JP2015109758A - Manufacturing method of electric power conversion device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the productivity in a manufacturing of a passage formation body for storing a power semiconductor module used in an electric power conversion device.SOLUTION: An electric power conversion device includes: a power semiconductor module which converts a direct current into an alternating current; a passage formation body which forms a storage space for storing the power semiconductor module; and a pipeline which introduces a cooling refrigerant into the storage space. A manufacturing method of the electric power conversion device according the invention includes: a first step where the pipeline is held in a mold in a state where an opening part of the pipeline is closed by a lid material; a second step where a material of the passage formation body is injected into the mold so as to cover the lid material and thereby forms the passage formation body; and a third step where a part of the material of the passage formation body covering the lid material and the lid material are cut to form the storage space connected with an inner space of the pipeline.

Description

  The present invention relates to a method for manufacturing a power converter, and more particularly, to a method for manufacturing a power converter suitable for being mounted on a vehicle.

  In a power converter equipped with a three-phase inverter circuit, it was difficult to mold with a core when molding a water channel for cooling a power semiconductor module, so it was necessary to seal the water channel lid, mounting screws, and water channel lid. Therefore, it is necessary to reduce the number of parts.

  In other words, when forming the flow path for cooling the power semiconductor module, it was difficult to form with a core, so the water channel was covered with a lid. For this reason, there has been a problem that manufacturing costs (lids, screws, assembly man-hours, lid sealing surface cutting, lid sealing, etc.) are expensive.

JP 2012-5323 A

  The subject of this invention is improving the productivity at the time of manufacturing the flow-path formation body which accommodates the power semiconductor module used for a power converter device.

  Another object of the present invention is to reduce the number of parts of the power converter and reduce the cost.

  A method for manufacturing a power conversion device according to the present invention that solves the above problems includes a power semiconductor module that converts a direct current into an alternating current, a flow path forming body that forms a storage space for storing the power semiconductor module, and the storage A power conversion device manufacturing method comprising: a pipe for introducing a cooling refrigerant into a space, wherein the pipe is held in a mold in a state where an opening of the pipe is closed by a lid member. A second step of forming the flow path forming body by injecting a material of the flow path forming body into the mold so as to cover the lid material, and the flow path forming body covering the lid material. And a third step of forming the storage space connected to the internal space of the pipe by cutting a part of the material and the lid material.

  According to the present invention, the productivity of a power converter can be improved.

  Further, according to the present invention, the cost of the power conversion device can be reduced.

The state figure of only the flow path 19 of the flow path formation body of a power converter device. The flow-path molded object 900 figure of an electric power converter. The piping diagram inserted in a power converter device. The manufacturing 1st process drawing of the flow-path molded object 900 of a power converter device. The manufacturing 2nd process drawing of the flow-path molded object 900 of an electric power converter. The figure which removed the bases 911-914 for the piping holding | maintenance of FIG. 4B. The cast drawing of the power semiconductor module accommodating part after manufacture 2nd process of the flow-path molded object 900 of a power converter device. The 5th manufacturing process drawing of the flow-path molded object 900 of a power converter device. The external view with which the power semiconductor modules 300U-300W were mounted | worn with the flow-path molded object 900 of the power converter device. The figure which shows a power semiconductor module single-piece | unit. The figure which carried out the horizontal cross section of the flow-path formation body 900 in which the power semiconductor modules 300U-300W are arrange | positioned. FIG. 5 is a cross-sectional view of a flow path forming body 900 in which a power semiconductor module 300U is disposed, perpendicularly to a flow path 19; FIG. 5 is a cross-sectional view of a flow path forming body 900 in which a power semiconductor module 300V is disposed, perpendicularly to a flow path 19;

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

  FIG. 1 is a state diagram of only the flow path 19 of the flow path forming body 900 (see FIG. 2) of the power conversion device according to the embodiment of the present invention. The first storage space 915 of the power semiconductor module 300U mounted on the flow path forming body 900 exists between the pipe 901 and the pipe 902. The appearance of the power semiconductor module 300U is described in FIG. The power semiconductor module 300V and the power semiconductor module 300W have the same configuration as the power semiconductor module 300U.

  The second storage space 916 of the power semiconductor module 300V mounted on the flow path forming body 900 exists between the pipe 902 and the pipe 903. The third storage space 917 of the power semiconductor module 300W mounted on the flow path forming body 900 exists between the pipe 903 and the pipe 904.

  The first arrangement direction of the pipe 901 and the first storage space 915 and the second arrangement direction of the pipe 904 and the third storage space 917 are parallel to each other. The arrangement direction of the pipe 902, the second storage space 916, and the pipe 903 crosses the first arrangement direction and the second arrangement direction. That is, the entire flow path 19 has a U-shape due to the pipe 901, the first storage space 915, and the like.

  FIG. 2 is a top perspective view and a bottom perspective view of the flow path molded body 900 of the power converter as viewed from the arrow A. FIG. In addition, as for the flow-path molded object 900 of this embodiment, an outer surface will form the outer surface of power converter device itself, and the flow-path molded object 900 serves as a housing | casing.

  FIG. 3 is a perspective view showing pipes 901 to 904 inserted into the flow path forming body 900.

  The pipe 901 forms a first opening on the side close to the first storage space 915 (see FIG. 1), and the first opening is closed by the lid member 905.

  The pipe 902 forms a second opening on the side close to the first storage space 915 (see FIG. 1), and the second opening is closed by the lid member 906. The pipe 902 forms a third opening on the side close to the second storage space 916 (see FIG. 1), and the third opening is closed by the lid member 907.

  The pipe 903 forms a fourth opening on the side close to the second storage space 916 (see FIG. 1), and the fourth opening is closed by the lid member 908. Further, the pipe 903 forms a fifth opening on the side close to the third storage space 917 (see FIG. 1), and the fifth opening is closed by the lid member 909.

  The pipe 904 forms a sixth opening on the side close to the third storage space 917 (see FIG. 1), and the sixth opening is closed by the lid member 910.

  4A to 4E show a manufacturing process of the flow path forming body 900 and the pipes 901 to 904.

  FIG. 4A is a first process diagram. In the first step, the pipe 901 is held by a table 911 that is held in the mold, and is arranged at a place excluding the first storage space 915. The pipe 902 is held by a table 912 that is held in the mold, and is disposed at a place excluding the first storage space 915 and the second storage space 916. The pipe 903 is held by a table 913 that is held in the mold, and is disposed at a place excluding the second storage space 916 and the third storage space 917. The pipe 904 is held by a table 914 that is held in the mold, and is disposed at a place excluding the third storage space 917.

  FIG. 4B shows a second process diagram, and is a top view and a bottom view of the flow path forming body 900. The material of the flow path molded body 900 is injected into the mold so as to cover the cover members 905 to 910 of the pipes 901 to 904 shown in FIG. In order to hold the pipe in the mold in a state where the pipes 901 to 904 block the pipe ports with the lid members 905 to 910, the material flows into the pipes 901 to 904 in order to inject the channel molded body material. Therefore, the flow path molded body 900 can be manufactured. At this time, since the material of the pipes 901 to 904 has a higher melting point than the material of the flow path forming body 900, the flow path forming body 900 is manufactured without melting. That is, the material of the pipes 901 to 904 has a higher melting point than the material of the flow path forming body 900. For example, the material of the pipes 901 to 904 can be an SUS material, and the material of the flow path forming body 900 can be an aluminum alloy.

  FIG. 4C shows a third process diagram, and is a top perspective view and a bottom perspective view of the flow path forming body 900. A 3rd process removes the stands 911-914 for holding piping. A part of the pipes 901 to 904 is exposed at a place where the bases 911 to 914 are removed.

  FIG. 4D shows a fourth process diagram, and is a top view of the flow path forming body 900, a side view in the short side direction, a side view in the long side direction, and an enlarged view of the storage space 915.

  After completion of the second step shown in FIG. 4 (B), the flow path molded body 900 is cast by a recess 919 that is smaller than the first storage space 915 and does not contact the pipe 901 and the pipe 902. Similarly to the first storage space 915, the third storage space 917 is cast by a recess 92 1 that does not contact the pipes 904 and 903. Furthermore, it casts by the recessed part 920 which is smaller than the 2nd storage space 916, and does not contact piping 902,903.

  As a result, the drill cutting allowance 922 at the time of the fifth step for creating the power semiconductor module housing space, which will be described later with reference to FIG. 4 (E), is reduced by the amount of casting, that is, the recesses 919, 920, 921 I can do it. For this reason, the number of cutting steps can be reduced, and the cost can be reduced.

  FIG. 4E is a top view of the flow path forming body 900, showing the fifth step diagram.

  In the fifth step, the first storage space 915 is formed by cutting the cutting portion 922, the lid member 905 of the pipe 901, and the lid member 906 of the pipe 902 shown in FIG. The first storage space 915 and the internal space of the pipe 901 are connected. The third storage space 917 is formed similarly.

  Further, the second storage space 916 is formed by cutting the cutting portion 923, the lid member 907 of the pipe 902, and the lid member 908 of the pipe 903 shown in FIG. The internal space of the storage space 916, the pipe 902, and the pipe 903 is connected.

  The cutting method forms the storage spaces 915 to 917 of the power semiconductor module with a drill 918.

  After implementing the said 2nd-5th process, the cover materials 905-910 of the piping 901-904 are deleted, and it becomes possible to form the flow path 19 through which a cooling medium flows. As a result, the lower cover of the flow path forming body for flowing the cooling medium can be formed integrally with the flow path forming body, and the screw for fixing the lower cover and the flow path forming body, between the lower cover and the flow path forming body. The sealing member which prevents the cooling water to arrange | position can be reduced.

  FIG. 5 is an external view in which the power semiconductor modules 300U to 300W are fixed to the flow path forming body 900 according to the embodiment of the present invention. The U-phase power semiconductor module 300U is fixed in the first storage space 915, the V-phase power semiconductor module 300V is fixed in the second storage space 916, and the W-phase power semiconductor module 300W is fixed in the third storage space 917. The The flow path forming body 900 has a rectangular parallelepiped shape in plan view, and a pipe 901 and a pipe 904 are provided on the side surface 900d thereof. The flow path 19 is formed in a U shape so as to follow the remaining three side surfaces 900a to 900c.

  FIG. 6 is an external view of power semiconductor modules 300U to 300W mounted on the flow path forming body 900 of the power conversion device. The power semiconductor modules 300U to 300W all have the same structure. The configuration is the same as that shown in JP 2012-5323 A.

  FIG. 7 is a horizontal cross-sectional view of the flow path forming body 900 in which the power semiconductor modules 300U to 300W are arranged as shown in FIG. As described above, the U-shaped channel 19 is formed in the channel forming body 900, and the U-phase power semiconductor module is provided in the first storage space 915 formed along the left side surface 900b in the drawing. 300U is arranged. Similarly, in the second storage space 916 formed along the side surface 900a opposite to the side surface 900d provided with the pipe 901 and the pipe 904, the V-phase power semiconductor module 300V is disposed and along the right side surface 900c. The W-phase power semiconductor module 300W is disposed in the third storage space 917 formed in this way.

  In the present embodiment, since the flow path 19 can be formed by the pipe 902 or the like, the pipe 902 connecting the first storage space 915 and the second storage space 916 can be easily curved so that the pressure loss is reduced. Can be formed.

  Specifically, the pipe 902 or the pipe 903 has these inner walls formed outside the inner wall of the second storage space 916, whereby the flow of the refrigerant becomes smooth and the pressure loss is reduced.

  FIG. 8 is a view in which a flow path forming body 900 in which the power semiconductor module 300U is arranged as shown in FIG.

  The cooling medium taken in from the pipe 901 passes through the generated power semiconductor module 300U and cools the power semiconductor module 300U. Flow Rate of Cooling Medium The pipe 901 is arranged at a position where the place where the flow rate in FIG. 924 is as high as possible hits the power semiconductor elements (IGBTs 328 and 330, diodes 156 and 166).

  FIG. 9 is a view in which the flow path forming body 900 in which the power semiconductor module 300V is arranged as shown in FIG.

  Each of the embodiments described above may be used alone or in combination. This is because the effects of the respective embodiments can be achieved independently or synergistically. In addition, the present invention is not limited to the above embodiment as long as the characteristics of the present invention are not impaired.

19: flow path, 156, 166: diode, 300U, V, W: power semiconductor module, 328, 330: IGBT, 900: flow path formation body, 900a to d: side surface of flow path formation body, 901 to 904: piping , 905 to 910: piping cover material, 911 to 914: a base for holding the piping 901 to 904 in the mold, 915: first storage space, 916: second storage space, 917: third storage space, 918: Drill, 919 to 921: recess, 922, 923: cutting allowance, 924: cooling medium flow chart,

Claims (4)

A power semiconductor module that converts direct current to alternating current;
A flow path forming body that forms a storage space for storing the power semiconductor module;
A pipe for introducing a cooling refrigerant into the storage space, and a method for manufacturing a power conversion device comprising:
A first step of holding the pipe in a mold in a state where the opening of the pipe is closed by a lid member;
A second step of forming the flow path forming body by injecting a material of the flow path forming body into the mold so as to cover the lid material;
A third step of forming the housing space connected to the internal space of the pipe by cutting a part of the material of the flow path forming body covering the lid material and the lid material. Production method. A method for manufacturing the power conversion device according to claim 1,
In the first step,
The said piping is a manufacturing method of the power converter device hold | maintained in a predetermined position with a holding stand. A method for manufacturing the power conversion device according to claim 1 or 2,
In the second step,
A method for manufacturing a power conversion device, wherein a space in which the material of the housing is not poured by casting is formed in a part of a region where the storage space is formed in the housing. A method of manufacturing a power conversion device according to any one of claims 1 to 4,
The power semiconductor module includes a first power semiconductor module and a second power semiconductor module,
The flow path forming body forms a first storage space for storing the first power semiconductor module and a second storage space for storing the second power semiconductor module;
The pipe is configured by a first pipe for introducing a cooling refrigerant into the first storage space, and a second pipe for introducing the cooling refrigerant flowing out of the first storage space into the second storage space,
In the first step, the pipe is held in a mold in a state where the opening of the first pipe is closed by the first lid member, and the opening of the second pipe is closed by the second lid member. The pipe is held in the mold in a peeled state,
In the second step, the flow path forming body is formed by injecting the material of the flow path forming body into the mold so as to cover the first lid material and the second lid material,
The third step includes a part of the material of the flow path forming body that covers the first lid member, a part of the material of the flow path forming body that covers the second lid material, the first lid material, and the first cover material. The manufacturing method of the power converter device which forms the said 1st storage space and said 2nd storage space connected with the internal space of the said 1st piping and the said 2nd piping by cutting 2 lid | cover materials.