JP2015175622A - Sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor capable of stably performing oscillation by shortening the transmission distance between a piezoelectric vibrator and an oscillation circuit as much as possible.SOLUTION: The sensor includes: a quartz oscillator 5 that has a sensing region to which a detection object in a liquid adheres and whose resonance frequency is changed by the adhesion of the detection object; and a package 4 including first and second storage recesses 6 that are disposed on both sides of a substrate unit 4a and surrounded with frame parts 4b and 4c; and 4d. The quartz oscillator 5 is stored in the first storage recess 6 so that the sensing region faces the outside of the package 4. An IC chip 24 including an oscillation circuit for oscillating the piezoelectric vibrator 5 is stored in the second storage recess, and encapsulation resin 25 is filled into it.

Description

  The present invention relates to a sensor that detects a substance contained in a liquid.

In recent years, as a sensor for detecting a very small amount of substance in liquid, the resonance frequency is changed by immersing a quartz vibrator, which is a piezoelectric vibrator, in the liquid and attaching the substance to the electrode surface of the crystal vibrator. Thus, a QCM (Quartz Crystal Microbalance) sensor that detects a very small amount of substance is used (see, for example, Patent Document 1). This QCM sensor can detect a change in mass of a substance on the order of 1 ng / cm ² .

JP 2007-271449 A

  In a measurement system using such a QCM sensor, for example, as shown in FIG. 4 of the above-mentioned Patent Document 1, the crystal oscillator of the QCM sensor is oscillated by an oscillation circuit connected to the QCM sensor placed in the liquid, The change in frequency is analyzed by a computer via a frequency counter. If the transmission distance between the QCM sensor and the oscillation circuit is long, noise mixing and transmission loss increase, and the QCM sensor oscillates. It becomes unstable and it becomes difficult to measure with high accuracy.

  The present invention has been made in view of the above points, and provides a sensor that can stably oscillate by shortening the transmission distance between a piezoelectric vibrator and an oscillation circuit as much as possible. With the goal.

  In order to achieve the above object, the present invention is configured as follows.

That is, the present invention is a sensor including a sensing region to which a detection target in a liquid adheres, and including a piezoelectric vibrator whose resonance frequency changes due to the attachment of the detection target,
A package having a substrate part and a frame part, wherein first and second storage recesses are formed on both sides of the substrate part and surrounded by the frame part;
The piezoelectric vibrator is housed in the first housing recess so that the sensing area faces the outside of the package,
An IC chip including an oscillation circuit for oscillating the piezoelectric vibrator is housed in the second housing recess.

  In a preferred embodiment of the present invention, the first storage recess has a portion where the thickness of the peripheral wall is thicker than the thickness of the peripheral wall of the second storage recess.

  In another embodiment of the present invention, the piezoelectric vibrator is a crystal vibrator in which excitation electrodes are respectively formed on both main surfaces of the crystal vibrating piece, and the sensing region is at least one main surface of the two main surfaces. A sensitive film formed on the excitation electrode of the surface.

  In still another embodiment of the present invention, a step portion that supports a peripheral portion of the crystal vibrating piece is formed in the first storage recess, and the peripheral portion of the crystal vibrating piece supported by the step portion and the The space between the peripheral wall of the first storage recess is sealed with a sealing material.

  In a preferred embodiment of the present invention, a sealing resin is filled in the second storage recess in which the IC chip is stored.

  According to the present invention, a piezoelectric vibrator whose resonance frequency changes when a detection target in a liquid adheres to a sensing region, and an IC chip including an oscillation circuit that oscillates the piezoelectric vibrator are provided on a package substrate. The sensor is housed in the first and second housing recesses on both sides of the part, so that the sensor becomes a sensor with a built-in oscillation circuit, and the transmission distance between the piezoelectric vibrator and the oscillation circuit is shortened. Mixing and fluctuations, oscillation stability can be improved, and measurement accuracy can be improved.

  In addition, since the first and second storage recesses surrounded by the frame portion are formed on both sides of the substrate portion, the so-called H-shaped package structure is formed. Therefore, the storage recess is formed only on one side of the substrate portion. Compared to the so-called single package structure formed, the rigidity balance is excellent.

  Further, the piezoelectric vibrator is housed in the first housing recess, and the IC chip including the oscillation circuit is housed in the second housing recess, that is, the piezoelectric vibrator and the IC chip including the oscillation circuit are housed in separate housing spaces. Therefore, the influence on the piezoelectric vibrator due to the heat generated by the IC chip can be suppressed.

  In addition, when measuring the mass of the detection target contained in the liquid, the sensor is subjected to stress accompanying stirring, etc. in order to perform measurement by immersing the sensor in the liquid. Since the peripheral wall of the first storage recess in which the piezoelectric vibrator has is thicker than the peripheral wall of the second storage recess in which the IC chip is stored, stress applied to the piezoelectric vibrator is reduced. While the measurement accuracy can be improved, the second storage recess in which the IC chip is stored can be sufficiently thin to secure a sufficient space for storing the IC chip.

  Further, the sensing region includes a sensitive film formed on at least one excitation electrode of both excitation electrodes respectively formed on both main surfaces of the crystal vibrating piece constituting the crystal resonator, and by this sensitive film, The detection target in the sample liquid can be attached.

  In addition, the crystal vibrating piece is supported by the step formed in the first housing recess so that the sensing region of one main surface faces the outside of the package. Since the gap between the peripheral edge portion and the peripheral wall of the first storage recess is sealed with the sealing material, even if the sensing region is immersed in the liquid, the liquid will enter the other main surface side of the crystal vibrating piece and both It is possible to prevent the excitation electrode on the main surface from being short-circuited.

  Further, since the sealing resin is filled in the second storage recess in which the IC chip is stored, the connection portion of the IC chip can be protected from external force and corrosion.

  According to the present invention, a piezoelectric vibrator whose resonance frequency changes when a detection target in a liquid adheres to a sensing region, and an IC chip including an oscillation circuit that oscillates the piezoelectric vibrator are provided on a package substrate. The sensor is housed in the first and second housing recesses on both sides of the part, so that the sensor becomes a sensor with a built-in oscillation circuit, and the transmission distance between the piezoelectric vibrator and the oscillation circuit is shortened. Mixing and fluctuations, oscillation stability can be improved, and measurement accuracy can be improved.

  Moreover, since the first and second storage recesses are formed on both sides of the substrate portion, the rigidity balance is excellent. Furthermore, since the piezoelectric vibrator and the IC chip including the oscillation circuit are housed in separate housing spaces, the influence on the piezoelectric vibrator due to the heat generated by the IC chip can be suppressed.

1A and 1B are diagrams showing a QCM sensor according to an embodiment of the present invention, in which FIG. 1A is a plan view, FIG. 1B is a cross-sectional view taken along line AA in FIG. FIG. 2 is a schematic configuration diagram of a measurement system using the QCM sensor of FIG. 3A and 3B are views showing a QCM sensor according to another embodiment of the present invention, in which FIG. 3A is a plan view, FIG. 3B is a longitudinal side view, and FIG. 3C is a bottom view. 4A and 4B are views showing a QCM sensor according to still another embodiment of the present invention. FIG. 4A is a plan view, and FIG. 4B is a longitudinal side view.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  1A and 1B show a sensor according to an embodiment of the present invention. FIG. 1A is a plan view, and FIG. 1B is a cross-sectional view taken along line AA in FIG. FIG. 10C is a bottom view.

  The sensor of this embodiment is a QCM sensor 1 including a crystal resonator 5 that is a piezoelectric resonator as a sensor element. The QCM sensor 1 includes a package 4 having a body 2 and a pair of legs 3. The body 2 of the package 4 has an AT-cut crystal resonator 5 incorporated on the front side thereof, and a back surface. On the side, an IC chip 24 including at least an oscillation circuit for oscillating the crystal resonator 5 is mounted.

  As shown in FIG. 4B, the package 4 includes a flat base material layer 4a that constitutes the substrate portion, and first and second upper portions that constitute a frame portion on the upper surface of the base material layer 4a. Layers 4b and 4c are formed, and a lower layer 4d constituting a frame portion is formed on the lower surface of the base material layer 4a. The package 4 is formed by firing laminated insulating sheets such as ceramics.

  A circular through hole is formed in each of the first and second upper layers 4b and 4c on the upper surface of the base material layer 4a as the substrate portion, and a first storage recess for fitting the crystal piece 7 of the crystal resonator 5 therein. 6 is formed. The first and second upper layers 4 b and 4 c constitute a frame portion surrounding the first storage recess 6.

  The opening diameter of the second upper layer 4c portion of the first storage recess 6 is larger than the opening diameter of the first upper layer 4b portion, and the first storage recess 6 has a stepped portion that supports the peripheral portion of the crystal piece 7. Is formed.

  A rectangular through hole is formed in the lower layer 4d on the lower surface of the base material layer 4a as the substrate portion so as to correspond to the first housing recesses 6 of the first and second upper layers 4b and 4c. And a second storage recess that is sealed with the sealing resin 25 is formed. The lower layer 4d constitutes a frame portion surrounding the second storage recess.

  The crystal piece 7 of the crystal unit 5 is formed in a circular shape, and excitation electrodes 8 a and 9 a are formed in a circular shape at the center of both the front and back surfaces of the crystal piece 7.

  Extraction electrodes 8b and 9b are formed from the excitation electrodes 8a and 9a toward the outer peripheral direction of the crystal piece 7 so as to be opposite to each other. The extraction electrode 8b on the front surface side of the crystal piece 7 goes around to the back surface side. These electrodes 8a, 9a; 8b, 9b are formed of, for example, a laminated film of chromium (Cr) / gold (Au) or Ti (titanium) / Au (gold). The electrode material is not limited to these metals, and nickel (Ni) / silver (Ag) or other metals may be used.

  On the excitation electrode 8a on the surface side of the crystal piece 7, a sensitive film 10 to which a specific substance to be detected adheres by adsorption or the like is formed.

  On the upper surface of the step portion of the first housing recess 6 of the package 4, connection electrodes 11 and 12 are formed so as to correspond to the extraction electrodes 8 b and 9 b of the crystal piece 7. The lead electrodes 8b and 9b of the piece 7 are connected via a conductive adhesive 13 using an epoxy resin or the like. A resin other than an epoxy resin may be used as the conductive adhesive.

  The connection electrodes 11 and 12 are connected to the electrode pads 14 and 15 on the lower surface of the base material layer 4 a by internal wiring (not shown), and the IC chip 24 is connected to the electrode pads 14 and 15 by the metal bumps of the IC chip 24. The sealing resin 25 is filled.

  The electrode pads 14 and 15 are connected to external terminals 16 and 17 on the surfaces of the leg portions 3 and 3 of the package 4 by internal wiring (not shown).

  Since the QCM sensor 1 of this embodiment is immersed in a liquid, when the excitation electrodes 8a and 9a on the front and back surfaces of the crystal piece 7 come into contact with the liquid, the crystal oscillator 5 cannot be oscillated. Therefore, in order to prevent liquid from entering the first storage recess 6, an insulating sealing material 18 is provided between the outer peripheral edge of the crystal piece 7 and the peripheral wall of the first storage recess 6 of the package 4. Is filled and sealed.

  As described above, the body 2 of the QCM sensor 1 includes the crystal resonator 5 and the IC chip 24 in the first storage recess 6 on the upper surface side and the second storage recess on the lower surface side of the base material layer 4a of the package 4, respectively. Since it is housed, the transmission distance between the crystal unit 5 and the oscillation circuit of the IC chip 24 can be shortened as compared with the above-described conventional example, noise mixing and fluctuation can be suppressed, and oscillation can be suppressed. Stability is improved and measurement accuracy is improved.

  Further, the first upper layer 4b on the upper surface of the base material layer 4a constitutes the peripheral wall of the first storage recess 6 for storing the crystal resonator 5, and the thickness t1 of the peripheral wall by the first upper layer 4b is shown in FIG. As shown in (b), it is thicker than the thickness t2 of the lower layer 4d constituting the peripheral wall of the second storage recess for storing the IC chip 24.

  As described above, the peripheral wall of the first storage recess 6 that stores the crystal resonator 5 at the top of the package 4 has a thicker portion than the peripheral wall of the second storage recess in which the IC chip 24 is stored. The upper portion of the package 4 is not easily deformed, and the stress applied to the crystal resonator 5 can be reduced. On the other hand, the lower portion of the package 4 can secure a sufficient space for accommodating the IC chip 24.

  Note that the thickness of the second upper layer 4c constituting the peripheral wall of the first storage recess 6 may also be relatively thicker than the thickness of the lower layer 4d.

  In the QCM sensor 1, the surface side of the crystal piece 7 of the crystal unit 5 is a sensing region immersed in a liquid, and the sensing region includes a sensitive film 10 to which a specific substance to be detected adheres.

  The QCM sensor 1 of this embodiment is suitable for, for example, a chemical sensor or a biosensor that detects an organic compound or a biomolecule. Next, a measurement system using the QCM sensor 1 of this embodiment will be described. .

  FIG. 2 is a schematic configuration diagram of a measurement system using the QCM sensor 1 of FIG.

  In this measurement system, a specific substance to be detected is injected into a liquid 19 such as a buffer solution by an injection device (not shown) to prepare a sample liquid, and the mass of the specific substance in the sample liquid is measured. It is.

  The QCM sensor 1 including the IC chip 24 including the oscillation circuit is connected to an external frequency counter 21. A sensitive film 10 to which a specific substance adheres is formed on the surface of the excitation electrode 8a of the QCM sensor 1. The QCM sensor 1 is immersed in a liquid 19 such as a buffer solution, and the specific substance to be detected is Measurement is performed by injecting the liquid 19. The liquid 19 is maintained at a constant temperature and stirred by a thermostat with a stirring function (not shown).

  First, the crystal resonator 5 is oscillated by the IC chip 24 of the QCM sensor 1, and the resonance frequency of the crystal resonator 5 is measured by the frequency counter 21. Next, a specific substance to be detected is injected into the liquid 19 by an injection device (not shown). The liquid 19 into which the specific substance is injected, that is, the specific substance in the sample liquid is bonded and attached to the sensitive film 10 of the QCM sensor 1, and the mass of the excitation electrode 8a is increased. As the mass of the excitation electrode 8a increases, the resonance frequency of the crystal unit 5 decreases. By analyzing the amount of decrease in the resonance frequency by the computer 22 via the frequency counter 21, the mass of the specific substance in the sample liquid is calculated.

  Since the QCM sensor 1 is used by being immersed in the liquid as described above, the package 4 receives the pressure of the liquid by stirring or the like. However, the package 4 is the first in which the crystal resonator 5 is accommodated as described above. Since the thickness of the peripheral wall of the one storage recess 6 is increased to increase the rigidity, the stress applied to the crystal unit 5 can be reduced.

  FIG. 3 shows a QCM sensor 31 according to another embodiment of the present invention, where FIG. 3 (a) is a plan view, FIG. 3 (b) is a longitudinal side view, and FIG. 3 (c). Is a bottom view.

  Whereas the QCM sensor 1 of the above embodiment is a so-called lead type having the external terminals 16 and 17 on the surfaces of the pair of legs 3, the QCM sensor 31 of this embodiment is a surface mount type.

  As shown in FIG. 2B, the package 32 includes a rectangular flat plate-like base material layer 32a constituting the substrate portion, and first and second frames constituting the frame portion on the upper surface of the base material layer 32a. Upper layers 32b and 32c are formed, and a lower layer 32d constituting a frame portion is formed on the lower surface of the base material layer 32a. The package 32 is formed by firing laminated insulating sheets such as ceramics.

  A circular through hole is formed in each of the first and second upper layers 32b and 32c on the upper surface of the base material layer 32a as the substrate portion, and a first storage recess for fitting the crystal piece 40 of the crystal resonator 37 therein. 38 is formed. The first and second upper layers 32 b and 32 c constitute a frame portion surrounding the first storage recess 38. The opening diameter of the second upper layer 32c portion of the first storage recess 38 is larger than the opening diameter of the first upper layer 32b portion, and the first storage recess 38 has a stepped portion that supports the peripheral portion of the crystal piece 40. Is formed.

  A rectangular through hole is formed in the lower layer 32d on the lower surface of the base material layer 32a as the substrate portion so as to correspond to the first storage recesses 38 of the first and second upper layers 32b and 32c, and the IC chip 51 is formed. And a second storage recess that is sealed with the sealing resin 39 is formed. The lower layer 32d constitutes a frame portion surrounding the second storage recess.

  The crystal piece 40 of the crystal unit 37 is formed in a circular shape, and excitation electrodes 41 a and 42 a are formed in a circular shape at the center of the front and back surfaces of the crystal piece 40. From each excitation electrode 41a, 42a, extraction electrodes 41b, 42b are formed toward the outer peripheral direction of the crystal piece 40 so as to be opposite to each other. The lead electrode 41b on the front surface side of the crystal piece 40 goes around to the back surface side.

  On the excitation electrode 41a on the surface side of the crystal piece 40, a sensitive film 43 to which a specific substance to be detected adheres by adsorption or the like is formed.

  Connection electrodes 44 and 45 are formed on the upper surface of the stepped portion of the first housing recess 38 of the package 32 so as to correspond to the extraction electrodes 41 b and 42 b of the crystal piece 40. The lead electrodes 41b and 42b of the piece 40 are connected via a conductive adhesive 46 using an epoxy resin or the like. A resin other than an epoxy resin may be used as the conductive adhesive.

  A plurality of electrode pads 47 are provided on the lower surface of the base material layer 32 a, and the IC chip 51 is connected to the electrode pads 47 by metal bumps of the IC chip 51. The plurality of electrode pads 47 on the lower surface of the base material layer 32 are connected to the connection electrodes 44 and 45 of the first housing recess 38 or four mounting externals at the corners of the bottom surface of the lower layer 32d through internal wiring (not shown). Connected to terminal 49.

  A sealing resin 39 is filled in the second storage recess in which the IC chip 51 on the lower surface side of the base material layer 32a is stored.

  In the QCM sensor 31, an insulating sealing material 50 is provided between the outer peripheral edge of the crystal piece 40 and the inner wall of the storage recess 38 of the package 32 in order to prevent liquid from entering the first storage recess 38. Filled and sealed.

  As described above, the QCM sensor 31 has a cross section in which the crystal resonator 37 and the IC chip 51 are respectively stored in the first storage recess 38 on the upper surface side and the second storage recess on the lower surface side of the base material layer 32a of the package 32. Since it has an H-type structure, the rigidity can be increased and the transmission distance between the crystal unit 37 and the oscillation circuit of the IC chip 51 can be shortened, thereby suppressing noise mixing and fluctuation. And stability of oscillation is improved.

  This package structure with an H-shaped cross section has storage recesses formed on both the upper and lower sides of the base material layer 32a, and therefore has a rigidity balance compared to a single package structure in which the storage recesses are formed only on one of the upper and lower sides. Are better.

  Since the crystal resonator 37 and the IC chip 51 are stored in separate storage spaces of the first storage recess 38 and the second storage recess, respectively, the frequency temperature characteristics of the crystal resonator 37 due to the heat generation of the IC chip 51 and the like. Can be reduced.

  Further, the first upper layer 32b on the upper surface of the base material layer 32a constitutes the peripheral wall of the first storage recess 38 for storing the crystal resonator 37. The thickness t1 of the peripheral wall by the first upper layer 32b is shown in FIG. As shown in (b), it is thicker than the thickness t2 of the lower layer 32d constituting the peripheral wall of the second storage recess for storing the IC chip 51.

  Accordingly, the upper portion of the package 32 is not easily deformed, and stress applied to the crystal resonator 37 can be reduced. On the other hand, the lower portion of the package 32 can sufficiently secure a space for housing the IC chip 51.

  FIG. 4 shows a QCM sensor 61 according to still another embodiment of the present invention, where FIG. 4 (a) is a plan view and FIG. 4 (b) is a longitudinal side view.

  In the QCM sensors 1 and 31 of the above embodiments, the circular excitation electrodes 8a and 9a; 41a and 42a and the circular sensitive films 10 and 43 are formed on the circular crystal pieces 7 and 40, respectively. In the QCM sensor 61 of the embodiment, rectangular excitation electrodes 68a and 69a are formed on a rectangular crystal piece 64, and a rectangular sensitive film 70 is formed.

  The QCM sensor 61 of this embodiment is also a surface-mount type QCM sensor like the QCM sensor 31 of FIG.

  The package 62 includes a base material layer 62a, and first and second upper layers 62b and 62c are formed on the upper surface of the base material layer 62a, and a lower layer 62d is formed on the lower surface of the base material layer 62a. .

  A first housing recess 65 for fitting the crystal piece 64 of the crystal resonator 63 is formed on the upper surface of the base material layer 62a. The lower layer 62d on the lower surface of the base material layer 62a is formed with a second storage recess that stores the IC chip 66 and is sealed with the sealing resin 67.

  The crystal piece 64 of the crystal unit 63 is formed in a rectangular shape, and excitation electrodes 68a and 69a are formed in a rectangular shape at the center of the front and back surfaces of the crystal piece 64. From each excitation electrode 68a, 69a, extraction electrodes 68b, 69b are formed toward the outer peripheral direction of the crystal piece 64 so as to be opposite to each other, and the extraction electrode 68b on the front surface side wraps around the back surface side. .

  On the excitation electrode 68a on the surface side of the crystal piece 64, a sensitive film 70 to which a specific substance to be detected adheres by adsorption or the like is formed in a rectangular shape.

  Connection electrodes 71 and 72 are formed on the upper surface of the stepped portion of the first housing recess 65 of the package 62 so as to correspond to the extraction electrodes 68 b and 69 b of the crystal piece 64. The lead electrodes 68b and 69b of the piece 64 are connected via a conductive adhesive 73 using an epoxy resin or the like.

  A plurality of electrode pads 74 are provided on the lower surface of the base material layer 62a, and an IC chip 66 is connected to the electrode pads 74 by metal bumps of the IC chip 66. The plurality of electrode pads 67 on the lower surface of the base material layer 62a are connected to the connection electrodes 71 and 72 of the first housing recess 65 and the mounting external terminals 75 on the bottom surface of the lower layer 32d through internal wiring (not shown). Is done.

  In the QCM sensor 61, an insulating sealing material 76 is provided between the outer peripheral edge of the crystal piece 64 and the inner wall of the storage recess 65 of the package 62 in order to prevent liquid from entering the first storage recess 65. Filled and sealed.

  Similarly to the QCM sensor 31, the QCM sensor 61 of this embodiment has a crystal resonator 63 and an IC chip in the first storage recess 65 on the upper surface side and the second storage recess on the lower surface side of the base material layer 62 a of the package 62. 66 has an H-shaped cross section on which each is mounted, the rigidity can be increased and the transmission distance between the crystal unit 63 and the oscillation circuit of the IC chip 66 can be shortened. Mixing and fluctuations can be suppressed, and the oscillation stability is improved.

(Other embodiments)
The material of the QCM sensor package is not limited to ceramic, but may be glass, crystal, silicon, or the like.

  The piezoelectric vibrator is not limited to a flat plate shape, but an inverted mesa structure in which a recess is formed in the central portion of one surface or / and the other surface to increase the thickness around the central portion, or one surface or / and the other surface. A piezoelectric vibrator having a mesa structure or the like in which the thickness of the outer peripheral portion of the surface is thinner than the thickness of the central portion may be used.

  The present invention may be applied to a flow cell type QCM sensor in which a flow path for allowing a sample solution to flow into and out of a sensing region of a crystal resonator is formed.

1,31,61 QCM sensor 2,32,62 package 5,37,63 crystal resonator 7,40,64 crystal piece 8a, 9a; 41a, 42a; 68a, 69a excitation electrode 10,43,70 sensitive film 24, 51, 66 IC chip

Claims (5)

A sensor having a sensing region to which a detection target in a liquid adheres, and a piezoelectric vibrator whose resonance frequency changes due to the adhesion of the detection target;
A package having a substrate part and a frame part, wherein first and second storage recesses are formed on both sides of the substrate part and surrounded by the frame part;
The piezoelectric vibrator is housed in the first housing recess so that the sensing area faces the outside of the package,
An IC chip including an oscillation circuit that oscillates the piezoelectric vibrator is housed in the second housing recess.
A sensor characterized by that. The first storage recess has a portion where the thickness of the peripheral wall is thicker than the thickness of the peripheral wall of the second storage recess.
The sensor according to claim 1. The piezoelectric vibrator is a crystal vibrator in which excitation electrodes are formed on both main surfaces of the crystal vibrating piece,
The sensing region includes a sensitive film formed on the excitation electrode of at least one of the principal surfaces.
The sensor according to claim 1 or 2. In the first storage recess, a stepped portion that supports a peripheral portion of the crystal vibrating piece is formed,
The gap between the peripheral part of the quartz crystal vibrating piece supported by the step part and the peripheral wall of the first storage recess is sealed with a sealing material,
The sensor according to claim 3. A sealing resin is filled in the second storage recess in which the IC chip is stored.
The sensor according to claim 1.

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