JP2015012211A - Imaging unit and imaging device - Google Patents

Abstract

When mounting a component such as an imaging chip on a mounting board, it is necessary to secure a large area for applying heat during mounting, for example, on a surface opposite to the mounting surface of the component. An imaging unit is mounted on an imaging chip, a mounting board on which the imaging chip is mounted, a connection member that electrically connects the imaging chip and the mounting board, and the imaging board. An encircling member that encloses the chip, and the mounting substrate is energized when mounting a mounting component that is at least one of the imaging chip, the encircling member, and the connecting member on the mounting substrate. And a conductive pattern that generates heat for mounting the mounting component on the mounting substrate. [Selection] Figure 4

Description

  The present invention relates to an imaging unit and an imaging apparatus.

An imaging unit having a package structure in which an imaging chip is mounted in a ceramic package is known.
[Prior art documents]
[Patent Literature]
[Patent Document 1] Japanese Patent Application Laid-Open No. 2007-019423

  In some cases, a component is mounted on the mounting substrate by applying heat to a surface opposite to the mounting surface on which a component such as an imaging chip is mounted on the mounting substrate. In this case, it is necessary to secure a region where the heating device contacts on the surface opposite to the mounting surface. Securing the area where the heating device contacts the mounting board may limit the area where the electronic component can be mounted.

  In the first aspect, the imaging unit is mounted on the imaging chip, a mounting board on which the imaging chip is mounted, a connection member that electrically connects the imaging chip and the mounting board, and the mounting board. A surrounding member that surrounds the imaging chip, and the mounting board mounts a mounting component that is at least one part of the imaging chip, the surrounding member, and the connection member on the mounting board. It has a conductor pattern that is energized to generate heat for mounting the mounting component on the mounting board.

  In the second aspect, an imaging device includes the imaging unit.

  In a third aspect, a method for manufacturing an imaging unit includes a step of preparing a mounting substrate having a conductor pattern and mounting an imaging chip, and electrically connecting the imaging chip, the imaging chip, and the mounting substrate. Providing a mounting component that is at least one of a connecting member connected to the mounting substrate and an encircling member encircling the imaging chip when mounted on the mounting substrate; and energizing the conductor pattern And mounting the mounting component on the mounting board by heat generated by the conductor pattern by energizing the conductor pattern.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is a schematic cross section of the camera 10 which is an example of an imaging device. 3 is a top view schematically showing an imaging unit 40. FIG. It is sectional drawing which shows the AA cross section of FIG. 2 typically. An example of arrangement | positioning of the conductor pattern 190 for a heating is shown typically. It is a perspective sectional view showing image pick-up unit 40 typically. FIG. 10 is a cross-sectional view schematically showing an imaging unit 640 as a first modification of the imaging unit 40. An example of arrangement | positioning of the conductor pattern 190 for a heating is shown typically. It is a top view which shows typically the imaging unit 840 as a 2nd modification of the imaging unit 40. FIG. It is sectional drawing which shows the AA cross section of FIG. 8 typically.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a schematic cross-sectional view of a camera 10 that is an example of an imaging apparatus. The camera 10 includes a lens unit 20 and a camera body 30. The lens unit 20 is attached to the camera body 30. The lens unit 20 includes an optical system arranged along the optical axis 22 in the lens barrel, and guides an incident subject light flux to the imaging unit 40 of the camera body 30.

  In the present embodiment, the direction along the optical axis 22 is defined as the z-axis direction. That is, the direction in which the subject light beam enters the imaging chip 100 included in the imaging unit 40 is defined as the z-axis direction. Specifically, the direction in which the subject luminous flux is incident is defined as the z-axis minus direction, and the opposite direction is defined as the z-axis plus direction. The longitudinal direction of the imaging chip 100 is defined as the x-axis direction. The short direction of the imaging chip 100 is defined as the y-axis direction. Specifically, the x-axis direction and the y-axis direction are determined in the directions illustrated in FIG. The x-axis, y-axis, and z-axis are right-handed orthogonal coordinate systems. For convenience of explanation, the z-axis plus direction may be referred to as the front side, the front side, or the like. Also, the z-axis minus direction may be referred to as rear, rear, etc. The z-axis negative direction side may be referred to as the back side.

  The camera body 30 has a mirror unit 31 at a position in the negative z-axis direction from the body mount 26 coupled to the lens mount 24. The mirror unit 31 includes a main mirror 32 and a sub mirror 33. The main mirror 32 is rotatably supported between an entry position where it enters the optical path of the subject light beam emitted from the lens unit 20 and a retreat position where it is retracted from the optical path of the subject light flux. The sub mirror 33 is rotatably supported with respect to the main mirror 32. The sub mirror 33 enters the entry position together with the main mirror 32 and retracts to the retract position together with the main mirror 32. As described above, the mirror unit 31 takes the approach state in which the subject light flux enters the optical path and the retreat state in which the subject light flux is retracted.

  When the mirror unit 31 is in the entering state, a part of the subject light beam incident on the main mirror 32 is reflected by the main mirror 32 and guided to the focus plate 80. The focus plate 80 is disposed at a position conjugate with the imaging surface of the imaging chip 100 included in the imaging unit 40, and visualizes the subject image formed by the optical system of the lens unit 20. The subject image formed on the focus plate 80 is observed from the finder window 86 through the pentaprism 82 and the finder optical system 84.

  When the mirror unit 31 is in the entering state, light beams other than the subject light beam reflected by the main mirror 32 out of the subject light beam incident on the main mirror 32 enter the sub mirror 33. Specifically, the main mirror 32 has a half mirror area, and the subject light flux that has passed through the half mirror area of the main mirror 32 enters the sub mirror 33. The sub mirror 33 reflects the light beam incident from the half mirror region toward the imaging optical system 70. The imaging optical system 70 guides the incident light beam to a focus detection sensor 72 for detecting the focus position. The focus detection sensor 72 outputs the focus position detection result to the MPU 51.

  The focus plate 80, the pentaprism 82, the main mirror 32, the sub mirror 33, and the finder optical system 84 are supported by a mirror box 60 as a support member. When the mirror unit 31 is in the retracted state and the front curtain and the rear curtain of the shutter unit 38 are in the open state, the subject luminous flux that passes through the lens unit 20 reaches the imaging surface of the imaging chip 100.

  A substrate 62 and a display unit 88 are sequentially arranged at a position in the negative z-axis direction of the imaging unit 40. As the display unit 88, for example, a liquid crystal panel or the like can be applied. The display surface of the display unit 88 appears on the back surface of the camera body 30. The display unit 88 displays an image generated from the output signal from the imaging chip 100.

  Electronic circuits such as MPU 51 and ASIC 52 are mounted on the substrate 62. The MPU 51 is responsible for overall control of the camera 10. An output signal from the imaging chip 100 is output to the ASIC 52 via a flexible printed circuit board or the like. The ASIC 52 processes the output signal output from the imaging chip 100.

  The ASIC 52 generates image data for display based on the output signal from the imaging chip 100. The display unit 88 displays an image based on the display image data generated by the ASIC 52. The ASIC 52 generates image data for recording based on the output signal from the imaging chip 100. The ASIC 52 generates image data for recording by performing, for example, image processing or compression processing on the output signal of the imaging chip. The recording image data generated by the ASIC 52 is recorded on a recording medium attached to the camera body 30. The recording medium is configured to be detachable from the camera body 30.

  FIG. 2 is a top view schematically showing the imaging unit 40. FIG. 3 is a cross-sectional view schematically showing the AA cross section of FIG. The imaging unit 40 includes an imaging chip 100, a mounting substrate 120, a frame 140, and a cover glass 160.

  The imaging chip 100 is a CMOS image sensor or a CCD image sensor. The imaging chip 100 includes an imaging area 101 and a peripheral area 102. The imaging region 101 is formed in the central part of the imaging chip 100. In the imaging region 101 of the imaging chip 100, an imaging surface is formed by a plurality of photoelectric conversion elements that photoelectrically convert subject light. The peripheral area 102 of the imaging chip 100 is located around the imaging area 101. The peripheral area 102 of the imaging chip 100 includes a processing circuit that reads out a pixel signal obtained by photoelectric conversion in the photoelectric conversion element and performs signal processing. The processing circuit includes an AD conversion circuit that converts the output pixel signal into a digital signal.

  The imaging chip 100 is mounted on the mounting substrate 120. The imaging chip 100 is mounted on the mounting substrate 120 by, for example, flip chip mounting. The imaging chip 100 is electrically connected to the mounting substrate 120 via bonding wires 110. The pixel signal converted into a digital signal by the AD conversion circuit of the imaging chip 100 is output to the mounting substrate 120 via the bonding wire 110. The imaging chip 100 is bonded to the mounting substrate 120 with an adhesive. The imaging chip 100 is accommodated in the opening 138 of the frame 140. The frame 140 is an example of a surrounding member that surrounds the imaging chip 100.

  The mounting substrate 120 mounts the imaging chip 100. The mounting substrate 120 includes a first layer 121, a core layer 207, and a second layer 122. The first layer 121 includes a solder resist layer 201, a wiring layer 202, an insulating layer 203, a wiring layer 204, and an insulating layer 205. The second layer 122 includes an insulating layer 215, a wiring layer 214, an insulating layer 213, a wiring layer 212, and a solder resist layer 211. The mounting substrate 120 is a multilayer core substrate having the core layer 207 as a core layer.

  On the mounting substrate 120, along the optical axis 22, the imaging chip 100, solder resist layer 201, wiring layer 202, insulating layer 203, wiring layer 204, insulating layer 205, core layer 207, insulating layer 215, wiring layer 214, insulating The layer 213, the wiring layer 212, and the solder resist layer 211 are arranged in this order.

  The insulating layer 203, the insulating layer 205, the insulating layer 215, and the insulating layer 213 are, for example, resin layers. The thickness of each of the insulating layer 203, the insulating layer 205, the insulating layer 215, and the insulating layer 213 is 30 μm to 40 μm. The thickness is a length in the z-axis direction.

  The wiring layer 202, the wiring layer 204, the wiring layer 214, and the wiring layer 212 include a wiring pattern. As a material for the wiring layer 202, the wiring layer 204, the wiring layer 214, and the wiring layer 212, an alloy of nickel and iron (for example, 42 alloy, 56 alloy), copper, aluminum, or the like can be used. Each of the wiring patterns included in the wiring layer 202, the wiring layer 204, the wiring layer 214, and the wiring layer 212 has a thickness of about 30 μm to 40 μm.

  The core layer 207 is made of metal. When the core layer 207 is formed of a metal, for example, an alloy of nickel and iron (for example, 42 alloy, 56 alloy), copper, aluminum, or the like may be used as the material of the core layer 207. The thickness of the core layer 207 is thicker than any of the wiring layers 202, 204, 214, and 212. The thickness of the core layer 207 is thicker than any of the insulating layers 203, 205, 215, and 213. Specifically, the thickness of the core layer 207 is about 0.1 mm to 0.4 mm. The rigidity of the core layer 207 is higher than the rigidity of any of the wiring layers 202, 204, 214, and 212. The rigidity of the core layer 207 may be higher than the rigidity of the first layer 121. The rigidity of the core layer 207 may be higher than the rigidity of the second layer 122.

  The core layer 207 may be made of resin. When the core layer 207 is formed of resin, FR4 may be used as the material of the core layer 207. When the core layer 207 is formed of resin, the core layer 207 is sandwiched between the wiring layers in the z-axis direction. For example, when the core layer 207 is formed of resin, along the optical axis 22, the imaging chip 100, the solder resist layer 201, the wiring layer 202, the insulating layer 203, the wiring layer 204, the core layer 207, the wiring layer 214, and the insulating layer 213, the wiring layer 212, and the solder resist layer 211 may be arranged in this order. When two wiring layers are additionally disposed, an additional insulating layer that contacts the wiring layer 204 and an additional wiring layer that contacts the core layer 207 are between the wiring layer 204 and the core layer 207. 22, and an additional wiring layer that contacts the core layer 207 and an additional insulating layer that contacts the wiring layer 214 are disposed along the optical axis 22 between the core layer 207 and the wiring layer 214. Are arranged in order.

  As described above, the mounting substrate 120 is a multilayer core substrate having a metal core or a resin core. The thickness of the mounting substrate 120 may be about 0.3 mm to 1.0 mm as a whole.

  At least a part of the wiring layer 202 is used for a wiring pattern that receives a pixel signal output from the imaging chip 100 via the bonding wire 110. The wiring layer 202 includes a bonding pad 240 to which the bonding wire 110 is connected.

  The wiring pattern included in the wiring layer 204 and the wiring pattern included in the wiring layer 214 can be used for, for example, a ground line 500 and a power supply line 510 described later. As will be described later, the wiring layer 202 and the wiring layer 204 include a wiring pattern 310, a wiring pattern as a heating conductor pattern 190 for heating the mounting substrate 120 when the imaging chip 100, the frame 140, and the bonding wire 110 are mounted. 322, a wiring pattern 341, and a wiring pattern 342 are further included.

  The imaging chip 100 is mounted on the solder resist layer 201. The imaging chip 100 is electrically connected to the bonding pad 240 by the bonding wire 110. The bonding pad 240 and the wiring layer 212 are electrically connected by a via 131 that penetrates the first layer 121 and the core layer 207. The via 131 is covered with an insulator 132. Pixel signals output from the imaging chip 100 are transmitted to the wiring layer 212 through the wiring layer 202 and the via 131.

  An electronic component 180 is provided on the solder resist layer 211. The electronic component 180 includes, for example, a connector, a capacitor, a resistor, a regulator, a transistor, and the like. The electronic component 180 constitutes a power supply circuit that supplies power to the circuits in the imaging chip 100. For example, a flexible board is connected to the connector as a part of the electronic component 180. The connector as a part of the electronic component 180 is connected to the wiring layer 212, and the pixel signal transmitted to the wiring layer 212 is transmitted to an external electronic circuit such as the ASIC 52 via the connector and the flexible substrate.

  The lead member of the electronic component 180 is fixed to the wiring layer 212 with solder or the like. Electronic component 180 and wiring layer 212 are electrically connected by a lead member. In this way, the electronic component 180 is provided on the second main surface 112 on the opposite side of the mounting substrate 120 from the first main surface 111 on which the imaging chip 100 is mounted.

  The imaging chip 100 is mounted on the mounting substrate 120 by COB (Chip On Board). The imaging chip 100 is mounted on the mounting substrate 120 by being bonded by, for example, the bonding portion 210. Specifically, the imaging chip 100 is bonded to the solder resist layer 201 of the mounting substrate 120 with the bonding portion 210. The bonding part 210 is formed of, for example, an adhesive. Specifically, the adhesion part 210 is formed by thermosetting a thermosetting adhesive. The adhesion part 210 is formed by thermosetting the thermosetting adhesive mainly by the heat generated by the wiring pattern 310. Specifically, the bonding portion 210 is formed by thermally curing a thermosetting adhesive with Joule heat generated by the wiring pattern 310 by energizing the wiring pattern 310.

  In the imaging chip mounting process, the imaging chip 100 is mounted on the mounting substrate 120. In the imaging chip mounting process, when the imaging chip 100 is mounted on the mounting substrate 120, the imaging chip 100 is heated by the heat generated by the wiring pattern 310. Specifically, the imaging chip 100 is heated by Joule heat generated by the wiring pattern 310 by energizing the wiring pattern 310. The imaging chip 100 is mounted on the heated mounting substrate 120 by thermocompression bonding.

  The bonding wire 110 is mounted on the imaging chip 100 and the bonding pad 240. The bonding wire 110 is mounted on the imaging chip 100 with, for example, solder. The bonding pad 240 is heated by the Joule heat generated by the wiring pattern 341 by energizing the wiring pattern 341 and the Joule heat generated by the wiring pattern 342 by energizing the wiring pattern 342. The bonding wire 110 is mounted on the heated bonding pad 240 by thermocompression bonding. The bonding wire 110 may be mounted on the bonding pad 240 by ultrasonic pressure bonding. The bonding wire 110 electrically connects the imaging chip 100 and the bonding pad 240.

  In the wire bonding process (bonding wire mounting process), the bonding wire 110 is mounted on the imaging chip 100 and the bonding pad 240. In the wire bonding process, when the bonding wire 110 is mounted on the bonding pad 240, the bonding pad 240 is heated by the heat generated by the wiring pattern wiring pattern wiring pattern 341 and the wiring pattern 342. Specifically, in the wire bonding process, the bonding pad 240 is caused by the Joule heat generated by the wiring pattern 341 by energizing the wiring pattern 341 and the Joule heat generated by the wiring pattern 342 by energizing the wiring pattern 342. Heated. In the wire bonding process, the bonding wire 110 is mounted on the heated bonding pad 240 by thermocompression bonding. In the wire bonding process, the bonding wire 110 may be mounted on the bonding pad 240 by ultrasonic pressure bonding. Through the wire bonding process, the bonding wire 110 electrically connects the imaging chip 100 and the bonding pad 240.

  The frame 140 is bonded to the mounting substrate 120 with the bonding portion 220. Specifically, the frame 140 is bonded to the solder resist layer 201 of the mounting substrate 120 by the bonding portion 220. The bonding part 220 is formed of, for example, an adhesive. Specifically, the bonding part 220 is formed by thermosetting a thermosetting adhesive. The adhesion part 220 is formed mainly by thermosetting the thermosetting adhesive with the heat generated by the wiring pattern 321 and the wiring pattern 322. Specifically, the bonding portion 220 is thermosetting by the Joule heat generated by the wiring pattern 321 by energizing the wiring pattern 321 and the Joule heat generated by the wiring pattern 322 by energizing the wiring pattern 322 wiring pattern. It is formed by thermosetting the adhesive.

  In the frame mounting process, the frame 140 is mounted on the mounting substrate 120. In the frame mounting process, when the frame 140 is mounted on the mounting substrate 120, the frame 140 is heated by the heat generated by the wiring pattern 321 and the wiring pattern 322. Specifically, the frame 140 is heated by the Joule heat generated by the wiring pattern 321 by energizing the wiring pattern 321 and the Joule heat generated by the wiring pattern 322 by energizing the wiring pattern 322. The frame 140 is mounted on the heated mounting substrate 120 by thermocompression bonding.

As described above, in the process of mounting the imaging chip 100, the bonding wire 110, and the frame 140, by energizing the wiring pattern 310, the wiring pattern 321, the wiring pattern 322, the wiring pattern 341, and the wiring pattern 342 provided on the mounting substrate 120, An area in the mounting substrate that needs to be heated can be heated. Therefore, for example, mounting is performed on the second main surface 112 of the mounting substrate 120 as compared with the case where components such as the imaging chip 100, the bonding wire 110, and the frame 140 are mounted on the mounting substrate 120 on which the heating conductor pattern 190 is not provided. It is possible to reduce the area where the heating equipment used sometimes contacts.
In addition, components such as the imaging chip 100, the bonding wire 110, and the frame 140 can be mounted on the mounting board 120 without heating the mounting board 120 by contacting a heating device. It is possible to mount the electronic component 180 on the main surface 112 in an area secured for contacting the heating device at the time of mounting. Therefore, the mounting density of the electronic components 180 on the second main surface 112 of the mounting substrate 120 can be increased.

  The frame 140 has a first surface 141, a second surface 142, a third surface 143, a fourth surface 144, a fifth surface 145, and a sixth surface 146. The sixth surface 146 forms an opening 138. The sixth surface 146 forms the inner wall surface of the frame 140. The opening 138 is formed at, for example, a central portion in the xy plane.

  The first surface 141 is a surface bonded by the cover glass 160 and the bonding portion 230. The first surface 141 is a surface in contact with the end of the sixth surface 146. The first surface 141 is formed along the outer edge of the sixth surface 146. The first surface 141 is a surface substantially parallel to the xy plane.

  The second surface 142 is a surface in contact with the end of the first surface 141. The second surface 142 is a surface formed along the outer edge of the first surface 141. The second surface 142 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

  The third surface 143 is a surface in contact with the end of the second surface 142. The third surface 143 is a surface substantially parallel to the xy plane and a surface substantially parallel to the first surface 141.

  The fourth surface 144 is a surface in contact with the end of the third surface 143. The fourth surface 144 is a surface formed along the outer edge of the third surface 143. The fourth surface 144 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

  The fifth surface 145 is a surface in contact with the end of the fourth surface 144. The fifth surface 145 is a surface formed along the outer edge of the fourth surface 144. The fifth surface 145 is a surface substantially parallel to the xy plane. The fifth surface 145 is a surface substantially parallel to the first surface 141 and the third surface 143. The fifth surface 145 is a surface that is bonded by the solder resist layer 201 of the mounting substrate 120 and the bonding portion 220. The fifth surface 145 is bonded to the heat radiating pad 260 described later by the bonding portion 220. The fifth surface 145 faces the adhesive portion 220. The fifth surface 145 is a surface in contact with the end of the sixth surface 146. The fifth surface 145 is formed along the outer edge of the sixth surface 146.

  The frame 140 has a step portion formed by the first surface 141, the second surface 142, and the third surface 143. The frame 140 has a mounting hole 148 as a mounting portion. The frame 140 has, for example, three attachment holes 148. All of the three attachment holes 148 pass through the third surface 143 to the fifth surface 145. All of the three attachment holes 148 are used for attaching the imaging unit 40 to another structure such as the mirror box 60.

  The frame 140 is fixed to the bracket 150 by, for example, screwing with a screw 149 through three mounting holes 148. The bracket 150 is fixed to the mirror box 60 by, for example, screwing. Therefore, the imaging unit 40 is fixed to the mirror box 60.

  When the frame 140 and the bracket 150 are screwed with, for example, a metal screw 149 using the mounting holes 148, heat generated when the imaging chip 100 is operating is directed toward the mirror box 60 via the screw 149. A heat transfer path for releasing heat can be formed.

  The frame 140 has a positioning hole 147. The frame 140 has two positioning holes 147, for example. Each of the two positioning holes 147 is a hole penetrating from the third surface 143 to the fifth surface 145. Any of the positioning holes 147 is used to position the imaging unit 40 with respect to the imaging unit 40. Of the two positioning holes 147, one positioning hole is a fitting hole, and the other positioning hole 147 is a long hole.

  The frame 140 is positioned with respect to the bracket 150 using the two positioning holes 147. For example, the frame 140 and the bracket 150 are positioned by inserting two positioning pins provided on the bracket 150 into the two positioning holes 147. The frame 140 is fixed while being positioned with respect to the bracket 150. Therefore, the imaging unit 40 is fixed while being positioned on the mirror box 60. The frame 140 and the bracket 150 may be fixed to a structure other than the mirror box 60.

  A heat conductive heat radiating pad is connected to the wiring pattern 322. The heat dissipation pad 260 is connected to the wiring pattern 322 through the via 262. The heat dissipating pad 260 is provided facing the bonding part 220. The heat dissipation pad 260 may be formed by part of the wiring layer 202. As will be described later, the heat radiation pads 260 are provided at six locations of the wiring pattern 322.

  The heating conductor pattern 190 having the wiring pattern 322, the wiring pattern 310, and the like, the via 262, and the heat dissipation pad 260 form a heat transfer path between the imaging chip 100 and the frame 140. For example, heat generated in the imaging chip 100 and transmitted in the negative z-axis direction when the imaging chip 100 is operating passes through the wiring pattern 310, the wiring pattern 322, etc., the via 262, and the heat dissipation pad 260. Is transmitted to the frame 140. The heat transmitted to the frame 140 is transmitted to the mirror box 60 and the like via the bracket 150. Therefore, after the imaging unit 40 is manufactured, the heating conductor pattern 190 can be used as a part of the heat dissipation path. For example, the heating conductor pattern 190 can be used as a part of a heat radiation path for transmitting heat generated in the imaging chip 100 during the operation of the camera 10 to the mirror box 60 via the frame 140. The frame 140 functions as a heat transfer member for radiating heat generated by the operation of the imaging chip 100 to the outside of the mounting substrate 120.

  The imaging unit 40 may be fixed to the mirror box 60 without using the bracket 150. The imaging unit 40 may be fixed to the mirror box 60 by, for example, screwing through the three mounting holes 148.

  The cover glass 160 is used for sealing the imaging chip 100. Cover glass 160 is fixed to frame 140 so as to cover opening 138 of frame 140. The cover glass 160 uses the opening 138 as a sealed space together with the frame 140 and the mounting substrate 120.

  The cover glass 160 is bonded to the frame 140 by the bonding portion 230. The adhesion part 230 is formed of an adhesive. Specifically, the bonding part 220 is formed by curing a photocurable adhesive. For example, the adhesive part 230 is formed by curing an ultraviolet curable adhesive with ultraviolet rays. As a material for the cover glass 160, borosilicate glass, quartz glass, non-alkali glass, heat-resistant glass, or the like can be used. The cover glass 160 has translucency. The thickness of the cover glass 160 is 0.5 mm to 0.8 mm.

  The cover glass 160 is fixed to the frame 140 after the imaging chip 100, the bonding wire 110 and the frame 140 are mounted on the mounting substrate 120. Since the cover glass 160 has a light-transmitting property, the cover glass 160 and the frame 140 can be bonded using a photo-curing adhesive. The cover glass 160 is an example of a translucent member. As the translucent member, quartz or the like can be applied in addition to glass.

  Thus, the mounting space is formed by the mounting substrate 120, the frame 140, and the cover glass 160. The imaging chip 100 is disposed in a sealed space formed by the mounting substrate 120, the frame 140, and the cover glass 160. As a result, the imaging chip 100 is less affected by the external environment. For example, the imaging chip 100 is not easily affected by moisture existing outside the sealed space. Therefore, deterioration of the imaging chip 100 can be prevented.

  FIG. 4 schematically shows an example of the arrangement of the heating conductor pattern 190. FIG. 5 is a perspective cross-sectional view schematically showing a part of the imaging unit 40. In FIG. 4, the mounting substrate 120 and the imaging chip 100 are indicated by dotted lines for the purpose of showing the positional relationship between the heating conductor pattern 190 and the mounting substrate 120 and the imaging chip 100.

  The heating conductor pattern 190 includes a first conductor pattern 410 and a second conductor pattern 420. The first conductor pattern 410 is energized when the imaging chip 100 and the frame 140 are bonded to the mounting substrate 120, and generates heat for bonding the imaging chip 100 and the frame 140 to the mounting substrate 120. The second conductor pattern 420 is energized when connecting the bonding wire 110 to the bonding pad 240, and generates heat for connecting the bonding wire 110 to the bonding pad 240.

  The first conductor pattern 410 is provided on a part of the wiring layer 204. The first conductor pattern 410 includes a wiring pattern 310 and a wiring pattern 320. The wiring pattern 310 is formed at a position in the minus direction of the z axis in the region where the bonding portion 210 is formed. The wiring pattern 320 is formed at a position in the minus direction of the z axis in the region where the bonding part 220 is formed. The wiring pattern 310 mainly generates heat for mounting the imaging chip 100 on the mounting substrate 120 when energized. The wiring pattern 320 includes a wiring pattern 321 and a wiring pattern 322. The wiring pattern 321 and the wiring pattern 322 mainly generate heat for mounting the frame 140 on the mounting substrate 120 when energized.

  The second conductor pattern 420 is provided on a part of the wiring layer 202. The second conductor pattern 420 includes a wiring pattern 341 and a wiring pattern 342. The wiring pattern 341 and the wiring pattern 342 mainly generate heat for connecting the bonding wire 110 to the bonding pad 240 when energized. The wiring pattern 341 and the wiring pattern 342 are provided around the bonding pad 240. The wiring pattern 341 and the wiring pattern 342 are provided so as to substantially surround the bonding pad 240. For example, the wiring pattern 341 and the wiring pattern 342 are provided so as to surround the three sides of the bonding pad 240.

  As shown in FIGS. 4 and 5, the wiring pattern 342 has a pattern along the arrangement direction of the plurality of bonding pads 240. In the xy plane, the plurality of bonding pads 240 are sandwiched between the wiring patterns 342. Specifically, the wiring pattern 342 includes a wiring part 361 and a wiring part 363 along a plurality of bonding pads 240 arranged along the y-axis direction, and a wiring part 362 between the wiring part 361 and the wiring part 362. Have In the xy plane, the plurality of bonding pads 240 are sandwiched between the wiring portion 361 and the wiring portion 361 by the wiring portion 363 located in the negative x-axis direction. The bonding pad 240 is located between the wiring pattern 341 and the wiring pattern 342 in the xy plane. The wiring pattern 341 also has the same pattern as the wiring pattern 342.

  The first conductor pattern 410 is formed as one wiring. The first conductor pattern 410 is formed as one wiring by the wiring pattern 321, the connection wiring 331, the wiring pattern 310, the connection wiring 332, and the wiring pattern 322.

  A first conductive pad 301 is connected to one end of the first conductor pattern 410. The second conductive pad 302 is electrically connected to the other end of the first conductor pattern 410. Specifically, the first conductive pad 301 is connected to one end of the wiring pattern 321. The wiring pattern 321 is a wiring portion from the first conductive pad 301 to one end of the connection wiring 331. The wiring pattern 310 is a wiring portion from the other end of the connection wiring 331 to one end of the wiring pattern 322. A second conductive pad 302 is connected to the other end of the wiring pattern 322.

  When energizing the first conductor pattern 410, a voltage is applied between the first conductive pad 301 and the second conductive pad 302. Here, a case where a current flows from the first conductive pad 301 toward the second conductive pad 302 will be described. The current flowing from the first conductive pad 301 into the first conductive pattern 410 is a wiring pattern 321, a connection wiring 331, It passes through the wiring pattern 310, the connection wiring 332, and the wiring pattern 322 in order, and flows out from the second conductive pad 302.

  Six heat radiation pads 260 are connected to the first conductor pattern 410. The six heat radiation pads 260 are connected to different positions between the first conductive pad 301 and the second conductive pad 302 in the first conductor pattern 410. One or more heat radiation pads 260 may be provided.

  The cross-sectional area of the wiring pattern 321, the cross-sectional area of the wiring pattern 310, and the cross-sectional area of the wiring pattern 322 are smaller than the cross-sectional area of the connection wiring 331. The cross-sectional area of the wiring pattern 321, the cross-sectional area of the wiring pattern 310, and the cross-sectional area of the wiring pattern 322 are smaller than the cross-sectional area of the connection wiring 332. In the description of this embodiment, the cross-sectional area of each wiring indicates the area of the cross section when each wiring is cut along a plane orthogonal to the direction in which the current flows.

  For example, the thickness of the wiring pattern 321, the thickness of the wiring pattern 310, the thickness of the wiring pattern 322, the thickness of the connection wiring 331, and the thickness of the connection wiring 332 may be substantially the same. The line width of the wiring pattern 321, the line width of the wiring pattern 310, and the line width of the wiring pattern 322 are shorter than the line width of the connection wiring 331. The line width of the wiring pattern 321, the line width of the wiring pattern 310, and the line width of the wiring pattern 322 are shorter than the line width of the connection wiring 332. The line thickness of each wiring described in the present embodiment represents the length in the z-axis direction. In this embodiment, the line width of each wiring represents the length in a direction perpendicular to the direction in which current flows and parallel to the xy plane.

  By making the cross-sectional area of the wiring pattern 321, the cross-sectional area of the wiring pattern 310, and the cross-sectional area of the wiring pattern 322 smaller than the cross-sectional area of the connection wiring 331 and the cross-sectional area of the connection wiring 332, the wiring pattern 321, wiring pattern The amount of heat per unit length generated in 310 and the wiring pattern 322 can be made larger than the amount of heat per unit length generated in each of the connection wiring 331 and the connection wiring 332. Therefore, it is possible to effectively heat a region that needs to be heated in the mounting substrate 120.

  As described above, the cross-sectional area of the heating conductor pattern 190 in the mounting region where the mounting component is mounted on the mounting substrate 120 has the heating conductor pattern 190 in the non-mounting region where the mounting component is not mounted on the mounting substrate 120. It is smaller than the cross-sectional area. The amount of heat applied to the mounting region can be controlled not only by the cross-sectional area but also by the wiring density of the heating conductor pattern 190. Therefore, the wiring density of the heating conductor pattern 190 in the mounting region where the mounting component is mounted on the mounting substrate 120 is higher than the wiring density of the heating conductor pattern 190 in the non-mounting region where the mounting component is not mounted on the mounting substrate 120. It's okay.

  Note that the cross-sectional area of the wiring pattern 310 may be different from the cross-sectional area of the wiring pattern 321 and the cross-sectional area of the wiring pattern 322. For example, when the amount of heat applied to the location where the imaging chip 100 is bonded is smaller than the location where the frame 140 is bonded, the cross-sectional area of the wiring pattern 310 may be larger than the cross-sectional area of the frame 140. The cross-sectional area of the wiring pattern arranged in each region may be determined according to the temperature and the amount of heat required in each region where the mounting component is mounted.

  The second conductor pattern 420 is formed as one wiring. The second conductor pattern 420 is formed as one wiring by the connection wiring 351, the wiring pattern 341, the connection wiring 352, the wiring pattern 342, and the connection wiring 353.

  A third conductive pad 303 is connected to one end of the second conductor pattern 420. A fourth conductive pad 304 is electrically connected to the other end of the second conductor pattern 420. Specifically, the third conductive pad 303 is connected to one end of the connection wiring 351. The connection wiring 351 is a wiring portion from the third conductive pad 303 to one end of the wiring pattern 341. The wiring pattern 341 is a wiring portion from the other end of the connection wiring 351 to one end of the connection wiring 352. The wiring pattern 342 is a wiring portion from the other end of the connection wiring 352 to one end of the connection wiring 353. A fourth conductive pad 304 is connected to the other end of the connection wiring 353.

  When energizing the second conductor pattern 420, a voltage is applied between the third conductive pad 303 and the fourth conductive pad 304. Here, the case where a current flows from the third conductive pad 303 toward the fourth conductive pad 304 will be described. The current flowing from the third conductive pad 303 into the connection wiring 351 is a connection wiring 351, a wiring pattern 341, and a connection wiring. 352, the wiring pattern 342, and the connection wiring 353 pass in order and flow out of the fourth conductive pad 304.

  The cross-sectional area of the wiring pattern 341 and the cross-sectional area of the wiring pattern 342 are smaller than the cross-sectional area of the connection wiring 351. Similarly, the cross-sectional area of the wiring pattern 341 and the cross-sectional area of the wiring pattern 342 are smaller than the cross-sectional area of the connection wiring 352 and the cross-sectional area of the connection wiring 353. As described above, in the second conductor pattern 420, the cross-sectional area of the wiring pattern 341 and the cross-sectional area of the wiring pattern 342 arranged around the bonding pad 240 are determined by any of the connection wiring 351, the connection wiring 352, and the connection wiring 353. It is smaller than the area. Therefore, the bonding pad 240 can be efficiently heated.

  Note that the cross-sectional area of the wiring pattern 341 and the cross-sectional area of the wiring pattern 342 may be different from the cross-sectional area of the wiring pattern 310. The cross-sectional area of the wiring pattern 341 and the cross-sectional area of the wiring pattern 342 may be different from the cross-sectional area of the wiring pattern 321 and the cross-sectional area of the wiring pattern 322. The cross-sectional areas of the wiring pattern 341 and the wiring pattern 342 may be determined according to the temperature and the amount of heat required when the bonding wire 110 is connected to the bonding pad 240. The cross-sectional area of each wiring can be adjusted by changing the line width. The cross-sectional area of each wiring can be adjusted by changing the line width and thickness of the wiring.

  As shown in FIG. 5, the third conductive pads 303 and the fourth conductive pads 304 are provided on the first main surface 111 of the mounting substrate 120. The first conductive pad 301 and the second conductive pad 302 are provided on the first main surface 111 of the mounting substrate 120.

  Note that the third conductive pad 303 and the fourth conductive pad 304 are provided on the first main surface 111 of the mounting substrate 120, and the first conductive pad 301 and the second conductive pad 302 are the second main surface 112 of the mounting substrate 120. May be provided. The third conductive pad 303 and the fourth conductive pad 304 are provided on the second main surface 112 of the mounting substrate 120, and the first conductive pad 301 and the second conductive pad 302 are provided on the first main surface 111 of the mounting substrate 120. It may be provided.

  FIG. 5 shows a state in which a bypass capacitor 580 as an example of the electronic component 180 provided on the second main surface 112 of the mounting substrate 120 is connected between the ground line 500 and the power supply line 510. The bypass capacitor 580 is provided at a position in the negative z-axis direction of the bonding pad 240. Therefore, the potential of the power supply line 510 can be stabilized in the vicinity of the bonding pad 240. Therefore, for example, it is possible to increase noise resistance with respect to the image signal of the imaging chip 100. In addition, a drive circuit for driving the imaging chip 100 can be disposed at an appropriate position on the second main surface 112. Therefore, the drive performance of the imaging chip 100 can be improved.

  A procedure for manufacturing the imaging unit 40 will be described. First, the mounting substrate 120 on which the heating conductor pattern 190 is formed is prepared. The imaging chip 100, the bonding wire 110, and the frame 140 are not mounted on the first main surface 111 of the mounting substrate 120, and the electronic component 180 is mounted on the second main surface 112 of the mounting substrate 120. Subsequently, a mounting component to be mounted on the first main surface 111 of the mounting substrate 120 is prepared. Here, the imaging chip 100 and the frame 140 will be described as mounting components.

  A thermosetting adhesive is applied to the first main surface 111 of the prepared mounting board 120. The thermosetting adhesive is applied to a region where the imaging chip 100 is bonded and a region where the frame 140 is bonded.

  Subsequently, the prepared imaging chip 100 and frame 140 are arranged in a region where a thermosetting adhesive is applied.

  Subsequently, a power supply terminal is connected to the first conductive pad 301 and the second conductive pad 302.

  Subsequently, a voltage is applied between the first conductive pad 301 and the second conductive pad 302 from the power source, and the first conductor pattern 410 is energized from the power source. Energization of the first conductor pattern 410 is performed until a predetermined curing time of the thermosetting adhesive has elapsed. The imaging chip 100 and the frame 140 are mounted on the mounting substrate 120 by the heat generated by the first conductor pattern 410.

  Subsequently, when the curing time of the thermosetting adhesive has elapsed, the energization of the first conductor pattern 410 is stopped, and the terminal of the power supply is removed from the first conductive pad 301 and the second conductive pad 302.

  The wire bonding process for connecting the bonding wire 110 to the bonding pad 240 may be incorporated in the above-described process. For example, the wire bonding process may be performed while the first conductor pattern 410 is energized. In this case, at least a part of the period in which the second conductor pattern 420 is energized may be performed in at least a part of the period in which the first conductor pattern 410 is energized.

  As described above, according to the imaging unit 40, the mounting substrate generates heat necessary for mounting mounting components such as the imaging chip 100, the frame 140, and the bonding wires 110 on the first main surface 111 of the mounting substrate 120. It can be provided from the heating conductor pattern 190 provided on 120. Therefore, the electronic component 180 can be mounted on the second main surface 112 of the mounting substrate 120 also in a region located in the negative z-axis direction of the mounting region of the first main surface 111 on which the mounting component is mounted. . This eliminates the need to heat the mounting substrate 120 by bringing the heating member into contact with the second main surface 112 when mounting the mounting component. Therefore, the mountable area where the electronic component 180 can be mounted on the second main surface 112 can be increased. In addition, the degree of freedom of the position where the electronic component 180 is mounted on the second main surface 112 can be increased. Therefore, the mounting cost can be reduced. In addition, the mounting density of the electronic components 180 on the second main surface 112 can be increased. Therefore, the mounting substrate 120 can be reduced in size. Moreover, the camera 10 can be reduced in size. In addition, the camera 10 can be reduced in weight.

  Further, according to the imaging unit 40, an appropriate amount of heat can be applied to each mounting region by adjusting the amount of current. In addition, a necessary amount of heat can be quickly applied to each mounting area. In addition, the ratio of the amount of heat applied to each mounting region can be adjusted in advance by setting the cross-sectional area of each wiring of the heating conductor pattern 190 to an appropriate value. Thus, according to the imaging unit 40, the mounting area can be heated to a necessary and sufficient temperature. Also, the time required for mounting can be shortened.

  In the heating conductor pattern 190 described above, the first conductor pattern 410 is provided on the wiring layer 204, and the second conductor pattern 420 is provided on the wiring layer 202. However, the first conductor pattern 410 and the second conductor pattern 420 may be provided in the wiring layer 202. By providing the first conductor pattern 410 and the second conductor pattern 420 in the wiring layer 202, the influence of the heating conductor pattern 190 on the ground line 500 and the power supply line 510 may be suppressed. Of course, the first conductor pattern 410 and the second conductor pattern 420 may be provided in the wiring layer 204.

  The position in the z-axis direction where the first conductor pattern 410 is provided is not limited to the example described above. The first conductor pattern 410 may be provided on the wiring layer 214. The first conductor pattern 410 may be provided on the wiring layer 212. The first conductor pattern 410 may be provided on any layer included in the mounting substrate 120. The second conductor pattern 420 may be provided on the wiring layer 214. The second conductor pattern 420 may be provided on the wiring layer 212. The position in the z-axis direction where the second conductor pattern 420 is provided is not limited to these examples. The second conductor pattern 420 may be provided on any layer included in the mounting substrate 120.

  In the heating conductor pattern 190, the first conductor pattern 410 is formed as one wiring pattern, and generates heat for mounting the imaging chip 100 and heat for mounting the frame 140. However, the wiring pattern 310 that generates heat for mounting the imaging chip 100 and the wiring pattern 321 and wiring pattern 322 that generate heat for mounting the frame 140 may be formed as separate wirings. A separate wiring pattern may be provided for each mounting component to be mounted. A separate wiring pattern may be provided for each mounting area of the mounting substrate 120. The first conductor pattern 410 and the second conductor pattern 420 may be formed as one wiring pattern.

  FIG. 6 is a cross-sectional view schematically showing an imaging unit 640 as a first modification of the imaging unit 40. FIG. 7 schematically shows an example of the arrangement of the heating conductor pattern 190.

  Among the components included in the imaging unit 640, the components having the same reference numerals as those provided to the components included in the imaging unit 40 described with reference to FIGS. 1 to 5 are included in the imaging unit 40. It has the same function and configuration as the corresponding component. Of the components included in the imaging unit 640, descriptions of components corresponding to the components included in the imaging unit 40 may be omitted. Of the components included in the imaging unit 640, only the differences between the components corresponding to the components included in the imaging unit 40 may be described.

  In the imaging unit 640, the heating conductor pattern 190 is formed as one conductor pattern 610. The conductor pattern 610 is a modification of the first conductor pattern 410 in the imaging unit 40. Heat for heating the mounting substrate 120 when the imaging chip 100, the frame 140, and the bonding wire 110 are mounted on the mounting substrate 120 is mainly provided by the conductor pattern 610.

  When at least one mounting component of the imaging chip 100, the frame 140, and the bonding wire 110 is mounted on the mounting substrate 120, the conductor pattern 610 is energized to generate Joule heat. The mounting substrate 120 is heated mainly by Joule heat generated by the conductor pattern 610, and the mounting component is mounted on the mounting substrate 120.

  FIG. 8 is a top view schematically showing an imaging unit 840 as a second modification of the imaging unit 40. FIG. 9 is a cross-sectional view schematically showing the AA cross section of FIG. Among the constituent elements of the imaging unit 840, constituent elements having the same reference numerals as the constituent elements of the imaging unit 40 have the same functions and configurations as the corresponding constituent elements of the imaging unit 40. Have. Of the components included in the imaging unit 840, description of components corresponding to the components included in the imaging unit 840 may be omitted. Of the components included in the imaging unit 840, only the differences between the components corresponding to the components included in the imaging unit 40 may be described.

  In FIG. 8, the outer edge of the mounting board 120 in the xy plane is indicated by a dotted line. The three attachment holes 148 will be described by distinguishing them from attachment holes 148a, attachment holes 148b, and attachment holes 148c.

  The imaging chip 100 has a rectangular shape on the xy plane. The imaging chip 100 has a first short side 801 and a second short side 802, and a first long side 803 and a second long side 804. The first short side 801 is located in the x-axis minus direction from the second short side 802. The first long side 803 is located in the y-axis plus direction from the second long side 804.

  The mounting substrate 120 has a rectangular shape in the xy plane. The mounting board 120 includes a mounting board side first side 821 along the first short side 801 of the imaging chip 100, a mounting board side second side 822 along the second short side 802 of the imaging chip 100, and the first side of the imaging chip 100. A mounting board side third side 823 along the first long side 803 and a mounting board side fourth side 824 along the second long side 804 of the imaging chip 100 are included.

  The mounting substrate side first side 821 is substantially parallel to the first short side 801 of the imaging chip 100. The mounting substrate side second side 822 is substantially parallel to the second short side 802 of the imaging chip 100. The mounting substrate side third side 823 is substantially parallel to the first long side 803 of the imaging chip 100. The mounting substrate side fourth side 824 is substantially parallel to the second long side 804 of the imaging chip 100. The mounting board side first side 821 is positioned in the x-axis minus direction from the mounting board side second side 822. The mounting board side third side 823 is positioned in the y-axis plus direction from the mounting board side fourth side 824.

  The mounting hole 148a is formed on the y-axis minus direction side from the position corresponding to the mounting substrate side fourth side 824 in the frame 140. The attachment hole 148 b and the attachment hole 148 c are formed on the frame 140 on the positive side in the y-axis direction from the mounting substrate side third side 823. The attachment hole 148b and the attachment hole 148c are formed along the x-axis direction. The attachment hole 148b and the attachment hole 148c are formed at the same position in the y-axis direction. In other words, the mounting hole 148a, the mounting hole 148b, and the mounting hole 148c are not formed between the position corresponding to the mounting board side third side 823 and the position corresponding to the mounting board side fourth side 824 in the y-axis direction. .

  Further, the mounting hole 148a, the mounting hole 148b, and the mounting hole 148c are formed from a position corresponding to the mounting board side first side 821 to a position corresponding to the mounting board side second side 822 in the x-axis direction. That is, the mounting hole 148a, the mounting hole 148b, and the mounting hole 148c are not formed on the x-axis minus direction side from the position corresponding to the mounting board side first side 821, but from the position corresponding to the mounting board side second side 822. It is not formed on the x-axis plus direction side. Thus, the mounting board 120 is located between the attachment hole 148a and the attachment hole 148b in the y-axis direction, and is located between the attachment hole 148a and the attachment hole 148c in the y-axis direction.

  The mounting hole 148 a, the mounting hole 148 b, and the mounting hole 148 c are not formed on the x-axis minus direction side from the position corresponding to the mounting board side first side 821, but from the position corresponding to the mounting board side second side 822. It is not formed on the plus direction side. The substrate 62 can be provided in the vicinity of the mounting substrate side first side 821 and the mounting substrate side second side 822. Therefore, the length of the signal transmission path between the imaging chip 100 and the ASIC 52 can be shortened. Since the electronic component 180 such as a connector can be mounted, the length of the flexible substrate connecting the substrate 62 and the mounting substrate 120 can be shortened.

  The pattern shape of the heating conductor pattern 190 is not limited to the above pattern shape. As the pattern shape of the heating conductor pattern 190, various pattern shapes can be applied in addition to the above pattern shape. As the heating conductor pattern 190, various pattern shapes such as a meandering pattern and a spiral pattern can be applied. In addition, as a conductor that generates heat for mounting the mounting component, which is at least one component of the imaging chip 100, the frame 140, and the bonding wire 110, on the mounting substrate 120, not a conductor pattern such as the heating conductor pattern 190, A solid pattern may be applied.

  The camera 10 including the lens unit 20 and the camera body 30 has been described as an example of an imaging apparatus. However, the imaging device may not include the lens unit 20. For example, the camera body 30 is an example of an imaging device. The imaging device is a concept that includes a lens non-exchangeable imaging device in addition to a lens-exchangeable imaging device such as a single-lens reflex camera.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above embodiment. It is apparent from the description of the scope of claims that embodiments with such changes or improvements can be included in the technical scope of the present invention.

  The execution order of each process such as operation, procedure, step, and stage in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the specification, and the drawings, even if it is described using “first”, “next”, etc. for the sake of convenience, it means that it is essential to carry out in this order. It is not a thing.

10 Camera 20 Lens unit 22 Optical axis 24 Lens mount 26 Body mount 30 Camera body 31 Mirror unit 32 Main mirror 33 Sub mirror 38 Shutter unit 40 Imaging unit 51 MPU
52 ASIC
60 mirror box 62 substrate 70 imaging optical system 72 focus detection sensor 80 focus plate 82 penta prism 84 finder optical system 86 finder window 88 display unit 100 imaging chip 101 imaging region 102 peripheral region 110 wire 111 first main surface 112 second main Surface 120 mounting substrate 121 first layer 122 second layer 131 via 132 insulator 138 opening 140 frame 141 first surface 142 second surface 143 third surface 144 fourth surface 145 fifth surface 146 sixth surface 147 positioning hole 148 Mounting hole 149 Screw 150 Bracket 160 Cover glass 180 Electronic component 190 Heating conductor pattern 201, 211 Solder resist layer 202, 204, 212, 214 Wiring layer 203, 205, 213, 215 Insulating layer 207 Core layer 210, 220, 230 Adhesion Part 240 Bonde Radiating pad 260 radiating pad 262 via 301 first conductive pad 302 second conductive pad 303 third conductive pad 304 fourth conductive pad 310, 320, 321, 322, 341, 342 wiring pattern 331, 332, 351, 352, 353 connection wiring 361 Wiring portion 362 Wiring portion 363 Wiring portion 410 First conductor pattern 420 Second conductor pattern 500 Ground line 510 Power line 580 Bypass capacitor 610 Conductor pattern 640 Imaging unit 801 First short side 802 Second short side 803 First long side 804 Second long side 821 Mounting substrate side first side 822 Mounting substrate side second side 823 Mounting substrate side third side 824 Mounting substrate side fourth side 840 Imaging unit

Claims (13)

An imaging chip;
A mounting substrate on which the imaging chip is mounted;
A connection member for electrically connecting the imaging chip and the mounting substrate;
A surrounding member mounted on the mounting substrate and surrounding the imaging chip;
The mounting substrate is
When mounting a mounting component, which is at least one component of the imaging chip, the surrounding member, and the connection member, on the mounting substrate, it is energized to generate heat for mounting the mounting component on the mounting substrate. An imaging unit having a conductor pattern. The conductor pattern is energized when mounting at least one of the imaging chip and the surrounding member on the mounting substrate using a thermosetting adhesive, and generates heat for curing the thermosetting adhesive. The imaging unit according to claim 1, which occurs. The surrounding member is fixed to the mounting substrate with a thermosetting adhesive cured by Joule heat generated by the conductor pattern when energized to the conductor pattern,
The imaging unit according to claim 2, wherein the conductor pattern is provided so as to surround the imaging chip in a plane horizontal to a mounting surface of the imaging chip. The imaging unit according to claim 3, further comprising an optical element fixed to the surrounding member so as to form a sealed space together with the mounting substrate and the surrounding member. The connection member includes a bonding wire connected to a bonding pad formed on the mounting substrate and the imaging chip,
5. The imaging unit according to claim 1, wherein the conductor pattern is energized when the bonding wire is bonded to the bonding pad, and generates heat for heating the bonding pad. 6. The mounting substrate is
A conductive first conductive contact electrically connected to a first position in the wiring direction of the conductor pattern;
A conductive second conductive contact electrically connected to a second position in the wiring direction of the conductor pattern;
When the mounting component is mounted on the mounting substrate, the conductor pattern is applied with a voltage between the first conductive contact and the second conductive contact, and the first conductive contact and the second conductive contact The imaging unit according to claim 1, wherein heat for mounting the mounting component on the mounting board is generated by a current flowing between the mounting unit and the mounting unit. The mounting substrate is
One or more thermally conductive thermal contacts connected to a position between the first position and the second position in the wiring direction of the conductor pattern;
The imaging unit according to claim 6, wherein the thermal contact is thermally coupled to a heat transfer member for radiating heat generated by operation of the imaging chip to the outside of the mounting substrate. The wiring density of the conductor pattern in a mounting region where the mounting component is mounted on the mounting substrate is higher than the wiring density of the conductor pattern in a non-mounting region where the mounting component is not mounted on the mounting substrate. The imaging unit according to claim 7. The cross-sectional area of the conductor pattern in a mounting area where the mounting component is mounted on the mounting board is smaller than the cross-sectional area of the conductor pattern in a non-mounting area where the mounting component is not mounted on the mounting board. The imaging unit according to any one of 1 to 8. The first mounting component and the second mounting component are mounted on the mounting substrate, and the amount of heat required when mounting the first mounting component on the mounting substrate is the same as that of the second mounting component. Larger than the amount of heat required for mounting on the mounting board,
The cross-sectional area of the conductor pattern in the first mounting area where the first mounting component is mounted on the mounting board is the conductor pattern in the second mounting area where the second mounting component is mounted on the mounting board. The imaging unit according to claim 1, wherein the imaging unit has a smaller cross-sectional area. The mounting substrate is
A first surface on which the mounting component is mounted;
A second surface that is a surface opposite to the first surface;
11. The electronic component is mounted on the second surface of the mounting substrate in a region on the first surface opposite to a region where the mounted component is mounted. The imaging unit described.   An imaging device comprising the imaging unit according to any one of claims 1 to 11. Preparing a mounting substrate having a conductor pattern on which an imaging chip is mounted;
At least one component of the imaging chip, a connection member that electrically connects the imaging chip and the mounting substrate, and an encircling member that surrounds the imaging chip when mounted on the mounting substrate Preparing a mounting component,
Energizing the conductor pattern;
Mounting the mounting component on the mounting board by heat generated by the conductor pattern by energizing the conductor pattern.

Images