JP2016062916A - Electronic component mounting substrate and manufacturing method of electronic component mounting substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting substrate where a metal block is hardly dropped from a base material when the substrate is bent in use.SOLUTION: An electronic component mounting substrate includes: a base material which is made of an insulation resin and includes a first principal surface and a second principal surface opposite to the first principal surface; a first conductor layer which is formed on the first principal surface of the base material; a second conductor layer which is formed on the second principal surface of the base material; a hole that penetrates the first conductor layer, the base material and the second conductor layer; and a metal block that is fitted into the hole. The hole includes a first fitting port closer to the first conductor layer and a second fitting port closer to the second conductor layer. The metal block includes a first protrusion that protrudes from a surface of the first conductor layer, and/or a second protrusion that protrudes from a surface of the second conductor layer. The first protrusion includes a first extension part that spreads so as to cover a periphery of the first fitting port and/or the second protrusion includes a second extension part that spreads so as to cover a periphery of the second fitting port.SELECTED DRAWING: Figure 1

Description

The present invention relates to an electronic component mounting board for mounting a surface mounting type electronic component and a method of manufacturing the electronic component mounting board.

Light emitting elements such as LEDs (light emitting diodes) are used as backlights for mobile phones and liquid crystal televisions. Such a light emitting element is used by being mounted on a light emitting element mounting member.
There are various types of light-emitting element mounting members, such as one in which terminal members are integrated by resin molding, one in which lead frames are bent, and further printed. There are those based on a wiring board. Among these, considering heat dissipation, miniaturization, cost, etc., a light emitting element mounting board based on a printed wiring board is often desired.

In recent years, there has been a demand for light-emitting elements that emit light with high luminance, and research has been progressing to improve the luminance by modularizing a plurality of LEDs and to improve the luminance of the LEDs themselves.
In order to modularize LEDs and improve luminance, LEDs are mounted on a light emitting element mounting substrate at a high density. An LED is known as a light-emitting element that generates a small amount of heat. However, when the density is increased in this manner, the LED generates heat that cannot be ignored.
As a substrate for suitably releasing heat generated from the light emitting element, Patent Document 1 discloses a light emitting element mounting substrate having the following configuration.

That is, Patent Document 1 discloses a light-emitting element mounting substrate including an element mounting surface on which a surface-emitting light-emitting element is mounted and a reflector surface that reflects light emitted from the light-emitting element. And a first conductor layer formed on the element mounting surface side of the substrate, the substrate including an insulating resin having a cavity forming portion bent so as to form a concave portion on the side and a convex portion on the back side, respectively. And a second conductor layer formed on the back side of the substrate, and a metal block that penetrates the substrate so as to be exposed on the bottom surface of the concave portion and the top surface of the convex portion, respectively. There is disclosed a light emitting element mounting substrate, wherein the reflector surface is formed on the inner surface of the concave portion around the element mounting surface.

The light emitting element mounting substrate of Patent Document 1 has a metal block that penetrates the base material. The metal block has high thermal conductivity and can serve as a path for radiating heat generated from the light emitting element to the back surface of the light emitting element mounting substrate. Therefore, even if heat is generated from the LED or the like, the heat can be suitably radiated. That is, the light emitting element mounting substrate of Patent Document 1 is a substrate having excellent heat dissipation.

JP 2014-135306 A

In recent years, electronic devices have been reduced in size and complexity, and in order to cope with such electronic devices, a substrate such as a printed wiring board is required to be a flexible substrate that can be bent.
When a substrate having a metal block penetrating the base material, such as the light emitting element mounting substrate of Patent Document 1, is used as a flexible substrate, the metal block is less flexible than the base material constituting the flexible substrate. When the substrate is bent, the base material and the metal block are separated, and there is a problem that the metal block falls off the base material.
That is, although the light emitting element mounting substrate of Patent Document 1 is excellent in heat dissipation, there is a problem that it is difficult to bend and use like a flexible substrate.

The present invention has been made in view of such problems, and an object of the present invention is to manufacture an electronic component mounting board in which a metal block is less likely to fall off from a base material when bent and used, and the electronic component mounting board Is to provide a method.

That is, the electronic component mounting board of the present invention is an electronic component mounting board on which a surface mounting type electronic component is mounted, and the electronic component mounting board is made of an insulating resin, and includes the first main surface and the above A base material provided with a second main surface opposite to the first main surface, a first conductor layer formed on the first main surface of the base material, and formed on a second main surface of the base material The second conductor layer, a hole penetrating the first conductor layer, the base material, and the second conductor layer, and a metal block fitted in the hole. The hole is formed in the first conductor layer. A first insertion portion on the side and a second insertion port on the second conductor layer side, wherein the metal block protrudes from the surface of the first conductor layer and / or the second conductor. A first protrusion extending from the surface of the layer, the first protrusion extending so as to cover the periphery of the first fitting opening; Has a part, and / or, the second projecting portion may have a second extending portion that extends to cover the periphery of the second fitting hole.

The electronic component mounting board of the present invention includes a metal block that penetrates the first conductor layer, the base material, and the second conductor layer.
Unlike filled vias that are formed in a through hole through a chemical process such as plating, the metal block does not have voids formed therein. Therefore, heat dissipation efficiency can be ensured without reducing the heat transfer efficiency of the metal block.

In the electronic component mounting board of the present invention, the metal block has a first protrusion protruding from the surface of the first conductor layer and / or a second protrusion protruding from the surface of the second conductor layer. The first protrusion has a first extending portion that extends so as to cover the periphery of the first fitting inlet, and / or the second protrusion covers the periphery of the second fitting inlet. It has the 2nd extension part extended so.
Thus, when the 1st extension part and / or the 2nd extension part are formed, the 1st extension part and / or the 2nd extension part will be separated from a base material, and it will fall out. Acts as an anchor to prevent. Therefore, when the electronic component mounting substrate of the present invention is bent, the metal block can be prevented from separating from the base material and falling off.

In the electronic component mounting board of the present invention, it is desirable that a metal plating layer be formed on the surface of the first conductor layer.
When the metal plating layer is formed on the surface of the first conductor layer, the surface of the first conductor layer is protected by the metal plating layer, and the first conductor layer can be protected from corrosion.

In the electronic component mounting board according to the present invention, the metal plating layer is preferably made of at least one metal selected from the group consisting of nickel and silver.
When a metal plating layer is formed using these substances, the effect of forming the metal plating layer is suitably exhibited.

In the electronic component mounting substrate of the present invention, it is desirable that the metal plating layer is formed so as to cover a part or all of the surface of the metal block.
When the metal plating layer is formed so as to cover part or all of the surface of the metal block, the metal block and the first conductor layer are reliably connected by the metal plating layer. Therefore, it is possible to prevent energization from being stopped due to poor contact.

In the electronic component mounting board according to the present invention, the metal block has the first protrusion, and the first protrusion extends so as to cover the periphery of the first fitting opening. It is desirable to have a part.
When the first extending portion is formed in this manner, the first extending portion functions as an anchor that prevents the metal block from being separated from the base material and falling off. Therefore, when the electronic component mounting substrate of the present invention is bent, the metal block can be prevented from separating from the base material and falling off from the second conductor layer side.

In the electronic component mounting substrate of the present invention, it is preferable that the first protrusion is an electrode pad for mounting the electronic component.
The 1st protrusion part which has a 1st extension part functions suitably as an electrode pad.
Moreover, although an electronic component is mounted on an electrode pad, if a 1st protrusion part is an electrode pad, a metal block will be located directly under an electronic component. The metal block serves as a path for dissipating the heat generated from the electronic component to the back of the electronic component mounting board, so if there is a metal block directly under the electronic component, the heat generated from the electronic component is Heat is easily radiated to the back surface of the electronic component mounting board through the block.

In the electronic component mounting substrate of the present invention, it is desirable that a nickel plating layer is formed on the surface of the electrode pad, and a gold plating layer is further laminated on the nickel plating layer.
When the nickel plating layer is formed on the surface of the electrode pad, the electrode pad can be protected from corrosion. In addition, if the nickel plating layer is only formed, an oxide film is formed on the surface of the nickel plating layer, and when the electronic component is mounted on the electronic component mounting board, an electrical connection between the electrode pad and the electronic component is generated. Connections tend to get worse. However, when a gold plating layer is further formed on the nickel plating layer, gold prevents nickel from being oxidized, thus preventing deterioration of the electrical connection between the electrode pad and the electronic component as described above. be able to.

In the electronic component mounting board of the present invention, it is desirable that a first recess is formed at the center of the top of the first protrusion.
When the 1st recessed part is formed, the effect that a 1st extension part functions as an anchor can be improved.
Further, when mounting the electronic component, it becomes easy to align, and the electronic component is not easily displaced.

In the electronic component mounting board of the present invention, the metal block has the second protrusion, and the second protrusion extends so as to cover the periphery of the second fitting inlet. It is desirable to have a part.
When the second extending portion is formed in this way, the second extending portion functions as an anchor that prevents the metal block from being separated from the base material and falling off. Therefore, when the electronic component mounting substrate of the present invention is bent, the metal block can be prevented from separating from the base material and falling off from the first conductor layer side.

In the electronic component mounting board of the present invention, it is desirable that a second recess is formed at the center of the top of the second protrusion.
When the 2nd recessed part is formed, the effect that a 2nd extension part functions as an anchor can be improved.

In the electronic component mounting board of the present invention, it is desirable that the insulating resin is polyimide.
When the insulating resin is polyimide, the insulating resin has both flexibility and insulating properties, so that the shape can be changed depending on the application while ensuring sufficient insulating properties.

The electronic component mounting board of the present invention is preferably a board for mounting a surface-mounting type light emitting element.
A light-emitting element is an electronic component that generates a large amount of heat and is easily deteriorated by heat. On the other hand, as described above, the electronic component mounting board of the present invention is excellent in heat dissipation. Therefore, when the electronic component mounting substrate of the present invention is used as a substrate for mounting a surface-mounting light-emitting element, heat from the surface-mounting light-emitting element can be suitably radiated. Therefore, it is possible to prevent the surface-mounted light emitting element from being deteriorated by heat.

In the electronic component mounting board of the present invention, it is desirable that a light reflecting layer is formed on the outermost surface on the first conductor layer side.
When mounting a surface-mounted light-emitting element on the electronic component mounting board of the present invention, the surface-mounted light-emitting element is usually covered with a transparent cover for the purpose of protecting the light-emitting element. . When the light emitting element emits light, most of the light is transmitted through the cover, but part of the light is reflected by the cover. If the light reflection layer is formed on the outermost surface on the first conductor layer side as in the electronic component mounting board of the present invention, the reflected light can be reflected again.
Accordingly, the luminance can be increased.

In the electronic component mounting substrate of the present invention, the light reflecting layer is preferably an insulating layer containing titanium oxide as a pigment.
Titanium oxide is a white pigment, and the light reflection layer containing titanium oxide can suitably reflect light. Therefore, the effect of having a light reflection layer can be achieved.

The method for manufacturing an electronic component mounting board according to the present invention is a method for manufacturing the electronic component mounting board, which is made of an insulating resin, and includes a first main surface and a second main surface opposite to the first main surface. A double-sided conductor substrate preparation step of preparing a double-sided conductor substrate in which a first conductor layer is formed on the first principal surface of a base material having a principal surface and a second conductor layer is formed on the second principal surface; The first conductor layer, the base material, and the first conductor are formed so that a first fitting inlet is formed on the first conductor layer side and a second fitting inlet on the second conductor layer side is formed. A hole forming step for forming a hole penetrating the two conductor layers, and a metal block is inserted into the hole, and a first protrusion is formed so that an end of the metal block protrudes from the surface of the first conductor layer And / or forming a second protrusion so that the end of the metal block protrudes from the surface of the second conductor layer. A first extending portion forming step of extending and expanding the first projecting portion so as to cover the periphery of the first fitting inlet and / or forming the first extending portion; and / or A second extending portion forming step of extending and extending the second projecting portion so as to cover the periphery and forming a second extending portion is included.

In a general method for manufacturing a substrate for mounting electronic components, a filled via is formed in a hole penetrating the first conductor layer, the base material, and the second conductor layer through a chemical process such as plating. In some cases, voids are formed. When voids are formed, the heat dissipation efficiency through filled vias decreases.
On the other hand, in the method for manufacturing an electronic component mounting board of the present invention, a metal block is inserted into the hole.
Unlike the filled via, the metal block has no voids formed therein. Therefore, in the manufactured electronic component mounting board, the heat transfer efficiency of the metal block is not reduced, and heat dissipation can be ensured.

In the electronic component mounting board manufacturing method of the present invention, a metal block is inserted into the hole, and the first protrusion is formed so that the end of the metal block protrudes from the surface of the first conductor layer. And / or an insertion step of forming a second protrusion so that an end of the metal block protrudes from the surface of the second conductor layer, and the first protrusion so as to cover the periphery of the first fitting inlet. A first extension portion forming step of extending and expanding to form a first extension portion, and / or forming the second extension portion by extending the second protrusion so as to cover the periphery of the second fitting opening. Including a second extending portion forming step.
Thus, the 1st extension part formation process and / or the 2nd extension part formation process are performed, the 1st extension part which spreads so that the circumference of the 1st fitting entrance may be covered, and / or the 1st The 2nd extension part extended so that the circumference | surroundings of 2 fitting inlets may be covered can be formed.
In the manufactured electronic component mounting substrate, when the first extending portion and / or the second extending portion is formed, the first extending portion and / or the second extending portion is the base material of the metal block. It functions as an anchor that prevents separation from falling off. Therefore, when the manufactured electronic component mounting board is bent, it is possible to prevent the metal block from separating from the base material and falling off.

In the electronic component mounting board manufacturing method of the present invention, in the first extending portion forming step, pressure is applied to the top of the first projecting portion to extend and expand the first projecting portion. It is desirable to form.
Since the metal block has plasticity, the first extending portion can be easily formed by applying pressure to the top of the first protrusion.

In the method for manufacturing an electronic component mounting board according to the present invention, in the first extending portion forming step, when pressure is applied to the top portion of the first projecting portion, a first recess is formed at the center of the top portion of the first projecting portion. It is desirable to apply pressure so that.
By applying pressure in this way, the first extending portion and the first conductor layer can be more firmly adhered to each other. Therefore, it is possible to prevent the metal block from shifting.

In the method of manufacturing an electronic component mounting board according to the present invention, in the second extending portion forming step, pressure is applied to the top of the second projecting portion to extend and expand the second projecting portion. It is desirable to form.
Since the metal block has plasticity, the second extending portion can be easily formed by applying pressure to the top of the second protrusion.

In the method of manufacturing an electronic component mounting substrate according to the present invention, in the second extending portion forming step, when pressure is applied to the top of the second protrusion, a second recess is formed at the center of the top of the second protrusion. It is desirable to apply pressure so that.
By applying pressure in this manner, the second extending portion and the second conductor layer can be more firmly adhered to each other. Therefore, it is possible to prevent the metal block from shifting.

In the method for manufacturing an electronic component mounting board according to the present invention, it is preferable to further perform a pattern forming step of forming an etching resist on the first conductor layer and the second conductor layer and forming a pattern by etching.
An arbitrary pattern can be formed by performing the pattern forming process.

FIG. 1 is a cross-sectional view schematically showing an example of an electronic component mounting board of the present invention on which surface-mount type electronic components are mounted. 2A to 2E are diagrams schematically showing an example of a process of inserting a metal block in the manufacture of the electronic component mounting board of the present invention. FIG. 3 is a cross-sectional view schematically showing an example in which the first protrusion is an electrode pad in the electronic component mounting board of the present invention. FIG. 4 shows an electronic component mounting board according to the present invention, wherein a metal block in which a first recess is formed at the center of the top of the first protrusion and a second recess is formed at the center of the top of the second protrusion. It is sectional drawing which shows typically an example of the used board | substrate for electronic component mounting. FIG. 5 is a cross-sectional view schematically showing an example of an electronic component mounting board of the present invention on which a surface-mounted light emitting element is mounted. FIG. 6 is a diagram schematically showing a double-sided conductor substrate preparation step in the method for manufacturing an electronic component mounting board according to the present invention. FIG. 7 is a diagram schematically showing an example of a hole forming step in the method for manufacturing an electronic component mounting board according to the present invention. FIG. 8 is a diagram schematically illustrating an example of an insertion process of the method for manufacturing an electronic component mounting board according to the present invention. FIG. 9 is a diagram schematically showing an example of a double-sided conductor board in which a metal block is inserted in the insertion process of the method for manufacturing an electronic component mounting board of the present invention. FIG. 10 is a diagram schematically illustrating an example of a first extending portion forming step and a second extending portion forming step in the method for manufacturing an electronic component mounting board according to the present invention. FIG. 11 schematically shows an example of a step of forming the first recess and the second recess in the first extension portion forming step and the second extension portion forming step of the method for manufacturing the electronic component mounting substrate of the present invention. FIG. 12A to 12C are diagrams schematically showing an example of a pattern forming process of the method for manufacturing an electronic component mounting board according to the present invention. FIGS. 13A and 13B are diagrams schematically showing an example of a metal plating layer forming step in the method for manufacturing an electronic component mounting board of the present invention. FIG. 14 is a diagram schematically showing an example of a light reflecting layer forming step of the method for manufacturing an electronic component mounting board according to the present invention.

Hereinafter, the electronic component mounting substrate of the present invention will be specifically described. However, the present invention is not limited to the following description, and can be appropriately modified and applied without departing from the scope of the present invention.

The electronic component mounting board of the present invention will be described with reference to the drawings.
FIG. 1 is a cross-sectional view schematically showing an example of an electronic component mounting board of the present invention on which surface-mount type electronic components are mounted.

As shown in FIG. 1, an electronic component mounting board 1, which is an example of an embodiment of the present invention, is an electronic component mounting board for mounting a surface mounting type electronic component 6.

The electronic component 6 mounted on the electronic component mounting substrate 1 is not particularly limited as long as it is a surface mount type. For example, a light emitting element such as an LED (light emitting diode) or LD (laser diode), a transistor, a capacitor, an IC chip, or the like. It may be.

As shown in FIG. 1, the electronic component mounting substrate 1 is made of an insulating resin, and includes a base 2 having a first main surface 11 and a second main surface 12 opposite to the first main surface 11; A first conductor layer 21 formed on the first main surface 11 of the substrate 2 and a second conductor layer 31 formed on the second main surface 12 of the substrate 2 are provided.

Although it does not specifically limit as insulating resin which comprises the base material 2, It is desirable that it is an insulating resin provided with a softness | flexibility. Examples of the constituent material of such an insulating resin include polyimide and glass epoxy, and among these, polyimide is desirable. When the insulating resin is polyimide, the insulating resin has both flexibility and insulating properties. Therefore, the shape can be changed according to the application while ensuring sufficient insulation.
Although the thickness of the base material 2 is not specifically limited, It is desirable that it is 30-70 micrometers.

Although the constituent material of the 1st conductor layer 21 and the 2nd conductor layer 31 is not specifically limited, It is desirable that they are copper, nickel, etc.
These constituent materials have good electrical conductivity and are suitable as conductors.
Although the thickness of the 1st conductor layer 21 and the 2nd conductor layer 31 is not specifically limited, It is desirable that it is thicker than the base material 2. FIG. Moreover, it is desirable that it is 10-300 micrometers.

As shown in FIG. 1, the electronic component mounting board 1 further includes a hole 50 penetrating the first conductor layer 21, the base material 2, and the second conductor layer 31, and a metal block 60 fitted in the hole 50. I have.

Unlike filled vias that are formed in through-holes through a chemical process such as plating, the metal block 60 does not have voids formed therein, and does not cause depressions or rises on the surface. Since voids are not formed inside, the heat transfer efficiency of the metal block 60 is not reduced, and heat dissipation can be ensured.

Although the constituent material of the metal block 60 is not particularly limited, it is desirable that the metal block 60 be copper having excellent electrical conductivity and thermal conductivity.
Further, the shape of the metal block 60 is not particularly limited, but it is desirable that the metal block 60 has a columnar shape with a flat bottom surface (surface). Examples of such a shape include a cylinder, a quadrangular column, a hexagonal column, and an octagonal column.

Further, as shown in FIG. 1, in the electronic component mounting substrate 1, the hole 50 has a first insertion port 51 on the first conductor layer 21 side and a second insertion port 52 on the second conductor layer side 31. The metal block 60 includes a first projecting portion 61 projecting from the surface of the first conductor layer 21 and a second projecting portion 62 projecting from the surface of the second conductor layer 31. The first extending portion 63 extends so as to cover the periphery of the first fitting entrance 51, and the second projecting portion 62 extends to cover the periphery of the second fitting entrance 52. A portion 64 is provided.
As described above, when the first extending portion 63 and the second extending portion 64 are formed, the first extending portion 63 and the second extending portion 64 are separated from the base material 2 and fall off the metal block 60. It functions as an anchor to prevent this. Therefore, when the electronic component mounting substrate 1 is bent, the metal block 60 can be prevented from being separated from the base material 2 and falling off.

The height of the first protrusion 61 is desirably 5 to 100 μm, and more desirably 5 to 50 μm. In addition, the height of the 1st protrusion part 61 is the distance which becomes the longest when a perpendicular is drawn toward the 1st protrusion part 61 side from the surface where the surface of the 1st conductor layer 21 belongs, FIG. it is that the distance indicated at medium T _1. Note that the height of the first projecting portion 61 is also the height of the first extending portion 63.
If the height of the first protruding portion 61 (first extending portion 63) is less than 5 μm, the first protruding portion 61 (first extending portion 63) is too thin and the electronic component mounting substrate 1 is bent. At this time, the first extending portion 63 is easily broken. As a result, it is difficult to prevent the metal block 60 from falling off the base material 2.
If the height of the first projecting portion 61 (first extending portion 63) exceeds 100 μm, the first projecting portion 61 (first extending portion 63) is too thick, making it difficult to mount the electronic component 6.
The height of the second protrusion 62 is preferably 5 to 70 μm, and more preferably 5 to 30 μm. Note that the height of the second protrusion 62 is the longest distance when a perpendicular is drawn from the surface to which the surface of the second conductor layer 31 belongs to the second protrusion 62 side. it is that the distance indicated by the middle T _2. Note that the height of the second projecting portion 62 is also the height of the second extending portion 64.
If the height of the second projecting portion 62 (second extending portion 64) is less than 5 μm, the second projecting portion 62 (second extending portion 64) is too thin and the electronic component mounting substrate 1 is bent. At this time, the second extending portion 64 is easily broken. As a result, it is difficult to prevent the metal block 60 from falling off the base material 2.
If the height of the second projecting portion 62 (second extending portion 64) exceeds 30 μm, the second projecting portion 62 (second extending portion 64) is too thick, making it difficult to mount the electronic component 6. Further, it becomes difficult to release heat generated from the electronic component 6.

The width of the first extending portion 63 is desirably 1.1 to 1.5 times the opening width of the hole 50, and more desirably 1.1 to 1.3 times. In addition, the opening width of the hole 50 is a distance in which the distance between two points is the maximum among any two points on the outline of the hole 50 in the electronic component mounting substrate 1 in plan view. The width of the first extending portion 63 is the largest when a straight line is drawn from the first insertion port 51 toward the outer end portion of the first extending portion 63 in the electronic component mounting substrate 1 in plan view. It is the distance that becomes shorter.
When the width of the first extending portion 63 is less than 1.1 times the opening width of the hole 50, the first extending portion 63 is too short, so that the metal block 60 is prevented from being separated from the base material 2 and falling off. The function as an anchor is not sufficiently exhibited.
When the width of the first extending portion 63 exceeds 1.5 times the opening width of the hole 50, the stress applied to the connecting portion of the first extending portion 63 when the electronic component mounting substrate 1 is bent increases. It becomes easy. As a result, the first extending portion 63 is easily broken. Therefore, it is difficult to prevent the metal block 60 from falling off the base material 2.
The width of the second extending portion 64 is preferably 1.1 to 1.5 times the opening width of the hole 50, and more preferably 1.1 to 1.3 times. The width of the second extending portion 64 is the largest when a straight line is drawn from the second fitting opening 52 toward the outer end portion of the second extending portion 64 in the planar electronic component mounting substrate 1. It is the distance that becomes shorter.
If the width of the second extending portion 64 is less than 1.1 times the opening width of the hole 50, the second extending portion 64 is too short, so that the metal block 60 is prevented from being separated from the base material 2 and falling off. The function as an anchor is not sufficiently exhibited.
If the width of the second extending portion 64 exceeds 1.5 times the opening width of the hole 50, the stress applied to the connecting portion of the second extending portion 64 when the electronic component mounting substrate 1 is bent increases. It becomes easy. As a result, the second extending portion 64 is easily broken. Therefore, it is difficult to prevent the metal block 60 from falling off the base material 2.

In the electronic component mounting substrate 1, it is desirable that the peripheral edge 53 of the first insertion opening 51 and the peripheral edge 54 of the second insertion opening 52 are pressed and recessed by the first protrusion 61 and the second protrusion 62.
This will be described with reference to the drawings.
2A to 2E are diagrams schematically showing an example of a process of inserting a metal block in the manufacture of the electronic component mounting board of the present invention.
As shown in FIG. 2A, when the electronic component mounting substrate 1 is manufactured, first, the holes 50 penetrating the first conductor layer 21, the base material 2, and the second conductor layer 31 are formed. Become. At this time, the first conductor layer 21 is formed with a first fitting inlet 51 that is an inlet of the hole 50, and the second conductor layer 31 is formed with a second fitting inlet 52 that is an inlet of the hole 50. .
Then, as shown in FIG. 2B, the metal block 60 is inserted into the hole 50.
2C, the end of the metal block 60 protrudes from the surface of the first conductor layer 21 and the surface of the second conductor layer 31, and the first protrusion 61 and the second protrusion 62 are formed. To be arranged.
Further, since the metal block 60 is plastic, as shown in FIG. 2 (d), the pressure can be easily applied to the top 65 of the first protrusion 61 and the top 66 of the second protrusion by applying pressure to the top. The first projecting portion 61 and the second projecting portion 62 can be extended and expanded to form the first extending portion 63 and the second extending portion 64 as shown in FIG.
Thus, when pressure is applied to the top 65 of the first protrusion 61 and the top 66 of the second protrusion 62 to form the first extension 63 and the second extension 64, the metal block 60 and the first conductor are formed. The adhesion between the layer 21 and the second conductor layer 31 is improved. Therefore, it is possible to prevent the metal block 60 from falling off.
Further, when pressure is applied to the top 65 of the first protrusion 61 and the top 66 of the second protrusion 62, the peripheral edge 53 of the first fitting inlet 51 and the peripheral edge 54 of the second fitting inlet 52 are in contact with the first protrusion 61. 2 and is pressed by the second projecting portion 62, and as shown in FIG. 2E, the corners of the first fitting inlet 51 and the corners of the second fitting inlet 52 are in a state of R. That is, the peripheral edge 53 of the first insertion opening 51 and the peripheral edge 54 of the second insertion opening 52 are pressed by the first protrusion 61 and the second protrusion 62, and the corners of the first insertion opening 51 and the second insertion opening 52. It can be said that the electronic component mounting substrate 1 with the corners having Rs is an electronic component mounting substrate manufactured by the above method.
Therefore, in the electronic component mounting substrate 1 having such a configuration, the metal block 60 can be prevented from falling off.

In FIG. 1, the metal block 60 has a first projecting portion 61 having a first extending portion 63 and a second projecting portion 62 having a second extending portion, but the electronic component mounting board of the present invention. In this case, the metal block 60 may have only one of the protrusions.
When the metal block 60 has only the first projecting portion 61 having the first extending portion 63, the metal block 60 is separated from the base material 2 when the electronic component mounting substrate 1 is bent, It is possible to prevent the second conductor layer 31 from falling off. In this case, the end of the metal block 60 opposite to the first protrusion 61 does not protrude from the surface of the second conductor layer 31, and the second protrusion may not be formed.
When the metal block 60 has only the projecting portion 62 having the second extending portion 64, the metal block 60 is separated from the base material 2 when the electronic component mounting substrate 1 is bent, and the first It is possible to prevent the conductor layer 21 from falling off. In this case, the end of the metal block 60 opposite to the second protrusion 62 does not protrude from the surface of the first conductor layer 21, and the first protrusion may not be formed.
The presence or absence of the first protrusion and the second protrusion may be selected according to the use of the electronic component mounting board.

As shown in FIG. 1, in the electronic component mounting substrate 1, a metal plating layer 70 is preferably formed on the surface of the first conductor layer 21.
When the metal plating layer 70 is formed, the surface of the first conductor layer 21 is protected by the metal plating layer 70, and the first conductor layer 21 can be protected from corrosion.

The metal plating layer 70 is preferably made of at least one metal selected from the group consisting of nickel and silver.
When the metal plating layer 70 consists of these metals, the effect of having the metal plating layer 70 is suitably exhibited.

The thickness of the metal plating layer 70 is not particularly limited, but is desirably 1.0 to 10 μm.

In the electronic component mounting substrate 1, the metal plating layer 70 is preferably formed so as to cover a part or all of the surface of the metal block 60.
When the metal plating layer 70 is formed so as to cover part or all of the surface of the metal block 60, the metal block 60 and the first conductor layer 21 are reliably connected by the metal plating layer 70. Therefore, it is possible to prevent energization from being stopped due to poor contact.

As shown in FIG. 1, in the electronic component mounting substrate 1, the first protrusion 61 may be an electrode pad 69 on which the electronic component 6 is mounted.
The first projecting portion 61 having the first extending portion 63 preferably functions as the electrode pad 69.
In addition, the electronic component 6 is mounted on the electrode pad 69, and when the first projecting portion 61 is the electrode pad 69, the metal block 60 is positioned directly below the electronic component 6. The metal block 60 serves as a path for dissipating the heat generated from the electronic component 6 to the back surface of the electronic component mounting substrate 1, so that if the metal block 60 is located directly under the electronic component 6, the electronic component 6 The heat generated from the heat is easily radiated to the back surface of the electronic component mounting substrate 1 through the metal block 60.

FIG. 3 is a cross-sectional view schematically showing an example in which the first protrusion is an electrode pad in the electronic component mounting board of the present invention. That is, FIG. 3 shows the electronic component mounting substrate 1 itself, which is obtained by removing the electronic component 6 from the electronic component mounting substrate 1 on which the surface mounting type electronic component 6 shown in FIG. 1 is mounted.
As shown in FIGS. 1 and 3, when the first protrusion 61 is used as the electrode pad 69, a nickel plating layer 81 is formed on the surface of the electrode pad 69 as the metal plating layer 70, and the nickel plating layer 81 Further, it is desirable that a gold plating layer 82 is further laminated.
When the nickel plating layer 81 is formed on the surface of the electrode pad 69, the electrode pad 69 can be protected from corrosion. Moreover, when the nickel plating layer 81 is formed, an oxide film is formed on the surface of the nickel plating layer 81, and when the electronic component 6 is mounted on the electronic component mounting substrate 1, the electrode pad 69 and the electronic component 6 The electrical connection between them tends to deteriorate. However, if the gold plating layer 82 is further formed on the nickel plating layer 81, gold prevents oxidation of nickel, so that the electrical connection between the electrode pad 69 and the electronic component 6 is poor as described above. Can be prevented.

The thickness of the nickel plating layer 81 is not particularly limited, but is desirably 1.0 to 10 μm.
The thickness of the gold plating layer 82 is not particularly limited, but is desirably 0.5 to 3.0 μm.

As shown in FIG. 4, in the electronic component mounting substrate 1, it is desirable that a first recess 67 is formed in the center of the top 65 of the first protrusion 61, and the top 66 of the second protrusion 62 is formed. It is desirable that a second recess 68 is formed at the center.
FIG. 4 shows an electronic component mounting board according to the present invention, wherein a metal block in which a first recess is formed at the center of the top of the first protrusion and a second recess is formed at the center of the top of the second protrusion. It is sectional drawing which shows typically an example of the used board | substrate for electronic component mounting.
When the 1st recessed part 67 is formed, the effect that the 1st extension part 63 functions as an anchor can be improved. Moreover, when mounting the electronic component 6, it becomes easy to align and the electronic component 6 becomes difficult to shift | deviate.
If the 2nd recessed part 68 is formed, the effect that the 2nd extension part 64 functions as an anchor can be improved.

The depth of the first recess 67 (in FIG. 4, indicated by _{T 3)} is not particularly limited, is preferably a 2 to 10 [mu] m, and more desirably 3 to 6 [mu] m.
If the depth of the first recess 67 is less than 2 μm, the effect of forming the first recess 67 is difficult to obtain. Moreover, when using solder, it becomes a cause of a void.
If the depth of the first recess 67 exceeds 10 μm, the distance between the electronic component 6 and the bottom portion of the first recess 67 becomes too long when the electronic component 6 is mounted. Therefore, the heat generated from the electronic component does not easily reach the metal block 60 and is difficult to dissipate efficiently. Further, in order to form the first recess 67 having such a depth, a strong pressure is required, and the production of the electronic component mounting board cannot be performed efficiently. Moreover, when using solder, it becomes a cause of a void.
The maximum diameter of the first recess 67 (indicated by W ₃ in FIG. 4) is not particularly limited, but is preferably 2 to 10 μm, and more preferably 3 to 6 μm.
When the maximum diameter of the first recess 67 is less than 2 μm, it is difficult to obtain the effect that the first recess 67 is formed. Moreover, when using solder, it becomes a cause of a void.
When the maximum diameter of the first recess 67 exceeds 10 μm, forming the first recess 67 having such a maximum diameter requires a strong pressure, and the production of the electronic component mounting substrate cannot be performed efficiently. Moreover, when using solder, it becomes a cause of a void.
(In FIG. 4, indicated by _{T 4)} the depth of the second recess 68 is not particularly limited, is preferably a 2 to 10 [mu] m, and more desirably 3 to 6 [mu] m.
If the depth of the second recess 68 is less than 2 μm, it is difficult to obtain the effect of forming the second recess 68. Moreover, when using solder, it becomes a cause of a void.
When the depth of the second recess 68 exceeds 10 μm, forming the second recess 68 having such a depth requires a strong pressure, and the production of the electronic component mounting board cannot be performed efficiently. Moreover, when using solder, it becomes a cause of a void.
The maximum diameter (indicated by W ₄ in FIG. 4) of the second recess 68 is not particularly limited, but is preferably 2 to 10 μm, and more preferably 3 to 6 μm.
When the maximum diameter of the second recess 68 is less than 2 μm, it is difficult to obtain the effect of forming the second recess 68. Moreover, when using solder, it becomes a cause of a void.
If the maximum diameter of the second concave portion 68 exceeds 10 μm, forming the second concave portion 68 having such a maximum diameter requires a strong pressure, and the production of the electronic component mounting substrate cannot be performed efficiently. Moreover, when using solder, it becomes a cause of a void.

The electronic component mounting substrate 1 is desirably a substrate on which the surface-mounting type light emitting element 7 is mounted.
FIG. 5 is a cross-sectional view schematically showing an example of an electronic component mounting board of the present invention on which a surface-mounted light emitting element is mounted.
The light emitting element 7 is an electronic component that generates a large amount of heat and is easily deteriorated by heat. On the other hand, as described above, the electronic component mounting board 1 is excellent in heat dissipation. Therefore, when the electronic component mounting substrate 1 is used as a substrate for mounting the surface-mounted light-emitting element 7, heat from the surface-mounted light-emitting element 7 can be suitably radiated. Therefore, it is possible to prevent the surface mounted light emitting element 7 from being deteriorated by heat.

As shown in FIG. 5, when the electronic component mounting substrate 1 is a substrate for mounting the surface mount type light emitting element 7, a light reflection layer 41 is formed on the outermost surface on the first conductor layer 21 side. It is desirable that it be formed.
The effect of the electronic component mounting substrate 1 including the light reflecting layer 41 will be described.
As shown in FIG. 5, the electronic component mounting substrate 1 and the light emitting element 7 are covered with a transparent cover 8 in order to protect the light emitting element 7.
As shown in FIG. 5, in the electronic component mounting substrate 1 including the light reflecting layer 41, when the light emitting element 7 emits light, most of the light is transmitted through the cover 8. Are reflected by the cover 8 (in FIG. 5, the direction of the arrow indicates the direction in which the light travels, and the thickness of the arrow indicates the amount of light). When the light reflection layer 41 is formed on the outermost surface on the first conductor layer 21 side, the reflected light can be reflected again. Accordingly, the luminance can be increased.
The constituent material of the cover 8 is not particularly limited, but is preferably acrylic resin (PMMA), polycarbonate (PC), glass or the like.

The constituent material of the light reflecting layer 41 is not particularly limited, but is preferably an insulating layer containing titanium oxide as a pigment, and more preferably a solder resist layer containing titanium oxide in the pigment.
Titanium oxide is a white pigment, and the light reflection layer 41 containing titanium oxide can suitably reflect light. Therefore, the effect of having the light reflection layer 41 can be achieved.
Further, when the light reflecting layer 41 is a solder resist layer containing titanium oxide in a pigment, in addition to the above effects, it also functions as a solder resist.

Next, an example of a method for manufacturing an electronic component mounting board according to the present invention will be described.
The method for manufacturing an electronic component mounting board according to the present invention is a method for manufacturing the electronic component mounting board, which is made of an insulating resin, and includes a first main surface and a second main surface opposite to the first main surface. A double-sided conductor substrate preparation step of preparing a double-sided conductor substrate in which a first conductor layer is formed on the first principal surface of a base material having a principal surface and a second conductor layer is formed on the second principal surface; The first conductor layer, the base material, and the first conductor are formed so that a first fitting inlet is formed on the first conductor layer side and a second fitting inlet on the second conductor layer side is formed. A hole forming step for forming a hole penetrating the two conductor layers, and a metal block is inserted into the hole, and a first protrusion is formed so that an end of the metal block protrudes from the surface of the first conductor layer And / or forming a second protrusion so that the end of the metal block protrudes from the surface of the second conductor layer. A first extending portion forming step of extending and expanding the first projecting portion so as to cover the periphery of the first fitting inlet and / or forming the first extending portion; and / or A second extending portion forming step of extending and extending the second projecting portion so as to cover the periphery and forming a second extending portion is included.

Hereinafter, each process will be described with reference to the drawings.

(1) Double-sided conductor board preparation process FIG. 6 is a diagram schematically showing a double-sided conductor board preparation process of the method for manufacturing an electronic component mounting board according to the present invention.
First, as shown in FIG. 6, the first main surface 11 of the base material is made of an insulating resin and includes a first main surface 11 and a second main surface 12 opposite to the first main surface 11. A double-sided conductor substrate 5 in which the first conductor layer 21 is formed and the second conductor layer 31 is formed on the second main surface 12 is prepared.

Although it does not specifically limit as insulating resin which comprises the base material 2, It is desirable that it is an insulating resin provided with a softness | flexibility. Examples of the constituent material of such an insulating resin include polyimide and glass epoxy, and among these, polyimide is desirable. When the insulating resin is polyimide, the insulating resin has both flexibility and insulating properties. Therefore, the shape can be changed according to the application while ensuring sufficient insulation.

The constituent material of the first conductor layer 21 and the second conductor layer 31 is preferably copper, nickel or the like.
These constituent materials have good electrical conductivity and are suitable as conductors.

(2) Hole Formation Step FIG. 7 is a diagram schematically showing an example of a hole formation step in the method for manufacturing an electronic component mounting board according to the present invention.
Next, as shown in FIG. 7, a hole 50 penetrating the first conductor layer 21, the base material 2, and the second conductor layer 31 is formed.
A method for forming the hole 50 is not particularly limited, and a press, a drill, a laser, or the like can be used.

(3) Insertion Process FIG. 8 is a diagram schematically showing an example of the insertion process of the method for manufacturing an electronic component mounting board according to the present invention.
FIG. 9 is a diagram schematically showing an example of a double-sided conductor board in which a metal block is inserted in the insertion process of the method for manufacturing an electronic component mounting board of the present invention.
Next, as shown in FIG. 8, the metal block 60 is inserted into the hole 50, and as shown in FIG. 9, the first protrusion so that the end of the metal block 60 protrudes from the surface of the first conductor layer 21. The second protruding portion 62 is formed so that the end portion of the metal block 60 protrudes from the surface of the second conductor layer 31 while forming the portion 61.

If a filled via is to be formed in the hole 50 through a chemical process such as plating, a void is formed inside the filled via, or a depression or bulge occurs on the surface.
In such a case, the thermal efficiency becomes small and the heat dissipation tends to be lowered.
On the other hand, since the metal block 60 has a dense structure, voids are not formed in the inside and the surface is not depressed or raised. Since voids are not formed inside, the heat transfer efficiency of the metal block 60 is not reduced, and heat dissipation can be ensured.

Moreover, the constituent material of the metal block 60 is not particularly limited, but is preferably copper that is excellent in electrical conductivity and thermal conductivity.
The shape of the metal block 60 is not particularly limited and may be selected according to the design, but it is desirable that the shape of the metal block 60 is a columnar shape with a flat bottom surface. Examples of such a shape include a cylinder, a quadrangular column, a hexagonal column, and an octagonal column.

In the above (2) hole forming step and (3) insertion step, a plurality of holes 50 may be formed and a plurality of metal blocks 60 may be inserted.
Moreover, it is desirable to perform the (3) insertion process at the same time as forming the hole 50 in the (2) hole formation process.
In such a method, the hole 50 can be formed by one operation, and the metal block 60 can be inserted into the hole 50. Therefore, an electronic component mounting board can be manufactured efficiently.

(4) Extension part formation process FIG. 10: is a figure which shows typically an example of the 1st extension part formation process and the 2nd extension part formation process of the manufacturing method of the electronic component mounting board | substrate of this invention.

(4-1) First Extension Portion Forming Step Next, the first extension portion 61 is extended and widened so as to cover the periphery of the first insertion opening 51 to form the first extension portion 63.
The method of forming the first extending portion 63 is not particularly limited, but as shown in FIG. 10, pressure is applied to the top portion 65 of the first projecting portion 61 to extend and expand the first projecting portion 61. It is desirable to form.
Since the metal block 60 is plastic, the first extending portion 63 can be easily formed by applying pressure to the top portion 65 of the first projecting portion 61 with the die 92.
As described above, when pressure is applied to the top portion 65 of the first projecting portion 61 to form the first extending portion 63, the adhesion between the metal block 60 and the first conductor layer 21 is improved. Therefore, it is possible to prevent the metal block 60 from falling off.
In addition, when applying pressure to the top 65 of the first protrusion 61, the peripheral edge 53 of the first fitting inlet 51 is pressed by the first protrusion 61, and the corner of the first fitting inlet 51 has an R. It becomes.

(4-2) Second Extension Portion Forming Step Simultaneously with the above (4-2) First Stretching Portion Forming Step, the second protrusion 62 is extended and widened so as to cover the periphery of the second fitting opening 52. The installation part 64 is formed.
The method of forming the second extending portion 64 is not particularly limited. However, as shown in FIG. 10, pressure is applied to the top portion 66 of the second projecting portion 62 by a mold 92 to extend and extend the second projecting portion 62. It is desirable to form the extended portion 64. Since the metal block 60 is plastic, the second extending portion 64 can be easily formed by applying pressure to the top 66 of the second protrusion 62.
Thus, when pressure is applied to the top portion 66 of the second protrusion 62 to form the second extending portion 64, the adhesion between the metal block 60 and the second conductor layer 31 is improved. Therefore, it is possible to prevent the metal block 60 from falling off.
Further, when pressure is applied to the top 66 of the second protrusion 62, the peripheral edge 54 of the second fitting opening 52 is pressed by the second protrusion 62, and the corner of the second fitting 52 is rounded. It becomes.

(4 ′) Concave Forming Step FIG. 11 shows the concavities for forming the first concave portion and the second concave portion in the first extending portion forming step and the second extending portion forming step of the electronic component mounting substrate manufacturing method of the present invention. It is a figure which shows an example of a formation process typically.
As shown in FIG. 11, when performing the above (4-1) first extending portion forming step and (4-2) second extending portion forming step, the center of the top portion of the first protruding portion 61 is arbitrarily selected. The first recess 67 may be formed on the top of the second protrusion 62, and the second recess 68 may be formed at the center of the top of the second protrusion 62 using a mold 93 having a predetermined shape.
A protrusion 94 is formed on the contact surface of the mold 93 with the first protrusion 61 and the second protrusion 62. When pressure is applied to the top 65 of the first protrusion 61 and the top 66 of the second protrusion 62 by the mold 93, the protrusion 94 bites into the first protrusion 61 and the second protrusion 62, thereby causing the first recess. 67 and a second recess 68 are formed.

By forming the 1st recessed part 67, the effect that the 1st extension part 63 functions as an anchor can be improved. Further, when the electronic component 6 is mounted on the manufactured electronic component mounting substrate 1, it is easy to align the position, and the electronic component 6 is not easily displaced.
Moreover, the effect that the 2nd extension part 64 functions as an anchor can be improved by forming the 2nd recessed part 68. FIG.

In the method for manufacturing an electronic component mounting board of the present invention, the above (4-1) first extending portion forming step may be performed and then the above (4-2) second extending portion forming step may be performed. You may reverse the order of a process.
Moreover, in the manufacturing method of the electronic component mounting substrate of the present invention, only one of the above-mentioned (4-1) first extending portion forming step and (4-2) the second extending portion forming step is performed. You may go. When only one of the steps is performed, in the above (3) insertion step, the end of the metal block 60 on the side where the extension portion is not formed is connected to the surface of the first conductor layer 21 or the second conductor layer 31. The metal block 60 is inserted into the hole 50 so as not to protrude from the surface.

(5) Pattern formation process Next, after the (4) extension part formation process shown in FIG. 10, pattern formation is performed.
12A to 12C are diagrams schematically showing an example of a pattern forming process of the method for manufacturing an electronic component mounting board according to the present invention.
As shown in FIG. 12A, an etching resist 91 is formed on the first conductor layer 21, the metal block 60, and the second conductor layer 31.
Next, as shown in FIG. 12B, the portions of the first conductor layer 21 and the second conductor layer 31 where the etching resist 91 is not formed are removed by etching.
Thereafter, the etching resist 91 is removed as shown in FIG. An arbitrary pattern can be formed by such a method.
Examples of the etchant include sulfuric acid-hydrogen peroxide aqueous solution, persulfate aqueous solution such as ammonium persulfate, ferric chloride, cupric chloride, hydrochloric acid and the like. Moreover, you may use the mixed solution containing a cupric complex and an organic acid as etching liquid.

Through the above steps, the electronic component mounting substrate 1 of the present invention can be manufactured.
Moreover, you may perform the following processes arbitrarily.

(6) Metal Plating Layer Formation Step FIGS. 13A and 13B are diagrams schematically showing an example of a metal plating layer formation step in the method for manufacturing an electronic component mounting board of the present invention.
As shown in FIG. 13A, in the method for manufacturing an electronic component mounting board, a metal plating layer forming step of forming a metal plating layer 70 on the surface of the first conductor layer 21 may be performed.
When the metal plating layer 70 is formed, the surface of the first conductor layer 21 is protected by the metal plating layer 70, and the first conductor layer 21 can be protected from corrosion.
The metal plating layer 70 is preferably made of at least one metal selected from the group consisting of nickel and silver. When the metal plating layer 70 consists of these metals, the effect of having the metal plating layer 70 is suitably exhibited.
Although the thickness of the metal plating layer 70 is not specifically limited, It is desirable to form it so that it may become 1.0-10 micrometers.

Moreover, when performing a metal plating layer formation process, it is desirable to form a metal plating layer so that a part or all of the surface of the metal block 60 may be covered.
By forming the metal plating layer 70 so as to cover part or all of the surface of the metal block 60, the metal block 60 and the first conductor layer 21 are reliably connected by the metal plating layer 70. Therefore, it is possible to prevent energization from being stopped due to poor contact.

In the case where the first protrusion 61 is used as the electrode pad 69 for mounting the electronic component 6 in the electronic component mounting substrate 1, first, as shown in FIG. It is desirable to form a nickel plating layer 81 as a metal plating layer 70 on the surface, and then further laminate a gold plating layer 82 on the nickel plating layer 81 as shown in FIG.
By forming the nickel plating layer 81 on the surface of the first protrusion 61 (electrode pad 69), the first protrusion 61 (electrode pad 69) can be protected from corrosion. Further, when only the nickel plating layer 81 is formed, an oxide film is formed on the surface of the nickel plating layer 81, and when the electronic component 6 is mounted on the electronic component mounting substrate 1, the gap between the electrode pad 69 and the electronic component 6 is increased. The electrical connection is likely to deteriorate. Therefore, it is desirable to remove the oxide film of the nickel plating layer 81 and to laminate the gold plating layer 82 on the nickel plating layer 81.

The removal of the nickel oxide film can be carried out using a commonly used nickel oxide film remover. A conventionally known reagent can be used as the nickel oxide film removing agent.
Moreover, it is desirable to perform gold plating using an electroless gold plating solution.

(7) Light Reflecting Layer Forming Step FIG. 14 is a diagram schematically showing an example of the light reflecting layer forming step of the method for manufacturing the electronic component mounting substrate of the present invention.
As shown in FIG. 14, when the electronic component mounting substrate 1 is used as a substrate for mounting a surface-mounting type light emitting device, the first conductor layer side after the above (6) metal plating layer forming step. It is desirable to form the light reflecting layer 41 on the outermost surface of 21.
When forming the light reflecting layer 41, it is desirable to form the light reflecting layer 41 using a material that contains titanium oxide as a pigment and that the formed light reflecting layer 41 becomes an insulating layer.
Further, the light reflection layer 41 is more preferably formed to be a solder resist layer.
Titanium oxide is a white pigment, and the light reflection layer 41 containing titanium oxide can suitably reflect light.
When the light reflection layer 41 is a solder resist layer containing titanium oxide in the pigment, in addition to the above effects, it also functions as a solder resist.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting substrate 2 Base material 5 Double-sided conductor substrate 6 Electronic component 7 Light emitting element 8 Cover 11 1st main surface 12 2nd main surface 21 1st conductor layer 31 2nd conductor layer 41 Light reflection layer 50 Hole 51 First fitting port 52 Second fitting port 53 First fitting port edge 54 Second fitting port edge 60 Metal block 61 First protrusion 62 Second protrusion 63 First extension part 64 Second extension part 65 1 projection top 66 second projection top 67 first recess 68 second recess 69 electrode pad 70 metal plating layer 81 nickel plating layer 82 gold plating layer 91 etching resist 92, 93 mold 94 protrusion

Claims (20)

An electronic component mounting board on which surface-mounted electronic components are mounted,
The electronic component mounting board is:
A base material comprising an insulating resin and comprising a first main surface and a second main surface opposite to the first main surface;
A first conductor layer formed on the first main surface of the substrate;
A second conductor layer formed on the second main surface of the substrate;
A hole penetrating the first conductor layer, the base material and the second conductor layer;
It consists of a metal block fitted in the hole,
The hole has a first fitting inlet on the first conductor layer side and a second fitting inlet on the second conductor layer side,
The metal block has a first protrusion protruding from the surface of the first conductor layer and / or a second protrusion protruding from the surface of the second conductor layer,
The first protrusion has a first extending portion that extends so as to cover the periphery of the first fitting inlet, and / or the second protrusion covers the periphery of the second fitting inlet. An electronic component mounting board comprising: a second extending portion extending in a manner like this. The electronic component mounting substrate according to claim 1, wherein a metal plating layer is formed on a surface of the first conductor layer. The electronic component mounting substrate according to claim 2, wherein the metal plating layer is made of at least one metal selected from the group consisting of nickel and silver. The electronic component mounting substrate according to claim 2, wherein the metal plating layer is formed so as to cover a part or all of a surface of the metal block. The said metal block has the said 1st protrusion part, and the said 1st protrusion part has the said 1st extension part extended so that the circumference | surroundings of the said 1st fitting inlet may be covered. The electronic component mounting board described in the above. The electronic component mounting substrate according to claim 5, wherein the first protrusion is an electrode pad on which the electronic component is mounted. The electronic component mounting substrate according to claim 6, wherein a nickel plating layer is formed on a surface of the electrode pad, and a gold plating layer is further laminated on the nickel plating layer. The electronic component mounting board according to claim 5, wherein a first recess is formed in the center of the top of the first protrusion. The said metal block has the said 2nd protrusion part, and the said 2nd protrusion part has the said 2nd extension part extended so that the circumference | surroundings of the said 2nd fitting inlet may be covered. The electronic component mounting board described in the above. The electronic component mounting substrate according to claim 9, wherein a second recess is formed in the center of the top of the second protrusion. The electronic component mounting substrate according to claim 1, wherein the insulating resin is polyimide. The electronic component mounting substrate according to claim 1, wherein the electronic component mounting substrate is a substrate on which a surface-mounted light emitting element is mounted. The electronic component mounting substrate according to claim 12, wherein a light reflecting layer is formed on an outermost surface on the first conductor layer side. The electronic component mounting substrate according to claim 13, wherein the light reflecting layer is an insulating layer containing titanium oxide as a pigment. It is a manufacturing method of the electronic component mounting board according to any one of claims 1 to 14,
A first conductor layer is formed on the first main surface of the base material made of an insulating resin and provided with a first main surface and a second main surface opposite to the first main surface, and the second main surface is formed. A double-sided conductor substrate preparation step of preparing a double-sided conductor substrate having a second conductor layer formed on the main surface thereof;
The first conductor layer, the base material, and the second so that a first insertion opening is formed on the first conductor layer side and a second insertion opening on the second conductor layer side is formed. A hole forming step for forming a hole penetrating the conductor layer;
A metal block is inserted into the hole, and a first protrusion is formed so that an end of the metal block protrudes from the surface of the first conductor layer and / or the metal block from the surface of the second conductor layer. An insertion step of forming the second protrusion so that the end of the protrusion protrudes;
A first extension portion forming step of extending and extending the first protrusion so as to cover the periphery of the first insertion port and / or forming a first extension portion and / or covering the periphery of the second insertion port. And a second extending portion forming step of extending and extending the second projecting portion to form a second extending portion. The electronic component mounting board according to claim 15, wherein, in the first extending portion forming step, pressure is applied to a top portion of the first protruding portion to extend and expand the first protruding portion to form the first extending portion. Manufacturing method. 17. In the first extending portion forming step, when pressure is applied to the top of the first protrusion, pressure is applied so that a first recess is formed at the center of the top of the first protrusion. The manufacturing method of the electronic component mounting board | substrate of description. The said 2nd extension part formation process WHEREIN: A pressure is applied to the top part of the said 2nd protrusion part, the said 2nd extension part is extended and extended, and the said 2nd extension part is formed in any one of Claims 15-17. A method of manufacturing an electronic component mounting board. 19. In the second extending portion forming step, when pressure is applied to the top of the second protrusion, pressure is applied so that a second recess is formed at the center of the top of the second protrusion. The manufacturing method of the electronic component mounting board | substrate of description. The method for manufacturing an electronic component mounting substrate according to claim 15, further comprising a pattern forming step of forming an etching resist on the first conductor layer and the second conductor layer and forming a pattern by etching.

Images