JP2015020387A - Seal molding method for insert parts and mold apparatus therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent distortion and deformation of an insert part due to resin flow resistance in a molding metal mold in which the insert part is set and encapsulated in the metal mold.SOLUTION: A pressure-receiving surface 4 is provided at the right side, supposing that resin is injected in a cavity 7 from the left side of the drawing as a shown arrow. Thus, even after the resin reaches the left side of insert part holding pins 3, since the left lateral surfaces of the insert part holding pins 3 is almost vertical to an insert part 1, the injection pressure of the resin acts almost vertically to the lateral surface of the insert part holding pins 3 and does not act so that the insert part holding pins 3 is regressed in the direction of being separated from the inset part 1. Thereafter, only after the resin goes around the insert part holding pins 3 and reaches the pressure-receiving surface 4 of the right side lateral surface, the injection pressure of the resin starts to act so that the insert part holding pins 3 is regressed in the direction of being separated from the inset part 1.

Description

  The present invention relates to a sealing molding method in which an insert part is set in a mold and sealing molding is performed, and a mold apparatus thereof.

  In a product in which a resin base or metal plate, which is a flat insert part, is installed in a mold and the surrounding area is sealed with resin, the part that is not sealed is pressed with the mold. In the case where the number of parts is small and cantilever is fixed, when the resin is poured, the resin pressure causes distortion and deformation of the insert part. For this purpose, it is necessary to fix the insert part with a holding pin.

  In that case, if the insert part is sandwiched between the holding pins and sealed, the product will have a holding pin-shaped hole and an exposed part of the insert will be generated. It becomes a problem in the product.

  Further, a method is adopted in which a cylinder or the like is employed at the timing when the resin reaches the vicinity of the holding pin, and the holding pin is moved backward in a direction away from the substrate with a mechanical structure. However, in this case, there is a problem in that the mold structure is complicated and the mold size is increased, and it is necessary to provide a power supply circuit.

  Moreover, there exists Unexamined-Japanese-Patent No. 2003-80552 (patent document 1) as background art of this technical field. In this publication, the tip of the substrate holding pin is formed in a tapered shape so that the substrate holding pin is retracted in the direction away from the substrate by the injection pressure of the molten resin.

JP 2003-80552 A

  In Patent Document 1, the substrate holding pin is configured to be retracted in a direction away from the substrate by the injection pressure of the molten resin. However, the tip of the substrate holding pin has an inclined surface or a convex over the entire circumference. Since it is a curved surface or a concave curved surface, the substrate holding pin moves backward in a direction away from the substrate from the time when the resin reaches the substrate holding pin. For this reason, the substrate holding pins release the substrate from being fixed before the insert part is fixed by the resin. Therefore, it has not been considered that it is impossible to prevent the occurrence of distortion and deformation of the insert component due to the resin pressure, which is the original function of the substrate holding pin.

  In order to solve the above problems, the present invention forms and arranges the surface of the insert component holding pin that receives the resin injection pressure so as to be opposite to the resin flow direction.

  As described above, according to the present invention, it is possible to provide a sealing molding method and a mold apparatus thereof that can secure the quality of a sealing product while enabling the fixing of an insert part.

It is the schematic of the target product of a present Example. It is the state figure which inserted and fixed the insert component of the present Example with the insert component holding pin. It is a state figure of the pin for insert parts holding at the time of pouring resin into the metallic mold of this example. It is the figure which looked at the pin for holding from the spring mounting side. It is an example of the front-end | tip shape of the insert component holding pin which receives resin pressure.

  An embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic view of a target product relating to the present invention. In FIG. 1, 1 is a flat insert part, 2 is the resin part which sealed it. As shown in FIG. 1, the plate-like insert part 1 is a product in which most of the part is sealed with a resin, the part that can be fixed with a mold is limited, For this reason, there is a possibility that the insert parts may be distorted or deformed by the pressure and resistance when the resin is poured into the mold. For this purpose, it is necessary to fix the insert part with a holding pin.

FIG. 2 is a view showing a state in which the insert part of the present invention is sandwiched and fixed by holding pins. In FIG. 2, 3 is an insert component holding pin, 4 is a pressure receiving surface for receiving resin injection pressure, 5 is a spring, 6 is a mold, and 7 is a cavity. Further, PL represents a mold parting line, and indicates a mating surface when the fixed mold and the movable mold are fastened when the resin is poured.
A mold composed of a fixed side mold and a movable side mold is clamped to fix a part of the insert part and to form a cavity 7 as a space, and the insert part arranged in the cavity is placed in the cavity. It is a mold configuration that is sealed by the injected resin.

  As shown in FIG. 2, a part of the insert part is fixed by a mold, and sandwiched and fixed by the insert part holding pin 3, thereby preventing the insert part from being distorted or deformed by a resin pressure. Further, the insert component holding pin 3 has a structure in which one end protrudes into the cavity 7 by the force of the spring 5 which is one of the elastic bodies, and can move forward in the direction in contact with the insert component 1. When the pressure receiving surface 4 receives the injection pressure at the time of pouring into the insert part, the insert part holding pin 3 moves backward in the direction away from the insert part 1 and opens the holding state of the insert part. For the spring rate, the resin injection pressure is calculated, and the spring corresponding to the pressure is selected. Depending on the actual molding situation, selection can be made by simply replacing the spring.

Here, the pressure receiving surface 4 that receives the resin injection pressure is configured and arranged so as to be provided only on the surface opposite to the resin flow direction. That is, in FIG. 2, if the resin is injected into the cavity 7 from the left side of the drawing as shown in the figure, the pressure receiving surface 4 is provided on the right side. Thereby, even if the resin reaches the left side of the insert component holding pin 3, the left side surface of the insert component holding pin 3 is substantially perpendicular to the insert component 1, so that the injection pressure of the resin is for holding the insert component. It acts substantially perpendicularly to the side surface of the pin 3 and does not act to retract the insert component holding pin 3 in a direction away from the insert component 1. After that, the resin injection pressure does not allow the insert component holding pin 3 to move away from the insert component 1 until the resin reaches the pressure receiving surface 4 on the right side surface through the insert component holding pin 3. Begin to act on.
FIG. 3 shows a state of the insert component holding pin 3 when the resin is poured into the cavity. In FIG. 3, reference numeral 2 denotes a resin portion, and it can be seen that the insert part holding pin 3 is retracted away from the insert part 1 by reaching the pressure receiving surface 4 of the insert part holding pin 3. .

  As described above, the timing of retracting the insert component holding pin 3 by the resin injection pressure in the direction away from the insert component 1 can be delayed as much as possible. Therefore, the holding time of the insert part can be lengthened and held reliably.

Next, the structure which arrange | positions so that the pressure receiving surface 4 provided in the pin 3 for insert components holding | maintenance may become correctly reverse with respect to the resin flow direction is demonstrated using FIG. FIG. 4 is a view of the insert component holding pin 3 as viewed from the side where the spring 5 is mounted. In FIG. 4, 8 is a flange-shaped portion for receiving the spring 5 of the insert component holding pin 3, 9 is a hole for receiving the spring 5 of the mold, and a cut surface 10 is provided in the flange-shaped portion 8 and the hole 9. Yes. Thereby, the hole 9 provided in the mold side and the cut surface 10 provided in the brim-shaped portion 8 of the insert component holding pin 3 function as a detent.
Thereby, the pressure receiving surface 4 provided in the insert component holding pin 3 is provided on the mold side by providing a desired cut surface 10 according to the arrangement of the insert component holding pin and the resin inlet. It can be positioned so that it is correctly opposite to the resin flow direction.

  In addition, this positioning structure is not limited to providing a cut surface, for example, you may provide a convex part in part, and as a rotation stop of the insert component holding pin 3 with respect to the mold side Any structure that functions and restricts the shaft rotation of the insert component holding pin 3 may be used.

  Further, the tip shape of the insert component holding pin 3 may be a flat surface inclined with respect to the axis of the insert component holding pin 3, but as shown in FIGS. Or an arc shape of (B), which can increase the area for receiving the resin injection pressure, and promote the backward movement of the insert part holding pins 3 in the direction away from the insert part 1. I can do it.

  In addition, it is desirable to install the insert component holding pin as close to the filling end as possible in consideration of the resin filling balance.

  As described above, in this embodiment, a mold composed of a fixed side mold and a movable side mold is clamped to fix a part of the insert part and configure a cavity, which is arranged in the cavity. In a mold apparatus for sealing an insert part with a resin injected into the cavity, an insert part holding pin provided on the mold and biased by an elastic body to project one end into the cavity and hold the insert part; A pressure receiving surface for receiving a resin injection pressure is provided on the half surface of the tip portion of the insert component holding pin protruding into the cavity, and the insert component holding pin is formed of a resin whose pressure receiving surface is injected into the cavity. It is set as the structure arrange | positioned so that it may become the opposite surface of the said insert component holding pin with respect to the flow direction.

That is, the structure is such that the timing of retracting the insert part holding pin in the direction away from the insert part can be delayed as much as possible only by the resin pressure in the molding process.
Further, it is a method of sealing and molding an insert part which is disposed in a cavity of a mold and protrudes into the cavity and is held by an insert part holding pin provided in the mold, and is injected into the cavity. The insert component is sealed with resin, and the insert component holding pin is inserted by receiving the injection pressure of the resin by the pressure receiving surface provided on the opposite surface of the insert component holding pin with respect to the flow direction of the resin. It is possible to provide a method for sealing and forming an insert part which is retracted in a direction away from the part and the insert part holding pin releases the holding of the insert part.

  As a result, it is possible to prevent the distortion and deformation of the insert part by extending the holding time of the insert part and securely holding the insert part, and it is possible to ensure product quality with a simple structure. In addition, it is possible to realize a mold structure and a method for reducing the mold cost.

  In addition, this invention is not limited to an above-described Example, Various modifications are included. For example, the above-described embodiments have been described in detail for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described.

1. Plate insert parts, 2. Resin part,
3. Pins for holding insert parts, 4. Pressure receiving surface,
5 ... Spring, 6 ... Mold,
7. Cavity, 10. Cut surface

Claims (6)

Resin in which a part of an insert part is fixed by clamping a mold composed of a fixed side mold and a movable side mold and a cavity is formed, and the insert part arranged in the cavity is injected into the cavity In the mold apparatus sealed by
An insert component holding pin that is provided in the mold and is urged by an elastic body to project one end into the cavity and hold the insert component;
A pressure receiving surface for receiving the resin injection pressure is provided on the half surface of the tip portion of the insert part holding pin protruding into the cavity,
The mold device according to claim 1, wherein the insert component holding pin is disposed so that the pressure receiving surface is opposite to the insert component holding pin with respect to a flow direction of the resin injected into the cavity. The mold apparatus according to claim 1, wherein
The insert component holding pin is disposed in the mold with limited axial rotation, and the pressure receiving surface of the insert component holding pin holds the insert component with respect to the flow direction of the resin injected into the cavity. A mold apparatus, wherein the mold apparatus is disposed so as to be on the opposite side of the pins for use. The mold apparatus according to any one of claims 1 and 2,
The mold apparatus according to claim 1, wherein the pressure receiving surface is a flat surface inclined with respect to an axis of the insert component holding pin. The mold apparatus according to any one of claims 1 and 2,
The mold apparatus according to claim 1, wherein the pressure receiving surface has an uneven surface inclined with respect to an axis of the insert component holding pin. The mold apparatus according to any one of claims 1 and 2,
The mold apparatus according to claim 1, wherein the pressure receiving surface is an arc-shaped surface inclined with respect to an axis of the insert component holding pin. A sealing molding method for insert parts,
The insert part is disposed in a cavity of a mold and is held by an insert part holding pin provided in the mold protruding into the cavity.
The insert part is sealed with a resin injected into the cavity, and the resin injection pressure is received by a pressure receiving surface provided on the opposite surface of the insert part holding pin with respect to the flow direction of the resin. A method of sealing and molding an insert part, wherein the insert part holding pin is retracted in a direction away from the insert part, and the insert part holding pin releases the holding of the insert part.

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