JP2016040981A - Power conversion device and electric vehicle - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power conversion device having high reliability, and further to provide an electric vehicle.SOLUTION: A power conversion device comprises: a first switch pair including a first switch 3 and a second switch 4 mutually connected in series; a second switch pair including a third switch 5 and a fourth switch 6 mutually connected in series; and a capacitor 2a electrically connected to the first and second switch pairs in parallel and disposed between the first and second switch pairs in a direction D6. Collectors 104 and 108 of the first switch 3 and the third switch 5, emitters 107 and 111 of the second switch 4 and the fourth switch 6 and electrodes 102a and 103a of the capacitor 2a are disposed side-by-side in the direction D6 at one side in a direction D5. Emitters 105 and 109 of the first switch 3 and the third switch 5 and collectors 106 and 110 of the second switch 4 and the fourth switch 6 are disposed side-by-side in the direction D6 at the other side in the second direction D5.SELECTED DRAWING: Figure 3

Description

  Embodiments described herein relate generally to a power converter and an electric vehicle.

  A hybrid vehicle using both an internal combustion engine and an electric motor as a driving device for driving wheels has been widely used. In addition, an electric vehicle having only an electric motor as a driving device for driving wheels has been widely used.

  An electric vehicle such as a hybrid vehicle or an electric vehicle has a power conversion device that converts DC power supplied from a battery into AC power and supplies the AC power to an electric motor. The power converter includes, for example, a pair of switching elements connected in series between a high potential side and a low potential side of a DC current supply line connected to a DC power supply. A series connection point of the pair of switching elements is connected to a load. Furthermore, if a capacitor is connected between the DC current supply lines, the potential of the DC current supply line can be suppressed from changing.

Japanese Patent No. 2880995

  For example, a power conversion device that converts DC power into three-phase AC power includes a pair of switching elements for each phase. By connecting a capacitor in parallel with each phase switching element pair in the three-phase power conversion device, the wiring distance between the capacitor and the switching element can be shortened, and the inductance can be reduced.

  However, when a capacitor is connected for each phase of the power conversion device, depending on the switching element and the layout design of the capacitor, the distance of the conductor connecting between the capacitor and the switching element becomes longer, and the inductance increases, resulting in power conversion. Efficiency may be reduced. Also, if the inductance of the conductor connecting the capacitor and the switching element increases, the surge voltage superimposed on the AC / DC current supply line increases, and if the surge voltage exceeds the breakdown voltage of the switching element, the power converter will fail. There was a possibility of causing.

  Embodiments of the present invention have been made in view of the above circumstances, and an object thereof is to provide a highly reliable power conversion device and electric vehicle.

  According to the embodiment, a first switch pair including a first switch and a second switch electrically connected in series with the first switch, a third switch, and electrically connected in series with the third switch. A second switch pair including the fourth switch, the first switch pair, and the second switch pair electrically connected in parallel, and in the first direction, the first switch pair and the second switch A capacitor disposed between a pair, an emitter terminal of the first switch and the third switch, an emitter terminal of the second switch and the fourth switch, and an electrode terminal of the capacitor, One side of the second direction substantially orthogonal to the first direction, arranged side by side in the first direction, the emitter terminals of the first switch and the third switch, and the second The switch and the collector terminal of the fourth switch, the other side in the second direction, the power conversion apparatus characterized by being first arranged side by side in the direction are provided.

FIG. 1 is an equivalent circuit diagram for explaining a configuration example of a power conversion device and an electric vehicle according to an embodiment. FIG. 2 is a perspective view illustrating an example of the appearance of the semiconductor package in the power conversion device according to the embodiment. Drawing 3 is a top view of the power converter of one embodiment. FIG. 4 is a diagram illustrating an example of a cross section of the power conversion device taken along line AA illustrated in FIG. 3. FIG. 5 is a diagram for describing an electrical connection configuration between a semiconductor package and a capacitor in the power conversion device according to the embodiment. FIG. 6 is a plan view for explaining a configuration example of a control circuit board in the power conversion device according to the embodiment. FIG. 7 is a diagram illustrating another example of a cross section of the power conversion device taken along line AA illustrated in FIG. 3. FIG. 8 is a diagram illustrating another example of a cross section of the power conversion device taken along line AA illustrated in FIG. 3. FIG. 9 is a diagram illustrating another example of the cross section of the power conversion device taken along line AA illustrated in FIG. 3.

Hereinafter, a power conversion device and an electric vehicle according to an embodiment will be described with reference to the drawings.
FIG. 1 is an equivalent circuit diagram for explaining a configuration example of a power conversion device and an electric vehicle according to an embodiment.

  The electric vehicle according to the present embodiment includes a power conversion device, a motor 15, and an axle that transmits the rotational power of the motor 15 to the wheels WL. The power conversion apparatus includes a DC power source 1, capacitors 2a to 2c, and semiconductor packages 3 to 14.

  The power conversion device of the present embodiment converts DC power supplied from the DC power supply 1 into three-phase AC power. The power conversion device is a three-phase bidirectional power conversion device that supplies a three-phase alternating current to the motor 15 by opening and closing the switching elements of the semiconductor packages 3 to 14 in accordance with a gate drive signal from a drive circuit (not shown). Each phase has two pairs of semiconductor packages.

  The DC power supply BT includes a storage battery such as a lithium ion battery or a nickel metal hydride battery. The DC power output from the DC power supply BT is output, and the DC power supply BT charges the electric energy generated by the motor 15.

  The semiconductor packages 3 to 14 are, for example, switching elements that can be electrically opened and closed such as IGBTs (Insulated Gate Bipolar Transistors), FETs (Field-Effect Transistors), GTOs (Gate Turn-Off Thyristors), and transistors. And a diode. A drive signal is input from a drive circuit (not shown) to the gate of the switching element. The switching elements are connected such that the collector is on the high potential side of the DC current supply line and the emitter is on the low potential side of the DC current supply line. The diode is connected in parallel with the switching element so that the direction from the low potential side to the high potential side of the DC current supply line is the forward direction.

  The power converter of this embodiment has two pairs of semiconductor packages 3 to 6 connected in series as U-phase semiconductor packages. That is, the U phase includes a first switch pair including a semiconductor package 3 (first switch) and a semiconductor package 4 (second switch) electrically connected in series with the semiconductor package 3, and a semiconductor package 5 (third Switch) and a second switch pair including a semiconductor package 6 (fourth switch) electrically connected in series with the semiconductor package 5.

  The semiconductor packages 3 and 4 are connected in series between the DC current supply lines. The semiconductor packages 5 and 6 are connected in series between the DC current supply lines. The series connection point of the semiconductor packages 3 and 4 and the series connection point of the semiconductor packages 5 and 6 are electrically connected to the U-phase terminal 128 of the power converter.

  The power conversion device of the present embodiment has two pairs of semiconductor packages 7 to 10 connected in series as V-phase semiconductor packages. That is, the V phase is a first switch pair including a semiconductor package 7 and a semiconductor package 8 electrically connected in series with the semiconductor package 7, a semiconductor package 9, and a semiconductor electrically connected in series with the semiconductor package 9. And a second switch pair including the package 10.

  The semiconductor packages 7 and 8 are connected in series between the DC current supply lines. The semiconductor packages 9 and 10 are connected in series between the DC current supply lines. The series connection point of the semiconductor packages 7 and 8 and the series connection point of the semiconductor packages 9 and 10 are electrically connected to the V-phase terminal 129 of the power converter.

  The power converter of this embodiment has two pairs of semiconductor packages 11 to 14 connected in series as a W-phase semiconductor package. That is, the W phase is a first switch pair including a semiconductor package 11 and a semiconductor package 12 electrically connected in series with the semiconductor package 11, a semiconductor package 13, and a semiconductor electrically connected in series with the semiconductor package 13. And a second switch pair including the package 14.

  The semiconductor packages 11 and 12 are connected in series between the DC current supply lines. The semiconductor packages 13 and 14 are connected in series between the DC current supply lines. The series connection point of the semiconductor packages 11 and 12 and the series connection point of the semiconductor packages 13 and 14 are electrically connected to the W-phase terminal 130 of the power converter.

  The capacitor 2 a is connected in parallel with the semiconductor packages 3, 4 (first switch pair), the semiconductor packages 5, 6 (second switch pair), and the DC power supply 1 between the DC current supply lines. The capacitor 2a includes a conductor 102a electrically connected to the high potential side DC current supply line and a conductor 103a electrically connected to the low potential side DC current supply line.

  The capacitor 2 b is connected in parallel with the semiconductor packages 7 and 8 (first switch pair), the semiconductor packages 9 and 10 (second switch pair), and the DC power supply 1 between the DC current supply lines. The capacitor 2b includes a conductor 102b electrically connected to the high potential side DC current supply line and a conductor 103b electrically connected to the low potential side DC current supply line.

  The capacitor 2 c is connected in parallel with the semiconductor packages 11 and 12 (first switch pair), the semiconductor packages 13 and 14 (second switch pair), and the DC power supply 1 between the DC current supply lines. The capacitor 2c includes a conductor 102c electrically connected to the high potential side DC current supply line and a conductor 103c electrically connected to the low potential side DC current supply line.

  The motor M generates torque by the current supplied from the power converter. Torque generated by connecting a load device is transmitted to the output shaft of the motor M. The motor M performs regenerative operation by converting the kinetic energy of the load device into electric power. The electric power generated by the regenerative operation of the motor M is converted into DC power by the power converter, and the DC power source BT is charged. In the present embodiment, the torque generated when the axle is connected to the output shaft of the motor M is transmitted to the wheel WL via the axle. Further, the motor M performs regenerative operation by converting the kinetic energy of the wheels WL transmitted through the axle to electric power.

  FIG. 2 is a perspective view illustrating an example of the appearance of the semiconductor package in the power conversion device according to the embodiment. In addition, although an example of the external appearance is shown about the semiconductor package 3 here, the external appearance of the semiconductor packages 4-14 is also the same.

  The semiconductor package 3 is configured as, for example, a double-sided heat dissipation type and a vertical mounting type power conversion element. The semiconductor package 3 of this embodiment includes a first conductor (collector conductor) 104, a second conductor (emitter conductor) 105, a plurality of signal terminals 64, and an envelope 500. .

  In the following description of the semiconductor package, the direction in which the plurality of signal terminals 64 extend from the envelope 500 is the height direction D1, and the direction in which the first conductor 104 and the second conductor 105 protrude from the envelope 500. Is a longitudinal direction D2, and a direction perpendicular to the height direction D1 and the longitudinal direction D2 is a width direction D3. The height direction D1, the longitudinal direction D2, and the width direction D3 are orthogonal to each other.

  The envelope 500 is an insulator formed of, for example, resin, and covers and seals components such as a semiconductor switch and a diode of the semiconductor package 3. The envelope 500 is formed in a substantially rectangular parallelepiped shape. The envelope 500 includes an upper surface 74 and a bottom surface (not shown) opposed in the height direction D1, side surfaces 75 and 76 opposed in the longitudinal direction D2, and two side surfaces 72 and 73 opposed in the width direction D3 and parallel to each other. ,have.

  On the upper surface 74 of the envelope 500, a portion between the parting line PL and the side surface 72 extends slightly inclined from the parting line PL toward the side surface 72 toward the bottom surface side. The portion between and extends from the parting line PL toward the side surface 73 slightly inclined toward the bottom surface side.

  The first conductor 104 protrudes outward in the longitudinal direction D2 of the envelope 500 from one side surface 76 of the envelope 500 at the position of the parting line PL. The contact portion 104a of the first conductor 104 is bent at a right angle toward the side surface 76 and faces the side surface 76 of the envelope 500 with a gap. Further, the contact portion 104 a is bent at a substantially right angle with respect to the longitudinal direction D <b> 2, and is located at a substantially center in the width direction D <b> 3 with respect to the envelope 500.

  The second conductor 105 protrudes outward in the longitudinal direction D2 of the envelope 500 from the other side surface 75 of the envelope 500 at the position of the parting line PL. The contact portion 105a of the second conductor 105 is bent at a right angle toward the side surface 75 and faces the side surface 75 of the envelope 500 with a gap. Further, the contact portion 105 a is bent at a substantially right angle with respect to the longitudinal direction D <b> 2, and is located at a substantially center in the stacking direction W with respect to the envelope 52.

  The signal terminals 64a to 64e are located at a distance from each other and protrude from the envelope 500 in the height direction D1 at the position of the parting line PL. The five signal terminals 64a to 64e extend in parallel to each other. The signal terminals 64a to 64e extend in parallel to each other along the height direction D1, and are bent at two points separated from each other in the height direction D1. The width of the signal terminals 64 a to 64 e in the longitudinal direction D <b> 2 is smaller at a portion away from the envelope 500 than in the vicinity of the envelope 500. A conductive film is formed on the outer surfaces of the tips of the signal terminals 64a to 64e.

  The signal terminals 64a to 64e are an emitter branch terminal (collector / emitter voltage monitor terminal) (branch signal terminal) 64a, a current (emitter sense current) monitor terminal 64b, a gate (gate-emitter voltage) terminal 64c, and a chip temperature monitor. Five signal terminals of terminals 64d and 64e are included.

Drawing 3 is a top view of the power converter of one embodiment. Here, a power conversion device in a state in which a control circuit board described later is separated is shown.
The power conversion device includes a bus bar module 20. The bus bar module 20 includes a frame having a plurality of openings provided in a matrix, a bus bar (not shown) housed in the frame, a fixing portion 21, a positive terminal 100, a negative terminal 101, a U Phase terminal 128, V phase terminal 129, and W phase terminal 130 are included.

  The plurality of openings of the bus bar module 20 are opened in a stacking direction D4 in which the bus bar module 20 and a case 26 described later are stacked. In this embodiment, two openings that are substantially orthogonal to the stacking direction D4 and orthogonal to each other are defined as a row direction (second direction) D5 and a column direction (first direction) D6, and nine openings are arranged in a matrix of three rows and three columns. Is arranged.

  In the semiconductor packages 3 to 14, the height direction D1 in FIG. 2 substantially coincides with the stacking direction D4 in FIG. 3, the longitudinal direction D2 in FIG. 2 substantially coincides with the row direction D5 in FIG. 3, and the width direction D3 in FIG. Are arranged so as to substantially coincide with the column direction D6 of FIG.

  The three openings arranged in the column direction (direction substantially parallel to the line AA) D6 accommodate the first switch pair, the second switch pair, and the capacitor of each phase in each column. In the column direction D6, the capacitors 2a to 2c are arranged between the first switch pair and the second switch pair, respectively. Of the three openings arranged in the column direction D6, a pair of semiconductor packages connected in series are arranged in the first and third openings.

  The fixing portion 21 is provided at a plurality of positions of the frame of the bus bar module 20 and has screw holes for fixing a case 26 and a control circuit board SB to be described later with screws. In the present embodiment, the bus bar module 20 has a substantially rectangular outer shape in plan view, and the fixing portion 21 protrudes outward from each of the four corners of the outer periphery of the bus bar module 20 and extends in the column direction D6. It protrudes outward from the extending outer peripheral portion.

  The positive electrode terminal 100 and the negative electrode terminal 101 have screw holes for screwing and fixing conductive means such as wires and cables that are electrically connected to the positive electrode and the negative electrode of the DC power supply BT, for example. In the present embodiment, the positive electrode terminal 100 and the negative electrode terminal 101 protrude outward from one outer peripheral portion extending in the row direction D5 of the bus bar module 20.

  The U-phase terminal 128, the V-phase terminal 129, and the W-phase terminal 130 have screw holes for screwing and fixing conductive means such as wires and cables connected to each phase current input terminal of the motor M, for example. ing. In the present embodiment, the U-phase terminal 128, the V-phase terminal 129, and the W-phase terminal 130 protrude outward from the other outer peripheral portion extending in the row direction D5 of the bus bar module 20.

Next, the arrangement of the U-phase semiconductor packages 3 to 6 and the capacitor 2a will be described.
In the U-phase semiconductor packages 3 to 6 and the capacitor 2a, the conductors 104, 107, 108, and 111 and the conductors 102a and 103a that are electrically connected to the DC current supply line are substantially orthogonal to the line AA. Conductors 105, 106, 109, 110 arranged on one side in the direction (row direction D5) and electrically connected to the U-phase terminal 128 in the direction (row direction D5) substantially orthogonal to the line AA Arranged on the other side.

  That is, collector terminals (conductors 104 and 108) of the semiconductor package 3 (first switch) and the semiconductor package 5 (third switch), and emitters of the semiconductor package 4 (second switch) and the semiconductor package 6 (fourth switch). The terminals (conductors 107 and 111) and the capacitor electrode terminals (conductors 102a and 103a) are arranged side by side in the column direction (first direction) D6 on one side in the row direction (second direction) D5. ing.

  Also, emitter terminals (conductors 105 and 109) of the semiconductor package 3 (first switch) and the semiconductor package 5 (third switch), and collectors of the semiconductor package 4 (second switch) and the semiconductor package 6 (fourth switch). The terminals (conductors 106 and 110) are arranged side by side in the column direction (first direction) D6 on the other side in the row direction (second direction) D5.

  The capacitor 2a includes a capacitor element and a substantially rectangular parallelepiped insulator that covers the capacitor element. The conductors 102a and 103a of the capacitor 2a protrude in a direction substantially perpendicular to the surface from one surface of the insulator. The conductors 102a and 103a are bent and extended in opposite directions in a direction substantially parallel to the surface at a distance from the surface of the insulator.

  The capacitor 2a is disposed such that the surface from which the conductors 102a and 103a protrude is opposed to a surface substantially parallel to the line AA of the opening. The conductors 102a and 103a are held in the recesses provided in the frame of the bus bar module 20 in the row direction D6. The capacitor 2a is positioned when the conductors 102a and 103a engage with the recesses of the bus bar module 20.

  The pair of semiconductor packages 3 and 4 connected in series is disposed in one opening in the column direction D6 of the capacitor 2a, and the pair of semiconductor packages 5 and 6 connected in series is the other side in the column direction D6 of the capacitor 2a. It is arranged in the opening.

  On one side of the capacitor 2 a in the column direction D 6, the semiconductor package 3 is arranged closer to the capacitor 2 a than the semiconductor package 4. The conductor 102a of the capacitor 2a, the first conductor 104 of the semiconductor package 3, and the second conductor 107 of the semiconductor package 4 are arranged side by side in the column direction D6. The second conductor 105 of the semiconductor package 3 and the first conductor 106 of the semiconductor package 4 are arranged side by side in the column direction D6.

  The first conductor 104 and the second conductor 105 of the semiconductor package 3 are held in a recess provided in the frame of the bus bar module 20. The first conductor 106 and the second conductor 107 of the semiconductor package 4 are held in a recess provided in the frame of the bus bar module 20.

  On the other side of the capacitor 2a in the column direction D6, the semiconductor package 5 is disposed closer to the capacitor 2a than the semiconductor package 6. The conductor 103a of the capacitor 2a, the first conductor 108 of the semiconductor package 5, and the second conductor 111 of the semiconductor package 6 are arranged side by side in the column direction D6. The second conductor 109 of the semiconductor package 5 and the first conductor 110 of the semiconductor package 6 are arranged side by side in the column direction D6.

  The first conductor 108 and the second conductor 109 of the semiconductor package 5 are held in a recess provided in the frame of the bus bar module 20. The first conductor 110 and the second conductor 111 of the semiconductor package 6 are held in a recess provided in the frame of the bus bar module 20.

  A bus bar (not shown) is formed of a conductive material, and electrically connects the first and second conductors 104 to 127 of the plurality of semiconductor packages 3 to 14 and the conductors 102a to 102c and 103a to 103c of the capacitors 2a to 2c. Connect. The bus bar electrically connects the plurality of semiconductor packages 3 to 14 and the capacitors 2a to 2c to the positive terminal 100, the negative terminal 101, the U-phase terminal 128, the V-phase terminal 129, and the W-phase terminal 130. Connect to.

  FIG. 4 is a diagram illustrating an example of an electrical connection structure between a U-phase semiconductor package and a capacitor in the power conversion device according to the embodiment.

  In the power conversion device of this embodiment, the conductors 102a and 103a of the capacitor 2a, the first conductors 104 and 108 of the semiconductor packages 3 and 5 on the upper arm (high potential side), and the lower arm (low potential side). The second conductors 107 and 111 of the semiconductor packages 4 and 6 are arranged on one side in the row direction D5. The second conductors 105 and 109 of the upper arm semiconductor packages 3 and 5 and the first conductors 106 and 110 of the lower arm semiconductor packages 4 and 6 are arranged on the other side in the row direction D5. By arranging as described above, it is possible to suppress an increase in the distance between the conductor connecting capacitor 2a and semiconductor packages 3-6.

  For example, when the semiconductor packages 3 to 6 are arranged along the column direction D6 and the capacitor 2a is arranged at the end of the column direction D6, the distance between the conductors connecting the semiconductor packages 3 and 4 and the capacitor 2a Or the distance of the conductor which connects between the semiconductor packages 5 and 6 and the capacitor | condenser 2a will become long.

  On the other hand, in the present embodiment, the capacitor 2a is disposed between the two pairs of semiconductor packages, and the conductors 104, 107, 108 of the semiconductor packages 3-6 connected to the conductors 102a, 103a of the capacitor 2a. , 111 are arranged side by side in the column direction D6 on one side in the row direction D5. In addition, the conductors 105, 106, 109, and 110 of the semiconductor packages 3 to 6 connected to the load are arranged side by side in the column direction D6 on the other side in the row direction D5.

  Therefore, for example, the first bus bar BB1 that electrically connects the conductor 102a of the capacitor 2a and the first conductors 104 and 108, the conductor 103a, and the second conductor 107, for example, inside the frame of the bus bar module 20. , 111 and the third bus bar BB3 electrically connecting the first conductors 106, 110 and the second conductors 105, 109 are provided, thereby providing the bus bars BB1 to BB1. The U-phase capacitor 2a and the semiconductor packages 3 to 6 can be connected while suppressing an increase in the distance of BB3. These bus bars BB1 to BB3 are insulated from each other, and are, for example, plate-like conductors extending substantially linearly along the column direction D6, and are electrically connected to the conductors 102a and 103a and the conductors 104 to 111. Connect.

  Further, the first bus bar BB1 is electrically connected (or formed integrally) with the positive terminal 100, and the second bus bar BB2 is electrically connected (or formed integrally) with the negative terminal 101, and the third Bus bar BB3 is electrically connected to U-phase terminal 128 (or formed integrally).

  In the above description, the arrangement and the electrical connection structure of the U-phase semiconductor packages 3 to 6 and the capacitor 2a have been described, but the V-phase and the W-phase have the same configuration.

  As described above, in the present embodiment, the pair of semiconductor packages is arranged in a line-symmetric position with respect to the row direction D5 with the arrangement position of the capacitors 2a to 2c as the center. For example, in the present embodiment, for the U phase, the upper arm semiconductor packages 3 and 5 are disposed at a position close to the capacitor 2a, and the lower arm semiconductor packages 4 and 6 are disposed at a position far from the capacitor 2a. The first conductors 104 and 108 of the upper arm semiconductor packages 3 and 5, the second conductors 107 and 111 of the lower arm semiconductor packages 4 and 6, and the conductors 102a and 103a of the capacitor 2a are arranged in the row direction D5. Are arranged side by side in the column direction D6.

  That is, according to the present embodiment, it is possible to suppress an increase in the distance of the conductor between the capacitor 2a and the semiconductor packages 3 to 6. As a result, an increase in inductance of the conductor connecting the capacitor 2a and the semiconductor package is suppressed, and power conversion efficiency can be improved. Further, an increase in surge voltage applied to the DC current supply line is suppressed, and failure of the power conversion device can be avoided.

  Further, by arranging the semiconductor package pair so as to be in a line-symmetrical position with respect to the row direction D5 with the arrangement position of the capacitor 2a as the center, current is biased to one of the two U-phase semiconductor package pairs. Flowing can be avoided.

FIG. 5 is a diagram illustrating an example of a cross section of the power conversion device along line AA illustrated in FIG. 3.
The power conversion device further includes a cooler including a cooling fin plate 24 and a case 26. The cooler supports a plurality of semiconductor packages 3 to 14, capacitors 2 a to 2 c, and a bus bar module 20.

  The case 26 is made of aluminum, for example, and includes a first recess 23A in which the capacitor 2a is accommodated and a second recess 23B that serves as a flow path for the cooling medium. The first recess 23A has a width in the stacking direction D4 larger than that of the second recess 23B. The capacitor 2a is fixed to the first recess 23A by, for example, an adhesive.

  One second recess 23B is provided on each side of the first recess 23A in the column direction D6. The second recess 23 </ b> B is provided with a receiving portion 23 </ b> C that supports the periphery of the cooling fin plate 24.

  The cooling fin plate 24 is made of, for example, aluminum. The cooling fin plate 24 is fixed to the receiving portion 23C and closes the opening of the second recess 23B. The space in the second recess 23 </ b> B closed by the cooling fin plate 24 serves as a cooling medium flow path 25. The surface on the flow channel 25 side of the cooling fin plate 24 has a convex portion extending along the flow direction of the flow channel, and is configured to increase the area in contact with the cooling medium. The surface exposed to the outside of the cooling fin plate 24 is located on substantially the same plane as the upper surface 26 </ b> U of the case 26.

  Semiconductor packages 3 to 6 are disposed on the cooling fin plate 24. An insulator (insulating sheet, adhesive, etc.) not shown is disposed between the cooling fin plate 24 and the semiconductor packages 3 to 6.

  Since the capacitor 2a is larger than the semiconductor packages 3 to 6, the capacitor 2a is fixed to the case 26 at a position lower than the semiconductor packages 3 to 6, thereby avoiding an increase in the size of the power converter.

  A frame of the bus bar module 20 is disposed between the capacitor 2a and the semiconductor packages 3 and 6. Thereby, it is possible to suppress the heat generated by the operation of the semiconductor packages 3 and 6 from being transmitted to the capacitor 2a.

  FIG. 6 is a plan view for explaining a configuration example of a control circuit board in the power conversion device according to the embodiment.

  The control circuit board SB includes a hole HL1 into which the signal terminals 64a to 64e of the semiconductor packages 3 to 14 are inserted, and a screw hole HL2 for screwing to the bus bar module 20.

  The circuit formed on the control circuit board SB and the semiconductor elements in the semiconductor packages 3 to 14 are electrically connected by inserting the tips of the signal terminals 64a to 64e into the holes HL1 and coming into contact therewith. Therefore, the control circuits of the semiconductor packages 3 to 14 are formed around the hole HL1 of the control circuit board SB.

  Here, the control circuit of the semiconductor package 3, 5, 7, 9, 11, 13 of the upper arm and the control circuit of the semiconductor package 4, 6, 8, 10, 12, 14 of the lower arm are insulated from each other. Must be. Therefore, on the control circuit board SB, the area AR1 for forming the control circuit of the upper arm semiconductor packages 3, 5, 7, 9, 11, 13 and the lower arm semiconductor packages 4, 6, 8, 10, 12 are formed. , 14 is required to be insulated from the area AR2 where the control circuits are formed.

  In the present embodiment, the semiconductor packages 3, 5, 7, 9, 11, and 13 of the upper arm are arranged on the center side in the column direction D6, and the semiconductor packages 4, 6, 8, 10, 12, and 14 of the lower arm are They are arranged outside in the column direction D6. For this reason, the control circuit of the semiconductor package 3, 5, 7, 9, 11, 13 of the upper arm is around the hole HL1 into which the signal terminals 64a to 64e of the semiconductor package 3, 5, 7, 9, 11, 13 are inserted. In addition, it can be formed in the area AR2 facing the capacitors 2a to 2c.

  The control circuits of the lower arm semiconductor packages 4, 6, 8, 10, 12, and 14 have signal terminals 64a to 64 of the semiconductor packages 4, 6, 8, 10, 12, and 14 on both sides of the area AR2 in the column direction D6. 64e can be formed in the area AR1 around the hole HL1.

  For example, when the upper arm semiconductor package and the lower arm semiconductor package are alternately arranged along the column direction D6, the areas AR1 and AR2 of the control circuit board SB are alternately provided along the column direction D6. It will be. For this reason, the insulation distance of area AR1 and area AR2 will be provided in the part facing capacitors 2a-2c.

  On the other hand, in the present embodiment, the area AR2 can be provided without being separated in the central portion of the control circuit board SB, so that the area where the control circuit can be mounted can be widened, and the degree of freedom in circuit design is increased. Can be improved.

  In the present embodiment, the example in which the upper arm semiconductor packages 3, 5, 7, 9, 11, and 13 are arranged in the vicinity of the capacitors 2a to 2c has been described. However, the lower arm semiconductor packages 4, 6, and 8 are disposed. 10, 12, 14 may be arranged on both sides of the capacitors 2a to 2c in the column direction D6. Capacitors 2a to 2c are arranged between a pair of semiconductor packages in column direction D6, and the positions of the capacitors 2a to 2c and semiconductor packages 3 to 14 and the direction of the conductor are centered on capacitors 2a to 2c with respect to row direction D5 As long as the line is symmetrical, the same effect can be obtained.

FIG. 7 is a diagram illustrating another example of a cross section of the power conversion device taken along line AA illustrated in FIG. 3.
In the following description, the same components as those in the above-described embodiment are denoted by the same reference numerals and description thereof is omitted.

  In this example, the configuration of the bus bar module 20 and the case 26 is different from the above-described embodiment. That is, in the above-described embodiment, a part of the frame of the bus bar module 20 is disposed between the semiconductor packages 3 and 5 and the capacitor 2a. However, in the example illustrated in FIG. 7, the case 26 has the first recess 23A. A partition wall 27 protruding in the stacking direction D4 is provided between the first recess 23B and the second recess 23B. The partition wall 27 is disposed between the semiconductor packages 3 and 5 and the capacitor 2a. It is desirable that the position of the end where the partition wall 27 extends in the stacking direction D4 is at least lower than the position of the upper surface of the capacitor 2a.

  Even if the partition 27 of the case 26 is disposed between the semiconductor packages 3 and 5 and the capacitor 2a instead of a part of the frame of the bus bar module 20 as in this example, the semiconductor package It is possible to suppress heat from being transmitted from 3, 5 to the capacitor 2a.

FIG. 8 is a diagram illustrating another example of a cross section of the power conversion device taken along line AA illustrated in FIG. 3.
In this example, the configuration of the cooling fin plate 24 is further different from the example shown in FIG. That is, in the example shown in FIG. 8, the cooling fin plate 24 further includes a partition wall 24 </ b> A extending between the semiconductor packages 3, 5 of the upper arm and the semiconductor packages 4, 6 of the lower arm. Thus, by further providing the partition 24A of the cooling fin plate 24, the cooling performance of the semiconductor packages 3 to 6 can be further improved.

FIG. 9 is a diagram illustrating another example of the cross section of the power conversion device taken along line AA illustrated in FIG. 3.
In this example, the curing temperature of the adhesive 29 for fixing the semiconductor packages 3 to 6 and the adhesive 30 for fixing the capacitor 2a are different. For example, when the heat resistance temperature of the capacitor 2a is lower than that of the semiconductor packages 3 to 6, if the same adhesive as the adhesive 29 used for fixing the semiconductor packages 3 to 6 is used as the adhesive 30, the capacitor 2a becomes higher than the heat resistance temperature. It is thought to cause a malfunction. Therefore, it is desirable that the adhesive 30 for fixing the capacitor 2a is one having a lower curing temperature than the adhesive 29 used for fixing the semiconductor packages 3-6. This makes it possible to provide a more reliable power conversion device and electric vehicle.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 1 ... DC power supply, 2a-2c ... Capacitor, 3-14 ... Semiconductor package, 15 ... Motor, 20 ... Busbar module, 21 ... Fixed part, 23A ... 1st recessed part, 23B ... 2nd recessed part, 23C ... Receiving part, 24 ... cooling fin plate, 24A ... partition wall, 26 ... case, 27 ... partition wall, 100 ... positive electrode terminal, 101 ... negative electrode terminal, 102a-102c ... conductor (electrode terminal), 103a-103c ... conductor (electrode terminal), 104 ˜127: Conductor (emitter terminal, collector terminal) D5: Row direction (second direction), D6: Column direction (first direction), SB: Control circuit board.

Claims (7)

A first switch pair including a first switch and a second switch electrically connected in series with the first switch;
A second switch pair including a third switch and a fourth switch electrically connected in series with the third switch;
A capacitor that is electrically connected in parallel with the first switch pair and the second switch pair and disposed between the first switch pair and the second switch pair in a first direction;
The collector terminals of the first switch and the third switch, the emitter terminals of the second switch and the fourth switch, and the electrode terminal of the capacitor are on one side in a second direction substantially orthogonal to the first direction. And arranged side by side in the first direction,
The emitter terminals of the first switch and the third switch and the collector terminals of the second switch and the fourth switch are arranged side by side in the first direction on the other side in the second direction. The power converter characterized by this. The first switch is disposed closer to the capacitor in the first direction than the second switch, and the third switch is disposed closer to the capacitor in the first direction than the fourth switch. Or
The second switch is disposed closer to the capacitor in the first direction than the first switch, and the fourth switch is disposed closer to the capacitor in the first direction than the third switch. The power converter according to claim 1, wherein:   A frame including an opening in which the first switch pair is disposed, an opening in which the capacitor is disposed, and an opening in which the second switch pair is disposed; and the emitter terminal, the collector terminal, The power converter according to claim 1, further comprising: a bus bar module having a bus bar that electrically connects the electrode terminal. A cooler that supports the first switch pair, the second switch pair, and the capacitor and includes a cooling medium flow path therein;
The power converter according to any one of claims 1 to 3, wherein the cooler includes a concave portion that accommodates the capacitor.   The power converter according to claim 4, wherein the cooler further includes partition walls provided on both sides of the capacitor in the first direction.   The cooler further includes a partition wall provided between the first switch and the second switch and between the third switch and the fourth switch in the first direction. The power converter according to claim 4 or 5, characterized by the above-mentioned. The power conversion device according to any one of claims 1 to 6,
A DC power source in which the collector terminal and the positive electrode of the first switch and the third switch are electrically connected, and the emitter terminal and the negative electrode of the second switch and the fourth switch are electrically connected;
A motor electrically connected to a series connection point of the first switch and the second switch, and a series connection point of the third switch and the fourth switch;
An electric vehicle comprising: an axle that transmits power of the motor to wheels.

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