JP2015099873A - Piezoelectric device, piezoelectric device mounting substrate, hybrid IC, and electronic equipment - Google Patents

Abstract

A piezoelectric device and a piezoelectric device mounting substrate that can be formed by a simple process and can effectively utilize the area of the substrate, and a hybrid IC and an electronic device using the piezoelectric device mounting substrate are provided. A piezoelectric device (100) according to the present invention includes a container (120), projecting portions (130a-d) protruding from the container bottom (122) which is the bottom surface of the container (120) and formed of an insulating material, and the projecting portions (130a-d). and mounting terminals formed on at least part of the bottom surface of the projecting portion, which is the bottom surface, and at least part of the electronic component is arranged below the bottom surface of the container and on the side of the bottom surface of the container on a plane including the bottom surface of the projecting portion. have the space available. [Selection drawing] Fig. 1

Description

  The present invention relates to a piezoelectric device, a piezoelectric device mounting substrate, a hybrid IC, and an electronic apparatus. In particular, the present invention relates to a piezoelectric device, a piezoelectric device mounting substrate, a hybrid IC, and an electronic apparatus that can cope with a reduction in mounting area.

  Piezoelectric devices are widely used in various electronic devices such as mobile phones and personal computers mainly for frequency selection and control. Piezoelectric devices can be classified into piezoelectric vibrators, piezoelectric oscillators, SAW devices, optical devices, and the like according to their functions. Then, crystal resonators and crystal oscillators using crystal as a piezoelectric element are widely known and are generally used.

  Here, as a crystal resonator, for example, Patent Document 1 discloses the following. First, there is a base having a recess. A crystal vibrating piece is accommodated in the recess, and a lid is joined to the base so as to cover the recess, and the crystal vibrating piece is sealed. A terminal member made of a metal material is joined to the four corners of the back surface of the base. A terminal member is provided with the connection part by the side of a base, and the electrode part located in the opposite side to the base side in a connection part. In plan view (when viewed from a direction perpendicular to the bottom surface of the base), the area of the connection portion is smaller than the area of the electrode portion. Therefore, a step is formed between the connection portion and the electrode portion. The step is provided on the side of the pair of terminal members facing each other in the short side direction of the base. And an electronic component is mounted in the level | step difference which mutually opposes in the short side direction of a base.

  In addition, a hybrid IC may be used for an electronic device. A hybrid IC is one in which an electronic component such as an IC, a capacitor, or a piezoelectric device is mounted on a substrate. The hybrid IC has the merits that a small electronic component can be handled as one package and can be easily handled or can be downsized. An example of such a hybrid IC is described in Patent Document 2 and the like.

JP 2013-58944 A JP 2002-190663 A

  However, the crystal resonator of Patent Document 1 requires a process such as formation of a metal material terminal member having a step and mounting of an electronic component on the step, which makes it difficult to increase the production amount, May be expensive. Further, in the hybrid IC described in Patent Document 2 and the like, it is difficult to increase the number of electronic components that can be mounted on a substrate having a predetermined area.

  In view of the circumstances as described above, the present invention provides a piezoelectric device and a piezoelectric device mounting substrate that can be formed by a simple process and that can effectively use the area of the substrate, and a hybrid IC and an electronic apparatus using the piezoelectric device mounting substrate. For the purpose of provision.

The piezoelectric device mounting substrate according to the first aspect of the present invention is:
A substrate,
A container, a protrusion protruding from the container bottom surface that is the bottom surface of the container and formed of an insulating material, and a mounting terminal formed on at least a part of the bottom surface of the protrusion that is the bottom surface of the protrusion. A piezoelectric device mounted on the substrate by bonding the mounting terminal to the substrate;
At least a part of the electronic component is disposed between the container and the substrate and mounted on the substrate.

  A piezoelectric device mounting substrate according to a second aspect of the present invention is the piezoelectric device mounting substrate according to the first aspect, in which the piezoelectric device having a rectangular bottom surface is mounted.

  A piezoelectric device mounting substrate according to a third aspect of the present invention is the piezoelectric device mounting substrate according to the second aspect, in which the protruding device is mounted with the piezoelectric device formed at the four corners of the bottom surface of the container.

  A piezoelectric device mounting substrate according to a fourth aspect of the present invention is the piezoelectric device mounting substrate according to the second aspect, in which the protruding device is mounted with the piezoelectric device formed on two sides of the bottom surface of the container.

  A piezoelectric device mounting substrate according to a fifth aspect of the present invention is the piezoelectric device mounting substrate according to the second aspect, in which the piezoelectric device formed on the four sides of the bottom surface of the container is mounted.

  The piezoelectric device mounting substrate according to a sixth aspect of the present invention is the piezoelectric device mounting substrate according to any one of the first to fifth aspects, wherein the mounting terminal is formed outside the piezoelectric device on the bottom surface of the protrusion. A piezoelectric device is mounted.

  The piezoelectric device mounting substrate according to a seventh aspect of the present invention is the piezoelectric device mounting substrate according to any one of the first to sixth aspects, wherein the electronic component is a temperature sensor component.

  The hybrid IC of the present invention has the piezoelectric device mounting substrate according to any one of the first to seventh aspects.

  The electronic apparatus of the present invention has the piezoelectric device mounting substrate according to any one of the first to seventh aspects.

  The piezoelectric device according to the first aspect of the present invention includes at least a container, a protrusion raised from the container bottom surface that is the bottom surface of the container, formed of an insulating material, and a bottom surface of the protrusion that is the bottom surface of the protrusion. A space in which at least a part of the electronic component can be disposed on the side of the bottom surface of the container that is below the bottom surface of the container and includes the bottom surface of the protrusion. It is characterized by having.

  The piezoelectric device according to a second aspect of the present invention is the piezoelectric device according to the first aspect, wherein the container bottom surface is exposed with no electronic components mounted thereon.

  The piezoelectric device according to a third aspect of the present invention is the piezoelectric device according to the second aspect, wherein the container bottom is rectangular.

  The piezoelectric device according to a fourth aspect of the present invention is the piezoelectric device according to the third aspect, wherein the protrusion is formed at four corners of the bottom surface of the container.

  The piezoelectric device according to a fifth aspect of the present invention is the piezoelectric device according to the third aspect, wherein the protrusion is formed on two sides of the bottom surface of the container.

  A piezoelectric device according to a sixth aspect of the present invention is the piezoelectric device according to the third aspect, wherein the protrusions are formed on the four sides of the bottom surface of the container.

  The piezoelectric device according to a seventh aspect of the present invention is the piezoelectric device according to any one of the first to sixth aspects, wherein the mounting terminal is formed outside the piezoelectric device on the bottom surface of the protrusion.

  According to the piezoelectric device, the piezoelectric device mounting substrate, the hybrid IC, and the electronic apparatus of the present invention, the area of the substrate on which the piezoelectric device is mounted can be effectively used without deteriorating the productivity.

1 is a perspective view of a piezoelectric device 100. FIG. FIG. 2A is a cross-sectional view of the piezoelectric device 100. FIG. FIG. 4B is a bottom view of the piezoelectric device 100. FIG. It is a top view of wall part sheet | seat 124S. It is a top view of bottom part sheet 122S. It is a top view of the protrusion part sheet | seat 130S. (A) is sectional drawing of the piezoelectric device mounting board | substrate 200. FIG. FIG. 6B is a plan view of the piezoelectric device mounting substrate 200. It is a side view of hybrid IC300. FIG. 4A is a perspective view of the piezoelectric device 400. FIG. FIG. 4B is a bottom view of the piezoelectric device 400. FIG. FIG. 4A is a perspective view of the piezoelectric device 500. FIG. FIG. 4B is a bottom view of the piezoelectric device 500. FIG. 5 is a cross-sectional view of a piezoelectric device mounting substrate 700. FIG.

<Piezoelectric device>
[Configuration of piezoelectric device]
First, a piezoelectric device 100 according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a perspective view of the piezoelectric device 100. 2A is a cross-sectional view of the piezoelectric device 100 taken along line AA in FIG. FIG. 2B is a bottom view of the piezoelectric device 100.

  As shown in FIG. 1, the piezoelectric device 100 includes a rectangular parallelepiped container 120 and protrusions 130 a to 130 d protruding from the bottom surface of the container 120. In the following description, as shown in FIG. 1, the direction perpendicular to the bottom surface of the container 120 is defined as the Z direction. Moreover, it is a direction perpendicular | vertical to a Z direction, and let the direction where the long side of the container 120 extends be a Y direction. A direction perpendicular to the Y direction and the Z direction is taken as an X direction. Note that, with the bottom surface of the container 120 as a reference, the extending direction of the protrusions 130a to 130d is − (minus), and the opposite direction is + (plus).

  The container 120 is made of, for example, ceramic and includes a flat bottom surface portion 122 and a wall portion 124 stacked on the bottom surface portion 122. The bottom surface portion 122 is rectangular when viewed from the Z direction. As can be seen from FIG. 2A, the wall portion 124 is formed on the outer peripheral portion of the surface on the + Z side of the bottom surface portion 122. A region surrounded by the bottom portion 122 and the wall portion 124 becomes a concave portion of the container 120. As shown in FIG. 2A, the crystal vibrating piece 160 is accommodated in the recess.

  Then, the lid 110 is joined to the surface on the + Z side of the wall portion 124 which becomes the opening end surface of the container 120. Since the lid 110 is disposed so as to cover the concave portion of the container 120, the crystal vibrating piece 160 is hermetically sealed. The lid 110 is made of, for example, Kovar. Kovar is an alloy of Fe (iron), Ni (nickel) and Co (cobalt). The surface of the lid 110 is covered with, for example, a Ni metal film. A metal film (not shown) formed on the entire surface of the wall portion 124 on the + Z side and the lid 110 are joined with a brazing material such as silver brazing.

  The quartz crystal vibrating piece 160 accommodated in the concave portion of the container 120 is rectangular when viewed from the Z direction. As shown in FIG. 2A, a pair of excitation electrodes 162 is formed on the crystal vibrating piece 160 on the + Z side and −Z side main surfaces and in the central portion. The lead electrode 164 extends in the −Y direction from the + Z side excitation electrode 162, is folded at the −Y side end of the excitation electrode 162, and extends to the −Z side surface of the excitation electrode 162. The extraction electrode 164 extends in the + Y direction from the −Z side excitation electrode 162, is folded at the + Y side end of the excitation electrode 162, and extends to the + Z side surface of the excitation electrode 162.

  The quartz crystal vibrating piece 160 is a pair of conductive adhesives 166 at least partially in contact with the lead electrodes 164 on the + Y side and −Y side ends of the main surface on the −Z side of the quartz crystal vibrating piece 160. It is fixed. Each of the conductive adhesives 166 is in contact with the connection electrode 168 formed at least partially on the + Z side surface of the bottom surface portion 122. Therefore, the pair of excitation electrodes 162 are electrically connected to different connection electrodes 168, respectively.

  Four projecting portions 130a to 130d are formed so as to protrude from the bottom surface of the container 120 in which the crystal vibrating piece 160 is accommodated, that is, from the −Z side surface of the bottom surface portion 122. The protrusions 130a to 130d are made of an insulating material, for example, ceramic. And protrusion part 130a-d is formed in the four corner | angular parts of the bottom face of the container 120 as FIG. 1, FIG. 2 (a), (b) shows. The protrusions 130a to 130d are formed with notches 140a to 140d at portions corresponding to the corners of the bottom surface 122 when viewed from the -Z side. The notches 140a to 140d extend in the Z direction as shown in FIG. 1 and FIG. 2B, and extend to the wall portion 124, for example.

  For example, the mounting terminals 150a to 150d are formed on the entire bottom surfaces of the protrusions 130a to 130d, that is, the -Z side surfaces of the protrusions 130a to 130d. The mounting terminals 150a to 150d are electrically connected to the side electrodes 152a to 152d formed in the notches 140a to 140d. Two of the side electrodes 152 a to 152 d, for example, the side electrodes 152 b and d on the diagonal line of the bottom surface portion 122 when viewed from the −Z side, are electrically connected to different connection electrodes 168. Therefore, in this case, the excitation electrode 162 is electrically connected to the notches 140b and d. The mounting terminals 150a and 150c that are not electrically connected to the excitation electrode 162 are dummy terminals.

  The height of the protrusions 130a to 130d, that is, the size of the protrusions 130a to 130d in the Z direction is higher than the height of the temperature sensor component 220a described later. In addition, there is a space in which at least a part of the temperature sensor component 220a can be disposed on the + Z side below the bottom surface of the container 120 (on the −Z side) and including the bottom surfaces of the projecting portions 130a to 130d. Further, as can be seen from FIGS. 2A and 2B, no electronic components are mounted on the bottom surface of the container 120, and the bottom surface of the container 120 is exposed.

[Piezoelectric Device Manufacturing Method]
Next, a method for manufacturing the piezoelectric device 100 will be described with reference to FIGS. 3 is a plan view of the wall sheet 124S, FIG. 4 is a plan view of the bottom sheet 122S, and FIG. 5 is a plan view of the protruding sheet 130S.

  First, the wall sheet 124S shown in FIG. 3 is prepared. The wall sheet 124S is made of, for example, a ceramic green sheet. The wall portion sheet 124S is provided with a plurality of virtual regions corresponding to the wall portion 124. This virtual region is a region surrounded by a virtual region V10 extending in the X direction and a virtual region V11 extending in the Y direction shown in FIG. In FIG. 3, nine virtual regions corresponding to the wall portion 124 are provided, but may be appropriately changed depending on the size of the wall portion sheet 124 </ b> S and the size of the wall portion 124. This also applies to the bottom sheet 122S and the protrusion sheet 130S described later.

  In the wall sheet 124S, a through-hole HL10 that is rectangular when viewed from the Z direction is formed at the center of the virtual region that becomes the wall 124. The through hole HL10 becomes a concave portion in the container 120, and a region surrounded by the through hole HL10 and the virtual regions V10 and V11 becomes a wall portion 124.

  Furthermore, the through hole HL11 that is circular when viewed from the Z direction is formed in the corner portion of the virtual region that becomes the wall portion 124 in the wall portion sheet 124S. As shown in FIG. 3, each through hole HL <b> 11 is formed so as to cover virtual regions that are adjacent to each other and become the wall portion 124. And through-hole HL11 becomes notch 140a-d shown by FIG.1 and FIG.2 (b).

  Also, a bottom sheet 122S shown in FIG. 4 is prepared. The bottom sheet 122S is made of, for example, a ceramic green sheet. The bottom surface sheet 122S is provided with a plurality of virtual regions corresponding to the bottom surface portion 122. This virtual area is an area surrounded by a virtual area V20 extending in the X direction and a virtual area V21 extending in the Y direction shown in FIG.

  A through hole HL20 that is circular when viewed from the Z direction is formed in the corner of the virtual region that becomes the bottom surface portion 122 in the bottom surface sheet 122S. As shown in FIG. 4, each through hole HL <b> 20 is formed so as to cover a virtual region that is adjacent to each other and becomes the bottom surface portion 122. And the through-hole HL20 becomes the notches 140a-d shown by FIG.1 and FIG.2 (b).

  Further, a conductive paste containing W (tungsten), for example, is printed on the bottom surface sheet 122S by screen printing or the like. This printing is performed, for example, in a region to be the connection electrode 168, an inner periphery of the through hole HL20, and a region to be the conductive path 169 extending from the connection electrode 168 and reaching the through hole HL20.

  Moreover, the protrusion part sheet | seat 130S shown by FIG. 5 is prepared. The protrusion sheet 130S is made of, for example, a ceramic green sheet. The projection sheet 130S is provided with a plurality of virtual areas corresponding to the projections 130a to 130d. This virtual area is an area surrounded by a virtual area V30 extending in the X direction and a virtual area V31 extending in the Y direction shown in FIG.

  In the protruding portion sheet 130S, a through hole HL31 that forms a cross when viewed from the Z direction is formed in the center of the virtual region that becomes the protruding portions 130a to 130d. The through hole HL31 is a virtual region that becomes the protrusions 130a to 130d, and extends to the + Y side and −Y side virtual region V30, and further extends to the + X side and −X side virtual region V31. And the area | region enclosed by through-hole HL31 and virtual area V30, V31 becomes protrusion part 130a-d.

  Moreover, the through-hole HL30 which becomes circular when it sees from a Z direction is formed in the corner | angular part of the virtual area | region used as protrusion part 130a-d in the protrusion part sheet | seat 130S. As shown in FIG. 5, each through hole HL <b> 30 is formed so as to cover virtual regions that are adjacent to each other and become the protruding portions 130 a to 130 d. And the through-hole HL30 becomes the notches 140a-d shown by FIG.1 and FIG.2 (b).

  Further, a conductive paste containing, for example, W (tungsten) is printed on the protrusion sheet 130S by screen printing or the like. This printing is performed, for example, on the inner periphery of the through-hole HL30 and the regions to be the mounting terminals 150a to d disposed on the −Z side surface of the protrusions 130a to 130d. In FIG. 5, the mounting terminals 150a to 150d are not shown.

  Next, the wall portion sheet 124S, the bottom surface portion sheet 122S, and the protruding portion sheet 130S formed in this way are stacked. Specifically, the bottom sheet 122S is stacked on the + Z side of the protruding sheet 130S, and the wall sheet 124S is stacked on the + Z side of the bottom sheet 122S. At this time, the virtual regions of the wall portion 124, the bottom surface portion 122, and the projecting portions 130a to 130d overlap each other. Then, it is fired. Next, for example, a Ni (nickel) metal film and an Au (gold) metal film are sequentially formed on a metal surface such as W formed by screen printing or the like by electrolytic plating or electroless plating. And it cut | disconnects by virtual area | region V10, V11, V20, V21, V30, V31, and the protrusion parts 130a-d which protrude from the container 120 are formed.

  Next, the crystal vibrating piece 160 on which the excitation electrode 162 and the extraction electrode 164 are prepared is prepared using a conductive adhesive 166 on the + Z side surface of the bottom surface portion 122 that becomes the bottom surface of the recess of the bottom surface portion 122. Secure to.

  Finally, the lid 110 is bonded to the surface on the + Z side of the wall portion 124 that becomes the opening end surface of the container 120, and the crystal vibrating piece 160 is hermetically sealed. At this time, for example, a brazing material such as silver brazing is formed in advance on the opening end surface or the outer peripheral portion of the surface on the −Z side of the lid 110. Next, the -Z side surface of the lid 110 is opposed to the opening end surface and overlapped, and joined by seam welding or the like. In this way, the piezoelectric device 100 is formed.

<Piezoelectric device mounting substrate>
Next, the piezoelectric device mounting substrate 200 will be described with reference to FIG. FIG. 6A is a cross-sectional view of the piezoelectric device mounting substrate 200. FIG. 6B is a plan view of the piezoelectric device mounting substrate 200. 6A is a cross-sectional view taken along line AA in FIG. 1, and the piezoelectric device mounting substrate 200 in FIG. 6A is taken along line BB in FIG. 6B. FIG.

  The piezoelectric device mounting substrate 200 includes a glass epoxy substrate 210, for example, and a temperature compensated oscillation circuit is formed on the substrate 210. The temperature-compensated oscillation circuit includes the piezoelectric device 100, a temperature sensor component 220a that detects the temperature of the piezoelectric device 100, and other circuit elements that constitute the temperature-compensated oscillation circuit. By using the temperature compensated oscillation circuit, even if the temperature of the piezoelectric device 100 changes, the temperature compensation can be performed on the frequency temperature characteristics of the piezoelectric device 100, and the frequency fluctuation can be reduced.

  As shown in FIG. 6A, the piezoelectric device 100 is bonded to the + Z side surface of the substrate 210 with solder 232. Due to the solder 232, the mounting terminals 150a to 150d are electrically connected to the wiring pattern 230 formed on the substrate 210.

  The temperature sensor component 220a that detects the temperature of the piezoelectric device 100 uses a thermistor or a diode, and is mounted on the surface of the substrate 210 on the + Z side with solder. The temperature sensor component 220a is disposed on the −Z side of the container 120 of the piezoelectric device 100 as illustrated in FIG. Therefore, the temperature sensor component 220a is disposed between the container 120 and the substrate 210.

  FIG. 6B shows the arrangement of the temperature sensor component 220a as viewed from the + Z side. As shown in FIG. 6B, when viewed from the + Z side, the temperature sensor component 220a is disposed at the center of the piezoelectric device 100. That is, the temperature sensor component 220a and the protrusions 130a to 130d are arranged so that the distances between them are substantially equal. Then, as shown in FIG. 6A, the quartz crystal vibrating piece 160 is disposed in the + Z direction of the temperature sensor component 220a.

  The piezoelectric device mounting substrate 200 may include a circuit other than the temperature compensated oscillation circuit. For example, there may be a circuit that uses the frequency of the temperature compensated oscillation circuit or a circuit that functions independently of the temperature compensated oscillation circuit.

<Hybrid IC>
Next, the hybrid IC 300 will be described with reference to FIG. It is a side view of hybrid IC300.

  The hybrid IC 300 uses a piezoelectric device mounting substrate 200 having a substrate 210. A conductive path that connects the piezoelectric device 100, the temperature sensor component 220a, the electronic component 220b, or other electronic components is formed on the substrate 210. Some of the conductive paths extend to through holes (not shown) formed in the substrate 210. The through-hole is formed, for example, in a corner portion or an outer peripheral portion when the substrate 210 is viewed from the + Z side. Then, one end of the lead frame 310 is inserted into the through hole from, for example, the −Z side of the substrate 210 and fixed to the substrate 210 with solder or the like. Accordingly, at least some of the lead frame 310 is conducted to the conductive path of the substrate 210.

<Effect>
According to the piezoelectric device 100, the piezoelectric device mounting substrate 200, and the hybrid IC 300 described above, the excellent effects listed below can be obtained.
(1) In the piezoelectric device 100, the protrusions 130a to 130d are raised from the bottom surface of the container 120. Further, there is a space in which at least a part of the temperature sensor component 220a can be disposed on the + Z side below the bottom surface of the container 120 (on the −Z side) and including the bottom surfaces of the projecting portions 130a to 130d. Therefore, when the piezoelectric device 100 is mounted on the substrate 210, the temperature sensor component 220a is disposed on the + Z side below the bottom surface (−Z side) of the container 120 and including the bottom surfaces of the protrusions 130a to 130d. The temperature sensor component 220a can be mounted on the substrate 210. Therefore, since the piezoelectric device 100 and the temperature sensor component 220a can be stacked and mounted on the substrate, the area of the substrate 210 can be effectively utilized.

  Further, in the piezoelectric device mounting substrate 200 and the hybrid IC 300, the temperature sensor component 220 a is disposed between the container 120 and the substrate 210 and mounted on the substrate 210. Therefore, since the piezoelectric device 100 and the temperature sensor component 220a are mounted on the substrate 210 in an overlapping manner, the area of the substrate 210 can be effectively utilized.

  (2) The piezoelectric device 100 only forms the protrusions 130 a to 130 d on the bottom surface of the container 120, and the temperature sensor component 220 a is not mounted on the piezoelectric device 100. Therefore, the piezoelectric device 100 can be formed without going through the process of mounting the temperature sensor component 220a on the piezoelectric device 100. That is, as described above, the area of the piezoelectric device 100 can be effectively used while avoiding complication of the manufacturing process of the piezoelectric device 100.

  Further, in the piezoelectric device mounting substrate 200 and the hybrid IC 300, as shown in FIG. 6A, the piezoelectric device 100 and the temperature sensor component 220a are stacked and placed on a substrate 210 coated with solder at a predetermined location. . Next, the piezoelectric device 100 and the temperature sensor component 220a can be fixed to the substrate 210 simultaneously with other electronic components such as the electronic component 220b by heating to melt the solder and then cooling. Therefore, as described above, the area of the piezoelectric device 100 can be effectively utilized while avoiding complication of the manufacturing process in the piezoelectric device mounting substrate 200 and the hybrid IC 300.

  (3) The protrusions 130a to 130d of the piezoelectric device 100 are formed of ceramic which is an insulating material. Here, the piezoelectric device 100 is mounted on the substrate, and the temperature sensor component 220a is disposed on the + Z side below the bottom surface (−Z side) of the container 120 and including the bottom surfaces of the protrusions 130a to 130d. Consider a case where the temperature sensor component 220a is mounted on the board. At this time, the protrusions 130a to 130d are disposed adjacent to the temperature sensor component 220a. However, the protrusions 130a to 130d are made of an insulating material. Therefore, the possibility that the characteristics of the piezoelectric device 100 or the temperature sensor component 220a change with a capacity between the temperature sensor component 220a and the protrusions 130a to 130d can be reduced.

  Further, in the piezoelectric device mounting substrate 200 and the hybrid IC 300, the piezoelectric device 100 is mounted on the substrate, and is below the bottom surface (−Z side) of the container 120 and on the + Z side of the plane including the bottom surfaces of the protrusions 130a to 130d. The temperature sensor component 220a is arranged, and the temperature sensor component 220a is mounted on the substrate. Therefore, as described above, it is possible to reduce the possibility that the characteristics of the piezoelectric device 100 or the temperature sensor component 220a change with capacity between the temperature sensor component 220a and the protrusions 130a to 130d.

  (4) The piezoelectric device 100 has a space where the temperature sensor component 220a can be arranged on the + Z side below the bottom surface of the container 120 (on the −Z side) and including the bottom surfaces of the protrusions 130a to 130d. Further, in the piezoelectric device mounting substrate 200 and the hybrid IC 300, the piezoelectric device 100 is mounted on the substrate, and is below the bottom surface (−Z side) of the container 120 and on the + Z side of the plane including the bottom surfaces of the protrusions 130a to 130d. The temperature sensor component 220a is arranged, and the temperature sensor component 220a is mounted on the substrate. Therefore, the temperature sensor component 220a can be disposed close to the piezoelectric device 100. Therefore, the temperature sensor component 220a can accurately measure the temperature of the piezoelectric device 100, and the temperature compensation circuit can accurately compensate for the temperature.

  (5) An electronic component is not mounted on the bottom surface of the container 120 of the piezoelectric device 100, and the container bottom surface is exposed. Therefore, the volume between the bottom surface of the container 120 and the substrate 210 on which the piezoelectric device 100 is mounted can be increased as compared with the case where electronic components are mounted on the bottom surface of the container 120. Therefore, since the types of temperature sensor components 220a that can be used increase, the degree of freedom in designing the temperature compensated oscillation circuit increases.

  (6) Electronic components are not mounted on the bottom surface of the container 120 of the piezoelectric device 100, and the container bottom surface is exposed. Therefore, when the piezoelectric device 100 and the temperature sensor component 220a are mounted on the substrate 210, for example, even if the temperature sensor component 220a contacts the bottom surface of the container 120, it is possible to reduce the possibility of an electrical short circuit.

  (7) The bottom surface of the container 120 of the piezoelectric device 100 is rectangular. Therefore, many containers 120 can be formed from the wall part sheet | seat 124S, the bottom face part sheet | seat 122S, and the protrusion part sheet | seat 130S compared with another shape.

  (8) The protrusions 130 a to 130 d of the piezoelectric device 100 are formed at the four corners of the bottom surface of the container 120. Therefore, at least a part of the temperature sensor component 220a can be disposed between a pair of adjacent protrusions 130a to 130d. Therefore, it is possible to ensure a large space in which at least a part of the temperature sensor component 220a can be disposed on the + Z side below the bottom surface of the container 120 (on the −Z side) and including the bottom surfaces of the protrusions 130a to 130d. For this reason, since the types of temperature sensor components 220a that can be used increase, the degree of freedom in designing the temperature compensated oscillation circuit increases.

<Other embodiments>
The piezoelectric device 100, the piezoelectric device mounting substrate 200, and the hybrid IC 300 according to the present invention are not limited to the configurations exemplified in the above-described embodiment, and can be implemented as, for example, the following forms appropriately modified. .

  The piezoelectric device mounting substrate 200 was used by being incorporated in the hybrid IC 300. However, the piezoelectric device mounting substrate 200 may be directly incorporated into an electronic apparatus such as a mobile phone or a personal computer.

  The substrate 210 of the hybrid IC 300 may have a configuration in which the lead frame 310 is not provided and terminal electrodes are formed. Specifically, the configuration is as follows. First, the substrate 210 does not have the lead frame 310, and has a plurality of terminal electrodes on one main surface. Further, as shown in FIGS. 6A and 6B, electronic components such as the piezoelectric device 100, the temperature sensor component 220a, and the electronic component 220b are mounted on the other main surface of the substrate 210. Then, the terminal electrode of the substrate 210 is conducted to the conductive path of the substrate 210. Such a hybrid IC is desirable because it can be surface-mounted using terminal electrodes.

  -Protrusion part 130a-d of the piezoelectric device 100 is formed in the four corners of the bottom face of the container 120 as FIG.1, FIG.2 (a) and (b) show. However, the protrusions 130a to 130d may be formed in other parts, for example, the central part of each side of the bottom surface of the container 120. Moreover, four protrusions are not necessarily required. For example, the pair of protrusions may be formed at both ends of one short side of the bottom surface of the container 120, and the other protrusion may be formed at the center of the other short side. In this case, three protrusions are formed. That is, the position and the number of the protrusions are arbitrary as long as a space in which the temperature sensor component 220a can be arranged can be secured between the container 120 and the substrate 210.

  The protrusions 130 a to 130 d of the piezoelectric device 100 are formed at the four corners of the bottom surface of the container 120. However, the protrusions may be formed on the four sides of the bottom surface of the container 120. This point will be described with reference to FIG. FIG. 8A is a perspective view of the piezoelectric device 400. FIG. 8B is a bottom view of the piezoelectric device 400.

  The difference between the piezoelectric device 400 and the piezoelectric device 100 shown in FIGS. 8A and 8B is a protrusion. In the piezoelectric device 400, protrusions 430 are formed on the bottom surface of the container 120, that is, on the four sides of the −Z side surface of the bottom surface portion 122. Therefore, the protrusion 430 is formed so as to go around the outer peripheral region of the bottom surface of the container 120. In addition, four mounting terminals 150 a to 150 d are formed on the bottom surface of the protruding portion 430, that is, on the −Z side surface of the protruding portion 430. The mounting terminals 150a to 150d are formed at the four corners of the bottom surface of the protrusion 430 as shown in FIG.

  In the piezoelectric device 400, the temperature sensor component 220 a can be arranged in a region surrounded by the protrusion 430. Specifically, the piezoelectric device 400 is mounted on the substrate 210 in the same manner as the piezoelectric device 100 of FIG. Then, the temperature sensor component 220a is disposed in a region surrounded by the protruding portion 430, and the temperature sensor component 220a is mounted on the substrate 210.

  Thus, the temperature sensor component 220a can be disposed in the region surrounded by the protrusion 430. Therefore, the influence of the external environment applied to the temperature sensor component 220a can be reduced, and the temperature detection accuracy of the crystal vibrating piece 160 accommodated in the container 120 can be increased. Further, the temperature sensor component 220a is disposed in a region surrounded by the protrusion 430. Therefore, the protrusion 430 can be used as a guide when the temperature sensor component 220a is placed on the substrate 210, and positioning of the temperature sensor component 220a is facilitated.

  In the piezoelectric device 400, as shown in FIG. 8B, the region surrounded by the protrusion 430 is rectangular when viewed from the −Z side. However, in addition to the rectangle, other shapes such as a circle or an ellipse may be used as long as the temperature sensor component 220a can be arranged. In addition, although the four mounting terminals 150a to 150d are formed in the piezoelectric device 400, the number of mounting terminals may be two. When two mounting terminals are used, one mounting terminal is formed so as to extend in the X direction on the −Y side of the bottom surface of the projecting portion 430, and the other mounting terminal is + Y on the bottom surface of the projecting portion 430. It may be formed to extend in the X direction on the side. Also, one mounting terminal is formed to extend in the Y direction on the −X side of the bottom surface of the protruding portion 430, and the other mounting terminal extends in the Y direction on the + X side of the bottom surface of the protruding portion 430. You may form as follows.

  The protrusions 130 a to 130 d of the piezoelectric device 100 are formed at the four corners of the bottom surface of the container 120. However, the protrusions may be formed on the two sides of the bottom surface of the container 120. This point will be described with reference to FIG. FIG. 9A is a perspective view of the piezoelectric device 500. FIG. 9B is a bottom view of the piezoelectric device 500.

  The difference between the piezoelectric device 500 and the piezoelectric device 100 shown in FIGS. 9A and 9B is a protrusion. In the piezoelectric device 500, a pair of protrusions 530a and 530b are formed on the bottom surface of the container 120, that is, on the two sides of the −Z side surface of the bottom surface portion 122. The two sides are a pair of long sides on the bottom surface of the container 120. As shown in FIG. 9B, mounting terminals 150a to 150d are formed on the bottom surfaces of the protrusions 530a and b, that is, on the −Z side surface of the protrusions 530a and b. The mounting terminals 150a and 150b are formed at both ends of the bottom surface of the protruding portion 530a, and the mounting terminals 150c and 150d are formed at both ends of the bottom surface of the protruding portion 530b.

  In the piezoelectric device 500, the temperature sensor component 220a can be disposed in a region sandwiched between the pair of protrusions 530a and 530b. Specifically, the piezoelectric device 500 is mounted on the substrate 210 in the same manner as the piezoelectric device 100 of FIG. And the temperature sensor component 220a is arrange | positioned in the area | region pinched | interposed into a pair of protrusion part 530a, b, and the temperature sensor component 220a is mounted in the board | substrate 210. FIG.

  As described above, the temperature sensor component 220a can be disposed in a region sandwiched between the pair of protrusions 530a and 530b. Therefore, the influence of the external environment applied to the temperature sensor component 220a can be reduced, and the temperature detection accuracy of the crystal vibrating piece 160 accommodated in the container 120 can be increased. The temperature sensor component 220a is disposed in a region sandwiched between the protrusions 530a and 530b. Therefore, when placing the temperature sensor component 220a on the substrate 210, the pair of protrusions 530a and 530b can be used as a guide, and positioning of the temperature sensor component 220a is facilitated.

  Further, as shown in FIG. 9B, both ends (+ Y side and −Y side) of the region sandwiched between the pair of protrusions 530a and 530b are released and are not blocked by the protrusions. Therefore, the size of the region can be increased as compared with the case where the protrusion is blocked. Therefore, for example, a large temperature sensor component 220a can be arranged in the area, or a plurality of electronic components can be arranged to effectively use the area.

  In the piezoelectric device 500, the pair of protrusions 530 a and b are formed on the pair of long sides on the bottom surface of the container 120. However, the pair of projecting portions 530 a and b may be formed on the pair of short sides on the bottom surface of the container 120. Further, the pair of protrusions 530 a and b may be formed on one short side and one long side of the bottom surface of the container 120. In addition, although the four mounting terminals 150a to 150d are formed in the piezoelectric device 400, the number of mounting terminals may be two. For example, one mounting terminal may be formed on each bottom surface of the pair of projecting portions 530a and 530b.

  In the piezoelectric device 100, the mounting terminals 150a to 150d are formed on the entire bottom surface of the protrusions 130a to 130d. However, the mounting terminals 150a to 150d may be formed only outside the piezoelectric device on the bottom surfaces of the protrusions 130a to 130d. This point will be described with reference to FIG. FIG. 10 is a cross-sectional view of the piezoelectric device mounting substrate 700.

  A piezoelectric device 600 is mounted on the piezoelectric device mounting substrate 700. Mounting terminals 650 a to 650 d are formed on the bottom surfaces of the protruding portions 130 a to 130 d of the piezoelectric device 600. The mounting terminals 650a to 650d are formed outside the bottom surface of the container 120 when viewed from the −Z side. And mounting terminal 650a-d is not formed in the center part of the bottom face of container 120 in protrusion part 130a-d. Further, projecting portion electrodes 654a to 654d connected to the mounting terminals 650a to 650d are formed on the side surfaces of the projecting portions 130a to 130d which are the outer surfaces of the piezoelectric device 600. The protrusions 130a and 130b, the mounting terminals 650a and b, and the protrusion electrodes 654a to 654d are not shown in FIG.

  As described above, the mounting terminals 150a to 150d are formed only outside the piezoelectric device on the bottom surfaces of the protrusions 130a to 130d. Here, a case where the piezoelectric device 600 is mounted on the substrate 210 with the solder 632 as shown in FIG. At this time, when viewed from the + Z side, the solder 632 is disposed only on the outer peripheral side of the piezoelectric device 600 and can be prevented from flowing into the center side of the piezoelectric device 600. Therefore, the possibility that the solder 632 flows into the temperature sensor component 220a arranged on the −Z side of the container 120 of the piezoelectric device 600 can be reduced, and a short circuit can be prevented.

  Further, projecting portion electrodes 654a to 654d connected to the mounting terminals 650a to 650d are formed on the side surfaces of the projecting portions 130a to 130d which are the outer surfaces of the piezoelectric device 600. Therefore, when the piezoelectric device 600 is mounted on the substrate 210 with the solder 632, the solder 632 crawls along the projecting portion electrodes 654a to 654d, and a solder fillet is formed. Accordingly, the piezoelectric device 600 is firmly bonded to the substrate 210. Even if there are no projecting portion electrodes 654a to 654d, the solder 632 crawls along the side electrodes 152a to 152d to form solder fillets, and the piezoelectric device 600 is bonded to the substrate 210 with a certain strength.

  An electronic component is not mounted on the bottom surface of the container 120 of the piezoelectric device 100. However, an electronic component such as an IC or a capacitor may be mounted on the bottom surface of the container 120. In this case, by increasing the height (the length in the Z direction) of the protrusions 130a to 130d, a plane that is below the bottom surface (−Z side) of the container 120 and includes the bottom surfaces of the protrusions 130a to 130d. A space in which the temperature sensor component 220a can be disposed can be secured on the container 120 side. When an oscillation circuit is formed on an IC mounted on the bottom surface of the container 120, the IC for the oscillation circuit can be omitted from the piezoelectric device mounting substrate 200.

  When the piezoelectric device 100 is mounted on the substrate 210, the temperature sensor component 220a is mounted on the substrate 210, and the temperature sensor component 220a is disposed between the piezoelectric device 100 and the substrate 210, one of the temperature sensor components 220a Only the portion may be disposed between the piezoelectric device 100 and the substrate 210. That is, the temperature sensor component 220a may be arranged so that the piezoelectric device 100 and a part of the temperature sensor component 220a overlap when viewed from the Z direction. Even in this case, the area of the substrate 210 can be effectively utilized.

  When the piezoelectric device 100 is mounted on the substrate 210, the temperature sensor component 220a is further mounted on the substrate 210, and the temperature sensor component 220a is disposed between the piezoelectric device 100 and the substrate 210, the piezoelectric device 100 and the substrate 210. One or more electronic components other than the temperature sensor component 220a may be arranged between the two and the electronic components may be mounted on the substrate 210. In other words, the temperature sensor component 220a and the one or more electronic components may be arranged so that the piezoelectric device 100 overlaps the temperature sensor component 220a and the one or more electronic components as viewed from the Z direction. Even in this case, the area of the substrate 210 can be effectively utilized.

  A temperature sensor component 220 a is disposed between the piezoelectric device 100 and the substrate 210. However, an electronic component other than the temperature sensor component 220a, for example, an electronic component such as an IC or a capacitor, may be disposed between the piezoelectric device 100 and the substrate 210 and mounted on the substrate 210. Even in this case, the piezoelectric device 100 and the electronic component can be arranged so as to overlap each other when viewed from the Z direction. Therefore, the area of the substrate 210 can be effectively utilized.

  In the piezoelectric device 100, the excitation electrode 162 and at least two of the mounting terminals 150a to 150d are electrically connected by at least two of the side electrodes 152a to 152d formed in the notches 140a to 140d. However, for example, through holes may be formed in the protrusions 130a to 130d, electrodes may be formed in the through holes, and at least two of the excitation electrode 162 and the mounting terminals 150a to 150d may be electrically connected. In this case, the notches 140a to 140d may be omitted.

  The pair of extraction electrodes 164 of the crystal vibrating piece 160 accommodated in the piezoelectric device 100 may be formed so as to extend from the pair of excitation electrodes 162 in the same direction, for example, the −Y direction. In this case, at one end of the crystal vibrating piece 160 on the −Y side, one extraction electrode 164 is positioned on the + X side and the other extraction electrode 164 is positioned on the −X side so that the pair of extraction electrodes 164 are not short-circuited. To do. Then, a pair of conductive adhesives 166 is applied to the −Y side end of the crystal vibrating piece 160 to bond the crystal vibrating piece 160 to the bottom surface portion 122.

  The container 120 and the protrusions 130a to 130d of the piezoelectric device 100 may be made of a material other than ceramic, such as glass or quartz. Similarly, the lid 110 of the piezoelectric device 100 may use glass or quartz other than metal.

  The piezoelectric device 100 may be configured as follows using glass or quartz for the container 120 and the lid 110. First, there is a crystal vibrating piece and a frame portion surrounding the outer periphery of the crystal vibrating piece. The quartz crystal resonator element and the frame part are connected by a connecting part. These quartz crystal vibrating pieces, the frame portion, and the connecting portion are integrally formed of quartz. A pair of plate-like members formed of glass or quartz is joined to both main surfaces of the frame portion. The quartz crystal vibrating piece is sealed in a region surrounded by the frame portion and the pair of plate-like members. The frame portion and the pair of plate-like members correspond to the lid 110 and the container 120. And protrusion part 130a-d is formed in the opposite surface of the surface joined to the frame part in one plate-shaped member.

  The quartz crystal vibrating piece 160 may have a shape other than a rectangle, for example, a tuning fork shape. The piezoelectric device 100 may use a piezoelectric material other than quartz, for example, lithium tantalate, lithium niobate, or piezoelectric ceramic, instead of the quartz crystal vibrating piece 160. Further, an oscillation circuit may be mounted on the piezoelectric device 100, and the piezoelectric device 100 may be used as a piezoelectric oscillator. Moreover, you may increase the number of the mounting terminals of the piezoelectric device 100 as needed. The piezoelectric device 100 may have a shape other than a rectangle when viewed from the Z direction, for example, a shape such as a circle or an ellipse.

DESCRIPTION OF SYMBOLS 100, 500, 600 ... Piezoelectric device 110 ... Lid 120 ... Container 122 ... Bottom part 122S ... Bottom part sheet 124 ... Wall part 124S ... Wall part sheet 130a-d. .. Projection 130S ... Projection Sheet 140a-d ... Notch 150a-d ... Mounting Terminal 152a-d ... Side Electrode 160 ... Crystal Vibrating Piece 162 ... Excitation Electrode 164. .. Extraction electrode 166 ... Conductive adhesive 168 ... Connection electrode 169 ... Conductive path 200,700 ... Piezoelectric device mounting board 210 ... Board 220a ... Temperature sensor component 220b ... Electronic component 230 ... Wiring pattern 232 ... Solder 300 ... Hybrid IC
310 ... Lead frame 400 ... Piezoelectric device 430 ... Protruding part 530a, b ... Protruding part 632 ... Solder 650a ... Mounting terminal HL10, HL11, HL20, HL30, HL31 ... Through Hole V10, V11, V20, V21, V30, V31 ... Virtual region

Claims (16)

A substrate,
A container, a protrusion protruding from the container bottom surface that is the bottom surface of the container and formed of an insulating material, and a mounting terminal formed on at least a part of the bottom surface of the protrusion that is the bottom surface of the protrusion. A piezoelectric device mounted on the substrate by bonding the mounting terminal to the substrate;
A piezoelectric device mounting substrate comprising: an electronic component mounted at least partially between the container and the substrate and mounted on the substrate.   The piezoelectric device mounting substrate according to claim 1, wherein the piezoelectric device having a rectangular bottom surface is mounted.   The piezoelectric device mounting substrate according to claim 2, wherein the piezoelectric device formed at the four corners of the bottom surface of the container is mounted on the protruding portion.   The piezoelectric device mounting substrate according to claim 2, wherein the projecting portion is mounted with the piezoelectric device formed on two sides of the bottom surface of the container.   The piezoelectric device mounting substrate according to claim 2, wherein the protrusion is mounted with the piezoelectric device formed on four sides of the bottom surface of the container.   The piezoelectric device mounting substrate according to claim 1, wherein the mounting terminal is mounted with the piezoelectric device formed outside the piezoelectric device on the bottom surface of the protrusion.   The electronic device having a piezoelectric device mounting substrate according to any one of claims 1 to 6, wherein the electronic component is a temperature sensor component.   A hybrid IC comprising the piezoelectric device mounting substrate according to any one of claims 1 to 7.   An electronic apparatus comprising the piezoelectric device mounting substrate according to any one of claims 1 to 7.   A container, a protrusion protruding from the container bottom surface that is the bottom surface of the container and formed of an insulating material, and a mounting terminal formed on at least a part of the bottom surface of the protrusion that is the bottom surface of the protrusion. And a space under which at least a part of the electronic component can be disposed on the side of the bottom surface of the container that is below the bottom surface of the container and includes the bottom surface of the projecting portion.   The piezoelectric device according to claim 10, wherein an electronic component is not mounted on the bottom surface of the container and the bottom surface of the container is exposed.   The piezoelectric device according to claim 10 or 11, wherein the container bottom has a rectangular shape.   The piezoelectric device according to claim 12, wherein the protrusions are formed at four corners of the bottom surface of the container.   The piezoelectric device according to claim 12, wherein the protrusion is formed on two sides of the bottom surface of the container.   The piezoelectric device according to claim 12, wherein the protrusions are formed on four sides of the bottom surface of the container.   The piezoelectric device according to claim 10, wherein the mounting terminal is formed outside the piezoelectric device on a bottom surface of the protrusion.