JP2015127078A - Processing method and processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To process hard-to-process material with high accuracy and high efficiency.SOLUTION: An active species generated by irradiating water, hydrogen peroxide water, ozone water, or a solvent comprising any one of them with ultraviolet light or the like is used to promote a chemical reaction with a processed matter surface and to process a processed surface with high accuracy.

Description

  The present invention relates to a processing method and a processing apparatus. Specifically, the present invention relates to a processing method capable of processing a difficult-to-work material such as SiC, GaN, and diamond with high efficiency and high accuracy, and a processing apparatus capable of realizing such a processing method.

  Mechanical processing has been used in various scenes since ancient times. For example, in mechanical polishing, a tool is pressed against a surface to be processed, and a part of the surface is removed by mechanical action.

  However, in such mechanical polishing processing, defects occur in the crystal lattice of the object, and it is very difficult to obtain a highly accurate surface. Therefore, a chemical processing method is used to perform highly accurate processing.

  For example, by flowing a suspension in which ultrafine powder is dispersed along the work surface, the ultrafine powder comes into contact with the work surface under almost no load, and the work is performed by the interaction at that time. Processing by so-called EEM (Elastic Emission Machining) for processing a surface is already known (Patent Documents 1 to 4).

  Further, plasma CVM (Chemical Vaporization Machining) is proposed which uses a radical reaction between a neutral radical based on a reaction gas and an atom or molecule on a surface to be processed (Patent Document 5).

  Furthermore, a high-efficiency machining method using a high-density radical reaction using a rotating electrode that forms a gas flow across the machining gap by rotating the rotating electrode at a high speed to entrain gas on the surface of the rotating electrode is proposed. (Patent Document 6).

  The aforementioned EEM and plasma CVM are very excellent as chemical processing. The EEM can obtain a smooth surface on an atomic scale, and the plasma CVM can perform highly efficient processing comparable to mechanical processing with high accuracy.

EEM can obtain a very smooth surface with respect to high-frequency spatial wavelengths. EEM is characterized in that fine particles such as SiO ₂ are supplied to the surface with ultrapure water, and the processing proceeds by the atoms on the surface of the fine particles and the atoms on the surface of the workpiece being chemically bonded. However, the EEM is difficult to flatten the spatial wavelength region of several tens of μm or more because of its processing principle.

  Further, plasma CVM processing utilizes a chemical reaction between neutral radicals in the plasma and the workpiece surface. Processing is performed by generating high-density plasma in a high-pressure atmosphere of 1 atm, causing neutral radicals generated in the plasma to act on atoms on the surface of the workpiece, and changing them into volatile substances.

  Therefore, plasma CVM machining has machining efficiency comparable to conventional machining without disturbing the atomic arrangement of the work surface. However, since the processing method does not have a reference surface, it is easily affected by the index surface.

  Under these circumstances, there are processing methods that attempt high-precision and high-efficiency processing of difficult-to-work products. For example, a catalyst-assisted chemical processing method described in Patent Document 7 has been proposed.

  Here, Patent Document 7 has a strong oxidizing power generated on a catalyst surface by arranging a workpiece in an oxidant solution and bringing a catalyst made of a transition metal into contact with or in close proximity to the workpiece surface. A method of processing a workpiece by removing or eluting a compound generated by a chemical reaction between an active species and a surface atom of the workpiece is described.

In Patent Document 7, as an embodiment, the catalyst to Fe, that it uses hydrogen peroxide (H 2 _{O 2)} is disclosed in oxidizing agent.

  In this case, on the Fe surface, OH radicals (hydroxy radicals) are generated as active species by the Fenton reaction represented by the following [Chemical Formula 1] and [Chemical Formula 2]. The OH radical (shown with a dot on the right side of OH) has a short life but has a very strong oxidizing power.

(Chemical formula 1)
Fe ²⁺ + H ₂ O ₂ → Fe ³⁺ + ОH ⁻ + ОH
(Chemical formula 2)
Fe ³⁺ + H ₂ O ₂ → Fe ²⁺ + 2OOOH ⁻

In general, it is known that OH radicals are produced by the decomposition of H ₂ O ₂ by the Harbor-Wais mechanism. In this reaction, OH radicals are generated by one-electron reduction with low-valent transition metals (Fe ²⁺ , Ti ³⁺ , Cr ²⁺ , Cu ^+, etc.).

In particular, the reaction with Fe ²⁺ is well known as the Fenton reaction. H ₂ O ₂ reacts with a low-valent metal ion capable of performing a redox reaction to generate an OH radical. Here, Fe ²⁺ acts as a catalyst.

  Here, when the workpiece is SiC, as shown in the following [Chemical Formula 3], the SiC surface is oxidized by the dissolved oxygen in the OH radical and hydrogen peroxide water, and the portion is processed preferentially. Presumed to be.

(Chemical formula 3)
SiC + 4OH ・ + О ₂ → SiO ₂ + 2H ₂ O + CO ₂ ↑

Japanese Patent Publication No. 2-25745 Japanese Patent Publication No. 7-16870 Japanese Patent Publication No. 6-44989 JP 2000-167770 A Japanese Patent No. 2962583 Japanese Patent No. 3069271 Japanese Patent No. 4873694

  Here, the processing method described in Patent Document 7 can also process difficult-to-work materials such as SiC, but further improvement in processing accuracy and processing efficiency for difficult-to-work materials is required. For example, in the field of semiconductor substrates using difficult-to-work products, a more accurate processing method is required from the viewpoint of miniaturization of the substrate size, quality improvement, and the like.

  The present invention has been invented in view of the above points, and provides a processing method capable of processing difficult-to-work products such as SiC, GaN, and diamond with high efficiency and high accuracy, and a processing apparatus capable of realizing such a processing method. The purpose is to provide.

[About processing methods]
In order to achieve the above object, the processing method of the present invention uses a catalyst made of a transition metal or a metal oxide on the processing reference surface, and water, hydrogen peroxide water, ozone water, or a solvent containing any of these. The workpiece surface is disposed in a state where at least a part of the workpiece is disposed on the substrate, and the solvent is irradiated with ultraviolet light or plasma, and the machining reference surface is in contact with or in close proximity to the workpiece surface of the workpiece. And a step of relatively moving the processing reference surface.

  Here, by irradiation with ultraviolet light or plasma, water, hydrogen peroxide water, ozone water, or a solvent containing any of these is decomposed to generate active species. Further, when the decomposition of the solvent continues, the active species in the solvent become excessive, and the active species are recombined to generate hydrogen peroxide. And by using the catalyst which consists of a transition metal or a metal oxide for a process reference surface, hydrogen peroxide and a catalyst react and an active seed | species generate | occur | produces on a catalyst surface again. In addition, water here means the thing containing ultrapure water and electrolyzed water.

  Also, by placing at least a part of the work piece in the solvent and moving the work surface and the work reference surface relative to each other with the work reference surface in contact with or in close proximity to the work surface of the work piece A compound is formed by a chemical reaction between the active species having strong oxidizing power generated on the catalyst surface and the surface atoms of the workpiece. The workpiece can be processed by removing the generated compound by relative motion.

  In the present invention, the active species can be generated excessively by irradiating water, hydrogen peroxide solution, ozone water, or a solvent containing any of these with ultraviolet light or plasma. The efficiency of processing using a catalyst can be increased. In addition, even when a compound that causes a chemical reaction directly with the catalyst, such as hydrogen peroxide, is not included in the solvent at the start of processing, active species and hydrogen peroxide are generated by irradiation with ultraviolet light or plasma. Can be processed.

  Further, since the processing member has the processing reference surface, the processing surface does not change as processing proceeds, and uniform processing can be performed.

  Further, examples of the transition metal used for the processing reference surface include Fe, Ni, Co, Cu, Cr, and Ti. Moreover, as a metal oxide used for a process reference surface, the oxide of a transition metal is mentioned, for example.

  Examples of the solvent include water, hydrogen peroxide water, ultrapure water, and ozone water. Examples of the workpiece include silicon carbide, silicon nitride, GaN, diamond, sapphire, ruby, and AIN.

  In order to achieve the above object, the processing method of the present invention uses a catalyst made of a transition metal or a metal oxide on a processing reference surface, and at least a part of the workpiece is placed in a solvent capable of generating active species. And irradiating the solvent with ultraviolet light or plasma, and relatively moving the work surface and the work reference surface with the work reference surface in contact with or in close proximity to the work surface of the work piece. A process is provided.

  Here, the solvent capable of generating active species is decomposed by irradiation with ultraviolet light or plasma, and active species are generated. And the chemical reaction through the catalyst which consists of a transition metal or a metal oxide originates in the produced | generated active species, and the workpiece can be processed.

  In the present invention, the active species can be generated excessively by irradiating the solvent capable of generating the active species with ultraviolet light or plasma, so that the reaction of the active species and the processing efficiency using the catalyst can be improved. it can. In addition, even when a compound that causes a chemical reaction directly with the catalyst, such as hydrogen peroxide, is not included in the solvent at the start of processing, active species can be generated by irradiation with ultraviolet light or plasma. Therefore, processing becomes possible.

  Further, since the processing member has the processing reference surface, the processing surface does not change as processing proceeds, and uniform processing can be performed.

  Examples of the solvent include water, hydrogen peroxide solution, ozone water, or a solution containing these.

[About processing equipment]
In order to achieve the above object, a processing apparatus according to the present invention has a processing reference surface including a catalyst made of a transition metal or a metal oxide on the surface, and is a rotatable processing member, and the processing member A rotation mechanism that is eccentric with respect to the rotation axis of the workpiece, is rotatable, and can hold a predetermined workpiece, and the processing member and the holding mechanism can be disposed on the inside. A processing tank that is filled with hydrogen water, ozone water, or a solvent containing any of these, a processing unit that irradiates the solvent with ultraviolet light or plasma, and the processing reference surface that covers the workpiece in the processing tank. A driving unit that relatively displaces the surface to be processed and the processing reference surface in a state of being in contact with or in close proximity to the processing surface;

  Here, the solvent in the processing tank is decomposed by a processing tank filled with water, hydrogen peroxide water, ozone water, or a solvent containing any of these, and a processing unit that irradiates the solvent with ultraviolet light or plasma. Can do. That is, water, hydrogen peroxide solution, ozone water, or a solvent containing any of these is decomposed to generate active species. Further, when the decomposition of the solvent continues, the active species in the solvent become excessive, and the active species are recombined to generate hydrogen peroxide. In addition, water here means the thing containing ultrapure water and electrolyzed water.

  Further, a processing member having a processing reference surface including a catalyst made of a transition metal or a metal oxide on the surface, a processing member and a holding mechanism can be arranged inside, and water, hydrogen peroxide water, ozone water, or these By the processing tank filled with the solvent containing any of them, the hydrogen peroxide generated in the solvent and the catalyst can be reacted. That is, the hydrogen peroxide and the catalyst react to generate active species on the catalyst surface again.

  In addition, the processing member and the holding mechanism can be arranged inside, a processing tank filled with water, hydrogen peroxide water, ozone water, or a solvent containing any of these, and a processing reference surface to be processed in the processing tank Processing by a chemical reaction can be performed on the processing surface by a driving unit that relatively displaces the processing surface and the processing reference surface in contact with or in close proximity to the processing surface of the object. That is, a compound is generated by a chemical reaction between the active species having a strong oxidizing power generated on the catalyst surface and the surface atoms of the workpiece. The workpiece can be processed by removing the generated compound by relative motion.

  In the present invention, the active species can be generated in excess in the solvent by irradiating water, hydrogen peroxide solution, ozone water, or a solvent containing any of these with ultraviolet light or plasma. It is possible to increase the efficiency of processing using the reaction and catalyst. In addition, even when a compound that causes a chemical reaction directly with the catalyst, such as hydrogen peroxide, is not included in the solvent at the start of processing, active species can be generated by irradiation with ultraviolet light or plasma. Therefore, processing becomes possible.

  Further, since the processing member has the processing reference surface, the processing surface does not change as processing proceeds, and uniform processing can be performed.

  Further, examples of the transition metal used for the processing reference surface include Fe, Ni, Co, Cu, Cr, and Ti. Moreover, as a metal oxide used for a process reference surface, the oxide of a transition metal is mentioned, for example.

  Moreover, as a solvent, water, hydrogen peroxide solution, ozone water, potassium hydroxide aqueous solution is mentioned, for example. Examples of the workpiece include silicon carbide, silicon nitride, GaN, diamond, sapphire, ruby, and AIN.

  The processing method and the processing apparatus according to the present invention are a processing method capable of processing a difficult-to-work material such as SiC, GaN, and diamond with high efficiency and high accuracy, and a processing apparatus capable of realizing such a processing method.

It is a conceptual diagram of the processing apparatus to which this invention is applied. It is the result of having measured the surface roughness before the process of the Example of this invention with the non-contact shape measuring machine. It is the result of having measured the surface roughness after the process of the Example of this invention with the non-contact shape measuring machine. It is a graph which shows the result of the processing efficiency of the Example and comparative example of this invention.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 to 3 in order to understand the present invention.

Embodiment
FIG. 1 is a conceptual diagram of a processing apparatus to which the present invention is applied. The processing apparatus 1 shown here includes a pure iron surface plate 2, an ultraviolet light source 3, a sample holder 4 holding a diamond substrate 8, and pure iron. It has a processing tank 9 in which the surface plate 2 and the sample holder 4 are arranged. The inside of the processing tank 9 is filled with the hydrogen peroxide solution 7.

  Moreover, the rotating shaft 6 provided in the center part of the processing tank 9 is connected with a motor (not shown), and the pure iron surface plate 2 is integrated with the processing tank 9 and is denoted by reference symbol A in FIG. It is configured to be rotatable in the direction shown.

  Further, the sample holder 4 has a rotating shaft 5 that is eccentric with respect to the rotating shaft 6 of the pure iron surface plate 2, and is configured to be rotatable about the rotating shaft 5 in the direction indicated by the symbol B in FIG. . Further, the sample holder 4 is lowered from above while holding the diamond substrate 8 to a position where the diamond substrate 8 and the pure iron surface plate 2 are in contact or in close proximity.

  Here, the pure iron surface plate 2 is an example of a processing member, the ultraviolet light source 3 is an example of a processing unit, the diamond substrate 8 is an example of a workpiece, and the sample holder 4 is an example of a holding mechanism. The motor is a part of the drive unit, and the wavelength of 189 nm or less emitted from the ultraviolet light source 3 is an example of ultraviolet light.

  In the present embodiment, the case where the processed member is made of pure iron is described as an example, but it is not always necessary to be made of pure iron. It is sufficient if it can react with hydrogen peroxide water to generate OH radicals which are active species, and may be formed of, for example, Ni, Co, Cu, Cr, Ti or the like. Moreover, the oxide of a transition metal may be sufficient.

In the present embodiment, the diamond substrate 8 is described as an example of the workpiece held by the sample holder 4, but the workpiece is not limited to the diamond substrate 8. For example, diamond-related materials (polycrystalline diamond, CVD diamond, DLC film), and hard and brittle materials such as SiC, GaN, sapphire, SiC ceramics, Si ₃ N ₄ ceramics, AIN, and glass can be used as the workpiece.

  In this embodiment, the hydrogen peroxide solution 7 is described as an example of the solvent. However, the solvent is not limited to the hydrogen peroxide solution 7, and irradiation with ultraviolet light or plasma is performed. It is sufficient if it generates OH radicals. For example, ultrapure water, ozone water, or the like can be used.

  Moreover, the position of the ultraviolet light source 3 that irradiates the solvent with ultraviolet light is sufficient as long as the OH radical is generated in the solvent.

  Hereinafter, the processing method by the processing apparatus 1 configured as described above will be described. That is, an example of a processing method to which the present invention is applied will be described.

  First, the inside of the processing tank 9 in which the pure iron surface plate 2 is arranged is filled with the hydrogen peroxide solution 7. Then, the diamond substrate 8 held on the sample holder 4 is brought into contact with the processing reference surface of the pure iron surface plate 2 while irradiating the hydrogen peroxide solution 7 with the ultraviolet light source 3.

When the hydrogen peroxide solution 7 is irradiated with ultraviolet light from the ultraviolet light source 3, OH radicals are generated by the decomposition of water molecules as shown in [Chemical Formula 4]. Further, when excessive OH radicals are generated in the solvent as a result of irradiation with ultraviolet light, the OH radicals are recombined and hydrogen peroxide (H ₂ O ₂ ) is generated as shown in [Chemical Formula 5]. That is, hydrogen peroxide is generated from water molecules in addition to the hydrogen peroxide solution 7 at the start of processing.

(Chemical formula 4)
H ₂ O + hν → ОH · + H · (h: Planck constant, ν: frequency of light)
(Chemical formula 5)
2OH · → H ₂ O ₂

  When the pure iron surface plate 2 using Fe as a catalyst is brought into contact with or in close proximity to the diamond substrate 8 in a solvent containing the generated hydrogen peroxide, OH radicals are generated as described in [Chemical Formula 1]. Occur. The OH radical reacts with surface atoms of the diamond substrate 8 to modify the diamond surface.

  Here, while rotating the pure iron surface plate 2 and the sample holder 4, the diamond substrate 8 held by the sample holder 4 is pressed against the pure iron surface plate 2 with a predetermined pressing force. As a result, relative movement occurs between the machining reference surface and the work surface.

  Further, since the pure iron surface plate 2 and the sample holder 4 are relatively moved, the catalyst is separated from the surface of the diamond substrate 8 and the modified layer is removed from the surface to be processed of the diamond substrate 8. The surface to be processed of the diamond substrate 8 is processed by the flow up to this point.

[Modification]
As a modification of the present embodiment, ultrapure water can be used as a solvent. That is, it is possible to perform processing with only the solvent replaced with ultrapure water and the other conditions being the same as in the embodiment.

  In the modified example, the ultrapure water can be irradiated with ultraviolet light to generate excess OH radicals and generate hydrogen peroxide. Therefore, even if the solvent does not contain hydrogen peroxide in advance, the workpiece can be processed by the catalytic reaction.

  Further, the modified method has an advantage in that the burden on the environment can be suppressed because the amount of chemical substances used for processing can be reduced.

〔effect〕
In the processing apparatus 1 to which the present invention is applied, the pure iron surface plate 2 and the sample holder 4 move relative to each other, so that the generated OH radicals chemically react with the surface atoms of the workpiece to remove the generated compounds. be able to.

  In addition, since the generated OH radicals chemically react with the surface atoms of the work piece, it can be removed by the relative movement of the pure iron surface plate 2 and the sample holder 4, so that a new work piece can be obtained at any time. Surfaces will appear and processing will be easier to proceed.

  Moreover, in the processing apparatus 1 to which the present invention is applied, OH radicals can be generated excessively in the solvent and hydrogen peroxide can be generated, so that the efficiency of processing using the reaction of OH radicals and a catalyst can be improved. it can.

  In addition, since the OH radicals generated on the catalyst surface are inactivated rapidly when they are separated from the catalyst surface, the OH radicals are present only on the catalyst surface as a reference surface or in a very close position, thereby spatially Can be processed in a controlled state.

  Further, the OH radical generated by irradiating the hydrogen peroxide solution 7 with ultraviolet light removes chemical contamination (organic contaminants) on the surface of the hydrogen peroxide solution 7 and the pure iron surface plate 2, and the surface of the diamond substrate 8. The chemical reaction can be stabilized. As a result, the surface of the diamond substrate 8 can be processed with high accuracy.

  Further, since the polishing method is not necessary in the processing method to which the present invention is applied, the cost can be greatly suppressed.

Examples of the present invention and comparative examples will be described below with reference to FIGS. In addition, the Example and comparative example which are shown here are examples, and do not limit this invention.
FIG. 2 shows the results of measuring the surface roughness before and after processing of the example of the present invention with a non-contact shape measuring machine.

[Example 1]
First, the processing method of Example 1 of this invention is demonstrated.
Single crystal diamond as a work piece was pressed against a nickel surface plate, which is a transition metal, with a load of 3.3 Mpa, the nickel surface plate was rotated at 40 rpm, and the sample holder was rotated at 40 rpm. Further, hydrogen peroxide water was used as the solvent, and the solvent was irradiated with ultraviolet light as shown in FIG.

  Processing for 14 hours was performed in such a situation, and the surface roughness of Example 1 was confirmed. The surface roughness data before and after processing is shown in FIG.

  As a result, as shown in FIG. 2, the processed surface roughness of the processed surface is in a good state (PV: 1.713 nm, rms: 0.162 nm, Ra: 0.129 nm).

Next, the processing method of an Example and a comparative example was performed, and the processing efficiency of the workpiece was confirmed. Note that Example 2 described below is the same method as Example 1 described above.
FIG. 3 is a graph showing the results of processing efficiency of examples of the present invention and comparative examples.

[Example 2]
First, the processing method of Example 2 of the present invention will be described.
Single crystal diamond as a work piece was pressed against a nickel surface plate, which is a transition metal, with a load of 3.3 Mpa, the nickel surface plate was rotated at 40 rpm, and the sample holder was rotated at 40 rpm. Also, ultrapure water was used as the solvent, and the solvent was irradiated with ultraviolet light as shown in FIG. Processing for 14 hours was performed in such a situation.

[Comparative Example 1]
In Comparative Example 1, single crystal diamond as a workpiece was pressed against a nickel surface plate with a load of 3.3 Mpa, the nickel surface plate was rotated at 40 rpm, and the sample holder was rotated at 40 rpm. Further, hydrogen peroxide water was used as the solvent. In addition, unlike Example 1 and Example 2, ultraviolet light irradiation was not performed with respect to the solvent.

[Comparative Example 2]
In Comparative Example 2, single crystal diamond as a workpiece was pressed against a nickel surface plate with a load of 3.3 Mpa, the nickel surface plate was rotated at 40 rpm, and the sample holder was rotated at 40 rpm. Moreover, ultrapure water was used as the solvent. In addition, unlike Example 1 and Example 2, ultraviolet light irradiation was not performed with respect to the solvent.

  The processing conditions of Example 1, Example 2, Comparative Example 1 and Comparative Example 2 are shown in Table 1 below.

  The result of the processing efficiency in the processing method of Example 1, Example 2, the comparative example 1, and the comparative example 2 comprised as mentioned above is shown in FIG.

  As shown in FIG. 3, in Example 1 shown by the code | symbol 10, it was 41.0 nm / h processing efficiency. Moreover, in the comparative example 1 shown with the code | symbol 11, it was 31.0 nm / h processing efficiency. As a result, in the method using hydrogen peroxide as the solvent, the processing efficiency was improved in Example 1 in which ultraviolet light was irradiated.

  Moreover, in Example 2 shown with the code | symbol 12, it was 17.6 nm / h processing efficiency. Moreover, in the comparative example 2 shown with the code | symbol 13, it was 11.8 nm / h processing efficiency. As a result, in the method using ultrapure water as the solvent, the processing efficiency was improved in Example 2 in which ultraviolet light was irradiated.

  From the results shown in FIG. 3, regardless of whether hydrogen peroxide water or ultrapure water is used as the solvent, the processing is performed while irradiating ultraviolet light, but the processing is performed without irradiating ultraviolet light. Even the machining efficiency was improved.

The processing apparatus and processing method to which the present invention is applied have been described so far. In the processing method of the present invention, ozone (O ₃ ) and oxygen (O ₂ ) are added in the form of microbubbles to the solvent. Methods can also be employed.

  In this case, as shown in [Chemical Formula 6] to [Chemical Formula 8], the OH radical generation reaction is further promoted in the solvent, and hydrogen peroxide water in which the OH radicals are recombined can be generated. That is, the efficiency of processing with a catalyst can be further increased.

(Chemical formula 6)
^{_{О 3 + hν → О (1}} D, 3 P) + О 2 (O (1 D): an oxygen atom of the first excited state, ^{O (3} P): an oxygen atom in the ground state)
(Chemical formula 7)
О ₂ + hν → О ( ¹ D) + О ( ³ P)
(Chemical formula 8)
_{^{О (1 D) + H 2}} О → 2ОH ·

  As described above, according to the present invention, it is possible to provide a processing method capable of processing a difficult-to-work product such as SiC, GaN, and diamond with high efficiency and high accuracy, and a processing apparatus capable of realizing such a processing method.

DESCRIPTION OF SYMBOLS 1 Processing apparatus 2 Pure iron surface plate 3 Ultraviolet light source 4 Sample holder 5 Rotating shaft 6 Rotating shaft 7 Hydrogen peroxide solution 8 Diamond substrate 9 Processing tank

Claims (10)

A catalyst comprising a transition metal or a metal oxide is used as a processing reference surface, and at least a part of the workpiece is disposed in water, hydrogen peroxide water, ozone water, or a solvent containing any of these, and the solvent A method of irradiating the workpiece with the ultraviolet light or plasma and relatively moving the workpiece reference surface with the workpiece reference surface in a state where the workpiece reference surface is in contact with or in close proximity to the workpiece reference surface. . The processing method according to claim 1, wherein the transition metal is made of one or a combination of two or more selected from Fe, Ni, Co, Cu, Cr, and Ti. The processing method according to claim 1, wherein the metal oxide is an oxide of a transition metal. The processing method according to claim 1, 2 or 3, wherein the solvent comprises one or a combination of two or more selected from water, hydrogen peroxide water, ultrapure water, and ozone water. The processing method according to claim 1, claim 2, claim 3, or claim 4, wherein the workpiece is made of any one of silicon carbide, silicon nitride, GaN, diamond, sapphire, ruby, and AIN. The solvent is supplied between a flat rotating surface plate serving as the processing reference surface and a processing surface of a workpiece held by a holder having a rotation axis that is eccentric with respect to the rotation axis of the rotation surface plate. ,
The relative movement is a movement of rotating the workpiece held by the holder while pressing the workpiece against the rotating surface plate with a predetermined pressing force. 5. The processing method according to 5. The processing method according to claim 1, claim 2, claim 3, claim 4, claim 5, or claim 6, wherein the transition metal is Fe and is processed using a Fenton reaction. Irradiation with ultraviolet light or plasma in a state where at least one of oxygen and ozone is supplied to the solvent. Claims 1, 2, 3, 4 and 5, Claim 6, Claim 7 The processing method as described in. Using a catalyst made of a transition metal or metal oxide on the processing reference surface, arranging at least a part of the workpiece in a solvent capable of generating active species, irradiating the solvent with ultraviolet light or plasma, A processing method comprising a step of relatively moving the processing surface and the processing reference surface in a state where the processing reference surface is in contact with or in close proximity to the processing surface of the workpiece. A processing member having a processing reference surface including a catalyst made of a transition metal or a metal oxide on its surface and being rotatable;
A holding mechanism for holding a predetermined workpiece while being rotatable and having a rotating shaft eccentric with respect to the rotating shaft of the processing member;
The processing member and the holding mechanism can be arranged inside, a processing tank for filling water, hydrogen peroxide water, ozone water, or a solvent containing any of these,
A processing unit for irradiating the solvent with ultraviolet light or plasma;
A processing apparatus comprising: a drive unit that relatively displaces the processing surface and the processing reference surface in a state where the processing reference surface is in contact with or in close proximity to the processing surface of the workpiece in the processing tank.

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