JP2015023173A - Laminated capacitor - Google Patents

Abstract

Provided is a multilayer capacitor capable of improving connectivity between an external electrode and an internal electrode and suppressing connection failure. A multilayer capacitor includes an element body, terminal electrodes A and B disposed at both ends of the element body 10, and disposed in the element body 10 and connected to the terminal electrodes 14A and 14B, respectively. Internal electrodes 12A and 12B are provided. The end faces 10a and 10b of the element body 10 are inclined so as to approach each other from the main surface 10d of the element body 10 toward the main surface 10c when viewed from the facing direction of the side surfaces 10e and 10f of the element body 10. The terminal electrodes 14A and 14B have main portions 14A1 and 14B1 disposed on the end faces 10a and 10b, respectively. The main portions 14A1 and 14B1 each have a film thickness that increases in the direction in which the end surfaces 10a and 10b are arranged from the main surface 10d toward the main surface 10c when viewed from the facing direction of the side surfaces 10e and 10f. [Selection] Figure 2

Description

  The present invention relates to a multilayer capacitor.

  Patent Document 1 discloses a ceramic component including an element body having a rectangular parallelepiped shape, a pair of internal electrodes disposed in the element body so as to face each other, and terminal electrodes respectively disposed at both ends of the element body. ing. One internal electrode is exposed on one end face of the element body and connected to one terminal electrode. The other internal electrode is exposed at the other end face of the element body and connected to the other terminal electrode.

JP 2012-028456 A

  An object of the present invention is to provide a multilayer capacitor capable of improving connectivity between a terminal electrode and an internal electrode and suppressing connection failure.

  A multilayer capacitor according to one aspect of the present invention is configured to connect first and second side surfaces facing each other so as to extend substantially parallel to each other, and facing each other so as to extend substantially parallel to each other and connecting the first and second side surfaces to each other. An element body having first and second main faces, first and second side faces and first and second end faces connecting the first and second principal faces, and The first terminal electrode arranged on the first end face side, the second terminal electrode arranged on the second end face side of the element body, and the first terminal electrode located in the element body and exposed from the first end face The end portion is located in the element body so as to face the first internal electrode connected to the first terminal electrode and the first internal electrode in the opposing direction of the first and second main surfaces, and the second A second internal electrode connected to the second terminal electrode at an end exposed from the end surface of the first and second inner electrodes The electrodes face each other in the facing direction of the first and second main surfaces, and the first and second side surfaces each have a pair of side edges facing each other, and one side edge of the pair of side edges is The first main surface is shorter than the other side edge, and the first main surface connects one side edge of each of the first and second side surfaces, and the whole is opposed to the first and second main surfaces. Overlapping the second main surface in the direction, the second main surface connects the other side edges of the first and second side surfaces, and the first and second end surfaces are the first and second side surfaces When viewed from the opposing direction of the side surfaces, the first main surface is inclined so as to approach each other as it goes from the second main surface to the first main surface, and the entire first main surface is opposed to the first and second main surfaces. The first terminal electrode overlaps with the second main surface in the direction, and the first terminal electrode is continuously drawn from the first portion and the first portion disposed on the first end surface. And a second portion disposed on the first main surface, and the second terminal electrode includes a third main portion disposed on the second end surface, and a third portion. A fourth portion that is continuously drawn and disposed on the first main surface, and the first and third portions are respectively viewed from the opposing direction of the first and second side surfaces. The thickness in the direction in which the first and second end faces are arranged increases from the second main surface toward the first main surface.

  In the multilayer capacitor according to one aspect of the present invention, the end portions of the internal electrodes are exposed from the respective end surfaces, and each end surface is inclined as viewed from the opposing direction of the first and second side surfaces. Therefore, according to the multilayer capacitor in accordance with one aspect of the present invention, the exposed area of the end portion of each internal electrode tends to increase. Therefore, since the end portion of each internal electrode and each terminal electrode are sufficiently fixed, the connectivity between the end portion of each internal electrode and each terminal electrode is improved. As a result, it is possible to suppress poor connection (loose contact) between the terminal electrode and the internal electrode.

  The first terminal electrode includes a planar first outer surface extending along the opposing direction of the first and second main surfaces, and the second terminal electrode is opposed to the first and second main surfaces. A planar second outer surface extending along the direction, and the first and second outer surfaces may be substantially parallel to each other and opposed to each other in the opposing direction of the first and second end faces. . In this case, in the opposing direction of the first and second end faces, the width of the first main surface is smaller than the width of the second main surface, but the width of the multilayer capacitor on the first main surface side, The width of the multilayer capacitor on the main surface side of 2 is substantially the same. Therefore, the size (area) of the first and second terminal electrodes on the first main surface side can be increased. Therefore, when the first main surface side is a mounting surface, the multilayer capacitor can be easily mounted on a circuit board or the like.

  The first and second outer surfaces may extend so as to be substantially orthogonal to the first and second side surfaces and the first and second main surfaces.

  In the opposing direction of the first and second end faces, the lengths of the first and second terminal electrodes may be greater than the separation distance between the second and fourth portions. In this case, the areas of the first and second terminal electrodes are sufficiently ensured on the first main surface side. Therefore, when the multilayer capacitor is mounted on a circuit board or the like, the contact area between the first and second terminal electrodes and the terminal electrode of the circuit board or the like can be increased. As a result, the electrical connection between the multilayer capacitor and the circuit board or the like can be more reliably performed. In particular, in a mounting structure in which a multilayer capacitor is embedded in a circuit board or the like, a laser beam is applied to the terminal electrode of the multilayer capacitor when a through hole (via hole) is formed in the circuit board or the like. At this time, since the areas of the first and second terminal electrodes on the first main surface side are sufficiently secured, the first and second terminal electrodes are easily irradiated with the laser beam. Therefore, it is possible to reduce the possibility of damage to the element body due to the laser beam.

  The width of the first and second end faces in the opposing direction of the first and second side faces may be larger than the other side edge of the first and second side faces. In this case, the first and second terminal electrodes are disposed on the first and second end faces extending along the longitudinal direction of the element body. Therefore, the current path is shortened in the element body, and the parasitic inductance is reduced. As a result, it is possible to effectively reduce the equivalent series inductance (ESL) in the multilayer capacitor.

  The first terminal electrode further includes a fifth portion that is continuously drawn from the first portion and disposed on the second main surface, and the second terminal electrode is continuous from the third portion. It may further have a sixth portion that is pulled out and arranged on the second main surface. In this case, since the second and fourth portions are arranged on the first main surface and the fifth and sixth portions are arranged on the second main surface, the first main surface or the second portion is arranged. The main surface can be a mounting surface.

  ADVANTAGE OF THE INVENTION According to this invention, the multilayer capacitor which can improve the connectivity of an external electrode and an internal electrode, and can suppress a connection defect can be provided.

FIG. 1 is a perspective view showing the multilayer capacitor in accordance with this embodiment. 2 is a cross-sectional view taken along line II-II in FIG. FIG. 3 is a cross-sectional view showing a mounting structure in which the multilayer capacitor of FIG. 1 is mounted on a substrate. FIG. 4 is a perspective view showing another example of the multilayer capacitor in accordance with the present embodiment. 5 is a cross-sectional view taken along line VV in FIG. 6 is a cross-sectional view showing a mounting structure in which the multilayer capacitor of FIG. 4 is mounted on a substrate.

  Embodiments of the present invention will be described with reference to the drawings. However, the following embodiments are exemplifications for explaining the present invention and are not intended to limit the present invention to the following contents. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

  As shown in FIGS. 1 and 2, the multilayer capacitor 1 includes an element body 10, internal electrodes 12 </ b> A and 12 </ b> B disposed in the element body 10, and terminal electrodes 14 </ b> A disposed on both end sides of the element body 10. , 14B. The length L of the multilayer capacitor 1 can be set to, for example, about 0.4 mm to 1.6 mm, the width W of the multilayer capacitor 1 can be set to, for example, about 0.2 mm to 0.8 mm, and the height H of the multilayer capacitor 1 is, for example, It can be set to about 0.10 mm to 0.35 mm.

  The element body 10 is a hexahedron having a pair of end faces 10a and 10b, a pair of main faces 10c and 10d, and a pair of side faces 10e and 10f. The pair of main surfaces 10c and 10d oppose each other so as to extend substantially in parallel with each other. The main surface 10c and the main surface 10d have the same width, but the length of the main surface 10c is smaller than the length of the main surface 10d. As viewed from the opposing direction of the main surfaces 10c and 10d, a part of the main surface 10d overlaps the entire main surface 10c.

  The pair of side surfaces 10e and 10f oppose each other so as to extend substantially in parallel with each other. When viewed from the direction in which the side surfaces 10e and 10f face each other, the side surfaces 10e and 10f in the present embodiment have a trapezoidal shape in which the upper base is shorter than the lower base. That is, each of the side surfaces 10e and 10f has a pair of opposing side edges which are an upper base and a lower base, the upper base has a short side, and the lower base has a long side longer than the upper base. . In the side surfaces 10e and 10f, a pair of side edges that connect the upper base and the lower base are oblique sides that approach each other as they go from the lower base to the upper base. The upper bases (short sides) of the side surfaces 10e and 10f are connected by a main surface 10c. The lower bases (long sides) of the side surfaces 10e and 10f are connected by a main surface 10d.

  The pair of end faces 10a and 10b are located at both ends of the element body 10, respectively. Specifically, the end surface 10a connects the main surfaces 10c and 10d and the side surfaces 10e and 10f at one end side. The end surface 10b connects these at the other end side of the main surfaces 10c and 10d and the side surfaces 10e and 10f. When viewed from the facing direction of the side surfaces 10e and 10f, the end surface 10a is inclined so as to approach the end surface 10b from the main surface 10d toward the main surface 10c. When viewed from the facing direction of the side surfaces 10e and 10f, the end surface 10b is inclined so as to approach the end surface 10a from the main surface 10d toward the main surface 10c. That is, the end faces 10a and 10b approach each other as they go from the main surface 10d to the main surface 10c.

  The multilayer capacitor 1 is configured as a so-called low profile capacitor. That is, in the element body 10, the dimension between the main surfaces 10c and 10d (height of the element body 10) h (see FIG. 2) is the maximum dimension between the end faces 10a and 10b (the length of the element body 10) L. (See FIG. 1) and the dimension between the side surfaces 10e and 10f (the width of the element body 10) W (see FIG. 1).

  The element body 10 includes a plurality of rectangular plate-like dielectric layers (not shown), a plurality of (two in the present embodiment) internal electrodes 12A, and a plurality of (two in the present embodiment) internal electrodes 12B. Is a laminated body laminated according to a predetermined order. The internal electrodes 12A and the internal electrodes 12B are arranged in the element body 10 so as to be alternately arranged in the stacking direction of the dielectric layers (the facing direction of the main surfaces 10c and 10d) (hereinafter referred to as “stacking direction”). ing. The internal electrode 12A and the internal electrode 12B are disposed to face each other with at least one dielectric layer interposed therebetween. In the actual multilayer capacitor 1, the plurality of dielectric layers are integrated by firing so that the boundary between them cannot be visually recognized.

Internal electrodes 12A is a rectangular shape, has a main electrode portion 12A _1, and lead portions 12A _2. Internal electrode 12B is a rectangular shape, has a main electrode portion 12B _1, and lead portions 12B _2. The main electrode portions 12A ₁ and 12A ₁ overlap each other when viewed from the stacking direction.

Drawer unit 12A ₂ extends toward the end surface 10a from the end portion of the end surface 10a side of the main electrode portion 12A _1. End of the end face 10a side of the lead-out portion 12A ₂ is exposed to the end surface 10a, and is connected to the terminal electrode 14A (baked electrode layer 14A ₁ to be described later). Therefore, the internal electrode 12A and the terminal electrode 14A are electrically connected. Exposed surface of the end face 10a side of the lead-out portion 12A ₂ is inclined with respect to the stacking direction, and substantially parallel to the inclined end surfaces 10a in the present embodiment.

Drawer unit 12B ₂ extends toward the end face 10b from the end portion of the end surface 10b side of the main electrode portion 12B _1. End of the end face 10b side of the lead portion 12B ₂ is exposed to the end face 10b, and is connected to the terminal electrode 14B (baked electrode layer 14B ₁ to be described later). Therefore, the internal electrode 12B and the terminal electrode 14B are electrically connected. Exposed surface of the end face 10b side of the lead portion 12B ₂ are inclined to the stacking direction, it is inclined along the end face 10b substantially parallel to the direction in the present embodiment.

  As shown in FIG. 2, the internal electrode 12A is disposed at the uppermost portion (position closest to the main surface 10c) of the element body 10, and is disposed at the lowermost portion (position closest to the main surface 10d) of the element body 10. The inner layer dimension between the internal electrodes 12B is “D1”. The outer layer dimension between the uppermost layer (protective layer) of the dielectric layer constituting the main surface 10c of the element body 10 and the internal electrode 12A disposed on the uppermost part of the element body 10 is “D2”. A portion having the outer layer dimension D2 in the element body 10 is formed by laminating a plurality of dielectric layers. The outer layer dimension between the lowermost layer of the dielectric layer constituting the main surface 10d of the element body 10 and the internal electrode 12B disposed at the lowermost part of the element body 10 is “D3”. The portion of the element body 10 having the outer layer dimension D3 is configured by laminating a plurality of dielectric layers.

  In the element body 10, the inner layer dimension D1 and the outer layer dimension D2 are substantially equal, and the inner layer dimension D1 and the outer layer dimension D3 are approximately equal. That is, the thickness of the inner layer is approximately equal to the thickness of the pair of outer layers sandwiching it. Here, “substantially equal” includes an error of about 5 μm, for example.

As shown in FIGS. 1 and 2, the terminal electrode 14A covers the entire end surface 10a and the region on the end surface 10a side of the main surface 10c. The terminal electrode 14A is disposed on the surface of the element body 10, and continuously extends from the end face 10a to the main surface 10c so as to go around the ridge portion of the element body 10. That is, the terminal electrodes 14A is a side 10e, which presents an L-shape when viewed from the opposing direction of 10f, the main portion 14A ₁ disposed on the end face 10a, the main is continuously withdrawn from the main portion 14A ₁ and a lead portion 14A ₂ arranged on the surface 10c.

In the main section 14A _1, side 10e, viewed from the opposing direction of 10f, the end surface 10a, the thickness in the opposing direction of 10b becomes larger toward the main surface 10c from the main surface 10d. The outer surface S1, intersects with the end face 10a, 10b opposite direction (longitudinal direction of the body 10) of the main portion 14A ₁ is a plan exhibiting a rectangular shape in the present embodiment, without the one end surface of the multilayer capacitor 1 ing.

As shown in FIGS. 1 and 2, the terminal electrode 14B covers the entire end surface 10b and the region on the end surface 10b side of the main surface 10c. The terminal electrode 14B is disposed on the surface of the element body 10, and continuously extends from the end face 10b to the main surface 10c so as to go around the ridge portion of the element body 10. That is, the terminal electrode 14B is a side 10e, which presents an L-shape when viewed from the opposing direction of 10f, the main portion 14B ₁ disposed on the end face 10b, the main is continuously withdrawn from the main portion 14B ₁ and a lead portion 14B ₂ arranged on the surface 10c.

In the main section 14B _1, side 10e, viewed from the opposing direction of 10f, the end surface 10a, the thickness in the opposing direction of 10b becomes larger toward the main surface 10c from the main surface 10d. Outer surface S2, which intersects the end faces 10a, 10b opposite direction (longitudinal direction of the body 10) of the main portion 14B ₁ is a plan exhibiting a rectangular shape in the present embodiment, without the other end face of the multilayer capacitor 1 ing.

  Both outer surfaces S1 and S2 extend substantially in parallel along the opposing direction of main surfaces 10c and 10d. The outer surfaces S1 and S2 face each other in the facing direction of the end faces 10a and 10b. In the present embodiment, the outer surfaces S1, S2 extend so as to be substantially orthogonal to the main surfaces 10c, 10d and the side surfaces 10e, 10f.

  In this embodiment, as shown in FIG. 2, the length X1 of the terminal electrode 14A in the facing direction of the end faces 10a and 10b (longitudinal direction of the element body 10) is the terminal electrode 14A and the terminal electrode 14A in the facing direction of the end faces 10a and 10b. It may be larger than the separation distance Y of 14B. In the present embodiment, as shown in FIG. 2, the length X2 of the terminal electrode 14B in the facing direction of the end faces 10a and 10b (longitudinal direction of the element body 10) is the terminal electrode 14A and the terminal electrode 14A in the facing direction of the end faces 10a and 10b. It may be larger than the separation distance Y of 14B.

Terminal electrodes 14A includes a baked electrode layer 14A _3, and a plating layer 14A _4. Terminal electrodes 14B includes a baked electrode layer 14B _3, and a plating layer 14B _4. The baked electrode layers 14 </ b> A ₃ and 14 </ b> B ₃ are disposed on the surface of the element body 10 so as to be in direct contact with the surface of the element body 10. The baking electrode layers 14A ₃ and 14B ₃ are made of a conductive paste containing a metal (for example, Cu, Ni, Ag, Pd, Au, or Pt) and a glass component (for example, borosilicate glass). 10 and the conductive paste is baked at a predetermined temperature. The content ratio of the glass components of the baking electrode layers 14A ₃ and 14B ₃ is, for example, 5 to 10%. That is, the baking electrode layers 14A ₃ and 14B ₃ contain Cu, Ni, Ag, Pd, Au, or Pt as a main component. The thickness of the baked electrode layers 14A ₃ and 14B ₃ is, for example, 1 μm or more.

Plating layer 14A ₄ is disposed on the surface of the sintered electrode layers 14A ₃ so as to cover the entire surface of the sintered electrode layers 14A _3. Plated layer 14B ₄ is disposed on the surface of the sintered electrode layers 14B ₃ to cover the entire surface of the sintered electrode layers 14B _3. The plating layers 14A ₄ and 14B ₄ contain Cu, Ag, Au, Ni, Pd, or Sn as a main component. The plating layers 14A ₄ and 14B ₄ may be composed of a plurality of layers. In this case, each layer constituting the plating layers 14A ₄ and 14B ₄ may be formed of the same kind of material or a different kind of material. The thickness of the plating layers 14A ₄ and 14B ₄ is, for example, 5 μm or more.

  Next, the mounting structure of the multilayer capacitor 1 will be described with reference to FIG. As shown in FIG. 3, the multilayer capacitor 1 is embedded and mounted in a substrate (circuit board) 100. The substrate 100 is configured by laminating a plurality of insulating resin sheets 102. The substrate 100 includes electrodes 104A and 104B formed on the surface of the substrate 100 and via conductors 106A and 106B. The via conductors 106A and 106B are filled in the through holes (via holes) 108A and 108B formed in the substrate 100, respectively.

  An end of the via conductor 106A on the inner side of the substrate 100 is connected to a portion of the terminal electrode 14A on the main surface 10c side. An end of the via conductor 106A on the outer side of the substrate 100 is connected to the electrode 104A. An end of the via conductor 106B on the inner side of the substrate 100 is connected to a portion of the terminal electrode 14B on the main surface 10c side. An end of the via conductor 106B on the outer side of the substrate 100 is connected to the electrode 104B.

  Next, a method for embedding the multilayer capacitor 1 in the substrate 100 will be described. First, a plurality of resin sheets 102 are laminated with the multilayer capacitor 1 disposed therein, and the multilayer capacitor 1 is embedded in the substrate 100. Next, through holes 108A and 108B are formed in the substrate 100 using a laser beam. At this time, the laser beam is emitted toward the main surface 10c side portion of the terminal electrodes 14A and 14B. As a result, the terminal electrodes 14A and 14B are exposed to the outside through the through holes 108A and 108B.

  Next, via conductors 106A and 106B are formed in the through holes 108A and 108B by electroless plating. Next, an electrode 104A is formed on the substrate 100 so as to be connected to the via conductor 106A, and an electrode 104B is formed on the substrate 100 so as to be connected to the via conductor 106B. Thus, the internal electrodes 12A and 12B of the multilayer capacitor 1 are electrically connected to the electrodes 104A and 104B through the terminal electrodes 14A and 14B and the via conductors 106A and 106B, respectively.

  In the present embodiment as described above, the end portions of the internal electrodes 12A and 12B are exposed from the end surfaces 10a and 10b, respectively, and the end surfaces 10a and 10b are inclined when viewed from the opposing direction of the side surfaces 10a and 10b. . The thickness of the internal electrodes 12A and 12B is usually very thin, about several μm. In this case, according to the multilayer capacitor 1 according to this embodiment, the exposed area of the end portions of the internal electrodes 12A and 12B increases. There is a tendency. Accordingly, since the end portions of the internal electrodes 12A and 12B and the terminal electrodes 14A and 14B are sufficiently fixed, the connectivity between the end portions of the internal electrodes 12A and 12B and the terminal electrodes 14A and 14B is improved. As a result, connection failure (loose contact) between the terminal electrodes 14A and 14B and the internal electrodes 12A and 12B can be suppressed.

  In the present embodiment, the outer surfaces S1, S2 are parallel to each other and face each other in the facing direction of the end faces 10a, 10b. The outer surfaces S1 and S2 extend so as to be substantially orthogonal to the main surfaces 10c and 10d and the side surfaces 10e and 10f. Therefore, in the facing direction of the end surfaces 10a and 10b, the width of the main surface 10c is smaller than the width of the main surface 10d, but the width of the multilayer capacitor 1 on the main surface 10c side and the width of the multilayer capacitor 1 on the main surface 10d side. The width is substantially the same. Therefore, the size (area) of the terminal electrodes 14A and 14B on the main surface 10c side can be increased. Therefore, according to the multilayer capacitor 1 according to the present embodiment, when the main surface 10c side is the mounting surface, the multilayer capacitor 1 can be easily mounted on the substrate.

In this embodiment, the end surface 10a, in the 10b opposing direction of (longitudinal direction of the multilayer capacitor 1), the terminal electrodes 14A, the length X1, X2 of 14B, larger than the distance Y of the lead portions _14A 2, 14B _2. In this case, the area of the terminal electrodes 14A and 14B is sufficiently ensured on the main surface 10c. Therefore, when the multilayer capacitor 1 is mounted on the substrate 100, the contact area between the terminal electrodes 14A and 14B and the terminal electrode of the substrate 100 can be increased. As a result, the electrical connection between the multilayer capacitor 1 and the substrate 100 can be more reliably performed. In particular, in a mounting structure in which the multilayer capacitor 1 is embedded in the substrate 100, when the through holes (via holes) 108 </ b> A and 108 </ b> B are formed in the substrate 100, the laser beam is applied to the terminal electrodes 14 </ b> A and 14 </ b> B of the multilayer capacitor 1. At this time, since the areas of the terminal electrodes 14A and 14B are sufficiently secured on the main surface 10c side, the laser beams are easily irradiated to the terminal electrodes 14A and 14B. Therefore, it is possible to reduce the possibility of damage to the element body 10 by the laser beam.

  In the present embodiment, the dimension (height of the element body 10) h between the main surfaces 10c and 10d is the maximum dimension (the length of the element body 10) L between the end faces 10a and 10b, and the side surfaces 10e and 10f. It is smaller than the dimension between them (the width of the element body 10) W. Therefore, the multilayer capacitor 1 is configured as a so-called low profile multilayer capacitor. In addition, since the terminal electrodes 14A and 14B are disposed on the main surfaces 10c and 10d, the multilayer capacitor 1 can be mounted in a state of being built in the substrate 100. By the way, in the mounting structure in which the multilayer capacitor 1 is embedded in the substrate 100, through holes (via holes) 108A and 108B are formed in the substrate 100 using a laser beam so that the terminal electrodes 14A and 14B of the multilayer capacitor 1 are exposed, and the through holes are formed. The via conductors 106A and 106B are connected to the terminal electrodes 14A and 14B of the multilayer capacitor 1 by embedding the via conductors 106A and 106B in the holes 108A and 108B, respectively. In such a mounting structure, since the current loop distance between the terminal electrodes 14A and 14B is shortened, the equivalent series inductance (ESL) can be lowered.

  In the present embodiment, in the element body 10, the inner layer dimension D1 and the outer layer dimension D2 are substantially equal, and the inner layer dimension D1 and the outer layer dimension D3 are approximately equal. In this case, since the outer layer dimensions D2 and D3 are relatively large, the outer layer portion functions as a protective layer. Therefore, occurrence of structural defects in the multilayer capacitor 1 can be suppressed. In addition, such a multilayer capacitor 1 can ensure electrostatic capacity.

In the present embodiment, the terminal electrodes 14A and 14B have the baked electrode layers 14A ₁ and 14B ₁ disposed on the surface of the element body 10, respectively. Therefore, since the internal electrodes 12A and 12B are connected to the baked electrode layers 14A ₁ and 14B ₁ located on the surface of the element body 10, the terminal electrodes 14A and 14B and the internal electrodes 12A and 12B can be more reliably connected. it can.

  As mentioned above, although embodiment of this invention was described in detail, this invention is not limited to above-described embodiment. For example, as shown in FIGS. 4 and 5, in the multilayer capacitor 2, the width of the end faces 10a and 10b in the facing direction of the side faces 10e and 10f is larger than the maximum width of the side faces 10e and 10f in the facing direction of the end faces 10a and 10b. May be larger. That is, the maximum dimension (length of the element body 10) L (see FIG. 4) between the end faces 10a and 10b is larger than the dimension (width of the element body 10) W (see FIG. 4) between the side faces 10e and 10f. It may be small. In this case, the terminal electrodes 14 </ b> A and 14 </ b> B are disposed on the end faces 10 a and 10 b extending along the longitudinal direction of the element body 10. Therefore, the current path is shortened in the element body 10 and the parasitic inductance is reduced. As a result, it is possible to effectively reduce equivalent series inductance (ESL) in the multilayer capacitor 2.

In the present embodiment, the terminal electrode 14A continuously extends from the end surface 10a to the main surface 10c so as to wrap around the ridge portion of the element body 10, and the terminal electrode 14B extends from the end surface 10b to the main surface 10c. It extended continuously to wrap around the ridge. That is, the terminal electrodes 14A and 14B had an L shape when viewed from the direction in which the side surfaces 10e and 10f face each other. However, the shape of the terminal electrodes 14A and 14B is not limited to this. Specifically, as the multilayer capacitor 2 shown in FIGS. 4 and 5, the terminal electrodes 14A is continuously withdrawn the lead portion 14A ₅ disposed on the main surface 10d further from the main portion 14A ₁ And may extend continuously from the end face 10a to the principal faces 10c and 10d so as to go around the ridges of the element body 10. Similarly, the terminal electrode 14B is continuously withdrawn further includes a lead portion 14B ₅ disposed on the principal surface 10d and the main portion 14B _1, the body 10 over the main surface 10c, 10d from the end surface 10a crest It may extend continuously so as to go around the part. That is, the terminal electrodes 14A and 14B may have a C shape when viewed from the opposing direction of the side surfaces 10e and 10f. In this case, since the lead portions 14A ₂ and 14B ₂ are arranged on the main surface 10c and the lead portions 14A ₅ and 14B ₅ are arranged on the main surface 10d, the main surfaces 10c and 10d can be used as mounting surfaces. . In this case, as shown in FIG. 6, in the multilayer capacitor 2 mounted on the substrate 100, via conductors 106A connected to the lead portions 14A ₂ and 14A ₅ are formed, and lead portions 14B ₂ and 14B ₅ are formed. Via conductors 106B connected to each of the two may be formed.

1,2 ... multilayer capacitor, 10 ... body, 10a, 10b ... end surface, 10c, 10d ... the main surface, 10e, 10f ... side, 12A, 12B ... internal electrode, 14A, 14B ... terminal _electrodes, 14A 1, 14B ₁ ... the main portion, _14A 2, 14B 2 _... lead-out portion.

Claims (6)

First and second side surfaces facing each other so as to extend substantially parallel to each other; first and second main surfaces facing each other so as to extend substantially parallel to each other and connecting the first and second side surfaces; An element body having first and second end faces connecting the first and second side faces and the first and second main faces;
A first terminal electrode disposed on the first end face side of the element body;
A second terminal electrode disposed on the second end face side of the element body;
A first internal electrode located in the element body and having an end exposed from the first end face connected to the first terminal electrode;
An end portion exposed from the second end surface is located in the element body so as to face the first internal electrode in a facing direction of the first and second main surfaces, and the second terminal electrode is connected to the second terminal electrode. A second internal electrode connected,
Each of the first and second side surfaces has a pair of side edges facing each other, and one side edge of the pair of side edges is shorter than the other side edge,
The first main surface connects the respective one side edges of the first and second side surfaces, and the entirety of the first main surface in the opposing direction of the first and second main surfaces. Overlap with the surface,
The second main surface connects the other side edges of the first and second side surfaces,
The first and second end surfaces are inclined so as to approach each other from the second main surface toward the first main surface as viewed from the opposing direction of the first and second side surfaces,
The first terminal electrode includes a first portion disposed on the first end surface and a second portion disposed on the first main surface continuously drawn from the first portion. And having a part
The second terminal electrode includes a third portion disposed on the second end surface, and a fourth portion disposed on the first main surface continuously drawn from the third portion. And having a part
Each of the first and third portions has a thickness in the facing direction of the first and second end surfaces from the second main surface as viewed from the facing direction of the first and second side surfaces. A multilayer capacitor that increases in size toward the main surface. The first terminal electrode includes a planar first outer surface extending along a facing direction of the first and second main surfaces,
The second terminal electrode includes a planar second outer surface extending along a facing direction of the first and second main surfaces,
2. The multilayer capacitor according to claim 1, wherein the first and second outer surfaces are substantially parallel to each other and face each other in a facing direction of the first and second end faces.   The multilayer capacitor according to claim 2, wherein the first and second outer surfaces extend so as to be substantially orthogonal to the first and second side surfaces and the first and second main surfaces.   The length of the said 1st and 2nd terminal electrode is larger than the separation distance of the said 2nd and 4th part in the opposing direction of the said 1st and 2nd end surface, The any one of Claims 1-3 The multilayer capacitor according to one item.   The width of the said 1st and 2nd end surface in the opposing direction of the said 1st and 2nd side surface is larger than the said other side edge of the said 1st and 2nd side surface, Any one of Claims 1-4. The multilayer capacitor according to one item. The first terminal electrode further includes a fifth portion that is continuously drawn from the first portion and disposed on the second main surface,
The second terminal electrode further includes a sixth portion that is continuously drawn from the third portion and arranged on the second main surface. The multilayer capacitor described.

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