JP2015073031A - Electrical equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide electrical equipment in which stress applied to electronic parts mounted on a first board and solder portions.SOLUTION: Electrical equipment has a board 2 on which an imaging element 51 is mounted, boards 3, 4 on which electronic parts are mounted, and a case 1 in which the boards 2, 3, 4 are accommodated and an opening 124 for exposing the imaging element 51 is formed. At the opening 124, a penetration direction from the outside of the case 1 to the inside thereof is set to an upward direction, the board 2 is disposed so that a lower surface 21 confronts the opening 124 and the normal direction of the lower surface 21 is coincident with the penetration direction of the opening 124, the boards 3, 4 are disposed so that the normal directions of the left surfaces 34, 44 and right surfaces 35, 45 thereof are different from the normal direction of the lower surface 21, and the upward movement of the board 2 is restricted by the contact between the edge of the upper surface 22 at the opposite side to the lower surface 21 of the board 2 and the inner surface of the case 1.

Description

  The present invention relates to an electrical device.

  2. Description of the Related Art Conventionally, there is an electric device that houses a plurality of substrates in a case and exposes functional components mounted on the substrate from the opening of the case (see, for example, Patent Document 1).

  The electric device (lighting control device) of Patent Document 1 has a case (apparatus main body, upper lid, cover) such that the second substrate (control substrate, power supply substrate) is perpendicular to the first substrate (sensor substrate). It is stored in. The first substrate and the second substrate are connected by a bendable flat cable. In addition, a functional component (remote control receiving unit) is mounted on the first substrate, and the functional component is exposed from an opening formed in the case.

JP 2002-151278 A

  Since the functional component mounted on the first substrate is exposed from the opening of the case, an external force may be applied to the functional component from the outside of the case through the opening. Due to this external force, the first substrate is deformed, and unnecessary stress may be applied to the electronic component mounted on the first substrate and the soldered portion of the electronic component.

  The present invention has been made in view of the above reasons, and an object of the present invention is to provide an electronic device mounted on a first substrate and an electric device capable of reducing stress on a soldered portion. .

  The electrical device of the present invention includes a first substrate on which functional components are mounted, a second substrate on which electronic components other than the functional components are mounted on a mounting surface, the first substrate, and the second substrate. And a case in which an opening for exposing the functional component is formed. In the opening, a through direction from the outside to the inside of the case is defined as a first direction, and the first substrate includes the opening. The first surface is opposed to the first surface, the normal direction of the first surface is the same direction as the through direction of the opening, and the second substrate is the normal direction of the mounting surface Is arranged in a direction different from the normal direction of the first surface, the edge of the second surface on the back side with respect to the first surface of the first substrate, and the inner surface of the case Limiting the movement of the first substrate in the first direction by contacting And butterflies.

  In this electrical apparatus, the case includes a contact portion that contacts an edge of the second surface of the first substrate, and the contact portion moves the first substrate in the first direction. It is preferable to limit.

  In this electrical apparatus, it is preferable that the functional component includes an image sensor.

  As described above, in the present invention, the second substrate is in contact with both the edge of the second surface of the first substrate and the inner surface of the case, whereby the first direction of the first substrate. Restrict movement to Thereby, even if an external force is applied to the functional component through the opening of the case, the deformation of the first substrate is suppressed, and the stress of the electronic component mounted on the first substrate and the soldered portion is reduced. There is an effect that can be.

It is a disassembled perspective view of the electric equipment of embodiment of this invention. It is an external view of an electric equipment. It is an external appearance perspective view of the assembled board | substrate. It is an external appearance perspective view in the state where the substrate was stored in the upper case. It is sectional drawing of the state in which the board | substrate was accommodated in the upper case.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment)
FIG. 1 is an exploded perspective view of the electric apparatus of the present embodiment, and FIG. In the following description, the vertical and horizontal directions indicated by arrows in FIG. 1 are defined as vertical and horizontal and longitudinal directions. The electrical apparatus according to the present embodiment is a sensor device that detects, for example, the presence or absence of a person using the image sensor 51 (functional component), and is provided in a state embedded in a ceiling. In addition, it is not the meaning which limits the use application of an electric equipment to a sensor apparatus.

  The electrical apparatus according to the present embodiment is configured by housing three substrates 2, 3, and 4 in a case 1. The substrate 2 corresponds to the first substrate, and the substrates 3 and 4 correspond to the second substrate.

  Case 1 is configured by combining upper case 11 and lower case 12. The upper case 11 is formed in a rectangular box shape that is open at the bottom. The lower case 12 includes a cylindrical portion 121 and a bottom portion 122 and is provided so as to cover the opening of the upper case 11. The cylindrical portion 121 is formed in a cylindrical shape whose upper end is in contact with the lower end of the upper case 11. The bottom portion 122 is continuous with the lower end of the cylindrical portion 121 and is formed in a disc shape that covers the lower side of the cylindrical portion 121.

  Further, a pair of hooking claws 111 are formed so as to protrude downward from the left and right side surfaces in the upper case 11. Grooves (not shown) are formed on the left and right side surfaces in the cylindrical portion 121. Then, the tip of the hook claw 111 of the upper case 11 is hooked into the groove of the cylindrical portion 121, so that the upper case 11 and the lower case 12 are fixed in a combined state. By combining the upper case 11 and the lower case 12, a space surrounded by the upper case 11 and the lower case 12 is formed, and the substrates 2, 3, and 4 are accommodated in this space.

  In addition, the lower case 12 includes a plate-shaped fixing bracket 123 formed in the front direction and the rear direction with the vertical direction as the thickness direction. By sandwiching the ceiling between the fixing bracket 123 and the bottom portion 122, the upper case 11 and the cylinder portion 121 are embedded in the ceiling, and the electric device is installed on the ceiling with the bottom portion 122 exposed from the ceiling.

  Next, the substrates 2, 3, and 4 will be described. The boards 2, 3, and 4 are printed boards on which electronic components are mounted. Then, the substrates 3 and 4 are assembled to the substrate 2 as shown in FIG.

  The substrate 2 is formed in a rectangular shape whose longitudinal direction is the front-rear direction, and is provided so that the lower surface 21 (first surface) faces the upper surface of the bottom portion 122. An imaging element 51 (functional component) and diodes 52 to 56 are mounted on the lower surface 21 of the substrate 2. The image sensor 51 is mounted at the center of the lower surface 21 of the substrate 2. The diodes 52 to 54 are mounted in a line in the order of the diode 52, the diode 53, and the diode 54 from the left on the rear edge of the lower surface 21 of the substrate 2. The diodes 55 and 56 are mounted on the front edge of the lower surface 21 of the substrate 2 in the order of the diode 55 and the diode 56 from the left. Although not shown, electronic components other than the image sensor 51 and the diodes 52 to 56 are also mounted on the substrate 2.

  An opening 124 that exposes the light receiving portion 511 of the image sensor 51 to the outside of the case 1 is formed at a position facing the image sensor 51 in the bottom 122 of the lower case 12. In other words, the through direction from the outside to the inside of the case 1 in the opening 124 is the upward direction (first direction). The substrate 2 is arranged so that the normal direction of the lower surface 21 on which the image sensor 51 is mounted is the vertical direction that is the same direction as the through direction of the opening 124. The lower part of the electric device can be imaged. Then, a processing circuit (not shown) detects whether a person exists using the imaging result of the imaging element 51.

  In addition, an opening 125 for exposing the diode 52 to the outside of the case 1 is formed at a position facing the diode 52 in the bottom portion 122 of the lower case 12. The diode 52 is a receiving diode that receives an infrared signal transmitted from a remote controller (not shown) for operation setting, and receives the infrared signal through the opening 125.

  An opening 126 for exposing the diode 53 to the outside of the case 1 is formed at a position facing the diode 53 at the bottom 122 of the lower case 12. In addition, an opening 127 for exposing the diode 54 to the outside of the case 1 is formed at a position facing the diode 54 in the bottom 122 of the lower case 12. The diodes 53 and 54 are transmitting diodes that transmit an infrared signal to the remote controller for operation setting, and transmit the infrared signal through the openings 126 and 127.

  An opening 128 for exposing the diode 55 to the outside of the case 1 is formed at a position facing the diode 55 in the bottom 122 of the lower case 12. In addition, an opening 129 for exposing the diode 56 to the outside of the case 1 is formed at a position facing the diode 56 in the bottom 122 of the lower case 12. The diode 55 is a red light emitting diode that emits red light, and the diode 56 is a green light emitting diode that emits green light. The diodes 55 and 56 function as a monitor that indicates the operation state, operation setting, and the like of the electric device by a combination of lighting, blinking, and extinguishing. The user can visually check the lighting state of the diodes 55 and 56 through the openings 128 and 129 from the outside of the case 1.

  Next, the board | substrate 3 is formed in the rectangular shape which makes the left-right direction the thickness direction, and is provided so that the left edge in the upper surface 22 (2nd surface) of the board | substrate 2 may be contacted. Specifically, slits 23 are formed in the front-rear direction near the front and rear ends of the left edge of the substrate 2. Further, a protrusion 31 is formed downward from the vicinity of the front end and rear end of the lower end of the substrate 3. And each protrusion 31 of the board | substrate 3 is inserted in each slit 23 of the board | substrate 2, and the board | substrate 2 and the board | substrate 3 are positioned. A plug connector 24 is provided at the center of the left edge of the upper surface 22 of the substrate 2. A receptacle connector 32 is provided at the center of the lower edge of the left surface 34 of the substrate 3. Then, the protrusion 31 of the substrate 3 is inserted into the slit 23 of the substrate 2 and the plug connector 24 of the substrate 2 and the receptacle connector 32 of the substrate 3 are connected, so that the substrate 2 and the substrate 3 are electrically connected. Is done. Further, the protrusion 31 of the substrate 3 is inserted into the slit 23 of the substrate 2, so that the lower surface of the substrate 3 contacts the left edge of the upper surface 22 of the substrate 2.

  A terminal block 33 to which an electric wire (not shown) is connected is provided at the center of the upper edge of the left surface 34 of the substrate 3. In addition, an opening 112 is formed on the left surface of the upper case 11 so that the wire connection port of the terminal block 33 is exposed when the board 3 is stored. A power supply line, a signal line, and the like from the outside of the electric device are connected to the terminal block 33 through the opening 112. Although not shown, electronic components other than the receptacle connector 32 and the terminal block 33 are also mounted on the left surface 34 and the right surface 35 which are mounting surfaces of the substrate 3.

  Next, the board | substrate 4 is formed in the rectangular shape which makes the left-right direction thickness direction, and is provided so that a part of right edge in the upper surface 22 of the board | substrate 2 may be contacted. Specifically, a protrusion 25 is formed in the right direction from the front and rear positions from the center at the right end of the substrate 2. Further, slits 41 are formed in the front-rear direction at positions on the front and rear sides of the lower edge of the substrate 4. Then, the protrusions 25 of the substrate 2 are inserted into the slits 41 of the substrate 4 so that the substrate 2 and the substrate 4 are positioned. A receptacle connector 26 is provided at the center of the right edge of the upper surface 22 of the substrate 2. A plug connector 42 is provided at the center of the lower edge of the left surface 44 of the substrate 4. And the protrusion 25 of the board | substrate 2 is inserted in the slit 41 of the board | substrate 4, and the receptacle connector 26 of the board | substrate 2 and the plug connector 42 of the board | substrate 4 are connected, and the board | substrate 2 and the board | substrate 4 are electrically connected. Is done. Further, the protrusion 25 of the substrate 2 is inserted into the slit 41 of the substrate 4, so that the upper surface in the slit 41 of the substrate 4 contacts the right edge (the upper surface of the protrusion 25) on the upper surface 22 of the substrate 2.

  In addition, a power circuit is configured by mounting electronic components on the substrate 4. The left surface 44 of the substrate 4 has a relatively large height typified by, for example, a transformer, a smoothing capacitor, an inductor, and the like. An electronic component 43 is mounted. Although not shown, electronic components other than the electronic component 43 are also mounted on the left surface 44 and the right surface 45 which are mounting surfaces of the substrate 4.

  Thus, by assembling the substrates 3 and 4 to the substrate 2, the lower end of the substrate 3 is in contact with the left edge of the upper surface 22 of the substrate 2, and the right edge of the upper surface 22 of the substrate 2, specifically, the protrusion. The upper surface in the slit 41 of the substrate 4 is in contact with the upper surface of 25.

  As shown in FIGS. 4 and 5, the substrates 2, 3 and 4 assembled as described above are accommodated in the upper case 11. At this time, the upper ends of the substrates 3 and 4 are brought into contact with the upper surface of the upper case 11 so that the substrates 3 and 4 are positioned in the upward direction.

Further, the front wall 113 and the rear wall 114, which are part of the side walls constituting the outer case of the upper case 11, are formed in a state of entering inside the other side walls. That is, the front wall and the rear wall 114 are in a state in which the front surface and the rear surface protrude inward on the inner surface of the upper case 11.
Therefore, when the substrates 2, 3, and 4 are accommodated in the upper case 11, the front edge of the upper surface 22 of the substrate 2 contacts a part of the lower end of the front wall 113, and the rear side of the upper surface 22 of the substrate 2 is The edge contacts a part of the lower end of the rear wall 114. The front wall 113 and the rear wall 114 correspond to contact portions.

  Then, the lower case 12 is assembled so as to cover the opening of the upper case 11 in which the substrates 2, 3, 4 are stored. At this time, a dowel (not shown) provided in the lower case 12 comes into contact with the lower surface 21 of the substrate 2, whereby the substrate 2 is positioned downward.

  As described above, the electric apparatus according to the present embodiment includes the substrate 2 (first substrate), the substrates 3 and 4 (second substrate), and the case 1. The substrate 2 is mounted with an image sensor 51 (functional component). On the substrates 3 and 4, electronic components other than the image sensor 51 are mounted on the left surfaces 34 and 44 and the right surfaces 35 and 45 (mounting surfaces). The case 1 accommodates the substrates 2, 3, and 4 and has an opening 124 that exposes the image sensor 51. In the opening 124, the penetrating direction from the outside to the inside of the case 1 is the upward direction (first direction). The substrate 2 is arranged such that the lower surface 21 (first surface) faces the opening 124 and the normal direction of the lower surface 21 is the vertical direction that is the same direction as the penetrating direction of the opening 124. The substrates 3 and 4 are arranged so that the normal directions of the left surfaces 34 and 44 and the right surfaces 35 and 45 are different from the normal direction of the lower surface 21. Further, the substrates 3 and 4 are in contact with the edge of the upper surface 22 (second surface) on the back side of the lower surface 21 of the substrate 2 and the inner surface of the case 1. As a result, the substrates 3 and 4 limit the upward movement of the substrate 2. Further, the case 1 includes a front wall 113 and a rear wall 114 (contact portion) that contact the edge of the upper surface 22 of the substrate 2. The front wall 113 and the rear wall 114 limit the upward movement of the substrate 2.

  That is, in the electrical apparatus of this embodiment, the substrates 3 and 4 are assembled so as to be perpendicular to the substrate 2. The lower end of the substrate 3 contacts the left edge of the upper surface 22 of the substrate 2, and the upper end contacts the upper surface of the upper case 11. Further, the upper surface of the substrate 4 is in contact with the right edge (the upper surface of the protrusion 25) of the upper surface 22 of the substrate 2, and the upper end thereof is in contact with the upper surface of the upper case 11. That is, the substrates 3 and 4 provided perpendicularly to the substrate 2 come into contact with both the edge of the upper surface 22 of the substrate 2 and the upper surface of the upper case 11, so that the substrate 2 moves upward. Limit. Further, the lower ends of the front wall 113 and the rear wall 114 of the upper case 11 are in contact with the front and rear edges of the upper surface 22 of the substrate 2, thereby restricting the upward movement of the substrate 2.

  In this way, the substrates 3, 4, the front wall 113, and the rear wall 114 are in contact with the edges in the four directions on the upper surface 22 of the substrate 2 formed in a rectangular shape, thereby restricting the upward movement of the substrate 2. Therefore, even if an external force is applied to the imaging element 51 exposed from the case 1 from the outside of the case 1 through the opening 124, deformation of the substrate 2 on which the imaging element 51 is mounted can be suppressed. By suppressing the deformation of the substrate 2, it is possible to reduce the stress of the electronic components (including the imaging device 51 and the diodes 52 to 56) mounted on the substrate 2 and the soldered portions of these electronic components.

  In addition, even when only the lower end of the upper case 11 is configured to contact the edges in the four directions on the upper surface 22 of the substrate 2, the upward movement of the substrate 2 is limited and deformation of the substrate 2 is suppressed. Can do. However, in such a configuration, it is necessary to make the area of the substrate 2 unnecessarily large in order to bring the four-direction edges of the upper surface 22 of the substrate 2 into contact with the lower end of the upper case 11, and the cost increases. There's a problem. However, in the present embodiment, the substrates 3 and 4 are used to restrict the upward movement of the substrate 2, so that it is not necessary to enlarge the substrate 2 unnecessarily, and the cost can be reduced.

  An electronic component 43 having a relatively large height is mounted on the left surface 44 of the substrate 4. That is, the electronic component 43 is disposed in a space surrounded by the substrates 2, 3, and 4. Therefore, the space in the case 1 can be used effectively, and the size of the electric device can be reduced.

  In addition, the electrical device of the present embodiment is a sensor device that detects, for example, the presence or absence of a person using the image sensor 51, and it is desirable that the vertical displacement of the image sensor 51 is small. The effect of suppressing deformation is great.

  In the present embodiment, the upward movement of the substrate 2 is limited using two second substrates (substrates 3 and 4), but at least a part of the edge on the upper surface 22 of the substrate 2 is used. As long as the second substrate is in contact, the number of second substrates may be one or three or more.

  In the present embodiment, the image sensor 51 has been described as an example of a functional component. However, the functional component may be any component that is exposed from the case 1 such as an ultrasonic microphone, an infrared light receiving unit, a connector, and the like. Not limited. In the present embodiment, the sensor device has been described as an example of an electric device. However, the electric device may be a lighting fixture, a control device, or the like, and the type is not limited.

1 Case 11 Upper Case 113 Front Wall (Contact Part)
114 Rear wall (contact part)
12 Lower case 124 Opening 2 Substrate (first substrate)
21 Lower surface (first surface)
22 Upper surface (second surface)
3 Substrate (second substrate)
34 Left side (mounting side)
35 Right side (mounting side)
4 Substrate (second substrate)
44 Left side (mounting side)
45 Right side (mounting side)
51 Image sensor (functional parts)

Claims (3)

A first board on which functional components are mounted;
A second substrate on which electronic components other than the functional components are mounted on the mounting surface;
A case in which the first substrate and the second substrate are accommodated and an opening is formed to expose the functional component;
In the opening, the penetration direction from the outside to the inside of the case is a first direction,
The first substrate is disposed so that the first surface faces the opening, and the normal direction of the first surface is the same direction as the through direction of the opening,
The second substrate is disposed such that a normal direction of the mounting surface is different from a normal direction of the first surface, and is on the back side of the first surface of the first substrate. An electric device characterized by restricting movement of the first substrate in the first direction by contacting an edge of a second surface and an inner surface of the case. The case includes a contact portion that contacts an edge of the second surface of the first substrate,
The electric device according to claim 1, wherein the contact portion restricts movement of the first substrate in the first direction. The electric device according to claim 1, wherein the functional component includes an image sensor.

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