JP2015166120A - Free abrasive grain processing wire and wire saw - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a free abrasive grain processing wire and a wire saw that improve slurry supply to a workpiece processing position and raise a speed of free abrasive grains in a slurry at a workpiece cutting position.SOLUTION: In a free abrasive grain processing wire 1, a hollow hole 3 is formed in a wire material 2 of circular cross section, and many holes 4 through which abrasive grains can pass are formed in the outer peripheral surface of the wire material 2 to make the many holes 4 communicate with the hollow hole 3. A wire saw that presses a workpiece to the free abrasive grain processing wire 1 to cut the workpiece is provided with a supply chamber at a running position of the free abrasive grain processing wire 1. The supply chamber is supplied with slurry in the interior of a storage tank by means of a pump to make the slurry actively flow into the hollow hole 3 from the many holes 4, so that the slurry and free abrasive grains in the slurry are supplied to a cutting position of the workpiece by the running of the free abrasive grain processing wire 1.

Description

  The present invention relates to an improvement of a free abrasive machining wire used in a loose abrasive machining type wire saw, and a wire saw using the free abrasive machining wire.

  The loose-abrasive machining type wire saw uses a loose-abrasive wire, attaches the slurry to the wire in the running state, and causes the loose abrasive particles in the slurry to act on a workpiece such as a semiconductor ingot to cut the workpiece. Do. When the slurry is supplied to the running wire, the slurry adheres to the outer peripheral surface of the running wire and enters the workpiece cutting position together with the loose abrasive grains in the slurry.

  According to a normal wire, during cutting, the slurry does not sufficiently enter the cutting position of the workpiece, and the speed of the free abrasive grains in the slurry is higher than the traveling speed of the wire, assuming that the workpiece is fixed. In general, it is not possible to exceed 1/2 of the traveling speed of the wire. For this reason, there is a problem that the slurry does not effectively enter the cutting position of the workpiece, and the free abrasive grains in the slurry do not effectively act on the grinding portion at the cutting position, so that the productivity does not increase.

  For example, in Patent Document 1, a wire is processed into a helically twisted shape, a spiral recess is formed on the surface of the wire, and the slurry is held in the recess on the surface of the wire when the silicon block is cut. , Increasing the holding power of the slurry, shortening the processing time, and improving the production efficiency.

  In addition, Patent Document 2 forms a plurality of grooves in the longitudinal direction on the wire surface, and keeps the free abrasive grains in the slurry in the grooves on the wire surface, so that the free abrasive grains are continuously formed between the wire and the workpiece. It is disclosed that the cutting force is improved by interposing and making the free abrasive grains easily bite into the workpiece.

  The techniques of Patent Document 1 and Patent Document 2 are both holding the slurry on the surface of the wire or holding free abrasive grains in the slurry on the surface of the wire. For this reason, there is a limit to the holding ability of slurry and loose abrasive grains on the surface of the wire, and the supply of slurry and loose abrasive grains to the workpiece processing position has not reached a sufficiently satisfactory level.

Japanese Patent Laid-Open No. 11-10514 JP 2009-23066 A

  Accordingly, the problem to be solved by the present invention is to improve the supply of slurry by the free abrasive machining wire to the workpiece processing position and to increase the speed of the free abrasive grains in the slurry at the workpiece cutting position.

  Under the above-mentioned problems, the present invention has a hollow wire structure and a porous wire structure in the loose abrasive machining wire.

  More specifically, the present invention relates to a wire for processing free abrasive grains, in which a wire having a circular cross section is formed into a hollow structure, hollow holes are formed in the wire, and free abrasive grains pass through the outer peripheral surface of the wire. A number of possible holes are formed, and the number of holes communicates with the hollow hole.

  Further, according to the present invention, in the loose abrasive machining wire, the numerous holes are formed at a constant number per unit length.

  Further, the present invention provides a wire having a circular cross section as a hollow structure, forming hollow holes in the wire, and forming a large number of holes through which free abrasive grains can pass on the outer peripheral surface of the wire. Using the loose abrasive wire that is communicated with the hollow hole, running the loose abrasive wire with a predetermined tension, pressing the workpiece to be worked against the loose abrasive wire, A wire saw for cutting a workpiece, wherein a feed chamber surrounding the loose abrasive wire is provided at a travel position of the loose abrasive wire, a pump is connected to the supply chamber, Slurry containing loose abrasive grains is supplied to the supply chamber, and the slurry in the supply chamber is allowed to actively flow into the hollow holes from the multiple holes of the loose abrasive grain processing wire. Play inside It is supplied to the cutting position of the workpiece with the abrasive grains by the running of the loose-abrasive machining wire (claim 3).

  Further, in the wire saw, the present invention is configured such that the loose abrasive machining wire is reciprocated, and the supply chamber is provided on the upstream side in the forward traveling direction and the upstream side in the backward traveling direction (Claim 4), Alternatively, the loose abrasive machining wire is made to travel in one direction, and the supply chamber is provided on the upstream side in the traveling direction (Claim 5).

  According to the loose abrasive machining wire according to the present invention, the slurry enters the hollow hole inside the loose abrasive machining wire from a large number of holes and is accommodated in the hollow hole. Holding amount, that is, the amount of slurry adhering to the wire as used in the prior art, and the free abrasive grains in the slurry are sufficiently supplied to the workpiece cutting position along with the travel of the free abrasive machining wire. The speed of the loose abrasive grains at the workpiece cutting position is increased, and the efficiency of the grinding process can be dramatically improved (claim 1).

  If the large number of holes are formed at a constant number per unit length, the grinding ability of the wire does not change in the length direction of the wire for loose abrasive machining, so that the loose abrasive even with the passage of time during cutting. The cutting function of the wire for grain processing does not change, and the cut surface of the workpiece also becomes a uniform and stable surface.

  Furthermore, according to the wire saw according to the present invention, the slurry actively flows into the hollow hole from the numerous holes of the free abrasive machining wire inside the supply chamber, and the cutting position of the workpiece is caused by the traveling of the free abrasive machining wire. Therefore, the grinding ability of the free abrasive grain processing wire can be sufficiently exhibited (claim 3).

  Further, according to the wire saw of the present invention, the supply chamber is provided on the upstream side of the traveling direction of the loose abrasive machining wire, and the loose abrasive machining wire travels and enters the cutting position of the workpiece. Since the grain processing wire holds the slurry by a large number of holes and hollow holes and carries the free abrasive grains therein to the cutting position, a good grinding action can be obtained at the grinding part of the workpiece. And claim 5).

It is a slope view of the wire for loose grain processing concerning the present invention. 1 is a front view of a wire saw according to the present invention. It is a top view of the winding state of the wire concerning the present invention.

  FIG. 1 shows a wire 1 for loose abrasive machining according to the present invention. The loose abrasive machining wire 1 has a circular cross-section of a wire 2 having a diameter of around 0.2 mm, a hollow hole 3 formed in the wire 2, and a number of holes 4 formed on the outer peripheral surface of the wire 2, Each hole 4 communicates with the hollow hole 3.

  The wire 2 is carbon steel represented by a piano wire. The hollow hole 3 has a size that can accommodate a large amount of loose abrasive grains 7 in a slurry 6 described later, and the large number of holes 4 are larger than the loose abrasive grains 7 in order to allow the free abrasive grains 7 to pass therethrough. It is a hole and is usually formed as a fixed number for each unit length of the wire 2.

  The manufacturing method of the wire 1 for loose abrasive grain processing uses, for example, the Mannesmann method, heats a billet with a circular cross section, inserts a plug into the center of the billet, and squeezes it with a plurality of conical rollers. After forming the hollow wire 2 with a desired diameter by drawing the wire 2 into a fine wire, fine particles such as silica sand are collided with the outer peripheral surface of the wire 2 by, for example, sandblasting, and a large number of holes 4, each hole 4 is communicated with the hollow hole 3 to form a porous structure.

  2 and 3 show a wire saw 10 according to the present invention. The wire saw 10 is a multi-wire type wire saw as an example, and uses the above-described loose abrasive machining wire 1. As shown in FIGS. 2 and 3, the loose abrasive machining wire 1 is wound, for example, on two grooved rollers 8 as a spiral at a constant pitch, and faces the workpiece 5 in the machining area. The wire feeding device and the wire winding device that do not perform reciprocating traveling or one-way traveling under a predetermined tension and sequentially feeding from the feeding device side to the winding device side.

  The slurry 6 includes a large number of fine loose abrasive grains 7 for loose abrasive processing, and is stored in a storage tank 9 and is supplied to the supply chamber 12 of the slurry 6 by a pump 11 under a predetermined pressure. To be supplied. The supply chamber 12 is provided at a position surrounding the loose abrasive wire 1 on the upstream side in the running direction of the loose abrasive wire 1 and allows the loose abrasive wire 1 to travel. Closed as much as possible. Although the slurry 6 that has flowed down in the processing zone is accommodated in the slurry receiver 13, it is filtered (not shown), returned to the storage tank 9 by a circulation pump, and repeatedly used.

  When the traveling mode of the loose abrasive wire 1 is reciprocating, the supply chamber 12 is connected to the upstream side of the forward travel of the loose abrasive wire 1 and the upstream side of the backward travel, that is, in FIG. Provided on the left and right sides with the workpiece 5 interposed therebetween. On the other hand, when the travel mode of the loose abrasive wire 1 is travel in one direction, the supply chamber 12 is provided only on the upstream side in the travel direction of the loose abrasive wire 1.

  When cutting the workpiece 5, the slurry 6 is supplied to the supply chamber 12 by the pump 11 as a pressure slightly higher than the atmospheric pressure. Further, the loose abrasive wire 1 touches the slurry 6 in the process of passing through the inside of the supply chamber 12. At this time, a part of the slurry 6 adheres to the surface of the loose abrasive machining wire 1, but many of the slurry 6 actively flows into the hollow holes 3 from the many holes 4, Is held in the form of accommodation. Under such a set state, the workpiece 5 is pressed against the machining area of the loose abrasive machining wire 1 in the running state.

  Accordingly, the loose abrasive machining wire 1 travels while holding the slurry 6 and the loose abrasive grains 7 in the slurry 6 inside the hollow holes 3 and the numerous holes 4, thereby causing the slurry 6 and loose abrasive grains to move. 7 is positively supplied to the cutting position of the workpiece 5. For this reason, the loose abrasive grains 7 in the slurry 6 flow out of the hollow holes 3 and the numerous holes 4 at the cutting position of the workpiece 5, and the outer abrasive surface of the loose abrasive machining wire 1 and the workpiece 5 are cut. The cutting part of the workpiece 5 is efficiently ground by being interposed between the positions.

  In this way, the slurry 6 enters the cutting position of the workpiece 5 at almost the same speed as the traveling speed of the loose abrasive machining wire 1, and in addition to the original grinding action, the action of lubrication, cooling, and chip discharge Run. As described above, the slurry 6 enters the inside of the hollow hole 3 from the many holes 4 and is held inside the hollow hole 3 and the many holes 4. Therefore, the supply of the slurry 6 by the loose abrasive machining wire 1 to the machining position of the workpiece 5 is larger than that in the conventional example of only the adhesion on the outer peripheral surface, and as a result, it is reliably improved.

  Moreover, since the loose abrasive grains 7 in the slurry 6 are supplied to the cutting position of the workpiece 5 along with the traveling of the loose abrasive machining wire 1, the speed of the loose abrasive grains 7 in the slurry 6 is the free abrasive grain processing. It is raised to a value close to the traveling speed of the working wire 1. As a result, the loose abrasive grains 7 are interposed between the outer peripheral surface of the loose abrasive grain processing wire 1 and the grinding portion of the workpiece 5 and exhibit a sufficient grinding action on the workpiece 5. As a result, the processing efficiency is dramatically improved.

  In addition, if a large number of holes 4 are formed as a fixed number for each unit length of the wire 2, the grinding ability does not change in the length direction of the free abrasive grain processing wire 1, and therefore, with the passage of time during cutting, However, the cutting function of the wire 1 for free abrasive grain processing does not change, and the cut surface of the workpiece 5 is also a uniform and stable surface.

  In addition, although not shown in figure, the workpiece | work 5 can also be pressed with respect to the loose-abrasive processing wire 1 from the bottom as shown in the figure, from the bottom. Furthermore, the wire saw 10 is not limited to the illustrated multi-wire type wire saw, but may be configured as a single-type wire saw.

  The present invention was developed for cutting a semiconductor ingot or the like as the work 4, but can also be applied to a cutting process for a crystal plate, porcelain, a metal plate, a carbon fiber reinforced resin material, a glass fiber reinforced resin material, or the like. .

DESCRIPTION OF SYMBOLS 1 Wire for processing loose abrasive 2 Wire 3 Hollow hole 4 Hole 5 Workpiece 6 Slurry 7 Free abrasive 8 Grooved roller 9 Reservoir 10 Wire saw 11 Pump 12 Supply chamber 13 Slurry receiving

Claims (5)

  The wire having a circular cross section has a hollow structure, and a hollow hole is formed in the wire, and a plurality of holes through which free abrasive grains can pass are formed on the outer peripheral surface of the wire, and the plurality of holes communicate with the hollow hole. A wire for processing free abrasive grains, characterized in that   2. The loose abrasive machining wire according to claim 1, wherein the plurality of holes are formed as a fixed number for each unit length.   The wire having a circular cross section has a hollow structure, and a hollow hole is formed in the wire, and a plurality of holes through which free abrasive grains can pass are formed on the outer peripheral surface of the wire, and the plurality of holes communicate with the hollow hole. A wire saw that uses the loose abrasive wire to be processed, runs the loose abrasive wire with a predetermined tension, presses the workpiece to be worked against the loose abrasive wire, and cuts the workpiece. A supply chamber surrounding the loose abrasive machining wire is provided at a travel position of the loose abrasive machining wire, a pump is connected to the supply chamber, and the slurry containing the free abrasive grains in the storage tank by the pump is provided. Is supplied to the supply chamber, and the slurry in the supply chamber is actively flowed into the hollow hole from the plurality of holes of the loose abrasive wire, and the slurry and the free abrasive grains in the slurry are removed. The loose abrasive Wire saw, wherein the supply to the cutting position of the workpiece by the traveling of the working wire.   The wire saw according to claim 3, wherein the loose abrasive machining wire is reciprocated, and the supply chamber is provided on the upstream side in the forward traveling direction and the upstream side in the backward traveling direction.   4. The wire saw according to claim 3, wherein the loose abrasive machining wire is unidirectionally traveled, and the supply chamber is provided upstream in the travel direction.

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