JP2016091925A

JP2016091925A - Terminal for board

Info

Publication number: JP2016091925A
Application number: JP2014227906A
Authority: JP
Inventors: 玉井　義昭; Yoshiaki Tamai; 義昭玉井
Original assignee: ICREX KK
Current assignee: ICREX KK
Priority date: 2014-11-10
Filing date: 2014-11-10
Publication date: 2016-05-23

Abstract

PROBLEM TO BE SOLVED: To provide a terminal for board capable of maintaining an electrical connection state between a circuit component and a printed circuit board even if the terminal is resonated by receiving external vibrations or the like.SOLUTION: A terminal 1 for board is used for fitting an electronic component onto the printed circuit board by being fitted on a surface of the printed circuit board and receiving and connecting a lead terminal of the electronic component. The terminal for board comprises: board mounting parts 2a and 2b which are bonded on the printed circuit board; and a terminal part 3 including a right-side terminal part 3R, a left-side terminal part 3L, a front-side terminal part 3F and a back-side terminal part 3B which are connected to the board mounting parts, extend in a cantilevered support shape and are opposite to each other. Within opposing intervals of the right-side terminal part 3R, the left-side terminal part 3L, the front-side terminal part 3F and the rear-side terminal part 3B, the lead terminal is inserted, received and electrically connected. Eigen frequencies of the right-side terminal part 3R, the left-side terminal part 3L, the front-side terminal part 3F and the back-side terminal part 3B are different for each pair.SELECTED DRAWING: Figure 1

Description

本発明は、回路基板に実装され、例えば電子部品等の回路構成部品と回路基板とを電気接続するための基板用端子に関する。 The present invention relates to a board terminal that is mounted on a circuit board and electrically connects a circuit component such as an electronic component and the circuit board.

従来から、半導体装置（ＩＣ）などの電子部品をプリント基板（回路基板）と電気的に接続させるため、この電子部品を装着可能に構成され、電子部品の外部端子（リード部）を内部に設けられた接触端子により接続させるソケット端子が知られている（例えば、下記の特許文献１を参照）。このようなソケット端子は、プリント基板の所定位置に貫通するように形成されたスルーホールを通じてプリント基板に半田接合されて実装される。こうしてプリント基板に実装されたソケット端子は、電子部品の外部端子をソケット端子の内部に挿入すると、ソケット端子の接触端子が電子部品の外部端子と弾性的に接触して両者が導通することにより、ソケット端子を介して電子部品とプリント基板との間の情報伝送が可能となる。 Conventionally, an electronic component such as a semiconductor device (IC) is electrically connected to a printed circuit board (circuit board) so that the electronic component can be mounted and an external terminal (lead portion) of the electronic component is provided inside. A socket terminal to be connected by a contact terminal is known (for example, see Patent Document 1 below). Such a socket terminal is mounted by being soldered to the printed circuit board through a through hole formed so as to penetrate a predetermined position of the printed circuit board. The socket terminal mounted on the printed circuit board in this way, when the external terminal of the electronic component is inserted into the socket terminal, the contact terminal of the socket terminal is in elastic contact with the external terminal of the electronic component, and both are conducted, Information can be transmitted between the electronic component and the printed circuit board via the socket terminal.

上記のソケットと同様に、プリント基板に実装されて、プリント基板に装着される電子部品とプリント基板との間の情報伝送を可能にする部材として、例えば下記の特許文献２に開示された基板用端子も開発されている。特許文献２に開示された基板用端子１はプリント基板１０に実装され、左右に対向する一対のコンタクト３，３により電子部品２０のリード部２１を弾性的に挟持して、電子部品２０とプリント基板１０とを電気的に接続するものである。 Similar to the socket described above, as a member that is mounted on a printed board and enables information transmission between the printed circuit board and an electronic component that is mounted on the printed board, for example, for a board disclosed in Patent Document 2 below Terminals are also being developed. The board terminal 1 disclosed in Patent Document 2 is mounted on a printed circuit board 10, and a lead portion 21 of the electronic component 20 is elastically sandwiched between a pair of contacts 3 and 3 facing left and right. The substrate 10 is electrically connected.

特開２０００−３６３４４号公報JP 2000-36344 A 特開２００７−２９９６６３号公報JP 2007-299663 A

ところで、特許文献２に開示された一対のコンタクト３，３は、互いに対称形の片持ち支持形状に形成されて、所定の接触圧（接触力）でリード部２１に接触するように構成されている。その上で、これら一対のコンタクト３，３は、使用環境等に応じて、想定される範囲内の振動（衝撃）が加わってもコンタクト３，３がリード部２１から瞬間的に離れること（この現象は「瞬断」とも称される）がないような接触圧でリード部２１に接触するように構成される。しかし、想定される範囲内における振動であっても、コンタクト３の固有振動数と略同一の振動が加わった場合、一対のコンタクト３，３が共振を起こしてコンタクト３に接触圧を越える力が作用してコンタクト３がリード２１から瞬間的に離れて瞬断が生じ、電子部品２０とプリント基板１０との電気的な接続が瞬時ではあるが断たれる虞があるという課題がある。 Incidentally, the pair of contacts 3 and 3 disclosed in Patent Document 2 are formed in a symmetrical cantilever support shape and configured to contact the lead portion 21 with a predetermined contact pressure (contact force). Yes. In addition, the pair of contacts 3 and 3 are instantaneously separated from the lead portion 21 even if vibration (impact) within an assumed range is applied depending on the use environment or the like (this The phenomenon is also referred to as “instantaneous interruption”) and is configured to contact the lead portion 21 with a contact pressure such that there is no such phenomenon. However, even if the vibration is within the assumed range, when a vibration substantially the same as the natural frequency of the contact 3 is applied, the pair of contacts 3 and 3 resonate and a force exceeding the contact pressure is exerted on the contact 3. There is a problem that the contact 3 is instantaneously separated from the lead 21 due to the action to cause an instantaneous disconnection, and the electrical connection between the electronic component 20 and the printed circuit board 10 may be instantaneously disconnected.

本発明は、上記課題に鑑みてなされたものであり、外部振動が加わるなどしてコンタクトが共振するような場合でも、回路構成部品とプリント基板との電気的な接続状態を維持することができる基板用端子を提供することを目的とする。 The present invention has been made in view of the above problems, and can maintain the electrical connection state between the circuit component and the printed circuit board even when the contact resonates due to external vibration or the like. An object is to provide a terminal for a substrate.

上記目的を達成するため、本発明に係る基板用端子は、回路基板（例えば、実施形態におけるプリント基板１０）の面上に取り付けられ、回路構成部品（例えば、実施形態にお
ける電子部品２０）のリード部（例えば、実施形態におけるリード端子２１）を受容接続して前記回路構成部品を前記回路基板に取り付けるために用いられる基板用端子であって、前記回路基板上に接合される基板実装部と、前記基板実装部に繋がって片持ち支持形状で延びるとともに互いに対向する複数対の端子を有する端子部とを備え、前記複数対の端子の対向間隔内に前記リード部を挿入させて前記端子部に前記リード部を受容して電気接続するように構成されており、前記複数対の端子の固有振動数が、各対毎に相違する。 In order to achieve the above object, the board terminal according to the present invention is mounted on the surface of a circuit board (for example, the printed circuit board 10 in the embodiment), and leads for circuit components (for example, the electronic component 20 in the embodiment). A board mounting portion that is used to receive and connect a portion (for example, the lead terminal 21 in the embodiment) and attach the circuit component to the circuit board, and is bonded onto the circuit board; A terminal portion connected to the substrate mounting portion and extending in a cantilevered support shape and having a plurality of pairs of terminals facing each other, and the lead portions are inserted into facing intervals of the plurality of pairs of terminals to the terminal portions The lead portions are received and electrically connected, and the natural frequencies of the plurality of pairs of terminals are different for each pair.

上述の基板用端子において、前記複数対の端子の片持ち支持長さが、各対毎に相違する構成であることが好ましい。 In the above-described substrate terminal, it is preferable that the cantilever support lengths of the plurality of pairs of terminals are different for each pair.

上述の基板用端子において、前記複数対の端子が、第１の方向において対向する一対の端子からなる第１端子対（例えば、実施形態における右側端子部３Ｒ、左側端子部３Ｌ）と、第２の方向において対向する一対の端子からなる第２端子対（例えば、実施形態における前側端子部３Ｆ、後側端子部３Ｂ）とからなり、前記第１の端子対は、前記第１の方向における互いに対向する側に向けて凸状に形成されてその間隔内に前記リード端子を受容して挟持する第１の接触部（例えば、実施形態における接触部３ｃ，３ｆ）を備え、前記第２の端子対は、前記第２の方向における互いに対向する側に向けて凸状に形成されてその間隔内に前記リード端子を受容して挟持する第２の接触部（例えば、実施形態における接触部３ｉ，３ｍ）を備える構成であることが好ましい。 In the above-described board terminals, the plurality of pairs of terminals include a first terminal pair (for example, the right terminal portion 3R and the left terminal portion 3L in the embodiment) composed of a pair of terminals facing each other in the first direction, and a second terminal. And a second terminal pair (for example, the front terminal portion 3F and the rear terminal portion 3B in the embodiment), and the first terminal pair is mutually connected in the first direction. A first contact portion (for example, contact portions 3c and 3f in the embodiment) that is formed in a convex shape toward the opposite side and receives and sandwiches the lead terminal within the interval is provided, and the second terminal The pair is formed in a convex shape toward the sides facing each other in the second direction, and a second contact portion (for example, the contact portion 3i in the embodiment, 3m) It is preferably formed.

また、上述の基板用端子において、前記第１の方向と前記第２の方向とが略直交する構成が好ましい。 In the above-described substrate terminal, it is preferable that the first direction and the second direction are substantially orthogonal.

上述の基板用端子において、絶縁性材料を用いて形成され、前記端子部を収容する端子収容部を有する端子収容部材（例えば、実施形態におけるハウジング３０）を備え、前記端子収容部に前記端子部を収容保持して構成されることが好ましい。 The above-described substrate terminal includes a terminal housing member (for example, the housing 30 in the embodiment) that is formed using an insulating material and has a terminal housing portion that houses the terminal portion, and the terminal housing portion includes the terminal portion. It is preferable that the container is accommodated and held.

また、上述の基板用端子において、前記端子部を収容する端子収容部および前記端子収容部に繋がって前記基板実装部を備える導電材料製のアウター部材（例えば、実施形態におけるアウターシェル５０）を有し、前記端子収容部に前記端子部を収容保持して構成されることが好ましい。 In addition, the above-described substrate terminal includes a terminal accommodating portion that accommodates the terminal portion and an outer member made of a conductive material that is connected to the terminal accommodating portion and includes the substrate mounting portion (for example, the outer shell 50 in the embodiment). And it is preferable that the said terminal accommodating part is accommodated and hold | maintained at the said terminal accommodating part.

本発明に係る基板用端子は、片持ち支持形状に形成されて互いに対向する複数対の端子により、リード部を受容して電気接続するように構成されており、その上で、これら複数対の端子の固有振動数が各対毎に相違する構成となっている。このため、外部振動が基板用端子（回路基板）に作用したときで、このときの振動数が複数対の端子のいずれかと共振する振動数であっても、その他の対の端子においては作用する外部振動の振動数と固有振動数とが異なるので、この端子によりリード部との接触状態を維持できる。よって、外部振動が加わるなどして端子が共振するような場合でも、回路構成部品と回路基板との瞬断の発生を確実に防止でき、これらが電気的に接続された状態を維持することができる。 The substrate terminal according to the present invention is configured to receive and electrically connect the lead portion with a plurality of pairs of terminals that are formed in a cantilever support shape and face each other. The natural frequency of the terminal is different for each pair. For this reason, when external vibrations act on the board terminal (circuit board), even if the frequency at this time is a frequency that resonates with one of a plurality of pairs of terminals, it acts on the other pairs of terminals. Since the frequency of the external vibration and the natural frequency are different, the contact state with the lead portion can be maintained by this terminal. Therefore, even when the terminal resonates due to external vibration or the like, the occurrence of a momentary disconnection between the circuit component and the circuit board can be reliably prevented, and the state in which these are electrically connected can be maintained. it can.

第１の実施形態に係る基板用端子を示し、（ａ）は正面図、（ｂ）は底面図、（ｃ）は側面図である。The board | substrate terminal which concerns on 1st Embodiment is shown, (a) is a front view, (b) is a bottom view, (c) is a side view. プリント基板に実装された第１の実施形態に係る基板用端子を、図１中のＩＩ−ＩＩ方向から示す断面図である。It is sectional drawing which shows the terminal for board | substrates concerning 1st Embodiment mounted in the printed circuit board from the II-II direction in FIG. 第２の実施形態に係るハウジング付き基板用端子を示し、（ａ）は平面図、（ｂ）は正面図、（ｃ）は側面図である。The terminal for board | substrates with a housing which concerns on 2nd Embodiment is shown, (a) is a top view, (b) is a front view, (c) is a side view. 第３の実施形態に係るアウターシェル付き基板用端子を構成する基板用端子を示し、（ａ）は平面図、（ｂ）は正面図、（ｃ）は底面図、（ｄ）は側面図である。The board | substrate terminal which comprises the board | substrate terminal with an outer shell which concerns on 3rd Embodiment is shown, (a) is a top view, (b) is a front view, (c) is a bottom view, (d) is a side view. is there. 第３の実施形態に係るアウターシェル付き基板用端子を示し、（ａ）は平面図、（ｂ）は正面図、（ｃ）は側面図である。The terminal for board | substrates with an outer shell which concerns on 3rd Embodiment is shown, (a) is a top view, (b) is a front view, (c) is a side view.

以下、本発明の好ましい実施形態について図面を参照して説明する。第１の実施形態に係る基板用端子１を図１に示しており、まず、この図を参照しながら、基板用端子１の構成について説明する。なお、以下においては、説明の便宜のため、各図に矢印で示すように前後、左右および上下方向を定義して説明を行う。 Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. The substrate terminal 1 according to the first embodiment is shown in FIG. 1. First, the configuration of the substrate terminal 1 will be described with reference to this figure. In the following description, for convenience of explanation, the front and rear, left and right, and up and down directions are defined as indicated by arrows in each drawing.

基板用端子１は、導電性を有する金属帯板（りん青銅もしくはベリリウム銅などの金属材料）に、打ち抜き加工および折り曲げ加工を施すことで形成され、略筒状に折り曲げられて上下に延びるベース部２と、ベース部２の上端部に繋がって上方に延びる端子部３とを一体的に形成して構成される。また、基板用端子１を形成するために用いられる金属帯板は、その表面に数μｍ程度の厚さのニッケルめっきが下地として施され、さらに数μｍ程度の厚さの錫めっきが仕上げとして施された構造となっている。 The substrate terminal 1 is formed by punching and bending a conductive metal strip (metal material such as phosphor bronze or beryllium copper), and is bent into a substantially cylindrical shape and extends vertically. 2 and a terminal portion 3 connected to the upper end portion of the base portion 2 and extending upward are integrally formed. Further, the metal strip used to form the substrate terminal 1 is provided with a nickel plating with a thickness of about several μm on the surface as a base, and further with a tin plating with a thickness of about several μm as a finish. It has a structured.

ベース部２は、略平坦に形成された４つの壁部から構成されており、具体的には、右側に位置して前後および上下に延びる右側ベース部２Ｒと、右側ベース部２Ｒの後端部に繋がって左右および上下に延びる後側ベース部２Ｂと、後側ベース部２Ｂの左端部に繋がって前後および上下に延びる左側ベース部２Ｌと、左側ベース部２Ｌの前端部に繋がって左右におよび上下に延びる前側ベース部２Ｆとを備えて構成される。右側ベース部２Ｒには、右側ベース部２Ｒの下端部に繋がって右方に延びる平坦な基板実装部２ａが形成され、左側ベース部２Ｌには、左側ベース部２Ｌの下端部に繋がって左方に延びる平坦な基板実装部２ｂが形成されている。なお、右側ベース部２Ｒの前端部と前側ベース部２Ｆの右端部とは、金属帯板を折り曲げ加工して形成するため、間隙を有して分離されている。 The base portion 2 is composed of four wall portions formed substantially flat. Specifically, the base portion 2 is located on the right side and extends in the front-rear and up-down directions, and the rear end portion of the right base portion 2R. Connected to the left base portion 2B extending to the left and right and up and down, to the left end portion of the rear base portion 2B and extending to the front and rear and up and down, and to the front end portion of the left base portion 2L and to the left and right And a front base portion 2F extending vertically. The right base portion 2R is formed with a flat board mounting portion 2a extending rightward and connected to the lower end portion of the right base portion 2R. The left base portion 2L is connected to the lower end portion of the left base portion 2L and leftward. A flat board mounting portion 2b extending in the direction is formed. The front end portion of the right base portion 2R and the right end portion of the front base portion 2F are separated by a gap because they are formed by bending a metal strip.

端子部３は、右側ベース部２Ｒの上端部に繋がって上方に延びる右側端子部３Ｒと、後側ベース部２Ｂの上端部に繋がって上方に延びる後側端子部３Ｂと、左側ベース部２Ｌの上端部に繋がって上方に延びる左側端子部３Ｌと、前側ベース部２Ｆの上端部に繋がって上方に延びる前側端子部３Ｆとを備えて構成される。この端子部３は、右側端子部３Ｒの前後幅、後側端子部３Ｂの左右幅、左側端子部３Ｌの前後幅および前側端子部３Ｆの左右幅が略同一寸法に形成されている。 The terminal part 3 is connected to the upper end part of the right base part 2R and extends upward, the rear terminal part 3B connected to the upper end part of the rear base part 2B and extended upward, and the left base part 2L. The left terminal portion 3L is connected to the upper end portion and extends upward, and the front terminal portion 3F is connected to the upper end portion of the front base portion 2F and extends upward. In this terminal portion 3, the front and rear width of the right terminal portion 3R, the left and right width of the rear terminal portion 3B, the front and rear width of the left terminal portion 3L, and the left and right width of the front terminal portion 3F are formed to have substantially the same dimensions.

右側端子部３Ｒは、図１（ａ）に示すように、右側ベース部２Ｒの上端部に繋がって左側斜め上方に延びる基端アーム部３ａと、基端アーム部３ａの上端部に繋がって右側斜め上方に延びる先端アーム部３ｂと、基端アーム部３ａおよび先端アーム部３ｂの接続部分に左方に向けて凸となるように形成された接触部３ｃとを備えた片持ち支持形状に構成される。このため、右側端子部３Ｒは、右側ベース部２Ｒとの接続部分を支持端部として、左右方向に弾性的に曲げ変形して揺動変位が可能である。この右側端子部３Ｒはその形状および質量に応じた固有振動数を有し、この固有振動数と同一の外部振動が加わると、これが共振する。 As shown in FIG. 1A, the right terminal portion 3R is connected to the upper end portion of the right base portion 2R and extends obliquely upward on the left side, and is connected to the upper end portion of the base end arm portion 3a on the right side. A cantilever supporting shape including a distal arm portion 3b extending obliquely upward and a contact portion 3c formed to protrude leftward at a connection portion of the proximal arm portion 3a and the distal arm portion 3b. Is done. For this reason, the right terminal portion 3R can be oscillated and displaced by being elastically bent and deformed in the left-right direction with the connecting portion with the right base portion 2R as a support end. The right terminal portion 3R has a natural frequency corresponding to its shape and mass, and when an external vibration identical to the natural frequency is applied, it resonates.

左側端子部３Ｌは、上記の右側端子部３Ｒと左右対称形に形成されており、基端アーム部３ａと左右対称である基端アーム部３ｄと、先端アーム部３ｂと左右対称である先端アーム部３ｅと、接触部３ｃと左右対称である接触部３ｆとを備えた片持ち支持形状に構成され、左右方向に弾性的に曲げ変形して揺動変位が可能である。なお、左側端子部３Ｌは右側端子３Ｒと左右対称形に形成されているため、右側端子部３Ｒと略同一の固有振動数を有する。 The left terminal portion 3L is formed symmetrically with the right terminal portion 3R described above, a proximal arm portion 3d that is symmetrical with the proximal arm portion 3a, and a distal arm that is symmetrical with the distal arm portion 3b. It is configured in a cantilever support shape including a portion 3e, a contact portion 3c and a contact portion 3f that is bilaterally symmetric, and can be oscillated and displaced by elastic bending in the left-right direction. Since the left terminal portion 3L is formed symmetrically with the right terminal 3R, it has substantially the same natural frequency as the right terminal portion 3R.

右側端子部３Ｒの接触部３ｃと左側端子部３Ｌの接触部３ｆとの左右間隔は、後述する電子部品２０を構成するリード端子２１が挿入されて揺動変位したときに所定の接触圧でリード端子２１に接触するように、リード端子２１の左右幅よりも小さく形成されている（図２参照）。なお、この所定の接触圧は、基本的にはリード端子２１との電気接続に要する接触圧であるが、この基板用端子１が実装されるプリント基板１０の使用等において想定される範囲内の振動が加わっても瞬断を起こさないような接触圧ともなるように設定される。 The right and left distance between the contact portion 3c of the right terminal portion 3R and the contact portion 3f of the left terminal portion 3L is set at a predetermined contact pressure when a lead terminal 21 constituting the electronic component 20 described later is inserted and swung. The lead terminal 21 is formed smaller than the left and right width so as to contact the terminal 21 (see FIG. 2). The predetermined contact pressure is basically a contact pressure required for electrical connection with the lead terminal 21, but is within a range assumed in use of the printed board 10 on which the board terminal 1 is mounted. The contact pressure is set such that no instantaneous interruption occurs even when vibration is applied.

前側端子部３Ｆは、図１（ｂ）に示すように、前側ベース部２Ｆの上端部に繋がって後側斜め上方に延びる基端アーム部３ｇと、基端アーム部３ｇの上端部に繋がって前側斜め上方に延びる先端アーム部３ｈと、基端アーム部３ｇおよび先端アーム部３ｈの接続部分に後方に向けて凸となるように形成された接触部３ｉとを備えた片持ち支持形状に構成される。上述の左右端子部３Ｌ，３Ｒと同様に、前側端子部３Ｆは、前側ベース部２Ｆとの接続部分を支持端部として、前後方向に弾性的に曲げ変形して揺動変位が可能である。但し、その上下高さは、図示のように、上述の左右端子部３Ｌ，３Ｒよりも高い。このため、前側端子部３Ｆは、左右端子部３Ｌ，３Ｒとは相違する固有振動数を有する。具体的には、前側端子部３Ｆの固有振動数は、左右端子部３Ｌ，３Ｒの固有振動数より低い振動数となる。 As shown in FIG. 1B, the front terminal portion 3F is connected to the upper end portion of the front base portion 2F and extends obliquely upward to the rear side, and is connected to the upper end portion of the base end arm portion 3g. Constructed in a cantilever support shape comprising a front arm portion 3h extending obliquely upward on the front side, and a contact portion 3i formed so as to protrude rearward from the connecting portion of the base arm portion 3g and the front arm portion 3h. Is done. Similar to the left and right terminal portions 3L and 3R described above, the front terminal portion 3F can be rocked and displaced by elastically bending and deforming in the front-rear direction with the connection portion with the front base portion 2F as a support end. However, the vertical height is higher than the above-described left and right terminal portions 3L and 3R as shown in the figure. For this reason, the front side terminal portion 3F has a natural frequency different from that of the left and right terminal portions 3L and 3R. Specifically, the natural frequency of the front terminal portion 3F is lower than the natural frequency of the left and right terminal portions 3L and 3R.

後側端子部３Ｂは、上記の前側端子部３Ｆと前後対称形に形成されており、基端アーム部３ｇと前後対称である基端アーム部３ｊと、先端アーム部３ｈと前後対称である先端アーム部３ｋと、接触部３ｉと前後対称である接触部３ｍとを備えた片持ち支持形状に構成され、前後方向に弾性的に曲げ変形して揺動変位が可能である。この後側端子部３Ｂは、前側端子部３Ｆと前後対称形に形成されているため、前側端子部３Ｆと略同一の固有振動数を有する。 The rear terminal portion 3B is formed in a symmetric shape with the front terminal portion 3F, and has a proximal arm portion 3j that is symmetric with the proximal arm portion 3g and a distal tip that is symmetric with the distal arm portion 3h. It is configured in a cantilever support shape including an arm portion 3k, a contact portion 3i and a contact portion 3m that is symmetric in the front-rear direction, and can be oscillated and displaced by elastic bending in the front-rear direction. Since the rear terminal portion 3B is formed symmetrically with the front terminal portion 3F, the rear terminal portion 3B has substantially the same natural frequency as the front terminal portion 3F.

前側端子部３Ｆの接触部３ｉと後側端子部３Ｂの接触部３ｍとの前後間隔は、接触部３ｃおよび接触部３ｆと同様に、後述するリード端子２１が挿入されて揺動変位したときに所定の接触圧でリード端子２１に接触するように、リード端子２１の前後幅よりも小さく形成されている。 The front-rear distance between the contact part 3i of the front terminal part 3F and the contact part 3m of the rear terminal part 3B is the same as that of the contact part 3c and the contact part 3f when the lead terminal 21 described later is inserted and oscillated and displaced. The lead terminal 21 is formed smaller than the front-rear width so as to come into contact with the lead terminal 21 with a predetermined contact pressure.

次に、この基板用端子１が実装されるプリント基板１０について、図２を参照しながら説明する。 Next, the printed circuit board 10 on which the board terminal 1 is mounted will be described with reference to FIG.

図２にはプリント基板１０の断面図を示しており、この図に示すように、プリント基板１０は、例えばエポキシ樹脂等の絶縁性の材料からなる平板状の基材１１を備えて構成され、基材１１の上面には導電体の配線パターン（図示せず）が形成され、下面側には電子部品２０が装着されるようになっている。プリント基板１０には、配線パターンに開口するよう上下に貫通する貫通孔１２が形成されている。プリント基板１０の上面において貫通孔１２を取り囲む部分には、配線パターンの一部分をなして接続用端子１を配線パターンに半田接続するための端子実装用ランド１３が形成されている。なお、電子部品２０としては、例えばＬＥＤやセンサ、コイル、ＩＣパッケージ、子基板等が例示されるが、リード端子２１を有する回路構成部品であれば特に限定されない。また、電子部品２０におけるリード端子２１の個数は特に限定されず、リード端子２１の個数だけ基板用端子１をプリント基板１０上に実装すればよい。 FIG. 2 shows a cross-sectional view of the printed circuit board 10. As shown in this figure, the printed circuit board 10 is configured to include a flat substrate 11 made of an insulating material such as an epoxy resin, for example. A conductor wiring pattern (not shown) is formed on the upper surface of the substrate 11, and the electronic component 20 is mounted on the lower surface side. A through hole 12 is formed in the printed board 10 so as to penetrate up and down so as to open in the wiring pattern. A terminal mounting land 13 for forming a part of the wiring pattern and soldering the connection terminal 1 to the wiring pattern is formed in a portion surrounding the through hole 12 on the upper surface of the printed board 10. Examples of the electronic component 20 include an LED, a sensor, a coil, an IC package, and a daughter board. However, the electronic component 20 is not particularly limited as long as it is a circuit component having the lead terminal 21. Further, the number of lead terminals 21 in the electronic component 20 is not particularly limited, and the board terminals 1 may be mounted on the printed board 10 by the number of lead terminals 21.

次に、上述の基板用端子１をプリント基板１０に実装する工程、実装状態での作用について、図２を参照しながら説明する。 Next, the process of mounting the above-described board terminal 1 on the printed board 10 and the operation in the mounted state will be described with reference to FIG.

まず、基板用端子１をプリント基板１０に実装する手順、および基板用端子１が実装さ
れたプリント基板１０に電子部品２０を装着する手順について説明する。プリント基板１０への基板用端子１の実装に際しては、まず、プリント基板１０の上面に形成された端子実装用ランド１３にクリーム半田を塗布する。そして、基板用端子１の基板実装部２ａ，２ｂを端子実装用ランド１３に当接するようにして、基板用端子１をプリント基板１０上に載置する。この状態で、基板用端子１が載置されたプリント基板１０全体を加熱してクリーム半田を溶融させることにより、基板実装部２ａ，２ｂが端子実装用ランド１３に半田接合されて、基板用端子１がプリント基板１０上に実装される。なお、貫通孔１２の中心軸と基板用端子１の中心軸（図１に示す中心軸Ｃ）とがほぼ一致するように、基板用端子１がプリント基板１０上に実装される。 First, a procedure for mounting the board terminal 1 on the printed board 10 and a procedure for mounting the electronic component 20 on the printed board 10 on which the board terminal 1 is mounted will be described. When mounting the board terminal 1 on the printed circuit board 10, first, cream solder is applied to the terminal mounting land 13 formed on the upper surface of the printed circuit board 10. Then, the board terminal 1 is placed on the printed board 10 so that the board mounting portions 2 a and 2 b of the board terminal 1 are in contact with the terminal mounting land 13. In this state, the printed circuit board 10 on which the board terminal 1 is placed is heated to melt the cream solder, whereby the board mounting portions 2a and 2b are soldered to the terminal mounting land 13 and the board terminal 1 is mounted on the printed circuit board 10. The board terminal 1 is mounted on the printed circuit board 10 so that the center axis of the through hole 12 and the center axis of the board terminal 1 (center axis C shown in FIG. 1) substantially coincide.

続いて、このようにして上面に基板用端子１が実装されたプリント基板１０に対して、下面側に電子部品２０を装着する。電子部品２０の装着は、電子部品２０のリード端子２１をプリント基板１０の貫通孔１２を通って基板用端子１内に上方に向けて挿入して行われる。このときリード端子２１は、ベース部２によって囲まれる空間を通って端子部３によって囲まれる領域へと進む。接触部３ｃと接触部３ｆとの左右間隔がリード端子２１の左右幅よりも小さく、接触部３ｉと接触部３ｍとの前後間隔がリード端子２１の前後幅よりも小さくため、リード端子２１はまず下側に位置する接触部３ｃ，３ｆと当接し、これを押し広げる。このため、接触部３ｃ，３ｆはリード端子２１の上方への挿入に応じて左右外側に向けて押し拡げられて弾性変形し、その弾性力によりリード端子２１を挟持する。なお、この左右からの挟持力に対応してリード端子２１の挿入に抵抗する力が生じる。このようにリード端子２１が接触部３ｃ，３ｆによって左右から挟持されることにより、リード端子２１の中心軸の位置が、左右方向において基板用端子１の中心軸Ｃの位置と揃えられる。 Subsequently, the electronic component 20 is mounted on the lower surface side of the printed circuit board 10 having the substrate terminals 1 mounted on the upper surface in this manner. The electronic component 20 is mounted by inserting the lead terminal 21 of the electronic component 20 through the through hole 12 of the printed board 10 and into the board terminal 1 upward. At this time, the lead terminal 21 proceeds through a space surrounded by the base portion 2 to a region surrounded by the terminal portion 3. Since the left-right distance between the contact part 3c and the contact part 3f is smaller than the left-right width of the lead terminal 21, and the front-rear distance between the contact part 3i and the contact part 3m is smaller than the front-rear width of the lead terminal 21, the lead terminal 21 is first The contact portions 3c and 3f located on the lower side are brought into contact with each other and are spread. For this reason, the contact portions 3c and 3f are expanded outwardly and elastically deformed in accordance with the insertion of the lead terminal 21 upward, and the lead terminal 21 is held by the elastic force. A force that resists insertion of the lead terminal 21 is generated corresponding to the clamping force from the left and right. Thus, the lead terminal 21 is clamped from the left and right by the contact portions 3c and 3f, so that the position of the central axis of the lead terminal 21 is aligned with the position of the central axis C of the board terminal 1 in the left-right direction.

この抵抗力に抗してリード端子２１がさらに上方に挿入されると、次にリード端子２１は次に接触部３ｉ，３ｍに当接し、これを押し広げる。これにより接触部３ｉ，３ｍはリード端子２１の上方への挿入に応じて前後外側に向けて押し拡げられて弾性変形し、その弾性力によりリード端子２１を挟持する。なお、この前後からの挟持力に対応してもリード端子２１の挿入に抵抗する力が生じる。このようにリード端子２１が接触部３ｉ，３ｍによって前後から挟持されることにより、リード端子２１の中心軸の位置が、前後方向においても基板用端子１の中心軸Ｃの位置と揃えられる。このとき、リード端子２１は、接触部３ｃ，３ｆにより左右から挟持されるとともに接触部３ｉ，３ｍにより前後から挟持される状態となり、両方の挾持力に対応する挿入抵抗に抗してリード端子２１を上方に向けて挿入することにより、図２の状態となり、電子部品２０（リード端子２１）とプリント基板１０（配線パターン１３）とが電気的に接続される。 When the lead terminal 21 is inserted further upward against this resistance force, the lead terminal 21 then comes into contact with the contact portions 3i and 3m and pushes it out. As a result, the contact portions 3i and 3m are elastically deformed by being expanded toward the front and rear and outside in accordance with the insertion of the lead terminal 21 upward, and the lead terminal 21 is sandwiched by the elastic force. A force that resists the insertion of the lead terminal 21 is generated even if the clamping force from the front and rear is accommodated. Thus, the lead terminal 21 is sandwiched from the front and rear by the contact portions 3i and 3m, so that the position of the central axis of the lead terminal 21 is aligned with the position of the central axis C of the board terminal 1 in the front-back direction. At this time, the lead terminal 21 is sandwiched from the left and right by the contact portions 3c and 3f and from the front and rear by the contact portions 3i and 3m, and the lead terminal 21 resists the insertion resistance corresponding to both gripping forces. 2 is inserted upward, the state shown in FIG. 2 is obtained, and the electronic component 20 (lead terminal 21) and the printed board 10 (wiring pattern 13) are electrically connected.

このように、基板用端子１においては、接触部３ｃ，３ｆと接触部３ｉ，３ｍとを上下にずらして位置させる構成なので、リード端子２１を挿入するとき、最初は接触部３ｃ，３ｆとの挿入抵抗に打ち勝つ挿入力が要求され、その後に接触部３ｉ，３ｍとの挿入抵抗に打ち勝つ挿入力が追加で要求される構成となる。このように段階的に挿入力が増加する構成であるため、挿入の最初の段階において４カ所の接触部３ｃ，３ｆ，３ｉ，３ｍ全てと同時接触する構成に比べ、リード端子２１を挿入しやすいという利点がある。また、上下に離れた２カ所（接触部３ｃ，３ｆおよび接触部３ｉ，３ｍ）において、互いに異なる方向（左右および前後）にリード端子２１を挟持する構成なので、端子部３に挿入されたリード端子２１を上下に延びる状態に保持できるという利点もある。 Thus, in the board terminal 1, the contact portions 3c and 3f and the contact portions 3i and 3m are positioned so as to be shifted up and down. Therefore, when the lead terminal 21 is inserted, the contact portions 3c and 3f are initially connected with the contact portions 3c and 3f. An insertion force that overcomes the insertion resistance is required, and thereafter, an insertion force that overcomes the insertion resistance with the contact portions 3i and 3m is additionally required. Since the insertion force increases in a stepwise manner as described above, the lead terminal 21 can be inserted more easily than the configuration in which all the four contact portions 3c, 3f, 3i, and 3m are simultaneously contacted at the initial stage of insertion. There is an advantage. In addition, since the lead terminal 21 is sandwiched in two different directions (left and right and front and rear) at two locations (contact portions 3c and 3f and contact portions 3i and 3m) separated from each other in the vertical direction, the lead terminals inserted into the terminal portion 3 There is also an advantage that 21 can be held in a vertically extending state.

このようにしてプリント基板１０に電子部品２０が装着された状態においては、接触部３ｃ，３ｆ，３ｉ，３ｍは所定の接触圧でリード端子２１に当接接触している。この接触圧は一般的に、プリント基板１０の使用時に加わる外部からの振動（衝撃）を考慮し、このような想定範囲内での外部振動（衝撃）がプリント基板１０を介して基板用端子１に作
用しても、基板用端子１のリード端子２１との接触が離れることが無いように設定されている。しかし、想定範囲内の振動であっても、この振動数が基板用端子１の右側端子部３Ｒ、左側端子部３Ｌ、前側端子部３Ｆもしくは後側端子部３Ｂの固有振動数と略同一の振動であると、その端子部において共振が発生する。 When the electronic component 20 is mounted on the printed circuit board 10 in this manner, the contact portions 3c, 3f, 3i, and 3m are in contact with and in contact with the lead terminal 21 with a predetermined contact pressure. This contact pressure generally takes into account external vibrations (impacts) applied when the printed circuit board 10 is used, and external vibrations (impacts) within such an assumed range are transmitted through the printed circuit board 10 to the board terminal 1. Even if it acts on, the contact with the lead terminal 21 of the board terminal 1 is set so as not to leave. However, even if the vibration is within the assumed range, this frequency is substantially the same as the natural frequency of the right terminal portion 3R, the left terminal portion 3L, the front terminal portion 3F, or the rear terminal portion 3B of the board terminal 1. If so, resonance occurs at the terminal portion.

例えば、基板用端子１に作用する振動数が、右側端子部３Ｒおよび左側端子部３Ｌの固有振動数と略同一の場合には、これら右側端子部３Ｒおよび左側端子部３Ｌが共振し、これら端子部３Ｒ，３Ｌがリード端子２１から瞬間的に離れることがあり得る。しかしながら、上述のように前側端子部３Ｆおよび後側端子部３Ｂの固有振動数が右側端子部３Ｒおよび左側端子部３Ｌの固有振動数と相違するため、右側端子部３Ｒおよび左側端子部３Ｌが共振しても前側端子部３Ｆおよび後側端子部３Ｂは共振することがない。このため、右側端子部３Ｒおよび左側端子部３Ｌの共振によりこれらがリード端子２１から瞬間的に離れることがあっても、前側端子部３Ｆおよび後側端子部３Ｂは共振しないため、リード端子２１との接触が保持される。この結果、基板用端子１とリード端子２１との瞬断が生じることが確実に防止できる。逆に、基板用端子１に作用する振動数が、前側端子部３Ｆおよび後側端子部３Ｂと略同一でこれらが共振しても、右側端子部３Ｒおよび左側端子部３Ｌは共振することがない。このため、この場合には、前側端子部３Ｆおよび後側端子部３Ｂが共振によりリード端子２１から瞬間的に離れることがあっても、右側端子部３Ｒおよび左側端子部３Ｌとリード端子２１との接触が保持される。この結果、このような場合にも基板用端子１とリード端子２１との瞬断が生じることが確実に防止できる。 For example, when the frequency acting on the board terminal 1 is substantially the same as the natural frequency of the right terminal portion 3R and the left terminal portion 3L, the right terminal portion 3R and the left terminal portion 3L resonate, and these terminals The portions 3R and 3L may be instantaneously separated from the lead terminal 21. However, since the natural frequencies of the front terminal portion 3F and the rear terminal portion 3B are different from the natural frequencies of the right terminal portion 3R and the left terminal portion 3L as described above, the right terminal portion 3R and the left terminal portion 3L resonate. Even so, the front terminal portion 3F and the rear terminal portion 3B do not resonate. For this reason, even if they are momentarily separated from the lead terminal 21 due to resonance of the right terminal portion 3R and the left terminal portion 3L, the front terminal portion 3F and the rear terminal portion 3B do not resonate. Contact is maintained. As a result, it is possible to reliably prevent the instantaneous disconnection between the board terminal 1 and the lead terminal 21. Conversely, even if the frequency acting on the board terminal 1 is substantially the same as that of the front terminal portion 3F and the rear terminal portion 3B and they resonate, the right terminal portion 3R and the left terminal portion 3L do not resonate. . Therefore, in this case, even if the front terminal portion 3F and the rear terminal portion 3B are momentarily separated from the lead terminal 21 due to resonance, the right terminal portion 3R, the left terminal portion 3L, and the lead terminal 21 Contact is maintained. As a result, even in such a case, instantaneous disconnection between the board terminal 1 and the lead terminal 21 can be reliably prevented.

このように、外部振動（衝撃）がプリント基板１０および基板用端子１に作用したときで、このときの振動数が基板用端子の端子部のいずれかと共振する振動数であっても、少なくともいずれか一対の端子部においてリード端子２１との接触状態を維持できるので、電子部品２０とプリント基板１０との瞬断の発生を確実に防止でき、これらが電気的に接続された状態を維持することができる。 As described above, when external vibration (impact) is applied to the printed circuit board 10 and the board terminal 1, even if the frequency at this time is a frequency that resonates with one of the terminal portions of the board terminal, at least Since the contact state with the lead terminal 21 can be maintained in the pair of terminal portions, the occurrence of a momentary disconnection between the electronic component 20 and the printed circuit board 10 can be reliably prevented, and the state in which they are electrically connected can be maintained. Can do.

また、基板用端子１においては、接触部３ｃ，３ｆ，３ｉ，３ｍがリード端子２１に所定の接触圧で弾性的に接触するように、基端アーム部３ａ，３ｄ，３ｇ，３ｊを中心軸Ｃに向けて折り曲げて形成している。ここで、例えば接触部３ｃ，３ｆと接触部３ｉ，３ｍとの上下位置を揃える構成とした場合、接触部３ｃ，３ｆ，３ｉ，３ｍ同士の干渉を防止するため、これらの左右幅（すなわち、図１（ｃ）に示す左右幅Ａ）が制限され、あまり大きくすることができない。これに対し、本実施形態の基板用端子１においては、左右側端子部３Ｌ，３Ｒに対して前後側端子部３Ｆ，３Ｂの上下寸法を小さくして、接触部３ｉ，３ｍに対して接触部３ｃ，３ｆを下方にずらして位置させている。このため、接触部３ｃ，３ｆの最大左右幅を拡大させることができる。これにより、端子部３（特に各端子部３Ｒ，３Ｌ，３Ｆ，３Ｂの幅寸法）に関して、設計の自由度を高めることができる。 Further, in the substrate terminal 1, the base end arm portions 3a, 3d, 3g, and 3j are centered so that the contact portions 3c, 3f, 3i, and 3m elastically contact the lead terminal 21 with a predetermined contact pressure. It is bent toward C. Here, for example, when the contact portions 3c, 3f and the contact portions 3i, 3m are configured so that the vertical positions thereof are aligned, in order to prevent interference between the contact portions 3c, 3f, 3i, 3m, these left and right widths (ie, The left-right width A) shown in FIG. 1 (c) is limited and cannot be made too large. On the other hand, in the board terminal 1 of the present embodiment, the vertical dimension of the front and rear side terminal portions 3F and 3B is reduced with respect to the left and right side terminal portions 3L and 3R, and the contact portion with respect to the contact portions 3i and 3m. 3c and 3f are shifted and positioned downward. For this reason, the maximum left-right width of the contact portions 3c and 3f can be increased. Thereby, the freedom degree of design can be raised regarding the terminal part 3 (especially width dimension of each terminal part 3R, 3L, 3F, 3B).

次に、第２の実施形態に係るハウジング付き基板用端子４０について、図３を参照して説明する。このハウジング付き基板用端子４０は、絶縁性樹脂材料を用いて形成されたハウジング３０と、このハウジング３０内に収容保持された基板用端子１ａとから構成される。 Next, the board terminal 40 with a housing according to the second embodiment will be described with reference to FIG. The housing-equipped board terminal 40 includes a housing 30 formed using an insulating resin material, and a board terminal 1 a housed and held in the housing 30.

なお、上述の第１の実施形態においては、前後端子部３Ｆ，３Ｂの接触部３ｉ，３ｍに対して左右端子部３Ｌ，３Ｒの接触部３ｃ，３ｆを下方にずらして位置させた構成の基板用端子１について説明したが、この第２の実施形態において説明する基板用端子１ａは、これとは反対に、左右端子部３Ｌ，３Ｒの接触部３ｃ，３ｆに対して前後端子部３Ｆ，３Ｂの接触部３ｉ，３ｍを下方にずらして位置させた構成を有している。この点を除いて、基板用端子１ａは第１の実施形態に係る基板用端子１と同一構成であり、その機能、作用は第１実施形態と同一である。このため、以下においては、基板用端子１ａについての説
明を省略する。 In the first embodiment described above, the substrate having a configuration in which the contact portions 3c and 3f of the left and right terminal portions 3L and 3R are shifted downward with respect to the contact portions 3i and 3m of the front and rear terminal portions 3F and 3B. Although the terminal 1 for a board | substrate was demonstrated, the terminal 1a for a board | substrate demonstrated in this 2nd Embodiment is contrary to this, front-and-rear terminal parts 3F and 3B with respect to the contact parts 3c and 3f of the left-right terminal parts 3L and 3R. The contact portions 3i and 3m are shifted and positioned downward. Except for this point, the board terminal 1a has the same configuration as the board terminal 1 according to the first embodiment, and the function and operation thereof are the same as those of the first embodiment. For this reason, the description about the board terminal 1a is omitted below.

ハウジング３０は、上下に延びる略四角柱状に形成されており、その内部には、上下に延びる四角柱状に形成されるとともに下方に開放され、下方から挿入される基板用端子１ａを収容保持するための端子収容部３１が形成されている。この端子収容部３１の左右および前後寸法は、後述するように、ベース部２を端子収容部３１内に圧入して基板用端子１ａをハウジング３０内に保持できるようにしている。また、ハウジング３０の上部の中心部には、リード端子３１を挿通可能な開口面積を有して上下に貫通するとともに、端子収容部３１に連通するリード挿通孔３２が形成されている。さらに、ハウジング３０の前側下部および後側下部には、下方に向けて突出する支持部３３，３３が形成されている。支持部３３，３３は、図３（ｂ）および（ｃ）に示すように、端子収容部３１内に基板用端子１ａが収容保持された状態において、支持部３３，３３の下面が基板実装部２ａ，２ｂの下面と揃うように形状されている。 The housing 30 is formed in a substantially quadrangular prism shape extending up and down, and in the interior thereof is formed in a quadrangular column shape extending in the up and down direction, opened downward, and accommodates and holds the board terminal 1a inserted from below. The terminal accommodating portion 31 is formed. As will be described later, the left and right dimensions and the front and rear dimensions of the terminal accommodating portion 31 allow the base portion 2 to be press-fitted into the terminal accommodating portion 31 so that the board terminal 1a can be held in the housing 30. In addition, a lead insertion hole 32 that has an opening area through which the lead terminal 31 can be inserted and penetrates in the vertical direction and communicates with the terminal accommodating portion 31 is formed at the center of the upper portion of the housing 30. Further, support portions 33 and 33 projecting downward are formed on the front lower portion and the rear lower portion of the housing 30. As shown in FIGS. 3 (b) and 3 (c), the support portions 33 and 33 are arranged so that the lower surfaces of the support portions 33 and 33 are mounted on the substrate mounting portion when the substrate terminal 1 a is accommodated and held in the terminal accommodation portion 31. It is shaped so as to be aligned with the lower surfaces of 2a and 2b.

ハウジング付き基板用端子４０は、ハウジング３０の端子収容部３１に対して下方から基板用端子１ａを挿入させて組み立てられる。このとき、ベース部２が中心軸Ｃに向けて弾性変形されながら挿入され、このベース部２の弾性変形による復元力により、ベース部２がハウジング３０の内面（端子収容部３１を形成する面）に押し付けられて、基板用端子１ａがハウジング３０に圧入保持される。基板用端子１ａがハウジング３０に保持された状態では、右側端子部３Ｒ、左側端子部３Ｌ、前側端子部３Ｆおよび後側端子部３Ｂはハウジング３０の内面との間に隙間を有しており、この隙間分だけ外側（中心軸Ｃから離れる向き）に弾性的に曲げ変形して揺動変位可能である。 The board terminal 40 with the housing is assembled by inserting the board terminal 1 a from below into the terminal accommodating portion 31 of the housing 30. At this time, the base portion 2 is inserted while being elastically deformed toward the central axis C, and the base portion 2 becomes the inner surface of the housing 30 (surface forming the terminal accommodating portion 31) by the restoring force due to the elastic deformation of the base portion 2. The board terminal 1 a is press-fitted and held in the housing 30. In a state where the board terminal 1a is held by the housing 30, the right terminal portion 3R, the left terminal portion 3L, the front terminal portion 3F, and the rear terminal portion 3B have a gap between the inner surface of the housing 30, It is possible to swing and displace by elastically bending and deforming outward (in the direction away from the central axis C) by this gap.

このようにして組み立てられるハウジング付き基板用端子４０は、第１の実施形態の基板用端子１と同様に、プリント基板１０上に実装される。ここで、ハウジング付き基板用端子４０は、第１の実施形態に係る基板用端子１単体の構成と比較して、上下に延びるハウジング３０を備えるために、プリント基板１０上に載置させたときに不安的になりやすい。具体的には、左右方向においては基板実装部２ａ，２ｂが位置するので比較的安定しているが、これに直交する前後方向は特に不安定になりやすい。そこで、ハウジング３０の前側下部および後側下部に支持部３３，３３を設けて、これらをプリント基板１０に当接させてハウジング付き基板用端子４０を支持させる構成とすることにより、プリント基板１０上に載置されたハウジング付き基板用端子４０を前後方向にも安定させることができる。 The housing-equipped board terminal 40 assembled in this manner is mounted on the printed board 10 in the same manner as the board terminal 1 of the first embodiment. Here, when the board terminal with housing 40 is mounted on the printed circuit board 10 in order to include the housing 30 extending vertically as compared with the configuration of the single board terminal 1 according to the first embodiment. Prone to anxiety. Specifically, since the board mounting portions 2a and 2b are positioned in the left-right direction, they are relatively stable. However, the front-rear direction perpendicular to this tends to be particularly unstable. Therefore, by providing support portions 33 and 33 at the front lower portion and the rear lower portion of the housing 30 and abutting them on the printed circuit board 10 to support the substrate terminal 40 with the housing, The board terminal 40 with the housing placed on the board can be stabilized in the front-rear direction.

ハウジング付き基板用端子４０がプリント基板１０に実装されると、ハウジング付き基板用端子４０に対して上方からリード端子２１を挿入させることにより、電子部品２０（リード端子２１）とプリント基板１０（配線パターン１３）とを電気的に接続させることが可能になる。具体的には、リード端子２１を上方からリード挿通孔３２に通して端子収容部３１内に挿入させることにより、まず接触部３ｃ，３ｆが左右外側に向けて押し拡げられて弾性変形し、次に接触部３ｉ，３ｍが前後外側に向けて押し拡げられて弾性変形して、その弾性力によりリード端子２１を挟持する。このようにして、接触部３ｃ，３ｆ，３ｉ，３ｍがリード端子２１に弾性的に接触して、電子部品２０とプリント基板１０とが電気的に接続される。 When the board terminal 40 with the housing is mounted on the printed board 10, the lead terminal 21 is inserted into the board terminal 40 with the housing from above, whereby the electronic component 20 (lead terminal 21) and the printed board 10 (wiring). The pattern 13) can be electrically connected. Specifically, by inserting the lead terminal 21 from above into the terminal accommodating portion 31 through the lead insertion hole 32, first, the contact portions 3c and 3f are expanded outwardly to the left and right, and elastically deformed. The contact portions 3i, 3m are pushed and expanded toward the front and rear and are elastically deformed, and the lead terminal 21 is held by the elastic force. In this way, the contact portions 3c, 3f, 3i, and 3m elastically contact the lead terminal 21, and the electronic component 20 and the printed board 10 are electrically connected.

ハウジング付き基板用端子４０では、第１の実施形態に係る基板用端子１の効果（リード端子２１の挿入容易化、瞬断防止および設計自由度の向上）以外に、次のような効果が得られる。第１に、前後および左右の側面が絶縁性樹脂材料製のハウジング３０によって覆われて構成されるので、例えば複数のハウジング付き基板用端子４０を前後方向に列状に並べてプリント基板１０に実装するような使用形態において、前後方向に隣り合う基板用端子１ａ同士の接触を確実に防止することができる。第２に、複数のハウジング付き基
板用端子４０を列状に並べて実装する使用形態の場合に、ハウシングを、複数のハウジング３０を列状に並べて繋いだ形状を有する単一の樹脂成型品として構成することができる。第３に、ハウジング３０により、ハウシング３０の内部に収容保持された基板用端子１ａを保護することができる。 The board terminal with housing 40 has the following effects in addition to the effects of the board terminal 1 according to the first embodiment (easy insertion of the lead terminal 21, prevention of instantaneous interruption and improvement in design flexibility). It is done. First, since the front and rear and left and right side surfaces are covered with a housing 30 made of an insulating resin material, for example, a plurality of board terminals 40 with a housing are arranged in a line in the front and rear direction and mounted on the printed board 10. In such a usage pattern, it is possible to reliably prevent contact between the board terminals 1a adjacent in the front-rear direction. Secondly, in the case of a usage form in which a plurality of housing terminals 40 with housings are arranged in a row, the housing is configured as a single resin molded product having a shape in which a plurality of housings 30 are arranged in a row. can do. Third, the housing 30 can protect the board terminal 1 a housed and held in the housing 30.

次に、第３の実施形態に係るアウターシェル付き基板用端子６０について、図４および図５を参照して説明する。このアウターシェル付き基板用端子６０は、導電性を有する金属帯板を用いて形成されたアウターシェル５０と、このアウターシェル５０内に収容保持された基板用端子１ｂとから構成される。 Next, a substrate terminal 60 with an outer shell according to a third embodiment will be described with reference to FIGS. 4 and 5. This board terminal 60 with an outer shell is comprised from the outer shell 50 formed using the metal strip which has electroconductivity, and the board | substrate terminal 1b accommodated and hold | maintained in this outer shell 50. As shown in FIG.

なお、この第３の実施形態における基板用端子１ｂは、第１の実施形態における基板用端子１から基板実装部２ａ，２ｂを除いた構成を有している、この点を除いて、基板用端子１ｂは第１の実施形態に係る基板用端子１と同一構成なので、以下においては、基板用端子１ｂについての説明を省略する。 The board terminal 1b in the third embodiment has a configuration in which the board mounting portions 2a and 2b are removed from the board terminal 1 in the first embodiment, except for this point. Since the terminal 1b has the same configuration as the board terminal 1 according to the first embodiment, description of the board terminal 1b will be omitted below.

アウターシェル５０は、上下に延びる略四角柱状に形成されており、その内部には、上下に延びる四角柱状に形成されるとともに下方に開放され、下方から挿入される基板用端子１ｂを収容保持するための端子収容部５１が形成されている。この端子収容部５１の左右および前後寸法は、後述するように、ベース部２の復元力を利用して基板用端子１ｂを圧入保持できるように、基板用端子１ｂを構成するベース部２の左右および前後寸法よりも幾分小さく形成されている。アウターシェル５０の上部には平坦な吸着面５０ａが形成されており、この吸着面５０ａを自動実装機（図示せず）に吸着させることにより、アウターシェル付き基板用端子６０を吸着搬送することが可能である。さらに、アウターシェル５０の右側下部には右方に延びる基板実装部５２ａが形成され、左側下部には左方に延びる基板実装部５２ｂが形成されている。 The outer shell 50 is formed in a substantially quadrangular prism shape extending in the vertical direction, and is formed in a rectangular column shape extending in the vertical direction and is opened downward to accommodate and hold the board terminal 1b inserted from below. The terminal accommodating part 51 for this is formed. As will be described later, the left and right dimensions of the terminal accommodating portion 51 are set to the left and right sides of the base portion 2 constituting the board terminal 1b so that the board terminal 1b can be press-fitted and held using the restoring force of the base portion 2. It is formed somewhat smaller than the front and rear dimensions. A flat suction surface 50a is formed on the upper part of the outer shell 50, and the suction terminal 50a is sucked by an automatic mounting machine (not shown) so that the board terminal 60 with the outer shell can be sucked and conveyed. Is possible. Further, a board mounting portion 52a extending rightward is formed in the lower right portion of the outer shell 50, and a board mounting portion 52b extending leftward is formed in the lower left portion.

アウターシェル付き基板用端子６０は、アウターシェル５０の端子収容部５１に対して下方から基板用端子１ｂを挿入させて組み立てられる。このとき、ベース部２が中心軸Ｃに向けて弾性変形されながら挿入され、このベース部２の弾性変形による復元力により、ベース部２がアウターシェル５０の内面（端子収容部５１を形成する面）に押し付けられて、基板用端子１ｂがアウターシェル５０に圧入保持される。基板用端子１ｂがアウターシェル５０に保持された状態では、右側端子部３Ｒ、左側端子部３Ｌ、前側端子部３Ｆおよび後側端子部３Ｂはアウターシェル５０の内面との間に隙間を有しており、この隙間分だけ外側（中心軸Ｃから離れる向き）に弾性的に曲げ変形して揺動変位可能である。 The board terminal 60 with the outer shell is assembled by inserting the board terminal 1b from below into the terminal accommodating portion 51 of the outer shell 50. At this time, the base portion 2 is inserted while being elastically deformed toward the central axis C, and the base portion 2 is inserted into the inner surface of the outer shell 50 (the surface forming the terminal accommodating portion 51 by the restoring force due to the elastic deformation of the base portion 2. ), The board terminal 1b is press-fitted and held in the outer shell 50. In a state where the board terminal 1b is held by the outer shell 50, the right terminal portion 3R, the left terminal portion 3L, the front terminal portion 3F, and the rear terminal portion 3B have a gap between the inner surface of the outer shell 50. Thus, it is possible to swing and displace by elastically bending and deforming outward (in a direction away from the central axis C) by this gap.

このようにして組み立てられるアウターシェル付き基板用端子６０は、自動実装機によりアウターシェル５０の吸着面５０ａが吸着されてプリント基板１０上に搬送され、アウターシェル５０の基板実装部５２ａ，５２ｂが端子実装用ランド１３に載置される。そして、この状態でプリント基板１０全体を加熱して端子実装用ランド１３の塗布されたクリーム半田を溶融させることにより、アウターシェル付き基板用端子６０がプリント基板１０上に実装される。 The board terminal 60 with the outer shell assembled in this way is sucked by the suction surface 50a of the outer shell 50 by the automatic mounting machine and conveyed onto the printed board 10, and the board mounting portions 52a and 52b of the outer shell 50 are the terminals. It is placed on the mounting land 13. In this state, the whole printed circuit board 10 is heated to melt the cream solder to which the terminal mounting lands 13 are applied, so that the board terminal 60 with the outer shell is mounted on the printed circuit board 10.

アウターシェル付き基板用端子６０がプリント基板１０上に実装されると、プリント基板１０に形成された貫通孔１２に下方からリード端子２１を通して、アウターシェル付き基板用端子６０に下方からリード端子２１を挿入させることにより、電子部品２０（リード端子２１）とプリント基板１０（配線パターン１３）とを電気的に接続させることが可能になる。具体的には、リード端子２１を下方から端子収容部５１内に挿入させることにより、接触部３ｃ，３ｆが左右外側に向けて押し拡げられて弾性変形するとともに、接触部３ｉ，３ｍが前後外側に向けて押し拡げられて弾性変形して、その弾性力によりリード端子２１を挟持する。このようにして、接触部３ｃ，３ｆ，３ｉ，３ｍがリード端子２１
に弾性的に接触して、電子部品２０とプリント基板１０とが電気的に接続される。 When the board terminal 60 with the outer shell is mounted on the printed board 10, the lead terminal 21 is passed through the through hole 12 formed in the printed board 10 from below through the lead terminal 21, and the board terminal 60 with outer shell is placed from below. By inserting, it becomes possible to electrically connect the electronic component 20 (lead terminal 21) and the printed circuit board 10 (wiring pattern 13). Specifically, by inserting the lead terminal 21 into the terminal accommodating portion 51 from below, the contact portions 3c and 3f are expanded outwardly and elastically deformed, and the contact portions 3i and 3m are front and rear outer sides. The lead terminal 21 is clamped by its elastic force. In this way, the contact portions 3c, 3f, 3i, and 3m are connected to the lead terminal 21.
The electronic component 20 and the printed circuit board 10 are electrically connected to each other.

アウターシェル付き基板用端子６０では、第１の実施形態に係る基板用端子１の効果（リード端子２１の挿入容易化、瞬断防止および設計自由度の向上）以外に、次のような効果が得られる。第１に、挿入されるリード端子２１に接触部３ｃ，３ｆ，３ｉ，３ｍを接触させて電気的に接続させる場合、接触部３ｃ，３ｆ，３ｉ，３ｍの位置から所定長さ以上奥に（上方に）リード端子２１を挿入させることが要求される。このアウターシェル付き基板用端子６０は、図５に示すように、端子部３を下側にして基板用端子１ｂをアウターシェル５０内に収容保持させる構成なので、第１の実施形態に係る基板用端子１と比較して、プリント基板１０に実装された状態においてプリント基板１０の表面近くに端子部３（接触部３ｃ，３ｆ，３ｉ，３ｍ）が位置する。このため、アウターシェル付き基板用端子６０に下方からリード端子２１を挿入するときに、第１の実施形態に係る基板用端子１と比較して、少ない挿入量でありながら、接触部３ｃ，３ｆ，３ｉ，３ｍから所定長さ以上上方にまでリード端子２１を挿入させて位置させることができる。第２に、アウターシェル５０により、アウターシェル５０の内部に収容保持された基板用端子１ｂを保護することができる。 The board terminal 60 with an outer shell has the following effects in addition to the effects of the board terminal 1 according to the first embodiment (easy insertion of the lead terminals 21, prevention of instantaneous interruption, and improvement in design flexibility). can get. First, when the contact portions 3c, 3f, 3i, and 3m are brought into contact with and electrically connected to the inserted lead terminal 21, the positions of the contact portions 3c, 3f, 3i, and 3m are more than a predetermined length inward ( It is required to insert the lead terminal 21 (above). As shown in FIG. 5, the board terminal 60 with an outer shell is configured to receive and hold the board terminal 1b in the outer shell 50 with the terminal portion 3 facing down, so that the board terminal according to the first embodiment is used. Compared with the terminal 1, the terminal part 3 (contact part 3c, 3f, 3i, 3m) is located near the surface of the printed circuit board 10 in the state mounted in the printed circuit board 10. For this reason, when the lead terminal 21 is inserted into the board terminal 60 with an outer shell from below, the contact portions 3c, 3f are smaller than the board terminal 1 according to the first embodiment, although the insertion amount is small. , 3i, 3m can be positioned by inserting the lead terminal 21 from a predetermined length upward. Secondly, the outer shell 50 can protect the board terminal 1b housed and held in the outer shell 50.

以上、本発明の好ましい第１〜第３の実施形態について説明してきたが、本発明はこれらの実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲であれば適宜改良可能である。 As mentioned above, although the preferable 1st-3rd embodiment of this invention has been described, this invention is not limited to these embodiment, If it is a range which does not deviate from the summary of this invention, it can improve suitably. is there.

上述の第１〜第３の実施形態では、接触部３ｃ，３ｆ，３ｉ，３ｍを内側に凸を向けた略く字状に屈曲形成した場合を例示して説明したが、この構成に限定されるものではなく、例えば、内側に凸を向けた円弧状に湾曲形成してもよい。 In the above-described first to third embodiments, the contact portions 3c, 3f, 3i, and 3m have been described by way of example in which they are bent in a substantially square shape with a convex inward, but the present invention is limited to this configuration. For example, it may be curved and formed in an arc shape with a convex inward.

上述の第１〜第３の実施形態において、基板用端子１，４０，６０が表面実装されるプリント基板としては、例えば、配線パターンの印刷が片面のみに施された片面基板、配線パターンの印刷が両面に施された両面基板、厚み方向中途に中間層が形成された多層基板、撓み変形が可能な柔軟性を持たせたフレキシブル基板等のいずれであってもよい。 In the first to third embodiments described above, as the printed circuit board on which the board terminals 1, 40, 60 are surface-mounted, for example, a single-sided board in which a wiring pattern is printed only on one side, a wiring pattern printing May be any one of a double-sided substrate having both sides, a multilayer substrate having an intermediate layer formed in the middle of the thickness direction, and a flexible substrate having flexibility capable of bending deformation.

上述の第１〜第３の実施形態では、一対の右側端子部３Ｒおよび左側端子部３Ｌと、一対の前側端子部３Ｆおよび後側端子部３Ｂとを備えた２対構成の端子部３を例示して説明したが、本発明はこの２対構成の端子部３を備えた基板用端子に限定して適用されるものではない。例えば３対構成以上の端子部３を備える基板用端子にも、同様に本発明を適用できる。 In the above-described first to third embodiments, a two-pair terminal portion 3 including a pair of right terminal portion 3R and left terminal portion 3L, and a pair of front terminal portion 3F and rear terminal portion 3B is illustrated. However, the present invention is not limited to the substrate terminal provided with the two-pair terminal portion 3. For example, the present invention can be similarly applied to a substrate terminal including a terminal portion 3 having a three-pair configuration or more.

上述の第１〜第３の実施形態において、電子部品２０に設けられるリード端子２１は、正方形の断面形状を有するものでも円形の断面形状を有するものでも良く、さらには、正五画形以上の多角形形状を有するものでも良い。 In the first to third embodiments described above, the lead terminal 21 provided in the electronic component 20 may have a square cross-sectional shape or a circular cross-sectional shape, and more than a regular pentagonal shape. It may have a polygonal shape.

上述の第１の実施形態において、図１（ｃ）に二点鎖線で示す被吸着部材８０を、基板用端子１に上方から着脱可能に取り付けることにより、基板用端子１が自動実装機を利用して吸着搬送可能となる。この被吸着部材８０は、接触部３ｃ，３ｆ，３ｉ，３ｍにより弾性的に挟持されて保持される軸部８１と、この軸部８１の上端部に繋がって前後および左右に延びるフランジ部８２とから構成される。フランジ部８２の上面には、平坦な吸着面８２ａが形成されている。このため、軸部８１を端子部３に挿入して被吸着部材８０を基板用端子１に保持させることにより、フランジ部８２の吸着面８２ａを自動実装機に吸着させて、自動実装機による搬送が可能になる。なお、自動実装機によりプリント基板１０上に吸着搬送された基板用端子部１は、被吸着部材８０が取り付けられた状態のままプリント基板１０に表面実装され、その後、被吸着部材８０が取り外される。 In the first embodiment described above, the substrate terminal 1 uses the automatic mounting machine by attaching the member to be attracted 80 shown by the two-dot chain line in FIG. 1C to the substrate terminal 1 so as to be detachable from above. As a result, it becomes possible to perform suction conveyance. The attracted member 80 includes a shaft portion 81 that is elastically sandwiched and held by the contact portions 3c, 3f, 3i, and 3m, and a flange portion 82 that is connected to the upper end portion of the shaft portion 81 and extends in the front-rear and left-right directions. Consists of A flat suction surface 82 a is formed on the upper surface of the flange portion 82. For this reason, by inserting the shaft portion 81 into the terminal portion 3 and holding the sucked member 80 on the terminal 1 for the substrate, the suction surface 82a of the flange portion 82 is sucked by the automatic mounting machine and transported by the automatic mounting machine. Is possible. In addition, the terminal part 1 for a board | substrate attracted | sucked and conveyed on the printed circuit board 10 with the automatic mounting machine is surface-mounted on the printed circuit board 10 in the state to which the to-be-adsorbed member 80 was attached, and the to-be-adsorbed member 80 is removed after that. .

上述の第２の実施形態では、ハウジング３０の上部の中心部にリード挿通孔３２が形成された構成について説明したが、この構成においてハウジング３０の上面に吸着用フィルムを貼付すれば、自動実装機を用いた吸着搬送が可能になる。また、第２の実施形態において、プリント基板１０に、ハウジング付き基板用端子４０の実装位置に対応させた貫通孔１２を形成することにより、この貫通孔１２を利用して下方からリード端子２１を挿入させて、接触部３ｃ，３ｆ，３ｉ，３ｍに接触させることも可能である。 In the second embodiment described above, the configuration in which the lead insertion hole 32 is formed in the central portion of the upper portion of the housing 30 has been described. However, in this configuration, if an adsorption film is attached to the upper surface of the housing 30, an automatic mounting machine is used. Adsorption conveyance using can be performed. Further, in the second embodiment, by forming the through hole 12 corresponding to the mounting position of the board terminal 40 with the housing on the printed circuit board 10, the lead terminal 21 is attached from below using the through hole 12. It is also possible to insert and contact the contact portions 3c, 3f, 3i, and 3m.

１基板用端子
２ａ基板実装部
２ｂ基板実装部
３端子部
３Ｂ後側端子部（第２端子対）
３Ｆ前側端子部（第２端子対）
３Ｌ左側端子部（第１端子対）
３Ｒ右側端子部（第１端子対）
３ｃ接触部（第１の接触部）
３ｆ接触部（第１の接触部）
３ｉ接触部（第２の接触部）
３ｍ接触部（第２の接触部）
１０プリント基板（回路基板）
２０電子部品（回路構成部品）
２１リード部端子（リード部）
３０ハウジング（端子収容部材）
３１端子収容部
５０アウターシェル（アウター部材）
５１端子収容部
５２ａ基板実装部
５２ｂ基板実装部 DESCRIPTION OF SYMBOLS 1 Board terminal 2a Board mounting part 2b Board mounting part 3 Terminal part 3B Rear side terminal part (2nd terminal pair)
3F Front terminal (second terminal pair)
3L left terminal (first terminal pair)
3R Right terminal (first terminal pair)
3c contact part (first contact part)
3f contact part (first contact part)
3i contact part (second contact part)
3m contact part (second contact part)
10 Printed circuit board (circuit board)
20 Electronic components (circuit components)
21 Lead terminal (lead part)
30 Housing (terminal receiving member)
31 Terminal receiving portion 50 Outer shell (outer member)
51 Terminal receiving part 52a Board mounting part 52b Board mounting part

Claims

A board terminal mounted on the surface of the circuit board and used for receiving and connecting a lead portion of the circuit component to attach the circuit component to the circuit board;
A board mounting portion bonded onto the circuit board;
A terminal portion connected to the substrate mounting portion and extending in a cantilever support shape and having a plurality of pairs of terminals facing each other;
The lead part is inserted into the facing interval between the plurality of pairs of terminals, and the lead part is received and electrically connected to the terminal part,
The board terminal characterized in that the natural frequency of the plurality of pairs of terminals is different for each pair.

The board terminal according to claim 1, wherein the cantilever support lengths of the plurality of pairs of terminals are different for each pair.

The plurality of pairs of terminals are composed of a first terminal pair consisting of a pair of terminals facing in the first direction and a second terminal pair consisting of a pair of terminals facing in the second direction,
The first terminal pair includes a first contact portion that is formed in a convex shape toward opposite sides in the first direction, and receives and sandwiches the lead terminal within the interval.
The second terminal pair includes a second contact portion that is formed in a convex shape toward the opposite sides in the second direction and receives and holds the lead terminal within the interval. The board terminal according to claim 1 or 2.

The board terminal according to claim 3, wherein the first direction and the second direction are substantially orthogonal to each other.

A terminal housing member that is formed using an insulating material and has a terminal housing portion that houses the terminal portion,
The board terminal according to claim 1, wherein the terminal housing is configured to be housed and held in the terminal housing.

An outer member made of a conductive material connected to the terminal housing portion and the terminal housing portion for housing the terminal portion and provided with the board mounting portion;
The board terminal according to claim 1, wherein the terminal housing is configured to be housed and held in the terminal housing.