JP2015088172A - Cooling device and data center equipped with it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling apparatus for cooling a rack type server capable of increasing cooling performance by reducing the temperature of condensed working fluid.SOLUTION: A cooling apparatus 4 includes a heat receiving part 12, a heat release path 13, a heat radiation part 15, a feedback path 14 and a heat receiving part 12, which are connected to each other in order to form a circular negative pressure passage which is filled with a working fluid 17. The heat receiving part 12 is provided with a check valve 21 at the upstream thereof. The heat radiation part 15 includes: a heat release container 15a to which the heat release path 13 is connected at the upper side and the feedback path 14 is connected at the bottom side thereof; and plural cooling pipes 32 penetrating the heat release container 15a therein. The plural cooling pipes 32 are disposed in horizontal and vertical directions. The distance between the cooling pipes 32 neighboring in the vertical direction is smaller than the distance between the cooling pipes 32 neighboring in the horizontal direction.

Description

  The present invention relates to a cooling device and a data center including the same.

  In a power conversion circuit of a large power consumption electronic device or electric vehicle, a large current of several tens of amperes flows through the semiconductor switching element, so that a large amount of heat is generated in this portion.

  Therefore, conventionally, the semiconductor switching element is cooled by a cooling device using a loop heat pipe as in Patent Document 1, for example.

  Hereinafter, the loop heat pipe shown in Patent Document 1 will be described with reference to FIG.

  As shown in FIG. 7, the loop heat pipe includes a loop circuit 103 that includes a rising pipe 101 and a down pipe 102 separately, a heat medium 112 that is a working fluid sealed in the loop circuit 103 under vacuum, and a loop circuit 103. And a heating unit 113 positioned below the riser pipe 101 and a lower part in the loop circuit 103, and a heat in the loop circuit 103. And a check valve 107 that limits the circulation direction of the medium 112.

  Here, when heat is generated in the semiconductor switching element brought into contact with the heating unit 113, the generated heat is transmitted to the heating unit 113, and the heat is applied to the heat medium 112 circulating through the heating unit 113 and vaporizes.

  The circulation direction is restricted by the check valve 107, and the vaporized heat medium 112 rises up the ascending pipe 101 and is led to the cooler 105 to be cooled. Here, the heat applied by the heating unit 113 is released.

  The heat medium 112 that has released heat from the cooler 105 descends the downcomer 102 and circulates again to the heating unit 113 via the check valve 107.

JP 61-038396 A

  In such a conventional cooling device, a heat exchange pipe 111 for cooling is inserted into the cooler 105, and water is supplied to the heat exchange pipe 111 as a coolant, but it is vaporized. There is a problem that the contact probability between the heat medium 112 and the heat exchange pipe 111 is low, and the cooling capacity of the cooler 105 is low.

  Further, for the purpose of cooling the semiconductor switching element, it is necessary to lower the temperature of the heat medium 112 condensed by releasing heat from the cooler 105, and it is required to lower the temperature of the condensed heat medium 112. .

  Therefore, the present invention aims to reduce the temperature of the condensed heat medium (hereinafter referred to as working fluid) and increase the cooling capacity.

  In order to achieve this object, the present invention is a cooling device that cools a rack-type server including a plurality of electronic devices having electronic components in a housing, and includes a heat receiving part, a heat radiation path, a heat radiation part, a return path, The heat receiving part is connected in order to form an annular negative pressure path in which a working fluid is stored, and the heat receiving part is provided with a check valve upstream of the heat receiving part. The heat radiating section includes a heat radiating container having the heat radiating path connected upward and the return path connected downward, and a plurality of cooling water pipes penetrating the heat radiating container. The cooling water pipes are arranged in a horizontal direction and a vertical direction. A plurality of horizontally disposed cooling water pipes provided in the vertical direction have a smaller interval than the cooling water pipes provided in the horizontal direction, thereby achieving the intended purpose.

  As described above, the present invention is a cooling device that cools a rack-type server including a plurality of electronic devices having electronic components in a housing. The heat receiving portion, the heat radiating path, the heat radiating portion, the return path, and the heat receiving portion are sequentially arranged. Connected to form a negative pressure path in which the working fluid is accommodated in an annular shape, and the heat receiving portion is provided with a check valve upstream of the heat receiving portion. A heat radiating container is provided with a heat radiating path on the upper side and the return path is connected on the lower side, and a plurality of cooling water pipes penetrating the heat radiating container. The cooling water pipes are horizontally arranged in the horizontal direction and in the vertical direction. Since the interval between the cooling water pipes provided in the vertical direction is narrower than the interval between the cooling water pipes provided in the horizontal direction, the cooling capacity can be increased.

  That is, the heat radiating portion of the present invention includes a heat radiating container in which the heat radiating path is connected upward and the return path is connected in the downward direction, and a plurality of cooling water pipes penetrating the heat radiating container. A plurality of the cooling water pipes that are horizontally arranged in the vertical direction and that are provided in the vertical direction are narrower than an interval between the cooling water pipes that are provided in the horizontal direction.

  For this reason, in the heat radiating container of the heat radiating section, the gas phase working fluid that has flowed into the heat radiating container from the refrigerant inlet provided in the upper part of the heat radiating container is composed of a plurality of pipes arranged at short distances in the vertical direction. It contacts the pipes in the uppermost row, and dissipates heat to the cooling water flowing in the pipes, and liquefies (condenses).

  The liquefied working fluid travels through a plurality of pipes arranged at close distances in the vertical direction along the semicircular circumference of the pipes from the top, falls from the bottom line of pipes to the bottom surface in the heat radiation container, and accumulates.

  In addition, the vaporized working fluid that did not come into contact with the uppermost line of piping contacts the pipes below the uppermost line while passing through the gaps of the plurality of vertical lines from the top to the bottom. Cooled as above.

  As a result, most of the vaporized working fluid comes into contact with a plurality of pipes, liquefies and further cools, that is, not only the latent heat but also sensible heat is dissipated, and is cooled below the condensation temperature of the working fluid. Liquid.

Schematic diagram of a data center provided with a cooling device for cooling the rack type server according to the first embodiment of the present invention. (A) Side view of a cooling device that cools the rack type server, (b) Rear view of the cooling device that cools the rack type server (A) Plan view of inner cooling loop of cooling device for cooling the rack type server, (b) bb cross-sectional view of FIG. 3 (a) (A) Detailed plan view of the heat radiation part of the cooling device for cooling the rack type server, (b) 4B-4B sectional view of FIG. 4 (a), (c) Enlarged view of the heat radiation part of FIG. 4 (b) (A) Perspective view of heat dissipation part of cooling device for cooling same rack type server, (b) Cross-sectional view of heat dissipation part of FIG. 5 (a) cut along c plane The figure corresponded to the 4B-4B cross section of Fig.4 (a) of the thermal radiation part of the cooling device which cools the rack type server of Embodiment 2 of this invention. Schematic showing a conventional cooling device

(Embodiment 1)
FIG. 1 is a schematic diagram of a data center 1 in which a plurality of rack servers 2 are accommodated as rack units. A plurality of rack servers 2 are installed in the data center 1.

  The rack-type server 2 has a housing with openings on the front side and the back side, and is provided with a plurality of electronic devices 3 in a rack shape inside the housing, with an operation panel and a display unit facing the front side. ing. On the back side, wirings and power lines for connecting the electronic devices 3 to each other or an external device are provided.

  Note that not all electronic devices have an operation panel or a display unit. A plurality of rack-type servers 2 are installed in the data center 1 and are called an electronic computer room, a server room, etc. as a whole.

  As shown in FIG. 2, the cooling device 4 according to the present embodiment includes an outer cooling loop 5 and a plurality of inner cooling loops 6. The outer cooling loop 5 includes an outdoor cooling tower 7, an outward water cooling pipe 8, and water cooling heat exchange. This is a water cooling cycle in which the refrigerant is circulated by sequentially connecting the unit 9 and the return water cooling pipe 10.

  That is, the refrigerant 11 is water, and the forward water cooling pipe 8 and the return water cooling pipe 10 connect the water cooling heat exchange unit 9 and the outdoor cooling tower 7 here. The water-cooling heat exchanging unit 9 is provided on the back side 23 of the housing 22, the two headers 24 a and 24 b, the cooling water inlet pipe 25 a connected to the heat radiating part 15 of the inner cooling loop 6, and the cooling water outlet pipe 25 b. And flexible pipes 26a and 26b connecting the headers 24a and 24b to the cooling water inlet pipe 25a and the cooling water outlet pipe 25b.

  FIG. 3A is a plan view of the inner cooling loop 6 of the cooling device 4 that cools the rack type server 2 according to the first embodiment of the present invention, and FIG. 3B is a cross-sectional view taken along line bb in FIG. It is sectional drawing. As shown in FIG. 3, the heat receiving portion 12, the heat radiation path 13, and the return path 14 of the inner cooling loop 6 are provided in the electronic device 3 alone. Further, the heat radiating section 15 is connected to the external cooling loop 5 outside the electronic device 3 alone via a cooling water inlet pipe 25a and a cooling water outlet pipe 25b. The heat radiation path 13 and the return path 14 connect the heat receiving part 12 and the heat radiation part 15.

  And the heat receiving part 12, the heat radiation path | route 13, the heat radiation part 15, and the return path 14 are connected in order, the circulation path 18 through which the working fluid 17 circulates is formed, and the heat of the heat receiving part 12 is moved to the heat radiation part 15. A check valve 21 is provided on the connection side between the return path 14 and the heat receiving part 12, that is, between the heat radiation part 15 and the heat receiving part 12 in the circulation path 18.

  The atmospheric pressure in the circulation path 18 is determined by the working fluid 17 to be used. For example, when the working fluid 17 is water, it is often set lower than the atmospheric pressure.

  Hereinafter, a detailed configuration of each unit will be described.

  As shown in FIG. 3, the heat receiving part 12 is box-shaped. The bottom surface of the heat receiving unit 12 is attached in a state that allows heat conduction to the electronic component 19, for example, cpu.

  Further, one end of the heat radiation path 13 and the return path 14 is connected to the upper part or the side surface of the heat receiving part 12. The heat receiving unit 12 transmits heat from the electronic component 19 to the working fluid 17.

  FIG. 4A is a detailed plan view of a heat radiation part of the cooling device that cools the rack type server according to the first embodiment of the present invention, and FIG. 4B is a cross-sectional view taken along the line 4b-4b of FIG. 4 (c) is an enlarged view of the heat dissipating part of FIG. 4 (b), FIG. 5 (a) is a perspective view of the heat dissipating part, and FIG. 5 (b) is a cross section cut along the plane of FIG. 5 (a) c of the heat dissipating part. FIG.

  As shown in FIGS. 4 (a) to 4 (c), the heat dissipating part 15 that releases the heat of the working fluid 17 includes a rectangular parallelepiped heat dissipating container 15a, a plurality of cooling water pipes 32 penetrating the heat dissipating container 15a, A cooling container 16 is used. The cooling container 16 is provided so as to cover the heat radiation container 15a so as to separate and cover the cooling water from the outside with the cooling water inlet pipe 25a, the cooling container 16, the cooling water pipe 32, the cooling container 16, and the cooling water outlet pipe 25b. It is flowing in order.

A plurality of cooling water pipes 32 are horizontally provided in the horizontal direction and the vertical direction, and an interval L _P between the cooling water pipes 32 provided in the vertical direction is made smaller than an interval L _H between the cooling water pipes 32 provided in the horizontal direction. ing.

  And as shown to Fig.5 (a), the connection port of the thermal radiation path | route 13 and the thermal radiation container 15a, and the connection port of the return path 14 and the thermal radiation container 15a are on the diagonal of the same side surface of the thermal radiation container 15a. That is, one end of the heat radiation path 13 is connected to the upper part of the heat radiation container 15a, and one end of the return path 14 is connected to the lower part of the heat radiation container 15a at a diagonal position.

  As shown in FIGS. 4 to 5, the cooling container 16 is provided so as to separate and cover five surfaces other than the side surface provided with the two connection ports of the heat radiation container 15 a, and the cooling water is supplied to the separated space. It is configured to flow.

  3 to 5 illustrate the case where the heat radiating unit 15 is housed in the case 33, the case 33 may not be provided.

  In the above configuration, the cooling action of the electronic component 19 will be described from the inner cooling loop 6.

  As shown in FIG. 3, the inner cooling loop 6 includes a heat receiving part 12, a heat radiation path 13, a heat radiation part 15, and a feedback path 14, and a working fluid 17 (for example, water) flows through the inner cooling loop 6. During normal operation, water up to the liquid level 20 (water level h) indicated by a broken line in the heat radiation portion 15 in FIG. 4B is stored, and a part of the cooling water pipe 32 in the lowermost row is submerged. Although not shown, water up to a similar water level h is also stored in the heat receiving section 12.

  When the rack type server 2 shown in FIG. 1 is activated, a large current flows through the electronic component 19, and thus heat generation starts rapidly. Then, in response to the heat, the water in the heat receiving portion 12 shown in FIG. 3 suddenly boils and vaporizes, and vigorously flows into the heat radiating container 15 a of the heat radiating portion 15 through the heat radiating path 13. At this time, due to the presence of the check valve 21, the water in the heat receiving portion 12 does not go in the direction of the return path 14.

As shown in FIG. 4, a plurality of penetrating cooling water pipes 32 are horizontally arranged in the heat dissipation container 15a in the horizontal direction and the vertical direction, and an interval L _P between the cooling water pipes 32 provided in the vertical direction is provided in the horizontal direction. The cooling water pipe 32 is narrower than the distance L _H between the cooling water pipes 32, and the uppermost cooling water pipe 32 is not provided near the connection port of the heat radiation path 13, and in the present embodiment, only one is provided on the back side. Yes.

  Further, one end of the heat radiation path 13 is connected to the upper part of the heat radiation container 15a, and one end of the return path 14 is connected to the lower part of the heat radiation container 15a at a diagonal position. The steam that has flowed into 15a travels toward the uppermost cooling water pipe 32 while spreading in the horizontal direction at the upper part in the heat radiation container 15a.

  For this reason, in the heat radiating container 15a of the heat radiating section, as shown by the arrow in FIG. 4C, the gas phase working fluid 17 that has flowed into the heat radiating container 15a from the refrigerant inlet provided at the upper part of the heat radiating container 15a. Is in contact with a plurality of uppermost pipes formed by a plurality of pipes spaced apart in the vertical direction, dissipates heat to the cooling water flowing through the pipes, and liquefies (condenses). FIG. 4C shows a state in which a water film is formed so that the liquefied water surrounds the cooling water pipe 32.

  The liquefied working fluid 17 travels through a plurality of pipes spaced apart in the vertical direction in order from the top through the semicircular circumference of the pipe, falls from the bottom line of the pipe to the bottom surface in the heat radiation container 15a, and accumulates.

Also, the vaporized working fluid 17 that has not contacted the uppermost line of piping passes from the top to the bottom through the gaps L _{H of} the line composed of a plurality of vertical lines as shown by the arrows in FIG. In the middle of this, the pipe contacts the pipe below the top row and is cooled in the same manner as described above.

  As a result, most of the vaporized working fluid 17 comes into contact with a plurality of pipes and is liquefied and further cooled, that is, not only the latent heat but also the sensible heat is dissipated to become a liquid with a lowered temperature. .

  Further, the cooling water pipe 32 in the uppermost row in the heat radiation container 15a is not provided near the connection port of the heat radiation path 13, and in the present embodiment, only one is provided on the back side so that the upper part of the heat radiation container is provided. The vaporized working fluid 17 can be flowed from the refrigerant inlet to the farthest pipe line without hindering the flow of the vaporized working fluid 17 flowing into the radiation container from the provided refrigerant inlet.

  Furthermore, by flowing cooling water between the heat radiating container 15a and the cooling container 16, the heat radiating container 15a itself can be cooled, and the gas phase working fluid 17 colliding with or contacting the inner wall of the heat radiating container 15a can be cooled. The liquefied working fluid 17 accumulated in the lower part of the heat radiation container 15a can also be cooled.

  As for the configuration of the cooling vessel 16, as shown in FIG. 5, the space to which the cooling water inlet pipe 25a and the cooling water outlet pipe 25b are connected functions as a cooling water chamber as an inlet space 16a and an outlet space 16b. The cooling water is configured to flow uniformly through the cooling water pipe 32.

  Next, the cooling action of the outer cooling loop 5 that cools the heat exchange water 29 that passes through the cooling water pipe 32 and exchanges heat with the working fluid 17 will be described with reference to FIG.

  The cooled forward cooling water 28 is sent from the outdoor cooling tower 7, and is divided into a plurality of heat radiating portions 15 from the header 24 a of the water-cooling heat exchanger 9 through the outgoing water cooling pipe 8, and then merges at the header 24 b to return water cooling pipe Cycle to 10.

  At this time, the heat exchange water 29 that has received the heat from the vaporized working fluid 17 flowing through the cooling water pipe 32 in the heat radiating section 15 becomes the return cooling water 30 and passes through the return water cooling pipe 10 to the outdoor cooling tower. Is taken to 7. Then, the heat from the heat radiating unit 15 is released to the outside air 31, and the return path cooling water 30 is cooled to the outside air temperature level.

  The backward cooling water 30 cooled by the outdoor cooling tower 7 becomes the outward cooling water 28, and the outward cooling water 28 is sent again to the water-cooling heat exchange unit 9, and heat is taken from the heat radiating unit 15 of the inner cooling loop 6. By such circulation, the electronic device 3 is continuously cooled.

  Further, as shown in FIG. 2B, the heat exchange water 29 flowing in parallel to the plurality of heat radiating portions 15 has the same flow path pressure loss in the path from the header 24a to the heat radiating portion 15 to the header 24b. In this way, the heat exchange water 29 having a uniform flow rate flows into each heat radiating portion 15. As a result, any heat radiating portion 15 of the water-cooled heat exchanging portion 9 has the same cooling performance.

  As described above, in the data center including the cooling device 4 for cooling the rack type server according to the embodiment of the present invention, the heat taken from the heat radiation part 15 of the inner cooling loop 6 shown in FIG. As shown, it is discharged from the outdoor cooling tower 7 to the outside air 31. Therefore, the indoor temperature rise due to the exhaust heat of the cooling device 4 can be prevented, and an increase in power consumption is suppressed as the entire data center 1 including air conditioning.

In FIGS. 3 to 5 of the present embodiment, the interval L _P between the cooling water pipes 32 adjacent in the vertical direction is provided, but the cooling water pipes 32 adjacent in the vertical direction may be contacted without being spaced apart. With this configuration, the liquefied working fluid 17 can be more reliably moved downward around the cooling water pipe 32. That is, scattering of the liquefied working fluid 17 due to the interval L _P can be suppressed, and the liquefied working fluid 17 can be cooled more reliably.

  Further, in this embodiment, the cooling container 16 is provided so as to cover the heat radiation container 15a so as to be separated from each other. However, if the cooling water inlet pipe 25a and the cooling water outlet pipe 25b can be directly connected to the respective cooling water pipes 32, the cooling container 16 is provided. May not be provided. However, in that case, the wall surface of the heat radiating container 15a is not cooled from the outside and the ability to cool is lowered, but the temperature of the condensed working fluid 17 is lowered by heat exchange on the outer peripheral surface of the cooling water pipe 32. Can do.

In the present embodiment, the loop type heat pipe system having a check valve in the middle of the refrigerant circulation shown in FIG. 3 as the inner cooling loop 6 has been described as an example. However, the inner cooling loop 6 does not have a check valve. A thermosiphon system can also be used.
In the case of the thermosiphon system, the amount of the working fluid 17 enclosed in the inner cooling loop 6 needs to be an amount that fills the working fluid 17 with the working fluid 17 during operation (more than the loop heat pipe system). Therefore, the lower part of the heat radiating part 15 is filled with the liquefied working fluid 17 and the condensation area of the heat radiating part 15 is reduced. Therefore, it is necessary to enlarge the heat radiating part 15.

(Embodiment 2)
Next, the case where the surfaces where the cooling container 16 and the heat radiating container 15a are separated from each other are two surfaces including the inlet space 16a and the outlet space 16b will be described with reference to FIG. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  FIG. 6 is a cross-sectional view of the heat dissipation container 15a corresponding to FIG. 4B of the first embodiment.

  As shown in FIG. 6, in the present embodiment, the cooling container 16 does not cover the cooling water pipe 32 direction of the heat radiating container 15 a apart from the cooling water pipe 32, and the cooling water pipe 32 direction of the heat radiating container 15 a as in the first embodiment. Can not be cooled from the outside. Therefore, compared to the first embodiment, the uppermost and lowermost cooling water pipes 32 are arranged close to the inner wall of the radiator vessel 15a, and the second row from the top of the cooling water pipe 32 is placed above the radiator vessel 15a. In the present embodiment, the cooling water pipe 32 is not provided in the vicinity of the connection port of the heat radiation path 13 as an inflow path of the gas-phase working fluid 17 flowing into the heat radiation container 15a from the provided refrigerant inlet. Only one is provided.

  In the above configuration, the gas-phase working fluid 17 that has flowed into the heat radiating container 15a from the refrigerant inlet flows in as the inflow path in the second row from the top of the cooling water pipe 32, and the working fluid 17 on the upper side of the inflow path is It contacts with the cooling water pipe 32 in the uppermost row, dissipates heat to the cooling water flowing through the cooling water pipe 32, and is liquefied (condensed). The liquefied working fluid 17 falls from the cooling water pipe 32 in the uppermost row and is transported to the one cooling water pipe 32 in the second row from the top by the flow of the vaporized working fluid 17. Contact.

  Subsequent downward movement of the liquefied working fluid 17 is the same as in the first embodiment, and liquefies and further cools, that is, not only the latent heat but also the sensible heat is dissipated, resulting in a liquid with a lowered temperature. .

  Next, the operation in which the cooling water pipe 32 in the lowermost row is arranged close to the inner wall of the radiation container 15a will be described.

  As shown in FIG. 7, the cooling water pipe 32 in the lowermost row is disposed below the water level H. Therefore, the liquefied working fluid 17 accumulated in the lower part of the heat radiating container 15 a can be cooled by the cooling water pipe 32.

  As described above, according to the configurations of the first, second, and third embodiments, the liquefied working fluid 17 is brought into contact with the plurality of cooling water pipes 32 to cool the liquefied working fluid 17, and at the lower part in the heat radiation container 15 a. By cooling the accumulated liquefied working fluid 17, the temperature of the working fluid 17 flowing into the heat receiving unit 12 through the return path 14 can be lowered, and the ability to cool the electronic component 19 of the heat receiving unit 12 can be reduced. Can be increased.

  The cooling device according to the present invention is a cooling device that cools a rack-type server including a plurality of electronic devices having electronic components in a housing. The heat receiving unit, the heat radiation path, the heat radiation unit, the return path, and the heat reception unit are sequentially arranged. Connected to form a negative pressure path in which the working fluid is accommodated in an annular shape, and the heat receiving portion is provided with a check valve upstream of the heat receiving portion. A heat dissipation path is provided on the upper side, and the return path is connected on the lower side with a heat dissipation container and a plurality of cooling water pipes penetrating the heat dissipation container. A plurality of the cooling water pipes are provided in the horizontal direction and the vertical direction. An interval between the cooling water pipes adjacent to each other is narrower than an interval between the cooling water pipes adjacent to each other in the horizontal direction, and is useful for cooling a semiconductor switching element in an inverter circuit of an electronic device and an electric vehicle. That.

DESCRIPTION OF SYMBOLS 1 Data center 2 Rack type server 3 Electronic device 4 Cooling device 5 Outer cooling loop 6 Inner cooling loop 7 Outdoor cooling tower 8 Outward water cooling pipe 9 Water cooling heat exchange part 10 Return path water cooling pipe 11 Refrigerant 12 Heat receiving part 13 Heat radiation path 14 Return path 15 Heat radiation part 15a Heat radiation container 16 Cooling container 16a Inlet space 16b Outlet space 17 Working fluid 18 Circulating path 19 Electronic component 20 Liquid level 21 Check valve 22 Housing 23 Back side 24a Header 24b Header 25a Cooling water inlet pipe 25b Cooling water outlet pipe 26a Flexible pipe 26b Flexible pipe 28 Outbound cooling water 29 Heat exchange water 30 Return path cooling water 31 Outside air 32 Cooling water piping 33 Case

Claims (6)

A cooling device that cools a rack-type server equipped with a plurality of electronic devices having electronic components in a housing. It operates in a ring by connecting a heat receiving part, a heat radiating path, a heat radiating part, a return path, and the heat receiving part in order. In the cooling device having a configuration in which a negative pressure path in which a fluid is stored is formed, and the heat receiving unit is provided with a check valve upstream of the heat receiving unit,
The heat dissipation part is
A heat dissipation container in which the heat dissipation path is connected upward and the return path is connected downward;
A plurality of cooling water pipes penetrating this heat radiation container,
A plurality of the cooling water pipes are horizontally arranged in the horizontal direction and the vertical direction,
The cooling device characterized in that an interval between the cooling water pipes provided in the vertical direction is narrower than an interval between the cooling water pipes provided in the horizontal direction. A cooling device that cools a rack-type server equipped with a plurality of electronic devices having electronic components in a housing. It operates in a ring by connecting a heat receiving part, a heat radiating path, a heat radiating part, a return path, and the heat receiving part in order. In a cooling device that forms a circulation path in which a fluid is stored,
The heat dissipation part is
A heat dissipation container in which the heat dissipation path is connected upward and the return path is connected downward;
A plurality of cooling water pipes penetrating this heat radiation container,
A plurality of the cooling water pipes are horizontally arranged in the horizontal direction and the vertical direction,
The cooling device characterized in that an interval between the cooling water pipes provided in the vertical direction is narrower than an interval between the cooling water pipes provided in the horizontal direction. The cooling device according to claim 1, wherein a vertical cooling water pipe is provided in contact therewith. The cooling device according to any one of claims 1 to 3, wherein a cooling container is provided outside the heat radiating container. The cooling device according to any one of claims 1 to 4, wherein the heat radiation path and the connection port of the heat radiation container, the return path and the connection port of the heat radiation container are on the diagonal line on the same side surface of the heat radiation container. . A data center comprising a plurality of rack servers and the cooling device according to any one of claims 1 to 5.

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