JP2015039410A - Endoscope - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an endoscope having high disturbance noise resistance while preventing an insertion part and the endoscope from being enlarged.SOLUTION: The endoscope includes: an imaging device provided at a distal side of the insertion part; an imaging cable 25 that has at least a signal line electrically connected to the imaging device and is extended to the inside of the insertion part; and a cylindrical metal blade 24 that has flexibility, is extended to at least a portion of the insertion part and protects inclusions including at least the imaging cable 25. The blade 24 is electrically connected, at the distal side of the insertion part, to a conductive comprehensive shield 35 covering the signal line of the imaging cable 25 or to a conductor provided in the imaging cable 25.

Description

  The present invention relates to an endoscope, and more particularly to an endoscope having a disturbance noise countermeasure structure.

  2. Description of the Related Art Conventionally, endoscopes for observing or treating an affected part in a body cavity by inserting an elongated insertion part into the body cavity have been widely used. The endoscope is provided with an image sensor such as a CCD (Charge Coupled Device) at the distal end of the insertion section, and displays a subject image captured by the image sensor on a monitor to observe an affected area or a treatment tool. The treatment tool is inserted into the insertion channel to treat the affected area.

  When a high-voltage, high-frequency electric scalpel is used to treat the affected area as a treatment tool inserted into the treatment tool insertion hole of the endoscope, the image sensor is driven by electromagnetic waves when the electric scalpel is output. Noise may be mixed into the signal or the video signal output from the image sensor, and the endoscope image displayed on the monitor may be disturbed.

  In order to prevent such noise contamination, it is conceivable to increase the thickness of the shield wound around the signal cable extending from the image sensor, but increasing the thickness of the shield leads to an increase in the diameter of the insertion portion. There is a limit.

  Therefore, as disclosed in Japanese Patent Application Laid-Open No. 08-286122 and Japanese Patent Application Laid-Open No. 04-183432, a method of reducing the generation of noise by winding a signal cable around a ferrite core has been proposed.

Japanese Patent Laid-Open No. 08-286122 Japanese Patent Laid-Open No. 04-183432

  However, in the case of the techniques disclosed in Japanese Patent Application Laid-Open Nos. 08-286122 and 04-183432, since the ferrite core itself is large, the size of the operation unit or the connector where the ferrite core is arranged is increased. There's a problem. Increasing the size of the operation unit and the connector not only lowers the operability of the endoscope but also may prevent it from being installed in the endoscope cleaning / disinfecting apparatus.

  Furthermore, in recent years, with the increase in the number of pixels of the image sensor, the video signal has become higher in frequency, so the use of the ferrite core dulls the video signal itself and affects the endoscopic image displayed on the monitor. There is also the problem of being out.

  Therefore, an object of the present invention is to provide an endoscope having high disturbance noise resistance while preventing an insertion portion from becoming thick and an endoscope from becoming large.

  An endoscope according to one embodiment of the present invention includes at least an image sensor provided on a distal end side of an insertion portion, and a signal line electrically connected to the image sensor, and an electric circuit extending in the insertion portion. A cable, and a cylindrical, flexible metal blade that extends to at least a part of the insertion portion and protects an inclusion including at least the electric cable, and the blade includes: On the distal end side of the insertion portion, the conductive cable is electrically connected to a conductive shield member that covers the signal line of the electric cable or a conductive wire provided in the electric cable.

  ADVANTAGE OF THE INVENTION According to this invention, the endoscope which has high disturbance noise tolerance is realizable, preventing the increase in diameter of an insertion part and the enlargement of an endoscope.

1 is a configuration diagram showing a configuration of an endoscope apparatus according to a first embodiment of the present invention. It is typical sectional drawing along the axial direction of the insertion part 4 for demonstrating the built-in thing of the insertion part 4 concerning the 1st Embodiment of this invention. It is sectional drawing of the imaging cable 25 covered with the braid | blade 24 concerning the 1st Embodiment of this invention. It is a figure for demonstrating the structure of the shield in the endoscope 2 concerning the 1st Embodiment of this invention. It is sectional drawing along the axial direction of the imaging cable 25 which shows the structure of the site | part in which the braid | blade 24 and the comprehensive shield 35 were electrically connected in the position P1 concerning the 1st Embodiment of this invention. FIG. 3 is a cross-sectional view showing a configuration in which the distal end portion of the general shield 35 is electrically connected to the distal end hard member 8 according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view showing a configuration in which a tip end portion of a blade 24 is electrically connected to a holding frame 63 according to the first embodiment of the present invention. 3 is a diagram illustrating a configuration in which a base end portion of a general shield 35 and a base end portion of a blade 24 are connected to a metal plate 53 provided in a connector 10 according to the first embodiment of the present invention. FIG. It is a figure for demonstrating the structure of the shield in the endoscope 2 concerning the 2nd Embodiment of this invention. It is sectional drawing for demonstrating the conducting wire 71 connected with the braid | blade 24 in the front-end | tip part of the imaging cable 25A concerning the 2nd Embodiment of this invention. It is a fragmentary sectional view which shows the structure of the imaging unit 9A regarding the reference structure 1. FIG. It is sectional drawing along the XII-XII line | wire of FIG. It is a fragmentary sectional view which shows the structure of the imaging unit 9B regarding the reference structure 2. FIG. 6 is a diagram for explaining a state in which a plurality of spot lights are irradiated from the jig to an OB area of the image sensor 7 and a plurality of spot lights are formed in the OB area of the image sensor 7 in the reference configuration 2. FIG. It is a perspective view of image sensor substrate 65C concerning the 1st device about reference composition 3. It is a perspective view of image sensor substrate 65D concerning the 2nd device about reference composition 3. It is a perspective view of image sensor substrate 65D concerning the 3rd device about reference composition 3. 12 is a side view of a relay board 132 for explaining an electrical connection between an imaging element board 65D and a relay board 132 related to Reference Configuration 3. FIG. It is a perspective view of image sensor substrate 65F concerning the 4th device about reference composition 3. FIG. 9 is a partial side view for explaining a state in which each conducting wire of the imaging cable 25 is connected to the imaging element substrate with respect to the reference configuration 4; 6 is a diagram for explaining connection between a plurality of integrally formed conductors 30 and a conductive portion 152 of an image sensor substrate 65 with respect to Reference Configuration 4. FIG. It is a figure for demonstrating mounting | wearing of the several conducting wire 30 to the cable reinforcement resin body 151A which has several insertion hole 151Aa for inserting the several conducting wire 30 regarding the reference structure 4. FIG. It is a figure which shows the state which inserted and attached each conducting wire 30 regarding each reference structure 4 to each penetration hole 151Aa of 151 A of cable reinforcement resin bodies. It is a partial side view for demonstrating the state with which each conducting wire of the imaging cable 25 covered with the conductive resin part integrally molded by the two-color molding is connected to an image pick-up element board | substrate regarding the reference structure 4. FIG. 10 is a diagram for explaining the connection between a plurality of conductive wires 30 covered with a conductive resin portion integrally molded by two-color molding and a conductive portion 152 of an imaging element substrate 65, with respect to Reference Configuration 4. FIG. 12 is a partial cross-sectional view showing a partial configuration of an imaging unit 9C regarding reference configuration 5. FIG. FIG. 6 is a schematic cross-sectional view of the insertion portion 4 at a portion where a CMOS sensor is positioned as an imaging element, with respect to the reference configuration 6; It is sectional drawing along the XXIIX-XXIIX line | wire of FIG.

  Embodiments of the present invention will be described below with reference to the drawings.

In each drawing used for the following description, the scale is different for each component in order to make each component large enough to be recognized on the drawing. It is not limited only to the quantity of the component described in the figure, the shape of the component, the ratio of the size of the component, and the relative positional relationship of each component.
(First embodiment)
(overall structure)
FIG. 1 is a configuration diagram showing a configuration of an endoscope apparatus according to the present embodiment. The endoscope apparatus 1 includes an endoscope 2 and a main body unit 3. The endoscope 2 includes an elongated insertion portion 4, an operation portion 5 provided at a proximal end portion of the insertion portion 4, and a universal cable 6 extending from the operation portion 5.

An imaging unit 9 including an imaging element 7 such as a CCD and a distal end hard member 8 on which the imaging element 7 is disposed is provided at the distal end of the insertion portion 4.
In addition, the insertion portion 4 has a bending portion 4A on the distal end side, and the bending portion 4A is an endoscope according to an operation of a bending operation device (not shown) such as a bending knob provided in the operation portion 5. It is comprised so that it can curve in the desired direction of 2 users.
A connector 10 is provided at the base end of the universal cable 6. The connector 10 can be detachably connected to a connector (not shown) of the main body 3.

  A user of the endoscope apparatus 1 connects the connector 10 of the universal cable 6 of the endoscope 2 to the main body unit 3 and inserts the insertion unit 4 into the subject. A user who is an operator pushes the insertion portion 4 into the patient's body and positions the distal end portion of the insertion portion 4 in the vicinity of the examination site up to the vicinity of the examination site. The user operates the bending operation device of the operation unit 5 to image the examination site with the imaging element 7 provided on the distal end side of the insertion unit 4, and displays the video of the examination site on the monitor ( (Not shown) or by operating the recording button of the operation unit 5 to be recorded in the storage device.

Further, the user inserts a treatment instrument (shown by a dotted line) 11 such as an electric knife from the treatment instrument insertion hole 5 a provided in the operation section 2, and the distal end portion of the electric knife from the distal end opening 4 a of the insertion section 4. By projecting, the treatment can be performed on the examination site.
The proximal end portion of the imaging cable 25 connected to the imaging element 7 is connected to the circuit board 51 of the connector 10.

As shown in FIG. 1, the imaging cable 25 is an electrical cable that has at least a signal line electrically connected to the imaging element 7 and extends in the insertion portion 4. The distal end portion of the imaging cable 25 is electrically connected to the imaging element 7 in the distal end rigid member 8 provided at the distal end portion of the insertion portion 4, and the proximal end portion is connected to the circuit board 51 of the connector 10. . The circuit board 51 is connected to a circuit in the main body 3.
(Configuration of insertion part)
Next, the structure of the insertion part 4 is demonstrated. Various members are inserted into the insertion portion 4. FIG. 2 is a schematic cross-sectional view along the axial direction of the insertion portion 4 for explaining the built-in object of the insertion portion 4.

The insertion portion 4 includes a tubular member 21 and a rubber sheath 22 that covers the outer periphery of the tubular member 21, and various built-in objects are inserted into the tubular member 21.
The tubular member 21 is a metal exterior member having flexibility. The tubular member 21 is an exterior member having a net-like portion and a conductive metal plate-like or tape-like portion.

  An imaging cable 25 that is an electric cable is inserted into the tubular member 21 as a built-in object to be inserted. The outer periphery of the imaging cable 25 is covered with a resin-made outer skin member 23, and the outer skin member 23 is further covered with a blade 24.

  Further, a treatment instrument insertion channel member 26 a that forms a treatment instrument insertion channel 26, a light guide 27, and four bending wires 28 are also inserted into the tubular member 21 as a built-in object. Although not shown, there are other air supply / water supply pipes and the like as other built-in objects.

  The blade 24 is a cylindrical member formed of a conductive metal net. As shown in FIGS. 1 and 2, the metal blade 24 extends in at least a part of the insertion portion 4 and protects the inclusion including at least the imaging cable 25. It is a shaped member. The proximal end portion of the blade 24 is fixed in the connector 10 by a heat shrinkable tube or the like.

The imaging cable 25, which is an electrical cable, is a composite cable that includes a plurality of signal lines. The configuration of the imaging cable 25 will be described later.
The treatment instrument insertion channel member 26a is a tube member through which a treatment instrument such as an electric knife can be inserted.

The light guide 27 is an optical fiber that guides the illumination light in order to emit illumination light from a light source device (not shown) connected to the connector 10 from the distal end portion of the insertion portion 4.
Of the four bending wires 28, the pair of bending wires 28 is a vertical bending wire, and the other pair of bending wires 28 is a horizontal bending wire.
(Image cable configuration)
FIG. 3 is a cross-sectional view of the imaging cable 25 covered with the blade 24.

  The imaging cable 25 includes a power supply line, a ground line, a drive signal line, and a video signal line inside. Here, as shown in FIG. 3, four single wires 31a to 31d (hereinafter, four single wires or any one single wire is referred to as a single wire 31) and four coaxial wires 32a to 32d (hereinafter, four wires). Or an arbitrary coaxial line is referred to as a coaxial line 32) is disposed around an intervening member 33 made of cotton yarn or the like, wound around a resin tape 34, and further conductive around the resin tape 34. A general shield 35, which is a metal film having properties, is covered. That is, the comprehensive shield 35 is provided as a shield member that covers the entire imaging cable 25 including a plurality of conducting wires such as a power supply line and a signal line.

The three power supply lines for the three power supply voltages Vdd1, Vdd2, and Vdd3 and the ground line for the ground potential Vss are each a single line 31, and two drive signal lines for vertical synchronization φV and horizontal synchronization φH. The two video signal lines Vout1 and Vout2 for video signal are coaxial lines 32.
Eight wires wound by the resin tape 34 are covered with a general shield 35 which is a conductive metal shield film.

  The imaging cable 25 covered with the comprehensive shield 35 is covered with a resin-made outer skin member 23, and a blade 24 is covered around the outer skin member 23. As shown in FIG. 1, the imaging cable 25 covered with the comprehensive shield 35 is inserted from the distal end portion of the insertion portion 4 to the connector 10. That is, the blade 24 covers the portion from the distal end portion to the proximal end portion of the imaging cable 25 covered with the general shield 35.

  Here, the imaging cable 25 is disposed from the distal end portion of the insertion portion 4 to the connector 10. However, when the imaging cable 25 is disposed from the distal end portion of the insertion portion 4 to the operation portion 5, the imaging cable is provided. The base end portion of 25 is connected to a circuit board in the operation unit 5.

As will be described later, at the position P1 on the distal end side of the insertion portion 4, a part of the outer skin member 23 is peeled off and removed, and the blade is removed at the portion where the outer shield member 23 is removed and the overall shield 35 is exposed. 24 and the overall shield 35 are electrically connected. The position P1 is a position on the distal end side with respect to the center position between the distal end portion of the insertion portion 4 and the operation portion 5. For example, as shown in FIG. 1, on the proximal end side of the bending portion 4A, the bending portion It is a position in the vicinity of 4A.
(Shield configuration)
FIG. 4 is a diagram for explaining the configuration of the shield in the endoscope 2.

  First, as shown in FIGS. 1 and 4, the blade 24 and the overall shield 35 are electrically connected at a position P1 on the distal end side of the insertion portion 4 and on the proximal end side of the bending portion 4A. That is, the blade 24 is electrically connected to the general shield 35 that is a conductive shield member that covers the signal line of the imaging cable 25 on the distal end side of the insertion portion 4.

FIG. 5 is a cross-sectional view along the axial direction of the imaging cable 25 showing the configuration of the part where the blade 24 and the general shield 35 are electrically connected at the position P1.
A part of the outer skin member 23 covering the general shield 35 is peeled and removed along the circumferential direction at a position P1 on the distal end side of the insertion portion 4. In FIG. 5, along the axial direction of the imaging cable 25, a part of the outer skin member 23 is removed only in the range of the length d1.

  Then, the outer shell member 23 is peeled off, and the heat-shrinkable tube 41 is heated by covering the portion where the general shield 35 is exposed under the blade 24, the heat-shrinkable tube 41 is contracted, and the blade 24 and the general shield 35 Adhere.

  That is, the imaging cable 25 that is an electric cable includes a general shield 35 that is a shield member and a skin member 23 that is a non-conductive skin covering the general shield 35, and the general shield 35 is exposed from the skin member 23. The blade 24 is electrically connected to the general shield 35 by contacting the general shield 35 of the shield exposed part.

As a result, within the range of the length d1, the inner peripheral surface of the blade 24 and the outer surface of the total shield 35 are in contact with each other, and the blade 24 and the total shield 35 are electrically connected so as to have the same potential. As will be described later, the general shield 35 is at the same potential as the ground, that is, the patient ground, on the proximal end side.
In addition, since the heat shrinkable tube 41 is disposed at the location where the outer skin member 23 is peeled off, the outer diameter of the electrical connection portion between the blade 24 and the integrated shield 35 is increased in the imaging cable 25 including the blade 24. Without doing so, the overall diameter is substantially the same.

  Here, the blade 24 is brought into close contact with the overall shield 35 by the thermal contraction of the heat shrinkable tube 41, and the blade 24 and the overall shield 35 are electrically connected to have the same potential. The blade 24 and the total shield 35 may be electrically connected by pressing the outer peripheral surface of the blade 24 and bringing the blade 24 into close contact with the total shield 35. In this case, in FIG. 5, a portion indicated by 41 is a bobbin winding portion.

Furthermore, the blade 24 and the overall shield 35 may be electrically connected by so-called direct attachment with solder at a portion where a part of the outer skin member 23 is removed. In this case, in FIG. 5, the portion indicated by 41 is solder.
Furthermore, the electrical connection between the blade 24 and the total shield 35 may be realized by using a combination of two or more of solder, spool, and heat shrinkable tube.

The position P1 at which the blade 24 and the overall shield 35 are electrically connected is on the distal end side of the insertion portion 4, but is preferably on the proximal end side of the bending portion 4A, particularly close to the bending portion 4A. The reason is as follows.
Since a heat shrinkable tube (or thread winding or solder) 41 is provided in a portion where the outer skin member 23 is partially removed, a stepped portion 42 is formed between the blade 24 and the heat shrinkable tube 41. The If the stepped portion 42 comes into contact with surrounding objects, the stepped portion 42 may damage the surrounding objects. Furthermore, if a coil is wound around another built-in object or a member such as a bending piece of the bending portion 4A, the step portion 42 may restrict the movement of the coil or the like. Therefore, here, in consideration of such a case, the position P1 is on the distal end side of the insertion portion 4. However, the position P1 is not provided in the distal end hard member 8 or in the range of the bending portion 4A. And the proximal end side of the curved portion 4A.
Further, as shown in FIG. 4, at the distal end portion of the insertion portion 4, the distal end portion of the general shield 35 indicated by a one-dot chain line is electrically connected to the distal end hard member 8. That is, the distal end portion of the comprehensive shield 35 is electrically connected to the distal end hard member 8 provided at the distal end portion of the insertion portion 4.

  FIG. 6 is a cross-sectional view showing a configuration in which the distal end portion of the general shield 35 is electrically connected to the distal end hard member 8.

  As shown in FIG. 6, the objective optical system 61 is fitted into a cylindrical and conductive lens frame 62, and the tip of the lens frame 62 is provided on a conductive metal tip hard member 8. The lens frame 62 is fixed to the distal end hard member 8 with a conductive adhesive.

A base end portion of the lens frame 62 is inserted into and fitted into a distal end portion of a cylindrical conductive holding frame 63, and the lens frame 62 is fixed to the holding frame 63 with a conductive adhesive. The holding frame 63 holds the cover glass 61a to which the image sensor 7 is fixed.
The base end portion of the holding frame 63 is inserted into and fitted into a cylindrical and conductive shield frame 64, and the holding frame 63 is fixed to the shield frame 64 with a conductive adhesive.

  The image sensor 7 is provided with a cover glass 61a on the light receiving surface side and an image sensor substrate 65 on the surface opposite to the light receiving surface. The image pickup device substrate 65 is provided with a plurality of lands, and a single wire 31 of the image pickup cable 25 and a plurality of conductive wires of the coaxial wire 32 are soldered to the lands with solder 66. A resin (not shown) is applied around the imaging element substrate 65, and the solder 66 is sealed.

  The front end of the general shield 35 and the shield frame 64 are electrically connected by a jumper wire 52. Specifically, both ends of the jumper wire 52 are connected to the general shield 35 and the shield frame 64 by solder 66.

As indicated by a two-dot chain line, the tip of the blade 24 and the shield frame 64 may be electrically connected by a jumper wire 52a. Also in this case, the jumper wire 52 a is connected to the blade 24 and the shield frame 64 by the solder 66. As a result, the tip of the blade 24 also has the same potential as the tip hard member 8, the lens frame 62, and the holding frame 63. That is, the distal end portion of the blade 24 is electrically connected to the distal end rigid member 8 provided at the distal end portion of the insertion portion 4.
Furthermore, at least one of the general shield 35 and the blade 24 may be electrically connected not only to the shield frame 64 but also to the bending piece.

Another configuration example in which the blade 24 and the holding frame 63 are set to the same potential will be described.
FIG. 7 is a cross-sectional view showing a configuration in which the tip of the blade 24 is electrically connected to the holding frame 63.

In FIG. 7, the distal end portion of the blade 24 that is a mesh body is expanded, and the distal end portion of the blade 24 is connected to the holding frame 63 so that the entire distal end portion covers the entire retaining frame 63. That is, the blade 24 is connected and fixed to the holding frame 63 so as to insert the holding frame 63 therein. Although not shown, the tip of the blade 24 is fixed to the holding frame 63 by soldering, a conductive adhesive, or thread winding. The blade 24 is filled with a resin (not shown).
Although not shown in FIG. 7, the general shield 35 is also connected to the shield frame 64 by a jumper wire 52.

The other configuration in FIG. 7 is the same as that in FIG.
In the configuration of FIG. 7, the entire holding frame 63 is covered with the blade 24, and as a result, the imaging element 7 and the imaging element substrate 65 are also covered with the blade 24, so that the shielding property is high. Further, according to the configuration of FIG. 7, since the blade 24 covers the image pickup unit including the image pickup element 7 and the image pickup element substrate, there is an effect that a conventional heat shrinkable tube covering the image pickup unit becomes unnecessary.

Further, as shown in FIG. 1, the base end portion of the general shield 35 and the base end portion of the blade 24 indicated by a dotted line are connected to a metal plate 53 provided in the connector 10.
FIG. 8 is a diagram illustrating a configuration in which the base end portion of the general shield 35 and the base end portion of the blade 24 are connected to the metal plate 53 provided in the connector 10. The metal plate 53 is at the same potential as the patient ground (GND). That is, the base end portion of the total shield 35 and the base end portion of the blade 24 are connected to the metal plate 53 that is a member having the same potential as the ground.

As shown in FIG. 8, a part of the base end portion of the total shield 35 is collected and connected to the metal plate 53 by solder 66.
Similarly, a part of the base end portion of the blade 24 is collected and connected to the metal plate 53 by the solder 66.

Each single line 31 and each coaxial line 32 of the imaging cable 25 are connected to the circuit board 51 by solder 66.
Here, both the base end of the blade 24 and the base end of the total shield 35 are connected to the metal plate 53, but only the base end of the total shield 35 is connected to the metal plate 53. May be.

Here, the base end portion of the blade 24 and the base end portion of the total shield 35 are both connected to the metal plate 53 because the blade 24 and the total shield 35 are electrically connected at the position P1 on the front end side of the imaging cable 25. This is because the blade 24 and the overall shield 35 are set to the same potential as the ground (patient ground) on the base end side, thereby improving the shielding performance over the entire imaging cable 25.
Furthermore, instead of the metal plate 53, the blade 24 and the total shield 35 are connected to a ground terminal (patient ground or video ground) or a ground land (patient ground or video ground) provided on the circuit board 51. May be.

With the above configuration, the following effects are produced.
First, since the blade 24 connected to the ground potential on the base end side and the general shield 35 are electrically connected at the position P1 in the vicinity of the imaging unit, the blade 24 also greatly contributes as a shield member. While preventing the diameter of the portion 4 from increasing and the size of the endoscope from being increased, the shielding performance of the imaging unit 9 and the imaging cable 25 can be improved as compared with the conventional case, and noise resistance due to disturbance can be improved.

In particular, since the position P1 is on the distal end side of the insertion portion 4, the shielding performance at a position away from the ground is improved.
Not only the position P1, but also the electrical connection between the blade 24 and the general shield 35 at the position P1, another position, for example, the position P2 on the proximal end side of the imaging cable 25 (FIGS. 1 and 4). In addition, an electrical connection between the blade 24 and the overall shield 35 as shown in FIG. 5 may be provided.
That is, the imaging cable 25 has a second shield exposed portion where the overall shield 35 is exposed from the outer skin member 23, the second shield exposed portion is located on the proximal end side of the imaging cable 25, and the blade 24 is The two shield exposed portions are electrically connected to the total shield 35 by contacting the total shield 35. As a result, by providing electrical connection portions between the blade 24 and the overall shield 35 at a plurality of positions, the shielding performance can be further improved over the entire imaging cable 25.

As described above, according to the present embodiment, it is possible to provide an endoscope having high disturbance noise resistance while preventing the insertion portion from increasing in diameter and the endoscope from being enlarged.
(Second Embodiment)
In the first embodiment, a part of the outer skin member 23 is peeled off and the overall shield 35 is exposed from the outer skin member 23, and the blade 24 and the overall shield 35 are directly attached by a heat shrinkable tube, solder, or the like. However, in this embodiment, the conductive wire that is a ground wire for the ground (patient ground) inserted in the imaging cable and the blade 24 are imaged. Connected at the end of the cable.

Hereinafter, although this Embodiment is demonstrated, the endoscope of this Embodiment has the structure substantially the same as the endoscope of 1st Embodiment, About the same component as 1st Embodiment Are denoted by the same reference numerals, description thereof will be omitted, and different configurations will be described.
FIG. 9 is a diagram for explaining the configuration of the shield in the endoscope 2 of the present embodiment.

  The imaging cable 25A according to the present embodiment corresponds to the imaging cable 25 according to the first embodiment. In the imaging cable 25A, a conductor 71 as a ground line is provided separately from the signal line, the power supply line, and the like. It is installed. The proximal end portion of the conducting wire 71 inserted into the imaging cable 25A is connected to the metal plate 53 at the same potential as the patient ground (GND) in the connector 10 by solder.

The conducting wire 71 is a dummy line that is not used as a power supply line, a signal line, or the like. For example, the conducting wire 71 may be inserted into the interposition member 33 made of cotton yarn or the like shown in FIG.
If a plurality of thin conducting wires are inserted into the interposition member 33 and used, the ground wire can be provided in the imaging cable 25A without increasing the outer diameter of the imaging cable 25A.

  At the distal end portion of the imaging cable 25A, the distal end portion of the conducting wire 71 is connected to the blade 24. FIG. 10 is a cross-sectional view for explaining the conductive wire 71 connected to the blade 24 at the distal end portion of the imaging cable 25A.

The conducting wire 71 exposed from the distal end portion of the imaging cable 25A is bent at the distal end portion of the imaging cable 25A and soldered to the blade 24 with the solder 66. That is, the blade 24 is electrically connected to the conductor 71 provided in the imaging cable 25 on the distal end side of the insertion portion 4, and the blade 24 and the conductor 71 are connected to the distal end of the blade 24. Thus, it is electrically connected to the conducting wire.
The base end portion of the blade 24 is connected to a metal plate 53 that is a member having the same potential as the ground. Furthermore, the distal end portion of the comprehensive shield 35 is electrically connected to the distal end hard member 8 provided at the distal end portion of the insertion portion 4. A resin (not shown) is applied around the imaging element substrate 65, and a heat shrinkable tube 72 is provided so as to cover the blade 24 and the shield frame 64.

  According to the present embodiment, the proximal end portion of the conducting wire 71 inserted into the imaging cable 25A is connected to the metal plate 53 at the same potential as the patient ground (GND), and the conducting wire is connected to the distal end portion of the imaging cable 25A. Since the distal end portion of 71 is electrically connected to the blade 24, the blade 24 also greatly contributes as a shield member. Therefore, the insertion portion 4 can be prevented from becoming thicker and the endoscope larger than the conventional one. The shielding performance of the image pickup unit 9 and the image pickup cable 25 can be improved, and the noise resistance due to disturbance can be improved.

In the present embodiment, the base end portion of the blade 24 may not be connected to the metal plate 53, but by connecting the base end portion of the blade 24 to the metal plate 53, the entire imaging cable 25A can be connected. It is possible to improve the shielding performance.
Also in this embodiment, the base end portion of the total shield 35 may be connected to the metal plate 53.

  As described above, according to the above-described two embodiments, the endoscope having a high disturbance noise countermeasure structure while preventing the insertion portion from increasing in diameter and the endoscope from being enlarged. Can be provided.

Next, a plurality of reference configurations will be described for each part of the endoscope.
(Reference configuration 1: Structure for preventing dust adhesion)
In the imaging unit, it is conceivable to use only the cover glass in order to eliminate the problem of peeling off the centering cover glass adhered to the glass lid.

  FIG. 11 is a partial cross-sectional view illustrating the configuration of the imaging unit 9A related to the reference configuration 1. As shown in FIG. 11, the holding frame 63A has a concave portion 63A1 in which an image pickup device substrate 65A, which is a rigid substrate on which the image pickup device 7 is mounted, is mounted on the proximal end side, and a lens frame on the distal end side. 62 has a recess 63A2. 12 is a cross-sectional view taken along line XII-XII in FIG.

An inward flange 63Aa is formed at the center of the holding frame 63A, and a cover glass 82 integrally formed with a diaphragm 81 is disposed at the distal end side of the inward flange 63Aa.
An image sensor substrate 65A on which the image sensor 7 is mounted is disposed on the proximal end side of the inward flange 63Aa so that the front surface of the image sensor 7 is in contact with the air, and between the image sensor 7 and the cover glass 82, air Layer 80 is formed.

  As shown in FIG. 12, the cover glass 82 is partially bonded to the inner peripheral surface of the holding frame 63 </ b> A by an adhesive C at a plurality of locations, here at four locations. The cover glass 82 is bonded to the holding frame 63A at four points so that air can escape between the cover glass 82 and the inner peripheral surface of the holding frame 63A. Even if the air layer formed between the imaging elements 7 expands or contracts, the cover glass 82 itself is not subjected to stress that moves along the axial direction of the imaging unit 9A. That is, the outer peripheral surface of the cover glass 82 is bonded to the inner peripheral surface of the holding frame 63A by spotting.

A ring-shaped elastic member 83 is arranged on the front end side of the cover glass 82 in order to fit the lens frame 62 into the holding frame 63A and fix it.
When the lens frame 62 is inserted into the holding frame 63A from the direction indicated by the arrow A1, dust is generated due to friction between the outer peripheral surface of the lens frame 62 and the inner peripheral surface of the holding frame 63A, and the dust is generated on the surface of the cover glass 82. There is a risk of adhesion.

  However, since the ring-shaped elastic member 83 is disposed on the front end side of the cover glass 82 here, the generated dust is pressed against the ring-shaped elastic member 83 and does not adhere to the surface of the cover glass 82. .

  In addition, when the image sensor substrate 65A on which the image sensor 7 is mounted is inserted and fitted into the holding frame 63A from the direction indicated by the arrow A2, the outer peripheral surface of the image sensor substrate 65A and the inner peripheral surface of the holding frame 63A There is a risk that dust will be generated due to friction with the cover glass 82 and adhere to the surface of the cover glass 82 or the light receiving surface of the image sensor 7. In particular, since a micro lens is formed on the image sensor 7, it is difficult to remove dust attached to the image sensor 7.

  However, here, by applying the adhesive 84 to the inner peripheral surface of the holding frame 63A, the generated dust is pressed against and adheres to the adhesive 84, and the surface of the cover glass 82 or the light receiving surface of the image sensor 7 It is designed not to adhere to.

As described above, according to the configuration described above, it is possible to prevent dust from adhering to the cover glass 82 or the image sensor 7 and improve the yield of the image pickup unit 9A.
(Reference configuration 2: Centering structure of image sensor)
The present invention relates to a structure in which an imaging element can be centered without a problem of peeling of a centering cover glass adhered to a glass lid in an imaging unit.

Conventionally, the cover glass has been used for centering the image pickup device, but it is conceivable to use only the cover glass in order to eliminate the problem of peeling of the centering cover glass. If the centering cover glass is not used, there is a problem that the centering of the image sensor cannot be performed.
In view of this, a large glass lid 91 is fitted into the stepped portion of the holding frame 63B so that the image sensor 7 bonded and fixed to the glass lid 91 is positioned.

  FIG. 13 is a partial cross-sectional view illustrating the configuration of the imaging unit 9B related to the reference configuration 2. As shown in FIG. 13, the holding frame 63B is fitted with an opening 92 into which the glass lid 91 on which the image pickup device 7 is mounted is fitted on the base end side and a lens frame 62 is fitted on the tip side. And an opening 93 to be used. A stepped portion 94 is formed inside the opening 92. The holding frame 63B is covered with a heat shrinkable tube 96.

  Since the image pickup element 7 is fixed to the glass lid 91 by adhesion, the glass lid 91 fits into the opening 92 of the holding frame 63B and abuts against the stepped portion 94, so that the centering of the image pickup element 7 is accurately performed. Can be done.

The image pickup device 7 is connected to the image pickup cable 25 via an image pickup device substrate 65B connected to the terminal portion 95 on the back surface of the image pickup device 7.
In addition, in order to position the image sensor 7 with respect to the glass lid 91, a jig that irradiates a plurality of spot lights onto the OB (optical black) region 101 of the image sensor 7 is used.

  FIG. 14 is a diagram for explaining a state in which a plurality of spot lights 102 are irradiated on the OB region of the image sensor 7 from the jig and a plurality of spot lights 102 are formed in the OB region 101 of the image sensor 7.

  A jig (not shown) is configured to irradiate the OB region 101 with a plurality of spot lights 102 when the imaging element 7 is bonded to the glass lid 91. The position of the image sensor 7 mounted on the jig is adjusted so that the plurality of spot lights 102 correctly strike the OB area 101 around the image area 103. This adjustment can be performed simultaneously with the focus adjustment.

  Further, the amount of eccentricity of the image sensor 7 is calculated from the amount of light received in the OB region 101. If the amount of calculation is small, the image clipping region 104 in the imaging region 103 is determined from the amount of eccentricity, and the image is cut out. You may do it.

With the above-described configuration, the image sensor can be centered without using a conventional center cover glass.
(Reference configuration 3: Configuration of image sensor substrate)
A plurality of conductors of the imaging cable 25 are connected to the image sensor substrate to which the image sensor 7 is connected. If the distance between lands to which the plurality of conductors are connected on the image sensor substrate is short, the conductors are soldered. Not only is it difficult to work, there is also a risk of shorting between adjacent conductors.
Therefore, the configuration of the imaging element substrate is configured as a plurality of devices described below.

FIG. 15 is a perspective view of the image sensor substrate 65C according to the first device related to the reference configuration 3. FIG. 15 is a perspective view of the imaging element substrate 65C as viewed from the side to which the imaging cable 25 is connected.
The image pickup device substrate 65C has a plurality of, here, eight lands 111. The land forming portion 65Ca in which each land 111 is provided is provided on the surface of the image sensor substrate 65C opposite to the surface on which the image sensor 7 is mounted.

  When the land forming portion 65Ca is viewed from the side opposite to the surface on which the image sensor 7 is mounted, the land forming portion 65Ca has a substantially triangular shape. The land forming portion 65Ca has two surfaces 112 corresponding to the two sides of the triangle. That is, the land forming portion 65Ca has two surfaces 112 formed at a predetermined angle with respect to each other. Each surface 112 is provided with a plurality of, here, four, groove-like lands 111 to which the respective conducting wires 30 of the imaging cable 25 are connected. Each conducting wire 30 is the single wire 31 or the coaxial wire 32 of the imaging cable 25 described above.

  In other words, the two surfaces 112 of the imaging element substrate 65C are surfaces that are non-parallel and formed at a predetermined angle and are parallel to the axial direction of the insertion portion 4. Each surface 112 is provided with a plurality of groove-like lands 111. The conductive wire 30 is soldered to each land 111.

  As shown in FIG. 15, four lands 111 are formed on each of the two surfaces 112 formed with a predetermined angle. The distance between two adjacent lands 111 is longer than the distance between two adjacent lands when the axes of the eight conductive wires 30 are arranged in parallel on one plane. Therefore, when each conducting wire 30 is soldered to each land 111, the soldering operator can easily perform the soldering operation, and the possibility of short-circuiting between the adjacent conducting wires 30 is reduced.

FIG. 16 is a perspective view of an image sensor substrate 65D according to a second device related to the reference configuration 3. FIG. 16 is a perspective view of the imaging element substrate 65D as viewed from the side to which the imaging cable 25 is connected.
The image pickup device substrate 65D has a plurality of, here, eight lands 121. The land forming portion 65Da on which each land 121 is provided is provided on the surface of the image sensor substrate 65D opposite to the surface on which the image sensor 7 is mounted.

  The land forming portion 65Da has a shape in which four projecting portions 123 projecting in the outer diameter direction of the cylindrical portion 122 are formed when viewed from the surface opposite to the surface on which the imaging element 7 is mounted. The land forming portion 65Da is formed of a plurality of lands that are elongated along the axial direction of the insertion portion 4 on each upper surface of the four protruding portions 123 and on each surface of the cylindrical portion 122 between the two adjacent protruding portions 123. 121. Each land 121 is connected to each conductor 30 of the imaging cable 25.

  In other words, the land forming portions 65Da of the image pickup device substrate 65D are formed with a plurality of lands 121 on the outer peripheral surface alternately at different heights in the radial direction from the central axis of the cylindrical land forming portion 65Da. The lead wire 30 is soldered to 121.

  According to the imaging element substrate 65D having the land forming portion 65Da shown in FIG. 16, the distance between the two adjacent lands 121 is adjacent when the axes of the eight conductive wires 30 are arranged in parallel on one plane. It is longer than the distance between two matching lands. Therefore, when each conducting wire 30 is soldered to each land 121, the soldering operator can easily perform the soldering operation, and the possibility of short-circuiting between the adjacent conducting wires 30 is reduced.

FIG. 17 is a perspective view of an image sensor substrate 65D according to a third device related to the reference configuration 3. FIG. 17 is a perspective view of the imaging element substrate 65E as viewed from the side to which the imaging cable 25 is connected.
The image pickup device substrate 65E has a plurality of, here, eight lands 131. The land forming portion 65Ea in which each land 131 is provided is provided on the surface of the image sensor substrate 65E opposite to the surface on which the image sensor 7 is mounted.

  The land forming portion 65Ea includes an extending portion 65Eb from which a part of the image sensor substrate 65E extends, and eight relay substrates 132 mounted on the extending portion 65Eb. Each relay board 132 is provided with a land 131 on one side surface.

FIG. 18 is a side view of the relay board 132 for explaining the electrical connection between the imaging element board 65E and the relay board 132 related to the reference configuration 3.
The relay substrate 132 has a convex portion 132a at the lower portion, and the extending portion 65Eb has a concave portion 65Eb2 into which the convex portion 132a is fitted. A wiring pattern 131 a that is electrically connected to the land 131 is formed in the relay substrate 132. A contact pattern 133 connected to a circuit in the image sensor substrate 65D is provided in the recess 65Eb2.

  Then, when the relay board 132 is mounted on the extension part 65Eb so that the convex part 132a fits into the concave part 65Eb2, the land 131 is placed in the image sensor substrate 65E via the wiring pattern 131a and the contact pattern 133. Electrically connected to the circuit.

  The eight relay boards 132 are mounted on the upper surface 65Eb1 of the extending part 65Eb. When the eight relay boards 132 are mounted on the upper surface 65Eb1, the surface of each relay board 132 on which the land 131 is provided is located on the opposite side of the contact surface of the relay board 132 with the upper surface 65Eb1.

  Further, the plurality of relay boards 132 have shapes such that the distances from the upper surface 65Eb1 to the land 131 are different from each other. As shown in FIG. 17, the eight relay boards 132 have different heights.

  In other words, on the upper surface 65Eb1 of the extending portion 65Eb of the image sensor substrate 65E, a plurality of relay boards 132 provided with lands 131 at different heights are provided side by side. The conductive wire 30 is soldered to each land 131.

  As shown in FIG. 17, since the plurality of lands 131 are provided at different heights, the distance between two adjacent lands 131 is one plane in which the axes of the eight conductive wires 30 are parallel to each other. It becomes longer than the distance between two adjacent lands when lined up. Therefore, when each conducting wire 30 is soldered to each land 131, the soldering operator can easily perform the soldering operation, and the possibility of short-circuiting between the adjacent conducting wires 30 is reduced.

FIG. 19 is a perspective view of an image sensor substrate 65F according to a fourth device related to the reference configuration 3. FIG. 19 is a perspective view of the imaging element substrate 65F as viewed from the side to which the imaging cable 25 is connected.
The image pickup device substrate 65F has a plurality of (here, eight) lands 141a to 141h. Some of the lands 141a to 141h (here, six lands) are provided in the extending portion 65Fa opposite to the surface on which the image sensor 7 of the image sensor substrate 65D is mounted, and the remaining lands (here, the land) The two lands) are provided on the relay substrate 142 mounted on the image sensor substrate 65D.

The extending portion 65Fa is formed on the surface opposite to the surface on which the image sensor 7 is mounted. Six lands 141a to 141f are provided on the upper surface of the extending portion 65Fa.
The relay board 142 is a U-shaped rigid board, and the relay board 142 is attached to the image sensor board 65F so as to surround a part of three surfaces of the image sensor board 65F.

  Two contacts 142a1 and 142a2 are exposed inside the relay substrate 142. When the relay substrate 142 is mounted on the image sensor substrate 65F, the two contacts 142a1 and 142a2 are respectively connected to the surface of the image sensor substrate 65F. The image pickup device substrate 65F and the relay substrate 142 are configured so as to contact the contact portions 65Fb1 and Fb2 formed in FIG.

  Further, the relay board 142 is provided with two lands 141g and 141h. When the relay board 142 is mounted on the image sensor substrate 65F, the two lands 141g and 141h include the six lands 141a to 141a. It is arranged on the same upper surface side as 141f.

  Further, inside the relay substrate 142, a wiring pattern 143 that electrically connects the contact 142a1 and the land 141g and a wiring pattern 144 that electrically connects the contact 142a2 and the land 141h are provided.

As shown in FIG. 19, some lands 141g and 141h out of the plurality of lands 141a to 141h are provided at positions different in height from each other via the relay board 142. The distance between them is longer than the distance between two adjacent lands when the axes of the eight conducting wires 30 are arranged in parallel on one plane. Therefore, when each conducting wire 30 is soldered to each land, the solder operator can easily perform the soldering operation, and the possibility of short-circuiting between the adjacent conducting wires 30 is reduced.
(Reference configuration 4: Sealing structure between conductors of imaging cable)
Usually, at the front end of the imaging cable 25, each exposed conductor is soldered, and then a resin is applied or filled so as to cover the solder part, but the solder part is completely covered with the resin so as to completely seal the solder part. Cannot be completely covered. Therefore, since air and moisture are contained in the resin, the conductor may be deteriorated due to thermal expansion.
In view of this, a resin sealing method for conducting wires of the imaging cable has been devised.

FIG. 20 is a partial side view for explaining a state in which each conducting wire of the imaging cable 25 is connected to the imaging element substrate with respect to the reference configuration 4.
A cable reinforcing resin body 151 integrally formed with a plurality of conducting wires 30 such as a single wire or a coaxial wire is provided at the distal end portion of the imaging cable 25. The cable reinforced resin body 151 is formed by integrally molding a part of the plurality of conductive wires 30 and the resin in a state where the covering members such as the resin tape and the outer sheath of the imaging cable 25 are peeled off and the respective conductive wires 30 are exposed. It is formed by doing. That is, each conductor 30 is covered with the resin so that air and moisture are not included between the conductor 30 and the resin by the cable reinforcing resin body 151 in the middle of the exposed plurality of conductors. And the front-end | tip part of each conducting wire 30 is exposed from the front end side of the cable reinforcement resin body 151. FIG.

FIG. 21 is a diagram for explaining the connection between the plurality of integrally formed conductive wires 30 and the conductive portion 152 of the imaging element substrate 65.
As shown in FIG. 21, each conductive wire 30 exposed from the distal end side of the cable reinforcing resin body 151 is disposed so as to contact the conductive portion 152 at the proximal end portion of the imaging element substrate 65.

  The conductive part 152 is formed using a resin sheet 153 in which conductive resin and non-conductive resin are alternately arranged. Each conductive resin portion of the resin sheet 153 becomes the conductive portion 152, and the nonconductive resin 154 exists next to the conductive portion 152.

The resin sheet 153 is bonded to the base end portion of the imaging element substrate 65 with an adhesive. When the resin sheet 153 is bonded to the base end portion of the image sensor substrate 65, the conductive portion 152 is disposed at the position of the electrical component of the image sensor substrate 65. Therefore, each conducting wire 30 is electrically connected to each wiring in the image sensor substrate 65.
Finally, each conducting wire 30 and the conductive portion 152 are joined by, for example, a spot laser, and a filling adhesive 155 is applied onto the plurality of conducting wires 30.

  In the above-described example, the plurality of conductive wires 30 are embedded in the cable reinforcing resin body 151 by integral molding. However, the plurality of conductive wires 30 are inserted into the molded cable reinforcing resin body. You may make it arrange | position 30 in a cable reinforcement resin body.

  FIG. 22 is a diagram for explaining the attachment of the plurality of conducting wires 30 to the cable reinforced resin body 151 </ b> A having the plurality of insertion holes 151 </ b> Aa for inserting the plurality of conducting wires 30 with respect to the reference configuration 4. As shown in FIG. 22, the cable reinforcing resin body 151A is formed by molding so that a plurality of insertion holes 151Aa for inserting the plurality of conducting wires 30 are formed inside the cable reinforcing resin body 151A.

  Each insertion hole 151Aa has an inner diameter smaller than the inner diameter of the portion 156 into which the outer sheath 30a of each conductive wire 30 is inserted when each conductive wire 30 is inserted into each insertion hole 151Aa. And a portion 157 into which only the core wire is inserted.

  And when each conducting wire 30 is inserted from the part 156 side of each insertion hole 151Aa, it will become like FIG. FIG. 23 is a diagram showing a state in which each conducting wire 30 is inserted and attached to each insertion hole 151Aa of the cable reinforcing resin body 151A.

  Moreover, in the above-mentioned example, although the front-end | tip part of the conducting wire 30 protrudes from the cable reinforcement resin bodies 151 and 151A, you may make it cover only a circumference | surroundings of conducting wire with conducting resin by integral molding, such as two-color molding. .

  FIG. 24 is a partial side view for explaining a state in which each conducting wire of the imaging cable 25 covered with the conductive resin portion integrally molded by two-color molding is connected to the imaging element substrate. FIG. 25 is a diagram for explaining the connection between the plurality of conductive wires 30 covered with the conductive resin portion integrally molded by two-color molding and the conductive portion 152 of the imaging element substrate 65.

  As shown in FIG. 25, the cable reinforcing resin body 151 </ b> B is integrally formed with the plurality of conductive wires 30 by two-color molding so that each conductive wire 30 is positioned in the conductive resin portion 158. That is, the cable reinforcing resin body 151B is integrally formed with the plurality of conductive wires 30 by two-color molding so as to include a conductive resin portion 158 that covers each conductive wire 30. Each conductive resin portion 158 comes into contact with the corresponding conductive portion 152 and is in a conductive state. However, a non-conductive resin is interposed between two adjacent conductive resin portions 158 so that the two adjacent The conductive resin portions 158 are electrically non-conductive with each other.

As described with reference to FIGS. 20 to 25 above, since the conducting wire 30 is resin-sealed at the distal end portion of the imaging cable 25, deterioration of the conducting wire 30 due to air or moisture can be prevented. Further, since a resin sheet is used or a conductive resin portion is formed by two-color molding, the connection of each conductive wire 30 to the imaging element substrate is simple and workability is good.
(Reference composition 5: Duplication of shield)
In order to enhance the shielding property, the base end portion of the holding frame 63 may be doubled with a cylindrical shield frame.

  FIG. 26 is a partial cross-sectional view illustrating a partial configuration of the imaging unit 9 </ b> C regarding the reference configuration 5. As shown in FIG. 26, the image sensor 7 is mounted on the glass lid 172, and a cover glass 173 affixed to the glass lid 172 is fitted and fixed to the proximal end side of the holding frame 171.

The image pickup device 7 is connected to the image pickup cable 25 through an image pickup device substrate 175 connected to the terminal portion 174 on the back surface of the image pickup device 7 that is bonded and fixed to the glass lid 172.
In addition, a metal coating is applied to the entire circumference and back surface of the image sensor 7, and an image sensor shield frame 176 is provided so as to surround the image sensor 7 and the image sensor substrate 175. The image sensor shield frame 176 is fixed to the glass lid 172 with solder 66.

Further, a conductive reinforcing frame 177 is also provided on the outer peripheral side of the holding frame 171. A heat shrinkable tube 178 is provided so as to cover the reinforcing frame 177.
Furthermore, the total shield 35 of the imaging cable 25 is connected to the imaging element shield frame 176 via the jumper wire 179 using the solder 66.
As described above, since the imaging unit 9C has the double shield structure including the imaging element shield frame 176 and the reinforcement frame 177, further improvement in shielding performance is achieved.

Further, since the image sensor shield frame 176 and the glass lid 172 are joined by solder, the image sensor 7 has high airtightness.
(Reference composition 6: Diameter reduction of insertion part)
A CMOS sensor instead of a CCD may be used as an image sensor, but the CMOS sensor has a larger chip size than a CCD. For this reason, when the CMOS sensor is mounted on the endoscope, a contrivance is made so that the diameter of the insertion portion does not increase.

  FIG. 27 is a schematic cross-sectional view of the insertion portion 4 in the portion where the CMOS sensor is located as the imaging device, with respect to the reference configuration 6. 28 is a cross-sectional view taken along line XXIIX-XXIIX in FIG.

  In the insertion portion 4, a treatment instrument insertion channel pipe line 181 a for the treatment instrument insertion channel 181, two light guides 182, and a cleaning nozzle pipe line 183 are arranged. Further, here, a CMOS sensor 184 as an image sensor is fixed to a cylindrical holding frame 186 via a cover glass 185.

Each pipe line such as the treatment instrument insertion channel pipe line 181 a and the lens frame 188 that holds the objective optical system 187 are fixed to the distal end hard member 189.
The CMOS sensor 184 that is an image sensor is fixed to the holding frame 186. However, as shown in FIG. 27, a part of the cylindrical holding frame 186 on the treatment instrument insertion channel 181 side has a cut shape. doing.

  Further, the imaging region 190 of the CMOS sensor 184 is also formed on the CMOS sensor 184 so as to shift to the center axis side of the insertion portion 4 when the CMOS sensor 184 is disposed in the distal end hard member 189.

  Therefore, the cut portion of the holding frame 186 is not in contact with the channel pipe line 181a, and the imaging region 190 which is an image area is also shifted to the central axis side of the insertion portion 4, so the CMOS sensor 184 is It can arrange | position in the insertion part 4 with a small diameter.

  The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Endoscope apparatus, 2 Endoscope, 3 Main-body part, 4 Insertion part, 4A Bending part, 4a Tip part opening, 5 Operation part, 5a Treatment instrument penetration hole, 6 Universal cable, 7 Imaging element, 8 Tip hard member , 9 Imaging unit, 10 Connector, 11 Treatment tool, 21 Tubular member, 22 Sheath, 23 Skin member, 24 Blade, 25, 25A Imaging cable, 26 Treatment tool insertion channel, 26a Treatment tool insertion channel member, 27 Light guide, 28 Curved wire, 30 lead wire, 31, 31a to 31d single wire, 32, 32a-32d coaxial wire, 33 interposition member, 34 resin tape, 35 general shield, 41 heat shrink tube, 42 stepped portion, 51 circuit board, 52, 52a jumper Wire, 53 metal plate, 61 objective optical system, 61a cover glass, 62 lens frame, 63 Lifting frame 64 shielding frame, 65 imaging element substrate, 66 a solder, 71 wires.

Claims (12)

An image sensor provided on the distal end side of the insertion portion;
An electric cable having at least a signal line electrically connected to the image sensor and extending in the insertion portion;
A cylindrical, flexible metal blade that extends to at least a portion of the insertion portion and protects an inclusion including at least the electric cable;
Have
The blade is electrically connected to a conductive shield member that covers the signal line of the electric cable or a conductive wire provided in the electric cable at a distal end side of the insertion portion. Endoscope. The electrical cable has the shield member and a non-conductive outer skin covering the shield member, and at least partly includes a first shield exposed portion where the shield member is exposed from the outer skin,
The endoscope according to claim 1, wherein the blade is electrically connected to the shield member by contacting the shield member of the first shield exposed portion.   The endoscope according to claim 1, wherein a base end portion of the shield member is connected to a ground member having the same potential as the ground.   The endoscope according to claim 3, wherein a base end portion of the blade is connected to the ground member.   The endoscope according to claim 1, wherein a distal end portion of the shield member is electrically connected to a distal end rigid member provided at a distal end portion of the insertion portion.   The endoscope according to claim 1, wherein a distal end portion of the blade is electrically connected to a distal end rigid member provided at a distal end portion of the insertion portion. The electrical cable has a second shield exposed portion where the shield member is exposed from the outer skin,
The second shield exposed portion is located on a proximal end side of the electric cable;
The endoscope according to claim 2, wherein the blade is electrically connected to the shield member by contacting the shield member at the first and second shield exposed portions.   The endoscope according to claim 1, wherein the blade is electrically connected to the conducting wire by connecting the blade and the conducting wire at a tip portion of the blade.   The endoscope according to claim 8, wherein a base end portion of the conducting wire is connected to a ground member having the same potential as the ground.   The endoscope according to claim 9, wherein a base end portion of the blade is connected to the ground member.   The endoscope according to claim 8, wherein a distal end portion of the shield member is electrically connected to a distal end rigid member provided at a distal end portion of the insertion portion.   The endoscope according to any one of claims 8 to 11, wherein the conducting wire is inserted into the electric cable.

Images