JP2015012214A - Transfer jig and manufacturing method of electronic component using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer jig capable of surely aligning a chip and being easily handled without incurring positional dislocation, and an efficient manufacturing method of an electronic component using the same.SOLUTION: A through hole 11 formed on an insertion pallet 10 is formed larger than a WT surface 1a of a chip 1 and smaller than an LW surface and an LT surface in such a shape that the chip can be passed therethrough only in an attitude with the WT surface down. A hold pallet 20 is formed in such a manner that (a) a depth D of a chip accommodation recess 21 is smaller than a length L of the chip, (b) the depth D of the chip accommodation recess is greater than a value resulting from subtracting a thickness Tp of the insertion pallet from the length L of the chip and greater than the thickness Tp of the insertion pallet, (c) a dimension resulting from adding the depth D of the chip accommodation recess and the thickness Tp of the insertion pallet is greater than the length L of the chip, and (d) a plane area of the chip accommodation recess is greater than a plane area of the through hole of the insertion pallet.

Description

  The present invention relates to a transfer jig used in a manufacturing process of an electronic component such as a chip type multilayer ceramic capacitor and a chip type inductor, and an electronic component manufacturing method using the same.

As a method for aligning the rectangular parallelepiped chip components, there is a method as disclosed in Patent Document 1.
In the invention according to Patent Document 1, a rectangular parallelepiped chip component having a predetermined thickness T, a width W having a value larger than the thickness T, and a length L having a value larger than the thickness T is used as a component holding plate. This is an invention of a method of aligning and holding in a predetermined posture and forming an external electrode by attaching an electrode paste to an exposed portion of the chip component. This Patent Document 1 discloses a rectangular parallelepiped chip component on a component holding plate in a predetermined posture. A method for maintaining alignment is shown.

  In this method, first, as shown in FIG. 12 (a), the second component alignment plate 102 is superimposed on the component holding plate 103 so that the through alignment hole 102a matches the component holding hole 103a. In addition, the first component alignment plate 101 is overlaid on the second component alignment plate 102 so that the lower end opening of the through alignment hole 101a is blocked by the portion orthogonal to the longitudinal center of the through alignment hole 102a. . In this state, the through-alignment hole 101a of the first component alignment plate 1 and the through-alignment hole 102a of the second component alignment plate 102 are parallel to each other when viewed in plan (viewed from above), and the longitudinal direction of each other. The direction center matches.

  Then, the chip component P is supplied in a loose state on the first component alignment plate 101, and vibration or oscillation is applied. Thus, the chip component P on the first component alignment plate 101 is dropped into the component alignment hole 101a with the largest surface Pa facing downward.

  Next, as shown in FIGS. 12B and 12C, the first component alignment plate 101 is slid in the short direction of the through alignment hole 101a (the width direction of the chip component P) to align the second component. The chip component P is moved onto the through-alignment hole 102a of the plate 102. When the center of gravity of the chip part P reaches the inner side of the edge of the through-alignment hole 102a (the edge of the guide surface) by this sliding operation (see FIG. 12B), the chip part P is rotated in the clockwise direction in the figure. The tilt starts gradually, and thereafter, the tilt increases according to the slide amount (see FIG. 12C), and the chip component P is eventually dropped into the component alignment hole 102a with the second largest surface Pb facing downward.

  Then, as shown in FIG. 12D, when the through alignment hole 101a of the first component alignment plate 101 is aligned with the through alignment hole 102a of the second component alignment plate 102 by the above-described sliding operation, the chip component is P is dropped into the component holding hole 103a of the component holding plate 103 through the component alignment hole 102a with the second largest surface Pb facing downward (into the component alignment hole 101a of the first component alignment plate 101). The chip component P is changed into 90 degrees and dropped into the component holding hole 103a).

  Next, as shown in FIG. 12 (e), the first component alignment plate 101 and the second component alignment plate 102 are simultaneously lifted and removed from the component holding plate 103. Thus, as shown in FIG. 12 (f), the chip component P is in a state where the second largest surface Pb faces downward, that is, one end in the width direction is inserted into the component holding hole 103a, and the other part is exposed to the outside. In this state, it is held on the component holding plate 103.

  In this state, the exposed end surface of the chip component P held on the component holding plate 103 is pressed against the exposed end surface (second largest surface Pb) of the electrode component by applying a paste coating plate with the electrode paste attached to one surface thereof. The electrode paste is applied to the surrounding portion.

However, the conventional method has the following problems.
When transferring the chip component, it is necessary to transfer the chip component while aligning the second component alignment plate and the component holding plate. However, when the chip component is transferred, the transfer jig is likely to vibrate due to vibration, and it may be fixed by a mechanical method such as screwing to suppress the position shift. When loosening and removing the second component alignment plate, there is a problem that unexpected vibration may be applied to the entire jig and the chip component may fall off the first component alignment plate, resulting in low reliability.

  In addition, a slide mechanism for reversing the chip, two types of component alignment plates, a component holding plate, and the like are required, which causes a problem that not only the structure is complicated and the cost is increased, but also the productivity is low.

Japanese Patent Laid-Open No. 9-232113

  The present invention solves the above-mentioned problem, and securely holds the state in which the holding pallet for holding the chip and the insertion pallet for feeding the chip into the chip receiving recess of the holding pallet are joined together. A transfer jig that can be easily released and can be easily handled without causing the chip to be securely aligned without causing a positional shift or dropping from the chip receiving recess, and the like. It is an object of the present invention to provide an efficient method for manufacturing electronic components.

In order to solve the above problems, the transfer jig of the present invention is
When the thickness is T, the width is W, and the length is L, the relationship of T <W <L is satisfied, and the WT surface, which is a surface defined by the thickness T and the width W, and the thickness T and the length L A transfer jig used for aligning a rectangular parallelepiped chip having an LT surface which is a defined surface and an LW surface which is a surface defined by a width W and a length L,
A plate-like insertion pallet, and a plate-like holding pallet used by being arranged on the lower surface side of the insertion pallet in the chip transfer step,
The insertion pallet includes a through hole through which the chip passes.
The through hole has a shape in which the planar area is larger than the WT surface of the chip, smaller than the LW surface and the LT surface, and allows the chip to pass only in an attitude with the WT surface down. Have
The holding pallet includes a chip receiving recess for receiving and holding the chip, and an insertion pallet holding suction hole for holding the insertion pallet on the upper surface by vacuum suction,
(A) The depth D of the chip receiving recess is smaller than the length L of the chip,
(C) The chip accommodating recess is accommodated in the chip accommodating recess only in a posture in which the planar area is smaller than the planar area of the through-hole of the insertion pallet and the chip faces the WT surface. It is characterized by having such a shape.

  The suction hole for holding the insertion pallet preferably has a cross-shaped planar shape.

  When the suction hole for holding the insertion pallet has a cross-shaped planar shape, the insertion pallet can be securely held on the holding pallet without requiring a complicated configuration, and the present invention is further improved. It can be effective.

  Moreover, it is preferable that the bottom part of the said chip | tip recessed part is formed with the suction hole for transfer promotion which accelerates | stimulates that the said chip | tip is transferred into the said chip | tip receiving recessed part by vacuum suction.

  By providing the transfer promotion suction hole at the bottom of the chip receiving recess, the chip can be reliably transferred by the chip receiving recess, and the present invention can be further effectively realized.

  Further, it is preferable that the chip has a thickness T of 0.15 mm or less.

According to the present invention, L is larger than both W and T, and the area of the WT surface, which is a surface defined by the thickness T and the width W, is a surface defined by the thickness T and the length L. Chips having a rectangular parallelepiped shape smaller than any of the areas of the LW surface, which is a surface defined by the area of the LT surface and the width W and the length L, are efficiently aligned in a posture with the smallest WT surface down. In the case where the thickness T or the width W is large, the alignment can be performed efficiently. However, a chip having a thickness T considerably smaller than W and having a thickness T of 0.15 mm or less is difficult to stand up, and it may not be easy to transfer the chip with the smallest WT surface down.
However, according to the present invention, such a chip having a small thickness T can be efficiently transferred and aligned in the chip receiving recess of the holding pallet with the WT surface having the smallest area facing down, which is particularly meaningful. is there.

In addition, the method of manufacturing the electronic component of the present invention includes
Through the step of transferring the chip using the transfer jig of the present invention, a method of manufacturing an electronic component having an external electrode on the surface of the chip,
The insertion pallet holding of the holding pallet is performed by joining the lower surface of the insertion pallet and the upper surface of the holding pallet so that the through hole of the insertion pallet faces the opening of the chip receiving recess of the holding pallet. Sucking from the suction hole for holding, and holding the lower surface of the insertion pallet and the upper surface of the holding pallet joined,
Supplying the chip onto the insertion pallet and swinging the chip into the chip receiving recess of the holding pallet in a posture with the WT surface down;
A step of separating the holding pallet and the insertion pallet after the chip is transferred into the chip receiving recess of the holding pallet and holding a part of the chip protruding from the chip receiving recess;
The chip is transferred to the adhesive holding jig by pressing and holding an adhesive holding jig provided with an adhesive material having adhesiveness to one of the WT surfaces of the chip protruding from the chip receiving recess. And a process of
Immersing the other WT surface of the chip held by the adhesive holding jig in a conductive paste layer, and applying a conductive paste for forming external electrodes to the WT surface of the chip. It is characterized by that.

  As described above, in the transfer jig of the present invention, the planar area of the through hole formed in the insertion pallet is larger than the WT surface of the chip and smaller than the LW surface and the LT surface, and the chip faces the WT surface downward. The holding pallet includes a chip receiving recess and an insertion pallet holding suction hole for holding the insertion pallet on the upper surface by vacuum suction, and (a) the chip receiving recess. The depth D of the chip is smaller than the length L of the chip. (B) The depth D of the chip receiving recess is larger than the value obtained by subtracting the thickness Tp of the insertion pallet from the length L of the chip and the thickness of the insertion pallet. Larger than Tp, (c) the chip receiving recess is received in the chip receiving recess only in a posture in which the plane area is smaller than the plane area of the through hole of the insertion pallet and the chip faces down the WT surface. Therefore, the tip is securely placed in the tip receiving recess of the holding pallet through the through-hole of the insertion pallet with the WT surface having the smallest area facing down. It becomes possible to transfer to.

  As shown in (a) above, by making the depth D of the chip receiving recess smaller than the length L of the chip, the upper end side of the chip protrudes from the chip receiving recess with the insertion pallet removed. Therefore, it becomes possible to easily and reliably carry out the process of transferring the chip to the adhesive holding jig in the subsequent process.

  Further, as shown in (b) above, the depth D of the chip receiving recess is larger than the value obtained by subtracting the thickness Tp of the insertion pallet from the length L of the chip and larger than the thickness Tp of the insertion pallet. Therefore, it is possible to securely hold the entire transferred chip in the space formed by the through hole of the insertion pallet and the chip receiving recess of the holding pallet, and when the insertion pallet is separated after the transfer process is completed. Further, it becomes possible to make a state in which half or more of the chips are housed in the chip housing recess, and the chip can be reliably held in the chip housing recess even after the insertion pallet is separated.

  Further, as in (c) above, the chip receiving recess is received in the chip receiving recess only in a posture in which the plane area is smaller than the plane area of the through-hole of the insertion pallet and the chip faces down the WT surface. First, the WT surface, which is the surface having the smallest chip area, enters the through-hole of the insertion pallet that is larger than the plane area of the chip-receiving recess, and is subsequently flatter than the through-hole. It will be transferred to the chip receiving recess having a small area.

  Therefore, it is possible to efficiently transfer the chip into the chip receiving recess as compared with the case where the chip is transferred into the chip receiving recess having a small planar area. And after completion | finish of transfer, a chip | tip is accommodated in the chip | tip accommodation recessed part whose plane area is smaller than the through-hole of an insertion pallet, and it hold | maintains reliably in a predetermined position, without producing a big position shift.

Further, the holding pallet has an insertion pallet holding suction hole for sucking and holding the insertion pallet. Since the insertion pallet is securely held by the holding pallet in the step of transferring the chip, the insertion pallet and the holding pallet are Thus, it is possible to securely hold the through hole and the chip receiving recess in a position where they face each other and to ensure that the chip is transferred into the chip receiving recess.
Furthermore, the mechanism for sucking and holding the insertion pallet is a separate system from the mechanism for sucking and holding the chip. Therefore, when the insertion pallet and the holding pallet are separated after the transfer of the chip is completed, the chip is sucked and held by stopping only the suction from the insertion pallet holding suction hole for sucking and holding the insertion pallet. However, since the insertion pallet and the holding pallet can be separated, it is possible to reliably prevent the chips from spilling out of the chip receiving recess due to an impact when separating the insertion pallet and the holding pallet.

  Further, in the electronic component manufacturing method of the present invention, since the transfer is performed using the above-described transfer jig of the present invention, the chips can be reliably transferred by being transferred to the chip receiving recesses of the holding plate. At the same time, by removing the insertion pallet, the chip can be held by protruding from the chip receiving recess of the holding pallet.

  As a result, the chip can be easily and reliably transferred to the adhesive holding jig, and the lower WT surface of the chip held by the adhesive holding jig is immersed in the conductive paste layer. Thus, it is possible to reliably apply the conductive paste for forming the external electrode to the WT surface, and it is possible to efficiently manufacture the electronic component including the external electrode.

It is a disassembled perspective view which shows the structure of the alignment apparatus provided with the transfer jig concerning one Embodiment of this invention. It is a perspective view which shows the structure of the chip | tip used as the object which transfers and aligns using the aligning apparatus provided with the transfer jig concerning one Embodiment of this invention. It is a top view which shows the principal part structure of the transfer jig concerning one Embodiment of this invention. It is front sectional drawing which shows the principal part structure of the transfer jig concerning one Embodiment of this invention. It is a figure which shows 1 process (state before transferring a chip | tip) of the manufacturing method of the electronic component concerning one Example of this invention. It is a figure which shows the other process (state which transferred the chip | tip) of the manufacturing method of the electronic component concerning one Example of this invention. It is a figure which shows the further another process (The state which isolate | separated the insertion pallet and the holding pallet) of the manufacturing method of the electronic component concerning one Example of this invention. It is a figure which shows the further another process (The process of sticking and holding a chip | tip on the adhesion holding jig) of the manufacturing method of the electronic component concerning one Example of this invention. It is a figure which shows the further another process (The state which transferred the chip | tip to the adhesion holding jig) of the manufacturing method of the electronic component concerning one Example of this invention. It is a figure which shows the further another process (The state which has immersed the chip | tip in the electrically conductive paste layer) of the manufacturing method of the electronic component concerning one Example of this invention. It is a figure which shows the further another process (The state which made the electrically conductive paste adhere to the WT surface of a chip | tip) of the manufacturing method of the electronic component concerning one Example of this invention. It is a figure which shows the conventional alignment method of chip components.

  Embodiments of the present invention will be described below to describe the features of the present invention in more detail.

[Embodiment]
FIG. 1 is an exploded perspective view showing an alignment apparatus B provided with a transfer jig A according to an embodiment of the present invention, and FIG. 2 is an object to be transferred and aligned using the alignment apparatus B provided with the transfer jig A. It is a perspective view which shows the structure of the chip | tip 1 used.
FIG. 3 is a plan view showing a main part configuration of the transfer jig A, and FIG. 4 is a front sectional view showing a main part configuration of the transfer jig A.

  In this embodiment, as shown in FIG. 2, the chip 1 to be transferred and aligned has a thickness T, a width W, and a length L in a relationship of T <W <L, and An area of the WT surface which is a surface defined by the thickness T and the width W, an area of the LT surface which is a surface defined by the thickness T and the length L, and a surface defined by the width W and the length L. It is a rectangular parallelepiped structure in which the area of a certain LW surface has a relationship of WT surface area <LT surface area <LW surface area.

In this embodiment, the chip 1 to be transferred is a ceramic multilayer body (multilayer ceramic capacitor element) formed in the production process of the multilayer ceramic capacitor, and has end faces (WT surfaces) 1a on the sides facing each other. ₁ and 1a ₂ have a structure in which internal electrodes 2 adjacent in the stacking direction are alternately drawn. The dimensions of the chip 1 to be transferred are a thickness T of 0.15 mm, a width W of 0.5 mm, and a length L of 1.0 mm.

Further, the chip (multilayer ceramic capacitor element) 1 is electrically connected to the internal electrode 2 drawn to the end faces (1a ₁ , 1a ₂ ) facing each other through the transfer / alignment process using the transfer jig A. Thus, a pair of external electrodes are formed on the end face.

  As shown in FIGS. 1, 3 and 4, the aligning device B used for transferring / aligning the chips 1 includes a transfer jig A including an insertion pallet 10 and a holding pallet 20, and an insertion tool. A vacuum suction chamber 30 for sucking and holding the pallet 10 to the holding pallet 20 is provided.

The insertion pallet 10 constituting the transfer jig A is plate-shaped and includes a through hole 11 through which the chip 1 passes. The through hole 11 has a plane area larger than the WT surfaces 1a ₁ and 1a _{2 of the} chip 1 shown in FIG. 2 and smaller than the LT surface 1b and the LW surface 1c, and the chip 1 faces the WT surface 1a ₁ or 1a ₂ downward. It has a shape that can pass only in the posture.

A frame 12 is provided around the insertion pallet 10 to prevent chips from spilling when the chips 1 are supplied onto the insertion pallet 10.
The holding pallet 20 is plate-shaped and includes a chip receiving recess 21 for receiving and holding the chip 1 and an insertion pallet holding suction hole 23 for sucking and holding the insertion pallet 10 on the upper surface thereof.

  The depth D of the chip receiving recess 21 is smaller than the length L of the chip 1, and the upper end side of the chip 1 protrudes from the chip receiving recess 21 with the insertion pallet 10 removed after the transfer of the chip 1 is completed. It is configured as follows.

  Further, the depth D of the chip receiving recess 21 is a value obtained by subtracting the thickness Tp of the insertion pallet 10 from the length L of the chip 1 so that the transferred chip 1 can be reliably held in the chip receiving recess 21. It is configured to be larger than the thickness Tp of the insertion pallet 10.

  Further, the chip receiving recess is arranged so that the entire chip 1 can be housed in a space formed by the through hole 11 of the insertion pallet 10 and the chip receiving recess of the holding pallet, and the reliability of housing and holding can be improved. The dimension obtained by adding the depth D of 21 and the thickness Tp of the insertion pallet 10 is configured to be larger than the length L of the chip 1. Therefore, by providing the above requirements, as shown in FIG. 4, the chip 1 has a portion that is 1/2 or more of the length L of the chip 1 accommodated in the chip accommodating recess 21, and the remaining portion is a through hole of the insertion pallet. It will be in the state located inside.

The chip receiving recess 21 has a plane area smaller than the plane area of the through hole 11 of the insertion pallet 10 (that is, the plane area of the through hole 11 is larger than the plane area of the chip receiving recess 21), and WT. The chip 1 is configured to be accommodated in the chip accommodating recess 21 only in a posture with the surface 1a ₁ or 1a ₂ facing down.

The plane area of the through hole 11 of the insertion pallet 10 is made larger than the plane area of the chip receiving recess 21 (that is, the plane area of the chip receiving recess 21 is made smaller than the plane area of the through hole 11 of the insertion pallet 10). This is because the WT surface 1a ₁ or 1a ₂ of the chip 1 enters the through hole 11 of the insertion pallet 10, the chip 1 rises with the WT surface 1a ₁ or 1a ₂ down, and enters the chip receiving recess 21 of the holding pallet 20. This is to facilitate the transfer.

  Further, when the planar area of the chip receiving recess 21 is smaller than the planar area of the through hole 11 of the insertion pallet 10, the chip 1 is large after being accommodated in the chip accommodating recess 21 with the WT face down. It is possible to securely hold the chip 1 at a predetermined position without causing a positional shift.

Further, by reducing the planar area of the chip receiving recess 21 of the holding pallet 20 so as to be slightly larger than the planar area of the WT surfaces 1a ₁ and 1a ₂ of the chip 1, the transferred chip 1 is almost It can be held in a vertical posture.

In this embodiment, an upper portion (a portion closer to the upper surface) 11a of the through-hole 11 of the insertion pallet 10 is configured in a step shape so that the diameter of the through-hole 11 increases toward the upper surface side. 1 is configured to be easily transferred into the through hole 11.
In addition, as in this embodiment, instead of configuring the upper portion of the through hole in a stepped shape, it is also possible to have a tapered shape so that the diameter of the through hole 11 increases toward the upper surface side.

  In this embodiment, the portion 11b below the stepped portion of the through hole 11 of the insertion pallet 10 is longer than the tip receiving recess 21 of the holding pallet 20 (in FIG. It is formed larger by 0.04 mm in the direction indicated by the arrow X) and larger by 0.2 mm in the direction orthogonal to the longitudinal direction (direction indicated by the arrow Y in FIG. 3).

  Further, in this embodiment, a transfer promotion suction hole 24 (FIG. 4) is formed at the bottom of the chip receiving recess 21 to promote the chip 1 being transferred into the chip receiving recess 21 by vacuum suction. Yes. Thus, by providing the transfer promoting suction hole 24, the chip 1 can be transferred into the chip receiving recess 21 more efficiently.

  The holding pallet 20 includes an insertion pallet holding suction hole 23 for holding the insertion pallet 10 by vacuum suction. In this embodiment, the insertion pallet holding suction hole 23 is provided with a cross-shaped groove in a portion where the vertical and horizontal center lines of the holding pallet 20 pass. A gap is more likely to occur between the insertion pallet 10 and the holding pallet 20 at the center than at the periphery. By forming the insertion pallet holding suction hole 23 in a cross shape, the gap between the insertion pallet 10 and the holding pallet 20 at the center can be more reliably held small. In particular, when the insertion pallet 10 is as thin as 1 mm or less, the insertion pallet 10 is warped and a gap is easily generated. In such a case, it is particularly effective to make the insertion pallet holding suction hole 23 into a cross shape.

  The through pallet 11 is not provided in a region of the insertion pallet 10 corresponding to the insertion pallet holding suction hole 23 whose cross-sectional shape is a cross shape, and the insertion pallet 10 is securely held by vacuum suction. It is configured to be able to.

In this embodiment, as a mechanism for holding the insertion pallet 10, the holding pallet 10 is provided with the insertion pallet holding suction hole 23 in a cross shape. However, the insertion pallet holding suction hole has a plurality of suction holes. It is also possible to have a configuration comprising
From the viewpoint of ensuring that the insertion pallet 10 is securely held on the holding pallet 20 by vacuum suction, the insertion pallet 10 includes a material having an appropriate flexibility (for example, a resin-based material or a spring). It is preferable to use a metal material having a property.

Furthermore, in this embodiment, the insertion pallet 10 has a thickness (= depth of the through hole) Tp of 0.50 mm.
Moreover, as for the holding pallet 20, the depth D of the chip | tip recessed part 21 is 0.55 mm.
Therefore, the total value of the thickness of the insertion pallet 10 (= depth of the through hole) Tp: 0.5 mm and the depth D of the chip receiving recess 21 of the holding pallet 20: 0.55 mm is 1.05 mm.

  Since the chip 1 has the dimensions that the thickness T is 0.15 mm, the width W is 0.5 mm, and the length L is 1.0 mm as described above, the thickness of the insertion pallet 10 in this embodiment is as follows. (= Depth of the through hole) Tp: 0.5 mm and the depth D of the chip receiving recess 21 of the holding pallet 20: 0.55 mm (1.05 mm) is a total value (1.05 mm) of the length 1 of the chip 1 (= 1 0.0 mm).

  Therefore, in this embodiment, a portion of ½ or more of the length L of the chip 1 is accommodated in the chip accommodating recess 21 (that is, the lower side of the chip is 0.55 mm with respect to L: 1.0 mm). The portion is housed in the chip housing recess 21), and the remaining portion (the upper 0.45 mm portion of the chip) is positioned in the through hole 11 of the insertion pallet 10.

  In addition, in the transfer jig | tool A of this embodiment, after the transfer process of the chip | tip 1 is complete | finished, the insertion pallet 10 is raised with the frame 12 and can be separated from the holding pallet 20.

  Further, the vacuum suction chamber 30 constituting the alignment device B together with the transfer jig A includes a holding vacuum suction hole 31, and is inserted by vacuum suction through the insertion pallet holding suction hole 23 of the holding pallet 20. The pallet 10 is configured to perform a function of sucking and holding the pallet 10 to the holding pallet 20.

  Further, the vacuum suction chamber 30 is provided at the bottom of the chip receiving recess 21 and passes through a transfer promotion suction hole 24 (FIG. 4) that promotes the transfer of the chip 1 into the chip receiving recess 21 by vacuum suction. In addition, the vacuum suction hole 32 for transfer promotion (FIG. 1) is provided for continuous vacuum suction.

  The vacuum suction chamber 30 is configured so that the vacuum suction from the holding vacuum suction hole 31 and the transfer promoting vacuum suction port 32 can be controlled by a valve.

  Further, the alignment apparatus B of the present invention is configured to be able to vibrate and oscillate the whole including the transfer jig A provided with the insertion pallet 10 and the holding pallet 20. And the chip | tip 1 can be efficiently transferred into the chip | tip receiving recessed part 21 of the holding pallet 20 by the above-mentioned vacuum suction for transfer promotion.

  Next, a method for transferring and aligning chips using the alignment apparatus B provided with the transfer jig A and a method for applying a conductive paste for forming external electrodes to the aligned chips are schematic views. This will be described with reference to FIGS.

(1) First, as shown in FIG. 5, the lower surface of the insertion pallet 10 and the upper surface of the holding pallet 20 so that the through hole 11 of the insertion pallet 10 and the opening of the chip receiving recess 21 of the holding pallet 20 face each other. And join.
Then, the insertion pallet 10 is sucked from the insertion pallet holding suction hole 23 (FIG. 1) of the holding pallet 20 to hold and fix the insertion pallet 10 on the upper surface of the holding pallet 20.
At this time, the vacuum chamber 30 (FIG. 1) is disposed on the lower surface side of the holding pallet 20, but the illustration of the vacuum chamber is omitted here.

  (2) Then, the chip 1 is supplied in a loose state to the area surrounded by the frame 12 (FIG. 1) on the upper surface of the insertion pallet 10.

  (3) Next, vibration and swing are applied to the insertion pallet 10 and the holding pallet 20, and vacuum suction for promoting the transfer is performed. As shown in FIG. Transfer to 21.

(4) Then, as shown in FIG. 7, the holding pallet 20 and the insertion pallet 10 are separated. As a result, the lower portion of the chip 1 is held in the chip receiving recess 21 of the holding pallet 20 with the upper portion of the chip 1 protruding.
In this embodiment, at this time, a portion of ½ or more of the length L of the chip 1 is housed in the chip housing recess 21.

(5) Then, as shown in FIG. 8, from the upper surface side of the holding pallet 20, the WT surface 1a ₁ which is a surface defined by the width W and the thickness T of the tip 1 protruding from the tip receiving recess 21. The adhesive holding jig 40 provided with the adhesive material 41 which is an adhesive sheet-like material is pressed against the chip 1 to hold the chip 1 on the adhesive material 14 of the adhesive holding jig 40, and as shown in FIG. In addition, the chip 1 is transferred to the adhesive holding jig 40 by separating the adhesive holding jig 40 and the holding pallet 20. In addition, as the adhesive material 41, the sheet-like adhesive material which has the adhesive strength and elasticity which can hold | maintain the chip | tip 1 is used. In addition, as the adhesive material 41, various materials that can hold the chip 1 by adhesion can be used.

(6) Next, as shown in FIG. 10, by immersing the lower WT surface 1a ₂ of the chip 1 held by the adhesive holding jig 40 in the conductive paste layer 42, the chip 1 is raised. As shown in FIG. 11, the conductive paste 42a is attached to the WT surface 1a ₂ of the chip 1 and the side surface in the vicinity thereof.

  (7) Then, with the chip 1 held by the adhesive holding jig 40, the attached conductive paste is dried.

(8) Thereafter, although not particularly illustrated, the conductive paste 42a of the chip 1 is applied to an adhesive holding jig using an adhesive material having a higher adhesive strength than the adhesive material 41 of the adhesive holding jig 40 used in the above (5). The applied WT surface 1a ₂ is adhered and held, the chip 1 is transferred, the steps according to the above (6) and (7) are performed, and the WT surface (1a ₁ ) on the opposite side of the chip 1 and its vicinity A conductive paste is attached to the side surface of the substrate.

  (9) Then, the chip is peeled off from the adhesive holding jig. Then, the conductive paste is baked under predetermined conditions. As a result, a multilayer ceramic capacitor having a structure in which the external electrodes that are electrically connected to the internal electrodes are formed on the mutually opposing end surfaces of the chip is obtained.

  In the transfer jig A used in the above embodiment, the insertion pallet and the holding pallet are transferred in a state where the insertion pallet and the holding pallet are joined and fixed to each other by vacuum suction. It is possible to suppress and prevent the positional deviation of the chip and accurately and reliably transfer the chip.

Further, since the transfer is performed with the WT surface having the smallest area of the chip on the lower side, the number of transfer (taken number) in one holding pallet can be increased and the productivity can be improved.
Further, since the transfer is promoted by vibration and swinging and vacuum suction, the time required for the transfer can be shortened and the productivity can be improved.

  Therefore, according to the method according to the above-described embodiment, it is possible to easily and surely transfer the chips aligned by the aligning apparatus including the transfer jig of the present invention to the adhesive holding jig, and to hold the adhesive. By immersing the WT surface of the chip held by the jig in the conductive paste layer, it becomes possible to reliably apply the conductive paste for forming external electrodes to the WT surface of the chip. As a result, it is possible to efficiently manufacture an electronic component having an external electrode.

  In the above-described embodiment, the case where a multilayer ceramic capacitor is manufactured has been described as an example. However, the present invention can also be applied to a case where a chip-type inductor, an LC composite component, or the like is manufactured.

  The present invention is not limited to the above embodiment in other respects as well, and relates to the specific configuration of the insertion pallet and the holding pallet, the size of the through hole of the insertion pallet and the chip receiving recess of the holding pallet, etc. It is possible to add various applications and modifications within the range.

1 Chip 1a _One WT surface of 1 chip 1a _2nd WT surface of ₂ chips 1b LT surface of chip 1c LW surface of chip 10 Insertion pallet 11 Through hole 11a Upper part of through hole (portion close to upper surface)
11b Lower part of the through hole 12 Frame 20 Holding pallet 21 Chip receiving recess 23 Inserting pallet holding suction hole 24 Transfer promoting suction hole 30 Vacuum suction chamber 31 Holding vacuum suction hole 32 Transfer promoting vacuum suction hole 40 Adhesive holding Jig 41 Adhesive material 42 Conductive paste layer 42a Conductive paste A Transfer jig B Alignment device D Depth of chip receiving recess Tp Thickness of insertion pallet L Chip length T Chip thickness W Chip width

Claims (5)

When the thickness is T, the width is W, and the length is L, the relationship of T <W <L is satisfied, and the WT surface, which is a surface defined by the thickness T and the width W, and the thickness T and the length L A transfer jig used for aligning a rectangular parallelepiped chip having an LT surface which is a defined surface and an LW surface which is a surface defined by a width W and a length L,
A plate-like insertion pallet, and a plate-like holding pallet used by being arranged on the lower surface side of the insertion pallet in the chip transfer step,
The insertion pallet includes a through hole through which the chip passes.
The through hole has a shape in which the planar area is larger than the WT surface of the chip, smaller than the LW surface and the LT surface, and allows the chip to pass only in an attitude with the WT surface down. Have
The holding pallet includes a chip receiving recess for receiving and holding the chip, and an insertion pallet holding suction hole for holding the insertion pallet on the upper surface by vacuum suction,
(A) The depth D of the chip receiving recess is smaller than the length L of the chip,
(C) The chip accommodating recess is accommodated in the chip accommodating recess only in a posture in which the planar area is smaller than the planar area of the through-hole of the insertion pallet and the chip faces the WT surface. A transfer jig characterized by having such a shape.   2. The transfer jig according to claim 1, wherein the insertion pallet holding suction hole has a cross-shaped planar shape.   3. The transfer promotion suction hole for promoting the transfer of the chip into the chip receiving recess by vacuum suction is formed at the bottom of the chip receiving recess. Transfer jig.   The transfer jig according to claim 1, wherein the tip has a thickness T of 0.15 mm or less. A method of manufacturing an electronic component including an external electrode on the surface of the chip through a step of transferring the chip using the transfer jig according to claim 1,
The insertion pallet holding of the holding pallet is performed by joining the lower surface of the insertion pallet and the upper surface of the holding pallet so that the through hole of the insertion pallet faces the opening of the chip receiving recess of the holding pallet. Sucking from the suction hole for holding, and holding the lower surface of the insertion pallet and the upper surface of the holding pallet joined,
Supplying the chip onto the insertion pallet and swinging the chip into the chip receiving recess of the holding pallet in a posture with the WT surface down;
A step of separating the holding pallet and the insertion pallet after the chip is transferred into the chip receiving recess of the holding pallet and holding a part of the chip protruding from the chip receiving recess;
The chip is transferred to the adhesive holding jig by pressing and holding an adhesive holding jig provided with an adhesive material having adhesiveness to one of the WT surfaces of the chip protruding from the chip receiving recess. And a process of
Immersing the other WT surface of the chip held by the adhesive holding jig in a conductive paste layer, and applying a conductive paste for forming external electrodes to the WT surface of the chip. An electronic component manufacturing method characterized by the above.

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