance value of the magnetoresistive element that changes due to a current-induced magnetic field of the current flowing through the conductor, as viewed from the stacking direction in the magnetoresistive element, The magnetoresistive effect element is arranged at a position where the conductor and a part or all of the conductor overlap, and the direction of the center line along the direction in which the current of the conductor flows is the center along the longitudinal direction of the magnetoresistive effect element The current detecting device is characterized by being different from the direction of the line.

この発明では、磁気抵抗効果素子における磁界応答性の飽和、さらにヒステリシスが改善され抵抗−磁気特性における再現性を向上させた電流検出装置等を提供できる。   According to the present invention, it is possible to provide a current detection device or the like in which saturation of magnetic field response in the magnetoresistive effect element and further improvement of hysteresis are improved and reproducibility in resistance-magnetic characteristics is improved.

この発明による電流検出装置および磁気検出装置の磁気抵抗効果素子と測定対象となる電流が印加させる導体の位置関係を示した透過斜視図である。It is the permeation | transmission perspective view which showed the positional relationship of the magnetoresistive effect element of the electric current detection apparatus by this invention and a magnetic detection apparatus, and the conductor which the electric current used as a measuring object applies. 図1の検出装置が電流検出装置として機能する場合の構成例を示す図である。It is a figure which shows the structural example in case the detection apparatus of FIG. 1 functions as a current detection apparatus. 負荷電流が導体の周囲に作る磁界の分布を示す図である。It is a figure which shows distribution of the magnetic field which load current makes around a conductor. 図1の一転鎖線aに沿った断面図である。FIG. 2 is a sectional view taken along a dashed line a in FIG. 1. この発明の実施の形態1によるTMR素子と測定対象となる電流が流れる導体の配置を示す上面から見た平面図である。It is the top view seen from the upper surface which shows arrangement | positioning of the TMR element by Embodiment 1 of this invention, and the conductor through which the electric current used as a measuring object flows. この実施の形態1のTMR素子の自由層と固定層の磁化方向を示す図である。It is a figure which shows the magnetization direction of the free layer of the TMR element of this Embodiment 1, and a fixed layer. 導体に電流を流した場合の電流の変化に対するTMR素子の抵抗の変化の比較を示す図である。It is a figure which shows the comparison of the change of the resistance of a TMR element with respect to the change of an electric current when an electric current is sent through a conductor. 導体に流される電流が誘起する磁界を説明するための図である。It is a figure for demonstrating the magnetic field which the electric current sent through a conductor induces. この発明の実施の形態2による電流検出装置のTMR素子と導体の位置関係を示す上面から見た平面図である。It is the top view seen from the upper surface which shows the positional relationship of the TMR element and conductor of the electric current detection apparatus by Embodiment 2 of this invention. この発明の実施の形態2における複数個のTMR素子を直列に接続した例を示す図である。It is a figure which shows the example which connected the several TMR element in Embodiment 2 of this invention in series. この発明の実施の形態2における複数個のTMR素子を直列に接続した別の例を示す図である。It is a figure which shows another example which connected the some TMR element in Embodiment 2 of this invention in series. この発明の実施の形態3による電流検出装置のTMR素子と導体の位置関係を示す上面から見た平面図である。It is the top view seen from the upper surface which shows the positional relationship of the TMR element and conductor of the electric current detection apparatus by Embodiment 3 of this invention. この発明の実施の形態4におけるTMR素子の自由層と固定層の磁化方向を示す図である。It is a figure which shows the magnetization direction of the free layer of a TMR element in Embodiment 4 of this invention, and a fixed layer. 自由層の磁化の一部が180度反転している様子を示す図である。It is a figure which shows a mode that a part of magnetization of a free layer is reversed 180 degree | times. 図14のA方向に一定の磁界を印加して無磁界での自由層の磁化方向を揃えたあとの様子を示す図である。It is a figure which shows the mode after applying a fixed magnetic field to the A direction of FIG. 14, and aligning the magnetization direction of the free layer in the non-magnetic field. この発明の実施の形態5による電流検出装置の構成を示した模式的な平面図である。It is the typical top view which showed the structure of the electric current detection apparatus by Embodiment 5 of this invention. この発明の実施の形態6による電流検出装置の構成を示した模式的な平面図である。It is the typical top view which showed the structure of the electric current detection apparatus by Embodiment 6 of this invention. この発明の実施の形態7による電流検出装置の構成を示した模式的な平面図である。It is the typical top view which showed the structure of the electric current detection apparatus by Embodiment 7 of this invention. この発明の実施の形態8による電流検出装置の構成を示した模式的な平面図である。It is the typical top view which showed the structure of the electric current detection apparatus by Embodiment 8 of this invention. この発明の実施の形態9による磁界検出装置の構成を示した模式的な平面図である。It is the typical top view which showed the structure of the magnetic field detection apparatus by Embodiment 9 of this invention. この発明の実施の形態9における外部磁界の測定を行うための一連の手順を示すフローチャートである。It is a flowchart which shows a series of procedures for performing the measurement of the external magnetic field in Embodiment 9 of this invention. この発明の実施の形態10による磁界検出装置の構成を示した模式的な平面図である。It is the typical top view which showed the structure of the magnetic field detection apparatus by Embodiment 10 of this invention. この発明の実施の形態10における回路要素の構成を示す図である。It is a figure which shows the structure of the circuit element in Embodiment 10 of this invention. この発明の実施の形態11による磁界検出装置の構成を示した模式的な平面図である。It is the typical top view which showed the structure of the magnetic field detection apparatus by Embodiment 11 of this invention. 図10の破線Xに沿った断面図である。It is sectional drawing along the broken line X of FIG.

この発明による電流検出装置、磁気検出装置は、検出対象となる電流が流れる導体が、磁気抵抗効果素子であるTMR素子の長手方向と異なる向きに交差することによって、導体を流れる電流が作る磁界がTMR素子の長手方向と短手方向の両方向に印加され、TMR素子の長手方向にバイアス磁界を印加することができる。これによってTMR素子の磁界応答性が飽和することを抑制することができ、広い磁界領域での動作が可能となる。またこれに加えて、バイアス磁界によってTMR素子のヒステリシスが改善され抵抗―磁気特性における再現性を向上することで、高精度な電流または磁界の測定が可能となる。この際に、追加的な電力の消費や占有面積や工程数の増大もない。   In the current detection device and the magnetic detection device according to the present invention, the conductor through which the current to be detected crosses in the direction different from the longitudinal direction of the TMR element which is a magnetoresistive effect element, thereby generating a magnetic field generated by the current flowing through the conductor. A bias magnetic field can be applied in the longitudinal direction of the TMR element by applying it in both the longitudinal direction and the short direction of the TMR element. As a result, saturation of the magnetic field response of the TMR element can be suppressed, and operation in a wide magnetic field region is possible. In addition to this, the hysteresis of the TMR element is improved by the bias magnetic field and the reproducibility in the resistance-magnetic characteristics is improved, so that the current or magnetic field can be measured with high accuracy. At this time, there is no additional power consumption, an occupied area, or an increase in the number of processes.

以下、この発明による電流検出装置等を各実施の形態に従って図面を用いて説明する。なお、各実施の形態において、同一もしくは相当部分は同一符号で示し、重複する説明は省略する。   Hereinafter, a current detection device and the like according to the present invention will be described with reference to the drawings according to each embodiment. In each embodiment, the same or corresponding parts are denoted by the same reference numerals, and redundant description is omitted.

実施の形態1.
図1はこの発明による電流検出装置および磁気検出装置の、磁気抵抗効果素子であるTMR素子1と、測定対象となる電流が印加させる導体2の位置関係を示した透過斜視図である。上部電極3aとTMR素子1の上面、及び下部電極3bとTMR素子1の下面は電気的に接続されており、上部電極3aと下部電極3bはTMR素子1を電源、接地または基準電位面、及び電圧計に接続するための配線(図示省略)に接続される。
Embodiment 1 FIG.
FIG. 1 is a transparent perspective view showing a positional relationship between a TMR element 1 which is a magnetoresistive effect element and a conductor 2 to which a current to be measured is applied, in the current detection apparatus and the magnetic detection apparatus according to the present invention. The upper electrode 3a and the upper surface of the TMR element 1, and the lower electrode 3b and the lower surface of the TMR element 1 are electrically connected, and the upper electrode 3a and the lower electrode 3b connect the TMR element 1 to a power source, ground or reference potential surface, and It is connected to wiring (not shown) for connecting to the voltmeter.

図2は図1の検出装置が電流検出装置として機能する場合の構成例を示す。TMR素子1の抵抗変化の検出は、TMR素子1に電流源20から一定電流を流し、その時の電圧を電圧計21で測定することで実施する。導体2には測定対象となる負荷電流(検出対象電流)Ilを消費する負荷22を接続する。このとき負荷電流Ilが導体2の周囲に作る磁界の分布を図3に示す。破線bは導体2の幅方向(図3のx軸方向)の中心を示している。導体2に負荷電流Ilを流した時に発生する磁界H2のx軸方向成分の強度は破線bに近いほど大きくなり、また導体2に近づくほど大きくなる。   FIG. 2 shows a configuration example when the detection device of FIG. 1 functions as a current detection device. Detection of the resistance change of the TMR element 1 is performed by passing a constant current from the current source 20 to the TMR element 1 and measuring the voltage at that time with the voltmeter 21. A load 22 that consumes a load current (detection target current) Il to be measured is connected to the conductor 2. FIG. 3 shows the distribution of the magnetic field generated around the conductor 2 by the load current Il at this time. A broken line b indicates the center of the conductor 2 in the width direction (x-axis direction in FIG. 3). The strength of the x-axis direction component of the magnetic field H2 generated when the load current Il flows through the conductor 2 increases as it approaches the broken line b, and increases as it approaches the conductor 2.

また図4は図1の一転鎖線aに沿った断面図である。ここでのTMR素子1は、スピンバルブ構造であり、下部電極3b上に下から、固定層を構成する反強磁性膜1aa、強磁性膜1bb、非磁性膜1cc、強磁性膜1ddが形成されており、その上にトンネル絶縁層1eeが形成され、更にその上に自由層である強磁性膜1ffが形成されている。そして強磁性膜1ffは上部電極3aと電気的に接続されている。下部電極3bの更に下層にある導体2は、下部電極3bと電気的に絶縁するために間に絶縁層4を挟んで配置されている。なお各磁性膜は磁性体層ともいう。   4 is a cross-sectional view taken along the dashed line a in FIG. The TMR element 1 here has a spin valve structure, and an antiferromagnetic film 1aa, a ferromagnetic film 1bb, a nonmagnetic film 1cc, and a ferromagnetic film 1dd constituting a fixed layer are formed on the lower electrode 3b from below. A tunnel insulating layer 1ee is formed thereon, and a ferromagnetic film 1ff as a free layer is further formed thereon. The ferromagnetic film 1ff is electrically connected to the upper electrode 3a. The conductor 2 in the lower layer of the lower electrode 3b is disposed with the insulating layer 4 interposed therebetween in order to be electrically insulated from the lower electrode 3b. Each magnetic film is also called a magnetic layer.

図5は実施の形態1によるTMR素子1と測定対象となる電流が流れる導体2を、磁気抵抗効果素子であるTMR素子1における積層方向、またはTMR素子1と導体2を結ぶ線の方向のTMR素子1側から見た(以下、例えば単に上面から見たもの等とする)時の配置を示す平面図である。なおTMR素子1は通常、電圧等の測定のために、積層方向の上下両端面に図4の上部電極3aと下部電極3bに相当する電極層からなる電極を有する。   FIG. 5 shows a TMR element 1 according to the first embodiment and a conductor 2 through which a current to be measured flows, the TMR element 1 being a magnetoresistive effect element in the stacking direction, or the direction of the line connecting the TMR element 1 and the conductor 2. FIG. 4 is a plan view showing an arrangement when viewed from the element 1 side (hereinafter, simply viewed from the upper surface, for example). Note that the TMR element 1 usually has electrodes composed of electrode layers corresponding to the upper electrode 3a and the lower electrode 3b in FIG.

TMR素子1は、上面から見た際の形状が角丸長方形状に加工される。それぞれ、長辺長はl、短辺長(幅)はwであり、l>wの関係にある。ここでは、TMR素子1の各辺を結ぶ長方形101を想定し、その対角線の交点を、中心0と定義している。   The TMR element 1 is processed into a rounded rectangular shape when viewed from above. In each case, the long side length is l, the short side length (width) is w, and l> w. Here, a rectangle 101 connecting the sides of the TMR element 1 is assumed, and the intersection of the diagonal lines is defined as the center 0.

図6にはこの実施の形態1のTMR素子1の自由層と固定層の磁化方向を示す。強磁性体における形状磁気異方性の影響により、TMR素子1の自由層の磁化10は、無磁界においてその長手方向を向いている。固定層の磁化11はTMR素子1の形状の短辺方向に固定されている。   FIG. 6 shows the magnetization directions of the free layer and the fixed layer of the TMR element 1 of the first embodiment. Due to the influence of shape magnetic anisotropy in the ferromagnetic material, the magnetization 10 of the free layer of the TMR element 1 is oriented in the longitudinal direction in the absence of a magnetic field. The magnetization 11 of the fixed layer is fixed in the short side direction of the shape of the TMR element 1.

本実施の形態においては、導体2の電流が流れる方向(長手方向)に沿った中心線c2とTMR素子1の中心0が一致して設計される。ここで、導体2に電流が流れた際に、図3に示したように磁界H2が誘起され、この磁界H2のx軸方向の成分により、TMR素子1の自由層(図4の1ff)の磁化10(図6参照)は磁界強度に依存した回転力を受け、x軸方向に傾斜する。この際に、TMR素子1の固定層(図4の1aa−1dd)の磁化は固定されているため、トンネル絶縁層1eeを介した、自由層(強磁性膜1ff)の磁化方向1fdと固定層の強磁性膜1ddの磁化方向1ddが変化する。この結果、導体2の電流に依存して、TMR素子1の抵抗が変化する。この発明において導体2に電流を流した場合の、電流の変化に対するTMR素子1の抵抗の変化を図7の実線Aに示す。また導体2とTMR素子1が平行に配置されている場合、すなわち図5の導体2の電流が流れる方向に沿った中心線c2と、TMR素子1の長辺方向に沿った中心線c1と、のなす角度θがθ=0度の場合の、電流の変化に対するTMR素子1の抵抗の変化を破線Bで示す。   In the present embodiment, the center line c2 along the direction (longitudinal direction) in which the current of the conductor 2 flows is designed so that the center 0 of the TMR element 1 coincides. Here, when a current flows through the conductor 2, a magnetic field H2 is induced as shown in FIG. 3, and the free layer (1ff in FIG. 4) of the TMR element 1 is generated by the component of the magnetic field H2 in the x-axis direction. The magnetization 10 (see FIG. 6) receives a rotational force depending on the magnetic field strength, and tilts in the x-axis direction. At this time, since the magnetization of the fixed layer (1aa-1dd in FIG. 4) of the TMR element 1 is fixed, the magnetization direction 1fd of the free layer (ferromagnetic film 1ff) and the fixed layer via the tunnel insulating layer 1ee. The magnetization direction 1dd of the ferromagnetic film 1dd changes. As a result, the resistance of the TMR element 1 changes depending on the current of the conductor 2. A change in resistance of the TMR element 1 with respect to a change in current when a current is passed through the conductor 2 in the present invention is shown by a solid line A in FIG. When the conductor 2 and the TMR element 1 are arranged in parallel, that is, the center line c2 along the direction in which the current of the conductor 2 in FIG. 5 flows, and the center line c1 along the long side direction of the TMR element 1, The change in resistance of the TMR element 1 with respect to the change in current when the angle θ formed by

実際に使用する場合は、TMR素子1に一定電流を流し、その上下の電圧を計測することでTMR素子1の抵抗の変化を読み取る。この結果、TMR素子1により、導体2における電流の計測が可能となる。
すなわち例えば、図2の電流源20からTMR素子1に一定電流を流し、その上下の電圧を電圧計21で計測する。そして図示を省略した測定・制御部で、電流と電圧からTMR素子1の抵抗を演算し、例えば予め記憶部に格納された図7のAに示すような導体2の電流とTMR素子1の電流−抵抗特性テーブルから導体2における電流を求める。
In actual use, a constant current is passed through the TMR element 1 and the voltage at the top and bottom thereof is measured to read the change in resistance of the TMR element 1. As a result, the current in the conductor 2 can be measured by the TMR element 1.
That is, for example, a constant current is supplied from the current source 20 of FIG. 2 to the TMR element 1, and the upper and lower voltages are measured by the voltmeter 21. Then, the measurement / control unit (not shown) calculates the resistance of the TMR element 1 from the current and voltage, and for example, the current of the conductor 2 and the current of the TMR element 1 as shown in FIG. -Obtain the current in the conductor 2 from the resistance characteristic table.

上記の磁界を介した電流検出を実施した場合、図4の断面図でも分かるように、導体2とTMR素子1は電気的に絶縁されているため、互いに影響を及ぼすことなく導体2の電流の検出が可能である。   When the current detection via the magnetic field is performed, the conductor 2 and the TMR element 1 are electrically insulated as shown in the cross-sectional view of FIG. Detection is possible.

本実施の形態の配置では、TMR素子の中心0が図3の破線bで示す位置にあるため、導体2から一定の距離zのx−y平面内では最大の磁界を検出することが可能であり、効率的な検出が可能となる。   In the arrangement of the present embodiment, since the center 0 of the TMR element is at the position indicated by the broken line b in FIG. 3, it is possible to detect the maximum magnetic field in the xy plane at a certain distance z from the conductor 2. Yes, efficient detection is possible.

またここでは、
TMR素子1と導体2の延在方向のなす角度θ、
TMR素子1の長さl、
導体2の幅w0、
との関係において、
w0/l=sinθ
の条件をみたしている。また、このなす角度θは、0度よりも大きい角度で設計を行う。θは3度以上が望ましい。導体2から発生する磁界は、先にも述べたように、その中心線c2に沿った部分で最大となるが、導体2の幅に含まれる範囲であれば電流検出装置として機能させるために十分な磁界を印加することができる。ここで示した配置では、TMR素子1の長手方向の中心線c1は全て導体2の幅w0の範囲内に含まれている。このため、導体2を流れる検出対象電流Ilが発生する磁界H2がTMR素子1に効率的に印加される。これによって電流の検出においても効率的な検出が可能である。
Also here
An angle θ between the extending direction of the TMR element 1 and the conductor 2,
The length l of the TMR element 1,
The width w0 of the conductor 2,
In relation to
w0 / l = sinθ
I met the conditions. In addition, the design is performed at an angle θ that is greater than 0 degrees. θ is preferably 3 degrees or more. As described above, the magnetic field generated from the conductor 2 is maximum in the portion along the center line c2, but the range included in the width of the conductor 2 is sufficient to function as a current detection device. A simple magnetic field can be applied. In the arrangement shown here, the center line c1 in the longitudinal direction of the TMR element 1 is all included in the range of the width w0 of the conductor 2. For this reason, the magnetic field H <b> 2 generated by the detection target current Il flowing through the conductor 2 is efficiently applied to the TMR element 1. As a result, efficient detection is possible even in current detection.

以下に本実施の形態の効果について説明する。先に述べたように本実施の形態では、TMR素子1と導体2の延在方向のなす角度θは、実質的に0より大きく、特に3度以上になるように意図して設計されており、且つ、例えば図5のように上から見た時にTMR素子1の全体が導体2に重なるように配置されているため、効率的な磁界の検出が可能な配置である。この際に、導体2を流れる電流が誘起する磁界のx方向の成分が、TMR素子1によって検知される磁界成分である。   The effects of this embodiment will be described below. As described above, in the present embodiment, the angle θ formed by the extending direction of the TMR element 1 and the conductor 2 is designed to be substantially larger than 0, particularly 3 degrees or more. In addition, for example, as shown in FIG. 5, since the entire TMR element 1 is disposed so as to overlap the conductor 2 when viewed from above, the TMR element 1 can be efficiently detected. At this time, the x-direction component of the magnetic field induced by the current flowing through the conductor 2 is the magnetic field component detected by the TMR element 1.

ここで図8に、導体2に流される電流が誘起する磁界のx方向の磁界に注目した時、この磁界成分を更にTMR素子1の長手方向を向く成分211と、短手方向を向く成分212に分解した時の様子を示す。導体2に流される電流が誘起する磁界のx軸方向を向く成分210は一様と仮定し、大きさをH0とした場合、TMR素子1の長手方向の成分はH0・sinθであり、短手方向はH0・cosθである。この場合、TMR素子1の自由層が磁界方向に飽和する磁界Hsは、近似的に、
Hs=Hk+H0・sinθ
と表わされる。Hkは自由層の磁化の異方性磁界であり、形状の長手方向に留まろうとする磁界を表わしている。θを0度とならないように設計するため、H0・sinθ≠0である。すなわち、x軸方向の磁界成分210は、TMR素子1の長手方向成分211と短手方向成分212に同時に作用する効果が得られる。
Here, in FIG. 8, when attention is paid to the magnetic field in the x direction of the magnetic field induced by the current flowing through the conductor 2, this magnetic field component is further divided into a component 211 facing the longitudinal direction of the TMR element 1 and a component 212 facing the short direction. Shows the state when disassembled. Assuming that the component 210 directed in the x-axis direction of the magnetic field induced by the current flowing through the conductor 2 is uniform and the magnitude is H0, the longitudinal component of the TMR element 1 is H0 · sin θ. The direction is H0 · cos θ. In this case, the magnetic field Hs at which the free layer of the TMR element 1 is saturated in the magnetic field direction is approximately,
Hs = Hk + H0 · sinθ
It is expressed as Hk is an anisotropic magnetic field of the magnetization of the free layer, and represents a magnetic field that tries to stay in the longitudinal direction of the shape. In order to design θ so as not to be 0 degrees, H0 · sin θ ≠ 0. That is, the magnetic field component 210 in the x-axis direction has an effect of simultaneously acting on the longitudinal component 211 and the transverse component 212 of the TMR element 1.

この効果によって、導体2からの磁界が増大すると、長手方向成分211が増加するため、磁化が短手方向に飽和することを抑制することが可能となる。これによって、θが0である場合よりも大きな磁界の検出が可能となる。具体的には、従来の素子配置の場合は
、測定可能な最大の電流は、Hkと等しい磁界を発生させる電流強度i(Hk)(図7参照)であるが、これに対して本発明によると、i(Hk)よりも大きい、Hk+H0・sinθと等しい磁界を発生させる電流まで測定することが可能となる。
この際、θが3度以上の場合に、TMR素子1の長手方向の成分はH0に対して5%以上の大きさとなり、有意な効果が得られる。
Due to this effect, when the magnetic field from the conductor 2 increases, the longitudinal component 211 increases, so that it is possible to suppress magnetization saturation in the short direction. This makes it possible to detect a larger magnetic field than when θ is zero. Specifically, in the case of the conventional element arrangement, the maximum current that can be measured is the current intensity i (Hk) (see FIG. 7) that generates a magnetic field equal to Hk. Thus, it is possible to measure up to a current that generates a magnetic field larger than i (Hk) and equal to Hk + H0 · sin θ.
At this time, when θ is 3 ° or more, the longitudinal component of the TMR element 1 is 5% or more of H0, and a significant effect is obtained.

また、ここでの電流検出装置はTMR素子1と検出対象の電流が流される導体2からのみ構成されており、TMR素子1の自由層の特性を改善するための特別な機構は設けていない。   Further, the current detecting device here is composed only of the TMR element 1 and the conductor 2 through which the current to be detected flows, and no special mechanism for improving the characteristics of the free layer of the TMR element 1 is provided.

ところで、TMR素子1と導体2の延在方向となす角度θが0であった場合は、TMR素子1の自由層の磁化はヒステリシスを発生する。これは、自由層における磁化の分布において、主に長辺方向の端部における磁化が、形状に沿って緩和する影響によるものである。これを改善するためには、TMR素子1の長手方向に直流磁界を印加する方法が有効である(この時に印加する磁界を一般にバイアス磁界と呼ぶ)。   By the way, when the angle θ between the extending direction of the TMR element 1 and the conductor 2 is 0, the magnetization of the free layer of the TMR element 1 generates hysteresis. This is mainly due to the effect that the magnetization at the end in the long side direction relaxes along the shape in the magnetization distribution in the free layer. In order to improve this, a method of applying a DC magnetic field in the longitudinal direction of the TMR element 1 is effective (the magnetic field applied at this time is generally called a bias magnetic field).

一方、この発明のように、TMR素子1と導体2の延在方向となす角が0ではない場合、導体2から発生する磁界の長手方向成分は、有意な磁界がTMR素子1の長手方向に印加されるため、測定対象である電流が誘起する磁界の一部を、バイアス磁界としても利用することが可能となり、ヒステリシスの発生を抑制することが可能である。
以上の実施の形態により、電流検出において、TMR素子1以外の追加的な機構を設けることなくバイアス磁界の効果を得ることが可能となるため、従来よりも大きな測定領域を確保する効果が得られるとともに、電流の高精度な検出が可能となる。
On the other hand, when the angle between the extending direction of the TMR element 1 and the conductor 2 is not 0 as in the present invention, the longitudinal component of the magnetic field generated from the conductor 2 has a significant magnetic field in the longitudinal direction of the TMR element 1. Since it is applied, a part of the magnetic field induced by the current to be measured can be used as a bias magnetic field, and the occurrence of hysteresis can be suppressed.
According to the above embodiment, in the current detection, it is possible to obtain the effect of the bias magnetic field without providing an additional mechanism other than the TMR element 1, so that an effect of ensuring a larger measurement region than the conventional one can be obtained. At the same time, the current can be detected with high accuracy.

実施の形態2.
図9はこの発明の実施の形態2による電流検出装置のTMR素子1と導体2の位置関係を示す上面から見た平面図である。断面から見た構成や、その他の基本的構成については、実施の形態1と同じであり、TMR素子1と導体2の平面における大きさと位置関係のみが異なる。
Embodiment 2. FIG.
FIG. 9 is a plan view seen from above showing the positional relationship between the TMR element 1 and the conductor 2 of the current detection device according to Embodiment 2 of the present invention. The configuration viewed from the cross section and other basic configurations are the same as those of the first embodiment, and only the size and positional relationship in the plane of the TMR element 1 and the conductor 2 are different.

ここでは、TMR素子1は導体2の幅w0よりも小さく、上から見た時、導体2はTMR素子1全体に重なる。実施の形態1と同様に、導体2から発生する磁界は、その中心線c2に沿った部分で最大となり、導体2の幅に含まれる部分で大きい。導体2がTMR素子1に重なるとき、TMR素子1の長手方向の中心線c1が全て導体2の幅の範囲内に含まれていることを前提とすると、TMR素子1の長さl、導体2の幅w0、TMR素子1の長手方向と導体2の長手方向との角度θおよび、TMR素子1の中心0と導体2の中心線c2との最短距離aの関係が
w0>l・sinθ+2a
を満たす。
Here, the TMR element 1 is smaller than the width w0 of the conductor 2, and the conductor 2 overlaps the entire TMR element 1 when viewed from above. As in the first embodiment, the magnetic field generated from the conductor 2 is maximum at the portion along the center line c2 and is large at the portion included in the width of the conductor 2. When it is assumed that when the conductor 2 overlaps the TMR element 1, the center line c1 in the longitudinal direction of the TMR element 1 is all included in the width range of the conductor 2, the length l of the TMR element 1, the conductor 2 The relationship between the width w0, the angle θ between the longitudinal direction of the TMR element 1 and the longitudinal direction of the conductor 2 and the shortest distance a between the center 0 of the TMR element 1 and the center line c2 of the conductor 2 is w0> l · sin θ + 2a
Meet.

以上の構成により、例えば、実施の形態1と同様な効果を得つつ、複数のTMR素子1を集積化して用いる際の配置の自由度を向上させることが可能である。複数個のTMR素子を直列に接続した配線の例を図10と図11に示す。例えば図10に示したTMR素子の直列接続を実現するためのTMR素子、上部電極、下部電極の配置の一例を図25に示す。図25の(a)は図10の破線Xに沿った断面図、(b)は各TMR素子1の各層の断面での磁化方向を示す。それぞれのTMR素子は上部電極191と下部電極192で直列に接続される。   With the above configuration, for example, it is possible to improve the degree of freedom of arrangement when using a plurality of TMR elements 1 in an integrated manner while obtaining the same effect as in the first embodiment. Examples of wiring in which a plurality of TMR elements are connected in series are shown in FIGS. For example, FIG. 25 shows an example of the arrangement of the TMR element, the upper electrode, and the lower electrode for realizing the series connection of the TMR elements shown in FIG. 25A is a cross-sectional view taken along the broken line X in FIG. 10, and FIG. 25B shows the magnetization direction in the cross section of each layer of each TMR element 1. Each TMR element is connected in series by an upper electrode 191 and a lower electrode 192.

図10は本実施の形態の条件を満たす、TMR素子1が複数個、導体2と重なるように配置されており、全てのTMR素子1が直列に接続されている例である。TMR素子1は基本的に上部電極と下部電極をそれぞれ有している(この発明に渡って同様)。図10における配線191,192はTMR素子1間の電気的配線を示しており、具体的には配線191,192は図25に示すように、隣接するTMR素子間に延びて共有される上部電極(192)、下部電極(191)からなる。複数個のTMR素子1はその上部同士、下部同士が交互に順番に電気的に接続されて直列接続されている。TMR素子1の配置を示すため、TMR素子1の下部同士を接続する配線を配線191、上部同士を接続する配線を配線192、下部配線とTMR素子1の下部の接続点を白丸194、上部配線とTMR素子の上部との接続点を黒丸193で示す。TMR素子1の下側(裏側)になる配線は破線で、接続点は白丸で示されている。そしてこれらの配線191,192が、例えば図25で示すように下部電極(191)、上部電極(192)で実現される。そして抵抗測定器190とグランドとの間に複数個のTMR素子1が配列されて、隣接するTMR素子1の上部同士、下部同士が交互に順に電気的に接続されている。図11の配線では、抵抗測定器190とグランドとの間に同様にして直列接続されたTMR素子1の直列回路が2本、並列接続されている。   FIG. 10 shows an example in which a plurality of TMR elements 1 satisfying the conditions of this embodiment are arranged so as to overlap the conductor 2 and all the TMR elements 1 are connected in series. The TMR element 1 basically has an upper electrode and a lower electrode (the same applies to the present invention). In FIG. 10, wirings 191 and 192 indicate electrical wiring between the TMR elements 1, and specifically, the wirings 191 and 192 extend between the adjacent TMR elements and are shared as shown in FIG. (192) and the lower electrode (191). The plurality of TMR elements 1 are electrically connected in series with their upper portions and lower portions alternately connected in order. In order to show the arrangement of the TMR element 1, the wiring connecting the lower parts of the TMR element 1 is the wiring 191, the wiring connecting the upper parts is the wiring 192, the connection point between the lower wiring and the lower part of the TMR element 1 is the white circle 194, the upper wiring A black circle 193 indicates a connection point between the TMR element and the top of the TMR element. The wiring on the lower side (back side) of the TMR element 1 is indicated by a broken line, and the connection point is indicated by a white circle. These wirings 191 and 192 are realized by a lower electrode (191) and an upper electrode (192) as shown in FIG. 25, for example. A plurality of TMR elements 1 are arranged between the resistance measuring device 190 and the ground, and the upper parts and the lower parts of the adjacent TMR elements 1 are electrically connected in turn alternately. In the wiring of FIG. 11, two series circuits of the TMR elements 1 connected in series in the same manner are connected in parallel between the resistance measuring device 190 and the ground.

直列接続とすることで、TMR素子の製造時のばらつきを平均化し、製造時の特性のばらつきを低減することが可能となる。また直列接続をすることで素子全体の抵抗を大きくすることができるため、静電気などで意図せず大きな電圧が印加された時に、素子が絶縁破壊し故障することを抑制することが可能になる。   By using the series connection, it is possible to average variations in manufacturing TMR elements and reduce variations in characteristics during manufacturing. In addition, since the resistance of the entire element can be increased by connecting in series, it is possible to prevent the element from being broken down and failing when a large voltage is applied unintentionally due to static electricity or the like.

一方、図20は抵抗測定器190とグランドとの間で、それぞれTMR素子1を複数個直列接続したものを並列接続した例である。このような構成であればTMR素子1の製造時の抵抗ばらつきを平均化する前述の効果をえられ、またTMR素子1の抵抗を調整することが可能となる。   On the other hand, FIG. 20 shows an example in which a plurality of TMR elements 1 connected in series are connected in parallel between the resistance measuring device 190 and the ground. With such a configuration, the above-described effect of averaging the resistance variation at the time of manufacturing the TMR element 1 can be obtained, and the resistance of the TMR element 1 can be adjusted.

本実施の形態の構成とすることで、ここまで述べたような、TMR素子の導体上でのレイアウトに自由度を拡張することが可能となる。   With the configuration of the present embodiment, the degree of freedom can be extended to the layout of the TMR element on the conductor as described above.

実施の形態3.
図12はこの発明の実施の形態3による電流検出装置のTMR素子1と導体2の位置関係を示す上面から見た平面図である。断面から見た構成や、その他の基本的構成については実施の形態1と同じであり、TMR素子1と導体2の平面における大きさと位置関係のみが異なっている。
Embodiment 3 FIG.
FIG. 12 is a plan view seen from above showing the positional relationship between the TMR element 1 and the conductor 2 of the current detection device according to Embodiment 3 of the present invention. The configuration viewed from the cross section and other basic configurations are the same as those of the first embodiment, and only the size and positional relationship in the plane of the TMR element 1 and the conductor 2 are different.

本実施の形態では、平面図で見たとき、TMR素子1と導体2が部分的に重なる配置である。実施の形態1および2と比較して効果は小さいが、TMR素子1と導体2が部分的に重なっていることから、同様な効果を得ることが可能である。ここでは、TMR素子1と導体2が部分的に重なるための条件である、
2a<l・sinθ,かつl・sinθ>w0
をみたした構成としている。
In the present embodiment, the TMR element 1 and the conductor 2 are partially overlapped when viewed in a plan view. Although the effect is small as compared with the first and second embodiments, the same effect can be obtained because the TMR element 1 and the conductor 2 partially overlap each other. Here, it is a condition for the TMR element 1 and the conductor 2 to partially overlap.
2a <l · sinθ and l · sinθ> w0
It has a configuration that meets the requirements.

TMR素子1の感度は、素子の微細化とともに、反磁界の影響が大きくなることで減少する。一方、導体2を流れる電流の大きさが一定の場合は導体2の幅w0が小さいほど、電流によって誘起される磁界の強度は大きくなる。本実施の形態の構成とすることで、TMR素子の一部分に大きな磁界を集中させることで感度を回復させることが可能となる。   The sensitivity of the TMR element 1 decreases as the influence of the demagnetizing field increases with the miniaturization of the element. On the other hand, when the current flowing through the conductor 2 is constant, the strength of the magnetic field induced by the current increases as the width w0 of the conductor 2 decreases. With the configuration of this embodiment, sensitivity can be recovered by concentrating a large magnetic field on a part of the TMR element.

実施の形態4.
この発明の実施の形態4による電流検出装置の基本的構成、動作については、実施の形態の1と同一である。図13にはこの実施の形態4におけるTMR素子1の自由層と固定層の磁化方向を示し、自由層の磁化方向10と固定層の磁化方向11が示されている。
Embodiment 4 FIG.
The basic configuration and operation of the current detection device according to the fourth embodiment of the present invention are the same as those of the first embodiment. FIG. 13 shows the magnetization directions of the free layer and the fixed layer of the TMR element 1 according to the fourth embodiment, and shows the magnetization direction 10 of the free layer and the magnetization direction 11 of the fixed layer.

実施の形態1の図6に示すように、固定層の磁化11をTMR素子1の短辺方向に固定した場合、形状による反磁界の影響にで、例えば高温になった場合などに、形状の長手方向へと傾斜する場合がある。図13に示した固定層の磁化11は、予め形状の長手方向になるように固定しており、短手方向に固定した場合と比較してその固定がより安定となる。この場合は、例えば、温度が上昇して、反強磁性膜による強磁性膜の固定が弱くなった場合でも、形状磁気異方性の効果により、その磁化方向が保たれる。なお、固定層の磁化方向は、TMR素子1の製造工程における熱処理時に、反強磁性膜とそれに接する強磁性膜の交換結合が無くなる温度において、固定層の磁化を飽和し得る磁界を、所望の方向に印加することで決定することが可能である。   As shown in FIG. 6 of the first embodiment, when the magnetization 11 of the fixed layer is fixed in the short side direction of the TMR element 1, the shape of the fixed layer 11 is affected by the demagnetizing field due to the shape, for example, when the temperature becomes high. It may be inclined in the longitudinal direction. The magnetization 11 of the fixed layer shown in FIG. 13 is fixed in advance so as to be in the longitudinal direction of the shape, and the fixation is more stable as compared with the case of fixing in the short direction. In this case, for example, even when the temperature rises and the fixation of the ferromagnetic film by the antiferromagnetic film becomes weak, the magnetization direction is maintained by the effect of shape magnetic anisotropy. The magnetization direction of the fixed layer is a desired magnetic field that can saturate the magnetization of the fixed layer at a temperature at which exchange coupling between the antiferromagnetic film and the ferromagnetic film in contact with the antiferromagnetic film disappears during the heat treatment in the manufacturing process of the TMR element 1. It can be determined by applying in the direction.

この構成においては、図13に示す自由層の磁化10が180°反転した場合に、抵抗の変化が生じるが、この対策として、例えば動作前に紙面上向き方向に、自由層の磁化10を飽和する磁界を印加することが有効である。   In this configuration, a resistance change occurs when the magnetization 10 of the free layer shown in FIG. 13 is inverted by 180 °. As a countermeasure, for example, the magnetization 10 of the free layer is saturated in the upward direction on the paper before the operation. It is effective to apply a magnetic field.

図14は自由層の磁化の一部が、180度反転している様子を示している。図14中の矢印220および221はTMR素子1の自由層の磁化を磁区構造のレベルで見た時のそれぞれの磁化方向である。初期状態では、TMR素子1の自由層の磁化は、TMR素子の長手方向を向くが、図14中に示す矢印222のA方向を向くかB方向を向くかは未確定である。この状態であると、無磁界でのTMR素子1の抵抗が不安定となるため、動作前に自由層の磁化方向を揃える必要がある。このためには、例えば、動作前にA方向に一定の磁界231を印加することで向きを揃えることが可能である。図15は仮にA方向に一定の磁界231を印加して、無磁界での自由層の磁化方向を揃えたあとの様子を示している。   FIG. 14 shows a state in which a part of the magnetization of the free layer is inverted by 180 degrees. Arrows 220 and 221 in FIG. 14 indicate the respective magnetization directions when the magnetization of the free layer of the TMR element 1 is viewed at the level of the magnetic domain structure. In the initial state, the magnetization of the free layer of the TMR element 1 faces the longitudinal direction of the TMR element, but it is uncertain whether it faces the A direction or the B direction of the arrow 222 shown in FIG. In this state, the resistance of the TMR element 1 without a magnetic field becomes unstable, so that the magnetization direction of the free layer must be aligned before operation. For this purpose, for example, the direction can be made uniform by applying a constant magnetic field 231 in the A direction before the operation. FIG. 15 shows a state after applying a constant magnetic field 231 in the A direction and aligning the magnetization direction of the free layer without a magnetic field.

本実施の形態によれば、固定層の磁化を安定化し、実施の形態1と同様な効果を得ることが可能である。これによって例えば温度や微細化に伴う、固定層の磁化方向の変化に因る影響を小さくすることが可能となる。   According to the present embodiment, it is possible to stabilize the magnetization of the fixed layer and obtain the same effect as in the first embodiment. As a result, for example, it is possible to reduce the influence caused by the change in the magnetization direction of the fixed layer due to temperature and miniaturization.

実施の形態5.
図16はこの発明の実施の形態5による電流検出装置の構成を示した模式的な平面図である。この図16においては導体2とTMR素子1の位置関係を明確に示すため、TMR素子1は実施の形態1〜3での図よりも、大きく示されている。実施の形態1で示したTMR素子1と導体2の組み合わせ(図6の61)と、それとは導体2の位置が鏡面対称である組合せ(図6の62)を用意し、それぞれの導体2同士の一端2aが接続された構成である。TMR素子1の長手方向は同一方向である。ここに示した2つのTMR素子1は直列に接続されている。一方のTMR素子は接地され、他方が電源に接続され、TMR素子間の電位63と接地電位の差を検出する。
すなわち、一方のTMR素子1の一方の電極が接地(GND)され他方の電極が他方のTMR素子1の一方の電極と接続され、他方のTMR素子1の他方の電極が電源(Vcc)に接続され、TMR素子1同士の接続点が出力端子(Vout)となっている。また、15が検出対象電流、16が電流が誘起する磁界(電流誘起磁界)を示す。
Embodiment 5 FIG.
FIG. 16 is a schematic plan view showing the configuration of a current detection device according to Embodiment 5 of the present invention. In FIG. 16, in order to clearly show the positional relationship between the conductor 2 and the TMR element 1, the TMR element 1 is shown larger than the drawings in the first to third embodiments. A combination of the TMR element 1 and the conductor 2 shown in the first embodiment (61 in FIG. 6) and a combination in which the position of the conductor 2 is mirror-symmetric (62 in FIG. 6) are prepared. The one end 2a is connected. The longitudinal direction of the TMR element 1 is the same direction. The two TMR elements 1 shown here are connected in series. One TMR element is grounded and the other is connected to a power source, and detects the difference between the potential 63 and the ground potential between the TMR elements.
That is, one electrode of one TMR element 1 is grounded (GND), the other electrode is connected to one electrode of the other TMR element 1, and the other electrode of the other TMR element 1 is connected to the power supply (Vcc). The connection point between the TMR elements 1 is an output terminal (Vout). Reference numeral 15 denotes a detection target current, and 16 denotes a magnetic field induced by the current (current-induced magnetic field).

そしてTMR素子間の電位(Vout)63と接地電位の差を検出する。図16は組み合わせ61の構成と組み合わせ62の構成においてTMR素子を1つずつ示したが、それぞれの構成において互いに同数であれば、複数が直列接続されていても良く、更に並列接続を含んでいてもよい。   Then, the difference between the potential (Vout) 63 between the TMR elements and the ground potential is detected. FIG. 16 shows one TMR element in each of the configuration of the combination 61 and the configuration of the combination 62. However, a plurality of TMR elements may be connected in series as long as they are the same number in each configuration, and further include a parallel connection. Also good.

導体2の配置がTMR素子1の長手方向に対して鏡面対称となっていることから、それぞれの導体2を流れる電流が誘起する磁界のTMR素子の短手方向成分は逆向きとなる。このためTMR素子1は導体2を流れる電流に対して、互いに逆方向の抵抗変化を示す。それぞれを構成する各TMR素子1は、同じ温度特性を持つため、一方を固定抵抗など温度特性の異なるものとした場合と比較して、導体2に電流を印加しない時の出力の誤差(オフセット)を低減することが可能である。また本実施の形態であると、一方の抵抗を固定とした場合と比較して、それぞれのTMR素子1の抵抗がそれぞれ大小逆に変化する分、変化量が2倍となるため、導体2を流れる同じ大きさの電流に対する出力変化が2倍となる。この結果として、より小さな電流を検出することが可能となる。   Since the arrangement of the conductors 2 is mirror-symmetric with respect to the longitudinal direction of the TMR element 1, the short direction component of the TMR element of the magnetic field induced by the current flowing through each conductor 2 is reversed. For this reason, the TMR element 1 exhibits resistance changes in opposite directions with respect to the current flowing through the conductor 2. Since each TMR element 1 constituting each has the same temperature characteristic, an error (offset) of an output when no current is applied to the conductor 2 as compared with the case where one of them has a different temperature characteristic such as a fixed resistance. Can be reduced. Further, in the present embodiment, the amount of change is twice as much as the resistance of each TMR element 1 changes in magnitude, compared to the case where one resistance is fixed. The output change for the same current flowing is doubled. As a result, a smaller current can be detected.

以上の構成によれば、温度等によるTMR素子の抵抗変動の影響を抑制可能で、且つ大きな出力信号が得られる電流検出装置を実現可能である。また、複数個のTMR素子を接続することで、製造工程に起因した特性ばらつきの影響も抑制可能である。   According to the above configuration, it is possible to realize a current detection device that can suppress the influence of resistance variation of the TMR element due to temperature or the like and can obtain a large output signal. Further, by connecting a plurality of TMR elements, it is possible to suppress the influence of characteristic variations caused by the manufacturing process.

実施の形態6.
図17はこの発明の実施の形態6による電流検出装置の構成を示した模式的な平面図である。ここでは、実施の形態5で示した構成(電流検出部と称す)を2つ直列に接続することで構成され(1本の導体2と2つのTMR素子1からなる構成を2つ並べて接続)、その接続点70が電源(Vcc)に接続されている。更に各々の中点(直列接続されたTMR素子1同士の接続点)の箇所が電圧計18に接続され、残りの端子はそれぞれ接地(GND)されている。
Embodiment 6 FIG.
FIG. 17 is a schematic plan view showing the configuration of a current detection device according to Embodiment 6 of the present invention. Here, two configurations (referred to as current detection units) shown in the fifth embodiment are connected in series (two configurations each composed of one conductor 2 and two TMR elements 1 are connected side by side). The connection point 70 is connected to the power source (Vcc). Furthermore, the middle point (the connection point between the TMR elements 1 connected in series) is connected to the voltmeter 18 and the remaining terminals are grounded (GND).

すなわち、図16の鏡面対称のV字型の導体を鏡面対称に2つ直列に接続したW字型の導体2に対し、導体2のそれぞれの傾斜部分(TMR素子が導体に対して傾き(θ)を持つように)に配置された4つのTMR素子1を、電源(Vcc)から接地(GND)の間に、2つのTMR素子1の直列回路が2つ形成されるように接続し、2つの直列回路のTMR素子1同士の接続点間に電圧計18が接続されている。このとき電源(Vcc)側に接続される2つの直列回路のTMR素子は、互いに導体の配置が鏡面対称でなければならない。   That is, with respect to the W-shaped conductor 2 in which two mirror-symmetrical V-shaped conductors in FIG. 16 are connected in mirror symmetry, each inclined portion of the conductor 2 (the TMR element is inclined with respect to the conductor (θ ) Are arranged so that two series circuits of the two TMR elements 1 are formed between the power supply (Vcc) and the ground (GND). A voltmeter 18 is connected between the connection points of the TMR elements 1 of the two series circuits. At this time, the TMR elements of the two series circuits connected to the power supply (Vcc) side must be mirror-symmetric with respect to the arrangement of the conductors.

この構成において、導体2に電流を印加しない場合、それぞれのTMR素子1は互いに同じ抵抗になるため、各々の中点は互いに等電位であるため、電位差は生じない。このとき中点間に接続された電圧計18は0を示す。一方、導体2に電流を印加した場合は、中点間に電位差が生じるため、ホイートストンブリッジを構成している。導体2に電流が流れた際に、電圧計18で電圧を測定することにより、導体2における電流の検出が可能である。   In this configuration, when no current is applied to the conductor 2, the TMR elements 1 have the same resistance, so that the midpoints are equipotential to each other, so that no potential difference occurs. At this time, the voltmeter 18 connected between the middle points indicates zero. On the other hand, when a current is applied to the conductor 2, a potential difference is generated between the midpoints, so that a Wheatstone bridge is configured. When a current flows through the conductor 2, the current in the conductor 2 can be detected by measuring the voltage with the voltmeter 18.

なお、図17で示したそれぞれのTMR素子については、実施に形態5と同様に、複数のTMR素子から構成されてもよい。   Each TMR element shown in FIG. 17 may be composed of a plurality of TMR elements as in the fifth embodiment.

本実施の形態では、導体2に電流を流さない時の出力は0であり、導体に流した電流が誘起する磁界に対する抵抗変化に比例した電圧変化が出力として得られるため、基準電位からの差分を計算する処理が不要となり、周辺回路を簡略化することが可能となる。また構成しているTMR素子の温度特性は全て等しいため、オフセットの低減が可能となり温度特性による抵抗変化の影響を低減することが可能である。   In the present embodiment, the output when no current is passed through the conductor 2 is 0, and a voltage change proportional to a resistance change with respect to the magnetic field induced by the current passed through the conductor is obtained as an output. The processing for calculating is unnecessary, and the peripheral circuit can be simplified. Further, since the temperature characteristics of the TMR elements that are configured are all equal, the offset can be reduced, and the influence of resistance change due to the temperature characteristics can be reduced.

実施の形態7.
図18はこの発明の実施の形態7による電流検出装置の構成を示した模式的な平面図であり、参照用TMR素子17を用いたハーフブリッジの構成を示す。ここでは、紙面左側のTMR素子1と導体2は実施の形態1における配置と同様であるが、紙面右側の参照用TMR素子17は、左側のTMR素子1と長手方向が同方向であり、導体2はその長手方向に直交する向きで配置されている。固定層の磁化方向は同じである。実施の形態5と同様に、それぞれの導体は接続されており、且つ、2つのTMR素子の接続は、図7に示す実施の形態5と同様である。
Embodiment 7 FIG.
FIG. 18 is a schematic plan view showing the configuration of a current detection device according to Embodiment 7 of the present invention, and shows the configuration of a half bridge using a TMR element 17 for reference. Here, the TMR element 1 and the conductor 2 on the left side of the paper are the same as those in the first embodiment, but the reference TMR element 17 on the right side of the paper has the same longitudinal direction as the TMR element 1 on the left side, and the conductor 2 is arrange | positioned in the direction orthogonal to the longitudinal direction. The magnetization direction of the fixed layer is the same. As in the fifth embodiment, the respective conductors are connected, and the connection between the two TMR elements is the same as in the fifth embodiment shown in FIG.

ここでは、参照用TMR素子17の自由層の磁化は、磁界16が印加されない状態では、参照用TMR素子17の自由層の磁化方向10aは形状異方性によって形状の長手方向を向く。固定層の磁化方向11aはこれと直交する方向を向いている。   Here, with respect to the magnetization of the free layer of the reference TMR element 17, the magnetization direction 10a of the free layer of the reference TMR element 17 faces the longitudinal direction of the shape due to the shape anisotropy in a state where the magnetic field 16 is not applied. The magnetization direction 11a of the fixed layer is oriented in a direction perpendicular to this.

導体2に検出対象となる電流15が流れた場合、誘起される磁界16は参照用TMR素子17に対し長手方向と平行な方向に印加される。このため、参照用TMR素子17の抵抗値は導体2を流れる検出対象電流15の有無に関わらず一定の値を示す。   When the current 15 to be detected flows through the conductor 2, the induced magnetic field 16 is applied to the reference TMR element 17 in a direction parallel to the longitudinal direction. Therefore, the resistance value of the reference TMR element 17 shows a constant value regardless of the presence or absence of the detection target current 15 flowing through the conductor 2.

なお、図18で示したそれぞれのTMR素子については、実施の形態5と同様に、複数のTMR素子から構成されてもよい。   Each TMR element shown in FIG. 18 may be composed of a plurality of TMR elements as in the fifth embodiment.

これらのTMR素子により、実施の形態5と同様なハーフブリッジを形成することで、検出対象電流15に応じた出力を、参照用TMR素子17の抵抗値を基準として出力することができる。これによって温度等の抵抗変動に対する出力の変動を抑制可能である。   By forming a half bridge similar to that of the fifth embodiment by using these TMR elements, an output corresponding to the detection target current 15 can be output based on the resistance value of the reference TMR element 17. As a result, it is possible to suppress fluctuations in output with respect to resistance fluctuations such as temperature.

実施の形態8.
図19はこの発明の実施の形態8による電流検出装置の構成を示した模式的な平面図であり、参照用TMR素子17a,17bを用いたフルブリッジの構成を示す。ここでは、実施の形態7で示したハーフブリッジ(電流検出部と称す)を2つ直列に接続した構成であり(1本の導体2と1つのTMR素子(1a,1b)と1つの参照用TMR素子(17b,17a)からなる構成を2つ並べて接続)、その接続点70が電源(Vcc)に接続されている。更に各々のハーフブリッジの中点(TMR素子(1a,1b)と参照用TMR素子(17b,17a)の接続点)の箇所が電圧計18に接続され、残りの端子はそれぞれ接地(GND)されており、ホイートストンブリッジを構成している。
Embodiment 8 FIG.
FIG. 19 is a schematic plan view showing the configuration of a current detection device according to Embodiment 8 of the present invention, and shows the configuration of a full bridge using reference TMR elements 17a and 17b. Here, two half bridges (referred to as current detection units) shown in the seventh embodiment are connected in series (one conductor 2 and one TMR element (1a, 1b) and one reference). Two TMR elements (17b, 17a) are connected side by side), and the connection point 70 is connected to a power source (Vcc). Further, the midpoint of each half bridge (the connection point of the TMR elements (1a, 1b) and the reference TMR elements (17b, 17a)) is connected to the voltmeter 18, and the remaining terminals are grounded (GND). And constitutes a Wheatstone bridge.

すなわち、それぞれが、導体2の傾斜部分(TMR素子が導体に対して傾き(θ)を持つように)に配置された1つのTMR素子(1a,1b)と、導体2が長手方向と直交する向きで配置された1つの参照用TMR素子(17b,17a)とからなる2つの直列回路が、電源(Vcc)と接地(GND)の間に接続され、2つの直列回路のTMR素子1と参照用TMR素子17の接続点間に電圧計18が接続されている。ここでVccに接続されるTMR素子は上記の2つの直列回路の内、TMR素子(1a,1b)のうちのいずれか1つと、TMR素子(17b,17a)のうちのいずれか1つがそれぞれ接続されなければならない。   That is, each of the TMR elements (1a, 1b) disposed on the inclined portion of the conductor 2 (so that the TMR element has an inclination (θ) with respect to the conductor) and the conductor 2 are orthogonal to the longitudinal direction. Two series circuits composed of one reference TMR element (17b, 17a) arranged in a direction are connected between a power supply (Vcc) and a ground (GND), and reference is made to the TMR element 1 of the two series circuits. A voltmeter 18 is connected between the connection points of the TMR element 17 for use. Here, the TMR element connected to Vcc is connected to either one of the TMR elements (1a, 1b) and one of the TMR elements (17b, 17a) of the above two series circuits. It must be.

導体2に電流が流れた際に、電圧計18で電圧を測定することにより、導体2における電流の検出が可能である。   When a current flows through the conductor 2, the current in the conductor 2 can be detected by measuring the voltage with the voltmeter 18.

なお、図19で示したそれぞれのTMR素子については、実施の形態5と同様に、複数のTMR素子から構成されてもよい。   Each TMR element shown in FIG. 19 may be composed of a plurality of TMR elements as in the fifth embodiment.

本実施の形態に依れば、実施の形態7で示した効果に加え、導体2に電流を印加しない時の出力が0となり、電流を印加することで生じる電位差が電流に比例するため、得られた電位差の絶対値を測定値として扱うことが可能となる。また実施の形態7に対して、2倍の出力信号を得ることができるため、より微小な電流の検出も可能となる。   According to the present embodiment, in addition to the effects shown in the seventh embodiment, the output when no current is applied to the conductor 2 is 0, and the potential difference generated by applying the current is proportional to the current. The absolute value of the potential difference thus obtained can be handled as a measured value. Further, since a double output signal can be obtained with respect to the seventh embodiment, a smaller current can be detected.

実施の形態9.
図20はこの発明の実施の形態9による磁界検出装置の構成を示した模式的な平面図であり、この発明による電流検出装置を用いて磁界検出を行う。ここでは図20に示すx軸方向から印加された外部磁界H20の検出を行う。この外部磁界H20は導体2を流れる電流が作る磁界のx方向の成分16と平行でなければならない。
Embodiment 9 FIG.
FIG. 20 is a schematic plan view showing the configuration of a magnetic field detection device according to Embodiment 9 of the present invention. Magnetic field detection is performed using the current detection device according to the present invention. Here, the external magnetic field H20 applied from the x-axis direction shown in FIG. 20 is detected. This external magnetic field H20 must be parallel to the x-direction component 16 of the magnetic field produced by the current flowing through the conductor 2.

ここでは、先ず、測定対象の外部磁界H20が存在しない状態で、TMR素子1の抵抗を測定し値を得る(外部磁界H20がないときのTMR素子1の抵抗をR0と定義する)。また図20に、このときTMR素子の抵抗を測定するための測定器と、得られた抵抗とR0の値を比較し、その結果に応じて電流源20aに対して、導体2に流す電流の増減を支持するための制御部および記憶部(共に図示省略)を備えた測定・制御部102を示す。   Here, first, the resistance of the TMR element 1 is measured to obtain a value in the state where the external magnetic field H20 to be measured does not exist (the resistance of the TMR element 1 when there is no external magnetic field H20 is defined as R0). Also, FIG. 20 compares the measuring instrument for measuring the resistance of the TMR element at this time with the obtained resistance and the value of R0, and according to the result, the current flowing through the conductor 2 to the current source 20a is compared. A measurement / control unit 102 including a control unit and a storage unit (both not shown) for supporting the increase / decrease is shown.

次に測定対象となる外部磁界H20を印加した状態でTMR素子1の抵抗を測定する(この時の測定値をR1とし、R0とR1の差の絶対値をΔRとする。ここでのΔRは、外部磁界H20を印加することでTMR素子1に生じた磁気抵抗効果による抵抗変化の絶対値である。そして、測定・制御部102から電流源20aに対して導体2に直流電流を供給させる電流供給指令103を出力する。この電流供給指令103は供給する電流値も指定する。この結果、導体2に供給された直流電流が作る電流誘起磁界16が外部磁界H20に加えられるため、TMR素子1の抵抗は更に変化する。ここで導体2に直流電流を供給した状態のTMR素子1の抵抗R2とR0との差をΔR’と定義する。   Next, the resistance of the TMR element 1 is measured with the external magnetic field H20 to be measured applied (the measured value at this time is R1, and the absolute value of the difference between R0 and R1 is ΔR, where ΔR is , The absolute value of the resistance change due to the magnetoresistive effect generated in the TMR element 1 by applying the external magnetic field H20, and a current for supplying a direct current to the conductor 2 from the measurement / control unit 102 to the current source 20a. The supply command 103 is output, and the current supply command 103 also designates a current value to be supplied.As a result, the current-induced magnetic field 16 generated by the direct current supplied to the conductor 2 is applied to the external magnetic field H20. The resistance of the TMR element 1 in a state where a direct current is supplied to the conductor 2 is defined as ΔR ′.

この時、ΔR>ΔR’(TMR素子1の抵抗がR0に近づくとき)であるならば、更に同じ向きに直流電流を増加させる。一方、ΔR<ΔR’(TMR素子1の抵抗がR0から遠ざかる)であるならば電流を減少させる。これを繰り返し、TMR素子1の抵抗が磁界を印加しない時の抵抗(R0)と等しくなる時の電流値を特定する。ここでその電流値を特定するときの条件は、ΔR’が一定の大きさαよりも小さいかどうかによる。このαは導体2に流す電流の制御分解能の下限の電流変化によって変化するTMR素子1の抵抗変化、または、空間に存在するノイズによる誤差や、測定・制御部102の測定分解能による量子化誤差のいずれかの最も大きい値とすることで、最も誤差の小さい外部磁界H20の測定が可能となる。   At this time, if ΔR> ΔR ′ (when the resistance of the TMR element 1 approaches R0), the direct current is further increased in the same direction. On the other hand, if ΔR <ΔR ′ (the resistance of the TMR element 1 moves away from R0), the current is decreased. This is repeated, and the current value when the resistance of the TMR element 1 becomes equal to the resistance (R0) when no magnetic field is applied is specified. Here, the condition for specifying the current value depends on whether ΔR ′ is smaller than a certain magnitude α. This α is a resistance change of the TMR element 1 that changes due to a current change at the lower limit of the control resolution of the current flowing through the conductor 2, or an error due to noise existing in the space, or a quantization error due to the measurement resolution of the measurement / control unit 102. By setting any one of the largest values, it is possible to measure the external magnetic field H20 with the smallest error.

この結果、特定された電流は、その電流が誘起する磁界16が丁度、TMR素子1の部分に於いて、測定対象である外部磁界H20と逆方向で大きさが同じ磁界を発生させる電流とみなすことができる。また、電流が作る磁界の強度は、電流に強度が比例するため、この特定された電流に、一定の係数を乗じることによって、外部磁界H20の大きさを特定することが可能となる。   As a result, the specified current is regarded as a current that causes the magnetic field 16 induced by the current to generate a magnetic field having the same magnitude in the opposite direction to the external magnetic field H20 to be measured in the portion of the TMR element 1. be able to. In addition, since the strength of the magnetic field generated by the current is proportional to the current, the magnitude of the external magnetic field H20 can be specified by multiplying the specified current by a certain coefficient.

ここまで述べた方法を用いることで、この発明による磁界検出装置を用いて外部磁界の検出が可能であることを示した。このような方式の測定において精度良い測定、及び広い強度範囲の磁界を測定するためには、図7のこの発明を適用した場合のTMR素子1の磁気特性A(電流−抵抗特性)に示したような、飽和しづらく、ヒステリシスの出ない磁気特性が必要であり、この発明によって上記の効果を得た磁界検出装置を実現することが可能となる。
図21に、ここまでに述べた、この発明により外部磁界の測定を行うための一連の手順をフローチャートとして示す。これは測定・制御部102において行われる。簡単に説明すると、
外部磁界H20を印加した状態でTMR素子1の抵抗R0を測定し、次に外部磁界H20を印加した状態でTMR素子1の抵抗R1を測定し、R0とR1の差の絶対値ΔRを求め(ステップS1)、
図20の導体2の例えばA→B方向の電流を増加、またはB→A方向の電流を減少させ(ステップS2)、
導体2に直流電流を供給した状態のTMR素子1の抵抗R2を測定し、R2とR0の差の絶対値ΔR’を求め(ステップS3)、
ΔR>ΔR’(TMR素子1の抵抗がR0に近づくとき)であるならば、ステップS1〜S4を繰り返して、同じ向きに直流電流を増加させ、ΔR’<α(α:所定値)になったら(ステップS4、S5)、
供給電流Iを磁界に換算して出力し(ステップS11)、
また、ステップS4で、ΔR<ΔR’(TMR素子1の抵抗がR0から遠ざかる)場合には、R0とR1の差の絶対値ΔRを求め(ステップS6)、
図20の導体2の例えばB→A方向の電流を増加、またはA→B方向の電流を減少させ(ステップS7)、
R2とR0の差の絶対値ΔR’を求め(ステップS8)、
ΔR>ΔR’(TMR素子1の抵抗がR0に近づくとき)であるならば、ステップS6〜S9を繰り返して、同じ向きに直流電流を増加させ、ΔR’<αになったら(ステップS9、S10)、
供給電流Iを磁界に換算して出力し(ステップS11)、
ステップS9で、ΔR<ΔR’(TMR素子1の抵抗がR0から遠ざかる)場合には、ステップS1に戻り、動作を繰り返す。
導体2に供給する電流Iは、図21のフローチャートに置いては、先ず導体2の端Aから端Bの方向に流しているが、この順番は逆であってもよい。
It has been shown that by using the method described so far, it is possible to detect an external magnetic field using the magnetic field detection device according to the present invention. In order to measure with high accuracy and to measure a magnetic field in a wide intensity range in such a method, the magnetic characteristics A (current-resistance characteristics) of the TMR element 1 in the case of applying the present invention shown in FIG. Such magnetic characteristics that are difficult to saturate and have no hysteresis are required, and the present invention makes it possible to realize a magnetic field detection device that achieves the above effects.
FIG. 21 is a flowchart showing a series of procedures for measuring an external magnetic field according to the present invention described so far. This is performed in the measurement / control unit 102. In brief,
The resistance R0 of the TMR element 1 is measured with the external magnetic field H20 applied, and then the resistance R1 of the TMR element 1 is measured with the external magnetic field H20 applied to determine the absolute value ΔR of the difference between R0 and R1 ( Step S1),
For example, the current in the A → B direction of the conductor 2 in FIG. 20 is increased or the current in the B → A direction is decreased (step S2).
The resistance R2 of the TMR element 1 in a state where a direct current is supplied to the conductor 2 is measured, and the absolute value ΔR ′ of the difference between R2 and R0 is obtained (step S3),
If ΔR> ΔR ′ (when the resistance of the TMR element 1 approaches R0), steps S1 to S4 are repeated to increase the direct current in the same direction, and ΔR ′ <α (α: a predetermined value). (Steps S4, S5)
The supply current I is converted into a magnetic field and output (step S11),
If ΔR <ΔR ′ (the resistance of the TMR element 1 moves away from R0) in step S4, the absolute value ΔR of the difference between R0 and R1 is obtained (step S6).
For example, the current in the B → A direction of the conductor 2 in FIG. 20 is increased or the current in the A → B direction is decreased (step S7).
An absolute value ΔR ′ of the difference between R2 and R0 is obtained (step S8),
If ΔR> ΔR ′ (when the resistance of the TMR element 1 approaches R0), steps S6 to S9 are repeated to increase the direct current in the same direction, and when ΔR ′ <α (steps S9, S10). ),
The supply current I is converted into a magnetic field and output (step S11),
If ΔR <ΔR ′ (the resistance of the TMR element 1 moves away from R0) in step S9, the process returns to step S1 to repeat the operation.
The current I supplied to the conductor 2 first flows in the direction from the end A to the end B of the conductor 2 in the flowchart of FIG. 21, but this order may be reversed.

実施の形態10.
図22はこの発明の実施の形態10による磁界検出装置の構成を示した模式的な平面図であり、実施の形態9で示した磁界検出装置を、実施の形態7で示したブリッジを用いて構成した場合の図である。実施の形態10では導体2と直交する位置に配置された参照用TMR素子17と、導体2とθの角度で交わるTMR素子1が直列に接続されており、それらの両端が電源(Vcc)と等電位面または接地(GND)面にそれぞれ接続されている。測定対象の外部磁界H20が存在しない場合は、これら2つのTMR素子1,17の抵抗は同値であるため、TMR素子1と参照用TMR素子17の接続点251の電位はVcc/2である。
Embodiment 10 FIG.
FIG. 22 is a schematic plan view showing the configuration of the magnetic field detection device according to the tenth embodiment of the present invention. The magnetic field detection device shown in the ninth embodiment is replaced with the bridge shown in the seventh embodiment. It is a figure at the time of comprising. In the tenth embodiment, the reference TMR element 17 disposed at a position orthogonal to the conductor 2 and the TMR element 1 intersecting at an angle θ with the conductor 2 are connected in series, and both ends thereof are connected to the power source (Vcc). Each is connected to an equipotential surface or a ground (GND) surface. When the external magnetic field H20 to be measured does not exist, the resistances of these two TMR elements 1 and 17 have the same value, so the potential at the connection point 251 between the TMR element 1 and the reference TMR element 17 is Vcc / 2.

外部磁界H20を印加すると、TMR素子1の抵抗と参照用TMR素子17の抵抗が不等になる(このときの接続点251の電圧とVcc/2との差の絶対値をΔVと定義する)ため、接続点251の電位はVcc/2ではなくなる。ここで、導体2に電流を供給すると、電流が誘起する磁界16によってTMR素子1の抵抗が変化する。この結果、参照用TMR素子17とTMR素子1との抵抗の大小関係が変化するため、ΔVもまた変化する(この変化後のΔVをΔV’と定義する)。このΔV’を、先の実施の形態9におけるΔR’と同様に、最小になるように導体2に印加する電流を、電圧計・制御部252と電流源20aで制御することで、TMR素子1に外部磁界を印加しない場合の抵抗になる磁界を誘起するための電流を特定することができる。   When the external magnetic field H20 is applied, the resistance of the TMR element 1 and the resistance of the reference TMR element 17 become unequal (the absolute value of the difference between the voltage at the connection point 251 and Vcc / 2 is defined as ΔV). Therefore, the potential at the connection point 251 is not Vcc / 2. Here, when a current is supplied to the conductor 2, the resistance of the TMR element 1 is changed by the magnetic field 16 induced by the current. As a result, since the magnitude relationship between the resistances of the reference TMR element 17 and the TMR element 1 changes, ΔV also changes (ΔV after this change is defined as ΔV ′). Similar to ΔR ′ in the ninth embodiment, the current applied to the conductor 2 is controlled by the voltmeter / control unit 252 and the current source 20a so as to minimize the ΔV ′. It is possible to specify a current for inducing a magnetic field that becomes a resistance when no external magnetic field is applied.

この時、参照用TMR素子17は外部磁界H20の影響を受けないように、磁気シールド254などで覆っておくこと精度を向上させることが可能である。本実施の形態の回路要素の構成を図23に示す。図23の抵抗261が参照用TMR素子17、可変の抵抗260がTMR素子1である。それらの接続点の電位を、比較器262を用いてVcc/2と比較する。   At this time, it is possible to improve accuracy by covering the reference TMR element 17 with a magnetic shield 254 or the like so as not to be affected by the external magnetic field H20. FIG. 23 shows the configuration of the circuit elements of this embodiment. The resistor 261 in FIG. 23 is the reference TMR element 17, and the variable resistor 260 is the TMR element 1. The potential at these connection points is compared with Vcc / 2 using a comparator 262.

本実施の形態であるとTMR素子1と参照用TMR素子17の温度特性が同じであることから、各温度において外部磁界H20を印加しないときの抵抗を参照用TMR素子17から得ることができ、各温度におけるTMR素子1が外部磁界H20を印加しない場合の抵抗になるための電流を、温度特性による誤差の影響を受けずに精度よく特定することが可能となる。   Since the temperature characteristics of the TMR element 1 and the reference TMR element 17 are the same in this embodiment, the resistance when the external magnetic field H20 is not applied at each temperature can be obtained from the reference TMR element 17. It is possible to accurately specify the current that becomes a resistance when the TMR element 1 at each temperature does not apply the external magnetic field H20 without being affected by an error due to temperature characteristics.

なお、図22の電流源20aは図20の電流源20aのように、導体2に流す電流の向きを変えられる構成のものであってもよい。   Note that the current source 20a in FIG. 22 may be configured to change the direction of the current flowing through the conductor 2 as in the current source 20a in FIG.

実施の形態11.
図24はこの発明の実施の形態11による磁界検出装置の構成を示した模式的な平面図であり、実施の形態10で説明した磁界検出装置を用いて、ホイートストンブリッジを構成した場合の図である。実施の形態10の構成を直列に接続し、その接続点271に電源(Vcc)を印加し、他方の端はそれぞれ接地(GND)する。TMR素子(1a,1b)と参照用TMR素子(17c,17d)のそれぞれの中点間の電位を電圧計・制御部252で測定し、その結果に応じて電流源20aを制御できるように接続されている。
Embodiment 11 FIG.
FIG. 24 is a schematic plan view showing the configuration of the magnetic field detection device according to the eleventh embodiment of the present invention, and is a diagram in the case where a Wheatstone bridge is configured using the magnetic field detection device described in the tenth embodiment. is there. The configurations of the tenth embodiment are connected in series, a power supply (Vcc) is applied to the connection point 271, and the other ends are grounded (GND). The potential between the middle points of the TMR elements (1a, 1b) and the reference TMR elements (17c, 17d) is measured by a voltmeter / control unit 252 and connected so that the current source 20a can be controlled according to the result. Has been.

ここでTMR素子1a,1bは外部磁界H20に対して抵抗が変化するが、参照用TMR素子17c,17dは常に外部磁界H20が印加されない時の抵抗を示す。ここで、外部磁界H20が印加されない場合は、TMR素子1a,1b、参照用TMR素子17c,17dのいずれも同じ抵抗となるため、電圧計・制御部252で測定される出力は0となる。一方、外部磁界H20が存在すると、TMR素子1a、1bと参照用TMR素子17c、17dの抵抗が不等となるため、電圧計・制御部252で電圧が生じる。この時の電圧をΔVとする。ここで電流源20aから導体2に電流を供給させると、電流により誘起される磁界によって、やはりTMR素子1a、1bの抵抗が変化しΔVが変化する(変化後の電圧をΔV’とする)。この時の電圧ΔVとΔV’を比較して、ΔVが最小になる電流を特定することで、外部磁界H20に相当する磁界を誘起する電流を特定することができる。   Here, the resistances of the TMR elements 1a and 1b change with respect to the external magnetic field H20, but the reference TMR elements 17c and 17d always show resistance when the external magnetic field H20 is not applied. Here, when the external magnetic field H20 is not applied, since the TMR elements 1a and 1b and the reference TMR elements 17c and 17d all have the same resistance, the output measured by the voltmeter / control unit 252 is zero. On the other hand, if the external magnetic field H20 exists, the resistances of the TMR elements 1a and 1b and the reference TMR elements 17c and 17d become unequal, and a voltage is generated in the voltmeter / control unit 252. The voltage at this time is ΔV. Here, when a current is supplied from the current source 20a to the conductor 2, the resistance of the TMR elements 1a and 1b also changes and ΔV changes due to the magnetic field induced by the current (the voltage after the change is assumed to be ΔV ′). By comparing the voltages ΔV and ΔV ′ at this time and identifying the current that minimizes ΔV, the current that induces the magnetic field corresponding to the external magnetic field H20 can be identified.

本実施の形態であると、ΔVを絶対値として得ることができるため、得られたΔVを増幅して導体2に印加する電流を決定することが可能となり、回路の構成要素を単純にすることが可能となる。   In this embodiment, since ΔV can be obtained as an absolute value, it is possible to amplify the obtained ΔV and determine the current to be applied to the conductor 2, thereby simplifying the circuit components. Is possible.

なお、図24の電流源20aは図20の電流源20aのように、導体2に流す電流の向きを変えられる構成のものであってもよい。   Note that the current source 20a in FIG. 24 may be configured to change the direction of the current flowing through the conductor 2 as in the current source 20a in FIG.

実施の形態12.
この発明の上記各実施の形態において、導体2をはじめ、上部電極3a、下部電極3bは導電性の物質で構成されなければならないことは言うまでもない。その材料としてアルミニウム、Cu、Au、Agなどの導電率の大きな金属を用いることが望ましい。これによって導体2に印加することのできる電流の上限が向上するため、より大きな電流を検出することが可能となる。
Embodiment 12 FIG.
In each of the embodiments of the present invention, it goes without saying that the conductor 2, the upper electrode 3a, and the lower electrode 3b must be made of a conductive material. It is desirable to use a metal having a high conductivity such as aluminum, Cu, Au, or Ag as the material. As a result, the upper limit of the current that can be applied to the conductor 2 is improved, so that a larger current can be detected.

また導電率が上述の物質に匹敵または凌駕する材料であれば、金属に限定する必要はなく、高い導電性を持つカーボンナノチューブや、伝導性のポリマーなどを用いて導体2を形成しても良い。   The conductor 2 may be formed using a carbon nanotube having high conductivity, a conductive polymer, or the like as long as the material has a conductivity comparable to or exceeding the above-described substances. .

アルミニウム、金、銀などの物質を使用する場合は、スパッタリングによって成膜される。またCuなどはメッキ技術と平坦化技術を用いたダマシン法などにより形成される。
図4のように導体2の上層にTMR素子1を形成する場合は、導体2や下部電極3bを形成した後、それぞれ化学機械研磨(CMP:Chemical Mechanical Polishing)などの手法で平坦化を行った後、TMR素子1を形成することが望ましい。
When a material such as aluminum, gold, or silver is used, the film is formed by sputtering. Cu or the like is formed by a damascene method using a plating technique and a planarization technique.
When the TMR element 1 is formed on the upper layer of the conductor 2 as shown in FIG. 4, the conductor 2 and the lower electrode 3b are formed, and then planarized by a method such as chemical mechanical polishing (CMP). Thereafter, it is desirable to form the TMR element 1.

なおこの発明は、上記の各実施の形態に限定されるものではなく、これらの可能な組み合わせを全て含む。   The present invention is not limited to the above-described embodiments, and includes all possible combinations thereof.

1,1a,1b TMR素子(磁気抵抗効果素子)、1aa 反強磁性膜、1bb 強磁性膜、1cc 非磁性膜、1dd 強磁性膜、1ee トンネル絶縁層、1ff 強磁性膜、2 導体、3a 上部電極、3b 下部電極、4 絶縁層、17,17a,17b 参照用TMR素子(磁気抵抗効果素子)、20,21a 電流源、21 電圧計、22 負荷、102 測定・制御部、190 抵抗測定器、252 電圧計・制御部、254 磁気シールド、262 比較器。   1, 1a, 1b TMR element (magnetoresistance effect element), 1aa antiferromagnetic film, 1bb ferromagnetic film, 1cc nonmagnetic film, 1dd ferromagnetic film, 1ee tunnel insulating layer, 1ff ferromagnetic film, 2 conductor, 3a upper part Electrode, 3b Lower electrode, 4 Insulating layer, 17, 17a, 17b Reference TMR element (magnetoresistance effect element), 20, 21a Current source, 21 Voltmeter, 22 Load, 102 Measurement / control unit, 190 Resistance measuring device, 252 Voltmeter / control unit, 254 Magnetic shield, 262 Comparator.

Claims (11)

磁化方向が固定された固定層と外部磁界によって磁化方向が変化する自由層とが積層された細長い磁気抵抗効果素子と、前記磁気抵抗効果素子の近傍に延在する導体と、を備え、前記導体に流れる電流の電流誘起磁界により変化する前記磁気抵抗効果素子の抵抗値に従い、前記導体に流れる電流を検出する電流検出装置であって、
前記磁気抵抗効果素子における積層方向からみて、前記磁気抵抗効果素子が前記導体とその一部または全部が重なる位置に配置され、かつ前記導体の電流が流れる方向に沿った中心線の方向が、前記磁気抵抗効果素子の長手方向に沿った中心線の方向と異なることを特徴とする電流検出装置。
An elongated magnetoresistive effect element in which a fixed layer whose magnetization direction is fixed and a free layer whose magnetization direction is changed by an external magnetic field, and a conductor extending in the vicinity of the magnetoresistive effect element, In accordance with the resistance value of the magnetoresistive effect element that changes due to the current-induced magnetic field of the current that flows in the current detection device,
When viewed from the stacking direction of the magnetoresistive effect element, the magnetoresistive effect element is disposed at a position where the conductor and part or all of the conductor overlap, and the direction of the center line along the direction in which the current of the conductor flows is A current detection device characterized by being different from a direction of a center line along a longitudinal direction of the magnetoresistive effect element.
前記磁気抵抗効果素子における積層方向から見て、前記導体の前記中心線と、前記磁気抵抗効果素子の中心が重なり、前記導体の幅w0と前記磁気抵抗効果素子の長手方向の長さlと、前記磁気抵抗効果素子の前記中心線と前記導体の前記中心線の角度θが、w0/l=sinθとなる配置である請求項1に記載の電流検出装置。   When viewed from the stacking direction of the magnetoresistive effect element, the center line of the conductor and the center of the magnetoresistive effect element overlap, the width w0 of the conductor and the longitudinal length l of the magnetoresistive effect element, The current detection device according to claim 1, wherein an angle θ between the center line of the magnetoresistive element and the center line of the conductor is w0 / l = sin θ. 前記磁気抵抗効果素子の前記固定層の磁化方向が、前記磁気抵抗効果素子の長手方向と直交する方向である請求項1または2に記載の電流検出装置。   The current detection device according to claim 1, wherein the magnetization direction of the fixed layer of the magnetoresistive effect element is a direction orthogonal to a longitudinal direction of the magnetoresistive effect element. 前記磁気抵抗効果素子の前記固定層の磁化方向が、前記磁気抵抗効果素子の長手方向と平行である請求項1または2に記載の電流検出装置。   The current detection device according to claim 1, wherein a magnetization direction of the fixed layer of the magnetoresistive effect element is parallel to a longitudinal direction of the magnetoresistive effect element. 前記磁気抵抗効果素子における積層方向から見て、前記導体の前記中心線と前記磁気抵抗効果素子の中心との距離a、前記導体の幅w0、前記磁気抵抗効果素子の長手方向の長さl、前記磁気抵抗効果素子の前記中心線と前記導体の前記中心線の角度θが、w0>l・sinθ+2aとなる配置である請求項1に記載の電流検出装置。   A distance a between the center line of the conductor and the center of the magnetoresistive effect element, a width w0 of the conductor, a length l in the longitudinal direction of the magnetoresistive effect element, as viewed from the stacking direction in the magnetoresistive effect element, 2. The current detection device according to claim 1, wherein an angle θ between the center line of the magnetoresistive effect element and the center line of the conductor is such that w0> l · sin θ + 2a. 前記磁気抵抗効果素子における積層方向から見て、前記導体の前記中心線と前記磁気抵抗効果素子の中心との距離a、前記導体の幅w0、前記磁気抵抗効果素子の長手方向の長さl、前記磁気抵抗効果素子の前記中心線と前記導体の前記中心線の角度θが、2a<l・sinθ,かつl・sinθ>w0となる配置である請求項1に記載の電流検出装置。   A distance a between the center line of the conductor and the center of the magnetoresistive effect element, a width w0 of the conductor, a length l in the longitudinal direction of the magnetoresistive effect element, as viewed from the stacking direction in the magnetoresistive effect element, 2. The current detection device according to claim 1, wherein an angle θ between the center line of the magnetoresistive effect element and the center line of the conductor is 2a <l · sin θ and l · sin θ> w 0. 長手方向が互いに平行になるように配置されかつ電気的に直列に接続された偶数個の前記磁気抵抗効果素子を備え、半数の前記磁気抵抗効果素子とは前記中心線同士が第1の角度で交差し、残りの半数の前記磁気抵抗効果素子とは前記中心線同士が前記第1の角度とは異なる第2の角度で交差する前記導体と交差し、
直列に接続された前記磁気抵抗効果素子に電圧印加したときの、前記半数の前記磁気抵抗効果素子と前記残りの半数の前記磁気抵抗効果素子との接続点の電位から前記導体に流れる電流を検出する制御部を有する請求項1に記載の電流検出装置。
An even number of magnetoresistive elements arranged in parallel in the longitudinal direction and electrically connected in series are provided, and half of the magnetoresistive elements are centered at a first angle. Intersecting with the other half of the magnetoresistive elements intersecting the conductors whose centerlines intersect at a second angle different from the first angle;
When a voltage is applied to the magnetoresistive effect elements connected in series, a current flowing through the conductor is detected from a potential at a connection point between the half of the magnetoresistive effect elements and the remaining half of the magnetoresistive effect elements. The current detection device according to claim 1, further comprising a control unit that performs the operation.
請求項7に記載の偶数個の前記磁気抵抗効果素子と前記導体を含む電流検出部を2つ直列接続し、
前記電流検出部間の接続点に電圧を印加した時の、それぞれの前記電流検出部に含まれる前記磁気抵抗効果素子の半数と残りの半数との接続点間の電位差から前記導体に流れる電流を検出する制御部を有する電流検出装置。
Two current detection units including the even number of the magnetoresistive effect elements according to claim 7 and the conductor are connected in series,
When a voltage is applied to a connection point between the current detection units, a current flowing through the conductor from a potential difference between the connection points between the half of the magnetoresistive effect elements included in each of the current detection units and the remaining half. A current detection device having a control unit for detection.
請求項1から8までのいずれか1項に記載の電流検出装置の、前記磁気抵抗効果素子の抵抗値変化を示す出力を検出し、同時に前記導体に印加された外部磁界を打ち消す方向に電流源から前記導体に電流値を変化させて電流を供給し、前記磁気抵抗効果素子の抵抗変化を示す出力が前記外部磁界が存在しない場合の出力と一致する時の前記導体に供給した電流値に従って前記外部磁界を検出する制御部を備えた磁界検出装置。   The current detection device according to claim 1, wherein an output indicating a change in resistance value of the magnetoresistive effect element is detected, and at the same time, a current source is applied in a direction to cancel the external magnetic field applied to the conductor. The current is changed from the current value to the conductor to supply current, and the output indicating the resistance change of the magnetoresistive element matches the output when the external magnetic field does not exist according to the current value supplied to the conductor. A magnetic field detection apparatus including a control unit that detects an external magnetic field. 磁化方向が固定された固定層と外部磁界によって磁化方向が変化する自由層とが積層された細長い磁気抵抗効果素子の、前記磁気抵抗効果素子の近傍に延在する導体に流れる電流の電流誘起磁界により変化する抵抗値に従い、前記導体に流れる電流を検出する電流検出方法であって、
前記磁気抵抗効果素子における積層方向からみて、前記磁気抵抗効果素子を前記導体とその一部または全部が重なる位置に、前記導体の電流が流れる方向に沿った中心線の方向が、前記磁気抵抗効果素子の長手方向に沿った中心線の方向と異なるように配置する電流検出方法。
A current-induced magnetic field of a current flowing in a conductor extending in the vicinity of the magnetoresistive effect element of an elongate magnetoresistive effect element in which a fixed layer whose magnetization direction is fixed and a free layer whose magnetization direction is changed by an external magnetic field are laminated A current detection method for detecting a current flowing through the conductor in accordance with a resistance value that varies according to:
When viewed from the stacking direction of the magnetoresistive effect element, the magnetoresistive effect element is positioned so that the conductor and a part or all of the conductor overlap, and the direction of the center line along the direction in which the current of the conductor flows is the magnetoresistive effect. A current detection method of arranging differently from the direction of the center line along the longitudinal direction of the element.
請求項10の電流検出方法の、前記磁気抵抗効果素子の抵抗値変化を示す出力を検出し、同時に前記導体に印加された外部磁界を打ち消す方向に前記導体に電流値を変化させて電流を供給し、前記磁気抵抗効果素子の抵抗値変化を示す出力が前記外部磁界が存在しない場合の出力と一致する時の前記導体に供給した電流値に従って前記外部磁界を検出する磁界検出方法。   11. The current detection method according to claim 10, wherein an output indicating a change in resistance value of the magnetoresistive effect element is detected, and at the same time, a current value is supplied to the conductor in a direction to cancel the external magnetic field applied to the conductor. A magnetic field detection method for detecting the external magnetic field according to a current value supplied to the conductor when an output indicating a change in resistance value of the magnetoresistive effect element coincides with an output when the external magnetic field does not exist.
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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017533419A (en) * 2014-10-03 2017-11-09 クロッカス・テクノロジー・ソシエテ・アノニム Self-referenced MRAM cell and magnetic field sensor having the self-referenced MRAM cell
JP2019158535A (en) * 2018-03-12 2019-09-19 Tdk株式会社 Magnetic sensor and position detector
US11002803B2 (en) 2018-06-08 2021-05-11 Tdk Corporation Magnetic field detection device
CN112946538A (en) * 2019-12-11 2021-06-11 Tdk株式会社 Magnetic field detection device and current detection device
JP2021092527A (en) * 2019-12-11 2021-06-17 Tdk株式会社 Magnetic field detector and current detector
DE102021105498A1 (en) 2020-03-18 2021-09-23 Tdk Corporation MAGNETIC FIELD DETECTION DEVICE AND CURRENT DETECTION DEVICE
KR20220105099A (en) * 2021-01-19 2022-07-26 숭실대학교산학협력단 Current sensor made of carbon nanotube wire with current conduction wires to be measured
JP2022538754A (en) * 2019-07-05 2022-09-06 クロッカス・テクノロジー・ソシエテ・アノニム Magnetic current magnetic field sensor with magnetoresistive differential full bridge
US11549970B2 (en) 2019-12-11 2023-01-10 Tdk Corporation Magnetic field detection apparatus and current detection apparatus
US12072397B2 (en) 2021-09-22 2024-08-27 Tdk Corporation Magnetic field detection apparatus
US12153104B2 (en) 2021-09-21 2024-11-26 Tdk Corporation Magnetic sensor including a plurality of magnetoresistive elements each having long shape in one direction
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US12455302B2 (en) 2019-12-11 2025-10-28 Tdk Corporation Magnetic field detection apparatus and current detection apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5247278A (en) * 1991-11-26 1993-09-21 Honeywell Inc. Magnetic field sensing device
JP2001516031A (en) * 1997-08-14 2001-09-25 ハネウエル・インコーポレーテッド Magnetic field detection device
JP2007101253A (en) * 2005-09-30 2007-04-19 Tdk Corp Current sensor
JP2007218700A (en) * 2006-02-15 2007-08-30 Tdk Corp Magnetic sensor and current sensor
JP2012052980A (en) * 2010-09-03 2012-03-15 Alps Green Devices Co Ltd Current sensor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5247278A (en) * 1991-11-26 1993-09-21 Honeywell Inc. Magnetic field sensing device
JP2001516031A (en) * 1997-08-14 2001-09-25 ハネウエル・インコーポレーテッド Magnetic field detection device
JP2007101253A (en) * 2005-09-30 2007-04-19 Tdk Corp Current sensor
JP2007218700A (en) * 2006-02-15 2007-08-30 Tdk Corp Magnetic sensor and current sensor
JP2012052980A (en) * 2010-09-03 2012-03-15 Alps Green Devices Co Ltd Current sensor

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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JP2019158535A (en) * 2018-03-12 2019-09-19 Tdk株式会社 Magnetic sensor and position detector
US11002803B2 (en) 2018-06-08 2021-05-11 Tdk Corporation Magnetic field detection device
US11531071B2 (en) 2018-06-08 2022-12-20 Tdk Corporation Magnetic field detection device
JP7595592B2 (en) 2019-07-05 2024-12-06 アレグロ・マイクロシステムズ・リミテッド・ライアビリティ・カンパニー Magnetic current magnetic field sensor with magnetoresistive differential full bridge
JP2022538754A (en) * 2019-07-05 2022-09-06 クロッカス・テクノロジー・ソシエテ・アノニム Magnetic current magnetic field sensor with magnetoresistive differential full bridge
JP7024811B2 (en) 2019-12-11 2022-02-24 Tdk株式会社 Magnetic field detector and current detector
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US12332282B2 (en) 2019-12-11 2025-06-17 Tdk Corporation Magnetic field detection apparatus and current detection apparatus
US11372029B2 (en) 2019-12-11 2022-06-28 Tdk Corporation Magnetic field detection apparatus and current detection apparatus
US11959943B2 (en) 2019-12-11 2024-04-16 Tdk Corporation Magnetic field detection apparatus and current detection apparatus
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US11422166B2 (en) 2020-03-18 2022-08-23 Tdk Corporation Magnetic field detection apparatus and current detection apparatus
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