JP2015002028A - LIGHTING DEVICE AND LIGHTING DEVICE DRIVE CONTROL METHOD - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a luminaire in which a temperature sensor checks the temperature state of LEDs.SOLUTION: A luminaire 1 includes: an LED substrate 5 fitted with LEDs 2 on a top surface 5a thereof; a heat radiation part 6 which is fixed to the reverse surface 5b of the LED substrate 5, and has a plurality of heat radiation fins arrayed annularly around an axis L orthogonal to the LED substrate 5; a thermistor 46 which detects a temperature in an inner periphery-side space 25 surrounded by the heat radiation fins 14; and an LED drive circuit 43 which controls power supply to the LEDs 2 based upon output from the thermistor 46. Heat from the LEDs 2 is conducted to the heat radiation part 6 through the LED substrate 5, and radiated from the heat radiation fins 14 which are arrayed annularly, so a temperature state of the LEDs 2 can be checked by detecting the temperature in the inner periphery-side space 25 surrounded by the heat radiation fins 14 by the thermistor 46.

Description

  The present invention relates to an illumination device including a temperature sensor that monitors a heat generation state of an LED, and a drive control method thereof.

  An illumination device using an LED as a light source is described in Patent Document 1. The illuminating device of the document has an LED substrate on which LEDs are mounted, and a heat dissipation unit including a heat dissipation unit and a cooling fan. The heat dissipation part includes a partition plate that contacts the LED substrate and a heat sink that contacts the partition plate from the opposite side of the LED substrate, and the heat sink includes a plurality of heat dissipation fins arranged in an annular shape around an axis perpendicular to the LED substrate. I have. The cooling fan is arranged on the inner peripheral side of the plurality of heat radiating fins with the air blowing port directed toward the LED substrate. The heat generated in the LED is transmitted to the heat radiating part through the LED substrate, and is released from the partition plate and the heat sink. Further, heat radiation from the partition plate and the heat sink is promoted by the air flow generated by the cooling fan. As a result, the LED is cooled, so that it is possible to prevent the LED from being damaged or the life of the element from being shortened due to its own heat generation.

  Among devices using LEDs as light sources, a temperature sensor is arranged in the vicinity of the LEDs to detect the temperature in the device, and the power supply to the LEDs is controlled based on the detected temperature, thereby suppressing the heat generation of the LEDs. There is something that is. Patent Literature 2 describes a display device that performs such control.

JP 2011-187264 A JP 2006-119184 A

  Here, in order to make the protection of the LED more reliable, it is conceivable that a temperature sensor is also mounted in the lighting device, and the power supply to the LED is controlled based on the output from the temperature sensor. However, when the temperature sensor is mounted on the lighting device, it becomes a problem as to what part of the lighting device can detect the temperature state of the LED.

  In view of the above points, an object of the present invention is to provide an illumination device that grasps the temperature state of an LED using a temperature sensor. Another object of the present invention is to propose a drive control method for an illumination device that can prevent the LED from being damaged due to heat generation.

  In order to solve the above-described problems, an illumination device of the present invention includes an LED substrate having an LED attached to the front surface, and a cylindrical portion that is fixed to the back surface of the LED substrate and extends in the thickness direction of the LED substrate. It has a heat radiation part and a temperature detection part which detects the temperature of the inner circumference side space of the cylindrical part.

  According to the present invention, the heat from the LED is transmitted to the heat radiating part via the LED substrate, and released through the cylindrical part. Therefore, the temperature state of the LED can be grasped by detecting the temperature in the inner circumferential space of the cylindrical portion by the temperature sensor.

  In this invention, it has a cooling fan provided with the air blowing outlet which faced the side of the said LED board in the said inner peripheral side space, The said temperature detection part is more than the said air blowing outlet in the thickness direction of the said LED board. It is desirable that the LED substrate is disposed away from the LED substrate. If it does in this way, it can prevent that the airflow formed with a cooling fan is sprayed directly on a temperature detection part. Therefore, it can suppress that the airflow formed with a cooling fan influences the output of a temperature detection part.

  In this invention, it has the shielding member which covers the said temperature detection part partially, and the said shielding member is a side of the said temperature detection part from the mounting surface in which the said temperature detection part was mounted, and the said mounting surface And a wall surface surrounding the temperature detecting portion. In this way, it is possible to further suppress the airflow formed by the cooling fan from affecting the output of the temperature detection unit.

  In this invention, it has a circuit board, The said heat radiating part is equipped with the heat sink which is contact | abutting to the edge part on the opposite side to the said LED board of the said cylindrical part, The said circuit board is the said heat sink. It is attached to the surface opposite to the cylindrical portion, the temperature detection unit is mounted on the surface of the circuit board on the cylindrical portion side, and the heat sink has a thickness direction of the LED substrate A through-hole penetrating in the thickness direction at a position overlapping with the temperature detection unit when viewed from above, the circuit board and the heat sink constitute the shielding member, Preferably, the surface is a mounting portion of the temperature detection unit on the surface of the circuit board on the cylindrical portion side, and the wall surface is an inner peripheral surface of the through hole. If it does in this way, it will become easy to partially cover a temperature detection part with a shielding member. Further, the temperature detection unit can be mounted on the circuit board.

  In the present invention, the inner peripheral space has a circular shape when viewed from the thickness direction of the LED board, and the cooling fan has one end in the thickness direction of the LED board serving as an air suction port. The outer end of which is a polygonal outer frame serving as the air outlet, and is fixed to the heat sink with the one end in contact with the heat sink. Is provided with a heat sink through hole communicating with the air suction port, the circuit board is provided with a substrate through hole communicated with the heat sink through hole, and the temperature detector is viewed from the thickness direction of the LED substrate. Sometimes, it is desirable to be located between the outer frame and the cylindrical portion. If it does in this way, it can control that the air current formed by a cooling fan influences a temperature detection part.

  In the present invention, it is desirable that the cylindrical portion is composed of a plurality of heat radiation fins arranged in an annular shape around an axis perpendicular to the LED substrate. If a cylindrical part is comprised from a some heat radiating fin, the surface area of a heat radiating part will increase. In addition, the airflow formed by the cooling fan passes between adjacent heat dissipating fins. Therefore, heat dissipation from the heat dissipation part can be promoted.

  In the present invention, the cooling fan is disposed close to each heat radiation fin so that a corner of the outer frame is inscribed in a virtual circle formed by connecting inner end portions of the plurality of heat radiation fins. It is desirable. In this way, the outer peripheral side of the outer frame in the inner peripheral space is surrounded by the wall portion that forms one side between the corners of the outer frame and the inner peripheral end portions of the plurality of radiating fins. A compartment (space) is formed. In such a section, since air convection hardly occurs, the temperature of the inner space can be accurately detected by the temperature detection unit.

  In the present invention, in order to suppress the heat generation of the LED, it is desirable to have an LED drive circuit that controls power supply to the LED based on an output from the temperature detection unit.

  In the present invention, it is preferable that a power supply stop circuit for stopping power supply to the LED when the power supply current exceeds a preset value is mounted on the circuit board. If it does in this way, when abnormal electric power is supplied to an illuminating device, it can prevent that LED is damaged.

  Next, the present invention provides an LED substrate having an LED mounted on the front surface, a heat dissipating portion that is fixed to the back surface of the LED substrate, and includes a tubular portion extending in the thickness direction of the LED substrate, and the tubular portion. And a cooling fan having an air outlet facing the LED board in the inner peripheral space of the lighting device, in the drive control method of the lighting device, at a position farther from the LED board than the air outlet The temperature of the inner space is monitored and the power supply current is monitored, and the power supply to the LED is controlled based on the temperature. When the power supply current exceeds a preset value, the LED is And the power supply to the cooling fan are stopped.

  According to the present invention, the temperature in the inner peripheral space of the cylindrical portion to which heat from the LED is transmitted through the LED substrate is monitored at a position where it is not directly exposed to the air blown out from the air outlet of the cooling fan. To do. Therefore, it is possible to grasp the temperature state of the LED while suppressing the influence of the airflow formed by the cooling fan, and to control the power supply to the LED. Thereby, since it is possible to avoid the LED from excessively generating heat, it is possible to prevent the LED from being damaged or the life of the element from being shortened due to its own heat generation. In addition, when an abnormal power supply current is detected, power supply to the LED is stopped, so that it is possible to prevent the LED from being damaged due to an abnormality in the power supply power supplied to the lighting device.

  According to the present invention, the temperature state of the LED can be grasped by the temperature sensor. Moreover, it is possible to prevent the LED from being damaged due to heat generation.

It is a perspective view at the time of seeing the illuminating device to which this invention is applied from the downward direction. It is the perspective view and side view of an illuminating device main body. It is a disassembled perspective view of an illuminating device main body. It is a perspective view which shows the state which removed the heat sink from the illuminating device main body. It is sectional drawing of the illuminating device main body in the XX line of FIG.2 (b). It is a block diagram of a feed circuit. It is a longitudinal cross-sectional view of an illuminating device main body.

(overall structure)
Hereinafter, an illumination device according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a lighting device to which the present invention is applied as viewed from below. The illumination device 1 is a downlight that can be installed in place of a mercury lamp or the like, and uses an LED 2 as a light source. In the following description, as shown in FIG. 1, the upper and lower sides of the illumination device 1 will be described with the light projecting direction set downward.

  The lighting device 1 has a lighting device body 3 and a reflector 4 fixed to the lower side of the lighting device body 3. The illuminating device body 3 includes an LED substrate 5 on which the LED 2 is mounted, a heat dissipating unit 6 disposed above the LED substrate 5, and a cap 7 disposed above the heat dissipating unit 6. The LED substrate 5 is attached to the lower end surface of the heat radiation part 6 with the surface 5a on which the LED 2 is mounted facing downward. The reflector 4 includes a cylindrical reflector body 8 having a diameter that expands downward, and two legs 9 that extend upward from the outer peripheral surface portion of the reflector body 8. The two leg portions 9 are provided at positions that are separated by 180 ° around the reflector body 8. The reflector 4 is fixed to the illuminating device main body 3 by attaching the upper end portions of the leg portions 9 to the illuminating device main body 3 in a state where the LED 2 is positioned on the inner peripheral side of the upper end opening of the reflector main body 8. .

(Lighting device body)
FIG. 2A is a perspective view of the lighting device main body 3 when viewed from below, and FIG. 2B is a side view of the lighting device main body 3. FIG. 3 is an exploded perspective view of the lighting device body 3. FIG. 4 is a perspective view showing a state in which the heat sink is removed from the lighting device body 3. FIG. 5 is a cross-sectional view of the illuminating device main body taken along the line XX of FIG.

  As shown to Fig.2 (a), the LED board 5 is a rectangle, and several LED2 is arranged in the center part of the surface 5a.

  As shown in FIG. 2, the heat dissipating part 6 includes a lower heat dissipating plate 11 and an upper heat dissipating plate 12 that are arranged in parallel with each other at positions separated in the vertical direction, and between the lower heat dissipating plate 11 and the upper heat dissipating plate 12. A heat sink 13 is provided. As shown in FIG. 3, the heat sink 13 includes a plurality of radiating fins 14 arranged in an annular shape and a circular bottom plate 15 connecting the lower end side portions of the inner peripheral side end portions 14 b of the radiating fins 14. ing. The plurality of heat radiating fins 14 form a cylindrical portion 10 extending in the thickness direction of the LED substrate 5. Each radiating fin 14 is a rectangular thin plate except for five radiating fins on which a fixing portion for fixing the lower radiating plate 11 and the upper radiating plate 12 and the heat sink 13 is formed. As shown in FIG. 2, the lower heat radiating plate 11 is in contact with the lower end surface 14 d of each radiating fin 14 (the end of the tubular portion 10 on the LED substrate 5 side) and the lower end surface of the bottom plate 15. The upper heat radiating plate 12 is in contact with the upper end surface 14e of each radiating fin 14 (the end of the cylindrical portion 10 on the circuit board 21 side). The lower heat radiating plate 11, the upper heat radiating plate 12, and the heat sink 13 are all made of aluminum.

  As shown in FIGS. 2A and 3, the lower radiator plate 11 is a circular plate member having a certain thickness. The LED substrate 5 is fixed to the lower surface of the lower heat radiating plate 11 with the back surface 5b in contact therewith. The LED substrate 5 and the lower heat radiating plate 11 are parallel to each other, and the plurality of heat radiating fins 14 of the heat sink 13 are arranged in an annular shape around an axis L orthogonal to the LED substrate 5. The lower heat sink 11 and the heat sink 13 are arranged coaxially and have the same diameter. Therefore, the outer peripheral end 14 a of each radiating fin 14 and the outer peripheral end of the lower radiating plate 11 are in the same position in the direction orthogonal to the axis L.

  As shown in FIG. 3, the upper radiator plate 12 has an annular shape, and includes a circular radiator plate through-hole 16 penetrating in the center portion in the direction of the axis L (thickness direction of the LED substrate). The upper radiator plate 12 and the heat sink 13 are arranged coaxially, and their diameters are equal. Therefore, the outer peripheral end 14a of each radiating fin 14 and the outer peripheral end of the upper radiating plate 12 are in the same position in the direction orthogonal to the axis L. On the other hand, the inner peripheral end 14 b of the upper radiator plate 12 is located on the inner peripheral side of the inner peripheral end 14 b of each radiating fin 14. Therefore, the opening diameter of the heat radiating plate through-hole 16 of the upper heat radiating plate 12 is formed by connecting the inner peripheral side end portions 14b of the plurality of radiating fins 14 when the plurality of radiating fins 14 are viewed from the direction of the axis L. It is smaller than the diameter of the virtual circle 14c. In the inner heat dissipating plate 12, the inner peripheral end portion 17 that protrudes to the inner peripheral side from the inner peripheral end portion 14 b of each radiating fin 14 has fan fixing through-holes 18 at four equiangular intervals around the axis L. Is provided.

  A circuit board 21 is placed on the upper surface of the upper radiator plate 12. The circuit board 21 has an annular shape and is provided with a square-shaped board through hole 22 penetrating in the direction of the axis L in the center portion. The circuit board 21 is disposed at a position where the board through hole 22 overlaps the heat sink through hole 16 of the upper heat sink 12 when viewed from the direction of the axis L, and the board through hole 22 and the heat sink through hole 16 communicate with each other. ing. When the state in which the circuit board 21 is superimposed on the upper radiator plate 12 is viewed from above in the direction of the axis L, the radiator plate through hole 16 is an inscribed circle of the substrate through hole 22, and the upper radiator plate 12 The provided fan fixing through hole 18 is located on the inner peripheral side of the four corners of the heat sink through hole 16. The outer diameter dimension of the circuit board 21 is shorter than the outer diameter dimension of the upper heat sink 12, and the outer peripheral edge of the circuit board 21 is located on the inner peripheral side from the outer peripheral edge of the upper heat sink 12. Therefore, the outer peripheral edge portion 12a of the upper radiator plate 12 is exposed upward.

  As shown in FIG. 4, a cooling fan 26 is disposed in the inner circumferential space 25 of the cylindrical portion 10, that is, the inner circumferential space 25 surrounded by the plurality of heat radiation fins 14. The inner space 25 has a circular shape when viewed from the direction of the axis L. The cooling fan 26 has a rectangular parallelepiped shape as a whole, and includes an outer frame 27 having a square shape when viewed from the direction of the axis L. The four walls of the outer frame 27 constituting each side of the quadrangle have an outer wall surface parallel to the axis L. In the outer frame 27, the upper end portion 27 a in the axis L direction is an air suction port 28 (see FIG. 3), and the lower end portion 27 b is an air blowing port 29. As shown in FIG. 5, the length of the diagonal line of the outer frame 27 is the diameter of a virtual circle 14 c formed by connecting the inner peripheral side ends 14 b of the plurality of radiating fins 14 when viewed from the direction of the axis L. The four corners of the outer frame 27 are opposed to the inner peripheral side end portion 14b of the cooling fin with a slight gap. That is, the cooling fan 26 is disposed in the vicinity of each radiating fin 14 so that the corners 27c to 27f of the outer frame 27 are inscribed in the virtual circle 14c. Accordingly, four sections 31 to 34 are formed on the outer peripheral side of the outer frame 27 in the inner peripheral space 25. Each section (the first section 31, the second section 32, the third section 33, and the fourth section 34) has an arc portion of an imaginary circle 14c formed by the inner peripheral side end portions 14b of the plurality of radiating fins 14 and an outer portion. The frame 27 is surrounded by one side.

  As shown in FIG. 3, screw holes 35 for fixing the cooling fan 26 are provided at the four corners of the upper end portion 27 a of the outer frame 27. The cooling fan 26 is fixed to the upper heat radiating plate 12 with the air suction port 28 communicating with the heat radiating plate through hole 16 of the upper heat radiating plate 12 and with the upper end in contact with the upper heat radiating plate 12. More specifically, the cooling fan 26 includes four head screws (not shown) that pass through the fan fixing through holes 18 of the upper radiator plate 12 from above and are screwed into the screw holes 35 of the outer frame 27. ) To the upper radiator plate 12. The air outlet 29 of the cooling fan 26 faces downward (the LED substrate 5 side) at a position closer to the upper radiator plate 12 than the bottom plate 15 of the heat sink 13. That is, the height dimension from the upper surface of the bottom plate 15 of the heat sink 13 to the air outlet 29 is ½ of the height dimension of the inner space 25 extending from the upper surface of the bottom plate 15 of the heat sink 13 to the upper end of the radiating fin 14. Is also long (see FIG. 7).

  Here, as shown in FIG. 3, a power supply circuit 42 including a plurality of electronic components 41 is formed on the upper surface of the circuit board 21 placed on the upper heat radiating plate 12. The power supply circuit 42 includes an LED drive circuit 43 (first drive circuit) that drives the LED 2, a cooling fan drive circuit 44 (second drive circuit) that drives the cooling fan 26, and a power supply stop circuit 45. The LED drive circuit 43 controls power supply to the LED 2 based on the output of the thermistor (temperature detection unit) 46 that detects the temperature of the inner circumferential space 25. The cooling fan drive circuit 44 rotates the cooling fan 26 at a constant speed. The power supply stop circuit 45 monitors the power supply current supplied to the power supply circuit 42, and stops power supply to the LED 2 when the power supply current exceeds a preset set value.

  On the lower surface of the circuit board 21, an LED wiring connector 52 for detachably connecting an LED wiring 51 for electrically connecting the LED driving circuit 43 and the LED 2, a cooling fan driving circuit 44 and the cooling fan 26 are electrically connected. A cooling fan wiring connector 54 and a thermistor 46 for detachably connecting the cooling fan wiring 53 to be connected to are mounted. The mounting positions of the LED wiring connector 52, the cooling fan wiring connector 54, and the thermistor 46 are all located closer to the inner peripheral side than the inner peripheral end portions 14b of the plurality of radiating fins 14 when viewed from the direction of the axis L. doing.

  The LED wiring connector 52 and the cooling fan wiring connector 54 are respectively mounted on one side and the other side with the substrate through hole 22 interposed therebetween. The upper heat radiating plate 12 is provided with one connector through hole 55 on one side and the other side of the heat radiating plate through hole 16 therebetween. As shown in FIG. 4, in a state where the circuit board 21 is placed on the upper heat radiating plate 12, the LED wiring connector 52 projects into the inner circumferential space 25 through one connector through hole 55, and is used for the cooling fan. The wiring connector 54 projects into the inner circumferential space 25 through the other connector through hole 55. The protruding portions of the LED wiring connector 52 and the cooling fan wiring connector 54 are located on the outer peripheral side of a pair of outer wall portions extending in parallel in the outer frame 27 of the cooling fan 26. As shown in FIG. 5, the protruding portions of the LED wiring connector 52 and the cooling fan wiring connector 54 include the cooling fan 26 among the four sections 31 to 34 on the outer peripheral side of the outer frame 27 in the inner peripheral space 25. Projecting into the first compartment 31 and the second compartment 32 on both sides sandwiched therebetween.

  As shown in FIGS. 3 to 5, the LED wiring 51 is drawn upward from the LED substrate 5 through a wiring through hole 56 provided in the lower heat sink 11. Further, the LED wiring 51 drawn upward through the wiring through-hole 56 is routed along the side surface and the top surface of the bottom plate 15 of the heat sink 13 and bent toward the inner peripheral side, and then extends upward. In addition, the LED is connected to the LED wiring connector 52 via the space between the outer frame 27 of the cooling fan 26 and the inner peripheral side end portion 14b of the radiating fin 14 (first section 31). The cooling fan wiring 53 is drawn from the lower end portion of the cooling fan 26 and passes between the outer frame 27 of the cooling fan 26 and the inner peripheral side end portion 14b of the radiating fin 14 (second section 32). It is connected to the wiring connector 54. According to this configuration, it is not necessary to route both the LED wiring 51 and the cooling fan wiring 53 on the outer peripheral side of the radiating fins 14, so that the wirings 51 and 53 are well accommodated. Furthermore, since the LED wiring 51 and the cooling fan wiring 53 can be positioned on the inner peripheral side with respect to the inner peripheral side end portion 14b of the radiating fin 14, each of the wirings 51 and 53 can be protected, and the lighting device Each wiring 51, 53 does not get in the way when installing 1.

  As shown in FIGS. 4 and 5, a thermistor through-hole 61 that penetrates the upper radiator plate 12 in the axis L direction is formed at a position overlapping the thermistor 46 when viewed from the axis L direction in the upper radiator plate 12. ing. The thermistor 46 is exposed to the inner circumferential space 25 through the thermistor through hole 61. In other words, the circuit board 21 and the upper radiator plate 12 constitute a shielding member 60 that partially covers the thermistor 46. That is, the thermistor 46 has an annular shape of a lower surface portion (mounting surface) 21 a on which the thermistor 46 is mounted on the lower surface of the circuit board 21, and a thermistor through hole 61 that extends from the lower surface portion toward the thermistor 46 and surrounds the thermistor 46. It is partially surrounded by an inner peripheral surface (annular wall surface) 61a. Here, as shown in FIG. 5, the thermistor 46 and the thermistor through hole 61 are formed between the outer frame 27 of the cooling fan 26 and the inner peripheral side end portion 14 b of the radiating fin 14 when viewed from the direction of the axis L (first It is exposed to 3 sections 33). More specifically, the thermistor 46 and the thermistor through-hole 61 are different from the pair of outer wall portions sandwiched between the LED wiring connector 52 and the cooling fan wiring connector 54 in the outer frame 27 of the cooling fan 26. It is located in the outer peripheral side of the outer wall part of this, and the inner peripheral side of the several radiation fin 14 arrange | positioned at annular | circular shape. In such a section, air convection hardly occurs, so the thermistor 46 can accurately detect the temperature of the inner circumferential space.

  As shown in FIGS. 2 to 4, the cap 7 includes a cap body 65 having a circular shape viewed from the direction of the axis L and three fixing portions 66 projecting downward from the outer peripheral edge portion 12 a of the cap body 65. . The cap body 65 has a bowl shape with the opening 62a facing downward. The fixing portions 66 are provided at equiangular intervals around the axis L.

  The cap 7 is disposed coaxially with the heat radiating portion 6 and is fixed to the heat radiating portion 6. More specifically, in the cap 7, the cap body 65 covers the radiator plate through hole 16, the substrate through hole 22 and the circuit board 21 from above, and the lower end surface of each fixing portion 66 is the outer peripheral edge portion 12 a of the upper radiator plate 12. And is fixed to the upper heat radiating plate 12. In a state where the cap 7 is mounted on the heat radiating portion 6, a gap 67 is formed between the outer peripheral edge of the cap 7 and the heat radiating portion 6. That is, the part located between each fixing | fixed part 66 in the circumferential direction becomes the clearance gap 67 between the cap main body 65 and the upper side heat sink 12.

(Power supply circuit)
FIG. 6 is a block diagram of the power feeding circuit 42. The power feeding circuit 42 receives a power monitoring power 71 supplied from the power supply line 70 and outputs a power having a predetermined voltage. The current monitoring circuit 71 monitors the current value of the power supply current supplied via the power supply line 70. A regulator circuit 72 is provided. A cooling fan control circuit 73 that receives power from the regulator circuit 72 to drive the cooling fan 26; an LED control circuit 74 that receives power from the regulator circuit 72 and outputs a drive signal for driving the LED 2; A power supply circuit 75 that supplies power from the power supply line 70 to the LED 2 based on the drive signal is provided. Outputs from the thermistor 46 and the current monitoring circuit 71 are input to the LED control circuit 74. In this example, the thermistor 46 is of a type whose resistance value decreases with increasing temperature. The regulator circuit 72, the LED control circuit 74, and the power supply circuit 75 constitute the LED drive circuit 43. The regulator circuit 72 and the cooling fan control circuit 73 constitute a cooling fan drive circuit 44. The current monitoring circuit 71, the LED control circuit 74, and the power supply circuit 75 constitute a power supply stop circuit 45.

  The LED control circuit 74 and the power supply circuit 75 are circuits for PWM driving the LED 2, and the LED control circuit 74 outputs a PWM signal to the power supply circuit 75 as a drive signal. The LED control circuit 74 reduces the duty ratio of the PWM signal when the temperature of the inner circumferential space 25 rises and the resistance value of the thermistor 46 decreases and the output from the thermistor 46 exceeds a preset threshold value. The electric power supplied to LED2 is reduced. In this example, the LED control circuit 74 sets the duty ratio of the PWM signal in the initial state to 100%, and switches the duty ratio to 50% when the output from the thermistor 46 exceeds a preset threshold value. As a result, the LED control circuit 74 reduces the power supplied to the LED 2 via the power supply circuit 75. On the other hand, the LED control circuit 74 increases the duty ratio of the PWM signal when the resistance value of the thermistor 46 rises and the output from the thermistor 46 falls below the threshold when the temperature of the inner space 25 once raised falls. Let In this example, the duty ratio of the PWM signal supplied to the LED 2 is returned from 50% to 100%. As a result, the LED control circuit 74 increases the power supplied to the LED 2 via the power supply circuit 75 and restores the power.

  The LED control circuit 74 controls power supply to the LED 2 based on the output of the current monitoring circuit 71. In this example, when the power supply current exceeds a preset value, an abnormal current detection signal is output from the current monitoring circuit 71. Therefore, the LED control circuit 74 stops the drive signal based on the abnormal current detection signal. As a result, power supply to the LED 2 via the power supply circuit 75 is stopped.

  The cooling fan control circuit 73 is a circuit that drives the cooling fan 26 by PWM, and rotates the cooling fan 26 at a constant speed.

(Operation of lighting device)
FIG. 7 is a longitudinal sectional view of the illuminating device body 3. When power is supplied to the lighting device 1, power is supplied to the LED 2 via the LED drive circuit 43, and the LED 2 emits light. In addition, power is supplied to the cooling fan 26 via the cooling fan drive circuit 44, and the cooling fan 26 operates. Furthermore, detection of the temperature of the inner circumferential space 25 by the thermistor 46 and monitoring of the power supply current by the current monitoring circuit 71 are started. In an initial state where power supply to the lighting device 1 is started, the duty ratio of the PWM signal supplied from the LED control circuit 74 to the power supply circuit 75 is 100%.

  As the LED 2 and the cooling fan 26 are supplied with power, the LED driving circuit 43 and the cooling fan driving circuit 44 on which the regulator circuit 72 is mounted generate heat. Further, the LED 2 generates heat as the LED 2 emits light.

  Here, the heat of the LED drive circuit 43 and the cooling fan drive circuit 44 is transmitted from the circuit board 21 to the heat sink 13 via the upper heat radiating plate 12 and is released from the heat radiating fins 14. The heat of the LED 2 is transmitted from the LED substrate 5 to the heat sink 13 via the lower heat radiating plate 11 and is released from the heat radiating fins 14. In this example, the heat radiating portion 6 including the heat radiating fins 14 is in contact with both the LED board 5 and the circuit board 21, and the heat radiating fins for cooling the LED 2 and the heat radiating fins for cooling the drive circuits 43 and 44 are used. 14 need not be provided separately, heat radiation from the LED 2 and the drive circuits 43 and 44 can be promoted with a simple configuration.

  Further, when the cooling fan 26 is operated, as indicated by an arrow in FIG. 7, the gap 67 between the outer peripheral edge of the cap 7 and the heat radiating portion 6 is passed through the heat radiating plate through hole 16 and the substrate through hole 22 to the inner peripheral side. An airflow A that is sucked into the space 25 and directed toward the LED substrate 5 is formed. The airflow A collides with the bottom plate 15 of the heat sink 13 to change its direction, and is discharged to the outside of the lighting device 1 through a plurality of heat radiation fins 14. Thereby, since the heat radiation from the radiation fin 14 is promoted, the heat radiation from the LED drive circuit 43 and the cooling fan drive circuit 44 and the heat radiation from the LED 2 are efficiently performed. Furthermore, since the airflow A generated by the cooling fan 26 passes through the upper surface of the circuit board 21, the LED drive circuit 43 and the cooling fan drive circuit 44 are exposed to the airflow A. Therefore, heat radiation from the LED drive circuit 43 and the cooling fan drive circuit 44 is promoted.

  Next, when the environmental temperature of the place where the lighting device 1 is installed is high, when the lighting device 1 is turned on for a long time, the LED 2 cannot be released sufficiently, and the LED 2 is excessive. May become hot. In such a case, the heat of the LED 2 transmitted from the LED substrate 5 to the heat sink 13 via the lower heat radiating plate 11 raises the temperature of the inner circumferential space 25 surrounded by the plurality of heat radiating fins 14. An increase in the temperature of the inner circumferential space 25 is detected by the thermistor 46.

  Here, the thermistor 46 is arranged on the outer peripheral side of the outer frame 27 of the cooling fan 26 and at a position farther from the LED substrate 5 than the air outlet 29. Therefore, the airflow A formed by the cooling fan 26 is not directly blown to the thermistor 46, and the thermistor 46 can detect the temperature of the inner circumferential space 25 at a position where the influence of the airflow A formed by the cooling fan 26 is small. Further, since the thermistor 46 is disposed in the recess 62 in which the opening 62a is exposed in the inner circumferential space 25, the influence from the airflow A formed by the cooling fan 26 can be further eliminated. Therefore, in this example, the heat generation state of the LED 2 can be accurately grasped based on the output from the thermistor 46. In this example, since the thermistor 46 is mounted on the lower surface of the circuit board 21 having the LED drive circuit 43 formed on the surface, the electrical connection between the LED drive circuit 43 and the thermistor 46 is easy. Furthermore, in this example, the thermistor 46 is exposed to the inner circumferential space 25 through the thermistor through-hole 61 formed in the upper radiator plate 12, and it is easy to dispose the thermistor 46 in the recess 62. .

  Thereafter, when the resistance value of the thermistor 46 decreases due to a rise in the temperature of the inner circumferential space 25 and the output from the thermistor 46 exceeds the threshold value, the LED control circuit 74 sets the duty ratio of the PWM signal supplied to the power supply circuit 75. Reduce. In this example, the duty ratio of the PWM signal is reduced from 100% to 50%. Thereby, since the electric power supplied to LED2 reduces, the heat_generation | fever of LED2 is suppressed. Therefore, it is possible to prevent the LED 2 from being damaged or the life of the LED 2 from being shortened due to its own heat generation.

  After that, when the temperature of the inner circumferential side space 25 once increased falls, the decrease in the temperature of the inner circumferential side space 25 increases the resistance value of the thermistor 46. Thereafter, when the output from the thermistor 46 becomes equal to or lower than the threshold value due to the increase in the resistance value, the LED control circuit 74 increases the duty ratio of the PWM signal supplied to the power supply circuit 75. In this example, the duty ratio of the PWM signal is returned from 50% to 100%. Thereby, the same electric power as in the initial state is supplied to the LED 2.

  In addition, when an abnormal power is supplied to the lighting device 1 when an abnormality occurs in the power supply device that supplies power to the lighting device 1, the current monitoring circuit 71 detects a power supply current exceeding the set value. . In this case, since an abnormal current detection signal is input from the current monitoring circuit 71 to the LED drive circuit 43, the LED control circuit 74 stops power supply to the LED2. As a result, it is possible to prevent a large current exceeding a specified value from flowing through the LED 2, and thus it is possible to prevent the LED 2 from being damaged when abnormal power is supplied from the power supply device.

  According to this example, it is possible to grasp the temperature state of the LED 2 while suppressing the influence of the airflow A formed by the cooling fan 26 and control the power supply to the LED 2. Thereby, since it can avoid that LED2 heat | fever-generates excessively, it can prevent that LED2 is damaged due to self heat_generation | fever or the lifetime of an element is shortened. In addition, when an abnormal power supply current is detected, power supply to the LED 2 and the cooling fan 26 is stopped, so that it is possible to prevent the LED 2 from being damaged due to an abnormality in the power supply power supplied to the lighting device 1.

(Other embodiments)
In the above example, the cooling fan 26 including the rectangular outer frame 27 is used. For example, when viewed from the direction of the axis L, a virtual fan formed by the inner peripheral side end portions 14b of the plurality of radiating fins 14 is used. A cooling fan 26 including a circular outer frame 27 having a diameter smaller than the diameter of the circle 14c can be used. Moreover, the cooling fan 26 provided with the polygonal outer frame 27 other than a rectangle can also be used. If the cooling fan 26 having the outer frame 27 having such a shape is mounted, a space is formed between the cooling fan 26 and the inner peripheral side end portions 14b of the plurality of radiating fins 14. Utilizing this, the LED wiring 51 and the cooling fan wiring 53 can be routed. Further, the thermistor 46 can be arranged in this space.

  In the above example, the LED 2 is driven and controlled based on the output from the thermistor 46, but the cooling fan 26 may be driven and controlled based on the output from the thermistor 46. In this case, for example, it is possible to perform control such as increasing the number of rotations of the cooling fan 26 as the temperature of the inner circumferential space 25 increases and the resistance value of the thermistor 46 decreases.

  Furthermore, when the power supply current supplied to the illuminating device 1 exceeds a set value, the power supply to the cooling fan 26 can be stopped together with the power supply to the LED 2. That is, the abnormal current detection signal output from the current monitoring circuit 71 is input to the cooling fan control circuit 73, and the cooling fan control circuit 73 stops power supply to the cooling fan 26 when the abnormal current detection signal is input. Can be configured.

  In the above example, the thermistor 46 is used to detect the temperature of the inner circumferential space 25. However, a temperature sensor different from the thermistor 46 is used, and power is supplied to the LED 2 based on the output from the temperature sensor. Can also be controlled.

  Furthermore, in the above example, the air outlet 29 of the cooling fan 26 faces the LED board 5 and the air inlet 28 faces the circuit board 21, but the cooling fan 26 is turned upside down, It is also possible to arrange the air outlet 29 so that it faces the circuit board 21 and the air inlet 28 faces the LED board 5.

  According to such a configuration, when the cooling fan 26 operates, the cooling fan 26 is sucked into the inner circumferential space 25 from the outer peripheral side of the radiating fin 14, and the upper surface of the circuit board 21 through the radiating plate through hole 16 and the substrate through hole 22. And an air flow is formed that is discharged to the outside through a gap 67 between the outer peripheral edge of the cap 7 and the heat radiating portion 6. Also by the air flow, heat radiation from the heat radiation fins 14 is promoted, and thus heat radiation from the LED drive circuit 43 and the cooling fan drive circuit 44 is promoted. Also in this configuration, it is not necessary to route the LED wiring 51 and the cooling fan wiring 53 on the outer peripheral side of the radiating fin 14, so that these wirings can be stored well and the wiring can be protected. These wirings do not get in the way of installation. Further, even in this configuration, since the airflow formed by the cooling fan 26 is not directly blown to the thermistor 46, the thermistor 46 controls the temperature of the inner circumferential space 25 at a position where the influence of the airflow formed by the cooling fan 26 is small. It can be detected.

  In this example, the heat sink 13 includes the cylindrical portion 10 constituted by a plurality of plate-like heat radiating fins 14, but the cylindrical portion constituted by a plurality of circular columns arranged in an annular shape is provided. A heat sink can also be mounted. Further, in the above example, the cylindrical portion 10 has a circular outline viewed from the direction of the axis L, but may have a polygonal outline.

DESCRIPTION OF SYMBOLS 1 ... Illuminating device 5 ... LED board 5a ... LED board front surface 5b ... LED board back surface 6 ... Heat radiation part 10 ... Cylindrical part 12 ... Upper heat sink (Heat radiation) Board)
14 ... Radiating fin 14c ... Virtual circle 14e ... Upper end surface of the radiating fin (the end of the cylindrical part opposite to the LED substrate side)
16 ... Heat sink through hole 21 ... Circuit board 21a ... Lower surface portion (mounting surface) of the circuit board
22 ... Substrate through hole 25 ... Inner peripheral space 26 ... Cooling fan 27 ... Outer frame 27c-27f ... Outer frame corner 28 ... Air suction port 29 ... Air blowing Port 43 ... LED drive circuit 45 ... Power supply stop circuit 46 ... Thermistor (temperature detector)
60 ... Shielding member 61 ... Thermistor through hole (through hole)
61a: An annular inner peripheral surface (annular wall surface) of the through hole for the thermistor
62 ... Recess 62a ... Open L of recess ... Axis

Claims (10)

An LED substrate with LEDs mounted on the surface;
A heat dissipating part that is fixed to the back surface of the LED substrate and includes a cylindrical part extending in the thickness direction of the LED substrate;
A temperature detection unit configured to detect the temperature of the inner circumferential space of the cylindrical part. In claim 1,
A cooling fan having an air outlet facing the LED substrate in the inner circumferential space;
The temperature detection unit is arranged at a position farther from the LED board than the air outlet in the thickness direction of the LED board. In claim 1 or 2,
A shielding member partially covering the temperature detection unit;
The shielding member includes a placement surface on which the temperature detection unit is placed, and a wall surface that extends from the placement surface toward the temperature detection unit and surrounds the temperature detection unit. A lighting device. In claim 3,
Having a circuit board,
The heat dissipating part includes a heat dissipating plate that is in contact with an end of the tubular part opposite to the LED substrate,
The circuit board is attached to the surface of the heat sink opposite to the cylindrical portion,
The temperature detection unit is mounted on a surface of the circuit board on the cylindrical part side,
The heat sink is provided with a through-hole penetrating in the thickness direction at a position overlapping with the temperature detection unit when viewed from the thickness direction of the LED substrate,
The circuit board and the heat sink constitute the shielding member,
The mounting surface is a mounting portion of the temperature detection unit on the surface of the cylindrical part of the circuit board,
The lighting device according to claim 1, wherein the wall surface is an inner peripheral surface of the through hole. In claim 4,
The inner circumferential space has a circular shape when viewed from the thickness direction of the LED substrate,
The cooling fan includes a polygonal outer frame in which one end in the thickness direction of the LED board is an air suction port and the other end is the air blowing port, and the one end is It is fixed to the heat radiating plate in contact with the heat radiating plate,
The heat radiating plate includes a heat radiating plate through hole communicating with the air suction port,
The circuit board includes a substrate through hole communicating with the heat sink through hole,
The illumination device according to claim 1, wherein the temperature detection unit is positioned between the outer frame and the cylindrical part when viewed from the thickness direction of the LED substrate. In claim 5,
The said cylindrical part is comprised from the some heat radiating fin arranged in the annular | circular shape around the axis line orthogonal to the said LED board | substrate. In claim 6,
The cooling fan is disposed close to each heat radiation fin so that a corner of the outer frame is inscribed in a virtual circle formed by connecting inner peripheral side ends of the plurality of heat radiation fins. A lighting device. In any one of claims 4 to 7,
The circuit board includes an LED drive circuit that controls power supply to the LED based on an output from the temperature detection unit. In any one of claims 4 to 8,
The lighting device, wherein a power supply stop circuit for stopping power supply to the LED is mounted on the circuit board when a power supply current exceeds a preset value. In an LED board having an LED mounted on the front surface, a heat dissipating part that is fixed to the back surface of the LED board, and that has a cylindrical part extending in the thickness direction of the LED board, and in an inner peripheral space of the cylindrical part In the driving control method of the lighting device, comprising a cooling fan having an air outlet facing the LED substrate side,
Monitoring the temperature of the inner circumferential space at a position farther from the LED substrate than the air outlet, and monitoring the power supply current,
The power supply to the LED is controlled based on the temperature, and when the power supply current exceeds a preset value, the power supply to the LED and the power supply to the cooling fan are stopped. The drive control method of the illuminating device.

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