JP2015087289A - Sensor element, force detection device, robot, electronic component transfer device, electronic component inspection device, and component processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor element, force detection device, robot, electronic component conveyance device, electronic component inspection device, and component processing device capable of reliably detecting an electric charge output from a piezoelectric plate, and having excellent detection accuracy.SOLUTION: An electric charge output element 10 comprises a laminated body in which a first sensor 12, a second sensor 13, and a third sensor 14 are laminated in a lamination direction; the first sensor 12 having a first piezoelectric plate composed of a Y cut quartz plate, and first electrode layers provided on both surfaces of the first piezoelectric plate respectively; the second sensor 13 having a second piezoelectric plate composed of an X cut quartz plate, and second electrode layers provided on both surfaces of the second piezoelectric plate respectively; the third sensor 14 having a third piezoelectric plate composed of a Y cut quartz plate, and third electrode layers provided on both surfaces of the third piezoelectric plate respectively.

Description

  The present invention relates to a sensor element, a force detection device, a robot, an electronic component transport device, an electronic component inspection device, and a component processing device.

  In recent years, industrial robots have been introduced into production facilities such as factories for the purpose of improving production efficiency. Such an industrial robot includes an arm that can be driven in the direction of one axis or a plurality of axes, and an end effector such as a hand, a component inspection device, or a component transfer device, which is attached to the tip of the arm. Parts manufacturing work such as parts assembly work, parts processing work, parts transport work, parts inspection work, etc. can be executed.

In such an industrial robot, for example, a force detection device is provided between the arm and the end effector. As a force detection device used for an industrial robot, for example, a force detection device disclosed in Patent Document 1 is used. The element of the force detection device described in Patent Literature 1 includes a laminated body including a plurality of piezoelectric substrates and a plurality of internal electrodes provided therebetween. In general, the laminated body having such a structure is formed by forming internal electrodes on one surface of each piezoelectric substrate and laminating them through an adhesive layer. As a result, it is possible to obtain a piezoelectric element that is laminated a plurality of times in the order of the piezoelectric substrate, the internal electrode, and the adhesive layer. Further, the internal electrode functions as a common electrode for two adjacent piezoelectric substrates.
However, as described above, an adhesive layer is provided between the internal electrode and one of the two adjacent piezoelectric substrates. Depending on the thickness of the adhesive layer and the like, the internal electrode may be insufficient in detecting the charge from the one piezoelectric substrate.

JP 2005-147830 A

  An object of the present invention is to provide a sensor element, a force detection device, a robot, an electronic component transport device, an electronic component inspection device, and a component processing device that can reliably detect charges output from a piezoelectric plate and have excellent detection accuracy. Is to provide.

Such an object is achieved by the following application examples according to the present invention.
[Application Example 1]
A sensor element according to the present invention includes a laminated body in which a plurality of sensors each including at least one piezoelectric plate made of a quartz plate and electrode layers provided on both sides of the piezoelectric plate are laminated in the laminating direction. ,
The laminate includes a bonding layer that bonds the sensors in the stacking direction.
Thereby, the structure which detects the electric charge output from the piezoelectric plate which an electrode layer adjoins conventionally through a joining layer can be abbreviate | omitted. Therefore, the electric charge output from the piezoelectric plate is directly detected by the electrode layer without passing through the bonding layer. For this reason, the electric charge output from the piezoelectric plate can be reliably detected.

[Application Example 2]
In the sensor element according to the present invention, the thermal expansion coefficient of the electrode layer provided on one surface of the piezoelectric plate and the thermal expansion coefficient of the electrode layer provided on the other surface of the piezoelectric plate are practically equal. It is preferable to do it.
Thereby, in the first piezoelectric plate, the second piezoelectric plate, and the third piezoelectric plate, it is possible to prevent the deformation of the piezoelectric plate caused by the difference in thermal expansion coefficient.

[Application Example 3]
In the sensor element according to the present invention, it is preferable that the thermal expansion coefficients of the electrode layers of the plurality of sensors are practically coincident with each other.
Thereby, the deformation | transformation of the piezoelectric plate which arises by the difference in a thermal expansion coefficient can be prevented more effectively.

[Application Example 4]
In the sensor element according to the present invention, the thickness of each bonding layer is preferably 0.2 μm or more and 2.0 μm or less.
Thereby, it is possible to reduce the size of the sensor element and to sufficiently ensure the bonding strength of each electrode layer.
[Application Example 5]
In the sensor element according to the present invention, in the stacked body, the bonding layer is preferably provided between the plurality of sensors.
Thereby, the sensor element has excellent detection accuracy.

[Application Example 6]
A force detection device according to the present invention includes a plurality of sensors each having at least one piezoelectric plate made of a quartz plate and electrode layers provided on both sides of the piezoelectric plate,
A plurality of sensors are provided with a laminated body laminated in the lamination direction,
The laminated body includes a sensor element having a bonding layer bonded in the stacking direction;
And an external force detection circuit that detects the external force based on the voltage output from the sensor element.
Thereby, the structure which detects the electric charge output from the piezoelectric plate which an electrode layer adjoins conventionally through a joining layer can be abbreviate | omitted. Therefore, the electric charge output from the piezoelectric plate is directly detected by the electrode layer without passing through the bonding layer. For this reason, the electric charge output from the piezoelectric plate can be reliably detected.
[Application Example 7]
In the force detection device according to the present invention, it is preferable that three or more sensor elements are provided.
Thereby, the force detection apparatus can detect 6-axis force.

[Application Example 8]
The robot according to the present invention has a plurality of arms, and at least one arm connecting body formed by rotatably connecting the adjacent arms of the plurality of arms;
An end effector provided on a distal end side of the arm coupling body;
It is provided between the said arm coupling body and the said end effector, The force detection apparatus of this invention which detects the external force applied to the said end effector is provided, It is characterized by the above-mentioned.

  Thereby, the same effect as the force detection device of the present invention can be obtained. Then, the external force detected by the force detection device can be fed back to perform the operation more precisely. Further, the contact of the end effector with the obstacle can be detected by the external force detected by the force detection device. Therefore, an obstacle avoidance operation, an object damage avoidance operation, and the like, which are difficult with conventional position control, can be easily performed, and the work can be executed more safely.

[Application Example 9]
An electronic component conveying apparatus according to the present invention includes a gripping unit that grips an electronic component,
It is provided with the force detection apparatus of this invention which detects the external force applied to the said holding part.
Thereby, the same effect as the force detection device of the present invention can be obtained. Then, the external force detected by the force detection device can be fed back to perform the operation more precisely. In addition, contact of the grip portion with an obstacle can be detected by the external force detected by the force detection device. Therefore, an obstacle avoidance operation, an object damage avoidance operation, and the like, which are difficult with conventional position control, can be easily performed, and the electronic component transport operation can be executed more safely.

[Application Example 10]
An electronic component inspection apparatus according to the present invention includes a gripping unit for gripping an electronic component,
An inspection unit for inspecting the electronic component;
It is provided with the force detection apparatus of this invention which detects the external force applied to the said holding part.

  Thereby, the same effect as the force detection device of the present invention can be obtained. Then, the external force detected by the force detection device can be fed back to perform the operation more precisely. In addition, contact of the grip portion with an obstacle can be detected by the external force detected by the force detection device. Therefore, an obstacle avoidance operation, an object damage avoidance operation, and the like that are difficult with conventional position control can be easily performed, and an electronic component inspection operation can be performed more safely.

[Application Example 11]
A component processing apparatus according to the present invention is provided with a tool displacing unit for mounting a tool and displacing the tool,
It is provided with the force detection apparatus of this invention which detects the external force applied to the said tool.
Thereby, the same effect as the force detection device of the present invention can be obtained. Then, by feeding back the external force detected by the force detection device, the component processing device can execute the component processing operation more precisely. Further, contact of the tool with an obstacle can be detected by an external force detected by the force detection device. Therefore, an emergency stop can be performed when an obstacle or the like comes into contact with the tool, and the component processing apparatus can execute a safer component processing operation.

It is sectional drawing which shows 1st Embodiment of the force detection apparatus (sensor element) of this invention. It is a top view of the force detection apparatus shown in FIG. It is a circuit diagram which shows roughly the force detection apparatus shown in FIG. It is sectional drawing which shows schematically the electric charge output element of the force detection apparatus shown in FIG. (A) is a side view which shows a 1st sensor, (b) And (c) is a side view which shows the conventional sensor. It is a top view which shows 2nd Embodiment of the force detection apparatus of this invention. It is sectional drawing in the AA line in FIG. FIG. 7 is a circuit diagram schematically showing the force detection device shown in FIG. 6. It is a figure which shows an example of the single arm robot using the force detection apparatus of this invention. It is a figure which shows an example of the multi-arm robot using the force detection apparatus of this invention. It is a figure which shows an example of the electronic component inspection apparatus and electronic component conveyance apparatus using the force detection apparatus of this invention. It is a figure which shows one example of the electronic component conveying apparatus using the force detection apparatus of this invention. It is a figure which shows one example of the component processing apparatus using the force detection apparatus of this invention. It is a figure which shows an example of the moving body using the force detection apparatus of this invention.

Hereinafter, a sensor element, a force detection device, a robot, an electronic component conveying device, an electronic component inspection device, and a component processing device according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
<First Embodiment>
1 is a sectional view showing a first embodiment of a force detection device (sensor element) according to the present invention, FIG. 2 is a plan view of the force detection device shown in FIG. 1, and FIG. 3 is a force detection device shown in FIG. FIG. 4 is a sectional view schematically showing a charge output element of the force detection device shown in FIG. 1, and FIG. 5 is a side view showing the first sensor. (B) And (c) is a side view which shows the conventional sensor.
In the following, for convenience of explanation, the upper side in FIGS. 1, 4 and 7 is referred to as “upper” or “upper”, and the lower side is referred to as “lower” or “lower”.

1 and 2 has a function of detecting an external force (including a moment), that is, three axes (α (X) axis, β (Y) axis, γ (Z) axis) orthogonal to each other. Has a function of detecting an external force applied along the line.
The force detection device 1 includes a first substrate 2, a second substrate 3 that is disposed at a predetermined interval from the first substrate 2, and that faces the first substrate 2, the first substrate 2, and the first substrate 2. The analog circuit board (circuit board) 4 provided between the two circuit boards 3 and the first circuit board 2 and the second board 3 are electrically connected to the analog circuit board 4. A sensor device 6 having a digital circuit board 5, a charge output element (sensor element) 10 that is mounted on an analog circuit board and outputs a signal according to an applied external force, and a package 60 that houses the charge output element 10, 2 One pressurizing bolt (fixing member) 71 is provided.

  As shown in FIG. 3, the analog circuit board 4 includes a conversion output circuit 90 a that converts the charge Qx output from the charge output element 10 of the mounted sensor device 6 into a voltage Vx, and the output from the charge output element 10. A conversion output circuit 90b for converting the charge Qz into the voltage Vz and a conversion output circuit 90c for converting the charge Qy output from the charge output element 10 into the voltage Vy are provided. The digital circuit board 5 includes an external force detection circuit 40 that detects the applied external force. The digital circuit board 5 is arranged on the first board 2 side of the analog circuit board 4, that is, between the analog circuit board 4 and the first board.

  As shown in FIG. 1, the sensor device 6 is disposed on the surface of the analog circuit board 4 on the second substrate 3 side, and a convex portion (first convex portion) 21 described later provided on the first substrate 2. And the second substrate 3. That is, the charge output element 10 is sandwiched between the convex portion 21 and the second substrate 3 via the package 60 and is pressurized. Note that either the first substrate 2 or the second substrate 3 may be a substrate on which a force is applied, but in the present embodiment, the second substrate 3 is described as a substrate on which a force is applied. The charge output element 10 may be disposed on the surface of the analog circuit board 4 on the first substrate 2 side.

  The shapes of the first substrate 2, the second substrate 3, the analog circuit substrate 4, and the digital circuit substrate 5 are not particularly limited, but in the present embodiment, the first substrate 2, the second substrate 3, and the analog The external shape of the circuit board 4 and the digital circuit board 5 is circular in plan view. In addition, as said other external shape in planar view of the 1st board | substrate 2, the 2nd board | substrate 3, the analog circuit board 4, and the digital circuit board 5, for example, polygons, such as a rectangle and a pentagon, an ellipse, etc. Is mentioned. Further, as the constituent materials of the first substrate 2, the second substrate 3, and the parts other than the respective elements and wirings of the analog circuit board 4, and the constituent elements of the respective parts of the digital circuit board 5 and other than the respective wirings, For example, various resin materials, various metal materials, and the like can be used.

<Sensor device>
The sensor device 6 includes a charge output element 10 and a package 60 that houses the charge output element 10.
The package 60 includes a base (first member) 61 having a recess 611 and a lid (second member) 62 joined to the base 61. The charge output element 10 is installed in the recess 611 of the base 61, and the recess 611 of the base 61 is sealed with a lid 62. Thereby, the charge output element 10 can be protected and the highly reliable force detection apparatus 1 can be provided. Note that the upper surface of the charge output element 10 is in contact with the lid 62. The lid 62 of the package 60 is disposed on the upper side, that is, the second substrate 3 side, and the base 61 is disposed on the lower side, that is, the first substrate 2 side, and the base 61 is the analog circuit board. 4 is fixed. With this configuration, the base 61 and the lid 62 are sandwiched between the convex portion 21 and the second substrate 3 and pressurized, and the charge output element 10 is sandwiched and applied by the base 61 and the lid 62. Pressed.

Moreover, it does not specifically limit as a constituent material of the base 61, For example, insulating materials, such as ceramics, etc. can be used. Moreover, it does not specifically limit as a constituent material of the cover body 62, For example, various metal materials, such as stainless steel, can be used. In addition, the constituent material of the base 61 and the constituent material of the lid 62 may be the same or different.
Further, the shape of the package 60 is not particularly limited, but in the present embodiment, the package 60 has a quadrangular shape in a plan view of the first substrate 2. Examples of the other shape in the plan view of the package 60 include other polygons such as a pentagon, a circle, and an ellipse. Moreover, when the shape of the package 60 is a polygon, the corner | angular part may be roundish, for example, and may be notched diagonally.

  Further, in this embodiment, the lid 62 has a plate shape, and the central portion 625 protrudes toward the second substrate 3 by bending a portion between the central portion 625 and the outer peripheral portion 626. Yes. The shape of the central portion 625 is not particularly limited, but in the present embodiment, the shape is the same as that of the charge output element 10 in a plan view of the first substrate 2, that is, a quadrangle. Note that the upper surface and the lower surface of the central portion 625 of the lid 62 are both flat.

A plurality of terminals 63 that are electrically connected to the charge output element 10 are provided at the end of the lower surface of the base 61 of the package 60. Each terminal 63 is electrically connected to the analog circuit board 4, whereby the charge output element 10 and the analog circuit board 4 are electrically connected. The number of terminals 63 is not particularly limited, but is four in the present embodiment, that is, the terminals 63 are respectively provided at four corners of the base 61.
The charge output element 10 is accommodated in such a package 60. The charge output element 10 will be described in detail later.

<Conversion output circuit>
Conversion output circuits 90 a, 90 b, and 90 c are connected to the charge output element 10. The conversion output circuit 90a has a function of converting the charge Qx output from the charge output element 10 into a voltage Vx. The conversion output circuit 90b has a function of converting the charge Qz output from the charge output element 10 into a voltage Vz. The conversion output circuit 90c has a function of converting the charge Qy output from the charge output element 10 into a voltage Vy. Since the conversion output circuits 90a, 90b, and 90c are the same, the conversion output circuit 90c will be typically described below.

  The conversion output circuit 90c has a function of converting the charge Qy output from the charge output element 10 into a voltage Vy and outputting the voltage Vy. The conversion output circuit 90 c includes an operational amplifier 91, a capacitor 92, and a switching element 93. The first input terminal (minus input) of the operational amplifier 91 is connected to the output electrode layer 122 of the charge output element 10, and the second input terminal (plus input) of the operational amplifier 91 is grounded to the ground (reference potential point). ing. The output terminal of the operational amplifier 91 is connected to the external force detection circuit 40. The capacitor 92 is connected between the first input terminal and the output terminal of the operational amplifier 91. The switching element 93 is connected between the first input terminal and the output terminal of the operational amplifier 91, and is connected in parallel with the capacitor 92. The switching element 93 is connected to a drive circuit (not shown), and the switching element 93 performs a switching operation in accordance with an on / off signal from the drive circuit.

  When the switching element 93 is off, the charge Qy output from the charge output element 10 is stored in the capacitor 92 having the capacitance C1, and is output to the external force detection circuit 40 as the voltage Vy. Next, when the switching element 93 is turned on, both terminals of the capacitor 92 are short-circuited. As a result, the electric charge Qy stored in the capacitor 92 is discharged to 0 coulomb, and the voltage V output to the external force detection circuit 40 is 0 volt. When the switching element 93 is turned on, the conversion output circuit 90c is reset. Note that the voltage Vy output from the ideal conversion output circuit 90 c is proportional to the amount of charge Qy output from the charge output element 10.

  The switching element 93 is a semiconductor switching element such as a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), for example. Since the semiconductor switching element is smaller and lighter than the mechanical switch, it is advantageous for reducing the size and weight of the force detection device 1. Hereinafter, a case where a MOSFET is used as the switching element 93 will be described as a representative example.

  The switching element 93 has a drain electrode, a source electrode, and a gate electrode. One of the drain electrode and the source electrode of the switching element 93 is connected to the first input terminal of the operational amplifier 91, and the other of the drain electrode and the source electrode is connected to the output terminal of the operational amplifier 91. The gate electrode of the switching element 93 is connected to a drive circuit (not shown).

  The same drive circuit may be connected to the switching element 93 of each of the conversion output circuits 90a, 90b, and 90c, or different drive circuits may be connected to each other. Each of the switching elements 93 receives an on / off signal that is all synchronized from the drive circuit. As a result, the operations of the switching elements 93 of the conversion output circuits 90a, 90b, and 90c are synchronized. That is, the on / off timings of the switching elements 93 of the conversion output circuits 90a, 90b, and 90c coincide with each other.

<External force detection circuit>
The external force detection circuit 40 detects the applied external force based on the voltage Vx output from the conversion output circuit 90a, the voltage Vz output from the conversion output circuit 90b, and the voltage Vy output from the conversion output circuit 90c. It has the function to do. The external force detection circuit 40 includes an AD converter 401 connected to the conversion output circuits 90a, 90b, and 90c, and an arithmetic unit 402 connected to the AD converter 401.

The AD converter 401 has a function of converting the voltages Vx, Vy, and Vz from analog signals to digital signals. The voltages Vx, Vy, Vz digitally converted by the AD converter 401 are input to the calculation unit 402.
That is, when an external force is applied in which the relative positions of the first substrate 2 and the second substrate 3 are shifted in the α (X) axis direction, the AD converter 401 outputs the voltage Vx. Similarly, when an external force is applied in which the relative positions of the first substrate 2 and the second substrate 3 are shifted from each other in the β (Y) axis direction, the AD converter 401 outputs the voltage Vy. Further, when an external force is applied in which the relative positions of the first substrate 2 and the second substrate 3 are shifted in the γ (Z) axis direction, the AD converter 401 outputs a voltage Vz.

  The arithmetic unit 402 performs various processes such as correction for eliminating the difference in sensitivity between the conversion output circuits 90a, 90b, and 90c on the digitally converted voltages Vx, Vy, and Vz. The arithmetic unit 402 outputs three signals proportional to the accumulated amounts of the charges Qx, Qy, and Qz output from the charge output element 10. Since these three signals correspond to the triaxial force (shearing force and compression / tensile force) applied to the charge output element 10, the force detection device 1 detects the triaxial force applied to the charge output element 10. can do.

  As shown in FIGS. 1 and 2, in the force detection device 1, a convex portion (first convex portion) 21 is provided on the first substrate 2. The first substrate 2 and the second substrate 3 have the convex portion 21 on the inside, and the surface of the first substrate 2 and the surface of the second substrate 3 are opposed to each other with a space therebetween. The upper surface (surface facing the second substrate 3) 211 of the convex portion 21 is a flat surface. The convex portion 21 may be formed integrally with the first substrate 2 or may be formed by a separate member. In addition, the constituent material of the convex part 21 is not specifically limited, For example, it can be the same as that of the 1st board | substrate 2. As shown in FIG.

Further, the position of the convex portion 21 is not particularly limited, but in the present embodiment, the convex portion 21 is disposed at the central portion of the first substrate 2.
In addition, the shape of the convex portion 21 is not particularly limited, but in the present embodiment, the shape is the same as that of the charge output element 10 in a plan view of the first substrate 2, that is, a quadrangle. In addition, as said other shape in planar view of the convex part 21, polygons, such as a square and a pentagon, an ellipse etc. are mentioned, for example.

  In addition, a hole 41 into which the convex portion 21 is inserted is formed in a portion of the analog circuit board 4 where the charge output element 10 is disposed, that is, in the central portion. The hole 41 is a through hole that penetrates the analog circuit board 4. The shape of the hole 41 is not particularly limited, but in the present embodiment, the shape is the same as that of the convex portion 21 in the plan view of the first substrate 2, that is, a quadrangle. The analog circuit board 4 is supported by the convex portion 21.

Similarly, a hole 51 into which the convex portion 21 is inserted is formed in a portion of the digital circuit board 5 where the charge output element 10 is disposed, that is, in the central portion. The shape of the hole 51 is not particularly limited, but in the present embodiment, the shape is the same as that of the convex portion 21 in the plan view of the first substrate 2, that is, a quadrangle. The digital circuit board 5 is supported by the convex portion 21.
The analog circuit board 4 has two holes 42 through which the two pressurizing bolts 71 are inserted. Similarly, the digital circuit board 5 has two holes 52 through which the two pressurizing bolts 71 are inserted. Is formed.

  The protrusion 21 is inserted into the hole 41 of the analog circuit board 4 and 51 of the digital circuit board 5 and protrudes toward the charge output element 10. The sensor device 6 is sandwiched between the convex portion 21 and the second substrate 3, whereby the charge output element 10 is sandwiched between the convex portion 21 and the second substrate 3 via the package 60. . Note that the lower surface (surface facing the first substrate 2) 36 of the second substrate 3 is a flat surface, and the lower surface 36 abuts against the central portion of the lid 62 of the sensor device 6 and the upper surface of the convex portion 21. 211 abuts the base 61.

  Further, the dimension of the convex portion 21 is not particularly limited, but the area of the convex portion 21 is preferably equal to or larger than the area of the charge output element 10 in a plan view of the first substrate 2. It is more preferable that it is larger than the above. In the configuration shown in the figure, the area of the convex portion 21 is larger than the area of the charge output element 10. The charge output element 10 is disposed in the convex portion 21 in a plan view of the first substrate 2 (viewed from a direction perpendicular to the first substrate 2), and the center of the charge output element 10 The line and the center line of the convex portion 21 coincide with each other. In this case, the charge output element 10 does not have to protrude from the convex portion 21 in the plan view of the first substrate 2. As a result, a pressure can be applied to the entire charge output element 10, and an external force is applied to the entire charge output element 10 during force detection, so that more accurate force detection can be performed.

  The first substrate 2 and the second substrate 3 are fixed by two pressurizing bolts 71. The “fixing” by the pressurizing bolt 71 is performed while allowing a predetermined amount of movement of the two fixed objects. Specifically, the first substrate 2 and the second substrate 3 are fixed by two pressurizing bolts 71 while allowing a predetermined amount of movement in the surface direction of the second substrate 3 to be allowed. . This also applies to other embodiments.

  Each pressurizing bolt 71 is arranged so that its head 715 is on the second substrate 3 side, and is inserted from the hole 35 formed in the second substrate 3, and the hole 42 of the analog circuit board 4. The male screw 716 is inserted into the hole 52 of the digital circuit board 5 and screwed into the female screw 25 formed on the first board 2. Each pressurizing bolt 71 applies a predetermined amount of pressure in the Z-axis direction (see FIG. 4), that is, pressurization, to the charge output element 10. In addition, the magnitude | size of the said pressurization is not specifically limited, It sets suitably.

Further, the position of each pressurizing bolt 71 is not particularly limited, but in the present embodiment, each pressurizing bolt 71 is located on the first board 2, the second board 3, the analog circuit board 4, or the digital circuit board 5. Along the circumferential direction, they are arranged so as to face each other through the charge output element 10 in equiangular intervals (180 ° intervals), that is, in a plan view of the second substrate 3. As a result, the first substrate 2 and the second substrate 3 can be fixed with good balance, and pressure can be applied to each charge output element 10 with good balance. The number of pressurizing bolts 71 is not limited to two, and may be three or more, for example.
In addition, it does not specifically limit as a constituent material of each pressurization volt | bolt 71, For example, various resin materials, various metal materials, etc. can be used.

Next, the charge output element 10 will be described.
The charge output element 10 has three charges Qx corresponding to each of external forces applied (received) along three axes (α (X) axis, β (Y) axis, γ (Z) axis) orthogonal to each other. , Qy, and Qz are output.
The shape of the charge output element 10 is not particularly limited, but in the present embodiment, the charge output element 10 has a quadrangular shape when viewed from the top of the first substrate 2, that is, from a direction perpendicular to the first substrate 2. Examples of the other external shape in plan view of the charge output element 10 include other polygons such as a pentagon, a circle, and an ellipse.

  As shown in FIG. 4, the charge output element 10 has a ground electrode layer 11, 15, 16, 17, 18, 19 grounded to the ground (reference potential point) and an external force (shearing force) parallel to the β axis. Accordingly, the first sensor 12 that outputs the charge Qy, the second sensor 13 that outputs the charge Qz according to the external force (compression / tensile force) parallel to the γ-axis, and the external force (shearing force) parallel to the α-axis ), And the bonding layers 101, 102, 103, 104, and 105, the ground electrode layers 11, 15, 16, 17, 18, and 19 and each sensor 12 , 13, and the bonding layers 101, 102, 103, 104, and 105 are alternately stacked. In FIG. 4, the stacking direction of the ground electrode layers 11, 15, 16, 17, 18, 19, the sensors 12, 13, 14 and the bonding layers 101, 102, 103, 104, 105 is the γ-axis direction, The directions orthogonal to the axial direction and orthogonal to each other are defined as an α axis direction and a β axis direction, respectively.

In the illustrated configuration, the first sensor 12, the second sensor 13, and the third sensor 14 are stacked in this order from the lower side in FIG. 4, but the present invention is not limited to this. The stacking order of the sensors 12, 13, and 14 is arbitrary.
The ground electrode layers 11, 15, 16, 17, 18, and 19 are electrodes that are grounded to the ground (reference potential point). Although the material which comprises the ground electrode layers 11, 15, 16, 17, 18, and 19 is not specifically limited, For example, nickel, gold | metal | money, titanium, aluminum, copper, iron, chromium, or an alloy containing these is preferable. Among these, it is particularly preferable to use stainless steel which is an iron alloy. The ground electrode layer 11 made of stainless steel has excellent durability and corrosion resistance.

The first sensor 12 has a function of outputting a charge Qy according to an external force (shearing force) applied (received) along the β axis. The first sensor 12 is configured to output a positive charge according to an external force applied along the positive direction of the β axis and to output a negative charge according to an external force applied along the negative direction of the β axis. Has been.
The first sensor 12 includes a first piezoelectric layer (first piezoelectric plate) 121 and a second piezoelectric layer (first piezoelectric plate) provided to face the first piezoelectric layer 121. 123, an output electrode layer (first electrode layer) 122a provided on the upper surface (first surface) of the first piezoelectric layer 121, and a lower surface (second surface) of the second piezoelectric layer 123. Output electrode layer (first electrode layer) 122b.

  The first piezoelectric layer 121 is composed of a piezoelectric body having three crystal axes that are orthogonal to each other, the x axis, the y axis, and the z axis. As a result, the x-axis direction and the α-axis direction match, the y-axis direction and the γ-axis direction match, and the z-axis direction and the β-axis direction match. When an external force along the positive direction of the β axis is applied to the surface of the first piezoelectric layer 121, electric charges are induced in the first piezoelectric layer 121 due to the piezoelectric effect. As a result, positive charges are collected near the surface of the first piezoelectric layer 121 on the output electrode layer 122a side, and negative charges are collected near the surface of the first piezoelectric layer 121 on the ground electrode layer 11 side. Similarly, when an external force along the negative direction of the β axis is applied to the surface of the first piezoelectric layer 121, negative charges are generated near the surface of the first piezoelectric layer 121 on the output electrode layer 122a side. As a result, positive charges are collected in the vicinity of the surface of the first piezoelectric layer 121 on the ground electrode layer 11 side.

  The second piezoelectric layer 123 is composed of a piezoelectric body having three crystal axes that are orthogonal to each other, that is, an x-axis, a y-axis, and a z-axis. As a result, the x-axis direction and the α-axis direction match, the y-axis direction and the γ-axis direction match, and the z-axis direction and the β-axis direction match. When an external force along the positive direction of the β axis is applied to the surface of the second piezoelectric layer 123, electric charges are induced in the second piezoelectric layer 123 due to the piezoelectric effect. As a result, positive charges are collected near the surface of the second piezoelectric layer 123 on the output electrode layer 122b side, and negative charges are collected near the surface of the second piezoelectric layer 123 on the ground electrode layer 15 side. Similarly, when an external force along the negative direction of the β axis is applied to the surface of the second piezoelectric layer 123, negative charges are generated in the vicinity of the surface of the second piezoelectric layer 123 on the output electrode layer 122b side. The positive charges are collected near the surface of the second piezoelectric layer 123 on the ground electrode layer 15 side.

  In addition, as a constituent material of the first piezoelectric layer 121 and the second piezoelectric layer 123, from the viewpoint of having excellent characteristics such as a wide dynamic range, high rigidity, high natural frequency, high load resistance, and the like. Consists of crystal. Further, like the first piezoelectric layer 121 and the second piezoelectric layer 123, a piezoelectric layer that generates an electric charge with respect to an external force (shearing force) along the surface direction of the layer is configured by a Y-cut crystal. be able to.

  The output electrode layer 122a has a function of outputting positive charge or negative charge generated in the first piezoelectric layer 121 as the charge Qya. As described above, when an external force along the positive direction of the β axis is applied to the first piezoelectric layer 121, positive charges are collected in the vicinity of the output electrode layer 122a. As a result, positive charge Qya is output from the output electrode layer 122a. On the other hand, when an external force along the negative direction of the β axis is applied to the first piezoelectric layer 121, negative charges are collected near the output electrode layer 122a. As a result, negative charge Qya is output from the output electrode layer 122a.

The output electrode layer 122b has a function of outputting a positive charge or a negative charge generated in the second piezoelectric layer 123 as a charge Qyb. As described above, when an external force along the positive direction of the β axis is applied to the second piezoelectric layer 123, positive charges are collected in the vicinity of the output electrode layer 122b. As a result, positive charge Qya is output from the output electrode layer 122b. On the other hand, when an external force along the negative direction of the β axis is applied to the second piezoelectric layer 123, negative charges are collected in the vicinity of the output electrode layer 122b. As a result, negative charge Qyb is output from the output electrode layer 122b.
Further, the charge Qya output from the output electrode layer 122a and the charge Qyb output from the output electrode layer 122b are added by the adder circuit 94 to become Qy.

Thus, in the first sensor 12, the first piezoelectric layer 121 and the second piezoelectric layer 123 are provided with electrode layers on both surfaces.
The material constituting the output electrode layer 122a and the output electrode layer 122b is not particularly limited, and the same material as that constituting the ground electrode layers 11, 15, 16, 17, 18, and 19 can be used.

The second sensor 13 has a function of outputting a charge Qz according to an external force (compression / tensile force) applied (received) along the γ axis. The second sensor 13 is configured to output a positive charge according to a compressive force parallel to the γ axis and to output a negative charge according to a tensile force parallel to the γ axis.
The second sensor 13 includes a third piezoelectric layer (second piezoelectric plate) 131 and a fourth piezoelectric layer (second piezoelectric plate) provided to face the third piezoelectric layer 131. 133, an output electrode layer (second electrode layer) 132a provided on the upper surface of the third piezoelectric layer 131, and an output electrode layer (second electrode) provided on the lower surface of the fourth piezoelectric layer 133 Layer) 132b.

  The third piezoelectric layer 131 has an x-axis, a y-axis, and a z-axis that are three crystal axes orthogonal to each other. As a result, the z-axis direction and the α-axis direction match, the x-axis direction and the γ-axis direction match, and the y-axis direction and the β-axis direction match. When a compressive force parallel to the γ-axis is applied to the third piezoelectric layer 131, a charge is induced in the third piezoelectric layer 131 due to the piezoelectric effect. As a result, positive charges are collected near the surface of the third piezoelectric layer 131 on the output electrode layer 132a side, and negative charges are collected near the surface of the third piezoelectric layer 131 on the ground electrode layer 16 side. Similarly, when a tensile force parallel to the γ-axis is applied to the surface of the third piezoelectric layer 131, negative charges gather near the surface of the third piezoelectric layer 131 on the output electrode layer 132a side, Positive charges collect near the surface of the third piezoelectric layer 131 on the ground electrode layer 16 side.

  The fourth piezoelectric layer 133 has an x-axis, a y-axis, and a z-axis that are three crystal axes orthogonal to each other. As a result, the z-axis direction and the α-axis direction match, the x-axis direction and the γ-axis direction match, and the y-axis direction and the β-axis direction match. When a compressive force parallel to the γ-axis is applied to the surface of the fourth piezoelectric layer 133, charges are induced in the fourth piezoelectric layer 133 due to the piezoelectric effect. As a result, positive charges gather near the surface of the fourth piezoelectric layer 133 on the output electrode layer 132b side, and negative charges gather near the surface of the fourth piezoelectric layer 133 on the ground electrode layer 17 side. Similarly, when a tensile force parallel to the γ-axis is applied to the surface of the fourth piezoelectric layer 133, negative charges gather near the output electrode layer 132b side surface of the fourth piezoelectric layer 133, Positive charges collect near the surface of the fourth piezoelectric layer 133 on the ground electrode layer 17 side.

  As the constituent material of the third piezoelectric layer 131 and the fourth piezoelectric layer 133, the same constituent material as that of the first piezoelectric layer 121 and the second piezoelectric layer 123 can be used. In addition, like the third piezoelectric layer 131 and the fourth piezoelectric layer 133, the piezoelectric layer that generates an electric charge with respect to an external force (compression / tensile force) perpendicular to the surface direction of the layer is made of X-cut quartz. Can be configured.

  The output electrode layer 132a has a function of outputting positive charges or negative charges generated in the third piezoelectric layer 131 as charges Qza. As described above, when an external force along the positive direction of the γ-axis is applied to the third piezoelectric layer 131, positive charges are collected in the vicinity of the output electrode layer 132a. As a result, a positive charge Qza is output from the output electrode layer 132a. On the other hand, when an external force along the negative direction of the γ axis is applied to the third piezoelectric layer 131, negative charges are collected in the vicinity of the output electrode layer 132a. As a result, negative charge Qya is output from the output electrode layer 132a.

The output electrode layer 132b has a function of outputting positive charges or negative charges generated in the fourth piezoelectric layer 133 as charges Qzb. As described above, when an external force along the positive direction of the γ-axis is applied to the fourth piezoelectric layer 133, positive charges are collected in the vicinity of the output electrode layer 132b. As a result, positive charge Qza is output from the output electrode layer 132b. On the other hand, when an external force along the negative direction of the γ axis is applied to the fourth piezoelectric layer 133, negative charges are collected in the vicinity of the output electrode layer 132b. As a result, a negative charge Qzb is output from the output electrode layer 132b.
Further, the charge Qza output from the output electrode layer 132a and the charge Qzb output from the output electrode layer 132b are added by the adder circuit 95 to become Qz.

Thus, in the second sensor 13, the third piezoelectric layer 131 and the fourth piezoelectric layer 133 are provided with electrode layers on both surfaces.
The third sensor 14 has a function of outputting a charge Qx according to an external force (shearing force) applied (received) along the α axis. The third sensor 14 is configured to output a positive charge according to an external force applied along the positive direction of the α axis and to output a negative charge according to an external force applied along the negative direction of the α axis. Has been.

  The third sensor 14 includes a fifth piezoelectric layer (third piezoelectric plate) 141 and a sixth piezoelectric layer (third piezoelectric plate) provided to face the fifth piezoelectric layer 141. 143, an output electrode layer (third electrode layer) 142a provided on the upper surface (first surface) of the fifth piezoelectric layer 141, and a lower surface (second surface) of the sixth piezoelectric layer 143 And an output electrode layer (third electrode layer) 142b.

  The fifth piezoelectric layer 141 has an x-axis, a y-axis, and a z-axis that are three crystal axes orthogonal to each other. As a result, the z-axis direction and the α-axis direction match, the y-axis direction and the γ-axis direction match, and the x-axis direction and the β-axis direction match. When an external force along the positive direction of the α axis is applied to the surface of the fifth piezoelectric layer 141, electric charges are induced in the fifth piezoelectric layer 141 by the piezoelectric effect. As a result, positive charges gather near the surface of the fifth piezoelectric layer 141 on the output electrode layer 142a side, and negative charges gather near the surface of the fifth piezoelectric layer 141 on the ground electrode layer 18 side. Similarly, when an external force along the negative direction of the α axis is applied to the surface of the fifth piezoelectric layer 141, negative charges are generated near the surface of the fifth piezoelectric layer 141 on the output electrode layer 142a side. As a result, positive charges are collected in the vicinity of the surface of the fifth piezoelectric layer 141 on the ground electrode layer 18 side.

  The sixth piezoelectric layer 143 has an x-axis, a y-axis, and a z-axis that are three crystal axes orthogonal to each other. As a result, the z-axis direction and the α-axis direction match, the y-axis direction and the γ-axis direction match, and the x-axis direction and the β-axis direction match. When an external force along the positive direction of the α axis is applied to the surface of the sixth piezoelectric layer 143, electric charges are induced in the sixth piezoelectric layer 143 by the piezoelectric effect. As a result, positive charges gather near the surface of the sixth piezoelectric layer 143 on the output electrode layer 142b side, and negative charges gather near the surface of the sixth piezoelectric layer 143 on the ground electrode layer 19 side. Similarly, when an external force along the negative direction of the α axis is applied to the surface of the sixth piezoelectric layer 143, negative charges are generated near the surface of the sixth piezoelectric layer 143 on the output electrode layer 142b side. The positive charges are collected near the surface of the sixth piezoelectric layer 143 on the side of the ground electrode layer 19.

  As the constituent materials of the fifth piezoelectric layer 141 and the sixth piezoelectric layer 143, the same constituent materials as those of the first piezoelectric layer 121 and the second piezoelectric layer 123 can be used. Further, like the fifth piezoelectric layer 141 and the sixth piezoelectric layer 143, the piezoelectric layer that generates an electric charge with respect to an external force (shearing force) along the surface direction of the layer is the first piezoelectric layer. Similarly to 121 and the second piezoelectric layer 123, it can be composed of Y-cut quartz.

  The output electrode layer 142a has a function of outputting positive charges or negative charges generated in the fifth piezoelectric layer 141 as charges Qxa. As described above, when an external force along the positive direction of the α axis is applied to the surface of the fifth piezoelectric layer 141, positive charges are collected in the vicinity of the output electrode layer 142a. As a result, positive charge Qxa is output from the output electrode layer 142a. On the other hand, when an external force along the negative direction of the α axis is applied to the surface of the fifth piezoelectric layer 141, negative charges are collected near the output electrode layer 142a. As a result, a negative charge Qxa is output from the output electrode layer 142a.

The output electrode layer 142b has a function of outputting positive charges or negative charges generated in the sixth piezoelectric layer 143 as charges Qxb. As described above, when an external force along the positive direction of the α axis is applied to the surface of the sixth piezoelectric layer 143, positive charges are collected in the vicinity of the output electrode layer 142b. As a result, positive charge Qxb is output from the output electrode layer 142b. On the other hand, when an external force along the negative direction of the α axis is applied to the surface of the sixth piezoelectric layer 143, negative charges are collected near the output electrode layer 142b. As a result, a negative charge Qxb is output from the output electrode layer 142b.
The charge Qxa output from the output electrode layer 142a and the charge Qxb output from the output electrode layer 142b are added by the adder circuit 96 to become Qx.

Thus, in the third sensor 14, the fifth piezoelectric layer 141 and the sixth piezoelectric layer 143 are provided with electrode layers on both sides.
In addition, the charge output element 10 includes bonding layers 101, 102, 103, 104, and 105. The bonding layer 101 is provided between the output electrode layer 122a and the output electrode layer 122b, and bonds the output electrode layer 122a and the output electrode layer 122b. The bonding layer 102 is provided between the ground electrode layer 15 and the ground electrode layer 16 and bonds the ground electrode layer 15 and the ground electrode layer 16 together. The bonding layer 103 is provided between the output electrode layer 132a and the output electrode layer 132b, and bonds the output electrode layer 132a and the output electrode layer 132b. The bonding layer 104 is provided between the ground electrode layer 17 and the ground electrode layer 18 and bonds the ground electrode layer 17 and the ground electrode layer 18 together. The bonding layer 105 is provided between the output electrode layer 142a and the output electrode layer 142b, and bonds the output electrode layer 142a and the output electrode layer 142b. With such a configuration, the first sensor 12, the second sensor 13, and the third sensor 14 are joined in the stacking direction to form a stacked body.

The thickness W of each bonding layer 101, 102, 103, 104, 105 is the same, preferably 0.2 μm or more and 2.0 μm or less, more preferably 1.0 μm or more and 1.5 μm or less. preferable. By making the thickness W of each bonding layer 101, 102, 103, 104, 105 within the above numerical range, the charge output element 10 can be reduced in size (thinned) and the bonding strength of each electrode layer can be increased. It can be secured sufficiently.
The material constituting the bonding layers 101, 102, 103, 104, and 105 is not particularly limited. For example, a silicone-based, epoxy-based, acrylic-based, cyanoacrylate-based, polyurethane-based adhesive, or the like is preferably used. Can do.

  As described above, in the charge output element 10, the first sensor 12, the second sensor 13, and the third sensor 14 are stacked in the stacking direction (γ-axis direction) so that the force detection directions of the sensors are orthogonal to each other. Are stacked. Thereby, each sensor can induce an electric charge according to force components orthogonal to each other. Therefore, the charge output element 10 outputs three charges Qx, Qy, and Qz according to each of external forces along the three axes (α (X) axis, β (Y) axis, γ (Z) axis). Can do.

Further, since each sensor has two piezoelectric layers, more charges can be detected compared to the case where each sensor is composed of one piezoelectric layer. Therefore, the sensitivity of the charge output element 10 can be improved.
The output electrode layers 122a, 122b, 132a, 132b, 142a, 142b and the ground electrode layers 11, 15, 16, 17, 18, 19 have substantially the same thickness and area in this embodiment.

  As described above, the charge output element 10 includes the ground electrode layer 11, the piezoelectric layer 121, the output electrode layer 122a, the bonding layer 101, the output electrode layer 122b, the second piezoelectric layer 123, the ground electrode layer 15, Bonding layer 102, ground electrode layer 16, third piezoelectric layer 131, output electrode 131a, bonding layer 103, output electrode layer 131b, fourth piezoelectric layer 133, ground electrode layer 17, bonding layer 104, ground electrode layer 18, the fifth piezoelectric layer 141, the output electrode layer 142a, the bonding layer 105, the output electrode layer 142b, the sixth piezoelectric layer 143, and the ground electrode layer 19 are laminated in this order from the negative side of the γ axis. That is, the first piezoelectric layer 121, the second piezoelectric layer 123, the third piezoelectric layer 131, the fourth piezoelectric layer 133, the fifth piezoelectric layer 141, and the sixth piezoelectric layer 143 are: Each has electrode layers on both sides.

According to such a configuration, the output electrode layer 122 a becomes a dedicated output electrode layer of the first piezoelectric layer 121. Since the bonding layer is omitted between the output electrode layer 122a and the first piezoelectric layer 121, the output electrode layer 122a reliably detects the charge Qya output from the first piezoelectric layer 121. be able to.
The output electrode layer 122b is a dedicated output electrode layer for the second piezoelectric layer 123. Since the bonding layer is omitted between the output electrode layer 122b and the second piezoelectric layer 123, the output electrode layer 122b reliably detects the charge Qyb output from the second piezoelectric layer 123. be able to.

The output electrode layer 132a is a dedicated output electrode layer for the third piezoelectric layer 131. Since the bonding layer is omitted between the output electrode layer 132a and the third piezoelectric layer 131, the output electrode layer 132a reliably detects the charge Qza output from the third piezoelectric layer 131. be able to.
The output electrode layer 132b is a dedicated output electrode layer for the fourth piezoelectric layer 133. Since the bonding layer is omitted between the output electrode layer 132a and the fourth piezoelectric layer 133, the output electrode layer 132a reliably detects the charge Qzb output from the fourth piezoelectric layer 133. be able to.

The output electrode layer 142a is a dedicated output electrode layer for the fifth piezoelectric layer 141. Since the bonding layer is omitted between the output electrode layer 142a and the fifth piezoelectric layer 141, the output electrode layer 142a reliably detects the charge Qxa output from the fifth piezoelectric layer 141. be able to.
The output electrode layer 142b is a dedicated output electrode layer for the sixth piezoelectric layer 143. Since the bonding layer is omitted between the output electrode layer 142b and the sixth piezoelectric layer 143, the output electrode layer 142b reliably detects the charge Qxb output from the sixth piezoelectric layer 143. be able to.

As described above, in the charge output element 10, the charges output from the piezoelectric layers 121, 123, 131, 133, 141, and 143 despite having the bonding layers 101, 102, 103, 104, and 105. Can be reliably detected. Therefore, the charge output element 10 with high detection accuracy can be obtained.
Here, each piezoelectric material layer 121, 123, 131, 133, 141, 143 formed of a quartz plate, output electrode layers 122a, 122b, 132a, 132b, 142a, 142b, and ground electrode layers 11, 15, 16, 17, 18 and 19 have different thermal expansion coefficients. In many cases, in the electrode material, the thermal expansion coefficient of the output electrode layer and the ground electrode layer is larger than the thermal expansion coefficient of the piezoelectric layer.

  As shown in FIG. 5B, for example, when the output electrode layer is provided only on the upper surface of the piezoelectric layer, the electrode layer expands more than the piezoelectric layer due to the temperature rise in the peripheral portion thereof. For this reason, force F1 is applied to the piezoelectric layer from the electrode layer. Since the force F1 is larger than the stress F2 generated by thermal expansion, the piezoelectric layer and the electrode layer may be warped so as to be bent as shown in FIG.

On the other hand, when the piezoelectric layer and the electrode layer contract due to a temperature drop around the piezoelectric layer and the output electrode layer, the electrode layer contracts more than the piezoelectric layer. For this reason, force F3 is applied to the piezoelectric layer from the electrode layer. Since the force F3 is larger than the stress F4 generated by thermal expansion, the piezoelectric layer and the electrode layer may be warped so as to be bent as shown in FIG.
However, in the charge output element 10, such a problem can be prevented. Hereinafter, this will be described. However, in each of the piezoelectric layers and each electrode layer, since the problem is prevented by the same principle, the first piezoelectric layer 121, the output electrode layer 122a, and the ground electrode layer 11 are representative. Explained.

In the charge output element 10, an output electrode layer 122 a is provided on the upper surface of the first piezoelectric layer 121, and a ground electrode layer 11 is provided on the lower surface of the first piezoelectric layer 121. That is, the first piezoelectric layer 121 has electrode layers on both sides. According to such a configuration, the output electrode layer 122a and the ground electrode layer 11 have a larger thermal expansion amount than the first piezoelectric layer 121, but the output electrode layer 122a and the ground electrode layer 11 have a thermal expansion amount. Are equal. Therefore, the force F5 applied from the output electrode layer 122a to the first piezoelectric layer 121 and the force F6 applied from the ground electrode layer 11 to the first piezoelectric layer 121 are in the same direction and have the same magnitude. As a result, the warp of the first piezoelectric layer 121 as described above can be prevented.
On the other hand, even when the temperature of the peripheral portion of the charge output element 10 decreases, the force F7 applied from the output electrode layer 122a to the first piezoelectric layer 121 and the first electrode from the ground electrode layer 11 as described above. The force F8 applied to the piezoelectric layer 121 has the same direction and the same magnitude. As a result, the warp of the first piezoelectric layer 121 as described above can be prevented.

As described above, it is possible to suppress or prevent the charge output element 10 from detecting unintentional charges due to a temperature change in the peripheral portion. As a result, the charge output element 10 with high detection accuracy can be obtained.
Further, when viewed from the γ-axis direction, the output electrode layer 122a and the ground electrode layer 11 preferably overlap. That is, when viewed from the γ-axis direction, the output electrode layer 122a and the ground electrode layer 11 are preferably the same size. Thus, during thermal deformation, the force applied from the output electrode layer 122a to the first piezoelectric layer 121 and the force applied from the ground electrode layer 11 to the first piezoelectric layer 121 are surely in the same direction, and It becomes the same size. Therefore, the warp can be more effectively prevented.

In this embodiment, the output electrode layers 122a, 122b, 132a, 132b, 142a, 142b and the ground electrode layers 11, 15, 16, 17, 18, 19 are made of the same material, but are made of different materials. It may be configured. When the output electrode layers 122a, 122b, 132a, 132b, 142a, 142b and the ground electrode layers 11, 15, 16, 17, 18, 19 are made of different materials, the output electrode layers 122a, 122b, 132a, 132b, It is preferable that the thermal expansion coefficients of 142a and 142b and the ground electrode layers 11, 15, 16, 17, 18, and 19 are practically the same. Thereby, the curvature mentioned above can be prevented effectively. Further, at least the thermal expansion coefficients of the output electrode layer 122a and the ground electrode layer 11 match, the thermal expansion coefficients of the output electrode layer 122b and the ground electrode layer 15 match, and the thermal expansion of the output electrode layer 132a and the ground electrode layer 16 The coefficients of thermal expansion match, the thermal expansion coefficients of the output electrode layer 132b and the ground electrode layer 17 match, the thermal expansion coefficients of the output electrode layer 142a and the ground electrode layer 18 match, and the heat of the output electrode layer 142b and the ground electrode layer 19 If the expansion coefficients coincide with each other, the above effect can be obtained.
In the present specification, “practically coincident” means that the difference in thermal expansion coefficient of each electrode layer is 1% or less of one thermal expansion coefficient. Moreover, if the difference in the thermal expansion coefficient of each electrode layer is 10% or less of one thermal expansion coefficient, the said curvature can be suppressed effectively.

Second Embodiment
FIG. 6 is a plan view showing a second embodiment of the force detection device of the present invention. 7 is a cross-sectional view taken along line AA in FIG. FIG. 8 is a circuit diagram schematically showing the force detection device shown in FIG.
Hereinafter, the second embodiment will be described with a focus on the differences from the first embodiment described above, and the description of the same matters will be omitted.

The force detection device 1 of the second embodiment shown in FIGS. 6 and 7 has a function of detecting an external force (including moment), that is, a six-axis force (translation force component (shear force) in the x, y, and z-axis directions). And a rotational force component (moment) around the x, y, and z axes.
As shown in FIGS. 6 and 7, the force detection device 1 has four sensor devices 6 and four pressurizing bolts 71. Although the position of each sensor device 6 is not particularly limited, in this embodiment, each sensor device 6, that is, each charge output element 10, is arranged around the first substrate 2, the second substrate 3, and the analog circuit substrate 4. Along the direction, they are arranged at equiangular intervals (90 ° intervals). Thereby, an external force can be detected without deviation. And a six-axis force can be detected. In the present embodiment, all the charge output elements 10 face the same direction, but the present invention is not limited to this.

The first substrate 2 is provided with four convex portions 21 so as to correspond to the sensor devices 6. Since the convex portion 21 has been described in the first embodiment, the description thereof is omitted.
The number of sensor devices 6 is not limited to the above four, and may be two, three, five, or more, for example. However, the number of sensor devices 6 is preferably plural, and more preferably three or more. In addition, if the force detection apparatus 1 has at least three sensor devices 6, it can detect a six-axis force. When there are three sensor devices 6, since the number of sensor devices 6 is small, the force detection apparatus 1 can be reduced in weight. Further, when there are four sensor devices 6 as shown in the figure, the 6-axis force can be obtained by a very simple calculation to be described later, so that the calculation unit 402 can be simplified.

<Conversion output circuit>
As shown in FIG. 8, conversion output circuits 90a, 90b, and 90c are connected to each charge output element 10, respectively. Since each of the conversion output circuits 90a, 90b, and 90c is the same as the conversion output circuit 90 of the first and second embodiments described above, description thereof is omitted.

<External force detection circuit>
The external force detection circuit 40 includes voltages Vx1, Vx2, Vx3, and Vx4 output from the conversion output circuits 90a, voltages Vz1, Vz2, Vz3, and Vz4 output from the conversion output circuits 90b, and the conversion output circuits 90c. Based on the output voltages Vy1, Vy2, Vy3, and Vy4, it has a function of detecting the applied external force. The external force detection circuit 40 includes an AD converter 401 connected to the conversion output circuits 90a, 90b, and 90c, and an arithmetic unit 402 connected to the AD converter 401.

  The AD converter 401 has a function of converting the voltages Vx1, Vy1, Vz1, Vx2, Vy2, Vz2, Vx3, Vy3, Vz3, Vx4, Vy4, and Vz4 from analog signals to digital signals. The voltages Vx 1, Vy 1, Vz 1, Vx 2, Vy 2, Vz 2, Vx 3, Vy 3, Vz 3, Vx 4, Vy 4, Vz 4 that are digitally converted by the AD converter 401 are input to the arithmetic unit 402.

  That is, when an external force is applied in which the relative positions of the first substrate 2 and the second substrate 3 are shifted in the α (X) axis direction, the AD converter 401 outputs the voltages Vx1, Vx2, Vx3, and Vx4. Similarly, when an external force is applied in which the relative positions of the first substrate 2 and the second substrate 3 are shifted in the β (Y) axis direction, the AD converter 401 outputs voltages Vy1, Vy2, Vy3, and Vy4. . Further, when an external force is applied in which the relative positions of the first substrate 2 and the second substrate 3 are shifted in the γ (Z) axis direction, the AD converter 401 outputs voltages Vz1, Vz2, Vz3, and Vz4.

The first substrate 2 and the second substrate 3 are capable of relative displacement rotating around the x axis, relative displacement rotating around the y axis, and relative displacement rotating around the z axis. It is possible to transmit the external force accompanying to the charge output element 10.
The calculation unit 402 translates the translational force component Fx in the x-axis direction and the translation in the y-axis direction based on the digitally converted voltages Vx1, Vy1, Vz1, Vx2, Vy2, Vz2, Vx3, Vy3, Vz3, Vx4, Vy4, and Vz4. It has a function of calculating a force component Fy, a translational force component Fz in the z-axis direction, a rotational force component Mx around the x axis, a rotational force component My around the y axis, and a rotational force component Mz around the z axis. Each force component can be obtained by the following equation.

Fx = Vx1 + Vx2 + Vx3 + Vx4
Fy = Vy1 + Vy2 + Vy3 + Vy4
Fz = Vz1 + Vz2 + Vz3 + Vz4
Mx = b × (Vz4-Vz2)
My = a × (Vz3−Vz1)
Mz = b * (Vx2-Vx4) + a * (Vy1-Vy3)
Here, a and b are constants.

Thus, the force detection device 1 can detect six-axis forces.
Note that the arithmetic unit 402 may perform, for example, correction that eliminates the difference in sensitivity between the conversion output circuits 90a, 90b, and 90c.
Further, as shown in FIGS. 6 and 7, the first substrate 2 and the second substrate 3 are fixed by four pressurizing bolts 71. The number of pressurizing bolts 71 is not limited to four, and may be two, three, five, or more, for example.

Further, the position of each pressurizing bolt 71 is not particularly limited, but in the present embodiment, each pressurizing bolt 71 is located on the first board 2, the second board 3, the analog circuit board 4, or the digital circuit board 5. They are arranged at equiangular intervals (90 ° intervals) along the circumferential direction. As a result, the first substrate 2 and the second substrate 3 can be fixed with good balance, and pressure can be applied to each charge output element 10 with good balance.
According to the force detection device 1, the same effect as that of the first embodiment described above can be obtained.

<Embodiment of single arm robot>
Next, based on FIG. 9, a single-arm robot which is an embodiment of the robot of the present invention will be described. Hereinafter, the present embodiment will be described with a focus on differences from the first and second embodiments described above, and description of similar matters will be omitted.
FIG. 9 is a diagram showing an example of a single arm robot using the force detection device of the present invention. The single-arm robot 500 of FIG. 9 includes a base 510, an arm 520, an end effector 530 provided on the distal end side of the arm 520, and a force detection device 1 provided between the arm 520 and the end effector 530. Have In addition, as the force detection apparatus 1, the thing similar to each embodiment mentioned above is used.

The base 510 has a function of accommodating an actuator (not shown) that generates power for rotating the arm 520, a control unit (not shown) that controls the actuator, and the like. The base 510 is fixed on, for example, a floor, a wall, a ceiling, or a movable carriage.
The arm 520 includes a first arm element 521, a second arm element 522, a third arm element 523, a fourth arm element 524, and a fifth arm element 525, and rotates adjacent arms. It is configured by linking freely. The arm 520 is driven by being rotated or bent in a compound manner around the connecting portion of each arm element under the control of the control unit.

The end effector 530 has a function of gripping an object. The end effector 530 has a first finger 531 and a second finger 532. After the end effector 530 reaches the predetermined operating position by driving the arm 520, the object can be gripped by adjusting the distance between the first finger 531 and the second finger 532.
The end effector 530 is a hand here, but the present invention is not limited to this. Other examples of the end effector include, for example, a component inspection device, a component transport device, a component processing device, a component assembly device, and a measuring instrument. The same applies to the end effectors in other embodiments.

The force detection device 1 has a function of detecting an external force applied to the end effector 530. By feeding back the force detected by the force detection device 1 to the control unit of the base 510, the single-arm robot 500 can perform more precise work. Further, the single arm robot 500 can detect contact of the end effector 530 with an obstacle or the like by the force detected by the force detection device 1. Therefore, an obstacle avoidance operation, an object damage avoidance operation, and the like, which are difficult with conventional position control, can be easily performed, and the single-arm robot 500 can perform work more safely.
In the illustrated configuration, the arm 520 includes a total of five arm elements, but the present invention is not limited to this. When the arm 520 is constituted by one arm element, when constituted by 2 to 4 arm elements, and when constituted by 6 or more arm elements, it is within the scope of the present invention. .

<Embodiment of double-arm robot>
Next, based on FIG. 10, a multi-arm robot which is an embodiment of the robot of the present invention will be described. Hereinafter, the present embodiment will be described with a focus on differences from the first and second embodiments described above, and description of similar matters will be omitted.
FIG. 10 is a diagram showing an example of a multi-arm robot using the force detection device of the present invention. 10 includes a base 610, a first arm 620, a second arm 630, a first end effector 640a provided on the distal end side of the first arm 620, and a second arm 620. A second end effector 640b provided on the distal end side of the arm 630, and between the first arm 620 and the first end effector 640a and between the second arm 630 and the second end effector 640b. A force detection device 1 is provided. In addition, as the force detection apparatus 1, the thing similar to each embodiment mentioned above is used.

The base 610 has a function of accommodating an actuator (not shown) that generates power for rotating the first arm 620 and the second arm 630, a control unit (not shown) that controls the actuator, and the like. Have. The base 610 is fixed on, for example, a floor, a wall, a ceiling, or a movable carriage.
The 1st arm 620 is comprised by connecting the 1st arm element 621 and the 2nd arm element 622 so that rotation is possible. The second arm 630 is configured by rotatably connecting the first arm element 631 and the second arm element 632. The first arm 620 and the second arm 630 are driven by being complexly rotated or bent around the connecting portion of each arm element under the control of the control unit.

  The first and second end effectors 640a and 640b have a function of gripping an object. The first end effector 640a has a first finger 641a and a second finger 642a. The second end effector 640b has a first finger 641b and a second finger 642b. After the first end effector 640a reaches a predetermined operating position by driving the first arm 620, the object is grasped by adjusting the distance between the first finger 641a and the second finger 642a. Can do. Similarly, after the second end effector 640b reaches a predetermined operation position by driving the second arm 630, the distance between the first finger 641b and the second finger 642b is adjusted to thereby adjust the object. It can be gripped.

The force detection device 1 has a function of detecting an external force applied to the first and second end effectors 640a and 640b. By feeding back the force detected by the force detection device 1 to the control unit of the base 610, the multi-arm robot 600 can perform the operation more precisely. The multi-arm robot 600 can detect contact of the first and second end effectors 640a and 640b with an obstacle by the force detected by the force detection device 1. Therefore, an obstacle avoidance operation, an object damage avoidance operation, and the like that have been difficult with conventional position control can be easily performed, and the multi-arm robot 600 can perform the operation more safely.
In the illustrated configuration, there are a total of two arms, but the present invention is not limited to this. The case where the multi-arm robot 600 has three or more arms is also within the scope of the present invention.

<Embodiments of Electronic Component Inspection Device and Electronic Component Transfer Device>
Next, based on FIG. 11 and FIG. 12, an electronic component inspection apparatus and an electronic component transport apparatus that are embodiments of the present invention will be described. Hereinafter, the present embodiment will be described focusing on the differences from the first and second embodiments described above, and the description of the same matters will be omitted.
FIG. 11 is a diagram showing an example of an electronic component inspection device and a component conveying device using the force detection device of the present invention. FIG. 12 is a diagram illustrating an example of an electronic component transport apparatus using the force detection device of the present invention.

  An electronic component inspection apparatus 700 in FIG. 11 includes a base 710 and a support base 720 provided upright on the side surface of the base 710. On the upper surface of the base 710, an upstream stage 712u on which the electronic component 711 to be inspected is placed and transported, and a downstream stage 712d on which the inspected electronic component 711 is placed and transported are provided. ing. Further, between the upstream stage 712u and the downstream stage 712d, an imaging device 713 for confirming the posture of the electronic component 711, and an inspection table 714 on which the electronic component 711 is set for inspecting electrical characteristics. And are provided. Examples of the electronic component 711 include semiconductors, semiconductor wafers, display devices such as CLD and OLED, crystal devices, various sensors, inkjet heads, various MEMS devices, and the like.

  Further, the support base 720 is provided with a Y stage 731 that can move in a direction (Y direction) parallel to the upstream stage 712u and the downstream stage 712d of the base 710. An arm portion 732 is extended in a direction (X direction) toward 710. An X stage 733 is provided on the side surface of the arm 732 so as to be movable in the X direction. In addition, the X stage 733 is provided with an imaging camera 734 and an electronic component transfer device 740 incorporating a Z stage movable in the vertical direction (Z direction). In addition, a gripping portion 741 that grips the electronic component 711 is provided on the front end side of the electronic component transport apparatus 740. Further, the force detection device 1 is provided between the tip of the electronic component transport device 740 and the grip portion 741. Further, on the front side of the base 710, a control device 750 for controlling the overall operation of the electronic component inspection device 700 is provided. In addition, as the force detection apparatus 1, the thing similar to each embodiment mentioned above is used.

  The electronic component inspection apparatus 700 inspects the electronic component 711 as follows. First, the electronic component 711 to be inspected is placed on the upstream stage 712u and moved to the vicinity of the inspection table 714. Next, the Y stage 731 and the X stage 733 are moved to move the electronic component transport device 740 to a position immediately above the electronic component 711 placed on the upstream stage 712u. At this time, the position of the electronic component 711 can be confirmed using the imaging camera 734. Then, when the electronic component transport device 740 is lowered using the Z stage built in the electronic component transport device 740 and the electronic component 711 is gripped by the gripping portion 741, the electronic component transport device 740 is directly placed on the imaging device 713. The position of the electronic component 711 is confirmed using the imaging device 713. Next, the attitude of the electronic component 711 is adjusted using a fine adjustment mechanism built in the electronic component transport apparatus 740. Then, after moving the electronic component transport device 740 to above the inspection table 714, the Z stage built in the electronic component transport device 740 is moved to set the electronic component 711 on the inspection table 714. Since the attitude of the electronic component 711 is adjusted using the fine adjustment mechanism in the electronic component conveying apparatus 740, the electronic component 711 can be set at the correct position on the inspection table 714. Next, after the electrical characteristic inspection of the electronic component 711 is completed using the inspection table 714, the electronic component 711 is picked up from the inspection table 714, the Y stage 731 and the X stage 733 are moved, and the upper stage 712d is moved. The electronic component conveying device 740 is moved to the position, and the electronic component 711 is placed on the downstream stage 712d. Finally, the downstream stage 712d is moved to transport the electronic component 711 that has been inspected to a predetermined position.

  FIG. 12 is a diagram illustrating an electronic component transport device 740 including the force detection device 1. The electronic component transport device 740 includes a gripping portion 741, a six-axis force detection device 1 connected to the gripping portion 741, a rotation shaft 742 connected to the gripping portion 741 via the six-axis force detection device 1, and a rotation shaft. A fine adjustment plate 743 is rotatably attached to 742. The fine adjustment plate 743 is movable in the X direction and the Y direction while being guided by a guide mechanism (not shown).

  Further, a piezoelectric motor 744θ for rotation direction is mounted toward the end surface of the rotation shaft 742, and a driving convex portion (not shown) of the piezoelectric motor 744θ is pressed against the end surface of the rotation shaft 742. Therefore, by operating the piezoelectric motor 744θ, the rotation shaft 742 (and the gripping portion 741) can be rotated by an arbitrary angle in the θ direction. Further, a piezoelectric motor 744 x for X direction and a piezoelectric motor 744 y for Y direction are provided toward the fine adjustment plate 743, and each drive convex portion (not shown) is a surface of the fine adjustment plate 743. It is pressed against. For this reason, by operating the piezoelectric motor 744x, the fine adjustment plate 743 (and the gripper 741) can be moved by an arbitrary distance in the X direction. Similarly, the fine adjustment can be performed by operating the piezoelectric motor 744y. The plate 743 (and the gripping portion 741) can be moved by an arbitrary distance in the Y direction.

  Further, the force detection device 1 has a function of detecting an external force applied to the grip portion 741. By feeding back the force detected by the force detection device 1 to the control device 750, the electronic component transport device 740 and the electronic component inspection device 700 can perform work more precisely. Further, the contact of the gripping portion 741 with an obstacle can be detected by the force detected by the force detection device 1. Therefore, an obstacle avoidance operation, an object damage avoidance operation, and the like that were difficult with conventional position control can be easily performed, and the electronic component transport device 740 and the electronic component inspection device 700 can perform safer work. is there.

<Embodiment of component processing apparatus>
Next, an embodiment of the component processing apparatus of the present invention will be described based on FIG. Hereinafter, the present embodiment will be described with a focus on differences from the first and second embodiments described above, and description of similar matters will be omitted.
FIG. 13 is a diagram showing an example of a component processing apparatus using the force detection device of the present invention. The component processing apparatus 800 of FIG. 13 is attached to a base 810, a support column 820 standing upright on the upper surface of the base 810, a feed mechanism 830 provided on a side surface of the support column 820, and a lift mechanism 830 that can be moved up and down. A tool displacement unit 840, a force detection device 1 connected to the tool displacement unit 840, and a tool 850 attached to the tool displacement unit 840 via the force detection device 1. In addition, as the force detection apparatus 1, the thing similar to each embodiment mentioned above is used.

  The base 810 is a base for mounting and fixing the workpiece 860. The column 820 is a column for fixing the feed mechanism 830. The feed mechanism 830 has a function of moving the tool displacement portion 840 up and down. The feed mechanism 830 includes a feed motor 831 and a guide 832 that raises and lowers the tool displacement portion 840 based on an output from the feed motor 831. The tool displacement unit 840 has a function of imparting displacement such as rotation and vibration to the tool 850. The tool displacement portion 840 includes a displacement motor 841, a tool attachment portion 843 provided at the tip of a main shaft (not shown) connected to the displacement motor 841, and a holder attached to the tool displacement portion 840 and holding the main shaft. Part 842. The tool 850 is attached to the tool attachment portion 843 of the tool displacement portion 840 via the force detection device 1 and is used for machining the workpiece 860 in accordance with the displacement given from the tool displacement portion 840. The tool 850 is not particularly limited, and is, for example, a wrench, a Phillips screwdriver, a flat-blade screwdriver, a cutter, a circular saw, a nipper, a cone, a drill, or a milling cutter.

  The force detection device 1 has a function of detecting an external force applied to the tool 850. By feeding back the external force detected by the force detection device 1 to the feed motor 831 and the displacement motor 841, the component processing device 800 can execute the component processing operation more precisely. Further, the contact of the tool 850 with an obstacle or the like can be detected by the external force detected by the force detection device 1. Therefore, an emergency stop can be performed when an obstacle or the like comes in contact with the tool 850, and the component processing apparatus 800 can execute a safer component processing operation.

<Embodiment of moving body>
Next, based on FIG. 14, embodiment of a moving body is described. Hereinafter, the present embodiment will be described with a focus on differences from the first and second embodiments described above, and description of similar matters will be omitted.
FIG. 14 is a diagram showing an example of a moving body using the force detection device of the present invention. The moving body 900 of FIG. 14 can move with the applied power. The moving body 900 is not particularly limited, and is, for example, a vehicle such as an automobile, a motorcycle, an airplane, a ship, or a train, a robot such as a bipedal walking robot, or a wheeled robot.

The moving body 900 detects a main body 910 (e.g., a vehicle casing, a robot main body, etc.), a power unit 920 that supplies power for moving the main body 910, and an external force generated by the movement of the main body 910. The force detection device 1 of the present invention and a control unit 930 are provided. In addition, as the force detection apparatus 1, the thing similar to each embodiment mentioned above is used.
When the main body 910 is moved by the power supplied from the power unit 920, vibration, acceleration, and the like are generated with the movement. The force detection device 1 detects an external force caused by vibration, acceleration, or the like that occurs with movement. The external force detected by the force detection device 1 is transmitted to the control unit 930. The control unit 930 can execute control such as posture control, vibration control, and acceleration control by controlling the power unit 920 and the like according to the external force transmitted from the force detection device 1.

The sensor device, the force detection device, the robot, the electronic component transport device, the electronic component inspection device, and the component processing device of the present invention have been described based on the illustrated embodiments. However, the present invention is not limited to this. Instead, the configuration of each part can be replaced with any configuration having the same function. In addition, any other component may be added to the present invention.
In addition, the present invention may be a combination of any two or more configurations (features) of the embodiment.

In the present invention, the package, that is, the first member and the second member may be omitted.
In the present invention, the element may protrude from the first convex portion in a plan view of the first substrate.
In the present invention, the element may protrude from the second convex portion in a plan view of the first substrate.

In the above embodiment, a device using a piezoelectric body is used as an element for outputting a signal in accordance with an external force. However, in the present invention, if the output changes depending on the applied external force, this element may be used. In addition, the thing using a pressure sensitive conductor etc. is mentioned, for example.
Further, in the present invention, instead of the pressurizing bolt, for example, one having no function of applying pressurization to the element may be used, or a fixing method other than the bolt may be adopted.

In addition, the robot of the present invention is not limited to an arm type robot (robot arm) as long as it has an arm, but is another type of robot such as a scalar robot, a legged walking (running) robot, or the like. Also good.
Further, the force detection device (sensor device) of the present invention is not limited to a robot, an electronic component transfer device, an electronic component inspection device, and a component processing device, but other devices such as other transfer devices, other inspection devices, vibrations. It can also be applied to measuring devices such as gauges, accelerometers, gravimeters, dynamometers, seismometers, inclinometers, and input devices.

DESCRIPTION OF SYMBOLS 1 ... Force detection apparatus 2 ... 1st board | substrate 21 ... Protruding part 211 ... Upper surface 25 ... Female screw 3 ... 2nd board | substrate 35 ... Hole 36 ... Lower surface 4 ... Analog circuit board 40 ... External force detection circuit 401 ... AD converter 402 ... Arithmetic unit 41, 42 ... hole 5 ... digital circuit board 51, 52 ... hole 6 ... sensor device 60 ... package 61 ... base 611 ... concave part 62 ... lid body 625 ... central part 626 ... outer peripheral part 63 ... terminal 71 ... pressure bolt 715: Head 716: Male screw 90a, 90b, 90c ... Conversion output circuit 91 ... Operational amplifier 92 ... Capacitor 93 ... Switching element 94 ... Adder circuit 10 ... Charge output element 11, 15, 16, 17, 18, 19 ... Ground electrode Layer 12 ... first sensor 121 ... first piezoelectric layer 122a, 122b ... output electrode layer 123 Second piezoelectric layer 13 ... Second sensor 131 ... Third piezoelectric layer 132a, 132b ... Output electrode layer 133 ... Fourth piezoelectric layer 14 ... Third sensor 141 ... Fifth piezoelectric layer 142a , 142b ... output electrode layer 143 ... sixth piezoelectric layer 101, 102, 103, 104, 105 ... bonding layer 500 ... single arm robot 510 ... base 520 ... arm 521 ... first arm element 522 ... second Arm element 523 ... Third arm element 524 ... Fourth arm element 525 ... Fifth arm element 530 ... End effector 531 ... First finger 532 ... Second finger 600 ... Multi-arm robot 610 ... Base 620 ... 1st arm 621 ... 1st arm element 622 ... 2nd arm element 630 ... 2nd arm 631 ... 1st arm element 632 ... 2nd Arm element 640a ... first end effector 641a ... first finger 642a ... second finger 640b ... second end effector 641b ... first finger 642b ... second finger 700 ... electronic component inspection device 710 ... base 711 ... Electronic components 712u ... Upstream stage 712d ... Downstream stage 713 ... Imaging device 714 ... Inspection table 720 ... Supporting table 731 ... Y stage 732 ... Arms 733 ... X stage 734 ... Imaging camera 740 ... Electronic component conveying device 741 ... Gripping part 742 ... Rotating shaft 743 ... Fine adjustment plate 744x, 744y, 744θ ... Piezoelectric motor 750 ... Control device 800 ... Part processing device 810 ... Base 820 ... Pole 830 ... Feed mechanism 831 ... Feed motor 832 ... Guide 840 ... Tool Displacement part 841 ... Displacement motor 842 ... Holding part 843 ... Tool mounting part 850 ... Tool 860 ... Parts to be processed 900 ... Moving body 910 ... Main body 920 ... Power part 930 ... Control part

Claims (11)

Comprising a laminate in which a plurality of sensors having at least one piezoelectric plate made of a quartz plate and electrode layers respectively provided on both sides of the piezoelectric plate are laminated in a lamination direction;
The stacked body includes a bonding layer that bonds the sensors in the stacking direction.   The thermal expansion coefficient of the electrode layer provided on one surface of the piezoelectric plate and the thermal expansion coefficient of the electrode layer provided on the other surface of the piezoelectric plate are practically coincident. Sensor element.   The sensor element according to claim 1, wherein the thermal expansion coefficients of the electrode layers of the plurality of sensors are practically coincident with each other.   The sensor element according to claim 1, wherein a thickness of the bonding layer is 0.2 μm or more and 2.0 μm or less.   5. The sensor element according to claim 1, wherein the bonding layer is provided between the plurality of sensors. A plurality of sensors having at least one piezoelectric plate made of a quartz plate, and electrode layers respectively provided on both sides of the piezoelectric plate;
A plurality of sensors are provided with a laminated body laminated in the lamination direction,
The laminated body includes a sensor element having a bonding layer bonded in the stacking direction;
An external force detection circuit that detects the external force based on a voltage output from the sensor element.   The force detection device according to claim 6, wherein three or more sensor devices are provided. A plurality of arms, and at least one arm connecting body formed by rotatably connecting the adjacent arms of the plurality of arms;
An end effector provided on a distal end side of the arm coupling body;
A robot comprising the force detection device according to claim 6 or 7, wherein the robot is provided between the arm coupling body and the end effector and detects an external force applied to the end effector. A gripper for gripping electronic components;
An electronic component conveying apparatus comprising: the force detecting device according to claim 6 or 7 that detects an external force applied to the gripping portion. A gripper for gripping electronic components;
An inspection unit for inspecting the electronic component;
An electronic component inspection apparatus comprising: the force detection device according to claim 6 or 7 that detects an external force applied to the grip portion. A tool displacing part for mounting the tool and displacing the tool;
A component processing apparatus comprising: the force detection device according to claim 6 or 7 that detects an external force applied to the tool.

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