JP2016048744A - Processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing device which efficiently detects displacement generated in a laminated semiconductor device wafer without providing any special inspection step and is capable of removing the displacement in the case where a displacement amount exceeds an allowable value.SOLUTION: The processing device is configured to apply predetermined processing to a workpiece 13 that is formed by pasting a plurality of circular tabular objects. The processing device includes outer edge detection means for detecting a position of an outer edge of the workpiece mounted on a temporary placement table 20. The processing device also includes: first and second light-emitting means 24a and 24b which are disposed at an upper side of the temporary placement table; and first and second light-receiving means 26a and 26b for receiving detection lights from the first light-emitting means and the second light-emitting means. The workpiece is irradiated with first and second detection lights in the state where the temporary placement table is rotated, positions of a pair of outer edges in the workpiece are detected multiple times, a diameter of the workpiece is calculated multiple times by diameter calculation means, and a difference between a maximum value and a minimum value of the diameter is calculated by displacement amount calculation means.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a processing apparatus for processing a laminated wafer formed by laminating a plurality of wafers each having a plurality of devices on the surface.

  In the manufacturing process of semiconductor devices, devices such as ICs and LSIs are formed in each region partitioned by dividing lines called streets on the surface of the semiconductor wafer. Then, individual semiconductor devices are manufactured by dividing the semiconductor wafer into chips along the planned dividing lines. The semiconductor device manufactured in this way is widely used in various electric appliances.

  In recent years, along with miniaturization and thinning of electrical equipment, semiconductor device packages are also required to be miniaturized and thin, and higher density of packaging is required. One technique for integrating a plurality of semiconductor devices in one package is a three-dimensional mounting in which a plurality of semiconductor device chips are stacked in the vertical direction and mounted.

  In conventional three-dimensional packaging, wire bonding is used to connect between semiconductor device chips or between a semiconductor device chip and an interposer. In connection by wire bonding, inductance and the like increase by the length of the wiring, so that there is a problem that it is not suitable for high-speed signal exchange, and it is necessary to stack chips so that wires do not touch semiconductor device chips and the like Therefore, there are problems such as difficulty in miniaturization.

  In recent years, as a new three-dimensional mounting technique, a mounting technique using a through-silicon via (TSV) instead of a wire has attracted attention. When the TSV technology is used, since the wiring length is shorter than that of the wire, the wiring resistance and inductance can be greatly reduced, and the power consumption can be greatly reduced.

  On the other hand, as one method for laminating semiconductor device chips, a plurality of semiconductor device wafers are laminated together, and a through electrode passing through the laminated semiconductor device wafers is formed to connect the wafers (Wafer On Wafer: WOW). There is.

JP 2003-249620 A

  The laminated semiconductor device wafer is divided into individual device chips through processes such as thinning by grinding or polishing and molding by resin, but there may be a case where the semiconductor device wafers are displaced from each other at the stage of lamination.

  In order to detect this deviation, it is necessary to provide a dedicated inspection process using a microscope. However, there are problems such as an increase in the number of processes and a long time for inspection and an increase in production cost. .

  The present invention has been made in view of the above points, and the object of the present invention is to efficiently detect the deviation generated in the laminated semiconductor device wafer without providing a special inspection process, and the deviation amount is The object of the present invention is to provide a processing apparatus that can be removed without sending the laminated device wafer to the next step when the allowable value is exceeded.

  According to the present invention, there is provided a processing apparatus for performing a predetermined processing on a workpiece on which a plurality of circular plate-like objects are bonded together, and a chuck table having a holding surface for holding the workpiece and the chuck table. Processing means for processing the processed workpiece, a cassette for storing a plurality of workpieces, a cassette mounting table on which the cassette is mounted, and a first transport for unloading the workpiece stored in the cassette Means, an abutting member for abutting the workpiece carried out from the cassette by the first conveying means, a temporary placing table having a smaller diameter than the workpiece, and holding the workpiece, Rotating means for rotating the placing table, second conveying means for conveying the workpiece to the chuck table, control means for controlling the first conveying means and the second conveying means, and the temporary placing Placed on the table Outer peripheral edge detecting means for detecting the position of the outer peripheral edge of the workpiece, the first transport means sucking and unloading the lower surface of the workpiece accommodated in the cassette, The work piece is placed on the temporary placement table so that the temporary center assumed to be the center of rotation of the temporary placement table coincides with the temporary placement table, and the outer periphery detection means is disposed above the temporary placement table. A first detection light that is provided on the outer peripheral edge of the workpiece placed on the temporary table and whose outer edge is positioned outside the outer peripheral edge of the workpiece and whose inner edge is irradiated to the workpiece; The first light emitting means for irradiating and the outer peripheral edge of the work piece disposed above the temporary table and at a position symmetrical to the first light emitting means across the rotation center of the temporary table. The outer edge is located outside the outer periphery of the work piece and the inner edge is irradiated to the work piece. Second light emitting means for emitting the second detection light, and first light receiving means for receiving the first detection light disposed below the temporary table corresponding to the first light emitting means, Corresponding to the second light emitting means, and a second light receiving means that is disposed below the temporary table and receives the second detection light. The first and second light emitting means are processed. The workpiece is irradiated with the first and second detection lights while the temporary table on which the workpiece is placed is rotated, and the first and second light receiving means are partially blocked by the workpiece. The position of the pair of outer peripheral edges in the workpiece is detected a plurality of times from the received light receiving positions of the first and second detection lights, and the control means detects the pair of outer peripheral edges detected a plurality of times by the outer peripheral edge detecting means. A diameter calculating means for calculating the value of the diameter of the workpiece a plurality of times from the position of the workpiece, and a compound calculated by the diameter calculating means Storage means for storing a value of the number of diameters and a preset allowable value of deviation amounts of the plurality of plate-like objects constituting the workpiece, and a maximum of the plurality of diameter values stored in the storage means Deviation amount calculating means for calculating the difference between the value and the minimum value as the deviation amount, and when the actual deviation amount value is less than or equal to the allowable value, the second conveying means removes the workpiece. Processing performed by transporting to a chuck table and performing processing by the processing means, and returning the workpiece to the cassette by the first transporting means when the actual deviation amount exceeds the allowable value An apparatus is provided.

  Preferably, the first transport means is a position where the lower surface of the workpiece stored in the cassette is sucked to unload the workpiece from the cassette and the workpiece can be abutted against the abutting member. In a state where the suction of the workpiece is released and the workpiece is placed on the first conveying means, the workpiece is abutted against the abutting member and the workpiece and the first The positional relationship between the first conveying unit and the workpiece is set to a predetermined positional relationship, and a temporary center assumed to be the center of the workpiece is determined from the positional relationship between the first conveying unit and the workpiece. The work piece is placed on the temporary placement table so as to match.

  According to the present invention, the work piece is irradiated with the first and second detection lights in a state in which the temporary placement table on which the work piece is placed is rotated by the outer peripheral edge detection means, and a pair of the work pieces on the work piece is irradiated The position of the outer periphery is detected a plurality of times, the diameter calculation means calculates a plurality of workpiece diameter values based on the detected value, and the difference between the maximum value and the minimum value of the plurality of diameter values is calculated. If the deviation value is less than the allowable value, the workpiece is transferred to the chuck table and processed. If the deviation exceeds the allowable value, the workpiece is returned to the cassette. Since it controls, an inspection process can be implemented in a processing apparatus, the time concerning an inspection process can be suppressed, and production cost can be suppressed.

It is a perspective view of the cutting device of an embodiment of the present invention. It is a longitudinal cross-sectional view of the outer periphery detection means accommodated on the cassette and the cassette mounting base. It is a side view of an outer periphery detection means, and a block diagram of a control means. It is a typical top view explaining an operation of the 1st conveyance means. FIG. 5A is a diagram showing the maximum value of the deviation amount calculated by the deviation amount calculation means of the workpiece on which a plurality of wafers are stacked, and FIG. 5B is a diagram showing the minimum value of the deviation amount.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, a perspective view of a cutting device 2 according to an embodiment of the present invention is shown. Reference numeral 4 denotes a base of the cutting apparatus 2, and a cassette mounting table 6 is disposed adjacent to the base 4 so as to be movable up and down.

  As best shown in FIG. 2, the cassette mounting table 6 is formed in a box shape having an opening 7, and a nut built in an engaging portion 14 a formed integrally with the support portion 14 is a ball screw. 8 is screwed. A cassette mounting table moving mechanism 12 is configured by the ball screw 8 and the pulse motor 10 connected to one end of the ball screw 8.

  A cassette 16 having a plurality of placement shelves 17 is placed on the cassette placement table 6. Although not shown in the drawing, a plurality of laminated wafers 13 are accommodated in a cassette 16 with both sides supported by a mounting shelf 17.

  The cassette mounting table 6 has a bottom wall 6 a, an upper wall 6 b, and a rear wall 6 c, and an outer peripheral edge detection unit (outer peripheral edge detection means) 18 is disposed in the cassette mounting table 6. The outer periphery detection unit 18 includes a temporary placement table 20 disposed on the bottom wall 6a of the cassette mounting table 6, and an abutting member 22 attached to the inner side of the rear wall 6c.

  The outer periphery detection unit 18 is further attached to the lower surface of the upper wall 6b that irradiates the first detection light toward the outer periphery of the laminated wafer (workpiece) 18 placed on the temporary placement table 20. One light emitting unit (first light emitting means) 24a, a first light receiving unit (first light receiving means) 26a disposed on the bottom wall 6a opposite to the first light emitting unit 24a, and temporarily placed A second light emitting unit (second light emitting means) 24b attached to the lower surface of the upper wall 6b at a position that is point-symmetric with respect to the extension line of the rotation center of the table 20, and the second light emitting unit 24b. And a second light receiving unit (second light receiving means) 26b disposed on the bottom wall 6a.

  Here, the laminated wafer (bonded wafer) 13 includes a first wafer 11a having a plurality of devices formed on the surface and a second wafer 11b having a plurality of devices formed on the surface, and the positional relationship between the devices. Are bonded to correspond to each other.

  At the time of bonding, the first wafer 11a and the second wafer 11b are bonded with care so that the outer peripheral edges thereof coincide with each other. However, there is a slight error, and the outer peripheral edge detecting means of the present invention is the outer periphery of the laminated wafer 13. The position of the periphery is detected.

  Referring again to FIG. 1, reference numeral 28 denotes a first transport unit (first transport means), which includes a hand 30 having a plurality of suction holes 32 on the surface, an L-shaped support member 34 that supports the hand 30, and A Y-axis moving block 36 connected to the lower end portion of the support member 34 is included.

  A nut is built in the Y-axis moving block 36, and this nut is screwed to a ball screw 38 rotatably attached to the base 4 so as to extend in the Y-axis direction. The ball screw 38 and the pulse motor 40 connected to one end of the ball screw 38 constitute a moving mechanism 42 of the first transport unit 28. When the pulse motor 40 is driven, the ball screw 38 rotates and the first transport unit 28 is moved in the Y-axis direction.

  A first portal frame 44 is erected on the base 4. Two guide rails 46 and 48 extending in the Y-axis direction are disposed on the front surface of the first portal frame 44. Reference numeral 50 denotes a second transport unit (second transport means) that is guided by the guide rail 46 and moves in the Y-axis direction, and is also arranged to be movable in the vertical direction (Z-axis direction). Yes.

  Reference numeral 52 denotes a third transport unit (third transport means) which is guided by the guide rail 48 and arranged to be movable in the Y-axis direction, and is also movably arranged in the vertical direction (Z-axis direction). It is installed.

  A chuck table 54 for sucking and holding the workpiece 13 is disposed at a substantially central portion of the base 4 so as to be rotatable and reciprocally movable in the X-axis direction. A second portal frame 56 is erected on the base 4 on the back side of the first portal frame 44. A first Y-axis moving block 58a and a second Y-axis moving block 58b are disposed on the second portal frame 56 so as to be independently movable in the Y-axis direction.

  A first Z-axis movement block 60a is attached to the first Y-axis movement block 58a so as to be movable in the Z-axis direction by the first Z-axis movement mechanism 62a, and a second Z-axis movement block 58b is moved to the second Z-axis movement block 58b. The block 60b is attached so as to be movable in the Z-axis direction by the second Z-axis moving mechanism 62b.

  The first Z-axis moving block 60a is provided with a first cutting unit 64a having a cutting blade at the tip, and the second Z-axis 60b is provided with a second cutting unit 64b having a cutting blade at the tip.

  Reference numeral 66 denotes a spinner cleaning unit, and the workpiece that has been cut by the first cutting unit 64a and / or the second cutting unit 64b is transported to the spinner cleaning unit 66 by the third transport unit 52. Spin cleaning and spin drying.

  Next, the arrangement relationship between the first and second light emitting units 24a and 24b and the first and second light receiving units 26a and 26b will be described with reference to FIG. The first light emitting unit 24a has a semiconductor laser as a light source. After the laser light emitted from the semiconductor laser is reflected by a mirror, the first light emitting unit 24a is passed through a long rectangular slit, and the light transmitted through the slit is passed through a collimating lens. The light is converted into parallel light, and the first detection light is emitted as 25a.

  The width of the first detection light 25a is set to 28 mm in this embodiment. Similarly, the second detection light 25b emitted from the second light emitting unit 24b is also emitted as collimated second detection light having a width of 28 mm.

  In the first light emitting unit 24 a, the outer edge of the first detection light 25 a is positioned outside the outer peripheral edge of the laminated wafer 13, and the first detection light 25 a is partially blocked by the outer peripheral edge of the laminated wafer 13. The cassette mounting table 6 is attached to the upper wall 6b. A first light receiving unit 26 a is fixed to the bottom wall 6 a of the cassette mounting table 6 so as to face the first light emitting unit 24 a.

  The second light emitting unit 24 b is attached to the upper wall 6 b of the cassette mounting table 6 at a position that is point-symmetric with the first light emitting unit 24 a with respect to the extension line of the rotation center of the temporary table 20. At this attachment position, the second detection light 25b emitted from the second light emitting unit 24b is positioned on the temporary placement table 20 with the outer edge of the second detection light 25b being more than the outer peripheral edge of the laminated wafer 13. The second detection light 25 b located outside is partially blocked by the laminated wafer 13. A second light receiving unit 26b is fixed to the bottom wall 6a of the cassette mounting table 6 so as to face the second light emitting unit 24b.

  Both the first light receiving unit 26 a and the second light receiving unit 26 b are composed of line sensors aligned in the Y-axis direction, and the coordinate values of each segment of the line sensor are stored in the control means 68.

  The control means 68 includes a diameter calculating means 70 for calculating the diameter of the laminated wafer 13 from the outputs of the first light receiving unit 26a and the second light receiving unit 26b, and a diameter calculated by the diameter calculating means 70 and a preset laminated value. A storage means 72 for storing an allowable value of a deviation amount between the first wafer 11a and the second wafer 11B constituting the wafer 13, and a maximum value and a minimum value of a plurality of diameter values stored in the storage means 72; And a deviation amount calculating means 74 for calculating the difference as an actual deviation amount.

  Hereinafter, the operation of the outer peripheral edge detection unit 18 configured as described above will be described. First, the first transport unit 28 is moved in the Y-axis direction, the hand 30 is inserted into the cassette 16, and the lower surface of the laminated wafer 13 accommodated in the cassette 16 is sucked by the suction holes 32 of the hand 30. Unload from 16

  Next, the cassette mounting table moving mechanism 12 is driven to raise the cassette mounting table 6, and then, as shown in FIG. 4A, the first transport unit 28 is moved in the Y-axis direction to move the laminated wafer 13. The sucked and held hand 30 is allowed to enter the cassette mounting table 6.

  Next, as shown in FIG. 4B, after the suction of the laminated wafer 13 by the hand 30 is released, the first transport unit 28 is further moved in the Y-axis direction and placed on the hand 30. The laminated wafer 13 is abutted against the arc-shaped abutting surface 22 a of the abutting member 22.

  Here, since the radius of curvature of the arc-shaped abutting surface 22 a of the abutting member 22 is formed so as to coincide with the radius of curvature of the laminated wafer 13, the laminated wafer 13 is the arc-shaped abutting surface 22 a of the abutting member 22. The coordinate value in the X-axis direction of the center of the laminated wafer 13 coincides with the coordinate value in the X-axis direction of the rotation center of the temporary placement table 20.

  In this state, the laminated wafer 13 is again sucked and held by the hand 30, and as shown in FIG. 4C, when the first transport unit 28 is moved by a predetermined distance in the direction of the arrow Y2, the center of the laminated wafer 13 is obtained. The first transport unit 28 is assembled so as to coincide with the rotation center of the temporary table 20.

  When the suction holding of the hand 30 with respect to the laminated wafer 13 is released and the cassette placing table moving mechanism 12 is driven to raise the temporary placing table 20, the temporary center assumed to be the center of the laminated wafer 13 is set to the temporary placing table 20. The laminated wafer 13 can be placed on the temporary placement table 20 so as to coincide with the rotation center.

  Next, the laminated wafer 13 is sucked and held by the temporary placement table 20, and the first detection light 25a and the second detection light 25b from the first light emission unit 24a and the second light emission unit 24b in a state where the temporary placement table 20 is rotated. At the same time.

  The first light receiving unit 26a and the second light receiving unit 26b are configured to change the position of the pair of outer peripheral edges of the laminated wafer 13 a plurality of times from the positions of the first detection light 25a and the second detection light 25b blocked by the laminated wafer 13. The detected value is transmitted to the control means 68.

  The control means 68 calculates the diameter of the laminated wafer 13 a plurality of times by the diameter calculating means 70 from the position of the pair of outer periphery detected by the outer periphery detection unit 18 a plurality of times. This multiple calculation includes the maximum value of the diameter of the laminated wafer 13 shown in FIG. 5 (A) and the minimum value of the diameter of the laminated wafer 13 shown in FIG. 5 (B).

  In the deviation amount calculation means 74, the difference between the maximum value and the minimum value of the plurality of diameter values stored in the storage means 72 is calculated as an actual deviation amount, and this actual deviation amount value is stored in the storage means 72. When the value is less than the allowable value, the laminated wafer 13 is unloaded from the cassette mounting table 6 by the first carrying unit 28, and then the laminated wafer 13 is received from the first carrying unit 28 by the second carrying unit 50. Then, the laminated wafer 13 is conveyed to the chuck table 54, and edge trimming of the laminated wafer 13 held on the chuck table 54 by the first cutting unit 64a and the second cutting unit 64b is performed.

  On the other hand, when the actual deviation amount calculated by the deviation amount calculation means 74 exceeds the allowable value stored in the storage means 72, the first layered wafer 13 is not transported to the chuck table 54, and the first The laminated wafer 13 is returned to a predetermined position of the cassette 16 by the transport unit 28, and this position is stored by the control means 68.

  According to the above-described embodiment, the outer peripheral edge of the laminated wafer 13 placed on the temporary placement table 20 is detected at a plurality of locations by the outer peripheral edge detection unit 18 arranged in the cassette placing table 6. Since the maximum and minimum values of the diameter can be detected as a deviation amount, in the case of a laminated wafer whose deviation amount exceeds a predetermined allowable value, it is easy to send this laminated wafer to the next process. Can be removed.

  In the embodiment described above, an example in which the present invention is applied to a cutting apparatus that performs edge trimming has been described. However, the present invention is not limited to this, and a grinding apparatus that processes a laminated wafer, a laser processing apparatus, or the like is used. The present invention can be similarly applied to other processing apparatuses.

2 Cutting device 6 Cassette mounting table 11a First wafer 11b Second wafer 12 Cassette mounting table moving mechanism 13 Laminated wafer (workpiece)
18 Outer rim detection unit 20 Temporary table 22 Abutting member 24a First light emitting unit 24b Second light emitting unit 26a First light receiving unit 26b Second light receiving unit 28 First transport unit 30 Hand 42 Y-axis moving mechanism 44 First portal frame 50 Second conveyance unit 52 Third conveyance unit 54 Chuck table 56 Second portal frame 64a First cutting unit 64b Second cutting unit 68 Control means 70 Diameter calculation means 72 Storage means 74 Deviation amount Calculation means

Claims (2)

A processing device that performs a predetermined processing on a workpiece on which a plurality of circular plate-shaped objects are bonded,
A chuck table having a holding surface for holding a workpiece;
Processing means for processing the workpiece held on the chuck table;
A cassette for storing a plurality of workpieces;
A cassette mounting table on which the cassette is mounted;
First transport means for unloading the workpieces contained in the cassette;
An abutting member that abuts the workpiece carried out of the cassette by the first conveying means;
A temporary table that has a smaller diameter than the workpiece and holds the workpiece;
Rotating means for rotating the temporary placement table;
A second conveying means for conveying the workpiece to the chuck table;
Control means for controlling the first transport means and the second transport means;
An outer periphery detecting means for detecting the position of the outer periphery of the workpiece placed on the temporary table,
The first conveying means sucks and unloads the lower surface of the workpiece contained in the cassette, and makes the temporary center assumed to be the center of the workpiece coincide with the rotation center of the temporary table. Place the workpiece on the temporary table,
The outer periphery detection means includes
The outer edge of the workpiece placed on the temporary table and placed on the temporary table is positioned outside the outer edge of the workpiece, and the inner edge of the workpiece is placed on the workpiece. First light emitting means for irradiating irradiated first detection light;
It is arranged above the temporary table and at a position that is point-symmetric with the first light emitting means across the rotation center of the temporary table, and the outer edge of the workpiece has an outer edge. A second light emitting means for irradiating a second detection light that is located outside the outer peripheral edge and the inner edge is irradiated to the workpiece;
A first light receiving means disposed below the temporary table corresponding to the first light emitting means and receiving the first detection light;
A second light receiving means disposed below the temporary table corresponding to the second light emitting means and receiving the second detection light,
The first and second light emitting means irradiate the workpiece with the first and second detection lights in a state where the temporary placement table on which the workpiece is placed is rotated. The light receiving means detects the position of the pair of outer peripheral edges of the workpiece a plurality of times from the light receiving positions of the first and second detection lights partially blocked by the workpiece,
The control means includes a diameter calculating means for calculating the value of the diameter of the workpiece a plurality of times from the position of the pair of outer peripheral edges detected a plurality of times by the outer peripheral edge detecting means;
Storage means for storing a plurality of diameter values calculated by the diameter calculation means and a preset allowable value of deviation amounts of a plurality of plate-like objects constituting the workpiece;
Deviation amount calculating means for calculating a difference between the maximum value and the minimum value of the plurality of diameter values stored in the storage means as an actual deviation amount;
If the actual deviation value is less than or equal to the allowable value, the workpiece is conveyed to the chuck table by the second conveying means and processed by the machining means, and the actual deviation value is A processing apparatus characterized by returning a workpiece to the cassette by the first conveying means when an allowable value is exceeded.   The first conveying means sucks the lower surface of the workpiece stored in the cassette, carries the workpiece out of the cassette, and conveys the workpiece to a position where it can abut against the abutting member. The workpiece is abutted against the abutting member in a state where the suction of the workpiece is released and the workpiece is placed on the first conveying means, and the workpiece and the first conveying means Is set to a predetermined positional relationship, and the temporary center assumed to be the center of the workpiece from the positional relationship between the first conveying means and the workpiece is made to coincide with the rotation center of the temporary table. The processing apparatus according to claim 1, wherein the workpiece is placed on the temporary placement table.