JP2015092519A - Light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To correctly provide a target light emission color by a plurality of LED chips which have different light emission colors.SOLUTION: When the light emission color of an LED chip 13b has a tone close to the tone of a color A, the light emission color of an LED chip 13c has a tone substantially equally close to both the tone of the color A and the tone of a color B, and the light emission color of an LED chip 13a has a tone closer to the tone of the color A than to the tone of the color B, the LED chips 13a, 13c are supplied with a wavelength conversion material 15a containing a phosphor which performs wavelength conversion into a color C as a complementary color (or a different color) by absorbing the wavelength of the color A and a wavelength conversion material 15b containing a phosphor which performs wavelength conversion into the color A by absorbing the wavelength of the color C respectively from different nozzles. Light beams emitted by wavelength conversion parts 14a-14c can be put together to obtain a target light emission color by changing balance in amount between the supplied wavelength conversion materials 15a, 15b according to balance in intensity between the tone of the color A and the tone of the color B of the LED chips 13a, 13c.

Description

  The present invention relates to a light emitting device on which a plurality of LED (Light Emitting Diode) chips are mounted.

  In recent years, light emitting devices equipped with LEDs have been widely used as backlight modules for liquid crystal panels from the viewpoint of power saving.

  In the above backlight module or the like, since it is necessary to have a constant light emission color, there are a method of using only a specific color LED device as the LED device to be mounted, and some predetermined colors as shown in FIG. A method of making the average emission color from the light emitting device constant by mounting the LED chips 1 and 2 in combination is adopted.

  Further, in Japanese Patent Laid-Open No. 2006-303140 (Patent Document 1), as shown in FIG. 22, the light emission characteristics of the LED chip 6 are measured in a state where the LED chip 6 is directly mounted on the light emitting device body 8 of the light emitting device 5. And rank. On the other hand, the wavelength converter 7 is designed and manufactured for each rank in advance corresponding to the rank of the LED chip 6. And it is proposed to select and combine an appropriate wavelength converter 7 for the LED chip 6 according to the rank, and to make the light emission color of a light emitting device unit using a plurality of such light emitting devices 5 constant. Yes.

  However, in the case of the above-described conventional method of using only a specific color LED device or a method of combining only the LED chips 1 and 2 of a predetermined color, the LED device or LED chip that can be used in the light emitting device. There is a problem that LED types and LED chips that cannot be used are generated.

  Further, in the light emitting device unit disclosed in Patent Document 1, when it is determined that there is no wavelength conversion unit 7 that can be combined based on the measurement result after mounting the LED chip 6, the LED chip 6 is mounted. There is a problem that the LED chip 6 needs to be replaced by discarding or reworking.

JP 2006-303140 A

  SUMMARY OF THE INVENTION An object of the present invention is to provide a light emitting device that can correctly obtain a target emission color from a plurality of LED chips that exhibit different emission colors.

In order to solve the above problems, a light-emitting device of the present invention includes:
Two or more LED chips exhibiting two or more different emission colors;
A wavelength conversion unit having different wavelength conversion characteristics for sealing each of the LED chips exhibiting different emission colors, and
The wavelength conversion unit includes a plurality of phosphors that absorb light of different wavelength components from light emitted from the sealed LED chip and convert the light into light of other wavelength components. It is a feature.

  According to the above configuration, each of the two or more LED chips exhibiting two or more different emission colors absorbs light of different wavelength components from the light emitted from the LED chip, and emits light of other wavelength components. It is sealed by a wavelength conversion unit having a plurality of phosphors that convert to a wavelength conversion characteristic different from each other. Therefore, if the wavelength conversion characteristic of the wavelength conversion unit is set so that the color of light emitted through the wavelength conversion unit becomes a target color by changing the ratio of the plurality of phosphors. Thus, a target emission color can be obtained correctly from a plurality of LED chips exhibiting different emission colors.

  That is, according to this invention, since the wavelength conversion characteristic of the said wavelength conversion part can be set according to the said LED chip to be used, it can prevent generating the LED chip which cannot be used. Therefore, it is not necessary to replace the LED chip by discarding or reworking.

In the light-emitting device of one embodiment,
The LED chip that exhibits at least one of the two or more different emission colors is composed of two or more LED chips,
Of the two or more LED chips exhibiting one emission color, adjacent LED chips are continuously sealed by the wavelength conversion unit having the same wavelength conversion characteristics.

  According to this embodiment, LED chips adjacent to each other that exhibit one emission color are continuously sealed by the wavelength conversion unit having the same wavelength conversion characteristics. Therefore, compared with the case where the LED chips adjacent to each other are individually sealed by the wavelength conversion unit having the same wavelength conversion characteristic, the number of man-hours can be reduced and the cost can be reduced.

In the light-emitting device of one embodiment,
Among the two or more LED chips exhibiting one emission color, the LED chip different from the LED chip continuously sealed by the wavelength conversion unit having the same wavelength conversion characteristic is the same wavelength conversion. It is sealed with a wavelength conversion section having the same wavelength conversion characteristics as the wavelength conversion section having characteristics.

  According to this embodiment, even for LED chips other than the LED chips adjacent to each other that exhibit the above one emission color, the target light emission is more correctly achieved by sealing with the wavelength conversion unit having the same wavelength conversion characteristics. Color can be obtained.

In the light-emitting device of one embodiment,
The wavelength conversion parts having different wavelength conversion characteristics are continuously formed.

  According to this embodiment, since the wavelength conversion parts having different wavelength conversion characteristics are also formed continuously from each other, the man-hours can be further reduced as compared with the case where they are individually formed, and the cost can be reduced. Can be achieved.

In the light-emitting device of one embodiment,
The colors of light emitted from the LED chips via the wavelength converter are all the same color.

  According to this embodiment, since the colors of light emitted from the LED chips via the wavelength conversion unit are all the same color, they can be used as a backlight module of a liquid crystal panel.

In the light-emitting device of one embodiment,
The wavelength conversion characteristic is set by setting the ratio of the plurality of phosphors included in the wavelength conversion unit to a ratio corresponding to the emission color of the LED chip being sealed.

  According to this embodiment, by setting the ratio of the plurality of phosphors included in the wavelength conversion unit to a ratio corresponding to the emission color of the LED chip, the wavelength conversion characteristics in each wavelength conversion unit are set. Has been. Therefore, when the LED chip is sealed with the wavelength conversion unit, for example, by changing the ratio of the supply amount of the wavelength conversion material including the first phosphor and the wavelength conversion material including the second phosphor. The wavelength conversion characteristic of the wavelength converter can be set to a characteristic corresponding to the emission color of the LED chip.

  As a result, it is possible to easily set the wavelength conversion characteristics of the wavelength conversion unit according to the LED chip to be used, and it is possible to correctly obtain a target emission color from a plurality of LED chips exhibiting different emission colors. it can.

In the light-emitting device of one embodiment,
The wavelength conversion unit sets the ratio of the plurality of phosphors included to a ratio corresponding to the emission color of the LED chip being sealed, and the thickness for sealing the LED chip is the LED The wavelength conversion characteristic is set by setting the thickness according to the emission color of the chip.

  According to this embodiment, the ratio of the plurality of phosphors included in the wavelength conversion unit is set to a ratio corresponding to the emission color of the LED chip, and the thickness of the wavelength conversion unit is set to the emission color of the LED chip. By setting the thickness according to the above, the wavelength conversion characteristic in each wavelength conversion unit is set. Therefore, when sealing the LED chip with the wavelength conversion unit, for example, by changing the ratio of the supply amount of the wavelength conversion material containing the first phosphor and the wavelength conversion material containing the second phosphor, The wavelength conversion characteristic of the wavelength conversion part is roughly set to a characteristic corresponding to the emission color of the LED chip, and the thickness of the wavelength conversion part on the LED chip is adjusted according to the emission color of the LED chip. Thus, the wavelength conversion characteristic of the wavelength conversion unit can be more accurately set to the characteristic corresponding to the emission color of the LED chip.

  As is clear from the above, the light emitting device of the present invention absorbs two or more LED chips exhibiting two or more different emission colors, and absorbs light of different wavelength components from the light emitted from the LED chip. It is sealed by a wavelength conversion unit having a plurality of phosphors having different wavelength conversion characteristics. Therefore, the wavelength conversion characteristic of the wavelength conversion unit is set so that the specific color of the light emitted through the wavelength conversion unit becomes the target color by changing the ratio of the plurality of phosphors. Therefore, the target emission color can be obtained correctly from a plurality of LED chips that exhibit different emission colors.

  That is, according to this invention, since the wavelength conversion characteristic of the said wavelength conversion part can be set according to the said LED chip to be used, it can prevent generating the LED chip which cannot be used. Therefore, it is not necessary to replace the LED chip by discarding or reworking.

It is a longitudinal cross-sectional view in the light-emitting device of 1st Embodiment of this invention. It is a figure which shows the manufacturing method of the light-emitting device shown in FIG. It is a longitudinal cross-sectional view in the light-emitting device of 2nd Embodiment. It is a figure which shows the manufacturing method of the light-emitting device shown in FIG. It is a longitudinal cross-sectional view in the light-emitting device of 3rd Embodiment. It is a figure which shows the manufacturing method of the light-emitting device shown in FIG. It is a figure which shows the manufacturing method following FIG. It is a longitudinal cross-sectional view in the modification of 3rd Embodiment. It is a figure which shows the manufacturing method of the light-emitting device shown in FIG. It is a longitudinal cross-sectional view in the light-emitting device of 4th Embodiment. It is a figure which shows the manufacturing method of the light-emitting device shown in FIG. It is a longitudinal cross-sectional view in the light-emitting device of 5th Embodiment. It is a figure which shows the manufacturing method of the light-emitting device shown in FIG. It is a longitudinal cross-sectional view in the light-emitting device of 6th Embodiment. It is a figure which shows the manufacturing method of the said light-emitting device shown in FIG. It is a figure which shows the manufacturing method following FIG. It is a longitudinal cross-sectional view in the modification of 6th Embodiment. It is a figure which shows the manufacturing method of the light-emitting device shown in FIG. It is a figure which shows the manufacturing method following FIG. It is a figure which shows the modification of the manufacturing method shown to FIG. 15 and FIG. It is a figure which shows the conventional backlight module. It is a figure which shows the light-emitting device unit disclosed by patent document 1. FIG.

  Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments.

First Embodiment FIG. 1 is a longitudinal sectional view of a light emitting device according to the present embodiment. As shown in FIG. 1, in the light emitting device 11 according to the present embodiment, two or more (three in the present embodiment) LED chips 13a to 13c are mounted on a substrate 12, and each LED chip 13a to 13c is mounted. 13c exhibits different emission colors. And each LED chip 13a-13c is covered with the wavelength conversion parts 14a-14c from which conversion wavelength differs, respectively, and radiates | emits the light of the target luminescent color. Here, the wavelength conversion unit 14a contains a phosphor that absorbs light of a specific wavelength component emitted from the LED chip 13a and generates light of different wavelengths. Similarly, the other wavelength converters 14b and 14c contain phosphors that absorb light of specific wavelength components emitted from the LED chips 13b and 13c and generate light of different wavelengths, and as a result, each wavelength. The light of the same target emission color is emitted from the conversion units 14a to 14c.

  FIG. 2 shows a method for manufacturing the light emitting device 11 shown in FIG. In the manufacturing method of the light emitting device 11, first, as shown in FIG. 2A, LED chips 13a to 13c having known light emission characteristics are mounted on the substrate 12 by, for example, a flip chip mounting method. Next, as shown in FIG. 2B, wavelength conversion materials 15a and 15b having different wavelength conversion characteristics are supplied to the respective LED chips 13a to 13c.

  Here, for example, the light emission color of the LED chip 13b has a strong A color, and the light emission color of the LED chip 13c has almost half the intensity of the A color and the B color. It is assumed that the light emission color of the chip 13a is slightly stronger in the A color than in the B color. In this case, as shown in FIG. 2 (b), the LED chip 13b absorbs the A wavelength component and converts it into a C wavelength component which is a complementary color of A (or a different color). Only the wavelength conversion material 15a containing the phosphor is supplied from the nozzle 16b. The B color is an intermediate color between the A color and the C color.

  The LED chip 13c is supplied with the wavelength converting material 15a from the nozzle 16c, while absorbing the C wavelength component and converting the wavelength component into an A wavelength component which is a complementary color of C (or a different color). The wavelength conversion material 15b containing the phosphor to be supplied is supplied from the nozzle 16c ′ by the same amount as the wavelength conversion material 15a. Further, the wavelength conversion material 15a is supplied to the LED chip 13a from the nozzle 16a, while the wavelength conversion material 15b is supplied from the nozzle 16a ′ in a smaller amount than the wavelength conversion material 15a.

  Here, the supply amount is expressed by the size of the wavelength conversion materials 15a and 15b drawn at the tips of the nozzles 16a, 16a ′, 16b, 16c and 16c ′. The same applies to FIG. 4, FIG. 11, and FIG.

  And as shown in FIG.2 (c), the wavelength conversion material 15a supplied to LED chip 13b becomes the wavelength conversion part 14b. The wavelength conversion material 15a and the wavelength conversion material 15b supplied to the LED chip 13c in substantially the same amount become the wavelength conversion unit 14c. The wavelength conversion material 15a supplied to the LED chip 13a and the wavelength conversion material 15b in an amount smaller than the wavelength conversion material 15a become the wavelength conversion unit 14a.

  In this case, each of the LED chip 13a and the LED chip 13c contains a phosphor that absorbs the A wavelength component and converts the wavelength component into a C wavelength component that is a complementary color (or a different color) of the A color. The conversion material 15a and the wavelength conversion material 15b containing a phosphor that absorbs the C wavelength component and converts the wavelength of the C color component to the A color wavelength component, which is a complementary color of C (or a different color), are supplied from different nozzles. I am trying to supply. Therefore, the amount of the wavelength conversion material 15a and the wavelength conversion material 15b to be supplied depends on the difference in the intensity balance between the A color and the B color in the LED chip 13a and the LED chip 13c. By changing the balance, the color of the light emitted from each of the wavelength converters 14a to 14c can be aligned with the target emission color. Furthermore, the defect of the light-emitting device 11 resulting from the emission color of the LED chips 13a to 13c can be reduced.

  In other words, in the present embodiment, the wavelength conversion characteristics of the wavelength conversion units 14a to 14c correspond to the ratio of phosphors having a plurality of wavelength conversion characteristics included in accordance with the emission color of the sealed LED chip. It is set by making the ratio.

  As a result, according to the present embodiment, there is no occurrence of unusable LED chips as in the case of the method using only the LED device of the target color or the method of using only the LED chip of a predetermined color. . Furthermore, when the LED device or the LED chip is mounted and the emission color becomes different from the target, it is not necessary to discard the obtained light emitting device or replace the LED device or the LED chip by rework. Further, as in the case of the light emitting device unit disclosed in Patent Document 1, since there is no wavelength conversion unit that can be combined in the wavelength conversion unit prepared in advance, it is not necessary to discard or rework.

Second Embodiment FIG. 3 is a longitudinal sectional view of a light emitting device according to the present embodiment. As shown in FIG. 3, in the light emitting device 21 according to the present embodiment, two or more (three in this embodiment) LED chips 23 a to 23 c are mounted on a substrate 22. However, in the present embodiment, two or more (two in the present embodiment) LED chips 23a and 23b adjacent to each other among the three LED chips 23a to 23c have the same emission color. The other one or more (one in the present embodiment) LED chip 23c exhibits different emission colors.

  The two LED chips 23a and 23b adjacent to each other are covered with a wavelength conversion unit 24a having the same conversion wavelength, and emit light of a target emission color. Further, the remaining one LED chip 23c is covered with a wavelength conversion unit 24b having a conversion wavelength different from that of the wavelength conversion unit 24a, and emits light of the target emission color.

  Here, the wavelength conversion unit 24a contains a phosphor that absorbs light of a specific wavelength component emitted from the LED chips 23a and 23b and generates light of different wavelengths. Similarly, the other wavelength converter 24b contains a phosphor that absorbs light of a specific wavelength component emitted from the LED chip 23c and generates light of a different wavelength. As a result, light of the same target emission color is emitted from the wavelength conversion units 24a and 24b.

  FIG. 4 shows a method for manufacturing the light emitting device 21 shown in FIG. First, as shown in FIG. 4A, LED chips 23a to 23c having known light emission characteristics are mounted on a substrate 22 by, for example, a flip chip mounting method. Next, as shown in FIG. 4B, wavelength conversion materials 25a and 25b having different wavelength conversion characteristics are supplied to the LED chip 23a and the LED chip 23c.

  Here, for example, the emission color of the LED chip 23c is approximately half the intensity of the A color and the B color, and the emission color of the LED chips 23a and 23b is the A color. Is slightly stronger than the B color. In this case, as shown in FIG. 4B, the LED chip 23c absorbs the wavelength component of A color and converts it into a wavelength component of C color which is the complementary color (or different color) of A color. A wavelength conversion material 25a containing a phosphor is supplied from a nozzle 26b, while a phosphor that absorbs a C wavelength component and converts the wavelength into an A wavelength component that is a complementary color of C (or a different color) is contained. The wavelength conversion material 25b to be supplied is supplied from the nozzle 26b 'by substantially the same amount as the wavelength conversion material 25a. In addition, the wavelength conversion material 25a is supplied to the LED chip 23a from the nozzle 26a, while the wavelength conversion material 25b is supplied from the nozzle 26a ′ in a smaller amount than the wavelength conversion material 25a.

  Next, as shown in FIG. 4C, the supply of the wavelength conversion material 25a from the nozzle 26b to the LED chip 23c and the supply of the wavelength conversion material 25b from the nozzle 26b ′ are terminated. The wavelength conversion material 25a and the wavelength conversion material 25b supplied in the same amount to the LED chip 23c become the wavelength conversion unit 24b. On the other hand, the nozzle 26a supplying the wavelength conversion material 25a and the nozzle 26a ′ supplying the wavelength conversion material 25b are moved to the LED chip 23b side adjacent to the LED chip 23a. Then, the wavelength conversion material 25a is supplied from the nozzle 26a to the LED chip 23b, while the wavelength conversion material 25b is supplied from the nozzle 26a ′ in a smaller amount than the wavelength conversion material 25a. Meanwhile, the wavelength conversion material 25a and the wavelength conversion material 25b supplied to the LED chip 23a become the wavelength conversion unit 24a.

  Next, as shown in FIG. 4D, the supply of the wavelength conversion material 25a from the nozzle 26a to the LED chip 23b and the supply of the wavelength conversion material 25b from the nozzle 26a ′ are terminated. Thus, the supplied wavelength conversion material 25a and the wavelength conversion material 25b become the wavelength conversion unit 24a. As a result, the LED chip 23a and the LED chip 23b that are adjacent to each other and emit the same emission color are covered with the wavelength conversion unit 24a having the same wavelength conversion characteristics.

  In this case, the LED chips 23a to 23c include a wavelength conversion material 25a containing a phosphor that absorbs the wavelength component of A and converts it into a wavelength component of C that is a complementary color of A (or a different color). And a wavelength conversion material 25b containing a phosphor that absorbs the C wavelength component and converts the wavelength of the C color component to the A wavelength component, which is a complementary color of C (or a different color), is supplied from different nozzles. I have to. Therefore, the amount of the wavelength conversion material 25a and the wavelength conversion material 25b to be supplied according to the difference in the intensity balance between the A color and the B color in the LED chips 23a and 23b and the LED chip 23c. By changing the balance, the color of the light emitted from each of the wavelength converters 24a to 24c can be aligned with the target emission color. Furthermore, the defect of the light-emitting device 21 resulting from the luminescent color of LED chip 23a-23c can be reduced.

  Further, the LED chip 23a and the LED chip 23b that are adjacent to each other and that emit the same emission color are connected to each other from the nozzle 26a and the nozzle 26a ′ that move in synchronization with each other, from the wavelength conversion material 25a and the wavelength conversion material 25b. It is continuously supplied and sealed. Accordingly, the number of man-hours can be reduced as compared with the case where the LED chip 23a and the LED chip 23b are separately supplied and sealed.

  In the present embodiment, the LED chips that emit the same emission color are described as two LED chips 23a and 23b adjacent to each other. The light-emitting device to which this embodiment can be applied is not limited to this. For example, when there are n (n ≧ 2) LED chips that are adjacent to each other and m LED chips that are separated from each other as LED chips that emit the same emission color, the n chips that are adjacent to each other are included. LED chips may be sealed by continuously supplying the same wavelength conversion material by moving nozzles, and the separated m LED chips may be individually sealed by supplying the same wavelength conversion material. . In that case, n ′ of the n LED chips adjacent to each other may be sealed by supplying the same wavelength conversion material separately from (n−n ′).

Third Embodiment FIG. 5 is a longitudinal sectional view of a light emitting device according to the present embodiment. As shown in FIG. 5, in the light emitting device 31 according to the present embodiment, two or more (three in the present embodiment) LED chips 33a to 33c are mounted on a substrate 32, and each LED chip 33a to 33c is mounted. 33c exhibits different emission colors. And each LED chip 33a-33c is continuously covered with the wavelength conversion parts 34a-34c from which conversion wavelength differs, respectively, and radiates | emits the light of the target luminescent color. Here, the wavelength converter 34a contains a phosphor that absorbs light of a specific wavelength component emitted from the LED chip 33a and generates light of different wavelengths. Similarly, the other wavelength converters 34b and 34c contain phosphors that absorb light of specific wavelength components emitted from the LED chips 33b and 33c and generate light of different wavelengths, and as a result, each wavelength. The light of the same target emission color is emitted from the conversion units 34a to 34c.

  6 and 7 show a method for manufacturing the light-emitting device 31 shown in FIG. First, as shown in FIG. 6A, LED chips 33a to 33c having known light emission characteristics are mounted on a substrate 32 by, for example, a flip chip mounting method.

  Here, for example, the light emission color of the LED chip 33b has a strong A color, and the light emission color of the LED chip 33a is slightly stronger in the A color than in the B color. It is assumed that the light emission color of the A color is slightly weaker than the B color. In that case, the LED chip 33b includes only a wavelength conversion material 35a containing a phosphor that absorbs the wavelength component of A and converts it into a wavelength component of C color that is a complementary color of A (or a different color). Supply. In addition, the LED chip 33a contains a phosphor that supplies the wavelength conversion material 35a and converts the wavelength component of the C color into the wavelength component of the A color that is a complementary color (or a different color) of the C color. The wavelength conversion material 35b to be supplied is supplied in a smaller amount than the wavelength conversion material 35a. Further, the wavelength conversion material 35a may be supplied to the LED chip 33c while the wavelength conversion material 35b may be supplied in a larger amount than the wavelength conversion material 35a.

  That is, the same wavelength conversion material 35a and wavelength conversion material 35b may be supplied to any of the LED chips 33a to 33c by simply changing the amounts. Therefore, in the present embodiment, supply is performed while continuously moving the nozzle 36a for supplying the wavelength conversion material 35a and the nozzle 36b for supplying the wavelength conversion material 35b to all the LED chips 33a to 33c. The wavelength converters 34a to 34c are continuously formed by changing the amount.

  Here, the supply amount is represented by the size of the arrow drawn accompanying the nozzles 36a and 36b. The same applies to FIG. 9, FIG. 15, FIG. 16, FIG. 18, and FIG.

  First, as shown in FIG. 6B, the nozzle 36a for supplying the wavelength conversion material 35a and the nozzle 36b for supplying the wavelength conversion material 35b are moved from the LED chip 33a side to the LED chip 33b side. As shown in FIG. 6C, the wavelength conversion material 35a is supplied from the nozzle 36a to the LED chip 33a, while the wavelength conversion material 35b is supplied from the nozzle 36b in a smaller amount than the wavelength conversion material 35a. Thus, the wavelength conversion unit 34a is formed on the LED chip 33a.

  Next, when the nozzle 36a and the nozzle 36b reach an intermediate position between the LED chip 33a and the LED chip 33b, the supply of the wavelength conversion material 35b from the nozzle 36b is stopped, as shown in FIG. 7 (d). Only the wavelength conversion material 35a is supplied from the nozzle 36a to the LED chip 33b. In this way, the wavelength conversion part 34b is formed on the LED chip 33b.

  Next, when the nozzle 36a and the nozzle 36b reach an intermediate position between the LED chip 33b and the LED chip 33c, supply of the wavelength conversion material 35b from the nozzle 36b is started, as shown in FIG. 7 (e). The wavelength conversion material 35a is supplied from the nozzle 36a to the LED chip 33c, while the wavelength conversion material 35b is supplied from the nozzle 36b in a larger amount than the wavelength conversion material 35a. In this way, the wavelength converter 34c is formed on the LED chip 33c.

  Thus, as shown in FIG. 7 (f), the LED chips 33a to 33c are continuously covered with the wavelength conversion units 34a to 34c having different wavelength conversion characteristics.

  In this case, the LED chips 33a to 33c include a wavelength conversion material 35a containing a phosphor that absorbs the wavelength component of A and converts the wavelength component into a wavelength component of C that is a complementary color of A (or a different color). And a wavelength conversion material 35b containing a phosphor that absorbs the C wavelength component and converts the wavelength of the C color component to the A wavelength component which is a complementary color (or a different color) of the C color, from different nozzles 36a and 36b. I am trying to supply. Therefore, the balance of the amount of the supplied wavelength conversion material 35a and the wavelength conversion material 35b is changed according to the difference in the intensity balance between the A color and the B color in the LED chips 33a to 33c. By doing so, the color of the light emitted from each of the wavelength converters 34a to 34c can be aligned with the target emission color. Furthermore, the defect of the light-emitting device 2 resulting from the luminescent color of LED chip 33a-33c can be reduced.

  Further, the wavelength conversion material 35a and the wavelength conversion material 35b are continuously supplied to all the LED chips 33a to 33c in different amounts from the nozzle 36a and the nozzle 36b that move in synchronization with each other. It is trying to seal. Therefore, the man-hour can be further reduced.

  As a modification of the present embodiment, like the light emitting device 41 shown in FIG. 8, the LED chips 43a and 43b adjacent to each other among the LED chips 43a to 43c mounted on the substrate 42 have the same emission color. When the other LED chips 43c exhibit different emission colors, the nozzle 46a for supplying the wavelength conversion material 45a and the nozzle 46b for supplying the wavelength conversion material 45b are moved from the LED chip 43a side to the LED chip 43b side. While moving, as shown in FIG. 9B and FIG. 9C, the wavelength conversion material 45a is supplied from the nozzle 46a to the LED chip 43a and the LED chip 43b, while the wavelength conversion material 45b is supplied to the nozzle 46b. Is supplied in a smaller amount than the wavelength converting material 45a. In this way, the wavelength conversion part 44a is formed on the LED chip 43a and the LED chip 43b.

  Further, when the nozzle 46a and the nozzle 46b reach an intermediate position between the LED chip 43b and the LED chip 43c, as shown in FIG. 9D, the wavelength conversion material 45a is inserted into the nozzle 46a with respect to the LED chip 43c. On the other hand, the wavelength conversion material 45b is supplied from the nozzle 46b in a larger amount than the wavelength conversion material 45a. Thus, the wavelength conversion unit 44b is formed on the LED chip 43c.

  As described above, as shown in FIG. 9 (e), the LED chips 43a to 43c are continuously connected by the wavelength converters 44a and 44b having different characteristics by the nozzle 46a and the nozzle 46b that move in synchronization with each other. Can be covered.

  In the first to third embodiments, the case where light emitted from all LED chips is emitted as light having the same target emission color through corresponding wavelength conversion units will be described as an example. However, the present invention is not limited to this.

  For example, the emission color of the light emitted from the combination of each LED chip and each wavelength conversion unit may be different depending on the purpose, or averaged over a fixed range to be the same emission color. You may design.

Fourth Embodiment FIG. 10 is a longitudinal sectional view of a light emitting device according to the present embodiment. As shown in FIG. 10, in the light emitting device 51 in the present embodiment, two or more (three in the present embodiment) LED chips 53a to 53c are mounted on a substrate 52, and each of the LED chips 53a to 53c is mounted. 53c exhibits different emission colors. The LED chips 53a to 53c are individually covered with wavelength conversion units 54a to 54c having the same conversion wavelength, and emit light of a target emission color. Here, the wavelength conversion parts 54a-54c contain the fluorescent substance which absorbs the light of the specific wavelength component radiated | emitted from LED chip 53a-53c, and generate | occur | produces the light of a different wavelength. As a result, light of the same target emission color is emitted from each of the wavelength converters 54a to 54c.

  FIG. 11 shows a method for manufacturing the light emitting device 51 shown in FIG. In the manufacturing method of the light emitting device 51, first, as shown in FIG. 11A, LED chips 53a to 53c whose light emission characteristics are known are mounted on a substrate 52 by, for example, a flip chip mounting method. Next, as shown in FIG. 11B, a wavelength conversion material 55 having the same conversion wavelength is supplied to each of the LED chips 53a to 53c.

  Here, for example, it is assumed that the emission color of the LED chip 53b is A, the emission color of the LED chip 53c is B, and the emission color of the LED chip 53a is an intermediate color between A and B. In this case, as shown in FIG. 11 (b), the LED chip 53a absorbs the B wavelength component and converts the wavelength component to the A wavelength component which is the complementary color (or different color) of B color. A predetermined amount of the wavelength converting material 55 containing the body is supplied from the nozzle 56a. Further, the wavelength conversion material 55 is supplied to the LED chip 53b from the nozzle 56b in a smaller amount than in the case of the LED chip 53a. Further, the wavelength conversion material 55 is supplied to the LED chip 53c from the nozzle 56c in a larger amount than in the case of the LED chip 53a.

  And as shown in FIG.11 (c), the wavelength conversion material 55 supplied to the said LED chip 53a becomes the wavelength conversion part 54a which covers the LED chip 53a by predetermined thickness. The wavelength conversion material 55 supplied to the LED chip 53b becomes a wavelength conversion unit 54b that covers the LED chip 53b thinner than the predetermined thickness. The wavelength conversion material 55 supplied to the LED chip 53c becomes a wavelength conversion unit 54c that covers the LED chip 53c thicker than the predetermined thickness. In this way, according to the intensity of the B color in the emission colors from the LED chips 53a to 53c, the B wavelength component is absorbed and converted into the A wavelength component which is the complementary color (or different color) of the B color. By changing the amount of the wavelength conversion material 55 containing the phosphor to be wavelength-converted, the same target light emission color can be emitted from the respective wavelength conversion units 54a to 54c.

  That is, in the present embodiment, the wavelength conversion characteristics are set by changing the absorption amount of the light of the specific wavelength component by changing the thickness of the wavelength conversion units 54a to 54c having the same conversion wavelength. In other words, the wavelength conversion characteristics of the wavelength conversion parts 54a to 54c are such that the ratio of the phosphors contained is a fixed ratio, and the thickness for sealing the LED chips 53a to 53c is set to a thickness corresponding to the emission color of the LED chips 53a to 53c. It is set by doing.

  In this case, the LED chips 53a to 53c include a wavelength conversion material 55 containing a phosphor that absorbs the B wavelength component and converts the wavelength component to the A wavelength component which is the complementary color (or different color) of the B color. Are supplied from different nozzles 56a to 56c. Therefore, by changing the amount of the wavelength conversion material 55 supplied according to the intensity of the B color in the LED chips 53a to 53c, the light emitted from each of the wavelength conversion units 54a to 54c is changed. The color can be aligned with the target emission color. Furthermore, it is possible to reduce defects in the light emitting device 51 due to the emission colors of the LED chips 53a to 53c.

  Furthermore, the wavelength conversion material 55 having the same conversion wavelength is supplied to the LED chips 53a to 53c. Therefore, as in the first embodiment, the number of man-hours can be reduced and the cost can be reduced as compared with the case where wavelength conversion materials having different conversion wavelengths are supplied.

Fifth Embodiment FIG. 12 is a longitudinal sectional view of a light emitting device according to the present embodiment. As shown in FIG. 12, in the light emitting device 61 in the present embodiment, two or more (three in this embodiment) LED chips 63 a to 63 c are mounted on a substrate 62. However, in the present embodiment, two or more (two in the present embodiment) LED chips 63a and 63b adjacent to each other among the three LED chips 63a to 63c have the same emission color. One or more (one in the present embodiment) LED chips 63c exhibit different emission colors.

  The two LED chips 63a and 63b adjacent to each other are covered with a predetermined thickness by the wavelength conversion unit 64a having the same conversion wavelength, and emit light of a target emission color. Further, the remaining one LED chip 63c is covered with a wavelength conversion unit 64b having the same conversion wavelength as that of the wavelength conversion unit 64a to be thinner than the predetermined thickness, and emits light of the target emission color. ing.

  Here, the wavelength conversion unit 64a contains a phosphor that absorbs light of a specific wavelength component emitted from the LED chips 63a and 63b and generates light of different wavelengths. Similarly, the other wavelength converter 64b contains a phosphor that absorbs the light of the specific wavelength component emitted from the LED chip 63c and generates the light of the different wavelength. As a result, the light of the same target emission color is emitted from the wavelength converters 64a and 64b.

  FIG. 13 shows a manufacturing method of the light emitting device 61 shown in FIG. First, as shown in FIG. 13A, LED chips 63a to 63c whose emission characteristics are known are mounted on a substrate 62 by, for example, a flip chip mounting method. Next, as shown in FIG. 13B, a wavelength conversion material 65 having the same conversion wavelength is supplied to the LED chip 63a and the LED chip 63c.

  Here, for example, the emission color of the LED chip 63c is A, and the emission color of the LED chips 63a and 63b is an intermediate color between the A color and the B color. In this case, as shown in FIG. 13B, the LED chip 63a absorbs the B wavelength component and converts the wavelength component into the A wavelength component which is the complementary color (or different color) of B color. A wavelength conversion material 65 containing a phosphor is supplied from the nozzle 66a so as to cover the LED chip 63a with a predetermined thickness. Further, the wavelength converting material 65 is supplied to the LED chip 63c so as to cover the LED chip 63c thinner than the LED chip 63a from the nozzle 66b.

  Next, as shown in FIG. 13C, the supply of the wavelength conversion material 65 from the nozzle 66b to the LED chip 63c is terminated. The wavelength conversion material 65 supplied to the LED chip 63c becomes the wavelength conversion unit 64b that covers the LED chip 63c thinner than the predetermined thickness. On the other hand, the nozzle 66a supplying the wavelength converting material 65 is moved to the LED chip 63b side adjacent to the LED chip 63a as it is. Then, the wavelength conversion material 65 is supplied from the nozzle 66a so as to cover the LED chip 63b with the predetermined thickness. Meanwhile, the wavelength conversion material 65 supplied to the LED chip 63a becomes the wavelength conversion unit 64a that covers the LED chip 63c with the predetermined thickness.

  Next, as shown in FIG. 13D, the supply of the wavelength conversion material 65 from the nozzle 66a to the LED chip 63b is terminated. Thus, the supplied wavelength converting material 65 becomes the wavelength converting portion 64a that covers the LED chip 63b with the predetermined thickness. As a result, the LED chip 63a and the LED chip 63b that are adjacent to each other and emit the same emission color are continuously covered with the wavelength conversion unit 64a having the same conversion wavelength.

  That is, in the present embodiment, different wavelength conversion characteristics are set by changing the amount of absorption of the light of the specific wavelength component by changing the thickness of the wavelength conversion units 64a and 64b having the same conversion wavelength.

  In this case, the LED chips 63a to 63c include a wavelength conversion material 65 containing a phosphor that absorbs the B wavelength component and converts the wavelength component to the A wavelength component which is a complementary color (or a different color) of B color. Are supplied from different nozzles 66a and 66b. Therefore, by changing the amount of the wavelength conversion material 65 supplied according to the intensity of the B color tint in the LED chips 63a and 63b and the LED chip 63c, the wavelength conversion units 64a and 64b can be changed. The color of the emitted light can be matched to the target emission color. Furthermore, it is possible to reduce defects in the light emitting device 61 due to the emission colors of the LED chips 63a to 63c.

  Further, the LED chip 63a and the LED chip 63b that are adjacent to each other and emit the same emission color are continuously supplied from the moving nozzle 66a and sealed. Therefore, compared with the case where the LED chip 63a and the LED chip 63b are separately supplied and sealed, the number of man-hours can be reduced.

  Further, a wavelength conversion material 65 having the same conversion wavelength is supplied to the LED chips 63a to 63c. Therefore, as in the second embodiment, the number of man-hours can be reduced and the cost can be reduced as compared with the case where wavelength conversion materials having different conversion wavelengths are supplied.

  In the present embodiment, the LED chips that emit the same emission color are described as two LED chips 63a and 63b adjacent to each other. The light-emitting device to which this embodiment can be applied is not limited to this. For example, when there are n (n ≧ 2) LED chips that are adjacent to each other and m LED chips that are separated from each other as LED chips that emit the same emission color, the n chips that are adjacent to each other are included. LED chips may be sealed by continuously supplying the same wavelength conversion material by moving nozzles, and the separated m LED chips may be individually sealed by supplying the same wavelength conversion material. . In that case, n ′ of the n LED chips adjacent to each other may be sealed by supplying the same wavelength conversion material separately from (n−n ′).

Sixth Embodiment FIG. 14 is a longitudinal sectional view of a light emitting device according to the present embodiment. As shown in FIG. 14, in the light emitting device 71 in the present embodiment, two or more (three in the present embodiment) LED chips 73a to 73c are mounted on a substrate 72, and each LED chip 73a to 73c is mounted. 73c exhibits different emission colors. And each LED chip 73a-73c is continuously covered by the wavelength conversion parts 74a-74c with the same conversion wavelength, and is covered with different thickness, and radiates | emits the light of the target luminescent color. Here, the wavelength conversion parts 74a-74c contain the fluorescent substance which absorbs the light of the specific wavelength component radiated | emitted from LED chip 73a-73c, and generate | occur | produces the light of a different wavelength.

  15 and 16 show a method for manufacturing the light emitting device 71 shown in FIG. First, as shown in FIG. 15A, LED chips 73a to 73c whose emission characteristics are known are mounted on a substrate 72 by, for example, a flip chip mounting method.

  Here, for example, it is assumed that the emission color of the LED chip 73b is A, the emission color of the LED chip 73c is B, and the emission color of the LED chip 73a is an intermediate color between A and B. In that case, as shown in FIG. 15C, while moving the nozzle 76 for supplying the wavelength converting material 75 from the LED chip 73a side to the LED chip 73b side, as shown in FIG. For the LED chip 73 a, a wavelength conversion material 75 containing a phosphor that absorbs the B wavelength component and converts the wavelength component to the A wavelength component that is the complementary color (or different color) of the B color from the nozzle 76. It supplies so that LED chip 73a may be covered by predetermined thickness. Thus, the wavelength conversion unit 74a that covers the LED chip 73a with the predetermined thickness is formed.

  Next, when the nozzle 76 reaches an intermediate position between the LED chip 73a and the LED chip 73b, the supply amount of the wavelength conversion material 75 from the nozzle 76 is decreased, and as shown in FIG. The wavelength conversion material 75 is supplied to the chip 73b so as to cover the LED chip 73b thinner than the predetermined thickness. Thus, the wavelength conversion unit 74b that covers the LED chip 73b with a thickness smaller than the predetermined thickness is formed.

  Next, when the nozzle 76 reaches an intermediate position between the LED chip 73b and the LED chip 73c, the supply amount of the wavelength conversion material 75 from the nozzle 76 is increased, and as shown in FIG. The wavelength conversion material 75 is supplied to the chip 73c so as to cover the LED chip 73c thicker than the predetermined thickness. Thus, the wavelength conversion unit 74c that covers the LED chip 73c with a thickness thicker than the predetermined thickness is formed.

  Thus, as shown in FIG. 16 (f), each of the LED chips 73a to 73c is continuously covered with the wavelength converters 74a to 74c having the same conversion wavelength and different thicknesses.

  That is, in the present embodiment, different wavelength conversion characteristics are set by changing the absorption amount of the light of the specific wavelength component by changing the thickness of the wavelength conversion units 74a to 74c having the same conversion wavelength.

  In this case, the LED chips 73a to 73c include a wavelength conversion material 75 containing a phosphor that absorbs the B wavelength component and converts the wavelength component to the A wavelength component which is the complementary color (or different color) of the B color. Are supplied from the same nozzle 76 by changing the supply amount. Therefore, by changing the amount of the wavelength conversion material 75 supplied according to the intensity of the B color in the emission colors of the LED chips 73a to 73c, the light is emitted from each of the wavelength conversion units 74a to 74c. The color of the light to be emitted can be aligned with the target emission color. Furthermore, the defect of the light-emitting device 71 resulting from the emission color of the LED chips 73a to 73c can be reduced.

  Furthermore, the wavelength conversion material 75 is continuously supplied from the nozzle 76 in different amounts to all the LED chips 73a to 73c and sealed. Therefore, the number of man-hours can be reduced.

  Further, a wavelength conversion material 75 having the same conversion wavelength is supplied to the LED chips 73a to 73c. Therefore, as in the third embodiment, the man-hours can be reduced and the cost can be reduced as compared with the case where wavelength conversion materials having different conversion wavelengths are supplied.

  As a modification in the present embodiment, like the light emitting device 81 shown in FIG. 17, the LED chips 83 a and 83 b adjacent to each other among the LED chips 83 a to 83 c mounted on the substrate 82 have the same emission color. When the other LED chips 83c exhibit different emission colors, the nozzle 86 that supplies the wavelength conversion material 85 is moved from the LED chip 83a side to the LED chip 83b side while moving the LED chip 83c to the LED chip 83b side. As shown in (d), the wavelength conversion material 85 is supplied from the nozzle 86 so as to cover the LED chip 83a and the LED chip 83b with a predetermined thickness. Thus, the wavelength conversion unit 84a that covers the LED chip 83a and the LED chip 83b with the predetermined thickness is formed.

  Further, when the nozzle 86 reaches an intermediate position between the LED chip 83b and the LED chip 83c, as shown in FIG. 19 (e), the supply amount of the wavelength conversion material 85 from the nozzle 86 is reduced with respect to the LED chip 83c. Reduced supply. Thus, the wavelength conversion unit 84b that covers the LED chip 83c thinner than the predetermined thickness is formed.

  As described above, as shown in FIG. 19E, each of the LED chips 83a to 83c is continuously covered by the moving nozzle 86 with the wavelength conversion units 84a and 84b having the same conversion wavelength and different thicknesses. be able to.

  In the fourth to sixth embodiments, the light emitted from all the LED chips is described as an example in which light of the same target emission color is emitted through the corresponding wavelength conversion unit. However, the present invention is not limited to this.

  For example, the emission color of the light emitted from the combination of each LED chip and each wavelength conversion unit may be different depending on the purpose, or averaged over a fixed range to be the same emission color. You may design.

  In the manufacturing method of the light emitting device 71 shown in FIG. 15 and FIG. 16, the supply amount is changed from the moving nozzle 76 according to the intensity of the B color in the emission color of the LED chips 73a to 73c. Thus, the wavelength conversion material 75 is supplied. In that case, when the viscosity of the wavelength conversion material 75 is low, the wavelength conversion material 75 flows from a location where the wavelength conversion material 75 is supplied to a thin location to a location where the wavelength conversion material 75 is supplied thinly, and the LED chips 73a to 73c have a desired thickness. The problem that it cannot be covered occurs.

  Therefore, as shown in FIG. 20A, a shallow concave portion 77 is formed around the place where the LED chips 73a to 73c are mounted on the surface of the substrate 72. And the narrow part 78a, 78b is formed by narrowing the width | variety of the recessed part 77 between LED chip 73a and LED chip 73b, and between LED chip 73b and LED chip 73c, and the circumference | surroundings of each LED chip 73a-73c, A circular recess 77 corresponding to the supply amount of the wavelength conversion material 75 is provided. For example, the wavelength conversion material 75 supplied to the LED chip 73a may not flow into the LED chip 73b. In that case, as shown in FIG.20 (b), it becomes possible to cover each LED chip 73a-73c with desired thickness by the wavelength conversion parts 74a-74c.

  Furthermore, as another embodiment, the first embodiment shown in FIG. 1 and the fourth embodiment shown in FIG. 10 may be used in combination. That is, for example, as in the first embodiment, even if the wavelength conversion material 15a and the wavelength conversion material 15b are supplied to the LED chip 13a and the LED chip 13c from different nozzles, the wavelength conversion units 14a to 14c. When the color of the light emitted from each of the wavelength conversion units cannot be matched with the target emission color, the thicknesses of the wavelength conversion units 14a to 14c are changed as in the fourth embodiment to change the wavelength conversion units. The color of the light emitted from each of 14a to 14c is correctly aligned with the target emission color.

  3 may be used in combination with the fifth embodiment shown in FIG. 12, or the third embodiment shown in FIG. 5 and the sixth embodiment shown in FIG. Even when used in combination with the first embodiment, or when the modified example of the third embodiment shown in FIG. 8 and the modified example of the sixth embodiment shown in FIG. The same operation as in the case of the combined use with the fourth embodiment is possible.

  In that case, the target emission color can be obtained accurately in any case of combination use. At the same time, it is possible to reduce defects in the light emitting device due to the emission color of the LED chip.

  In addition, in the said 1st Embodiment to the said 3rd Embodiment, two types of fluorescent substance which absorbs the wavelength component of a different color is contained, and each wavelength conversion part is comprised, However, Three or more types are comprised. A phosphor may be included. Similarly, in the fourth embodiment to the sixth embodiment, two or more kinds of phosphors may be included.

As an example of the phosphor, there is CaAlSiN ₃ : Eu when the conversion destination color is red, and there is a YAG phosphor when the color is green or yellow.

  The present invention can be applied to backlight modules and lighting devices such as liquid crystal panels, and electronic components, electrical components and electronic devices on which they are mounted.

11, 21, 31, 41, 51, 61, 71, 81 ... light emitting device,
12, 22, 32, 42, 52, 62, 72, 82 ... substrate,
13a-13c, 23a-23c, 33a-33c, 43a-43c, 53a-53c,
63a-63c, 73a-73c, 83a-83c ... LED chip,
14a-14c, 24a, 24b, 34a-34c, 44a, 44b, 54a-54c,
64a, 64b, 74a to 74c, 84a, 84b ... wavelength conversion unit,
15a, 15b, 25a, 25b, 35a, 35b, 45a, 45b, 55,
65, 75, 85 ... wavelength conversion material,
16a, 16a ', 16b, 16c, 16c', 26a, 26a ', 26b, 26b', 36a, 36b,
46a, 46b, 56a, 56b, 56c, 66a, 66b, 76, 86 ... Nozzle,
77 ... concave,
78a, 78b ... Stenosis.

Claims (7)

Two or more light emitting diode chips exhibiting two or more different emission colors;
A wavelength conversion unit having different wavelength conversion characteristics for sealing each of the light emitting diode chips exhibiting different emission colors, and
The wavelength conversion unit includes a plurality of phosphors that absorb light of different wavelength components from light emitted from the sealed light emitting diode chip and convert the light into light of other wavelength components. A light emitting device characterized by the above. The light-emitting device according to claim 1.
The light emitting diode chip exhibiting at least one light emission color of the two or more different light emission colors is composed of two or more light emitting diode chips,
Among the two or more light emitting diode chips exhibiting one light emission color, adjacent light emitting diode chips are continuously sealed by the wavelength conversion unit having the same wavelength conversion characteristic. Light emitting device. The light-emitting device according to claim 2.
A light emitting diode chip different from the light emitting diode chip continuously sealed by the wavelength conversion unit having the same wavelength conversion characteristic among the two or more light emitting diode chips exhibiting one light emission color is the same as the above. The light emitting device is sealed with a wavelength conversion unit having the same wavelength conversion characteristic as that of the wavelength conversion unit having the wavelength conversion characteristic. In the light-emitting device as described in any one of Claim 1- Claim 3,
The light emitting device, wherein the wavelength conversion units having different wavelength conversion characteristics are formed continuously with each other. In the light-emitting device as described in any one of Claim 1- Claim 4,
The light emitting device according to claim 1, wherein the light emitted from each of the light emitting diode chips through the wavelength conversion unit has the same color. The light-emitting device according to any one of claims 1 to 5,
The wavelength conversion section is configured such that the wavelength conversion characteristic is set by setting a ratio of the plurality of phosphors included to a ratio according to a light emission color of the sealed LED chip. A light emitting device characterized by the above. The light-emitting device according to any one of claims 1 to 5,
The wavelength conversion unit is configured such that the ratio of the plurality of phosphors included is a ratio according to the emission color of the light-emitting diode chip being sealed, and the thickness for sealing the light-emitting diode chip is The wavelength conversion characteristic is set by setting the thickness according to the light emission color of the light emitting diode chip.

Images