JP2015019062A - Substrate processing device, semiconductor equipment, self-diagnosis device of semiconductor equipment, and self-diagnosis method of semiconductor equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing device capable of autonomously diagnosing itself without support of an automated material handling system and another test equipment.SOLUTION: A substrate processing device 100 includes: a process unit 110 which performs a substrate processing step; a plurality of load ports 120 provided so as to load a substrate or a carrier which houses a plurality of substrates; a plurality of communication interface units 131 to 134 installed in response to the respective load ports so as to communicate with a transfer unit which transfers the substrate or the carrier; and a controller 140 which controls transfer operation of the substrate or the carrier by transmitting and receiving signals between itself and the transfer unit through the communication interface units. The controller includes a first process unit which operates the first communication interface unit 131 as a passive type and a second process unit which operates the second communication interface unit 132 as an active type.

Description

  The present invention relates to a substrate processing apparatus, a semiconductor facility, a semiconductor facility self-diagnosis device, and a semiconductor facility self-diagnosis method.

  A semiconductor facility such as a substrate processing apparatus includes a transfer unit such as an automatic material handling system (AMHS). The automatic transfer equipment loads an unprocessed substrate or a storage container (carrier) storing an unprocessed substrate on a load port, and loads a container in which a processed substrate or a processed substrate is stored. It is a device for transferring from a port to another process unit.

  In order to improve the productivity of the semiconductor, communication between the automatic transfer equipment and the substrate processing apparatus is performed according to a standard (for example, SEMI E84) regarding communication with the semiconductor equipment. SEMI E84 is a communication protocol used for handoff of storage containers between semiconductor production equipment and automatic transport equipment, by optical communication between semiconductor production equipment and automatic transport equipment. Done.

  In SEMI E84, semiconductor equipment does not actively provide storage containers for automatic transfer equipment, nor receive storage containers from automatic transfer equipment, and passively provide storage containers for automatic transfer equipment. Or take a container. On the other hand, the automatic transfer equipment actively loads the storage container on the load port or carries the storage container from the load port. In this connection, during the communication between the semiconductor equipment and the automatic transport equipment under SEMI E84, the semiconductor equipment is operated as a passive type, and the automatic transport equipment is the active type that is the opposite. It is operated as.

  Before a semiconductor facility is normally operated and a process such as substrate processing is performed, a setup operation through a communication test with an automatic transfer device must be performed first. However, in the case of existing semiconductor equipment, it is difficult to perform a communication test of the semiconductor equipment in advance without the support of automatic equipment that operates as an active type, and the setup work must be performed only after the automatic equipment is installed. Can do. The longer the installation of the automatic transfer equipment, the longer it takes to check and eliminate the error of the semiconductor equipment, and there is a risk that the normal operation of the semiconductor equipment will be delayed.

  In addition, in the existing semiconductor equipment diagnostic device, if an abnormality occurs in the communication between the semiconductor equipment and the automatic transport equipment during the process of installing the automatic transport equipment and performing the communication test, is the semiconductor equipment abnormal? It is difficult to check if there is an abnormality in the automatic transfer equipment, and in order to solve the problem, it is essential to collaborate with the manufacturer of the automatic transfer equipment. Inevitably, time is wasted.

  On the other hand, as part of diagnosing semiconductor equipment without the assistance of automatic transfer equipment, there is a plan to purchase another test equipment, perform a communication test using the test equipment, and perform setup work. Since the equipment is expensive, it is necessary to increase the process cost and to support the skilled engineer who is familiar with the parallel input / output signal diagram (Parallel Input / Output signal diagram). In addition, when an abnormality occurs between the test equipment and the semiconductor equipment, it is impossible to accurately determine whether the problem is caused by the problem of the semiconductor equipment, and the semiconductor of the test equipment is required. There are difficulties in diagnosing equipment.

Korean Published Patent No. 10-2008-0096021

  The present invention provides a semiconductor facility, a semiconductor facility self-diagnosis device, and a semiconductor facility self-diagnosis method capable of autonomously diagnosing a semiconductor facility without the assistance of automatic transfer equipment or other test equipment. With the goal. It is another object of the present invention to provide a substrate processing apparatus capable of actively diagnosing the substrate processing apparatus without the assistance of automatic transfer equipment or other test equipment.

  Another problem to be solved by the present invention is a semiconductor facility capable of accurately grasping the cause when an abnormality occurs in communication between the semiconductor facility and the automatic transfer equipment, a self-diagnosis device for the semiconductor facility, Another object of the present invention is to provide a self-diagnosis method for semiconductor equipment. Further, another problem to be solved by the present invention is to provide a substrate processing apparatus capable of accurately grasping the cause when an abnormality occurs in communication between the substrate processing apparatus and automatic transfer equipment. There is.

  Still another problem to be solved by the present invention is to provide a semiconductor facility, a semiconductor facility self-diagnosis device, and a semiconductor capable of autonomously performing a communication test of the semiconductor facility without changing the hardware configuration of the semiconductor facility. It is to provide a self-diagnosis method for equipment. Still another object of the present invention is to provide a substrate processing apparatus capable of actively performing a communication test of the substrate processing apparatus without changing the hardware configuration of the substrate processing apparatus. is there.

  The problems to be solved by the present invention are not limited to the problems mentioned above. Other technical problems that are not mentioned can be clearly understood from the following description by those skilled in the art to which the present invention belongs.

  In order to achieve the above-described problems, a substrate processing apparatus according to an aspect of the present invention is provided with a plurality of process units in which a process of processing a substrate is performed and a storage container that stores a substrate or a plurality of substrates. A plurality of communication interface units installed corresponding to each load port so as to communicate with each of the load ports, the transfer unit for transferring the substrate or the storage container, and the transfer unit through the communication interface unit. And a controller for controlling the transfer operation of the substrate or the storage container by transmitting and receiving signals between the at least one first communication interface unit among the plurality of communication interface units. A first process unit that operates as a type, and a small number of the plurality of communication interface units. Both and a second processing unit for operating the one of the second communication interface unit as an active type.

  In the substrate treatment apparatus, the controller sends an active signal and a passive signal between the first process unit and the second process unit via the first communication interface unit and the second communication interface unit. A communication test can be performed by transmitting and receiving.

  In the substrate treatment apparatus, the first process unit operates the first communication interface unit corresponding to the first load port among the plurality of load ports as the passive type, and the second process unit includes: The second communication interface corresponding to the second load port among the plurality of load ports can be operated as the active type to perform self-diagnosis of communication at the first load port.

  The substrate processing apparatus further includes a communication cable for transmitting a signal between the first communication interface unit and the second communication interface unit, and the communication cable is opposed to the first communication interface unit. A first input / output interface unit disposed; a second input / output interface unit disposed opposite to the second communication interface unit; the first input / output interface unit; and the second input / output interface unit. Interconnecting interconnects.

  In the above-described substrate treatment apparatus, the interconnection unit includes a channel in which an input channel of the first input / output interface unit and an output channel of the second input / output interface unit are different from each other, and the first input / output unit The first input / output interface unit and the second input / output interface unit may be cross-connected so that the output channel of the interface unit and the input channel of the second input / output interface unit have different channels.

  In the substrate treatment apparatus, the first process unit receives an active signal through a first channel of the first communication interface unit, transmits a passive signal through a second channel of the first communication interface unit, and The first communication interface unit is operated as a passive type, and the second process unit receives the passive signal through the first channel of the second communication interface unit and the active through the second channel of the second communication interface unit. A signal may be transmitted to operate the second communication interface unit as an active type.

  In the substrate treatment apparatus, the communication cable receives the passive signal from the second channel of the first communication interface unit through the second channel of the first input / output interface unit, The passive signal is transmitted to the first channel of the second communication interface unit through the first channel, and the active signal is received from the second channel of the second communication interface unit through the second channel of the second input / output interface unit. The active signal may be transmitted to the first channel of the first communication interface unit through the first channel of the first input / output interface unit.

  In the above substrate treatment apparatus, the communication interface unit may include a photocoupler that transmits and receives an optical signal to perform parallel input / output (Parallel Input / Output) communication.

  In the substrate treatment apparatus, the active signal is a signal transmitted from the transfer unit operating as an active type to the controller through the communication interface unit during normal operation of the substrate processing apparatus, and the passive signal is The signal may be transmitted to the transfer unit through the communication interface unit from the controller operating as a passive type during normal operation of the substrate processing apparatus.

  In order to solve the above-described problem, a semiconductor equipment self-diagnosis device according to another aspect of the present invention provides a signal to a transfer unit that transfers a substrate or a storage container that stores a plurality of substrates through a plurality of communication interface units. And a controller for controlling a transfer operation of the substrate or the storage container between the transfer unit and the semiconductor facility by receiving a signal from the transfer unit, and the controller includes the plurality of communication interface units. A first process unit that operates at least one first communication interface unit as a passive type, and a second process that operates at least one second communication interface unit among the plurality of communication interface units as an active type Part.

  In the above self-diagnosis apparatus, the controller sends an active signal and a passive signal between the first process unit and the second process unit via the first communication interface unit and the second communication interface unit. A communication test can be performed by transmitting and receiving.

  In the above self-diagnosis apparatus, the first process unit includes a first communication interface unit corresponding to a first load port in a load port of a semiconductor facility provided to load the substrate or the storage container. Operate as a passive type, and the second process unit operates the second communication interface unit corresponding to the second load port of the semiconductor facility as the active type to self-diagnose communication at the first load port. Can do.

  The self-diagnosis device further includes a communication cable for transmitting a signal between the first communication interface unit and the second communication interface unit, and the communication cable is opposed to the first communication interface unit. A first input / output interface unit disposed; a second input / output interface unit disposed opposite to the second communication interface unit; the first input / output interface unit; and the second input / output interface unit. An interconnecting unit to be coupled, wherein the interconnecting unit has a channel in which an input channel of the first input / output interface unit and an output channel of the second input / output interface unit are different from each other; Output channel of one input / output interface unit and the second input / output interface unit To have different channels and input channels together, the said first input-output interface unit and said second input-output interface unit can cross linking.

  In order to solve the above-described problems, a semiconductor facility according to another aspect of the present invention is compatible with a plurality of load ports provided to load a storage container for storing a substrate or a plurality of substrates, and each load port. A plurality of communication interface units installed so that at least one communication interface unit of the plurality of communication interface units operates as an active type and sends an active signal to another communication interface unit. By transmitting, the communication of the other communication interface unit is self-diagnosed.

  In the semiconductor facility, the semiconductor facility may further include a communication cable that transmits a signal between the at least one communication interface unit and the other communication interface unit.

  In order to solve the above-described problems, a semiconductor facility self-diagnosis method according to another aspect of the present invention is provided in a load port of a semiconductor facility provided to load a substrate or a storage container that accommodates a plurality of substrates. The first communication interface unit corresponding to the first load port is operated as a passive type, the second communication interface unit corresponding to the second load port of the semiconductor facility is operated as an active type, and the first communication interface unit and And performing a communication test by transmitting and receiving an active signal and a passive signal to and from the second communication interface unit to perform self-diagnosis of communication at the first load port.

  In the self-diagnosis method, the step of self-diagnosis of the communication includes transmitting an active signal transmitted from the second communication interface unit to the first communication interface unit using a communication cable; Transmitting a passive signal transmitted from one communication interface unit to the second communication interface unit using the communication cable.

  In the self-diagnosis method, the active signal is a signal transmitted from the transfer unit operating as an active type to the first communication interface unit or the second communication interface unit during normal operation of the semiconductor facility, The passive signal may be a signal transmitted from the first communication interface unit or the second communication interface unit to the transfer unit during normal operation of the semiconductor facility.

  According to the present invention, a semiconductor facility or a substrate processing apparatus can be diagnosed autonomously without the assistance of automatic transfer equipment or other test equipment.

  Further, according to the present invention, when a communication abnormality occurs between the semiconductor facility or the substrate processing apparatus and the automatic transfer equipment, the cause can be accurately grasped.

  Further, according to the present invention, it is possible to autonomously perform a communication test of a semiconductor facility or a substrate processing apparatus without changing the hardware configuration of the semiconductor facility or the substrate processing apparatus.

  The effects of the present invention are not limited to the effects described above. Effects not mentioned can be clearly understood by those skilled in the art to which the present invention belongs from the present specification and the accompanying drawings.

1 is a perspective view of a substrate processing apparatus according to an embodiment of the present invention. 1 is a side view of a substrate processing apparatus according to an embodiment of the present invention. It is a block diagram of the controller which comprises the substrate processing apparatus by one Embodiment of this invention. It is a block diagram of the communication interface of the communication interface part and transfer unit which comprise the substrate processing apparatus by one Embodiment of this invention. FIG. 10 is a parallel input / output signal diagram according to SEMI E84 in the process of transferring the storage container from the transfer unit to the load port. FIG. 10 is a parallel input / output signal diagram according to SEMI E84 in the process of transferring the storage container from the load port to the transfer unit. 1 is a perspective view of a semiconductor equipment self-diagnosis device according to an embodiment of the present invention. 1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. It is a block diagram of the communication cable which comprises the self-diagnosis apparatus of the semiconductor facility by one Embodiment of this invention. It is a block diagram of the self-diagnosis apparatus of the semiconductor facility by other embodiment of this invention.

  Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be embodied in various forms different from each other. The embodiments are merely for the purpose of fully disclosing the present invention. Is provided to enable those having ordinary skill in the art to understand the content of the invention, which is defined by the following claims.

  Even if not defined, all terms used herein (including technical or scientific terms) have the same meaning as terms commonly interpreted by universal techniques in the prior art to which this invention belongs. Have Terms defined by a general dictionary can be construed to have the same meaning as the terms meant in the related art and / or the present application. And it should not be conceptualized or overly formalized, even if it is not clearly defined here.

  In the drawings, some components may be exaggerated slightly. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or corresponding elements. In describing embodiments of the present invention, detailed descriptions of related known configurations or functions may be omitted if they may obscure the subject matter of the present invention.

  The self-diagnosis apparatus for a semiconductor facility according to an embodiment of the present invention can change a communication interface corresponding to one or more load ports between a passive type and an active type. Configure and self-diagnose the semiconductor facility by setting a communication interface between different load ports of the semiconductor facility. Therefore, a semiconductor facility self-diagnosis device according to an embodiment of the present invention communicates between a first process unit that operates a communication interface unit of one or more load ports as a passive type and one or more other load ports. And a second process unit that operates the interface unit as an active type.

  The controller operates the first communication interface unit corresponding to the first load port of the semiconductor facility as the passive type using the first process unit, and supports the second load port of the semiconductor facility using the second process unit. The storage container is moved in the first load port by operating the second communication interface unit as an active type and transmitting and receiving an active signal and a passive signal between the second communication interface unit and the first communication interface unit. It is possible to autonomously diagnose the presence or absence of communication abnormality related to the semiconductor equipment.

  FIG. 1 is a perspective view of a substrate processing apparatus according to an embodiment of the present invention, and FIG. 2 is a side view of the substrate processing apparatus according to an embodiment of the present invention. 1 to 2, a substrate processing apparatus 100 according to an embodiment of the present invention includes a process unit 110, a plurality of load ports 120, communication interface units 131 to 134, and a controller 140.

  The process unit 110 performs a process of processing a substrate, for example, a process of removing a foreign material from the substrate (wet cleaning). An equipment front end module (EFEM) is provided on the front side of the process unit 110, and the equipment front end module performs a substrate processing process from the storage container 10 loaded on the load ports 121 to 124. A substrate is supplied to a process chamber (not shown) to be performed, and the processed substrate is supplied to the storage container 10. The equipment front end module includes a frame 111 and a door opener 112 provided in each of openings 111 a formed on the front surface of the frame 111.

  The load ports 121 to 124 are installed on the front side of each opening 111a on the front surface of the frame 111, and are provided so as to load the storage container 10. The storage container 10 stores a large number of substrates, and may be provided as a sealed container such as a fully open integrated pod (FOUP). Fixing protrusions for fixing the storage container 10 may be formed on the upper surfaces of the load ports 121 to 124.

  The embodiment shown in FIGS. 1 to 2 has a structure in which four load ports 121 to 124 are arranged side by side in one direction. Various changes can be made to the form of an array structure or the like surrounded by a square, and the number of load ports can also be changed according to the substrate processing process or the like.

  The door opener 112 automatically opens and closes the door of the storage container 10 placed on the upper surfaces of the corresponding load ports 121 to 124. In the frame 111, an index robot (not shown) for transferring a substrate between the storage container 10 placed on the load ports 121 to 124 and a process chamber (for example, a cleaning chamber) may be provided.

  The communication interface units 131 to 134 correspond one-to-one to positions corresponding to the load ports 121 to 124, for example, above the load ports 121 to 124 so as to communicate with the transfer unit 20 that transfers the storage container 10. Can be installed as follows. In the embodiment shown in FIG. 1 to FIG. 2, the communication interface units 131 to 134 are installed on the front end side of the upper surface of the frame 111, but the communication interface units 131 to 134 are the upper front part of the frame 111. It can be installed at other positions such as the side.

  The transfer unit 20 stacks the storage container 10 storing unprocessed substrates on one or more load ports 121 to 124, and stores the storage container 10 storing processed substrates in one or more load ports. Transfer from 121 to 124 to another process unit. The transfer unit 20 may be an automatic material handling system (AMHS) such as OHT (Overhead Hoist Transport), AGV (Automatic Guided Vehicle), or RGV (Rail Guided Vehicle).

  In the embodiment shown in FIGS. 1 to 2, the transfer unit 20 is an OHT automatic transfer equipment, and the communication interface units 131 to 134 are installed above the corresponding load ports 121 to 124. When 20 is other automatic transport equipment such as AGV or RGV, the communication interface units 131 to 134 are located at other positions where the approach of the transfer unit 20 can be sensed, such as the front side of the load ports 121 to 124. Can be installed.

  The transfer unit 20 moves according to the rail 30 installed in the upper part of the load ports 121-124 along the direction in which the load ports 121-124 are arranged. The transfer unit 20 lowers the storage container 10 storing the substrate to be processed onto the upper surface of the load port 120, picks up the storage container 10 storing the processed substrate from the load port 120, and performs the next process unit. Can be transferred to.

  As one embodiment, the transfer unit 20 includes a moving unit 21 that is coupled to the rail 30 and moves according to the rail 30, a hoist 22 that is connected to the lower end of the moving unit 21 by a wire 23, and the container 10 at the lower end of the hoist 22 A gripping hand 24 is provided. The transfer unit 20 holds the storage container 10 with the hand 24 and moves above the load ports 121 to 124 at the designated positions, and then lowers the hoist 22 to place the storage container 10 on the load ports 121 to 124. Can be loaded.

  On the other hand, the transfer unit 20 descends the hoist 22 to grip the storage container 10 placed on the load ports 121 to 124 with the hand 24, moves up the hoist 22, moves according to the rail 30, and loads it. The storage container 10 loaded in the ports 121 to 124 can be transferred to another process facility. The hand 24 can grip the storage container 10 using, for example, a vacuum suction facility or a robot arm device.

  As shown in FIG. 2, the transfer unit 20 includes a control unit 25 and a communication interface 26 for communication with the substrate processing apparatus 100. The control unit 25 is installed inside the transfer unit 20, and the communication interface 26 is installed on the rear surface side of the transfer unit 20 so as to face the communication interface units 131 to 134 of the substrate processing apparatus 100. The communication interface 26 of the transfer unit 20 is controlled by the control unit 25 and communicates with the communication interface units 131 to 134 of the substrate processing apparatus 100.

  The controller 140 transmits and receives signals to and from the control unit 25 of the transfer unit 20 through the communication interface units 131 to 134 to control the transfer operation of the storage container 10 between the transfer unit 20 and the load ports 121 to 124. . The controller 140 is installed inside the frame 111, but the installation position of the controller 140 is not particularly limited. A connector 135b on the controller 140 side is provided on the upper surface of the frame 111, and the connector 135a on the communication interface units 131 to 134 may be coupled to or separated from the connector 135b on the controller 140 side.

  FIG. 3 is a block diagram of a controller constituting the substrate processing apparatus according to one embodiment of the present invention. Referring to FIG. 3, the controller 140 activates a first process unit 141 that operates one or more communication interface units 131 to 134 as a passive type, and one or more communication interface units 131 to 134. A second process unit 142 that operates as an active type and an interface unit 143 having a first channel 1431 and a second channel 1432 are provided. The interface unit 143 is connected to the communication interface units 131 to 134 via connectors 135a and 135b.

  Communication between the transfer unit 20 and the substrate processing apparatus 100 is performed according to a standard (for example, SEMI E84) regarding communication between semiconductor devices. SEMI E84 is transferred between the substrate processing apparatus 100 and the transfer unit 20 as a communication protocol used for handoff of the storage container 10 and the communication interface units 131 to 134 of the substrate processing apparatus 100. This is performed by optical communication with the communication interface 26 of the unit 20.

  Under SEMI E84, the substrate processing apparatus 100 does not actively provide the storage container 10 to the transfer unit 20 or receive the storage container 10 from the transfer unit 20. Or is taken with the storage container 10. In contrast, the transfer unit 20 actively loads the storage container 10 on the load ports 121 to 124 and picks up the storage container from the load ports 121 to 124. When communicating between the substrate processing apparatus 100 and the transfer unit 20, the SEMI E84 operates the substrate processing facility 100 as a passive type and operates the transfer unit 20 as an active type which is the opposite.

  First, referring to FIGS. 4 to 6, during a normal processing process of the substrate processing apparatus 100, communication is performed according to SEMI E84, and the storage container 10 is transferred between the transfer unit 20 and the substrate processing apparatus 100. After the process of transferring the substrate, the process of autonomously performing self-diagnosis of the substrate processing apparatus 100 with the semiconductor facility will be described according to the embodiment of the present invention.

  While performing a normal process in the substrate processing apparatus 100, the controller 140 operates the first process unit 141 for all the communication interface units 131 to 134, and corresponds to the load ports 121 to 124 accordingly. Each communication interface unit 131 to 134 operates as a passive type. A communication interface method between the substrate processing apparatus 100 and the transfer unit 20 at this time will be described with reference to FIG.

  FIG. 4 shows a communication interface method between the first communication interface unit 131 corresponding to the first load port 121 and the communication interface 26 of the transfer unit 20. The same applies to the communication interface method between the second to fourth communication interface units 132 to 134 corresponding to the ports 122 to 122 and the communication interface 26 of the transfer unit 20.

  For example, the communication interface 26 of the transfer unit 20 and the communication interface units 131 to 134 of the substrate processing apparatus 100 transmit / receive optical signals to perform parallel input / output (PI / O) communication. (Photo coupler). The communication interface 26 and the first communication interface unit 131 each include a first channel CH_A and a second channel CH_B, and each of the first channel CH_A and the second channel CH_B has an 8-bit channel. For example, the first to eighth channels constitute the first channel CH_A, and the ninth to sixteenth channels constitute the second channel CH_B.

  In accordance with SEMI E84, during a normal processing process of the substrate processing apparatus 100, the controller 140 of the substrate processing apparatus 100 drives the first process unit 141 to set the first communication interface unit 131 as a passive type. In operation, the controller 25 of the transfer unit 20 causes the communication interface 26 to operate as an active type. In other words, the control unit 25 of the transfer unit 20 transmits the active signal AS to the first channel CH_A of the first communication interface unit 131 through the first channel CH_A of the communication interface 26, and the controller 140 responds to the active signal AS. Then, the passive signal PS is transmitted to the second channel CH_B of the communication interface 26 through the second channel CH_B of the first communication interface unit 131.

  The controller 140 of the substrate processing apparatus 100 receives the active signal AS through the first channel CH_A of the first communication interface unit 131. The control unit 25 of the transfer unit 20 receives the passive signal PS through the second channel CH_B of the communication interface 26. As described above, the control unit 25 of the transfer unit 20 and the controller 140 of the substrate processing apparatus 100 communicate with each other by transmitting and receiving the active signal AS and the passive signal PS, as shown in FIGS. Through the process, the storage container 10 is transferred between the transfer unit 20 and the substrate processing apparatus 100.

  FIG. 5 is a parallel input / output signal diagram according to SEMI E84 in the process of transferring the storage container from the transfer unit to the load port. “A → P” shown in FIG. 5 indicates that the active signal AS is transmitted from the control unit 25 of the transfer unit 20 to the controller 140 of the substrate processing apparatus 100, and “P → A” indicates that the substrate processing apparatus 100 It shows that the passive signal PS is transmitted from the controller 140 to the control unit 25 of the transfer unit 20.

  First, the control unit 25 of the transfer unit 20 transmits a high level CS_0 signal to the controller 140 of the substrate processing apparatus 100 through the second channel of the first channels CH_A of the communication interface 26, and then The high level VALID signal is transmitted through the first channel. The controller 140 of the substrate processing apparatus 100 receives the CS_0 signal through the second channel in the first channel CH_A of the first communication interface unit 131, and the VALID signal through the first channel in the first channel CH_A. Receive.

  In response to the high-level VALID signal, the controller 140 checks whether or not the load port 121 is ready to receive the storage container 10. If the storage container 10 can be received, the controller 140 outputs the VALID signal. In response, a high-level L_REQ signal is transmitted to the controller 25 of the transfer unit 20 through the ninth channel of the second channel CH_B, and the storage container 10 can be loaded into the first load port 121. Notify that there is.

  In response to the high-level L_REQ signal, the transfer unit 20 transmits a high-level TR_REQ signal to the substrate processing apparatus 100 to notify that the storage container 10 can be transported. In response to the high-level TR_REQ signal, the controller 140 of the substrate processing apparatus 100 transmits a high-level READY signal to the control unit 25 of the transfer unit 20 to notify that the first load port 121 is accessible. To do. In response to the high-level READY signal, the control unit 25 of the transfer unit 20 transmits a high-level BUSY signal to the controller 140 of the substrate processing apparatus 100 to notify that the transfer of the storage container 10 is started. The conveyance of the storage container 10 is started.

  If the storage container 10 is detected at the first load port 121, the L_REQ signal is shifted to a low level, and the controller 25 of the transfer unit 20 changes the BUSY signal to the low level according to the low level L_REQ signal. In accordance with the low-level BUSY signal, the TR_REQ signal is transitioned to the low level, and the high-level COMPT signal is transmitted to the controller 140 of the substrate processing apparatus 100 to notify that the transfer of the storage container 10 has been completed. .

  In response to the high-level COMPT signal, the controller 140 changes the READY signal to the low level. The control unit 25 of the transfer unit 20 changes the CS_0 signal, the VALID signal, and the COMPT signal to the low level according to the low-level READY signal, and notifies that the series of transfer operations has been completed. Performs initialization for transporting.

  FIG. 6 is a parallel input / output signal diagram (Parallel Input / Output signal diagram) according to SEMI E84 in the process of transferring the storage container from the load port to the transfer unit. Referring to FIG. 6, first, the control unit 25 of the transfer unit 20 transmits a high-level CS_0 signal to the substrate processing apparatus 100 through the second channel in the first channel CH_A of the communication interface 26, and then The high level VALID signal is transmitted through the first channel. The controller 140 of the substrate processing apparatus 100 receives the CS_0 signal through the second channel in the first channel CH_A of the first communication interface unit 131, and the VALID signal through the first channel in the first channel CH_A. Receive.

  In response to the high-level VALID signal, the controller 140 of the substrate processing apparatus 100 confirms whether or not the storage container 10 can be transferred from the first load port 121, and the transfer of the storage container 10 is performed. If possible, in response to the high-level VALID signal, a high-level U_REQ signal is transmitted to the control unit 25 of the transfer unit 20 through the tenth channel in the second channel CH_B, and the first load port 121 notifies that the storage container 10 can be transported.

  In response to the high-level U_REQ signal, the control unit 25 of the transfer unit 20 transmits a high-level TR_REQ signal to the controller 140 of the substrate processing apparatus 100 to confirm that the storage container 10 can be received. Notice. In response to the TR_REQ signal, the controller 140 of the substrate processing apparatus 100 transmits a high-level READY signal to the control unit 25 of the transfer unit 20 to notify that the first load port 121 is accessible.

  In response to the READY signal, the control unit 25 of the transfer unit 20 transmits a high-level BUSY signal to the controller 140 of the substrate processing apparatus 100 to start transporting the storage container 10 from the first load port 121. And the conveyance of the storage container 10 is started. If the transfer unit 20 senses that the storage container 10 is transported, the controller 140 of the substrate processing apparatus 100 changes the U_REQ signal to a low level and transmits it to the control unit 25 of the transfer unit 20.

  The control unit 25 of the transfer unit 20 changes the BUSY signal to the low level according to the low level U_REQ signal, changes the TR_REQ signal to the low level according to the low level BUSY signal, and converts the high level COMPT signal to the substrate processing apparatus. 100 to the controller 140 to notify the completion of the transport of the storage container 10.

  In response to the high-level COMPT signal, the controller 140 of the substrate processing apparatus 100 transitions the READY signal to the low level and transmits it to the control unit 25 of the transfer unit 20. The control unit 25 of the transfer unit 20 changes the CS_0 signal, the VALID signal, and the COMPT signal to a low level according to the low-level READY signal to notify that a series of transfer operations has been completed. Initialize for transport.

  On the other hand, a setup operation must be performed through a communication test of the substrate processing apparatus 100 before the processing process by the substrate processing apparatus 100 is normally operated. According to SEMI E84, the substrate processing apparatus 100 is Since it is designed to operate as a passive type at the time of communication with the transfer unit 20, the conventional semiconductor equipment can communicate with the semiconductor equipment without the support of an automatic transfer equipment that operates as an active type or another test equipment. It is difficult to carry out the test quickly. Embodiments of the present invention described below present a semiconductor facility self-diagnosis apparatus and method capable of autonomously diagnosing a semiconductor facility without the assistance of automatic transfer equipment or test equipment.

  FIG. 7 is a perspective view of a semiconductor facility self-diagnosis apparatus according to an embodiment of the present invention, and FIG. 8 is a plan view of the semiconductor facility self-diagnosis apparatus according to an embodiment of the present invention. Among the configurations of the embodiment illustrated in FIGS. 7 to 8, the description of the configurations similar to the configurations illustrated in FIGS. 1 to 2 is omitted. In order to explain the process of self-diagnosis of the substrate processing apparatus without the transfer unit, the transfer unit is not shown in FIGS.

  Referring to FIGS. 3 and 7 to 8, the semiconductor facility self-diagnosis apparatus according to an embodiment of the present invention includes communication interface units 131 to 134, a controller 140, and a communication cable 150. In the following embodiment, the controller 140 operates the second communication interface unit 132 corresponding to the second load port 122 as an active type, and performs a communication test regarding the conveyance of the storage container 10 in the first load port 121. A case where the semiconductor equipment is self-diagnosed will be described as an example.

  The controller 140 activates the first process unit 141 with respect to the first communication interface unit 131 corresponding to the first load port 121 to operate the first communication interface unit 131 as a passive type, and the second The second process unit 142 is operated with respect to the second communication interface unit 132 corresponding to the load port 122 to operate the second communication interface unit 132 as an active type.

  In other words, the controller 140 transmits an active signal (active signal) to the first communication interface unit 131 through the second communication interface unit 132, receives a passive signal from the first communication interface unit 131, and receives the first signal. A passive signal is transmitted to the second communication interface unit 132 through the communication interface unit 131, and an active signal is received from the second communication interface unit 132.

  As described above with reference to FIGS. 4 to 6, the active signal is a signal (for example, VALID, CS_ 0, TR_REQ, BUSY, The passive signal means a signal (for example, L_REQ, U_REQ, READY, etc.) transmitted from the communication interface units 131 to 134 to the transfer unit during normal operation of the semiconductor facility.

  The communication cable 150 is provided between the first communication interface unit 131 and the second communication interface unit 132, and transmits an active signal and a passive signal between the first communication interface unit 131 and the second communication interface unit 132. . That is, the communication cable 150 receives a passive signal from the first communication interface unit 131 and transmits the passive signal to the second communication interface unit 132, and receives an active signal from the second communication interface unit 132 to the first communication interface unit 131. Send.

  FIG. 9 is a configuration diagram of a communication cable constituting the self-diagnosis apparatus for semiconductor equipment according to an embodiment of the present invention. 7 to 9, the communication cable 150 is disposed to face the first input / output interface unit 151 and the second communication interface unit 132 that are disposed to face the first communication interface unit 131. A second input / output interface unit 152 and an interconnection unit 153 that connects the first input / output interface unit 151 and the second input / output interface unit 152.

  In one embodiment, the first input / output interface unit 151 and the second input / output interface unit 152 are connected to the first communication interface unit 131 and the second communication interface unit 132 in parallel input / output (PI / O), respectively. Perform communication.

  The first input / output interface unit 151 and the second input / output interface unit 152 have channels corresponding to the communication interface units 131 to 134, for example, 8-bit channels CH_A and CH_B. Similar to the communication interface units 131 to 134, the first channel CH_A may include the first to eighth channels, and the second channel CH_B may include the ninth to sixteenth channels.

  The interconnection unit 153 includes an input channel CH_A of the first input / output interface unit 151 and an output channel CH_B of the second input / output interface unit 152, and an output channel CH_B of the first input / output interface unit 151 and the second input / output interface unit 152. The first input / output interface unit 151 and the second input / output interface unit 152 are cross-connected so that the input channels CH_A have different channels.

  In order to perform the communication test of the semiconductor facility, the controller 140 operates, for example, the first communication interface unit 131 as a passive type and the second communication interface unit 132 as an active type. Communication is performed by transmitting and receiving active signals and passive signals between the first communication interface unit 131 and the second communication interface unit 132 according to the parallel input / output signal diagram shown in FIG.

  For example, the first communication interface unit 131 operates as a passive type, receives an active signal (eg, VALID, CS_0, TR_REQ, BUSY, COMPT signal, etc.) through the first channel CH_A, and receives a passive signal (eg, L_REQ). , U_REQ, READY signal, etc.) are transmitted through the second channel CH_B to perform a communication test. Under SEMI E84, the communication interface units 131 to 134 of the substrate processing apparatus 100 can output signals only through the second channel CH_B. Therefore, unlike the first communication interface unit 131, the controller 140 differs from the first communication interface unit 131. The unit 132 transmits the active signal AS through the second channel CH_B and receives the passive signal PS through the first channel CH_A.

  The communication cable 150 transmits the active signal AS received through the second channel CH_B of the second communication interface unit 132 to the first channel CH_A of the first communication interface unit 131 across the first channel CH_A, and transmits the first communication interface 131. The passive signal PS received through the second channel CH_B of the unit 131 crosses the first channel CH_A and is transmitted to the first channel CH_A of the second communication interface unit 132.

  In this way, when the communication cable 150 that connects the communication interfaces 131 and 132 by cross-connecting the input channel and the output channel with different channels (first channel and second channel) is used, it follows SEMI E84. The semiconductor equipment can be self-diagnosed without modifying or replacing the hardware configuration of the communication interface units 131 and 132 designed as described above.

  In the embodiment shown in FIGS. 7 to 8, the first communication interface unit 131 is operated as a passive type and the second communication interface unit 132 is operated as an active type to transport the storage container 10 in the first load port 121. A communication test for the process is performed, but the third communication interface unit 133 or the fourth communication interface unit 134 is operated as a passive type, and the third communication interface unit 133 or the fourth communication interface unit 134 and the second communication interface unit are operated. It is of course possible to perform a communication test for the third load port 123 or the fourth load port 124 by connecting the terminal 132 to the terminal 132 with the communication cable 150.

  In one embodiment, after performing a communication test on the first load port 121 using the second load port 122, the first communication interface unit 131 is changed from the passive type to the active type while the communication cable 150 is maintained. If the second communication interface unit 132 is changed from the active type to the passive type, the communication test for the second load port 122 subsequent to the first load port 121 is continuously performed without moving the communication cable 150. can do.

  According to the embodiment of the present invention, it is possible to confirm whether or not there is an abnormality in any of the load ports in the semiconductor facility by performing self-diagnosis on a large number of load ports 121 to 124. The semiconductor equipment can be promptly diagnosed to shorten the equipment setup time. For example, when an abnormality occurs as a result of performing a communication test with the second communication interface unit 132 set to an active type and the first communication interface unit 131 set to a passive type, the result of another communication test, for example, If there is no abnormality in the result of the communication test between the second communication interface unit 132 and the third communication interface unit 133, there is a problem with the first communication interface unit 131 of the first communication interface unit 131 and the second communication interface unit 132. I understand that there is.

  FIG. 10 is a configuration diagram of a self-diagnosis apparatus for semiconductor equipment according to another embodiment of the present invention. As shown in FIG. 10, the first connector 135a connected to the communication interface units 131 to 132 is separated from the second connector 135b connected to the controller 140, and the second connectors 135b of the communication interface units 131 to 132 are separated. The communication test may be performed by connecting the communication cables 150 to each other. According to the embodiment shown in FIG. 10, when a communication error occurs, the occurrence of an error such as whether the cause is in the communication interface units 131 and 132, or a problem with internal wiring or a program error. The cause of this can be accurately grasped and promptly treated.

  In the above embodiment, the self-diagnosis device for semiconductor equipment for testing the communication between the transfer unit 20 for transferring the storage container 10 for storing a large number of substrates and the substrate processing apparatus 100 has been described. The semiconductor device self-diagnosis device according to the embodiment is used for diagnosing a semiconductor facility by testing communication for transferring a substrate between a transfer unit for transferring one substrate and a load port for mounting the substrate. It can be done.

  Hereinafter, with reference to FIGS. 4 and 7 to 9, the operation and operation of the self-diagnosis apparatus for semiconductor equipment according to an embodiment of the present invention and the self-diagnosis method for semiconductor equipment according to an embodiment of the present invention will be described. To do. First, in a host computer (not shown), when an operator inputs a work command for performing a communication test of a semiconductor facility using a user interface, the controller 140 performs a semiconductor operation according to the work command. Carry out equipment communication tests.

  For example, when the communication test for the first load port 121 is to be performed using the second communication interface unit 132 corresponding to the second load port 122, the controller 140 performs the first communication according to a work command from the host computer. The first process unit 141 is operated for the interface unit 131, the first communication interface unit 131 is operated as a passive type, the second process unit 142 is operated for the second communication interface unit 132, The second communication interface unit 132 is changed from the passive type to the active type.

  The operator arranges the first input / output interface unit 151 of the communication cable 150 so as to face the front of the first communication interface unit 131, and the second input / output interface unit 152 faces the front of the second communication interface unit 132. Arrange to do. As an alternative, the communication cable 150 can be arranged in front of the communication interface units 131 and 132 using another jig.

  The second process unit 141 of the controller 140 transmits an active signal AS to the second channel CH_B of the second communication interface unit 132 through the second channel CH_B of the interface unit 143 connected to the second communication interface unit 132. The active signal AS is received from the second channel CH_B of the second communication interface unit 132 via the communication cable 150 to the first channel CH_A of the first communication interface unit 131.

  At this time, the communication cable 150 receives the active signal AS from the second channel CH_B of the second communication interface unit 132 through the second channel CH_B of the second input / output interface unit 152, and receives the active signal AS of the first input / output interface unit 151. The active signal AS is transmitted to the first channel CH_A of the first communication interface unit 131 by crossing the first channel CH_A and outputting. The active signal AS is transmitted from the first channel CH_A of the first communication interface unit 131 to the first channel CH_A of the interface unit 143 connected to the first communication interface unit 131 and input to the first process unit 141 of the controller 140. The

  The first process unit 141 of the controller 140 transmits the passive signal PS corresponding to the active signal AS to the second channel of the first communication interface unit 131 through the second channel CH_B of the interface unit 143 connected to the first communication interface unit 131. Transmit to channel CH_B. The passive signal PS is received from the second channel CH_B of the first communication interface unit 131 via the communication cable 150 to the first channel CH_A of the second communication interface unit 132.

  At this time, the communication cable 150 receives the passive signal PS from the second channel CH_B of the first communication interface unit 131 through the second channel CH_B of the first input / output interface unit 151, and receives it from the second input / output interface unit 152. The second signal is transmitted across the first channel CH_A, and the passive signal PS is transmitted to the first channel CH_A of the second communication interface unit 132. The passive signal PS is transmitted from the first channel CH_A of the second communication interface unit 132 to the first channel CH_A of the interface unit 143 connected to the second communication interface unit 132 and input to the second process unit 142 of the controller 140. The

  Again, the second processing unit 142 transmits the active signal AS in response to the passive signal PS, and such a process is performed according to the parallel input / output signal diagrams as shown in FIGS. Can. As described above, by performing the communication test by transmitting / receiving the active signal AS and the passive signal PS between the first process unit 141 and the second process unit 142, the semiconductor facility can be self-diagnosed autonomously. .

  When a communication abnormality occurs in the semiconductor facility, the error information can be displayed through the host computer. The operator can confirm the cause of the abnormality through the screen of the host computer, take corrective action, and quickly resolve the error. According to the embodiment of the present invention, it is possible to self-diagnose a semiconductor facility and eliminate a communication error in the semiconductor facility in advance even when the automatic transportation equipment is not installed, at the time of installation transfer or failure of the automatic transportation equipment. Thus, installation or inspection of the automatic transfer equipment is completed, the semiconductor process can be restarted quickly, and semiconductor productivity can be improved.

  After performing a setup operation by self-diagnosis of the semiconductor facility, the controller 140 performs all the communication interface units 131 to 134 for a normal substrate processing process when performing the substrate processing process using the semiconductor facility. Is operated as a passive type. That is, during normal operation of the semiconductor facility, communication is performed between the automatic transport equipment that operates as the active type and the semiconductor facility that operates as the passive type by the first process unit 141 of the controller 140, and the storage container is transported. The process can be performed smoothly. The semiconductor equipment self-diagnosis apparatus according to the embodiment of the present invention can be applied to a substrate processing apparatus, a stocker equipment, and the like.

  The above embodiments are presented to assist the understanding of the present invention, and do not limit the scope of the present invention. Embodiments variously modified from these embodiments also belong to the scope of the present invention. Must understand. The technical protection scope of the present invention is defined by the technical idea of the scope of claims, and is not limited to the wording description itself of the scope of claims. It should be understood that this extends to a range of inventions.

10 storage container,
20 transfer unit,
21 moving part,
22 Hoist,
23 wires,
24 hands,
25 control unit,
26 communication interface,
30 rails,
100 substrate processing apparatus,
110 process units,
111 frames,
111a opening,
112 door opener,
120-124 load port,
131-134 communication interface unit,
135a, 135b connector,
140 controller,
141 the first process part,
142 second process part,
143 interface part,
1431 Channel 1
1432 Second channel,
150 communication cable,
151 First input / output interface unit,
152 second input / output interface unit,
153 interconnect.

Claims (18)

A process unit in which a process of processing a substrate is performed;
A plurality of load ports provided to load a storage container for storing a substrate or a plurality of substrates;
A plurality of communication interface units installed corresponding to each load port so as to communicate with a transfer unit for transferring the substrate or the storage container;
A controller that transmits and receives signals to and from the transfer unit through the communication interface unit, and controls a transfer operation of the substrate or the storage container.
The controller is
A first process unit that operates at least one first communication interface unit of the plurality of communication interface units as a passive type, and at least one second communication interface unit of the plurality of communication interface units is active. A substrate processing apparatus including a second process unit operated as a type.   The controller transmits and receives an active signal and a passive signal between the first process unit and the second process unit via the first communication interface unit and the second communication interface unit to perform a communication test. The substrate processing apparatus according to claim 1, which is performed. The first process unit operates the first communication interface unit corresponding to the first load port among the plurality of load ports as the passive type,
The second process unit operates a second communication interface unit corresponding to a second load port among the plurality of load ports as the active type to self-diagnose communication at the first load port. 2. The substrate processing apparatus according to 2. A communication cable for transmitting a signal between the first communication interface unit and the second communication interface unit;
The communication cable is
A first input / output interface unit arranged to face the first communication interface unit;
A second input / output interface unit disposed to face the second communication interface unit;
The substrate processing apparatus according to claim 3, further comprising: an interconnection unit that connects the first input / output interface unit and the second input / output interface unit. The interconnect is
The input channel of the first input / output interface unit and the output channel of the second input / output interface unit have different channels, and the output channel of the first input / output interface unit and the second input / output interface unit The substrate processing apparatus according to claim 4, wherein the first input / output interface unit and the second input / output interface unit are cross-connected so that the input channels have different channels. The first process unit receives an active signal through a first channel of the first communication interface unit, transmits a passive signal through a second channel of the first communication interface unit, and makes the first communication interface unit passive. Act as a type,
The second process unit receives the passive signal through a first channel of the second communication interface unit, transmits the active signal through a second channel of the second communication interface unit, and transmits the active signal to the second communication interface unit. The substrate processing apparatus according to claim 5, wherein the substrate processing apparatus is operated as an active type. The communication cable is
The passive signal is received from the second channel of the first communication interface unit through the second channel of the first input / output interface unit, and the second communication interface unit of the second communication interface unit is received through the first channel of the second input / output interface unit. Send the passive signal to one channel,
The active signal is received from the second channel of the second communication interface unit through the second channel of the second input / output interface unit, and the first signal of the first communication interface unit is received through the first channel of the first input / output interface unit. The substrate processing apparatus according to claim 6, wherein the active signal is transmitted to one channel.   The substrate processing apparatus according to claim 1, wherein the communication interface unit includes a photocoupler that transmits and receives an optical signal to perform parallel input / output communication. The active signal is a signal transmitted from the transfer unit operating as an active type to the controller through the communication interface unit during normal operation of the substrate processing apparatus,
The said passive signal is a signal transmitted to the said transfer unit through the said communication interface part from the said controller which operate | moves as a passive type at the time of normal operation | movement of the said substrate processing apparatus. Substrate processing equipment. A signal is transmitted to a transfer unit for transferring a substrate or a storage container for storing a plurality of substrates through a plurality of communication interface units, and a signal is received from the transfer unit to receive the signal between the transfer unit and the semiconductor facility. Or a controller for controlling the transfer operation of the storage container,
The controller is
A first process unit that operates at least one first communication interface unit of the plurality of communication interface units as a passive type, and at least one second communication interface unit of the plurality of communication interface units is active. A self-diagnosis device for semiconductor equipment, comprising a second process unit operated as a type.   The controller transmits and receives an active signal and a passive signal between the first process unit and the second process unit via the first communication interface unit and the second communication interface unit to perform a communication test. 11. The semiconductor equipment self-diagnosis device according to claim 10, which is performed. The first process unit operates the first communication interface unit corresponding to the first load port in the load port of the semiconductor facility provided to load the substrate or the storage container as the passive type,
The said 2nd process part operates the 2nd communication interface part corresponding to the 2nd load port of the said semiconductor equipment as said active type, and self-diagnose communication in the said 1st load port. Self-diagnosis device for semiconductor equipment. A communication cable for transmitting a signal between the first communication interface unit and the second communication interface unit;
The communication cable is
A first input / output interface unit arranged to face the first communication interface unit;
A second input / output interface unit disposed to face the second communication interface unit;
An interconnection part for connecting the first input / output interface part and the second input / output interface part,
The interconnect is
The input channel of the first input / output interface unit and the output channel of the second input / output interface unit have different channels, and the output channel of the first input / output interface unit and the second input / output interface unit The semiconductor device self-diagnosis device according to claim 12, wherein the first input / output interface unit and the second input / output interface unit are cross-connected so that the input channels have different channels. A semiconductor facility comprising a plurality of load ports provided to load a substrate or a storage container for storing a plurality of substrates, and a plurality of communication interface units installed to correspond to the load ports. ,
At least one communication interface unit among the plurality of communication interface units operates as an active type, and transmits an active signal to another communication interface unit, thereby self-diagnosis of communication of the other communication interface unit. Semiconductor equipment.   The semiconductor equipment according to claim 14, further comprising a communication cable that transmits a signal between the at least one communication interface unit and the other communication interface unit.   A first communication interface unit corresponding to a first load port in a load port of a semiconductor facility provided to load a substrate or a storage container that accommodates a plurality of substrates is operated as a passive type, and the first of the semiconductor facility A second communication interface unit corresponding to two load ports is operated as an active type, and an active signal and a passive signal are transmitted and received between the first communication interface unit and the second communication interface unit to perform a communication test. A self-diagnosis method for semiconductor equipment, comprising the step of self-diagnosis of communication at the first load port. The self-diagnosis of the communication includes
Transmitting an active signal transmitted from the second communication interface unit to the first communication interface unit using a communication cable;
17. The semiconductor facility self-diagnosis method according to claim 16, further comprising: transmitting a passive signal transmitted from the first communication interface unit to the second communication interface unit using the communication cable. The active signal is a signal transmitted from the transfer unit operating as an active type to the first communication interface unit or the second communication interface unit during normal operation of the semiconductor facility,
18. The semiconductor facility self-diagnosis method according to claim 17, wherein the passive signal is a signal transmitted from the first communication interface unit or the second communication interface unit to the transfer unit when the semiconductor facility is operating normally.