JP2015149450A - Exposure apparatus and article manufacturing method - Google Patents

Abstract

An exposure apparatus advantageous in improving throughput is provided. An exposure apparatus for exposing a substrate has a blocking portion for blocking light emitted from a light source and a passing portion for allowing the light to pass therethrough, and irradiates the light to the substrate by rotating. A shutter member that switches between non-irradiation and a control unit that controls rotation of the shutter member so that the light is allowed to pass through the passage portion from the state where the light is blocked at the shielding portion. The blocking portion is larger than a cross-section of the optical path region through which the light passes, and the control unit determines a first time to start irradiating the light to the substrate, and at the first time, the A second time for starting the rotation of the shutter member is determined so that the passage of the light in the passage portion is started, and the rotation of the shutter member is started at the second time. [Selection] Figure 1

Description

  The present invention relates to an exposure apparatus and a method for manufacturing an article.

  As an apparatus used in a manufacturing process (lithography process) of a semiconductor device or the like, there is an exposure apparatus that transfers a mask pattern onto a substrate. As one method for improving the throughput of the exposure apparatus, there is a method of shortening the switching time between light irradiation and non-irradiation on the substrate. For example, in Patent Document 1, two shutter members each having a light blocking portion and a light passing portion are used and rotated while being synchronized with each other, whereby light is not irradiated onto the substrate. An exposure apparatus that switches between irradiation has been proposed. In the exposure apparatus described in Patent Document 1, since each shutter member can be reduced in size and weight by using two shutter members, the switching time can be shortened by increasing the rotation speed of each shutter member. Yes.

Japanese Patent Laid-Open No. 11-233423

  Patent Document 1 does not describe controlling the rotation of the shutter member in synchronization with the settling of the substrate. In the exposure apparatus, if the rotation of the shutter member is started after the substrate is set at a position where exposure is to be performed, it may be disadvantageous in terms of throughput.

  SUMMARY An advantage of some aspects of the invention is that it provides an exposure apparatus that is advantageous in improving throughput.

  In order to achieve the above object, an exposure apparatus according to one aspect of the present invention is an exposure apparatus that performs exposure of a substrate, and includes a blocking portion that blocks light emitted from a light source, and a passing portion that allows the light to pass therethrough. And a shutter member that switches between irradiation and non-irradiation of the light to the substrate by rotating, and allowing the light to pass through the passage portion from a state where the light is blocked at the blocking portion. A control unit that controls the rotation of the shutter member so as to be in a state of being in a state where the blocking portion is larger than a cross-section of an optical path region through which the light passes, and the control unit is configured to transmit the light to the substrate. A first time for starting irradiation is determined, a second time for starting the rotation of the shutter member is determined so that the passage of the light at the passage portion is started at the first time, and the second time is determined. In the To start the rotation of the member, characterized in that.

  Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, an exposure apparatus that is advantageous in improving throughput can be provided.

It is the schematic which shows the structure of the exposure apparatus of 1st Embodiment. It is a figure which shows the structure of the shutter part of 1st Embodiment. It is a figure showing signs that exposure light is switched between interception and passage by rotating a shutter member. It is a figure which shows the rotational speed of the shutter member at the time of exposing the object shot area | region, and the intensity | strength of exposure light. It is a figure which shows the structure of the conventional shutter member. It is a flowchart which shows the method of controlling rotation of a shutter member in exposing a target shot area. It is a figure which shows the structure of the shutter member of 2nd Embodiment. It is a figure which shows the rotational speed of the shutter member at the time of exposing the object shot area | region, and the intensity | strength of exposure light.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member thru | or element, and the overlapping description is abbreviate | omitted.

<First Embodiment>
An exposure apparatus 100 according to the first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a schematic diagram showing a configuration of an exposure apparatus 100 according to the first embodiment. The exposure apparatus 100 of the first embodiment is a step-and-repeat type exposure apparatus, and transfers a mask pattern to each of a plurality of shot regions formed on the substrate by exposing the substrate 3. The step-and-repeat method repeats an exposure process in which a predetermined shot area is exposed while the substrate 3 is set, and a step process in which the substrate 3 is moved stepwise to a shot area where the next exposure is performed. In this method, each shot area is exposed. The exposure apparatus 100 of the first embodiment can include a light source 1, a shutter unit 4, a mask stage 21, a projection optical system 6, and a substrate stage 22. In addition, the exposure apparatus 100 can include a detection unit S that detects the intensity of light that has passed through the shutter unit 4 and a control unit 13. The control unit 13 includes, for example, a CPU and a memory, and controls the entire exposure apparatus 100 (each part of the exposure apparatus 100). That is, the control unit 13 controls a process of transferring the pattern formed on the mask 2 to the substrate 3 (a process of exposing the substrate 3).

  The light source 1 emits light for exposing the substrate 3 (hereinafter, exposure light). The shutter unit 4 switches between irradiation and non-irradiation of the exposure light on the substrate 3 by blocking or passing the exposure light emitted from the light source 1. The mask stage 21 is configured to be movable while holding the mask 2 in order to position the mask 2. The projection optical system 6 has a predetermined magnification (for example, 1/2 times), and projects the pattern formed on the mask 2 onto the substrate 3. The substrate stage 22 is configured to be movable while holding the substrate 3 in order to position the substrate 3. In the exposure apparatus 100 configured as described above, the pattern of the mask 2 is projected onto the substrate 3 via the projection optical system 6, thereby forming a latent image pattern on the resist applied to the substrate 3. The latent image pattern is developed in a developing device, whereby a resist pattern is formed on the substrate.

  The detection unit S detects the intensity of the exposure light that has passed through the shutter unit 4. The detection unit S can include, for example, an optical sensor 5, an amplifier 7, a V / F converter 9, and a pulse counter 11. The optical sensor 5 detects the intensity of exposure light between the shutter unit 4 and the mask stage 21. The optical sensor 5 can include a photoelectric conversion element such as a CMOS sensor or a CCD sensor. The photoelectric conversion element may be disposed in the optical path of the exposure light between the shutter unit 4 and the mask stage 21 or may be disposed so as to receive the light extracted by the mirror disposed on the optical path. Also good. The amplifier 7 converts a signal indicating the intensity of exposure light detected by the optical sensor 5 into a voltage signal. The V / F converter 9 converts the voltage signal output from the amplifier into a frequency signal. The pulse counter 11 counts the number of pulses of the frequency signal output from the V / F converter 9. The count value counted by the pulse counter 11 means an amount obtained by integrating the intensity of exposure light, and is proportional to the exposure amount of the substrate 3. Accordingly, the control unit 13 can acquire information indicating the exposure amount of the substrate 3 using the count value output from the pulse counter 11. Further, the control unit 13 may input a signal indicating the intensity of the exposure light detected by the optical sensor 5 and acquire information indicating the intensity of the exposure light.

  Next, the role of the shutter unit 4 in the step-and-repeat method will be described. In an exposure process in which the substrate 3 is exposed with the substrate stage 22 being set, the exposure light emitted from the light source 1 is irradiated onto the substrate 3. On the other hand, in the step of moving the substrate stage 22, it is preferable that the exposure light emitted from the light source 1 is not irradiated onto the substrate 3. Therefore, the shutter part 4 is arrange | positioned between the light source 1 and the mask stage 21, and it is comprised so that exposure light may be passed in an exposure process, and exposure light may be interrupted | blocked at a step process. That is, the shutter unit 4 is configured to switch between exposure light irradiation and non-irradiation on the substrate 3, and the switching is controlled by the control unit 13. Here, the exposure apparatus 100 is required to improve the throughput (productivity), and in order to improve the throughput, a time for switching between exposure light irradiation and non-irradiation on the substrate 3 (hereinafter referred to as switching time). ) Is preferably shortened. Therefore, in the exposure apparatus 100 of the first embodiment, the shutter unit 4 is configured so that the switching time can be shortened. Below, the structure of the shutter part 4 is demonstrated.

  FIG. 2 is a diagram illustrating a configuration of the shutter unit 4 according to the first embodiment. FIG. 2A is a side view of the shutter unit 4. The shutter unit 4 can include, for example, a shutter member 33 that switches between blocking and passing of exposure light, and a motor 31 that rotates the shutter member 33. The shutter member 33 has a blocking portion 33 a that blocks the exposure light emitted from the light source 1 and a passage portion 33 b that allows the exposure light to pass, and is attached to the motor 31 via the boss 32. 2B and 2C are diagrams when the shutter member 33 is viewed from the light source 1 side. FIG. 2B shows a state where the exposure light is blocked by the blocking portion 33a, and FIG. 2C shows a state where the exposure light is allowed to pass by the transmission portion 33b. When the exposure of the substrate 3 is started, the control unit 13 rotates the shutter member 33 so that the exposure light is blocked by the blocking portion 33a (FIG. 2B), and the exposure light is transmitted by the passage portion 33b. Is in a state of passing (FIG. 2C). On the other hand, when the exposure of the substrate 3 is finished, the control unit 13 rotates the shutter member 33 again, and from the state where the exposure light is allowed to pass through the passage portion 33b (FIG. 2C), the blocking portion. The exposure light is blocked by 33a (FIG. 2B).

  Next, a specific configuration of the shutter member 33 according to the first embodiment will be described. In order to achieve stable rotation of the shutter member 33, the shutter member 33 is preferably configured to have two blocking portions 33a disposed symmetrically with respect to the rotation axis of the shutter member 33. Further, it is preferable that the blocking portion 33a and the passage portion 33b are configured such that the opening angles of the shutter member 33 with respect to the rotation axis are equal to each other. If the opening angle is made equal between the blocking portion 33a and the passage portion 33b, the first rotation angle and the third rotation angle can be made the same, so that the rotation of the shutter member 33 can be easily controlled.

  The blocking portion 33a of the shutter member 33 has a predetermined rotation angle (first rotation angle) during a period from the start of rotation of the shutter member 33 to the start of exposure light exposure to the substrate 3. Is configured to rotate. Further, in the blocking portion 33a, the shutter member 33 rotates at a predetermined rotation angle (fourth rotation angle) during a period from the end of irradiation of the exposure light to the substrate 3 to the end of the rotation of the shutter member 33. It is configured as follows. That is, the blocking portion 33a of the shutter member 33 has an opening angle with respect to the rotation axis of the shutter member 33 such that the opening angle of the shutter member 33 is larger than the minimum opening angle in which the cross section of the optical path region 10 through which the exposure light passes is smaller than the cross section of the optical path region 10. Configured to be larger). For example, when the minimum opening angle (hereinafter referred to as the opening angle of the optical path region 10) in which the cross section of the optical path region 10 falls is 60 degrees, as shown in FIG. Is configured to be 90 degrees larger than the opening angle of the optical path region 10. At this time, for example, the first rotation angle and the fourth rotation angle are each 15 degrees.

  The passage portion 33b of the shutter member 33 has a predetermined rotation angle (second rotation angle) during a period from when the entire cross section of the optical path region 10 is included in the passage portion 33b until the shutter member 33 finishes rotating. The member 33 is configured to rotate. The passage portion 33b has a predetermined rotation angle during a period from when the exposure light passes through the passage portion 33b until the shutter member 33 starts rotating and the exposure light is blocked by the blocking portion 33a. The shutter member 33 is configured to rotate at (third rotation angle). That is, the passage portion 33b of the shutter member 33 is configured such that the opening angle with respect to the rotation axis of the shutter member 33 is larger than the opening angle of the optical path region 10 (greater than the cross section of the optical path region 10). For example, as illustrated in FIG. 2C, the passing portion 33 b is configured such that the opening angle is 90 degrees that is larger than the opening angle of the optical path region 10. At this time, for example, the second rotation angle and the third rotation angle are each 15 degrees.

  Next, control in the case of switching between exposure light irradiation and non-irradiation on the substrate 3 using the shutter member 33 configured as described above will be described with reference to FIGS. 3 and 4. FIG. 3 is a diagram showing how exposure light is switched between blocking and passing by rotating the shutter member 33 when exposing a shot area to be exposed (hereinafter, target shot area). FIG. 4 is a diagram showing the rotation speed of the shutter member 33 when the target shot area is exposed and the intensity of exposure light that passes through the shutter member 33 and is detected by the detection unit S. In FIG. 4, the dashed line indicates the rotation speed of the shutter member 33, and the solid line indicates the intensity of the exposure light detected by the detection unit S.

  In the period before time t1, the state shown in FIG. 3A is established, and all of the exposure light is blocked by the blocking portion 33a of the shutter member 33 and does not pass through the shutter member 33. During this period, the intensity of the exposure light detected by the detection unit S is almost zero. At time t1, in order to start exposure of the substrate 3, the control unit 13 controls the shutter unit 4 so as to start the rotation of the shutter member 33. In the period from time t1 to time t2, the state is as shown in FIG. 3B, and the entire cross section of the optical path region 10 is included in the blocking portion 33a of the shutter member 33, that is, all of the exposure light is blocked. It is in a state where it is blocked by the portion 33a. This period is a period during which the shutter member 33 rotates at the first rotation angle, and the rotation of the shutter member 33 is accelerated during this period. Further, the intensity of the exposure light detected by the detection unit S during this period is almost zero. In the period from time t2 to time t3, the state is as shown in FIG. 3C, and a part of the exposure light passes through the passage portion 33b of the shutter member 33 and starts to enter the substrate. That is, time t2 is the time when exposure of the substrate 3 is started. During this period, the intensity of the exposure light detected by the detection unit S increases.

  In the period from time t3 to time t4, the state is as shown in FIG. 3D, and the entire cross section of the optical path region 10 is included in the passage portion 33b of the shutter member 33, that is, all of the exposure light passes. It is in a state of passing through 33b. This period is a period during which the shutter member 33 rotates at the second rotation angle, and the rotation of the shutter member 33 is decelerated during this period. Further, the intensity of the exposure light detected by the detection unit S during this period is not less than a predetermined value (for example, the maximum value). At time t4, the shutter member 33 finishes rotating. In the period from time t4 to time t5, the state is as shown in FIG. 3E, in which the shutter member is stopped and all the exposure light passes through the passage portion 33b of the shutter member 33. In this period, the intensity of the exposure light detected by the detection unit S becomes a predetermined value or more.

  At time t <b> 5, the control unit 13 controls the shutter unit 4 to start the rotation of the shutter member 33 in order to end the exposure of the substrate 3. In the period from time t5 to time t6, the state is as shown in FIG. 3F, and the entire cross section of the optical path region 10 is included in the passage portion 33b of the shutter member 33, that is, all of the exposure light passes. It is in a state of passing through the portion 33b. This period is a period during which the shutter member 33 rotates at the third rotation angle, and the rotation of the shutter member 33 is accelerated during this period. Further, the intensity of the exposure light detected by the detection unit S during this period is not less than a predetermined value. In the period from time t6 to time t7, the state is as shown in FIG. 3G, and a part of the exposure light starts to be blocked by the blocking portion 33a of the shutter member 33. During this period, the intensity of the exposure light detected by the detection unit S decreases. At time t7, all of the exposure light is blocked by the blocking portion 33a of the shutter member 33, and the intensity of the light detected by the detection unit S becomes substantially zero. Therefore, time t6 is a time when the exposure light is blocked by the blocking portion 33a of the shutter member 33, and time t7 is a time when the exposure ends.

  In the period from time t7 to time t8, the state is as shown in FIG. 3H, and the entire cross section of the optical path region 10 is included in the blocking portion 33a of the shutter member 33, that is, all the exposure light is blocked. It is in a state where it is blocked by the portion 33a. This period is a period during which the shutter member 33 rotates at the fourth rotation angle, and the rotation of the shutter member 33 is decelerated during this period. Further, the intensity of the exposure light detected by the detection unit S during this period is almost zero. At time 8, the shutter member 33 finishes rotating. Here, the period during which the substrate 3 is exposed in FIG. 4 corresponds to the period from time t2 to time t7.

  In the exposure apparatus 100 of the first embodiment, by controlling the rotation of the shutter member 33 as described above, it is possible to reduce the switching time between exposure light irradiation to the substrate 3 and non-irradiation. The switching time is a period from time t2 to time t3 in FIG. 4 or a period from time t6 to time t7. By shortening the switching time in this way, the time (exposure time) until the exposure amount, which is the amount obtained by integrating the intensity of the exposure light applied to the substrate 3, reaches the target exposure amount is shortened, and the throughput is improved. be able to.

  Here, the principle that the switching time can be shortened in the exposure apparatus 100 of the first embodiment will be described. The shutter member 33 according to the first embodiment is configured such that the opening angle of the blocking portion 33 a is larger than the opening angle of the optical path region 10. Therefore, the rotation of the shutter member 33 can be accelerated in a period from the start of the rotation of the shutter member 33 to the start of exposure of the substrate 3 (a period from time t1 to time t2). As a result, the shutter member 33 can have a predetermined rotational speed (initial speed) at time t2 when exposure of the substrate 3 is started. Further, the shutter member 33 of the first embodiment is configured such that the opening angle of the passage portion 33 b is larger than the opening angle of the optical path region 10. As a result, the rotation of the shutter member 33 during a period from the time when the intensity of the exposure light passing through the passage portion 33b becomes equal to or greater than a predetermined value until the rotation of the shutter member 33 ends (a period from time t3 to time t4). Can be decelerated. As a result, the shutter member 33 can have a predetermined rotation speed at time t3 when the intensity of the exposure light becomes a predetermined value or more. Thus, since the shutter member 33 can have a predetermined rotation speed at each of the time t2 and the time t3, the switching time (period from the time t2 to the time t3) can be shortened. It goes without saying that the period from time t6 to time t7 can be shortened for the same reason as the period from time t2 to time t3.

  On the other hand, in the conventional shutter member 41, the opening angle of the blocking portion 41a is substantially the same as the opening angle of the optical path region 10, as shown in FIG. Therefore, a period corresponding to the period from time t1 to time t2 is not provided, and it is necessary to start the rotation of the shutter member 41 at the time when the exposure of the substrate 3 is started. Therefore, the shutter member 41 cannot have a predetermined rotation speed (initial speed) at the time. Similarly, in the conventional shutter member 41, as shown in FIG. 5B, the opening angle of the passage portion 41b is substantially the same as the opening angle of the optical path region 10. Therefore, a period corresponding to the period from time t3 to time t4 is not provided, and it is necessary to end the rotation of the shutter member 41 at a time when the intensity of the exposure light passing through the shutter member 41 becomes a predetermined value or more. Therefore, the shutter member 41 cannot have a predetermined rotation speed at the time. Therefore, in the exposure apparatus 100 of the first embodiment, the rotation speed when the shutter member 33 is rotated to switch between irradiation and non-irradiation of the exposure light on the substrate 3 is made higher than when the conventional shutter member 41 is used. Can do. That is, the exposure apparatus 100 of the first embodiment can increase the rotation speed when rotating the opening angle (60 degrees) of the optical path region 10 as compared with the case where the conventional shutter member 41 is used. As a result, the switching time between exposure light irradiation and non-irradiation on the substrate 3 can be reduced to about 52% as compared with the case where the conventional shutter member 41 is used.

  When the substrate 3 is exposed using the shutter member 33 configured as described above, a time difference is generated between the time t1 when the rotation of the shutter member 33 is started and the time t2 when the exposure of the substrate 3 is started. . In this case, if the rotation of the shutter member 33 is started after the substrate 3 is disposed at the position where the substrate is to be disposed when the target shot area is exposed, the interval between the time t1 and the time t2 is started. Time that does not contribute to production can be generated by the time difference. Similarly, there is a time difference between time t5 when the rotation of the shutter member 33 is started and time t6 when the exposure light is blocked. In this case, if the rotation of the shutter member 33 is started after the exposure amount of the substrate 3 reaches the target exposure amount, the substrate 3 is exposed by the time difference between the time t5 and the time t6. Become. Therefore, the exposure apparatus 100 of the first embodiment controls the rotation of the shutter member 33 in consideration of the time difference described above. Hereinafter, a method of controlling the rotation of the shutter member 33 when exposing the target shot area will be described with reference to FIG. FIG. 6 is a flowchart showing a method for controlling the rotation of the shutter member 33 when the target shot area is exposed.

  In S101, the control unit 13 determines a time (first time) at which exposure light irradiation is started on the target shot area. The first time at which exposure light irradiation is started to the target shot area corresponds to time t2 in FIG. 4. For example, the substrate 3 is disposed at a position where the substrate 3 is to be disposed when the target shot area is exposed. It is preferable that the scheduled time be set. Therefore, for example, the control unit 13 obtains a scheduled time at which the substrate 3 is arranged using the moving path and moving speed while the substrate stage 22 is moved stepwise, and determines the first time according to the scheduled time. Then it is good. In S102, the control unit 13 determines a time (second time) for starting the rotation of the shutter member 33 so that irradiation of exposure light to the target shot area is started at the first time determined in S101. The second time at which the rotation of the shutter member 33 starts corresponds to time t1 in FIG. For example, the control unit 13 determines a rotation speed (or rotation acceleration) when rotating the shutter member 33, and determines a second time for starting the rotation of the shutter member 33 based on the rotation speed. In S103, the control unit 13 determines whether or not the second time has come. When it is not the second time, the process of S103 is repeated, and when the second time is reached, the process proceeds to S104. In S <b> 104, the control unit 13 starts rotating the shutter member 33. In S105, the control unit 13 starts decelerating the rotation of the shutter member 33 when the intensity of the exposure light detected by the detection unit S exceeds a reference value (for example, a value that is half the maximum intensity). Thereby, the control part 13 can complete | finish rotation of the shutter member 33 so that it may be in the state of FIG.3 (e) at the time t4 in FIG.

  In S <b> 106, the control unit 13 determines a scheduled time at which the exposure amount of the substrate 3 becomes the target exposure amount, and determines a time (third time) at which exposure light blocking is started according to the scheduled time. The scheduled time when the exposure amount of the substrate 3 becomes the target exposure amount corresponds to the time t7 in FIG. 4, and the third time at which the exposure light is blocked corresponds to the time t6 in FIG. For example, the control unit 13 switches the switching time when starting exposure of the target shot area 33 (period between time t2 and time t3 in FIG. 4) or switching in a shot area where exposure has been performed before the target shot area. The third time may be determined based on the time. In S107, the control unit 13 determines the time (fourth time) at which rotation of the shutter member 33 is started so that the exposure light is blocked at the third time determined in S106. The fourth time at which the rotation of the shutter member 33 starts corresponds to time t5 in FIG. In S108, the control unit 13 determines whether or not the fourth time has come. If it is not the fourth time, the process of S108 is repeated, and the process proceeds to S109 when the fourth time is reached. In S109, the control unit 13 starts rotating the shutter member 33. In S110, the control unit 13 starts decelerating the rotation of the shutter member 33 when the intensity of the exposure light detected by the detection unit S falls below a reference value (for example, a value half the maximum intensity). Accordingly, the rotation of the shutter member 33 can be ended at time t8 in FIG. 4, and the exposure of the target shot area can be ended.

  Here, in the first embodiment, S106 and S107 are performed after the exposure of the target shot area is started. However, the present invention is not limited to this. For example, before the exposure of the target shot area is started, that is, It may be performed before S103. Moreover, although the shutter member 33 of 1st Embodiment is comprised so that it may have two interruption | blocking parts arrange | positioned with respect to the rotating shaft of the shutter member 33, it is not restricted to it. For example, it may be configured to have one blocking portion, or may be configured to have three or more blocking portions. Furthermore, in the first embodiment, the opening angle of the blocking portion 33a and the opening angle of the passage portion 33b in the shutter member 33 are set to 90 degrees, but the present invention is not limited to this. May be changed as appropriate.

  As described above, the shutter member 33 used in the exposure apparatus 100 of the first embodiment includes the blocking portion 33a and the passing portion 33b each having an opening angle larger than the opening angle of the optical path region 10 through which the exposure light passes. It is configured. By configuring the shutter member 33 in this way and starting the rotation of the shutter member 33 prior to the start and end of exposure of the substrate 3, the switching time between exposure light irradiation and non-irradiation on the substrate can be shortened. Can do. Therefore, the exposure time of the substrate 3 can be shortened and the throughput can be improved.

Second Embodiment
An exposure apparatus according to the second embodiment will be described. The exposure apparatus of the second embodiment differs from the exposure apparatus 100 of the first embodiment in the configuration of the shutter member 51, and accordingly, the rotation control of the shutter member 51 is also different. Hereinafter, the configuration of the shutter member 51 and the control of the rotation of the shutter member 51 will be described.

  FIG. 7 is a diagram illustrating a configuration of the shutter member 51 according to the second embodiment. FIG. 7A shows a state where the exposure light is blocked at the blocking portion 51a, and FIG. 7B shows a state where the exposure light passes through the passage portion 51b. In the shutter member 51 of the second embodiment, as shown in FIGS. 7A and 7B, the opening angle of the blocking portion 51a is substantially the same as the opening angle of the optical path region 10, and the opening angle of the passage portion 51b. Is configured to be larger than the opening angle of the optical path region 10. The shutter member 51 of the second embodiment is configured such that the opening angle of the blocking portion 51a is 60 degrees and the opening angle of the passage portion 51b is 120 degrees, for example.

  FIG. 8 is a diagram showing the rotation speed of the shutter member 51 when exposing the target shot area, and the intensity of exposure light that passes through the shutter member 51 and is detected by the detection unit S. In FIG. 8, the dashed line indicates the rotation speed of the shutter member 51, and the solid line indicates the intensity of the exposure light detected by the detection unit S. In the exposure apparatus of the second embodiment, the time when exposure is started and the time when rotation of the shutter member 51 is started are the same time t9, but the intensity of exposure light detected by the detection unit S is equal to or greater than a predetermined value. At time t10, the shutter member 51 can have a predetermined rotation speed. Then, the rotation of the shutter member 51 ends at time t11. In the exposure apparatus of the second embodiment, the rotation of the shutter member 51 is started at time t12 prior to time t13 when the exposure light is blocked, and the shutter member 51 has a predetermined rotation speed at time t13. Can do. At time t14, the rotation of the shutter member 51 and the exposure of the substrate 3 are finished.

  By using the shutter member 51 configured as described above, the switching time corresponding to the period from the time t9 to the time t10 and the period from the time t13 to the time t14 is compared with the case where the conventional shutter member 41 is used. It can be shortened to about 72%. Here, the process of determining the time t12 is the same as the process of determining the fourth time in S107 in the flowchart of FIG.

  As described above, the exposure apparatus of the second embodiment can shorten the exposure time because it can shorten the switching time between exposure light irradiation and non-irradiation similarly to the exposure apparatus 100 of the first embodiment. , Throughput can be improved. Further, in the exposure apparatus of the second embodiment, when the exposure of the shot area is started, it is not necessary to start the rotation of the shutter member prior to the start of the exposure. Therefore, the steps S101 and S102 in the flowchart shown in FIG. A process becomes unnecessary. Therefore, the exposure apparatus of the second embodiment can easily control the rotation of the shutter member 51, although the switching time is longer than that of the exposure apparatus 100 of the first embodiment.

<Embodiment of Method for Manufacturing Article>
The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing an article such as an electronic device such as a semiconductor device or an element having a fine structure. In the method for manufacturing an article according to the present embodiment, a latent image pattern is formed on the photosensitive agent applied to the substrate using the above-described exposure apparatus (a step of exposing the substrate), and the latent image pattern is formed in this step. Developing the substrate. Further, the manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, and the like). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

  As mentioned above, although preferred embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

Claims (12)

An exposure apparatus for exposing a substrate,
A shutter member that has a blocking portion that blocks light emitted from the light source and a passing portion that allows the light to pass therethrough, and that switches between irradiation and non-irradiation of the light to the substrate by rotating;
A control unit that controls the rotation of the shutter member so that the light is allowed to pass through the passage portion from the state where the light is blocked at the cutoff portion;
Including
The blocking portion is larger than a cross section of an optical path region through which the light passes,
The controller determines a first time to start irradiating the light to the substrate, and starts rotating the shutter member so that the passage of the light at the passage portion is started at the first time. An exposure apparatus, wherein a second time to be determined is determined, and rotation of the shutter member is started at the second time.   The said control part determines the said 1st time according to the time when the said board | substrate is arrange | positioned in the position where the said board | substrate should be arrange | positioned when the said exposure is performed. Exposure equipment. A substrate stage that is movable while holding the substrate;
The exposure apparatus according to claim 2, wherein the control unit determines the first time based on a moving path and a moving speed when the substrate stage is moved stepwise. A detection unit that detects the intensity of the light that has passed through the shutter member;
4. The control unit according to claim 1, wherein when the intensity of the light detected by the detection unit exceeds a reference value, the control unit starts decelerating rotation of the shutter member. 5. 2. The exposure apparatus according to item 1. The passage portion is larger than a cross section of the optical path region;
The controller starts to reduce the rotation of the shutter member before the entire cross section of the optical path region is included in the passage portion, and even after the entire cross section of the optical path region is included in the passage portion. 5. The exposure apparatus according to claim 1, wherein the rotation of the shutter member is decelerated. The control unit controls the rotation of the shutter member so that the light is blocked by the blocking portion from the state where the light is allowed to pass by the passing portion;
The passage portion is larger than a cross section of the optical path region;
The control unit determines a third time to start blocking the light at the blocking portion, and rotates the shutter member so that the blocking of the light at the blocking portion is started at the third time. The exposure apparatus according to claim 1, wherein a fourth time to start is determined, and rotation of the shutter member is started at the fourth time.   The exposure apparatus according to claim 6, wherein the control unit determines the third time according to a scheduled time at which an exposure amount of the substrate becomes a target exposure amount.   The controller starts to decelerate the shutter member before the entire cross section of the optical path region is included in the blocking portion, and the shutter also after the entire cross section of the optical path region is included in the blocking portion. The exposure apparatus according to claim 6, wherein the rotation of the member is decelerated.   9. The exposure apparatus according to claim 1, wherein the shutter member includes the two blocking portions disposed symmetrically with respect to a rotation axis of the shutter member.   The exposure according to any one of claims 1 to 9, wherein the blocking portion and the passage portion are configured such that the opening angles of the shutter member with respect to the rotation axis are equal to each other. apparatus. An exposure apparatus for exposing a substrate,
A shutter member that has a blocking portion that blocks light emitted from the light source and a passing portion that allows the light to pass therethrough, and that switches between irradiation and non-irradiation of the light to the substrate by rotating;
A control unit that controls the rotation of the shutter member so that the light is allowed to pass through the passage portion from the state where the light is blocked at the cutoff portion;
Including
The passage portion is larger than a cross section of an optical path region through which the light passes,
The controller starts to reduce the rotation of the shutter member before the entire cross section of the optical path region is included in the passage portion, and even after the entire cross section of the optical path region is included in the passage portion. An exposure apparatus that decelerates rotation of the shutter member. A step of exposing a substrate using the exposure apparatus according to any one of claims 1 to 11,
Developing the substrate exposed in the step;
A method for producing an article comprising:

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