JP2015141685A - Apparatus and method for testing capacitance sensors - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and method for testing capacitance sensors, which allow for checking wiring lines for broken lines or the like even after a conductor pattern of a base material layer is covered with a protective layer.SOLUTION: A test apparatus includes; a connection substrate to be connected to a capacitance sensor; testing means for checking for anomalies of the capacitance sensor connected to the connection substrate; a computer device for reporting at least a test result of the testing means; and a conductive test jig to be brought into contact with a conductive pattern of the capacitance sensor. The capacitance sensor includes a non-conductive base material layer, a conductor pattern formed on the base material layer, and a protective cover layer that covers the conductive pattern layer. The testing means has functions for; obtaining a Diff value using capacitance measured when the test jig is brought into contact with a plurality of detection electrodes of the conductor pattern of the capacitance sensor connected to the connection substrate; comparing the obtained Diff value with a determination value; and, when the compared Diff value does not match the determination value, outputting an NG result to the computer device.

Description

  The present invention relates to an inspection device and an inspection method for an electrostatic capacity sensor used in the manufacturing stage and the shipping stage of the electrostatic capacity sensor.

  Although the conventional capacitance sensor is not shown, an insulating base material layer, a conductive pattern formed on the base material layer, and a transparent protective cover that adheres to the surface of the base material layer and covers the conductive pattern And a human body contact or the like is detected by a change in electrostatic capacity accompanying the approach of a finger or the like (see Patent Documents 1 and 2).

  The base material layer is formed in, for example, a flat rectangular shape, and an elongated tail protrudes from the peripheral edge. In addition, the conductive pattern includes a plurality of detection electrodes arranged in the base material layer and close to a finger, etc., and a plurality of wiring lines extending from the plurality of detection electrodes to the tail via the peripheral edge of the base material layer And a plurality of connection terminals formed at the ends of the respective wiring lines extending to the tail of the base material layer.

  In such a capacitance sensor, a conductive pattern is formed on the surface of the base material layer, and the protective cover layer is adhered to the surface of the base material layer. In-process contact electrical inspection is performed before and after the adhesion of the protective cover layer. And sensitivity test are performed respectively. When the in-process contact electrical inspection is performed before adhesion of the protective cover layer, the probe comes into contact with the detection electrode and the connection terminal of the conductive pattern, and the resistance value is measured. Existence is inspected (see Patent Document 3).

  On the other hand, when the in-process contact electrical inspection is performed after adhesion of the protective cover layer, the probe contacts between a plurality of connection terminals, and the resistance value is measured, so that the detection electrode or the wiring line is short-circuited. The presence or absence of leaks is inspected (see Patent Document 4).

  The sensitivity test is performed before the electrostatic capacitance sensor is shipped after the protective cover layer is adhered to the surface of the base material layer. Specifically, the microcomputer module is electrically connected to a plurality of connection terminals of the capacitance sensor, the conductive pseudo finger contacts the detection electrode of the conductive pattern, and the capacitance after the contact of the pseudo finger is measured. A Diff value (sensitivity value) is acquired by the calculation used, and the acquired Diff value is compared with a preset threshold value. If the Diff value deviates from the threshold value as a result of the comparison, it is regarded as abnormal. Thus, the sensitivity of the detection electrode of the conductive pattern is inspected.

JP 2012-194874 A JP 2010-86026 A JP 2013-105196 A JP 2012-227097 A

  Since the conventional capacitance sensor is configured as described above, it is possible to effectively inspect the disconnection of the wiring line before the protective cover layer is adhered to the base material layer. At the stage after the cover layer is adhered, disconnection or the like of the wiring line cannot be effectively inspected, and there is a problem that inspection work is restricted and becomes very complicated. In addition, if the in-process contact electrical inspection and sensitivity inspection can be performed together after the protective cover layer is adhered to the base material layer, the inspection work will be greatly simplified, making the work smoother and faster. Is very convenient.

  The present invention has been made in view of the above, and a capacitance sensor inspection apparatus and inspection method capable of inspecting disconnection or the like of a wiring line even after the conductive pattern of the base material layer is covered with a protective layer. The purpose is to provide. Another object of the present invention is to provide an inspection device and an inspection method for a capacitance sensor that can collectively perform in-process contact electrical inspection and sensitivity inspection after adhesion of the protective layer.

In the present invention, in order to solve the above problems, a connection board connected to the capacitance sensor, an inspection means for inspecting whether there is an abnormality in the capacitance sensor connected to the connection board, and at least an inspection of the inspection means An apparatus comprising an informing means for informing a result, and a conductive inspection tool in contact with the conductive pattern of the capacitance sensor,
The capacitance sensor includes an insulating base material layer, a conductive pattern formed on the base material layer, and a protective layer covering the conductive pattern, and has a tail connected from the base material layer to the connection substrate. A plurality of detection electrodes formed on the base material layer, a plurality of wiring lines extending from the plurality of detection electrodes to the tail of the base material layer, and each wiring extending to the tail of the base material layer Formed from a connection terminal electrically connected to the connection board,
The inspection means has a function of acquiring a difference value using the capacitance when the inspection tool comes into contact with a plurality of detection electrodes of the conductive pattern of the capacitance sensor connected to the connection substrate, and the acquired difference value is determined. It is characterized by realizing a function of comparing values and a function of outputting the result to the notification means when the compared difference value is out of the determination value.

  The inspection unit measures the capacitance of the plurality of detection electrodes forming the conductive pattern of the capacitance sensor connected to the connection substrate, and acquires an average value of at least one of the raw value and the reference value. A function, a function for comparing the acquired average value with the judgment value, a function for outputting the result to the notification means when the compared average value is out of the judgment value, and a comparison of the average value out of the judgment value The average value of the raw value and the reference value is obtained using the capacitance when the inspection tool comes into contact with the plurality of detection electrodes of the conductive pattern of the capacitance sensor connected to the connection board. The function of acquiring the difference value can be realized by the calculation using these values.

  The inspection unit obtains an average value of the raw value and the reference value using the capacitance when the inspection tool comes into contact with the plurality of detection electrodes of the conductive pattern of the capacitance sensor connected to the connection substrate. In addition, a function to acquire the difference value by calculation using these values and a function to estimate the resistance value of the conductive pattern from the average value of the acquired raw values and output the estimation result to the notification means are realized. can do.

  Further, the inspection means has a function of measuring the capacitance of a plurality of detection electrodes forming the conductive pattern of the capacitance sensor connected to the connection substrate and obtaining an average value of the unprocessed values, It is also possible to realize a function of estimating the resistance value of the conductive pattern from the average value of the processed values and outputting the estimated result to the notification means and a function of comparing the average value of the unprocessed values with the determination value.

In addition, among the capacitance sensor, the connection board, the inspection means, and the inspection tool, the inspection jig includes at least the capacitance sensor, the connection board, and the inspection tool. A first mounting board to be mounted and a second mounting board for mounting the connection board are provided, and the plurality of connection terminals and the connection board for forming the conductive pattern of the capacitance sensor are electrically connected to the second mounting board. Fixed fixtures to connect
The inspection tool is a column-shaped block that is mounted on the first mounting plate of the inspection jig and covers the capacitance sensor, and a detection electrode that is supported by the block and forms a conductive pattern of the capacitance sensor. Preferably, it includes a conductive test pin.

  In order to solve the above-mentioned problems, the present invention is characterized by inspecting the presence or absence of abnormality of the capacitance sensor by the capacitance sensor inspection device according to any one of claims 1 to 5.

  Here, the capacitance sensor in the claims may be any of a self-capacitance sensor, a mutual capacitance sensor, and a self-mutual capacitance sensor. The base material layer and the conductive pattern of this capacitance sensor are not particularly required to be transparent, opaque or translucent. The base material layer is not particularly limited to a flat circular shape, a rectangular shape, a polygonal shape, or the like, and may be formed three-dimensionally. Further, when a conductive inspection tool is brought into contact with a plurality of detection electrodes of the capacitance sensor, a difference value can be obtained by bringing the inspection tool into contact with the plurality of detection electrodes farthest from the wiring line.

  The detection electrode of the capacitance sensor is formed into a planar circle, rectangle, polygon, comb, or the like. Further, the notification means includes at least various computer devices, buzzers, lamps, and the like. Preferably, the inspection unit realizes a function of regarding the wiring line of the conductive pattern as a disconnection when the compared difference value is not deviated from the determination value and outputting the disconnection result to the notification unit. Further, it is preferable to realize a function of regarding the detected difference of the conductive pattern as damage to the detection electrode when the value of the compared difference value is out of the determination value and lower than the determination value, and outputting the damage result to the notification means.

  The inspection means may have a function of acquiring an average value of the raw value and the reference value, an average value of the raw value, or an average value of the reference value. Furthermore, it is preferable to realize a function of regarding the leakage of the conductive pattern and the like and outputting the result to the notification means when the compared average value is higher or lower than the determination value.

  According to the present invention, when inspecting a capacitance sensor in which the conductive pattern of the base material layer is covered with the protective layer, the plurality of connection terminals of the tail of the capacitance sensor are fixed to the connection substrate, and the inspection means And the inspection tool is brought into strong contact with the plurality of detection electrodes of the capacitance sensor. Then, the inspection unit measures the capacitance of the plurality of detection electrodes, acquires a difference value, and compares the acquired difference value with a determination value. In this comparison, if the detection electrode, wiring line, or connection terminal of the capacitance sensor is missing or disconnected, the compared difference value deviates from the determination value, and the determination result indicating abnormality is output to the notification means. .

  When a determination result indicating that there is an abnormality is output to the notification means and the notification means notifies, it is found that the inspected capacitance sensor is abnormal, so that the inspection target capacitance sensor is regarded as a rejected product and processed. be able to. On the other hand, when the compared difference value of the detection electrodes is within the determination value, it has been found that there is no abnormality in the capacitance sensor, so that the capacitance sensor to be inspected can be shipped. .

According to the present invention, it is possible to effectively and reliably inspect the disconnection of the wiring line of the conductive pattern even at the stage after the conductive pattern of the capacitance sensor is covered with the protective layer.
According to the second aspect of the present invention, in-process contact electrical inspection and sensitivity inspection are performed at a time even when the capacitance sensor to be inspected is a self-capacitance sensor, a mutual capacitance sensor, or a self-mutual capacitance sensor. Can do. Therefore, damage, disconnection, leakage, short circuit, etc. of the conductive pattern can be effectively and reliably inspected collectively.

  According to the invention described in claim 3, since the resistance value of the conductive pattern is estimated from the average value of the acquired raw values, the estimation result is output to the notification means before the acquired difference value is compared with the determination value. Thus, the convenience of inspection can be achieved.

  According to the invention of claim 4, since the resistance value of the conductive pattern is estimated from the average value of the acquired raw values, the estimation result is calculated before comparing the average value of the acquired raw values with the determination value. The information can be output to the notification means for convenience of inspection. For example, if the estimated resistance value is low, a short circuit between the wiring lines is suspected when the wiring line of the conductive pattern is made of silver paste or the like. Also, for example, if the estimated resistance value is a medium resistance value, if the detection electrode of the conductive pattern is made of a conductive polymer or the like, a leak between the detection electrodes is suspected, so it is possible to call attention to inspection work Become.

  According to the fifth aspect of the invention, it is possible to stabilize at least the inspection posture of the capacitance sensor, the connection board, and the inspection tool by the inspection jig. In addition, it is possible to reliably connect the plurality of connection terminals of the capacitance sensor and the connection substrate. Furthermore, since the conductive inspection pin of the inspection tool contacts the detection electrode of the capacitance sensor as an artificial finger in an area that does not change, stable inspection can be expected.

It is plane explanatory drawing which shows typically the self-capacitance sensor in embodiment of the inspection apparatus of the electrostatic capacitance sensor which concerns on this invention. It is the II-II sectional view explanatory drawing of FIG. It is a plane explanatory view showing typically the mutual capacity sensor in the embodiment of the inspection apparatus of the electrostatic capacity sensor concerning the present invention. FIG. 4 is a sectional view taken along line IV-IV in FIG. 3. It is plane explanatory drawing which shows typically the connection board | substrate and test | inspection means in embodiment of the inspection apparatus of the electrostatic capacitance sensor which concerns on this invention. It is explanatory drawing which shows typically the test | inspection flowchart of the test | inspection means in embodiment of the test | inspection apparatus and test | inspection method of the electrostatic capacitance sensor which concern on this invention. It is a perspective explanatory view showing typically an inspection tool and an inspection jig in an embodiment of an inspection device of a capacitance sensor concerning the present invention. It is a perspective explanatory view showing typically the inspection jig in the embodiment of the inspection device of the capacitance sensor concerning the present invention. It is a perspective explanatory view showing typically the capacitance sensor and the inspection jig in the embodiment of the inspection device of the capacitance sensor according to the present invention. It is a plane explanatory view showing a state where a detection electrode of a capacitance sensor in an embodiment of an inspection device and inspection method of a capacitance sensor concerning the present invention has a chip, and a wiring line is disconnected. It is explanatory drawing which shows typically the test | inspection flowchart of the test | inspection means in 2nd Embodiment of the test | inspection apparatus and test | inspection method of the electrostatic capacitance sensor which concern on this invention. It is a plane explanatory view showing typically the leaked self-capacitance sensor in the 2nd embodiment of the inspection device and inspection method of the capacitance sensor concerning the present invention. It is a plane explanatory view showing a normal mutual capacitance sensor in a 3rd embodiment of an inspection device and inspection method of a capacitance sensor concerning the present invention. It is a plane explanatory view showing a broken abnormal mutual capacitance sensor in a 3rd embodiment of an inspection device and inspection method of a capacitance sensor concerning the present invention.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. An inspection apparatus for a capacitance sensor according to this embodiment includes a base material layer 2 and a protective cover layer 10 as shown in FIGS. Is a device for inspecting the electrostatic capacitance sensor 1 having the conductive pattern 5 interposed therebetween, the connection substrate 20 connected to the conductive pattern 5 of the electrostatic capacitance sensor 1, and the electrostatic capacitance connected to the connection substrate 20. Inspection means 30 for inspecting the presence or absence of abnormality of the sensor 1, computer equipment 40 for informing at least the inspection result of the inspection means 30, an inspection tool 50 in contact with the conductive pattern 5 of the capacitance sensor 1, and capacitance The sensor 1, the connection substrate 20, the inspection means 30, and the inspection jig 60 on which the inspection tool 50 is mounted.

  The electrostatic capacity sensor 1 can be either (1) a self-capacitance sensor 1A that is easy to mount and generates less noise, (2) a mutual-capacitance sensor 1B that has high noise resistance, or (3) a self-mutual-capacity sensor that has these characteristics. Inspected as necessary. In the case of the self-capacitance sensor 1A, the capacitance sensor 1 includes, for example, an insulating base layer 2 and a conductive pattern 5 formed on the surface of the base layer 2 as shown in FIGS. The transparent protective cover layer 10 that is adhered to the surface of the base material layer 2 and covers a part of the conductive pattern 5 is formed.

  The base material layer 2 is formed into a flat rectangular shape extending in the left-right direction using, for example, various thin resin films or glass having flexibility, and is an elongated tail 3 electrically connected to the connection substrate 20 from the center of the rear edge of the periphery. And a reinforcing plate 4 for increasing the strength is attached to the back surface of the tail 3. When a resin film is selected as the material of the base material layer 2, a film made of polyethylene terephthalate, polycarbonate, polyethylene naphthalate, polyimide, polyamide, acrylic resin, cycloolefin polymer, or the like is used as the resin film.

  The conductive pattern 5 includes a plurality of detection electrodes 6 that are arranged at intervals in the XY direction of the base material layer 2 and are close to a finger or the like, and a peripheral portion of each detection electrode 6 through a peripheral portion of the base material layer 2. The plurality of wiring lines 7 extending to the tail 3 and the plurality of connection terminals 9 formed at the end portions of the wiring lines 7 extending to the tail 3 of the base material layer 2 are formed.

  The plurality of detection electrodes 6 are arranged in a horizontal row at intervals, and each detection electrode 6 corresponds to the size of a finger or the like by a paste containing metal fine particles, carbon, carbon nanotubes, carbon nanofibers, metal deposition, or the like. It is formed in a plane circle. When translucency is required for each detection electrode 6, it is formed into a planar circle by a resin containing a conductive polymer (for example, PEDOT / PSS), a metal oxide film such as ITO, and metal fine particles such as silver nanowires. The

  Each wiring line 7 is formed into a strip of thin thin film using, for example, a paste containing metal particles, a carbon paste, a metal thin film, ITO, a conductive polymer, or the like. When the material of the wiring line 7 is metal particles or a metal thin film, gold, silver, copper, aluminum or the like is used. The wiring line 7 is formed in a planar ring shape that is laminated on the peripheral edge of the detection electrode 6 in order to ensure the connection at the tip part, and a protective carbon coat layer 8 is laminated on the terminal part. The end portion where the coat layer 8 is laminated functions as a connection terminal 9 for connection.

  The protective cover layer 10 is formed in a substantially convex shape having an insulating property by the same material as that of the base material layer 2, and is adhered to the surface of the base material layer 2 and a part of the tail 3 via an insulating adhesive material. Thus, the plurality of detection electrodes 6 and the plurality of wiring lines 7 are covered and protected, and the plurality of connection terminals 9 are exposed.

  In the case of the mutual capacitance sensor 1B, the capacitance sensor 1 is basically formed in the same manner as the self-capacitance sensor 1A, but the base material layer 2 and the conductive pattern 5 are changed. As shown in FIGS. 3 and 4, the base material layer 2 of the mutual capacitance sensor 1 </ b> B is formed in a planar rectangle extending in the front-rear direction, and the tail 3 electrically connected to the connection substrate 20 from the center of the rear edge of the periphery. It protrudes, and a reinforcing plate 4 for improving the strength is attached to the back surface of the tail 3.

  As shown in the figure, the conductive pattern 5 includes, for example, a plurality of detection electrodes 6 arranged in a 2 × 4 matrix, and each detection electrode 6 is divided into a transmission detection electrode 11 and a reception detection electrode 12. . These transmission / reception detection electrodes 11 and 12 are each formed in a substantially planar comb shape, and the transmission detection electrode 11 and the reception detection electrode 12 are engaged with each other through a slight gap.

  Since each detection electrode 6 is divided into a transmission detection electrode 11 and a reception detection electrode 12, the wiring line 7 is also divided into a transmission wiring line 13 and a reception wiring line 14. The transmission wiring line 13 is electrically connected to the outer peripheral edge of each of the plurality of transmission detection electrodes 11. On the other hand, the reception wiring line 14 branches to the outer peripheral edge portions of the plurality of reception detection electrodes 12 and is electrically connected and shared. The plurality of transmission wiring lines 13 and reception wiring lines 14 are extended side by side on the tail 3 of the base material layer 2 via a jumper structure, and the plurality of transmission wiring lines 13 and reception wiring lines are extended. A short dummy terminal 15 is formed between the 14 connection terminals 9 as necessary.

  As shown in FIG. 5, the connection substrate 20 is integrated with the inspection unit 30 and is electrically connected to the plurality of connection terminals 9 of the conductive pattern 5 of the capacitance sensor 1. The connection substrate 20 is formed wide so as to be electrically connected to the plurality of connection terminals 9 regardless of the size and type of the capacitance sensor 1.

  As shown in FIG. 5, the inspection means 30 is integrated with the connection board 20 and is supplied with a wiring board 31 that is fed from a power source, a microcontroller 32 for the capacitance sensor 1 mounted on the wiring board 31, A USB microcontroller 33 mounted on the wiring board 31, a connector 34 for a computer device 40 mounted on the wiring board 31, and an interface 35 mounted on the wiring board 31 and capable of communicating with a control controller (PLC). And these are conducted.

  The microcontrollers 32 and 33 are not particularly limited. For example, the CPUs, RAMs, ROMs, I / O blocks and the like are built in, and the digital circuit and the analog circuit can be separately designed in the IC. PSoC made by the company is used. The PSoC includes CY8C21645 type, CY8C22345 type, and CY8C24994 type.

  The microcontroller 32 for the capacitance sensor 1 has a plurality of input terminals connected to the connection board 20, a predetermined history and the like stored in the RAM, and a predetermined program stored in the ROM. These programs are rewritten as necessary by the controller connected via the interface 35. The predetermined program is rewritten according to the type of the capacitance sensor 1 or the like.

  Such an inspection means 30 realizes a predetermined function as a computer when the CPU of the microcontroller 32 reads a predetermined program stored in the ROM area using the RAM area as a work area. That is, as shown in FIG. 6, when the conductive inspection tool 50 comes into contact with the plurality of detection electrodes 6 of the capacitance sensor 1 connected to the connection substrate 20, the capacitance is measured and the Diff value (difference) Value) by calculation, a function for comparing the acquired Diff value with the predetermined determination upper limit value and determination lower limit value, and when the compared Diff value is out of the determination upper limit value and determination lower limit value A function of outputting the determination result to the computer device 40 is realized.

  When acquiring the Diff value, the capacitance is measured to obtain the average value of the raw count (raw value) and the baseline value (reference value), respectively, and the average value of the baseline value is calculated from the average value of the raw count. The subtracted value can be used as the Diff value. Although the value of the raw count varies depending on the capacitance of the detection electrode 6, the variation also affects other than a human finger or the like, so the variation component is canceled by the baseline value.

  The baseline value is obtained from the Raw count and functions as a bandpass filter that detects the movement of a finger or the like. This baseline value is the same value as the Raw count when gradual fluctuation occurs. The determination upper limit value and the determination lower limit value are set in advance with reference to the Diff value of the capacitance sensor 1 that is completely appropriate.

  The computer device 40 is an existing device provided with a display device, and dedicated inspection software is installed. The computer device 40 is connected to the inspection means 30 via a USB or a connector 34, and enables monitoring of the Raw count, baseline value, and Diff value of the capacitance sensor 1 in real time.

  As shown in FIG. 7, the inspection tool 50 is mounted on an inspection jig 60 to cover the capacitance sensor 1, and is supported by the block 51 to a plurality of detection electrodes 6 of the capacitance sensor 1. A plurality of conductive inspection pins 55 in contact with each other are provided. The block 51 includes a plurality of opposing plates 52 that face each other at a predetermined interval in the vertical direction, and a plurality of connecting rods 53 that pass through and connect the four corners of the plurality of opposing plates 52. It is comprised with the metal material of this, resin material, etc.

  On both sides of the surface of the uppermost opposing plate 52, gripping operation handles 54 each having a substantially U shape are mounted as necessary. Further, the plurality of conductive inspection pins 55 are lined up and supported by the plurality of opposing plates 52 of the block 51, and each conductive inspection pin 55 is formed in a cylindrical shape with a conductive material. As a contact with a stable area. The number of the conductive inspection pins 55 is appropriately changed in consideration of the number of detection electrodes 6, and the shape of the conductive inspection pins 55 is changed according to the shape of the detection electrodes 6.

  As shown in FIGS. 7 to 9, the inspection jig 60 is supported by a large flat base plate 61 having a rectangular plane and a plurality of support rods on the base plate 61, and the capacitance sensor 1 and the inspection tool 50. The first mounting plate 62 for horizontally mounting the block 51, and the second mounting plate for horizontally mounting the connection substrate 20 and the inspection means 30 supported on the base plate 61 via a plurality of support rods. 63.

  The first and second mounting plates 62 and 63 are formed in planar rectangles having different sizes, and are arranged in parallel at the same height in a state where they are combined vertically and horizontally. A vertically long clamp tool 64 that electrically positions and presses the plurality of connection terminals 9 of the capacitance sensor 1 to the connection board 20 is provided in the vicinity of the first mounting plate 62 on the surface of the second mounting plate 63. Installed.

  In the above, when inspecting the capacitance sensor 1 in which the protective cover layer 10 is adhered to the base material layer 2, first, the computer device 40 is activated and the sample is placed on the first mounting plate 62 of the inspection jig 60. The capacitance sensor 1 is set (S1 in FIG. 6), the capacitance sensor 1 is fixed to the first mounting plate 62 of the inspection jig 60 (S2), and a plurality of the tails 3 of the capacitance sensor 1 are fixed. The connection terminal 9 is positioned and fixed to the connection substrate 20 by the clamp 64 (S3).

  When setting the capacitance sensor 1, although depending on the material of the base material layer 2 and the conductive pattern 5, if the conductive pattern 5 is severely damaged or the like is visually apparent, The capacitance sensor 1 can be discarded, and another capacitance sensor 1 can be the inspection target. For example, when the detection electrode 6 of the conductive pattern 5 is opaque and has a large chip, the chip is visually apparent, so that the capacitance sensor 1 to be inspected can be discarded. On the other hand, when the detection electrode 6 of the conductive pattern 5 is transparent and chipped, or when the wiring line 7 is transparent and disconnected, the chipping or disconnection is not clearly determined. Inspect as it is.

  When the plurality of connection terminals 9 of the capacitance sensor 1 are fixed to the connection substrate 20 by positioning and pressure contact, the capacitance sensor 1 is not touched. This is because the capacitance of the detection electrode 6 may change when the capacitance sensor 1 is touched.

  After the electrostatic capacitance sensor 1 is positioned and fixed to the connection substrate 20, the inspection means 30 and the microcontroller 32 for the electrostatic capacitance sensor 1 are operated (S4), and the inspection tool 50 is applied to each detection electrode 6 of the electrostatic capacitance sensor 1. The flat end face of the conductive inspection pin 55 which is a pseudo finger is pressed through the protective cover layer 10 (S5).

  Then, the inspection means 30 measures the capacitance and converts it into a digital value, acquires the average value of the Raw count and the baseline value, acquires the Diff value by calculation using these average values (S5), The acquired Diff value is compared with a predetermined determination upper limit value and determination lower limit value, and the determination result (OK, NG) is output to the computer device 40 as shown in Table 1 (S6).

  At this time, the inspection unit 30 can realize a function of estimating the resistance value of the conductive pattern 5 from the acquired average value of the Raw count and outputting the estimation result to the computer device 40. To explain this point, for example, the plurality of connection terminals 9 of the capacitance sensor 1 are insulated and the resistance value is ideally infinite, but the adjacent connection terminals 9 and the connection terminals 9 leak. If the resistance value changes, the average value of the Raw count acquired by the microcontroller 32 also changes.

  For example, when the microcontroller 32 is a Cypress PSoC CY8C21645 type, the average value of the Raw count becomes higher as the resistance value between the adjacent connection terminals 9 is lower, and also when the Cypress PSOC CY8C22345 type is used. The lower the resistance value between adjacent connection terminals 9, the higher the value. Further, in the case of the CY8C24994 type of PSoC manufactured by Cypress, the lower the resistance value between adjacent connection terminals 9, the lower the value.

  Therefore, if the resistance value of the conductive pattern 5 is estimated from the acquired average value of the Raw count, the acquired Diff value is compared with the determination upper limit value and the determination lower limit value, and the determination result is output to the computer device 40. Before, the result according to the estimation result can be output to the computer device 40 to contribute to the inspection work. For example, when the wiring line 7 is made of silver paste, if the estimated resistance value is low, a leak or a short circuit between the wiring lines 7 is suspected. In addition, it can be used as a reference for later inspection work, and the inspection accuracy can be improved.

  When comparing the Diff value with the determination upper limit value and the determination lower limit value, as shown in FIG. 10, when the disconnection 16 occurs in the wiring line 7 of the No. 2 detection electrode 6 of the capacitance sensor 1, the comparison was made. The Diff value is significantly lower than the determination lower limit value, and the Diff value deviates from the determination value and becomes abnormal.

  At this time, the NG result is output to the computer device 40, for example, “No. 2 detection electrode is NG” (see Table 1). Also, the raw count and the baseline value are the same value, the Diff value does not change at 0, and the cause of the NG result can be assumed to be a disconnection. Therefore, the cause of the NG result is “the wiring line of the detection electrode of No2 is disconnected” And the like are specifically output to the computer device 40 (see Table 1).

  Further, as shown in FIG. 10, when the chip 17 is partially generated in the No. 4 detection electrode 6 of the capacitance sensor 1, the compared Diff value is lower than the determination lower limit value, and the Diff value is It is out of the judgment value and becomes abnormal. At this time, the NG result is output to the computer device 40, for example, “No. 4 detection electrode is NG” (see the same table). Further, the Diff value changes when the raw count and the baseline value are different, and it can be estimated that the cause of the NG result is missing. Therefore, the cause of the NG result is specifically described as “No. 4 detection electrode missing” or the like. (See the same table).

  When the compared Diff value is higher than the determination upper limit value, the positioning and fixing of the capacitance sensor 1 is incomplete, or the detection electrode 6 of the capacitance sensor 1 and the conductive inspection pin 55 of the inspection tool 50 are used. A problem such as an abnormally short distance is suspected. At this time, since there is no abnormality in the capacitance sensor 1 to be inspected, the inspection environment of the capacitance sensor 1 is reconfirmed.

  When an NG result is output to the computer device 40 and the cause is specifically displayed, it is found that the inspected electrostatic capacity sensor 1 is abnormal, and therefore the inspected electrostatic capacity sensor 1 is not used. It is considered that the product is acceptable and is discarded or repaired after completing the inspection work (S7). On the other hand, when the Diff values of all the detection electrodes 6 compared are within the determination value, it has been found that there is no abnormality in the capacitance sensor 1, so that the capacitance sensor 1 to be inspected is completely passed. The inspection tool 50 and the capacitance sensor 1 are removed from the inspection jig 60 and are shipped.

  According to the above, even after the protective cover layer 10 is adhered to the base material layer 2, the inspection electrode 6 can be effectively inspected for the chip 17 of the detection electrode 6 and the disconnection 16 of the wiring line 7. The inspection becomes really easy. In addition to the NG result, the cause of the NG result is specifically displayed. Therefore, the protective cover layer 10 of the capacitance sensor 1 can be peeled off to repair the conductive pattern 5 quickly and accurately.

  Next, FIGS. 10 to 12 show a second embodiment of the present invention. In this case, the inspection means 30 forms a plurality of conductive patterns 5 of the capacitance sensor 1 connected to the connection substrate 20. The capacitance of the detection electrode 6 is measured and converted into a digital value, and a function for acquiring an average value of at least one of the Raw count and the baseline value, and a determination upper limit value and a determination lower limit value in which the acquired average value is preset. And the function of outputting the NG result to the computer device 40 when the compared average value deviates from the determination upper limit value and the determination lower limit value, and the compared average value from the determination upper limit value and the determination lower limit value. When the conductive inspection tool 50 is in contact with the plurality of detection electrodes 6 of the capacitance sensor 1 connected to the connection substrate 20 when it is not detached, the capacitance is measured and converted into a digital value, The function of acquiring the iff value, the function of comparing the acquired Diff value with the predetermined determination upper limit value and determination lower limit value, and the determination result when the compared Diff value is out of the determination upper limit value and determination lower limit value To the computer device 40 is realized.

  For the determination upper limit value and the determination lower limit value compared with the average value of at least one of the raw count and the baseline value, refer to the average value of the raw count and the average value of the baseline value of the capacitance sensor 1 that is completely appropriate. Is preset.

  In the above, when inspecting the capacitance sensor 1 in which the protective cover layer 10 is adhered to the base material layer 2, first, the computer device 40 is activated and the sample is placed on the first mounting plate 62 of the inspection jig 60. The capacitance sensor 1 is set (S1 in FIG. 11), the capacitance sensor 1 is fixed to the first mounting plate 62 of the inspection jig 60 (S2), and the plurality of tails 3 of the capacitance sensor 1 are fixed. The connection terminal 9 is positioned and fixed to the connection substrate 20 by the clamp 64 (S3), and the inspection means 30 and the microcontroller 32 for the capacitance sensor 1 are operated (S4).

  When the inspection unit 30 is operated, the microcontroller 32 of the inspection unit 30 measures and digitally converts the raw capacitance of each detection electrode 6 of the capacitance sensor 1 connected to the connection substrate 20, and the Raw count. And the average value of the baseline values are respectively obtained (S9), and the obtained average value is compared with a predetermined determination upper limit value and determination lower limit value, and the determination result (OK, NG) is calculated as shown in Table 2. It outputs to the apparatus 40 (S10).

  At this time, as shown in FIG. 10, when the disconnection 16 occurs in the wiring line 7 of the No. 2 detection electrode 6 of the capacitance sensor 1, the compared average value is lower than the determination lower limit value, and the determination is made. It will be out of value. At this time, the NG result is output to the computer device 40, for example, “No. 2 detection electrode is NG” (see Table 2). Moreover, since it can be estimated from the NG result that there is some defect in the No. 2 detection electrode 6 and its wiring line 7, the cause of the NG result is output to the computer device 40 as “No. 2 detection electrode is defective” or the like ( (See Table 2).

  In addition, as shown in the figure, even when a chip 17 is partially generated in the No. 4 detection electrode 6 of the capacitance sensor 1, the average value compared becomes lower than the determination lower limit value, and the It will come off. At this time, the NG result is output to the computer device 40, for example, “No. 4 detection electrode is NG” (see the same table). Moreover, since it can be estimated from the NG result that there is some defect in the No. 4 detection electrode 6 and its wiring line 7, the cause of the NG result is specifically output to the computer device 40 such as “No. 4 detection electrode is defective”. (See Table 2).

  In addition, as shown in FIG. 12, when a leak 18 occurs between the plurality of wiring lines 7 of the capacitance sensor 1, the compared average value is lower than the determination lower limit value or the average value is determined. It becomes higher than the upper limit value, and the average value deviates from the judgment value and becomes abnormal. Also in this case, the NG result is output to the computer device 40.

  Whether the compared average value is lower or higher than the determination value is adjusted depending on the type of the microcontroller 32 for the capacitance sensor 1. For example, in the case of the CY8C21645 type or CY8C22345 type manufactured by Cypress, the Raw count increases as the resistance value of the leak 18 decreases, and the maximum value that the Raw count can take when the resistance value of the leak 18 approaches 0. Value. On the other hand, in the case of the Cypress microcontroller CY8C24994 type, the Raw count decreases as the resistance value of the leak 18 decreases. If the resistance value of the leak 18 approaches 0, the Raw count becomes 0.

  When an NG result is output to the computer device 40, since it has been found that the inspected capacitance sensor 1 is abnormal, is the inspected capacitance sensor 1 regarded as a rejected product and discarded? The inspection work is finished (S11). On the other hand, when the compared average value is within the determination value, it has been found that there is no abnormality in the capacitance sensor 1 under inspection, and thus the inspection is continued.

  In the case as shown in FIG. 10, the capacitance sensor 1 to be inspected may be regarded as a rejected product and immediately discarded, but the detection electrode 6 of the capacitance sensor 1 has no chip 17 and the wiring line 7 When only the disconnection 16 is abnormal, depending on the degree of the disconnection 16 and the values of the determination upper limit value and the determination lower limit value, the compared average value may be erroneously determined to be within the determination value. Further, when repairing the rejected capacitance sensor 1, only “NG” and “defective” are insufficient, and it is necessary to accurately grasp the cause of the NG result. Therefore, in such a case, the inspection of the capacitance sensor 1 can be continued.

  When it is found that there is no abnormality in the capacitance sensor 1 or when the inspection is continued, the conductive inspection pin 55 of the inspection tool 50 is attached to each detection electrode 6 of the capacitance sensor 1 as in the first embodiment. Pressure contact is made through the protective cover layer 10 (S5). Then, the inspection unit 30 measures the capacitance and converts it into a digital value, acquires the raw count and the average value of the baseline value, and acquires the Diff value from the average value by calculation (S5). The Diff value is compared with a predetermined determination upper limit value and determination lower limit value, and the determination result is output to the computer device 40 as shown in Table 1 (S6).

  At this time, if the wiring line 7 of the detection electrode 6 of No. 2 is disconnected, the compared Diff value is significantly lower than the determination lower limit value, and the Diff value deviates from the determination lower limit value. At this time, the NG result is output to the computer device 40, for example, “No. 2 detection electrode is NG” (see Table 1). In addition, since the raw value and the baseline value are the same value, the Diff value does not change, and the cause of the NG result can be assumed to be the disconnection 16, so the computer device 40 indicates that the “No2 detection electrode wiring line is disconnected” or the like. Is specifically output (see Table 1).

  When the No. 4 detection electrode 6 is partially missing, the compared Diff value is lower than the determination lower limit value, and the Diff value deviates from the determination lower limit value. At this time, the NG result is output to the computer device 40, for example, “No. 4 detection electrode is NG” (see the same table). In addition, the Diff value changes when the raw count and the baseline value are different, and the cause of the NG result can be estimated as missing 17. Therefore, the cause of the NG result such as “No 4 detection electrode is missing” in the computer device 40 is concrete. (See the same table).

  When the NG result and the cause thereof are specifically displayed on the computer device 40, since it has been found in detail that the inspected capacitance sensor 1 is abnormal, the inspection subject capacitance sensor 1 is rejected. Dispose of the product as a product or complete the inspection and repair (S7). On the other hand, when the Diff values of all the detection electrodes 6 compared are within the determination value, it has been found that there is no abnormality in the capacitance sensor 1, so that the capacitance sensor 1 to be inspected is completely passed. The inspection tool 50 and the capacitance sensor 1 are removed from the inspection jig 60 and are shipped. Thereby, a series of inspection work is completed completely.

  In this embodiment, the same effect as that of the above embodiment can be expected, and it is not necessary to separately perform the in-process contact electrical inspection and the sensitivity inspection. That is, even at the stage after the protective cover layer 10 is adhered, the sensitivity of the detection electrodes 6 and the chipping 17, the leak 18 between the detection electrodes 6 and the wiring lines 7, the disconnection 16 of the wiring lines 7, and the short circuit between the wiring lines 7. Can be inspected collectively, so that the inspection work can be simplified and the work can be speeded up.

  Next, FIGS. 13 and 14 show a third embodiment of the present invention. In this case, the capacitance sensor 1 is a mutual capacitance sensor 1B, and the mutual capacitance sensor 1B is disconnected. The inspection principle will be described.

  First, a normal mutual capacitance sensor 1B is prepared as a sample, the normal mutual capacitance sensor 1B is set on the first mounting plate 62 of the inspection jig 60, and the plurality of detection electrodes 6 of the mutual capacitance sensor 1B are set to No1. Detection electrodes 6 to No. 4 were set as the detection electrodes 6. When the mutual capacitance sensor 1B is set in the inspection jig 60 in this manner, the conductive inspection pins 55 of the inspection tool 50 are pressed into contact with the detection electrodes 6 of No1 and No4 via the protective cover layer 10, and the raw electrodes of the detection electrodes 6 of No1 and No4 are connected. Count, baseline value, and Diff value were measured.

  Next, a part of the reception wiring line 14 of the mutual capacitance sensor 1B was disconnected, and the disconnected mutual capacitance sensor 1B was set on the first mounting plate 62 of the inspection jig 60. As shown in FIG. 14, the location of the disconnection line 16 of the reception wiring line 14 is an end portion of the reception wiring line 14 connected to the reception detection electrode 12 forming the No. 4 detection electrode 6. After setting the disconnected mutual capacitance sensor 1B, the conductive inspection pin 55 of the inspection tool 50 is pressed into contact with the detection electrodes 6 of No1 and No4 via the protective cover layer 10, and the Raw count and the baseline of the detection electrodes 6 of No1 and No4 are set. Value and Diff value were measured.

  Next, the Raw count, baseline value, and Diff value of the No. 1 detection electrode 6 before and after the disconnection are summarized in Table 3, and the Raw count, baseline value, and Diff value of the No. 4 detection electrode 6 before and after the disconnection are summarized in Table 4. These were examined.

  First, the transmission detection electrode 11 forming the No. 1 detection electrode 6 is not related to the disconnection 16 of the reception wiring line 14 connected to the No. 4 detection electrode 6, so the Raw count, the baseline value, and the Diff value are disconnected. There was almost no change before and after. In contrast, the reception detection electrode 12 forming the No. 1 detection electrode 6 has a Diff count that hardly fluctuates when the reception wiring line 14 connected to the No. 4 detection electrode 6 is disconnected. The value decreased by 179 or more from before the disconnection. Due to the decrease in the raw count and the baseline value, it can be estimated that there is some defect in the shared reception wiring line 14.

  Next, the transmission detection electrode 11 that forms the No. 4 detection electrode 6 has a Diff value that does not vary much when the reception wiring line 14 connected to the No. 4 detection electrode 6 is disconnected, but the Raw count and the baseline value. Decreased by 58 or more from before the disconnection. Due to the decrease in the Raw count and the baseline value, it is possible to predict that there is some defect in the No. 4 detection electrode 6 although the No. 4 transmission detection electrode 11 has no disconnection 16.

On the other hand, in the receiving detection electrode 12 forming the No. 4 detecting electrode 6, when the receiving wiring line 14 is disconnected, the raw count is greatly decreased by 430 or more and the baseline value is significantly decreased by 180 or more before the disconnection. Moreover, the Diff value is 0 from 255 before disconnection.
Due to the fluctuations in the Raw count, the baseline value, and the Diff value, it is possible to specify that the reception wiring line 14 is not connected to the reception detection electrode 12 of the No. 4 detection electrode 6 and is disconnected.

  In the above embodiment, the base material layer 2 of the capacitance sensor 1 is a single sheet. However, a pair of base material layers 2 is prepared, an X conductive pattern group is formed on one base material layer 2, A Y conductive pattern group may be formed on the base material layer 2 and the pair of base material layers 2 may be laminated and adhered via an insulating adhesive material. Further, the plurality of transmission wiring lines 13 and the reception wiring lines 14 may extend to the tail 3 of the base material layer 2 via a jumper structure part or a through hole part, or via the through hole part. You may extend to the tail 3 of the base material layer 2.

  The number of the microcontrollers 32 for the capacitance sensor 1 of the inspection unit 30 may be single, or a plurality of microcontrollers 32 may be used, and the plurality of controllers 32 may realize the above functions as a computer.

  Further, the microcontroller 32 of the above embodiment may realize a function of estimating the resistance value of the conductive pattern 5 from the acquired average value of the Raw count and outputting the estimation result to the computer device 40. To explain this point, for example, the plurality of connection terminals 9 of the capacitance sensor 1 are insulated and the resistance value is ideally infinite, but the adjacent connection terminals 9 leak or are short-circuited. If they are equal, the resistance value changes, and along with this change, the average value of the Raw count acquired by the microcontroller 32 also changes.

  For example, when the microcontroller 32 is a Cypress PSoC CY8C21645 type, the average value of the Raw count becomes higher as the resistance value between the adjacent connection terminals 9 is lower, and also when the Cypress PSOC CY8C22345 type is used. The lower the resistance value between adjacent connection terminals 9, the higher the value. Further, in the case of the CY8C24994 type of PSoC manufactured by Cypress, the lower the resistance value between adjacent connection terminals 9, the lower the value.

  Therefore, if the resistance value of the conductive pattern 5 is estimated from the acquired average value of the Raw count, the acquired average value of the Raw count is compared with the determination upper limit value and the determination lower limit value, and the determination result is output to the computer device 40. Before, the result according to the estimation result can be output to the computer device 40 to speed up the inspection work. For example, if the estimated resistance value is low, if the wiring line 7 is made of silver paste, a short circuit between the wiring lines 7 is suspected. It can be used as a precaution for inspection work.

  For example, if the estimated resistance value is a medium resistance value, when the detection electrode 6 is made of a conductive polymer, leakage between the detection electrodes 6 is suspected. At this time, it may be displayed on the computer device 40 as “Possibility of leak in detection electrode” or the like, and can be used as an important point for later inspection work. In addition, when the capacitance sensor 1 is automatically removed from the inspection jig 60 of the above embodiment, it is preferable to change the place where the capacitance sensor 1 is placed according to the inspection result.

  In addition, the inspection result can be marked on the capacitance sensor 1 after the inspection. The discarded capacitive sensor 1 can be provided with a notch or a large x mark so that it cannot be used. Further, a buzzer or a lamp is used instead of the computer device 40, and if the compared average value is out of the judgment value or the compared Diff value is out of the judgment value, the NG result is output to the buzzer or the lamp. However, it is possible to notify the abnormality with these buzzers and lamps.

  The inspection apparatus and inspection method for a capacitance sensor according to the present invention are used in the field of manufacturing a capacitance sensor.

DESCRIPTION OF SYMBOLS 1 Capacitance sensor 1A Self-capacitance sensor 1B Mutual capacitance sensor 2 Base material layer 3 Tail 5 Conductive pattern 6 Detection electrode 7 Wiring line 9 Connection terminal 10 Protective cover layer (protective layer)
11 Transmitting detection electrode (detection electrode)
12 Detection electrode for detection (detection electrode)
13 Transmission wiring line (wiring line)
14 Receiving wiring line (wiring line)
16 Disconnection 17 Chip 18 Leak 20 Connection board 30 Inspection means 31 Wiring board 32 Microcontroller 33 Microcontroller 34 Connector 35 Interface 40 Computer equipment (notification means)
50 Inspection Tool 51 Block 55 Conductivity Inspection Pin 60 Inspection Jig 62 First Mounting Plate 63 Second Mounting Plate 64 Clamp Tool (Fixing Tool)

Claims (6)

A connection board connected to the capacitance sensor, an inspection means for inspecting the presence or absence of abnormality of the capacitance sensor connected to the connection board, an informing means for informing at least an inspection result of the inspection means, and an electrostatic capacitance A capacitance sensor inspection device comprising a conductive inspection tool that contacts a conductive pattern of a sensor,
The capacitance sensor includes an insulating base material layer, a conductive pattern formed on the base material layer, and a protective layer covering the conductive pattern, and has a tail connected from the base material layer to the connection substrate. A plurality of detection electrodes formed on the base material layer, a plurality of wiring lines extending from the plurality of detection electrodes to the tail of the base material layer, and each wiring extending to the tail of the base material layer Formed from a connection terminal electrically connected to the connection board,
The inspection means has a function of acquiring a difference value using the capacitance when the inspection tool comes into contact with a plurality of detection electrodes of the conductive pattern of the capacitance sensor connected to the connection substrate, and the acquired difference value is determined. An inspection apparatus for a capacitance sensor, which realizes a function of comparing a value and a function of outputting a result of the comparison to a notification means when the compared difference value deviates from a determination value.   The inspection means measures a capacitance of a plurality of detection electrodes forming a conductive pattern of the capacitance sensor connected to the connection substrate, and obtains an average value of at least one of a raw value and a reference value; The function of comparing the acquired average value with the judgment value, the function of outputting the result to the notification means when the compared average value is out of the judgment value, and the compared average value is not out of the judgment value In this case, the average value of the raw value and the reference value is obtained using the capacitance when the inspection tool comes into contact with the plurality of detection electrodes of the conductive pattern of the capacitance sensor connected to the connection substrate, and these The capacitance sensor inspection device according to claim 1, wherein a function of acquiring a difference value is realized by a calculation using the value of the capacitance sensor.   The inspection means obtains the average value of the raw value and the reference value by using the capacitance when the inspection tool comes into contact with the plurality of detection electrodes of the conductive pattern of the capacitance sensor connected to the connection substrate, Claims for realizing a function of acquiring a difference value by calculation using these values and a function of estimating the resistance value of the conductive pattern from the average value of the acquired raw values and outputting the estimation result to the notification means Item 3. The capacitance sensor inspection device according to Item 1 or 2.   The inspection means has a function of measuring the capacitance of a plurality of detection electrodes forming the conductive pattern of the capacitance sensor connected to the connection substrate and obtaining an average value of the raw values, and the acquired raw value 4. The function of estimating the resistance value of the conductive pattern from the average value and outputting the estimated result to the notification means and the function of comparing the average value of the unprocessed value and the judgment value are realized. Inspection device for capacitance sensor. Among the capacitance sensor, the connection board, the inspection means, and the inspection tool, at least the capacitance sensor, the connection board, and an inspection jig for mounting the inspection tool are included, and the inspection jig mounts the capacitance sensor. A first mounting board and a second mounting board for mounting the connection board are provided, and the plurality of connection terminals and the connection board for forming the conductive pattern of the capacitance sensor are electrically connected to the second mounting board. Provide a fixture to connect,
The inspection tool is a column-shaped block that is mounted on the first mounting plate of the inspection jig and covers the capacitance sensor, and a detection electrode that is supported by the block and forms a conductive pattern of the capacitance sensor. 5. The capacitance sensor inspection device according to claim 1, further comprising a conductive inspection pin.   6. A method for inspecting a capacitance sensor, wherein the presence or absence of abnormality of the capacitance sensor is inspected by the capacitance sensor inspection apparatus according to claim 1.

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